© Semiconductor Components Industries, LLC, 2012
June, 2012 − Rev. 5
1Publication Order Number:
MC74HCT4851A/D
MC74HCT4851A,
MC74HCT4852A
Analog Multiplexers/
Demultiplexers with
Injection Current Effect
Control with LSTTL
Compatible Inputs
Automotive Customized
This device is pin compatible to standard HC405x and MC1405xB
analog mux/demux devices, but feature injection current effect
control. This makes them especially suited for usage in automotive
applications where voltages in excess of normal logic voltage are
common.
The injection current effect control allows signals at disabled analog
input channels to exceed the supply voltage range without affecting
the signal of the enabled analog channel. This eliminates the need for
external diode/ resistor networks typically used to keep the analog
channel signals within the supply voltage range.
The devices utilize low power silicon gate CMOS technology. The
Channel Select and Enable inputs are compatible with standard CMOS
or LSTTL outputs.
Features
•Injection Current Cross−Coupling Less than 1mV/mA
(See Figure 6)
•Pin Compatible to HC405x and MC1405xB Devices
•Power Supply Range (VCC − GND) = 4.5 to 5.5 V
•In Compliance With the Requirements of JEDEC Standard
No. 7 A
•Chip Complexity: 154 FETs or 36 Equivalent Gates
•These Devices are Pb−Free and are RoHS Compliant
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MARKING
DIAGRAMS
SOIC−16
D SUFFIX
CASE 751B
TSSOP−16
DT SUFFIX
CASE 948F
1
16
1
16
1
16
HCT485xAG
AWLYWW
HCT4
85xA
ALYWG
G
1
16
X = 1 or 2
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G= Pb−Free Package
1
16 SOIC−16 WIDE
DW SUFFIX
CASE 751G
1
16
HCT485xA
AWLYWWG
See detailed ordering and shipping information in the package
dimensions section on page 11 of this data sheet.
ORDERING INFORMATION
(Note: Microdot may be in either location)
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2
Figure 1. MC74HCT4851A Logic Diagram
Single−Pole, 8−Position Plus Common Off
X0 13
X1 14
X2 15
X3 12
X4 1
X5 5
X6 2
X7 4
A11
B10
C9
ENABLE 6
MULTIPLEXER/
DEMULTIPLEXER X
3
ANALOG
INPUTS/
CHANNEL
INPUTS
PIN 16 = VCC
PIN 8 = GND
COMMON
OUTPUT/
INPUT
1516 14 13 12 11 10
21 34567
VCC
9
8
X2 X1 X0 X3 A B C
X4 X6 X X7 X5 Enable NC GND
Figure 2. MC74HCT4851A 16−Lead Pinout (Top View)
OUTPUTS
SELECT
L
L
L
L
H
H
H
H
X
L
L
H
H
L
L
H
H
X
L
H
L
H
L
H
L
H
X
FUNCTION TABLE − MC74HCT4851A
Control Inputs
ON Channels
Enable
Select
CBA
X0
X1
X2
X3
X4
X5
X6
X7
NONE
L
L
L
L
L
L
L
L
H
Figure 3. MC74HCT4852A Logic Diagram
Double−Pole, 4−Position Plus Common Off
X0 12
X1 14
X2 15
X3 11
Y0 1
Y1 5
Y2 2
Y3 4
A10
B9
ENABLE 6
X SWITCH
Y SWITCH
X
13
ANALOG
INPUTS/OUTPUTS
CHANNEL‐SELECT
INPUTS PIN 16 = VCC
PIN 8 = GND
COMMON
OUTPUTS/INPUTS
L
L
H
H
X
L
H
L
H
X
FUNCTION TABLE − MC74HCT4852A
Control Inputs
ON ChannelsEnable
Select
BA
X0
X1
X2
X3
L
L
L
L
H
X = Don’t Care
Figure 4. MC74HCT4852A 16−Lead Pinout (Top View)
1516 14 13 12 11 10
21 34567
VCC
9
8
X2 X1 X X0 X3 A B
Y0 Y2 Y Y3 Y1 Enable NC GND
Y
3
Y0
Y1
Y2
Y3
NONE
MC74HCT4851A, MC74HCT4852A
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3
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC Positive DC Supply Voltage (Referenced to GND) –0.5 to + 7.0 V
Vin DC Input Voltage (Any Pin) (Referenced to GND) –0.5 to VCC + 0.5 V
IDC Current, Into or Out of Any Pin $25 mA
PDPower Dissipation in Still Air, SOIC Package†
TSSOP Package†
500
450
mW
Tstg Storage Temperature Range –65 to + 150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds
SOIC or TSSOP Package 260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC Positive DC Supply Voltage (Referenced to GND) 4.5 5.5 V
Vin DC Input Voltage (Any Pin) (Referenced to GND) GND VCC V
VIO*Static or Dynamic Voltage Across Switch 0.0 1.2 V
TAOperating Temperature Range, All Package Types – 55 + 125 °C
tr, tfInput Rise/Fall Time VCC = 2.0 V
(Channel Select or Enable Inputs) VCC = 4.5 V
VCC = 6.0 V
0
0
0
1000
500
400
ns
*For voltage drops across switch greater than 1.2 V (switch on), excessive VCC current may be
drawn; i.e., the current out of the switch may contain both VCC and switch input components. The
reliability of the device will be unaffected unless the Maximum Ratings are exceeded.
DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted
Symbol Parameter Condition
VCC
V
Guaranteed Limit
Unit
−55 to 25°C≤85°C≤125°C
VIH Minimum High−Level Input Voltage,
Channel−Select or Enable Inputs
Ron = Per Spec 4.5
to
5.5
2.0 2.0 2.0 V
VIL Maximum Low−Level Input Voltage,
Channel−Select or Enable Inputs
Ron = Per Spec 4.5
to
5.5
0.8 0.8 0.8 V
Iin Maximum Input Leakage Current on Digital Pins
(Enable/A/B/C)
Vin = VCC or GND 5.5 ±0.1 ±1.0 ±1.0 mA
ICC Maximum Quiescent Supply Current
(per Package)
Vin(digital) = VCC or GND
Vin(analog) = GND
5.5 2.0 20 40 mA
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
MC74HCT4851A, MC74HCT4852A
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4
DC CHARACTERISTICS — Analog Section
Symbol Parameter Condition VCC
Guaranteed Limit
Unit
−55 to 25°C≤85°C≤125°C
Ron Maximum “ON” Resistance Vin = VIL or VIH;VIS = VCC to
GND; IS ≤ 2.0 mA
4.5
5.5
550
400
650
500
750
600
W
DRon Delta “ON” Resistance Vin = VIL or VIH; VIS = VCC/2
IS ≤ 2.0 mA
4.5
5.5
80
60
100
80
120
100
W
Ioff Maximum Off−Channel Leakage Current,
Any One Channel
Common Channel
Vin = VCC or GND
5.5 ±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
mA
Ion Maximum On−Channel Leakage
Channel−to−Channel
Vin = VCC or GND
5.5 ±0.1 ±0.1 ±0.1
mA
AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns, VCC = 5.0 V ± 10%)
Symbol Parameter VCC −55 to 25°C≤85°C≤125°C Unit
tPHL,
tPLH
Maximum Propagation Delay, Analog Input to Analog Output 5.0 40 45 50 ns
tPHL,
tPHZ,PZH
tPLH,
tPLZ,PZL
Maximum Propagation Delay, Enable or Channel−Select to Analog Output 5.0 80 90 100 ns
Cin Maximum Input Capacitance Digital Pins
(All Switches Off) Any Single Analog Pin
(All Switches Off) Common Analog Pin
10
35
40
10
35
40
10
35
40
pF
CPD Power Dissipation Capacitance Typical 5.0 20 pF
INJECTION CURRENT COUPLING SPECIFICATIONS (VCC = 5V, TA = −55°C to +125°C)
Symbol Parameter Condition Typ Max Unit
VDout Maximum Shift of Output Voltage of Enabled Analog Channel Iin* ≤ 1 mA, RS ≤ 3,9 kW
Iin* ≤ 10 mA, RS ≤ 3,9 kW
Iin* ≤ 1 mA, RS ≤ 20 kW
Iin* ≤ 10 mA, RS ≤ 20 kW
0.1
1.0
0.5
5.0
1.0
5.0
2.0
20
mV
* Iin = Total current injected into all disabled channels.
Figure 5. Typical On Resistance VCC = 4.5V
MC74HCT4851A, MC74HCT4852A
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5
Current Source
HP4155C
Smu #2
Vin1 = 4.9 V (Smu3)
Iin1 meas. Here
Vm1 connected here.
Vin2 / Iin2 meas. here.
GND or VSS
3
NOTES: Rs = 3.9 KW or 20 KW.
NOTES: Vm1 & Vm2 are internal
NOTES: HP4155C Voltmeters.
16
4
13
6
8
External DC P.S.
VCC = 5 V
XVout
Vm2 connected here.
X7
X0
RS
Figure 6. Injection Current Coupling Specification
MC74HCT4851A, MC74HCT4852A
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6
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Channel 8
Common Out
VCC
HCT4051A Microcontroller
A/D - Input
VCC
5V
6V5V
Sensor
(8x Identical Circuitry)
Figure 7. Actual Technology
Requires 32 passive components and one extra 6V regulator
to suppress injection current into a standard HCT4051 multiplexer
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Channel 8
Common Out
VCC
HCT4851A Microcontroller
A/D - Input
VCC
5V
Sensor
(8x Identical Circuitry)
Figure 8. MC74HCT4851A Solution
Solution by applying the HCT4851A multiplexer
MC74HCT4851A, MC74HCT4852A
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7
Figure 9. On Resistance Test Set−Up
PLOTTER
MINI COMPUTER
PROGRAMMABLE
POWER
SUPPLY
DC ANALYZER
VCC
DEVICE
UNDER TEST
+-
ANALOG IN COMMON OUT
GND
Figure 10. Maximum Off Channel Leakage Current,
Any One Channel, Test Set−Up
OFF
OFF
6
8
16
COMMON O/I
VCC
VIH
NC
A
VCC
VEE
VCC
Figure 11. Maximum Off Channel Leakage Current,
Common Channel, Test Set−Up
OFF
OFF
6
8
16
COMMON O/I
VCC
VIH
ANALOG I/O
VCC
VEE
VCC
Figure 12. Maximum On Channel Leakage Current,
Channel to Channel, Test Set−Up
ON
OFF
6
8
16
COMMON O/I
VCC
VIL
VCC
VEE
VCC
N/C
A
ANALOG I/O
Figure 13. Propagation Delays, Channel Select
to Analog Out
Figure 14. Propagation Delay, Test Set−Up Channel
Select to Analog Out
VCC
GND
CHANNEL
SELECT
(VI)
ANALOG
OUT 50%
tPLH tPHL
VM
ON/OFF
6
8
16
VCC
CL*
*Includes all probe and jig capacitance
CHANNEL SELECT
TEST
POINT
COMMON O/I
OFF/ON
ANALOG I/O
VCC
VI = GND to 3.0 V
VM = 1.3 V
MC74HCT4851A, MC74HCT4852A
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8
Figure 15. Propagation Delays, Analog In
to Analog Out
Figure 16. Propagation Delay, Test Set−Up
Analog In to Analog Out
Figure 17. Propagation Delays, Enable to
Analog Out
Figure 18. Propagation Delay, Test Set−Up
Enable to Analog Out
VCC
GND
ANALOG
IN
(VI)
ANALOG
OUT 50%
tPLH tPHL
50%
ON
6
8
16
VCC
CL*
*Includes all probe and jig capacitance
TEST
POINT
COMMON O/I
ANALOG I/O
ON/OFF
6
8
ENABLE
VCC
ENABLE
(VI)
90%
VM
10%
tftr
VCC
GND
ANALOG
OUT
tPZL
ANALOG
OUT
tPZH
HIGH
IMPEDANCE
VOL
VOH
HIGH
IMPEDANCE
10%
90%
tPLZ
tPHZ
50%
50%
ANALOG I/O
CL*
TEST
POINT
16
VCC
10kW
1
2
1
2
POSITION 1 WHEN TESTING tPHZ AND tPZH
POSITION 2 WHEN TESTING tPLZ AND tPZL
Figure 19. Power Dissipation Capacitance,
Test Set−Up
ON/OFF
6
8
16
VCC
CHANNEL SELECT
NC
COMMON O/I
OFF/ON
ANALOG I/O
VCC
A
11
VCC
VI = GND to 3.0 V
VM = 1.3 V
VI = GND to 3.0 V
VM = 1.3 V
MC74HCT4851A, MC74HCT4852A
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9
13 X0
14 X1
15 X2
12 X3
1X4
5X5
2X6
4X7
3X
11
A
10
B
9
C
6
ENABLE
Figure 20. Diagram of Bipolar Coupling Mechanism
Appears if Vin exceeds VCC, driving injection current into the substrate
Figure 21. Function Diagram, HCT4851A
+
+
+
P+ P+
N - Substrate (on VCC potential)
Gate = VCC
(Disabled) Common Analog Output
Vout > VCC
Disabled Analog Mux Input
Vin > VCC + 0.7V
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
MC74HCT4851A, MC74HCT4852A
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10
Figure 22. Function Diagram, HCT4852A
10
A
9
B
6
ENABLE
13 X0
14 X1
15 X2
12 X3
1Y0
5Y1
2Y2
4Y3
13 X
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
3Y
INJECTION
CURRENT
CONTROL
MC74HCT4851A, MC74HCT4852A
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11
ORDERING INFORMATION
Device Package Shipping†
MC74HCT4851ADG SOIC−16
(Pb−Free)
48 Units / Rail
MC74HCT4851ADR2G SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
M74HCT4851ADTR2G TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
MC74HCT4851ADTG TSSOP−16
(Pb−Free)
48 Units / Rail
M74HCT4851ADWR2G SOIC−16 WIDE
(Pb−Free)
1000 Units / Tape & Reel
MC74HCT4852ADG SOIC−16
(Pb−Free)
48 Units / Rail
MC74HCT4852ADR2G SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
M74HCT4852ADTR2G TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
MC74HCT4852ADTG TSSOP−16
(Pb−Free)
48 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC74HCT4851A, MC74HCT4852A
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12
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45_
G
8 PLP
−B−
−A−
M
0.25 (0.010) B S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
6.40
16X
0.58
16X 1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
16
89
8X
MC74HCT4851A, MC74HCT4852A
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13
PACKAGE DIMENSIONS
SOIC−16 WIDE
DW SUFFIX
CASE 751G−03
ISSUE C
D
14X
B16X
SEATING
PLANE
S
A
M
0.25 B S
T
16 9
81
hX 45_
M
B
M
0.25
H8X
E
B
A
e
T
A1
A
L
C
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN MAX
MILLIMETERS
A2.35 2.65
A1 0.10 0.25
B0.35 0.49
C0.23 0.32
D10.15 10.45
E7.40 7.60
e1.27 BSC
H10.05 10.55
h0.25 0.75
L0.50 0.90
q0 7
__
MC74HCT4851A, MC74HCT4852A
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14
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F
ISSUE B
ÇÇÇ
ÇÇÇ
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.18 0.28 0.007 0.011
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
18
16 9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
ÉÉ
ÉÉ
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
7.06
16X
0.36 16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
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MC74HCT4851A/D
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