SN74LVTH244AGQNR - Texas Instruments

SN54LVTH244A, SN74LVTH244A

3.3-V ABT OCTAL BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SCAS586J − DECEMBER 1996 − REVISED OCTOBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DSupport Mixed-Mode Signal Operation (5-V

Input and Output Voltages With 3.3-V VCC)

DTypical VOLP (Output Ground Bounce)

<0.8 V at VCC = 3.3 V, TA = 25°C

DSupport Unregulated Battery Operation

Down to 2.7 V

DIoff and Power-Up 3-State Support Hot

Insertion

DBus Hold on Data Inputs Eliminates the

Need for External Pullup/Pulldown

Resistors

DLatch-Up Performance Exceeds 500 mA Per

JESD 17

DESD Protection Exceeds JESD 22

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

1OE

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

GND

VCC

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

2A1

SN54LVTH244A ...J OR W PACKAGE

SN74LVTH244A . . . DB, DW, NS,

OR PW PACKAGE

(TOP VIEW)

3 2 1 20 19

910111213

1Y1

2A4

1Y2

2A3

1Y3

1A2

2Y3

1A3

2Y2

1A4

SN54LVTH244A . . . FK PACKAGE

(TOP VIEW)

2Y4

1A1

1OE

1Y4

2A2 2OE

2Y1

GND

2A1

VCC

SN74LVTH244A . . . RGY PACKAGE

(TOP VIEW)

120

10 11

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

2A1 V

GND

1OE

description/ordering information

These octal buffers and line drivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the

capability to provide a TTL interface to a 5-V system environment.

ORDERING INFORMATION

TAPACKAGE†ORDERABLE

PART NUMBER TOP-SIDE MARKING

QFN − RGY Tape and reel SN74LVTH244ARGYR LXH244A

SOIC DW

Tube SN74LVTH244ADW

LVTH244A

SOIC − DW Tape and reel SN74LVTH244ADWR LVTH244A

40°Cto85°C

SOP − NS Tape and reel SN74LVTH244ANSR LVTH244A

−40°C to 85°CSSOP − DB Tape and reel SN74LVTH244ADBR LXH244A

TSSOP − PW Tape and reel SN74LVTH244APWR LXH244A

VFBGA − GQN

Tape and reel

SN74LVTH244AGQNR

LXH244A

VFBGA − ZQN (Pb-free) Tape and reel SN74LVTH244AZQNR LXH244A

CDIP − J Tube SNJ54LVTH244AJ SNJ54LVTH244AJ

−55°C to 125°CCFP − W Tube SNJ54LVTH244AW SNJ54LVTH244AW

LCCC − FK Tube SNJ54LVTH244AFK SNJ54LVTH244AFK

†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available

at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

On products compliant to MIL-PRF-38535, all parameters are tested

unless otherwise noted. On all other products, production

processing does not necessarily include testing of all parameters.

SN54LVTH244A, SN74LVTH244A

3.3-V ABT OCTAL BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SCAS586J − DECEMBER 1996 − REVISED OCTOBER 2003

2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

description/ordering information (continued)

The ’LVTH244A devices are organized as two 4-bit line drivers with separate output-enable (OE) inputs. When

OE is low, the devices pass data from the A inputs to the Y outputs. When OE is high, the outputs are in the

high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup

or pulldown resistors with the bus-hold circuitry is not recommended.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry

disables the outputs, preventing damaging current backflow through the devices when they are powered down.

The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,

which prevents driver conflict.

terminal assignments

1234

A1A1 1OE VCC 2OE

B1A2 2A4 2Y4 1Y1

C1A3 2Y3 2A3 1Y2

D1A4 2A2 2Y2 1Y3

EGND 2Y1 2A1 1Y4

FUNCTION TABLE

(each buffer)

INPUTS OUTPUT

OE A

OUTPUT

L H H

LLL

H X Z

SN74LVTH244A . . . GQN OR ZQN PACKAGE

(TOP VIEW)

1234

SN54LVTH244A, SN74LVTH244A

3.3-V ABT OCTAL BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SCAS586J − DECEMBER 1996 − REVISED OCTOBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

logic diagram (positive logic)

218

1Y1

1OE

1A1

416

1Y2

1A2

614

1Y3

1A3

812

1Y4

1A4

11 9 2Y1

2OE

2A1

13 7 2Y2

2A2

15 5 2Y3

2A3

17 3 2Y4

2A4

Pin numbers shown are for the DB, DW, FK, J, NS, PW, RGY, and W packages.

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage range, VCC −0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, VI (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Voltage range applied to any output in the high-impedance

or power-off state, VO (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Voltage range applied to any output in the high state, VO (see Note 1) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . .

Current into any output in the low state, IO: SN54LVTH244A 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SN74LVTH244A 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current into any output in the high state, IO (see Note 2): SN54LVTH244A 48 mA. . . . . . . . . . . . . . . . . . . . . .

SN74LVTH244A 64 mA. . . . . . . . . . . . . . . . . . . . . .

Input clamp current, IIK (VI < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output clamp current, IOK (VO < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance, θJA (see Note 3): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 3): DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 3): GQN/ZQN package 78°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 3): NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 3): PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 4): RGY package 37°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

2. This current flows only when the output is in the high state and VO > VCC.

3. The package thermal impedance is calculated in accordance with JESD 51-7.

4. The package thermal impedance is calculated in accordance with JESD 51-5.

SN54LVTH244A, SN74LVTH244A

3.3-V ABT OCTAL BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SCAS586J − DECEMBER 1996 − REVISED OCTOBER 2003

4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

recommended operating conditions (see Note 5)

SN54LVTH244A SN74LVTH244A

UNIT

MIN MAX MIN MAX UNIT

VCC Supply voltage 2.7 3.6 2.7 3.6 V

VIH High-level input voltage 2 2 V

VIL Low-level input voltage 0.8 0.8 V

VIInput voltage 5.5 5.5 V

IOH High-level output current −24 −32 mA

IOL Low-level output current 48 64 mA

Δt/ΔvInput transition rise or fall rate Outputs enabled 10 10 ns/V

Δt/ΔVCC Power-up ramp rate 200 200 μs/V

TAOperating free-air temperature −55 125 −40 85 °C

NOTE 5: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

SN54LVTH244A, SN74LVTH244A

3.3-V ABT OCTAL BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SCAS586J − DECEMBER 1996 − REVISED OCTOBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

PARAMETER

TEST CONDITIONS

SN54LVTH244A SN74LVTH244A

UNIT

PARAMETER TEST CONDITIONS MIN TYP†MAX MIN TYP†MAX UNIT

VIK VCC = 2.7 V, II = −18 mA −1.2 −1.2 V

VCC = 2.7 V to 3.6 V, IOH = −100 μA VCC−0.2 VCC−0.2

VCC = 2.7 V, IOH = −8 mA 2.4 2.4

VOH

V3V

IOH = −24 mA 2V

VCC = 3 V IOH = −32 mA 2

V27V

IOL = 100 μA 0.2 0.2

VCC = 2.7 V IOL = 24 mA 0.5 0.5

IOL = 16 mA 0.4 0.4

VOL

V3V

IOL = 32 mA 0.5 0.5 V

VCC = 3 V IOL = 48 mA 0.55

IOL = 64 mA 0.55

Control inputs

VCC = 0 or 3.6 V, VI = 5.5 V 50 10

Control inputs VCC = 3.6 V, VI = VCC or GND ±1±1

Data inputs

V36V

VI = VCC 1 1 μA

Data inputs VCC = 3.6 V VI = 0 −5 −5

Ioff VCC = 0, VI or VO = 0 to 4.5 V ±100 μA

V3V

VI = 0.8 V 75 75

II(h ld)

Data inputs

VCC = 3 V VI = 2 V −75 −75

μA

I(hold)

ata

nputs

VCC = 3.6 V‡, VI = 0 to 3.6 V 500

−750

IOZH VCC = 3.6 V, VO = 3 V 5 5 μA

IOZL VCC = 3.6 V, VO = 0.5 V −5 −5 μA

IOZPU

VCC = 0 to 1.5 V, VO = 0.5 V to 3 V,

OE = don’t care ±100∗±100 μA

IOZPD

VCC = 1.5 V to 0, VO = 0.5 V to 3 V,

OE = don’t care ±100∗±100 μA

VCC

3.6 V,

Outputs high 0.39 0.19

ICC

CC =

IO = 0, Outputs low 14 5 mA

ICC

VI = VCC or GND Outputs disabled 0.39 0.19

ΔICC§VCC = 3 V to 3.6 V, One input at VCC − 0.6 V,

Other inputs at VCC or GND 0.2 0.2 mA

CiVI = 3 V or 0 3 3 pF

CoVO = 3 V or 0 7 7 pF

∗ On products compliant to MIL-PRF-38535, this parameter is not production tested.

†All typical values are at VCC = 3.3 V, TA = 25°C.

‡This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.

§This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.

SN54LVTH244A, SN74LVTH244A

3.3-V ABT OCTAL BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SCAS586J − DECEMBER 1996 − REVISED OCTOBER 2003

6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

switching characteristics over recommended operating free-air temperature range, CL = 50 pF

(unless otherwise noted) (see Figure 1)

SN54LVTH244A SN74LVTH244A

PARAMETER FROM

(INPUT)

(OUTPUT)

VCC = 3.3 V

± 0.3 V VCC = 2.7 V VCC = 3.3 V

± 0.3 V VCC = 2.7 V UNIT

(INPUT)

(OUTPUT)

MIN MAX MIN MAX MIN TYP†MAX MIN MAX

tPLH

0.5 3.8 4.1 1.1 2.3 3.5 3.8

tPHL

A Y 0.5 3.8 3.9 1.3 2.1 3.3 3.6 ns

tPZH

0.8 5 6 1.1 2.5 4.5 5.3

tPZL

OE Y0.8 5 5.4 1.4 2.7 4.4 4.9 ns

tPHZ

1.3 5.5 5.8 1.9 2.8 4.4 4.5

tPLZ

OE Y1.2 4.7 4.8 1.8 2.9 4.4 4.4 ns

†All typical values are at VCC = 3.3 V, TA = 25°C.

SN54LVTH244A, SN74LVTH244A

3.3-V ABT OCTAL BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SCAS586J − DECEMBER 1996 − REVISED OCTOBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PARAMETER MEASUREMENT INFORMATION

1.5 V

tsu

From Output

Under Test

CL = 50 pF

(see Note A)

LOAD CIRCUIT

6 V

Open

GND

500 Ω

Data Input

Timing Input 1.5 V

2.7 V

0 V

1.5 V 1.5 V

2.7 V

0 V

2.7 V

0 V

1.5 V

Input

VOLTAGE WAVEFORMS

SETUP AND HOLD TIMES

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES

INVERTING AND NONINVERTING OUTPUTS

VOLTAGE WAVEFORMS

PULSE DURATION

tPLH

tPHL

tPLH

VOH

VOL

1.5 V 1.5 V

2.7 V

0 V

1.5 V1.5 V

Input

1.5 V

Output

Control

Output

Waveform 1

S1 at 6 V

(see Note B)

Output

Waveform 2

S1 at GND

(see Note B)

VOL

VOH

tPZL

tPZH

tPLZ

tPHZ

1.5 V1.5 V

3 V

0 V

1.5 V VOL + 0.3 V

1.5 V VOH − 0.3 V

≈0 V

2.7 V

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES

LOW- AND HIGH-LEVEL ENABLING

Output

tPLH/tPHL

tPLZ/tPZL

tPHZ/tPZH

Open

6 V

GND

TEST S1

NOTES: A. CL includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.

C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.

D. The outputs are measured one at a time with one transition per measurement.

E. All parameters and waveforms are not applicable to all devices.

1.5 V

Figure 1. Load Circuit and Voltage Waveforms

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

5962-9584401Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI

5962-9584401QRA ACTIVE CDIP J 20 1 TBD Call TI Call TI

5962-9584401QSA ACTIVE CFP W 20 1 TBD Call TI Call TI

5962-9584401V2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

5962-9584401VRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

5962-9584401VSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

SN74LVTH244ADB ACTIVE SSOP DB 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ADBE4 ACTIVE SSOP DB 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ADBG4 ACTIVE SSOP DB 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ADBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI

SN74LVTH244ADBR ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ADBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ADW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ADWE4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ADWR ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2012

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN74LVTH244AGQNR LIFEBUY BGA

MICROSTAR

JUNIOR

GQN 20 1000 TBD SNPB Level-1-240C-UNLIM

SN74LVTH244ANSR ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ANSRG4 ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244APW ACTIVE TSSOP PW 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244APWG4 ACTIVE TSSOP PW 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244APWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI

SN74LVTH244APWR ACTIVE TSSOP PW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74LVTH244ARGYR ACTIVE VQFN RGY 20 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

SN74LVTH244ARGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

SN74LVTH244AZQNR ACTIVE BGA

MICROSTAR

JUNIOR

ZQN 20 1000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM

SNJ54LVTH244AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54LVTH244AJ ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SNJ54LVTH244AW ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

PACKAGE OPTION ADDENDUM

www.ti.com 28-Aug-2012

Addendum-Page 3

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54LVTH244A, SN54LVTH244A-SP, SN74LVTH244A :

•Catalog: SN74LVTH244A, SN54LVTH244A

•Enhanced Product: SN74LVTH244A-EP, SN74LVTH244A-EP

•Military: SN54LVTH244A

•Space: SN54LVTH244A-SP

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Enhanced Product - Supports Defense, Aerospace and Medical Applications

•Military - QML certified for Military and Defense Applications

•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74LVTH244ADBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1

SN74LVTH244ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1

SN74LVTH244AGQNR BGA MI

CROSTA

R JUNI

GQN 20 1000 330.0 12.4 3.3 4.3 1.5 8.0 12.0 Q1

SN74LVTH244ANSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1

SN74LVTH244APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1

SN74LVTH244APWRG4 TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1

SN74LVTH244ARGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1

SN74LVTH244AZQNR BGA MI

CROSTA

R JUNI

ZQN 20 1000 330.0 12.4 3.3 4.3 1.6 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74LVTH244ADBR SSOP DB 20 2000 367.0 367.0 38.0

SN74LVTH244ADWR SOIC DW 20 2000 367.0 367.0 45.0

SN74LVTH244AGQNR BGA MICROSTAR

JUNIOR GQN 20 1000 340.5 338.1 20.6

SN74LVTH244ANSR SO NS 20 2000 367.0 367.0 45.0

SN74LVTH244APWR TSSOP PW 20 2000 364.0 364.0 27.0

SN74LVTH244APWR TSSOP PW 20 2000 367.0 367.0 38.0

SN74LVTH244APWRG4 TSSOP PW 20 2000 367.0 367.0 38.0

SN74LVTH244ARGYR VQFN RGY 20 3000 367.0 367.0 35.0

SN74LVTH244AZQNR BGA MICROSTAR

JUNIOR ZQN 20 1000 340.5 338.1 20.6

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

4040065 /E 12/01

28 PINS SHOWN

Gage Plane

8,20

7,40

0,55

0,95

0,25

12,90

12,30

10,50

8,50

Seating Plane

9,907,90

10,50

9,90

0,38

5,60

5,00

0,22

2016

6,50

0,05 MIN

5,905,90

DIM

A MAX

A MIN

PINS **

2,00 MAX

6,90

7,50

0,65 M

0,15

0°–ā8°

0,10

0,09

0,25

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which

have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such

components to meet such requirements.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265