© 2001
BIPOLAR ANALOG INTEGRATED CIRCUIT
µ
µµ
µ
PC2933A, 2905A
THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR
DATA SHEET
Document No. G15374EJ2V0DS00 (2nd edition)
Date Published September 2001 NS CP(K)
Printed in Japan
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
DESCRIPTION
The
µ
PC2933A, 2905A of low dropout voltage three terminal positive regulators is constructed with PNP output
transistor. The
µ
PC2933A, 2905A feature the ability to source 1 A of output current with a low dropout voltage of typically
0.7 V.
The power dissipation of the
µ
PC2933A, 2905A can be drastically reduced compared with the conventional three
terminal positive voltage regulators that is constructed with NPN output transistor. Also, this series corresponds to the low
voltage output (3 V, 3.3 V) which is not in the conventional low dropout regulators (
µ
PC2400A series).
FEATURES
• Output current in excess of 1.0 A
• Low dropout voltage VDIF = 0.7 V TYP. (at IO = 1 A)
• On-chip overcurrent and thermal protection circuit
•
••
• On-chip output transistor safe area protection circuit
PIN CONFIGURATION (Marking Side)
123 1: INPUT
2: GND
3: OUTPUT
PC2933AHF, 2905AHF : MP-45G
1: INPUT
2: GND
3: OUTPUT
4: GND (Fin)
PC2933AHB, 2905AHB : MP-3
PC2933AT, 2905AT : MP-3Z
123
4
The mark ★ shows major revised points.
Data Sheet G15374EJ2V0DS
2
µ
µµ
µ
PC2933A, 2905A
BLOCK DIAGRAM
Start-up
circuit Reference
voltage
Thermal
shut down
Error
amp. Drive
circuit
Saturation
protection
Safe operating
area protection
OUTPUT
GND
INPUT
Over current
protection
Data Sheet G15374EJ2V0DS 3
µ
µµ
µ
PC2933A, 2905A
ORDERING INFORMATION
Part Number Pack age Output Vol tage Marking Pack age Type
µ
PC2933AHF MP-45G
(Isolat ed TO-220)
3.3 V 2933A • Pack ed i n envel ope
µ
PC2933AHB MP-3 (SC-64) 3.3 V 2933A • Pack ed i n envel ope
µ
PC2933AT MP-3Z (SC-63) 3.3 V 2933A • Pack ed i n envel ope
µ
PC2933AT-E1 MP-3Z (SC-63) 3.3 V 2933A • 16 mm wide em bossed taping
• Pin 1 on drawout side
• 2000 pcs/ reel
µ
PC2933AT -E2 MP-3Z (SC-63) 3.3 V 2933A • 16 mm width embos sed taping
• Pin 1 at t akeup side
• 2000 pcs/ reel
µ
PC2933AT -T1 MP-3Z (SC-63) 3.3 V 2933A • 32 mm wide adhesive taping
• Pin 1 at drawout si de
• 1500 pcs/ reel
µ
PC2933AT -T2 MP-3Z (SC-63) 3.3 V 2933A • 32 mm wide adhesive taping
• Pin 1 at t akeup side
• 1500 pcs/ reel
µ
PC2905AHF MP-45G
(Isolat ed TO-220)
5.0 V 2905A • Pack ed i n envel ope
µ
PC2905AHB MP-3 (SC-64) 5.0 V 2905A • Pack ed i n envel ope
µ
PC2905AT MP-3Z (SC-63) 5.0 V 2905A • Pack ed i n envel ope
µ
PC2905AT-E1 MP-3Z (SC-63) 5.0 V 2905A • 16 mm wide em bossed taping
• Pin 1 at drawout si de
• 2000 pcs/ reel
µ
PC2905AT-E2 MP-3Z (SC-63) 5.0 V 2905A • 16 mm wide em bossed taping
• Pin 1 at t akeup side
• 2000 pcs/ reel
µ
PC2905AT-T1 MP-3Z (SC-63) 5.0 V 2905A • 32 mm wide adhesive taping
• Pin 1 at drawout si de
• 1500 pcs/ reel
µ
PC2905AT-T2 MP-3Z (SC-63) 5.0 V 2905A • 32 mm wide adhesive taping
• Pin 1 at t akeup side
• 1500 pcs/ reel
Data Sheet G15374EJ2V0DS
4
µ
µµ
µ
PC2933A, 2905A
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Rating
Parameter Symbol
µ
PC2933AHF,
2905AHF
µ
PC2933AHB, 2905AHB
µ
PC2933AT, 2905AT
Unit
Input Vol tage VIN 20 V
Internal P ower Dis sipation Note(TC = 25°C) PT15 10 W
Operating Ambient Temperature TA–30 to +85 °C
Operating Junction Tem perature TJ–30 to +150 °C
Storage Temperature Tstg –55 t o +150 °C
Thermal Resistance (juncti on to case) Rth(J-C) 7 12.5 °C/W
Thermal Resistance (juncti on to ambient ) Rth(J-A) 65 125 °C/W
Note Internally limited. When the operating junction temperature rises over 150°C, the internal circuit shuts down the
output voltage.
Caution If the absolute maximum rating of any of the above parameters is exceeded even momentarily, the
quality of the product may be degraded. In other words, absolute maximum ratings specify the
values exceeding which the product may be physically damaged. Be sure to use the product with
these ratings never exceeded.
STANDARD CONNECTION
INPUT
C
IN
PC2933A, 2905A OUTPUT
C
OUT
D
1
D
2
+
CIN: 0.1
µ
F or higher. Set this value according to the length of the line between the regulator and INPUT pin. Be sure
to connect CIN to prevent parasitic oscillation. Use of a film capacitor or other capacitor with excellent voltage and
temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure
that CIN is 0.1
µ
F or higher for the voltage and temperature range to be used.
COUT: 47
µ
F or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place
CIN and COUT as close as possible to the IC pins (within 2 cm). Also, use an electrolytic capacitor with low
impedance characteristics if considering use at sub-zero temperatures.
D1: If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode.
D2: If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode.
Caution Make sure that no voltage is applied to the OUTPUT pin from external.
★
Data Sheet G15374EJ2V0DS 5
µ
µµ
µ
PC2933A, 2905A
RECOMMENDED OPERATING CONDITIONS
Param et e r Symbol Type Num ber MIN. TYP. MAX. Unit
µ
PC2933A 4.3 16 Input Voltage VIN
µ
PC2905A 6 16
V
Output Current IOAll 0 1.0 A
Operating Ambient Temperature TAAll –30 +85 °C
Operating Junction Tem perature TJAll –30 +125 °C
ELECTRICA L CHARACTERISTICS
µ
µµ
µ
PC2933A (TJ = 25°
°°
°C, VIN = 5 V, IO = 500 mA, CIN = 0.22
µ
µµ
µ
F, COUT = 47
µ
µµ
µ
F, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
3.18 3.3 3.42 VOutput Voltage VO
0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 500 mA 3.14 3.46
0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 1 A
Line Regulation REGIN 4.3 V ≤ VIN ≤ 16 V 12 33 mV
Load Regulation REGL0 A ≤ IO ≤ 1 A 23 33
IO = 0 A 2.0 3.0 mAQuiescent Current IBIAS
IO = 1 A 20 40
VIN = 3.1 V, IO = 0 A 10 30 mAStartup Quies cent Current IBIAS (s)
VIN = 3.1 V, IO = 1 A 80
Quiescent Current Change
∆
IBIAS 0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V 3.0 15 mA
Output Nois e Voltage Vn10 Hz ≤ f ≤ 100 kHz 55
µ
Vr.m.s.
Ripple Rejec t ion R•R 4.3 V ≤ VIN ≤ 16 V, f = 120 Hz 48 64 dB
Dropout Vol tage VDIF 0°C ≤ TJ ≤ 125°C, IO = 1 A 0.7 1.0 V
VIN = 4.5 V 1.2 1.6 3.0Short Circuit Current IOpeak
VIN = 16 V 1.2
A
VIN = 4.5 V 1.0 1.4 3.0 APeak Output Current IOpeak
VIN = 16 V 1.3 1.7 2.8
Temperature Coefficient of
Output Voltage
∆
VO /
∆
T0°C ≤ TJ ≤ 125°C, IO = 5 mA –0.4 mV/°C
Data Sheet G15374EJ2V0DS
6
µ
µµ
µ
PC2933A, 2905A
µ
µµ
µ
PC2905A (TJ = 25°
°°
°C, VIN = 8 V, IO = 500 mA, CIN = 0.22
µ
µµ
µ
F, COUT = 47
µ
µµ
µ
F, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
4.83 5.0 5.18 VOutput Voltage VO
0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 500 mA 4.75 5.25
0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 1 A
Line Regulation REGIN 6 V ≤ VIN ≤ 16 V 23 50 mV
Load Regulation REGL0 A ≤ IO ≤ 1 A 28 50 mV
IO = 0 A 2.2 3.5 mAQuiescent Current IBIAS
IO = 1 A 28 50
VIN = 4.5 V, IO = 0 A 10 30 mAStartup Quies cent Current IBIAS (s)
VIN = 4.5 V, IO = 1 A 50
Quiescent Current Change
∆
IBIAS 0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V 2.9 15 mA
Output Nois e Voltage Vn10 Hz ≤ f ≤ 100 kHz 90
µ
Vr.m.s.
Ripple Rejec t i o n R•R f = 120 Hz, 6 V ≤ VIN ≤ 16 V 46 61 dB
Dropout Vol tage VDIF 0°C ≤ TJ ≤ 125°C, IO = 1 A 0.7 1.0 V
VIN = 6.5 V 1.15 1.8 3.0Short Circuit Current IOpeak
VIN = 16 V 1.1
A
VIN = 6.5 V 1.1 1.5 3.0 APeak Output Current IOpeak
VIN = 16 V 1.4 2.0 2.8
Temperature Coefficient of
Output Voltage
∆
VO /
∆
T0°C ≤ TJ ≤ 125°C, IO = 5 mA 0.6 mV/°C
Data Sheet G15374EJ2V0DS 7
µ
µµ
µ
PC2933A, 2905A
TYPICAL CHARACTERISTICS (Reference Values)
300
200
100
0
-100
-200
-300
-400 0 100 150
T
J
∆
V - Output Voltage Deviation - mV
O
∆
V
O
vs.T
J
-50 50
PC2905A
PC2933A
I
O
= 5 mA
-
Operating Junction Temperature -
˚C
µ
µ
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0012345678
V
IN
Voltage - V
V
O
- Output Voltage - V
V
O
vs.V
IN
PC2933A
T
J
= 25
˚C
O
= 0.5 A
I
O
= 5 mA
I
O
= 1.0 A
- Input
8
7
6
5
4
3
2
1
0012345678
V
IN -
Input
Voltage - V
V
O
vs. V
IN
PC2905A
T
J
= 25
˚C
O
= 0.5 A
I
O
= 5 mA
I
O
= 1.0 A
V
O
- Output Voltage - V
50
40
30
20
10
040 2 6 8 101214161820
BIAS
Quiescent Current - mA
BIAS
I
BIAS(s)
) vs.V
IN
PC2933A
O
= 0.5 A
I
O
= 0 A
I
O
= 1 A
T = 25
˚C
V
IN
-
Input
Voltage - V
50
40
30
20
10
0 2468101214161820
T = 25
˚C
O
= 0.5 A
I
O
= 0 A
I
O
= 1 A
V
IN
-
Input
Voltage - V
BIAS
I
BIAS(s)
) vs.V
IN
PC2905A
BIAS
Quiescent Current - mA
50 85 100 150
5
10
15
20
0
1.0
1.92
P
d -
Total Power Dissipation - W
T
A -
Operating Ambient Temperature -
˚C
0
P
d vs.
T
A
Solid line :
PC2933AHF, 2905AHF
Broken line :
PC2933AHB, 2905AHB
PC2933AT, 2905AT
With infinite heatsink
Without heatsink
Data Sheet G15374EJ2V0DS
8
µ
µµ
µ
PC2933A, 2905A
1.0
0.8
0.6
0.4
0.2
0
-25 +1250 +150+75
V
DIF
- Dropout Voltage - V
V
DIF
vs.T
J
+100+50+25
PC2905A
PC2933A
I
O
= 1.0 A
T
J
Operating Junction Temperature -
˚C
3
2
1
0
0
20
DIF
I
O peak
- Peak Output Current - A
I
O peak
vs. V
DIF
PC2933A
10 155
T
J
= 125
˚C
T
J
= 25
˚C
T
J
= 0
˚C
- Dropout Voltage - V
V
m
3
2
1
0
0
20
IO peak - Peak Output Current - A
vs.V
IO peak DIF
PC2905A
10 15
T
J
= 125
˚C
T
J
= 25
˚C
T
J
= 0
˚C
V
DIF - Dropout Voltage - V
R R vs. f
RR - Ripple Rejection - dB
80
70
0100 1 k 10 k 100 k
f - Frequency - Hz
60
50
40
30
20
10
T
J
= 25
˚C
I
O
= 1 A
PC2933A
PC2905A
4.3 V V
IN
16 V
6 V V
IN
16 V ( PC2905A)
( PC2933A)
R R vs. I
O
80
70
30 0.2 0.4 0.6 1.0
0.80
60
50
40
PC2933A
PC2905A
O
- Output Current - A
I
RR - Ripple Rejection - dB
f = 120 Hz
T
J
= 25
˚C
4.3 V V
IN
16 V
6 V V
IN
16 V ( PC2905A)
( PC2933A)
V
DIF
vs. I
O
V
DIF
- Dropout Voltage - V
1.0
00.2 0.4 0.6 1.0
I
O
- Output Current - A
0.8
0.6
0.4
0.2
00.8
PC2905A
PC2933A
T
J
= 25
˚C
Data Sheet G15374EJ2V0DS 9
µ
µµ
µ
PC2933A, 2905A
V
O
vs.I
O
PC2933A
6
5
0 0.4 0.8 1.2 2.4
1.6
4
3
1
2.0
2
V
IN
= 16 V
V
IN
= 4.3 V V
IN
= 5 V
T
J
= 25
˚C
I
O
- Output Current - A
V
O
- Output Voltage - V
6
5
0 0.4 0.8 1.2 2.4
1.6
4
3
1
2.0
2V
IN
= 16 V
V
IN
= 6 V
V
IN
= 8 V
V
O
vs.I
O
PC2905A
V
O
- Output Voltage - V
I
O
- Output Current - A
T
J
= 25
˚C
Data Sheet G15374EJ2V0DS
10
µ
µµ
µ
PC2933A, 2905A
PACKAGE DRAWINGS
µ
µµ
µ
PC2933AHF, 2905AHF
D 17.0±0.3
3PIN PLASTIC SIP (MP-45G)
NOTE
Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
ITEM MILLIMETERS
P3HF-254B-4
G0.25
H 2.54 (T.P.)
A 10.0±0.2
I5.0±0.3
U2.4±0.5
V
Y8.9±0.7
Z1.30±0.2
J
K
L8.5±0.2
B7.0±0.2
C1.50±0.2
E
F0.75±0.10
M8.5±0.2
N
P2.8±0.2
3.3±0.2
φ
2.46±0.2
5.0±0.2
4.5±0.2
0.65±0.10
132
M
A
BE
I
D
L
M
K
Y
J
H
C
FG
Z
N
P
U
V
Data Sheet G15374EJ2V0DS 11
µ
µµ
µ
PC2933A, 2905A
µ
µµ
µ
PC2933AHB, 2905AHB
MP-3(SC-64) (Unit: mm)
123
4
2.32.3
0.75
1.1
±
0.1
0.5
1.6
±
0.2
5.0
±
0.2
6.5 0.2
5.5
±
0.27.0 MIN.
+
0.2
–
0.1
1.5
+
0.2
–
0.1
13.7 MIN.
2.3
±
0.2
0.5
±
0.1
0.5
+
0.2
–
0.1
±
µ
µµ
µ
PC2933AT, 2905AT
MP-3Z (SC-63) (Unit: mm )
2.3 2.3 0.8
0.9 MAX. 0.8 MAX.
1.1
±
0.2
0.8
123
4
4.3 MAX.
10.0 MAX.
0.5 1.0 MIN.
1.5 TYP.
2.0 MIN.
5.5
±
0.2 1.5
+
0.2
–
0.1
6.5
±
0.2
2.3
±
0.2
5.0
±
0.2 0.5
±
0.1
Data Sheet G15374EJ2V0DS
12
µ
µµ
µ
PC2933A, 2905A
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our
sales offices.
For more details, refer to our document “SEM ICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Surface Mount Device
µ
µµ
µ
PC2933AT, 2905AT: MP-3Z (SC-63)
Process Conditions Symbol
Infrared Ray Refl ow Peak temperature: 235° C or below (Package surface temperature),
Reflow time: 30 sec onds or less (at 210°C or higher),
Maximum number of refl ow proces ses: 2 t i mes or less.
IR35-00-2
Vapor Phase Soldering Peak temperature: 215° C or bel ow (Pac kage surfac e temperat ure),
Reflow time: 40 sec onds or less (at 200°C or higher),
Maximum number of refl ow proces ses: 2 t i mes or less.
VP15-00-2
Wave Soldering Solder temperature: 260° C or bel ow, Flow time: 10 seconds or les s,
Maximum number of fl ow proces ses: 1 ti me,
Pre-heating t emperature: 120°C or below (Package s urface temperature).
WS60-00-1
Partial Heating Method Pin temperature: 300° C or bel ow,
Heat time: 3 s econds or less (Per each s i de of the device).
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Through-hole devices
µ
PC2933AHF, 2905AHF: MP-45G
µ
PC2933AHB, 2905AHB: MP-3
Process Conditions
Wave solderi ng
(only to leads )
Solder temperature: 260° C or bel ow,
Flow time: 10 seconds or less.
Partial heating method P in temperature: 300°C or below,
Heat time: 3 seconds or les s (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
Data Sheet G15374EJ2V0DS 13
µ
µµ
µ
PC2933A, 2905A
NOTES ON USE
When the
µ
PC2933A, 2905A are used with an input voltage that is lower than the value indicated in the recommended
operating conditions, a large quiescent current flows through the device due to saturation of the transistor of the output
stage. (Refer to the IBIAS (IBIAS(S)) vs. VIN curves in TYPICAL CHARACTERISTICS).
These products have saturation protector, but a current of up to 80 mA MAX. may flow through the device. Thus the
power supply on the input side must have sufficient capacity to allow this quiescent current to pass when the device starts
up.
REFERENCE DOCUMENTS
Docum ent Name Docum ent No.
QUALITY GRADES ON NEC SE MI CONDUCTOR DEV ICES C11531E
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL C10535E
VOLTAGE RE GULATOR OF SMD G11872E
SEMICONDUCTOR S ELECTION GUI DE – PRODUCTS AND P A CKAGES X13769E
Data Sheet G15374EJ2V0DS
14
µ
µµ
µ
PC2933A, 2905A
[MEMO]
Data Sheet G15374EJ2V0DS 15
µ
µµ
µ
PC2933A, 2905A
[MEMO]
µ
µµ
µ
PC2933A, 2905A
M8E 00. 4
The information in this document is current as of September, 2001. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
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and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
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systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
•
•
•
•
•
•
