LM70 www.ti.com SNIS112G - JUNE 2000 - REVISED MARCH 2013 LM70 SPI/MICROWIRE 10-Bit plus Sign Digital Temperature Sensor Check for Samples: LM70 FEATURES 1 * * 2 * * * 0.25C Temperature Resolution. Shutdown Mode Conserves Power Between Temperature Reading SPI and MICROWIRE Bus Interface VSSOP-8 and WSON-8 Packages Save Space UL Recognized Component APPLICATIONS * * * * * System Thermal Management Personal Computers Disk Drives Office Electronics Electronic Test Equipment KEY SPECIFICATIONS * * * DESCRIPTION The LM70 is a temperature sensor, Delta-Sigma analog-to-digital converter with an SPI and MICROWIRE compatible interface available in WSON and VSSOP 8-pin packages. The host can query the LM70 at any time to read temperature. A shutdown mode decreases power consumption to less than 10 A. This mode is useful in systems where low average power consumption is critical. The LM70 has 10-bit plus sign temperature resolution (0.25C per LSB) while operating over a temperature range of -55C to +150C. The LM70's 2.65V to 5.5V supply voltage range, low supply current and simple SPI interface make it ideal for a wide range of applications. These include thermal management and protection applications in hard disk drives, printers, electronic test equipment, and office electronics. Supply Voltage 2.65V to 5.5V Supply Current - Operating - 260 A (typ) - 490 A (max) - Shutdown - 12 A (typ) Temperature Accuracy - -40C to 85C, 2C(max) - -10C to 65C, +1.5/-2C(max) - -55C to 125C, +3/-2C(max) - -55C to 150C, +3.5/-2C(max) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2013, Texas Instruments Incorporated LM70 SNIS112G - JUNE 2000 - REVISED MARCH 2013 www.ti.com Simplified Block Diagram Connection Diagram Top View Top View Figure 1. VSSOP-8 Package See Package Number DGK0008A Figure 2. WSON-8 Package See Package Number NGK0008A PIN DESCRIPTIONS VSSOP-8 Pin No. WSON-8 Pin No. SI/O 1 1 Input/Output - Serial bus bi-directional data line. Schmitt trigger input. From and to Controller SC 2 3 Clock - Serial bus clock Schmitt trigger input line. From Controller GND 4 7 Power Supply Ground Ground V+ 5 5 Positive Supply Voltage Input DC Voltage from 2.65V to 5.5V. Bypass with a 0.1 F ceramic capacitor. CS 7 8 Chip Select input. From Controller NC 3, 6, 8 2, 4, 6 No Connect These pins are not connected to the LM70 die in any way. Pin Name 2 Description Submit Documentation Feedback Typical Connection Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 LM70 www.ti.com SNIS112G - JUNE 2000 - REVISED MARCH 2013 Typical Application Figure 3. COP Microcontroller Interface These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 3 LM70 SNIS112G - JUNE 2000 - REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) -0.3V to 6.0V Supply Voltage -0.3V to V+ + 0.3V Voltage at any Pin Input Current at any Pin (2) 5 mA Package Input Current (2) 20 mA -65C to +150C Storage Temperature Soldering Information, Lead Temperature VSSOP-8 and WSON-8 Packages (3) Vapor Phase (60 seconds) Infrared (15 seconds) 215C 220C ESD Susceptibility (4) Human Body Model 3000V Machine Model (1) (2) (3) (4) 300V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > +VS) the current at that pin should be limited to 5 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. See the section titled "Surface Mount" found in a current Linear Data Book for other methods of soldering surface mount devices. Human body model, 100 pF discharged through a 1.5 k resistor. Machine model, 200 pF discharged directly into each pin. Operating Ratings Specified Temperature Range See TMIN to TMAX (1) -55C to +150C Supply Voltage Range (+VS) (1) +2.65V to +5.5V The life expectancy of the LM70 will be reduced when operating at elevated temperatures. LM70 JA (thermal resistance, junction-toambient) when attached to a printed circuit board with 2 oz. foil is summarized in the table below:Device Number LM70CILD Thermal Resistance (JA), 51.3C/W, Device Number LM70CIMM Thermal Resistance (JA), 200C/W Temperature-to-Digital Converter Characteristics Unless otherwise noted, these specifications apply for V+ = 2.65V to 3.6V for the LM70-3 and V+ = 4.5V to 5.5V for the LM705 (1). Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ=+25C, unless otherwise noted. LM70-5 Limits (3) LM70-3 Limits (3) Units (Limit) TA = -10C to +65C +1.5/-2.0 +1.5/-2.0 C (max) TA = -40C to +85C 2.0 2.0 C (max) TA = -55C to +125C +3.0/-2.0 +3.0/-2.0 C (max) +3.5/-2.0 +3.5/-2.0 C (max) Parameter Temperature Error (1) Test Conditions Typical (2) TA = -55C to +150C Resolution 11 0.25 Bits C Temperature Conversion Time See (4) 140 210 210 ms (max) Quiescent Current Serial Bus Inactive 260 490 490 A (max) Serial Bus Active 260 A Shutdown Mode 12 A (1) (2) (3) (4) 4 Both part numbers of the LM70 will operate properly over the V+ supply voltage range of 2.65V to 5.5V. The temperature error for temperature ranges of -10C to +65C, -40C to +85C, -55C to +125C and -55C to +150C include error induced by power supply variation of 5% from the nominal value. Temperature error will increase by 0.3C for a power supply voltage (V+) variation of 10% from the nominal value. Typicals are at TA = 25C and represent most likely parametric norm. Limits are guaranteed to AOQL (Average Outgoing Quality Level). This specification is provided only to indicate how often temperature data is updated. The LM70 can be read at any time without regard to conversion state (and will yield last conversion result). A conversion in progress will not be interrupted. The output shift register will be updated at the completion of the read and a new conversion restarted. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 LM70 www.ti.com SNIS112G - JUNE 2000 - REVISED MARCH 2013 Logic Electrical Characteristics Digital DC Characteristics Unless otherwise noted, these specifications apply for V+ = 2.65V to 3.6V for the LM70-3 and V+ = 4.5V to 5.5V for the LM705. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ=+25C, unless otherwise noted. Parameter VIN(1) VIN(0) Test Conditions Typical (1) Logical "1" Input Voltage Logical "0" Input Voltage Input Hysteresis Voltage Units (Limit) Limits (2) V+ x 0.7 V (min) V+ + 0.3 V (max) -0.3 V (min) V+ x 0.3 V (max) V (min) V+ = 2.65V to 3.6V 0.8 0.27 V+ = 4.5V to 5.5V 0.8 0.35 V (min) IIN(1) Logical "1" Input Current VIN = V+ 0.005 3.0 A (max) IIN(0) Logical "0" Input Current VIN = 0V -0.005 -3.0 A (min) CIN All Digital Inputs VOH High Level Output Voltage IOH = -400 A 2.4 V (min) VOL Low Level Output Voltage IOL = +2 mA 0.4 V (max) IO_TRI-STATE TRI-STATE Output Leakage Current VO = GND VO = V+ -1 +1 A (min) A (max) (1) (2) 20 pF Typicals are at TA = 25C and represent most likely parametric norm. Limits are guaranteed to AOQL (Average Outgoing Quality Level). Logic Electrical Characteristics Serial Bus Digital Switching Characteristics Unless otherwise noted, these specifications apply for V+ = 2.65V to 3.6V for the LM70-3 and V+ = 4.5V to 5.5V for the LM705, CL (load capacitance) on output lines = 100 pF unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25C, unless otherwise noted. Parameter Test Conditions Typical (1) Limits (2) Units (Limit) s (min) (max) t1 SC (Clock) Period 0.16 DC t2 CS Low to SC (Clock) High Set-Up Time 100 ns (min) t3 CS Low to Data Out (SO) Delay 70 ns (max) t4 SC (Clock) Low to Data Out (SO) Delay 70 ns (max) t5 CS High to Data Out (SO) TRI-STATE 200 ns (min) t6 SC (Clock) High to Data In (SI) Hold Time 60 ns (min) t7 Data In (SI) Set-Up Time to SC (Clock) High 30 ns (min) (1) (2) Typicals are at TA = 25C and represent most likely parametric norm. Limits are guaranteed to AOQL (Average Outgoing Quality Level). Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 5 LM70 SNIS112G - JUNE 2000 - REVISED MARCH 2013 www.ti.com Timing Diagrams Figure 4. Data Output Timing Diagram Figure 5. TRI-STATE Data Output Timing Diagram Figure 6. Data Input Timing Diagram 6 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 LM70 www.ti.com SNIS112G - JUNE 2000 - REVISED MARCH 2013 Figure 7. Temperature-to-Digital Transfer Function (Non-linear scale for clarity) Figure 8. TRI-STATE Test Circuit Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 7 LM70 SNIS112G - JUNE 2000 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics Average Power-On Reset Voltage vs Temperature Static Supply Current vs Temperature Figure 9. Figure 10. Temperature Error Figure 11. 8 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 LM70 www.ti.com SNIS112G - JUNE 2000 - REVISED MARCH 2013 FUNCTIONAL DESCRIPTION The LM70 temperature sensor incorporates a band-gap type temperature sensor and 10-bit plus sign ADC (Delta-Sigma Analog-to-Digital Converter). Compatibility of the LM70's three wire serial interface with SPI and MICROWIRE allows simple communications with common microcontrollers and processors. Shutdown mode can be used to optimize current drain for different applications. A manufacture's ID register identifies the LM70 as a TI product. POWER UP AND POWER DOWN The LM70 always powers up in a known state. The power up default condition is continuous conversion mode. Immediatly after power up the LM70 will output an erroneous code until the first temperature conversion has completed. When the supply voltage is less than about 1.6V (typical), the LM70 is considered powered down. As the supply voltage rises above the nominal 1.6V power up threshold, the internal registers are reset to the power up default state described above. SERIAL BUS INTERFACE The LM70 operates as a slave and is compatible with SPI or MICROWIRE bus specifications. Data is clocked out on the falling edge of the serial clock (SC), while data is clocked in on the rising edge of SC. A complete transmit/receive communication will consist of 32 serial clocks. The first 16 clocks comprise the transmit phase of communication, while the second 16 clocks are the receive phase. When CS is high SI/O will be in TRISTATE. Communication should be initiated by taking chip select (CS) low. This should not be done when SC is changing from a low to high state. Once CS is low the serial I/O pin (SI/O) will transmit the first bit of data. The master can then read this bit with the rising edge of SC. The remainder of the data will be clocked out by the falling edge of SC. Once the 14 bits of data (one sign bit, ten temperature bits and 3 high bits) are transmitted the SI/O line will go into TRI-STATE. CS can be taken high at any time during the transmit phase. If CS is brought low in the middle of a conversion the LM70 will complete the conversion and the output shift register will be updated after CS is brought back high. The receive phase of a communication starts after 16 SC periods. CS can remain low for 32 SC cycles. The LM70 will read the data available on the SI/O line on the rising edge of the serial clock. Input data is to an 8-bit shift register. The part will detect the last eight bits shifted into the register. The receive phase can last up to 16 SC periods. All ones must be shifted in order to place the part into shutdown. A zero in any location will take the LM70 out of shutdown. The following codes only should be transmitted to the LM70: * 00 hex (normal operation) * 01 hex (normal operation) * 03 hex (normal operation) * 07 hex (normal operation) * 0F hex (normal operation) * 1F hex (normal operation) * 3F hex(normal operation) * 7F hex(normal operation) * FF hex (Shutdown, transmit manufacturer's ID) any others may place the part into a Test Mode. Test Modes are used by TI to thoroughly test the function of the LM70 during production testing. Only eight bits have been defined above since only the last eight transmitted, before CS is taken HIGH, are detected by the LM70 The following communication can be used to determine the Manufacturer's/Device ID and then immediately place the part into continuous conversion mode. With CS continuously low: * Read 16 bits of temperature data * Write 16 bits of data commanding shutdown * Read 16 bits of Manufacture's/Device ID data * Write 8 to 16 bits of data commanding Conversion Mode * Take CS HIGH. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 9 LM70 SNIS112G - JUNE 2000 - REVISED MARCH 2013 www.ti.com Note that 210 ms will have to pass for a conversion to complete before the LM70 actually transmits temperature data. TEMPERATURE DATA FORMAT Temperature data is represented by a 11-bit, two's complement word with an LSB (Least Significant Bit) equal to 0.25C: Digital Output Temperature Binary Hex +150C 0100 1011 0001 1111 4B 1Fh +125C 0011 1110 1001 1111 3E 9Fh +25C 0000 1100 1001 1111 0B 9Fh +0.25C 0000 0000 0011 1111 00 3Fh 0C 0000 0000 0001 1111 00 1Fh -0.25C 1111 1111 1111 1111 FF FFh -25C 1111 0011 1001 1111 F3 9Fh -55C 1110 0100 1001 1111 E4 9Fh Note: The last two bits are TRI-STATE and depicted as one in the table. The first data byte is the most significant byte with most significant bit first, permitting only as much data as necessary to be read to determine temperature condition. For instance, if the first four bits of the temperature data indicate an overtemperature condition, the host processor could immediately take action to remedy the excessive temperatures. SHUTDOWN MODE/MANUFACTURER'S ID Shutdown mode is enabled by writing XX FF to the LM70 as shown in Figure 14c. and discussed in Section 1.2. The serial bus is still active when the LM70 is in shutdown. Current draw drops to less than 10 A between serial communications. When in shutdown mode the LM70 always will output 1000 0001 0000 00XX. This is the manufacturer's ID/Device ID information. The first 5-bits of the field (1000 0XXX) are reserved for manufacturer's ID. INTERNAL REGISTER STRUCTURE The LM70 has three registers, the temperature register, the configuration register and the manufacturer's/device identification register. The temperature and manufacturer's/device identification registers are read only. The configuration register is write only. CONFIGURATION REGISTER (Selects shutdown or continuous conversion modes): Table 1. (Write Only): D15 D14 D13 D12 D11 D10 D9 D8 X X X X X X X X D7 D6 D5 D4 D3 D2 D1 D0 Shutdown D0-D15 set to XX FF hex enables shutdown mode. D0-D15 set to XX 00 hex enables continuous conversion mode. Note: setting D0-D15 to any other values may place the LM70 into a manufacturer's test mode, upon which the LM70 will stop responding as described. These test modes are to be used for production testing only. See Section 1.2 Serial Bus Interface for a complete discussion. 10 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 LM70 www.ti.com SNIS112G - JUNE 2000 - REVISED MARCH 2013 TEMPERATURE REGISTER Table 2. (Read Only): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 MSB Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB 1 1 1 X X D0-D1: Undefined. TRI-STATE will be output on SI/0. D2-D4: Always set high. D5-D15: Temperature Data. One LSB = 0.25C. Two's complement format. MANUFACTURER'S/DEVICE ID REGISTER Table 3. (Read Only): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 0 0 1 0 0 0 0 0 0 X X D0-D1: Undefined. TRI-STATE will be output on SI/0. D2-D4: Always set LOW. D5-D15: Manufacturer's ID Data. This register is accessed whenever the LM70 is in shutdown mode. Serial Bus Timing Diagrams Figure 12. a) Reading Continuous Conversion - Single Eight-Bit Frame Figure 13. b) Reading Continuous Conversion - Two Eight-Bit Frames Figure 14. c) Writing Shutdown Control Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 11 LM70 SNIS112G - JUNE 2000 - REVISED MARCH 2013 www.ti.com Application Hints To get the expected results when measuring temperature with an integrated circuit temperature sensor like the LM70, it is important to understand that the sensor measures its own die temperature. For the LM70, the best thermal path between the die and the outside world is through the LM70's pins. In the VSSOP-8 package the ground pin is connected to the back side of the LM70 die and thus has the most effect on the die temperature. Although the other pins will also have some effect on the LM70die temperature and therefore should not be discounted. The LM70 will provide an accurate measurement of the temperature of the printed circuit board on which it is mounted, because the pins represent a good thermal path to the die. A less efficient thermal path exists between the plastic package and the LM70 die. If the ambient air temperature is significantly different from the printed circuit board temperature, it will have a small effect on the measured temperature. In probe-type applications, the LM70 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM70 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to insure that moisture cannot corrode the LM70 or its connections. Typical Applications Figure 15. Temperature Monitor Using Intel 196 Processor 12 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 LM70 www.ti.com SNIS112G - JUNE 2000 - REVISED MARCH 2013 Figure 16. LM70 Digital Input Control Using Micro-Controller's General Purpose I/O Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 13 LM70 SNIS112G - JUNE 2000 - REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision F (March 2013) to Revision G * 14 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 13 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM70 PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM70CILD-3/NOPB ACTIVE WSON NGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -55 to 150 T33 LM70CILD-5/NOPB ACTIVE WSON NGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -55 to 150 T35 LM70CILDX-3/NOPB ACTIVE WSON NGK 8 4500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -55 to 150 T33 LM70CIMM-3 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -55 to 150 T04C LM70CIMM-3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 150 T04C LM70CIMM-5 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -55 to 150 T03C LM70CIMM-5/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 150 T03C LM70CIMMX-3/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 150 T04C LM70CIMMX-5/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 150 T03C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2017 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM70CILD-3/NOPB WSON NGK 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM70CILD-5/NOPB WSON NGK 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM70CILDX-3/NOPB WSON NGK 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM70CIMM-3 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM70CIMM-3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM70CIMM-5 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM70CIMM-5/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM70CIMMX-3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM70CIMMX-5/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM70CILD-3/NOPB WSON NGK 8 1000 210.0 185.0 35.0 LM70CILD-5/NOPB WSON NGK 8 1000 210.0 185.0 35.0 LM70CILDX-3/NOPB WSON NGK 8 4500 367.0 367.0 35.0 LM70CIMM-3 VSSOP DGK 8 1000 210.0 185.0 35.0 LM70CIMM-3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM70CIMM-5 VSSOP DGK 8 1000 210.0 185.0 35.0 LM70CIMM-5/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM70CIMMX-3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM70CIMMX-5/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NGK0008A LDA08A (Rev C) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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