December 2011 Doc ID 10004 Rev 13 1/19
19
RHFL4913XX25
RHFL4913XX33 - RHFL4913XX50
Rad-hard positive fixed voltage regulator
Features
■2 and 3 A low dropout voltage
■Embedded overtemperature, overcurrent
protections
■Adjustable current limitation
■Output overload monitoring/signalling
■Fixed 2.5 V, 3.3 V, 5.0 V output voltages
■Inhibit (ON/OFF) TTL-compatible control
■Programmable output short-circuit current
■Remote sensing operation
■Rad-hard: tested up to 300 krad Mil Std 883E
Method 1019.6 and low dose rate conditions
■Heavy Ions SEL immune
Description
The RHFL4913 fixed is a high performance Rad-
hard positive voltage regulator family. Available in
various hermetic ceramic packages, it is
specifically intended for space and harsh radiation
environments. Input supply range is up to 12 V.
RHFL4913 fixed is QML-V qualified, DSCC SMD
are 5962F02534 / 02535 / 02536.
SMD.5
TO-257
Flat-16
Figure 1. Block diagram for package SMD.5 and TO-257
www.st.com
Contents RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
2/19 Doc ID 10004 Rev 13
Contents
1 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.1 Low pin count package limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2 SENSE pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.3 Inhibit ON-OFF control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.4 Overtemperature protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.5 Overcurrent protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.6 OCM pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.7 Alternate to . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6.1 Remote sensing operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7 Notes about Flat-16 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7.1 Radiation performances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7.2 Die information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
9 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Diagram
Doc ID 10004 Rev 13 3/19
1 Diagram
Figure 2. Block diagram for package Flat-16
Pin configuration RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
4/19 Doc ID 10004 Rev 13
2 Pin configuration
Figure 3. Pin configuration (top view for Flat-16, bottom view for SMD.5)
TO-257
SMD.5
Flat-16
Table 1. Pin description
Pin name Flat-16 (1) SMD.5 (2) TO-257
VO1, 2, 6, 7 1 3
VI3, 4, 5 2 1
GND 13 3 2
ISC 8
OCM 10
INHIBIT 14
SENSE 16
NC 9, 11, 12, 15
1. The upper metallic package lid and the bottom metallization are neither connected to regulator die nor to package
terminals, hence electrically floating.
2. The upper metallic package lid is neither connected to regulator die nor to package terminals, hence electrically floating.
RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Maximum ratings
Doc ID 10004 Rev 13 5/19
3 Maximum ratings
Table 2. Absolute maximum ratings (1)
1. Exceeding maximum ratings may damage the device.
Symbol Parameter Value Unit
VIDC input voltage, VI - VGROUND 14 V
IOOutput current RHFL4913S, ESY 3 A
RHFL4913KP 2
PDTC = 25°C power dissipation KP, S Versions 15 W
ESY Version 10
TSTG Storage temperature range -65 to +150 °C
TOP Operating junction temperature range -55 to +150 °C
TJJunction temperature (2)
2. Internally limited to about maximum +175 °C by thermal shutdown circuit.
+150 °C
ESD Electrostatic discharge capability Class 3
Table 3. Thermal data
Symbol Parameter Flat-16 TO-257 SMD.5 Unit
RthJC Thermal resistance junction-case max. 8.3 12.5 8.3 °C/W
TSOLD Maximum soldering temperature, 10 sec. 300 °C
Electrical characteristics RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
6/19 Doc ID 10004 Rev 13
4 Electrical characteristics
TJ = 25 °C, VI = VO + 2.5 V, CI = CO = 1 µF, unless otherwise specified.
Table 4. Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
VIOperating input voltage IO = 2 A (Flat-16) or 3A (SMD.5 & TO-257) 12 V
VOOutput voltage accuracy VI = VO+2.5V, IO = 5mA -2 2 %
ISHORT Output current limit (1) Adjustable by mask/external resistor 4.5 A
VOOperating output voltage IO = 2 A, 2.5 V output voltage 2.45 2.55 V
VOOperating output voltage IO = 2 A, 3.3 V output voltage 3.23 3.37 V
VOOperating output voltage IO = 2 A, 5.0 V output voltage 4.9 5.1 V
ΔVO/ΔVILine regulation
VI = VO+2.5V to 12 V, IO = 5mA (+25°C) 0.3 %
VI = VO+2.5V to 12 V, IO = 5mA (-55°C) 0.4 %
VI = VO+2.5V to 12 V, IO = 5mA (+125°C) 0.4 %
ΔVO/ΔVOLoad regulation
VI = VO+2.5V, IO = 5mA to 400 mA
(+25°C) 0.2 %
VI = VO+2.5V, IO = 5mA to 400 mA (-55°C) 0.3 %
VI = VO+2.5V, IO = 5mA to 400 mA
(+125°C) 0.3 %
VI = VO+2.5V, IO = 5mA to 1A (+25°C) 0.3 %
VI = VO+2.5V, IO = 5mA to 1A (-55°C) 0.4 %
VI = VO+2.5V, IO = 5mA to 1A (+125°C) 0.4 %
ZOUT Output impedance IO = 100 mA DC and 20 mA rms 100 mΩ
IqQuiescent current
VI = VO+2.5V, IO = 30mA, on mode 8
mA
VI = VO+2.5V, IO = 300mA, on mode 25
VI = VO+2.5V, IO = 1A, on mode 60
VI = VO+2.5V, IO = 3A, on mode
(only for SMD.5 and TO-257) 150
VI = VO+2V, VINH = 2.4V, off mode 1
IqQuiescent current VI =VO+2.5V, IO=1A, TJ=+125°C, on mode 40 mA
VI =VO+2.5V, IO=1A, TJ=-55°C, on mode 100
RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Electrical characteristics
Doc ID 10004 Rev 13 7/19
VdDropout voltage
IO = 400mA, TJ = -55°C 300 400
mV
IO = 400mA, TJ = +25°C 350 450
IO = 400mA, TJ = +125°C 450 550
IO = 1A, TJ = -55°C 550
IO = 1A, TJ = +25°C 650
IO = 1A, TJ = +125°C 800
IO = 2A, TJ = +25°C 750
IO = 2A, TJ = +125°C 950
VINH(ON) Inhibit voltage IO = 5mA, TJ= -55 to 125°C 0.8 V
VINH(OFF) Inhibit voltage IO = 5mA, TJ= -55 to 125°C 2.4 V
SVR Supply voltage rejection
(1) VI = VO+2.5V ± 1V, IO = 5mA f = 120Hz 60 70 dB
f = 33kHz 30 40
ISH Shutdown input current VINH = 5 V 15 µA
VOCM OCM pin voltage Sinked IOCM = 24 mA active low 0.38 V
tPLH
tPHL
Inhibit propagation delay
(1) VI = VO+2.5V, VINH = 2.4 V, IO = 400 mA on-off 20 µs
off-on 100 µs
eN Output noise voltage (1) B= 10Hz to 100kHz, IO = 5mA to 2A 40 µVrms
1. This value is guaranteed by design. For each application it’s strongly recommended to comply with the maximum current
limit of the package used.
Table 4. Electrical characteristics (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
Figure 4. Application diagram for remote sensing operation
Device description RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
8/19 Doc ID 10004 Rev 13
5 Device description
The RHFL4913 fixed voltage contains a PNP type power element controlled by a signal
resulting from amplified comparison between the internal temperature compensated band-
gap cell and the fraction of the desired output voltage value. This fractional value is obtained
from an internal-to-die resistor divider bridge set by STMicroelectronics. The device is
protected by several functional blocks.
5.1 Low pin count package limitations
Some functions (INHIBIT, OCM, SENSE) are not available due to lack of pins.
Corresponding die pads are by default connected inside silicon.
5.2 SENSE pin
The load voltage is applied by a Kelvin line connected to SENSE pin: Voltage feed-back
comes from the internal divider resistor bridge. Therefore possible output voltages are set
by manufacturer mask metal options. SENSE pin is not available in 3pin packages.
5.3 Inhibit ON-OFF control
By setting INHIBIT pin TTL-high, the device switches off the output current and voltage. The
device is ON when INHIBIT pin is set low. Since INHIBIT pin is internally pulled down, it can
be left floating in case inhibit function is not utilized. INHIBIT pin is not available in 3pin
packages.
5.4 Overtemperature protection
A temperature detector internally monitors the power element junction temperature. The
device goes OFF at approx. 175 °C, returning to ON mode when back to approx. 40 °C. It is
worth noting that when the internal temperature detector reaches 175 °C, the active power
element can be at 225 °C: device reliability cannot be granted in case of extensive operation
under these conditions.
5.5 Overcurrent protection
ISC pin. An internal non-fold back short-circuit limitation is set with ISHORT > 3.8 A (VO is 0
V). This value can be reduced by an external resistor connected between ISC pin and VI pin,
with a typical value range of 25 kΩ to 200 kΩ. This adjustment feature is not available in 3
pin packages. To keep excellent VO regulation, it is necessary to set ISHORT 1.6 times
greater than the maximum desired application IO. When IO reaches ISHORT – 300 mA, the
current limiter overrules regulation and VO starts to drop and the OCM flag is risen. When no
current limitation adjustment is required, ISC pin must be left unbiased (as it is in 3 pin
packages).
RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Device description
Doc ID 10004 Rev 13 9/19
5.6 OCM pin
Goes low when current limiter starts to be active, otherwise VOCM = VI. It is bufferized and
can sink 10 mA. OCM pin is internally pulled-up by a 5 kΩ resistor. Not available in 3 pin
packages.
5.7 Alternate to
RHFL4913 fixed (& custom) voltages replace all 3-terminal industry devices, providing
essential benefits
- Lower drop-out
- High radiation performance
- Better SVR
- Saving the high stability external setting resistors.
Application information RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
10/19 Doc ID 10004 Rev 13
6 Application information
The RHFL4913 fixed voltage is functional as soon as VI-VO voltage difference is slightly
above the power element saturation voltage. A minimum 0.5 mA IO ensures perfect “no-
load” regulation.
All available VI pins must always be externally interconnected, same thing for all available
VO pins, otherwise device stability and reliability cannot be granted. All NC pins can be
connected to ground. The INHIBIT function switches off the output current in an electronic
way, that is very quickly. According to Lenz’s Law, external circuitry reacts with –LdI/dt terms
which can be of high amplitude in case some series-inductance exists. The effect would be
a large transient voltage developed on both device terminals. It is necessary to protect the
device with Schottky diodes preventing negative voltage excursions. In the worst case, a 14
V Zener diode shall protect the device input.
The device has been designed for high stability and low drop out operation: minimum 1 µF
input and output tantalum capacitors are therefore mandatory. Capacitor ESR range is from
0.01 Ω to over 20 Ω. Such range turns out to be useful when ESR increases at low
temperature. When large transient currents are expected, larger value capacitors are
necessary.
In case of high current operation with expected short-circuit events, caution must be
considered relatively to capacitors. They must be connected as close as possible to device
terminals. As some tantalum capacitors may permanently fail when submitted to high
charge-up surge currents, it is recommended to decouple them with 470 nF polyester
capacitors.
Being RHFL4913 fixed voltage manufactured with very high speed bipolar technology 6 GHz
fT transistors), the PCB lay-out must be performed with extreme care, very low inductance,
low mutually coupling lines, otherwise high frequency parasitic signals may be picked-up by
the device resulting into self-oscillation. User’s benefit is a SVR performance extended to far
higher frequencies.
6.1 Remote sensing operation
In case the load is located far from the regulator, it is recommended to comply with the
scheme below. To obtain the best regulation, it is in addition essential to care about:
– The wire connecting R2 to the load end must not be crossed by the load current
(Kelvin sense).
The noise captured by the wires between the load and the chip could bring a noisy output
voltage. In case this happens, it is recommended that shielded cables are used for these
connections. The external wrap must be used for connecting the ground of the chip with the
load ground. It is also recommended to place 1 µF tantalum capacitors between output and
ground close to the device and another next to the load.
RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Notes about Flat-16 package
Doc ID 10004 Rev 13 11/19
7 Notes about Flat-16 package
The bottom of package is metallized to allow user to directly solder the voltage regulator to
PCB, no heat sink needed, in order to optimize heat removal performance.
7.1 Radiation performances
The RHFL4913F has been tested against: 300krad TID ELDERS in accordance with Mil-
1019.6, bipolar section: post radiation parameters are within datasheet pre-rad limits.
Submitted to 200MeV Iodine ions of 60.4MeV/cm2/mg LET up to 1exp(+7) ions / cm2, no
SEL event has been detected.
7.2 Die information
RHFL4913 fixed is also available in die form. Space dice are electrically tested by
STMicroelectronics in such a way that, when mounted in proper thermal and electrical
substrate, they provide full compliance with equivalent packaged product.
- Max die dimensions: 2.794 mm by 3.861 mm or 110 mils by 152 mils
- Die thickness: 357 µm +/- 50 µm
- Pad size: 184 µm by 184 µm
- Metallization: Aluminum 4% silicon alloy
- Die backside: Bare silicon
- Die backside potential: Ground
(*) Die SENSE pad is active in RHFL4913 fixed die. It shall not be left unbonded. It should be bonded to VO pin.
(**) Die adjust pad is available in the die lay-out but is not electrically connected to the IC. It shall be left
unconnected during hybrid bonding.
Figure 5. Die size
Package mechanical data RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
12/19 Doc ID 10004 Rev 13
8 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Package mechanical data
Doc ID 10004 Rev 13 13/19
Dim.
mm. inch.
Min. Typ. Max. Min. Typ. Max.
A 2.16 2.72 0.085 0.107
b0.430.017
c0.130.005
D9.910.390
E6.91 0.272
E2 4.32 0.170
E30.76 0.030
e 1.27 0.050
L 6.72 0.265
Q 0.66 1.14 0.026 0.045
S1 0.130.005
Flat-16 (MIL-STD-1835) mechanical data
7450901A
18
16
eb
c
L
E
D
S1Q
A
E2
E3
L
E3
9
Package mechanical data RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
14/19 Doc ID 10004 Rev 13
Dim. mm. inch.
Min. Typ. Max. Min. Typ. Max.
A2.843.00 3.15 0.112 0.1180.124
A1 0.25 0.38 0.51 0.010 0.015 0.020
b7.137.26 7.39 0.281 0.286 0.291
b1 5.585.72 5.84 0.220 0.225 0.230
b2 2.282.41 2.54 0.090 0.095 0.100
b3 2.923.05 3.180.115 0.120 0.125
D 10.0310.16 10.280.395 0.400 0.405
D1 0.76 0.030
E7.39 7.52 7.64 0.291 0.296 0.301
e1.91 0.075
SMD.5 mechanical data
7386434B
E
RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Package mechanical data
Doc ID 10004 Rev 13 15/19
Dim. mm. inch.
Min. Typ. Max. Min. Typ. Max.
A 10.54 0.415
B 10.54 0.415
C 16.64 0.655
D 4.7 5.33 0.185 0.210
E 1.02 0.40
F3.56 3.683.81 0.140 0.145 0.150
G13.51 0.532
H 5.26 0.207
I 0.76 0.030
J3.05 0.120
K 2.54 0.100
L 15.2 16.5 0.598 0.650
M2.290.090
N 0.71 0.028
R 1.65 0.065
TO-257 mechanical data
0117268C
Ordering information RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
16/19 Doc ID 10004 Rev 13
9 Ordering information
Table 5. Order codes
DIE Flat-16 SMD.5 TO-257 Terminal
finish
Out.
volt. Q.ty level
RHFL4913KP25-01V RHFL4913S25-03V RHFL4913ESY2505V GOLD 2.5 V QML-V
RHFL4913KP25-02V RHFL4913S25-04V RHFL4913ESY2506V SOLDER 2.5 V QML-V
RHFL4913KP251 RHFL4913S251 RHFL4913ESY251 GOLD 2.5 V EM1
RHFL4913KP252 RHFL4913S252 RHFL4913ESY252 GOLD 2.5 V EM1=EM
2+48h B.I.
L491325DIE2V NA 2.5 V QML-V
L491325DIE2S NA 2.5 V EM1
RHFL4913KP33-01V RHFL4913S33-03V RHFL4913ESY3305V GOLD 3.3 V QML-V
RHFL4913KP33-02V RHFL4913S33-04V RHFL4913ESY3306V SOLDER 3.3 V QML-V
RHFL4913KP331 RHFL4913S331 RHFL4913ESY331 GOLD 3.3 V EM1
RHFL4913KP332 RHFL4913S332 RHFL4913ESY332 GOLD 3.3 V EM1=EM
2+48h B.I.
L491333DIE2V NA 3.3 V QML-V
L491333DIE2S NA 3.3 V EM1
RHFL4913KP50-01V RHFL4913S50-03V RHFL4913ESY5005V GOLD 5.0 V QML-V
RHFL4913KP50-02V RHFL4913S50-04V RHFL4913ESY5006V SOLDER 5.0 V QML-V
RHFL4913KP501 RHFL4913S501 RHFL4913ESY501 GOLD 5.0 V EM1
RHFL4913KP502 RHFL4913S502 RHFL4913ESY502 GOLD 5.0 V EM1=EM
2+48h B.I.
L491350DIE2V NA 5.0 V QML-V
L491350DIE2S NA 5.0 V EM1
RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Ordering information
Doc ID 10004 Rev 13 17/19
Note: 3 V version is available on request.
Table 6. Part number - SMD equivalent
ST part number SMD part number
RHFL4913KP25-01V 5962F0253401VXC
RHFL4913KP25-02V 5962F0253401VXA
RHFL4913KP33-01V 5962F0253501VXC
RHFL4913KP33-02V 5962F0253501VXA
RHFL4913KP50-01V 5962F0253601VXC
RHFL4913KP50-02V 5962F0253601VXA
RHFL4913S25-03V 5962F0253402VYC
RHFL4913S25-04V 5962F0253402VYA
RHFL4913S33-03V 5962F0253502VYC
RHFL4913S33-04V 5962F0253502VYA
RHFL4913S50-03V 5962F0253602VYC
RHFL4913S50-04V 5962F0253602VYA
RHFL4913ESY2505V 5962F0253402VZC
RHFL4913ESY2506V 5962F0253402VZA
RHFL4913ESY3305V 5962F0253502VZC
RHFL4913ESY3306V 5962F0253502VZA
RHFL4913ESY5005V 5962F0253602VZC
RHFL4913ESY5006V 5962F0253602VZA
L491325DIE2V 5962F0253402V9A
L491333DIE2V 5962F0253502V9A
L491350DIE2V 5962F0253602V9A
Table 7. Environmental characteristics
Parameter Conditions Value Unit
Output voltage thermal drift -55°C to +125°C 40 ppm/°C
Output voltage radiation drift From 0 krad to 300 krad at 0.55 rad/s 8 ppm/krad
Output voltage radiation drift From 0 krad to 300 krad, Mil Std 883E Method
1019.6 6 ppm/krad
Revision history RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
18/19 Doc ID 10004 Rev 13
10 Revision history
Table 8. Document revision history
Date Revision Changes
05-May-2004 4 Mistake in pin description SMD.5 on table 3.
28-Oct-2004 5 New order codes added - tables 4 and 5.
27-May-2005 6 The features, tables 4, 5 and the figures 1, 2 updated.
08-Jun-2005 7 Modified: PD on table 1, the RthJC for TO-257 on table 2 and the tables 6 and 7,
added DIE information.
26-Aug-2008 8 Added new output 1.5 V, modified: Table 4 on page 6, Table 5 on page 16 and
Table 6 on page 17.
02-Oct-2008 9 Modified: Features on page 1, Application information on page 10 and SMD.5
mechanical data on page 14.
20-Nov-2009 10 Modified: Table 5 on page 16.
19-Oct-2010 11 Modified: Section 7 on page 11.
08-Feb-2011 12 Added: note Table 1 on page 4.
07-Dec-2011 13 Removed the note under Table 1 on page 4 and added footnotes 1 and 2.
RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
Doc ID 10004 Rev 13 19/19
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
