LM70
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LM70 SPI/MICROWIRE 10-Bit plus Sign Digital Temperature Sensor
Check for Samples: LM70
1FEATURES DESCRIPTION
2• 0.25°C Temperature Resolution. The LM70 is a temperature sensor, Delta-Sigma
• Shutdown Mode Conserves Power Between analog-to-digital converter with an SPI and
Temperature Reading MICROWIRE compatible interface available in WSON
• SPI and MICROWIRE Bus Interface and VSSOP 8-pin packages. The host can query the
LM70 at any time to read temperature. A shutdown
• VSSOP-8 and WSON-8 Packages Save Space mode decreases power consumption to less than 10
• UL Recognized Component µA. This mode is useful in systems where low
average power consumption is critical.
APPLICATIONS The LM70 has 10-bit plus sign temperature resolution
• System Thermal Management (0.25°C per LSB) while operating over a temperature
• Personal Computers range of −55°C to +150°C.
• Disk Drives The LM70's 2.65V to 5.5V supply voltage range, low
• Office Electronics supply current and simple SPI interface make it ideal
for a wide range of applications. These include
• Electronic Test Equipment thermal management and protection applications in
hard disk drives, printers, electronic test equipment,
KEY SPECIFICATIONS and office electronics.
• Supply Voltage 2.65V to 5.5V
• Supply Current
– Operating
– 260 μA (typ)
– 490 μA (max)
– Shutdown
– 12 μA (typ)
• Temperature Accuracy
–−40°C to 85°C, ±2°C(max)
–−10°C to 65°C, +1.5/−2°C(max)
–−55°C to 125°C, +3/−2°C(max)
–−55°C to 150°C, +3.5/−2°C(max)
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM70
SNIS112G –JUNE 2000–REVISED MARCH 2013
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Simplified Block Diagram
Connection Diagram
Top View Top View
Figure 1. VSSOP-8 Package Figure 2. WSON-8 Package
See Package Number DGK0008A See Package Number NGK0008A
PIN DESCRIPTIONS
VSSOP-8 WSON-8
Pin Name Description Typical Connection
Pin No. Pin No.
SI/O 1 1 Input/Output - Serial bus bi-directional data line. From and to Controller
Schmitt trigger input.
SC 2 3 Clock - Serial bus clock Schmitt trigger input line. From Controller
GND 4 7 Power Supply Ground Ground
V+5 5 Positive Supply Voltage Input DC Voltage from 2.65V to 5.5V. Bypass with a
0.1 μF ceramic capacitor.
CS 7 8 Chip Select input. From Controller
NC 3, 6, 8 2, 4, 6 No Connect These pins are not connected to the LM70 die
in any way.
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Typical Application
Figure 3. COP Microcontroller Interface
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)
Supply Voltage −0.3V to 6.0V
Voltage at any Pin −0.3V to V++ 0.3V
Input Current at any Pin(2) 5 mA
Package Input Current(2) 20 mA
Storage Temperature −65°C to +150°C
Soldering Information, Lead Temperature
VSSOP-8 and WSON-8 Packages(3)
Vapor Phase (60 seconds) 215°C
Infrared (15 seconds) 220°C
ESD Susceptibility(4)
Human Body Model 3000V
Machine Model 300V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
(2) When the input voltage (VI) at any pin exceeds the power supplies (VI< GND or VI> +VS) the current at that pin should be limited to 5
mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input
current of 5 mA to four.
(3) See the section titled “Surface Mount” found in a current Linear Data Book for other methods of soldering surface mount devices.
(4) Human body model, 100 pF discharged through a 1.5 kΩresistor. Machine model, 200 pF discharged directly into each pin.
Operating Ratings
Specified Temperature Range TMIN to TMAX
See(1) −55°C to +150°C
Supply Voltage Range (+VS) +2.65V to +5.5V
(1) The life expectancy of the LM70 will be reduced when operating at elevated temperatures. LM70 θJA (thermal resistance, junction-to-
ambient) when attached to a printed circuit board with 2 oz. foil is summarized in the table below:Device Number LM70CILD Thermal
Resistance (θJA), 51.3°C/W, Device Number LM70CIMM Thermal Resistance (θJA), 200°C/W
Temperature-to-Digital Converter Characteristics
Unless otherwise noted, these specifications apply for V+= 2.65V to 3.6V for the LM70-3 and V+= 4.5V to 5.5V for the LM70-
5(1).Boldface limits apply for TA= TJ= TMIN to TMAX;all other limits TA= TJ=+25°C, unless otherwise noted.
LM70-5 LM70-3 Units
Parameter Test Conditions Typical(2) Limits(3) Limits(3) (Limit)
Temperature Error(1) TA=−10°C to +65°C +1.5/−2.0 +1.5/−2.0 °C (max)
TA=−40°C to +85°C ±2.0 ±2.0 °C (max)
TA=−55°C to +125°C +3.0/−2.0 +3.0/−2.0 °C (max)
TA=−55°C to +150°C +3.5/−2.0 +3.5/−2.0 °C (max)
Resolution 11 Bits
0.25 °C
Temperature Conversion Time See(4) 140 210 210 ms (max)
Quiescent Current Serial Bus Inactive 260 490 490 μA (max)
Serial Bus Active 260 μA
Shutdown Mode 12 μA
(1) Both part numbers of the LM70 will operate properly over the V+supply voltage range of 2.65V to 5.5V. The temperature error for
temperature ranges of −10°C to +65°C, −40°C to +85°C, −55°C to +125°C and −55°C to +150°C include error induced by power supply
variation of ±5% from the nominal value. Temperature error will increase by ±0.3°C for a power supply voltage (V+) variation of ±10%
from the nominal value.
(2) Typicals are at TA= 25°C and represent most likely parametric norm.
(3) Limits are guaranteed to AOQL (Average Outgoing Quality Level).
(4) This specification is provided only to indicate how often temperature data is updated. The LM70 can be read at any time without regard
to conversion state (and will yield last conversion result). A conversion in progress will not be interrupted. The output shift register will be
updated at the completion of the read and a new conversion restarted.
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Logic Electrical Characteristics Digital DC Characteristics
Unless otherwise noted, these specifications apply for V+= 2.65V to 3.6V for the LM70-3 and V+= 4.5V to 5.5V for the LM70-
5. Boldface limits apply for TA= TJ= TMIN to TMAX;all other limits TA= TJ=+25°C, unless otherwise noted. Units
Parameter Test Conditions Typical(1) Limits(2) (Limit)
VIN(1) Logical “1” Input Voltage V+× 0.7 V (min)
V++ 0.3 V (max)
VIN(0) Logical “0” Input Voltage −0.3 V (min)
V+× 0.3 V (max)
Input Hysteresis Voltage V+= 2.65V to 3.6V 0.8 0.27 V (min)
V+= 4.5V to 5.5V 0.8 0.35 V (min)
IIN(1) Logical “1” Input Current VIN = V+0.005 3.0 μA (max)
IIN(0) Logical “0” Input Current VIN = 0V −0.005 −3.0 μA (min)
CIN All Digital Inputs 20 pF
VOH High Level Output Voltage IOH =−400 μA2.4 V (min)
VOL Low Level Output Voltage IOL = +2 mA 0.4 V (max)
IO_TRI-STATE TRI-STATE Output Leakage Current VO= GND −1μA (min)
VO= V++1 μA (max)
(1) Typicals are at TA= 25°C and represent most likely parametric norm.
(2) Limits are guaranteed to AOQL (Average Outgoing Quality Level).
Logic Electrical Characteristics Serial Bus Digital Switching Characteristics
Unless otherwise noted, these specifications apply for V+= 2.65V to 3.6V for the LM70-3 and V+= 4.5V to 5.5V for the LM70-
5, CL(load capacitance) on output lines = 100 pF unless otherwise specified. Boldface limits apply for TA= TJ= TMIN to
TMAX;all other limits TA= TJ= +25°C, unless otherwise noted. Units
Parameter Test Conditions Typical(1) Limits(2) (Limit)
t1SC (Clock) Period 0.16 μs (min)
DC (max)
t2CS Low to SC (Clock) High Set-Up Time 100 ns (min)
t3CS Low to Data Out (SO) Delay 70 ns (max)
t4SC (Clock) Low to Data Out (SO) Delay 70 ns (max)
t5CS High to Data Out (SO) TRI-STATE 200 ns (min)
t6SC (Clock) High to Data In (SI) Hold Time 60 ns (min)
t7Data In (SI) Set-Up Time to SC (Clock) High 30 ns (min)
(1) Typicals are at TA= 25°C and represent most likely parametric norm.
(2) Limits are guaranteed to AOQL (Average Outgoing Quality Level).
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Typical Performance Characteristics
Average Power-On Reset Voltage vs Temperature Static Supply Current vs Temperature
Figure 9. Figure 10.
Temperature Error
Figure 11.
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FUNCTIONAL DESCRIPTION
The LM70 temperature sensor incorporates a band-gap type temperature sensor and 10-bit plus sign ΔΣ ADC
(Delta-Sigma Analog-to-Digital Converter). Compatibility of the LM70's three wire serial interface with SPI and
MICROWIRE allows simple communications with common microcontrollers and processors. Shutdown mode can
be used to optimize current drain for different applications. A manufacture's ID register identifies the LM70 as a
TI product.
POWER UP AND POWER DOWN
The LM70 always powers up in a known state. The power up default condition is continuous conversion mode.
Immediatly after power up the LM70 will output an erroneous code until the first temperature conversion has
completed.
When the supply voltage is less than about 1.6V (typical), the LM70 is considered powered down. As the supply
voltage rises above the nominal 1.6V power up threshold, the internal registers are reset to the power up default
state described above.
SERIAL BUS INTERFACE
The LM70 operates as a slave and is compatible with SPI or MICROWIRE bus specifications. Data is clocked
out on the falling edge of the serial clock (SC), while data is clocked in on the rising edge of SC. A complete
transmit/receive communication will consist of 32 serial clocks. The first 16 clocks comprise the transmit phase of
communication, while the second 16 clocks are the receive phase.
When CS is high SI/O will be in TRISTATE. Communication should be initiated by taking chip select (CS) low.
This should not be done when SC is changing from a low to high state. Once CS is low the serial I/O pin (SI/O)
will transmit the first bit of data. The master can then read this bit with the rising edge of SC. The remainder of
the data will be clocked out by the falling edge of SC. Once the 14 bits of data (one sign bit, ten temperature bits
and 3 high bits) are transmitted the SI/O line will go into TRI-STATE. CS can be taken high at any time during
the transmit phase. If CS is brought low in the middle of a conversion the LM70 will complete the conversion and
the output shift register will be updated after CS is brought back high.
The receive phase of a communication starts after 16 SC periods. CS can remain low for 32 SC cycles. The
LM70 will read the data available on the SI/O line on the rising edge of the serial clock. Input data is to an 8-bit
shift register. The part will detect the last eight bits shifted into the register. The receive phase can last up to 16
SC periods. All ones must be shifted in order to place the part into shutdown. A zero in any location will take the
LM70 out of shutdown. The following codes only should be transmitted to the LM70:
• 00 hex (normal operation)
• 01 hex (normal operation)
• 03 hex (normal operation)
• 07 hex (normal operation)
• 0F hex (normal operation)
• 1F hex (normal operation)
• 3F hex(normal operation)
• 7F hex(normal operation)
• FF hex (Shutdown, transmit manufacturer's ID)
any others may place the part into a Test Mode. Test Modes are used by TI to thoroughly test the function of the
LM70 during production testing. Only eight bits have been defined above since only the last eight transmitted,
before CS is taken HIGH, are detected by the LM70
The following communication can be used to determine the Manufacturer's/Device ID and then immediately place
the part into continuous conversion mode. With CS continuously low:
• Read 16 bits of temperature data
• Write 16 bits of data commanding shutdown
• Read 16 bits of Manufacture's/Device ID data
• Write 8 to 16 bits of data commanding Conversion Mode
• Take CS HIGH.
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Note that 210 ms will have to pass for a conversion to complete before the LM70 actually transmits temperature
data.
TEMPERATURE DATA FORMAT
Temperature data is represented by a 11-bit, two's complement word with an LSB (Least Significant Bit) equal to
0.25°C:
Digital Output
Temperature Binary Hex
+150°C 0100 1011 0001 1111 4B 1Fh
+125°C 0011 1110 1001 1111 3E 9Fh
+25°C 0000 1100 1001 1111 0B 9Fh
+0.25°C 0000 0000 0011 1111 00 3Fh
0°C 0000 0000 0001 1111 00 1Fh
−0.25°C 1111 1111 1111 1111 FF FFh
−25°C 1111 0011 1001 1111 F3 9Fh
−55°C 1110 0100 1001 1111 E4 9Fh
Note: The last two bits are TRI-STATE and depicted as one in the table.
The first data byte is the most significant byte with most significant bit first, permitting only as much data as
necessary to be read to determine temperature condition. For instance, if the first four bits of the temperature
data indicate an overtemperature condition, the host processor could immediately take action to remedy the
excessive temperatures.
SHUTDOWN MODE/MANUFACTURER'S ID
Shutdown mode is enabled by writing XX FF to the LM70 as shown in Figure 14c. and discussed in Section 1.2.
The serial bus is still active when the LM70 is in shutdown. Current draw drops to less than 10 µA between serial
communications. When in shutdown mode the LM70 always will output 1000 0001 0000 00XX. This is the
manufacturer's ID/Device ID information. The first 5-bits of the field (1000 0XXX) are reserved for manufacturer's
ID.
INTERNAL REGISTER STRUCTURE
The LM70 has three registers, the temperature register, the configuration register and the manufacturer's/device
identification register. The temperature and manufacturer's/device identification registers are read only. The
configuration register is write only.
CONFIGURATION REGISTER
(Selects shutdown or continuous conversion modes):
Table 1. (Write Only):
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
X X X X X X X X Shutdown
D0-D15 set to XX FF hex enables shutdown mode.
D0-D15 set to XX 00 hex enables continuous conversion mode.
Note: setting D0-D15 to any other values may place the LM70 into a manufacturer's test mode, upon which the
LM70 will stop responding as described. These test modes are to be used for production testing only. See
Section 1.2 Serial Bus Interface for a complete discussion.
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TEMPERATURE REGISTER
Table 2. (Read Only):
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
MSB Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB 1 1 1 X X
D0–D1: Undefined. TRI-STATE will be output on SI/0.
D2–D4: Always set high.
D5–D15: Temperature Data. One LSB = 0.25°C. Two's complement format.
MANUFACTURER'S/DEVICE ID REGISTER
Table 3. (Read Only):
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
10000001000000XX
D0–D1: Undefined. TRI-STATE will be output on SI/0.
D2-D4: Always set LOW.
D5–D15: Manufacturer's ID Data. This register is accessed whenever the LM70 is in shutdown mode.
Serial Bus Timing Diagrams
Figure 12. a) Reading Continuous Conversion - Single Eight-Bit Frame
Figure 13. b) Reading Continuous Conversion - Two Eight-Bit Frames
Figure 14. c) Writing Shutdown Control
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Application Hints
To get the expected results when measuring temperature with an integrated circuit temperature sensor like the
LM70, it is important to understand that the sensor measures its own die temperature. For the LM70, the best
thermal path between the die and the outside world is through the LM70's pins. In the VSSOP-8 package the
ground pin is connected to the back side of the LM70 die and thus has the most effect on the die temperature.
Although the other pins will also have some effect on the LM70die temperature and therefore should not be
discounted. The LM70 will provide an accurate measurement of the temperature of the printed circuit board on
which it is mounted, because the pins represent a good thermal path to the die. A less efficient thermal path
exists between the plastic package and the LM70 die. If the ambient air temperature is significantly different from
the printed circuit board temperature, it will have a small effect on the measured temperature.
In probe-type applications, the LM70 can be mounted inside a sealed-end metal tube, and can then be dipped
into a bath or screwed into a threaded hole in a tank. As with any IC, the LM70 and accompanying wiring and
circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may
operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as
Humiseal and epoxy paints or dips are often used to insure that moisture cannot corrode the LM70 or its
connections.
Typical Applications
Figure 15. Temperature Monitor Using Intel 196 Processor
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REVISION HISTORY
Changes from Revision F (March 2013) to Revision G Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 13
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM70CILD-3/NOPB ACTIVE WSON NGK 8 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -55 to 150 T33
LM70CILD-5/NOPB ACTIVE WSON NGK 8 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -55 to 150 T35
LM70CILDX-3/NOPB ACTIVE WSON NGK 8 4500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -55 to 150 T33
LM70CIMM-3 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -55 to 150 T04C
LM70CIMM-3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 150 T04C
LM70CIMM-5 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -55 to 150 T03C
LM70CIMM-5/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 150 T03C
LM70CIMMX-3/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 150 T04C
LM70CIMMX-5/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 150 T03C
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM70CILD-3/NOPB WSON NGK 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LM70CILD-5/NOPB WSON NGK 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LM70CILDX-3/NOPB WSON NGK 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LM70CIMM-3 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM70CIMM-3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM70CIMM-5 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM70CIMM-5/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM70CIMMX-3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM70CIMMX-5/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM70CILD-3/NOPB WSON NGK 8 1000 210.0 185.0 35.0
LM70CILD-5/NOPB WSON NGK 8 1000 210.0 185.0 35.0
LM70CILDX-3/NOPB WSON NGK 8 4500 367.0 367.0 35.0
LM70CIMM-3 VSSOP DGK 8 1000 210.0 185.0 35.0
LM70CIMM-3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM70CIMM-5 VSSOP DGK 8 1000 210.0 185.0 35.0
LM70CIMM-5/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM70CIMMX-3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM70CIMMX-5/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
MECHANICAL DATA
NGK0008A
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LDA08A (Rev C)
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thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
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