1White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
NC
I/O
0
I/O
1
I/O
2
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
#
NC
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
V
CC
CS
4
#
WE
4
#
I/O
27
A
4
A
5
A
6
WE
3
#
CS
3
#
GND
I/O
19
128KX32 5V FLASH MODULE, SMD 5962-94716
FEATURES
Access Times of 50**, 60, 70, 90, 120, 150ns
Packaging:
• 66 pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
• 68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880 inch) square, 3.56mm (0.140 inch) high
(Package 510)
• 68 lead, Hermetic CQFP (G2L), 22.4mm
(0.880 inch) square, 4.06mm (0.160 inch) high
(Package 528)
Sector Architecture
• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
100,000 Erase/Program Cycles Typical, 0°C to
+70°C
Organized as 128Kx32
FIGURE 1 – PIN CONFIGURATION FOR WF128K32N-XH1X5
Pin Description
Commercial, Industrial and Military Temperature
Ranges
5 Volt Programming. 5V ± 10% Supply
Low Power CMOS, 1mA Standby Typical
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Page Program Operation and Internal Program
Control Time
Weight
WF128K32-XG2LX5 - 8 grams typical
WF128K32-XG2UX5 - 8 grams typical
WF128K32-XH1X5 - 13 grams typical
Note: For programming information refer to Flash Programming 1M5 Application Note.
* This product is subject to change without notice.
* * The access time of 50ns is available in Industrial and Commercial temperature
ranges only.
Block Diagram
WE1#CS
1#CS
2#CS
3#CS
4#WE4#WE3#WE2#
128K x 8 128K x 8 128K x 8 128K x 8
OE#
A
0-16
I/O
0-7
I/O
24-31
I/O
16-23
I/O
8-15
8888
Top View
I/O0-31 Data Inputs/Outputs
A0-16 Address Inputs
WE1-4# Write Enables
CS1-4# Chip Selects
OE# Output Enable
VCC Power Supply
GND Ground
NC Not Connected
2White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
PIN DESCRIPTION
FIGURE 3 – PIN CONFIGURATION FOR WF128K32-XG2UX5 AND WF128K32-XG2LX5
BLOCK DIAGRAM
TOP VIEW
WE
1
#CS
1
#CS
2
#CS
3
#CS
4
#WE
4
#WE
3
#WE
2
#
128K x 8 128K x 8 128K x 8 128K x 8
OE#
A0-16
I/O0-7 I/O24-31
I/O16-23
I/O8-15
8888
I/O0-31 Data Inputs/Outputs
A0-16 Address Inputs
WE1-4# Write Enables
CS1-4# Chip Selects
OE# Output Enable
VCC Power Supply
GND Ground
NC Not Connected
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
GND
I/O8
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
VCC
A11
A12
A13
A14
A15
A16
CS1#
OE#
CS2#
NC
WE4#
WE3#
WE2#
NC
NC
NC
NC
A0
A1
A2
A3
A4
A5
CS3#
GND
CS4#
WE1#
A6
A7
A8
A9
A10
VCC
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
3White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
ABSOLUTE MAXIMUM RATINGS (1)
NOTES:
1. Stresses above the absolute maximum rating may cause permanent damage to
the device. Extended operation at the maximum levels may degrade performance
and affect reliability.
2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions,
inputs may overshoot VSS to -2.0 V for periods of up to 20ns. Maximum DC
voltage on output and I/O pins is Vcc + 0.5V. During voltage transitions, outputs
may overshoot to VCC + 2.0 V for periods of up to 20ns.
3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may
overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9
is +13.5V which may overshoot to 14.0 V for periods up to 20ns.
NOTES:
1. The ICC current listed includes both the DC operating current and the frequency
dependent component (at 5 MHz).
The frequency component typically is less than 2 mA/MHz, with OE# at VIH.
2. ICC active while Embedded Algorithm (program or erase) is in progress.
3. DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Min Max Unit
Supply Voltage VCC 4.5 5.5 V
Input High Voltage VIH 2.0 VCC + 0.3 V
Input Low Voltage VIL -0.5 +0.8 V
Operating Temp. (Mil.) TA-55 +125 °C
A9 Voltage for Sector Protect VID 11.5 12.5 V
Parameter Unit
Operating Temperature -55 to +125 °C
Supply Voltage Range (VCC) -2.0 to +7.0 V
Signal voltage range (any pin except A9) (2) -2.0 to +7.0 V
Storage Temperature Range -65 to +150 °C
Lead Temperature (soldering, 10 seconds) +300 °C
Data Retention Mil Temp 10 years
Endurance (write/erase cycles) Mil Temp 10,000 cycles min.
A9 Voltage for sector protect (VID) (3) -2.0 to +14.0 V
Parameter Symbol Conditions Min Max Unit
Input Leakage Current ILI VCC = 5.5, VIN = GND to VCC 10 μA
Output Leakage Current ILOx32 VCC = 5.5, VIN = GND to VCC 10 μA
VCC Active Current for Read (1) ICC1 CS# = VIL, OE# = VIH 140 mA
VCC Active Current for Program or
Erase (2)
ICC2 CS# = VIL, OE# = VIH 200 mA
VCC Standby Current ICC3 VCC = 5.5, CS# = VIH, f = 5MHz 6.5 mA
VCC Static Current ICC4 VCC = 5.5, CS# = VIH 0.6 mA
Output Low Voltage VOL IOL = 8.0 mA, VCC = 4.5 0.45 V
Output High Voltage VOH1 IOH = -2.5 mA, VCC = 4.5 0.85 x
VCC
V
Output High Voltage VOH2 IOH = -100 μA, VCC = 4.5 VCC
-0.4
V
Low VCC Lock Out Voltage VLKO 3.2 V
CAPACITANCE
Ta = +25°C
Parameter
Symbol
Conditions Max Unit
OE# capacitance COE
VIN = 0V, f = 1.0 MHz
50 pF
WE1-4# capacitance
HIP (PGA) H1
CWE
VIN = 0V, f = 1.0 MHz
20
pF
CQFP G2U/G2L 15
CS1-4# capacitance CCS
VIN = 0V, f = 1.0 MHz
20 pF
Data# I/O capacitance CI/O
VI/O = 0V, f = 1.0 MHz
20 pF
Address input capacitance CAD
VIN = 0V, f = 1.0 MHz
50 pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS – CMOS COMPATIBLE
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
4White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, CS# CONTROLLED
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
FIGURE 4 – AC TEST CIRCUIT
Parameter Symbol -50 -60 -70 -90 -120 -150 Unit
Min Max Min Max Min Max Min Max Min Max Min Max
Write Cycle Time tAVAV tWC 50 60 70 90 120 150 ns
WE# Setup Time tWLEL tWS 000000ns
CS# Pulse Width tELEH tCP 25 30 35 45 50 50 ns
Address Setup Time tAVEL tAS 000000ns
Data Setup Time tDVEH tDS 25 30 30 45 50 50 ns
Data Hold Time tEHDX tDH 000000ns
Address Hold Time tELAX tAH 40 45 45 45 50 50 ns
WE# Hold from WE# High tEHWH tWH 000000ns
CS# Pulse Width High tEHEL tCPH 20 20 20 20 20 20 ns
Duration of Programming Operation tWHWH1 14 14 14 14 14 14 μs
Duration of Erase Operation tWHWH2 2.2 60 2.2 60 2.2 60 2.2 60 2.2 60 2.2 60 sec
Read Recovery before Write tGHEL 000000ns
Chip Programming Time 12.5 12.5 12.5 12.5 12.5 12.5 sec
Notes:
VZ is programmable from -2V to +7V.
IOL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
VZ is typically the midpoint of VOH and VOL.
IOL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
AC Test Conditions
Parameter Typ Unit
Input Pulse Levels VIL = 0, VIH = 3.0 V
Input Rise and Fall 5 ns
Input and Output Reference Level 1.5 V
Output Timing Reference Level 1.5 V
5White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE# CONTROLLED
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter Symbol -50 -60 -70 -90 -120 -150 Unit
Min Max Min Max Min Max Min Max Min Max Min Max
Write Cycle Time tAVAV tWC 50 60 70 90 120 150 ns
Chip Select Setup Time tELWL tCS 000000ns
Write Enable Pulse Width tWLWH tWP 25 30 35 45 50 50 ns
Address Setup Time tAVWL tAS 000000ns
Data Setup Time tDVWH tDS 25 30 30 45 50 50 ns
Data Hold Time tWHDX tDH 000000ns
Address Hold Time tWLAX tAH 40 45 45 45 50 50 ns
Chip Select Hold Time tWHEH tCH 000000ns
Write Enable Pulse Width High tWHWL tWPH 20 20 20 20 20 20 ns
Duration of Byte Programming Operation
(min)
tWHWH1 14 14 14 14 14 14 μs
Sector Erase Time tWHWH2 2.2 60 2.2 60 2.2 60 2.2 60 2.2 60 2.2 60 sec
Read Recovery Time Before Write tGHWL 000000ns
VCC Setup Time tVCS 50 50 50 50 50 50 μs
Chip Programming Time 12.5 12.5 12.5 12.5 12.5 12.5 sec
Output Enable Setup Time tOES 000000ns
Output Enable Hold Time (1) tOEH 10 10 10 10 10 10 ns
1. For Toggle and Data Polling.
AC CHARACTERISTICS – READ ONLY OPERATIONS
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter Symbol -50 -60 -70 -90 -120 -150 Unit
Min Max Min Max Min Max Min Max Min Max Min Max
Read Cycle Time tAVAV tRC 50 60 70 90 120 150 ns
Address Access Time tAVQV tACC 50 60 70 90 120 150 ns
Chip Select Access Time tELQV tCE 50 60 70 90 120 150 ns
OE# to Output Valid tGLQV tOE 25 30 35 40 50 55 ns
Chip Select to Output High Z (1) tEHQZ tDF 20 20 20 25 30 35 ns
OE# High to Output High Z (1) tGHQZ tDF 20 20 20 25 30 35 ns
Output Hold from Address, CS# or OE#
Change, whichever is fi rst
tAXQX tOH 000000ns
1. Guaranteed by design, not tested.
6White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
FIGURE 5 – AC WAVEFORMS FOR READ OPERATIONS
Addresses Addresses Stable
Output Valid
DX
DXHigh Z High Z
tACC
tOE
tOH
tDF
tCE
tRC
Outputs
CS1#/CS2#
OE#
WE#
7White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
FIGURE 6 – WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to the device (for each chip).
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
Addresses 5555H PA PA
Data# Polling
tAS tAH
tWC
tGHWL
tCS
tDS
tWP
tWPH
tWHWH1
tDH
AOH PD D7#
tRC
tOE
tDF
tOH
tCE
DOUT
CS#
OE#
WE#
Data
5.0 V
8White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
FIGURE 7 – AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
Notes:
1. SA is the sector address for Sector Erase.
Addresses 5555H 5555H 5555H2AAAH 2AAAH SA
tAS
tAH
tGHWL
tWP
tWPH
tDH
AAH 55H 80H AAH 55H 10H/30H
tCS
tDS
tVDS
CS#
OE#
WE#
Data
VCC
9White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
FIGURE 8 – AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS
CS#
OE#
WE#
D0-D6
D7 D7#
D0-D6 = Invalid
D7 =
Valid Data
High Z
D0-D7
Valid Data
Data
tCH
tOEH
tOE
tOE
tOH
tDF
tCE
tWHWH 1 or 2
10 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
FIGURE 9 – WRITE/ERASE/PROGRAM OPERATION, CS# CONTROLLED
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to the device (for each chip).
4. DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
Addresses 5555H PA PA
Data# Polling
tAS tAH
tWC
tGHEL
tWS
tDS
tCP
tCPH
tWHWH1
tDH
AOH PD D7#DOUT
WE#
OE#
CS#
Data
5.0 V
11 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
12 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
The White 68 lead G2U CQFP fi lls the same fi t
and function as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2U has the TCE and lead
inspection advantage of the CQFP form.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
oo
13 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
25.15 (0.990) ± 0.25 (0.010) MAX
22.36 (0.880) ± 0.25 (0.010) MAX
20.31 (0.800) REF
0.38 (0.015) ± 0.05 (0.002)
1.27 (0.050) TYP
5.10 (0.200) MAX
0.25 (0.010) ± 0.10 (0.002)
24.0 (0.946)
± 0.25 (0.010)
0.23 (0.009) REF
R 0.127
(0.005)
2O / 9O
0.89 (0.035)
± 1.14 (0.045)
1.37 (0.054) MIN 0.004
0.940" TYP
PACKAGE 528 : 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
14 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
V
PP PROGRAMMING VOLTAGE
5 = 5V
DEVICE GRADE:
Q = MIL - STD 833 Compliant
M = Military Screened -55°C to +125°C
I = Industrial -40°C to +85°C
C = Commercial 0°C to + 70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Profi le CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, Low Profi le CQFP (Package 528)
ACCESS TIME (ns)
IMPROVEMENT MARK
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrade
ORGANIZATION, 128K x 32
User confi gurable as 256K x 16 or 512K x 8
Flash
WHITE ELECTRONIC DESIGNS CORP.
ORDERING INFORMATION
W F 128K32 X - XXX X X 5 X
15 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
Note 1: Package Not Recommended For New Design
DEVICE TYPE SPEED PACKAGE SMD NO.
128K x 32 Flash 150ns 66 pin HIP (H1) 5962-94716 01H8X
128K x 32 Flash 120ns 66 pin HIP (H1) 5962-94716 02H8X
128K x 32 Flash 90ns 66 pin HIP (H1) 5962-94716 03H8X
128K x 32 Flash 70ns 66 pin HIP (H1) 5962-94716 04H8X
128K x 32 Flash 60ns 66 pin HIP (H1) 5962-94716 05H8X
128K x 32 Flash 150ns 68 lead CQFP (G2U) 5962-94716 01HNX
128K x 32 Flash 120ns 68 lead CQFP (G2U) 5962-94716 02HNX
128K x 32 Flash 90ns 68 lead CQFP (G2U) 5962-94716 03HNX
128K x 32 Flash 70ns 68 lead CQFP (G2U) 5962-94716 04HNX
128K x 32 Flash 60ns 68 lead CQFP (G2U) 5962-94716 05HNX
128K x 32 Flash 150ns 68 lead CQFP (G2L) 5962-94716 01HAX
128K x 32 Flash 120ns 68 lead CQFP (G2L) 5962-94716 02HAX
128K x 32 Flash 90ns 68 lead CQFP (G2L) 5962-94716 03HAX
128K x 32 Flash 70ns 68 lead CQFP (G2L) 5962-94716 04HAX
128K x 32 Flash 60ns 68 lead CQFP (G2L) 5962-94716 05HAX
