Memory Module Specifications KHX21S12P1K2/8 8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3-2133 CL12 204-Pin SODIMM Kit Supports Kingston HyperX Plug and Play (PnP) SPECIFICATIONS CL(IDD) 12 cycles Row Cycle Time (tRCmin) 44.22ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) Row Active Time (tRASmin) 33ns (min.) Maximum Operating Power TBD W* (per module) UL Rating 94 V - 0 Operating Temperature 0o C to 85o C Storage Temperature -55o C to +100o C *Power will vary depending on the SDRAM used. DESCRIPTION FEATURES Kingston's KHX21S12P1K2/8 is a kit of two 512M x 64-bit (4GB) DDR3-2133 CL12 SDRAM (Synchronous DRAM) 2Rx8 * * * * * * * * * * JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply * * Bi-directional Differential Data Strobe * * On Die Termination using ODT pin * * Asynchronous Reset memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at JEDEC DDR3-2133 at a low latency timing of 12-12-12 at 1.5V. Additional timing parameters are shown in the PnP Timing Parameters section. Each 204-pin SODIMM uses gold contact fingers and requires +1.5V. The electrical and mechanical specifications are as follows: Note: PnP implementation is only possible in configurations that include a BIOS that supports the PnP function. Your maximum speed will be determined by your BIOS. PnP JEDEC TIMING PARAMETERS: * * * DDR3-2133 CL12-12-12 @1.5V DDR3-1866 CL11-11-11 @1.5V DDR3-1600 CL9-9-9 @1.5V VDDQ = 1.5V (1.425V ~ 1.575V) 1066MHz fCK for 2133Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 12, 11, 10, 9, 8, 7, 6, 5 Posted CAS Programmable Additive Latency: 0, CL - 2, or CL - 1 clock Programmable CAS Write Latency(CWL) = 10 (DDR3-2133) 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm 1%) Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C PCB : Height 1.180" (30.00mm), double sided component Continued >> Document No. 4806636-001.A00 11/27/12 Page 1 continued HyperX MODULE DIMENSIONS (units = millimeters) FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. Document No. 4806636-001.A00 Page 2