a +5 V Powered CMOS RS-232 Drivers/Receivers ADM223/ADM230L-ADM241L ADM232L TYPICAL OPERATING CIRCUIT FEATURES Single 5 V Power Supply Meets All EIA-232-E and V.28 Specifications 120 kB/s Data Rate On-Board DC-DC Converters 69 V Output Swing with +5 V Supply Small 1 mF Capacitors Low Power Shutdown 1 mA Receivers Active in Shutdown (ADM223) ESD > 2 kV 630 V Receiver Input Levels Latch-Up FREE Plug-In Upgrade for MAX223/230-241 Plug-In Upgrade for AD230-AD241 +5V INPUT 1F 6.3V 1F 16V TTL/CMOS INPUTS* TTL/CMOS OUTPUTS APPLICATIONS Computers Peripherals Modems Printers Instruments 1 C1+ 3 C1- +5V TO +10V VOLTAGE DOUBLER 4 C2+ +10V TO -10V VOLTAGE INVERTER 5 C2- VCC 16 V+ 2 V- 6 1F 6.3V 1F 16V T1IN 11 T1 14 T1OUT T2IN 10 T2 7 T2OUT R1OUT 12 R1 13 R1IN R2OUT 9 R2 8 R2IN GND 15 1F 6.3V RS-232 OUTPUTS RS-232 INPUTS** ADM232L *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT GENERAL DESCRIPTION The ADM2xx family of line drivers/receivers is intended for all EIA-232-E and V.28 communications interfaces, especially in applications where 12 V is not available. The ADM223, ADM230L, ADM235L, ADM236L and ADM241L feature a low power shutdown mode that reduces power dissipation to less than 5 W, making them ideally suited for battery powered equipment. Two receivers remain enabled during shutdown on the ADM223. The ADM233L and ADM235L do not require any external components and are particularly useful in applications where printed circuit board space is critical. All members of the ADM230L family, except the ADM231L and the ADM239L, include two internal charge pump voltage converters that allow operation from a single +5 V supply. These converters convert the +5 V input power to the 10 V required for RS-232 output levels. The ADM231L and ADM239L are designed to operate from +5 V and +12 V supplies. An internal +12 V to -12 V charge pump voltage converter generates the -12 V supply. The ADM2xxL is an enhanced upgrade for the AD2xx family featuring lower power consumption, faster slew rate and operation with smaller (1 F) capacitors. Table I. Selection Table Part Number Power Supply Voltage No. of RS-232 Drivers No. of RS-232 Receivers External Capacitors Low Power Shutdown (SD) TTL Three-State EN No. of Pins ADM223 ADM230L ADM231L ADM232L ADM233L ADM234L ADM235L ADM236L ADM237L ADM238L ADM239L ADM241L +5 V +5 V +5 V & +7.5 V to +13.2 V +5 V +5 V +5 V +5 V +5 V +5 V +5 V +5 V & +7.5 V to +13.2 V +5 V 4 5 2 2 2 4 5 4 5 4 3 4 5 0 2 2 2 0 5 3 3 4 5 5 4 4 2 4 None 4 None 4 4 4 2 4 Yes (SD) Yes No No No No Yes Yes No No No Yes Yes (EN) No No No No No Yes Yes No No Yes Yes 28 20 14 16 20 16 24 24 24 24 24 28 REV. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 World Wide Web Site: http://www.analog.com Fax: 617/326-8703 (c) Analog Devices, Inc., 1997 VCC = +5 V 6 10% (ADM223, 31L, 32L, 34L, 36L, 38L, 39L, 41L); VCC = +5 V 6 5% (ADM230L, 33L, 35L, 37L); V+ = 7.5 V to 13.2 V (ADM231L & ADM239L); C1-C4 = 1.0 mF Ceramic. All Specifications TMIN to TMAX unless otherwise noted.) ADM223/ADM230L-ADM241L-SPECIFICATIONS Parameter Output Voltage Swing VCC Power Supply Current V+ Power Supply Current Shutdown Supply Current Input Logic Threshold Low, VINL Input Logic Threshold High, VINH Logic Pull-Up Current RS-232 Input Voltage Range RS-232 Input Threshold Low RS-232 Input Threshold High RS-232 Input Hysteresis RS-232 Input Resistance TTL/CMOS Output Voltage Low, VOL TTL/CMOS Output Voltage High, VOH TTL/CMOS Output Leakage Current Output Enable Time (TEN) Min 5 Typ 9 2 3.5 0.4 1.5 1 2.0 10 -30 0.8 0.2 3 1.2 1.7 0.5 5 3.5 0.05 250 Output Disable Time (TDIS) 50 Propagation Delay Instantaneous Slew Rate1 Transition Region Slew Rate 0.5 25 5 Output Resistance RS-232 Output Short Circuit Current 300 Max Units Volts 3.0 mA 6 mA 1 mA 4 mA 5 A 0.8 V V 25 A +30 V V 2.4 V 1.0 V 7 k 0.4 V V 5 A ns ns 30 10 s V/s V/s mA Test Conditions/Comments All Transmitter Outputs Loaded with 3 k to Ground No Load, All TINS = VCC (Except ADM223) No Load, All TINS = GND ADM231L, ADM239L No Load, V+ = 12 V ADM231L & ADM239L Only TIN, EN, SD, EN, SD TIN, EN, SD, EN, SD TIN = 0 V IOUT = -1.0 mA EN = VCC, 0 V ROUT VCC ADM223, ADM235L, ADM236L, ADM239L, ADM241L (Figure 25. CL = 150 pF) ADM223, ADM235L, ADM236L, ADM239L, ADM241L (Figure 25. RL = 1 k) RS-232 to TTL CL = 10 pF, RL = 3-7 k, TA = +25C RL = 3 k, CL = 2500 pF Measured from +3 V to -3 V or -3 V to +3 V VCC = V+ = V- = 0 V, VOUT = 2 V NOTE 1 Sample tested to ensure compliance. Specifications subject to change without notice. ABSOLUTE MAXIMUM RATINGS* (TA = 25C unless otherwise noted) VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +6 V V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VCC - 0.3 V) to +14 V V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to -14 V Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to (VCC + 0.3 V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V Output Voltages TOUT . . . . . . . . . . . . . . . . . . (V+, + 0.3 V) to (V-, - 0.3 V) ROUT . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to (VCC + 0.3 V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous Power Dissipation N-14 DIP (Derate 10 mW/C above +70C) . . . . . 800 mW N-16 DIP (Derate 10.5 mW/C above +70C) . . . 840 mW N-20 DIP (Derate 11 mW/C above +70C) . . . . . 890 mW N-24 DIP (Derate 13.5 mW/C above +70C) . . 1000 mW N-24A DIP (Derate 13.5 mW/C above +70C) . . 500 mW R-16 SOIC (Derate 9 mW/C above +70C) . . . . . 760 mW R-20 SOIC (Derate 9.5 mW/C above +70C) . . . 800 mW R-24 SOIC (Derate 12 mW/C above +70C) . . . . 850 mW R-28 SOIC (Derate 12.5 mW/C above +70C) . . 900 mW RS-28 SSOP (Derate 10 mW/C above +70C) . . . 900 mW Q-14 Cerdip (Derate 10 mW/C above +70C) . . . 720 mW Q-16 Cerdip (Derate 10 mW/C above +70C) . . . 800 mW Q-20 Cerdip (Derate 11.2 mW/C above +70C) . . . 890 mW Q-24 Cerdip (Derate 12.5 mW/C above +70C) . . 1000 mW D-24 Ceramic (Derate 20 mW/C above +70C) . . 1000 mW Thermal Impedance, JA N-14 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140C/W N-16 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135C/W N-20 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125C/W N-24 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120C/W N-24A DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110C/W R-16 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105C/W R-20 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105C/W R-24 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85C/W R-28 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80C/W RS-28 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100C/W Q-14 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105C/W Q-16 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100C/W Q-20 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100C/W Q-24 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55C/W D-24 Ceramic . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50C/W Operating Temperature Range Commercial (J Version) . . . . . . . . . . . . . . . . . . . 0 to +70C Industrial (A Version) . . . . . . . . . . . . . . . . -40C to +85C Storage Temperature Range . . . . . . . . . . . -65C to + 150C Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . +300C Vapour Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220C ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >2000 V *This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. -2- REV. 0 ADM223/ADM230L-ADM241L ORDERING GUIDE Model Temperature Range Package Option* ADM223 ADM223AR ADM223ARS -40C to +85C -40C to +85C R-28 RS-28 ADM232L ADM232LJN ADM232LJR ADM232LAN ADM232LAR ADM232LAQ 0C to +70C 0C to +70C -40C to +85C -40C to +85C -40C to +85C N-16 R-16 N-16 R-16 Q-16 ADM235L ADM235LJN 0C to +70C ADM235LAN -40C to +85C ADM235LAQ -40C to +85C N-24A N-24A D-24 ADM238L ADM238LJN ADM238LJR ADM238LAN ADM238LAR ADM238LAQ N-24 R-24 N-24 R-24 Q-24 0C to +70C 0C to +70C -40C to +85C -40C to +85C -40C to +85C Model Temperature Range Package Option* Model Temperature Range Package Option* ADM230L ADM230LJN ADM230LJR ADM230LAN ADM230LAR ADM230LAQ 0C to +70C 0C to +70C -40C to +85C -40C to +85C -40C to +85C N-20 R-20 N-20 R-20 Q-20 ADM231L ADM231LJN ADM231LJR ADM231LAN ADM231LAR ADM231LAQ 0C to +70C 0C to +70C -40C to +85C -40C to +85C -40C to +85C N-14 R-16 N-14 R-16 Q-14 ADM233L ADM233LJN ADM233LAN 0C to +70C -40C to +85C N-20 N-20 ADM234L ADM234LJN ADM234LJR ADM234LAN ADM234LAR ADM234LAQ 0C to +70C 0C to +70C -40C to +85C -40C to +85C -40C to +85C N-16 R-16 N-16 R-16 Q-16 ADM236L ADM236LJN ADM236LJR ADM236LAN ADM236LAR ADM236LAQ 0C to +70C 0C to +70C -40C to +85C -40C to +85C -40C to +85C N-24 R-24 N-24 R-24 Q-24 ADM237L ADM237LJN ADM237LJR ADM237LAN ADM237LAR ADM237LAQ 0C to +70C 0C to +70C -40C to +85C -40C to +85C -40C to +85C N-24 R-24 N-24 R-24 Q-24 ADM239L ADM239LJN ADM239LJR ADM239LAN ADM239LAR ADM239LAQ 0C to +70C 0C to +70C -40C to +85C -40C to +85C -40C to +85C N-24 R-24 N-24 R-24 Q-24 ADM241L ADM241LJR ADM241LAR ADM241LJRS ADM241LARS 0C to +70C -40C to +85C 0C to +70C -40C to +85C R-28 R-28 RS-28 RS-28 *D = Ceramic DIP; N = Plastic DIP; Q = Cerdip; R = Small Outline IC (SOIC); RS = Small Shrink Outline Package (SSOP). CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADM223/ADM230L-ADM241L features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. REV. 0 -3- WARNING! ESD SENSITIVE DEVICE ADM223/ADM230L-ADM241L +5V INPUT T3OUT 1 20 T4OUT T1OUT 2 19 T2OUT 3 18 NC T2IN 4 T5IN 17 SD T1IN 5 ADM230L GND 6 TOP VIEW (Not to Scale) VCC 7 14 T3IN C1+ 8 13 V- V+ 9 12 C2- 10 11 C2+ C1- 1F 6.3V 16 T5OUT 15 T4IN 1F 16V TTL/CMOS INPUTS* NC = NO CONNECT Figure 1. ADM230L DIP/SOIC Pin Configuration 10 C1- 11 C2+ 12 C2- VCC 7 +5V TO +10V VOLTAGE DOUBLER C1+ 8 V+ 9 +10V TO -10V VOLTAGE INVERTER V- 13 1F 6.3V 1F 16V T1IN 5 T1 2 T1OUT T2IN 4 T2 3 T2OUT T3IN 14 T3 1 T3OUT T4IN 15 T4 20 T4OUT T5IN 19 T5 16 T5OUT NC 18 ADM230L 17 SD GND 1F RS-232 OUTPUTS 6 *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT DIP Figure 2. ADM230L Typical Operating Circuit C1+ 1 14 C1- 2 13 VCC V- 3 ADM231L V+ 12 GND 11 T1OUT 5 10 R1IN R2OUT 6 9 R1OUT T2IN 7 8 T1IN T2OUT 4 R2IN TOP VIEW (Not to Scale) +5V INPUT 1F 13 VCC 1 C+ 1F 16V 2 C- +12V TO -12V VOLTAGE CONVERTER V+ 14 V- 3 SOIC 1 16 T1 11 T1OUT T2IN 7 T2 4 T2OUT R1OUT 9 10 R1IN TTL/CMOS INPUTS* V+ C1- 2 15 VCC V- 3 14 GND T2OUT 4 ADM231L 13 T1OUT R2IN 5 TOP VIEW (Not to Scale) 12 R1IN R2OUT 6 11 T2IN 7 10 NC 8 9 1F 16V 8 T1IN C1+ +7.5V TO 13.2V R1 RS-232 INPUTS** TTL/CMOS OUTPUTS R2OUT R2 6 GND 12 R1OUT RS-232 OUTPUTS 5 R2IN ADM231L T1IN *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT NC NC = NO CONNECT Figure 4. ADM231L Typical Operating Circuit (DIP Pinout) Figure 3. ADM231L DIP & SOIC Pin Configurations -4- REV. 0 ADM223/ADM230L-ADM241L +5V INPUT C1+ 1 16 VCC V+ 2 15 GND C1- 3 14 T1OUT C2+ 4 ADM232L 13 R1IN C2- 5 TOP VIEW (Not to Scale) 12 R1OUT V- 6 11 T1IN T2OUT 7 10 R2IN 8 9 1F 6.3V 1F 16V 1 C1+ +5V TO +10V VOLTAGE DOUBLER C1- 3 4 C2+ 5 C2- +10V TO -10V VOLTAGE INVERTER VCC 16 V+ 2 V- 1F 6.3V 1F 6.3V 6 1F 16V T1IN 11 T1 14 T1OUT T2IN 10 T2 7 T2OUT R1OUT 12 R1 13 R1IN R2OUT 9 R2 8 R2IN TTL/CMOS INPUTS* RS-232 OUTPUTS T2IN R2OUT RS-232 INPUTS** TTL/CMOS OUTPUTS GND ADM232L 15 Figure 5. ADM232L DIP/SOIC Pin Configuration *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 6. ADM232L Typical Operating Circuit +5V INPUT 7 VCC T2IN 1 20 R2OUT T1IN 2 19 R2IN R1OUT 3 18 T2OUT R1IN 4 17 V- 16 C2- 15 C2+ 14 V+ T1OUT 5 ADM233L GND 6 TOP VIEW (Not to Scale) VCC 7 C1+ 8 GND C2- 9 10 13 12 11 T1IN 2 T1 5 T2IN 1 T2 18 T2OUT R1OUT 3 4 R1IN TTL/CMOS INPUTS* R1 T1OUT RS-232 INPUTS** TTL/CMOS OUTPUTS R2OUT DO NOT MAKE CONNECTIONS TO THESE PINS C1- INTERNAL -10V POWER SUPPLY V- C2+ RS-232 OUTPUTS INTERNAL +10V POWER SUPPLY 20 R2 8 C1+ C2+ 15 12 V- 14 V+ R2IN C2+ 11 13 C1- 17 V- 19 ADM233L C2- 10 C2- 16 GND 6 GND 9 *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 7. ADM233L DIP Pin Configuration Figure 8. ADM233L Typical Operating Circuit REV. 0 -5- ADM223/ADM230L-ADM241L +5V INPUT 1F 6.3V T1OUT T2OUT 1 16 T3OUT 2 15 T4OUT T2IN 3 T1IN 4 GND 5 VCC 14 T4IN ADM234L 13 T3IN TOP VIEW (Not to Scale) 12 V- 6 11 C2- C1+ 7 10 C2+ V+ 8 9 C1- 1F 16V TTL/CMOS INPUTS* 7 C1+ +5V TO +10V VOLTAGE DOUBLER 9 C1- 10 C2+ 11 C2- +10V TO -10V VOLTAGE INVERTER VCC 6 V+ 8 V- 12 1F 6.3V 1F 16V T1IN 4 T1 1 T1OUT T2IN 3 T2 2 T2OUT T3IN 13 T3 16 T3OUT T4IN 14 T4 15 T4OUT GND 1F RS-232 OUTPUTS ADM234L 5 *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT Figure 9. ADM234L DIP/SOIC Pin Configuration Figure 10. ADM234L Typical Operating Circuit +5V INPUT 1F 12 VCC T1IN 8 T1 3 T1OUT T2IN 7 T2 4 T2OUT T3IN 15 T3 2 T3OUT T4IN 16 T4 1 T4OUT T5IN 22 T5 19 T5OUT T4OUT 1 24 R3IN T3OUT 2 23 R3OUT T1OUT 3 22 T5IN T2OUT 4 21 SD R2IN 5 20 EN R2OUT 6 ADM235L 19 T5OUT T2IN 7 TOP VIEW (Not to Scale) 18 R4IN R1OUT 9 R1 10 R1IN T1IN 8 17 R4OUT R2OUT 6 R2 5 R2IN 9 16 T4IN R1IN 10 15 T3IN R3OUT 23 R3 24 R3IN GND 11 14 R5OUT R4OUT 17 R4 18 R4IN VCC 12 13 R5IN R5OUT 14 R5 13 R5IN 21 SD R1OUT TTL/CMOS INPUTS* TTL/CMOS OUTPUTS EN 20 GND ADM235L RS-232 OUTPUTS RS-232 INPUTS** 11 *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 11. ADM235L DIP Pin Configuration Figure 12. ADM235L Typical Operating Circuit -6- REV. 0 ADM223/ADM230L-ADM241L +5V INPUT 1F 6.3V T3OUT 1 24 T1OUT 2 23 R2IN T2OUT 3 22 R1IN 4 21 SD R1OUT 5 20 ADM236L T4OUT R2OUT EN T2IN 6 T1IN 7 GND 8 17 VCC 9 16 R3IN C1+ 10 15 V- V+ 11 14 C2- C1- 12 13 C2+ TOP VIEW (Not to Scale) 19 1F 16V TTL/CMOS INPUTS* T4IN 10 C1+ +5V TO +10V VOLTAGE DOUBLER 12 C1- 13 C2+ 14 C2- +10V TO -10V VOLTAGE INVERTER VCC 9 V+ 11 V- 15 1F 6.3V 1F 1F 16V T1IN 7 T1 2 T1OUT T2IN 6 T2 3 T2OUT T3IN 18 T3 1 T3OUT T4IN 19 T4 24 T4OUT R1OUT 5 R1 4 R1IN R2OUT 22 R2 23 R2IN R3OUT 17 R3 16 R3IN EN 20 ADM236L 21 SD RS-232 OUTPUTS 18 T3IN R3OUT TTL/CMOS OUTPUTS GND RS-232 INPUTS** 8 *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 13. ADM236L DIP/SOIC Pin Configuration Figure 14. ADM236L Typical Operating Circuit +5V INPUT 1F 6.3V T3OUT 24 1 T4OUT T1OUT 2 T2OUT 3 22 R2OUT R1IN 4 21 T5IN R1OUT 5 20 T5OUT T2IN 6 ADM237L 19 T4IN T1IN 7 TOP VIEW (Not to Scale) 18 T3IN GND 8 17 VCC 9 16 R3IN C1+ 1F 16V 23 R2IN TTL/CMOS INPUTS* 10 C1+ +5V TO +10V VOLTAGE DOUBLER 12 C1- 13 C2+ 14 C2- +10V TO -10V VOLTAGE INVERTER VCC 9 V+ 11 V- 15 1F 6.3V 1F 1F 16V T1IN 7 T1 2 T1OUT T2IN 6 T2 3 T2OUT T3IN 18 T3 1 T3OUT T4IN 19 T4 24 T4OUT T5IN 21 T5 20 T5OUT R1OUT 5 R1 4 R1IN R2OUT 22 R2 23 R2IN R3OUT 17 R3 16 R3IN RS-232 OUTPUTS R3OUT 10 15 V- V+ 11 14 C2- C1- 12 13 C2+ TTL/CMOS OUTPUTS GND RS-232 INPUTS** ADM237L 8 *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 15. ADM237L DIP/SOIC Pin Configuration Figure 16. ADM237L Typical Operating Circuit REV. 0 -7- ADM223/ADM230L-ADM241L +5V INPUT 1F 6.3V 24 T3OUT T2OUT 1 T1OUT 2 23 R3IN R2IN 3 22 R3OUT R2OUT 4 21 T4IN T1IN 5 20 T4OUT R1OUT 6 ADM238L 19 T3IN R1IN 7 TOP VIEW (Not to Scale) GND 8 17 VCC 9 16 R4IN C1+ 10 15 V- V+ 11 14 C2- C1- 12 13 C2+ 1F 16V TTL/CMOS INPUTS* 10 C1+ +5V TO +10V VOLTAGE DOUBLER 12 C1- 13 C2+ +10V TO -10V VOLTAGE INVERTER 14 C2- VCC 9 V+ 11 V- 15 1F 6.3V 1F 1F 16V T1IN 5 T1 2 T1OUT T2IN 18 T2 1 T2OUT T3IN 19 T3 24 T3OUT T4IN 21 T4 20 T4OUT RS-232 OUTPUTS 18 T2IN R4OUT R1OUT 6 R1 7 R1IN R2OUT 4 R2 3 R2IN TTL/CMOS OUTPUTS RS-232 INPUTS** R3OUT 22 R4OUT 17 GND 8 R3 23 R3IN R4 16 R4IN ADM238L *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 17. ADM238L DIP/SOIC Pin Configuration Figure 18. ADM238L Typical Operating Circuit +5V INPUT 1F R1OUT 1 24 R1IN 2 23 T2IN GND 3 22 R2OUT VCC 4 21 R2IN V+ 5 20 T2OUT C+ 6 ADM239L 19 T1OUT TOP VIEW (Not to Scale) 1F 16V T1IN C- 7 18 R3IN V- 8 17 R3OUT R5IN 9 16 T3IN R5OUT 10 15 NC R4OUT 11 14 EN R4IN 12 13 T3OUT 6 C1+ 7 C1- +12V TO -12V VOLTAGE INVERTER VCC 4 +7.5V TO +13.2V INPUT V+ 5 V- 8 1F 16V TTL/CMOS INPUTS* TTL/CMOS OUTPUTS NC = NO CONNECT T1IN 24 T1 19 T1OUT T2IN 23 T2 20 T2OUT T3IN 16 T3 13 T3OUT R1OUT 1 R1 2 R1IN R2OUT 22 R2 21 R2IN R3OUT 17 R3 18 R3IN R4OUT 11 R4 12 R4IN R5OUT 10 R5 9 R5IN EN 14 15 NC GND ADM239L RS-232 OUTPUTS RS-232 INPUTS** 3 *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 19. ADM239L DIP/SOIC Pin Configuration Figure 20. ADM239L Typical Operating Circuit -8- REV. 0 ADM223/ADM230L-ADM241L +5V INPUT 12 C1+ 1F 16V T3OUT 1 28 T4OUT T1OUT 2 27 R3IN T2OUT 3 26 R2IN 4 25 SD R2OUT 5 24 EN T2IN 6 23 R4IN 14 C1- 15 C2+ 1F 16V R3OUT TTL/CMOS INPUTS * 16 C2- +5V TO +10V VOLTAGE DOUBLER V CC 11 +10V TO -10V VOLTAGE INVERTER V- 17 V+ 13 1F 6.3V 1F 16V T1IN 7 T1 2 T1 OUT T2IN 6 T2 3 T2 OUT T3IN 20 T3 1 T3 OUT T4 28 T4 OUT 7 ADM241L 22 R4OUT R1OUT 8 TOP VIEW (Not to Scale) 21 T4IN T4IN 21 R1IN R1 OUT 8 R1 9 R1 IN R2 OUT 5 R2 4 R2 IN R3 OUT 26 R3 27 R3 IN R4 OUT 22 R4 23 R4 IN R5 OUT 19 R5 18 R5 IN EN 24 25 SD T1IN 9 20 T3IN GND 10 19 R5OUT VCC 11 18 R5IN C1+ 12 17 V+ 13 16 C2- C1- 14 C2+ 15 TTL/CMOS OUTPUTS V- ADM241L GND 1F RS-232 OUTPUTS RS-232 INPUTS ** 10 *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 21. ADM241L SOIC/SSOP Pin Configuration Figure 22. ADM241L Typical Operating Circuit +5V INPUT 12 C1+ T3OUT 1 T1OUT 2 27 R3IN T2OUT 3 26 R2IN 4 25 SD 5 24 EN T2IN 6 23 R4IN T1IN 7 R1OUT 8 R1IN ADM223 22 TOP VIEW (Not to Scale) 21 T4IN 9 20 T3IN GND 10 19 R5OUT VCC 11 18 R5IN C1+ 12 17 C1- 14 TTL/CMOS INPUTS * R4OUT 16 C2- +5V TO +10V VOLTAGE DOUBLER V CC 11 +10V TO -10V VOLTAGE INVERTER V- 17 V+ 13 1F 6.3V 1F 1F 16V T1IN 7 T1 2 T1 OUT T2IN 6 T2 3 T2 OUT T3IN 20 T3 1 T3 OUT T4IN 21 T4 28 T4 OUT R1 OUT 8 R1 9 R1IN R2 OUT 5 R2 4 R2IN R3 OUT 26 R3 27 R3IN R4 OUT 22 R4 23 R4IN R5 OUT 19 R5 18 R5IN EN 24 ADM223 25 SD RS-232 OUTPUTS V- TTL/CMOS OUTPUTS 16 C2- 15 14 C1- 15 C2+ 1F 16V R3OUT R2OUT V+ 13 1F 16V 28 T4OUT C2+ GND RS-232 INPUTS ** 10 *INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT NOTE: RECEIVERS R4 AND R5 REMAIN ACTIVE IN SHUTDOWN. Figure 23. ADM223 SOIC/SSOP Pin Configuration Figure 24. ADM223 Typical Operating Circuit REV. 0 -9- ADM223/ADM230L-ADM241L PIN FUNCTION DESCRIPTION Mnemonic Function VCC V+ Power Supply Input 5 V 10% (+5 V 5% ADM233L, ADM235L). Internally generated positive supply (+10 V nominal) on all parts except ADM231L and ADM239L. ADM231L, ADM239L requires external 7.5 V to 13.2 V supply. Internally generated negative supply (-10 V nominal). Ground pin. Must be connected to 0 V. (ADM231L and ADM239L only). External capacitor (+ terminal) is connected to this pin. (ADM231L and ADM239L only). External capacitor (- terminal) is connected to this pin. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (+ terminal) is connected to this pin. (ADM233L) The capacitor is connected internally and no external connection to this pin is required. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (- terminal) is connected to this pin. (ADM233L) The capacitor is connected internally and no external connection to this pin is required. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (+ terminal) is connected to this pin. (ADM233L) Internal capacitor connections, Pins 11 and 15 must be connected together. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (- terminal) is connected to this pin. (ADM233L) Internal capacitor connections, Pins 10 and 16 must be connected together. V- GND C+ C- C1+ C1- C2+ C2- TIN TOUT RIN ROUT EN/EN SD/SD NC Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. An internal 400 k pull-up resistor to VCC is connected on each input. Transmitter (Driver) Outputs. These are RS-232 levels (typically 10 V). Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 k pull-down resistor to GND is connected on each input. Receiver Outputs. These are TTL/CMOS levels. Enable Input. Active low on ADM235L, ADM236L, ADM239L, ADM241L. Active high ADM223. This input is used to enable/disable the receiver outputs. With EN = low (EN = high ADM223), the receiver outputs are enabled. With EN = high (EN = low ADM223), the outputs are placed in a high impedance state. This facility is useful for connecting to microprocessor systems. Shutdown Input. Active high on ADM235L, ADM236L, ADM241L. Active low on ADM223. With SD = high on the ADM235L, ADM236L, ADM241L, the charge pump is disabled, the receiver outputs are placed in a high impedance state and the driver outputs are turned off. With SD low on the ADM223, the charge pump is disabled, the driver outputs are turned off and all receivers except R4 and R5 are placed in a high impedance state. In shutdown, the power consumption reduces to 5 W. No Connect. No connections are required to this pin. Table I. ADM235L, ADM236L, ADM241L Truth Table Table II. ADM223 Truth Table SD EN Status Transmitters T1-T5 Receivers R1-R5 0 0 1 0 1 0 Normal Operation Normal Operation Shutdown Enabled Enabled Disabled Enabled Disabled Disabled -10- SD EN Status Transmitters Receivers T1-T4 R1-R3 R4, R5 0 0 1 1 Disabled Disabled Enabled Enabled 0 1 0 1 Shutdown Shutdown Normal Operation Normal Operation Disabled Disabled Disabled Enabled Disabled Enabled Disabled Enabled REV. 0 ADM223/ADM230L-ADM241L 10 10 8 V+ VOUT (1 O/P LOADED) VOUT - V VOUT - V | V- | 6 8 4 VOUT (ALL O/Ps LOADED) 6 2 4 0 0 10 20 IOUT -- mA 30 40 3.0 4.0 5.0 VCC - V Figure 25. Charge Pump V+, V- vs. Current Figure 27. Transmitter Output Voltage vs. VCC 12 18 16 10 TOUT HIGH 8 TOUT - V SLEW RATE - V/s 14 12 10 6 TOUT LOW 4 8 2 6 0 4 0 500 1000 1500 2000 2 0 2500 CAPACITIVE LOAD - pF 300 V+, V- IMPEDANCE - V- (UNLOADED) V- (LOADED) V+ (UNLOADED) 100 V+ (LOADED) 0 3 4 VCC - V Figure 29. Charge Pump Impedance vs. VCC REV. 0 6 8 Figure 28. Transmitter Output Voltage vs. Current Figure 26. Transmitter Slew Rate vs. Load Capacitance 200 4 IOUT - mA -11- 5 ADM223/ADM230L-ADM241L A3 0.8 V A3 100 100 90 90 10 10 0% 0% 5V 5V B Lw 5 1ms H O 0.8 V B Lw 5V Figure 30. Charge Pump, V+, V- Exiting Shutdown A3 5 5s H O Figure 31. Transmitter Output Loaded Slew Rate 0.8 V 100 90 10 0% B Lw 5V H O 1s 5 Figure 32. Transmitter Output Unloaded Slew Rate GENERAL INFORMATION CIRCUIT DESCRIPTION The ADM223/ADM230L-ADM241L family of RS-232 drivers/ receivers are designed to solve interface problems by meeting the EIA-232-E specifications while using a single digital +5 V supply. The EIA-232-E standard requires transmitters which will deliver 5 V minimum on the transmission channel and receivers which can accept signal levels down to 3 V. The ADM223/ADM230L-ADM241L meet these requirements by integrating step up voltage converters and level shifting transmitters and receivers onto the same chip. CMOS technology is used to keep the power dissipation to an absolute minimum. A comprehensive range of transmitter/receiver combinations is available to cover most communications needs. The internal circuitry in the ADM230L-ADM241L consists of three main sections. These are: The ADM223, ADM230L, ADM235L, ADM236L and ADM241L are particularly useful in battery powered systems as they feature a low power shutdown mode which reduces power dissipation to less than 5 W. (a) A charge pump voltage converter (b) RS-232 to TTL/CMOS receivers (c) TTL/CMOS to RS-232 transmitters Charge Pump DC-DC Voltage Converter The charge pump voltage converter consists of an oscillator and a switching matrix. The converter generates a 10 V supply from the input 5 V level. This is done in two stages using a switched capacitor technique as illustrated in Figures 33 and 34. First, the 5 V input supply is doubled to 10 V using capacitor C1 as the charge storage element. The 10 V level is then inverted to generate -10 V using C2 as the storage element. S1 S3 VCC V+ = 2VCC C1 The ADM233L and ADM235L are designed for applications where space saving is important as the charge pump capacitors are molded into the package. S2 GND The ADM231L and ADM239L include only a negative charge pump converter and are intended for applications where a positive 12 V is available. C3 S4 VCC INTERNAL OSCILLATOR To facilitate sharing a common line or for connection to a microprocessor data bus the ADM235L, ADM236L, ADM239L and ADM241L feature an enable (EN, EN) function. When disabled, the receiver outputs are placed in a high impedance state. -12- Figure 33. Charge-Pump Voltage Doubler REV. 0 ADM223/ADM230L-ADM241L S1 S3 GND V+ FROM VOLTAGE DOUBLER C2 S2 C4 S4 GND V- = - (V+) INTERNAL OSCILLATOR Figure 34. Charge-Pump Voltage Inverter Capacitors C3 and C4 are used to reduce the output ripple. Their values are not critical and can be reduced if higher levels of ripple are acceptable. The charge pump capacitors C1 and C2 may also be reduced at the expense of higher output impedance on the V+ and V- supplies. Enable Input The ADM235, ADM239, ADM241L and ADM223 feature an enable input used to enable or disable the receiver outputs. The enable input is active low on the ADM235L, ADM239L, ADM241L and active high on the ADM223. Refer to Tables I and II. When disabled, all receiver outputs are placed in a high impedance state. This function allows the outputs to be connected directly to a microprocessor data bus. It can also be used to allow receivers from different devices to share a common data line. The timing diagram for the enable function is shown in Figure 35. 3V EN* 0V The V+ and V- supplies may also be used to power external circuitry if the current requirements are small. TEN Transmitter (Driver) Section ROUT The drivers convert TTL/CMOS input levels into EIA-232-E output levels. With VCC = +5 V and driving a typical EIA-232-E load, the output voltage swing is 9 V. Even under worst case conditions the drivers are guaranteed to meet the 5 V EIA-232-E minimum requirement. The input threshold levels are both TTL and CMOS compatible with the switching threshold set at VCC/4. With a nominal VCC = 5 V the switching threshold is 1.25 V typical. Unused inputs may be left unconnected, as an internal 400 k pull-up resistor pulls them high forcing the outputs into a low state. As required by the EIA-232-E standard, the slew rate is limited to less than 30 V/s without the need for an external slew limiting capacitor and the output impedance in the power-off state is greater than 300 . Receiver Section The receivers are inverting level shifters which accept EIA232-E input levels ( 5 V to 15 V) and translate them into 5 V TTL/CMOS levels. The inputs have internal 5 k pull-down resistors to ground and are also protected against overvoltages of up to 30 V. The guaranteed switching thresholds are 0.8 V minimum and 2.4 V maximum which are well within the 3 V EIA-232-E requirement. The low level threshold is deliberately positive as it ensures that an unconnected input will be interpreted as a low level. The receivers have Schmitt trigger inputs with a hysteresis level of 0.5 V. This ensures error-free reception for both noisy inputs and for inputs with slow transition times. 3.5V VOH - 0.1V 0.8V VVOL + 0.1V *POLARITY OF EN IS REVERSED FOR ADM223. Figure 35. Enable Timing APPLICATION HINTS Driving Long Cables In accordance with the EIA-232-E standard, long cables are permissible provided that the total load capacitance does not exceed 2500 pF. For longer cables which do exceed this, then it is possible to trade off baud rate vs. cable length. Large load capacitances cause a reduction in slew rate, and hence the maximum transmission baud rate is decreased. The ADM230L-ADM241L are designed so that the slew rate reduction with increasing load capacitance is minimized. For the receivers, it is important that a high level of noise immunity be inbuilt so that slow rise and fall times do not cause multiple output transitions as the signal passes slowly through the transition region. The ADM230L-ADM241L have 0.5 V of hysteresis to guard against this. This ensures that, even in noisy environments, error-free reception can be achieved. High Baud Rate Operation The ADM230L-ADM241L feature high slew rates permitting data transmission at rates well in excess of the EIA-232-E specification. The drivers maintain 5 V signal levels at data rates up to 100-kB/s under worst-case loading conditions. Shutdown (SD) The ADM223, ADM230L, ADM235L, ADM236L and ADM241L feature a control input that may be used to disable the part and reduce the power consumption to less than 5 W. This is very useful in battery operated systems. During shutdown the charge pump is turned off, the transmitters are disabled and all receivers except R4 and R5 on the ADM223 are put into a high-impedance disabled state. Receivers R4 and R5 on the ADM223 remain enabled during shutdown. This feature allows monitoring external activity such as ring indicator monitoring while the device is in a low power shutdown mode. The shutdown control input is active high on all parts except the ADM223 where it is active low. Refer to Tables I and II. REV. 0 TDIS -13- ADM223/ADM230L-ADM241L OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 14-Lead Plastic DIP (N-14) 14 14-Lead Cerdip (Q-14) 8 1 8 14 0.280 (7.11) 0.240 (6.10) PIN 1 0.271 (6.89) 0.240 (6.09) PIN 1 7 7 1 0.325 (8.25) 0.300 (7.62) 0.795 (20.19) 0.725 (18.42) 0.060 (1.52) 0.015 (0.38) 0.210 (5.33) 0.150 (3.81) 0.200 (5.05) 0.125 (3.18) 0.100 (2.54) BSC 0.022 (0.558) 0.014 (0.356) 0.195 (4.95) 0.115 (2.93) 0.163 (4.14) 0.133 (3.378) 0.21 (5.33) 0.15 (3.81) 0.125 (3.17) MIN 0.015 (0.381) 0.008 (0.204) SEATING PLANE 0.070 (1.77) 0.045 (1.15) 0.300 (7.62) REF 0.780 (19.81) 0.012 (0.305) 0.008 (0.203) 15 0.02 (0.5) 0.016 (0.406) 0.11 (2.79) 0.099 (2.28) 0.06 (1.52) 0.05 (1.27) SEATING PLANE 0 16-Lead Plastic DIP (N-16) 16-Lead Cerdip (Q-16) 16 9 0.280 (7.11) 0.240 (6.10) PIN 1 1 16 0.150 (3.81) 0.200 (5.05) 0.125 (3.18) 0.070 (1.77) 0.045 (1.15) 0.100 (2.54) BSC 8 0.300 (7.62) REF 0.780 (19.81) 0.060 (1.52) 0.015 (0.38) 0.022 (0.558) 0.014 (0.356) 0.271 (6.89) 0.240 (6.09) 1 0.325 (8.25) 0.300 (7.62) 0.840 (21.33) 0.745 (18.93) 0.210 (5.33) 9 PIN 1 8 0.195 (4.95) 0.115 (2.93) 0.163 (4.14) 0.133 (3.378) 0.015 (0.381) 0.008 (0.204) 0.125 (3.17) MIN SEATING PLANE 0.02 (0.5) 0.016 (0.406) 0.21 (5.33) 0.15 (3.81) 0.012 (0.305) 0.008 (0.203) 15 0.11 (2.79) 0.099 (2.28) 0.06 (1.52) 0.05 (1.27) SEATING PLANE 0 16-Lead SOIC (R-16) 9 16 0.299 (7.60) 0.291 (7.40) 0.419 (10.65) 0.404 (10.26) PIN 1 8 1 0.413 (10.50) 0.348 (10.10) 0.010 (0.25) 0.004 (0.10) 0.050 (1.27) BSC 0.018 (0.46) 0.014 (0.36) 0.107 (2.72) 0.089 (2.26) 0.015 (0.38) 0.007 (1.18) 0.364 (9.246) 0.344 (8.738) 0.045 (1.15) 0.020 (0.50) -14- REV. 0 ADM223/ADM230L-ADM241L 20-Lead Plastic DIP (N-20) 20 20-Lead Cerdip (Q-20) 11 0.280 (7.11) 0.240 (6.10) PIN 1 20 11 1 10 0.28 (7.11) 0.24 (6.1) PIN 1 10 1 1.060 (26.90) 0.925 (23.50) 0.060 (1.52) 0.015 (0.38) 0.210 (5.33) 0.100 (2.54) BSC 0.29 (7.366) 0.18 (4.57) 0.125 (3.18) 0.20 (5.0) 0.14 (3.56) 0.015 (0.381) 0.008 (0.204) 0.011 (0.28) 0.15 (3.8) 0.125 (3.18) SEATING PLANE 0.070 (1.78) 0.045 (1.15) 0.32 (8.128) 0.935 (23.75) 0.195 (4.95) 0.115 (2.93) 0.150 (3.81) 0.200 (5.05) 0.125 (3.18) 0.022 (0.558) 0.014 (0.356) 0.97 (24.64) 0.325 (8.25) 0.300 (7.62) 0.009 (0.23) 0.02 (0.5) 0.016 (0.41) 0.07 (1.78) 0.05 (1.27) 0.11 (2.79) 0.09 (2.28) 15 SEATING PLANE 0 LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH 24-Lead Ceramic DIP (D-24) 20-Lead SOIC (R-20) 0.005 (0.13) 20 11 0.098 (2.49) 24 13 0.2992 (7.60) 0.2914 (7.40) 0.610 (15.49) 0.500 (12.70) PIN 1 0.4193 (10.65) 0.3937 (10.00) PIN 1 1 1 12 0.075 (1.91) 0.015 (0.38) 1.290 (32.77) 0.0118 (0.30) 0.0040 (0.10) 0.0500 (1.27) BSC 0.225 (5.72) 0.1043 (2.65) 0.0926 (2.35) 0.5118 (13.00) 0.4961 (12.60) 0.0192 (0.49) 0.0138 (0.35) 0.0125 (0.32) 0.0091 (0.23) 8 0 0.023 (0.58) 0.014 (0.36) 0.0500 (1.27) 0.0157 (0.40) 12 1 0.55 (13.97) 0.53 (13.47) PIN 1 SEATING PLANE 12 1 0.32 (8.128) 0.30 (7.62) 0.07 (1.78) 0.05 (1.27) SEATING PLANE 13 24 1.25 (31.75) 1.24 (31.5) 0.130 (3.30) 0.128 (3.25) 0.11 (2.79) 0.09 (2.28) 0.070 (1.78) 0.030 (0.76) 0.260 0.001 (6.61 0.03) 1.228 (31.19) 1.226 (31.14) 0.02 (0.5) 0.016 (0.41) 0.110 (2.79) 0.090 (2.29) 24-Lead Plastic DIP (N-24A) 13 24 PIN 1 0.015 (0.38) 0.008 (0.20) 0.150 (3.81) 0.200 (5.08) 0.120 (3.05) 0.0291 (0.74) x 45 0.0098 (0.25) 24-Lead Plastic DIP (N-24) 15 0 0.2 (5.08) MAX 0.175 (4.45) 0.12 (3.05) 0.02 (0.508) 0.015 (0.381) 0.011 (0.28) 0.009 (0.23) NOTES 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH 2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. REV. 0 0.620 (15.75) 0.590 (14.99) 10 -15- 0.606 (15.4) 0.594 (15.09) 0.16 (4.07) 0.14 (3.56) 0.105 (2.67) 0.095 (2.42) 0.065 (1.66) 0.045 (1.15) SEATING PLANE 15 0 0.012 (0.305) 0.008 (0.203) 24-Lead Cerdip (Q-24) 13 1 12 0.295 (7.493) MAX 0.299 (7.6) 0.291 (7.39) 0.320 (8.128) 0.290 (7.366) 1.290 (32.77) MAX 0.414 (10.52) 0.398 (10.10) PIN 1 0.180 (4.572) MAX 0.225 (5.715) MAX 0.125 (3.175) MIN 15 28 14 1 SEATING PLANE 0.070 (1.778) 15 0.021 (0.533) 0.110 (2.794) 0.065 (1.651) 0.020 (0.508) 0.015 (0.381) 0.090 (2.286) 0.055 (1.397) 0 TYP TYP TYP 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH. 2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. 0.096 (2.44) 0.089 (2.26) 0.708 (18.02) 0.696 (17.67) 0.012 (0.305) 0.008 (0.203) TYP 0.01 (0.254) 0.006 (0.15) 0.05 (1.27) BSC 0.03 (0.76) 0.02 (0.51) 0.019 (0.49) 0.014 (0.35) 0.013 (0.32) 0.009 (0.23) 6 0 C1900-18-4/94 24 PIN 1 28-Lead SOIC (R-28) 0.042 (1.067) 0.018 (0.457) 1. LEAD NO. IDENTIFIED BY A DOT. 2. SOICLEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. 24-Lead SOIC (R-24) 24 28-Lead SSOP (RS-28) 13 28 15 0.299 (7.6) 0.291 (7.39) PIN 1 12 1 0.212 (5.38) 0.205 (5.207) 0.414 (10.52) 0.398 (10.10) 0.311 (7.9) 0.301 (7.64) PIN 1 1 0.096 (2.44) 0.089 (2.26) 0.608 (15.45) 0.596 (15.13) 0.05 (1.27) BSC 0.019 (0.49) 0.014 (0.35) 0.013 (0.32) 0.009 (0.23) 0.407 (10.34) 0.397 (10.08) 0.03 (0.76) 0.02 (0.51) 6 0 0.042 (1.067) 0.018 (0.447) 0.008 (0.203) 0.002 (0.050) 0.0256 (0.65) BSC 0.07 (1.78) 0.066 (1.67) 0.009 (0.229) 0.005 (0.127) 8 0 0.037 (0.94) 0.022 (0.559) 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS PRINTED IN U.S.A. 0.01 (0.254) 0.006 (0.15) 14 -16-