UCC29411, UCC29412 UCC29413, UCC39411 UCC39412, UCC39413 www.ti.com SLUS245E - MARCH 2000 - REVISED JULY 2005 LOW-POWER SYNCHRONOUS BOOST CONVERTER FEATURES * * * * * * * * PW PACKAGE (TOP VIEW) 1 V Input Voltage Operation Start-Up Ensured Under Full Load on Main Output, and Operation Down to 0.5 V 200 mW Output Power at Battery Voltages as Low as 0.8 V Secondary 7 V Supply from a Single Inductor Output Fully Disconnected in Shutdown Adaptive Current Mode Control for Optimum Efficiency High Efficiency Over Wide Operating Range 6 A Shutdown Supply Current Output Reset Function with Programmable Reset Period 1 2 3 4 VIN SD/FB RESB CT 8 7 6 5 VGD VOUT SW GND D PACKAGE (TOP VIEW) VOUT VGD VIN SD/FB 1 8 2 7 3 6 4 5 SW GND CT RESB DESCRIPTION The UCCx9411 family of low-input voltage, single-inductor-boost converters is optimized to operate from a single or dual alkaline cell, and steps up to a 3.3 V, 5 V, or adjustable output at 200 mW. The UCCx9411 family also provides an auxiliary 7 V output, primarily for the gate-drive supply, which can be used for applications requiring an auxiliary output, such as 5 V, by linear regulating. The primary output starts up under full load at input voltages typically as low as 0.8 V with a ensured max of 1 V, and operates down to 0.5 V once the converter is operating, thereby maximizing battery usage. SIMPLIFIED BLOCK DIAGRAM AND APPLICATION CIRCUIT + 22 H 100 F SW 1 VGD VIN 1 V TO 3.5 V 6 3.3 V 200 mW 8 1.2 7 100 F START-UP CIRCUITRY VOUT 100 F 0.5 MODULATOR CONTROL CIRCUIT SYNCHRONOUS RECTIFICATION CIRCUITRY ANTI-CROSS CONDUCTION START-UP MULTIPLEXING LOGIC MAX INPUT POWER CONTROL ADAPTIVE CURRENT CONTROL R RES RESB SD/FB 2 RESET CONTROL CIRCUIT GLITCH SUPRESSION PROGRAMMABLE TIMING 3 CT 4 5 A. GND CT Pinout shown is for the TSSOP Package. Consult Package Descriptions for the SOIC configurations. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2005, Texas Instruments Incorporated UCC29411, UCC29412 UCC29413, UCC39411 UCC39412, UCC39413 www.ti.com SLUS245E - MARCH 2000 - REVISED JULY 2005 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (CONTINUED) The UCCx9411 family is designed to accommodate demanding applications such as pagers and cell phones that require high efficiency over a wide operating range of several milliwatts to a couple of hundred milli-watts. High efficiency at low output current is achieved by optimizing switching and conduction losses with a low total quiescent current. At higher output current, the 0.5 switch and 1.2 synchronous rectifier along with continuous mode conduction provide high power efficiency. The wide input voltage range of the UCCx9411 family can accommodate other power sources such as NiCd and NiMH. The UCCx9411 family also provides shutdown control. Packages available are the 8-pin SOIC (D) and 8-pin TSSOP (PW) to optimize board space. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) VALUE/UNIT VIN Input voltage SD Input voltage -0.3 V to VIN VGD Input voltage -0.3 V to 14 V SW Input voltage -0.3 V to 15 V VOUT Output voltage -0.3 V to 10 V (1) (2) -0.3 V to 10 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Currents are positive into, negative out of the specific terminal. Consult Packaging Section of the Portable Products Data Book (SLUD001) for thermal limitations and considerations of packages. available options TJ (1) PACKAGE PW (1) PACKAGE D (1) OUTPUT VOLTAGE OUTPUT VOLTAGE ADJ 3.3 V 5V ADJ 3.3 V 5V -40C to 85C 29411PW 29412PW 29413PW 29411D 29412D 29413D 0C to 70C 39411PW 39412PW 39413PW 39411D 39412D 39413D The UCC39411, UCC39412 and UCC39413 is avilable in tape and reel. Add TR suffix to device type (e.g. UCC39411PWTR or UCC39411DTR) to order quantities of 2000 devices per reel (PW package) or 2500 devices per reel (D package). ELECTRICAL CHARACTERISTICS TJ = 0C to 70C for the UCC3941x, TJ = -40C to 85C for the UCC2941x, VIN = 1.25 V for UCC39411, UCC39412, VIN = 2.5 V for the UCC39413, TA = TJ PARAMETER TEST CONDITIONS UCC3941x MIN UCC2941x TYP MAX No external VGD load, TJ = 25C, IOUT = 60 mA (1) 0.8 No external VGD load, IOUT = 60 mA (1) 0.9 MIN UNITS TYP MAX 1 0.8 1 V 1.1 1.2 1.4 V 0.7 V 3.2 V 16 A INPUT VOLTAGE SECTION Minimum start-up voltage Minimum dropout voltage No external VGD load, IOUT = 10 mA (1) Input voltage range Quiescent supply current (1) (2) 2 0.5 1.1 See (2) 3.2 6 12 1.3 8 Ensured by design. Not production tested. For the UCC39411 FB = 1.306 V, VGD = 7.7 V, For the UCC39412 VOUT = 3.5 V and VGD = 7.7 V, For the UCC39413 VOUT = 5.3 V, VGD=9.3 V. UCC29411, UCC29412 UCC29413, UCC39411 UCC39412, UCC39413 www.ti.com SLUS245E - MARCH 2000 - REVISED JULY 2005 ELECTRICAL CHARACTERISTICS (continued) TJ = 0C to 70C for the UCC3941x, TJ = -40C to 85C for the UCC2941x, VIN = 1.25 V for UCC39411, UCC39412, VIN = 2.5 V for the UCC39413, TA = TJ PARAMETER Supply current at shutdown UCC3941x TEST CONDITIONS MIN UCC2941x MAX 6 MIN UNITS TYP MAX 12 8 16 A 15 28 20 37 A 3 6 5 10 A 3.2 3.3 3.39 3.15 3.3 3.45 V 3.17 3.3 3.43 3.11 3.3 3.5 V 4.85 5 5.15 4.78 5 5.23 V 4.8 5 5.2 4.71 5 5.3 V 1.212 1.25 1.288 1.194 1.25 1.306 V 5.5 V SD = GND TYP OUTPUT SECTION (2) Quiescent supply current See Supply current at shutdown SD = GND Regulation voltage (UCC39412) Regulation voltage (UCC39413) ADJ voltage (UCC39411) 1 V < VIN < 3 V 1 V < VIN < 3 V, 0 mA < IOUT < 60 mA (1) 1 V < VIN < 5 V 1 V < VIN < 5 V, 0 mA < IOUT < 60 mA (1) 1 V < VIN < 3 V Maximum output voltage (UCCx9411) 5.5 VGD OUTPUT SECTION Quiescent supply current See (2) 20 40 27 55 A Supply current at shutdown SD = GND 20 40 27 55 A 7 7.7 6.3 7 7.7 V Regulation voltage (UCC39411/2) Regulation voltage (UCC39413) 1 V < VIN < 3 V 1 V < VIN < 3 V, 0 mA < IOUT < 10 6.3 mA (1) 6.3 7 7.7 6.3 7 7.7 V 1 V < VIN < 5 V 7.7 8.5 9.3 7.7 8.5 9.3 V 1 V < VIN < 5 V, 0 mA < IOUT < 10 mA (3) 7.7 8.5 9.3 7.7 8.5 9.3 V 180 250 300 180 250 300 mA 385 550 715 385 550 715 mA D package 0.5 0.75 0.6 0.85 (3) 50 D package 1.2 1.8 0.4 0.6 0.8 2 5 15 5 20 INDUCTOR CHARGING SECTION (L = 22 H) Peak discontinuous current Operating range, L = 22 H Peak continuous current Charge switch RDS(on) Current limit delay See 50 ns SYNCHRONOUS RECTIFIER SECTION Rectifier RDS(on) 1.4 2.16 SHUTDOWN SECTION Threshold Input bias current SD = GND SD = 1.25 V 0.2 0.6 2 0.9 V 5 15 A 20 100 nA RESET SECTION Threshold (UCC39411) 1.08 1.125 1.17 1.07 1.125 1.18 V Threshold (UCC39412) 2.85 2.97 3.09 2.83 2.97 3.11 V 4.32 4.5 4.68 4.3 4.5 4.7 V 113 188 300 94 188 300 ms Threshold (UCC39413) Reset period CT = 0.15 F VOUT to reset delay VOUT falling at -1 mV/s (3) Sink current Output low voltage 1 IOUT = 500 A Output leakage (3) 60 60 20 1 s 20 mA 0.1 0.1 V 0.5 0.5 A Ensured by design. Not production tested. 3 UCC29411, UCC29412 UCC29413, UCC39411 UCC39412, UCC39413 www.ti.com SLUS245E - MARCH 2000 - REVISED JULY 2005 PIN ASSIGNMENTS VIN: Input voltage to supply the IC during start-up. After the output is running the IC draws power from VOUT or VGD. SW: An inductor is connected between this pin and VIN. The VGD (gate drive supply) flyback diode is also connected to this pin. When servicing the main output supply this pin pulls low, charging the inductor, then shuts off dumping the energy through the synchronous rectifier to the output. When servicing the VGD supply, the internal synchronous rectifier stays off and the energy is diverted to VGD through the flyback diode. During discontinuous portions of the inductor current, a MOSFET resistively connects VIN to SW damping excess circulating energy to eliminate undesired high-frequency ringing. VGD: The VGD pin, which is coarsely regulated around 7 V (8.5 V for the UCC39413), is primarily used for the gate drive supply for the power switches in the IC. This pin can be loaded with up to 10 mA as long as it does not present a load at voltages below 2 V (this ensures proper start-up of the IC). The VGD supply can go as low as 6.3 V without interfering with the servicing of the main output. When below 6.3 V, VGD has the highest priority. VOUT: Main output voltage (3.3 V, 5 V, or adjustable), has highest priority in the multiplexing scheme, as long as VGD is above the critical level of 6.3 V. Startup at full load is achievable at input voltages down to 1 V. CT: This pin provides the timer for determining the reset period. The period is controlled by placing a capacitor to ground of value C = (0.81e-6) x t where t is the desired reset period. RESB: This pin provides an active low signal to alert the user when the main output voltage falls below 10% of its targeted value. The open-drain output can be used to reset a microcontroller that may be powered off of the main output voltage. SD/FB: For the UCC39411, this pin is used to adjust the output voltage via a resistive divider from VOUT. It also serves as the shutdown pin for all three versions. Pulling this pin low provides a shutdown signal to the IC. GND: Ground of the IC. 4 UCC29411, UCC29412 UCC29413, UCC39411 UCC39412, UCC39413 www.ti.com SLUS245E - MARCH 2000 - REVISED JULY 2005 APPLICATION INFORMATION OPERATION A detailed block diagram of the UCC39411 is shown in Figure 1. Unique control circuitry provides high-efficiency power conversion for both light and heavy loads by transitioning between discontinuous and continuous conduction based on load conditions. Figure 2 depicts converter waveforms for the application circuit shown in Figure 3. A single 22H inductor provides the energy pulses required for a highly efficient 3.3 V converter at up to 200 mW output power. At time t1, the 3.3 V output voltage has dropped below its lower threshold, and the inductor is charged with an on time determined by: tON = 5.5 s/VIN. For a 1.25 V input and a 22 H inductor, the resulting peak current is approximately 250 mA. At time t2, the inductor begins to discharge with a minimum off time of approximately 1 ms. Under lightly loaded conditions, the amount of energy delivered in this single pulse satisfies the voltage-control loop, and the converter does not command any more energy pulses until the output again drops below the lower-voltage threshold. At time t3, the VGD supply drops below its lower threshold, but the output voltage is still above its threshold point. This results in an energy pulse to the gate-drive supply at t4. In some cases, a single pulse supplied to VGD is insufficient to raise the VGD voltage level enough to satisfy the voltage loop. Under this condition, multiple pulses are supplied to VGD. Note that when the UCC3941x is servicing VGD only, the IC maintains a discontinuous mode of operation. After time t4, the 3.3 V output drops below its threshold and requests to be serviced once the VGD cycle has completed, which occurs at time t5. Time t6 represents a transition between light load and heavy load. A single energy pulse is not sufficient to force the output voltage above its upper threshold before the minimum off time has expired and a second charge cycle is commanded. Since the inductor current does not reach zero in this case, the peak current is greater than 250 mA at the end of the next charge on time. The result is a ratcheting of inductor current until either the output voltage is satisfied, or the converter reaches its set current limit. At time t7, the gate drive voltage has dropped below its 7 V threshold but the converter continues to service the output because it has higher priority unless VGD drops below about 6.3 V. Between time t7 and t8, the converter reaches its peak current limit. Once the peak current is reached, the converter operates in continuous mode with approximately 60 mA of inductor current ripple. At time t8, the 3.3 V output is satisfied and the converter can service the gate drive voltage, VGD, which occurs at time t9. 5 A. 6 2 6 5 VGD CT RESET Figure 1. Low Power Synchronous Boost 2.5 V VOUT VREF GOOD 5 V GS VGD RESET TIMER CT VLOW VBAT VGD 1.25 V REFERENCE 0.66 A MAX FROM SD INTERNAL BIAS VDD RISING EDGE DELAY T ON = 5.5 E -6 VBAT 50 ns R.E.D. C PUMP 8 3 200 kHZ START-UP OSCILLATOR AND CONTROL SW VIN VON 50 ns R.E.D. VGD 1 s R.E.D. VON SD R Q Q t OFF TIMER 1- s RISING EDGE DELAY VBAT R SD PRIORITY ENCODER D CLK FROM SD VREF GOOD VGD Q 6 V (UCC39411/2) 7.5 V (UCC39413) VGD 7.5 V (UCC39411/2) 8.5 V (UCC39413) VGD 1.25 V (UCC39411) 3.3 V (UCC39412) 5.0 V (UCC39413) 0.5V SD 1.2 7 4 1 SD/FB VOUT UCC29411, UCC29412 UCC29413, UCC39411 UCC39412, UCC39413 SLUS245E - MARCH 2000 - REVISED JULY 2005 www.ti.com APPLICATION INFORMATION (continued) Switches are shown in the low state. Pinouts as shown is for the 8-pin D package (SOIC). See package description for 8-pin PW (TSSOP). UCC29411, UCC29412 UCC29413, UCC39411 UCC39412, UCC39413 www.ti.com SLUS245E - MARCH 2000 - REVISED JULY 2005 APPLICATION INFORMATION (continued) VGD RIPPLE 50 mV/DIV 7V 200 mVP-P TYPICAL OUTPUT RIPPLE 20 mV/DIV 3.3 V 20 mVP-P CURRENT LIMIT TYPICAL INDUCTOR CURRENT t2 t1 t3 t4 t5 t6 t7 LIGHT LOAD CURRENT t8 t9 HIGH LOAD CURRENT Figure 2. Inductor Current and Output Ripple Waveforms L = 10 H TO 100 H 10 F 8 VGD 1 6 VIN SW VOUT 7 10 F R1 4 80 nF CT SD/FB 1-2 CELL ALKALINE 1.0 V TO 3.2 V 100 F 2 VOUT 100 k R2 UDG-98069 3 A. RESB GND 5 Pinout shown is for the TSSOP package. Consult Package Description for the SOIC configuration. Figure 3. Low Power Synchronous Boost Converter ADJ Version -200 mW SHUTDOWN CONTROL Shutdown of the UCC3941x is controlled via the interface with the SD/FB pin. Pulling the SD/FB pin low, for all 7 UCC29411, UCC29412 UCC29413, UCC39411 UCC39412, UCC39413 www.ti.com SLUS245E - MARCH 2000 - REVISED JULY 2005 APPLICATION INFORMATION (continued) versions, causes the IC to go into shutdown. In the UCC39412 and UCC39413, the SD/FB pin is used solely as a shutdown function. Therefore, the SD/FB pin for the UCC39412 and UCC39413 can be directly controlled using conventional CMOS or transistor to transistor logic (TTL) technology. For the UCC39411, interface into the SD/FB is slightly more complicated due to the added feedback function. When feeding back the output voltage to the SD/FB pin on the UCC39411, the IC requires a Thevenin impedance of at least 200 k (500 k for industrial/military applications) to ground. Then, to accomplish shutdown of the IC, an open-drain device may be used. COMPONENT SELECTION INDUCTOR SELECTION An inductor value of 22 H works well in most applications, but values between 10 H to 100 H are also acceptable. Lower value inductors typically offer lower ESR and smaller physical size. Due to the nature of the bang-bang controllers, larger inductor values typically result in larger overall voltage ripple, because once the output voltage level is satisfied the converter goes discontinuous, resulting in the residual energy of the inductor causing overshoot. It is recommended to keep the ESR of the inductor below 0.15 for 200 mW applications. OUTPUT CAPACITOR SELECTION Once the inductor value is selected, the capacitor value determines the ripple of the converter. The worst case peak-to-peak ripple of a cycle is determined by two components, one is due to the charge storage characteristic, and the other is the ESR of the capacitor. The worst case ripple occurs when the inductor is operating at max current and is expressed as follows: 2 I L CL V I C CL ESR 2C V V O I (1) * * * * * ICL = the peak inductor current = 550 mA V = Output ripple VO = Output voltage VI = Input voltage CESR = ESR of the output capacitor INPUT CAPACITOR SELECTION Since the UCCx9411 family does not require a large decoupling capacitor on the input voltage to operate properly, a 10 F cap is sufficient for most applications. Optimum efficiency occurs when the capacitor value is large enough to decouple the source impedance, this usually occurs for capacitor values in excess of 100 F. RESET OPERATION A reset function is provided to prevent the microprocessor from executing code during undervoltage conditions, typically during power up or power down. The reset voltage threshold is fixed at 90% of the output voltage for all versions of the UCCx941x. To prevent erratic operation in noisy environments, a glitch filter is provided. To allow sufficient time for the microprocessor clock to stabilize, a user-programmable reset period is provided. The reset period, the time from the output voltage rising above 90% of nominal to RESB going high, is programmed via an external capacitor connected to the CT pin. The reset period is defined as: tRP = C x 1.25 where C is in F, and tRP is in seconds. A typical reset profile during power up is shown in Figure 4 and power down in Figure 5. 8 UCC29411, UCC29412 UCC29413, UCC39411 UCC39412, UCC39413 www.ti.com SLUS245E - MARCH 2000 - REVISED JULY 2005 TYPICAL CHARACTERISTICS POWER-UP SEQUENCE POWER-DOWN SEQUENCE VOUT VOUT RESB RESB CT Figure 4. Figure 5. TYPICAL EFFICIENCY vs LOAD CURRENT TYPICAL EFFICIENCY vs LOAD CURRENT 100 90 100 VIN = 3.0 V 90 80 IN = 3.0 V 80 V 70 V IN = 2.4 V IN = 1.2 V 60 70 Efficiency - % Efficiency - % V 50 40 30 0 0 0.01 0.025 Load Current - A Figure 6. 0.04 0.06 V IN = 1.2 V UCC39411 @ 3.3 VOUT L = 22 H, DO1608-223 20 10 0.001 = 2.4 V 40 10 0.0001 IN 50 30 UCC39411 @ 3.3 VOUT L = 22 H, DO3316-223 20 V 60 0.0001 0.001 0.01 0.025 0.04 0.06 Load Current - A Figure 7. 9 UCC29411, UCC29412 UCC29413, UCC39411 UCC39412, UCC39413 www.ti.com SLUS245E - MARCH 2000 - REVISED JULY 2005 TYPICAL CHARACTERISTICS (continued) TYPICAL EFFICIENCY vs LOAD CURRENT TYPICAL EFFICIENCY vs LOAD CURRENT 100 90 100 V IN = 3.0 V 90 80 80 70 V IN V = 2.4 V IN 70 = 1.2 V Efficiency - % Efficiency - % V = 3.0 V IN 60 50 40 30 20 60 50 40 30 UCC39412 L = 22 H, DO3316-223 10 0 0 0.01 0.02 0.03 UCC39413 L = 15 H, DO3316-153 20 10 0.0001 0.001 0.04 0.06 0.0001 0.001 Load Current - A 0.03 Figure 9. TYPICAL EFFICIENCY vs LOAD CURRENT TYPICAL EFFICIENCY vs LOAD CURRENT 0.04 100 V IN = 3.0 V 90 V = 3.0 V IN 80 70 V IN V = 2.4 V IN 70 = 1.2 V Efficiency - % Efficiency - % 0.02 Load Current - A 80 60 50 40 30 60 50 40 10 0 0 0.01 0.02 0.03 Load Current - A Figure 10. UCC39413 L = 15 H, DO1608-153 20 10 0.0001 0.001 0.04 0.06 VIN = 1.2 V VIN = 2.4 V 30 UCC39412 L = 22 H, DO1608-223 20 10 0.01 Figure 8. 100 90 V = 1.2 V IN V = 2.4 V IN 0.0001 0.001 0.01 0.02 Load Current - mA Figure 11. 0.03 0.04 UCC29411, UCC29412 UCC29413, UCC39411 UCC39412, UCC39413 www.ti.com SLUS245E - MARCH 2000 - REVISED JULY 2005 TYPICAL CHARACTERISTICS (continued) TYPICAL EFFICIENCY vs LOAD CURRENT (2 CELL APPLICATION) MAXIMUM LOAD CURRENT, 2 CELL APPLICATION vs INPUT CURRENT 155 100 150 95 Efficiency - % 90 V V 85 V 80 IN IN IN IN 145 = 3.0 V = 2.5 V = 2.0 V = 1.8 V Load Current - mA V 140 135 130 125 UCC39411 @ 3.3 VOUT L = DO1608-223 120 75 UCC39411 @ 3.3 VOUT L = DO1608-223 115 70 110 75 100 Load Current - mA Figure 12. 150 1.8 2.0 2.5 3.0 Input Voltage - V Figure 13. 11 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) UCC29411D OBSOLETE UCC29411DG4 OBSOLETE UCC29412PW OBSOLETE UCC29412PWG4 OBSOLETE UCC39411D ACTIVE UCC39411DG4 Package Type Package Pins Package Drawing Qty SOIC Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) D 8 TBD Call TI Call TI -40 to 85 UCC 29411 SOIC D 8 TBD Call TI Call TI -40 to 85 TSSOP PW 8 TBD Call TI Call TI -40 to 85 TSSOP PW 8 TBD Call TI Call TI -40 to 85 SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC 39411 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC 39411 29412 UCC39411N LIFEBUY PDIP P 8 TBD Call TI Call TI 0 to 70 UCC39411NG4 LIFEBUY PDIP P 8 TBD Call TI Call TI 0 to 70 UCC39411PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 39411 UCC39411PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 39411 UCC39412PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-2-260C-1 YEAR 0 to 70 39412 UCC39412PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 39412 UCC39412PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 39412 UCC39412PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 39412 UCC39413D OBSOLETE SOIC D 8 TBD Call TI Call TI 0 to 70 UCC 39413 UCC39413DG4 OBSOLETE SOIC D 8 TBD Call TI Call TI 0 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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