© 2008-2012 Microchip Technology Inc. DS70318F-page 1
dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04
Operating Conditions
3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS
3.0V to 3.6V, -40ºC to +125ºC, DC to 40 MIPS
3.0V to 3.6V, -40ºC to +85ºC, DC to 50 MIPS
Core: 16-bit dsPIC33F CPU
Code-efficient (C and Assembly) architecture
Two 40-bit wide accumulators
Single- cy c l e (M AC /M PY) with dual data fetch
Single-cycle mixed-si gn MUL plus hardware divide
32-bit multiply support
Clock Management
±2.0% in te rn a l os c i llator
Programmable PLLs and oscillator clock sources
Fail-Safe Clock Monitor (FSCM)
Independent Watchdog Timer (WDT)
Fast wake-up and start-up
Power Management
Low-power management mode s (Sleep, Idle, Doze)
Integrated Power-on Reset and Brown-out Reset
High-Speed PWM
Up to four PWM pairs with independent timing
Dead time for rising and falling edges
1.04 ns PWM resolution
PWM support for:
- DC/DC, AC/DC, Inverters, PFC, and Lighting
Programmable Fault inp uts
Flexible trigger configurations for ADC conversions
Advanced Analog Features
ADC module:
- 10-bit resolution with up to 2 Successive Approximation
Register (SAR) converters (4 Msps) and up to six
Sample and Hold (S&H) ci rcuit s
- Up to 12 input channels grouped into six conversion
pairs plus two voltage reference monitoring inputs
- Dedicated result buffer for each analog channel
Flexible and independent ADC trigger sources
Advanced Analog Features (Continued)
Up to four High-Speed Comparators with di rect
connection to the PWM module:
- Programmable references with 1024 voltage points
Timers/Output Compare/Input Capture
Three general purpose timers:
- Three 16-bit and one 32-bit timer/counter
Two Output Compare (OC) modules
Two Input Capture (IC) modules
Peripheral Pin Select (PPS) to allow function remap
Communication Interfaces
UART module (12.5 Mbps)
- With support for LIN 2.0 protocols and IrDA®
4-wire SPI module
•I
2C™ module (up to 1 Mbaud) with SMBus support
PPS to allow function remap
Input/Output
Sink/Source 18 mA on 8 pins, 10 mA on 10 p ins, and 6
mA on 17 pins
5V-tolerant pins
Selectable open drain and pull-ups
External interrupts on up to 30 I/O pins
Qualification and Class B Support
AEC-Q100 REVG (Grade 1 -40ºC to +125ºC)
AEC-Q100 REVG (Grade 0 -40ºC to +150ºC)
Class B Safety Library, IEC 60730, VDE certifie d
Debugger Development Support
In-circuit and in-a pplication programming
Two breakpoints
IEEE 1149.2-compatible (JTAG) boundary scan
Trace and run-time watch
Packages
Type SOIC SPDIP QFN-S QFN TQFP VTLA
Pin Count 18 28 28 28 44 44 44
I/O Pins 13 21 21 21 35 35 35
Contact Le ad/Pitch 1.27 1.27 .100'' 0.65 0.65 0.80 0.50
Dimensions 10.30x7.50x2.65 17.9x7.50x2.05 1.365x.240x.120” 6x6x0.9 8x8x1 10x10x1 6x6x0.9
Note: All dimensions are in millimeters (mm) unless specified.
16-bit Digital Signal Controllers (up to 16 KB Flash and up to 2 KB
SRAM) with High-Speed PWM, ADC, and Comparators
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 2 © 2008-2012 Microchip Technology Inc.
dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 PRODUCT
FAMILIES
The device names, pin counts, memory sizes and
peripheral availability of each device are listed below.
The following pages show their pinout diagrams.
TABLE 1: dsPIC33FJ06GS101 /X02 and dsPIC33FJ16GSX02/X04 CONTROLLER FAMILIES
Device
Pins
Program Flash Memory (Kbytes)
RAM (Bytes)
Remappable Peripherals
DAC Output
I2C™
ADC
I/O Pins
Packages
Remappable Pins
16-bit Timer
Input Capture
Output Compare
UART
SPI
PWM(2)
Analog Comparator
External Interrupts(3)
SARs
Sample and Hold (S&H) Circuit
Analog-to-Digital Inputs
dsPIC33FJ06GS101 18 6 256 8 2 0 1 1 1 2x2(1) 030113613SOIC
dsPIC33FJ06GS102 28 6 256 16 2 0 1 1 1 2x2 0 3 0 1 1 3 6 21 SPDIP
SOIC
QFN-S
dsPIC33FJ06GS202 28 6 1K 16 2 1 1 1 1 2x2 2 3 1 1 1 3 6 21 SPDIP
SOIC
QFN-S
dsPIC33FJ16GS402 28 16 2K 16 3 2 2 1 1 3x2 0 3 0 1 1 4 8 21 SPDIP
SOIC
QFN-S
dsPIC33FJ16GS404 44 16 2K 30 3 2 2 1 1 3x2 0 3 0 1 1 4 8 35 QFN
TQFP
VTLA
dsPIC33FJ16GS502 28 16 2K 16 3 2 2 1 1 4x2(1) 431126821SPDIP
SOIC
QFN-S
dsPIC33FJ16GS504 44 16 2K 30 3 2 2 1 1 4x2(1) 4 311261235QFN
TQFP
VTLA
Note 1: The PWM4H:PWM4L pins are remappable.
2: The PWM Fault pins and PWM synchronization pins are remappable.
3: Only two out of three interrupts are remappable.
© 2008-2012 Microchip Technology Inc. DS70318F-page 3
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Pin Diagrams
18-Pin SOIC
28-Pin SOIC, SPDIP
dsPIC33FJ06GS101
MCLR
AN0/RA0
AN1/RA1
VDD
VSS
AN2/RA2
TDO/RP5(1)/CN5/RB5
TMS/PGEC2/RP4(1)/CN4/RB4
TCK/PGED2/INT0/RP3(1)/CN3/RB3
VCAP
OSC2/CLKO/AN7/RP2(1)/CN2/RB2
OSC1/CLKI/AN6/RP1(1)/CN1/RB1 VSS
PGEC1/SDA1/RP7(1)/CN7/RB7
PGED1/TDI/SCL1/RP6(1)/CN6/RB6
AN3/RP0(1)/CN0/RB0
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
PWM1L/RA3
PWM1H/RA4
dsPIC33FJ06GS102
MCLR
PWM1L/RA3
PWM1H/RA4
PWM2L/RP14(1)/CN14/RB14
PWM2H/RP13(1)/CN13/RB13
RP12(1)/CN12/RB12
RP11(1)/CN11/RB11VSS
VDD
AN0/RA 0
AN1/RA 1
AVDD
AVSS
AN2/RA2
PGED3/RP8(1)/CN8/RB8 PGEC3/RP15(1)/CN15/RB15
TMS/PGEC2/RP4(1)/CN4/RB4
TCK/PGED2/INT0/RP3(1)/CN3/RB3
VCAP
OSC2/CLKO/RP2(1)/CN2/RB2
OSC1/CLKIN/RP1(1)/CN1/RB1 VSS
TDO/RP5(1)/CN5/RB5
PGEC1/SDA/RP7(1)/CN7/RB7
PGED1/TDI/SCL/RP6(1)/CN6/RB6
AN5/RP10(1)/CN10/RB10
AN4/RP9(1)/CN9/RB9
AN3/RP0(1)/CN0/RB0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Note 1: The RPn pins can be used by any remappable peripheral. See the TABLE 1: “dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 Controller Families” table for the list of available peripherals
28-Pin SPDIP, SOIC
dsPIC33FJ06GS202
MCLR
PWM1L/RA3
PWM1H/RA4
PWM2L/RP14(1)/CN14/RB14
PWM2H/RP13(1)/CN13/RB13
TCK/RP12(1)/CN12/RB12
TMS/RP11(1)/CN11/RB11VSS
VDD
AN0/CMP1A/RA0
AN1/CMP1B/RA1
AVDD
AVSS
AN2/CMP1C/CMP2A/RA2
PGED3/RP8(1)/CN8/RB8 PGEC3/RP15(1)/CN15/RB15
PGEC2/EXTREF/RP4(1)/CN4/RB4
PGED2/DACOUT/INT0/RP3(1)/CN3/RB3
VCAP
OSC2/CLKO/RP2(1)/CN2/RB2
OSC1/CLKIN/RP1(1)/CN1/RB1 VSS
TDO/RP5(1)/CN5/RB5
PGEC1/SDA/RP7(1)/CN7/RB7
PGED1/TDI/SCL/RP6(1)/CN6/RB6
AN5/CMP2D/RP10(1)/CN10/RB10
AN4/CMP2C/RP9(1)/CN9/RB9
AN3/CMP1D/CMP2B/RP0(1)/CN0/RB0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
= Pins are up to 5V tol e ran t
= Pins are up to 5V tol e ran t
= Pins are up to 5V tol e ran t
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 4 © 2008-2012 Microchip Technology Inc.
Pin Diagrams (Continued)
28-Pin SPDIP, SOIC
28-Pin SPDIP, SOIC
MCLR
PWM1L/RA3
PWM1H/RA4
PWM2L/RP14(1)/CN14/RB14
PWM2H/RP13(1)/CN13/RB13
TCK/PWM3L/RP12(1)/CN12/RB12
TMS/PWM3H/RP11(1)/CN11/RB11VSS
VDD
AN0/RA0
AN1/RA1
AVDD
AVSS
AN2/RA2
PGED3/RP8(1)/CN8/RB8 PGEC3/RP15/CN15/RB15
PGEC2/RP4(1)/CN4/RB4
PGED2/INT0/RP3(1)/CN3/RB3
VCAP
OSC2/CLKO/AN7/RP2(1)/CN2/RB2
OSC1/CLKIN/AN6/RP1(1)/CN1/RB1 VSS
TDO/RP5(1)/CN5/RB5
PGEC1/SDA/RP7(1)/CN7/RB7
PGED1/TDI/SCL/RP6(1)/CN6/RB6
AN5/RP10(1)/CN10/RB10
AN4/RP9(1)/CN9/RB9
AN3/RP0(1)/CN0/RB0
Note 1: The RPn pins can be used by any remappable peripheral. See the TABLE 1: “dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 Cont roller Families” tabl e for the list of available peripherals
dsPIC33FJ16GS502
MCLR
PWM1L/RA3
PWM1H/RA4
PWM2L/RP14(1)/CN14/RB14
PWM2H/RP13(1)/CN13/RB13
TCK/PWM3L/RP12(1)/CN12/RB12
TMS/PWM3H/RP11(1)/CN11/RB11VSS
VDD
AN0/CMP1A/RA0
AN1/CMP1B/RA1
AVDD
AVSS
AN2/CMP1C/CMP2A/RA2
CN8/RB8/PGED3/RP8(1)/CN8/RB8 PGEC3/RP15(1)/CN15/RB15
PGEC2/EXTREF/RP4(1)/CN4/RB4
PGED2/DACOUT/INT0/RP3(1)/CN3/RB3
VCAP
OSC2/CLKO/AN7/CMP3D/CMP4B/RP2(1)/CN2/RB2
OSC1/CLKIN/AN6/CMP3C/CMP4A/RP1(1)/CN1/RB1 VSS
TDO/RP5(1)/CN5/RB5
PGEC1/SDA/RP7(1)/CN7/RB7
PGED1/TDI/SCL/RP6(1)/CN6/RB6
AN5/CMP2D/CMP3B/RP10(1)/CN10/RB10
AN4/CMP2C/CMP3A/RP9(1)/CN9/RB9
AN3/CMP1D/CMP2B/RP0(1)/CN0/RB0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
= Pins are up to 5V tolerant
= Pins are up to 5V tolerant
dsPIC33FJ16GS402
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
© 2008-2012 Microchip Technology Inc. DS70318F-page 5
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Pin Diagrams (Continued)
28-Pin QFN-S(2)
1011
2
3
6
1
18
19
20
21
22
121314 15
8
716
17
232425262728
9
dsPIC33FJ06GS102
PGED2/INT0/RP3(1)/CN3/RB3
5
4
AVDD
AVSS
PWM1L/RA3
PWM1H/RA4
PWM2L/RP14(1)/CN14/RB14
PWM2H/RP13(1)/CN13/RB13
TCK/RP12(1)/CN12/RB12
TMS/RP11(1)/CN11/RB11
VSS
VCAP
PGEC1/SDA/RP7(1)/CN7/RB7
PGED1/TDI/SCL/RP6(1)/CN6/RB6
TDO/RP5(1)/CN5/RB5
PGEC3/RP15(1)/CN15/RB15
MCLR
AN0/RA0
AN1/RA1
AN2/RA2
AN3/RP0(1)/CN0/RB0
AN4/RP9(1)/CN9/RB9
AN5/RP10(1)/CN10/RB10
VSS
OSC1/CLKIN/RP1(1)/CN1/RB1
OSC2/CLKO/RP2(1)/CN2/RB2
PGEC2/RP4(1)/CN4/RB4
VDD
PGED3/RP8(1)/CN8/RB8
1011
2
3
6
1
18
19
20
21
22
121314 15
8
716
17
232425262728
9
dsPIC33FJ06GS202
PGED2/DACOUT/INT0/RP3(1)/CN3/RB3
5
4
AVDD
AVSS
PWM1L/RA3
PWM1H/RA4
PWM2L/RP14(1)/CN14/RB14
PWM2H/RP13(1)/CN13/RB13
TCK/RP12(1)/CN12/RB12
TMS/RP11(1)/CN11/RB11
VSS
VCAP
PGEC1/SDA/RP7(1)/CN7/RB7
PGED1/TDI/SCL/RP6(1)/CN6/RB6
TDO/RP5(1)/CN5/RB5
PGEC3/RP15(1)/CN15/RB15
MCLR
AN0/CMP1A/RA0
AN1/CMP1B/RA1
AN2/CMP1C/CMP2A/RA2
AN3/CMP1D/CMP2B/RP0(1)/CN0/RB0
AN4/CMP2C/RP9(1)/CN9/RB9
AN5/CMP2D/RP10(1)/CN10/RB10
VSS
OSC1/CLKIN/RP1(1)/CN1/RB1
OSC2/CLKO/RP2(1)/CN2/RB2
PGEC2/EXTREF/RP4(1)/CN4/RB4
VDD
PGED3/RP8(1)/CN8/RB8
Note 1: The RPn pins can be used by any remappable peripheral. See the TABLE 1: “dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 Controller Families” table for the list of available peripherals.
2: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V SS externally.
= Pins are up to 5V tolerant
= Pins are up to 5V tolerant
28-Pin QFN-S(2)
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 6 © 2008-2012 Microchip Technology Inc.
Pin Diagrams (Continued)
28-Pin QFN-S(2)
1011
2
3
6
1
18
19
20
21
22
121314 15
8
716
17
232425262728
9
dsPIC33FJ16GS402
PGED2/INT0/RP3(1)/CN3/RB3
5
4
AVDD
AVSS
PWM1L/RA3
PWM1H/RA4
PWM2L/RP14(1)/CN14/RB14
PWM2H/RP13(1)/CN13/RB13
TCK/PWM3L/RP12(1)/CN12/RB12
TMS/PWM3H/RP11(1)/CN11/RB11
VSS
VCAP
PGEC1/SDA/RP7(1)/CN7/RB7
PGED1/TDI/SCL/RP6(1)/CN6/RB6
TDO/RP5(1)/CN5/RB5
PGEC3/RP15(1)/CN15/RB15
MCLR
AN0/RA0
AN1/RA1
AN2/RA2
AN3/RP0(1)/CN0/RB0
AN4/RP9(1)/CN9/RB9
AN5/RP10(1)/CN10/RB10
VSS
OSC1/CLKIN/AN6/RP1(1)/CN1/RB1
OSC2/CLKO/AN7/RP2(1)/CN2/RB2
PGEC2/RP4(1)/CN4/RB4
VDD
PGED3/RP8(1)/CN8/RB8
1011
2
3
6
1
18
19
20
21
22
121314 15
8
716
17
232425262728
9
dsPIC33FJ16GS502
PGED2/DACOUT/INT0/RP3(1)/CN3/RB3
5
4
AVDD
AVSS
PWM1L/RA3
PWM1H/RA4
PWM2L/RP14(1)/CN14/RB14
PWM2H/RP13(1)/CN13/RB13
TCK/PWM3L/RP12(1)/CN12/RB12
TMS/PWM3H/RP11(1)/CN11/RB11
VSS
VCAP
PGEC1/SDA/RP7(1)/CN7/RB7
PGED1/TDI/SCL/RP6(1)/CN6/RB6
TDO/RP5(1)/CN5/RB5
PGEC3/RP15(1)/CN15/RB15
MCLR
AN0/CMP1A/RA0
AN1/CMP1B/RA1
AN2/CMP1C/CMP2A/RA2
AN3/CMP1D/CMP2B/RP0(1)/CN0/RB0
AN4/CMP2C/CMP3A/RP9(1)/CN9/RB9
AN5/CMP2D/CMP3B/RP10(1)/CN10/RB10
VSS
OSC1/CLKIN/AN6/CMP3C/CMP4A/RP1(1)/CN1/RB1
OSC2/CLKO/AN7/CMP3D/CMP4B/RP2(1)/CN2/RB2
PGEC2/EXTREF/RP4(1)/CN4/RB4
VDD
PGED3/RP8(1)/CN8/RB8
Note 1: The RPn pins can be used by any remappable peripheral. See the TABLE 1: “dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 Controller Families” table for the list of avai lable peripherals.
2: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
28-Pin QFN-S(2)
= Pins are up to 5V tolerant
= Pins are up to 5V tolerant
© 2008-2012 Microchip Technology Inc. DS70318F-page 7
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Pin Diagrams (Continued)
44-Pin VTLA(2)
AN4/RP9(1)/CN9/RB9
AN5/RP10(1)/CN10/RB10
OSC1/CLKI/AN6/RP1(1)/CN1/RB1
OSC2/CLKO/AN7/RP2(1)/CN2/RB2
RP17(1)/CN17/RC1
RP26(1)/CN26/RC10
VDD
RP25(1)/CN25/RC9
VSS
PGED1/TDI/SCL/RP6(1)/CN6/RB6
RP18(1)/CN18/RC2
PGEC3/RP15(1)/CN15/RB15
VDD
PGEC2/RP4(1)/CN4/RB4
RP24(1)/CN24/RC8
VSS
TDO/RP5(1)/CN5/RB5
PGED3/RP8(1)/CN8/RB8
RP23(1)/CN23/RC7
PGED2/INT0/RP3(1)/CN3/RB3
PWM2H/RP13(1)/CN13/RB13
TCK/PWM3L/RP12(1)/CN12/RB12
TMS/PWM3H/RP11(1)/CN11/RB11
VCAP
VSS
RP20(1)/CN20/RC4
RP19(1)/CN19/RC3
RP22(1)/CN22/RC6
RP21(1)/CN21/RC5
PGEC1/SDA/RP7(1)/CN7/RB7
PWM2L/RP14(1)/CN14/RB14
AN3/RP0(1)/CN0/RB0
AN2/RA2
AN1/RA1
AN0/RA0
MCLR
RP29(1)/CN29/RC13
AVDD
AVSS
PWM1L/RA3
PWM1H/RA4
RP16(1)/CN16/RC0
RP28(1)/CN28/RC12
RP27(1)/CN27/RC11
Note 1: The RPn pins can be used by any remappable peripheral. See the TABLE 1: “dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 Controller Families” table for the list of available peripherals.
2: The metal plane at th e bottom of the device is not connect ed to any pins and is recommended to be connected to VSS e xternally .
= Pins are up to 5V tolerant
1
12
41 40 39 38 37 36 35 34
2
3
4
5
6
7
8
30
29
28
27
26
25
24
23
13 14 15 16 17 18 19
9
10
11 2220 21
33
32
31
424344
dsPIC33FJ16GS404
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 8 © 2008-2012 Microchip Technology Inc.
Pin Diagrams (Continued)
44-Pin VTLA(2)
AN4/CMP2C/CMP3A/RP9(1)/CN9/RB9
AN5/CMP2D/CMP3B/RP10(1)/CN10/RB10
OSC1/CLKI/AN6/CMP3C/CMP4A/RP1(1)/CN1/RB1
OSC2/CLKO/AN7/CMP3D/CMP4B/RP2(1)/CN2/RB2
AN8/CMP4C/RP17(1)/CN17/RC1
AN10/RP26(1)/CN26/RC10
VDD
AN11/RP25(1)/CN25/RC9
VSS
PGED1/TDI/SCL/RP6(1)/CN6/RB6
AN9/EXTREF/CMP4D/RP18(1)/CN18/RC2
PGEC3/RP15(1)/CN15/RB15
VDD
PGEC2/RP4(1)/CN4/RB4
RP24(1)/CN24/RC8
VSS
TDO/RP5(1)/CN5/RB5
PGED3/RP8(1)/CN8/RB8
RP23(1)/CN23/RC7
PGED2/DACOUT/INT0/RP3(1)/CN3/RB3
PWM2H/RP13(1)/CN13/RB13
TCK/PWM3L/RP12(1)/CN12/RB12
TMS/PWM3H/RP11(1)/CN11/RB11
VCAP
VSS
RP20(1)/CN20/RC4
RP19(1)/CN19/RC3
RP22(1)/RN22/RC6
RP21(1)/CN21/RC5
PGEC1/SDA/RP7(1)/CN7/RB7
PWM2L/RP14(1)/CN14/RB14
AN3/CMP1D/CMP2B/RP0(1)/CN0/RB0
AN2/CMP1C/CMP2A/RA2
AN1/CMP1B/RA1
AN0/CMP1A/RA0
MCLR
RP29(1)/CN29/RC13
AVDD
AVSS
PWM1L/RA3
PWM1H/RA4
RP16(1)/CN16/RC0
RP28(1)/CN28/RC12
RP27(1)/CN27/RC11
Note 1: The RPn pins can be used by any remappable peripheral. See the TABLE 1: “dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 Controller Families” table for the list of available peripherals.
2: The metal plane at the bott om of the device is not connected to any pins and is recommende d to connect to VSS externally.
= Pins are up to 5V tolerant
1
12
41 40 39 38 37 36 35 34
2
3
4
5
6
7
8
30
29
28
27
26
25
24
23
13 14 15 16 17 18 19
9
10
11 22
20 21
33
32
31
424344
dsPIC33FJ16GS504
© 2008-2012 Microchip Technology Inc. DS70318F-page 9
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Pin Diagrams (Continued)
44-Pin QFN(2)
44
dsPIC33FJ16GS404
43 42 41 40 39 38 37 36 35
12 13 14 15 16 17 18 19 20 21
330
29
28
27
26
25
24
23
4
5
7
8
9
10
11
1
232
31
6
22
33
34
AN4/RP9(1)/CN9/RB9
AN5/RP10(1)/CN10/RB10
OSC1/CLKI/AN6/RP1(1)/CN1/RB1
OSC2/CLKO/AN7/RP2(1)/CN2/RB2
RP17(1)/CN17/RC1
RP26(1)/CN26/RC10
VDD
RP25(1)/CN25/RC9
VSS
PGED1/TDI/SCL/RP6(1)/CN6/RB6
RP18(1)/CN18/RC2
PGEC3/RP15(1)/CN15/RB15
VDD
PGEC2/RP4(1)/CN4/RB4
RP24(1)/CN24/RC8
VSS
TDO/RP5(1)/CN5/RB5
PGED3/RP8(1)/CN8/RB8
RP23(1)/CN23/RC7
PGED2/INT0/RP3(1)/CN3/RB3
PWM2H/RP13(1)/CN13/RB13
TCK/PWM3L/RP12(1)/CN12/RB12
TMS/PWM3H/RP11(1)/CN11/RB11
VCAP
VSS
RP20(1)/CN20/RC4
RP19(1)/CN19/RC3
RP22(1)/CN22/RC6
RP21(1)/CN21/RC5
PGEC1/SDA/RP7(1)/CN7/RB7
PWM2L/RP14(1)/CN14/RB14 AN3/RP0(1)/CN0/RB0
AN2/RA2
AN1/RA1
AN0/RA0
MCLR
RP29(1)/CN29/RC13
AVDD
AVSS
PWM1L/RA3
PWM1H/RA4
RP16(1)/CN16/RC0
RP28(1)/CN28/RC12
RP27(1)/CN27/RC11
Note 1: The RPn pins can be used by any remappable peripheral. See the TABLE 1: “dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 Controll er Families” table for the list of available peripherals.
2: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to
VSS externally.
= Pins are up to 5V tolerant
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 10 © 2008-2012 Microchip Technology Inc.
Pin Diagrams (Continued)
44-Pin QFN(2)
44
dsPIC33FJ16GS504
43 42 41 40 39 38 37 36 35
12 13 14 15 16 17 18 19 20 21
330
29
28
27
26
25
24
23
4
5
7
8
9
10
11
1
232
31
6
22
33
34
AN4/CMP2C/CMP3A/RP9(1)/CN9/RB9
AN5/CMP2D/CMP3B/RP10(1)/CN10/RB10
OSC1/CLKI/AN6/CMP3C/CMP4A/RP1(1)/CN1/RB1
OSC2/CLKO/AN7/CMP3D/CMP4B/RP2(1)/CN2/RB2
AN8/CMP4C/RP17(1)/CN17/RC1
AN10/RP26(1)/CN26/RC10
VDD
AN11/RP25(1)/CN25/RC9
VSS
PGED1/TDI/SCL/RP6(1)/CN6/RB6
AN9/EXTREF/CMP4D/RP18(1)/CN18/RC2
PGEC3/RP15(1)/CN15/RB15
VDD
PGEC2/RP4(1)/CN4/RB4
RP24(1)/CN24/RC8
VSS
TDO/RP5(1)/CN5/RB5
PGED3/RP8(1)/CN8/RB8
RP23(1)/CN23/RC7
PGED2/DACOUT/INT0/RP3(1)/CN3/RB3
PWM2H/RP13(1)/CN13/RB13
TCK/PWM3L/RP12(1)/CN12/RB12
TMS/PWM3H/RP11(1)/CN11/RB11
VCAP
VSS
RP20(1)/CN20/RC4
RP19(1)/CN19/RC3
RP22(1)/RN22/RC6
RP21(1)/CN21/RC5
PGEC1/SDA/RP7(1)/CN7/RB7
PWM2L/RP14(1)/CN14/RB14 AN3/CMP1D/CMP2B/RP0(1)/CN0/RB0
AN2/CMP1C/CMP2A/RA2
AN1/CMP1B/RA1
AN0/CMP1A/RA0
MCLR
RP29(1)/CN29/RC13
AVDD
AVSS
PWM1L/RA3
PWM1H/RA4
RP16(1)/CN16/RC0
RP28(1)/CN28/RC12
RP27(1)/CN27/RC11
Note 1: The RPn pins can be used by any remappable peripheral. See the TABLE 1: “dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 Cont roller Families” table for the list of available peripherals.
2: The metal plane at the bottom of the device is not connected to any pins and is recommended to connect to VSS
externally.
= Pins are up to 5V tolerant
© 2008-2012 Microchip Technology Inc. DS70318F-page 11
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Pin Diagrams (Continued)
44-Pin TQFP
10
11
2
3
4
5
6
1
18
19
20
21
22
12
13
14
15
38
8
7
44
43
42
41
40
39
16
17
29
30
31
32
33
23
24
25
26
27
28
36
34
35
9
37
PGED1/TDI/SCL/RP6(1)/CN6/RB6
RP18(1)/CN18/RC2
PGEC3/RP15(1)/CN15/RB15
VDD
PGEC2/RP4(1)/CN4/RB4
RP16(1)/CN16/RC0
VSS
TDO/RP5(1)/CN5/RB5
PGED3/RP8(1)/CN8/RB8
RP23(1)/CN23/RC7
AN3/RP0(1)/CN0/RB0
AN2/RA2
AN1/RA1
AN0/RA0
MCLR
RP29(1)/CN29/RC13
AVDD
AVSS
PWM1L/RA3
PWM1H/RA4
PWM2H/RP13(1)/CN13/RB13
TCK/PWM3L/RP12(1)/CN12/RB12
TMS/PWM3H/RP11(1)/CN11/RB11
VSS
VCAP
RP19(1)/CN19/RC3
RP22(1)/CN22/RC6
RP21(1)/CN21/RC5
PGEC1/SDA/RP7(1)/CN7/RB7
AN4/RP9(1)/CN9/RB9
AN5/RP10(1)/CN10/RB10
OSC1/CLKI/AN6/RP1(1)/CN1/RB1
OSC2/CLKO/AN7/RP2(1)/CN2/RB2
RP17(1)/CN17/RC1
RP20(1)/CN20/RC4
VDD
VSS
RP27(1)/CN27/RC11
RP28(1)/CN28/RC12
PGED2/INT0/RP3(1)/CN3/RB3
dsPIC33FJ16GS404
PWM2L/RP14(1)/CN14/RB14
RP24(1)/CN24/RC8
RP25(1)/CN25/RC9
RP26(1)/CN26/RC10
Note 1: The RPn pins can be used by any remappable peripheral. See the TABLE 1: “dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 Controller Families” table for the list of available peripherals
= Pins are up to 5V tolerant
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 12 © 2008-2012 Microchip Technology Inc.
Pin Diagrams (Continued)
44-Pin TQFP
10
11
2
3
4
5
6
1
18
19
20
21
22
12
13
14
15
38
8
7
44
43
42
41
40
39
16
17
29
30
31
32
33
23
24
25
26
27
28
36
34
35
9
37
PGED1/TDI/SCL/RP6(1)/CN6/RB6
AN9/EXTREF/CMP4D/RP18(1)/CN18/RC2
PGEC3/RP15(1)/CN15/RB15
VDD
PGEC2/RP4(1)/CN4/RB4
RP16(1)/CN16/RC0
VSS
TDO/RP5(1)/CN5/RB5
PGED3/RP8(1)/CN8/RB8
RP23(1)/CN23/RC7
AN3/CMP1D/CMP2B/RP0(1)/CN0/RB0
AN2/CMP1C/CMP2A/RA2
AN1/CMP1B/RA1
AN0/CMP1A/RA0
MCLR
RP29(1)/CN29/RC13
AVDD
AVSS
PWM1L/RA3
PWM1H/RA4
PWM2H/RP13(1)/CN13/RB13
TCK/PWM3L/RP12(1)/CN12/RB12
TMS/PWM3H/RP11(1)/CN11/RB11
VSS
VCAP
RP19(1)/CN19/RC3
RP22(1)/CN22/RC6
RP21(1)/CN21/RC5
PGEC1/SDA/RP7(1)/CN7/RB7
AN4/CMP2C/CMP3A/RP9(1)/CN9/RB9
AN5/CMP2D/CMP3B/RP10(1)/CN10/RB10
OSC1/CLKI/AN6/CMP3C/CMP4A/RP1(1)/CN1/RB1
OSC2/CLKO/AN7/CMP3D/CMP4B/RP2(1)/CN2/RB2
AN8/CMP4C/RP17(1)/CN17/RC1
RP20(1)/CN20/RC4
VDD
VSS
RP27(1)/CN27/RC11
RP28(1)/CN28/RC12
PGED2/DACOUT/INT0/RP3(1)/CN3/RB3
dsPIC33FJ16GS504
PWM2L/RP14(1)/CN14/RB14
RP24(1)/CN24/RC8
AN11/RP25(1)/CN25/RC9
AN10/RP26(1)/CN26/RC10
Note 1: The RPn pins can be used by any remappable peripheral. See the TABLE 1: “dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 Controll er Families” table for the li st of available peripherals
= Pins are up to 5V tolerant
© 2008-2012 Microchip Technology Inc. DS70318F-page 13
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Table of Contents
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 Product Families.......................................................................................... 2
1.0 Device Overview ........................................................................................................................................................................ 15
2.0 Guidelines for Getting Started with 16-bit Digital Signal Controllers.......................................................................................... 19
3.0 CPU............................................................................................................................................................................................ 29
4.0 Memory Organization................................................................................................................................................................. 41
5.0 Flash Program Memory.............................................................................................................................................................. 81
6.0 Resets ....................................................................................................................................................................................... 87
7.0 Interrupt Controller ................................................................. .................................................................................................... 95
8.0 Oscillator Configuration ......................................................................................................................................................... 133
9.0 Power-Saving Features............................................................................................................................................................ 145
10.0 I/O Ports................................................................................................................................................................................... 153
11.0 Timer1...................................................................................................................................................................................... 181
12.0 Timer2/3 features .................................................................................................................................................................... 183
13.0 Input Capture............................................................................................................................................................................ 189
14.0 Output Compare....................................................................................................................................................................... 191
15.0 High-Speed PWM......................... ..................... ..................... ..................... ............................................................................. 195
16.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 217
17.0 Inter-Integrated Circuit (I2C™) ................................................................................................................................................. 223
18.0 Universal Asynchronous Receiver Transmitter (UART)........................................................................................................... 231
19.0 High-Speed 10-bit Analog-to-Digital Converter (ADC)............................................................................................................. 237
20.0 High-Speed Analog Comparator.. ..................... ..................... ..................... ..................... ........................................................ 261
21.0 Special Features .......................... ............................................................................................................................................ 265
22.0 Instruction Set Summary.......................................................................................................................................................... 273
23.0 Development Support............................................................................................................................................................... 281
24.0 Electrical Characteristics.......................................................................................................................................................... 285
25.0 High Temperature Electrical Characteristics............................................................................................................................ 331
26.0 50 MIPS Electrical Characteristics........................................................................................................................................... 339
27.0 DC and AC Device Characteristics Graphs.............................................................................................................................. 347
28.0 Packaging Information.............................................................................................................................................................. 351
The Microchip Web Site..................................................................................................................................................................... 381
Customer Change Notification Service.............................................................................................................................................. 381
Customer Support.............................................................................................................................................................................. 381
Reader Response............................................................................ .................................................................................................. 382
Product Identification System ............................................................................................................................................................ 383
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
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The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 14 © 2008-2012 Microchip Technology Inc.
Referenced Sources
This device data sheet is based on the following
individual chapters of the “dsPIC33F/PIC24H Family
Reference Manual”. These documents should be
considered as the primary reference for the operation
of a particular module or device feature.
Section 1. “Introduction” (DS70197)
Section 2. “CPU” (DS70204)
Section 3. “Data Memory” (DS70202)
Section 4. “Program Memory” (DS70203)
Section 5. “Flash Programming” (DS70191)
Section 8. “Reset” (DS70192)
Section 9. “Watchdo g Timer and Power-Savin g Mod es (DS70196)
Section 10. “I/O Ports” (DS701 93)
Section 11. “Timers” (DS70205)
Section 12. “Input Capture” (DS70198)
Section 13. “Output Compare” (DS70209)
Section 16. “Analog-to-Digital Converter (ADC)”
Section 17. “UART” (DS70188)
Section 18. “Serial Peripheral Interface (SPI)” (DS70206)
Section 19. “Inter-Integrated Circuit™ (I2C™)” (DS70195)
Section 23. “CodeGuard™ Security (DS70199)
Section 24. “Programming and Diagnostics” (DS70207)
Section 25. “Device Configuration” (DS70194)
Section 41. “Interrupts (Part IV)” (DS70300)
Section 42. “Oscillator (Part IV)” (DS70307)
Section 43. “High- Speed PWM” (DS70323)
Section 44. “High-Speed 10-bit Analog-to-Digital Converter (ADC)” (DS70321)
Section 45. “High-Speed Analog Comparator” (DS70296)
Section 52. “Oscillator (Part VI)” (DS70644)
Note: To access the documents listed below,
browse to the documentation section of
the dsPIC33FJ16GS504 product page of
the Microchip web site
(www.microchip.com).
In addition to parameters, features, and
other documentation, the resulting page
provides links to the related family
reference manual sections.
© 2008-2012 Microchip Technology Inc. DS70318F-page 15
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
1.0 DEVICE OVERVIEW
This document contains device-specific information for
the following dsPIC33F Digital Signal Controller (DSC)
devices:
dsPIC33FJ06GS101
dsPIC33FJ06GS102
dsPIC33FJ06GS202
dsPIC33FJ16GS402
dsPIC33FJ16GS404
dsPIC33FJ16GS502
dsPIC33FJ16GS504
ds
PIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04
devices contain extensive Digital Signal Processor
(DSP) functionality with a high-performance, 16-bit
microcontroller (MCU) architecture.
Figure 1-1 shows a genera l block diagram of the core
and peripheral modules in the dsPIC33FJ06GS101/X02
and dsPIC33FJ16GSX02/X04 devices. Table 1-1 lists
the functions of the various pins shown in the pinout
diagrams.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a compre-
hensive reference source. To comple-
ment the information in this data sheet,
refer to the “dsPIC33F/PIC24H Family
Reference Manual”. Please see the
Microchip web site (www.microchip.com)
for the latest “dsPIC33F/PIC24H Family
Reference Manual” sections.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 16 © 2008-2012 Microchip Technology Inc.
FIGURE 1-1: dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 BLOCK DIAGRAM
16
OSC1/CLKI
OSC2/CLKO
VDD, VSS
Timing
Generation
MCLR
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Brown-out
Reset
FRC/LPRC
Oscillators
Regulator
Voltage
VCAP
IC1,2 I2C1
PORTA
Instruction
Decode &
Control
PCH PCL
16
Program Counter
16-bit ALU
23
23
24
23
Instruction Reg
PCU
16 x 16
W Register Array
ROM Latch
16
EA MUX
16
16
8
Interrupt
Controller
PSV & Table
Data Access
Control Block
Stack
Control
Logic
Loop
Control
Logic
Data Latch
Address
Latch
Address Latch
Program Memory
Data Latch
Literal Data
16 16
16
16
Data Latch
Address
Latch
16
X RAM Y RAM
16
Y Data Bus
X Data Bus
DSP Engine
Divide Support
16
Control Signals
to Various Blocks
ADC1
Timers
PORTB
Address Generator Unit s
1-3
CNx
UART1 PWM
4 x 2
Remappable
Pins
PORTC
SPI1
OC1
OC2
Analog
Comparators 1- 4
Note: Not all pins or features are implemented on all device pinout configurations. See pinout diagrams for the specific pins and features
present on each device.
© 2008-2012 Microchip Technology Inc. DS70318F-page 17
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 1-1: PINOUT I/O DESCRIPTIONS
Pin Name Pin
Type Buffer
Type PPS
Capable Description
AN0-AN11 I Analog No Analog input channels
CLKI
CLKO
I
O
ST/CMOS
No
No
External clock source input. Always associated with OSC1 pin
function.
Oscillator crystal output. Connect s to cryst al or resonator in Cryst al
Oscillator mode. Optionally functions as CLKO in RC and EC
modes. Always associated with OSC2 pin function.
OSC1
OSC2
I
I/O
ST/CMOS
No
No
Oscillator crystal input. ST buffer when configured in RC mode;
CMOS otherwise.
Oscillator crystal output. Connect s to cryst al or resonator in Cryst al
Oscillator mode. Optionally functions as CLKO in RC and EC
modes.
CN0-CN29 I ST No Change notification inputs. Can be software programmed for
internal weak pull-ups on all inputs.
IC1-IC2 I ST Yes Capture inputs 1/2
OCFA
OC1-OC2 I
OST
Yes
Yes C ompare Fault A input (for Compare Channels 1 and 2)
Compare Outputs 1 through 2
INT0
INT1
INT2
I
I
I
ST
ST
ST
No
Yes
Yes
External Interrupt 0
External Interrupt 1
External Interrupt 2
RA0-RA4 I/O ST No PORTA is a bidirectional I/O port
RB0-RB15 I/O ST No PORTB is a bidirectional I/O port
RC0-RC13 I/O ST No PORTC is a bidirectional I/O port
RP0-RP29 I/O ST No Remappable I/O pins
T1CK
T2CK
T3CK
I
I
I
ST
ST
ST
Yes
Yes
Yes
Timer1 external clock input
Timer2 external clock input
Timer3 external clock input
U1CTS
U1RTS
U1RX
U1TX
I
O
I
O
ST
ST
Yes
Yes
Yes
Yes
UART 1 clear to send
UAR T 1 rea dy to send
UAR T1 receive
UAR T 1 transmit
SCK1
SDI1
SDO1
SS1
I/O
I
O
I/O
ST
ST
ST
Yes
Yes
Yes
Yes
Synchronous serial clock input/output for SPI1
SPI1 data in
SPI1 data out
SPI1 slave synchronization or frame pulse I/O
SCL1
SDA1 I/O
I/O ST
ST No
No Synchronous serial clock input/output for I2C1
Synchronous serial data input/output for I2C1
TMS
TCK
TDI
TDO
I
I
I
O
TTL
TTL
TTL
No
No
No
No
JTAG Test mode select pin
JTAG test clock input pin
JTAG test data input pin
JTAG test data output pin
Legend: CMOS = CMOS compatible input or output Analog = Analog input I = Input
ST = Schmitt Trigger input with CMOS levels P = Power O = Output
TTL = Transistor-Transistor Logic PPS = Peripheral Pin Select
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 18 © 2008-2012 Microchip Technology Inc.
CMP1A
CMP1B
CMP1C
CMP1D
CMP2A
CMP2B
CMP2C
CMP2D
CMP3A
CMP3B
CMP3C
CMP3D
CMP4A
CMP4B
CMP4C
CMP4D
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
No
No
No
No
No
No
No
No
No
No
No
No
No
No
No
No
Comparator 1 Channel A
Comparator 1 Channel B
Comparator 1 Channel C
Comparator 1 Channel D
Comparator 2 Channel A
Comparator 2 Channel B
Comparator 2 Channel C
Comparator 2 Channel D
Comparator 3 Channel A
Comparator 3 Channel B
Comparator 3 Channel C
Comparator 3 Channel D
Comparator 4 Channel A
Comparator 4 Channel B
Comparator 4 Channel C
Comparator 4 Channel D
DACOUT O No DAC output voltage
ACMP1-ACMP4 O Yes DAC trigger to PWM module
EXTREF I Analo g No External voltage reference input for the reference DACs
REFCLKO O Yes REFCLKO output signal is a postscaled derivative of the system
clock
FLT1-FLT8
SYNCI1-SYNCI2
SYNCO1
PWM1L
PWM1H
PWM2L
PWM2H
PWM3L
PWM3H
PWM4L
PWM4H
I
I
O
O
O
O
O
O
O
O
O
ST
ST
Yes
Yes
Yes
No
No
No
No
No
No
Yes
Yes
Fault Inputs to PWM module
External synchronizati on signal to PWM Master Time Base
PWM master time base for external device synchronization
PWM1 low output
PWM1 high output
PWM2 low output
PWM2 high output
PWM3 low output
PWM3 high output
PWM4 low output
PWM4 high output
PGED1
PGEC1
PGED2
PGEC2
PGED3
PGEC3
I/O
I
I/O
I
I/O
I
ST
ST
ST
ST
ST
ST
No
No
No
No
No
No
Data I/O pin for programming/debugging communication Channel 1
Clock input pin for programming/debugging communication
Channel 1
Data I/O pin for programming/debugging communication Channel 2
Clock input pin for programming/debugging communication
Channel 2
Data I/O pin for programming/debugging communication Channel 3
Clock input pin for programming/debugging communication
Channel 3
MCLR I/P ST No Master Clear (Reset) input. This pin is an active-low Reset to the
device.
AVDD P P No Positive supply for analog modules. This pin must be connected at
all times. AVDD is connected to VDD.
AVSS P P No Ground reference for analog modules. AVSS is connected to VSS.
VDD P No Positive supply for peripheral logic and I/O pins.
VCAP P No CPU logic filter capacitor connection.
VSS P No Ground reference for logic and I/O pins.
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name Pin
Type Buffer
Type PPS
Capable Description
Legend: CMOS = CMOS compatible input or output Analog = Analog input I = Input
ST = Schmitt T rigger input with CMOS levels P = Power O = Output
TTL = T ransistor-Transistor Logic PPS = Peripheral Pin Select
© 2008-2012 Microchip Technology Inc. DS70318F-page 19
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
2.0 GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
2.1 Basic Connection Requirements
Getting started with the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 family of 16-bit Digital Signal
Controllers (DSC) requires attention to a minimal set of
device pin connections before proceeding with
development. The following is a list of pin names, which
must always be connected:
All VDD and VSS pins
(see Section 2.2 “Decoupling Capacitors”)
All AVDD and AVSS pins (regardless if ADC module
is not used)
(see Section 2.2 “Decoupling Capacitors”)
•V
CAP
(see Section 2.3 “Capacitor on Internal Volt ag e
Regulator (VCAP)”)
•MCLR
pin
(see Section 2.4 “Master Clear (MCLR) Pin”)
PGECx/PGEDx pins used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP™ Pins”)
OSC1 and OSC2 pins when external oscillator
source is used
(see Section 2.6 “External Oscillato r Pin s”)
2.2 Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD and
AVSS is required.
Consider the following criteria when using decoupling
capacitors:
Value and type of capacitor: Recommendation
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
Handling high freque nc y nois e : If the board is
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the dsPIC33F/PIC24H
Family Reference Manual, which is avail-
able from the Microchip website
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 20 © 2008-2012 Microchip Technology Inc.
FIGURE 2-1: RECOMMENDED
MINIMUM CONN ECTI ON
2.2.1 TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including DSCs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that con-
nects the power supply source to the device, and the
maximum current drawn by the device in the applica-
tion. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. T ypical
values range from 4.7 µF to 47 µF.
2.3 Capacitor on Internal Voltage
Regulator (VCAP)
A low-ESR (< 5 Ohms) capacitor is required on the
VCAP pin, which is used to stabilize the voltage
regulator output voltage. The VCAP pin must not be
connected to VDD, and must have a capacitor between
4.7 µF and 10 µF, 16 V connected to ground. The type
can be ceramic or tantalum. Refer to Section 24.0
“Electrical Characteristics” for additional
information.
The placement of this capacitor should be clos e to the
VCAP. It is recommended that the trace length not
exceed one-quarter inch (6 mm). Refer to Section 21.2
“On-Chip Voltage Regulator” for details.
2.4 Master Clear (MCLR) Pin
The MCLR pin provides two specific device
functions:
De v ice Reset
Device programming and debugging.
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (VIH and VIL) and fast signal
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application a nd PCB requirements.
For example, as shown in Figure 2-2, it is
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2: EXAMPLE OF MCLR PIN
CONNECTIONS
dsPIC33F
VDD
VSS
VDD
VSS
VSS
VDD
AVDD
AVSS
VDD
VSS
0.1 µF
Ceramic 0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
C
R
VDD
MCLR
0.1 µF
Ceramic
VCAP
L1(1)
R1
10 µF
Tantalum
Note 1: As an option, instead of a hard-wired connecti on, an
inductor (L1) can be substituted between VDD and
AVDD to improve ADC noise rejection. The inductor
impedance should be less than 1Ω and the indu ctor
capacity greater than 10 mA.
Where:
fFCNV
2
--------------
=
f1
2πLC()
-----------------------
=
L1
2πfC()
----------------------
⎝⎠
⎛⎞
2
=
(i.e., ADC conversion rate/2)
Note 1: R 10 kΩ is recommended. A suggested
starting value is 10 kΩ. Ensure that the
MCLR pin VIH and V IL specifications are met.
2: R1 470Ω will limit any current flowin g into
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
VIH and VIL specifications are met.
C
R1
R
VDD
MCLR
dsPIC33F
JP
© 2008-2012 Microchip Technology Inc. DS70318F-page 21
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
2.5 ICSP™ Pins
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging
purposes. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resisto rs, series diodes, and capacito rs on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger
communications to the device. If such discrete
components are an application requirement, they
should be removed from the circuit during program-
ming and debugging. Alternatively, refer to the AC/DC
characteristics and timing requirements information in
the respective device Flash programming specification
for information on capacitive loading limits and pin input
voltage high (VIH) and input low (VIL) requirements.
Ensure that the “Communication Channel Select”
(i.e., PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB® ICD 3 or MPLAB® REAL ICE™.
For more information on ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip website.
“Using MPLAB® ICD 3” (poster) DS51765
“MPLAB® ICD 3 Design Advisory” DS51764
“MPLAB® REAL ICE™ In-Circuit Debugger
User's Guide” DS51616
“Using MPLAB® REAL ICE™” (poster) DS51749
2.6 External Oscillator Pins
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 8.0 “Oscillator
Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces insid e the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in Figure 2-3.
FIGURE 2-3: SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
2.7 Oscillator Value Conditions on
Device Start-up
If the PLL of the target device is enabled and
configured for the device start-up oscillator, the
maximum oscillator source frequency must be limited
to 4 MHz < FIN < 8 MHz to comply with device PLL
start-up conditions. This means that if the external
oscillator frequency is outside this range, the
application must start up in the FRC mode first. The
default PLL settings after a POR with an oscillator
frequency outside this range will violate the device
operating speed.
Once the device powers up, the application firmware
can initialize the PLL SFRs, CLKDIV, and PLLDBF to a
suitable value, and then perform a clock switch to the
Oscillator + PLL clock source. Note that clock switching
must be enabled in the device Configuration word.
13
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
14
15
16
17
18
19
20
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 22 © 2008-2012 Microchip Technology Inc.
2.8 Configuration of Analog and
Digital Pins During ICSP
Operations
If MPLAB ICD 2, ICD 3 or REAL ICE is sel ected as a
debugger, it automatically initializes all of the A/D input
pins (ANx) as “digital” pins, by setting all bits in the
ADPCFG register.
The bits in the registers that correspond to the A/D pins
that are initialized by MPLAB ICD 2, ICD 3, or REAL
ICE, must not b e cleared by the user applica tion firm-
ware; otherwise, communication errors will result
between the debugger and the device.
If your application needs to use certain A/D pins as
analog input pins during the debug session, the user
application must clear the corresponding bits in the
ADPCFG register during initialization of the ADC mod-
ule.
When MPLAB ICD 2, ICD 3, or REAL ICE is used as a
programmer, the user application firmware must
correctly configure the ADPCFG register. Automatic
initialization of these registers is only done during
debugger operation. Failure to correctly configure the
register(s) will result in all A/D pins being recognized as
analog input pins, resulting in the port value being read
as a logic '0', which may affect user application func-
tionality.
2.9 Unused I/Os
Unused I/O pi ns should be configured as outputs and
driven to a logic-low state.
Alternatively, connect a 1k to 10k resistor between VSS
and unused pins and drive the output to logic low.
2.10 Typical Application Connection
Examples
Examples of typical application connections are shown
in Figure 2-4 through Figure 2-11.
© 2008-2012 Microchip Technology Inc. DS70318F-page 23
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 2-4: DIGITAL PFC
FIGURE 2-5: BOOST CONVERTER IMPLEMENTATION
VAC
IPFC
VHV_BUS
ADC Channel ADC Channel ADC Channel
PWM Output
|VAC|
k1
k2
k3
FET
dsPIC33FJ06GS101
Driver
IPFC
VOUTPUT
ADC Channel ADC ADC Channel
PWM
k1
k2
k3
FET
dsPIC33FJ06GS101
VINPUT
Channel Output
Driver
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 24 © 2008-2012 Microchip Technology Inc.
FIGURE 2-6: SINGLE-PHASE SYNCHRONOUS BUCK CONVERTER
FIGURE 2-7: MULTI-PHASE SYNCHRONOUS BUCK CONVERTER
k1
Analog
Comp.
k2
k7
PWM
PWM
ADC
Channel
ADC
Channel
5V Output
I5V
12V Input
FET
Driver
dsPIC33FJ06GS202
k5
k4
k3
k6
k7
Analog Comparator
Analog Comparator
ADC Channel
Analog Comparator
ADC
Channel
PWM
PWM
PWM
PWM
PWM
PWM
3.3V Output
12V Input
FET
Driver FET
Driver
FET
Driver
dsPIC33FJ06GS502
© 2008-2012 Microchip Technology Inc. DS70318F-page 25
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 2-8: OFF-LINE UPS
ADC
ADC
ADC
ADC
ADC
PWM PWMPWM
dsPIC33FJ16GS504
PWM PWM PWM
FET
Driver FET
Driver k2k1FET
Driver FET
Driver FET
Driver FET
Driver k4k5
VBAT
GND
+VOUT+
VOUT-
Full-Bridge Inverter
Push-Pull Converter VDC
GND
FET
Driver
ADC PWM
k3
k6
or
Analog Comp.
Battery Charger
+
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 26 © 2008-2012 Microchip Technology Inc.
FIGURE 2-9: INTERLEAVED PFC
VAC
VOUT+
ADC Channel PWM ADC
PWM
|VAC|
k4k3
FET
dsPIC33FJ06GS202
Driver
VOUT-
ADC Channel
FET
Driver
ADC
k1k2
Channel Channel
ADC
Channel
© 2008-2012 Microchip Technology Inc. DS70318F-page 27
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 2-10: PHASE-SHIFTED FULL-BRIDGE CONVERTER
VIN+
VIN-
S1
Gate 4
Gate 2
Gate 3
Gate 1
Analog
Ground
VOUT+
VOUT-
dsPIC33FJ06GS202
PWM
PWM ADC
Channel PWM ADC
Channel
k2
FET
Driver
k1
FET
Driver
FET
Driver
Gate 1
Gate 2
S1 Gate 3
Gate 4
S3
S3
Gate 6
Gate 5
Gate 6
Gate 5
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 28 © 2008-2012 Microchip Technology Inc.
FIGURE 2-11: AC-TO-DC POWER SUPPLY WITH PFC AND THREE OUTPUTS (12V, 5V, AND 3.3V)
k4
ADC
Channel
PWM
UART
RX
PWM
PWM
IZVT
VHV_BUS VOUT
Isolation
Barrier
ADC
Channel
PWM
PWM
PWM
FET
Driver FET
Driver FET
Driver
dsPIC33FJ16GS504 k6
Analog
Comp.
UART
TX k10
k7
k9
k8
k11
k5
PWM
PWM
ADC
Channel
Analog Comparator
Analog Comparator
ADC Channel
Analog Comparator
ADC
Channel
PWM
PWM
PWM
PWM
PWM
PWM
3.3V Output
5V Output
I5V
12V Input
FET
Driver FET
Driver
FET
Driver
FET
Driver
I3.3V_3
I3.3V_2
I3.3V_1
dsPIC33FJ16GS504
VAC
IPFC
VHV_BUS
|VAC|
k1
k2
k3
FET Driver
ADC
Ch. ADC
Ch. PWM
Output ADC
Ch.
PFC Stage
3.3V Multi-Phase Buck Stage
ZVT with Current Doubler Synchronous Rectifier
5V Buck Stage
Secondary Controller
Primary Controller
© 2008-2012 Microchip Technology Inc. DS70318F-page 29
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
3.0 CPU
The CPU module has a 16-bit (da ta) modified Harva rd
architecture with an enhanced instruction set, including
significant support for DSP. The CPU has a 24-bit
instruction word with a variable length opcode field.
The Program Counter (PC) is 23 bits wide and
addresses up to 4M x 24 bits of user program memory
space. The actual amount of program memory
implemented varies from device to device. A single-
cycle instruction prefetch mechanism is used to help
maintain throughput and provides predictable
execution. All instructions execute in a single cycle,
with the exception of instructions that change the
program flow, the double-word move (MOV.D)
instruction and the table instructions. Overhead-free
program loop constructs are supported using the DO
and REPEAT instructions, both of which are
interruptible at any point.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices have sixteen, 16-bit working registers in
the programmer’s model. Each of the working registers
can serve as a data, address or address offset register .
The sixteenth working register (W15) operates as a
software Stack Pointer (SP) for interrupts and calls.
There are two classes of instruction in the
ds
PIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04
devices: MCU and DSP. These two instruction
classes are seamlessly integrated into a single CPU.
The instruction set includes many addressing modes
and is designed for optimum C compiler efficiency.
For most instructions, the dsPIC33FJ06GS101/X02
and dsPIC33FJ16GSX02/X04 is capable of execut-
ing a data (or program data) memory read, a work-
ing register (data) read, a data memory write and a
program (instruction) memory read per instruction
cycle. As a result, three parameter instructions can
be supported, allowing A + B = C operations to be
executed in a single cycle.
A block diagram of the CPU is shown in Figure 3-1,
and the programmers model is shown in Figure 3-2.
3.1 Data Addressing Overview
The data space can be addressed as 32K words or
64 Kbytes a nd is split into two blocks, referred to as X
and Y data memory. Each memory block has its own
independent Address Generation Unit (AGU). The
MCU class of instructions operates solely through
the X memory AGU, which accesses the entire
memory map as one linear data space. Certain DSP
instructions operate through the X and Y AGUs to
support dual operand reads, which splits the data
address space into two parts. The X and Y data space
boundary is device-specific.
Overhead-free circular buffers (Modulo Addressing
mode) are supported in b oth X an d Y ad dress spaces.
The Modulo Addressing removes the software
boundary checking overhead for DSP algorithms.
Furthermore, the X AGU circular addressing can be
used with any of the MCU class of instructions. The X
AGU also supports Bit-Reversed Addressing to greatly
simplify input or o utput data reordering for ra dix-2 FF T
algorithms.
The upper 32 Kbytes of the data space memory map
can optionally be mapped into program space at any
16K program word boundary defined by the 8-bit
Program S p ace V isibility Page (PSVPAG) register . The
program-to-data space mapping feature allows any
instruction access program space as if it were data
space.
3.2 DSP Engine Overview
The DSP engine features a high-speed, 17-bit by 17-bit
multiplier, a 40-bit ALU, two 40-bit saturating
accumulators and a 40-bit bidirectional barrel shifter.
The barrel shifter is capable of shifting a 40-bit value up
to 16 bits, right or left, in a single cycle. The DSP
instructions operate seamlessly with all other
instructions and have been designed for optimal real-
time performance. The MAC instruction and other asso-
ciated instructions can concurrently fetch two data
operands from memory while multiplying two W
registers and accumulating and optionally saturating
the result in the same cycle. This instruction
functionality requires that the RAM data space be split
for these instructions and linear for all others. Data
space partitioning is achieved in a transparent and
flexible manner through dedicating certain working
registers to each address space.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 2. “CPU”
(DS70204) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 30 © 2008-2012 Microchip Technology Inc.
3.3 Special MCU Features
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices feature a 17-bit by
17-bit single-cycle multiplier that is shared by both the
MCU ALU and DSP engine. The multiplier can per-
form signed, unsigned and mixed sign multiplication.
Using a 17-bit by 17-bit multiplier for 16-bit by 16-bit
multiplication not only allows you to perform mixed sign
multiplication, it also achieves accurate results for
special operations, such as (-1.0) x (1.0).
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices support 16/16 and 32/16 divide operations,
both fractional and inte ger. All divide instructi ons are iter-
ative operations. They must be executed within a
REPEAT loop, resulting in a total execution time of 19
instruction cycles. The divide operation can be
interrupted during any of those 19 cycles without loss of
data.
A 40-bit barrel shifter is used to perform up to a 16-bit
left or right shift in a single cycle. The barrel shifter can
be used by both MCU and DSP instructions.
FIGURE 3-1: dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 CPU CORE
BLOCK DIAGRAM
Instruction
Decode &
Control
PCH PCL
Program Counter
16-bit ALU
24
23
Instruction Reg
PCU
16 x 16
W Register Array
ROM Latch
EA MUX
Interrupt
Controller
Stack
Control
Logic
Loop
Control
Logic
Data Latch
Address
Latch
Control Signals
to Various Blocks
Literal Data
16 16
16
To Peripheral Modules
Data Latch
Address
Latch
16
X RAM Y RAM
Address Generator Units
16
Y Data Bus
X Data Bus
DSP Engine
Divide Support
16
16
23
23
16
8
PSV & Table
Data Access
Control Block
16
16
16
16
Program Memory
Data Latch
Address Latch
© 2008-2012 Microchip Technology Inc. DS70318F-page 31
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 3-2: dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 PROGRAMMER’S MODEL
PC22 PC0
7 0
D0D15
Program Counter
Data Table Page Address
STATUS Register
Working Registers
DSP Operand
Registers
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12/DSP Offset
W13/DSP Write Back
W14/Frame Pointer
W15/Stack Pointer
DSP Address
Registers
AD39 AD0AD31
DSP
Accumulators ACCA
ACCB
7 0Program Space Visibility Page Address
Z
0
OA OB SA SB
RCOUNT
15 0REPEAT Loop Counter
DCOUNT
15 0DO Loop Counter
DOSTART
22 0 DO Loop Start Address
IPL2 IPL1
SPLIM Stack Pointer Limit Register
AD15
SRL
PUSH.S Shadow
DO Shadow
OAB SAB
15 0Core Configuration Register
Legend
CORCON
DA DC RA N
TBLPAG
PSVPAG
IPL0 OV
W0/WREG
SRH
DO Loop End Address
DOEND
22
C
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 32 © 2008-2012 Microchip Technology Inc.
3.4 CPU Control Registers
REGISTER 3-1: SR: CPU STATUS REGISTER
R-0 R-0 R/C-0 R/C-0 R-0 R/C-0 R -0 R/W-0
OA OB SA(1) SB(1) OAB SAB(1,4) DA DC
bit 15 bit 8
R/W-0(2) R/W-0(3) R/W-0(3) R-0 R/W-0 R/W-0 R/W-0 R/W-0
IPL<2:0>(2) RA N OV Z C
bit 7 bit 0
Legend:
C = Clearable bit R = Readable bit U = Unimplemented bit, read as ‘0’
S = Settable bit W = Writable bit -n = Value at POR
‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 OA: Accumulator A Overflow Status bit
1 = Accumulator A overflowed
0 = Accumulator A has not overflowed
bit 14 OB: Accumulator B Overflow Status bit
1 = Accumulator B overflowed
0 = Accumulator B has not overflowed
bit 13 SA: Accumulator A Saturation ‘Sticky’ Status bit(1)
1 = Accumulator A is saturated or has been saturated at some time
0 = Accumulator A is not saturated
bit 12 SB: Accumulator B Saturation ‘Sticky’ Status bit(1)
1 = Accumulator B is saturated or has been saturated at some time
0 = Accumulator B is not saturated
bit 11 OAB: OA || OB Combined Accumulator Over fl o w Status bit
1 = Accumulators A or B have overflowed
0 = Neither Accumulators A or B have overflowed
bit 10 SAB: SA || SB Combined Accumulato r ‘Sticky’ Stat us bi t (1,4)
1 = Accumulators A or B are saturated or have been saturated at some time in the past
0 = Neither Accumulator A or B are saturated
bit 9 DA: DO Loop Active bit
1 = DO loop in progress
0 = DO loop not in progress
bit 8 DC: MCU ALU Half Carry/Borrow bit
1 = A carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized data)
of the result occurred
0 = No carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for w ord-sized
data) of the result occurred
Note 1: This bit can be read or cleared (not set).
2: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level (IPL). The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
3: The IPL<2:0> Status bits are read-only when NSTDIS = 1 (INTCON1<15>).
4: Clearing this bit will clear SA and SB.
© 2008-2012 Microchip Technology Inc. DS70318F-page 33
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2)
111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled
110 = CPU Interrupt Priority Level is 6 (14)
101 = CPU Interrupt Priority Level is 5 (13)
100 = CPU Interrupt Priority Level is 4 (12)
011 = CPU Interrupt Priority Level is 3 (11)
010 = CPU Interrupt Priority Level is 2 (10)
001 = CPU Interrupt Priority Level is 1 (9)
000 = CPU Interrupt Priority Level is 0 (8)
bit 4 RA: REPEAT Loop Active bit
1 = REPEAT loop in progress
0 = REPEAT loop not in progress
bit 3 N: MCU ALU Negative bit
1 = Result was negative
0 = Result was non-negative (zero or positive)
bit 2 OV: MCU ALU Overflow bit
This bit is used for signed arithmetic (2’s complement). It indicates an overflow of a magnitude that
causes the sign bit to change state.
1 = Overflow occurred for signed arithmeti c (in this arithmetic operation)
0 = No overflow occurred
bit 1 Z: MCU ALU Zero bit
1 = An operation that affects the Z bit has set it at some time in the past
0 = The most recent operation that affects the Z bit has cleared it (i.e., a non-zero result)
bit 0 C: MCU ALU Carry/Borrow bit
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
REGISTER 3-1: SR: CPU STATUS REGISTER (CONTINUED)
Note 1: This bit can be read or cleared (not set).
2: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level (IPL). The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
3: The IPL<2:0> Status bits are read-only when NSTDIS = 1 (INTCON1<15>).
4: Clearing this bit will clear SA and SB.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 34 © 2008-2012 Microchip Technology Inc.
REGISTER 3-2: CORCON: CORE CONTROL REGISTER
U-0 U-0 U-0 R/W-0 R/W-0 R-0 R-0 R-0
—USEDT
(1) DL<2:0>
bit 15 bit 8
R/W-0 R/W-0 R/W-1 R/W-0 R/C-0 R/W-0 R/W-0 R/W-0
SATA SATB SATDW ACCSAT IPL3(2) PSV RND IF
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit -n = Value at POR ‘1’ = Bit is set
0’ = Bit is cleared ‘x = Bit is unknown U = Unimplemented bit, read as ‘0’
bit 15-13 Unimplemented: Read as ‘0
bit 12 US: DSP Multiply Unsigned/Signed Control bit
1 = DSP engine multiplies are unsigned
0 = DSP engine multiplies are signed
bit 11 EDT: Early DO Loop Termination Control bit(1)
1 = Terminate executing DO loop at end of current loop iteration
0 = No effect
bit 10-8 DL<2:0>: DO Loop Nesting Level Status bits
111 = 7 DO loops active
001 = 1 DO loop active
000 = 0 DO loops active
bit 7 SATA: ACCA Saturation Enable bit
1 = Accumulator A saturation enable d
0 = Accumulator A saturation disabled
bit 6 SATB: ACCB Saturation Enable bit
1 = Accumulator B saturation enable d
0 = Accumulator B saturation disabled
bit 5 SATDW: Data Space Write from DSP Engine Saturation Enable bit
1 = Data space write saturation enabled
0 = Data space write saturation disabled
bit 4 ACCSAT: Accumulator Saturation Mode Select bit
1 = 9.31 saturation (super saturation)
0 = 1.31 saturation (normal saturation)
bit 3 IPL3: CPU Interrupt Priority Level Status bit 3(2)
1 = CPU Interrupt Priority Level is greater than 7
0 = CPU Interrupt Priority Level is 7 or less
bit 2 PSV: Program Space Visibility in Data Space Enable bit
1 = Program space visible in data space
0 = Program space not visible in data space
bit 1 RND: Rounding Mode Select bit
1 = Biased (conventional) rounding enabled
0 = Unbiased (convergent) rounding enabled
bit 0 IF: Integer or Fractional Multiplier Mode Select bit
1 = Integer mode enabled for DSP multiply ops
0 = Fractional mode enabled for DSP multiply ops
Note 1: This bit will always read as ‘0’.
2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.
© 2008-2012 Microchip Technology Inc. DS70318F-page 35
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
3.5 Arithmetic Logic Unit (ALU)
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 ALU is 16 bits wide and is capable of addition,
subtraction, bit shifts and logic operations. Unless
otherwise mentioned, arithmetic operations are 2’s
complement in nature. Depending on the operation, the
ALU can affect the values of the Carry (C), Zero (Z),
Negati ve (N), Overflow (OV) and Digit Carry (D C) Status
bits in the SR reg ister. The C and DC Status bit s opera te
as Borrow and Digit Borrow bits, respectively, for
subtrac tion operatio ns.
The ALU can perform 8-bit or 16-bit operations,
depending on the mode of the instruction that is used.
Data for the ALU operation can come from the W
register array or data memory, depending on the
addressing mode of the instruction. Likewise, output
data from the ALU can be written to the W register array
or a data memory location.
Refer to the “16-bit MCU and DSC Programmer’s
Reference Manual” (DS70157) for information on the
SR bits affected by each instruction.
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 CPU incorporates hardware support for both multipli-
cation and division. This includes a dedicated hardware
multiplier and support hardware for 16-bit-divisor division.
3.5.1 MULTIPLIER
Using the high-speed, 17-bit x 17-bit multiplier of the
DSP engine, the ALU supports unsigned, signed or
mixed sign operation in several MCU multiplication
modes:
16-bit x 16-bit signed
16-bit x 16-bit unsigned
16-bit signed x 5-bit (literal) unsigned
16-bit unsigned x 16-bit unsigned
16-bit unsigned x 5-bit (literal) unsigned
16-bit unsigned x 16-bit signed
8-bit unsigned x 8-bit unsigned
3.5.2 DIVIDER
The divide block supports 32-bit/16-bit and 16-bit/16-bit
signed and unsigned integer divide operations with the
following data sizes:
32-bit signed/16-bit signed divide
32-bit unsigned/16-bit unsigned divide
16-bit signed/16-bit signed divide
16-bit unsigned/16-bit unsigned divide
The quotient for all divide instructions ends up in W0 and
the remainder in W1. 16-bit signed and unsigned DIV
instructions can specify any W register for both the 16-bit
divisor (Wn) and any W register (aligned) pair
(W(m + 1):Wm) for the 32-bit dividend. The divide
algorithm takes one cycle per bit of divisor , so both 32-bit/
16-bit and 16-bit/16-bit instructions take the same
number of cycles to execute.
3.6 DSP Engine
The DSP engine consists of a high-speed, 17-bit x
17-bit multiplier, a barrel shifter and a 40-bit adder/
subtracter (with two target accumulators, round and
saturation logic).
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 is a single-cycle instruction flow architecture; there-
fore, concurrent operation of the DSP engine with MCU
instruction flow is not possible. However , some MCU ALU
and DSP engine resources can be used concurrently by
the same instruction (for exampl e, ED, EDAC).
The DSP engine can also perform inherent
accumulator-to-accumulator operations that require no
additional data. These instructions are ADD, SUB and
NEG.
The DSP engine has options selected through bits in
the CPU Core Control register (CORCON), as listed
below:
Fractional or integer DSP multiply (IF)
Signed or unsigned DSP multiply (US)
Conventional or convergent rounding (RND)
Automatic saturation on/off for ACCA (SATA)
Automatic saturation on/off for ACCB (SATB)
Automatic saturation on/off for writes to data
memory (SATDW)
Accumulator Saturation mode selection (ACC-
SAT)
A block diagram of the DSP engine is shown in
Figure 3-3.
TABLE 3-1: DSP INSTRUCTIONS
SUMMARY
Instruction Algebraic
Operation ACC Write
Back
CLR A = 0 Yes
ED A = (x – y)2No
EDAC A = A + (x – y)2No
MAC A = A + (x * y) Yes
MAC A = A + x2No
MOVSAC No change in A Yes
MPY A = x * y No
MPY A = x 2No
MPY.N A = – x * y No
MSC A = A – x * y Yes
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 36 © 2008-2012 Microchip Technology Inc.
FIGURE 3-3: DSP ENGINE BLOCK DIAGRAM
Zero Backfill
Sign-Extend
Barrel
Shifter
40-bit Accumulator A
40-bit Accumulator B Round
Logic
X Data Bus
To/From W Array
Adder
Saturate
Negate
32
32
33
16
16 16
16
40 40
40 40
S
a
t
u
r
a
t
e
Y Data Bus
40
Carry/Borrow Out
Carry/Borrow In
16
40
Multiplier/Scaler
17-bit
© 2008-2012 Microchip Technology Inc. DS70318F-page 37
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
3.6.1 MULTIPLIER
The 17-bit x 17-bit multiplier is capable of signed or
unsigned operation and can multiplex its output using a
scaler to support either 1.31 fractional (Q31) or 32-bit
integer results. Unsigned operands are zero-extende d
into the 17th bit of the multiplier input value. Signed
operands are sign-extended into the 17th bit of the
multiplier input value . The output of the 17-bit x 17-bit
multiplier/scaler is a 33-b it value that is sign-extended
to 40 bits. Integer data is inherently represented as a
signed 2’s complement value, where the Most
Significant bit (MSb) is defined as a sign bit. The range
of an N-bit 2’s complement integer is -2N-1 to 2N-1 – 1.
For a 16-bit integer, the data range is -32768
(0x8000) to 32767 (0x7FFF) including 0.
For a 32-bit integer, the data range is
-2,147,483,648 (0x8000 0000) to 2,147,483,647
(0x7FFF FFFF).
When the multiplier is configured for fractional
multiplication, the data is represented as a 2’s
complement fraction, where the MSb is defined as a
sign bit and the radix point is implied to lie just after the
sign bit (QX format). The range of an N-bit 2’s
complement fraction with this implied radix point is -1.0
to (1 – 21-N). For a 16-bit fraction, the Q15 da ta range
is -1.0 (0x8000) to 0.999969482 (0x7FFF) including 0
and has a precision of 3.01518x10-5. In Fractional
mode, the 16 x 16 multiply operation generates a
1.31 product that has a precision of 4.65661 x 10-10.
The same multiplier is used to support the MCU
multiply instructions, which include integer 16-bit
signed, unsigned and mixed sign multipl y operations.
The MUL instruction can be directed to use byte or
word-sized operands. Byte operands will direct a 16-bit
result, and word operands will direct a 32-bit result to
the specified register(s) in the W array.
3.6.2 DATA ACCUMULATORS AND
ADDER/SUBTRACTER
The data accumulator consists of a 40-bit adder/
subtracter with automatic sign extension logic. It can
select one of two accumulators (A or B) as its pre-
accumulation source and post-accumulation
destination. For the ADD and LAC instructions, the data
to be accumulated or lo aded can be optionally scaled
using the barrel shifter prior to accumulation.
3.6.2.1 Adder/Subtracter, Overflow and
Saturation
The adder/subtracter is a 40-bi t a dder with an option al
zero input into one side, and either true or complement
data into the other input.
In the case of addition, the Carry/Borrow input is
active-high and the other input is true data (not
complemented).
In the case of subtraction, the Carry/Borrow input
is active-low and the other input is complemented.
The adder/subtracter generates Overflow Status bits,
SA/SB and OA/OB, which are latched and reflected in
the STATUS register:
Overflow from bit 39: this is a catastrophic
overflow in which the sign of the accumulator is
destroyed.
Overflow into guard bits, 32 through 39: this is a
recoverable overflow. This bit is set whenever all
the guard bits are not identical to each other.
The adder has an additional saturation block that
controls accumulator data saturation, if selected. It
uses the result of the adder, the Overflow Status bits
described previously and the SAT<A:B>
(CORCON<7:6>) and ACCSAT (CORCON<4>) mode
control bits to determine when and to what value to
saturate.
Six STATUS register bits support saturation and
overflow:
OA: ACCA overflowed into guard bits
OB: ACCB overflowed into guard bits
SA: ACCA saturated (bit 31 overflow and
saturation)
or
ACCA overflowed into guard bits and saturated
(bit 39 overflow and saturation)
SB: ACCB saturated (bit 31 overflow and
saturation)
or
ACCB overflowed into guard bits and saturated
(bit 39 overflow and saturation)
OAB: Logical OR of OA and OB
SAB: Logical OR of SA and SB
The OA and OB bits are modified each time data
passes through the adder/subtracter. When set, they
indicate that the most recent ope ration has overflowed
into the accumulator guard bits (bits 32 through 39).
The OA and OB bits can also optionally generate an
arithmetic warning trap when set and the correspond-
ing Overflow Trap Flag Enable bits (OV A TE, OVBTE) in
the INTCON1 register are set (refer to Section 7.0
“Interrupt Controller”). This allows the user applica-
tion to take immediate action, for example, to correct
system gain.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 38 © 2008-2012 Microchip Technology Inc.
The SA and SB bits are modified each time data
passes through the adder/subtracter, but can only be
cleared by the user application. When set, they indicate
that the accumulator has overflowed its maximum
range (bit 31 for 32-bit saturation or bit 39 for 40-bit
saturation) and will be saturated (if saturation is
enabled). When saturation is not enabled, SA and SB
default to bit 39 overflow and thus, indicate that a cata-
strophic overflow has occurred. If the COVTE bit in the
INTCON1 register is set, SA and SB bits will gen erate
an arithmetic warning trap when saturation is disabled.
The Overflow and Satura tion Status bits can opti onally
be viewed in the STATUS Register (SR) as the logical
OR of OA and OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). Programmers can check one bit in
the STATUS register to d etermine if ei ther accumula tor
has overflowed, or one bit to determine if either
accumulator has saturated. This is useful for complex
number arithmetic, which typically uses both
accumulators.
The device supports three Saturation and Overflow
modes:
Bit 39 Overflow and Saturation:
When bit 39 overflow and satura tion occu rs, the
saturation logic loads the maximally positive
9.31 (0x7FFFFFFFFF) or maximally negative
9.31 value (0x8000000000 ) into the t arget accumu-
lator. The SA or SB bit is set and remains set until
cleared by the user application. This conditio n is
referred to as ‘super saturation’ and provides
protection against erroneous data or unexpected
algorithm problems (such as gain calculations).
Bit 31 Overflow and Saturation:
When bit 31 overflow and saturati on occu rs, the
saturation logic then loads the maxi mally positive
1.31 value (0x007FFFF FFF) or maximally nega-
tive 1.31 value (0x0080000000) into the target
accumulator. The SA or SB bit is set and remains
set until cleared by the user application. When
this Saturation mode is in effect, the guard bits are
not used, so the OA, OB or OAB bits are never
set.
Bi t 39 Ca tastrophic Overflow :
The bit 39 Overflow Status bit from the adder is
used to set the SA or SB bit, which remains set
until cleared by the user application. No saturation
operation is performed, and the accumulator is
allowed to overflow, destroying its sign. If the
COVTE bit in the INTCON1 register is set, a
catastrophic overflow can initiate a trap exception.
3.6.3 ACCUMULATOR ‘WRITE BACK’
The MAC class of instructions (with the exception of
MPY, MPY.N, ED and EDAC) can optionally write a
rounded version of the high word (bits 31 through 16)
of the accumulator that is not targeted by the instruction
into data space memory. The write is performed across
the X bus into combined X and Y address space. The
following addressing modes are supported:
W13, Register Direct:
The rounded contents of the non-target
accumulator are written into W13 as a
1.15 fraction.
[W13] + = 2, Register Indirect with Post-Increment:
The rounded contents of the non-target
accumulator are written into the address pointed
to by W13 as a 1.15 fraction. W13 is then
incremented by 2 (for a word write).
3.6.3.1 Round Logic
The round logic is a combi nation al block that pe rforms
a conventional (biased) or convergent (unbiased)
round function during an accumulator write (store). The
Round mode is determined by the state of the RND bit
in the CORCON register. It generates a 16-bit,
1.15 da ta value that is passed to the data space write
saturation logic. If rounding is not indicated by the
instruction, a truncated 1.15 data value is stored and
the least significant word is si mply discarded.
Conventional rounding zero-extends bit 15 of the accu-
mulator and adds it to the ACCxH word (bits 16 through
31 of the accumulator).
If the ACCxL word (bits 0 through 15 of the
accumulator) is between 0x8000 and 0xFFFF
(0x8000 included), ACCxH is incremented .
If ACCxL is between 0x0000 and 0x7FFF, ACCxH
is left unchanged.
A consequence of this algorithm is that over a
succession of random rounding operations, the value
tends to be biased slightly positive.
Convergent (or unbiased) rounding operates in the
same manner as conventi onal rounding, except when
ACCxL equals 0x8000. In this case, the Least
Significant bit (bit 16 of the accumulator) of ACCxH is
examined:
If it is ‘1’, ACCxH is incremented.
If it is ‘0’, ACCxH is not modified.
Assuming that bit 16 is effectively random in nature,
this scheme removes any rounding bias that may
accumulate.
The SAC and SAC.R instructions store either a
truncated (SAC), or rounded (SAC.R) version of the
contents of the target accumulator to data memory via
the X bus, subject to data saturation (see
Section 3.6.3.2 “Data Space Write Saturation”). For
the MAC class of instructions, the accumulator write-
back operation functions in the same manner,
addressing combined MCU (X and Y) data space
though the X bus. For this class of instructions, the data
is always subject to rounding.
© 2008-2012 Microchip Technology Inc. DS70318F-page 39
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
3.6.3.2 Data Space Write Saturation
In addition to adder/subtracter saturation, writes to data
space can also be saturated, but without affecting the
contents of the source accumulator. The data space
write saturation logic block accepts a 16-bit, 1.15
fractional value from the round lo gic block as its input,
together with overflow status from the original source
(accumulator) and the 16-bit round adder . These inputs
are combined and used to select the appropriate
1.15 fractional value as output to write to data space
memory.
If the SAT DW bit in the CORCON register is set, data
(after rounding or truncation) is tested for overflow and
adjusted accordingly:
For input data greater than 0x007FFF, data
written to memory is forced to the maximum
positive 1.15 value, 0x7FFF.
For input data less than 0xFF8000, data written to
memory is forced to the maximum negative
1.15 value, 0x8000.
The Most Significant bit of the source (bit 39) is used to
determine the sign of the operand being tested.
If the SATDW bit in the CORCON register is not set, the
input data is always passed through unmodified under
all conditions.
3.6.4 BARREL SHIFTER
The barrel shifter can perform up to 16-bit arithmetic or
logic right shifts, or up to 16-bit left shifts in a single
cycle. The source can be either of the two DSP
accumulators or the X bus (to support multi-bit shifts of
register or memory data).
The shifter requires a signed binary value to determine
both the magnitude (number of bits) and direction of the
shift operation. A positive value shifts the operand right.
A negative value shifts the operand left. A value o f ‘0
does not modify the operand.
The barrel shifter is 40 bits wide, thereby obtaining a
40-bit result for DSP shift operations and a 16-bit result
for MCU shift operations. Data from the X bus is
presented to the barrel shifter between bit positions 16
and 31 for right sh ifts, and between bit p osition s 0 and
16 for left shifts.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 40 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 41
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
4.0 MEMORY ORGANIZATION
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 architecture features separate program and data
memory spaces and buses. This archi tecture also allows
the direct access to program memory from the data
space during cod e execution.
4.1 Program Address Space
The program address memory space of the
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices is 4M instructions. The space is
addressable by a 24-bit value derived either from the
23-bit Program Counter (PC) during program exe cution,
or from table operation or data space remapping as
described in Section 4.6 “Interfacing Program and
Data Memory Spaces”.
User application access to the program memory space
is restricted to the lower half of the address range
(0x000000 to 0x7FFFFF). T he exception is the use of
TBLRD/TBLWT operations, which use TBLPAG<7> to
permit access to the Configuration bits and Device ID
sections of the configuration memory space.
The memory maps for the dsPIC33FJ06GS101/X02
and dsPIC33FJ16GSX02/X04 devices are shown in
Figure 4-1.
FIGURE 4-1: PROGRAM MEMORY MAPS FOR dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 DEVICES
Note: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 4. “Program
Memory” (DS70202) in the dsPIC33F/
PIC24H Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com).
Reset Address 0x000000
0x0000FE
0x000002
0x000100
Device Configuration
User Program
Flash Memory
0x001000
0x000FFE
(1792 instructions)
0x800000
0xF80000
Registers 0xF80017
0xF80018
DEVID (2) 0xFEFFFE
0xFF0000
0xFFFFFE
0xF7FFFE
Unimplemented
(Read ‘0’s)
GOTO Instruction
0x000004
Reserved
0x7FFFFE
Reserved
0x000200
0x0001FE
0x000104
Alternate Vector Table
Reserved
Interrupt Vector Table
dsPIC33FJ06GS101/102/202
Configuration Memory Space User Memory Space
Reset Address 0x000000
0x0000FE
0x000002
0x000100
Device Configuration
User Program
Flash Memory
0x002C00
0x002BFE
(5376 instructions)
0x800000
0xF80000
Registers 0xF80017
0xF80018
0xF7FFFE
Unimplemented
(Read ‘0’s)
GOTO Instruction
0x000004
Reserved
0x7FFFFE
Reserved
0x000200
0x0001FE
0x000104
Alternate Vector Table
Reserved
Interrupt Vector Table
dsPIC33FJ16GS402/404/502/504
Configuration Memory Space User Memory Space
Reserved 0xFF0002 DEVID (2)
Reserved
0xFEFFFE
0xFF0000
0xFFFFFE
0xFF0002
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 42 © 2008-2012 Microchip Technology Inc.
4.1.1 PROGRAM MEMORY
ORGANIZATION
The program memory space is organized in word-
addressable blocks. Although it is treated as 24 bits
wide, it is more appropriate consider each address of
the program memory as a lower and upper word, with
the upper byte of the upper word being unimplemented.
The lower word always has an even address, while the
upper word has an odd address (see Figure 4-2).
Program memory addresses are always word-aligned
on the lower word, an d addresses are incremented or
decremented by two during the code execution. This
arrangement provides compatibility with data memory
space addressing and makes data in the program
memory space accessible.
4.1.2 INTERRUPT AND TR AP VECTORS
All dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices reserve the addresses between 0x00000
and 0x000200 for hard-coded program execution vectors.
A hardware Reset vector is provided to redirect code exe-
cution from the default value of the PC on device Reset to
the actual start of code. A GOTO instruction is
programmed by the user application at 0x000000, with
the actual address for the start of code at 0x000002.
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices also have two interrupt vector tables, located
from 0x000004 to 0x0000FF and 0x000100 to 0x0001FF.
These vector tables allow each of the device interrupt
sources to be handled by separate Interrupt Service
Routines (ISRs). A more detailed discussion of the
interrupt vector tables is provided in Section 7.1
“Interrupt Vector Table”.
FIGURE 4-2: PROGRAM MEMORY ORGANIZATION
0816
PC Address
0x000000
0x000002
0x000004
0x000006
23
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(read as ‘0’)
least significant word
most significant word
Instruction Width
0x000001
0x000003
0x000005
0x000007
msw
Address (lsw Address)
© 2008-2012 Microchip Technology Inc. DS70318F-page 43
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
4.2 Dat a Add re ss Space
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 CPU has a separate, 16-bit-
wide data memory space. The data space is accessed
using separate Address Generation Units (AGUs) for
read and write operations. The data memory maps is
shown in Figure 4-3.
All Effective Addresses (EAs) in the data memory space
are 16 bit s wide and point to bytes within the d ata space.
This arrangement gives a data space address range of
64 Kbytes or 32K words. The lower half of the data
memory space (that is, when EA<15> = 0) is used for
implemented memory addresses, while the upper half
(EA<15> = 1) is reserved for the Program Space
Visibility area (see Section 4.6.3 “Reading Data from
Program Memory Using Program Space Visibility”).
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices implement up to 2 Kbytes of data memory .
Should an EA point to a location outside of this area, an
all-zero word or byte will be returned.
4.2.1 DATA SPACE WIDTH
The data memory space is organized in byte
addressable, 16-bit wide blocks. Data is aligned in data
memory and registers as 16-bit words, but all data
space EAs resolve to bytes. The Least Significant
Bytes (LSBs) of each word have even addresses, while
the Most Significant Bytes (MSBs) have odd
addresses.
4.2.2 DATA MEMORY ORGANIZATION
AND ALIGNMENT
To maintain backward compatibility with PIC® MCU
devices and improve data space memory usage
efficiency, the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 instruction set supports both
word and byte operations. As a consequence of byte
accessibility, all effective address calculations are
internally scaled to step through word-aligned memory .
For example, the core recognizes that Post-Modified
Register Indirect Addressing mode [Ws++] that results
in a value of Ws + 1 for byte operations and Ws + 2 for
word operations.
Data byte reads will read the complete word that
contains the byte, using the LSB of any EA to
determine which byte to select. The selected byte is
placed onto the LSB of the data path. That is, data
memory and registers are organized as two parallel
byte-wide entities with shared (word) address decode
but separate write lines. Data byte writes only write to
the corresponding side of the array or register that
matches the byte a dd re ss.
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported, so
care must be taken when mixing byte and word
operations, or translating from 8-bit MCU code. If a
misaligned read or write is attempted, an address error
trap is generated. If the error occurred on a read, the
instruction underway is completed. If the error occurred
on a write, the instruction is executed but the write does
not occur. In either case, a trap is then executed,
allowing the system and/or user application to examine
the machine state prior to execution of the address
Fault.
All byte loads into any W register are loaded into the
Least Significant Byte. The Most Significant Byte is not
modified.
A sign-extend instruction (SE) is provided to allow user
applications to translate 8-bit signed data to 16-bit
signed values. Alternatively, for 16-bit unsigned data,
user applications can clear the MSB of any W register
by executing a zero-extend (ZE) instruction on the
appropriate address.
4.2.3 SFR SPACE
The first 2 Kbytes of the near data space, from 0x0000
to 0x07FF, is primarily occupied by Special Function
Registers (SFRs). These are used by the
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 core and peripheral modules for controlling the
operation of the device.
SFRs are distributed among the modules that they
control, and are generally grouped together by module.
Much of the SFR space contains unused addresses;
these are read as ‘0’.
4.2.4 NEAR DATA SPACE
The 8-Kbyte area between 0x0000 and 0x1FFF is
referred to as the near data space. Locations in this
space are directly addressable via a 13-bit absolute
address field within all memory direct instructions.
Additionally , the whole data space is addressable using
MOV instructions, which support Memory Direct
Addressing mode with a 16-bit address field, or by
using Indirect Addressing mode using a working
register as an Address Pointer.
Note: The actual set of peripheral features and
interrupts varies by the device. Refer to
the corresponding device tables and
pinout diagrams for device-specific
information.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 44 © 2008-2012 Microchip Technology Inc.
FIGURE 4-3: DATA MEMORY MAP FOR dsPIC33FJ06GS101/102 DEVICES WITH 256 BYTES
OF RAM
0x0000
0x07FE
0x08FE
0xFFFE
LSB
Address
16 bits
LSbMSb
MSB
Address
0x0001
0x07FF
0xFFFF
Optionally
Mapped
into Program
Memory
0x0801 0x0800
0x0900
2-Kbyte
SFR Space
256 bytes
SRAM Space
0x8001 0x8000
SFR Space
X Data
Unimplemented (X)
0x087E
0x0880
0x087F
0x0881
0x08FF
0x0901
0x1FFF 0x1FFE
0x2001 0x2000
8-Kbyte
Near Data
Space
X Data RA M (X)
Y Data RAM (Y)
© 2008-2012 Microchip Technology Inc. DS70318F-page 45
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 4-4: DATA MEMORY MAP FOR dsPIC33FJ06G S2 02 DEVICE WITH 1 KB RAM
0x0000
0x07FE
0x0BFE
0xFFFE
LSB
Address
16 bits
LSbMSb
MSB
Address
0x0001
0x07FF
0xFFFF
Optionally
Mapped
into Program
Memory
0x0801 0x0800
0x0C00
2-Kbyte
SFR Space
1-Kbyte
SRAM Space
0x8001 0x8000
SFR Space
X Data
Unimplemented (X)
0x09FE
0x0A00
0x09FF
0x0A01
0x0BFF
0x0C01
0x1FFF 0x1FFE
0x2001 0x2000
8-Kbyte
Near Data
Space
X Data RA M (X)
Y Data RAM (Y)
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 46 © 2008-2012 Microchip Technology Inc.
FIGURE 4-5: DATA MEMORY MAP FOR dsPIC33FJ16GS402/404/502/504 DEVICES WITH
2 KB RAM
0x0000
0x07FE
0x0FFE
0xFFFE
LSB
Address
16 bits
LSbMSb
MSB
Address
0x0001
0x07FF
0xFFFF
Optionally
Mapped
into Program
Memory
0x0801 0x0800
0x1000
2-Kbyte
SFR Space
2-Kbyte
SRAM Space
0x8001 0x8000
SFR Space
X Data
Unimplemented (X)
0x0BFE
0x0C00
0x0BFF
0x0C01
0x0FFF
0x1001
0x1FFF 0x1FFE
0x2001 0x2000
8-Kbyte
Near Data
Space
X Data RA M (X)
Y Data RAM (Y)
© 2008-2012 Microchip Technology Inc. DS70318F-page 47
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
4.2.5 X AND Y DATA SPACES
The core has two data spaces, X and Y. These data
spaces can be considered either separate (for some
DSP instructions), or as one unified linear address
range (for MCU instructions). The data spaces are
accessed using two Address Generation Units (AGUs)
and separate data paths. This feature allows certain
instructions to concurrently fetch two words from RAM,
thereby enabling efficient execution of DSP algorithms,
such as Finite Impulse Response (FIR) filtering and
Fast Fourier Tr ansform (FFT).
The X data space is used by all instructions and
supports all addressing modes. X data space has
separate read and write data buses. The X read data
bus is the read data path for all instructions that view
data space as combined X and Y address space. It is
also the X data prefetch path for the dual operand DSP
instructions (MAC class).
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED,
EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to
provide two concurrent data read paths.
Both the X and Y data spaces support Modulo
Addressing mode for all instructions, subject to
addressing mode restrictions. Bit-Reversed Addressing
mode is only supported for writes to X data sp ace.
All data memory writes, including in DSP instructions,
view data space as combined X and Y address space.
The boundary between the X and Y data spaces is
device-dependent and is not user-programmable.
All effective addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes , or 32K words, though the
implemented memory locations vary by device.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 48 © 2008-2012 Microchip Technology Inc.
TABLE 4-1: CPU CORE REGISTER MAP
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
WREG0 0000 Workin g Registe r 0 0000
WREG1 0002 Workin g Registe r 1 0000
WREG2 0004 Workin g Registe r 2 0000
WREG3 0006 Workin g Registe r 3 0000
WREG4 0008 Workin g Registe r 4 0000
WREG5 000A Workin g Registe r 5 0000
WREG6 000C W ork ing Regi ster 6 0000
WREG7 000E Workin g Registe r 7 0000
WREG8 0010 Workin g Registe r 8 0000
WREG9 0012 Workin g Registe r 9 0000
WREG10 0014 Working Register 10 0000
WREG11 0016 Working Regi ster 11 0000
WREG12 0018 Working Register 12 0000
WREG13 001A Working Register 13 0000
WREG14 001C W orking Register 14 0000
WREG15 001E Working Register 15 0800
SPLIM 0020 S t ack Poin ter Li mit Registe r xxxx
ACCAL 0022 ACCAL xxxx
ACCAH 0024 ACCAH xxxx
ACCAU 0026 ACCA<39> ACCA<39> ACCA<39> ACCA<39> ACCA<39> ACCA<39> ACCA<39> ACCA<39> ACCAU xxxx
ACCBL 0028 ACCBL xxxx
ACCBH 002A ACCBH xxxx
ACCBU 002C ACCB<39> ACCB<39> ACCB<39> ACCB<39> ACCB<39> ACCB<39> ACCB<39> ACCB<39> ACCBU xxxx
PCL 002E Program Counter Low Word Register 0000
PCH 0030 Program Counter High Byte Register 0000
TBLPAG 0032 Table Page Addr ess Po int er Regi ster 0000
PSVPAG 0034 Program Memory Visibility Page Address Pointer Register 0000
RCOUNT 0036 Repeat Loop Counter Register xxxx
DCOUNT 0038 DCOUNT<15:0> xxxx
DOSTARTL 003A DOSTARTL<15:1> 0 xxxx
DOSTARTH 003C DOSTARTH<5:0> 00xx
DOENDL 003E DOENDL<15:1> 0 xxxx
DOENDH 0040 DOENDH 00xx
SR 0042 OA OB SA SB OAB SAB DA DC IPL<2:0> RA N OV Z C 0000
CORCON 0044 US EDT DL<2:0> SATA SATB SATDW ACCSAT IPL3 PSV RND IF 0020
MODCON 0046 XMODEN YMODEN BWM<3:0> YWM<3:0> XWM<3:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 49
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 4-2: CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ06GS101
TABLE 4-3: CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ06GS102, dsPIC33FJ06GS202, dsPIC33FJ16GS402 AND
dsPIC33FJ16GS502
TABLE 4-4: CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ16GS404 AND dsPIC33FJ16GS504
XMODSRT 0048 XS<15:1> 0 xxxx
XMODEND 004A XE<15:1> 1 xxxx
YMODSRT 004C YS<15:1> 0 xxxx
YMODEND 004E YE<15:1> 1 xxxx
XBREV 0050 BREN XB<14:0> xxxx
DISICNT 0052 Disable Interrupts Counter Register xxxx
TABLE 4-1: CPU CORE REGISTER MAP (CONTINUED)
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
File Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
CNEN1 0060 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000
CNPU1 0068 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
File
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000
CNPU1 0068 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
File
Name SFR
Addr Bit 15Bit 14Bit 13Bit 12Bit 11Bit 10Bit 9Bit 8Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0All
Resets
CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000
CNEN2 0062 CN29IE CN28IE CN27IE CN26IE CN25IE CN24IE CN23IE CN22IE CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000
CNPU1 0068 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000
CNPU2 006A CN29PUE CN28PUE CN27PUE CN26PUE CN25PUE CN24PUE CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 50 © 2008-2012 Microchip Technology Inc.
TABLE 4-5: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC33FJ06GS101 DEVICES ONLY
File
Name SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
INTCON1 0080 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE SFTACERR DIV0ERR MATHERR ADDRERR STKERR OSCFAIL 0000
INTCON2 0082 ALTIVT DISI INT2EP INT1EP INT0EP 0000
IFS0 0084 ADIF U1TXIF U1RXIF SPI1IF SPI1EIF —T2IF —T1IFOC1IF—INT0IF
0000
IFS1 0086 —INT2IF INT1IF CNIF MI2C1IF SI2C1IF 0000
IFS3 008A PSEMIF 0000
IFS4 008C —U1EIF0000
IFS5 008E —PWM1IF 0000
IFS6 0090 ADCP1IF ADCP0IF —PWM4IF0000
IFS7 0092 ADCP3IF 0000
IEC0 0094 ADIE U1TXIE U1RXIE SPI1IE SPI1EIE —T2IE —T1IEOC1IE—INT0IE
0000
IEC1 0096 —INT2IE INT1IE CNIE MI2C1IE SI2C1IE 0000
IEC2 0098 0000
IEC3 009A —PSEMIE 0000
IEC4 009C —U1EIE0000
IEC5 009E —PWM1IE 0000
IEC6 00A0 ADCP1IE ADCP0IE —PWM4IE0000
IEC7 00A2 ADCP3IE 0000
IPC0 00A4 T1IP<2:0> OC1IP<2:0> INT0IP<2:0> 4404
IPC1 00A6 T2IP<2:0> 4000
IPC2 00A8 U1RXIP<2:0> SPI1IP<2:0> SPI1EIP<2:0> 4440
IPC3 00AA -— ADIP<2:0> U1TXIP<2:0> 0044
IPC4 00AC —CNIP<2:0> MI2C1IP<2:0> SI2C1IP<2:0> 4044
IPC5 00AE INT1IP<2:0> 0004
IPC7 00B2 INT2IP<2:0> 0040
IPC14 00C0 PSEMIP<2:0> 0040
IPC16 00C4 U1EIP<2:0> 0400
IPC23 00D2 PWM1IP<2:0> 0040
IPC24 00D4 PWM4IP<2:0> 4400
IPC27 00DA ADCP1IP<2:0> ADCP0IP<2:0> 0040
IPC28 00DC ADCP3IP<2:0> 0000
INTTREG 00E0 —ILR<3:0> VECNUM<6:0> 0000
Legend: x = unkn own va lue on Re set, — = unim pleme nted , read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 51
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 4-6: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC33FJ06GS102 DEVICES ONLY
File
Name SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
INTCON1 0080 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE SFTACERR DIV0ERR MATHERR ADDRERR STKERR OSCFAIL 0000
INTCON2 0082 ALTIVT DISI INT2EP INT1EP INT0EP 0000
IFS0 0084 ADIF U1TXIF U1RXIF SPI1IF SPI1EIF —T2IF —T1IFOC1IF—INT0IF
0000
IFS1 0086 —INT2IF —INT1IFCNIF MI2C1IF SI2C1IF 0000
IFS3 008A —PSEMIF 0000
IFS4 008C —U1EIF0000
IFS5 008E PWM2IF PWM1IF 0000
IFS6 0090 ADCP1IF ADCP0IF 0000
IFS7 0092 ADCP2IF 0000
IEC0 0094 ADIE U1TXIE U1RXIE SPI1IE SPI1EIE —T2IE —T1IEOC1IE—INT0IE
0000
IEC1 0096 —INT2IE INT1IE CNIE MI2C1IE SI2C1IE 0000
IEC3 009A —PSEMIE 0000
IEC4 009C —U1EIE0000
IEC5 009E PWM2IE PWM1IE 0000
IEC6 00A0 ADCP1IE ADCP0IE 0000
IEC7 00A2 —ADCP2IE
0000
IPC0 00A4 T1IP<2:0> OC1IP<2:0> —INT0IP<2:0>
4404
IPC1 00A6 T2IP<2:0> 4000
IPC2 00A8 U1RXIP<2:0> SPI1IP<2:0> —SPI1EIP<2:0> 4440
IPC3 00AA - ADIP<2:0> U1TXIP<2:0> 0044
IPC4 00AC —CNIP<2:0> MI2C1IP<2:0> SI2C1IP<2:0> 4044
IPC5 00AE —INT1IP<2:0>
0004
IPC7 00B2 INT2IP<2:0> 0040
IPC14 00C0 PSEMIP<2:0> 0040
IPC16 00C4 U1EIP<2:0> 0040
IPC23 00D2 PWM2IP<2:0> PWM1IP<2:0> 4400
IPC27 00DA ADCP1IP<2:0> ADCP0IP<2:0> 4400
IPC28 00DC ADCP2IP<2:0> 0004
INTTREG 00E0 —ILR<3:0> VECNUM<6:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 52 © 2008-2012 Microchip Technology Inc.
TABLE 4-7: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC33FJ06G202 DEVICES ONLY
File
Name SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
INTCON1 0080 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE SFTACERR DIV0ERR MATHERR ADDRERR STKERR OSCFAIL 0000
INTCON2 0082 ALTIVT DISI INT2EP INT1EP INT0EP 0000
IFS0 0084 ADIF U1TXIF U1RXIF SPI1IF SPI1EIF —T2IF T1IF OC1IF IC1IF INT0IF 0000
IFS1 0086 —INT2IF INT1IF CNIF AC1IF MI2C1IF SI2C1IF 0000
IFS3 008A —PSEMIF 0000
IFS4 008C —U1EIF0000
IFS5 008E PWM2IF PWM1IF 0000
IFS6 0090 ADCP1IF ADCP0IF —AC2IF 0000
IFS7 0092 ADCP6IF ADCP2IF 0000
IEC0 0094 ADIE U1TXIE U1RXIE SPI1IE SPI1EIE —T2IE T1IE OC1IE IC1IE INT0IE 0000
IEC1 0096 —INT2IE INT1IE CNIE AC1IE MI2C1IE SI2C1IE 0000
IEC3 009A —PSEMIE 0000
IEC4 009C —U1EIE0000
IEC5 009E PWM2IE PWM1IE 0000
IEC6 00A0 ADCP1IE ADCP0IE —AC2IE 0000
IEC7 00A2 ADCP6IE —ADCP2IE
0000
IPC0 00A4 —T1IP<2:0> OC1IP<2:0> IC1IP<2:0> INT0IP<2:0> 4444
IPC1 00A6 —T2IP<2:0> 4000
IPC2 00A8 U1RXIP<2:0> SPI1IP<2:0> SPI1EIP<2:0> 4440
IPC3 00AA -— ADIP<2:0> U1TXIP<2:0> 0044
IPC4 00AC CNIP<2:0> AC1IP<2:0> MI2C1IP<2:0> SI2C1IP<2:0> 4444
IPC5 00AE INT1IP<2:0> 0004
IPC7 00B2 INT2IP<2:0> 0040
IPC14 00C0 PSEMIP<2:0> 0040
IPC16 00C4 U1EIP<2:0> 0040
IPC23 00D2 PWM2IP<2:0> PWM1IP<2:0> 4400
IPC25 00D6 AC2IP<2:0> 4000
IPC27 00DA ADCP1IP<2:0> ADCP0IP<2:0> 4400
IPC28 00DC ADCP2IP<2:0> 0004
IPC29 00DE ADCP6IP<2:0> 0004
INTTREG 00E0 —ILR<3:0> VECNUM<6:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 53
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 4-8: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC33FJ16GS402/404 DEVICES ONLY
File
Name SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
INTCON1 0080 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE SFTACERR DIV0ERR MATHERR ADDRERR STKERR OSCFAIL 0000
INTCON2 0082 ALTIVT DISI INT2EP INT1EP INT0EP 0000
IFS0 0084 ADIF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000
IFS1 0086 —INT2IF INT1IF CNIF MI2C1IF SI2C1IF 0000
IFS3 008A PSEMIF 0000
IFS4 008C —U1EIF0000
IFS5 008E PWM2IF PWM1IF 0000
IFS6 0090 ADCP1IF ADCP0IF —PWM3IF
0000
IFS7 0092 ADCP3IF ADCP2IF 0000
IEC0 0094 ADIE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000
IEC1 0096 —INT2IE INT1IE CNIE MI2C1IE SI2C1IE 0000
IEC3 009A PSEMIE 0000
IEC4 009C —U1EIE0000
IEC5 009E PWM2IE PWM1IE 0000
IEC6 00A0 ADCP1IE ADCP0IE —PWM3IE
0000
IEC7 00A2 ADCP3IE ADCP2IE 0000
IPC0 00A4 —T1IP<2:0> OC1IP<2:0> IC1IP<2:0> —INT0IP<2:0>
4444
IPC1 00A6 —T2IP<2:0> OC2IP<2:0> IC2IP<2:0> 4440
IPC2 00A8 U1RXIP<2:0> SPI1IP<2:0> SPI1EIP<2:0> T3IP<2:0> 4444
IPC3 00AA -— ADIP<2:0> U1TXIP<2:0> 0044
IPC4 00AC CNIP<2:0> MI2C1IP<2:0> SI2C1IP<2:0> 4044
IPC5 00AE —INT1IP<2:0>
0004
IPC7 00B2 INT2IP<2:0> 0040
IPC14 00C0 PSEMIP<2:0> 0040
IPC16 00C4 U1EIP<2:0> 0040
IPC23 00D2 PWM2IP<2:0> —PWM1IP<2:0>-— 4400
IPC24 00D4 PWM3IP<2:0> 0004
IPC27 00DA ADCP1IP<2:0> ADCP0IP<2:0> -— 4400
IPC28 00DC ADCP3IP<2:0> ADCP2IP<2:0> 0044
INTTREG 00E0 —ILR<3:0> VECNUM<6:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 54 © 2008-2012 Microchip Technology Inc.
TABLE 4-9: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC33FJ16GS502 DEVICES ONLY
File
Name SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
INTCON1 0080 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE SFTACERR DIV0ERR MATHERR ADDRERR STKERR OSCFAIL 0000
INTCON2 0082 ALTIVT DISI INT2EP INT1EP INT0EP 0000
IFS0 0084 ADIF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000
IFS1 0086 —INT2IF INT1IF CNIF AC1IF MI2C1IF SI2C1IF 0000
IFS3 008A PSEMIF 0000
IFS4 008C —U1EIF0000
IFS5 008E PWM2IF PWM1IF 0000
IFS6 0090 ADCP1IF ADCP0IF AC4IF AC3IF AC2IF PWM4IF PWM3IF 0000
IFS7 0092 —ADCP6IF—ADCP3IFADCP2IF
0000
IEC0 0094 ADIE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000
IEC1 0096 —INT2IE INT1IE CNIE AC1IE MI2C1IE SI2C1IE 0000
IEC3 009A PSEMIE 0000
IEC4 009C —U1EIE0000
IEC5 009E PWM2IE PWM1IE 0000
IEC6 00A0 ADCP1IE ADCP0IE AC4IE AC3IE AC2IE PWM4IE PWM3IE 0000
IEC7 00A2 ADCP6IE ADCP3IE ADCP2IE 0000
IPC0 00A4 T1IP<2:0> —OC1IP<2:0> IC1IP<2:0> INT0IP<2:0> 4444
IPC1 00A6 T2IP<2:0> —OC2IP<2:0> IC2IP<2:0> -— 4440
IPC2 00A8 U1RXIP<2:0> SPI1IP<2:0> SPI1EIP<2:0> T3IP<2:0> 4444
IPC3 00AA -— -— ADIP<2:0> U1TXIP<2:0> 0044
IPC4 00AC CNIP<2:0> AC1IP<2:0> MI2C1IP<2:0> SI2C1IP<2:0> 4444
IPC5 00AE INT1IP<2:0> 0004
IPC7 00B2 INT2IP<2:0> 0040
IPC14 00C0 —PSEMIP<2:0> 0040
IPC16 00C4 U1EIP<2:0> 0040
IPC23 00D2 PWM2IP<2:0> PWM1IP<2:0> 4400
IPC24 00D4 PWM4IP<2:0> PWM3IP<2:0> 0044
IPC25 00D6 AC2IP<2:0> 4000
IPC26 00D8 AC4IP<2:0> AC3IP<2:0> 0044
IPC27 00DA ADCP1IP<2:0> ADCP0IP<2:0> -— 4400
IPC28 00DC ADCP3IP<2:0> ADCP2IP<2:0> 0044
IPC29 00DE ADCP6IP<2:0> 0004
INTTREG 00E0 —ILR<3:0> VECNUM<6:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 55
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 4-10: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC33FJ16GS504 DEVICES ONLY
File
Name SFR
Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
INTCON1 0080 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE SFTACERR DIV0ERR MATHERR ADDRERR STKERR OSCFAIL 0000
INTCON2 0082 ALTIVT DISI INT2EP INT1EP INT0EP 0000
IFS0 0084 ADIF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000
IFS1 0086 —INT2IF INT1IF CNIF AC1IF MI2C1IF SI2C1IF 0000
IFS3 008A PSEMIF 0000
IFS4 008C —U1EIF0000
IFS5 008E PWM2IF PWM1IF 0000
IFS6 0090 ADCP1IF ADCP0IF AC4IF AC3IF AC2IF —PWM4IFPWM3IF
0000
IFS7 0092 ADCP6IF ADCP5IF ADCP4IF ADCP3IF ADCP2IF 0000
IEC0 0094 ADIE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000
IEC1 0096 —INT2IE INT1IE CNIE AC1IE MI2C1IE SI2C1IE 0000
IEC3 009A —PSEMIE 0000
IEC4 009C —U1EIE0000
IEC5 009E PWM2IE PWM1IE 0000
IEC6 00A0 ADCP1IE ADCP0IE AC4IE AC3IE AC2IE PWM4IE PWM3IE 0000
IEC7 00A2 ADCP6IE ADCP5IE ADCP4IE ADCP3IE ADCP2IE 0000
IPC0 00A4 T1IP<2:0> OC1IP<2:0> IC1IP<2:0> —INT0IP<2:0>
4444
IPC1 00A6 T2IP<2:0> OC2IP<2:0> IC2IP<2:0> 4440
IPC2 00A8 U1RXIP<2:0> SPI1IP<2:0> SPI1EIP<2:0> T3IP<2:0> 4444
IPC3 00AA -— ADIP<2:0> U1TXIP<2:0> 0044
IPC4 00AC —CNIP<2:0> AC1IP<2:0> MI2C1IP<2:0> SI2C1IP<2:0> 4444
IPC5 00AE —INT1IP<2:0>
0004
IPC7 00B2 INT2IP<2:0> 0040
IPC14 00C0 PSEMIP<2:0> 0040
IPC16 00C4 U1EIP<2:0> 0040
IPC23 00D2 PWM2IP<2:0> —PWM1IP<2:0> 4400
IPC24 00D4 PWM4IP<2:0> PWM3IP<2:0> 0044
IPC25 00D6 AC2IP<2:0> 4000
IPC26 00D8 AC4IP<2:0> AC3IP<2:0> 0440
IPC27 00DA —ADCP1IP<2:0> ADCP0IP<2:0> 4400
IPC28 00DC —ADCP5IP<2:0> ADCP4IP<2:0> ADCP3IP<2:0> ADCP2IP<2:0> 4444
IPC29 00DE ADCP6IP<2:0> 0004
INTTREG 00E0 —ILR<3:0> VECNUM<6:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 56 © 2008-2012 Microchip Technology Inc.
TABLE 4-11: TIMER REGISTER MAP FOR ds PIC33FJ06GS101 AND dsPIC 33FJ06GSX02
TABLE 4-12: TIMER REGISTER MAP FOR dsPIC33FJ16GSX02 AND dsPIC33FJ16GSX04
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TMR1 0100 Timer1 Regis ter 0000
PR1 0102 Period Register 1 FFFF
T1CON 0104 TON —TSIDL———— TGATE TCKPS<1:0> TSYNC TCS 0000
TMR2 0106 Timer2 Regis ter 0000
PR2 010C Period Register 2 FFFF
T2CON 0110 TON —TSIDL———— TGATE TCKPS<1:0> —TCS0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TMR1 0100 Timer1 Regis ter 0000
PR1 0102 Period Register 1 FFFF
T1CON 0104 TON —TSIDL———— TGATE TCKPS<1:0> TSYNC TCS 0000
TMR2 0106 Timer2 Regis ter 0000
TMR3HLD 0108 Timer3 Holding Register (for 32-bit timer operations only) xxxx
TMR3 010A Timer 3 Reg iste r 0000
PR2 010C Period Register 2 FFFF
PR3 010E Period Register 3 FFFF
T2CON 0110 TON —TSIDL———— TGATE TCKPS<1:0> T32 —TCS0000
T3CON 0112 TON —TSIDL———— TGATE TCKPS<1:0> —TCS0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-13: INPUT CAPTURE REGISTER MAP FOR dsPIC33FJ06GS202
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
IC1BUF 0140 Input Capture 1 Register xxxx
IC1CON 0142 —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 57
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 4-14: INPUT CAPTURE REGISTER MAP FOR dsPIC33FJ16GSX02 AND dsPIC33FJ16GSX04
TABLE 4-16: OUTPUT COMP ARE REGISTER MAP FOR dsPIC33FJ16GSX02 AND dsPIC33FJ06GSX04
SFR
Name SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
IC1BUF 0140 Input Capture 1 Register xxxx
IC1CON 0142 —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000
IC2BUF 0144 Input Capture 2 Register xxxx
IC2CON 0146 —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-15: OUTPUT COMPARE REGISTER MAP FOR dsPIC33FJ06GS101 AND dsPIC33FJ06GSX02
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
OC1RS 0180 Output Compare 1 Secondary Register xxxx
OC1R 0182 Output Compare 1 Register xxxx
OC1CON 0184 —OCSIDL OCFLT OCTSEL OCM<2:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
OC1RS 0180 Output Compare 1 Secondary Register xxxx
OC1R 0182 Output Compare 1 Register xxxx
OC1CON 0184 —OCSIDL OCFLT OCTSEL OCM<2:0> 0000
OC2RS 0186 Output Compare 2 Secondary Register xxxx
OC2R 0188 Output Compare 2 Register xxxxx
OC2CON 018A —OCSIDL OCFLT OCTSEL OCM<2:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-17: HIGH-SPEED PWM REGISTER MAP
File Name Addr
Offset Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PTCON 0400 PTEN PTSIDL SESTAT SEIEN EIPU SYNCPOL SYNCOEN SYNCEN SYNCSRC<1:0> SEVTPS<3:0> 0000
PTCON2 0402 —PCLKDIV<2:0>0000
PTPER 0404 PTPER<15:0> FFF8
SEVTCMP 0406 SEVTCMP<15:3> 0000
MDC 040A MDC<15:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 58 © 2008-2012 Microchip Technology Inc.
TABLE 4-18: HIGH-SPEED PWM GENERATOR 1 REGISTER MAP
File Name Addr
Offset Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PWMCON1 0420 FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS DTC<1:0> CAM XPRES IUE 0000
IOCON1 0422 PENH PENL POLH POLL PMOD<1:0> OVRENH OVRENL OVRDAT<1:0> FLTDAT<1:0> CLDAT<1:0> SWAP OSYNC 0000
FCLCON1 0424 IFLTMOD CLSRC<4:0> CLPOL CLMOD FLTSRC<4:0> FLTPOL FLTMOD<1:0> 0000
PDC1 0426 PDC1<15:0> 0000
PHASE1 0428 PHASE1<15:0> 0000
DTR1 042A DTR1<13:0> 0000
ALTDTR1 042C ALTDTR1<13:0> 0000
SDC1 042E SDC1<15:0> 0000
SPHASE1 0430 SPHASE1<15:0> 0000
TRIG1 0432 TRGCMP<15:3> 0000
TRGCON1 0434 TRGDIV<3:0> —DTM—TRGSTRT<5:0>0000
STRIG1 0436 STRGCMP<15:3> 0000
PWMCAP1 0438 PWMCAP1<15:3> 0000
LEBCON1 043A PHR PHF PLR PLF FLTLEBEN CLLEBEN LEB<6:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-19: HIGH-SPEED PWM GE NERATOR 2 REGISTER MAP FOR dsPIC33FJ06GS102/202 AND dsPIC33FJ16GSX02/X04 DEVICES ONLY
File Name Addr
Offset Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PWMCON2 0440 FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS DTC<1:0> CAM XPRES IUE 0000
IOCON2 0442 PENH PENL POLH POLL PMOD<1:0> OVRENH OVRENL OVRDAT<1:0> FLTDAT<1:0> CLDAT<1:0> SWAP OSYNC 0000
FCLCON2 0444 IFLTMOD CLSRC<4:0> CLPOL CLMOD FLTSRC<4:0> FLTPOL FLTMOD<1:0> 0000
PDC2 0446 PDC2<15:0> 0000
PHASE2 0448 PHASE2<15:0> 0000
DTR2 044A DTR2<13:0> 0000
ALTDTR2 044C ALTDTR2<13:0> 0000
SDC2 044E SDC2<15:0> 0000
SPHASE2 0450 SPHASE2<15:0> 0000
TRIG2 0452 TRGCMP<15:3> 0000
TRGCON2 0454 TRGDIV<3:0> —DTM—TRGSTRT<5:0>0000
STRIG2 0456 STRGCMP<15:3> 0000
PWMCAP2 0458 PWMCAP2<15:3> 0000
LEBCON2 045A PHR PHF PLR PLF FLTLEBEN CLLEBEN LEB<6:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 59
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 4-20: HIGH-SPEED PWM GENERATOR 3 REGISTER MAP FOR dsPIC33FJ16GSX02/X04 DEVICES ONLY
File Name Addr
Offset Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PWMCON3 0460 FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS DTC<1:0> CAM XPRES IUE 0000
IOCON3 0462 PENH PENL POLH POLL PMOD<1:0> OVRENH OVRENL OVRDAT<1:0> FLTDAT<1:0> CLDAT<1:0> SWAP OSYNC 0000
FCLCON3 0464 IFLTMOD CLSRC<4:0> CLPOL CLMOD FLTSRC<4:0> FLTPOL FLTMOD<1:0> 0000
PDC3 0466 PDC3<15:0> 0000
PHASE3 0468 PHASE3<15:0> 0000
DTR3 046C DTR3<13:0> 0000
ALTDTR3 046C ALTDTR3<13:0> 0000
SDC3 046E SDC3<15:0> 0000
SPHASE3 0470 SPHASE3<15:0> 0000
TRIG3 0472 TRGCMP<15:3> 0000
TRGCON3 0474 TRGDIV<3:0> —DTM—TRGSTRT<5:0>0000
STRIG3 0476 STRGCMP<15:3> 0000
PWMCAP3 0478 PWMCAP3<15:3> 0000
LEBCON3 047A PHR PHF PLR PLF FLTLEBEN CLLEBEN LEB<6:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-21: HIGH-SPEED PWM GENERATOR 4 REGISTER MAP FOR dsPIC33FJ06GS101 AND dsPIC33FJ16GS50X DEVICES ONLY
File Name Addr
Offset Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PWMCON4 0480 FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS DTC<1:0> CAM XPRES IUE 0000
IOCON4 0482 PENH PENL POLH POLL PMOD<1:0> OVRENH OVRENL OVRDAT<1:0> FLTDAT<1:0> CLDAT<1:0> SWAP OSYNC 0000
FCLCON4 0484 IFLTMOD CLSRC<4:0> CLPOL CLMOD FLTSRC<4:0> FLTPOL FLTMOD<1:0> 0000
PDC4 0486 PDC4<15:0> 0000
PHASE4 0488 PHASE4<15:0> 0000
DTR4 048A DTR4<13:0> 0000
ALTDTR4 048A ALTDTR4<13:0> 0000
SDC4 048E SDC4<15:0> 0000
SPHASE4 0490 SPHASE4<15:0> 0000
TRIG4 0492 TRGCMP<15:3> 0000
TRGCON4 0494 TRGDIV<3:0> —DTM—TRGSTRT<5:0>0000
STRIG4 0496 STRGCMP<15:3> 0000
PWMCAP4 0498 PWMCAP4<15:3> 0000
LEBCON4 049A PHR PHF PLR PLF FLTLEBEN CLLEBEN LEB<6:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 60 © 2008-2012 Microchip Technology Inc.
TABLE 4-23: UART1 REGISTER MAP
TABLE 4-24: SPI1 REGISTER MAP
TABLE 4-22: I2C1 REGISTER MAP
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
I2C1RCV 0200 Receive R eg i st er 0000
I2C1TRN 0202 Transmit Register 00FF
I2C1BRG 0204 Baud Rate Generator Register 0000
I2C1CON 0206 I2CEN I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000
I2C1STAT 0208 ACKSTAT TRSTAT —— BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000
I2C1ADD 020A Address Register 0000
I2C1MSK 020C —AMSK<9:0>0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
U1MODE 0220 UARTEN USIDL IREN RTSMD UEN1 UEN0 WAKE LPBACK ABAUD URXINV BRGH PDSEL<1:0> STSEL 0000
U1STA 0222 UTXISEL1 UTXINV UTXISEL0 UTXBRK UTXE
NUTXBF TRMT URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA 0110
U1TXREG 0224 UART Transmit Register xxxx
U1RXREG 0226 UART Receive Register 0000
U1BRG 0228 Baud Rate Generator Prescaler 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
SPI1STAT 0240 SPIEN SPISIDL —SPIROV SPITBF SPIRBF 0000
SPI1CON1 0242 DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE<2:0> PPRE<1:0> 0000
SPI1CON2 0244 FRMEN SPIFSD FRMPOL FRMDLY 0000
SPI1BUF 0248 SPI1 Transmit and Receive Buffer Register 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 61
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 4-25: HIGH-SPEED 10-BIT ADC REGISTER MAP FOR dsPIC33FJ06GS101 DEVICES ONLY
TABLE 4-26: HIGH-SPEED 10-BIT ADC REGISTER MAP FOR dsPIC33FJ06GS102 DEVICES ONLY
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
ADCON 0300 ADON ADSIDL SLOWCLK —GSWTRG FORM EIE ORDER SEQSAMP ASYNCSAMP —ADCS<2:0>0003
ADPCFG 0302 —PCFG7PCFG6 PCFG3 PCFG2 PCFG1 PCFG0 0000
ADSTAT 0306 P3RDY P1RDY P0RDY 0000
ADBASE 0308 ADBASE<15:1> 0000
ADCPC0 030A IRQEN1 PEND1 SWTRG1 TRGSRC1<4:0> IRQEN0 PEND0 SWTRG0 TRGSRC0<4:0> 0000
ADCPC1 030C IRQEN3 PEND3 SWTRG3 TRGSRC3<4:0> 0000
ADCBUF0 0320 ADC Data Buffer 0 xxxx
ADCBUF1 0322 ADC Data Buffer 1 xxxx
ADCBUF2 0324 ADC Data Buffer 2 xxxx
ADCBUF3 0326 ADC Data Buffer 3 xxxx
ADCBUF6 032C ADC Data Buffer 6 xxxx
ADCBUF7 032E ADC Data Buffer 7 xxxx
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 B i t 0 All
Resets
ADCON 0300 ADON —ADSIDLSLOWCLK—GSWTRG FORM EIE ORDER SEQSAMP ASYNCSAMP ADCS<2:0> 0003
ADPCFG 0302 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000
ADSTAT 0306 P2RDY P1RDY P0RDY 0000
ADBASE 0308 ADBASE<15:1> 0000
ADCPC0 030A IRQEN1 PEND1 SWTRG1 TRGSRC1<4:0> IRQEN0 PEND0 SWTRG0 TRGSRC0<4:0> 0000
ADCPC1 030C IRQEN2 PEND2 SWTRG2 TRGSRC2<4:0> 0000
ADCBUF0 0320 ADC Data Buffer 0 xxxx
ADCBUF1 0322 ADC Data Buffer 1 xxxx
ADCBUF2 0324 ADC Data Buffer 2 xxxx
ADCBUF3 0326 ADC Data Buffer 3 xxxx
ADCBUF4 0328 ADC Data Buffer 4 xxxx
ADCBUF5 032A ADC Data Buffer 5 xxxx
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 62 © 2008-2012 Microchip Technology Inc.
TABLE 4-27: HIGH-SPEED 10-BIT ADC REGISTER MAP FOR dsPIC33FJ06GS202 DEVICES ONLY
TABLE 4-28: HIGH-SPEED 10-BIT ADC REGISTER MAP FOR dsPIC33FJ16GS402/404 DEVICES ONLY
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
ADCON 0300 ADON —ADSIDLSLOWCLK—GSWTRG FORM EIE ORDER SEQSAMP ASYNCSAMP ADCS<2:0> 0003
ADPCFG 0302 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000
ADSTAT 0306 —P6RDY P2RDY P1RDY P0RDY 0000
ADBASE 0308 ADBASE<15:1> 0000
ADCPC0 030A IRQEN1 PEND1 SWTRG1 TRGSRC1<4:0> IRQEN0 PEND0 SWTRG0 TRGSRC0<4:0> 0000
ADCPC1 030C IRQEN2 PEND2 SWTRG2 TRGSRC2<4:0> 0000
ADCPC3 0310 IRQEN6 PEND6 SWTRG6 TRGSRC6<4:0> 0000
ADCBUF0 0320 ADC Data Buffer 0 xxxx
ADCBUF1 0322 ADC Data Buffer 1 xxxx
ADCBUF2 0324 ADC Data Buffer 2 xxxx
ADCBUF3 0326 ADC Data Buffer 3 xxxx
ADCBUF4 0328 ADC Data Buffer 4 xxxx
ADCBUF5 032A ADC Data Buffer 5 xxxx
ADCBUF12 0338 ADC Data Buff er 12 xxxx
ADCBUF13 033A ADC Data Buffer13 xxxx
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
ADCON 0300 ADON —ADSIDLSLOWCLK—GSWTRG FORM EIE ORDER SEQSAMP ASYNCSAMP ADCS<2:0> 0003
ADPCFG 0302 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000
ADSTAT 0306 P3RDY P2RDY P1RDY P0RDY 0000
ADBASE 0308 ADBASE<15:1> 0000
ADCPC0 030A IRQEN1 PEND1 SWTRG1 TRGSRC1<4:0> IRQEN0 PEND0 SWTRG0 TRGSRC0<4:0> 0000
ADCPC1 030C IRQEN3 PEND3 SWTRG3 TRGSRC3<4:0> IRQEN2 PEND2 SWTRG2 TRGSRC2<4:0> 0000
ADCBUF0 0320 ADC Data Buffer 0 xxxx
ADCBUF1 0322 ADC Data Buffer 1 xxxx
ADCBUF2 0324 ADC Data Buffer 2 xxxx
ADCBUF3 0326 ADC Data Buffer 3 xxxx
ADCBUF4 0328 ADC Data Buffer 4 xxxx
ADCBUF5 032A ADC Data Buffer 5 xxxx
ADCBUF6 032C ADC Data Buffer 6 xxxx
ADCBUF7 032E ADC Data Buffer 7 xxxx
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 63
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 4-29: HIGH-SPEED 10-BIT ADC REGISTER MAP FOR dsPIC33FJ16GS502 DEVICES ONLY
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
ADCON 0300 ADON ADSIDL SLOWCLK —GSWTRG FORM EIE ORDER SEQSAMP ASYNCSAMP —ADCS<2:0>0003
ADPCFG 0302 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000
ADSTAT 0306 P6RDY P3RDY P2RDY P1RDY P0RDY 0000
ADBASE 0308 ADBASE<15:1> 0000
ADCPC0 030A IRQEN1 PEND1 SWTRG1 TRGSRC1<4:0> IRQEN0 PEND0 SWTRG0 TRGSRC0<4:0> 0000
ADCPC1 030C IRQEN3 PEND3 SWTRG3 TRGSRC3<4:0> IRQEN2 PEND2 SWTRG2 TRGSRC2<4:0> 0000
ADCPC3 0310 IRQEN6 PEND6 SWTRG6 TRGSRC6<4:0> 0000
ADCBUF0 0320 ADC Data Buffer 0 xxxx
ADCBUF1 0322 ADC Data Buffer 1 xxxx
ADCBUF2 0324 ADC Data Buffer 2 xxxx
ADCBUF3 0326 ADC Data Buffer 3 xxxx
ADCBUF4 0328 ADC Data Buffer 4 xxxx
ADCBUF5 032A ADC Data Buffer 5 xxxx
ADCBUF6 032C ADC Data Buffer 6 xxxx
ADCBUF7 032E ADC Data Buffer 7 xxxx
ADCBUF12 0338 ADC Data Buffer 12 xxxx
ADCBUF13 033A ADC Data Buffer 13 xxxx
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 64 © 2008-2012 Microchip Technology Inc.
TABLE 4-30: HIGH-SPEED 10-BIT ADC REGISTER MAP FOR dsPIC33FJ16GS504 DEVICES ONLY
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
ADCON 0300 ADON —ADSIDLSLOWCLK—GSWTRG FORM EIE ORDER SEQSAMP ASYNCSAMP ADCS<2:0> 0003
ADPCFG 0302 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000
ADSTAT 0306 P6RDY P5RDY P4RDY P3RDY P2RDY P1RDY P0RDY 0000
ADBASE 0308 ADBASE<15:1> 0000
ADCPC0 030A IRQEN1 PEND1 SWTRG1 TRGSRC1<4:0> IRQEN0 PEND0 SWTRG0 TRGSRC0<4:0> 0000
ADCPC1 030C IRQEN3 PEND3 SWTRG3 TRGSRC3<4:0> IRQEN2 PEND2 SWTRG2 TRGSRC2<4:0> 0000
ADCPC2 030E IRQEN5 PEND5 SWTRG5 TRGSRC5<4:0> IRQEN4 PEND4 SWTRG4 TRGSRC4<4:0> 0000
ADCPC3 0310 IRQEN6 PEND6 SWTRG6 TRGSRC6<4:0> 0000
ADCBUF0 0320 ADC Data Buffer 0 xxxx
ADCBUF1 0322 ADC Data Buffer 1 xxxx
ADCBUF2 0324 ADC Data Buffer 2 xxxx
ADCBUF3 0326 ADC Data Buffer 3 xxxx
ADCBUF4 0328 ADC Data Buffer 4 xxxx
ADCBUF5 032A ADC Data Buffer 5 xxxx
ADCBUF6 032C ADC Data Buffer 6 xxxx
ADCBUF7 032E ADC Data Buffer 7 xxxx
ADCBUF8 0330 ADC Data Buffer 8 xxxx
ADCBUF9 0332 ADC Data Buffer 9 xxxx
ADCBUF10 0334 ADC Data Buff er 10 xxxx
ADCBUF11 0336 ADC Data Buffer 11 xxxx
ADCBUF12 0338 ADC Data Buff er 12 xxxx
ADCBUF13 033A ADC Data Buffer 13 xxxx
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 65
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 4-31: ANALOG COMPARATOR CONTROL REGISTER MAP FOR dsPIC33FJ06GS202 DEVICES ONLY
TABLE 4-32: ANALOG COMPARATOR CONTROL REGISTER MAP dsPIC33FJ16GS502/504 DEVICES ONLY
File Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
CMPCON1 0540 CMPON —CMPSIDL DACOE INSEL<1:0> EXTREF CMPSTAT CMPPOL RANGE 0000
CMPDAC1 0542 —CMREF<9:0>0000
CMPCON2 0544 CMPON —CMPSIDL DACOE INSEL<1:0> EXTREF CMPSTAT CMPPOL RANGE 0000
CMPDAC2 0546 —CMREF<9:0>0000
File Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
CMPCON1 0540 CMPON —CMPSIDL DACOE INSEL<1:0> EXTREF CMPSTAT CMPPOL RANGE 0000
CMPDAC1 0542 —CMREF<9:0>0000
CMPCON2 0544 CMPON —CMPSIDL DACOE INSEL<1:0> EXTREF CMPSTAT CMPPOL RANGE 0000
CMPDAC2 0546 —CMREF<9:0>0000
CMPCON3 0548 CMPON —CMPSIDL DACOE INSEL<1:0> EXTREF CMPSTAT CMPPOL RANGE 0000
CMPDAC3 054A —CMREF<9:0>0000
CMPCON4 054C CMPON —CMPSIDL DACOE INSEL<1:0> EXTREF CMPSTAT CMPPOL RANGE 0000
CMPDAC4 054E —CMREF<9:0>0000
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 66 © 2008-2012 Microchip Technology Inc.
TABLE 4-33: PERIPHERAL PIN SELECT INPUT REGISTER MAP
TABLE 4-34: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ06GS101
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RPINR0 0680 —INT1R<5:0> 3F00
RPINR1 0682 —INT2R<5:0>003F
RPINR2 0684 —T1CKR<5:0> 0000
RPINR3 0686 —T3CKR<5:0>—T2CKR<5:0>3F3F
RPINR7 068E IC2R<5:0> IC1R<5:0> 3F3F
RPINR11 0696 —OCFAR<5:0>3F3F
RPINR18 06A4 U1CTSR<5:0> —U1RXR<5:0>003F
RPINR20 06A8 —SCK1R<5:0>—SDI1R<5:0>3F3F
RPINR21 06AA SS1R<5:0> 0000
RPINR29 06BA —FLT1R<5:0> 3F00
RPINR30 06BC —FLT3R<5:0>—FLT2R<5:0>3F3F
RPINR31 06BE —FLT5R<5:0>—FLT4R<5:0>3F3F
RPINR32 06C0 —FLT7R<5:0>—FLT6R<5:0>3F3F
RPINR33 06C2 SYNCI1R<5:0> —FLT8R<5:0>3F3F
RPINR34 06C4 SYNCI2R<5:0> 3F3F
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
File
Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bi t 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RPOR0 06D0 RP1R<5:0> —RP0R<5:0>0000
RPOR1 06D2 RP3R<5:0> —RP2R<5:0>0000
RPOR2 06D4 RP5R<5:0> —RP4R<5:0>0000
RPOR3 06D6 RP7R<5:0> —RP6R<5:0>0000
RPOR16 06F0 RP33<5:0> RP32<5:0> 0000
RPOR17 06F2 RP35<5:0> RP34<5:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 67
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 4-35: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ06GS102, dsPIC33FJ06GS202, dsPIC33FJ1 6GS4 02
AND dsPIC33FJ16GS502
TABLE 4-36: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ16GS404 AND dsPIC33FJ16GS504
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RPOR0 06D0 RP1R<5:0> RP0R<5:0> 0000
RPOR1 06D2 RP3R<5:0> —RP2R<5:0>0000
RPOR2 06D4 RP5R<5:0> —RP4R<5:0>0000
RPOR3 06D6 RP7R<5:0> —RP6R<5:0>0000
RPOR4 06D8 RP9R<5:0> —RP8R<5:0>0000
RPOR5 06DA —RP11R<5:0> RP10R<5:0> 0000
RPOR6 06DC RP13R<5:0> RP12R<5:0> 0000
RPOR7 06DE RP15R<5:0> RP14R<5:0> 0000
RPOR16 06F0 RP33<5:0> RP32<5:0> 0000
RPOR17 06F2 RP35<5:0> RP34<5:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RPOR0 06D0 RP1R<5:0> RP0R<5:0> 0000
RPOR1 06D2 RP3R<5:0> RP2R<5:0> 0000
RPOR2 06D4 RP5R<5:0> RP4R<5:0> 0000
RPOR3 06D6 RP7R<5:0> RP6R<5:0> 0000
RPOR4 06D8 RP9R<5:0> RP8R<5:0> 0000
RPOR5 06DA —RP11R<5:0>—RP10R<5:0>0000
RPOR6 06DC RP13R<5:0> —RP12R<5:0>0000
RPOR7 06DE RP15R<5:0> —RP14R<5:0>0000
RPOR8 06E0 RP17R<5:0> —RP16R<5:0>0000
RPOR9 06E2 RP19R<5:0> —RP18R<5:0>0000
RPOR10 06E4 RP21R<5:0> —RP20R<5:0>0000
RPOR11 06E6 RP23R<5:0> —RP22R<5:0>0000
RPOR12 06E8 RP25R<5:0> —RP24R<5:0>0000
RPOR13 06EA RP27R<5:0> —RP26R<5:0>0000
RPOR14 06EC RP29R<5:0> —RP28R<5:0>0000
RPOR16 06F0 RP33<5:0> RP32<5:0> 0000
RPOR17 06F2 RP35<5:0> RP34<5:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 68 © 2008-2012 Microchip Technology Inc.
TABLE 4-37: PORTA REGISTER MAP
TABLE 4-38: PORTB REGISTER MAP FOR dsPIC33FJ06GS101
TABLE 4-39: PORTB REGISTER MAP FOR dsPIC33FJ06GS102, dsPIC33FJ06GS202, dsPIC33FJ16GS402, dsPIC33FJ16GS404,
dsPIC33FJ16GS502 AND dsPIC33FJ16GS504
TABLE 4-40: PORTC REGISTER MAP FOR dsPIC33FJ16GS404 AND dsPIC33FJ16GS504
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISA 02C0 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 001F
PORTA 02C2 RA4 RA3 RA2 RA1 RA0 xxxx
LATA 02C4 LATA4 LATA3 LATA2 LATA1 LATA0 0000
ODCA 02C6 ODCA4 ODCA3 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISB 02C8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 00FF
PORTB 02CA RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx
LATB 02CC LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000
ODCB 02CE ODCB7 ODCB6 ODCB4 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 B i t 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISB 02C8 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 FFFF
PORTB 02CA RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx
LATB 02CC LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000
ODCB 02CE ODCB15 ODCB14 ODCB13 ODCB12 ODCB11 ODCB8 ODCB7 ODCB6 ODCB4(1) 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This bit is not available on dsPI C33FJ06GS202/502 devices.
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISC 02D0 TRISC13 TRISC12 TRISC11 TRISC10 TRISC9 TRISC8 TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 3FFF
PORTC 02D2 RC13 RC12 RC11 RC10 RC9 RC8 RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx
LATC 02D4 LATC13 LATC12 LATC11 LATC10 LATC9 LATC8 LATC7 LATC6 LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 0000
ODCC 02D6 ODCC13 ODCC12 ODCC11 ODCC8 ODCC7 ODCC6 ODCC5 ODCC4 ODCC3 ODCC0 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 69
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 4-41: SYSTEM CONTROL REGISTER MAP
TABLE 4-42: NVM REGISTER MAP
TABLE 4-43: PMD REGISTER MAP FOR dsPIC33FJ06GS101 DEVICES ONLY
TABLE 4-44: PMD REGISTER MAP FOR dsPIC33FJ06GS102 DEVICES ONLY
SFR Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RCON 0740 TRAPR IOPUWR CM VREGS EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR xxxx(1)
OSCCON 0742 COSC<2:0> NOSC<2:0> CLKLOCK IOLOCK LOCK —CF OSWEN 0300(2)
CLKDIV 0744 ROI DOZE<2:0> DOZEN FRCDIV<2:0> PLLPOST<1:0> PLLPRE<4:0> 3040
PLLFBD 0746 PLLDIV<8:0> 0030
REFOCON 074E ROON ROSSLP ROSEL RODIV<3:0> 0000
OSCTUN 0748 TUN<5:0> 0000
ACLKCON 0750 ENAPLL APLLCK SELACLK APSTSCLR<2:0> ASRCSEL FRCSEL 2300
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: The RCON register Reset values are dependent on type of Reset.
2: The OSCCON register Reset values are dependent on the FOSC Configuration bits and on type of Reset.
File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
NVMCON 0760 WR WREN WRERR —ERASE—NVMOP<3:0>0000(1)
NVMKEY 0766 NVMKEY<7:0> 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset.
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PMD1 0770 T2MD T1MD PWMMD I2C1MD —U1MD —SPI1MD —ADCMD0000
PMD2 0772 —IC2MDIC1MD —OC2MDOC1MD0000
PMD3 0774 CMPMD 0000
PMD4 0776 —REFOMD 0000
PMD6 077A —PWM4MD —PWM1MD 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PMD1 0770 T2MD T1MD PWMMD I2C1MD —U1MD —SPI1MD —ADCMD0000
PMD2 0772 —IC2MDIC1MD —OC2MDOC1MD0000
PMD3 0774 CMPMD 0000
PMD4 0776 —REFOMD 0000
PMD6 077A PWM2MD PWM1MD 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 70 © 2008-2012 Microchip Technology Inc.
TABLE 4-45: PMD REGISTER MAP FOR dsPIC33FJ06GS202 DEVICES ONLY
TABLE 4-46: PMD REGISTER MAP FOR dsPIC33FJ16GS402 AND dsPIC33FJ16GS404 DEVICES ONLY
TABLE 4-47: PMD REGISTER MAP FOR dsPIC33FJ16GS502 AND dsPIC33FJ16GS504 DEVICES ONLY
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PMD1 0770 T2MD T1MD PWMMD I2C1MD —U1MD —SPI1MD —ADCMD0000
PMD2 0772 —IC1MD —OC1MD0000
PMD3 0774 CMPMD 0000
PMD4 0776 —REFOMD 0000
PMD6 077A PWM2MD PWM1MD 0000
PMD7 077C CMP2MD CMP1MD 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PMD1 0770 T3MD T2MD T1MD PWMMD I2C1MD —U1MD —SPI1MD —ADCMD0000
PMD2 0772 —IC2MDIC1MD —OC2MDOC1MD0000
PMD3 0774 0000
PMD4 0776 —REFOMD 0000
PMD6 077A PWM3MD PWM2MD PWM1MD 0000
PMD7 077C 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name SFR
Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PMD1 0770 T3MD T2MD T1MD PWMMD I2C1MD —U1MD —SPI1MD —ADCMD0000
PMD2 0772 —IC2MDIC1MD —OC2MDOC1MD0000
PMD3 0774 CMPMD 0000
PMD4 0776 —REFOMD 0000
PMD6 077A PWM4MD PWM3MD PWM2MD PWM1MD 0000
PMD7 077C CMP4MD CMP3MD CMP2MD CMP1MD 0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
© 2008-2012 Microchip Technology Inc. DS70318F-page 71
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
4.2.6 SOFTWARE STACK
In addition to its use as a working register, the W15
register in the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices is also used as a
software Stack Pointer. The Stack Pointer always
points to the first available free word and grows from
lower to higher addresses. It predecrements for stack
pops and post-increments for stack pushes, as shown
in Figure 4-6. For a PC push during any CALL instruc-
tion, the MSb of the PC is zero-extended before the
push, ensuring that the MSb is always clear.
The Stack Pointer Limit register (SPLIM) associated
with the S t ack Pointer sets an upper address boundary
for the stack. SPLIM is uninitialized at Reset. As is the
case for the Stack Pointer, SPLIM<0> is forced to 0
because all stack operations must be word-aligned.
Whenever an EA is generated using W15 as a source
or destination pointer, the resulting address is
compared with the value in SPLIM. If the contents of
the Stack Pointer (W15) and the SPLIM register are
equal and a push operation is performed, a stack error
trap will not occur. The stack error trap will occur on a
subsequent push operation. For example, to cause a
stack error trap when the stack grows beyond address
0x1000 in RAM, initialize the SPLIM with the value
0x0FFE.
Similarly, a S t ack Pointer underflow (stack error) trap is
generated when the Stack Pointer address is found to
be less than 0x0800. This prevents the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.
FIGURE 4-6: CALL STACK FRAME
4.3 Instruction Addressing Modes
The addressing modes shown in Table 4-48 form the
basis of the addressing modes optimized to support the
specific features of individual instructions. The
addressing modes provided in the MAC class of
instructions differ from those in the other instruction
types.
4.3.1 FILE REGISTER INSTRUCTIONS
Most file register instructions use a 13-bit address field
(f) to directly address data present in the first 8192
bytes of data memory (near data space). Most file
register instructions employ a working register, W0,
which is denoted as WREG in these instructions. The
destination is typically either the same file register or
WREG (with the exception of the MUL instruction),
which writes the result to a register or register pair. The
MOV instruction allows additional flexibility and can
access the entire data space.
4.3.2 MCU INSTRUCTIONS
The three-operand MCU instructions are of the form:
Operand 3 = Operand 1 <function> Operand 2
where, Operand 1 is always a working register (that is,
the addressing mode can only be register direct), which
is referred to as Wb. Operand 2 can be a W register,
fetched from data memory, or a 5-bit literal. The result
location can be either a W register or a data memory
location. The following addressing modes are
supported by MCU instructions:
Register Direct
Register Indirect
Register Indirect Post-Modified
Register Indirect Pre-Modified
5-bit or 10-bi t Literal
Note: A PC push during exception processing
concatenates the SRL register to the MSb
of the PC prior to the push.
<Free Word>
PC<15:0>
000000000
015
W15 (before CALL)
W15 (after CALL)
Stack Grows Toward
Higher Address
0x0000
PC<22:16>
POP : [--W15]
PUSH : [W15++]
Note: Not all instructions support all the
addressing modes given above. Individ-
ual instructions can support different sub-
sets of these addressing modes.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 72 © 2008-2012 Microchip Technology Inc.
TABLE 4-48: FUNDAMENTAL ADDRESSING MODES SUPPORTED
4.3.3 MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP accumulator class of
instructions to provide a greater addressing flexibility
than other instructions. In addition to the addressing
modes supported by most MCU instructions, move and
accumulator instructions also support Register Indirect
with Register Offset Addressing mode, also referred to
as Register Indexed mode.
In summary, the following addressing modes are
supported by move and accumulator instructions:
Register Direct
Register Indirect
Registe r Indirect Post-modified
Registe r Indirect Pre-modified
Registe r Indirect with Register Offset (Indexed)
Register Indirect with Literal Offset
8-bit Literal
16-bit Literal
4.3.4 MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred
to as MAC instructions, use a simplified set of addressing
modes to allow the user application to effectively
manipulate the data pointers through register indirect
tables.
The two-source operand prefetch registers must be
members of the set {W8, W9, W10, W11}. For data
reads, W8 and W9 are always directed to the X RAGU,
and W10 and W11 are always directed to the Y AGU.
The effective addresses generated (before and after
modification) must, therefore, be valid addresses within
X data space for W8 and W9 and Y data space for W10
and W11.
In summary, the following addressing modes are
supported by the MAC class of instructions:
Register Indirect
Register Indirect Post-Modified by 2
Register Indirect Post-Modified by 4
Register Indirect Post-Modified by 6
Register Indirect with Register Offset (Indexed)
4.3.5 OTHER INSTRUCTIONS
Besides the addressing modes outlined previously , some
instructions use literal constants of various sizes. For
example, BRA (branch) instructions use 16-bit signed
literals to specify the branch destination directly , whereas
the DISI instruction uses a 14-bit unsigned literal field. In
some instructions, such as ADD Acc, the source of an
operand or result is implied by the opcode itself. Certain
operations, such as NOP, do not have any operands.
Addressing Mode Description
File Register Direct The address of the file register is specified explicitly.
Register Direct The contents of a register are accessed directly.
Register Indirect The contents of Wn forms the Effective Address (EA).
Register Indirect Post-Modified The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-Modified Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset
(Register Indexed) The sum of Wn and Wb forms the EA.
Register Indirect with Literal Offset The sum of Wn and a literal forms the EA.
Note: For the MOV instructions, the addressing
mode specified in the instruction can differ
for the source and destination EA.
However, the 4-bit Wb (register offset)
field is shared by both source and
destination (but typically only used by
one).
Note: Not all instructions support all the
addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
Note: Register Indirect with Register Offset
Addressing mode is availab le only for W9
(in X space) and W11 (in Y space).
© 2008-2012 Microchip Technology Inc. DS70318F-page 73
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
4.4 Modulo Addressing
Modulo Addressing mo de is a method used to provid e
an automated means to support circular data buffers
using hardware. The objective is to remove the need
for software to perform data address boun dary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either data or program
space (since the data pointer mechanism is essentially
the same for both). One circular buffer can be supported
in each of the X (which also provides the pointers into
program space) and Y data spaces. Modulo Addressing
can operate on any W register pointer. However, it is not
advisable to use W14 or W15 for Modulo Addressing
since these two registers are used as the Stack Frame
Pointer and S t ack Pointer, respectively.
In general, any particular circular buffer can be
configured to operate in only one direction as there are
certain restrictions on the buffer start address (for
incrementing buffers), or end address (for
decrementing buffers), based upon the direction of the
buffer.
The only exception to the usage restrictions is for
buffers that have a power-of-two length. As these
buffers satisfy the start and end address criteria, they
can operate in a bidirectional mode (that is, address
boundary checks are performed on both the lower and
upper address boundaries).
4.4.1 START AND END ADDRESS
The Modulo Addressing scheme requires that a
starting and ending address be specified and loaded
into the 16-bit Modulo Buffer Address registers:
XMODSRT, XMODEND, YMODSRT and YMODEND
(see Table 4-1).
The length of a circular buffer is not directly specified. It
is determined by the difference between the
corresponding start and end addresses. The maximum
possible length of the circular buffer is 32K words
(64 Kbytes).
4.4.2 W ADDRESS REGISTER
SELECTION
The Modulo and Bit-Reversed Addressing Control
register, MODCON<15:0>, contains enable flags as
well as a W register field to specify the W Address
registers. The XWM and YWM fields select the
registers that will operate with Mo dulo Addressing:
•If XWM = 15, X RAGU and X WAGU Modulo
Addressing is disabled.
•If YWM = 15, Y AGU Modulo Addressing is
disabled.
The X Address Space Pointer W register (XWM), to
which Modulo Addressing is to be appli ed, is stored in
MODCON<3:0> (see Table 4-1). Modulo Addressing is
enabled for X data space when XWM is set to any value
other than ‘15’ and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM) to
which Modulo Addressing i s to be applied is stored in
MODCON<7:4>. Modulo Addressing is enabled for Y
data space when YWM is set to any value other than
‘15’ and the YMODEN bit is set at MODCON<14>.
FIGURE 4-7: MODULO ADDRESSING OPERATION EXAMPLE
Note: Y space Modulo Addressing EA
calculations assume word-sized data
(LSb of every EA is always clear).
0x1100
0x1163
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
Byte
Address
MOV #0x1100, W0
MOV W0, XMODSRT ;set modulo start address
MOV #0x1163, W0
MOV W0, MODEND ;set modulo end address
MOV #0x8001, W0
MOV W0, MODCON ;enable W1, X AGU for modulo
MOV #0x0000, W0 ;W0 holds buffer fill value
MOV #0x1110, W1 ;point W1 to buffer
DO AGAIN, #0x31 ;fill the 50 buffer locations
MOV W0, [W1++] ;fill the next location
AGAIN: INC W0, W0 ;increment the fill value
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 74 © 2008-2012 Microchip Technology Inc.
4.4.3 MODULO ADDRESSING
APPLICABILITY
Modulo Addressing can be applied to the Effective
Address (EA) calculation associated with any W
register. Address boundaries check for addresses
equal to:
The upper boundary addresses for incrementing
buffers
The lower bo undary addresses for decrementing
buffers
The address boundaries check for addresses less than
or greater than the upper (for incrementing buffers) and
lower (for decrementing buffers) boundary addresses
(not just equal to). Address changes can, therefore,
jump beyond boundaries and still be adjusted correctly.
4.5 Bit-Reversed Addressing
Bit-Reversed Addressing mode is intended to simplify
data re-ordering for radix-2 FFT algorithms. It is
supported by the X AGU for data writes only.
The modifier, which can be a constant value or register
contents, is regarded as having its bit order reversed. The
address source and destination are kep t in normal order.
Thus, the only operand requiring reversa l is the modifier.
4.5.1 BIT-REVERSED ADDRESSING
IMPLEMENTATION
Bit-Reversed Addressing mode is enabled in any of
these situations:
BWM bits (W register selection) in the MODCON
register are any value other th an 15 (the stack
cannot be accessed using Bit-Reversed
Addressing)
The BREN bit is set in the XBREV register
The addressing mode used is Register In direct
with Pre-Increment or Post-Increment
If the length of a bit-reversed buffer is M = 2N bytes,
the last ‘N’ bits of the data buffer start address must
be zeros.
XB<14:0> is the Bit-Reversed Address modifier, or
‘pivot point,’ which is typically a constant. In the case of
an FFT computation, its value is equal to half of the FFT
data buffer size.
When enabled, Bit-Reversed Addressing is executed
only for Register Indirect with Pre-Increment or Post-
Increment Addressing and word-sized data writes. It
will not function for any other addressing mode or for
byte-sized data, and normal addresses are generated
instead. When Bit-Reversed Addressing is active, the
W Address Pointer is always added to the address
modifier (XB), and the offset associated with the Regis-
ter Indirect Addressing mode is ignored. In addition, as
word-sized data is a requirement, the LSb of the EA is
ignored (and always clear).
If Bit-Reversed Addressing has already been enabled
by setting the BREN (XBREV<15>) bit, a write to the
XBREV register should not be immediately followed by
an indirect read operation using the W register that has
been designated as the Bit-Reversed Pointer.
Note: The modulo corrected effective address is
written back to the register only when Pre-
Modify or Post-Modify Addressing mode is
used to compute the effective address.
When an address offset (such as
[W7 + W2]) is used, Modulo Addressing
correction is performed but the contents of
the register remain unchanged.
Note: All bit-reversed EA calculations assume
word-sized data (LSb of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
Note: Modulo Addressing and Bit-Reversed
Addressing should not be enabled
together. If an application attempts to do
so, Bit-Reversed Addressing will assume
priority when active for the X WAGU and X
WAGU; Modulo Addressing will be dis-
abled. However, Modulo Addressing will
continue to function in the X RAGU.
© 2008-2012 Microchip Technology Inc. DS70318F-page 75
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 4-8: BIT-REVERSED ADDRESS EXAMPLE
TABLE 4-49: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)
Normal Address Bit-Reversed Address
A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal
0000 00000 0
0001 11000 8
0010 20100 4
0011 31100 12
0100 40010 2
0101 51010 10
0110 60110 6
0111 71110 14
1000 80001 1
1001 91001 9
1010 10 0101 5
1011 11 1101 13
1100 12 0011 3
1101 13 1011 11
1110 14 0111 7
1111 15 1111 15
b3 b2 b1 0
b2 b3 b4 0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
Bit-Reversed Address
XB = 0x0008 for a 16-Word Bit-Reversed Buffer
b7 b6 b5 b1
b7 b6 b5 b4
b11 b10 b9 b8
b11 b10 b9 b8
b15 b14 b13 b12
b15 b14 b13 b12
Sequential Address
Pivot Point
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 76 © 2008-2012 Microchip Technology Inc.
4.6 Interfacing Program and Data
Memory Spaces
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 architecture uses a 24-bit-wide program space and a
16-bit-wide data space. The architecture is also a
modified Harvard scheme, meaning that data can also be
present in the program space. To use this data
successfully, it must be accessed in a way th at preserves
the alignment of information in both spaces.
Aside from normal execution, the dsPIC33FJ06GS101/
X02 and dsPIC33FJ16GSX02/X04 architecture
provides two methods by which program space can be
accessed during operation:
Using table instructions to access individual bytes
or words anywhere in the program space
Remapping a portion of the program space into
the data space (Program Space Visibility)
Table instructions allow an appl ication to read or write
to small areas of the program memory. This capability
makes the method ideal for accessing data tables that
need to be updated periodically. It also allows access
to all bytes of the program word. The remapping
method allows an application to access a large block of
data on a read-only basis, which is ideal for look ups
from a large table of static data. The application can
only access the least significant word of the program
word.
4.6.1 ADDRESSING PROGRAM SPACE
Since the address ranges for the data and program
spaces are 16 and 24 bits, respectively, a method is
needed to create a 23-bit or 24-bit program address
from 16-bit data registers. The solution depends on the
interface method to be used.
For table operations, the 8-bit Table Page register
(TBLPAG) is used to define a 32K word region within
the program space. This is concatenated with a 16-bit
EA to arrive at a full 24-bit progra m space address. In
this format, the Most Significant bit of TBLPAG is used
to determine if the operation occurs in the user memory
(TBLPAG<7> = 0) or the configuration memory
(TBLPAG<7> = 1).
For remapping operations, the 8-bit Program Space
Visibility Register (PSVPAG) is used to define a
16K wo rd page in the progra m space. When the Most
Significant bit of the EA is ‘1’, PSVP AG is concatenated
with the lower 15 bits of the EA to form a 23-bit program
space address. Unlike table operations, this limits
remapping operations strictly to the user memory area.
Table 4-50 and Figure 4-9 show how the program EA is
created for table operations and remapping accesses
from the data EA. Here, P<23:0> refers to a program
space word, and D<15:0> refers to a data space word.
TABLE 4-50: PROGRAM SPACE ADDRESS CONSTRUCTION
Access Type Access
Space Program Space Address
<23> <22:16> <15> <14:1> <0>
Instruction Access
(Code Execution) User 0PC<22:1> 0
0xx xxxx xxxx xxxx xxxx xxx0
TBLRD/TBLWT
(Byte/Word Read/Write) User TBLPAG<7:0> Data EA<15:0>
0xxx xxxx xxxx xxxx xxxx xxxx
Configuration TBLPAG<7:0> Data EA<15:0>
1xxx xxxx xxxx xxxx xxxx xxxx
Program Space Visibility
(Block Remap/Read) User 0PSVPAG<7:0> Data EA<14:0>(1)
0 xxxx xxxx xxx xxxx xxxx xxxx
Note 1: Data EA<15> is always ‘1’ in this case, but is not used in calculating the program space address. Bit 15 of
the address is PSVPAG<0>.
© 2008-2012 Microchip Technology Inc. DS70318F-page 77
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 4-9: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
0Program Counter
23 bits
1
PSVPAG
8 bits
EA
15 bits
Program Counter(1)
Select
TBLPAG
8 bits
EA
16 bits
Byte Select
0
0
1/0
User/Configuration
Table Operations(2)
Program Space Visibility(1)
Space Select
24 bits
23 bits
(Remapping)
1/0
0
Note 1: The Least Significant b it (LSb) of program space addresses is alwa ys fixed as ‘0’ to maintain word
alignment of data in the program and data spaces.
2: Table operations are not required to be word-aligned. Table read operations are permitted in the
configuration memory space.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 78 © 2008-2012 Microchip Technology Inc.
4.6.2 DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
The TBLRDL and TBLWTL instructions offer a direct
method of reading or writing the lower word of any
address within the program space without going
through data space. The TBLRDH and TBLWTH
instructions are the only method to read or write the
upper 8 bits of a program space word as data.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two 16-bit
wide word address spaces, residing side by side, each
with the same address range. TBLRDL and TBLWTL
access the space that contains the least significant
data word. TBLRDH and TBLWTH access the space that
contains the upper data byte.
Two table instructions are provided to move byte or
word-sized (16-bit) data to and from program space.
Both function as either byte or word operati ons.
TBLRDL (Table Read Low):
- In Word mode, this instruction maps the
lower word of the program space location
(P<15:0>) to a data address (D<15:0>).
- In Byte mode, either the upper or lower byte
of the lower program word is mapped to the
lower byte of a data address. The upper byte
is selected when byte select is ‘1’; the lower
byte is selected when it is ‘0’.
TBLRDH (Table Read High):
- In Word mode, this instruction maps the entire
upper word of a program address (P<23:16>)
to a data address. Note that D<15:8>, the
‘phantom byte’, will always be ‘0’.
- In Byte mode, this instruction maps the upper
or lower byte of the program word to D<7:0>
of the data address, in the TBLRDL
instruction. The data is always ‘0’ when the
upper ‘phantom’ byte is selected (Byte
Select = 1).
Similarly, two table instructions, TBLWTH and TBLWTL,
are used to write individual bytes or words to a program
space address. The details of their operation are
explained in Section 5.0 “F lash Program Memory” .
For all table operations, the area of program memory
space to be accessed is determined by the Table Page
register (TBLPAG). TBLPAG covers the entire program
memory space of the device, including user and
configuration spaces. When TBLPAG<7> = 0, the table
page is located in the user memory space. When
TBLPAG<7> = 1, the page is located in configuration
space.
FIGURE 4-10: ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS
081623
00000000
00000000
00000000
00000000
‘Phantom’ Byte
TBLRDH.B (Wn<0> = 0)
TBLRDL.W
TBLRDL.B (Wn<0> = 1)
TBLRDL.B (Wn<0> = 0)
23 15 0
TBLPAG
02
0x000000
0x800000
0x020000
0x030000
Program Space
The address for the table operation is determined by th e data EA
within the page defined by the TBLPAG register.
Only read operations are shown; wr ite operations are also valid in
the user memory area.
© 2008-2012 Microchip Technology Inc. DS70318F-page 79
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
4.6.3 READING DATA FROM PROGRAM
MEMORY USING PROGRAM SPACE
VISIBILITY
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word page of the program space.
This option provides transparent access to stored
constant data from the data space without the need to
use special instructions (such as TBLRDL/H).
Program space access through the data space occurs
if the Most Significant bit of the data space EA is ‘1’ and
program space visibility is enabled by settin g the PSV
bit in the Core Control register (CORCON<2>). The
location of the program memory space to be mapped
into the data space is determined by the Program
Space Visibility Page register (PSVPAG). This 8-bit
register defines any one of 256 possible pages of
16K words in program space. In effect, PSVPAG
functions as the upper 8 bits of the program memory
address, with the 15 bits of the EA functioning as the
lower bits. By incrementing the PC by 2 for each
program memory word, the lower 15 bits of data space
addresses directly map to the lower 15 bits in the
corresponding program space addresses.
Data reads to this area add a cycle to the instruction
being executed, since two program memory fetches
are required.
Although each data space address 8000h and higher
maps directly into a corresponding program memory
address (see Figure 4-11), only the lower 16 bits of the
24-bit program word are used to contain the data. The
upper 8 bits of any program space location used as
data should be programmed with ‘1111 1111’ or
0000 0000’ to force a NOP. This prevents possible
issues should the area of code ever be accidentally
executed.
For operations that use PSV and are executed outside
a REPEAT loop, the MOV and MOV.D instructions require
one instruction cycle in addition to the specified
execution time. All other instructions require two
instruction cycles in addition to the specified execution
time.
For operations that use PSV, and are executed insi de
a REPEAT loop, these instances require two instruction
cycles in addition to the specified execution time of the
instruction:
Execution in the first iteration
Execution in the last iteration
Execution prior to exiting the loop due to an
interrupt
Execution upon re-entering the loop after an
interrupt is serviced
Any other iteration of the REPEAT loop will allow the
instruction using PSV to access data, to execute in a
single cycle.
FIGURE 4-11: PROGRAM SPACE VISIBILITY OPERATION
Note: PSV access is temporarily disabled during
table reads/writes.
23 15 0
PSVPAG Data Space
Program Space
0x0000
0x8000
0xFFFF
02 0x000000
0x800000
0x010000
0x018000
When CORCON<2> = 1 and EA<15> = 1:
The data in the page
designated by
PSVPAG is mapped
into the upper half of
the data memory
space...
Data EA<14:0>
...while the lower 15 bits
of the EA specify an
exact address within
the PSV area. This
corresponds exactly to
the same lower 15 bits
of the actual program
space address.
PSV Area
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 80 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 81
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
5.0 FLASH PROGRAM MEMORY
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices contain internal Flash program memory for
storing and executing application code. The memory is
readable, writable and erasable during norma l operation
over the entire VDD range.
Flash memory can be pro grammed in two w ays :
In-Circuit Serial Progra mming™ (ICSP™)
programming capability
Run-Time Self-Programming (RTSP)
ICSP allows a dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 device to be serially
programmed while in the end application circuit. This is
done with two lines for programming clock and
programming data (one of the alternate programming
pin pairs: PGECx/PGEDx, and three other lines for
power (VDD), ground (VSS) and Master Clear (MCLR).
This allows customers to manufacture boards with
unprogrammed devices and then program the digital
signal controller just before shipping the product. T his
also allows the most recent firmware or a custom
firmware to be programmed.
RTSP is accomplished using TBLRD (table read) and
TBLWT (table write) instructions. With RTSP, the user
application can write program memory data, either in
blocks or ‘rows’ of 64 instructions (192 bytes) at a time,
or a single program memory word , and erase p rogram
memory in blocks or ‘pages’ of 512 instructions
(1536 bytes) at a time.
5.1 Table Instructions and Flash
Programming
Regardless of the method used, all programming of
Flash memory is done with the table read and table
write instructions. These allow direct read and write
access to the program memory space from the data
memory while the devi ce is in no rmal operating mode.
The 24-bit target address in the program memory is
formed using bits<7:0> of the TBLPAG register and the
Effective Address (EA) from a W register specified in
the table instruction, as shown in Figure 5-1.
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
both Word and Byte modes.
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of program memory. TBLRDH
and TBLWTH can also access program memory in Word
or Byte mode.
FIGURE 5-1: ADDRESSING FOR TABLE REGISTERS
Note 1: This data sheet summarizes the fea-
tures of the dsPIC33FJ06GS101/X02
and dsPIC33FJ16GSX02/X04 families
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 5. “Flash
Programming” (DS70191) in the
dsPIC33F/PIC24H Family Reference
Manual”, which is available from the
Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
0
Program Counter
24 bits
Program Counter
TBLPAG Reg
8 bits
Working Reg EA
16 bits
Byte
24-bit EA
0
1/0
Select
Using
Table Instruction
Using
User/Configuration
Space Select
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 82 © 2008-2012 Microchip Technology Inc.
5.2 RTSP Operation
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 Flash program memory array is organized into rows
of 64 instructions or 192 bytes. RTSP allows the user
application to erase a page of memory, which consists of
eight rows (512 instructions) at a time, and to program
one row or one word at a time. Table 24-12 shows typical
erase and programming times. The 8-row erase pages
and single row write rows are edge-aligned from the
beginning of program memory, on boundaries of
1536 bytes and 192 bytes, respectively.
The program memory implements holding buffers that
can contain 64 instructions of programming data. Prior
to the actual programming operation, the write data
must be loaded into the buffers sequentially. The
instruction words loaded must always be from a group
of 64 boundary.
The basic sequence for RTSP programming is to set up
a Table Pointer, then do a series of TBLWT instructions
to load the buffers. Programming is performed by
setting the control bits in the NVMCON register. A total
of 64 TBLWTL and TBLWTH instructio ns are required
to load the instructions.
All of the table write operat ions are single-word writes
(two instruction cycles) because only the buffers are
written. A programming cycle is required for
programming each row.
5.3 Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. The processor stalls (waits) until the
programming operation is finishe d.
The programming ti me depends on the FRC accuracy
(see Table 24-20) and the value of the FRC Oscillator
Tuning register (see Register 8-4). Use the following
formula to calculate the minimum and maximum values
for the Row Write Time, Page Erase Time, and Word
Write Cycle Time parameters (see Table 24-12).
EQUATION 5-1: PROGRAMMING TIME
For example, if the device is operating at +125°C, the
FRC accuracy will be ±5%. If the TUN<5:0> bits (see
Register 8-4) are set to ‘b111111, the minimum row
write time is equal to Equation 5-2.
EQUATION 5-2: MINIMUM ROW WRITE
TIME
The maximum row write time is equal to Equation 5-3.
EQUATION 5-3: MAXIMUM ROW WRITE
TIME
Setting the WR bit (NVMCON<15>) starts the opera-
tion, and the WR bit is automatically cleared when the
operation is finished.
5.4 Control Registers
Two SFRs are used to read and write the program
Flash memory: NVMCON and NVMKEY.
The NVMCON register (Register 5-1) controls which
blocks are to be erased, which memory type is to be
programmed and the start of the programming cycle.
NVMKEY is a write-only register that is used for write
protection. To start a programming or erase sequence,
the user application must consecutively write 0x55 and
0xAA to the NVMKEY register. Refer to Section 5.3
“Programming Operations” for further details.
T
7.37 MHz FRC Accuracy()%FRC Tuning()%××
--------------------------------------------------------------------------------------------------------------------------
TRW 11064 Cycles
7.37 MHz 10.05+()1 0.00375()××
---------------------------------------------------------------------------------------------- 1.435ms==
TRW 11064 Cycles
7.37 MHz 10.05()1 0.00375()××
----------------------------------------------------------------------------------------------1.586ms==
© 2008-2012 Microchip Technology Inc. DS70318F-page 83
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 5-1: NVMCON: FLASH MEMORY CONTROL REGISTER
R/SO-0(1) R/W-0(1) R/W-0(1) U-0 U-0 U-0 U-0 U-0
WR WREN WRERR
bit 15 bit 8
U-0 R/W-0(1) U-0 U-0 R/W-0(1) R/W-0(1) R/W-0(1) R/W-0(1)
ERASE —NVMOP<3:0>
(2)
bit 7 bit 0
Legend: SO = Settable Only bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 WR: Write Control bit
1 = Initiate s a Flash memory program or erase operation. The operation is self-timed and the bit i s
cleared by hardware once operation is complete.
0 = Program or erase operation is complete and inactive
bit 14 WREN: Write Enable bit
1 = Enable Flash pro gram/erase operations
0 = Inhibit Flash program/erase operations
bit 13 WRERR: Write Sequence Error Flag bit
1 = An improper program or erase sequence attempt or termination has occurred (bit is set
automatically on any set attemp t of the WR bit)
0 = The program or erase operation completed normally
bit 12-7 Unimplemented: Read as ‘0
bit 6 ERASE: Erase/Program Enable bit
1 = Perform the erase opera tion specified by NVMOP<3:0> on the next WR command
0 = Perform the program opera tion specified by NVMOP<3:0> on the next WR command
bit 5-4 Unimplemented: Read as ‘0
bit 3-0 NVMOP<3:0>: NVM Operation Select bits(2)
If ERASE = 1:
1111 = Memory bulk erase operation
1101 = Erase general segment
0011 = No operation
0010 = Memory page erase operation
0001 = No operation
0000 = Erase a single Configuration register byte
If ERASE = 0:
1111 = No operation
1101 = No operation
0011 = Memory word program operation
0010 = No operation
0001 = Memory row program operation
0000 = Program a single Configuration register byte
Note 1: These bits can only be Reset on POR.
2: All other combinations of NVMOP<3:0> are unimplemented.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 84 © 2008-2012 Microchip Technology Inc.
REGISTER 5-2: NVMKEY: NONVOLATILE MEMORY KEY REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0
NVMKEY<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0
bit 7-0 NVMKEY<7:0>: Key Register bits (write-only)
© 2008-2012 Microchip Technology Inc. DS70318F-page 85
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
5.4.1 PROGRAMMING ALGORITHM FOR
FLASH PROGRAM MEMORY
One row of program Flash memory can be
programmed at a time. To achieve this, it is necessary
to erase the 8-row erase page that contains the desired
row. The general process is:
1. Read eight rows of program memory
(512 in structions) and store in data RAM.
2. Update the program data in RAM with the desire d
new data.
3. Erase the block (see Example 5-1):
a) Set the NVMOP<3:0> bits (NVMCON<3:0>)
to ‘0010’ to configure for block erase. Set the
ERASE (NVMCON<6>) and WREN
(NVMCON<14>) bits.
b) Write the starting address of the page to be
erased into the TBLPAG and W registers.
c) Write 0x55 to NV MKEY.
d) Write 0x AA to NVMKEY.
e) Set the WR bit (NVMCON<15>). The erase
cycle begins and the CPU stalls for the duration
of the erase cycle. When the erase is done, the
WR bit is cleared automatically.
4. Write the first 64 instructions from data RAM into
the program memory buffers (see Example 5-2).
5. Write the progra m bl o ck to Fl ash memory:
a) Set the NVMOP<3:0> bits to ‘0001’ to
configure for row programming. Clear the
ERASE bit and set the WREN bit.
b) Write 0x55 to the NVMKEY register.
c) Write 0xAA to the NVMKEY register.
d) Set the WR bit. The programming cycle begins
and the CPU stalls for the duration of the write
cycle. When the write to Flash memory is done,
the WR bit is cleared automatically.
6. Repeat steps 4 and 5, using the next availa ble 64
instructions from the block in data RAM by incre-
menting the value in the TBLPAG register, until all
512 instructions are written back to Flash memory.
For protection against accidental operations, the write
initiate sequence for the NVMKEY register must be
used to allow any erase or program operation to
proceed. After the programming command has been
executed, the user application must wait for the pro-
gramming time until programming is complete. The two
instructions following the start of the programming
sequence should be NOPs, as shown in Example 5-3.
EXAMPLE 5-1: ERASING A PROGRAM MEMORY PAGE
; Set up NVMCON for block erase operation
MOV #0x4042, W0 ;
MOV W0, NVMCON ; Initialize NVMCON
; Init pointer to row to be ERASED
MOV #tblpage(PROG_ADDR), W0 ;
MOV W0, TBLPAG ; Initialize PM Page Boundary SFR
MOV #tbloffset(PROG_ADDR), W0 ; Initialize in-page EA[15:0] pointer
TBLWTL W0, [W0] ; Set base address of erase block
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55, W0
MOV W0, NVMKEY ; Write the 55 key
MOV #0xAA, W1 ;
MOV W1, NVMKEY ; Write the AA key
BSET NVMCON, #WR ; Start the erase sequence
NOP ; Insert two NOPs after the erase
NOP ; command is asserted
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 86 © 2008-2012 Microchip Technology Inc.
EXAMPLE 5-2: LOADING THE WR ITE BUFFERS
EXAMPLE 5-3: INITIATING A PROGRAMMING SEQUENCE
; Set up NVMCON for row programming operations
MOV #0x4001, W0 ;
MOV W0, NVMCON ; Initialize NVMCON
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV #0x0000, W0 ;
MOV W0, TBLPAG ; Initialize PM Page Boundary SFR
MOV #0x6000, W0 ; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV #LOW_WORD_0, W2 ;
MOV #HIGH_BYTE_0, W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
; 1st_program_word
MOV #LOW_WORD_1, W2 ;
MOV #HIGH_BYTE_1, W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
; 2nd_program_word
MOV #LOW_WORD_2, W2 ;
MOV #HIGH_BYTE_2, W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
; 63rd_program_word
MOV #LOW_WORD_31, W2 ;
MOV #HIGH_BYTE_31, W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55, W0
MOV W0, NVMKEY ; Write the 55 key
MOV #0xAA, W1 ;
MOV W1, NVMKEY ; Write the AA key
BSET NVMCON, #WR ; Start the erase sequence
NOP ; Insert two NOPs after the
NOP ; erase command is asserted
© 2008-2012 Microchip Technology Inc. DS70318F-page 87
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
6.0 RESETS
The Reset module combines all Reset sources and
controls the device Master Reset Signal, SYSRST. The
following is a list of device Reset sources:
POR: Power-on Reset
BOR: Brown-out Reset
•MCLR
: Master Clear Pin Reset
•SWR: Software RESET Instruction
WDTO: Watchdog Timer Reset
CM: Configuration Mismatch Reset
TRAPR: Trap Conflict Reset
IOPUWR: Illegal Condition Device Reset
- Illegal Opco de Reset
- Uninitialized W Register Reset
- Security Reset
A simplified block diagram of the Reset module is
shown in Figure 6-1.
Any active source of reset will make the SYSRST
signal active. On system Reset, some of the registers
associated with the CPU a nd pe ripherals a re fo rced to
a known Reset state and some are unaffected.
All types of device Reset sets a corresponding status
bit in the RCON register to indicate the type of Reset
(see Register 6-1).
A POR clears all the bits, except for the POR bit
(RCON<0>), that are set. The user appl ication can set
or clear any bit at any time during code execution. The
RCON bits only serve as status bits. Setting a p articular
Reset status bit in software does not cause a device
Reset to occur.
The RCON register also has other bits associated with
the Watchdog Timer and device power-saving states.
The function of these bits is discussed in other sections
of this manual.
FIGURE 6-1: RESET SYSTEM BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 8. “Reset”
(DS70192) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: Refer to the specific perip heral section or
Section 3.0 “CPU” of this data sheet for
register Reset states.
Note: The status bits in the RCON register
should be cleared after they are read so
that the next RCON register value after a
device Reset is mean i n gful.
MCLR
VDD
Internal
Regulator BOR
Sleep or Idle
RESET Instruction
WDT
Module
Glitch Filter
Trap Conflict
Illegal Opcode
Uninitialized W Register
SYSRST
VDD Rise
Detect POR
Configuration Mismatch
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 88 © 2008-2012 Microchip Technology Inc.
REGISTER 6-1: RCON: RESET CONTROL REGISTER(1)
R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
TRAPR IOPUWR —CMVREGS
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1
EXTR SWR SWDTEN(2) WDTO SLEEP IDLE BOR POR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 TRAPR: Trap Reset Flag bit
1 = A Trap Conflict Reset has occurred
0 = A Trap Conflict Reset has not occurred
bit 14 IOPUWR: Illegal Opcode or Uninitialized W Access Rese t Flag bit
1 = An illegal opcode detection, an illegal address mode or uninitialized W register used as an
Address Pointer caused a Reset
0 = An illegal opcode or uninitialized W Reset has not occurred
bit 13-10 Unimplemented: Read as ‘0
bit 9 CM: Configuration Mismatch Flag bit
1 = A Configuration Mismatch Reset has occurred
0 = A Configurat io n Misma tch Reset has NOT occurred
bit 8 VREGS: Voltage Regulator Standby During Sleep bit
1 = Voltage regulator is active during Sleep
0 = Voltage regulator goes into Standby mode during Sleep
bit 7 EXTR: External Reset Pin (MCLR) bit
1 = A Master Clear (pin) Reset has occurred
0 = A Master Clear (pin) Reset has not occurred
bit 6 SWR: Software Reset Flag (Instruction) bit
1 = A RESET instruction has been executed
0 = A RESET instruction has not been executed
bit 5 SWDTEN: Software Enable/Disable of WDT bit(2)
1 = WDT is enabled
0 = WDT is disabled
bit 4 WDTO: Watch dog Timer Time-out Flag bi t
1 = WDT time-out has occurred
0 = WDT time-out has not occurred
bit 3 SLEEP: Wake-up from Sleep Flag bit
1 = Device has been in Sleep mode
0 = Device has not been in Sleep mode
bit 2 IDLE: Wake-up from Idle Flag bit
1 = Device was in Idle mode
0 = Device was not in Idle mode
Note 1: All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not
cause a device Reset.
2: If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enab led, regardless of the
SWDTEN bit setting.
© 2008-2012 Microchip Technology Inc. DS70318F-page 89
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 1 BOR: Brown-out Reset Flag bit
1 = A Brown-out Reset has occurred
0 = A Brown-out Reset has not occurred
bit 0 POR: Power-on Reset Flag bit
1 = A Power-up Reset has occurred
0 = A Power-up Reset has not occurred
REGISTER 6-1: RCON: RESET CONTROL REGISTER(1) (CONTINUED)
Note 1: All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not
cause a device Reset.
2: If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the
SWDTEN bit setting.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 90 © 2008-2012 Microchip Technology Inc.
6.1 System Reset
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 families of devices have two types o f Reset:
Cold Reset
Warm Reset
A cold Reset is the result of a Power-on Reset (POR)
or a Brown-out Reset (BOR). On a cold Reset, the
FNOSC Configuration bits in the FOSC Configuration
register select the device clock source.
A warm Reset is the result of all the other Reset
sources, including the RESET instruction. On warm
Reset, the device will continue to operate from the
current clock source as indicated by the Current
Oscillator Selection (COSC<2:0>) bi ts in the Oscillator
Control (OSCCON<14:12>) register.
The device is kept in a Reset state until the system
power supplies have stabilized at appropriate levels
and the oscillator clock is ready. The sequence in
which this occurs is detailed in Figure 6-2.
TABLE 6-1: OSCILLATOR DELAY
Oscillator Mode Oscillator
Startup Delay Oscillator
Startup Timer PLL Lock Time Total Delay
FRC, FRCDIV16, FRCDIVN TOSCD(1) ——TOSCD(1)
FRCPLL TOSCD(1) —TLOCK(3) TOSCD + TLOCK(1,3)
XT TOSCD(1) TOST(2) —TOSCD + TOST(1,2)
HS TOSCD(1) TOST(2) —TOSCD + TOST(1,2)
EC ————
XTPLL TOSCD(1) TOST(2) TLOCK(3) TOSCD + TOST +
TLOCK(1,2,3)
HSPLL TOSCD(1) TOST(2) TLOCK(3) TOSCD + TOST +
TLOCK(1,2,3)
ECPLL TLOCK(3) TLOCK(3)
LPRC TOSCD(1) ——TOSCD(1)
Note 1: TOSCD = Oscillator start-up delay (1.1 μs max for FRC, 70 μs max for LPRC). Crystal oscillator start-up
times vary with crystal characteristics, load capacitance, etc.
2: TOST = Oscillator start-up timer delay (1024 oscillator clock period). For example, TOST = 102.4 μs for a
10 MHz crystal and TOST = 32 ms for a 32 kHz crystal.
3: TLOCK = PLL lock time (1.5 ms nominal) if PLL is enabled.
© 2008-2012 Microchip Technology Inc. DS70318F-page 91
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 6-2: SYSTEM RESET TIMING
Reset Run
Device Status
VDD
VPOR
VBOR
POR Reset
BOR Reset
SYSRST
TPWRT
TPOR
TBOR
Oscillator Clock
TOSCD TOST TLOCK
Time
FSCM TFSCM
1
23
4
5
6
Note 1 : PO R Reset: A POR circuit holds the device in Reset when the power supply is turned on. The POR circuit is active
until VDD crosses the VPOR threshold and the delay, TPOR, has elapsed.
2: B OR Reset: The on-chip voltage regulator has a BOR circuit that keeps the device in Reset until VDD crosses the
VBOR threshold and the delay, TBOR, has elapsed. The delay, TBOR, ensures the voltage regulator output becomes
stable.
3: PWRT Timer: The programmable power-up timer continues to hold the processor in Reset for a specific period of
time (TPWRT) after a BOR. The delay, TPWRT, ensures that the system power supplies have stabil ized at the appro-
priate level for full-speed operation. After the delay, TPWRT has elapsed and the SYSRST becomes inactive, which in
turn, enables the selected oscillator to start generating clock cycles.
4: Oscilla tor Delay: The total delay for the clock to be ready for various clock source selections is given in Table 6-1.
Refer to Section 8.0 “Oscillator Configuration” for more information.
5: When the oscillator clock is ready, the processor begins execution from location 0x000000. The user application
programs a GOTO instruction at the Reset address, which redirects program execution to the appropriate start-up
routine.
6: If the Fail-Safe Clock Monitor (FSCM) is enabled, it begins to monitor the system clock when the system clock is ready
and the delay, TFSCM, has elapsed.
TABLE 6-2: OSCILLATOR DELAY
Symbol Parameter Value
VPOR POR threshold 1.8V nominal
TPOR POR extension time 30 μs maximum
VBOR BOR threshold 2.5V nominal
TBOR BOR extension time 100 μs maximum
TPWRT Programmable
power-up time delay 0-128 ms nominal
TFSCM Fail-Safe Clock Monitor
delay 900 μs maximum
Note: When the device exits the Reset
condition (begins normal operation), the
device operating parameters (voltage,
frequency, temperature, etc.) must be
within their operating ranges; otherwise,
the device may not function correctly.
The user application must ensure that
the delay between the time power is first
applied, and the time SYSRST becomes
inactive, is long enough to get all
operating p arame ters within specification.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 92 © 2008-2012 Microchip Technology Inc.
6.2 Power-on Reset (POR)
A Power-on Reset (POR) circuit ensures the device is
reset from power-on. The POR circuit is active until
VDD crosses the VPOR threshold and the delay, T POR,
has elapsed. The delay, TPOR, ensures the internal
device bias circuits become stable.
The device supply voltage characteristics must meet
the specified starting voltage and rise rate
requirements to generate the POR. Refer to
Section 24.0 “Electrical Characteristics for details.
The POR status (POR) bit in the Reset Control
(RCON<0>) register is set to indicate the Power-on
Reset.
6.2.1 Brown-out Reset (BOR) and
Power-up Timer (PWRT)
The on-chip regulator has a Brown-out Reset (BOR)
circuit that resets the device when the VDD is too low
(VDD < VBOR) for proper device operation. The BOR
circuit keeps the device in Reset until VDD crosses the
VBOR threshold and the delay, TBOR, has elapsed. The
delay, TBOR, ensures the voltage regulator output
becomes stable.
The BOR status (BOR) bit in the Reset Control
(RCON<1>) register is set to indicate the Brown-out
Reset.
The device will not run at full speed after a BOR as the
VDD should rise to acceptable levels for full-speed
operation. The PWRT provides power-up time delay
(TPWRT) to ensure that the system power supplies have
stabilized at the appropriate levels for full-speed
operation before the SYSRST is released.
The power-up timer delay (TPWRT) is programmed by
the Power-on Reset Timer Value Select
(FPWRT<2:0>) bits in the POR Configuration
(FPOR<2:0>) register, which provides eight settings
(from 0 ms to 128 ms). Refer to Section 21.0 “S pecial
Features” for further details.
Figure 6-3 shows the typical brown-out scenarios. The
reset delay (TBOR + TPWRT) is initiated each time VDD
rises above the VBOR trip point.
FIGURE 6-3: BROWN-OUT SITUATIONS
VDD
SYSRST
VBOR
VDD
SYSRST
VBOR
VDD
SYSRST
VBOR
TBOR + TPWRT
VDD dips before PWRT expires
TBOR + TPWRT
TBOR + TPWRT
© 2008-2012 Microchip Technology Inc. DS70318F-page 93
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
6.3 External Reset (EXTR)
The external Reset i s generated by driving the MCLR
pin low . The MCLR pin is a Schmitt trigger input with an
additional glitch filter . Reset pulses that are longer than
the minimum pulse width will generate a Re set. Refer
to Section 24.0 “Electrical Characteristics” for
minimum pulse width specifications. The external
Reset (MCLR) pin (EXTR) bit in the Reset Control
(RCON) register is set to indicate the MCLR Reset.
6.3.0.1 EXTERNAL SUPERVISORY
CIRCUIT
Many systems have external supervisory circuits that
generate Reset signa ls to reset multiple de vices in the
system. This external Reset signal can be directly
connected to the MCLR pin to reset the device when
the rest of system is reset.
6.3.0.2 INTERNAL SUPERVISORY CIRCUIT
When using the internal power supervisory circuit to
reset the device, the external Reset pin (MCLR) should
be tied directly or resistively to VDD. In this case, the
MCLR pin will not be used to generate a Reset. The
external Reset pin (MCLR) does not have an internal
pull-up and must not be left unconnected.
6.4 Software RESET Instruction (SWR)
Whenever the RESET instruction is executed, the
device will assert SYSRST, placing the device in a
special Reset state. This Reset state will not
re-initialize the clock. The clock source in effect prior to
the RESET instruction will remain. SYSRST is released
at the next instruction cycle and the Reset vector fetch
will commence.
The Software Reset (SWR) flag (instruction) in the
Reset Control (RCON<6>) register is set to indicate
the software Reset.
6.5 Watchdog Time-out Reset (WDTO)
Whenever a Watchdog time-out occurs, the device will
asynchronously assert SYSRST. The clock source will
remain unchanged. A WDT time-out during Sleep or
Idle mode will wake-up the processor , but will not reset
the processor.
The Watchdog Timer Time-out (WDTO) flag in the
Reset Control (RCON<4>) register is set to indicate
the Watchdog Reset. Refer to Section 21.4
“Watchdog Timer (WDT)” for more information on
Watchdog Reset.
6.6 Trap Conflict Reset
If a lower priority hard trap occurs while a higher
priority trap is being processed, a hard Trap Conflict
Reset occurs. The hard traps include exceptions of pri-
ority level 13 through level 15, inclusive. The address
error (level 13) and oscillator error (level 14) traps fall
into this category.
The Trap Reset (TRAPR) flag in the Reset Control
(RCON<15>) register is set to indicate the T rap Conflict
Reset. Refer to Section 7.0 “Interrupt Controller” for
more information on Trap Conflict Resets.
6.7 Configuration Mismatch Reset
To maintain the integrity of the Peripheral Pin Select
Control registers, they are constantly monitored with
shadow registers in hardware. If an unexpected
change in any of the registers occur (such as cell
disturbances caused by ESD or other external events),
a Configuration Mismatch Reset occurs.
The Configuration Mismatch (CM) flag in the Reset
Control (RCON<9>) register is set to indicate the
Configuration Mismatch Reset. Refer to Section 10.0
“I/O Ports” for more information on the
Configuration Mismatch Reset.
6.8 Illegal Condition Device Reset
An illegal condition device Reset occurs due to the
following sources:
Illeg al Opcode Reset
Uninitial ized W Register Reset
Security Reset
The Illegal Opcode or Uninitialized W Access Reset
(IOPUWR) flag in the Reset Control (RCON<14>)
register is set to indicate the illegal condition device
Reset.
6.8.1 ILLEGAL OPCODE RESET
A device Reset is generated if the device attempts to
execute an illegal opcode value that is fetched from
program memory.
The Illegal Opcode Reset function can prevent the
device from executing program memory sections that
are used to store constant data. To take advantage of
the Illegal Opcode Reset, use only the lower 16 bits of
each program memory section to store the data values.
The upper 8 bits should be programmed with 3Fh,
which is an illegal opcode value.
Note: The Configuration Mismatch Reset
feature and associated Reset fla g are not
available on all devices.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 94 © 2008-2012 Microchip Technology Inc.
6.8.2 UNINITIALIZED W REGISTER
RESET
Any attempt to use the uninitialized W register as an
Address Pointer will Reset the device. The W register
array (with the exception o f W15) is cleared during all
Resets and is considered uninitialized until written to.
6.8.3 SECURITY RESET
If a Program Flow Change (PFC) or Vector Flow
Change (VFC) targets a restricted location in a
protected segment (boot and secure segment), that
operation will cause a Security Reset.
The PFC occurs when the program counter is reloaded
as a result of a call, jump, computed jump, return,
return from subroutine or other form of branch
instruction.
The VFC occurs when the program counter is reloaded
with an interrupt or trap vector.
Refer to Section 21.8 “Code Protection and
CodeGuard™ Security” for more information on
Security Reset.
6.9 Using the RCON Status Bits
The user application can read the Reset Control
(RCON) register after any device Reset to determine
the cause of the Reset.
Table 6-3 provides a summary of the Reset flag bit
operation.
TABLE 6-3: RESET FLAG BIT OPERATION
Note: The status bits in the RCON register
should be cleared after they are read so
that the next RCON reg ister value after a
device Reset will be meaningful.
Flag Bit Set by: Cleared by:
TRAPR (RCON<15>) Trap conflict event POR,BOR
IOPWR (RCON<14>) Illegal opcode or uniniti alized W register
access or Security Reset POR,BOR
CM (RCON<9>) Configuration Mismatch POR,BOR
EXTR (RCON<7>) MCLR Reset POR
SWR (RCON<6>) RESET instruction POR,BOR
WDTO (RCON<4>) WDT time-out PWRSAV instruction, CLRWDT instruction,
POR,BOR
SLEEP (RCON<3>) PWRSAV #SLEEP instruction POR,BOR
IDLE (RCON<2>) PWRSAV #IDLE instruction POR,BOR
BOR (RCON<1>) POR, BOR
POR (RCON<0>) POR
Note: All Reset flag bits can be set or cleared by user software.
© 2008-2012 Microchip Technology Inc. DS70318F-page 95
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
7.0 INTERRUPT CONTROLLER
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 interrupt contro ller reduces the numerous peri pheral
interrupt request signals to a single interrupt request
signal to the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 CPU. It has the following
features:
Up to eight proce ssor exceptions and software
traps
Seven user-selectable priority levels
Interrupt Vector Table (IVT) with up to 118 vectors
A unique vector for each interrupt or exception
source
Fixed priority within a specified user priority level
Alternate Interrupt Vector Table (AIVT) for debug
support
Fixed interrupt entry and return latencies
7.1 Interrupt Vector Table
The Interrupt Vector Table (IVT) is shown in Figure 7-1.
The IVT resides in program memory, starting at locati on
000004h. The IVT contains 126 vectors, consisting of
eight nonmaskable trap vectors, plus up to 118 sources
of interrupt. In general, each interrupt source has its ow n
vector. Each interrupt vector contains a 24-bit-wide
address. The value programmed into each interrupt
vector location is the starting address of the associated
Interrupt Service Routine (ISR).
Interrupt vectors are prioritized in terms of their natural
priority. This priority is linked to their position in the
vector table. Lower addresses generally have a higher
natural priority. For example, the interrupt associated
with vector 0 will take priority over interrupts at any
other vector address.
The
ds
PIC33FJ06GS101/X02 and dsPIC33FJ16 GSX02/
X04 devices implement up to 35 unique interrupts and
4 non-maskable traps. These are summarized in
Table 7-1.
7.1.1 ALTERNATE INTERRUPT VECTOR
TABLE
The Alternate Interrupt Vector Table (AIVT) is located
after the IVT, as shown in Figure 7-1. Access to the
AIVT is provided by the ALTIVT control bit
(INTCON2<15>). If the ALTIVT bit is set, all interrupt
and exception processes use the alternate vectors
instead of the default vectors. The alternate vectors are
organized in the same manner as the default vectors.
The AIVT supports debugging by providing a means to
switch between an application and a support
environment without requiring the interrupt vectors to
be reprogrammed. This feature also enables switching
between applications for evaluation of different
software algorithms at run time. If the AIVT is not
needed, the AIVT should be programmed with the
same addresses used in the IVT.
7.2 Reset Sequence
A device Reset is not a true exception because the
interrupt controller is not involved in the Reset process.
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 device clears its registers in response to a Reset,
which forces the PC to zero. The digi tal signal controller
then begins program execution at loca tion 0x000 00 0. A
GOTO instruction at the Reset address can redirect
program execution to the appropriate start-up routine.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 41. “Interrupts
(Part IV)” (DS70300) in the “dsPIC33F/
PIC24H Family Reference Manual,
which is available on the Microchip web
site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: Any unimplemented or unused vector
locations in the IVT and AIVT should be
programmed with the address of a default
interrupt handler routine that contains a
RESET instruction.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 96 © 2008-2012 Microchip Technology Inc.
FIGURE 7-1: dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 INTERRUPT VECTOR
TABLE
Reset – GOTO Instruction 0x000000
Reset – GOTO Address 0x000002
Reserved 0x000004
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved
Reserved
Reserved
Interrupt Vector 0 0x000014
Interrupt Vector 1
~
~
~
Interrupt Vector 52 0x00007C
Interrupt Vector 53 0x00007E
Interrupt Vector 54 0x000080
~
~
~
Interrupt Vector 116 0x0000FC
Interrupt Vector 117 0x0000FE
Reserved 0x000100
Reserved 0x000102
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved
Reserved
Reserved
Interrupt Vector 0 0x000114
Interrupt Vector 1
~
~
~
Interrupt Vector 52 0x00017C
Interrupt Vector 53 0x00017E
Interrupt Vector 54 0x000180
~
~
~
Interrupt Vector 116
Interrupt Vector 117 0x0001FE
Start of Code 0x000200
Decreasing Natural Order Priority
Interrupt Vector Table (IVT)(1)
Alternate Interrupt Vector Table (AIVT)(1)
Note 1: See Table 7-1 for the list of implemented interrupt vectors.
© 2008-2012 Microchip Technology Inc. DS70318F-page 97
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 7-1: INTERRUPT VECTORS
Vector
Number
Interrupt
Request
(IQR) IVT Address AIVT Address Interrupt Source
Highest Natural Order Priority
8 0 0x000014 0x000114 INT0 – External Interrupt 0
9 1 0x000016 0x000116 IC1 – Input Capture 1
10 2 0x000018 0x000118 OC1 – Output Compare 1
11 3 0x00001A 0x00011A T1 – Timer1
12 40x00001C 0x00011C Reserved
13 5 0x00001E 0x00011E IC2 – Input Capture 2
14 6 0x000020 0x000120 OC2 – Output Compare 2
15 7 0x000 022 0x000122 T2 – Timer2
16 8 0x000 024 0x000124 T3 – Timer3
17 9 0x000026 0x000126 SPI1E – SPI1 Fault
18 10 0x000 028 0x000128 SPI1 – SPI1 Tran sfer Done
19 11 0x0 0002A 0x00012A U1RX – UART1 Receiver
20 12 0x00002C 0x00012C U1T X – UART1 Transmitter
21 13 0x00002E 0x00012E ADC ADC Group Convert Done
22-23 14-15 0x000030-0x000032 0x000130-0x000132 Reserved
24 16 0x000034 0x000134 SI2C1 – I2C1 Slave Event
25 17 0x000036 0x000136 MI2C1 – I2C1 Master Event
26 18 0x000038 0x000138 CMP1 – Analog Comparator 1 Interrupt
27 19 0x00003A 0x00013A CN – Input Change Notification Interrupt
28 20 0x00003C 0x00013C INT1 – External Interrupt 1
29-36 21-28 0x00003E-0x00004C 0x00013E-0x00014C Reserved
37 29 0x00004E 0x00014E INT2 – External Interru pt 2
38-64 30-56 0x000050-0x000084 0x000150-0x000184 Reserved
65 57 0x000086 0x000186 PWM PSEM Special Event Match
66-72 58-64 0x000088-0x000094 0x000188-0x000194 Reserved
73 65 0x000096 0x000196 U1E – UART1 Error Interrupt
74-101 66-93 0x000098-0x0000CE 0x000198-0x0001CE Reserved
102 94 0x0000D0 0x0001D0 PWM1 – PWM1 Interrupt
103 95 0x0000D2 0x0001D2 PWM2 – PWM2 Interrupt
104 96 0x0000D4 0x0001D4 PWM3 – PWM3 Interrupt
105 97 0x0000D6 0x0001D6 PWM4 – PWM4 Interrupt
106-110 98-102 0x0000D8-0x0000E0 0x0001D8-0x0001E0 Reserved
111 103 0x0000E2 0x00001E2 CMP2 – Analog Comparator 2
112 104 0x0000E4 0x0001E4 CMP3 – Analog Comparator 3
113 105 0x0000E6 0x0001E6 CMP4 – Analog Comparator 4
114-117 106-109 0x0000E8-0x0000EE 0x0001E8-0x0001EE Reserved
118 110 0x0000F0 0x0001F0 A DC Pair 0 Convert Done
119 111 0x0000F2 0x0001F2 ADC Pair 1 Convert Done
120 112 0x0000F4 0x0001F4 A DC Pair 2 Convert Done
121 113 0x0000F6 0x0001F6 A DC Pair 3 Convert Done
122 114 0x0000F8 0x0001F8 A DC Pair 4 Convert Done
123 115 0x0000FA 0x0001F A ADC Pair 5 Convert Done
124 116 0x0000FC 0x0001FC ADC Pair 6 Convert Done
125 117 0x0000FE 0x0001FE Reserved
Lowest Natural Order Priority
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 98 © 2008-2012 Microchip Technology Inc.
7.3 Interrupt Control and Status
Registers
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices implement 27 registers for the interrupt
controller:
INTCON1
INTCON2
•IFSx
•IECx
•IPCx
•INTTREG
7.3.1 INTCON1 AND INTCON2
Global interrupt control functions are controlled from
INTCON1 and INTCON2. INTCON1 contains the
Interrupt Nesting Disable (NSTDIS) bit as well as the
control and status flags for the processor trap sources.
The INTCON2 register controls the external interrupt
request signal behavior and the use of the Alternate
Interrupt Vector Table.
7.3.2 IFSx
The IFSx registers maintain all of th e interrupt request
flags. Each source of interrupt has a status bit, which is
set by the respective peripherals or external signal and
is cleared via software.
7.3.3 IECx
The IECx registers maintain all of the interrupt enable
bits. These control bits are used to individually enabl e
interrupts from the peripherals or external signals.
7.3.4 IPCx
The IPCx registers are used to set the Interrupt Priority
Level for each source of interrupt. Each user i nterrupt
source can be assigned to one of eight priority levels.
7.3.5 INTTREG
The INTTREG register contains the associated
interrupt vector number and the new CPU Interrupt
priority Level, which are latched into the Vector Number
(VECNUM<6:0>) and Interrupt Level (ILR<3:0>) bit
fields in the INTTREG register. The new Interrupt
Priority Level is the priority of the pending interrupt.
The interrupt sources are assigned to the IFSx, IECx
and IPCx registers in the same sequence that they are
listed in Table 7-1. For example, the INT0 (External
Interrupt 0) is shown as h aving vector nu mber 8 and a
natural order priority of 0. Thus, the INT0IF bit is found
in IFS0<0>, the INT0IE bit is found in IEC0<0> and the
INT0IP bits are found in the first position of IPC0
(IPC0<2:0>).
7.3.6 STATUS/CONTROL REGISTERS
Although they are not specifically part of the interrupt
control hardware, two of the CPU Control registers
contain bits that control interrupt functionality.
The CPU STATUS register, SR, contains the
IPL<2:0> bits (SR<7:5>). These bits indicate the
current CPU interrupt Priority Leve l. The user can
change the current CPU priority level by wri ting to
the IPL bits.
The CORCON register contains the IPL3 bit,
which together with IPL<2:0>, indicates the
current CPU priority level. IPL3 is a read-only bit
so that trap events cannot be masked by the user
software.
All Interrupt registers are described in Register 7-1
through Register 7-35 in the following pages.
© 2008-2012 Microchip Technology Inc. DS70318F-page 99
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-1: SR: CPU STATUS REGISTER(1)
REGISTER 7-2: CORCON: CORE CONTROL REGISTER(1)
R-0 R-0 R/C-0 R/C-0 R-0 R/C-0 R -0 R/W-0
OA OB SA SB OAB SAB DA DC
bit 15 bit 8
R/W-0(3) R/W-0(3) R/W-0(3) R-0 R/W-0 R/W-0 R/W-0 R/W-0
IPL<2:0>(2) RA NOV Z C
bit 7 bit 0
Legend:
C = Clearable bit R = Readable bit U = Unimplemented bit, read as ‘0’
S = Settable bit W = Writable bit -n = Value at POR
‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2)
111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled
110 = CPU Interrupt Priority Level is 6 (14)
101 = CPU Interrupt Priority Level is 5 (13)
100 = CPU Interrupt Priority Level is 4 (12)
011 = CPU Interrupt Priority Level is 3 (11)
010 = CPU Interrupt Priority Level is 2 (10)
001 = CPU Interrupt Priority Level is 1 (9)
000 = CPU Interrupt Priority Level is 0 (8)
Note 1: For complete register details, see Register 3-1.
2: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
3: The IPL<2:0> status bits are read-onl y when NSTDIS (INTCON1<15>) = 1.
U-0 U-0 U-0 U-0 R/W-0 R-0 R-0 R-0
US EDT DL<2:0>
bit 15 bit 8
R/W-0 R/W-0 R/W-1 R/W-0 R/C-0 R/W-0 R/W-0 R/W-0
SATA SATB SATDW ACCSAT IPL3(2) PSV RND IF
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit -n = Value at POR ‘1’ = Bit is set
0’ = Bit is cleared ‘x = Bit is unknown U = Unimplemented bit, read as ‘0’
bit 3 IPL3: CPU Interrupt Priority Level Status bit 3(2)
1 = CPU Interrupt Priority Level is greater than 7
0 = CPU Interrupt Priority Leve l is 7 or less
Note 1: For complete register details, see Register 3-2.
2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 100 © 2008-2012 Microchip Technology Inc.
REGISTER 7-3: INTCON1: INTERRUPT CONTROL REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE
bit 15 bit 8
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
SFTACERR DIV0ERR MATHERR ADDRERR STKERR OSCFAIL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 NSTDIS: Interrupt Nesting Disable bit
1 = Interrupt nesting is disab led
0 = Interrupt nesting is ena bled
bit 14 OVAERR: Accumulator A Overfl ow Trap Flag bit
1 = Trap was caused by overflow of Accumulator A
0 = Trap was not caused by overflow of Accumulator A
bit 13 OVBERR: Accumulator B Overflow Trap Flag bit
1 = Trap was caused by overflow of Accumulator B
0 = Trap was not caused by overflow of Accumulator B
bit 12 COVAERR: Accumulator A Catastrophic Overflow Trap Flag bit
1 = Trap was caused by catastrophic overflow of Accumulator A
0 = Trap was not caused by catastrophic overflow of Accumulator A
bit 11 COVBERR: Accumulator B Catastrophic Overflow Trap Flag bit
1 = Trap was caused by catastrophic overflow of Accumulator B
0 = Trap was not caused by catastrophic overflow of Accumulator B
bit 10 OVATE: Accumulator A Overflow Trap Enable bit
1 = Trap overflow of Accumulator A
0 = Trap disabled
bit 9 OVBTE: Accumulator B Overflow Trap Enable bit
1 = Trap overflow of Accumulator B
0 = Trap disabled
bit 8 COVTE: Catastrophic Overflow Trap Enable bit
1 = Trap on catastrophic overflow of Accumulator A or B enabled
0 = Trap disabled
bit 7 SFTACERR: Shift Accumulator Error Status bit
1 = Math error trap was caused by an invalid accumulator shift
0 = Math error trap was not caused by an invalid accumulator shift
bit 6 DIV0ERR: Arithmetic Error Status bit
1 = Math error trap was caused by a divide by zero
0 = Math error trap was not caused by a divide by zero
bit 5 Unimplemented: Read as ‘0
bit 4 MATHERR: Arithmetic Error S tatus bit
1 = Math error trap has occurred
0 = Math error trap has not occurred
bit 3 ADDRERR: Address Error Trap Status bit
1 = Address error trap has occurred
0 = Address error trap has not occurred
© 2008-2012 Microchip Technology Inc. DS70318F-page 101
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 2 STKERR: Stack Error Trap Sta tu s bit
1 = Stack error trap has occurred
0 = Stack error trap has not occurred
bit 1 OSCFAIL: Oscillator Failure Trap Status bit
1 = Oscillator failure trap has occurred
0 = Oscillator failure trap has not occurred
bit 0 Unimplemented: Read as ‘0
REGISTER 7-3: INTCON1: INTERRUPT CONTROL REGISTER 1 (CONTINUED)
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 102 © 2008-2012 Microchip Technology Inc.
REGISTER 7-4: INTCON2: INTERRUPT CONTROL REGISTER 2
R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0
ALTIVT DISI
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
INT2EP INT1EP INT0EP
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ALTIVT: Enable Alternate Interru pt Vector Table bi t
1 = Use alternate vector table
0 = Use standard (default) vector table
bit 14 DISI: DISI Instruction Status bit
1 = DISI instruction is active
0 = DISI instruction is not active
bit 13-3 Unimplemented: Read as ‘0
bit 2 INT2EP: External Interrupt 2 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 1 INT1EP: External Interrupt 1 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 0 INT0EP: External Interrupt 0 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
© 2008-2012 Microchip Technology Inc. DS70318F-page 103
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-5: IFS0: INTERRUPT FLAG STATUS REGISTER 0
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADIF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13 ADIF: ADC Group Conversion Complete Interrupt Flag S tatus bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12 U1TXIF: UART1 Transmitter Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11 U1RXIF: UART1 Receiver Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10 SPI1IF: SPI1 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9 SPI1EIF: SPI1 Fault Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8 T3IF: Ti mer3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7 T2IF: Ti mer2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6 OC2IF: Output Compare Channel 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5 IC2IF: Input Capture Channel 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4 Unimplemented: Read as ‘0
bit 3 T1IF: Ti mer1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2 OC1IF: Output Compare Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 104 © 2008-2012 Microchip Technology Inc.
bit 1 IC1IF: Input Capture Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 INT0IF: External Interrupt 0 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
REGISTER 7-5: IFS0: INTERRUPT FLAG STATUS REGISTER 0 (CONTINUED)
© 2008-2012 Microchip Technology Inc. DS70318F-page 105
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-6: IFS1: INTERRUPT FLAG STATUS REGISTER 1
U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
—INT2IF
bit 15 bit 8
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
INT1IF CNIF AC1IF MI2C1IF SI2C1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13 INT2IF: External Interrupt 2 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12-5 Unimplemented: Read as ‘0
bit 4 INT1IF: External Interrupt 1 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 3 CNIF: Input Change Notification Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2 AC1IF: Analog Comparator 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1 MI2C1IF: I2C1 Master Events Interrupt Flag S tatus bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 SI2C1IF: I2C1 Slave Events Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 106 © 2008-2012 Microchip Technology Inc.
REGISTER 7-7: IFS3: INTERRUPT FLAG STATUS REGISTER 3
REGISTER 7-8: IFS4: INTERRUPT FLAG STATUS REGISTER 4
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0
PSEMIF
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10 Unimplemented: Read as ‘0
bit 9 PSEMIF: PWM Special Event Match Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8-0 Unimplemented: Read as ‘0
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0
—U1EIF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-2 Unimplemented: Read as ‘0
bit 1 U1EIF: UART1 Error Interr up t Fl a g Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 Unimplemented: Read as ‘0
© 2008-2012 Microchip Technology Inc. DS70318F-page 107
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-9: IFS5: INTERRUPT FLAG STATUS REGISTER 5
R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0
PWM2IF PWM1IF
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 PWM2IF: PWM2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 14 PWM1IF: PWM1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 13-0 Unimplemented: Read as ‘0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 108 © 2008-2012 Microchip Technology Inc.
REGISTER 7-10: IFS6: INTERRUPT FLAG STATUS REGISTER 6
R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
ADCP1IF ADCP0IF —AC4IFAC3IF
bit 15 bit 8
R/W-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
AC2IF PWM4IF PWM3IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ADCP1IF: ADC Pair 1 Conversion Done Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 14 ADCP0IF: ADC Pair 0 Conversion Done Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 13-10 Unimplemented: Read as ‘0
bit 9 AC4IF: Analog Comparator 4 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8 AC3IF: Analog Comparator 3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7 AC2IF: Analog Comparator 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6-2 Unimplemented: Read as ‘0
bit 1 PWM4IF: PWM4 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 PWM3IF: PWM3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
© 2008-2012 Microchip Technology Inc. DS70318F-page 109
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-11: IFS7: INTERRUPT FLAG STATUS REGISTER 7
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADCP6IF ADCP5IF ADCP4IF ADCP3IF ADCP2IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-5 Unimplemented: Read as ‘0
bit 4 ADCP6IF: ADC Pair 6 Conversion Done Interrupt Flag S tatus bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 3 ADCP5IF: ADC Pair 5 Conversion Done Interrupt Flag S tatus bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2 ADCP4IF: ADC Pair 4 Conversion Done Interrupt Flag S tatus bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1 ADCP3IF: ADC Pair 3 Conversion Done Interrupt Flag S tatus bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0 ADCP2IF: ADC Pair 2 Conversion Done Interrupt Flag S tatus bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 110 © 2008-2012 Microchip Technology Inc.
REGISTER 7-12: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADIE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13 ADIE: ADC1 Conversion Compl ete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12 U1TXIE: UART1 Transmitter Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 11 U1RXIE: UART1 Receiver Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10 SPI1IE: SPI1 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 9 SPI1EIE: SPI1 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8 T3IE: Timer3 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7 T2IE: Timer2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6 OC2IE: Output Compare Channel 2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5 IC2IE: Input Capture Channel 2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4 Unimplemented: Read as ‘0
bit 3 T1IE: Timer1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2 OC1IE: Output Compare Channel 1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
© 2008-2012 Microchip Technology Inc. DS70318F-page 111
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 1 IC1IE: Input Capture Channel 1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0 INT0IE: External Interrupt 0 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
REGISTER 7-12: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 (CONTINUED)
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 112 © 2008-2012 Microchip Technology Inc.
REGISTER 7-13: IEC1: INTERRUPT ENABLE CONTROL REGISTER 1
U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
—INT2IE
bit 15 bit 8
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
INT1IE CNIE AC1IE MI2C1IE SI2C1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13 INT2IE: External Interrupt 2 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12-5 Unimplemented: Read as ‘0
bit 4 INT1IE: External Interrupt 1 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 3 CNIE: Input Change Notification Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2 AC1IE: Analog Comparator 1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1 MI2C1IE: I2C1 Master Events Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0 SI2C1IE: I2C1 Slave Events Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
© 2008-2012 Microchip Technology Inc. DS70318F-page 113
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-14: IEC3: INTERRUPT ENABLE CONTROL REGISTER 3
REGISTER 7-15: IEC4: INTERRUPT ENABLE CONTROL REGISTER 4
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0
PSEMIE
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10 Unimplemented: Read as ‘0
bit 9 PSEMIE: PWM Special Event Match Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8-0 Unimplemented: Read as ‘0
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0
—U1EIE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-2 Unimplemented: Read as ‘0
bit 1 U1EIE: UART1 Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0 Unimplemented: Read as ‘0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 114 © 2008-2012 Microchip Technology Inc.
REGISTER 7-16: IEC5: INTERRUPT ENABLE CONTROL REGISTER 5
R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0
PWM2IE PWM1IE
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 PWM2IE: PWM2 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 14 PWM1IE: PWM1 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 13-0 Unimplemented: Read as ‘0
© 2008-2012 Microchip Technology Inc. DS70318F-page 115
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-17: IEC6: INTERRUPT ENABLE CONTROL REGISTER 6
R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
ADCP1IE ADCP0IE —AC4IEAC3IE
bit 15 bit 8
R/W-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
AC2IE PWM4IE PWM3IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ADCP1IE: ADC Pair 1 Conversion Don e Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 14 ADCP0IE: ADC Pair 0 Conversion Don e Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 13-10 Unimplemented: Read as ‘0
bit 9 AC4IE: Analog Comparator 4 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 8 AC3IE: Analog Comparator 3 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 7 AC2IE: Analog Comparator 2 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 6-2 Unimplemented: Read as ‘0
bit 1 PWM4IE: PWM4 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 0 PWM3IE: PWM3 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 116 © 2008-2012 Microchip Technology Inc.
REGISTER 7-18: IEC7: INTERRUPT ENABLE CONTROL REGISTER 7
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADCP6IE ADCP5IE ADCP4IE ADCP3IE ADCP2IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-5 Unimplemented: Read as ‘0
bit 4 ADCP6IE: ADC Pair 6 Conversion Done Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 3 ADCP5IE: ADC Pair 5 Conversion Done Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 2 ADCP4IE: ADC Pair 4 Conversion Done Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 1 ADCP3IE: ADC Pair 3 Conversion Done Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 0 ADCP2IE: ADC Pair 2 Conversion Done Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
© 2008-2012 Microchip Technology Inc. DS70318F-page 117
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-19: IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
T1IP<2:0> —OC1IP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
—IC1IP<2:0> INT0IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 T1IP<2:0>: Timer1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 INT0IP<2:0>: External Interrupt 0 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 118 © 2008-2012 Microchip Technology Inc.
REGISTER 7-20: IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
T2IP<2:0> —OC2IP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
—IC2IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 T2IP<2:0>: Timer2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0
© 2008-2012 Microchip Technology Inc. DS70318F-page 119
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-21: IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
U1RXIP<2:0> SPI1IP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
SPI1EIP<2:0> T3IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 SPI1IP<2:0>: SPI1 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 SPI1EIP<2:0>: SPI1 Error Interrupt Priority bit s
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 T3IP<2:0>: Timer3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 120 © 2008-2012 Microchip Technology Inc.
REGISTER 7-22: IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
—ADIP<2:0> U1TXIP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0
bit 6-4 ADIP<2:0>: ADC1 Conversion Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
© 2008-2012 Microchip Technology Inc. DS70318F-page 121
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-23: IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
CNIP<2:0> AC1IP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
MI2C1IP<2:0> SI2C1IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 CNIP<2:0>: Change Notification Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 AC1IP<2:0>: Analog Comparator 1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 MI2C1IP<2:0>: I2C1 Master Events Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 SI2C1IP<2:0>: I2C1 Slave Events Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 122 © 2008-2012 Microchip Technology Inc.
REGISTER 7-24: IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5
REGISTER 7-25: IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0
INT1IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 Unimplemented: Read as ‘0
bit 2-0 INT1IP<2:0>: External Interrupt 1 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
U-0 U-1 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
INT2IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0
bit 6-4 INT2IP<2:0>: External Interrupt 2 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0
© 2008-2012 Microchip Technology Inc. DS70318F-page 123
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-26: IPC14: INTERRUPT PRIORITY CONTROL REGISTER 14
REGISTER 7-27: IPC16: INTERRUPT PRIORITY CONTROL REGISTER 16
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
PSEMIP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0
bit 6-4 PSEMIP<2:0>: PWM Special Eve nt Match Interrupt Priority bi ts
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
—U1EIP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0
bit 6-4 U1EIP<2:0>: UART1 Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0 Unimplemented: Read as ‘0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 124 © 2008-2012 Microchip Technology Inc.
REGISTER 7-28: IPC23: INTERRUPT PRIORITY CONTROL REGISTER 23
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
—PWM2IP PWM1IP<2:0>
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 PWM2IP<2:0>: PWM2 Interrupt Priority bits
111 = Interrupt is priority 7 (hig hest priority)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 PWM1IP<2:0>: PWM1 Interrupt Priority bits
111 = Interrupt is priority 7 (hig hest priority)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7-0 Unimplemented: Read as ‘0
© 2008-2012 Microchip Technology Inc. DS70318F-page 125
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-29: IPC24: INTERRUPT PRIORITY CONTROL REGISTER 24
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
—PWM4IP PWM3IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0
bit 6-4 PWM4IP<2:0>: PWM4 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 PWM3IP<2:0>: PWM3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 126 © 2008-2012 Microchip Technology Inc.
REGISTER 7-30: IPC25: INTERRUPT PRIORITY CONTROL REGISTER 25
U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0
—AC2IP<2:0>
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 AC2IP<2:0>: Analog Comparator 2 Interrupt Priority bits
111 = Interrupt is priority 7 (hig hest priority)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11-01 Unimplemented: Read as ‘0
© 2008-2012 Microchip Technology Inc. DS70318F-page 127
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-31: IPC26: INTERRUPT PRIORITY CONTROL REGISTER 26
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
—AC4IP<2:0> AC3IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0
bit 6-4 AC4IP<2:0>: Analog Comparator 4 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 AC3IP<2:0>: Analog Comparator 3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 128 © 2008-2012 Microchip Technology Inc.
REGISTER 7-32: IPC27: INTERRUPT PRIORITY CONTROL REGISTER 27
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
ADCP1IP<2:0> ADCP0IP<2:0>
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 ADCP1IP<2:0>: ADC Pair 1 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 ADCP0IP<2:0>: ADC Pair 0 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7-0 Unimplemented: Read as ‘0
© 2008-2012 Microchip Technology Inc. DS70318F-page 129
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-33: IPC28: INTERRUPT PRIORITY CONTROL REGISTER 28
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
ADCP5IP<2:0> ADCP4IP<2:0>
bit 15 bit 8
U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0
ADCP3IP<2:0> ADCP2IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 ADCP5IP<2:0>: ADC Pair 5 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11 Unimplemented: Read as ‘0
bit 10-8 ADCP4IP<2:0>: ADC Pair 4 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7 Unimplemented: Read as ‘0
bit 6-4 ADCP3IP<2:0>: ADC Pair 3 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3 Unimplemented: Read as ‘0
bit 2-0 ADCP2IP<2:0>: ADC Pair 2 Conversion Done Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 130 © 2008-2012 Microchip Technology Inc.
REGISTER 7-34: IPC29: INTERRUPT PRIORITY CONTROL REGISTER 29
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0
ADCP6IP<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 Unimplemented: Read as ‘0
bit 2-0 ADCP6IP<2:0>: ADC Pair 6 Conversion Done Interrupt 1 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
001 = Interrupt is priority 1
000 = Interrupt source is disabled
© 2008-2012 Microchip Technology Inc. DS70318F-page 131
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 7-35: INTTREG: INTERRUPT CONTROL AND STATUS REGISTER
U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0
—ILR<3:0>
bit 15 bit 8
U-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
VECNUM<6:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12 Unimplemented: Read as ‘0
bit 11-8 ILR<3:0>: New CPU Interrup t Priority Level bits
1111 = CPU Interrupt Priority Level is 15
0001 = CPU Interrupt Priority Level is 1
0000 = CPU Interrupt Priority Level is 0
bit 7 Unimplemented: Read as ‘0
bit 6-0 VECNUM<6:0>: Vector Number of Pending Interrupt bits
0111111 = Interrupt vector pending is number 135
0000001 = Interrupt vector pending is number 9
0000000 = Interrupt vector pending is number 8
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 132 © 2008-2012 Microchip Technology Inc.
7.4 Interrupt Setup Procedures
7.4.1 INITIALIZATION
Complete the following steps to configure an interrupt
source at initialization:
1. Set the NSTDIS bit (INTCON1<15>) if nested
interrupts are not desired.
2. Select the user-assigned priority level for the
interrupt source by writing the control bits in th e
appropriate IPCx register. The priority level will
depend on the specific application and type of
interrupt source. If multiple priority levels are not
desired, the IPCx register control bits for all
enabled interrupt sources can be programmed
to the same non-zero value.
3. Clear the interrupt flag status bit associated with
the peripheral in the associated IFSx register.
4. Enable the interrupt source by setting the
interrupt enable control bit associated with the
source in the appropriate IECx register.
7.4.2 INTERRUPT SERVICE ROUTINE
The method used to declare an ISR and initialize the
IVT with the correct vector address depends on the
programming language (C or assembler) and the
language development toolsuite used to develop the
application.
In general, the user application must clear the interrupt
flag in the appropriate IFSx register for the source of
interrupt that the ISR handles. Otherwise, program will
re-enter the ISR immediately after exiting the routine. If
the ISR is coded in assembly language, it must be
terminated using a RETFIE instruction to unstack the
saved PC value, SRL value and old CPU priority level.
7.4.3 TRAP SERVICE ROUTINE
A Trap Service Routine (TSR) is coded like an ISR,
except that the appropriate trap status flag in the
INTCON1 register must be cleared to avoid re-entry
into the TSR.
7.4.4 INTERRUPT DISABLE
The following steps outline the procedure to disable all
user interrupts:
1. Push the current SR value onto the software
stack using the PUSH instruction.
2. Force the CPU to priority level 7 by inclusive
ORing the value 0xE0 with SRL.
To enable user interrupts, the POP instruction can be
used to restore the previous SR value.
The DISI instruction provides a convenient way to
disable interrupts of priority levels 1-6 for a fixed period
of time. Level 7 interrupt sources are not disabled by
the DISI instruction.
Note: At a device Reset, the IPCx registers are
initialized such that all user interrupt
sources are assigned to priority level 4. Note: Only user interrupts with a priority level of
7 or lower can be disab led. Trap sources
(level 8-level 15) cannot be disabled.
© 2008-2012 Microchip Technology Inc. DS70318F-page 133
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
8.0 OSCILLATOR CONFIGURATION The oscillator system provides:
External and internal oscillator options as clock
sources
An on-chip Phase-Locked Loop (PLL) to scale the
internal operating frequency to the required system
clock frequency
An internal FRC oscillator that can also be used with
the PLL, thereby allowing full-spee d operation
without any external clock generation hardware
Clock switching between various clock sources
Programmable clock postscaler for system power
savings
A Fail-Safe Clock Monitor (FSCM) that detects clock
failure and takes fail-safe measures
A Clock Control register (OSCCON)
Nonvolatil e Configuration bits for main oscillator
selection.
Auxiliary PLL for ADC and PWM
A simplified diagram of th e oscillator system is shown
in Figure 8-1.
FIGURE 8-1: OSCILLATOR SYSTEM DIAGRAM
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a compre-
hensive reference source. To comple-
ment the information in this data sheet,
refer to Section 42. “Oscillator (Part
IV)” (DS70307) in the “dsPIC33F/
PIC24H Family Reference Manual,
which is available from the Microchip web
site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
XTPLL, HSPLL,
XT, HS, EC
FRCDIV<2:0>
WDT, PWRT,
FSCM
FRCDIVN
FRCDIV16
ECPLL, FRCPLL
NOSC<2:0> FNOSC<2:0>
Reset
FRC
Oscillator
LPRC
Oscillator
DOZE<2:0>
S3
S1
S2
S1/S3
S7
S6
FRC
LPRC
S0
S5
÷16
Clock Switch
S7
Clock Fail
÷2
TUN<5:0>
PLL(1) FCY(3)
FOSC
FRCDIV
DOZE
÷N ACLK
SELACLK APSTSCLR<2:0>
To PWM/ADC(1)
ENAPLL
POSCMD<1:0>
FVCO(1)
APLL(1)
x16
ASRCSEL FRCSEL
POSCCLK FRCCLK
FRCCLK
POSCCLK
÷N
ROSEL RODIV<3:0>
REFCLKO
POSCCLK
Reference Clock Generation
Auxiliary Clock Generation
RPx
Note 1: See Section 8.1.3 “PLL Configuration and Section 8.2 “Auxiliary Clock Generation” for configura tion restrictions.
2: If the Oscillator is used with XT or HS modes, an ext ernal parallel resistor with the value of 1 MΩ must be connected.
3: The term FP refers to the clock source f or all the peripherals, while FCY refer s to the clock source for the CPU. Throughout this do cument,
FCY and FP are used interchangeably, except in the case of Doze mode. FP and FCY will be different when Doze mode is used in any
ratio other than 1:1, which is the default.
FVCO(1)
FOSC
FP(3)
OSC2
OSC1 Primary Oscillator
R(2)
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 134 © 2008-2012 Microchip Technology Inc.
8.1 CPU Clocking System
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices provide six system clock options:
Fast RC (FRC) Oscillator
FRC Oscillator with PLL
Primary (XT, HS or EC) Oscillator
Primary Oscillator with PLL
Low-Po wer RC (LPRC) Oscillator
FRC Oscillator with Postscaler
8.1.1 SYSTEM CLOCK SOURCES
The Fast RC (FRC) internal oscillator runs at a nominal
frequency of 7.37 MHz. User software can tune the
FRC frequency. User software can optionally specify a
factor (ranging from 1:2 to 1:256) by which the FRC
clock frequency is divided. This factor is selected using
the FRCDIV<2:0> (CLKDIV<10:8>) bits.
The primary oscillator can u se one of the following as
its clock source:
XT (Crystal): Crystals and ceramic resonators in
the range of 3 MHz to 10 MHz. The crystal is
connected to the OSC1 and OSC2 pins.
HS (High-Speed Cryst al): Crystals in the range of
10 MHz to 40 MHz. The crystal is connected to
the OSC1 and OSC2 pins.
EC (External Clock): The external clock signal is
directly applied to the OSC1 pin.
The LPRC internal oscIllator runs at a nominal
frequency of 32.768 kHz. It is also used as a reference
clock by the Watchdog Timer (WDT) and Fail-Safe
Clock Monitor (FSCM).
The clock signals generated by the FRC and primary
oscillators can be optionally applied to an on-chip
Phase-Locked Loop (PLL) to provide a wide range of
output frequencies for device operation. PLL
configuration is described in Secti on 8.1 .3 “PLL Con-
figuration”.
The FRC frequency depends on the FRC accuracy
(see Table 24-20) and the value of the FRC Oscillator
Tuning register (see Register 8-4).
8.1.2 SYSTEM CLOCK SELECTION
The oscillator source used at a device Power-on Reset
event is selected using Configuration bit settings. The
oscillator Configuration bit settings are located in the
Configuration registers in the program memory. (Refer
to Section 21.1 “Configuration Bits” for further
details.) The Initial Oscillator Selection Configuration
bits, FNOSC<2:0> (FOSCSEL<2:0>), and the Primary
Oscillator Mode Select Configuration bits,
POSCMD<1:0> (FOSC<1:0>), select the oscillator
source that is used at a Power-on Reset. The FRC
primary oscillator is the default (unprogrammed)
selection.
The Configuration bits allow users to choose among
12 differen t cl ock modes, shown in Table 8-1.
The output of the oscilla tor (or the output of the PLL if
a PLL mode has been selected), FOSC, is divided by 2
to generate the device instruction clock (FCY) and the
peripheral clock time base (FP). FCY defines the
operating speed of the device and speeds up to 40
MHz are supported by the dsPIC33FJ06GS101/X02
and dsPIC33FJ16GSX02/X04 architecture.
Instruction execution speed or device operating
frequency, FCY, is given by Equation 8-1.
EQUATION 8-1: DEVICE OPERATING
FREQUENCY
TABLE 8-1: CONFIGURATION BIT VALUES FOR CLOCK SELECTION
FCY = FOSC/2
Oscillator Mode Oscillator Source POSCMD<1:0> FNOSC<2:0> See Note
Fast RC Oscillator with Divide-by-N (FRCDIVN) Internal xx 111 1, 2
Fast RC Oscillator with Divide-by-16 (FRCDIV16) Internal xx 110 1
Low-Power RC Oscillator (LPRC) Internal xx 101 1
Reserved Reserved xx 100
Primary Oscillator (HS) with PLL (HSPLL) Primary 10 011
Primary Oscillator (XT) with PLL (XTPLL) Primary 01 011
Primary Oscillator (EC) with PLL (ECPLL) Primary 00 011 1
Primary Oscillator (HS) Primary 10 010
Primary Oscillator (XT) Primary 01 010
Primary Oscillator (EC) Primary 00 010 1
Fast RC Oscillator with PLL (FRCPLL) Internal xx 001 1
Fast RC Oscillator (FRC) Internal xx 000 1
Note 1: OSC2 pin function is determined by the OSCIOFNC Configuration bit.
2: This is the default oscillator mode for an unprogrammed (erased) device.
© 2008-2012 Microchip Technology Inc. DS70318F-page 135
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
8.1.3 PLL CONFIGURATION
The primary oscillator and internal FRC oscillator can
optionally use an on-chip PL L to obtain higher speeds
of operation. The PLL provides significant flexibility in
selecting the device op erating spee d. A block dia gram
of the PLL is shown in Figure 8-2.
The output of the primary oscillator or FRC, denoted as
‘FIN’, is divided down by a prescale factor (N1) of 2, 3,
... or 33 before being provided to the PLL’s Voltage
Controlled Oscillator (VCO). The input to the VCO must
be selected in the range of 0.8 MHz to 8 MHz. The
prescale factor ‘N1’ is selected using the
PLLPRE<4:0> bits (CLKDIV<4:0>).
The PLL Feedback Divisor, selected using the
PLLDIV<8:0> bits (PLLFBD<8:0>), provides a factor , ‘M’,
by which the input to the VCO is multiplied. This factor
must be selected such that the resulting VCO output
frequency is in the range of 100 MHz to 200 MHz.
The VCO output is further divided by a postscale factor ,
‘N2’. This factor is sele cted using the PLLPOST<1:0>
bits (CLKDIV<7:6>). ‘N2’ can be either 2, 4, or 8, and
must be selected such that the PLL output frequency
(FOSC) is in the range of 12.5 MHz to 80 MHz, which
generates device operating speeds of 6.25-40 MIPS.
For a primary oscillator or FRC oscillator, output ‘FIN’,
the PLL output ‘FOSC’ is given by Equation 8-2.
EQUATION 8-2: FOSC CALCULATION
For example, suppose a 10 MHz crystal is being used
with the selected oscillator mode of XT with PLL (see
Equation 8-3).
If PLLPRE<4:0> = 0, then N1 = 2. This yields a
VCO input of 10/2 = 5 MHz, which is within the
acceptable range of 0.8-8 MHz.
If PLLDIV<8:0> = 0x1E, then M = 32. This yields a
VCO output of 5 x 32 = 160 MHz, which is within
the 100-200 MHz ranged needed.
If PLLPOST<1:0> = 0, then N2 = 2. This provides
a Fosc of 160/2 = 80 MHz. The resultant device
operating speed is 80/2 = 40 MIPS.
EQUATION 8-3: XT WITH PLL MODE
EXAMPLE
FIGURE 8-2: dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 PLL BLOCK DIAGRAM
( )
M
N1*N2
FOSC = FIN *
FCY = FOSC
2==
1
2(10000000 * 32
2 * 2 )40 MIPS
0.8-8.0 MHz
Here(1) 100-200 MHz
Here(1)
Divide by
2, 4, 8
Divide by
2-513
Divide by
2-33
Source (Crystal, External PLLPRE XVCO
PLLDIV
PLLPOST
Clock or Internal RC)
12.5-80 MHz
Here(1)
FOSC
FVCO
N1
M
N2
Note 1: This frequency range must be satisfied at all times.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 136 © 2008-2012 Microchip Technology Inc.
8.2 Auxiliary Clock Generation
The auxiliary clock generation is used for a peripherals
that need to operate at a frequency unrelated to the
system clock such as a PWM or ADC.
The primary oscillator and internal FRC oscillator
sources can be used with an auxiliary PLL to obtain the
auxiliary clock. The auxiliary PLL has a fixed 16x
multiplication factor.
The auxiliary clock has the following configuration
restrictions:
For proper PWM operation, auxiliary clock genera-
tion must be configured for 120 MHz (see parameter
OS56 in Table 24-18 in Section 24.0 “Electrical
Characteristics”). If a slower frequency is desire d,
the PWM Input Clock Prescaler (Divider) Select bits
(PCLKDIV<2:0>) should be used.
To achieve 1.04 ns PWM resolution, the auxiliary
clock must use the 16x auxiliary PLL (APLL). All
other clock sources will have a minimum PWM
resolution of 8 ns.
If the primary PLL is used as a source for the aux-
iliary clock, the primary PLL should be configured
up to a maximum operation of 30 MIPS or less
8.3 Reference Clock Generation
The reference clock output logic provides the user with
the ability to output a clock signal based on the system
clock or the crystal oscillator on a device pin. The user
application can specify a wide range of clock scaling
prior to outputting the reference clock.
© 2008-2012 Microchip Technology Inc. DS70318F-page 137
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
8.4 Oscillator Control Registers
REGISTER 8-1: OSCCON: OSCILLATOR CONTROL REGISTER(1,2)
U-0 R-0 R-0 R-0 U-0 R/W-y R/W-y R/W-y
COSC<2:0> NOSC<2:0>(3)
bit 15 bit 8
R/W-0 R/W-0 R-0 U-0 R/C-0 U-0 U-0 R/W-0
CLKLOCK IOLOCK LOCK —CF —OSWEN
bit 7 bit 0
Legend: y = Value set from Configuratio n bits on POR
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0
bit 14-12 COSC<2:0>: Current Oscillator Selection bits (read-only)
111 = Fast RC oscillator (FRC) with divide-by-n
110 = Fast RC oscillator (FRC) with divide-by-16
101 = Low-Power RC oscillator (LPRC)
100 = Reserved
011 = Primary oscillator (XT, HS, EC) with PLL
010 = Primary oscillator (XT, HS, EC)
001 = Fast RC oscillator (FRC) with PLL
000 = Fast RC oscillator (FRC)
bit 11 Unimplemented: Read as ‘0
bit 10-8 NOSC<2:0>: New Oscilla tor Selection bits(3)
111 = Fast RC oscillator (FRC) with divide-by-n
110 = Fast RC oscillator (FRC) with divide-by-16
101 = Low-Power RC oscillator (LPRC)
100 = Reserved
011 = Primary oscillator (XT, HS, EC) with PLL
010 = Primary oscillator (XT, HS, EC)
001 = Fast RC oscillator (FRC) with PLL
000 = Fast RC oscillator (FRC)
bit 7 CLKLOCK: Clock Lock Enable bit
If clock switching is enabled and FSCM is disabled, (FOSC<FCKSM> = 0b01):
1 = Clock switching is disabled, system clock source is locked
0 = Clock switching is enabled, system clock source can be modified by clock switching
bit 6 IOLOCK: Peripheral Pin Select Lock bit
1 = Peripherial pin select is locked, write to Peripheral Pin Select registers not allowed
0 = Peripherial pin select is not locked, write to Peripheral Pin Select registers allowed
bit 5 LOCK: PLL Lock Status bit (read-only)
1 = Indicates that PLL is in lock, or PLL start-up timer is satisfied
0 = Indicates that PLL is out of lock, start-up timer is in progress or PLL is disabled
bit 4 Unimplemented: Read as ‘0
Note 1: Writes to this register require an unlock sequence. Refer to Section 42. “Oscillator (Part IV)” (DS70307)
in the “dsPIC33F/PIC24H Family Reference Manual” (available from the Microchip website) for details.
2: This register is reset only on a Power-on Reset (POR).
3: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.
This applies to clock switches in eith er direction. In these instances, the application must switch to FRC
mode as a transition clock source between the two PLL modes.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 138 © 2008-2012 Microchip Technology Inc.
bit 3 CF: Clock Fail Detect bit (read/clear by application)
1 = FSCM has detected clock failure
0 = FSCM has not detected clock failure
bit 2-1 Unimplemented: Read as ‘0
bit 0 OSWEN: Oscillator Switch Enable bit
1 = Request oscillator switch to selection specified by NOSC<2:0> bits
0 = Oscillator switch is complete
REGISTER 8-1: OSCCON: OSCILLATOR CONTROL REGISTER(1,2) (CONTINUED)
Note 1: Writes to this register require an unlock sequence. Refer to Section 42. “Oscillator (Part IV)” (DS70307)
in the “dsPIC33F/PIC24H Family Reference Manual” (available from the Microchip website) for details.
2: This register is reset only on a Power-on Reset (POR).
3: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.
This applies to clock switches in either direction. In these inst ances, the application must switch to FRC
mode as a transition clock source between the two PLL modes.
© 2008-2012 Microchip Technology Inc. DS70318F-page 139
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 8-2: CLKDIV: CLOCK DIVISOR REGISTER(1)
R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0
ROI DOZE<2:0> DOZEN(2) FRCDIV<2:0>
bit 15 bit 8
R/W-0 R/W-1 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PLLPOST<1:0> PLLPRE<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ROI: Recover on Interrupt bit
1 = Interrupts will clear the DOZEN bit and the processor clock/peripheral clock ratio is set to 1:1
0 = Interrupts have no effect on the DOZEN bit
bit 14-12 DOZE<2:0>: Processor Clock Reduction Select bits
111 = FCY/128
110 = FCY/64
101 = FCY/32
100 = FCY/16
011 = FCY/8 (defaul t)
010 = FCY/4
001 = FCY/2
000 = FCY/1
bit 11 DOZEN: Doze Mode Enable bit(2)
1 = DOZE<2:0> field specifies the ratio between the peripheral clocks and the processor clocks
0 = Processor clock/peripheral clock ratio forced to 1:1
bit 10-8 FRCDIV<2:0>: Internal Fast RC Oscillator Postscaler bits
111 = FRC divide by 256
110 = FRC divide by 64
101 = FRC divide by 32
100 = FRC divide by 16
011 = FRC divide by 8
010 = FRC divide by 4
001 = FRC divide by 2
000 = FRC divide by 1 (default)
bit 7-6 PLLPOST<1:0>: PLL VCO Output Divider Select bits (also denoted as ‘N2’, PLL postscaler)
11 = Output/8
10 = Reserved
01 = Output/4 (default)
00 = Output/2
bit 5 Unimplemented: Read as ‘0
bit 4-0 PLLPRE<4:0>: PLL Phase Detector Input Divider bits (also denoted as ‘N1’, PLL prescaler)
11111 = Input/33
00001 = Input/3
00000 = Input/2 (def a ul t)
Note 1: This register is reset only on a Power-on Reset (POR).
2: This bit is clea re d wh en th e ROI bit is set and an int errupt occurs.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 140 © 2008-2012 Microchip Technology Inc.
REGISTER 8-3: PLLFBD: PLL FEEDBACK DIVISOR REGISTER(1)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
—PLLDIV<8>
bit 15 bit 8
R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0
PLLDIV<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-9 Unimplemented: Read as ‘0
bit 8-0 PLLDIV<8:0>: PLL Feedback Divisor bits (also denoted as ‘M’, PLL multiplier)
111111111 = 513
000110000 = 50 (default)
000000010 = 4
000000001 = 3
000000000 = 2
Note 1: This register is reset only on a Power-on Reset (POR).
© 2008-2012 Microchip Technology Inc. DS70318F-page 141
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 8-4: OSCTUN: FRC OSC ILLA T OR TUNING REGIS TER (1)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TUN<5:0>(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6 Unimplemented: Read as ‘0
bit 5-0 TUN<5:0>: FRC Oscillator Tuning bits(2)
011111 = Center frequency + 11.625% (8.23 MHz)
011110 = Center frequency + 11.25% (8.20 MHz)
000001 = Center frequency + 0.375% (7.40 MHz)
000000 = Center frequency (7.37 MHz nominal)
111111 = Center frequency -0.375% (7.345 MHz)
100001 = Center frequency -11.625% (6.52 MHz)
100000 = Center frequency -12% (6.49 MHz)
Note 1: This register is reset only on a Power-on Reset (POR).
2: OSCTUN functionality has been provided to help customers compensate for temperature effects on the
FRC frequency over a wide range of temperatures. The tuning step size is an approximation and is neither
characterized nor tested.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 142 © 2008-2012 Microchip Technology Inc.
REGISTER 8-5: ACLKCON: AUXILIARY CLOCK DIVISOR CONTROL REGISTER(1)
R/W-0 R-0 R/W-1 U-0 U-0 R/W-1 R/W-1 R/W-1
ENAPLL APLLCK SELACLK APSTSCLR<2:0>
bit 15 bit 0
R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0
ASRCSEL FRCSEL
bit 7
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ENAPLL: Auxiliary PLL Enable bit
1 = APLL is enabled
0 = APLL is disabled
bit 14 APLLCK: APLL Locked Status bit (read-only)
1 = Indicates that auxiliary PLL is in lock
0 = Indicates that auxiliary PLL is not in lock
bit 13 SELACLK: Select Auxiliary Clock Source for Auxiliary Clock Divider bit
1 = Auxiliary Oscillators provides the source clock for auxiliary clock divider
0 = Primary PLL (FVCO) provides the source clock for auxiliary clock divider
bit 12-11 Unimplemented: Read as ‘0
bit 10-8 APSTSCLR<2:0>: Auxiliary Clock Output Divider bits
111 = Divided by 1
110 = Divided by 2
101 = Divided by 4
100 = Divided by 8
011 = Divided by 16
010 = Divided by 32
001 = Divided by 64
000 = Divided by 256
bit 7 ASRCSEL: Select Reference Clock Source for Auxiliary Clock bit
1 = Primary oscillator is the clock source
0 = No clock input is selected
bit 6 FRCSEL: Select Reference Clock Source for Auxiliary PLL bit
1 = Select FRC clock for auxiliary PLL
0 = Input clock source is determined by ASRCSEL bit setting
bit 5-0 Unimplemented: Read as ‘0
Note 1: This register is reset only on a Power-on Reset (POR).
© 2008-2012 Microchip Technology Inc. DS70318F-page 143
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 8-6: REFOCON: REFERENCE OSCILLATOR CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ROON ROSSLP ROSEL RODIV<3:0>(1)
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ROON: Reference Oscillator Output Enab le bit
1 = Reference oscillator output enabled on REFCLK0(2) pin
0 = Reference oscillator output disabled
bit 14 Unimplemented: Read as ‘0
bit 13 ROSSLP: Reference Oscillator Run in Sleep bit
1 = Reference oscillator output continues to run in Sleep
0 = Reference oscillator output is disabled in Sleep
bit 12 ROSEL: Reference Oscilla t or So urce Sel e ct bi t
1 = Oscillator crystal used as the reference clock
0 = System clock used as the reference clock
bit 11-8 RODIV<3:0>: Reference Oscillato r Divider bits(1)
1111 = Reference clock divided by 32,768
1110 = Reference clock divided by 16,384
1101 = Reference clock divided by 8,192
1100 = Reference clock divided by 4,096
1011 = Reference clock divided by 2,048
1010 = Reference clock divided by 1,024
1001 = Reference clock divided by 512
1000 = Reference clock divided by 256
0111 = Reference clock divided by 128
0110 = Reference clock divided by 64
0101 = Reference clock divided by 32
0100 = Reference clock divided by 16
0011 = Reference clock divided by 8
0010 = Reference clock divided by 4
0001 = Reference clock divided by 2
0000 = Reference clock
bit 7-0 Unimplemented: Read as ‘0
Note 1: The reference oscillator output must be disabled (ROON = 0) before writing to these bits.
2: This pin is remappable. Refer to Section 10.6 “Peripheral Pin Select” for more information.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 144 © 2008-2012 Microchip Technology Inc.
8.5 Clock Switching Operation
Users can switch applications among any of the four
clock sources (primary, LP, FRC and LPRC) under
software control at any time . To limi t the possible side
effects of this flexibility, dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices have a safeguard
lock built into the switch process.
8.5.1 ENABLING CLOCK SWITCHING
To enable clock switching, the FCKSM1 Configuration
bit in the Configuration register must be programmed to
0’. (Refer to Section 21.1 “Configuration Bits” for
further details.) If the FCKSM1 Configuration bit is
unprogrammed (‘1’), the clock switching function and
Fail-Safe Clock Monitor function are disabled. This is
the default setting.
The NOSC<2:0> control bits (OSCCON<10:8>) do not
control the clock selection when clock switching is
disabled. However, the COSC<2:0> bits
(OSCCON<14:12>) reflect the clock source selected
by the FNOSC Configuration bits.
The OSWEN control bit (OSCCON<0>) has no effect
when clock switching is disabled. It is he ld at 0’ at all
times.
8.5.2 OSCILLATOR SWITCHING SEQUENCE
To perform a clock switch, the following basic sequence
is required:
1. If required, read the COSC<2:0> bits to determine
the current oscillator source.
2. Perform the unlock sequence to allow a write to
the OSCCON register high byte.
3. Write the appropriate value to the NOSC<2:0>
control bits for the new oscillator source.
4. Perform the unlock sequence to allow a write to
the OSCCON register low byte.
5. Set the OSWEN bit to initiate the oscillator switch.
After the basic sequence is completed, the system
clock hardware responds as follows:
1. The clock switching hardware compares the
COSC<2:0> status bits with the new value of the
NOSC<2:0> control bits. If they are the same,
the clock switch is a redundant operation. In this
case, the OSWEN bit is cleared automatically
and the clock switch is aborted.
2. If a valid clock switch has been initiated, the LOCK
(OSCCON<5>) and the CF (OSCCON<3>) status
bits are cleared.
3. The new oscillator is turned on by the hardware if
it is not currently running. If a crystal oscillator
must be turned on, the hardware waits until the
Oscillator S tart-up T imer (OST) expires. If the new
source is using the PLL, the hardware waits until a
PLL lock is detected (LOCK = 1).
4. The hardware waits for 10 clock cycles from the
new clock source and then performs the clock
switch.
5. The hardware clears the OSWEN bit to indicate a
successful clock transition. In addition, the
NOSC<2:0> bit values are transferred to the
COSC<2:0> status bits.
6. The old clock source is turned off at this time, with
the exception of LPRC (if WDT or FSCM are
enabled).
8.6 Fail-Safe Clock Monitor (FSCM)
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue to operate even in the event of an oscillator
failure. The FSCM function is enabled by programming.
If the FSCM function is enabled, the LPRC internal
oscillator runs at all times (except during Sleep mode)
and is not subject to control by the Watchdog Timer.
During an oscillator failure, the FSCM generates a
clock failure trap event and switches the system clock
over to the FRC oscillator. Then, the application
program can either attempt to restart the oscillator or
execute a controlled shutdown. The trap can be treated
as a warm Reset by simply loading the Re set address
into the oscillator fail trap vector.
If the PLL multiplier is used to scale the system clock,
the internal FRC is also multiplied by the same factor
on clock failure. Essentially, the device switches to
FRC with PLL on a clock failure.
Note: Primary oscillator mode has three different
submodes (XT, HS and EC), which are
determined by the POSCMD<1:0>
Configuration bits. While an application
can switch to and from primary oscillator
mode in software, it cannot switch among
the different primary submodes without
reprogramming the device.
Note 1: The processor continues to execute code
throughout the clock switching sequence.
Timing-sensitive code should not be
executed during this time.
2: Direct clock switches between any pri-
mary oscillator mode with PLL and
FRCPLL mode are not permitted. This
applies to clock switches in either direc-
tion. In these instances, the application
must switch to FRC mode as a transition
clock source between the two PLL modes.
3: Refer to Section 42. “Oscillator (Part
IV)” (DS70307) in the “dsPIC33F/PIC24H
Family Reference Manual” for details.
© 2008-2012 Microchip Technology Inc. DS70318F-page 145
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
9.0 POWER-SAVING FEATURES
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices provide the ability to manage power
consumption by selectively managing clocking to the
CPU and the peripherals. In general, a lower clock
frequency and a reduction in the number of circuits being
clocked constitutes lower consumed power.
dsPIC33FJ06GS101/X02 and ds PIC33FJ16GSX02/X04
devices can manage power consumption in four different
ways:
Clock Frequency
Instruction-Based Sleep and Idle modes
Software-Controlled Doze mode
Selective Peripheral Control in Software
Combinations of these methods can be used to
selectively tailor an application’s power consumption
while still maintaining critical application features, such
as timing-sensitive commun ications.
9.1 Clock Frequency and Clock
Switching
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices allow a wide range
of clock frequencies to be selected under application
control. If the system clock configuration is not locked,
users can choose low-power or high-precision
oscillators by simply changing the NOSC<2:0> bits
(OSCCON<10:8>). The process of changing a system
clock during operation, as well as limitations to the
process, are discussed in more detail in Section 8.0
“Oscillator Configuration”.
9.2 Instruction-Based Power-Saving
Modes
The dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices have two special power-saving modes that
are entered through the execution of a special PWRSAV
instruction. Sleep mode stops clock operation and halts all
code execution. Idle mode halts the CPU and code
execution, but allows peripheral modules to continue
operation. The assembler syntax of the PWRSAV
instruction is shown in Example 9-1.
Sleep and Idle modes can be exited as a result of an
enabled interrupt, WDT time-out or a device Reset. When
the device exits these mo des, it is said to w ake-up.
9.2.1 SLEEP MODE
The following occur in Sleep mode:
T he system clock source is shut down. If an
on-chip oscillator is used, it is turned off
The device current consumption is reduced to a
minimum, provided that no I/O pin is sourcing
current
The Fail-Safe Clock Monitor doe s not operate,
since the system clock source is disabled
The LPRC clock continues to run in Sleep mode if
the WDT is enabled
The WDT, if enabled, is au tomatically cleared
prior to entering Sleep mode
Some device features or peripherals may continue
to operate. This includes the items such as the
input change notification on the I/O port s or
peripherals that use an external clock input.
Any peripheral that requires the system clock
source for its operation is disabled
The device will wake-up from Sleep mode on any of
these events:
Any interrupt source that is individual ly enabled
Any form of device Re set
A WDT time-out
On wake-up from Sleep mode, the processor restarts
with the same clock source that was active when Sleep
mode was entered.
EXAMPLE 9-1: PWRSAV INSTRUCTION SYNTAX
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 9. “Watchdog
Timer and Power-Saving Modes”
(DS70196) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: SLEEP_MODE and IDLE_MODE are
constants defined in the assembler
include file for the selected device.
PWRSAV #SLEEP_MODE ; Put the device into SLEEP mode
PWRSAV #IDLE_MODE ; Put the device into IDLE mode
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 146 © 2008-2012 Microchip Technology Inc.
9.2.2 IDLE MODE
The following occur in Idle mode:
The CPU stops executing instructions
The WDT is automati cally cleared
The system clock source remains active. By
default, all peripheral modules continue to operate
normally from the system clock source, but can
also be selectively disabled (see Section 9.4
“Peripheral Module Disable”).
If the WDT or FSCM is enabled, the LPRC also
remains active
The device will wake-up from Idle mode on any of these
events:
Any interrupt that is individually enabled
Any device Reset
A WDT time-out
On wake-up from Idle mode, the clock is reapplied to
the CPU and instruction execution will begin (2-4 clock
cycles later), starting with the instruction following the
PWRSAV instruction, or the first instruction in the ISR.
9.2.3 INTERRUPTS COINCIDENT WITH
POWER SAVE INSTRUCTIONS
Any interrupt that coincides with the execution of a
PWRSAV instruction is held off until entry into Sleep or
Idle mode has completed. The device then wakes up
from Sleep or Idle mode.
9.3 Doze Mode
The preferred strategies for reducing power
consumption are changing clock speed and invoking
one of the power-saving modes. In some
circumstances, this may not be practical. For example,
it may be necessary for an application to maintain
uninterrupted synchronous communication, even while
it is doing nothing else. Reducing system clock spee d
can introduce communication errors, while using a
power-saving mode can stop communications
completely.
Doze mode is a simple and effective alternative method
to reduce power consumption while the device is still
executing code. In this mode, the system clock
continues to operate from the same source and at the
same speed. Peripheral modules continue to be
clocked at the same speed, while the CPU clock speed
is reduced. Synchronization between the two clock
domains is maintained, allowing the peripherals to
access the SFRs while the CPU executes code at a
slower rate.
Doze mode is enabled by setting the DOZEN bit
(CLKDIV<11>). The ratio between peripheral and core
clock speed is determined by the DOZE<2:0> bits
(CLKDIV<14:12>). There are eight possible
configurations, from 1:1 to 1:128, with 1:1 being the
default setting.
Programs can use Doze mode to selectively reduce
power consumption in event-driven applications. This
allows clock-sensitive functions, such as synchronous
communications, to continu e witho ut interruption while
the CPU idles, waiting for something to invoke an
interrupt routine. An automatic return to full-speed CPU
operation on interrupts can be enabled by setting the
ROI bit (CLKDIV<15>). By default, interrupt events
have no effect on Doze mode operation.
For example, suppose the device is operating at
20 MIPS and the CAN module has been configured for
500 kbps based on this device operating speed. If the
device is placed in Doze mode with a clock frequency
ratio of 1:4, the CAN module continues to communicate
at the required bit rate of 500 kbps, but the CPU now
starts executing instructions at a frequency of 5 MIPS.
9.4 Peripheral Module Disable
The Peripheral Module Disable (PMD) registers
provide a method to disable a peripheral module by
stopping all clock sources supplied to that module.
When a peripheral is disabled using the appropriate
PMD control bit, the peripheral is in a minimum po wer
consumption state. The control and status registers
associated with the peripheral are also disabled, so
writes to those registers will have no effect and read
values will be invalid.
A peripheral module is enabled only if both the
associated bit in the PMD register is cleared and the
peripheral is supported by the specific dsPIC® DSC
variant. If the peripheral is present in the device, it is
enabled in the PMD registe r by default.
Note: If a PMD bit is set, the corresponding
module is disabled after a delay of one
instruction cycle. Similarly, if a PMD bit is
cleared, the corresponding module is
enabled after a delay of one instruction
cycle (assuming the module control regis-
ters are already configured to enable
module operation).
© 2008-2012 Microchip Technology Inc. DS70318F-page 147
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 9-1: PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1
U-0 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0
T3MD T2MD T1MD PWMMD(1)
bit 15 bit 8
R/W-0 U-0 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0
I2C1MD —U1MD—SPI1MD ADCMD
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13 T3MD: Timer3 Module Disable bit
1 = T imer3 module is disabled
0 = T imer3 module is enabled
bit 12 T2MD: Timer2 Module Disable bit
1 = T imer2 module is disabled
0 = T imer2 module is enabled
bit 11 T1MD: Timer1 Module Disable bit
1 = T imer1 module is disabled
0 = T imer1 module is enabled
bit 10 Unimplemented: Read as ‘0
bit 9 PWMMD: PWM Module Disable bit(1)
1 = PWM module is disabled
0 = PWM module is enabled
bit 8 Unimplemented: Read as ‘0
bit 7 I2C1MD: I2C1 Module Disable bit
1 = I2C1 module is disabled
0 = I2C1 module is enabled
bit 6 Unimplemented: Read as ‘0
bit 5 U1MD: UART1 Module Disable bit
1 = UART1 module is disabled
0 = UART1 module is enabled
bit 4 Unimplemented: Read as ‘0
bit 3 SPI1MD: SPI1 Module Disable bit
1 = SPI1 module is disabled
0 = SPI1 module is enabled
bit 2-1 Unimplemented: Read as ‘0
bit 0 ADCMD: ADC Module Disable bit
1 = ADC module is disabled
0 = ADC module is enabled
Note 1: Once the PWM module is re-enabled (PWMMD is set to ‘1’ and then set to ‘0’), all PWM registers must be
reinitialized.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 148 © 2008-2012 Microchip Technology Inc.
REGISTER 9-2: PMD2: PERIPHERAL MODULE DISABLE CONTROL REGISTER 2
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
——————IC2MDIC1MD
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
——————OC2MDOC1MD
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10 Unimplemented: Read as ‘0
bit 9 IC2MD: Input Capture 2 Mo du l e Disable bit
1 = Input Capture 2 module is disabled
0 = Input Capture 2 module is enabled
bit 8 IC1MD: Input Capture 1 Mo du l e Disable bit
1 = Input Capture 1 module is disabled
0 = Input Capture 1 module is enabled
bit 7-2 Unimplemented: Read as ‘0
bit 1 OC2MD: Output Compare 2 Module Disable bit
1 = Output Compare 2 module is disabled
0 = Output Compare 2 module is enabled
bit 0 OC1MD: Output Compare 1 Module Disable bit
1 = Output Compare 1 module is disabled
0 = Output Compare 1 module is enabled
© 2008-2012 Microchip Technology Inc. DS70318F-page 149
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 9-3: PMD3: PERIPHERAL MODULE DISABLE CONTROL REGISTER 3
REGISTER 9-4: PMD4: PERIPHERAL MODULE DISABLE CONTROL REGISTER 4
U-0 U-0 U-0 U-0 U-0 R/W-0 U-0 U-0
———— CMPMD
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0
bit 10 CMPMD: Analog Comparator Module Disable bit
1 = Analog comparator module is disabled
0 = Analog comparator module is enabled
bit 9-0 Unimplemented: Read as ‘0
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
bit 15 bit 8
U-0 U-0 U-0 U-0 R/W-0 U-0 U-0 U-0
————REFOMD
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-4 Unimplemented: Read as ‘0
bit 3 REFOMD: Reference Clock Genera tor Modu le Disable bit
1 = Reference clock generator module is disabled
0 = Reference clock generator module is enabled
bit 2-0 Unimplemented: Read as ‘0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 150 © 2008-2012 Microchip Technology Inc.
REGISTER 9-5: PMD6: PERIPHERAL MODULE DISABLE CONTROL REGISTER 6
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
——— PWM4MD PWM3MD PWM2MD PWM1MD
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12 Unimplemented: Read as ‘0
bit 11 PWM4MD: PWM Generator 4 Module Disable bit
1 = PWM Generator 4 module is disabled
0 = PWM Generator 4 module is enabled
bit 10 PWM3MD: PWM Generator 3 Module Disable bit
1 = PWM Generator 3 module is disabled
0 = PWM Generator 3 module is enabled
bit 9 PWM2MD: PWM Generator 2 Module Disable bit
1 = PWM Generator 2 module is disabled
0 = PWM Generator 2 module is enabled
bit 8 PWM1MD: PWM Generator 1 Module Disable bit
1 = PWM Generator 1 module is disabled
0 = PWM Generator 1 module is enabled
bit 7-0 Unimplemented: Read as ‘0
© 2008-2012 Microchip Technology Inc. DS70318F-page 151
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 9-6: PMD7: PERIPHERAL MODULE DISABLE CONTROL REGISTER 7
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
——— CMP4MD CMP3MD CMP2MD CMP1MD
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12 Unimplemented: Read as ‘0
bit 11 CMP4MD: Analog Comparator 4 Module Disable bit
1 = Analog Comparator 4 module is disabled
0 = Analog Comparator 4 module is enabled
bit 10 CMP3MD: Analog Comparator 3 Module Disable bit
1 = Analog Comparator 3 module is disabled
0 = Analog Comparator 3 module is enabled
bit 9 CMP2MD: Analog Comparator 2 Module Disable bit
1 = Analog Comparator 2 module is disabled
0 = Analog Comparator 2 module is enabled
bit 8 CMP1MD: Analog Comparator 1 Module Disable bit
1 = Analog Comparator 1 module is disabled
0 = Analog Comparator 1 module is enabled
bit 7-0 Unimplemented: Read as ‘0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 152 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 153
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
10.0 I/O PORTS
All of the device pins (except VDD, VSS, MCLR and
OSC1/CLKI) are shared among the peripherals and the
parallel I/O ports. All I/O input ports feature Schmitt
Trigger inputs for improved noise immunity.
10.1 Parallel I/O (PIO) Ports
Generally a parallel I/O port that shares a pin with a
peripheral is subservient to the peripheral. The
peripheral’s output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has ownership of the output data and control signals of
the I/O pin. The logic also prevents “loop through”, in
which a port’s digital output can drive the input of a
peripheral that shares the same pin. Figure 10-1 shows
how ports are shared with other peripherals and the
associated I/O pin to which they are connected.
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as
a general purpose output pin is disabled. The I/O pin
can be read, but the output driver for the parallel port bit
is disabled. If a peripheral is enabled, but the peripheral
is not actively driving a pin, that pin can be driven by a
port.
All port pins have three registers directly associated
with their operation as digital I/O. The data direction
register (TRISx) determines whether the pin is an input
or an output. If the data direction bit i s ‘1’, then th e pin
is an input. All port pins are defined as inputs after a
Reset. Reads from the latch (LATx) read the latch.
Writes to the latch write the latch. Reads from the port
(PORTx) read the port pins, while writes to the port pins
write the latch.
Any bit and its associated data and control registers
that are not valid for a particular device will be
disabled. That means the corresponding LATx and
TRISx registers and the port pin will read as zeros.
When a pin is shared with another peripheral or
function that is defined as an input only, it is
nevertheless regarded as a dedicated port because
there is no other competing source of outputs.
FIGURE 10-1: BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a compre-
hensive reference source. To comple-
ment the information in this data sheet,
refer to Section 10. “I/O Ports”
(DS70193) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available on Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
QD
CK
WR LAT +
TRIS Latch
I/O Pin
WR PORT
Data Bus
QD
CK
Data Latch
Read PORT
Read TRIS
1
0
1
0
WR TRIS
Peripheral Output Data Output Enable
Peripheral Input Data
I/O
Peripheral Module
Peripheral Output Enable
PIO Module
Output Multiplexers
Output Data
Input Data
Peripheral Module Enable
Read LAT
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 154 © 2008-2012 Microchip Technology Inc.
10.2 Open-Drain Configuration
In addition to the PORT, LAT and TRIS registers for
data control, some digital-only port pins can also be
individually configured for either digital or open-drain
output. This is controlled by the Open-Drain Control
register, ODCx, associated with each port. Setti ng any
of the bits configures the corresponding pin to act as an
open-drain output.
The open-drain feature allows the generation of
outputs higher than VDD (for example, 5V) on any
desired 5V tolerant pins by using external pull-up
resistors. The maximum open-drain voltage allowed is
the same as the maximum VIH specification.
Refer to Pin Diagrams for the available pins and
their functionality.
10.3 Configuring Analog Port Pins
The ADPCFG and TRIS registers control the operation
of the Analog-to-Digital (A/D) port pins. The port pins
that are to function as analog inputs must have their
corresponding TRIS bit set (input). If the TRIS bit is
cleared (output), the digital output level (VOH or VOL)
will be converted.
The ADPCFG register has a default value of 0x0000;
therefore, all pins that share ANx functions are analo g
(not digital) by default.
When the PORT register is read, all pins configured as
analog input channels will read as cleared (a low level).
Pins configured as digital inputs will not convert an
analog input. Analog levels on any pin defined as a
digital input (including the ANx pins) can cause the
input buffer to consume current that exceeds the
device specifications.
10.4 I/O Port Write/Read Timing
One instruction cycle is required between a port direction
change or port write operation and a rea d operation of
the same port. Typically , this instruction would be a NOP.
An example is shown in Example 10-1.
10.5 Input Change Notification
The input change notification function of the I/O
ports allows the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices to generate interrupt
requests to the processor in response to a
Change-Of-State (COS) on selected input pins. This
feature can detect input Change-Of-States even in
Sleep mode, when the clocks are disabled. Depending
on the device pin count, up to 30 external signals (CNx
pin) can be selected (enabled) for generating an
interrupt request on a Change-Of-State.
Four control registers are associated with the CN
module. The CNEN1 and CNEN2 registers contain the
interrupt enable control bits for each of the CN input
pins. Setting any of these bits enables a CN interrupt
for the corresponding pins.
Each CN pin also has a weak pull-up connected to it.
The pull-ups act as a current source connected to the
pin, and eliminate the need for external resistors when
the push button or keypad devices are connected. The
pull-ups are enabled separately using the CNPU1 and
CNPU2 registers, which contain the control bits for
each of the CN pins. Setting any of the control bits
enables the weak pull-ups for the corresponding pins.
EQUATION 10-1: PORT WRITE/READ EXAMPLE
Note: Pull-ups on change notification pins
should always be disabled when the port
pin is configured as a digital output.
MOV 0xFF00, W0 ; Configure POR TB<15:8 > as in puts
MOV W0, TRISBB ; and PORTB<7:0 > as ou tputs
NOP ; Delay 1 cycle
BTSS PORTB, #13 ; Next Instruction
© 2008-2012 Microchip Technology Inc. DS70318F-page 155
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
10.6 Peripheral Pin Select
Peripheral pin select configuration enables peripheral
set selection and placement on a wide range of I/O
pins. By increasing the pinout options available on a
particular device, programmers can better tailor the
microcontroller to their entire application, rather than
trimming the application to fit the device .
The peripheral pin select configuration feature operates
over a fixed subset of digital I/O pi ns. Pro grammers can
independently map the input and/or output of most
digital peripherals to any one of these I/O pins.
Peripheral pin select is performed in software, and gen-
erally does not require the device to be reprogrammed.
Hardware safeguards are included that prevent acciden-
tal or spuriou s changes to the peripheral ma pping, once
it has been est ablished.
10.6.1 AVAILABLE PINS
The peripheral pin select feature is used with a range
of up to 30 pins. The number of available pins depends
on the particular device and its pin count. Pins that
support the peripheral pin select feature include the
designation “RPn” in their full pin designation, where
“RP” designates a remappable peripheral and “n” is the
remappable pin number.
10.6.2 CONTROLLING PERIPHERAL PIN
SELECT
Peripheral pin select features are controlled through
two sets of Special Function Registers: one to map
peripheral inputs and another one to map outputs.
Because they are separately controlled, a particular
peripheral’s input and output (if the peripheral has both)
can be placed on any selectable function pin without
constraint.
The association of a pe ripheral to a peripheral select-
able pin is handled in two different ways, depending on
whether an input or output is being mappe d.
10.6.2.1 Input Mapping
The inputs of the peripheral pin select options are
mapped on the basis of the peripheral. A control
register associated w ith a peripheral dictates the pin it
will be mapped to. The RPINRx registers are used to
configure peripheral input mapp ing (see Register 10-1
through Register 10-14). Each register contains set s of
6-bit fields, with each set associated with one of the
remappable peripherals. Programming a given
peripheral’s bit field with an appropriate 6-bit value
maps the RPn pin with that value to that peripheral. For
any given device, the valid range of values for any bit
field corresponds to the maximum number of peripheral
pin selections supported by the device.
Figure 10-2 Illustrates remappable pin selection for
U1RX input.
FIGURE 10-2: REMAPPABLE MUX
INPUT FOR U1RX
Note: For input mapping only , the Peripheral Pin
Select (PPS) functionality does not have
priority over the TRISx settings. There-
fore, when configuring the RPx pin for
input, the corresponding bit in the TRISx
register must also be configured for input
(i.e., set to ‘1’).
RP0
RP1
RP2
RP33
0
33
1
2U1RX Input
U1RXR<5:0>
to Peripheral
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 156 © 2008-2012 Microchip Technology Inc.
TABLE 10-1: SE L E C TABL E INPUT SOURCES (MAP S I N P U T TO Function)
Input Name Function Name Register Configuration
Bits
External Interrupt 1 INT1 RPINR0 INT1R<5:0>
External Interrupt 2 INT2 RPINR1 INT2R<5:0>
Timer1 External Clock T1CK RPINR2 T1CKR<5:0>
Timer2 External Clock T2CK RPINR3 T2CKR<5:0>
Timer3 External Clock T3CK RPINR3 T3CKR<5:0>
Input Capture 1 IC1 RPINR7 IC1R<5:0>
Input Capture 2 IC2 RPINR7 IC2R<5:0>
Output Compare Fault A OCFA RPINR11 OCFAR<5:0>
UART1 Receive U1RX RPINR18 U1RXR<5:0>
UART1 Clear To Send U1CTS RPINR18 U1CTSR<5:0>
SPI Data Input 1 SDI1 RPINR20 SDI1R<5:0>
SPI Clock Input 1 SCK1 RPINR20 SCK1R<5:0>
SPI Slave Select Input 1 SS1 RPINR21 SS1R<5:0>
PWM Fault Input PWM1 FLT1 RPINR29 FLT1R<5:0>
PWM Fault Input PWM2 FLT2 RPINR30 FLT2R<5:0>
PWM Fault Input PWM3 FLT3 RPINR30 FLT3R<5:0>
PWM Fault Input PWM4 FLT4 RPINR31 FLT4R<5:0>
PWM Fault Input PWM5 FLT5 RPINR31 FLT5R<5:0>
PWM Fault Input PWM6 FLT6 RPINR32 FLT6R<5:0>
PWM Fault Input PWM7 FLT7 RPINR32 FLT7R<5:0>
PWM Fault Input PWM8 FLT8 RPINR33 FLT8R<5:0>
External Synchronization signal to PWM Master Time Base SYNCI1 RPINR33 SYNCI1R <5:0>
External Synchronization signal to PWM Master Time Base SYNCI2 RPINR34 SYNCI2R <5:0>
© 2008-2012 Microchip Technology Inc. DS70318F-page 157
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
10.6.2.2 Output Mapping
In contrast to inputs, the outputs of the peripheral pin
select options are mapped on the basis of the pin. In
this case, a control register associated with a p articular
pin dictates the peripheral output to be mapped. The
RPORx registers are used to control output mapping.
Like the RPINRx registers, each register contains sets
of 6-bit fields, with each set associated with one RPn
pin (see Register 10-15 through Register 10-31). The
value of the bit field corresponds to one of the
peripherals, and that perip heral’s output is mapped to
the pin (see Table 10-2 and Figure 10-3).
The list of peripherals for output mapping also includes
a null value of 00000’ because of the mapping
technique. This permits any given pin to remain
unconnected from the output of any of the pin
selectable peripherals.
FIGURE 10-3: MULTIPLEXING OF
REMAPPABLE OUTPUT
FOR RPn
TABLE 10-2: OUTPUT SELECTION FOR REMAPPABLE PIN (RPn)
0
45
3
RPORn<5:0>
Default
U1TX Output Enable
U1RTS Output Enable 4
PWM4L Output Enable 19
OC2 Output Enable
0
45
3
Default
U1TX Output
U1RTS Output 4
PWM4L Output 19
OC2 Output
Output Enable
Output Data RPn
Function RPORn<5:0> Output Name
NULL 000000 RPn tied to default port pin
U1TX 000011 RPn tied to UART1 transmit
U1RTS 000100 RPn tied to UART1 ready to send
SDO1 000111 RPn tied to SPI1 da ta output
SCK1 001000 RPn tied to SPI1 clock output
SS1 001001 RPn tied to SPI1 sl ave sel e ct ou tp u t
OC1 010010 RPn tied to Output Compare 1
OC2 010011 RPn tied to Output Compare 2
SYNCO1 100101 RPn tied to external device synchronization signal via PWM master time base
REFCLKO 100110 REFCLK output signal
ACMP1 100111 RPn tied to Analog Comparator Output 1
ACMP2 101000 RPn tied to Analog Comparator Output 2
ACMP3 101001 RPn tied to Analog Comparator Output 3
ACMP4 101010 RPn tied to Analog Comparator Output 4
PWM4H 101100 RPn tied to PWM output pins associated with PWM Generator 4
PWM4L 101101 RPn tied to PWM output pins associated with PWM Generator 4
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 158 © 2008-2012 Microchip Technology Inc.
10.6.2.3 Virtual Pins
dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices support four virtual
RPn pins (RP32, RP33, RP34 and RP35), which are
identical in functi onality to all other RPn pins, with th e
exception of pinouts. These four pins are internal to the
devices and are not connected to a physical device pin.
These pins provide a simple way for inter-peripheral
connection without util izing a physica l pin . For example,
the output of the analog comparator can be connected to
RP32 and the PWM Fault input can be configured for
RP32 as well. This configuration allows the analog
comparator to trigger PWM Faults without the use of an
actual physical pin on the device.
10.6.3 CONTROLLING CONFIGURATION
CHANGES
Because peripheral remapping can be changed during
run time, some restrictions on peripheral remapping
are needed to prevent accidental configuration
changes. dsPIC33F devices include three features to
prevent alterations to the peripheral map:
Control register lock sequence
Contin uous state monitoring
Config uration bit pin select lock
10.6.3.1 Control Register Lock
Under normal operation, writes to the RPINRx and
RPORx registers are not allowed. Attempted writes
appear to execute normally, but the contents of the
registers remain unchanged. To change these
registers, they must be unlocked in hardware. The
register lock is controlled by the IOLOCK bit
(OSCCON<6>). Setting IOLOCK prevents writes to the
control registers; clearing IOLOCK allows writes.
To set or clear IOLOCK, a specific command sequence
must be executed:
1. Write 0x 46 to OSC CON<7:0>.
2. Write 0x 57 to OSC CON<7:0>.
3. Clear (or set) IOLOCK as a single operation.
Unlike the similar sequence wi th the oscil lator’s LOCK
bit, IOLOCK remains in one state until changed. This
allows all of th e peripheral pin selects to be configured
with a single unlock sequence followed by an update to
all control registers, then locked with a second lock
sequence.
10.6.3.2 Continuous State Monitoring
In addition to being protected from direct writes, the
contents of the RPINRx and RPORx registers are
constantly monitored in hardware by shadow registers.
If an unexpected change in any of the registers occurs
(such as cell disturbances caused by ESD or other
external events), a Configuration Mismatch Reset will
be triggered.
10.6.3.3 Configuration Bit Pin Select Lock
As an additional level of safety, the device can be
configured to prevent many write session to the
RPINRx and RPORx registers. The IOL1WAY
(FOSC<5>) Configuration bit blocks the IOLOCK bit
from being cleared after it has been set once. If
IOLOCK remains set, the register unlock procedure will
not execute and the Peripheral Pin Select Control
registers cannot be written to. The only way to clear the
bit and re-enab le peripheral re mappin g is to perform a
device Reset.
In the default (unprogrammed) state, IOL1WAY is set,
restricting users to one write session. Programming
IOL1WAY allows user applications unlimited access
(with the proper use of the unlock sequence) to the
Peripheral Pin Select registers.
Note: MPLAB® C30 provides built-in C
language functions for unlocking the
OSCCON register:
__builtin_write_OSCCONL(value)
__builtin_write_OSCCONH(value)
See the MPLAB C30 Help files for more
information.
© 2008-2012 Microchip Technology Inc. DS70318F-page 159
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
10.7 Peripheral Pin Select Registers
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of devices implement
34 registers for remapp able perip heral config uration:
15 Input Remappable Peripheral Registers
19 Output Remappable Peripheral Registers
Not all output remappable peripheral registers are
implemented on all devices. See the specific register
description for further details.
Note: Input and output register values can only
be changed if OSCCON<IOLOCK> = 0.
See Section 10.6.3.1 “Control Register
Lock” for a specific command sequence.
REGISTER 10-1: RPINR0: PERIPHERAL PIN SELECT INPUT REGISTER 0
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—INT1R<5:0>
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 INT1R<5:0>: Assign External Interrupt 1 (INTR1) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
bit 7-0 Unimplemented: Read as ‘0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 160 © 2008-2012 Microchip Technology Inc.
REGISTER 10-2: RPINR1: PERIPHERAL PIN SELECT INPUT REGISTER 1
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—INT2R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6 Unimplemented: Read as ‘0
bit 5-0 INT2R<5:0>: Assign External Interrupt 2 (INTR2) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
© 2008-2012 Microchip Technology Inc. DS70318F-page 161
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 10-3: RPINR3: PERIPHERAL PIN SELECT INPUT REGISTER 3
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—T3CKR<5:0>
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—T2CKR<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 T3CKR<5:0>: Assign Timer3 External Clock (T3CK) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 T2CKR<5:0>: Assign Timer2 External Clock (T2CK) to the Correspondin g RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 162 © 2008-2012 Microchip Technology Inc.
REGISTER 10-4: RPINR7: PERIPHERAL PIN SELECT INPUT REGISTER 7
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
IC2R<5:0>
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
IC1R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 IC2R<5:0>: Assign Input Capture 2 (IC2) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 IC1R<5:0>: Assign Input Capture 1 (IC1) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
© 2008-2012 Microchip Technology Inc. DS70318F-page 163
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 10-5: RPINR11: PERIPHERAL PIN SELECT INPUT REGISTER 11
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—OCFAR<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6 Unimplemented: Read as ‘0
bit 5-0 OCFAR<5:0>: Assign Output Capture A (OCFA) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 164 © 2008-2012 Microchip Technology Inc.
REGISTER 10-6: RPINR18: PERIPHERAL PIN SELECT INPUT REGISTER 18
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
U1CTSR<5:0>
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—U1RXR<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 U1CTSR<5:0>: Assign UART1 Clear to Send (U1CTS) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 U1RXR<5:0>: Assign UART1 Receive (U1RX) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
© 2008-2012 Microchip Technology Inc. DS70318F-page 165
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 10-7: RPINR20: PERIPHERAL PIN SELECT INPUT REGISTER 20
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—SCK1R<5:0>
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—SDI1R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 SCK1R<5:0>: Assign SPI1 Clock Input (SCK1IN) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 SDI1R<5:0>: Assign SPI1 Data Input (SDI1) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 166 © 2008-2012 Microchip Technology Inc.
REGISTER 10-8: RPINR21: PERIPHERAL PIN SELECT INPUT REGISTER 21
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
SS1R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6 Unimplemented: Read as ‘0
bit 5-0 SS1R<5:0>: Assign SPI1 Slave Select Input (SS1IN) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
© 2008-2012 Microchip Technology Inc. DS70318F-page 167
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 10-9: RPINR29: PERIPHERAL PIN SELECT INPUT REGISTER 29
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—FLT1R<5:0>
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 FLT1R<5:0>: Assign PWM Fault Input 1 (FLT 1) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
bit 7-0 Unimplemented: Read as ‘0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 168 © 2008-2012 Microchip Technology Inc.
REGISTER 10-10: RPINR30: PERIPHERAL PIN SELECT INPUT REGISTER 30
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—FLT3R<5:0>
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—FLT2R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 FLT3R<5:0>: Assign PWM Fault Input 3 (FLT3 ) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 FLT2R<5:0>: Assign PWM Fault Input 2 (FLT2) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
© 2008-2012 Microchip Technology Inc. DS70318F-page 169
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 10-11: RPINR31: PERIPHERAL PIN SELECT INPUT REGISTER 31
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—FLT5R<5:0>
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—FLT4R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 FLT5R<5:0>: Assign PWM Fault Input 5 (FLT 5) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 FLT4R<5:0>: Assign PWM Fault Input 4 (FLT 4) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 170 © 2008-2012 Microchip Technology Inc.
REGISTER 10-12: RPINR32: PERIPHERAL PIN SELECT INPUT REGISTER 32
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—FLT7R<5:0>
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—FLT6R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 FLT7R<5:0>: Assign PWM Fault Input 7 (FLT7 ) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 FLT6R<5:0>: Assign PWM Fault Input 6 (FLT6) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
© 2008-2012 Microchip Technology Inc. DS70318F-page 171
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 10-13: RPINR33: PERIPHERAL PIN SELECT INPUT REGISTER 33
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—SYNCI1R<5:0>
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—FLT8R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 SYNCI1R<5:0>: Assign PWM Master Time Base External Synchronization Signal to th e
Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 FLT8R<5:0>: Assign PWM Fault Input 8 (FLT 8) to the Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 172 © 2008-2012 Microchip Technology Inc.
REGISTER 10-14: RPINR34: PERIPHERAL PIN SELECT INPUT REGISTER 34
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—SYNCI2R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6 Unimplemented: Read as ‘0
bit 5-0 SYNCI2R<5:0>: Assign PWM Master Time Base External Synchronization Signal to the
Corresponding RPn Pin bits
111111 = Input tied to VSS
100011 = Input tied to RP35
100010 = Input tied to RP34
100001 = Input tied to RP33
100000 = Input tied to RP32
00000 = Input tied to RP0
REGISTER 10-15: RPOR0: PERIPHERAL PIN SELECT OUTPUT REGISTER 0
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP1R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP0R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP1R<5:0>: Peripheral Output Function is Assigned to RP1 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP0R<5:0>: Peripheral Output Function is Assigned to RP0 Output Pin bits
(see Table 10-2 for peripheral function numbers)
© 2008-2012 Microchip Technology Inc. DS70318F-page 173
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 10-16: RPOR1: PERIPHERAL PIN SELECT OUTPUT REGISTER 1
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP3R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP2R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP3R<5:0>: Peripheral Output Function is Assigned to RP3 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP2R<5:0>: Peripheral Output Function is Assigned to RP2 Output Pin bits
(see Table 10-2 for peripheral function numbers)
REGISTER 10-17: RPOR2: PERIPHERAL PIN SELECT OUTPUT REGISTER 2
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP5R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP4R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP5R<5:0>: Peripheral Output Function is Assigned to RP5 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP4R<5:0>: Peripheral Output Function is Assigned to RP4 Output Pin bits
(see Table 10-2 for peripheral function numbers)
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 174 © 2008-2012 Microchip Technology Inc.
REGISTER 10-18: RPOR3: PERIPHERAL PIN SELECT OUTPUT REGISTER 3
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP7R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP6R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP7R<5:0>: Peripheral Output Function is Assigned to RP7 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP6R<5:0>: Peripheral Output Function is Assigned to RP6 Output Pin bits
(see Table 10-2 for peripheral function numbers)
REGISTER 10-19: RPOR4: PERIPHERAL PIN SELECT OUTPUT REGISTER 4
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP9R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP8R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP9R<5:0>: Peripheral Output Function is Assigned to RP9 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP8R<5:0>: Peripheral Output Function is Assigned to RP8 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1: This register is not implemented in the dsPIC33FJ06GS101 device.
© 2008-2012 Microchip Technology Inc. DS70318F-page 175
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 10-20: RPOR5: PERIPHERAL PIN SELECT OUTPUT REGISTER 5
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—RP11R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP10R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP11R<5:0>: Peripheral Output Function is Assigned to RP11 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP10R<5:0>: Peripheral Output Function is Assigned to RP10 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1: This register is not implemented in the dsPIC33FJ06GS101 device.
REGISTER 10-21: RPOR6: PERIPHERAL PIN SELECT OUTPUT REGISTER 6
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP13R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP12R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP13R<5:0>: Peripheral Output Function is Assigned to RP13 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP12R<5:0>: Peripheral Output Function is Assigned to RP12 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1: This register is not implemented in the dsPIC33FJ06GS101 device.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 176 © 2008-2012 Microchip Technology Inc.
REGISTER 10-22: RPOR7: PERIPHERAL PIN SELECT OUTPUT REGISTER 7
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP15R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP14R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP15R<5:0>: Peripheral Output Function is Assigned to RP15 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP14R<5:0>: Peripheral Output Function is Assigned to RP14 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1: This register is not implemented in the dsPIC33FJ06GS101 device.
REGISTER 10-23: RPOR8: PERIPHERAL PIN SELECT OUTPUT REGISTER 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP17R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP16R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP17R<5:0>: Peripheral Output Function is Assigned to RP17 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP16R<5:0>: Peripheral Output Function is Assigned to RP16 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1: This register is implemented in dsPIC33FJ16GS404 and d sPIC3 3FJ16GS504 devices only.
© 2008-2012 Microchip Technology Inc. DS70318F-page 177
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 10-24: RPOR9: PERIPHERAL PIN SELECT OUTPUT REGISTER 9
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP19R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP18R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP19R<5:0>: Peripheral Output Function is Assigned to RP19 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP18R<5:0>: Peripheral Output Function is Assigned to RP18 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1: This register is implemented in dsPIC33FJ16GS404 and dsPIC33FJ16GS504 devices only.
REGISTER 10-25: RPOR10: PERIPHERAL PIN SELECT OUTPUT REGISTER 10
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP21R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP20R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP21R<5:0>: Peripheral Output Function is Assigned to RP21 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP20R<5:0>: Peripheral Output Function is Assigned to RP20 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1: This register is implemented in dsPIC33FJ16GS404 and dsPIC33FJ16GS504 devices only.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 178 © 2008-2012 Microchip Technology Inc.
REGISTER 10-26: RPOR11: PERIPHERAL PIN SELECT OUTPUT REGISTER 11
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP23R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP22R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP23R<5:0>: Peripheral Output Function is Assigned to RP23 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP22R<5:0>: Peripheral Output Function is Assigned to RP22 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1: This register is implemented in dsPIC33FJ16GS404 and d sPIC3 3FJ16GS504 devices only.
REGISTER 10-27: RPOR12: PERIPHERAL PIN SELECT OUTPUT REGISTER 12
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP25R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP24R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP25R<5:0>: Peripheral Output Function is Assigned to RP25 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP24R<5:0>: Peripheral Output Function is Assigned to RP24 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1: This register is implemented in dsPIC33FJ16GS404 and d sPIC3 3FJ16GS504 devices only.
© 2008-2012 Microchip Technology Inc. DS70318F-page 179
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 10-28: RPOR13: PERIPHERAL PIN SELECT OUTPUT REGISTER 13
REGISTER 10-29: RPOR14: PERIPHERAL PIN SELECT OUTPUT REGISTER 14
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP27R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP26R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP27R<5:0>: Peripheral Output Function is Assigned to RP27 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP26R<5:0>: Peripheral Output Function is Assigned to RP26 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1: This register is implemented in dsPIC33FJ16GS404 and dsPIC33FJ16GS504 devices only.
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP29R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP28R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP29R<5:0>: Peripheral Output Function is Assigned to RP29 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP28R<5:0>: Peripheral Output Function is Assigned to RP28 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1: This register is implemented in dsPIC33FJ16GS404 and dsPIC33FJ16GS504 devices only.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 180 © 2008-2012 Microchip Technology Inc.
REGISTER 10-30: RPOR16: PERIPHERAL PIN SELECT OUTPUT REGISTER 16
REGISTER 10-31: RPOR17: PERIPHERAL PIN SELECT OUTPUT REGISTER 17
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP33R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP32R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP33R<5:0>: Peripheral Output Function is Assigned to RP33 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP32R<5:0>: Peripheral Output Function is Assigned to RP32 Output Pin bits
(see Table 10-2 for peripheral function numbers)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP35R<5:0>
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RP34R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-8 RP35R<5:0>: Peripheral Output Function is Assigned to RP35 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RP34R<5:0>: Peripheral Output Function is Assigned to RP34 Output Pin bits
(see Table 10-2 for peripheral function numbers)
© 2008-2012 Microchip Technology Inc. DS70318F-page 181
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
11.0 TIMER1
The Timer1 module is a 16-bit timer, which can serve
as a time counter for the Real-Time Clock (RTC), or
operate as a free-ru nn i n g interval timer/coun ter.
The Timer1 module has the following unique features
over other timers:
Can be operated from the low-power 32 kHz
crystal oscillator available on the device
Can be operated in Asynchronous Counter mode
from an external clock source
Optionally, the external clock input (T1CK) can be
synchronized to the internal device clock and the
clock synchronization is performed after the
prescaler
The unique features of Timer1 allow it to be used for
Real-Time Clock (RTC) applications. A block diagram
of Timer1 is shown in Figure 11-1.
The T imer1 module can operate in one of the following
modes:
Timer mode
Gated Timer mode
Synchronous Counter mode
Asynchronous Counter mode
In Timer and Gated Timer modes, the input clock is
derived from the internal instructi on cycle clock (FCY).
In Synchronous and Asynchronous Counter modes,
the input clock is derived from the external clock input
at the T1CK pin.
The T imer modes are determined by the following bits:
Timer Clock Source Control bit (TCS): T1CON<1>
Timer Synchronization Control bit (TSYNC):
T1CON<2>
Timer Gate Control bit (TGATE): T1CON<6>
The timer control bit settings for different operating
modes are given in the Table 11-1.
TABLE 11-1: TIMER MODE SETTINGS
FIGURE 11-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 11. “Timers”
(DS70205) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Mode TCS TGATE TSYNC
Timer 00x
Gated Timer 01x
Synchronous
Counter 1x1
Asynchronous
Counter 1x0
TGATE
TCS
00
10
x1
TMR1
Comparator
PR1
TGATE
Set T1IF Flag
0
1
TSYNC
1
0
Sync Equal
Reset
T1CK Prescaler
(/n)
TCKPS<1:0>
Gate
Sync
FCY
Falling Edge
Detect
Prescaler
(/n)
TCKPS<1:0>
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 182 © 2008-2012 Microchip Technology Inc.
REGISTER 11-1: T1CON: TIMER1 CONTROL REGISTER
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
TON —TSIDL
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0
TGATE TCKPS<1:0> —TSYNCTCS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 TON: Timer1 On bit
1 = Starts 16-bit Timer1
0 = Stops 16-bit Timer1
bit 14 Unimplemented: Read as ‘0
bit 13 TSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operati on in Idle mode
bit 12-7 Unimplemented: Read as ‘0
bit 6 TGATE: Timer1 Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disable d
bit 5-4 TCKPS<1:0> Timer1 Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3 Unimplemented: Read as ‘0
bit 2 TSYNC: Timer1 External Clock Input Synchronization Select bit
When TCS = 1:
1 = Synchronize external clock input
0 = Do not synchronize external clock input
When TCS = 0:
This bit is ignored.
bit 1 TCS: Timer1 Clock Source Select bit
1 = External clock from T1CK pin (on the rising edge)
0 = Internal clock (FCY)
bit 0 Unimplemented: Read as ‘0
© 2008-2012 Microchip Technology Inc. DS70318F-page 183
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
12.0 TIMER2/3 FEATURES Timer2 is a Type B timer that offers the following major
features:
A Ty pe B timer can be concatenated with a
Type C timer to form a 32-bit timer
External clock input (TxCK) is always synchronized
to the internal device clock and the clock
synchronization is performed after the prescaler.
Figure 12-1 shows a block diagram of the T ype B timer .
T imer3 is a Type C timer that of fers the following major
features:
A Type C timer can be concatenated with a
Type B timer to form a 32-bit timer
The external clock input (TxCK) is always
synchronized to the internal device clock and the
clock synchronization is performed before the
prescaler
A block diagram of the Type C timer is shown in
Figure 12-2.
FIGURE 12-1: TYPE B T IMER BLOCK DIAGRAM (x = 2)
FIGURE 12-2: TYPE C TIMER BLOCK DIAGRAM (x = 3)
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 11. “Timers”
(DS70205) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available on the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: Timer3 is not available on all devices.
Prescaler
(/n)
TGATE
TCS
00
10
x1
TMRx
Comparator
PRx
TGATE
Set TxIF Flag
0
1
Sync
TCKPS<1:0>
Equal
Reset
TxCK
Gate
Sync
FCY
Falling Edge
Detect
Prescaler
(/n)
TCKPS<1:0>
Prescaler
(/n)
Gate
Sync
TGATE
TCS
00
10
x1
TMRx
Comparator
PRx
FCY
TGATE
Falling Edge
Detect Set TxIF Flag
0
1
Sync
TCKPS<1:0>
Equal
Reset
TxCK
Prescaler
(/n)
TCKPS<1:0>
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 184 © 2008-2012 Microchip Technology Inc.
The Timer2/3 module can operate in one of the
following modes:
Timer mode
Gated Timer mode
Synchronous Counter mode
In Timer and Gated Timer modes, the input clock is
derived from the internal instruction cycle clock (FCY).
In Synchronous Counter mode, the input clock is
derived from the external clock input at the TxCK pin.
The timer modes are determined by the following bits:
TCS (TxCON<1>): Timer Clock Source Control bit
TGATE (TxCON<6>): Timer Gate Control bit
Timer control bit settings for different operating modes
are given in the Table 12-1.
TABLE 12-1: TIMER MODE SETTINGS
12.1 16-bit Operation
To configure any of the timers for individual 16-bit
operation:
1. Clear the T32 bit corresponding to that timer.
2. Select the timer prescaler ratio using the
TCKPS<1:0> bits.
3. Set the Clock and Gating modes using the TCS
and TGATE bits.
4. Load the timer period value into the PRx
register.
5. If interrupts are required, set the interrupt enable
bit, TxIE. Use the priority bits, TxIP<2:0>, to set
the interrupt priority.
6. Set the TON bit.
12.2 32-bit Operation
A 32-bit timer module can be formed by combining a
Type B and a Type C 16-bit timer module. For 32-bit
timer operation, the T32 control bit in the T ype B Timer
Control (TxCON<3>) register must be set. The Type C
timer holds the most significant word (msw) and the
Type B timer holds the least significant word (lsw)
for 3 2-bit operation.
When configured for 32-bit operation, only the Type B
Timer Control (TxCON) register bits are required for
setup and control while the Type C Timer Control
register bits are igno red (except the TSIDL bit).
For interrupt control, the combined 32-bit timer uses
the interrupt enable, interrupt flag and interrupt priority
control bits of the Type C timer. The interrupt control
and status bits for the Type B timer are ignored
during 32-bit timer operation.
The T imer2 and Timer 3 that can be combined to form a
32-bit timer are listed in Table 12-2.
TABLE 12-2: 32-BIT TIMER
A block diagram representation of the 32-bit timer
module is shown in Figure 12-3. The 32-timer module
can operate in one of the following modes:
Timer mode
Gated Timer mode
Synchronous Counter mode
To configure the features of Timer2/3 for 32-bit
operation:
1. Set the T32 control bit.
2. Select the prescaler ratio for Timer2 using the
TCKPS<1:0> bits.
3. Set the Clock and Gating modes using the
corresponding TCS and TGATE bits.
4. Load the timer period value. PR3 contains the
most significant word of the value, while PR2
contains the least significant word.
5. If interrupts are required, set the interrupt enable
bit, T3IE. Use the priority bits, T3IP<2:0>, to set
the interrupt priority. While Timer2 controls the
timer, the interrupt appears as a Timer3
interrupt.
6. Set the corresponding TON bit.
The timer value at any point is stored in the register
pair, TMR3:TMR2, which always contains the most
significant word of the count, while TMR2 contains the
least significant word.
Mode TCS TGATE
Timer 00
Gated Timer 01
Synchronous Counter 1x
Type B Timer (lsw) Type C Timer (msw)
Timer2 Timer3
© 2008-2012 Microchip Technology Inc. DS70318F-page 185
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 12-3: 32-BIT TIMER BLOCK DIAGRAM
Prescaler
(/n)
TGATE
TCS
00
10
x1
TMRx(1)
PRx
TGATE
Set TyIF
0
1
Sync
TCKPS<1:0>
Equal
TxCK
Gate
Sync
FCY
Falling Edge
Detect
Prescaler
(/n)
TCKPS<1:0> TMRy(2)
Comparator
PRy
Reset
msw
lsw
TMRyHLD
Data Bus <15:0>
Flag
Note 1: Timerx is a Type B Timer (x = 2).
2: Timery is a Type C Timer (y = 3).
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 186 © 2008-2012 Microchip Technology Inc.
REGISTER 12-1: TxCON: TIMER CONTROL REGISTER (x = 2)
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
TON —TSIDL
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0
TGATE TCKPS<1:0> T32 —TCS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 TON: Timer x On bit
When T32 = 1 (in 32-bit Timer mode):
1 = Starts 32-bit TMRx:TMRy timer pair
0 = Stops 32-bit TMRx:TMRy timer pair
When T32 = 0 (in 16-bit Timer mode):
1 = Starts 16-bit timer
0 = Stops 16-bit timer
bit 14 Unimplemented: Read as ‘0
bit 13 TSIDL: Stop in Idle Mode bit
1 = Discontinue timer operation when device enters Idle mode
0 = Continue timer operation in Idle mode
bit 12-7 Unimplemented: Read as ‘0
bit 6 TGATE: Timerx Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disable d
bit 5-4 TCKPS<1:0>: Timerx Input Clock Prescale Select bits
11 = 1:256 prescale value
10 = 1:64 prescale value
01 = 1:8 prescale value
00 = 1:1 prescale value
bit 3 T32: 32-bit Timerx Mode Select bit
1 = TMRx and TMRy form a 32-bit timer
0 = TMRx and TMRy form separate 16-bit timer
bit 2 Unimplemented: Read as ‘0
bit 1 TCS: Timerx Clock Source Select bit
1 = External clock from TxCK pin
0 = Internal clock (FOSC/2)
bit 0 Unimplemented: Read as ‘0
© 2008-2012 Microchip Technology Inc. DS70318F-page 187
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 12-2: TyCON: TIMER CONTROL REGISTER (y = 3)
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
TON(2) —TSIDL
(1)
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 U-0
— TGATE
(2) TCKPS<1:0>(2) —TCS
(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 TON: Timer y On bit(2)
1 = Starts 16-bit Timery
0 = Stops 16-bit Timery
bit 14 Unimplemented: Read as ‘0
bit 13 TSIDL: Stop in Idle Mode bit(1)
1 = Discontinue timer operation when device enters Idle mode
0 = Continue timer operation in Idle mode
bit 12-7 Unimplemented: Read as ‘0
bit 6 TGATE: Timery Gated Time Accumulation Enable bit (2)
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disabled
bit 5-4 TCKPS<1:0>: Timery Input Clock Prescale Select bits(2)
11 = 1:256 prescale value
10 = 1:64 prescale value
01 = 1:8 prescale value
00 = 1:1 prescale value
bit 3-2 Unimplemented: Read as ‘0
bit 1 TCS: Timery Clock Source Select bit(2)
1 = External clock from TxCK pin
0 = Internal clock (FOSC/2)
bit 0 Unimplemented: Read as ‘0
Note 1: When 32-bit timer operation is enabled (T32 = 1) in the Timer Control register (TxCON<3>), the TSIDL bit
must be cleared to operate the 32-bit timer in Idle mode.
2: When the 32-bit timer operation is enabled (T32 = 1) in the Timer Control (TxCON<3>) register, these bits
have no effect.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 188 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 189
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
13.0 INPUT CAPTURE
The input capture module is useful in applications
requiring frequency (period) and pulse measurement.
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices support up to two
input capture channels.
The input capture module captures the 16-bit value of
the selected Time Base register when an event occurs
at the ICx pin. The events that cause a capture event
are listed below in three categories:
Simple Capture Event modes:
- Capture timer value on every falling edge of
input at ICx pin
- Capture timer value on every rising edge of
input at ICx pin
Captu re timer value on every edge (rising and
falling)
Prescaler Capture Event modes:
- Capture timer value on every 4th rising edge
of input at ICx pin
- Capture timer value on every 16th rising
edge of input at ICx pin
Each input capture channel can select one of the
two 16-bit timers (Timer2 or Timer3) for the time
base. The selected timer can use either an internal
or external clock.
Other operational features include:
Device wake-up from captur e pin during CPU
Sleep and Idle modes
Interrupt on input capture event
4-word FIFO buffer for capture values
- Interrupt optionally generated after 1, 2, 3 or
4 buffer locations are filled
Use of input capture to provide additional sources
of external interrupts
FIGURE 13-1: INPUT CAPTURE BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 12. “Input Cap-
ture” (DS70198) in the “dsPIC33F/
PIC24H Family Reference Manual,
which is available on the Microchip web
site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
ICxBUF
ICx Pin ICM<2:0> (ICxCON<2:0 > )
Mode Select
3
10
Set Flag ICxIF
(in IFSx Register)
TMR2 TMR3
Edge Detection Logic
16 16
FIFO
R/W
Logic
ICxI<1:0>
ICOV, ICBNE (ICxCON<4:3>)
ICxCON Interrupt
Logic
System Bus
From 16-bit Timers
ICTMR
(ICxCON<7>)
FIFO
Prescaler
Counter
(1, 4, 16) and
Clock Synchronizer
Note 1: An ‘x’ in a signal, register or bit name denotes the number of the capture channel.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 190 © 2008-2012 Microchip Technology Inc.
13.1 Input Capture Register
REGISTER 13-1: ICxCON: INPUT CAPTURE x CONTROL REGISTER (x = 1, 2)
U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
—ICSIDL
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R-0, HC R -0, HC R/W-0 R/W-0 R/W-0
ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>
bit 7 bit 0
Legend: HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimple mented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13 ICSIDL: Input Capture Module Stop in Idle Control bit
1 = Input capture module halts in CPU Idle mode
0 = Input capture module continues to operate in CPU Idle mode
bit 12-8 Unimplemented: Read as ‘0
bit 7 ICTMR: Input Capture Timer Select bits
1 = TMR2 contents are captured on capture event
0 = TMR3 contents are captured on capture event
bit 6-5 ICI<1:0>: Select Number of Captures per Interrupt bits
11 = Interrupt on every fourth capture event
10 = Interrupt on every third capture event
01 = Interrupt on every second capture event
00 = Interrupt on every capture event
bit 4 ICOV: Input Capture Overflow Status Flag bit (read-only)
1 = Input capture overflow occurred
0 = No input capture overflow occurred
bit 3 ICBNE: Input Capture Buffer Empty Status bit (read-only)
1 = Input capture buffer is not empty, at least one more capture value can be read
0 = Input capture buffer is empty
bit 2-0 ICM<2:0>: Input Capture Mode Select bits
111 = Input capture functions as interrupt pin only when device is in Sleep or Idle mode. Rising edge
detect-only, all other control bits are not applicable.
110 = Unused (module disabled)
101 = Capture mode, every 16th rising edge
100 = Capture mode, every 4th rising edge
011 = Capture mode, every rising edge
010 = Capture mode, every falling edge
001 = Capture mode, every edge (rising and falling). ICI<1:0> bits do not control interrupt generation
for this mode.
000 = Input capture module turned off
© 2008-2012 Microchip Technology Inc. DS70318F-page 191
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
14.0 OUTPUT COMPARE The output compare module can select either T imer2 or
Timer3 for its time base. The module compares the
value of the timer with the value of one or two Compare
registers depending on the operating mode selected.
The state of the output pin changes when the timer
value matches the Compare register value. The output
compare module generates either a single output
pulse, or a sequence of output pulses, by changing the
state of the output pin on the compare match events.
The output compare module can also generate
interrupts on compare match events.
The output compare module has multiple operating
modes:
Active-Low One-Sho t mode
Active-High One- Sho t mode
Toggle mode
Delayed One-Shot mode
Continuous Pulse mode
PWM mode without Faul t Protection
PWM mode with Fault Prote c tion
FIGURE 14-1: OUTPUT COMP ARE MODULE BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 13. “Output
Compare” (DS70209) in the “dsPIC33F/
PIC24H Family Reference Manual,
which is available on the Microchip web
site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
OCxR
Comparator
Output
Logic
OCM<2:0>
Output Enable
OCx
Set Flag bit
OCxIF
OCxRS
Mode Select
3
01
OCTSEL 01
16
16
OCFA
TMR2 TMR2
QS
R
TMR3 TMR3
Rollover Rollover
Note: An ‘x’ in a signal, register or bit name denotes the number of the output compare channels.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 192 © 2008-2012 Microchip Technology Inc.
14.1 Output Compare Modes
Configure the Output Compare modes by setting the
appropriate Output Compare Mode (OCM<2:0>) bits in
the Output Compare Control (OCxCON<2:0>) register .
Table 14-1 lists the different bit settings for the Output
Compare modes. Figure 14-2 illustrates the output
compare operation for various modes. The user
application must disable the associated timer when
writing to the Output Compare Control registers to
avoid malfunctions.
TABLE 14-1: OUTPUT COMPARE MODES
FIGURE 14-2: OUTPUT COMPARE OPERATION
Note: Refer to Section 13. “Output Compare”
(DS70209) in the “dsPIC33F/PIC24H
Family Reference Manual” for OCxR and
OCxRS register restrictions.
OCM<2:0> Mode OCx Pin Initial State O Cx Interrupt Generation
111 PWM with Fault Protection 0’, if OCxR is zero
1’, if OCxR is non-zero OCFA falling edge for OC1 to OC4
110 PWM without Fault Protection 0’, if OCxR is zero
1’, if OCxR is non-zero No interrupt
101 Continuous Pulse 0OCx falling edge
100 Delayed One-Shot 0OCx falling edge
011 Toggle Current output is maintained OCx rising and falling edge
010 Active-High One-Shot 1OCx falling edge
001 Active-Low One-Shot 0OCx rising edge
000 Module Disabled Controlled by GPIO register
OCxRS
TMRy OCxR
Timer is Reset on
Period Match
Continuous Pulse
(OCM = 101)
PWM
(OCM = 110 or 111)
Active-Low One-Shot
(OCM = 001)
Active-High One-Shot
(OCM = 010)
Toggle
(OCM = 011)
Delayed One-Shot
(OCM = 100)
Output Compare
Mode Enabled
© 2008-2012 Microchip Technology Inc. DS70318F-page 193
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 14-1: OCxCON: OU TPUT COMPARE x CONTROL REGISTER (x = 1, 2)
U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
—OCSIDL
bit 15 bit 8
U-0 U-0 U-0 R-0, HC R/W-0 R/W-0 R/W-0 R/W-0
OCFLT OCTSEL OCM<2:0>
bit 7 bit 0
Legend: HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13 OCSIDL: Sto p Output Compare in Idle Mode Control bit
1 = Output Compare x halts in CPU Idle mode
0 = Output Compare x continues to operate in CPU Idle mode
bit 12-5 Unimplemented: Read as ‘0
bit 4 OCFLT: PWM Fault Condition Status bit
1 = PWM Fault condition has occurred (cleared in hardware on ly)
0 = No PWM Fault condition has occurred (this bit is only used when OCM<2:0> = 111)
bit 3 OCTSEL: Output Compare Timer Select bit
1 = Timer3 is the clock source for Compare x
0 = Timer2 is the clock source for Compare x
bit 2-0 OCM<2:0>: Output Compare Mode Select bits
111 = PWM mode on OCx, Fault pin enabled
110 = PWM mode on OCx, Fault pin disabled
101 = Initialize OCx pin low, generate con tinuous output pulses on OCx pin
100 = Initialize OCx pin low, generate sin gle output pulse on OCx pin
011 = Compare event toggles OCx pin
010 = Initialize OCx pin high, compare event forces OCx pin low
001 = Initialize OCx pin low, compare event forces OCx pin high
000 = Output compare channel is disabled
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 194 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 195
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
15.0 HIGH-SPEED PWM
The high-speed PWM module on the
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 devices supports a wide variety of PWM modes
and output formats. This PWM module is ideal for
power conversion applications, such as:
AC/DC Converters
DC/DC Converters
Power Factor Correction (PFC)
Uninterruptible Power Supply (UPS)
•Inverters
Battery Cha r gers
Digital Lighting
15.1 Features Overview
The high-speed PWM module incorporates the
following features:
2-4 PWM generators with 4-8 outputs
Individual time base and duty cycle for each of the
eight PWM outputs
Dead time for rising and falling edges:
Duty cycle resolution of 1.04 ns
Dead-time resolution of 1.04 ns
Phase shift resolution of 1.04 ns
Frequency resolution of 1.04 ns
PWM modes supporte d:
- Standard Edge-Aligned
- True Independent Output
- Complementary
- Center-Aligned
- Push-Pull
- Multiphase
- Variable Phase
- Fixed Off-Time
- Current Reset
- Current-Limit
Independent Fault/Current-Limit inputs for each of
the eight PWM outputs
Output override control
Special Event Trigger
PWM capture feature
Prescaler for input clock
Dual trig ger from PWM to ADC
PWMxH, PWMxL output pin swapping
PWM4H, PWM4L pins remappable
On-the-fly PWM frequency, duty cycle and phase
shift changes
Disabling of Individual PWM generators to reduce
power consumption
Leading-Edge Blanking (LEB) functionality
Figure 15-1 conceptualizes the PWM module in a
simplified block diagram. Figure 15-2 illustrates how
the module hardware is partitioned for each PWM
output pair for the Complementary PWM mode. Each
functional unit of the PWM module is discussed in
subsequent sections.
The PWM module contains four PWM generators. The
module has up to eight PWM output pins: PWM1H,
PWM1L, PWM2H, PWM2L, PWM3H, PWM3L,
PWM4H and PWM4L. For complementary outputs,
these eight I/O pins are grouped into H/L pairs.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a compre-
hensive reference source. To comple-
ment the information in this data sheet,
refer to Section 43. “High- Speed
PWM” (DS70323) in the “dsPIC33F/
PIC24H Family Reference Manual,
which is available on the Microchip web
site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: Duty cycle, dead-time, phase shift and
frequency resolution is 8.32 ns in
Center-Aligned PWM mode.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 196 © 2008-2012 Microchip Technology Inc.
15.2 Feature Description
The PWM module is designed for applications that
require:
High-resolution at high PWM frequencies
The ability to drive Stan dard, Edge-Aligned,
Center-Aligned Complementary mode, an d
Push-Pull mode outputs
The ability to create multiphase PWM outputs
For Center-Aligned mode, the duty cycle, period phase
and dead-time resolutions will be 8.32 ns.
Two common, medium power converter topologies are
push-pull and half-bridge. These designs require the
PWM output signal to be switched between alternate
pins, as provided by the Push-Pull PWM mode.
Phase-shifted PWM describes the situation where
each PWM generator provide s outputs, but the phase
relationship between the generator outputs is
specifiable and changeable.
Multiphase PWM is often used to improve DC/DC
converter load transient response, and reduce the size
of output filter capacitors and inductors. Multiple DC/
DC converters are often operated in parallel, but
phase-shifted in time. A single PWM output operating
at 250 kHz has a period of 4 μs, but an array of four
PWM channels, staggered by 1 μs each, yields an
effective switching frequency of 1 MHz. Multiphase
PWM applications typically use a fixed-phase
relationship.
Variable phase PWM is useful in Zero Voltage
Transition (ZVT) power converters. Here, the PWM
duty cycle is always 50%, and the power flow is
controlled by varying the relative phase shift between
the two PWM generators.
© 2008-2012 Microchip Technology Inc. DS70318F-page 197
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 15-1: SIMPLIFIED CONCEPTUAL BLOCK DIAGRAM OF HIGH-SPEED PWM
MUX
Latch
Comparator
Timer
PDC2
Phase
MUX
Latch
Comparator
Timer
PDC3
Phase
MUX
Latch
Comparator
Timer
PDC4
Phase
MUX
Latch
Comparator
Timer
PDC1
PWMCONx
LEBCONx
Channel 1
Dead-Time Generator
PTCON
SEVTCMP
Comparator Special Event
IOCONx
PWM Enable and Mode Control
Channel 3
Dead-Time Generator
Channel 4
Dead-Time Generator
ALTDTRx, DTRx Dead-Time Control
Special Event
Postscaler
FLTX(1)
PWM3L
PWM3H
PWM2L
PWM2H
16-bit Data Bus
PWM1L
PWM1H
FCLCONx
Pin and Mode Control
MDC
ADC Trigger Control
Master Duty Cycle Register
Fault Mode and Pin Control
Pin Override Control
Special Event
PTPER
Timer Period
PWM GEN 1
PWM GEN 2
PWM GEN 4
PTMR
Master Time Base
Phase
PWM GEN 3
Channel 2
Dead-Time Generator
PWM4L(1)
PWM4H(1)
PWM User, Current-Limit and Fault Override and Routing Logic
Fault CLMT Override Logic
Trigger
Comparison Value
Fault Control
Logic
TRGCONx
Control for Blanking External Input Signals
SYNCO(1)
SYNCIX(1)
Note 1: These pins are remappable.
External Time Base
Synchronization
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 198 © 2008-2012 Microchip Technology Inc.
FIGURE 15-2: PARTITIONED OUTPUT PAIR, COMPLEMENTARY PWM MODE
15.3 Control Registers
The following registers control the operation of the
high-speed PWM module.
PTCON: PWM Time Base Control Register
PTCON2: PWM Clock Divider Select Register
PTPER: PWM Master Time Base Register
SEVTCMP: PWM Special Event Compare
Register
MDC: PWM Master Duty Cycle Register
PWMCONx: PWMx Control Register
PDCx: PWMx Generator Duty Cycle Register
PHASEx: PWMx Primary Phase Shift Register
(provides the local time base period for PWMxH)
DTRx: PWMx Dead-Time Register
ALTDTRx: PWMx Alternate Dead-Time Register
SDCx: PWMx Secondary Duty Cycle Register
SPHASEx: PWMx Secondary Phase Shift
Register (provides the local time base for
PWMxL)
TRGCONx: PWMx Trigger Control Register
IOCONx: PWMx I/O Control Register
FCLCONx: PWMx Fault Current-Limit Control
Register
TRIGx: PWMx Primary Trigger Compare Value
Register
STRIGx: PWMx Secondary Trigger Compare
Value Register
LEBCONx: Leading-Edge Blanking Control
Register
PWMCAPx: Primary PWMx Time Base Capture
Register
PWM Duty Cycle Register
Duty Cycle Comparator
Fault Override Values
Channel Override Values
Fault Pin Assignment Logic
Fault Pin
PWMXH
PWMXL
TMR < PDC PWM
Override
Logic
Dead-Time
Logic
Fault Active
Phase Off set
M
U
X
M
U
X
Timer/Counter
© 2008-2012 Microchip Technology Inc. DS70318F-page 199
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 15-1: PTCON: PWM TIME BASE CONTROL REGISTER
R/W-0 U-0 R/W-0 HS/HC-0 R/W-0 R/W-0 R/W-0 R/W-0
PTEN PTSIDL SESTAT SEIEN EIPU(1) SYNCPOL(1) SYNCOEN(1)
bit 15 bit 8
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SYNCEN(1) SYNCSRC<1:0>(1) SEVTPS<3:0>(1)
bit 7 bit 0
Legend: HC = Hardware Clearable bit HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 PTEN: PWM Module Enable bit
1 = PWM module is enabled
0 = PWM module is disabled
bit 14 Unimplemented: Read as ‘0
bit 13 PTSIDL: PWM Time Base Stop in Idle Mode bit
1 = PWM time base halts in CPU Idle mode
0 = PWM time base runs in CPU Idle mode
bit 12 SESTAT: Special Event Interrupt Status bit
1 = Special event interrupt is pending
0 = Special event interrupt is not pending
bit 11 SEIEN: Special Event Interrupt Enable bit
1 = Special event interrupt is enabled
0 = Special event interrupt is disabled
bit 10 EIPU: Enable Immediate Period Updates bit(1)
1 = Active Period register is updated immediately
0 = Active Period register updates occur on PWM cycle boundaries
bit 9 SYNCPOL: Synchronization Input/Output Polarity bit(1)
1 = SYNCIx and SYNCO polarity is inverted (active-low)
0 = SYNCIx and SYNCO are active-high
bit 8 SYNCOEN: Primary Time Base Sync Enable bit(1)
1 = SYNCO output is enabled
0 = SYNCO output is disabled
bit 7 SYNCEN: External Time Base Synchronization Enable bit(1)
1 = External synchronization of primary time base is enabled
0 = External synchronization of primary time base is disabled
bit 6 Unimplemented: Read as ‘0
bit 5-4 SYNCSRC<1:0>: Synchronous Source Selection bits(1)
11 = Reserved
10 = Reserved
01 = SYNCI2
00 = SYNCI1
bit 3-0 SEVTPS<3:0>: PWM Sp ecial Event Trigger Output Postscaler Select bits(1)
1111 = 1:16 Postscaler generates a S pecial Event Trigger trigger on every sixteenth compare match event
0001 = 1:2 Postscaler generates a Special Event Trigger on every seco nd compare match event
0000 = 1:1 Postscaler generates a Special Event Trigger on every compare match event
Note 1: These bits should be changed only when PTEN = 0. In addition, when using the SYNCIx feature, the user
application must program the period register with a value that is slightly larger than the expected period of
the external synchronization input signal.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 200 © 2008-2012 Microchip Technology Inc.
REGISTER 15-2: PTCON2: PWM CLOCK DIVIDER SELECT REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
PCLKDIV<2:0>(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 Unimplemented: Read as ‘0
bit 2-0 PCLKDIV<2:0>: PWM Input Clock Prescaler (Divider) Select bits(1)
111 = Reserved
110 = Divide by 64, maximum PWM timing resolution
101 = Divide by 32, maximum PWM timing resolution
100 = Divide by 16, maximum PWM timing resolution
011 = Divide by 8, maximum PWM timing resolution
010 = Divide by 4, maximum PWM timing resolution
001 = Divide by 2, maximum PWM timing resolution
000 = Divide by 1, maximum PWM timing resolution (Power-on default)
Note 1: These bits should be changed only when PTEN = 0. Changing the clock selection durin g operation will
yield unpredictable results.
REGISTER 15-3: PTPER: PWM MASTER TIME BASE REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
PTPER <15:8>
bit 15 bit 8
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0
PTPER <7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 PTPER<15:0>: PWM Master Time Base (PMTMR) Period Value bits
Note 1: The minimum value that can be loaded into the PTPER register is 0x0010 and the maximum value is
0xFFF8.
© 2008-2012 Microchip Technology Inc. DS70318F-page 201
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 15-4: SEVTCMP: PWM SPECIAL EVENT COMPARE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SEVTCMP <12:5>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0
SEVTCMP <4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 SEVTCMP<12:0>: Spe cial Event Compare Count Value bits
bit 2-0 Unimplemented: Read as ‘0
REGISTER 15-5: MDC: PWM MASTER DUTY CYCLE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
MDC<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
MDC<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 MDC<15:0>: Master PWM Duty Cycle Value bits
Note 1: The smallest pulse width that can be gen erated on the PWM output corresponds to a value of 0x0009,
while the maximum pulse width generated corresp onds to a value of Period – 0x0008.
2: As the duty cycle gets closer to 0% or 100% of the PWM period (0 ns-40 ns, depending on the mode of
operation), the PWM duty cycle resolution will degrade from 1 LSB to 3 LSB.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 202 © 2008-2012 Microchip Technology Inc.
REGISTER 15-6: PWMCONx: PWMx CONTROL REGISTER
HS/HC-0 HS/HC-0 HS/HC-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
FLTSTAT(1) CLSTAT(1) TRGSTAT FLTIEN CLIEN TRGIEN ITB(3) MDCS(3)
bit 15 bit 8
R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
DTC<1:0> —CAM
(2,3) XPRES(4) IUE
bit 7 bit 0
Legend: HC = Hardware Clearable bit HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 FLTSTAT: Fault Interrupt Status bit(1)
1 = Fault interrupt is pending
0 = No Fault interrupt is pending. This bit is cleared by setting FLTIEN = 0.
bit 14 CLSTAT: Current-Limit Interrupt Status bit(1)
1 = Current-limit interrupt is pending
0 = No current-limit interrupt is pending. This bit is cleared by setting CLIEN = 0.
bit 13 TRGSTAT: Trigger Interrupt Status bit
1 = Trigger interrupt is pending
0 = No trigger interrupt is pendin g. This bit is cleared by setting TRGIEN = 0.
bit 12 FLTIEN: Fault Interrupt Enable bit
1 = Fault interrupt is enabled
0 = Fault interrupt is disabled and the FLTSTAT bit is cleared
bit 11 CLIEN: Current-Limit Interrupt Enable bit
1 = Current-limit interrupt enabled
0 = Current-limit interrupt disabled and the CLSTAT bit is cleared
bit 10 TRGIEN: Trigger Interrupt Enable bit
1 = A trigger event generates an interrupt request
0 = Trigger event interrupts are disabled and the TRGSTAT bit is cleared
bit 9 ITB: Independent Time Base Mode bit(3)
1 = PHASEx/SPHASEx register provides time base period for this PWM generator
0 = PTPER register provides timing for this PWM generator
bit 8 MDCS: Master Duty Cycle Register Select bit(3)
1 = MDC register provides duty cycle information for this PWM generator
0 = PDCx/SDCx register provides duty cycle information for this PWM generator
bit 7-6 DTC<1:0>: Dead-Time Control bits
11 = Reserved
10 = Dead-time function is disabled
01 = Negative dead time actively applied for all output modes
00 = Positive dead time actively applied for all outpu t modes
bit 5-3 Unimplemented: Read as ‘0
Note 1: Software must clear the interrupt status here and the corresponding IFS bit in the interrupt controller.
2: The Independent Time Base mode (ITB = 1) must be enabled to use Center-Aligned mode. If ITB = 0, the
CAM bit is ignored.
3: These bits should be changed only when PTEN = 0. Changing the clock selection during operation will
yield unpredictable results.
4: To operate in External Period Reset mode, configure FCLCONx<CLMOD> = 0 and PWMCONx<ITB> = 1.
© 2008-2012 Microchip Technology Inc. DS70318F-page 203
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 2 CAM: Center-Aligned Mode Enable bit(2,3)
1 = Center-Aligned mode is enabled
0 = Center-Aligned mode is disabled
bit 1 XPRES: External PWM Reset Control bit(4)
1 = Current-limit source resets time base for this PWM generator if it is in Independent T ime Base mode
0 = External pins do not affect PWM time base
bit 0 IUE: Immediate Update Enable bit
1 = Updates to the active MDC/PDCx/SDCx registers are immedi ate
0 = Updates to the active MDC/PDCx/SDCx registers are synchron ized to the PWM time base
REGISTER 15-6: PWMCONx: PWMx CONTROL REGISTER (CONTINUED)
Note 1: Software must clear the interrupt status here and the corresponding IFS bit in the interrupt controller.
2: The Independent Time Base mode (ITB = 1) must be enabled to use Center-Aligned mode. If ITB = 0, the
CAM bit is ignored.
3: These bits should be changed only when PTEN = 0. Changing the clock selection during operation will
yield unpredictable results.
4: To operate in External Period Reset mode, configure FCLCONx<CLMOD> = 0 and PWMCONx<ITB> = 1.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 204 © 2008-2012 Microchip Technology Inc.
REGISTER 15-7: PDCx: PWMx GENERATOR DUTY CYCLE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PDCx<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PDCx<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 PDCx<15:0>: PWM Generator # Duty Cycle Value bits
Note 1: In Independent PWM mode, the PDCx regi ster controls the PWMxH duty cycle only. In Complementary,
Redundant and Push-Pull PWM modes, the PDCx register controls the duty cycle of both the PWMxH and
PWMxL. The smallest pulse width that can be generated on th e PWM output corresponds to a val ue of
0x0009, while the maximum pulse width generated corresponds to a value of Period-0x0008.
2: As the duty cycle gets closer to 0% or 100% of the PWM period (0 ns-40 ns, depending on the mode of
operation), the PWM duty cycle resolution will degrade from 1 LSB to 3 LSB.
REGISTER 15-8: SDCx: PWMx SECONDARY DUTY CYCLE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SDCx<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SDCx<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 SDCx<15:0>: Secondary Duty Cycle for PWMxL Output Pin bits
Note 1: The SDCx register is used in Independent PWM mode only. When use d in Independent PWM mode, the
SDCx register controls the PWMxL duty cycle. The smallest pulse width that can be generated on the
PWM output corresponds to a value of 0x0009, while the maximum pulse width generated corresponds to
a value of Period-0x0008.
2: As the duty cycle gets closer to 0% or 100% of the PWM period (0 ns-40 ns, depending on the mode of
operation), the PWM duty cycle resolution will degrade from 1 LSB to 3 LSB.
© 2008-2012 Microchip Technology Inc. DS70318F-page 205
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 15-9: PHASEx: PWMx PRIMARY PHASE SHIFT REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PHASEx<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PHASEx<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 PHASEx<15:0>: PWM Phase Shif t Value or Independent T ime Base Period for this PWM Generator bits
Note 1: If PWMCONx<ITB> = 0, the following applies base d on the mode of operation:
• Complementary, Redundant and Push-Pull Output mode (IOCONx<PMOD> = 00, 01, or 10)
PHASEx<15:0> = Phase shift value for PWMxH and PWMxL outputs
• True Independent Output mode (IOCONx<PMOD> = 11) PHASEx<15:0> = Phase shift value for
PWMxL only
2: If PWMCONx<ITB> = 1, the following applies based on the mode of operation:
• Complementary, Redun dant, and Push-Pull Output mode (IOCONx<PMOD> = 00, 01, or 10)
PHASEx<15:0> = Independent time base period value for PWMxH and PWMxL
T rue Independent Output mode (IOCONx<PMOD> = 11) PHASEx<15:0> = Independent time base
period value for PWMxL only
Th e smallest pulse width that can be generated on the PWM output corresponds to a value of
0x0008, while the maximum pulse width generated corresponds to a value of Period - 0x0008.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 206 © 2008-2012 Microchip Technology Inc.
REGISTER 15-10: SPHASEx: PWMx SECONDARY PHASE SHIFT REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SPHASEx<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SPHASEx<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 SPHASEx<15:0>: Secondary Phase Offset for PWMxL Output Pin bits
(used in Independent PWM mode only)
Note 1: If PWMCONx<ITB> = 0, the following applies base d on the mode of operation:
Complementary, Redundant and Push-Pull Output mode (IOCONx<PMOD> = 00, 01, or 10) SPHA-
SEx<15:0> = Not used
• True Independent Output mode (IOCONx<PMOD> = 11) PHASEx<15:0> = Phase shift value for
PWMxL only
2: If PWMCONx<ITB> = 1, the following applies base d on the mode of operation:
Complementary, Redundant and Push-Pull Output mode (IOCONx<PMOD> = 00, 01, or 10) SPHA-
SEx<15:0> = Not used
True Independent Output mode (IOCONx<PMOD> = 11) PHASEx<15:0> = Independent time base
period value for PWMxL only
© 2008-2012 Microchip Technology Inc. DS70318F-page 207
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
.
REGISTER 15-11: DTRx: PWMx DEAD-TIME REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DTRx<13:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DTRx<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-0 DTRx<13:0>: Unsigned 14-bit Dead-Time Value for PWMx Dead-Time Unit bits
REGISTER 15-12: ALTDTRx: PWMx ALTERNATE DEAD-TIME REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ALTDTRx<13:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ALTDTR <7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0
bit 13-0 ALTDTRx<13:0>: Unsigned 14-bit Dead-Time Value for PWMx Dead-Time Unit bits
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 208 © 2008-2012 Microchip Technology Inc.
REGISTER 15-13: TRGCONx: PWMx TRIGGER CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0
TRGDIV<3:0>
bit 15 bit 8
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DTM(1) —TRGSTRT<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12 TRGDIV<3:0>: Trigger # Output Divid er bi ts
1111 = Trigger output for every 16th trigger event
1110 = Trigger output for every 15th trigger event
1101 = Trigger output for every 14th trigger event
1100 = Trigger output for every 13th trigger event
1011 = Trigger output for every 12th trigger event
1010 = T rigger output for every 11th trigger event
1001 = Trigger output for every 10th trigger event
1000 = T rigger output for every 9th trigger event
0111 = T rigger output for every 8th trigger event
0110 = T rigger output for every 7th trigger event
0101 = T rigger output for every 6th trigger event
0100 = T rigger output for every 5th trigger event
0011 = T rigger output for every 4th trigger event
0010 = Trigger output for every 3rd trigger event
0001 = Tri gger output for every 2nd trigger event
0000 = Trigger output for every trigger event
bit 11-8 Unimplemented: Read as ‘0
bit 7 DTM: Dual Trigger Mode bit(1)
1 = Secondary trigger event is combined with the primary trigger event to create the PWM trigger.
0 = Secondary trigger event is not combined with the primary trigger event to create the PWM trigger .
Two separate PWM triggers are generated.
bit 6 Unimplemented: Read as ‘0
bit 5-0 TRGSTRT<5:0>: Trigger Postscaler Start Enable Select bits
111111 = Wait 63 PWM cycles before generating the first trigger event after the module is enabled
000010 = Wait 1 PWM cycles before gen erating the first trigger event after the module is enabled
000001 = Wait 1 PWM cycles before gen erating the first trigger event after the module is enabled
000000 = Wait 0 PWM cycles before gen erating the first trigger event after the module is enabled
Note 1: The secondary generator cannot generate PWM trigger interrup ts.
© 2008-2012 Microchip Technology Inc. DS70318F-page 209
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 15-14: IOCONx: PWMx I/O CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PENH PENL POLH POLL PMOD<1:0>(1) OVRENH OVRENL
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
OVRDAT<1:0> FLTDAT<1:0> CLDAT<1:0> SWAP OSYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 PENH: PWMH Output Pin Ownership bit
1 = PWM module controls PWMxH pin
0 = GPIO module controls PWMxH pin
bit 14 PENL: PWML Output Pin Ownership bit
1 = PWM module controls PWMxL pin
0 = GPIO module controls PWMxL pin
bit 13 POLH: PWMH Output Pin Polarity bit
1 = PWMxH pin is active-low
0 = PWMxH pin is active-high
bit 12 POLL: PWML Output Pin Polarity bit
1 = PWMxL pin is active-low
0 = PWMxL pin is active-high
bit 11-10 PMOD<1:0>: PWM # I/O Pin Mode bits(1)
11 = PWM I/O pin pair is in the True Independe nt Output mode
10 = PWM I/O pin pair is in the Push-Pull Output mode
01 = PWM I/O pin pair is in the Redundant Output mode
00 = PWM I/O pin pair is in the Complementary Output mode
bit 9 OVRENH: Override Enable for PWMxH Pin bit
1 = OVRDAT<1> provides data for output on PWMxH pin
0 = PWM generator provides data for PWMxH pin
bit 8 OVRENL: Override Enable for PWMxL Pin bit
1 = OVRDAT<0> provides data for output on PWMxL pin
0 = PWM generator provides data for PWMxL pin
bit 7-6 OVRDAT<1:0>: Data for PWMxH and PWMxL Pins if Override is Enabled bits
If OVERENH = 1 then OVRDAT<1> provides data for PWMxH.
If OVERENL = 1 then OVRDAT<0> provides data for PWMxL.
bit 5-4 FLTDAT<1:0>: State(2) for PWMxH and PWMxL Pins if FLTMOD is Enabled bits
FCLCONx<IFLTMOD> = 0: Normal Faul t mod e:
If Fault active, then FLTDAT<1> provides state for PWMxH.
If Fault active, then FLTDAT<0> provides state for PWMxL.
FCLCONx<IFLTMOD> = 1: Independent Fault mode:
If current-limit active, then FLTDAT<1> provides data for PWMxH.
If Fault active, then FLTDAT<0> provides state for PWMxL.
Note 1: These bits should be changed only when PTEN = 0. Changing the clock selection durin g operation will
yield unpredictable results.
2: State represents the active/inactive state of the PWM module depending on the POLH and POLL bit set-
tings.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 210 © 2008-2012 Microchip Technology Inc.
bit 3-2 CLDAT<1:0>: State(2) for PWMxH and PWMxL Pins if CLMODE is Enabled bits
FCLCONx<IFLTMOD> = 0: Normal Faul t mod e:
If current-limit active, then CLDAT<1> provides state for PWMxH.
If current-limit active, then CLDAT<0> provides state for PWMxL.
FCLCONx<IFLTMOD> = 1: Independent Fault mode:
CLDAT<1:0> is ignored.
bit 1 SWAP<1:0>: SWAP PWMxH and PWMxL pins
1 = PWMxH output signal is connected to PWMxL pin and PWMxL signal is connected to PWMxH pins
0 = PWMxH and PWMxL pins are mapped to their respective pins
bit 0 OSYNC: Output Override Synchronization bit
1 = Output overrides via the OVRDAT<1:0> bits are synchronized to the PWM time base
0 = Output overrides via the OVDDAT<1 :0> bits occur on next CPU clock boundary
REGISTER 15-14: IOCONx: PWMx I/O CONTROL REGISTER (CONTINUED)
Note 1: These bits should be changed only when PTEN = 0. Changing the clock selection durin g operation will
yield unpredictable results.
2: State represents the active/inactive state of the PWM module depending on the POLH and POLL bit set-
tings.
© 2008-2012 Microchip Technology Inc. DS70318F-page 211
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 15-15: FCLCONx: PWMx FAULT CURRENT-LIMIT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IFLTMOD CLSRC<4:0>(2,3) CLPOL(1) CLMOD
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
FLTSRC<4:0>(2,3) FLTPOL(1) FLTMOD<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 IFLTMOD: Independent Fault Mode Enable bit
1 = Independent Fault mode: Current-limit input maps FLTDAT<1> to PWMxH output and Fault input
maps FLTDAT<0> to PWMxL output. The CLDAT<1:0> bits are not used for override functions.
0 = Normal Fault mode: Current-limit feature maps CLDAT<1:0> bits to the PWMxH and PWMxL
outputs. The PWM Fault feature maps FLTDAT<1:0> to the PWMxH and PWMxL outputs.
bit 14-10 CLSRC<4:0>: Current-Limit Control Signa l Source Select for PWM # Generator bits(2,3)
11111 = Reserved
01000 = Reserved
00111 = Fault 8
00110 = Fault 7
00101 = Fault 6
00100 = Fault 5
00011 = Fault 4
00010 = Fault 3
00001 = Fault 2
00000 = Fault 1
bit 9 CLPOL: Current-Limit Polarity for PWM Generator # bit(1)
1 = The selected current-limit source is active-low
0 = The selected current-limit source is active-high
bit 8 CLMOD: Current-Limit Mode Enable bit for PWM Generator # bit
1 = Current-limit function is enabled
0 = Current-limit function is disabled
Note 1: These bits should be changed only when PTEN = 0. Changing the clock selection durin g operation will
yield unpredictable results.
2: When Independent Faul t mode is enabled (IFLTMOD = 1), and Fault 1 is used for Current-Limit mode
(CLSRC<4:0> = b0000), the Fault Control Source Select bits (FLTSRC<4:0>) should be set to an unused
Fault source to prevent Fault 1 from disabling both the PWMxL and PWMxH outputs.
3: When Independent Faul t mode is enabled (IFLTMOD = 1) and Fault 1 is used for Fault mode
(FLTSRC<4:0> = b0000), the Current-Limit Control Source Select bits (CLSRC<4:0>) should be set to an
unused current-limit source to prevent the current-limit source from disabling both the PWMxH and
PWMxL outputs.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 212 © 2008-2012 Microchip Technology Inc.
bit 7-3 FLTSRC<4:0>: Fault Control Signal Source Select for PWM Generator # bits(2,3)
11111 = Reserved
01000 = Reserved
00111 = Fault 8
00110 = Fault 7
00101 = Fault 6
00100 = Fault 5
00011 = Fault 4
00010 = Fault 3
00001 = Fault 2
00000 = Fault 1
bit 2 FLTPOL: Fault Polarity for PWM Generator # bit(1)
1 = The selected Fault source is active-low
0 = The selected Fault source is active-high
bit 1-0 FLTMOD<1:0>: Fault Mode for PWM Generator # bits
11 = Fault input is disabled
10 = Reserved
01 = The selected Fault source forces PWMxH, PWMxL pins to FLTDAT values (cycle)
00 = The selected Fault source forces PWMxH, PWMxL pins to FLTDAT values (latched condition)
REGISTER 15-15: FCLCONx: PWMx FAULT CURRENT-LIMIT CONTROL REGISTER (CONTINUED)
Note 1: These bits should be changed only when PTEN = 0. Changing the clock selection durin g operation will
yield unpredictable results.
2: When Independent Faul t mode is enabled (IFLTMOD = 1), and Fault 1 is used for Current-Limit mode
(CLSRC<4:0> = b0000), the Fault Control Source Select bits (FLTSRC<4:0>) should be set to an unused
Fault source to prevent Fault 1 from disabling both the PWMxL and PWMxH outputs.
3: When Independent Faul t mode is enabled (IFLTMOD = 1) and Fault 1 is used for Fault mode
(FLTSRC<4:0> = b0000), the Current-Limit Control Source Select bits (CLSRC<4:0>) should be set to an
unused current-limit source to prevent the current-limit source from disabling both the PWMxH and
PWMxL outputs.
© 2008-2012 Microchip Technology Inc. DS70318F-page 213
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 15-16: TRIGx: PWMx PRIMARY TR IGGER COMPARE VALUE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TRGCMP<12:5>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0
TRGCMP<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 TRGCMP<12:0>: Trigger Control Value bits
When primary PWM functions in local time base, this register contains the compare values that can
trigger the ADC module.
bit 2-0 Unimplemented: Read as ‘0
REGISTER 15-17: STRIGx: PWMx SECONDARY TRIGGER COMPARE VALUE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STRGCMP<12:5>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0
STRGCMP<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 STRGCMP<12:0>: Secondary Trigger Control Value bits
When secondary PWM functions in local time base, this register contains the compare values that can
trigger the ADC module.
bit 2-0 Unimplemented: Read as ‘0
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 214 © 2008-2012 Microchip Technology Inc.
REGISTER 15-18: LEBCONx: LEADING-EDGE BLANKING CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PHR PHF PLR PLF FLTLEBEN CLLEBEN LEB<6:5>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0
LEB<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 PHR: PWMxH Rising Edge Trigger Enable bit
1 = Rising edge of PWMxH will trigger LEB counter
0 = LEB ignores rising edge of PWMxH
bit 14 PHF: PWMH Falling Edge Trigger Enable bit
1 = Falling edge of PWMxH will trigger LEB counter
0 = LEB ignores falling edge of PWMxH
bit 13 PLR: PWML Rising Edge Trigger Enable bit
1 = Rising edge of PWMxL will trigger LEB counter
0 = LEB ignores rising edge of PWMxL
bit 12 PLF: PWML Falling Edge Trigger Enable bit
1 = Falling edge of PWMxL will trigger LEB counter
0 = LEB ignores falling edge of PWMxL
bit 11 FLTLEBEN: Fault Input LEB Enable bit
1 = Leading-edge blanking is applied to selected Fault input
0 = Leading-edge blanking is not applied to selected Fault input
bit 10 CLLEBEN: Current-Limit LEB Enable bit
1 = Leading-edge blanki ng is applied to selected current-limit input
0 = Leading-edge blanking is not applied to selected current-limit input
bit 9-3 LEB<6:0>: Leading-Edge Blanking for Current-Limit and Fault Inputs bits
Val ue is 8.32 nsec increments.
bit 2-0 Unimplemented: Read as ‘0
© 2008-2012 Microchip Technology Inc. DS70318F-page 215
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 15-19: PWMCAPx: PRIMARY PWMx TIME BASE CAPTURE REGISTER
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
PWMCAP<12:5>(1,2)
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 U-0 U-0 U-0
PWMCAP<4:0>(1,2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3 PWMCAP<12:0>: Captured PWM Time Base Value bits(1,2)
The value in this register represents the captured PWM time base value when a leading edge is
detected on the current-limit input.
bit 2-0 Unimplemented: Read as ‘0
Note 1: The capture feature is only available on primary output (PWMxH).
2: This feature is active only after LEB processing on the current-limit input signal is complete.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 216 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 217
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
16.0 SERIAL PERIPHERAL
INTERFACE (SPI) The Serial Peripheral Interface (SPI) module is a
synchronous serial interface useful for communicating
with other peripheral or microcontroller devices. These
peripheral devices can be serial EEPROMs, shift
registers, display drivers, analog-to-digital converters
and so on. The SPI module is compatible with SPI and
SIOP from Motorola®.
The SPI module consists of a 16-bit shift register,
SPIxSR (where x = 1), used for shifting data in and out,
and a buffer register, SPIxBUF. A control register,
SPIxCON, configures the module. Additionally , a status
register, SPIxSTAT, indicates status conditions.
The serial interface consists of the following four pins:
SDIx (Serial Data Input)
SDOx (Serial Data Output)
SCKx (Shift Clock Input Or Output)
SSx (Active-Low Slave Select).
In Master mode operation, SCK is a clock output; in
Slave mode, it is a clock input.
FIGURE 16-1: SPI MODULE BLOCK DIAGRAM
Note 1: This data sheet sum marizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 18. “Serial
Peripheral Interface (SPI)” (DS70206) in
the “dsPIC33F/PIC24H Fa mily Reference
Manual”, which is available on the
Microchip web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Internal Data Bus
SDIx
SDOx
SSx
SCKx
SPIxSR
bit 0
Shift Control
Edge
Select
FCY
Primary
1:1/4/16/64
Enable
Prescaler
Sync
SPIxBUF
Control
Transfer
Transfer
Write SPIxBUF
Read SPIxBUF
16
SPIxCON1<1:0>
SPIxCON1<4:2>
Master Clock
Clock
Control
Secondary
Prescaler
1:1 to 1:8
SPIxRXB SPIxTXB
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 218 © 2008-2012 Microchip Technology Inc.
REGISTER 16-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
SPIEN SPISIDL
bit 15 bit 8
U-0 R/C-0 U-0 U-0 U-0 U-0 R-0 R-0
SPIROV SPITBF SPIRBF
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 SPIEN: SPIx Enable bit
1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins
0 = Disables module
bit 14 Unimplemented: Read as ‘0
bit 13 SPISIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operati on in Idle mode
bit 12-7 Unimplemented: Read as ‘0
bit 6 SPIROV: Receive Overflow Flag bit
1 = A new byte/word is completely received and discarded. The user software has not read the
previous data in the SPIxBUF register.
0 = No overflow has occurred
bit 5-2 Unimplemented: Read as ‘0
bit 1 SPITBF: SPIx Transmit Buffer Full Status bit
1 = Transmit not yet started, SPIxTXB is full
0 = Transmit started, SPIxTXB is empty. Automatically set in hardware when CPU writes SPIxBUF
location, loading SPIxTXB. Automatically cle ared in hardware when SPIx module transfers da ta
from SPIxTXB to SPIxSR.
bit 0 SPIRBF: SPIx Receive Buffer Full Status bit
1 = Receive complete, SPIxRXB is full
0 = Receive is not complete, SPIxRXB is empty. Automatically set in hardware when SPIx transfers
data from SPIxSR to SPIxRXB. Automatically cleared in hardware when core reads SPIxBUF
location, reading SPIxRXB.
© 2008-2012 Microchip Technology Inc. DS70318F-page 219
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 16-2: SPIXCON1: SPIx CONTROL REGISTER 1
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DISSCK DISSDO MODE16 SMP CKE(1)
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SSEN(3) CKP MSTEN SPRE<2:0>(2) PPRE<1:0>(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13 Unimplemented: Read as ‘0
bit 12 DISSCK: Disable SCKx pin bit (SPI Master modes only)
1 = Internal SPI clock is disabled; pin functions as I/O
0 = Internal SPI clock is enabled
bit 11 DISSDO: Disable SDOx pin bit
1 = SDOx pin is not used by module; pin functions as I/O
0 = SDOx pin is controlled by the module
bit 10 MODE16: Word/Byte Communication Select bit
1 = Communication is word-wide (16 bits)
0 = Communication is byte-wide (8 bits)
bit 9 SMP: SPIx Data Input Sample Phase bit
Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
Slave mode:
SMP must be cleared when SPIx is used in Slave mode.
bit 8 CKE: SPIx Clock Edge Select bit(1)
1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6)
0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6)
bit 7 SSEN: Slave Select Enable bit (Slave mode)(3)
1 = SSx pin used for Slave mode
0 = SSx pin not used by module; pin controlled by port function
bit 6 CKP: Clock Polarity Select bit
1 = Idle state for clock is a high level; active state is a low level
0 = Idle state for clock is a low level; active state is a high level
bit 5 MSTEN: Master Mode Enable bit
1 = Master mode
0 = Slave mode
Note 1: The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes
(FRMEN = 1).
2: Do not set both primary and secondary prescalers to a value of 1:1.
3: This bit must be cleared when FRMEN = 1.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 220 © 2008-2012 Microchip Technology Inc.
bit 4-2 SPRE<2:0>: Secondary Prescale bits (Master mode)(2)
111 = Secondary prescale 1:1
110 = Secondary prescale 2:1
000 = Secondary prescale 8:1
bit 1-0 PPRE<1:0>: Primary Prescale bits (Master mode)(2)
11 = Primary prescale 1:1
10 = Primary prescale 4:1
01 = Primary prescale 16:1
00 = Primary prescale 64:1
REGISTER 16-2: SPIXCON1: SPIx CONTROL REGISTER 1 (CONTINUED)
Note 1: The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes
(FRMEN = 1).
2: Do not set both primary and secondary prescalers to a value of 1:1.
3: This bit must be cleared when FRMEN = 1.
© 2008-2012 Microchip Technology Inc. DS70318F-page 221
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 16-3: SPIxCON2: SPIx CONTROL REGISTER 2
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0
FRMEN SPIFSD FRMPOL
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0
FRMDLY
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 FRMEN: Framed SPIx Support bit
1 = Framed SPIx support enabled (SSx pin used as frame sync pulse input/output)
0 = Framed SPIx support disabled
bit 14 SPIFSD: Frame Sync Pulse Direction Control bit
1 = Frame sync pulse input (slave)
0 = Frame sync pulse output (master)
bit 13 FRMPOL: Frame Sync Puls e Po la ri ty bi t
1 = Frame sync pulse is active-high
0 = Frame sync pulse is active-low
bit 12-2 Unimplemented: Read as ‘0
bit 1 FRMDLY: Frame Sync Pulse Edge Select bit
1 = Frame sync pulse coincides with first bit clock
0 = Frame sync pulse precedes first bit clock
bit 0 Unimplemented: This bit must not be set to ‘1’ by the user application
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 222 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 223
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
17.0 INTER-INTEGRATED CIRCUIT
(I2C™)
The Inter-Integrated Circuit (I2C) module provides
complete hardware support for both Slave and
Multi-Master modes of the I2C serial communication
standard with a 16-bit interface.
The I2C module has a 2-pin interface , whe r e:
The SCLx pin is clock
The SDAx pin is data
The I2C module offers the following key features:
•I
2C interface supporting both Master and Slave
modes of operation
•I
2C Slave mode supports 7-bit and 10-bit addressing
•I
2C Master mode supports 7-bit and 10-bit
addressing
•I
2C port allows bidirectional transfers between
master and slaves
Serial clock synchronization for I2C port can be used
as a handshake mechanism to suspend and resume
serial transfer (SCLREL control)
•I
2C supports multi-master operation, detects bus
collision and arbitrates accordingly
17.1 Operating Modes
The hardware fully implements all the master and slave
functions of the I2C Standard and Fast mode
specifications, as well as 7-bit and 10-bit addressing.
The I2C module can operate either as a slave or a
master on an I2C bus.
The following types of I2C operation are supported:
•I
2C slave operation with 7-bit addressing
•I
2C slave operation with 10-bit addressing
•I
2C master operation with 7-bit or 10-bit addressing
Note 1: This data sheet summarizes the fea-
tures of the dsPIC33FJ06GS101/X02
and dsPIC33FJ16GSX02/X04 families
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 19.
“Inter-Integrated Circuit (I2C™)”
(DS70195) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available on the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 224 © 2008-2012 Microchip Technology Inc.
FIGURE 17-1: I2C™ BLOCK DIAGRAM ( X = 1)
Internal
Data Bus
SCLx
SDAx
Shift
Match Detect
I2CxADD
Start and Stop
Bit Detect
Clock
Address Match
Clock
Stretching
I2CxTRN LSb
Shift Clock
BRG Down Counter
Reload
Control
TCY/2
Start and Stop
Bit Generation
Acknowledge
Generation
Collision
Detect
I2CxCON
I2CxSTAT
Control Logic
Read
LSb
Write
Read
I2CxBRG
I2CxRSR
Write
Read
Write
Read
Write
Read
Write
Read
Write
Read
I2CxMSK
I2CxRCV
© 2008-2012 Microchip Technology Inc. DS70318F-page 225
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
17.2 I2C Registers
I2CxCON and I2CxSTAT are control and status
registers. The I2CxCON register is readable and
writable. The lower six bits of I2CxSTAT are read-only.
The remaining bits of the I2CxSTAT are read/write:
I2CxRSR is the shift register used for shifting data
internal to the module and the user application
has no access to it
I2CxRCV is the receive buffer and the register to
which data bytes are written, or from which data
bytes are read
I2CxTRN is the tran smi t re gi st er to wh ich bytes
are written during a transmit ope ration
The I2Cx ADD register holds the slave address
A status bit, ADD10, indicates 10-bit Address
mode
The I2C x BRG acts as the Baud Rate Generator
(BRG) reload value
In receive operations, I2CxRSR and I2CxRCV together
form a double-buffered receiver. When I2CxRSR
receives a complete byte, it is transferred to I2CxRCV,
and an interrupt pulse is generated.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 226 © 2008-2012 Microchip Technology Inc.
REGISTER 17-1: I2CxCON: I2Cx CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-1, HC R/W-0 R/W-0 R/W-0 R/W-0
I2CEN I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0, HC R/W-0, HC R/W-0, HC R/W-0, HC R/W-0, HC
GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit W = Writable bit HS = Hardware Settable bit HC = Hardware Clearable bit
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 I2CEN: I2Cx Enable bit
1 = Enables the I2Cx module and co nfigures the SDAx and SCLx pins as serial port pins
0 = Disables the I2Cx module. All I2C pins are controlled by port functions.
bit 14 Unimplemented: Read as ‘0
bit 13 I2CSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters an Idle mode
0 = Continue module operati on in Idle mode
bit 12 SCLREL: SCLx Release Control bit (when operating as I2C slave)
1 = Release SCLx clock
0 = Hold SCLx clock low (clock stretch)
If STREN = 1:
Bit is R/W (i.e., software can write 0’ to initiate stretch and write ‘1’ to release clock). Hardware clear
at beginning of slave transmission. Hardware clear at end of slave receptio n.
If STREN = 0:
Bit is R/S (i.e., software can only write ‘1’ to release clock). Hardware clear at beginning of slave
transmission.
bit 11 IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit
1 = IPMI mode is enabled; all addresses acknowledged
0 = IPMI mode disabled
bit 10 A10M: 10-bit Slave Address bit
1 = I2CxADD is a 10-bit slave address
0 = I2CxADD is a 7-bit slave address
bit 9 DISSLW: Disable Slew Rate Control bit
1 = Slew rate control disabled
0 = Slew rate control enabled
bit 8 SMEN: SMbus Input Levels bit
1 = Enable I/O pin thresholds compliant with SMbus specificatio n
0 = Disable SMbus input thresholds
bit 7 GCEN: General Call Enable bit (when operating as I2C slave)
1 = Enable interrupt when a general call address is received in the I2CxRSR
(module is enabled for reception)
0 = General call address di sabled
bit 6 STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave)
Used in conjunction with SCLREL bit.
1 = Enable software or receive clock stretching
0 = Disable software or receive clock stretching
© 2008-2012 Microchip Technology Inc. DS70318F-page 227
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 5 ACKDT: Acknowled ge Data bit (when operating as I2C master, applicable during master receive)
Val ue that is transmitted when the software initiates an Acknowledge sequence.
1 = Send NACK during Acknowledge
0 = Send ACK during Acknowledge
bit 4 ACKEN: Acknowledge Sequence Enable bit
(when operating as I2C master, applicable during ma ster receive)
1 = Initiate Acknowledge sequence on SDAx and SCLx pins and transmit ACKDT data bit. Hardware
clear at end of master Acknowledge sequence.
0 = Acknowledge sequence not in progress
bit 3 RCEN: Receive Enable bit (when operating as I2C master)
1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of master receive data byte.
0 = Receive sequence not in progress
bit 2 PEN: Stop Condition Enable bit (when operating as I2C master)
1 = Initiate Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence.
0 = Stop condition not in progress
bit 1 RSEN: Repeated Start Condition Enable bit (when operating as I2C master)
1 = Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of master
Repeated Start sequence.
0 = Repeated Start condition not in progress
bit 0 SEN: Start Condition Enable bit (when operating as I2C master)
1 = Initiate Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence.
0 = Start condition not in progress
REGISTER 17-1: I2CxCON: I2Cx CONTROL REGISTER (CONTINUED)
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 228 © 2008-2012 Microchip Technology Inc.
REGISTER 17-2: I2CxSTAT: I2Cx STATUS REGISTER
R-0, HSC R-0, HSC U-0 U-0 U-0 R/C-0, HSC R-0, HSC R-0, HSC
ACKSTAT TRSTAT BCL GCSTAT ADD10
bit 15 bit 8
R/C-0, HS R/C-0, HS R-0, HSC R/C-0, HSC R/C-0, HSC R-0, HSC R-0, HSC R-0, HSC
IWCOL I2COV D_A P S R_W RBF TBF
bit 7 bit 0
Legend: U = Unimplemented bit, read as ‘0’
R = Readable bit W = Writable bit HS = Hardware Settable bit HSC = Hardware Settable/Clearable
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 15 ACKSTAT: Acknowledge Status bit
(when operating as I2C master, applicable to master transmit operation)
1 = NACK received from slave
0 = ACK received from slave
Hardware set or clear at end of slave Acknowledge.
bit 14 TRSTAT: Transmit Status bit (when operating as I2C master, app licable to master transmit operation)
1 = Master transmit is in progress (8 bits + ACK)
0 = Master transmit is not in progress
Hardware set at beginn in g of master transmission. H ardw a re clea r at end of sla ve Ackn ow l e dg e.
bit 13-11 Unimplemented: Read as ‘0
bit 10 BCL: Master Bus Collision Detect bit
1 = A bus collision has been detected during a master operation
0 = No collision
Hardware set at detection of bus collision.
bit 9 GCSTAT: General Call Status bit
1 = General call address was received
0 = General call address was not received
Hardware set when address matches general call address. Hardware clear at Stop detection.
bit 8 ADD10: 10-bit Address Status bit
1 = 10-bit address was matched
0 = 10-bit address was not matched
Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection.
bit 7 IWCOL: Write Collision Detect bit
1 = An attempt to write the I2CxTRN register failed because the I2C module is busy
0 = No collision
Hardware set at occurrence of write to I2CxTRN while busy (clear ed by software).
bit 6 I2COV: Receive Overflow Flag bit
1 = A byte was received while the I2CxRCV register is still holdi ng the previous byte
0 = No overflow
Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software).
bit 5 D_A: Data/Address bit (when operating as I2C slave)
1 = Indicates that the last byte received was data
0 = Indicates that the last byte received was device address
Hardware clear at device address match. Hardware set by reception of slave byte.
bit 4 P: St op bit
1 = Indicates that a Stop bit has be en detected last
0 = Stop bit was not detected last
Hardware set or clear when Start, Repeated Start or Stop detected.
© 2008-2012 Microchip Technology Inc. DS70318F-page 229
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 3 S: Start bit
1 = Indicates that a Start (or Repeated Start) bit has been detected last
0 = Start bit was no t de te cted last
Hardware set or clear when Start, Repeated Start or Stop detected.
bit 2 R_W: Read/Write Information bit (when operating as I2C slave)
1 = Read – indicates data transfer is output from slave
0 = Write – indicates data transfer is input to slave
Hardware set or clear after reception of I2C device address byte.
bit 1 RBF: Receive Buffer Full Status bit
1 = Receive complete, I2CxRCV is full
0 = Receive not complete, I2CxRCV is empty
Hardware set when I2CxRCV is written with received byte. Hardware clear when software reads
I2CxRCV.
bit 0 TBF: T ra n s mi t Buffer Full Status bit
1 = Transmit in progress, I2CxTRN is full
0 = Transmit complete, I2CxTRN is empty
Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission.
REGISTER 17-2: I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED)
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 230 © 2008-2012 Microchip Technology Inc.
REGISTER 17-3: I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
AMSK<9:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
AMSK<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimpleme nted bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10 Unimplemented: Read as ‘0
bit 9-0 AMSK<9:0>: Mask for Address bit x Select bits
1 = Enable masking for bit x of incoming message address; bit match not requi r e d in th is po si ti on
0 = Disable masking for bit x; bit match required in this position
© 2008-2012 Microchip Technology Inc. DS70318F-page 231
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
18.0 UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART)
The Universal Asynchronous Receiver Transmitter
(UART) module is one of the serial I/O modules
available in the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 device families. The UART
is a full-duplex, asynchronous system that can
communicate with peripheral devices, such as
personal computers, LIN, RS-232 and RS-485
interfaces. The module a lso supports a hardware flow
control option with the UxCTS and UxRTS pins and
also includes an IrDA® encoder and decoder.
The primary features of the UART module are:
Full-Duplex, 8-bit or 9-bit Data T ransmission
through the UxTX and UxRX pins
Even, Odd or No Parity Options (for 8-bit data)
One or Two Stop bits
Hardware Flow Control Option with UxCTS and
UxRTS Pins
Fully Integrated Baud Rate Generator with 16-bit
Prescaler
Baud Rates Ranging from 12.5 Mbps to 38 bps at
50 MIPS
4-Deep First-In First-Out (FIFO) Transmit Data
Buffer
4-Deep FIFO Receive Data Buffer
Parity, Framing and Buffer Overru n Erro r De tection
Support for 9-bit mode with Address Detect
(9th bit = 1)
Transmit and Receive Interrupts
A Separate Interrupt for all UART Error Conditions
Loopback mode for Diagnostic Support
Support for Sync and Break Characters
Support for Automatic Baud Rate Detection
IrDA Encoder and Decoder Logic
16x Baud Clock Output for IrDA® Support
A simplified block diagram of the UART module is
shown in Figure 1. The UART module consist s of these
key hardware elements:
Baud Rate Generator
Asynchronous Transmitter
Asynchronous Receiver
FIGURE 1: UART SIMPLIFIED BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 17. “UART”
(DS70188) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available on the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
U1RX
Hardware Flow Control
UART Receiver
UART Transmitter U1TX
Baud Rate Generator
U1RTS/BCLK1
IrDA®
U1CTS
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 232 © 2008-2012 Microchip Technology Inc.
REGISTER 18-1: UxMODE: UARTx MODE REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
UARTEN(1) USIDL IREN(2) RTSMD —UEN<1:0>
bit 15 bit 8
R/W-0 HC R/W-0 R/W-0, HC R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WAKE LPBACK ABAUD URXINV BRGH PDSEL<1:0> STSEL
bit 7 bit 0
Legend: HC = Hardware Clearable
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 UARTEN: UARTx Enabl e bi t(1)
1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0>
0 = UARTx is disabled; all UARTx pins are controlled by port latches; UARTx power consumption minimal
bit 14 Unimplemented: Read as ‘0
bit 13 USIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12 IREN: IrDA® Encoder and Decoder Enable bit(2)
1 =IrDA
® encoder and decoder enabled
0 =IrDA
® encoder and decoder disabled
bit 11 RTSMD: Mode Selection for UxRTS Pin bit
1 =UxRTS
pin in Simplex mode
0 =UxRTS pin in Flow Control mode
bit 10 Unimplemented: Read as ‘0
bit 9-8 UEN<1:0>: UARTx Enable bits
11 = UxTX, UxRX and BCLK pins are enabled and used; UxCT S pi n controlled by port latches
10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used
01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches
00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLK pins controlled by
port latches
bit 7 WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit
1 = UARTx will continue to sample the UxRX pin; interrupt generated on falling edge ; bit cleared
in hardware on following rising edge
0 = No wake-up enabled
bit 6 LPBACK: UARTx Loopback Mode Select bit
1 = Enable Loopback mode
0 = Loopback mode is disabled
bit 5 ABAUD: Auto-Baud Enable bit
1 = Enable baud rate measurement on the next character – require s reception of a Sync field (55h)
before other data; cleared in hardware upon completi on
0 = Baud rate measurement disabled or completed
bit 4 URXINV: Receive Polarity Inversion bit
1 = UxRX Idle state is ‘0
0 = UxRX Idle state is ‘1
Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for
information on enabling the UART module for receive or transmit operation.
2: This feature is only available for the 16x BRG mode (BRGH = 0).
© 2008-2012 Microchip Technology Inc. DS70318F-page 233
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 3 BRGH: High Baud Rate Enable bit
1 = BRG generate s 4 clocks per bit period (4x baud clock, High-Speed mode)
0 = BRG generates 16 clocks per bit period (16x baud clock, Standard mode)
bit 2-1 PDSEL<1:0>: Parity and Data Selection bits
11 = 9-bit data, no parity
10 = 8-bit data, odd parity
01 = 8-bit data, even parity
00 = 8-bit data, no parity
bit 0 STSEL: Stop Bit Selection bit
1 = Two Stop bits
0 = One Stop bit
REGISTER 18-1: UxMODE: UARTx MODE REGISTER (CONTINUED)
Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for
information on enabling the UART module for receive or transmit operation.
2: This feature is only available for the 16x BRG mode (BRGH = 0).
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 234 © 2008-2012 Microchip Technology Inc.
REGISTER 18-2: UxSTA: UARTx STATUS AND CONT ROL REGISTER
R/W-0 R/W-0 R/W-0 U-0 R/W-0, HC R/W-0 R-0 R-1
UTXISEL1 UTXINV UTXISEL0 UTXBRK UTXEN(1) UTXBF TRMT
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R-1 R-0 R-0 R/C-0 R-0
URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA
bit 7 bit 0
Legend: HC = Hardware Clearable bit C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15,13 UTXISEL<1:0>: Transmission Interrupt Mode Selection bits
11 = Reserved; do not use
10 = Interrupt when a character is transferred to the Transmit Shift register, and as a result, the
transmit buffer becomes empty
01 = Interrupt when the last character is shifted out of the Transmit Shift register; all transmit
operations are completed
00 = I nterrupt when a character is transferred to th e Transmit Shift register (this implies there is at
least one character open in the transmit buffer)
bit 14 UTXINV: Transmit Polarity Inversion bit
If IREN = 0:
1 = UxTX Idle state is ‘0
0 = UxTX Idle state is ‘1
If IREN = 1:
1 =IrDA
® encoded UxTX Idle state is ‘1
0 =IrDA
® encoded UxTX Idle state is ‘0
bit 12 Unimplemented: Read as ‘0
bit 11 UTXBRK: Transmit Break bit
1 = Send Sync Break on next transmission – S t art bit, followed by twelve ‘0’ bits, followed by S top bit;
cleared by hardware upon completion
0 = Sync Break transmission disabled or completed
bit 10 UTXEN: Transmit Enable bit(1)
1 = Transmit enabled, UxTX pin controlled by UARTx
0 = Transmit disabled, any pending transmission is aborted and buffer is reset; UxTX pin controlled
by port
bit 9 UTXBF: Transmit Buffer Full Status bit (read-only)
1 = Transmit buffer is full
0 = Transmit buffer is not full; at least one more character can be written
bit 8 TRMT: Transmit Shift Register Empty bit (read-only)
1 = Transmit Shift register is empty and transmit buf fe r is empty (t he last tran smission has co mp leted)
0 = Transmit Shift register is not empty, a transmission is in progress or queued
bit 7-6 URXISEL<1:0>: Receive Interrupt Mode Selection bits
11 = Interrupt is set on UxRSR transfer making the receive buffer full (i.e., has 4 data characters)
10 = Interrupt is set on UxRSR transfer making the receive buffer 3/4 full (i.e., has 3 data characters)
0x = Interrupt is set when any character i s received and transferred from the UxRSR to the receive
buffer; receive buffer has one or more characters
Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for
information on enabling the UART module for transmit operation.
© 2008-2012 Microchip Technology Inc. DS70318F-page 235
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 5 ADDEN: Address Character Detect bit (bit 8 of received data = 1)
1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect.
0 = Address Detect mode disabled
bit 4 RIDLE: Receiver Idle bit (read-only)
1 = Receiver is Idle
0 = Receiver is active
bit 3 PERR: Parity Error Status bit (read-only)
1 = Parity error has been detected for the current character (character at the top of the receive FIFO)
0 = Parity error has not been detected
bit 2 FERR: Framing Error Status bit (read-only)
1 = Framing error has been detected for the current character (character at the top of the receive
FIFO)
0 = Framing error has not be en detected
bit 1 OERR: Receive Buffer Overrun Error Status bit (clear/read-only)
1 = Receive buffer has overflowed
0 = Receive buffer has not overflowed. Clearing a previously set OERR bit (10 transition) will reset
the receiver buffer and the UxRSR to the empty state.
bit 0 URXDA: Receive Buffer Data Available bit (read-only)
1 = Receive buffer has data, at least one more character can be read
0 = Receive buffer is empty
REGISTER 18-2: UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED)
Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for
information on enabling the UART module for transmit operation.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 236 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 237
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
19.0 HIGH-SPEED 10-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices provide high-speed
successive approximation analog to digital conversions to
support applications such as AC/DC and DC/DC power
converters.
19.1 Features Overview
The ADC module comprises the following features:
10-bit resolution
Unipolar inputs
Up to two Successive Approximation Registers
(SARs)
Up to 12 external input channels
Up to two internal analog inputs
Dedicated result register for each ana log input
±1 LSB accuracy at 3.3V
Single suppl y operation
4 Msps conversion rate at 3. 3V (d evi ce s wi th tw o
SARs)
2 Msps conversion rate at 3.3V (devices with one
SAR)
Low-p ower CMOS technology
19.2 Module Description
This ADC module is designed for applications that
require low latency between the request for conversion
and the resultant output data. Typical applications
include:
AC/DC power supplies
DC/DC converters
Power Factor Correction (PFC)
This ADC works with the high-speed PWM module in
power control applications that require h igh-frequency
control loops. This module can sample and convert two
analog inputs in a 0.5 microsecond when two SARs are
used. This small conversi on delay reduces the “phase
lag” between measurement and control system
response.
Up to five inputs may be sampled at a time (four inputs
from the dedicated sample and hold circuits and one
from the shared sample and hold circuit). If multiple
inputs request conversion, the ADC will convert them in
a sequential manner, starting with the lowest order
input.
This ADC design provides each pair of analog inputs
(AN1,AN0), (AN3,AN2),..., the ability to specify its own
trigger source out of a maximum of sixteen different
trigger sources. This capability allows this ADC to
sample and convert anal og inputs that are associated
with PWM generators operating on independent time
bases.
The user application typi cally require s synchroniza tion
between analog data sampling and PWM output to the
application circuit. The very high-speed operation of
this ADC module allows “data on demand”.
In addition, several hardware features have been
added to the peripheral interface to improve real-time
performance in a typical DSP-based application.
Result alignment options
Automated sampling
External conversion start control
Two internal inputs to monitor INTREF internal
reference and EXTREF input signal
19.3 Module Functionality
The high-speed 10-bit ADC module is designed to
support power conversion applications when used with
the High-S peed PWM module. The ADC may have one
or two SAR modules, depending on the device variant.
If two SARs are present on a device, two conversions
can be processed at a time, yielding 4 Msps conversion
rate. If only one SAR is present on a device, only one
conversion can be processed at a time, yielding 2 Msps
conversion rate. The high-spe ed 10-bit ADC produces
two 10-bit conversion resul ts in a 0.5 microsecond.
The ADC module supports up to 12 external analog
inputs and two internal analog inputs. To monitor
reference voltage, two internal inputs, AN12 and AN13,
are connected to the EXTREF and INTREF voltages,
respectively.
The analog reference voltage is defined as the device
supply voltage (AV DD/AVSS).
Block diagrams of the ADC module are shown in
Figure 19-1 through Figure 19-6.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families of
devices. It is not intended to be a compre-
hensive reference source. To comple-
ment the information in this data sheet,
refer to Section 44. “High-Speed 10-bit
Analog-to-Digital Converter (ADC)”
(DS70321) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available on the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 238 © 2008-2012 Microchip Technology Inc.
FIGURE 19-1: ADC BLOCK DIAGRAM FOR dsPIC33FJ06GS101 DEVICES WITH ONE SAR
Even Numbered Inputs with Dedicated
Shared Sample and Hold
Data
Format
SAR
Core
Eight
Registers
16-bit
Sample and Hold (S&H) Circuits
Bus Interf ace
AN0
AN1
AN3
AN6
AN7
AN2
© 2008-2012 Microchip Technology Inc. DS70318F-page 239
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 19-2: ADC BLOCK DIAGRAM FOR dsPIC33FJ06GS102 DEVICES WITH ONE SAR
Even Numbered Inputs with Dedicated
Shared Sample and Hold
Data
Format
SAR
Core
Eight
Registers
16-bit
Sample and Hold (S&H) Circuits
Bus Interface
AN0
AN2
AN1
AN4
AN5
AN3
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 240 © 2008-2012 Microchip Technology Inc.
FIGURE 19-3: ADC BLOCK DIAGRAM FOR dsPIC33FJ06GS202 DEVICES WITH ONE SAR
AN12(1)
AN13(2)
Even Numbered Inputs with Dedicated
Shared Sample and Hold
Data
Format
SAR
Core
Eight
Registers
16-bit
Sample and Hold (S&H) Circuits
Bus Interfa ce
AN0
AN2
AN1
AN4
AN5
AN3
(INTREF)
(EXTREF)
Note 1: AN12 (EXTREF) is an internal a nalog input. To measure the volt age at AN12 (EXTRE F), an analog comp arat or must b e enabled
and EXTREF must be selected as the comparator reference.
2: AN13 (INTREF) is an internal analog input and is not available on a pin.
© 2008-2012 Microchip Technology Inc. DS70318F-page 241
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 19-4: ADC BLOCK DIAGRAM FOR dsPIC33FJ16GS402/404 DEVICES WITH ONE SAR
Even Numbered Inputs with Dedicated
Shared Sample and Hold
Data
Format
SAR
Core
Ten
Registers
16-bit
Sample and Hold (S&H) Circuits
Bus Interface
AN0
AN2
AN1
AN5
AN6
AN7
AN3
AN4
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 242 © 2008-2012 Microchip Technology Inc.
FIGURE 19-5: ADC BLOCK DIAGRAM FOR dsPIC33FJ16GS502 DEVICES WITH TWO SARS
AN12(1)
AN13(2)
Even Numbered Inputs with Dedicated
Odd Numbered Inputs
with Shared S&H
Even numbered inputs
with shared S&H
Data
Format
SAR
Core
Five
Registers
16-bit
SAR
Core
Sample and Hold (S&H) Circuits
Bus Interface
AN0
AN2
AN6
AN1
AN3
Data
Format
Five
Registers
16-bit
AN4
AN5
AN7
(INTREF)
(EXTREF)
Note 1: AN12 (EXTREF) is an i nternal analog input. To measure the voltag e at AN12 (EXTREF), an analog comp arator must be ena bled
and EXTREF must be selected as the comparator reference.
2: AN13 (INTREF) is an internal analog input and is not available on a pin.
© 2008-2012 Microchip Technology Inc. DS70318F-page 243
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 19-6: ADC BLOCK DIAGRAM FOR dsPIC33FJ16GS504 DEVICES WITH TWO SARS
AN12(1)
AN13(2)
Even Numbered Inputs with Dedicated
Odd Numbered Inputs
with Shared S&H
Even Numbered Inputs
with Shared S&H
Data
Format
SAR
Core
Seven
Registers
16-bit
SAR
Core
Sample and Hold (S&H) Circuits
Bus Interface
AN0
AN2
AN6
AN1
AN3
AN8
AN10
Data
Format
Seven
Registers
16-bit
AN4
AN5
AN7
AN9
AN11
(INTREF)
(EXTREF)
Note 1: AN12 (EXTREF) is an internal analog input. To measure the voltage at AN12 (EXTREF), an analog comparator must be enabled
and EXTREF must be selected as the comparator reference.
2: AN13 (INTREF) is an internal analog input and is not available on a pin.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 244 © 2008-2012 Microchip Technology Inc.
19.4 ADC Control Registers
The ADC module uses the following control and status
registers:
ADCON: Analog-to-Digital Control Register
ADSTAT: Analog-to-Digital Status Register
ADBASE: Analog-to-Digital Base Register
ADPCFG: Analog-to-Digital Port Configuration
Register
ADCPC0: Analog-to-Digital Convert Pair Control
Register 0
ADCPC1: Analog-to-Digital Convert Pair Control
Register 1
ADCPC2: Analog-to-Digital Convert Pair Control
Register 2
ADCPC3: Analog-to-Digital Convert Pair Control
Register 3(1)
The ADCON register controls the operation of the
ADC module. The ADSTAT register displays the
status of the conversion processes. The ADPCFG
registers configure the port pins as analog inputs or
as digital I/O. The ADCPCx registers control the
triggering of the ADC conversions. See Register 19-1
through Register 19-8 for detailed bit configurations.
Note: A unique feature of the ADC module is its
ability to sample inputs in an
asynchronous manner. Individual sample
and hold circuits can be triggered
independently of each other.
© 2008-2012 Microchip Technology Inc. DS70318F-page 245
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 19-1: ADCON: ANALOG-TO-DIGITAL CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0
ADON —ADSIDLSLOWCLK
(1) —GSWTRG—FORM
(1)
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-1 R/W-1
EIE(1) ORDER(1,2) SEQSAMP(1,2) ASYNCSAMP(1) ADCS<2:0>(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ADON: Analog-to-Digital Operating Mode bit
1 = Analog-to-Digital Converter (ADC) module is operating
0 = ADC converter is off
bit 14 Unimplemented: Read as ‘0
bit 13 ADSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12 SLOWCLK: Enable The Slow Clock Divider bit(1)
1 = ADC is clocked by the auxiliary PLL (ACLK)
0 = ADC is clock by the primary PLL (FVCO)
bit 11 Unimplemented: Read as ‘0
bit 10 GSWTRG: Globa l Software Trigger bit
When this bit is set by the user, it will trigger conversi ons if selected by the TRGSRC<4:0> bits in the
ADCPCx registers. This bit must be cleared by the user prior to initiating another global trigger (i.e., this
bit is not auto-clearing).
bit 9 Unimplemented: Read as ‘0
bit 8 FORM: Data Output Format bit(1)
1 = Fractional (DOUT = dddd dddd dd00 0000)
0 = Integer (DOUT = 0000 00dd dddd dddd)
bit 7 EIE: Early Interrupt Enable bit(1)
1 = Interrupt is generated after first conversion is completed
0 = Interrupt is generated after second conversion is completed
bit 6 ORDER: Conversion Order bit(1,2)
1 = Odd numbered analog input is converted first, followed by conve rsi on of even numbered input
0 = Even numbered analog input is converted first, followed by conversion of odd numbered input
bit 5 SEQSAMP: Sequential Sample Enable bit(1,2)
1 = Shared Sample and Hold (S&H) circuit is sampled at the start of the second conversion if
ORDER = 0. If ORDER = 1, then the shared S&H is sampled at the start of the first conversion.
0 = Shared S&H is sampled at the same time the dedicated S&H is sampled if the shar ed S&H is not
currently busy with an existing conversion process. If the shared S&H is busy at the time the
dedicated S&H is sampled, then the shared S&H will sample at the start of the new conversion cycle.
bit 4 ASYNCSAMP: Asynchronous Dedicated S&H Sampling Enable bit(1)
1 = The dedicated S&H is constantly sampling and then terminates sampling as soon as the trigger
pulse is detected.
0 = The dedicated S&H start s sampling when the trigger event is detected and completes the sampling
process in two ADC clock cycles.
Note 1: This control bit can only be changed while ADC is disabled (ADON = 0).
2: This bit is only available on devices with one SAR.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 246 © 2008-2012 Microchip Technology Inc.
bit 3 Unimplemented: Read as ‘0
bit 2-0 ADCS<2:0>: Analog-to-Digital Conversion Clock Divider Select bits(1)
111 = FADC/8
110 = FADC/7
101 = FADC/6
100 = FADC/5
011 = FADC/4 (default)
010 = FADC/3
001 = FADC/2
000 = FADC/1
REGISTER 19-1: ADCON: ANALOG-TO-DIGITAL CONTROL REGISTER (CONTINUED)
Note 1: This control bit can only be changed while ADC is disabled (ADON = 0).
2: This bit is only available on devices with one SAR.
© 2008-2012 Microchip Technology Inc. DS70318F-page 247
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 19-2: ADSTAT: ANALOG -TO-DIGITAL STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
U-0 R/C-0, HS R/C-0, HS R/C-0, HS R/C-0, HS R/C-0, HS R /C-0, HS R/C-0, HS
P6RDY P5RDY P4RDY P3RDY P2RDY P1RDY P0RDY
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR
C = Clearable bit ‘1’ = Bit is set
HS = Hardware Settable bit ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7 Unimplemented: Read as ‘0
bit 6 P6RDY: Conversion Data for Pair 6 Ready bit
Bit is set when data is ready in buffer, cleared when a ‘0’ is written to this bit.
bit 5 P5RDY: Conversion Data for Pair 5 Ready bit
Bit is set when data is ready in buffer, cleared when a ‘0’ is written to this bit.
bit 4 P4RDY: Conversion Data for Pair 4 Ready bit
Bit is set when data is ready in buffer, cleared when a ‘0’ is written to this bit.
bit 3 P3RDY: Conversion Data for Pair 3 Ready bit
Bit is set when data is ready in buffer, cleared when a ‘0’ is written to this bit.
bit 2 P2RDY: Conversion Data for Pair 2 Ready bit
Bit is set when data is ready in buffer, cleared when a ‘0’ is written to this bit.
bit 1 P1RDY: Conversion Data for Pair 1 Ready bit
Bit is set when data is ready in buffer, cleared when a ‘0’ is written to this bit.
bit 0 P0RDY: Conversion Data for Pair 0 Ready bit
Bit is set when data is ready in buffer, cleared when a ‘0’ is written to this bit.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 248 © 2008-2012 Microchip Technology Inc.
REGISTER 19-3: ADBASE: ANALOG-TO-DIGITAL BASE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADBASE<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
ADBASE<7:1>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-1 ADBASE<15:1>: This register contains the base address of the user’s ADC Interrupt Service Routine
jump table. This register, when read, contains the sum of the ADBASE register contents and the
encoded value of the PxRDY status bits.
The encoder logic provides the bit number of the highest priority PxRDY bits where P0RDY is the
highest priority, and P6RDY is the lowest priority.
bit 0 Unimplemented: Read as ‘0
Note 1: The encoding results are shifted left two bits so bits 1-0 of the result are always zero.
2: As an alternative to using the ADBASE Register, the ADCP0-6 ADC Pair Conversion Complete Interrupts
can be used to invoke A to D conversion completion routines for individual ADC input pairs.
REGISTER 19-4: ADPCFG: ANALOG-TO-DIGIT AL PORT CONFIGURATION REGISTER
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
PCFG11 PCFG10 PCFG9 PCFG8
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12 Unimplemented: Read as ‘0
bit 11-0 PCFG11:PCFG0: Analog-to-Digital Port Configuration Control bits(1)
1 = Port pin in Digital mode, port read input enabled, Analog-to-Digital input multiplexor con nected to
AVSS
0 = Port pin in Analog mode, port read input disabled, Analog-to-Digital samples pin voltage
Note 1: Not all PCFGx bits are available on all devices. See Figure 19-1 through Figure 19-6 for the available
analog pins (PCFGx = ANx, where x = 0-11).
© 2008-2012 Microchip Technology Inc. DS70318F-page 249
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 19-5: ADCPC0: ANALOG-TO-DIGITAL CONVERT PAIR CONTROL REGISTER 0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN1 PEND1 SWTRG1 TRGSRC1<4:0>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN0 PEND0 SWTRG0 TRGSRC0<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 IRQEN1: Interrupt Request Enabl e 1 bi t
1 = Enable IRQ generation when requested conversion of channels AN3 and AN2 is co mpleted
0 = IRQ is not generated
bit 14 PEND1: Pending Conversion Status 1 bit
1 = Conversion of channels AN3 and AN2 is pendin g. Set when selected tri gger is asserted
0 = Conversion is complete
bit 13 SWTRG1: Software Trigger 1 bit
1 = Start conversion of AN3 and AN2 (if selected in TRGSRC bits)(1)
This bit is automatically cleared by hardwa re wh en th e PEN D 1 bi t i s set.
0 = Conversion is not started
Note 1: The trigger source must be set as global software trigger prior to setting this bit to ‘1’. If other conversions
are in progress, then conversion will be perfo rmed when the conversion resources are available.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 250 © 2008-2012 Microchip Technology Inc.
bit 12-8 TRGSRC1<4:0>: Trig ge r 1 So urce Sel e cti o n bi ts
Selects trigger source for conversion of analog channels AN3 and AN2.
11111 = Timer2 period match
11011 = Reserved
11010 = PWM Generator 4 current-limit ADC trigger
11001 = PWM Generator 3 current-limit ADC trigger
11000 = PWM Generator 2 current-limit ADC trigger
10111 = PWM Generator 1 current-limit ADC trigger
10110 = Reserved
10010 = Reserved
10001 = PWM Generator 4 secondary trigger selected
10000 = PWM Generator 3 secondary trigger selected
01111 = PWM Generator 2 secondary trigger selected
01110 = PWM Generator 1 secondary trigger selected
01101 = Reserved
01100 = Timer1 period match
01000 = Reserved
00111 = PWM Generator 4 primary trigger selecte d
00110 = PWM Generator 3 primary trigger selecte d
00101 = PWM Generator 2 primary trigger selecte d
00100 = PWM Generator 1 primary trigger selecte d
00011 = PWM S pecial Event Trigger selected
00010 = Global software trigger selected
00001 = Individual software trigger selected
00000 = No conversion enabled
bit 7 IRQEN0: In te rrupt Request Ena b l e 0 bi t
1 = Enable IRQ generation when requested conversion of channels AN1 and AN0 is co mpleted
0 = IRQ is not genera ted
bit 6 PEND0: Pending Conversion Status 0 bit
1 = Conversion of channels AN1 and AN0 is pendin g; set when selected tri gger is asserted
0 = Conversion is complete
bit 5 SWTRG0: Software Trigger 0 bit
1 = Start conversion of AN1 and AN 0 (if selected by TRGSRC bits)(1)
This bit is automatically cleared by hardware when the PEND0 bit is set.
0 = Conversion is not started
REGISTER 19-5: ADCPC0: ANALOG-TO-DIGITAL CONVERT PAIR CONTROL REGISTER 0
(CONTINUED)
Note 1: The trigger source must be set as global software trigger prior to setting this bit to ‘1’. If other conversions
are in progress, then conversion will be perfo rmed when the conversion resources are available.
© 2008-2012 Microchip Technology Inc. DS70318F-page 251
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 4-0 TRGSRC0<4:0>: Trig ge r 0 Sou r ce Sel e cti o n bi ts
Selects trigger source for conversion of analog channels AN1 and AN0.
11111 = Timer2 period match
11011 = Reserved
11010 = PWM Generator 4 current-limit ADC trigger
11001 = PWM Generator 3 current-limit ADC trigger
11000 = PWM Generator 2 current-limit ADC trigger
10111 = PWM Generator 1 current-limit ADC trigger
10110 = Reserved
10010 = Reserved
10001 = PWM Generator 4 secondary trigger selected
10000 = PWM Generator 3 secondary trigger selected
01111 = PWM Generator 2 secondary trigger selected
01110 = PWM Generator 1 secondary trigger selected
01101 = Reserved
01100 = Timer1 period match
01000 = Reserved
00111 = PWM Generator 4 primary trigger selecte d
00110 = PWM Generator 3 primary trigger selecte d
00101 = PWM Generator 2 primary trigger selecte d
00100 = PWM Generator 1 primary trigger selecte d
00011 = PWM S pecial Event Trigger selected
00010 = Global software trigger selected
00001 = Individual software trigger selected
00000 = No conversion enabled
REGISTER 19-5: ADCPC0: ANALOG-TO-DIGITAL CONVERT PAIR CONTROL REGISTER 0
(CONTINUED)
Note 1: The trigger source must be set as global software trigger prior to setting this bit to ‘1’. If other conversions
are in progress, then conversion will be perfo rmed when the conversion resources are available.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 252 © 2008-2012 Microchip Technology Inc.
REGISTER 19-6: ADCPC1: ANALOG-TO-DIGIT AL CONVERT PAIR CONTROL REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN3(1) PEND3(1) SWTRG3(1) TRGSRC3<4:0>(1)
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN2(2) PEND2(2) SWTRG2(2) TRGSRC2<4:0>(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 IRQEN3: Interrupt Request Enabl e 3 bi t(1)
1 = Enable IRQ generation when requested conversion of channels AN7 and AN6 is co mpleted
0 = IRQ is not genera ted
bit 14 PEND3: Pending Conversion Status 3 bit(1)
1 = Conversion of channels AN7 and AN6 is pendin g. Set when selected tri gger is asserted
0 = Conversion is complete
bit 13 SWTRG3: Software Trigger 3 bit(1)
1 = Start conversion of AN7 and AN6 (if selected in TRGSRC bits)(3)
This bit is automatically cleared by hardware when the PEND3 bit is set.
0 = Conversion is not started
Note 1: These bit s are ava i l ab l e i n th e dsPIC33FJ16GS4 02/404, dsPIC33FJ16GS504, dsPIC33FJ16GS502 and
dsPIC33FJ06GS101 devices only.
2: These bits are available in the dsPIC33FJ16GS502, dsPIC33FJ16GS504, dsPIC33FJ06GS102,
dsPIC33FJ06GS202 and dsPIC33FJ16GS402/404 devices only.
3: The trigger source must be set as global software trigger prior to setting this bit to ‘1’. If other conversions
are in progress, then conversion will be perfo rmed when the conversion resources are available.
© 2008-2012 Microchip Technology Inc. DS70318F-page 253
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 12-8 TRGSRC3<4:0>: Trig ge r 3 Sou r ce Sel e cti o n bi ts(1)
Selects trigger source for conversion of analog channels AN7 and AN6.
11111 = Timer2 period match
11011 = Reserved
11010 = PWM Generator 4 current-limit ADC trigger
11001 = PWM Generator 3 current-limit ADC trigger
11000 = PWM Generator 2 current-limit ADC trigger
10111 = PWM Generator 1 current-limit ADC trigger
10110 = Reserved
10010 = Reserved
10001 = PWM Generator 4 secondary trigger selected
10000 = PWM Generator 3 secondary trigger selected
01111 = PWM Generator 2 secondary trigger selected
01110 = PWM Generator 1 secondary trigger selected
01101 = Reserved
01100 = Timer1 period match
01000 = Reserved
00111 = PWM Generator 4 primary trigger selecte d
00110 = PWM Generator 3 primary trigger selecte d
00101 = PWM Generator 2 primary trigger selecte d
00100 = PWM Generator 1 primary trigger selecte d
00011 = PWM S pecial Event Trigger selected
00010 = Global software trigger selected
00001 = Individual software trigger selected
00000 = No conversion enabled
bit 7 IRQEN2: In te rrupt Request Ena b l e 2 bi t(2)
1 = Enable IRQ generation when requested conversion of channels AN5 and AN4 is co mpleted
0 = IRQ is not generated
bit 6 PEND2: Pending Conversion Status 2 bit(2)
1 = Conversion of channels AN5 and AN4 is pendin g; set when selected tri gger is asserted.
0 = Conversion is complete
bit 5 SWTRG2: Software Trigger 2 bit(2)
1 = Start conversion of AN5 and AN 4 (if selected by TRGSRC bits)(3)
This bit is automatically cleared by hardwa re wh en th e PEN D 2 bi t i s set.
0 = Conversion is not started
REGISTER 19-6: ADCPC1: ANALOG-TO-DIGITAL CONVERT PAIR CONTROL REGISTER 1
(CONTINUED)
Note 1: These bit s are ava i l ab l e i n th e dsPIC33FJ16GS4 02/404, dsPIC33FJ16GS504, dsPIC33FJ16GS502 and
dsPIC33FJ06GS101 devices only.
2: These bits are available in the dsPIC33FJ16GS502, dsPIC33FJ16GS504, dsPIC33FJ06GS102,
dsPIC33FJ06GS202 and dsPIC33FJ16GS402/404 devices only.
3: The trigger source must be set as global software trigger prior to setting this bit to ‘1’. If other conversions
are in progress, then conversion will be perfo rmed when the conversion resources are available.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 254 © 2008-2012 Microchip Technology Inc.
bit 4-0 TRGSRC2<4:0>: Trig ge r 2 So urce Sel e cti o n bi ts
Selects trigger source for conversion of analog channels AN5 and AN4.
11111 = Timer2 period match
11011 = Reserved
11010 = PWM Generator 4 current-limit ADC trigger
11001 = PWM Generator 3 current-limit ADC trigger
11000 = PWM Generator 2 current-limit ADC trigger
10111 = PWM Generator 1 current-limit ADC trigger
10110 = Reserved
10010 = Reserved
10001 = PWM Generator 4 secondary trigger selected
10000 = PWM Generator 3 secondary trigger selected
01111 = PWM Generator 2 secondary trigger selected
01110 = PWM Generator 1 secondary trigger selected
01101 = Reserved
01100 = Timer1 period match
01000 = Reserved
00111 = PWM Generator 4 primary trigger selecte d
00110 = PWM Generator 3 primary trigger selecte d
00101 = PWM Generator 2 primary trigger selecte d
00100 = PWM Generator 1 primary trigger selecte d
00011 = PWM S pecial Event Trigger selected
00010 = Global software trigger selected
00001 = Individual software trigger selected
00000 = No conversion enabled
REGISTER 19-6: ADCPC1: ANALOG-TO-DIGITAL CONVERT PAIR CONTROL REGISTER 1
(CONTINUED)
Note 1: These bit s are ava i l ab l e i n th e dsPIC33FJ16GS4 02/404, dsPIC33FJ16GS504, dsPIC33FJ16GS502 and
dsPIC33FJ06GS101 devices only.
2: These bits are available in the dsPIC33FJ16GS502, dsPIC33FJ16GS504, dsPIC33FJ06GS102,
dsPIC33FJ06GS202 and dsPIC33FJ16GS402/404 devices only.
3: The trigger source must be set as global software trigger prior to setting this bit to ‘1’. If other conversions
are in progress, then conversion will be perfo rmed when the conversion resources are available.
© 2008-2012 Microchip Technology Inc. DS70318F-page 255
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 19-7: ADCPC2: ANALOG-TO-DIGITAL CONVERT PAIR CONTROL REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN5 PEND5 SWTRG5 TRGSRC5<4:0>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN4 PEND4 SWTRG4 TRGSRC4<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 IRQEN5: Interrupt Request Enabl e 5 bi t
1 = Enable IRQ generation when requ ested conversion of channels AN11 and AN10 is completed
0 = IRQ is not generated
bit 14 PEND5: Pending Conversion Status 5 bit
1 = Conversion of channels AN11 and AN10 is pending; set when selected trigger is asserted
0 = Conversion is complete
bit 13 SWTRG5: Software Trigger 5 bit
1 = Start conversion of AN11 and AN10 (if selected in TRGSRC bits)(2)
This bit is automatically cleared by hardwa re wh en th e PEN D 5 bi t i s set.
0 = Conversion is not started
Note 1: This register is only implemented on the dsPIC33FJ16GS504 devices.
2: The trigger source must be set as global software trigger prior to setting this bit to ‘1’. If other conversions
are in progress, then conversion will be perfo rmed when the conversion resources are available.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 256 © 2008-2012 Microchip Technology Inc.
bit 12-8 TRGSRC5<4:0>: Trig ge r 5 So urce Sel e cti o n bi ts
Selects trigger source for conversion of analog channels AN11 and AN10.
11111 = Timer2 period match
11011 = Reserved
11010 = PWM Generator 4 current-limit ADC trigger
11001 = PWM Generator 3 current-limit ADC trigger
11000 = PWM Generator 2 current-limit ADC trigger
10111 = PWM Generator 1 current-limit ADC trigger
10110 = Reserved
10010 = Reserved
10001 = PWM Generator 4 secondary trigger selected
10000 = PWM Generator 3 secondary trigger selected
01111 = PWM Generator 2 secondary trigger selected
01110 = PWM Generator 1 secondary trigger selected
01101 = Reserved
01100 = Timer1 period match
01000 = Reserved
00111 = PWM Generator 4 primary trigger selecte d
00110 = PWM Generator 3 primary trigger selecte d
00101 = PWM Generator 2 primary trigger selecte d
00100 = PWM Generator 1 primary trigger selecte d
00011 = PWM S pecial Event Trigger selected
00010 = Global software trigger selected
00001 = Individual software trigger selected
00000 = No conversion enabled
bit 7 IRQEN4: In te rrupt Request Ena b l e 4 bi t
1 = Enable IRQ generation when requested conversion of channels AN9 and AN8 is co mpleted
0 = IRQ is not genera ted
bit 6 PEND4: Pending Conversion Status 4 bit
1 = Conversion of channels AN9 and AN8 is pendin g; set when selected tri gger is asserted
0 = Conversion is complete
bit 5 SWTRG4: Software Trigger4 bit
1 = Start conversion of AN9 and AN 8 (if selected by TRGSRC bits)(2)
This bit is automatically cleared by hardware when the PEND4 bit is set.
0 = Conversion is not started
REGISTER 19-7: ADCPC2: ANALOG-TO-DIGITAL CONVERT PAIR CONTROL REGISTER 2
(CONTINUED)
Note 1: This register is only implemented on the dsPIC33FJ16GS504 devices.
2: The trigger source must be set as global software trigger prior to setting this bit to ‘1’. If other conversions
are in progress, then conversion will be perfo rmed when the conversion resources are available.
© 2008-2012 Microchip Technology Inc. DS70318F-page 257
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 4-0 TRGSRC4<4:0>: Trig ge r 4 Sou r ce Sel e cti o n bi ts
Selects trigger source for conversion of analog channels AN9 and AN8.
11111 = Timer2 period match
11011 = Reserved
11010 = PWM Generator 4 current-limit ADC trigger
11001 = PWM Generator 3 current-limit ADC trigger
11000 = PWM Generator 2 current-limit ADC trigger
10111 = PWM Generator 1 current-limit ADC trigger
10110 = Reserved
10010 = Reserved
10001 = PWM Generator 4 secondary trigger selected
10000 = PWM Generator 3 secondary trigger selected
01111 = PWM Generator 2 secondary trigger selected
01110 = PWM Generator 1 secondary trigger selected
01101 = Reserved
01100 = Timer1 period match
01000 = Reserved
00111 = PWM Generator 4 primary trigger selecte d
00110 = PWM Generator 3 primary trigger selecte d
00101 = PWM Generator 2 primary trigger selecte d
00100 = PWM Generator 1 primary trigger selecte d
00011 = PWM S pecial Event Trigger selected
00010 = Global software trigger selected
00001 = Individual software trigger selected
00000 = No conversion enabled
REGISTER 19-7: ADCPC2: ANALOG-TO-DIGITAL CONVERT PAIR CONTROL REGISTER 2
(CONTINUED)
Note 1: This register is only implemented on the dsPIC33FJ16GS504 devices.
2: The trigger source must be set as global software trigger prior to setting this bit to ‘1’. If other conversions
are in progress, then conversion will be perfo rmed when the conversion resources are available.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 258 © 2008-2012 Microchip Technology Inc.
REGISTER 19-8: ADCPC3: ANALOG-TO-DIGIT AL CONVERT PAIR CONTROL REGISTER 3(1)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQEN6 PEND6 SWTRG6 TRGSRC6<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0
bit 7 IRQEN6: In te rrupt Request Ena b l e 6 bi t
1 = Enable IRQ generation when requ ested conversion of channels AN13 and AN12 is completed
0 = IRQ is not genera ted
bit 6 PEND6: Pending Conversion Status 6 bit
1 = Conversion of channels AN13 and AN 12 is pending; set when selected trigger is asserted
0 = Conversion is complete
bit 5 SWTRG6: Software Trigger 6 bit
1 = Start conversion of AN13 (INTREF) and AN12 (EXTREF) (if selected by TRGSRC bits)(2)
This bit is automatically cleared by hardware when the PEND6 bit is set.
0 = Conversion is not started
Note 1: This register is only implemented on the dsPIC33FJ16GS502 and dsPIC33FJ16GS504 devices.
2: The trigger source must be set as global software trigger prior to setting this bit to ‘1’. If other conversions
are in progress, conversion will be performed when the conversion resources are available.
© 2008-2012 Microchip Technology Inc. DS70318F-page 259
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
bit 4-0 TRGSRC6<4:0>: Trig ge r 6 Sou r ce Sel e cti o n bi ts
Selects trigger source for conversion of analog channels AN13 and AN12.
11111 = Timer2 period match
11011 = Reserved
11010 = PWM Generator 4 current-limit ADC trigger
11001 = PWM Generator 3 current-limit ADC trigger
11000 = PWM Generator 2 current-limit ADC trigger
10111 = PWM Generator 1 current-limit ADC trigger
10110 = Reserved
10010 = Reserved
10001 = PWM Generator 4 secondary trigger selected
10000 = PWM Generator 3 secondary trigger selected
01111 = PWM Generator 2 secondary trigger selected
01110 = PWM Generator 1 secondary trigger selected
01101 = Reserved
01100 = Timer1 period match
01000 = Reserved
00111 = PWM Generator 4 primary trigger selecte d
00110 = PWM Generator 3 primary trigger selecte d
00101 = PWM Generator 2 primary trigger selecte d
00100 = PWM Generator 1 primary trigger selecte d
00011 = PWM S pecial Event Trigger selected
00010 = Global software trigger selected
00001 = Individual software trigger selected
00000 = No conversion enabled
REGISTER 19-8: ADCPC3: ANALOG-TO-DIGITAL CONVERT PAIR CONTROL REGISTER 3(1)
(CONTINUED)
Note 1: This register is only implemented on the dsPIC33FJ16GS502 and dsPIC33FJ16GS504 devices.
2: The trigger source must be set as global software trigger prior to setting this bit to ‘1’. If other conversions
are in progress, conversion will be performed when th e conversion resources are available.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 260 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 261
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
20.0 HIGH-SPE ED ANALOG
COMPARATOR
The dsPIC33F SMPS Comparator module monitors
current and/or voltage transients that may be too fast
for the CPU and ADC to capture.
20.1 Features Overview
The SMPS comparator module contains the following
major features:
16 selectable comparator inputs
Up to four analog comparators
10-bit DAC for each analog comparator
Programmable outpu t polarity
Interrupt generation capability
DACOUT pin to pro vi de DAC output
DAC has three ranges of operation :
-AV
DD/2
- Internal Reference (INTREF)
- External Reference (EXT REF)
ADC sample and convert trigger capability
Disable capability reduces power consumption
Functional support for PWM module:
- PWM duty cycle control
- PWM period control
- PWM Fault detect
20.2 Module Description
Figure 20-1 shows a functional block diagram of one
analog comparator from the SMPS comparator
module. The analog comparator provides high-speed
operation with a typical delay of 20 ns. The comparator
has a typical offset voltage of ±5 mV. The negative
input of the comparator is always connected to the
DAC circuit. The positive input of the comparator is
connected to an analog multiplexer that selects the
desired source pin.
The analog comparator input pins are typically sha red
with pins used by the Analog-to-Digital Converter
(ADC) module. Both the comparator and the ADC can
use the same pins at the same time. This capability
enables a user to measure an input voltage with the
ADC and detect voltage transients with the
comparator.
FIGURE 20-1: COMPARATOR MODULE BLOCK DIAGRAM
Note 1: This data sheet summarizes the
features of the dsPIC33FJ06GS101/X02
and dsPIC33FJ16GSX02/X04 families
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 45. “High-Speed
Analog Comparator” (DS70296) in the
“dsPIC33F/PIC24H Family Reference
Manual”, which is available on the
Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
CMPxA(1)
CMPxC(1)
DAC
CMPPOL
0
1
AVDD/2
INTREF(2)
M
U
X
M
U
X
CMREF
CMPx(1)
INSEL<1:0>
10
ACMPx (Trigger to PWM)(1)
Interrupt Request
CMPxB(1)
CMPxD(1) Glitch Filter Pulse
EXTREF(2)
Status
AVSS
Generator
RANGE
DACOUT
DACOE
Note 1: x = 1, 2, 3, and 4.
2: For the INTREF and EXTREF values, refer to the DAC Module Specifications (Table 24-43) in Section 24.0
“Electrical Characteristics”.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 262 © 2008-2012 Microchip Technology Inc.
20.3 Module Applications
This module provides a means for the SMPS dsPIC
DSC devices to monitor voltage and currents in a
power conversion application. The ability to detect
transient conditions and stimulate the dsPIC DSC
processor and/or peripherals, without requiring the
processor and ADC to constantly monitor voltages or
currents, frees the dsPIC DSC to perform other tasks.
The comparator module has a high-spee d comparator
and an associated 10-bit DAC that provides a
programmable reference voltage to the inverting input
of the comparator. The polari ty of the comparator out-
put is user-programmable. The output of the module
can be used in the following modes:
Generate an Interrupt
Trigger an ADC Sample and Convert Process
Truncate the PWM Signal (current limit)
Truncate the PWM Period (current minimum)
Disable the PWM Outputs (Fault latch)
The output of the comparator mo dule may be used in
multiple modes at the same time, such as: 1) generate
an interrupt, 2) have the ADC take a sa mple and con-
vert it, and 3) truncate the PWM output in response to
a voltage being detected beyond its expected value.
The comparator module can also be used to wake-up
the system from Sleep or Idle mode when the analog
input voltage exceeds the programmed threshold
voltage.
20.4 DAC
The range of the DAC is controlled thro ugh an analog
multiplexer that selects either AVDD/2, an internal ref-
erence source, INTREF, or an external reference
source, EXTREF. The full range of the DAC (AVDD/2)
will typically be used when the chosen input source pin
is shared with the ADC. The reduced range option
(INTREF) will likely be used when monitoring current
levels using a current sense resistor. Usually, the
measured voltages in such applications are small
(<1.25V); therefore the option of using a reduced
reference range for the comparator extends the
available DAC resolution in these applications. The
use of an external reference enables the user to
connect to a reference that better suits their
application.
DACOUT, shown in Figure 20-1, can only be
associated with a single comparator at a given time.
20.5 Interaction with I/O Buffers
If the comparator module is enabled and a pin has
been selected as the source for the comparator, then
the chosen I/O pad must disable the digital input buffer
associated with the pad to prevent excessive currents
in the digital buffer due to analog input voltages.
20.6 Digital Logic
The CMPCONx register (see Register 20-1) provides
the control logic that configures the comparator
module. The digital logic provid es a glitch filter for the
comparator output to mask transient signals in less
than two instruction cycles. In Sleep or Idle mode, the
glitch filter is bypassed to enable an asynchronous
path from the comparator to the interrupt controller.
This asynchronous path can be used to wake-up the
processor from Sleep or Idle mode.
The comparator can be disabled while in Idle mode if
the CMPSIDL bit is set. If a device has multiple
comparators, if any CMPSIDL bit is set, then the entire
group of comparators will be disabled while in Idle
mode. This behavior reduce s complexity in the design
of the clock control logic for this module.
The digital logic also provides a one TCY width pulse
generator for triggering the ADC and generating
interrupt requests.
The CMPDACx (see Register 20-2) register provides
the digital input value to the reference DAC.
If the module is disabled, the DAC and comparator are
disabled to reduce power consumption.
20.7 Comparator Input Range
The comparator has a limitation for the input Common
Mode Range (CMR) of (AVDD – 1.5V), typical. This
means that both inputs should not exceed this range.
As long as one of the inputs is within the Common
Mode Range, the comparator output will be correct.
However, any input exceeding the CMR limitation will
cause the comparator input to be saturated.
If both inputs exceed the CMR, the comparator output
will be indeterminate.
20.8 DAC Output Range
The DAC has a limitation for the maximum reference
voltage input of (AVDD – 1.6) volts. An external
reference voltage input should not exceed this value or
the reference DAC output will become indetermina te.
20.9 Comparator Registers
The comparator module is controlled by the following
registers:
CMPCONx: Comparator Control Register
CMPDACx: Comparator DAC Control Register
Note: It should be ensured in software that
multiple DACOE bits are not set. The
output on the DACOUT pin will be indeter-
minate if multiple comparators enable the
DAC output.
© 2008-2012 Microchip Technology Inc. DS70318F-page 263
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
REGISTER 20-1: CMPCONx: COMPARATOR CONTROL REGISTER
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0
CMPON CMPSIDL —DACOE
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0
INSEL<1:0> EXTREF —CMPSTAT CMPPOL RANGE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 CMPON: Comparator Operating Mode bit
1 = Comparator module is enabled
0 = Comparator module is disabled (reduces po wer consumption)
bit 14 Unimplemented: Read as ‘0
bit 13 CMPSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode.
0 = Continue module operation in Idle mode
If a device has multiple comparators, any CMPSIDL bit set to ‘1’ disables ALL comparators while in
Idle mode.
bit 12-9 Reserved: Read as ‘0
bit 8 DACOE: DAC Output Enable
1 = DAC analog voltage is output to DACOUT pin(1)
0 = DAC analog voltage is not connected to DACOUT pin
bit 7-6 INSEL<1:0>: Input Source Select for Comparator bits
00 = Select CMPxA input pin
01 = Select CMPxB input pin
10 = Select CMPxC input pin
11 = Select CMPxD input pin
bit 5 EXTREF: Enable External Reference bit
1 = External source provides reference to DAC (maximum DAC voltage determined by external
voltage source)
0 = Internal reference sources provide reference to DAC (maximum DAC voltage determined by
RANGE bit setting)
bit 4 Reserved: Read as ‘0
bit 3 CMPSTAT: Current State of Comparator Output Including CMPPOL Selection bit
bit 2 Reserved: Read as ‘0
bit 1 CMPPOL: Comparator Output Polarity Control bit
1 = Output is inve rted
0 = Output is non-inverted
bit 0 RANGE: Selects DAC Output Voltage Range bit
1 = High Range: Max DAC Value = AV DD/2, 1.65V at 3.3V AVDD
0 = Low Range: Max DAC Value = INTREF(2)
Note 1: DACOUT can be associated only with a single comparator at any given time. The software must ensure
that multiple comparators do not enable the DAC output by setting their respective DACOE bit.
2: Refer to the DAC Module Specifications (Table 24-43) in Section 24.0 “Electrical Characteristics for
the INTREF value.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 264 © 2008-2012 Microchip Technology Inc.
REGISTER 20-2: CMPDACx: COMPARATOR DAC CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
—CMREF<9:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CMREF<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10 Reserved: Read as ‘0
bit 9-0 CMREF<9:0>: Comparator Reference Voltage Select bits
1111111111 = (CMREF * INTREF/1024) or (CMREF * (AVDD/2)/1 024) volts depending on RANGE
bit or (CMREF * EXTREF/1024) if EXTREF is set
0000000000 = 0.0 volts
ã 2008-2012 Microchip Technology Inc. DS70318F-page 265
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
21.0 SPECIAL FEATURES
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices include several
features intended to maximize application flexibility and
reliability, and minimize cost through elimination of
external components. These are:
Flexible Configuration
Watchdog Timer (WDT)
Code Protection and CodeGuard™ Security
JTAG Boundary Scan Interface
In-Circuit Serial Programming™ (ICSP™)
In-Circuit Emulation
Brown-out Reset (BOR)
21.1 Configuration Bits
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices provide no n-volatile
memory implementations for device Configuration bits.
Refer to Section 25. “Device Configuration”
(DS70194) in the “dsPIC33F/PIC24H Family
Reference Manual” for more information on this
implementation.
The Configuration bits can be programmed (read
as 0’), or left unprogrammed (read as ‘1’), to select
various device configurations. These bits are mapped
starting at program memory location 0xF80000.
The individual Configuration bit descriptions for the
Configuration registers are shown in Table 21-2.
Note that address, 0xF80000, is beyond the user pro-
gram memory space. It belongs to the configuration
memory space (0x800000-0xFFFFFF), which can only
be accessed using table reads and t able writes.
The device Configuration register map is shown in
Table 21-1.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices. It is
not intended to be a comprehensive ref-
erence source. To complement the in for-
mation in this data sheet, refer to the
“dsPIC33F/PIC24H Family Reference
Manual”. Please see the Microchip web
site (www.microchip.com) for the latest
“dsPIC33F/PIC24H Family Reference
Manual” sections.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
TABLE 21-1: DEVICE CONFIGURATION REGISTER MAP
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0xF80000 FBS BSS<2:0> BWRP
0xF80002 Reserved
0xF80004 FGS GSS<1:0> GWRP
0xF80006 FOSCSEL IESO —FNOSC<2:0>
0xF80008 FOSC FCKSM<1:0> IOL1WAY OSCIOFNC POSCMD<1:0>
0xF8000A FWDT FWDTEN WINDIS WDTPRE WDTPOST<3:0>
0xF8000C FPOR Reserved(2) FPWRT<2:0>
0xF8000E FICD Reserved(1) JTAGEN —ICS<1:0>
0xF80010 FUID0 User Unit ID Byte 0
0xF80012 FUID1 User Unit ID Byte 1
Legend: — = unimplemented bit, read as ‘0’.
Note 1: These bits are reserved for use by development tools and must be programmed to 1’.
2: This bit reads th e current programme d val ue.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 266 © 2008-2012 Microchip Technology Inc.
TABLE 21-2: dsPIC33F CONFIGURATION BITS DESCRIPTION
Bit Field Register RTSP Effect Description
BWRP FBS I mmediate Boot Segment Program Flash Write Protection bit
1 = Boot segment ca n be wri tten
0 = Boot segment is write-prot ected
BSS<2:0> FBS Immediate Boot Segment Program Flash Code Protection Size bits
x11 = No boot program Flash segment
Boot space is 256 instruction words (except interrupt vectors)
110 = Standard security; boot program Flash segment ends at
0x0003FE
010 = High security; boot program Flash segment ends at
0x0003FE
Boot space is 768 instruction words (except interrupt vectors)
101 = Standard security; boot program Flash segment ends at
0x0007FE
001 = High security; boot program Flash segment ends at
0x0007FE
Boot space is 1792 instruction words (except interrupt vectors)
100 = Standard security; boot program Flash segment ends at
0x000FFE
000 = High security; boot program Flash segment ends at
0x000FFE
GSS<1:0> FGS Immediate General Segment Code-Protect bits
11 = User program memory is not code-protected
10 = Standard security
0x = High security
GWRP FGS Immediate General Segment Write-Protect bit
1 = User program m em ory is not write-protected
0 = User progra m memory is write-prot e c te d
IESO FOSCSEL Immediate Two-speed Oscillator Start-up Enable bit
1 = Start-up device with FRC, then automatically switch to the
user-selected oscillator source when ready
0 = Start-up device with user-selected oscillator source
FNOSC<2:0> FOSCSEL If clock switch
is enabled,
RTSP effect
is on any
device Reset;
otherwise,
Immediate
Initial Oscillator Source Selection bits
111 = Internal Fast RC (FRC) oscillator with postscaler
110 = Internal Fast RC (FRC) oscillator with divide-by-16
101 = LPRC oscillator
100 = Reserved
011 = Primary (XT, HS, EC) oscillator with PLL
010 = Primary (XT, HS, EC) oscillator
001 = Internal Fast RC (FRC) oscillator with PLL
000 = FRC oscillator
FCKSM<1:0> FOSC Immediate Clock Switching Mode bits
1x = Clock switching is disabled, Fail-Safe Clock Moni tor is dis-
abled
01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled
00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled
IOL1WAY FOSC Immediate Peripheral Pin Select Configuration bit
1 = Allow only one reconfiguration
0 = Allow multiple reconfigurations
OSCIOFNC FOSC Immediate OSC2 Pin Function bit (except in XT and HS mod e s)
1 = OSC2 is clock output
0 = OSC2 is general purpose digital I/O pin
© 2008-2012 Microchip Technology Inc. DS70318F-page 267
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
POSCMD<1:0> FOSC Immediate Primary Oscillator Mode Select bits
11 = Primary oscillator disabled
10 = HS Crystal Oscillator mode
01 = XT Crystal Oscillator mode
00 = EC (External Clock) mode
FWDTEN FWDT Immediate Watchdog Timer Enable bi t
1 = Watchdog Timer always enabled (LPRC oscillator cannot be
disabled; clearing the SWDTEN bit in the RCON register will have
no effect)
0 = Watchdog T imer enabled/disabled by user software (LPRC can
be disabled by clearing the SWDTEN bit in the RCON register)
WINDIS FWDT Immediate Watchdog Timer Window Enable bit
1 = Watchdog Timer in Non-Window mode
0 = Watchdog Timer in Window mode
WDTPRE FWDT Immediate Watchdog Timer Prescaler bit
1 = 1:128
0 = 1:32
WDTPOST<3:0> FWDT Immediate Watchdog Timer Postscaler bits
1111 = 1:32,768
1110 = 1:16,384
0001 = 1:2
0000 = 1:1
FPWRT<2:0> FPOR Immediate Power-on Reset Timer Value Select bits
111 = PWRT = 128 ms
110 = PWRT = 64 ms
101 = PWRT = 32 ms
100 = PWRT = 16 ms
011 = PWRT = 8 ms
010 = PWRT = 4 ms
001 = PWRT = 2 ms
000 = PWRT = Disabled
JTAGEN FICD Immediate JTAG Enable bit
1 = JTAG is enabled
0 = JTAG is disabled
ICS<1:0> FICD Immediate ICD Communication Channel Select Enable bits
11 = Communicate on PGEC1 and PGED1
10 = Communicate on PGEC2 and PGED2
01 = Communicate on PGEC3 and PGED3
00 = Reserved, do not use.
TABLE 21-2: dsPIC33F CONFIGURATION BITS DESCRIPTION (CONTINUED)
Bit Field Register RTSP Effect Description
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 268 © 2008-2012 Microchip Technology Inc.
21.2 On-Chip Voltage Regulator
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices power their core digital
logic at a nominal 2.5V. This can create a conflict for
designs that are required to operate at a higher typical
voltage, such as 3.3V. To simplify system design, all
devices in the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 families incorporate an on-chip
regulator that allows the device to run its core logic from
VDD.
The regulator provides power to the core from the other
VDD pins. When the regulator is enabled, a low-ESR
(less than 5 ohms) capacitor (such as tantalum or
ceramic) must be connected to the VCAP pin
(Figure 21-1). This helps to maintain the stability of the
regulator. The recommended value for the filter
capacitor is provided in Table 24-13 located in
Section 24.1 “DC Characteristics”.
On a POR, it t akes approximately 20 μs for the on-chip
voltage regulator to generate an output voltage. During
this time, designated as TSTARTUP, code execution is
disabled. TSTARTUP is applied every time the device
resumes operation after any power-down.
FIGURE 21-1: CONNECTIONS FOR THE
ON-CHIP VOLTAGE
REGULATOR(1,2,3)
21.3 BOR: Brown-Out Reset
The Brown-out Reset (BOR) module is based on an
internal voltage reference circuit. Th e main purpose of
the BOR module is to generate a device Reset when a
brown-out condition occurs. Brown-out conditions are
generally caused by glitches on the AC mains (for
example, missing portions of the AC cycle waveform
due to bad power transmission lines, or voltage sags
due to excessive current draw when a large inductive
load is turned on).
A BOR generates a Reset pulse, which resets the
device. The BOR selects the clock source, based on
the device Configuration bit values (FNOSC< 2:0> and
POSCMD<1:0>).
If an oscillator mode is selected, the BOR activates the
Oscillator Start-up Timer (OST). The system clock is
held until OST expires. If the PLL is u sed, the clock is
held until the LOCK bit (OSCCON<5>) is ‘1’.
Concurrently, the PWRT time-out (TPWRT) is applied
before the internal Reset is released. If TPWRT = 0 and
a crystal oscillator is being used, then a nominal delay
of TFSCM = 100 is applied. The total delay in this case
is TFSCM.
The BOR S tatus bit (RCON<1>) is set to indicate that a
BOR has occurred. The BOR circuit continues to
operate while in Sleep or Idle modes and resets the
device should VDD fall below the BOR threshold
voltage.
Note: It is important for the low-ESR capacitor to
be placed as close as possible to the VCAP
pin.
Note 1: These are typical operating voltages. Refer to
Table 24-13 located in Section 24.1 “DC
Characteristics” for th e fu ll o perat in g
ranges of VDD.
2: It is important for the low-ESR capacitor to
be placed as close as possible to th e VCAP
pin.
3: Typical VCAP pin voltage = 2.5V when
VDD VDDMIN.
VDD
VCAP
VSS
dsPIC33F
CEFC
3.3V
10 µF
Tantalum
© 2008-2012 Microchip Technology Inc. DS70318F-page 269
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
21.4 Watchdog Timer (WDT)
For dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices, the WDT is dr iven by
the LPRC oscillator . When the WDT is enabled, the clock
source is also enabled.
21.4.1 PRESCALER/POSTSCALER
The nominal WDT cl ock source from LPRC is 32 kHz.
This feeds a prescaler than can be configured for either
5-bit (divide-by-32) or 7-bit (divide-by-128) operation.
The prescaler is set by the WDTPRE Configuration bit.
With a 32 kHz input, the prescaler yields a nominal
WDT time-out period (TWDT) of 1 ms in 5-bit mode, or
4 ms in 7-bit mode.
A variable postscaler divides down the WDT prescaler
output and allows for a wide range of time-out periods.
The postscaler is controlled by the WDTPOST<3:0>
Configuration bits (FWDT<3:0>) which allow the
selection of 16 settings, from 1:1 to 1:32,768. Using the
prescaler and postscaler, time-out periods ranging from
1 ms to 131 seconds can be achieved.
The WDT, prescaler and postscaler are reset:
On any device Reset
On the completion of a clock switch, whether
invoked by software (i.e., setting the OSWEN bit
after changing the NOSC<2:0> bits) or by
hardware (i.e., Fail-Safe Clock Monitor)
When a PWRSAV instruction is executed
(i.e., Sleep or Idle mode is entered)
When the device exits Sleep or Idle mode to
resume normal operation
•By a CLRWDT instruction during normal execution
21.4.2 SLEEP AND IDLE MODES
If the WDT is enabled, it will continue to run during
Sleep or Idle modes. W hen the WDT time-out occurs,
the device will wake the device and code execution will
continue from where the PWRSAV instruction was
executed. The corresponding SLEEP bit (RCON<3>)
or IDLE bit (RCON<2>) will need to be cleared in
software after the device wakes up.
21.4.3 ENABLING WDT
The WDT is enabled or disabled by the FWDTEN
Configuration bit in the FWDT Configuration register.
When the FWDTEN Configuration bit is set, the WDT is
always enabled.
The WDT can be optionally controlled in software when
the FWDTEN Configuration bit has been programmed
to ‘0’. The WDT is enabled in software by setting the
SWDTEN control bit (RCON<5>). The SWDTEN
control bit is cleared on any device Reset. The software
WDT option allows the user application to enable the
WDT for critical code segments and disable the WDT
during non-critical segments for maximum power
savings.
The WDT flag bit, WDTO (RCON<4>), is not automatically
cleared following a WDT time-out. To detect subsequent
WDT events, the flag must be cleared in software.
FIGURE 21-2: WDT BLOCK DIAGRAM
Note: The CLRWDT and PWRSAV instructions
clear the prescaler and postscaler counts
when executed.
Note: If the WINDIS bit (FWDT<6>) is cleared,
the CLRWDT instruction should be executed
by the application software only during the
last 1/4 of the WDT period. This CLRWDT
window can be determined by using a timer .
If a CLRWDT instruction is executed before
this window, a WDT Reset occurs.
All Device Resets
T r ansition to New Clock Source
Exit Sleep or Idle Mode
PWRSAV Instruction
CLRWDT Instruction
0
1
WDTPRE WDTPOST<3:0>
Watchdog Timer
Prescaler
(Divide by N1) Postscaler
(Divide by N2)
Sleep/Idle
WDT
WDT Window Select
WINDIS
WDT
CLRWDT Instruction
SWDTEN
FWDTEN
LPRC Clock
RS RS
Wake-up
Reset
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 270 © 2008-2012 Microchip Technology Inc.
21.5 JTAG Interface
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices implement a JTAG
interface, which supports boundary scan device test-
ing, as well as in-circuit programming. Detailed infor-
mation on this interface will be provided in future
revisions of the document.
21.6 In-Circuit Serial Programming
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 family of digital signal
controllers can be serially programmed while in the end
application circuit. This is done with two lines for clock
and data and three other lines for power, ground and
the programming sequence. Serial programming
allows customers to manufacture boards with
unprogrammed devices and then program the digital
signal controller just before shipping the product. Serial
programming also allows the most recent firmware or a
custom firmware to be programmed. Refer to the
“dsPIC33F/PIC24H Flash Programming Specification”
(DS70152) for details about In-Circuit Serial
Programming (ICSP).
Any of the three pairs of programming clock/data pins
can be used:
PGEC1 and PGED1
PGEC2 and PGED2
PGEC3 and PGED3
21.7 In-Circuit Debugger
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices provide simple
debugging functionality through the PGECx (Emula-
tion/Debug Clock) and PGEDx (Emulation/Debug
Data) pin functions.
Any of the three pairs of debugging clock/data pins can
be used:
PGEC1 and PGED1
PGEC2 and PGED2
PGEC3 and PGED3
To use the in-circuit debugger function of the device,
the design must implement ICSP connections to
MCLR, VDD, VSS, and the PGECx/PGEDx pin pair. In
addition, when the feature is enabled, some of the
resources are not available for general use. These
resources include the first 80 bytes of data RAM and
two I/O pins.
© 2008-2012 Microchip Technology Inc. DS70318F-page 271
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
21.8 Code Protection and
CodeGuard™ Security
The dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices offer the intermediate
implementation of CodeGuard™ Security. CodeGuard
Security enables multiple parties to securely share
resources (memory, interrupts and peripherals) on a
single chip. This feature helps protect individual
Intellectual Property (IP) in collaborative system designs.
When coupled with software encryption libraries, Code-
Guard™ Security can be used to securely update Flash
even when multiple IPs reside on a single chip.
TABLE 21-3: CODE FLASH SECURITY
SEGMENT SIZES FOR
6-Kbyte DEVICES
The code protection features are controlled by the
Configuration registers: FBS and FGS.
Secure segment and RAM protection is not implemented
in dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices.
TABLE 21-4: CODE FLASH SECURITY
SEGMENT SIZES FOR
16-Kbyte DEVICES
Configuration Bits
BSS<2:0> = x11
0K
BSS<2:0> = x10
256
BSS<2:0> = x01
768
BSS<2:0> = x00
1792
002BFEh
0001FEh
000200h
000000h
VS = 256 IW
0003FEh
000400h
0007FEh
000800h
GS = 1792 IW 000FFEh
001000h
002BFEh
0001FEh
000200h
000000h
VS = 256 IW
0003FEh
000400h
0007FEh
000800h
000FFEh
001000h
GS = 1536 IW
BS = 256 IW
002BFEh
0001FEh
000200h
000000h
VS = 256 IW
0003FEh
000400h
0007FEh
000800h
000FFEh
001000h
GS = 1024 IW
BS = 768 IW
002BFEh
0001FEh
000200h
000000h
VS = 256 IW
0003FEh
000400h
0007FEh
000800h
000FFEh
001000h
BS = 1792 IW
Note: Refer to Section 23. “CodeGuard™
Security” (DS70199) for further informa-
tion on CodeGuard Security usage, con-
figuration and operation.
Configuration Bits
BSS<2:0> = x11
0K
BSS<2:0> = x10
256
BSS<2:0> = x01
768
BSS<2:0> = x00
1792
002BFEh
0001FEh
000200h
000000h
VS = 256 IW
0003FEh
000400h
0007FEh
000800h
GS = 5376 IW 000FFEh
001000h
002BFEh
0001FEh
000200h
000000h
VS = 256 IW
0003FEh
000400h
0007FEh
000800h
000FFEh
001000h
GS = 5120 IW
BS = 256 IW
002BFEh
0001FEh
000200h
000000h
VS = 256 IW
0003FEh
000400h
0007FEh
000800h
000FFEh
001000h
GS = 4608 IW
BS = 768 IW
002BFEh
0001FEh
000200h
000000h
VS = 256 IW
0003FEh
000400h
0007FEh
000800h
GS = 3584 IW
000FFEh
001000h
BS = 1792 IW
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 272 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 273
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
22.0 INSTRUCTION SET SUMMARY
The dsPIC33F in struction set is identical to th at of the
dsPIC30F.
Most instructions are a single program memory word
(24 bits). Only three instructions require two program
memory locations.
Each single-word instruction is a 24-bit word, divided
into an 8-bit opcode, which specifies the instruction
type and one or more operands, which further specify
the operation of the instruction.
The instruction set is highly ortho gonal an d is gr ouped
into five basic categories:
Word or byte-oriented operations
Bit-oriented operations
Literal operations
DSP operations
Control operations
Table 22-1 shows the general symbols used in
describing the instructions.
The dsPIC33F instruction set summary in Table 22-2
lists all the instructions, along with the status flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
The first source ope rand, which is typically a
register ‘Wb’ without any address modifier
The second sou rce operand, which is typically a
register ‘Ws’ with or without an address modifier
The destination of the result, which is typically a
register ‘Wd’ with or without an address modifier
However , word or byte-oriented file register instructions
have two operands:
The file register specified by the value, ‘f
The destination, which coul d be either the file
register, ‘f’, or the W0 register, which is denoted
as ‘WREG’
Most bit-oriented instructions (including simple
rotate/shift instructions) have two operands:
The W register (with or without an address
modifier) or file register (specified by the value of
‘Ws’ or ‘f’)
The bit in the W register or file register
(specified by a literal value or indirectly by the
contents of register ‘Wb’)
The literal instructions that involve data movement can
use some of the following operands:
A literal value to be loaded into a W register or file
register (specified by ‘k’)
The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
The first source operand, which is a register ‘Wb’
without any address modifier
The second source operand, which is a literal
value
The destination of the result (only if not the same
as the first source operand), which is typically a
register ‘Wd’ with or without an address mo difier
The MAC class of DSP instructions can use some of the
following operands:
The accumulator (A or B) to be used (required
operand)
The W registers to be used as the two operands
The X and Y address space prefetch operations
The X and Y address space prefetch destinations
The accumulator write-back destination
The other DSP instructions do not involve any
multiplication and can include:
The accumulator to be used (required)
The source or destination operand (designated as
Wso or Wdo, respectively) with or without an
address modifier
The amount of shift specified by a W register,
‘Wn’, or a literal value
The control instructions can use some of the following
operands:
A program memory address
The mode of the table read and table write
instructions
Note: This data sheet summarizes the features
of the dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04 devices. It is
not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
latest sections in the “dsPIC33F/PIC24H
Family Reference Manual”, which are
available on the Microchip web site
(www.microchip.com).
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 274 © 2008-2012 Microchip Technology Inc.
Most instructions are a single word. Certain
double-word instructions are designed to provide all the
required information in these 48 bits. In the second
word, the 8 MSbs are ‘0’s. If this second word is
executed as an instruction (by itself), it will exe cute as
a NOP.
The double-word instructions execute in two instruction
cycles.
Most single-word instructions are executed in a single
instruction cycle, unless a conditional test is true, or the
program counter is changed as a result of the
instruction. In these cases, the execution takes two
instruction cycles with the additional instruction cycle(s)
executed as a NOP. Notable exceptions are the BRA
(unconditional/computed branch), indirect CALL/GOTO,
all table reads and writes and RETURN/RETFIE
instructions, which are single-word instructions but take
two or three cycles. Certain instructions that involve
skipping over the subsequent instruction require either
two or three cycles if the skip is performed, depending
on whether the instruction being skipped is a single-word
or two-word instruction. Moreover, double-word moves
require two cycles.
Note: For more details on the instruction set,
refer to the “16-bit MCU and DSC
Programmer’s Reference Manual”
(DS70157).
TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS
Field Description
#text Means literal defined by text
(text) Means “content of text
[text] Means “the location addressed by text
{ } Optional field or operation
<n:m> Register bit field
.b Byte mode selection
.d Double-Word mode selection
.S Shadow register select
.w Word mode selection (default)
Acc One of two accumulators {A, B}
AWB Accumulator Write-Back Destination Address register {W13, [W13]+ = 2}
bit4 4-bit bit selection field (used in word-addressed instructions) {0...15}
C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero
Expr Absolute address, label or expression (resolved by the linker)
f File register address {0x0000...0x1FFF}
lit1 1-bit unsigned literal {0,1}
lit4 4-bit unsigned literal {0...15}
lit5 5-bit unsigned literal {0...31}
lit8 8-bit unsigned literal {0...255}
lit10 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode
lit14 14-bit unsigned literal {0...16384}
lit16 16-bit unsigned literal {0...65535}
lit23 23-bit unsigned literal {0...8388608}; LSb must be ‘0
None Field does not require an entry, can be blank
OA, OB, SA, SB DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate
PC Program Counter
Slit10 10-bit signed literal {-512...511}
Slit16 16-bit signed literal {-32768...32767}
Slit6 6-bit signed literal {-16...16}
Wb Base W register {W0..W15}
Wd Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo Destination W register
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm,Wn Dividend, Divisor Working register pair (Direct Addressing)
© 2008-2012 Microchip Technology Inc. DS70318F-page 275
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Wm*Wm Multiplicand and Multiplier Working register pair for Square instructions
{W4 * W4,W5 * W5,W6 * W6,W7 * W7}
Wm*Wn Multiplicand and Multiplier Working register pair for DSP instructions
{W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7}
Wn One of 16 Working registers {W0..W15}
Wnd One of 16 Destination Working registers {W0...W15}
Wns One of 16 Source Working registers {W0...W15}
WREG W0 (Working register used in file register instructions)
Ws Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso Source W register
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
Wx X Data Space Prefetch Address register for DSP instructions
{[W8] + = 6, [W8] + = 4, [W8] + = 2, [W8], [W8] - = 6, [W8] - = 4, [W8] - = 2,
[W9] + = 6, [W9] + = 4, [W9] + = 2, [W9], [W9] - = 6, [W9] - = 4, [W9] - = 2,
[W9 + W12], none}
Wxd X Data Space Prefetch Destination register for DSP instructions {W4...W7}
Wy Y Data Space Prefetch Address register for DSP instructions
{[W10] + = 6, [W10] + = 4, [W10] + = 2, [W10], [W10] - = 6, [W10] - = 4, [W10] - = 2,
[W11] + = 6, [W11] + = 4, [W11] + = 2, [W11], [W11] - = 6, [W11] - = 4, [W11] - = 2,
[W11 + W12], none}
Wyd Y Data Space Prefetch Destination register for DSP instructions {W4...W7}
TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field Description
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 276 © 2008-2012 Microchip Technology Inc.
TABLE 22-2: INSTRUCTION SET OVERVIEW
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # o f
Words # of
Cycles Status Flags
Affected
1ADD ADD Acc Add Accumulators 1 1 OA,OB,SA,SB
ADD f f = f + WREG 1 1 C,DC ,N,O V,Z
ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z
ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z
ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z
ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z
ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB
2ADDC ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z
3AND AND f f = f .AND. WREG 1 1 N,Z
AND f,WREG WREG = f .AND. WREG 1 1 N,Z
AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z
AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z
AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z
4ASR ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z
ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z
ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z
5BCLR BCLR f,#bit4 Bit Clear f 1 1 None
BCLR Ws,#bit4 Bit Clear Ws 1 1 None
6BRA BRA C,Expr Branch if Carry 1 1 (2) None
BRA GE,Expr Branch if Greater Than or Equal 1 1 (2) None
BRA GEU,Expr Branch if Unsigned Greater Than or Equal 1 1 (2) None
BRA GT,Expr Branch if Greater Than 1 1 (2) None
BRA GTU,Expr Branch if Unsigned Greater Than 1 1 (2) None
BRA LE,Expr Branch if Le ss Than or Equal 1 1 (2) None
BRA LEU,Expr Branch if Unsigned Less Than or Equal 1 1 (2) None
BRA LT,Expr Branch if Le ss Than 1 1 (2) None
BRA LTU,Expr Branch if Unsigned Less Than 1 1 (2) None
BRA N,Expr Branch if Negative 1 1 (2) None
BRA NC,Expr Branch if Not Carry 1 1 (2) None
BRA NN,Expr Branch if Not Negative 1 1 (2) None
BRA NOV,Expr Branch if Not Overflow 1 1 (2) None
BRA NZ,Expr Branch if Not Zero 1 1 (2) None
BRA OA,Expr Branch if Accumula tor A Overflow 1 1 (2) None
BRA OB,Expr Branch if Accumula tor B Overflow 1 1 (2) None
BRA OV,Expr Branch if Overflow 1 1 (2) None
BRA SA,Expr Branch if Accumula tor A Saturated 1 1 (2) None
BRA SB,Expr Branch if Accumula tor B Saturated 1 1 (2) None
BRA Expr Branch Unconditionally 1 2 None
BRA Z,Expr Branch if Zero 1 1 (2) None
BRA Wn Computed Branch 1 2 None
7BSET BSET f,#bit4 Bit Set f 1 1 None
BSET Ws,#bit4 Bit Set Ws 1 1 None
8BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None
BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None
9BTG BTG f,#bit4 Bit Toggle f 1 1 None
BTG Ws,#bit4 Bit Toggle Ws 1 1 None
© 2008-2012 Microchip Technology Inc. DS70318F-page 277
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1
(2 or 3) None
BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1
(2 or 3) None
11 BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1
(2 or 3) None
BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1
(2 or 3) None
12 BTST BTST f,#bit4 Bit Test f 1 1 Z
BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C
BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z
BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C
BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z
13 BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z
BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C
BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z
14 CALL CALL lit23 Call Subroutine 2 2 None
CALL Wn Call Indirect Subroutine 1 2 None
15 CLR CLR f f = 0x0000 1 1 None
CLR WREG WREG = 0x0000 1 1 None
CLR Ws Ws = 0x0000 1 1 None
CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB
16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep
17 COM COM f f = f 11 N,Z
COM f,WREG WREG = f 11 N,Z
COM Ws,Wd Wd = Ws 11 N,Z
18 CP CP f Compare f with WREG 1 1 C,DC,N,OV,Z
CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC ,N,OV,Z
CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C,DC,N,OV,Z
19 CP0 CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z
CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z
20 CPB CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,Ws Compare Wb with Ws, with Borrow
(Wb – Ws – C)1 1 C,DC,N,OV,Z
21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, Skip if = 1 1
(2 or 3) None
22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, Skip if > 1 1
(2 or 3) None
23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, Skip if < 1 1
(2 or 3) None
24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, Skip if 11
(2 or 3) None
25 DAW DAW Wn Wn = Decimal Adjust Wn 1 1 C
26 DEC DEC f f = f – 1 1 1 C,DC,N,OV,Z
DEC f,WREG WREG = f – 1 1 1 C,DC ,N,O V,Z
DEC Ws,Wd Wd = Ws – 1 1 1 C,DC,N,OV,Z
27 DEC2 DEC2 f f = f – 2 1 1 C,DC,N,OV,Z
DEC2 f,WREG WREG = f – 2 1 1 C,DC ,N,O V,Z
DEC2 Ws,Wd Wd = Ws – 2 1 1 C,DC,N,OV,Z
28 DISI DISI #lit14 Disable Interrupts for k Instruction Cycles 1 1 None
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # o f
Words # of
Cycles Status Flags
Affected
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 278 © 2008-2012 Microchip Technology Inc.
29 DIV DIV.S Wm,Wn Signed 16/16-bit Int eger Divide 1 18 N,Z,C,OV
DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV
DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV
DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV
30 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C,OV
31 DO DO #lit14,Expr Do code to PC + Expr, lit14 + 1 times 2 2 None
DO Wn,Expr Do code to PC + Expr, (Wn) + 1 times 2 2 None
32 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB,
SA,SB,SAB
33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB,
SA,SB,SAB
34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None
35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C
36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C
37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C
38 GOTO GOTO Expr Go to Address 2 2 None
GOTO Wn Go to Indirect 1 2 None
39 INC INC f f = f + 1 1 1 C,DC,N,OV,Z
INC f,WREG WREG = f + 1 1 1 C,DC ,N,O V,Z
INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z
40 INC2 INC2 f f = f + 2 1 1 C,DC,N,OV,Z
INC2 f,WREG WREG = f + 2 1 1 C,DC ,N,O V,Z
INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z
41 IOR IOR f f = f .IOR. WREG 1 1 N,Z
IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z
IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z
IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z
IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z
42 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
43 LNK LNK #lit14 Link Frame Pointer 1 1 None
44 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z
LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z
LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z
LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z
LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z
45 MAC MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
,
AWB
Multiply and Accumulate 1 1 OA,OB,OAB,
SA,SB,SAB
MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB,
SA,SB,SAB
46 MOV MOV f,Wn Move f to Wn 1 1 None
MOV f Move f to f 1 1 N,Z
MOV f,WREG Move f to WREG 1 1 None
MOV #lit16,Wn Move 16-bit Literal to Wn 1 1 None
MOV.b #lit8,Wn Move 8-bit Literal to Wn 1 1 None
MOV Wn,f Move Wn to f 1 1 None
MOV Wso,Wdo Move Ws to Wd 1 1 None
MOV WREG,f Move WREG to f 1 1 None
MOV.D Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None
MOV.D Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None
47 MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB Prefetch and Store Accumulator 1 1 None
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # o f
Words # of
Cycles Status Flags
Affected
© 2008-2012 Microchip Technology Inc. DS70318F-page 279
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
48 MPY MPY
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
MPY
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
49 MPY.N MPY.N
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multi ply Wm by Wn) to Accumulator 1 1 None
50 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
,
AWB
Multiply and Subtract from Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
51 MUL MUL.SS Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * signed(Ws) 1 1 None
MUL.SU Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None
MUL.US Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None
MUL.UU Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned( Wb) *
unsigned(Ws) 1 1 None
MUL.SU Wb,#lit5,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None
MUL.UU Wb,#lit5,Wnd {Wnd + 1, Wnd} = unsi gned(Wb) *
unsigned(lit5) 1 1 None
MUL f W3:W2 = f * WREG 1 1 None
52 NEG NEG Acc Negate Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
NEG f f = f + 1 1 1 C,DC,N,OV,Z
NEG f,WREG WREG = f + 1 1 1 C,DC,N,O V,Z
NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z
53 NOP NOP No Operation 1 1 None
NOPR No Operation 1 1 None
54 POP POP f Pop f from Top-of-Stack (TOS) 1 1 None
POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None
POP.D Wnd Pop from Top-of-Stack (TOS) to
W(nd):W(nd + 1) 1 2 None
POP.S Pop Shadow Registers 1 1 All
55 PUSH PUSH f P us h f to Top-of-Stack (TOS) 1 1 None
PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None
PUSH.D Wns Push W(ns):W(ns + 1) to Top-of-Stack (TOS) 1 2 None
PUSH.S Push Shadow Registers 1 1 None
56 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO,Sleep
57 RCALL RCALL Expr Relative Call 1 2 None
RCALL Wn Computed Call 1 2 None
58 REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None
REPEAT Wn Repeat Next Instruction (Wn) + 1 times 1 1 None
59 RESET RESET Software Device Reset 1 1 None
60 RETFIE RETFIE Return from interrupt 1 3 (2) None
61 RETLW RETLW #lit10,Wn Return with Literal in Wn 1 3 (2) None
62 RETURN RETURN Return from Subroutine 1 3 (2) None
63 RLC RLC f f = Rotate Left through Carry f 1 1 C,N,Z
RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z
RLC Ws,Wd Wd = Rot ate Left through Carry Ws 1 1 C,N,Z
64 RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N,Z
RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z
RLNC Ws,Wd Wd = Rot ate Left (No Carry) Ws 1 1 N,Z
65 RRC RRC f f = Rotate Right through Carry f 1 1 C,N,Z
RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z
RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # o f
Words # of
Cycles Status Flags
Affected
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 280 © 2008-2012 Microchip Technology Inc.
66 RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N,Z
RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z
RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z
67 SAC SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None
SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None
68 SE SE Ws,Wnd Wnd = Sign-Extended Ws 1 1 C,N,Z
69 SETM SETM f f = 0xFFFF 1 1 None
SETM WREG WREG = 0xFFFF 1 1 None
SETM Ws Ws = 0xFFFF 1 1 None
70 SFTAC SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB,
SA,SB,SAB
SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB,
SA,SB,SAB
71 SL SL f f = Left Shift f 1 1 C,N,OV,Z
SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z
SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z
SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z
SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z
72 SUB SUB Acc Subtract Accumulators 1 1 OA,OB,OAB,
SA,SB,SAB
SUB f f = f – WREG 1 1 C,DC,N,OV,Z
SUB f,WREG WREG = f – WREG 1 1 C,DC,N,OV,Z
SUB #lit10,Wn Wn = Wn – lit10 1 1 C,DC,N,OV,Z
SUB Wb,Ws,Wd Wd = Wb – Ws 1 1 C,DC,N,OV,Z
SUB Wb,#lit5,Wd Wd = Wb – lit5 1 1 C,DC,N,OV,Z
73 SUBB SUBB f f = f – WREG – (C) 1 1 C,DC,N,OV,Z
SUBB f,WREG WREG = f – WREG – (C) 1 1 C,DC,N,OV,Z
SUBB #lit10,Wn Wn = Wn – lit10 – (C) 1 1 C,DC,N,OV,Z
SUBB Wb,Ws,Wd Wd = Wb – Ws – (C) 1 1 C,DC,N,OV,Z
SUBB Wb,#lit5,Wd Wd = Wb – lit5 – (C) 1 1 C,DC,N,OV,Z
74 SUBR SUBR f f = WREG – f 1 1 C,DC,N,OV,Z
SUBR f,WREG WREG = WREG – f 1 1 C,DC,N,OV,Z
SUBR Wb,Ws,Wd Wd = Ws – Wb 1 1 C,DC,N,OV,Z
SUBR Wb,#lit5,Wd Wd = lit5 – Wb 1 1 C,DC,N,OV,Z
75 SUBBR SUBBR f f = WREG – f – (C) 1 1 C,DC,N,OV,Z
SUBBR f,WREG WREG = WREG – f – (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,Ws,Wd Wd = Ws – Wb – (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,#lit5,Wd Wd = lit5 – Wb – (C) 1 1 C,DC,N,OV,Z
76 SWAP SWAP.b Wn Wn = Nibble Swap Wn 1 1 None
SWAP Wn Wn = Byte Swap Wn 1 1 None
77 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None
78 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None
79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None
80 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None
81 ULNK ULNK Unlink Frame Pointer 1 1 None
82 XOR XOR f f = f .XOR. WREG 1 1 N,Z
XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z
XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z
XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z
XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z
83 ZE ZE Ws,Wnd Wnd = Zero-Extend Ws 1 1 C,Z,N
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # o f
Words # of
Cycles Status Flags
Affected
© 2008-2012 Microchip Technology Inc. DS70318F-page 281
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
23.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers and dsPIC® digital signal
controllers are supported with a full range of software
and hardware development tools:
Integrated Development Environment
- MPLAB® IDE Software
Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- HI-TECH C® for Various Device Families
- MPASMTM Assembler
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
Simulators
- MPLAB SIM Software Simulator
Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
In-Circuit Debu ggers
- MPLAB ICD 3
- PICkit™ 3 Debug Express
Device Programmers
- PICkit™ 2 Programmer
- MPLAB PM3 Device Programmer
Low-Cost Demonstration/Development Boards,
Evaluation Kits, and Starter Kits
23.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- In-Circuit Emulator (sold separately)
- In-Circuit Debugger (sold separately)
A full-featured editor with color-coded context
A multiple project manager
Customizable data windows with direct edit of
contents
High-level source code debugging
Mouse over variable inspection
Drag and drop variables from source to watch
windows
Extensive on-line help
Integration of select third party tools, such as
IAR C Compilers
The MPLAB IDE allows you to:
Edit your source files (either C or assembly)
One-touch compile or assemble, and download to
emulator and simulator tools (automatically
updates all project information)
Debug usin g:
- Source files (C or assembly)
- Mixed C and assembly
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 282 © 2008-2012 Microchip Technology Inc.
23.2 MPLAB C Compilers for Various
Device Families
The MPLAB C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC18,
PIC24 and PIC32 families of microcontrollers and the
dsPIC30 and dsPIC33 families of digital signal control-
lers. These compilers provide powerful integration
capabilities, superior code optimization and ease of
use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
23.3 HI-TECH C for Various Device
Families
The HI-TECH C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC
family of microcontrollers and the dsPIC family of digital
signal controllers. These compilers provide powerful
integration capabilities, omniscient code generation
and ease of us e.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
The compilers include a macro assembler, linker, pre-
processor , and one-step driver , and can run on multiple
platforms.
23.4 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker , Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST fi les that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
Integration into MPLAB IDE projects
User-defined macros to streamline
assembly code
Conditional assembly for multi - purpose
source files
Directives that allow complete control over the
assembly process
23.5 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler . It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of libra ry files of preco mpiled cod e. Wh en
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features inclu de:
Efficient linking of single libraries instead of many
smaller files
Enhanced code maintainability by grouping
related modules together
Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
23.6 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file . Notable features
of the assembler include:
Support for the entire device instruction set
Support for fixe d-point and floating-point data
Command line interface
Rich directive set
Flexibl e macro language
MPLAB IDE compatibility
© 2008-2012 Microchip Technology Inc. DS70318F-page 283
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
23.7 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and d sPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified a nd stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
development tool.
23.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The emulator is connected to the design engineer ’s PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with in-
circuit debugger systems (RJ11) or with the new high-
speed, noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers
significant advantages over competitive emulators
including low-cost, full-speed emulation, run-time
variable watches, trace analysis, complex breakpoint s, a
ruggedized probe interface and long (up to three meters)
interconnection cables.
23.9 MPLAB ICD 3 In-Circuit Debugger
System
MPLAB ICD 3 In-Circuit Debugger System is Micro-
chip's most cost effective high-speed hardware
debugger/programmer for Microchi p Flash Digital Sig-
nal Controller (DSC) and microcontroller (MCU)
devices. It debugs and programs PIC® Flash microcon-
trollers and dsPIC® DSCs with the powerful, yet easy-
to-use graphical user interface of MPLAB Integrated
Development Environment (IDE).
The MPLAB ICD 3 In-Circuit Debugger probe is con-
nected to the design engineer's PC using a high-speed
USB 2.0 interface and is connected to the target with a
connector compatible with the MPLAB ICD 2 or MPLAB
REAL ICE systems (RJ-11). MPLAB ICD 3 supports all
MPLAB ICD 2 headers.
23.10 PICkit 3 In-Circuit Debugger/
Programmer and
PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and program-
ming of PIC® and dsPIC® Flash microcontrollers at a
most affordable price point using the powerful graphical
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer's PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to imple-
ment in-circuit debugging and In-Circuit Serial Pro-
gramming™.
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller , hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 284 © 2008-2012 Microchip Technology Inc.
23.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
The PICkit™ 2 Development Programmer/Debugger is
a low-cost development tool with an easy to use inter-
face for programming and debugging Microchip’s Flash
families of microcontrollers. The full featured
Windows® programming interface supports baseline
(PIC10F, PIC12F5xx, PIC16F5xx), midrange
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,
dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit
microcontrollers, and many Microchip Serial EEPROM
products. With Microchip’s powerful MPLAB Integrated
Development Environment (IDE) the PICkit™ 2
enables in-circuit debugging on most PIC® microcon-
trollers. In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the ap plication. When halted at a break-
point, the file registers can be examined and modified.
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
23.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modu-
lar, detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an MMC card for file
storage and data applications.
23.13 Demonstration/Development
Boards, Evaluation Kits, and
Star ter Ki ts
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displa ys, potentiometers and additiona l
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and d sPICDEM™ demon-
stration/develop ment board series of circuit s, Microchip
has a line o f evaluation kit s and demons tration softwa re
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
© 2008-2012 Microchip Technology Inc. DS70318F-page 285
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
24.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 electrical characteristics.
Additional information will be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 family are listed below.
Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of
the device at these or any other conditions above the parameters indicated in the operation listings of this specification
is not implied.
Absolute Maximum Ratings(1)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any pin that is not 5V tolerant, with respect to VSS(3) ...................................................-0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS, when VDD 3.0V(3) ................................................. -0.3V to +5.6V
Voltage on any 5V tolerant pin with respect to Vss, when VDD < 3.0V(3)........................................-0.3V to (VDD + 0.3V)
Maximum current out of VSS pin.......... ................. ........................................................................ ........................300 mA
Maximum current into VDD pin(2)...........................................................................................................................250 mA
Maximum current sourced/sunk by any 4x I/O pin....................................................................................... ...........15 mA
Maximum current sourced/sunk by any 8x I/O pin....................................................................................... ...........25 mA
Maximum current sourced/sunk by any 16x I/O pin................................................................................................45 mA
Maximum current sunk by all ports ....................... ........................................................................... ... ................. .200 mA
Maximum current sourced by all ports(2)...............................................................................................................200 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings o f this specification i s not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2: Maximum allowable current is a function of devi c e maximum power dissipation (see Table 24-2).
3: See the Pin Diagrams section for 5V tolerant pins.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 286 © 2008-2012 Microchip Technology Inc.
24.1 DC Characteristics
TABLE 24-1: OPERATING MIPS VS. VOLTAGE
Characteristic VDD Range
(in Volts) Temp Range
(in °C)
Max MIPS
dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04
3.0-3.6V(1) -40°C to +85°C 40
3.0-3.6V(1) -40°C to +125°C 40
Note 1: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested but not characterized. All device
analog modules such as the ADC, etc., will function but with deg raded performance below VDDMIN. Refer
to BO10 in Table 24-11 for BOR values.
TABLE 24-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
Industrial Temperature Devices
Operating Junction Temperature Range TJ-40 +125 °C
Operating Ambient Temperature Range TA-40 +85 °C
Extended Temperature Devices
Operating Junction Temperature Range TJ-40 +140 °C
Operating Ambient Temperature Range TA-40 +125 °C
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDDΣ IOH) PDPINT + PI/OW
I/O Pin Power Dissipation:
I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/θJA W
TABLE 24-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 44-Pin QFN θJA 28 °C/W 1
Package Thermal Resistance, 44-Pin TFQP θJA 39 °C/W 1
Package Thermal Resistance, 28-Pin SPDIP θJA 42 °C/W 1
Package Thermal Resistance, 28-Pin SOIC θJA 47 °C/W 1
Package Thermal Resistance, 28 -Pi n QFN -S θJA 34 °C/W 1
Package Thermal Resistance, 18-Pin SOIC θJA 57 °C/W 1
Package Thermal Resistance, 44-Pin VTLA θJA 25 °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.
© 2008-2012 Microchip Technology Inc. DS70318F-page 287
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-4: DC TEMPERATURE AND VO LTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
Operating Voltage
DC10 VDD Supply Voltage(4) 3.0 3.6 V Industrial and Extended
DC12 VDR RAM Data Retention Voltage(2) 1.8 V
DC16 VPOR VDD Start Voltage
to Ensure Internal
Power-on Reset Signal
——VSS V—
DC17 SVDD VDD Rise Rate(3)
to Ensure Internal
Power-on Reset Signal
0.03 V/ms 0V-3.0V in 0.1 seconds
Note 1: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
2: This is the limit to which VDD may be lowered without losing RAM data.
3: These parameters are characterized bu t not tested in manufacturing.
Note 1: Overall functional device operatio n at VBORMIN < VDD < VDDMIN is tested but not characterized. All device
analog modules such as the ADC, etc., will function but with degraded performance below VDDMIN. Refer
to BO10 in Table 24-11 for BOR values.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 288 © 2008-2012 Microchip Technology Inc.
TABLE 24-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Operating Current (IDD)(2)
DC20d 55 70 mA -40°C
3.3V 10 MIPS
See Note 2
DC20a 55 70 mA +25°C
DC20b 55 70 mA +85°C
DC20c 55 70 mA +125°C
DC21d 68 85 mA -40°C
3.3V 16 MIPS
See Note 2 and Note 3
DC21a 68 85 mA +25°C
DC21b 68 85 mA +85°C
DC21c 68 85 mA +125°C
DC22d 78 95 mA -40°C
3.3V 20 MIPS
See Note 2 and Note 3
DC22a 78 95 mA +25°C
DC22b 78 95 mA +85°C
DC22c 78 95 mA +125°C
DC23d 88 110 mA -40°C
3.3V 30 MIPS
See Note 2 and Note 3
DC23a 88 110 mA +25°C
DC23b 88 110 mA +85°C
DC23c 88 110 mA +125°C
DC24d 98 120 mA -40°C
3.3V 40 MIPS
See Note 2
DC24a 98 120 mA +25°C
DC24b 98 120 mA +85°C
DC24c 98 120 mA +125°C
DC25d 128 160 mA -40°C
3.3V
40 MIPS
See Note 2, except PWM is
operating at maximum speed
(PTCON2 = 0x0000)
DC25a 125 150 mA +25°C
DC25b 121 150 mA +85°C
DC25c 119 150 mA +125°C
DC26d 115 140 mA -40°C
3.3V
40 MIPS
See Note 2, except PWM is
operating at 1/2 speed
(PTCON2 = 0x0001)
DC26a 112 140 mA +25°C
DC26b 110 140 mA +85°C
DC26c 108 140 mA +125°C
Note 1: Data in “Typical” column is at 3.3V, +25°C unl ess otherwise stated.
2: IDD is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code exec ution pattern and temperature, also have an impact
on the current consumption. The test conditions for all IDD measurements are as follows:
Oscillator is configured in EC mode with PLL, OSC1 is driven with external square wave from
rail-to-rail (EC clock overshoot/unde rshoot < 250 mV required)
CLKO is configured as an I/O input pin in the Configuration word
All I/O pins are configured as inp uts and pulled to VSS
•MCLR = VDD, WDT and FSCM are disabled
CPU, SRAM, program memory and data memory are operational
No peripheral modules are operating; however, every peripheral is being clocked (all PMDx bits are
zeroed)
CPU executing while(1) statement
JTAG disabled
3: These parameters are characterized but not tested in manufacturing.
© 2008-2012 Microchip Technology Inc. DS70318F-page 289
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DC27d 111 140 mA -40°C
3.3V
40 MIPS
See Note 2, except PWM is
operating at 1/4 speed
(PTCON2 = 0x0002)
DC27a 108 130 mA +25°C
DC27b 105 130 mA +85°C
DC27c 103 130 mA +125°C
DC28d 102 130 mA -40°C
3.3V
40 MIPS
See Note 2, except PWM is
operating at 1/8 speed
(PTCON2 = 0x0003)
DC28a 100 120 mA +25°C
DC28b 100 120 mA +85°C
DC28c 100 120 mA +125°C
TABLE 24-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CONTINUED)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Operating Current (IDD)(2)
Note 1: Data in “Typical” column is at 3.3V, +25°C unless otherwise stated.
2: IDD is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact
on the current consumption. The test conditions for all IDD measurements are as follows:
Oscillator is configured in EC mode with PLL, OSC1 is driven with external square wave from
rail-to-rail (EC clock overshoot/unde rshoot < 250 mV required)
CLKO is configured as an I/O input pin in the Configuration word
All I/O pins are configured as inputs and pulled to VSS
•MCLR = VDD, WDT and FSCM are disabled
CPU, SRAM, program memory and data memory are operational
No peripheral modules are operating; however, every peripheral is being clocked (all PMDx bits are
zeroed)
CPU executing while(1) statement
JTAG disabled
3: These parameters are characterized but not tested in manufacturing.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 290 © 2008-2012 Microchip Technology Inc.
TABLE 24-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
DC CHARACTERISTICS
Standard Operating Co nd itions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Idle Current (IIDLE): Core Off Clock On Base Current(2)
DC40d 45 100 mA -40°C
3.3V 10 MIPS
DC40a 45 100 mA +25°C
DC40b 45 100 mA +85°C
DC40c 45 100 mA +125°C
DC41d 47 100 mA -40°C
3.3V 16 MIPS(3)
DC41a 47 mA +25°C100
DC41b 47 100 mA +85°C
DC41c 47 100 mA +125°C
DC42d 50 100 mA -40°C
3.3V 20 MIPS(3)
DC42a 50 100 mA +25°C
DC42b 50 100 mA +85°C
DC42c 50 100 mA +125°C
DC43d 55 105 mA -40°C
3.3V 30 MIPS(3)
DC43a 55 105 mA +25°C
DC43b 55 105 mA +85°C
DC43c 55 105 mA +125°C
DC44d 60 105 mA -40°C
3.3V 40 MIPS
DC44a 60 105 mA +25°C
DC44b 60 105 mA +85°C
DC44c 60 105 mA +125°C
Note 1: Data in “Typical” column is at 3.3V, +25°C unl ess otherwise stated.
2: Base Idle current (IIDLE) is measured as follows:
CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
CLKO is configured as an I/O input pin in the Configuration word
All I/O pins are configured as inputs and pulled to VSS
•MCLR = VDD, WDT and FSCM are disabled
No peripheral modules are operating; however, every peripheral is being clocked (all PMDx bits are
zeroed)
JTAG disabled
3: These parameters are characterized but not tested in manufacturing.
© 2008-2012 Microchip Technology Inc. DS70318F-page 291
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Power-Down Current (IPD)(2,4)
DC60d 125 500 μA -40°C
3.3V Base Power-Down Current
DC60a 135 500 μA +25°C
DC60b 235 500 μA +85°C
DC60c 565 950 μA +125°C
DC61d 40 50 μA -40°C
3.3V Watchdog Timer Current: ΔIWDT(3)
DC61a 40 50 μA +25°C
DC61b 40 50 μA +85°C
DC61c 80 90 μA +125°C
Note 1: Data in the Typical column is at 3.3V, +25°C unless otherwise stated.
2: IPD (Sleep) current is measured as follows:
CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
CLKO is configured as an I/O input pin in the Configuration word
All I/O pins are configured as inputs and pulled to VSS
•MCLR = VDD, WDT and FSCM are disabled
All peripheral modules are disabled (PMDx bits are all ones)
The VREGS bit (RCON<8>) = 0 (i.e., core regulator is set to stand-by while the device is in Sleep
mode)
JTAG disabled
3: The Δ current is the additional current consumed when the WDT module is enabled. This curre nt should
be added to the base IPD current.
4: These currents are measured on the device containing the most memory in this family.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 292 © 2008-2012 Microchip Technology Inc.
TABLE 24-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless other wise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter No. Typical(1) Max Doze
Ratio Units Conditions
DC73a 75 105 1:2 mA -40°C 3.3V 40 MIPSDC73f 60 105 1:64 mA
DC73g 60 105 1:128 mA
DC70a 75 105 1:2 mA +25°C 3.3V 40 MIPSDC70f 60 105 1:64 mA
DC70g 60 105 1:128 mA
DC71a 75 105 1:2 mA +85°C 3.3V 40 MIPSDC71f 60 105 1:64 mA
DC71g 60 105 1:128 mA
DC72a 75 105 1:2 mA +125°C 3.3V 40 MIPSDC72f 60 105 1:64 mA
DC72g 60 105 1:128 mA
Note 1: Data in the Typical column is at 3.3V, +25°C unless otherwise stated.
2: IDOZE is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code exec ution pattern and temperature, also have an impact
on the current consumption. The test conditions for all IDOZE measurements are as follows:
Oscillator is configured in EC mode and external clock active, OSC1 is driven with external square
wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
CLKO is configured as an I/O input pin in the Configuration word
All I/O pins are configured as inputs and pulled to VSS
•MCLR = VDD, WDT and FSCM are disabled
CPU, SRAM, program memory and data memory are operational
No peripheral modules are operating; however, every peripheral is being clocked (all PMDx bits are
zeroed)
CPU executing while(1) statement
JTAG disabled
© 2008-2012 Microchip Technology Inc. DS70318F-page 293
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for
Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
VIL Input Low Voltage
DI10 I/O Pins VSS —0.2VDD V—
DI15 MCLR VSS —0.2VDD V
DI16 I/O Pins with OSC1 VSS —0.2VDD V—
DI18 I/O Pins with SDAx, SCLx VSS 0.3 VDD V SMbus disabled
DI19 I/O Pins with SDAx, SCLx VSS 0.8 V SMbus enabled
VIH Input High Voltage
DI20
DI21 I/O Pins Not 5V Tolerant(4)
I/O Pins 5V Tolerant(4) 0.7 VDD
0.7 VDD
VDD
5.5 V
V
DI28
DI29 SDA1, SCL1
SDA1, SCL1 0.7 VDD
2.1
5.5
5.5 V
VSMbus disabled
SMbus enabled
ICNPU CNx Pull-up Current
DI30 250 μAVDD = 3.3V, VPIN = VSS
IIL Input Leakage Current(2,3,4)
DI50 I/O Pins with:
4x Driver Pins - RA0-RA2, RB0-
RB2, RB5-RB10, RB15, RC1, RC2,
RC9, RC10
8x Driver Pins - RC0, RC3-RC8,
RC11-RC13
16x Driver Pins - RA3, RA4, RB3,
RB4, RB11-RB14
±2
±4
±8
μA
μA
μA
VSS VPIN VDD,
Pin at high-impedance
VSS VPIN VDD,
Pin at high-impedance
VSS VPIN VDD,
Pin at high-impedance
DI55 MCLR ——±2μAVSS VPIN VDD
DI56 OSC1 ±2 μAVSS VPIN VDD,
XT and HS modes
Note 1: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
2: The leakage current on the MCLR pin is strongly dependent on the app lied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
4: See Pin Diagrams for the list of 5V tolerant I/O pins.
5: VIL source < (VSS – 0.3). Characterized but not tested.
6: Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not
tested.
7: Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.
8: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.
9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted pro-
vided the mathematical “absolute instantaneous” sum of the input inj ection currents from all pins do not
exceed the specified limit. Characterized but not tested.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 294 © 2008-2012 Microchip Technology Inc.
IICL Input Low Injection Current
DI60a 0 -5(5,8) mA All pins except VDD, VSS,
AVDD, AVSS, MCLR,
VCAP, and RB5
IICH Input High Injection Current
DI60b 0 +5(6,7,8) mA All pins except VDD, VSS,
AVDD, AVSS, MCLR,
VCAP, RB5, and digital
5V-tolerant designated
pins
IICT Total Input Injection Current
DI60c (sum of all I/O and control pins) -20(9) —+20
(9) mA Absolute inst antaneous
sum of all ± input
injection current s fro m
all I/O pins
(| I
ICL + | IICH |)
IICT
TABLE 24-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for
Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
Note 1: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
2: The leakage current on the MCLR pin is strongly dependent on th e applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
4: See Pin Diagrams for the list of 5V tolerant I/O pins.
5: VIL source < (VSS – 0.3). Characterized but not tested.
6: Non-5V tol era n t pi n s VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not
tested.
7: Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.
8: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.
9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted pro-
vided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not
exceed the specified limit. Characterized but not tested.
© 2008-2012 Microchip Technology Inc. DS70318F-page 295
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions : 3.0V to 3.6V
(unless otherwise sta ted)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param. Symbol Characteristic Min. Typ. Max. Units Conditions
DO10 VOL
Output Low Voltage
I/O Pins:
4x Sink Driver Pins - RA0-RA2,
RB0-RB2, RB5-RB10, RB15,
RC1, RC2, RC9, RC10
——0.4V IOL 6 mA, VDD = 3.3V
See Note 1
Output Low Voltage
I/O Pins:
8x Sink Driver Pins - RC0, RC3-
RC8, RC11-RC13
——0.4VIOL 10 mA, VDD = 3.3V
See Note 1
Output Low Voltage
I/O Pins:
16x Sink Driver Pins - RA3,
RA4, RB3, RB4, RB11-RB14
——0.4VIOL 18 mA, VDD = 3.3V
See Note 1
DO20 VOH
Output High Volt ag e
I/O Pins:
4x Source Driver Pins - RA0-
RA2, RB0-RB2, RB5-RB10,
RB15, RC1, RC2, RC9, RC10
2.4 V IOH -6 mA, VDD = 3.3V
See Note 1
Output High Volt ag e
I/O Pins:
8x Source Driver Pins - RC0,
RC3-RC8, RC11-RC13
2.4 V IOH -10 mA, VDD = 3.3V
See Note 1
Output High Volt ag e
I/O Pins:
16x Source Driv er Pi ns - RA3 ,
RA4, RB3, RB4, RB11-RB14
2.4 V IOH -18 mA, VDD = 3.3V
See Note 1
DO20A VOH1
Output High Volt ag e
I/O Pins:
4x Source Driver Pins - RA0-
RA2, RB0-RB2, RB5-RB10,
RB15, RC1, RC2, RC9, RC10
1.5
V
IOH -12 mA, VDD = 3.3V
See Note 1
2.0 IOH -11 mA, VDD = 3.3V
See Note 1
3.0 IOH -3 mA, VDD = 3.3V
See Note 1
Output High Volt ag e
8x Source Driver Pins - RC0,
RC3-RC8, RC11-RC13
1.5
V
IOH -16 mA, VDD = 3.3V
See Note 1
2.0 IOH -12 mA, VDD = 3.3V
See Note 1
3.0 IOH -4 mA, VDD = 3.3V
See Note 1
Output High Volt ag e
I/O Pins:
16x Source Driv er Pi ns - RA3 ,
RA4, RB3, RB4, RB11-RB14
1.5
V
IOH -30 mA, VDD = 3.3V
See Note 1
2.0 IOH -25 mA, VDD = 3.3V
See Note 1
3.0 IOH -8 mA, VDD = 3.3V
See Note 1
Note 1: Parameters are characterized, but not tested.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 296 © 2008-2012 Microchip Technology Inc.
TABLE 24-11: ELECTRICAL CHARACTERISTICS: BOR
DC CHARACTERISTICS
Standard Operating Conditions (see Note 3): 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min(1) Typ Max Units Conditions
BO10 VBOR BOR Event on VDD Transition
High-to-Low
BOR Event is Tied to VDD Core
Voltage Decrease
2.55 2.79 V See Note 2
Note 1: Parameters are for design guidance only and are not tested in manufacturing.
2: The device will operate as normal until the VDDMIN threshold is reached.
3: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested but not characterized. All device
analog modules such as the ADC, etc., will function but with degraded performance below VDDMIN.
© 2008-2012 Microchip Technology Inc. DS70318F-page 297
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-13: INTERNAL VOLTAGE REGULATOR S PECIFICATIONS
TABLE 24-12: DC CHARACTERISTICS: PROGRAM MEMORY
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
Program Flash Memory
D130 EPCell Endurance 10,000 E/W -40°C to +125°C
D131 VPR VDD for Read VMIN —3.6VVMIN = Minimum operating
voltage
D132B VPEW VDD for Self-Timed Write VMIN —3.6VVMIN = Minimum operating
voltage
D134 TRETD Characteristic Retention 20 Year Provided no other specifications
are violated, -40°C to +125°C
D135 IDDP Supply Current during
Programming —10mA
D136a TRW Row Write T ime 1.32 1.74 ms TRW = 11064 FRC cycles,
TA = +85°C, See Note 2
D136b TRW Row Write T ime 1.28 1.79 ms TRW = 11064 FRC cycles,
TA = +125°C, See Note 2
D137a TPE Page Erase Time 20.1 26.5 ms TPE = 168517 FRC cycles,
TA = +85°C, See Note 2
D137b TPE Page Erase Time 19.5 27.3 ms TPE = 168517 FRC cycles,
TA = +125°C, See Note 2
D138a TWW Word Write Cycle Time 42.3 55.9 µs TWW = 355 FRC cycles,
TA = +85°C, See Note 2
D138b TWW Word Write Cycle Time 41.1 57.6 µs TWW = 355 FRC cycles,
TA = +125°C, See Note 2
Note 1: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
2: Other conditions: FRC = 7.37 MHz, TUN<5:0> = b'011111 (for Min), TUN<5:0> = b'100000 (for Max).
This parameter depends on the FRC accuracy (see Table 24-20) and the value of the FRC Oscillator Tun-
ing register (see Register 9-4). For complete details on calculating the Minimum an d Maximum time see
Section 5.3 “Programming Operations”.
Operating Co nditions: -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristics Min Typ Max Units Comments
CEFC External Filter Capacitor
Value(1) 4.7 10 μF Capacitor must be low
series resistance
(< 5 ohms)
Note 1: Typical VCAP voltage = 2.5 volts when VDD VDDMIN.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 298 © 2008-2012 Microchip Technology Inc.
24.2 AC Characteristics and Timing Parameters
This section defines dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 AC characteristics and timing parameters.
TABLE 24-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
FIGURE 24-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
TABLE 24-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS
AC CHARACTERISTICS
Standard Operating Condit ions: 3.0V to 3.6V
(unless otherw ise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Exte nded
Operating voltage VDD range as described in Table 24-1.
Param
No. Symbol Characteristic Min Typ Max Units Conditions
DO50 COSCO OSC2 Pin 15 pF In XT and HS modes when external
clock is used to drive OSC1
DO56 CIO All I/O Pins and OSC2 50 pF EC mode
DO58 CBSCLx, SDAx 400 pF In I2C™ mode
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL=464Ω
CL= 50 pF for all pins except OSC2
15 pF for OSC2 output
Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2
© 2008-2012 Microchip Technology Inc. DS70318F-page 299
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 24-2: EXTERNAL CLOCK TIMING
Q1 Q2 Q3 Q4
OSC1
CLKO
Q1 Q2 Q3 Q4
OS20
OS25 OS30 OS30
OS40
OS41
OS31 OS31
TABLE 24-16: EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Co nditions: 3.0V to 3.6 V
(unless otherw ise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symb Characteristic Min Typ(1) Max Units Conditions
OS10 FIN External CLKI Frequency
(External clocks allowed only
in EC and ECPLL modes)
DC 40 MHz EC
Oscillator Crystal Frequency 3.5
10
10
40 MHz
MHz XT
HS
OS20 TOSC TOSC = 1/FOSC 12.5 DC ns
OS25 TCY Instruction Cycle Time(2) 25 DC ns
OS30 TosL,
TosH External Clock in (OSC1)
High or Low Time 0.375 x TOSC 0.6 25 x TOSC ns EC
OS31 TosR,
TosF External Clock in (OSC1)
Rise or Fall Time ——20nsEC
OS40 TckR CLKO Rise Time(3) —5.2ns
OS41 TckF CLKO Fall Time(3) —5.2ns
OS42 GMExternal Oscillator
Transconductance(4) 14 16 18 mA/V VDD = 3.3V
TA = +25º C
Note 1: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
2: Instruction cycle period (TCY) equals two times the input oscillator time-base period . All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exc eeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock inp ut is used, the
“max.” cycle time limit is “DC” (no clock) for all devices.
3: Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin.
4: Data for this parameter is Preliminary. This parameter is characterized, but not tested in manufacturing.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 300 © 2008-2012 Microchip Technology Inc.
TABLE 24-17: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V)
AC CHARACTERISTICS
Standard Operating Conditio ns: 3.0V to 3.6V (unless otherwise
stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
OS50 FPLLI PLL Voltage Controlled
Oscillator (VCO) Input
Frequency Range
0.8 8 MHz ECPLL, XTPLL modes
OS51 FSYS On-Chip VCO System
Frequency 100 200 MHz
OS52 TLOCK PLL Start-up Time (Lock Time) 0.9 1.5 3.1 mS
OS53 DCLK CLKO Stability (Jitter)(2) -3 0.5 3 % Measured over 100 ms
period
Note 1: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated. Parameters are for design guidance only
and are not tested in manufacturing.
2: These parameters are characterized by similarity, but are not tested in manufacturing. This specification is
based on clock cycle by clock cycle measurements. To calculate the effective jitter for individual time bases
or communication clocks use this formula:
TABLE 24-18: AUXILIARY PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V)
AC CHARACTERISTICS
Standard Operating Conditio ns: 3.0V to 3.6V (unless otherwise
stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
OS56 FHPOUT 0n-Chip 16x PLL CCO
Frequency 112 118 120 MHz
OS57 FHPIN On-Chip 16x PLL Phase
Detector Input Frequency 7.0 7.37 7.5 MHz
OS58 TSU Frequency Generator Lock
Time ——10µs
Note 1: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated. Parameters are for design guidance only
and are not tested in manufacturing.
© 2008-2012 Microchip Technology Inc. DS70318F-page 301
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-19: AC CHARACTERISTICS: INTERNAL FRC ACCURACY
AC CHARACTERISTICS St andard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature - 40°C TA +85°C for industrial
-40°C TA +125°C for Extended
Param
No. Characteristic Min Typ Max Units Conditions
Internal FRC Accuracy @ FRC Freq uency = 7.37 MHz(1)
F20a FRC -2 +2 % -40°C TA +85°C VDD = 3.0-3.6V
F20b FRC -5 +5 % -40°C TA +125°C VDD = 3.0-3.6V
Note 1: Frequency calibrated at +25°C and 3.3V. TUN bits can be used to compensate for temperature drift.
TABLE 24-20: AC CHARACTERISTICS: INTERNAL LPRC ACCURACY
AC CHARACTERISTICS St andard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Characteristic Min Typ Max Units Conditions
LPRC @ 32.768 kHz(1)
F21a LPRC -20 ±6 +20 % -40°C TA +85°C VDD = 3.0-3.6V
F21b LPRC -70 +70 % -40°C TA +125°C VDD = 3.0-3.6V
Note 1: Change of LPRC frequency as VDD changes.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 302 © 2008-2012 Microchip Technology Inc.
FIGURE 24-3: I/O TIMING CHARACTERISTICS
Note: Refer to Figure 24-1 for load conditions.
I/O Pin
(Input)
I/O Pin
(Output)
DI35
Old Value New Value
DI40
DO31
DO32
TABLE 24-21: I/O TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
DO31 TIOR Port Output Rise Time:
4x Source Driver Pins - RA0-RA2,
RB0-RB2, RB5-RB10, RB15, RC1,
RC2, RC9, RC10 —1025ns
Refer to Figure 24-1
for test conditions
8x Source Driver Pins - RC0, RC3-
RC8, RC11-RC13 8 20 ns
16x Source Driver Pins - RA3, RA4,
RB3, RB4, RB11-RB14 6 15 ns
DO32 TIOFPort Output Fall Time:
4x Source Driver Pins - RA0-RA2,
RB0-RB2, RB5-RB10, RB15, RC1,
RC2, RC9, RC10 —1025ns
Refer to Figure 24-1
for test conditions
8x Source Driver Pins - RC0, RC3-
RC8, RC11-RC13 8 20 ns
16x Source Driver Pins - RA3, RA4,
RB3, RB4, RB11-RB14 6 15 ns
DI35 TINP INTx Pin High or Low Time (input) 20 ns
DI40 TRBP CNx High or Low Time (input) 2 TCY
Note 1: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
© 2008-2012 Microchip Technology Inc. DS70318F-page 303
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 24-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING CHARACTERISTICS
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
Reset
Watchdog
Timer
Reset
SY11
SY10
SY20
SY13
I/O Pins
SY13
Note: Refer to Figure 24-1 for load conditions.
FSCM
Delay
SY35
SY30
SY12
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 304 © 2008-2012 Microchip Technology Inc.
TABLE 24-22: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SY10 TMCLMCLR Pulse Width (low) 2 μs -40°C to +85°C
SY11 TPWRT Power-up Timer Period 2
4
8
16
32
64
128
ms -40°C to +85°C
User progra mma b le
SY12 TPOR Power-on Reset Delay 3 10 30 μs -4 0°C to + 85°C
SY13 TIOZ I/O High-Impedance from MCLR
Low or Watchdog Timer Reset 0.68 0.72 1.2 μs—
SY20 TWDT1 Wat chdog T i mer T im e-out Period ms See Section 21.4 “Watch-
dog Timer (WDT)” and
LPRC parameter F21a
(Table 24-20).
SY30 TOST Oscillator Start-up Time 1024
TOSC ——TOSC = OSC1 period
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
© 2008-2012 Microchip Technology Inc. DS70318F-page 305
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 24-5: TIMER1, 2 AND 3 EXTERNAL CLOCK TIMING CHARACTERISTICS
Note: Refer to Figure 24-1 for load conditions.
Tx11
Tx15
Tx10
Tx20
TMRx OS60
TxCK
TABLE 24-23: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1)
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
TA10 TTXH TxCK High
Time Synchronous,
no prescaler TCY + 20 ns Must also meet
parameter
TA15
N = prescale
value (1, 8, 64,
256)
Synchronous,
with prescaler (TCY + 20)/N ns
Asynchronous 20 ns
TA11 TTXLTxCK Low
Time Synchronous,
no prescaler TCY + 20 ns Must also meet
parameter
TA15
N = prescale
value (1, 8, 64,
256)
Synchronous,
with prescaler (TCY + 20)/N ns
Asynchronous 20 ns
TA15 TTXP TxCK Input
Period Synchronous,
no prescaler 2 TCY + 40 ns
Synchronous,
with prescaler Greater of:
40 ns or
(2 TCY + 40)/N
N = prescale
value (1, 8, 64,
256)
Asynchronous 40 ns
OS60 FT1 T1CK Oscillator Input Fre-
quency Range (oscillator
enabled by setting bit, TCS
(T1CON<1>))
DC 50 kHz
TA20 TCKEXTMRL Delay from External TxCK
Clock Edge to Timer
Increment
0.75 TCY + 40 1.75 TCY + 40
Note 1: Timer1 is a Type A timer.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 306 © 2008-2012 Microchip Technology Inc.
TABLE 24-24: TIMER2 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
TB10 TTXH TxCK High
Time Synchronous Greater of:
20 ns or
(TCY + 20)/N
ns Must also meet
parameter TB15
N = prescale
value (1, 8, 64,
256)
TB11 TTXLTxCK Low
Time Synchronous Greater of:
20 ns or
(TCY + 20)/N
ns Must also meet
parameter TB15
N = prescale
value (1, 8, 64,
256)
TB15 TTXP TxCK Input
Period Synchronous Greater of:
40 ns or
(2 TCY + 40)/N
ns N = prescale
value (1, 8, 64,
256)
TB20 TCKEXTMRL Delay from External TxCK
Clock Edge to T i mer
Increment
0.75 TCY + 40 1.75 TCY + 40 ns
TABLE 24-25: TIMER3 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless other wise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
TC10 TTXH TxCK High
Time Synchronous TCY + 20 ns Must also meet
parameter TC15
TC11 TTXL TxCK Low
Time Synchronous TCY + 20 ns Must also meet
parameter TC15
TC15 TTXP TxCK Input
Period Synchronous,
with prescaler 2 TCY + 40 ns
TC20 TCKEXTMRL Delay from External TxCK
Clock Edge to Timer
Increment
0.75 TCY + 40 1.75 TCY + 40
© 2008-2012 Microchip Technology Inc. DS70318F-page 307
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 24-6: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS
FIGURE 24-7: OUTPUT COMP ARE MODULE (OCx) TIMING CHARACTERISTICS
TABLE 24-26: INPUT CAPTURE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Co nd itions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Max Units Conditions
IC10 TccL ICx Input Low Time No prescaler 0.5 TCY + 20 ns
With prescaler 10 ns
IC11 TccH ICx Input High Time No prescaler 0.5 TCY + 20 ns
With prescaler 10 ns
IC15 TccP ICx Input Period (TCY + 40)/N ns N = prescale
value (1, 4, 16)
Note 1: These parameters are characterized but not tested in manufacturing.
TABLE 24-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
OC10 TccF OCx Output Fall Time ns See parameter DO32
OC11 TccR OCx Output Rise Time ns See parameter DO31
Note 1: These parameters are characterized but not tested in manufacturing.
ICx
IC10 IC11
IC15
Note: Refer to Figure 24-1 for load conditions.
OCx
OC11 OC10
(Output Compare
Note: Refer to Figure 24-1 for load conditions.
or PWM Mode)
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 308 © 2008-2012 Microchip Technology Inc.
FIGURE 24-8: OC/PWM MODULE TIMING CHARACTERISTICS
OCFA
OCx
OC20
OC15
Active Tri-state
TABLE 24-28: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
OC15 TFD Fault In put to PWM I/O
Change ——TCY + 20 ns
OC20 TFLT Fault Input Pulse Width TCY + 20 ns
Note 1: These parameters are characterized but not tested in manufacturing.
© 2008-2012 Microchip Technology Inc. DS70318F-page 309
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 24-9: HIGH-SPEED PWM MODULE FAULT TIMING CHARACTERISTICS
FIGURE 24-10: HIGH-SPEED PWM MODULE TIMING CHARACTERISTICS
FLTx
PWMx
MP30
MP20
PWMx
MP11 MP10
Note: Refer to Figure 24-1 for load conditions.
TABLE 24-29: HIGH-SPEED PWM MODULE TI MING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operatin g te mperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
MP10 TFPWM PWM Output Fall Time 2.5 ns
MP11 TRPWM PWM Output Rise Time 2.5 ns
MP20 TFD Fault Input to PWM
I/O Change ——15ns
MP30 TFH Minimum PWM Fault Pulse
Width 8 ns DTC<10> = 10
MP31 TPDLY Tap Delay 1.04 ns ACLK = 120 MHz
MP32 ACLK PWM Input Clock 120 MHz See Note 2
Note 1: These parameters are characterized but not tested in manufacturing.
2: This parameter is a maximum allowed input clock for the PWM module.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 310 © 2008-2012 Microchip Technology Inc.
TABLE 24-30: SPIx MAXIMUM DATA/CLOCK RATE SUMMARY
FIGURE 24-11: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 0) TIMING
CHARACTERISTICS
FIGURE 24-12: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 1) TIMING
CHARACTERISTICS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +8 5°C for Industrial
-40°C TA +125°C for Extended
Maximum
Data Rate
Master
Transmit Only
(Half-Duplex)
Master
Transmit/Receive
(Full-Duplex)
Slave
Transmit/Receive
(Full-Duplex) CKE CKP SMP
15 Mhz Table 24-31 ——0,10,10,1
9 Mhz Table 24-32 10,11
9 Mhz Table 24-33 00,11
15 Mhz Table 24-34 100
11 Mhz Table 24-35 110
15 Mhz Table 24-36 010
11 Mhz Table 24-37 000
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SP10
SP21
SP20
SP35
SP20
SP21
MSb LSb
Bit 14 - - - - - -1
SP30, SP31
SP30, SP31
Note: Refer to Figure 24-1 for load conditions.
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SP10
SP21
SP20
SP35
SP20
SP21
MSb LSb
Bit 14 - - - - - -1
SP30, SP31
Note: Refer to Figure 24-1 for load conditions.
SP36
© 2008-2012 Microchip Technology Inc. DS70318F-page 311
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-31: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Con d itions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP10 TscP Maximum SCK Frequency 15 MHz See Note 3
SP20 TscF SCKx Output Fall Time ns See parameter DO32
and Note 4
SP21 TscR SCKx Output Rise Time ns S ee paramete r DO31
and Note 4
SP30 TdoF S DOx Data Outpu t Fall Time ns See parameter DO32
and Note 4
SP31 TdoR SDOx Data Output Rise Time ns See parameter DO31
and Note 4
SP35 TscH2doV,
TscL2doV SDOx Data Output Valid after
SCKx Edge —620ns
SP36 TdiV2scH,
TdiV2scL SDOx Data Output Setup to
First SC Kx Edge 30 ns
Note 1: These parameters are characterized, but are not tested in manufacturing.
2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
3: The minimum clock period for SCKx is 66.7 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPIx pins.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 312 © 2008-2012 Microchip Technology Inc.
FIGURE 24-13: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = X, SMP = 1) TIMING
CHARACTERISTICS
TABLE 24-32: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING
REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Condition s: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP10 TscP Maximum SCK Frequency 9 MHz See Note 3
SP20 TscF SCKx Output Fall Time ns See parameter DO32
and Note 4
SP21 TscR SCKx Output Rise Time ns See parameter DO31
and Note 4
SP30 TdoF SDOx Data Output Fall Time ns See parameter DO32
and Note 4
SP31 TdoR SDOx Data Output Rise Time ns See parameter DO31
and Note 4
SP35 TscH2doV,
TscL2doV SDOx Data Output Valid after
SCKx Edge 6 20 ns
SP36 TdoV2sc,
TdoV2scL SDOx Data Output Setup to
First SCKx Edge 30 ns
SP40 TdiV2scH,
TdiV2scL Setup Time of SDIx Data
Input to SCKx Edge 30 ns
SP41 TscH2diL,
TscL2diL Hold Time of SDIx Data Input
to SCKx Edge 30 ns
Note 1: These parameters are characterized, but are not tested in manufacturing.
2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
3: The minimum clock period for SCKx is 111 ns. T he clock generated in Master mode must not violate this
specification.
4: Assumes 50 pF load on all SPIx pins.
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SP10
SP21
SP20
SP35
SP20
SP21
MSb LSb
Bit 14 - - - - - -1
SP30, SP31
Note: Refer to Figure 24-1 for load conditions.
SP36
SP41
MSb In LSb In
Bit 14 - - - -1
SDIx
SP40
© 2008-2012 Microchip Technology Inc. DS70318F-page 313
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 24-14: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = X, SMP = 1) TIMING
CHARACTERISTICS
TABLE 24-33: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING
REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP10 TscP Maximum SCK Frequency 9 MHz -40ºC to +125ºC and
see Note 3
SP20 TscF SCKx Output Fall Time ns See parameter DO32
and Note 4
SP21 TscR SCKx Output Rise Time ns See parameter DO31
and Note 4
SP30 TdoF SDOx Data Output Fall Time ns See parameter DO32
and Note 4
SP31 TdoR SDOx Data Output Rise Time ns See parameter DO31
and Note 4
SP35 TscH2doV,
TscL2doV SDOx Data Output Valid after
SCKx Edge 6 20 ns
SP36 TdoV2scH,
TdoV2scL SDOx Data Output Setup to
First SCKx Edge 30 ns
SP40 TdiV2scH,
TdiV2scL Setup Time of SDIx Data
Input to SCKx Edge 30 ns
SP41 TscH2diL,
TscL2diL Hold Time of SDIx Data Input
to SCKx Edge 30 ns
Note 1: These parameters are characterized, but are not tested in manufacturing.
2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
3: The minimum clock period for SCKx is 111 ns. T he clock generated in Master mode must not violate this
specification.
4: Assumes 50 pF load on all SPIx pins.
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDIx
SP10
SP40 SP41
SP21
SP20
SP35
SP20
SP21
MSb LSb
Bit 14 - - - - - -1
MSb In LSb In
Bit 14 - - - -1
SP30, SP31
SP30, SP31
Note: Refer to Figure 24-1 for load conditions.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 314 © 2008-2012 Microchip Technology Inc.
FIGURE 24-15: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING
CHARACTERISTICS
SSx
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDI
SP50
SP60
SDIx
SP30,SP31
MSb Bit 14 - - - - - -1 LSb
SP51
MSb In Bit 14 - - - -1 LSb In
SP35
SP52
SP73
SP72
SP72
SP73
SP70
SP40 SP41
Note: Refer to Figure 24-1 for load conditions.
© 2008-2012 Microchip Technology Inc. DS70318F-page 315
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-34: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING
REQUIREMENTS
AC CHARACTERISTICS
Standard Operating C onditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP70 TscP Maximum SCK Input Frequency 15 MHz See Note 3
SP72 TscF SCKx Input Fall Time ns See parameter DO32
and Note 4
SP73 TscR SCKx Input Rise Time ns See parameter DO31
and Note 4
SP30 TdoF SDOx Data Output Fall Time ns See parameter DO32
and Note 4
SP31 TdoR SDOx Data Output Rise T i me ns See parameter DO31
and Note 4
SP35 TscH2doV,
TscL2doV SDOx Dat a Output Valid after
SCKx Edge —620ns
SP36 TdoV2scH,
TdoV2scL SDOx Data Output Setup to
First SCKx Edge 30 ns
SP40 TdiV2scH,
TdiV2scL Setup Time of SDIx Data Input
to SCKx Edge 30 ns
SP41 TscH2diL,
TscL2diL Hold Time of SDIx Data Input
to SCKx Edge 30 ns
SP50 TssL2scH,
TssL2scL SSx to SCKx or SCKx Input 120 ns
SP51 TssH2doZ SSx to SDOx Output
High-Impedance(4) 10 50 ns
SP52 TscH2ssH
TscL2ssH SSx after SCKx Edge 1.5 TCY + 40 ns See Note 4
SP60 TssL2doV SDOx Data Output Valid after
SSx Edge ——50ns
Note 1: These parameters are characterized, but are not tested in manufacturing.
2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
3: The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must
not violate this specification.
4: Assumes 50 pF load on all SPIx pins.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 316 © 2008-2012 Microchip Technology Inc.
FIGURE 24-16: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING
CHARACTERISTICS
SSx
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDI
SP50
SP60
SDIx
SP30,SP31
MSb Bit 14 - - - - - -1 LSb
SP51
MSb In Bit 14 - - - -1 LSb In
SP35
SP52
SP52
SP73
SP72
SP72
SP73
SP70
SP40 SP41
Note: Refer to Figure 24-1 for load conditions.
© 2008-2012 Microchip Technology Inc. DS70318F-page 317
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-35: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING
REQUIREMENTS
AC CHARACTERISTICS
Standard Operating C onditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP70 TscP Maximum SCK Input Frequency 11 MHz See Note 3
SP72 TscF SCKx Input Fall Time ns See parameter DO32
and Note 4
SP73 TscR SCKx Input Rise Time ns See parameter DO31
and Note 4
SP30 TdoF SDOx Data Output Fall Time ns See parameter DO32
and Note 4
SP31 TdoR SDOx Data Output Rise T i me ns See parameter DO31
and Note 4
SP35 TscH2doV,
TscL2doV SDOx Dat a Output Valid after
SCKx Edge —620ns
SP36 TdoV2scH,
TdoV2scL SDOx Data Output Setup to
First SCKx Edge 30 ns
SP40 TdiV2scH,
TdiV2scL Setup Time of SDIx Data Input
to SCKx Edge 30 ns
SP41 TscH2diL,
TscL2diL Hold Time of SDIx Data Input
to SCKx Edge 30 ns
SP50 TssL2scH,
TssL2scL SSx to SCKx or SCKx Input 120 ns
SP51 TssH2doZ SSx to SDOx Output
High-Impedance(4) 10 50 ns
SP52 TscH2ssH
TscL2ssH SSx after SCKx Edge 1.5 TCY + 40 ns See Note 4
SP60 TssL2doV SDOx Data Output Valid after
SSx Edge ——50ns
Note 1: These parameters are characterized, but are not tested in manufacturing.
2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
3: The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not
violate this specification.
4: Assumes 50 pF load on all SPIx pins.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 318 © 2008-2012 Microchip Technology Inc.
FIGURE 24-17: SPIx SLAVE MODE (FULL-DUPLEX CKE = 0, CKP = 1, SMP = 0) TIMING
CHARACTERISTICS
SSX
SCKX
(CKP = 0)
SCKX
(CKP = 1)
SDOX
SP50
SP40 SP41
SP30,SP31 SP51
SP35
MSb LSb
Bit 14 - - - - - -1
MSb In Bit 14 - - - -1 LSb In
SP52
SP73
SP72
SP72
SP73
SP70
Note: Refer to Figure 24-1 f or load conditions.
SDIX
© 2008-2012 Microchip Technology Inc. DS70318F-page 319
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-36: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING
REQUIREMENTS
AC CHARACTERISTICS
Standard Operating C onditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP70 TscP Maximum SCK Input Frequency 15 MHz See Note 3
SP72 TscF SCKx Input Fall Time ns See parameter DO32
and Note 4
SP73 TscR SCKx Input Rise Time ns See parameter DO31
and Note 4
SP30 TdoF SDOx Data Output Fall Time ns See parameter DO32
and Note 4
SP31 TdoR SDOx Data Output Rise T i me ns See parameter DO31
and Note 4
SP35 TscH2doV,
TscL2doV SDOx Dat a Output Valid after
SCKx Edge —620ns
SP36 TdoV2scH,
TdoV2scL SDOx Data Output Setup to
First SCKx Edge 30 ns
SP40 TdiV2scH,
TdiV2scL Setup Time of SDIx Data Input
to SCKx Edge 30 ns
SP41 TscH2diL,
TscL2diL Hold Time of SDIx Data Input
to SCKx Edge 30 ns
SP50 TssL2scH,
TssL2scL SSx to SCKx or SCKx Input 120 ns
SP51 TssH2doZ SSx to SDOx Output
High-Impedance(4) 10 50 ns
SP52 TscH2ssH
TscL2ssH SSx after SCKx Edge 1.5 TCY + 40 ns See Note 4
Note 1: These parameters are characterized, but are not tested in manufacturing.
2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
3: The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must
not violate this specification.
4: Assumes 50 pF load on all SPIx pins.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 320 © 2008-2012 Microchip Technology Inc.
FIGURE 24-18: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING
CHARACTERISTICS
SSX
SCKX
(CKP = 0)
SCKX
(CKP = 1)
SDOX
SP50
SP40 SP41
SP30,SP31 SP51
SP35
MSb LSb
Bit 14 - - - - - -1
MSb In Bit 14 - - - -1 LSb In
SP52
SP73
SP72
SP72
SP73
SP70
Note: Refer to Figure 24-1 for load conditions.
SDIX
© 2008-2012 Microchip Technology Inc. DS70318F-page 321
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-37: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING
REQUIREMENTS
AC CHARACTERISTICS
Standard Operating C onditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP70 TscP Maximum SCK Input Frequency 11 MHz See Note 3
SP72 TscF SCKx Input Fall Time ns See parameter DO32
and Note 4
SP73 TscR SCKx Input Rise Time ns See parameter DO31
and Note 4
SP30 TdoF SDOx Data Output Fall Time ns See parameter DO32
and Note 4
SP31 TdoR SDOx Data Output Rise T i me ns See parameter DO31
and Note 4
SP35 TscH2doV,
TscL2doV SDOx Dat a Output Valid after
SCKx Edge —620ns
SP36 TdoV2scH,
TdoV2scL SDOx Data Output Setup to
First SCKx Edge 30 ns
SP40 TdiV2scH,
TdiV2scL Setup Time of SDIx Data Input
to SCKx Edge 30 ns
SP41 TscH2diL,
TscL2diL Hold Time of SDIx Data Input
to SCKx Edge 30 ns
SP50 TssL2scH,
TssL2scL SSx to SCKx or SCKx Input 120 ns
SP51 TssH2doZ SSx to SDOx Output
High-Impedance(4) 10 50 ns
SP52 TscH2ssH
TscL2ssH SSx after SCKx Edge 1.5 TCY + 40 ns See Note 4
Note 1: These parameters are characterized, but are not tested in manufacturing.
2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
3: The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not
violate this specification.
4: Assumes 50 pF load on all SPIx pins.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 322 © 2008-2012 Microchip Technology Inc.
FIGURE 24-19: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
FIGURE 24-20: I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
IM31 IM34
SCLx
SDAx
Start
Condition Stop
Condition
IM30 IM33
Note: Refer to Figure 24-1 for load conditions.
IM11 IM10 IM33
IM11 IM10
IM20
IM26 IM25
IM40 IM40 IM45
IM21
SCLx
SDAx
In
SDAx
Out
Note: Refer to Figure 24-1 for load conditions.
© 2008-2012 Microchip Technology Inc. DS70318F-page 323
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-38: I2Cx BUS DATA TI MING REQUIREMENTS (MASTER MODE)
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operatin g te mperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min(1) Max Units Conditions
IM10 TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1) μs—
400 kHz mode TCY/2 (BRG + 1) μs—
1 MHz mode(2) TCY/2 (BRG + 1) μs—
IM11 THI:SCL Clock High Time 100 kHz mode T CY/2 (BRG + 1) μs—
400 kHz mode TCY/2 (BRG + 1) μs—
1 MHz mode(2) TCY/2 (BRG + 1) μs—
IM20 TF:SCL SDAx and SCLx
Fall Time 100 kHz mode 300 ns CB is specified to be
from 10 pF to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(2) 100 ns
IM21 TR:SCL SDAx and SCLx
Rise Time 100 kHz mode 1000 ns CB is specified to be
from 10 pF to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(2) 300 ns
IM25 TSU:DAT Data Input
Setup Time 100 kHz mode 250 ns
400 kHz mode 100 ns
1 MHz mode(2) 40 — ns
IM26 THD:DAT Data Input
Hold Time 100 kHz mode 0 μs—
400 kHz mode 0 0.9 μs—
1 MHz mode(2) 0.2 — μs—
IM30 TSU:STA Start Condition
Setup Time 100 kHz mode TCY/2 (BRG + 1) μs Only relevant for
Repeated Start
condition
400 kHz mode TCY/2 (BRG + 1) μs
1 MHz mode(2) TCY/2 (BRG + 1) μs
IM31 THD:STA Start Condition
Hold Time 100 kHz mode TCY/2 (BRG + 1) μs After this period the
first clock pulse is
generated
400 kHz mode TCY/2 (BRG + 1) μs
1 MHz mode(2) TCY/2 (BRG + 1) μs
IM33 TSU:STO Stop Condition
Setup Time 100 kHz mode TCY/2 (BRG + 1) μs—
400 kHz mode TCY/2 (BRG + 1) μs—
1 MHz mode(2) TCY/2 (BRG + 1) μs—
IM34 THD:STO Stop Cond ition 1 00 kHz mode TCY/2 (BRG + 1) ns
Hold Time 400 kHz mode TCY/2 (BRG + 1) ns
1 MHz mode(2) TCY/2 (BRG + 1) ns
IM40 TAA:SCL Output Valid
From Clock 100 kHz mode 3500 ns
400 kHz mode 1000 ns
1 MHz mode(2) 400 ns
IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 μs Time the bus must be
free before a new
transmission can start
400 kHz mode 1.3 μs
1 MHz mode(2) 0.5 μs
IM50 CBBus Capacitive Loading 400 pF
IM51 TPGD Pulse Gobbler Delay 65 390 ns See Note 3
Note 1: BRG is the value of the I2C™ Baud Rate Generator. Refer to Section 19. “Inter-Integrated Circuit
(I2C™)” (DS70195) in the “dsPIC33F/PIC24H Family Reference Manual”.
2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
3: Typical value for this parameter is 130 ns.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 324 © 2008-2012 Microchip Technology Inc.
FIGURE 24-21: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
FIGURE 24-22: I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS31 IS34
SCLx
SDAx
Start
Condition Stop
Condition
IS30 IS33
IS30 IS31 IS33
IS11
IS10
IS20
IS26 IS25
IS40 IS40 IS45
IS21
SCLx
SDAx
In
SDAx
Out
© 2008-2012 Microchip Technology Inc. DS70318F-page 325
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-39: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param. Symbol Characteristic Min Max Units Conditions
IS10 TLO:SCL Clock Low Time 10 0 kHz mode 4.7 μs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 1.3 μs Device must ope rate at a
minimum of 10 MHz
1 MHz mode(1) 0.5 μs—
IS11 THI:SCL Clock High Time 100 kHz mode 4.0 μs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 0.6 μs Device must ope rate at a
minimum of 10 MHz
1 MHz mode(1) 0.5 μs—
IS20 TF:SCL SDAx and SCLx
Fall Time 100 kHz mode 300 ns CB is specified to be from
10 pF to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(1) 100 ns
IS21 TR:SCL SDAx and SCLx
Rise Time 100 kHz mode 1000 ns CB is specified to be from
10 pF to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(1) 300 ns
IS25 TSU:DAT Data Input
Setup Time 100 kHz mode 250 ns
400 kHz mode 100 ns
1 MHz mode(1) 100 ns
IS26 THD:DAT Data Input
Hold Time 100 kHz mode 0 μs—
400 kHz mode 0 0.9 μs—
1 MHz mode(1) 00.3μs—
IS30 TSU:STA Start Condition
Setup Time 100 kHz mode 4.7 μs O nly relevant for Repeated
Start condition
400 kHz mode 0.6 μs
1 MHz mode(1) 0.25 μs
IS31 THD:STA Start Condition
Hold Time 100 kHz mode 4.0 μs After this period, the first
clock pulse is generated
400 kHz mode 0.6 μs
1 MHz mode(1) 0.25 μs
IS33 TSU:STO Stop Condition
Setup Time 100 kHz mode 4.7 μs—
400 kHz mode 0.6 μs—
1 MHz mode(1) 0.6 μs—
IS34 THD:STO Stop Condition
Hold Time 100 kHz mode 4000 ns
400 kHz mode 600 ns
1 MHz mode(1) 250 ns
IS40 TAA:SCL Output Valid
From Clock 100 kHz mode 0 3500 ns
400 kHz mode 0 1000 ns
1 MHz mode(1) 0 350 ns
IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 μs Time the bus must be free
before a new transmission
can start
400 kHz mode 1.3 μs
1 MHz mode(1) 0.5 μs
IS50 CBBus Capacitive Loading 400 pF
Note 1: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 326 © 2008-2012 Microchip Technology Inc.
=
TABLE 24-40: 10-BIT HIGH-SPEED ADC MODULE SPECIFICATIONS
AC CHARACTERISTICS
Standard Operating Conditions (see Note2): 3.0V and 3.6V
(unless other wise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
Device Supply
AD01 AVDD Module VDD Supply AVDD is internally con-
nected to VDD. See parame-
ter (DC10) in Table 24-4
AD02 AVSS Module VSS Supply AVSS is internally connected
to VSS
Analog Input
AD10 VINH-VINL Full-Scale Input Span VSS —VDD V—
AD11 VIN Absolute Input Voltage AVSS —AVDD V—
AD12 IAD Operating Current 8 mA
AD13 Leakage Current ±0.6 μAV
INL = AVSS = 0V, AVDD = 3.3V
Source Impedance = 100Ω
AD17 RIN Recommended Impedance
Of Analog Voltage Source 100 Ω
DC Accuracy @ 1.5 MSPS
AD20A Nr Resolution 10 data bits
AD21A INL Integral Nonlinearity -0.5 -0.3/+0.5 +1.2 LSb
AD22A DNL Differential Nonlinearity -0.9 ±0.6 +0 .9 LSb
AD23A GERR Gain Error 13 15 22 LSb
AD24A EOFF Offset Error 6 7 8 LSb
AD25A Monotonicity(1) Guaranteed
DC Accuracy @ 1.7 MSPS
AD20B Nr Resolution 10 data bits
AD21B INL Integral Nonlinearity -0.5 -0.4/+1.1 +1.8 LSb
AD22B DNL Differential Nonlinearity -1.0 ±1.0 +1 .5 LSb
AD23B GERR Gain Error 13 15 22 LSb
AD24B EOFF Offset Error 6 7 8 LSb
AD25B Monotonicity(1) Guaranteed
DC Accuracy @ 2.0 MSPS
AD20C Nr Resolution 10 data bits
AD21C INL Integral Nonlinearity -0.8 -0.5/+1.8 +2.8 LSb
AD22C DNL Differential Nonlinearity -1.0 -1.0/+1.8 +2 .8 LSb
AD23C GERR Gain Error 14 16 23 LSb
AD24C EOFF Offset Error 6 7 8 LSb
AD25C Monotonicity(1) Guaranteed
Dynamic Pe rfo rmance
AD30 THD Total Harmonic Distortion -73 dB
AD31 SINAD Signal to Noise and Distortion 58 dB
AD32 SFDR Spurious Free Dynamic Range -73 dB
AD33 FNYQ Input Signal Bandwidth 1 MHz
AD34 ENOB Effective Number of Bits 9.4 bits
Note 1: The analog-to-digital conversion result neve r decreases with an increase in input voltage, and has no
missing codes.
2: Module is functional at VBOR < VDD < VDDMIN, but with degraded performance. Module func tionality is
tested but not characterized.
© 2008-2012 Microchip Technology Inc. DS70318F-page 327
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 24-23: ANALOG-TO-DIGITAL CONVERSION TIMING PER INPUT
TABLE 24-41: 10-BIT HIGH-SPEED ADC MODULE T IMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions (see Note 2): 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min. Typ(1) Max. Units Conditions
Clock Parameters
AD50b TAD ADC Clock Period 35.8 ns
Conversion Rate
AD55b tCONV Conversion Time 14 TAD ——
AD56b FCNV Throughput Rate
Devices with Single SAR 2.0 Msps
Devices with Dual SARs 4.0 Msps
Timing Parameters
AD63b tDPU T ime to Stabilize Analog Stage
from ADC Off to ADC On(1) 1.0 10 μs—
Note 1: These parameters are characterized but not tested in manufacturing.
2: Module is functional at VBOR < VDD < VDDMIN, but with degraded performance. Module functionality is
tested but not characterized.
TAD
ADC Data
ADBUFxx
98 210
Old Data New Data
CONV
ADC Clock
Trigger Pulse
Tconv
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 328 © 2008-2012 Microchip Technology Inc.
TABLE 24-42: COMPARATOR MODULE SPECIFICATIONS
DC CHARACTERISTICS Standard Operating Conditions (see Note 2): 3.0V to 3.6V
Operating temperature: -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param.
No. Symbol Characteristic Min Typ Max Units Comments
CM10 VIOFF Input Offset Voltage -58 +14/-40 66 mV
CM11 VICM Input Common Mode
Voltage Range(1) 0—AVDD – 1.5 V
CM12 VGAIN Open Loop Gain(1) 90 db
CM13 CMRR Common Mode
Rejection Ratio(1) 70 db
CM14 TRESP Large Signal Response 21 30 49 ns V+ input step of 100 mv while
V- input held at AVDD/2. Delay
measured from analog input pin to
PWM output pin.
Note 1: Parameters are for design guidance only and are not tested in manufacturing.
2: Module is functional at VBOR < VDD < VDDMIN, but with degraded performance. Module functionality is
tested but not characterized.
TABLE 24-43: DAC MODULE SPECIFICATIONS
AC and DC CHARACTERISTICS Standard Operating Conditions (see Note 2): 3.0V to 3.6V
Operating temperature: -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param.
No. Symbol Characteristic Min Typ Max Units Comments
DA01 EXTREF External Voltage Reference(1) 0AVDD – 1.6 V
DA08 INTREF Internal Voltage Reference(1) 1.25 1.32 1.41 V
DA02 CVRES Resolution 10 Bits
DA03 INL Integral Nonlinearity Error -7 -1 +7 LSB AVDD = 3.3V,
DACREF = (AVDD/2)V
DA04 DNL Differential Nonlinearity Error -5 -0.5 +5 LSB
DA05 EOFF Offset Error 0.4 -0.8 2.6 %
DA06 EG Gain Error 0.4 -1.8 5.2 %
DA07 TSET Settling Time(1) 711 1551 2100 nsec Measured when
range = 1 (high range),
and CMREF<9:0> transi-
tions from 0x1FF to
0x300.
Note 1: Parameters are for design guidance only and are not tested in manufacturing.
2: Module is functional at VBOR < VDD < VDDMIN, but with degraded performance. Module functionality is
tested but not characterized.
© 2008-2012 Microchip Technology Inc. DS70318F-page 329
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 24-44: DAC OUTPUT BUFFER DC SPECIFICATIONS
DC CHARACTERISTICS Standard Operating Conditions (see Note 1): 3.0V to 3.6V
Operating temperature: -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param.
No. Symbol Characteristic Min Typ Max Units Comments
DA10 RLOAD Resistive Output Load
Impedance 3K Ω
DA11 CLOAD Output Load Capacitance 20 35 pF
DA12 IOUT Output Current Drive
Strength -1740 ±1400 +1770 μA Sink and source
DA13 VRANGE Full Output Drive St rength
Voltage Range AVSS + 250
mV —AVDD – 900 mV V
DA14 VLRANGE Output Drive Voltage
Range at Reduced
Current Drive of 50 μA
AVSS + 50 mV AVDD – 500 mV V
DA15 IDD Current Consumed when
Module is Enabled,
High-Power Mode
369 626 948 μA Module will always
consume this
current even if no
load is connected to
the output
DA16 ROUTON Output Impedance when
Module is Enabled 1200 Ω
Note 1: Module is functional at VBOR < VDD < VDDMIN, but with degra ded performance. Module functionality is
tested but not characterized.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 330 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 331
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
25.0 HIGH TEMPERATURE ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 electrical characteristics
for devices operating in an ambient temperature range of -40°C to +150°C.
The specifications between -40°C to +150°C are identical to those shown in Section 24.0 “Electrical Characteristics”
for operation between -40°C to +125°C, with the exception of the parameters listed in this section.
Parameters in this section begin with an H, which denotes High temperature. For example, parameter DC10 in
Section 24.0 “Electrical Characteristics” is the Industrial and Extended temperature equivalent of HDC10.
Absolute maximum ratings for the dsPIC33FJ06GS101/X 02 and dsPIC33FJ16GSX02/X04 high temperature devices
are listed below. Exposure to these maximum rating conditions for extended periods can affect device reliability.
Functional operation of the device at these or any other conditions above the parameters indicated in the operation
listings of this specification is not implied.
Absolute Maximum Ratings(1)
Ambient temperature under bias(3) .........................................................................................................-40°C to +150°C
Storage temperature .............................................................................................................................. -65°C to +160°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any pin that is not 5V tolerant with respect to VSS(4) ....................................................-0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V(4) ....................................... -0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD 3.0V(4) .................................................... -0.3V to 5.6V
Maximum current out of VSS pin.......... ................. ........................................................................ ..........................60 mA
Maximum current into VDD pin(2).............................................................................................................................60 mA
Maximum junction temperature.............................................................................................................................+155°C
Maximum current sourced/sunk by any 4x I/O pin....................................................................................................4 mA
Maximum current sourced/sunk by any 8x I/O pin....................................................................................................8 mA
Maximum current sourced/sunk by any 16x I/O pin................................................................................................16 mA
Maximum current sunk by all ports combined ....................................................................................... ...............180 mA
Maximum current sourced by all ports combined(2) ....................... ............................... ............................... .........180 mA
Note: Programming of the Flash memory is not allowed above 125°C.
Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings o f this specification i s not implied. Exposure to maximum
rating conditions for extended periods can affect device reliability.
2: Maximum allowable current is a function of devi c e maximum power dissipation (see Table 25-2).
3: AEC-Q100 reliability testing for devices intended to operate at 150°C is 1,000 hours. Any design in which
the total operating time from 125°C to 150°C will be greater than 1,000 hours is not warranted without prior
written approval from Microchip Technology Inc.
4: Refer to the Pin Diagrams section for 5V tolerant pins.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 332 © 2008-2012 Microchip Technology Inc.
25.1 High Temperature DC Characteristics
TABLE 25-1: OPERATING MIPS VS. VOLTAGE
Note 1: Overall functional device operation at VBORMIN < VDD < V DDMIN is tested but not charac terized. All device
analog modules such as the ADC, etc., will function but with degraded performance below VDDMIN. Refer to
BO10 in Table 24-11 for BOR values.
TABLE 25-2: THERMAL OPERATING CONDITIONS
TABLE 25-3: DC TEMPERATURE AND VO LTAGE SPECIFICATIONS
Characteristic VDD Range
(in Volts) Temperature Range
(in °C)
Max MIPS
dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04
3.0V to 3.6V(1) -40°C to +150°C 20
Rating Symbol Min Typ Max Unit
High Temperature Devices
Operating Junction Temperature Range TJ-40 +155 °C
Operating Ambient Temperature Range TA-40 +150 °C
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD - Σ IOH) PDPINT + PI/OW
I/O Pin Power Dissipation:
I/O = Σ ({VDD - VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ - TA)/θJA W
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +150°C for High Temperature
Parameter
No. Symbol Characteristic Min Typ Max Units Conditions
Operating Voltage
HDC10 Supply Voltage
VDD 3.0 3.3 3.6 V -40°C to +150°C
© 2008-2012 Microchip Technology Inc. DS70318F-page 333
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 25-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +150°C for High Temperature
Parameter
No. Typical(1) Max Units Conditions
Power-Down Current (IPD)(2,4)
HDC60e 1000 2000 μA +150°C 3.3V Base Power-Down Current
HDC61c 100 110 μA +150°C 3.3V Watchdog Timer Current: ΔIWDT(3)
Note 1: Data in the Typical column is at 3.3V, +25°C unless otherwise stated.
2: IPD (Sleep) current is measured as follows:
CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
CLKO is configured as an I/O input pin in the Configuration word
All I/O pins are configured as inputs and pulled to VSS
•MCLR = VDD, WDT and FSCM are disabled
All peripheral modules are disabled (PMDx bits are all ones)
The VREGS bit (RCON<8>) = 0 (i.e., core regulator is set to stand-by while the device is in Sleep
mode)
JTAG disabled
3: The Δ current is the additional current consumed when the WDT module is enabled. This curre nt should
be added to the base IPD current.
4: These currents are measured on the device containing the most memory in this family.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 334 © 2008-2012 Microchip Technology Inc.
TABLE 25-5: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions : 3.0V to 3.6V
(unless otherwise sta ted)
Operating temperature -40°C TA +150°C for High
Temperature
Param. Symbol Characteristic Min. Typ. Max. Units Conditions
DO10 VOL
Output Low Voltage
I/O Pins:
4x Sink Driver Pins - RA0-RA2,
RB0-RB2, RB5-RB10, RB15,
RC1, RC2, RC9, RC10
——0.4VIOL 3.6 mA, VDD = 3.3V
See Note 1
Output Low Voltage
I/O Pins:
8x Sink Driver Pins - RC0, RC3-
RC8, RC11-RC13
——0.4V IOL 6 mA, VDD = 3.3V
See Note 1
Output Low Voltage
I/O Pins:
16x Sink Driver Pins - RA3,
RA4, RB3, RB4, RB11-RB14
——0.4VIOL 12 mA, VDD = 3.3V
See Note 1
DO20 VOH
Output High Voltage
I/O Pins:
4x Source Driver Pins - RA0-
RA2, RB0-RB2, RB5-RB10,
RB15, RC1, RC2, RC9, RC10
2.4 V IOL -4 mA, VDD = 3.3V
See Note 1
Output High Voltage
I/O Pins:
8x Source Driver Pins - RC0,
RC3-RC8, RC11-RC13
2.4 V IOL -8 mA, VDD = 3.3V
See Note 1
Output High Voltage
I/O Pins:
16x Source Driv er Pi ns - RA3 ,
RA4, RB3, RB4, RB11-RB14
2.4 V IOL -16 mA, VDD = 3.3V
See Note 1
DO20A VOH1
Output High Voltage
I/O Pins:
4x Source Driver Pins - RA0-
RA2, RB0-RB2, RB5-RB10,
RB15, RC1, RC2, RC9, RC10
1.5
V
IOH -3.9 mA, VDD = 3.3V
See Note 1
2.0 IOH -3.7 mA, VDD = 3.3V
See Note 1
3.0 IOH -2 mA, VDD = 3.3V
See Note 1
Output High Voltage
8x Source Driver Pins - RC0,
RC3-RC8, RC11-RC13
1.5
V
IOH -7.5 mA, VDD = 3.3V
See Note 1
2.0 IOH -6.8 mA, VDD = 3.3V
See Note 1
3.0 IOH -3 mA, VDD = 3.3V
See Note 1
Output High Voltage
I/O Pins:
16x Source Driv er Pi ns - RA3 ,
RA4, RB3, RB4, RB11-RB14
1.5
V
IOH -15 mA, VDD = 3.3V
See Note 1
2.0 IOH -14 mA, VDD = 3.3V
See Note 1
3.0 IOH -7 mA, VDD = 3.3V
See Note 1
Note 1: Parameters are cha rac terized, but not tested.
© 2008-2012 Microchip Technology Inc. DS70318F-page 335
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 25-6: DC CHARACTERISTICS: PROGRAM MEMORY
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +150°C for High Temperature
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
Program Flash Memory
HD130 EPCell Endurance 10,000 E/W -40°C to +150°C(2)
HD134 TRETD Characteristic Retention 20 Year 1000 E/W cycles or less and no
other specifications are violated
Note 1: These parameters are assured by design, but are not characterized or tested in manufacturing.
2: Programming of the Flash memory is not allowed above 125°C.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 336 © 2008-2012 Microchip Technology Inc.
25.2 AC Characteristics and Timing
Parameters
The information contained in this section defines
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/
X04 AC characteristics and timing parameters for high
temperature devices. However, all AC timing
specifications in this section are the same as those in
Section 31.2 “AC Characteristics and Timing
Parameters”, with the exception of the parameters
listed in this section.
Parameters in this section begin with an H, which
denotes High temperature. For example, parameter
OS53 in Section 31.2 “AC Characteristics and
Timing Parameters” is the Industrial and Extended
temperature equivalent of HOS53.
TABLE 25-7: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
FIGURE 25-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
TABLE 25-8: PLL CLOCK TIMING SPECIFICATIONS
AC CHARACTERISTICS
Standard Operating Condit ions: 3.0V to 3.6V
(unless otherw ise stated)
Operating temperature -40°C TA +150°C for High Te mperature
Operating voltage VDD range as described in Table 25-1.
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL=464Ω
CL= 50 pF for all pins except OSC2
15 pF for OSC2 output
Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2
AC
CHARACTERISTICS
Standard Operating Condit ions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +150°C for High Temperature
Param
No. Symbol Characteristic Min Typ Max Units Conditions
HOS53 DCLK CLKO Stability (Ji tter)(1) -5 0.5 5 % Measured o v er 1 00 m s
period
Note 1: These parameters are characterized, but are not tested in manufacturing.
© 2008-2012 Microchip Technology Inc. DS70318F-page 337
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 25-9: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS
TABLE 25-10: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
AC
CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V (unless oth erwise stated)
Operating temperature -40°C TA +150°C for High Temperature
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
HSP35 TscH2doV,
TscL2doV SDOx Data Output Valid after
SCKx Edge —1025ns
HSP40 TdiV2scH,
TdiV2scL Setup Time of SDIx Data Input
to SCKx Edge 28 ns
HSP41 TscH2diL,
TscL2diL Hold Time of SDIx Data Input
to SCKx Edge 35 ns
Note 1: These parameters are characterized but not tested in manufacturing.
AC
CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +150°C for High Temperature
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
HSP35 TscH2doV,
TscL2doV SDOx Dat a Output Valid after
SCKx Edge —1025ns
HSP36 TdoV2sc,
TdoV2scL SDOx Data Output Setup to
First SCKx Edge 35 ns
HSP40 TdiV2scH,
TdiV2scL Setup Time of SDIx Data Input
to SCKx Edge 28 ns
HSP41 TscH2diL,
TscL2diL Hold Time of SDIx Data Input
to SCKx Edge 35 ns
Note 1: These parameters are characterized but not tested in manufacturing.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 338 © 2008-2012 Microchip Technology Inc.
TABLE 25-11: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
TABLE 25-12: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
AC
CHARACTERISTICS
Standard Operating Condit ions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +150°C for High Temperature
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
HSP35 TscH2doV,
TscL2doV SDOx Dat a Output Valid after
SCKx Edge ——35ns
HSP40 TdiV2scH,
TdiV2scL Setup Time of SDIx Data Input
to SCKx Edge 25 ns
HSP41 TscH2diL,
TscL2diL Hold T ime of SDIx Data Input to
SCKx Edge 25 ns
HSP51 TssH2doZ SSx to SDOx Output
High-Impedance 15 55 ns See Note 2
Note 1: These parameters are characterized but not tested in manufacturing.
2: Assumes 50 pF load on all SPIx pins.
AC
CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C TA +150°C for High Temperature
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
HSP35 TscH2doV,
TscL2doV SDOx Data Output Valid after
SCKx Edge 35 ns
HSP40 TdiV2scH,
TdiV2scL Setup Time of SDIx Data Input
to SCKx Edge 25 ns
HSP41 TscH2diL,
TscL2diL Hold Time of SDIx Data Input
to SCKx Edge 25 ns
HSP51 TssH2doZ SSx to SDOX Output
High-Impedance 15 55 ns See Note 2
HSP60 TssL2doV SDOx Data Output Valid after
SSx Edge 55 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Assumes 50 pF load on all SPIx pins.
© 2008-2012 Microchip Technology Inc. DS70318F-page 339
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
26.0 50 MIPS ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 electrical characteristics
for devices operating at 50 MIPS.
The specifications for 50 MIPS are identical to those shown in Section 24.0 “Electrical Characteristics”, with the
exception of the parameters listed in this section.
Parameters in this section begin with the letter “M”, which denotes 50 MIPS operation. For example, p arameter DC29a
in Section 24.0 “Electrical Characteristics”, is the up to 40 MIPS operation equivalent of MDC29a.
Absolute maximum ratings for the dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 50 MIPS devices are listed
below. Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional
operation of the device at these or any other conditions above the parameters indicated in the operation listings of this
specification is not implied.
Absolute Maximum Ratings(1)
Ambient temperature under bias...............................................................................................................-40°C to +85°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any pin that is not 5V tolerant, with respect to VSS(3) ...................................................-0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS, when Vdd 3.0V(3) ................................................. -0.3V to +5.6V
Voltage on any 5V tolerant pin with respect to Vss, when VDD < 3.0V(3)........................................-0.3V to (VDD + 0.3V)
Maximum current out of VSS pin.......... ................. ........................................................................ ........................300 mA
Maximum current into VDD pin(2)...........................................................................................................................250 mA
Maximum current sourced/sunk by any 4x I/O pin....................................................................................... ...........15 mA
Maximum current sourced/sunk by any 8x I/O pin....................................................................................... ...........25 mA
Maximum current sourced/sunk by any 16x I/O pin................................................................................................45 mA
Maximum current sunk by all ports ....................... ........................................................................... ... ................. .200 mA
Maximum current sourced by all ports(2)...............................................................................................................200 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings o f this specification i s not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2: Maximum allowable current is a function of devi c e maximum power dissipation (see Table 24-2).
3: See the Pin Diagrams section for 5V tolerant pins.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 340 © 2008-2012 Microchip Technology Inc.
26.1 DC Characteristics
TABLE 26-1: OPERATING MIPS VS. VOLTAGE
Characteristic VDD Range
(in Volts) Temp Range
(in °C)
Max MIPS
dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04
3.0-3.6V(1) -40°C to +85°C 50
Note 1: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested but not characterized. All device
analog modules such as the ADC, etc., will function but with deg raded performance below VDDMIN. Refer
to BO10 in Table 24-11 for BOR values.
TABLE 26-2: DC CHARACTERISTICS: OPERATING CURRENT (IDD)
DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6 V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Parameter
No. Typical Max Units Conditions
Operating Current (IDD)(1)
MDC29d 105 125 mA -40°C 3.3V 50 MIPS
See Note 1
MDC29a 105 125 mA +25°C
MDC29b 105 125 mA +85°C
Note 1: IDD is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code exec ution pattern and temperature, also have an impact
on the current consumption. The test conditions for all IDD measurements are as follows:
Oscillator is configured in EC mode with PLL, OSC1 is driven with external square wave from
rail-to-rail (EC clock overshoot/unde rshoot < 250 mV required)
CLKO is configured as an I/O input pin in the Configuration word
All I/O pins are configured as inp uts and pulled to VSS
•MCLR = VDD, WDT and FSCM are disabled
CPU, SRAM, program memory and data memory are operational
No peripheral modules are operating; however, every peripheral is being clocked (all PMDx bits are
zeroed)
CPU executing while(1) statement
JTAG disabled
© 2008-2012 Microchip Technology Inc. DS70318F-page 341
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 26-3: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
DC CHARACTERISTICS St a ndard Operat ing Co nditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Parameter
No. Typical Max Units Conditions
Idle Current (IIDLE): Core Off Clock On Base Current(1)
MDC45d 64 105 mA -40°C 3.3V 50 MIPSMDC45a 64 105 mA +25°C
MDC45b 64 105 mA +85°C
Note 1: Base Idle current (IIDLE) is measured as follows:
CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
CLKO is configured as an I/O input pin in the Configuration word
All I/O pins are configured as inputs and pulled to VSS
•MCLR = VDD, WDT and FSCM are disabled
No peripheral modules are operating; however, every peripheral is being clocked (all PMDx bits are
zeroed)
The NVMSIDL bit (NVMCON<12>) = 1 (i.e., Flash regulator is set to stand-by while the device is in
Idle mode)
JTAG disabled
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 342 © 2008-2012 Microchip Technology Inc.
TABLE 26-4: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)
DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V
(unless other wise stated)
Operating temperature -40°C TA +85°C for Industrial
Parameter No. Typical Max Doze
Ratio Units Conditions
MDC74a 80 105 1:2 mA -40°C 3.3V 50 MIPSMDC74f 65 105 1:64 mA
MDC74g 65 105 1:128 mA
MDC75a 81 105 1:2 mA +25°C 3.3V 50 MIPSMDC75f 65 105 1:64 mA
MDC75g 65 105 1:128 mA
MDC76a 81 105 1:2 mA +85°C 3.3V 50 MIPSMDC76f 65 105 1:64 mA
MDC76g 65 105 1:128 mA
Note 1: primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the
current consumption. The test conditions for all IDOZE measurements are as follows:
Oscillator is configured in EC mode and external clock active, OSC1 is driven with external square
wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
CLKO is configured as an I/O input pin in the Configuration word
All I/O pins are configured as inputs and pulled to VSS
•MCLR = VDD, WDT and FSCM are disabled
CPU, SRAM, program memory and data memory are operational
No peripheral modules are operating; however, every peripheral is being clocked (all PMDx bits are
zeroed)
CPU executing while(1) statement
JTAG disabled
© 2008-2012 Microchip Technology Inc. DS70318F-page 343
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
26.2 AC Characteristics and Timing Parameters
This section defines dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 AC characteristics and timing parameters
for 50 MIPS devices.
TABLE 26-5: EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS Standard Operating Conditio ns : 3.0V to 3.6V
(unless otherw ise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Symb Characteristic Min Typ(1) Max Units Conditions
MOS10 FIN External CLKI Frequency
(External clocks allowed only
in EC and ECPLL modes)
DC 50 MHz EC
Oscillator Crystal Frequency 3.5
10
10
50 MHz
MHz XT
HS
MOS20 TOSC TOSC = 1/FOSC 10 DC ns
MOS25 TCY Instruction Cycle Time(2) 20 DC ns
Note 1: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
2: Instruction cycle period (TCY) equals two times the input oscillator time-base period . All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exc eeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock inp ut is used, the
“max.” cycle time limit is “DC” (no clock) for all devices.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 344 © 2008-2012 Microchip Technology Inc.
TABLE 26-6: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1)
AC CHARACTERISTICS Stand ard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Symbol Characteristic Min Typ Max Units Conditions
MTA10 TTXH TxCK High
Time Synchronous,
no prescaler TCY + 15 ns Must also meet
parameter T A15.
N = prescale
value
(1, 8, 64, 256)
Synchronous,
with prescaler (TCY + 15)/N ns
Asynchronous 15 ns
MTA11 TTXLTxCK Low
Time Synchronous,
no prescaler (TCY + 15) ns Must also meet
parameter T A15.
N = prescale
value
(1, 8, 64, 256)
Synchronous,
with prescaler (TCY + 10)/N ns
Asynchronous 15 ns
MTA15 TTXP TxCK Input
Period Synchronous,
no prescaler 2 TCY + 30 ns
Synchronous,
with prescaler Greater of:
40 ns or
(2 TCY + 30)/N
N = prescale
value
(1, 8, 64, 256)
Asynchronous 30 ns
MOS60 Ft1 SOSCI/T1CK Oscillator
Input frequency Range
(oscillator enabled by set-
ting bit TCS (T1CON<1>))
DC 50 kHz
MTA20 TCKEXTMRL Delay from External TxCK
Clock Edge to Timer Incre-
ment
0.75 TCY + 30 1.75 TCY + 30
Note 1: Timer1 is a Type A.
© 2008-2012 Microchip Technology Inc. DS70318F-page 345
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 26-7: TIMER2 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
MTB10 TtxH TxCK High
Time Synchronous
mode Greater of:
15 or
(TCY + 15)/N
——ns
Must also meet
parameter TB15
N = prescale
value
(1, 8, 64, 256)
MTB11 TtxL TxCK Low
Time Synchronous
mode Greater of:
15 or
(TCY + 15)/N
ns Must also meet
parameter TB15
N = prescale
value
(1, 8, 64, 256)
MTB15 TtxP TxCK
Input
Period
Synchronous
mode Greater of:
40 or
(2 TCY + 30)/N
ns N = prescale
value
(1, 8, 64, 256)
MTB20 TCKEXTMRL Delay from External TxCK
Clock Edge to Timer
Increment
0.75 TCY + 30 1.75 TCY + 30 ns
Note 1: These parameters are characterized, but are not tested in manufacturing.
TABLE 26-8: TIMER3 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
MTC10 TtxH TxCK High
Time Synchronous TCY + 10 ns Must also meet
parameter TC15
MTC11 TtxL TxCK Low
Time Synchronous TCY + 10 ns Must also meet
parameter TC15
MTC15 TtxP TxCK Input
Period Synchronous,
with prescaler 2 TCY + 20 ns
MTC20 TCKEXTMRL Delay from External TxCK
Clock Edge to Timer
Increment
0.75 TCY + 20 1.7 5 TCY + 20 ns
Note 1: These parameters are characterized, but are not tested in manufacturing.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 346 © 2008-2012 Microchip Technology Inc.
TABLE 26-9: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
MOC15 TFD Fault Input to PWM I/O
Change ——TCY + 10 ns
MOC20 TFLT Fault Input Pulse Width TCY + 10 ns
Note 1: These parameters are characterized but not tested in manufacturing.
© 2008-2012 Microchip Technology Inc. DS70318F-page 347
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
27.0 DC AND AC DEVICE CHARACTERISTICS GRAPHS
FIGURE 27-1: VOH – 4x DRIVER PINS
FIGURE 27-2: VOH – 8x DRIVER PINS
FIGURE 27-3: VOH – 16x DRIVER PINS
Note: The graphs provided followi ng this note are a statistical summary based on a limited number of samples and are pr ovided for design gu idance purposes
only. The performance characteristics listed herein are not tested or guaranteed. In some graphs, the data presented may be outside the specified operating
range (e.g., outside specified power supply range) and therefore, outside the warranted range .
-0.030
-0.025
-0.020
-0.015
-0.010
IOH (A)
-0.030
-0.025
-0.020
-0.015
-0.010
-0.005
0.000
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00
IOH (A)
VOH (V)
3V
3.3V
3.6V
Absolute Maximum
-0.040
-0.035
-0.030
-0.025
-0.020
-0.015
IOH (A)
-0.040
-0.035
-0.030
-0.025
-0.020
-0.015
-0.010
-0.005
0.000
0.00 1.00 2.00 3.00 4.00
IOH (A)
VOH (V)
3V
3.3V
3.6V
Absolute Maximum
-0.080
-0.070
-0.060
-0.050
-0.040
-0.030
-0.020
IOH (A)
-0.080
-0.070
-0.060
-0.050
-0.040
-0.030
-0.020
-0.010
0.000
0.00 1.00 2.00 3.00 4.00
IOH (A)
VOH (V)
3.3V
3.6V
Absolute Maximum
3V
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 348 © 2008-2012 Microchip Technology Inc.
FIGURE 27-4: VOL – 4x DRIVER PINS
FIGURE 27-5: VOL – 8x DRIVER PINS
FIGURE 27-6: VOL – 16x DRIVER PINS
0.010
0.015
0.020
0.025
0.030
0.035
0.040
IOL (A)
0.000
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.040
0.00 1.00 2.00 3.00 4.00
IOL (A)
VOL (V)
3V
3.3V
3.6V
Absolute Maximum
0.020
0.030
0.040
0.050
0.060
IOL (A)
0.000
0.010
0.020
0.030
0.040
0.050
0.060
0.00 1.00 2.00 3.00 4.00
IOL (A)
VOL (V)
3V
3.3V
3.6V
Absolute Maximum
0.040
0.060
0.080
0.100
0.120
IOL (A)
0.000
0.020
0.040
0.060
0.080
0.100
0.120
0.00 1.00 2.00 3.00 4.00
IOL (A)
VOL (V)
3V
3.3V
3.6V
Absolute Maximum
© 2008-2012 Microchip Technology Inc. DS70318F-page 349
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 27-7: TYPICAL IPD CURRENT @ VDD = 3.3V
FIGURE 27-8: TYPICAL IDD CURRENT @ VDD = 3.3V
FIGURE 27-9: TYPICAL IDOZE CURRENT @ VDD = 3.3V
FIGURE 27-10: TYPICAL IIDLE CURRENT @ VDD = 3.3V
420
620
820
1020
1220
IPD Current (µA)
20
220
420
620
820
1020
1220
-40256585125150
IPD Current (µA)
Temperature (Celsius)
70
80
90
100
110
120
Average (mA)
40
50
60
70
80
90
100
110
120
10 20 30 40 50
Average (mA)
MIPS
48
58
68
78
88
98
108
118
O
ZE Current (mA)
18
28
38
48
1:1 1:2 1:64 1:128
ID
O
Doze Ratio
50 MIPS
40 MIPS
50
55
60
65
70
Average (mA)
40
45
50
55
60
65
70
10 20 30 40 50
Average (mA)
MIPS
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 350 © 2008-2012 Microchip Technology Inc.
FIGURE 27-11: TYPICAL FRC FREQUENCY @ VDD = 3.3V
FIGURE 27-12: TYPICAL LPRC FREQUENCY @ VDD = 3.3V
FIGURE 27-13: TYPICAL INTREF @ VDD = 3.3V
71
7.15
7.2
7.25
7.3
7.35
7.4
7.45
F
RC Frequency (MHz)
7
7.05
7.1
7.15
7.2
7.25
7.3
7.35
7.4
7.45
-40 25 85 125 150
FRC Frequency (MHz)
Temperature (Celsius)
22
24
26
28
30
32
34
L
PRC Frequency (kHz)
18
20
22
24
26
28
30
32
34
-40 25 85 125 150
LPRC Frequency (kHz)
Temperature (Celsius)
1.31
1.32
1.33
1.34
1.35
1.36
INTREF (V)
1.29
1.3
1.31
1.32
1.33
1.34
1.35
1.36
-40 25 85 125 150
INTREF (V)
Temperature (Celsius)
© 2008-2012 Microchip Technology Inc. DS70318F-page 351
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
28.0 PACKAGING INFORMATION
28.1 Package Marking Information
Legend: XX...X Customer-speci fi c in fo rmation
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next
line, thus limiting the number of available characters for customer-specific information.
3
e
3
e
28-Lead SPDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ06GS
0830235
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ06GS
0830235
202-E/SP
202-E/SO
3
e
3
e
18-Lead SOIC (.300”)
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ06
0830235
GS101-I/SO
3
e
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 352 © 2008-2012 Microchip Technology Inc.
28.1 Package Marking Information (Continued)
28-Lead QFN-S
XXXXXXXX
XXXXXXXX
YYWWNNN
Example
33FJ06GS
202EMM
0830235
XXXXXXXXXX
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
dsPIC33FJ16
Example
GS504-E/ML
0830235
44-Lead T Q F P
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ
16GS504
0830235
-E/PT
3
e
3
e
3
e
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte T in (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next
line, thus limiting the number of available characters for customer-specific information.
3
e
3
e
XXXXXXXXXX
44-Lead VTLA (TLA)
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
dsPIC33FJ
Example
-E/TL
0830235
16GS504
3
e
© 2008-2012 Microchip Technology Inc. DS70318F-page 353
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
28.2 Package Details
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DS70318F-page 362 © 2008-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
© 2008-2012 Microchip Technology Inc. DS70318F-page 363
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 364 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 365
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
APPENDIX A: REVISION HISTORY
Revision A (January 2008)
This is the initial revision of this document.
Revision B (June 2008)
This revision includes minor typographical and
formatting changes throughout the data sheet text. In
addition, redundant information was removed that is
now available in the respective chapters of the
dsPIC33F/PIC24H Family Reference Manual, which
can be obtained from the Microchip website
(www.microchip.com).
The major changes are referenced by their respective
section in the following table.
TABLE A-1: MAJOR SECTION UPDATES
Section Name Update Description
“High-Performance, 16-bit Digital
Signal Controllers” Moved location of Note 1 (RPn pin) references (see “Pin Diagrams”).
Section 3.0 “Memory Organization” Updated CPU Core Register map SFR reset value for CORCON (see
Table 3-1).
Removed Interrupt Controller Register Map SFR IPC29 and updated reset
values for IPC0, IPC1, IPC14, IPC16, IPC23, IPC24, IPC27, and IPC28 (see
Table 3-5).
Removed Interrupt Controller Register Map SFR IPC24 and IPC29 and
updated reset values for IPC0, IPC1, IPC2, IPC14, IPC16, IPC23, IPC27,
and IPC28 (see Table 3-6).
Removed Interrupt Controller Register Map SFR IPC24 and updated reset
values for IPC1, IPC2, IPC4, IPC14, IPC16, IPC23 , IPC24, IPC27, and
IPC28 (see Table 3-7).
Updated Interrupt Controller Register Map SFR reset values for IPC1,
IPC14, IPC16, IPC23, IPC24, IPC27, and IPC28 (see Table 3-8).
Updated Interrupt Controller Register Map SFR reset values for IPC1,
IPC14, IPC16, IPC23, IPC24, IPC25, IPC26, IPC27, IPC28, and IPC29 (see
Table 3-9).
Updated Interrupt Controller Register Map SFR reset values for IPC1, IPC4,
IPC14, IPC16, IPC23, IPC24, IPC25, IPC26, IPC27, IPC28, and IPC29 (see
Table 3-10).
Added SFR definitions for RPOR16 and RPOR17 (see Table 3-34,
Table 3-35, and Table 3-3 6).
Updated bit definitions for PORTA, PORTB, and PORTC SFRs (ODCA,
ODCB, and ODCC) (see Table 3-37, Table 3-38, Table 3-39, and
Table 3-40).
Updated bit definitions and reset value for System Control Register map
SFR CLKDIV (see Table 3-41).
Added device-specific information to title of PMD Register Map (see
Table 3-47).
Added device-specific PMD Register Maps (see Table 3-46, Table 3-45, and
Table 3-43).
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 366 © 2008-2012 Microchip Technology Inc.
Section 7.0 “Oscillator
Configuration” Removed the first sentence of the third clock source item (External Clock) in
Section 7.1.1 “System Clock sources”
Updated the default bit values for DOZE and FRCDIV in the Clock Divisor
Register (see Register 7-2).
Section 8.0 “Power-Saving
Features” Added the following six registers:
“PMD1: Peripheral Module Disable Control Register 1”
“PMD2: Peripheral Module Disable Control Register 2”
“PMD3: Peripheral Module Disable Control Register 3”
“PMD4: Peripheral Module Disable Control Register 4”
“PMD6: Peripheral Module Disable Control Register 6”
“PMD7: Peripheral Module Disable Control Register 7”
Section 9.0 “I/O Ports” Added paragraph and Table 9-1 to Section 9.1.1 “Open-Drain
Configuration”, which provides details on I/O pins and their functionality.
Removed 9.1.2 “5V Tolerance”.
Updated MUX range and removed virtual pin details in Figure 9-2.
Updated PWM Input Name descriptions in Table 9-1.
Added Section 9.4.2.3 “Virtual Pin s”.
Updated bit values in all Peripheral Pin Select Input Registers (see
Register 9-1 through Register 9-14).
Updated bit name information for Peripheral Pin Select Output Registe r s
RPOR16 and RPOR17 (see Register 9-30 and Register 9-31).
Added the following two registers:
“RPOR16: Peripheral Pin Select Output Register 16”
“RPOR17: Peripheral Pin Select Output Register 17”
Removed the following sections:
9.4.2 “Available Peripherals”
9.4.3.2 “Virtual Input Pins
9.4.3.4 “Peripheral Mapping”
9.4.5 “Considerations for Peripheral Pin Selection” (and all subsections)
Section 14.0 “High-Speed PWM” Added Note 1 (remappable pin reference) to Figure 14-1.
Added Note 2 (Duty Cycle resolution) to PWM Master Duty Cycle Register
(Register 14-5), PWM Genera to r Duty Cycle Register (Register 14-7), and
PWM Secondary Duty Cycle Register (Register 14-8).
Added Note 2 and Note 3 and updated bit information for CLSRC and
FLTSRC in the PWM Fault Current-Limit Control Register (Register 14-15).
Section 15.0 “Serial Peripheral
Interface (SPI)” Removed the following sections, which are now available in th e related
section of the dsPIC33F/PIC24H Family Refe rence Manual:
15.1 “Interrupts”
15.2 “Receive Operati o ns”
15.3 “Transmit Operations”
15.4 “SPI Setup” (retained Figure 15-1: SPI Module Block Diagram)
TABLE A-1: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description
© 2008-2012 Microchip Technology Inc. DS70318F-page 367
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Section 16.0 “Inter-Integrated
Circuit (I2C™)” Removed the following sections, which are now available in the related
section of the dsPIC33F/PIC24H Family Refe rence Manual:
•16.3I
2C Interrupts”
16.4 “Baud Rate Generator” (retained Figure 16-1: I2C Block Diagram)
•16.5I
2C Module Addresse s
16.6 “Slave Address Masking”
16.7 “IPMI Support”
16.8 “General Call Address Support”
16.9 “Automatic Clock Stretch”
16.10 “Software Controlled Clock S tretching (STREN = 1)”
16.11 “Slope Control”
16.12 “Clock Arbitration”
16.13 “Multi-Master Communication , Bus Collision, and Bus Arbitration
Section 17.0 “Universal
Asynchronous Receiver Transmitter
(UART)”
Removed the following sections, which are now available in the related
section of the dsPIC33F/PIC24H Family Refe rence Manual:
17.1 “UART Baud Rate Generator”
17.2 “Transmitting in 8-bit Data Mode
17.3 “Transmitting in 9-bit Data Mode
17.4 “Break and Sync Transmit Sequence”
17.5 “Receivin g in 8-bit or 9-bit Data Mode”
17.6 “Flow Control Using UxCTS and UxRTS Pins”
17.7 “Infrared Support”
Removed IrDA references and Note 1, and updated the bit and bit value
descriptions for UTXINV (UxSTA<14 >) in the UARTx Status and Control
Register (see Register 17-2).
Section 18.0 “High-Speed 10-bit
Analog-to-Digital Converter (ADC)” Updated bit value information for Analog-to-Digi tal Control Registe r (see
Register 18-1).
Updated TRGSRC6 bit value for T imer1 period match in the Analog-to-
Digital Convert Pair Control Register 3 (see Register 18-8 ).
TABLE A-1: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 368 © 2008-2012 Microchip Technology Inc.
Section 23.0 “Electrical
Characteristics” Updated Typ values for Thermal Packaging Characteristics (Table 23-3).
Removed Typ value for DC Temperature and Voltage Specifications
parameter DC12 (Table 23-4).
Updated all Typ values and conditions for DC Characteristics: Operating
Current (IDD), updated last sentence in Note 2 (Table 23-5).
Updated all Typ value s for DC Characteristics: Idle Current (IIDLE) (see
Table 23-6).
Updated all Typ values for DC Characteristics: Power Down Current (IPD)
(see Table 23-7).
Updated all Typ values for DC Characteristics: Doze Current (IDOZE) (see
Table 23-8).
Added Note 4 (reference to new table containing digital-only and analog pin
information, as well as Current Sink/Source capabilities) in the I/O Pin Input
Specifications (Table 23-9).
Updated Max value for BOR electrical characteristics parameter BO10 (see
Table 23-11).
Swapped Min and Typ values for Program Memory parameters D136 and
D137 (Table 23-12).
Updated Typ values for Internal RC Accuracy parameter F20 and added
Extended temperature range to table heading (see Table 23-19).
Removed all values for Reset, Watchdog Timer, Oscillator Start-up Timer,
and Power-up Timer parameter SY20 and updated conditions, which now
refers to Section 20.4 “Watchdo g Timer (WDT)” and LPRC parameter
F21a (see Table 23-22).
Added specifications to High-Speed PWM Module Timing Requirements for
Tap Delay (Table 23-29).
Updated Min and Max values for 10-bit High-Speed Analog-to-Digital
Module parameters AD01 and AD11 (see Table 23-36).
Updated Max value and unit of measure for DAC AC Specification (see
Table 23-40).
TABLE A-1: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description
© 2008-2012 Microchip Technology Inc. DS70318F-page 369
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Revision C and D (March 2009)
This revision includes minor typographical and
formatting changes throughout the data sheet text.
Global changes include:
Changed all instances of OSCI to OSC1 and
OSCO to OSC2
Changed all instances of PGCx/EMUCx and
PGDx/EMUDx (where x = 1, 2, or 3) to PGECx
and PGEDx
Changed all instances of VDDCORE and VDDCORE/
VCAP to VCAP/VDDCORE
Other major changes are referenced by their respective
section in the following table.
TABLE A-2: MAJOR SECTION UPDATES
Section Name Update Description
“High-Performance, 16-bit Digital
Signal Controllers” Added “Application Examples” to list of features
Updated all pin diagrams to denote the pin voltage tolerance (see “Pin
Diagrams”).
Added Note 2 to the 28-Pin QFN-S and 44-Pin QFN pin diagrams, which
references pin connections to VSS.
Section 1.0 “Device Overview” Add ed ACMP1-ACMP4 pin names and Peripheral Pin Select capability
column to Pinout I/O Descriptions (see Table 1-1).
Section 2.0 “Guidelines for Getting
Started with 16-bit Digital Signal
Controllers”
Added new section to the data sheet that provid es guidelines on getting
started with 16-bit Digital Signal Controllers.
Section 3.0 “CPU” Updated CPU Core Block Diagram with a connection from the DSP Engine
to the Y Data Bus (see Figure 3-1).
Vertically extended the X and Y Data Bus lines in the DSP Engine Block
Diagram (see Figure 3-3).
Section 4.0 “Memory Organization” Updated Reset valu e for ADCON in Table 4-25.
Removed reference to dsPIC33FJ06GS102 devices in the PMD Register
Map and updated bit definitions for PMD1 and PMD6, and removed PMD7
(see Table 4-43).
Added a new PMD Register Map, which references dsPIC33FJ06GS102
devices (see Table 4-44).
Updated RAM stack address and SPLIM values in the third paragraph of
Section 4.2.6 “Software Stack”
Removed Section 4.2.7 “Data Ram Protection Feature”.
Section 5.0 “Flash Program
Memory” Updated Section 5.3 “Programming Operations” with pr ogramming time
formula.
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 370 © 2008-2012 Microchip Technology Inc.
Section 8.0 “Oscillator
Configuration” Added Note 2 to the Oscillator System Diagram (see Figure 8-1).
Added a paragraph regarding FRC accuracy at the end of Section 8.1.1
“System Clock Sourc es”.
Added Note 1 and Note 2 to the OSCON register (see Register ).
Added Note 1 to the OSCTUN register (see Register 8-4).
Added Note 3 to Section 8.4.2 “Oscillator Switching Sequence”.
Section 10.0 “I/O Ports” Removed Table 9-1 and added reference to pin diagrams for I/O pin
availability and functionali ty.
Added paragraph on ADPCFG register default values to Section 10.3
“Configuring Analog Port Pins”.
Added Note box regarding PPS functionality with input mapping to
Section 10.6.2.1 “Input Mappin g”.
Section 15.0 “High-Speed PWM” Updated Note 2 in the PTCON register (see Register 15-1).
Added Note 4 to the PWMCONx register (see Register 15-6).
Updated Notes for the PHASEx and SPHASEx registers (see Register 15-9
and Register 15-10, respectively).
Section 16.0 “Serial Peripheral
Interface (SPI)” Added Note 2 and Note 3 to the SPIxCON1 register (see Register 16-2).
Section 18.0 “Universal
Asynchronous Receiver Transmitter
(UART)”
Updated the Notes in the UxMode register (see Register 18-1).
Updated the UTXINV bit settings in the UxSTA register and added Note 1
(see Register 18-2).
Section 19.0 “High-Speed 10-bit
Analog-to-Digital Converter (ADC)” Updated the SLOWCLK and ADCS<2:0> bit settings and updated Note 1in
the ADCON register (see Register 19-1).
Removed all notes in the ADPCFG register and replaced them with a single
note (see Register 19-4).
Updated the SWTRGx bit settings in the ADCPCx registers (see
Register 19-5, Register 19-6, Register 19-7, and Register 19-8).
TABLE A-2: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description
© 2008-2012 Microchip Technology Inc. DS70318F-page 371
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Section 24.0 “Electrical
Characteristics” Updated Typical values for Thermal Packaging Char acteristics (see
Table 24-3).
Updated Min and Max values for parameter DC12 (RAM Data Retention
Voltage) and added Note 4 (see Table 24-4).
Updated Characteristics for I/O Pin Input Specifications (see Table 24 - 9).
Added ISOURCE to I/O Pin Output Specifications (see Table 24-10).
Updated Program Memory values for parameters 136, 137, and 138
(renamed to 136a, 137a, and 138 a), added parameters 136b, 137b, and
138b, and added Note 2 (see Table 24-12).
Added parameter OS42 (GM) to the External Clock Timing Requirements
(see Table 24-16).
Updated Conditions for symbol TPDLY (Tap Delay) and added symbol ACLK
(PWM Input Clock) to the High-Speed PWM Module Timing Requirements
(see Table 24-29).
Updated parameters AD01 and AD02 in the 10-bit High-Speed Analog-to-
Digital Module Specifications (see Table 24-36).
Updated parameters AD50b, AD55b, and AD56b, and removed parameters
AD57b and AD60b from the 10-bit High-Speed Analog-to-Digital Module
Timing Requirements (see Ta ble 24-37).
TABLE A-2: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 372 © 2008-2012 Microchip Technology Inc.
Revision E (December 2009)
The revision includes the following global update:
Added Note 2 to the shaded table that appears at
the beginning of each chapter. This new note
provides information regarding the availability of
registers and their associated bits
This revision also includes minor typographical and
formatting changes throughout the data sheet text.
All other major changes are referenced by their
respective section in the following table.
TABLE A-3: MAJOR SECTION UPDATES
Section Name Update Description
“16-bit Microcontrollers and Digital
Signal Controllers (up to 16 KB Flash
and up to 2 KB SRAM) with High-
Speed PWM, ADC and Comparators”
Changed CN6 to CN5 on pin 16 of dsPIC33FJ16GS502 28-pin SPDIP,
SOIC pin diagram.
Section 2.0 “Guidelines for Getting
Started with 16-bit Digital Signal
Controllers”
Removed the 10 Ohm resistor from Figure 2-1.
Section 4.0 “Memory Organization” Re named bit 13 of the REFOCON SFR in the System Control Register
Map from ROSIDL to ROSSLP and changed the All Resets value from
0000’ to ‘2300’ for the ACLKCON SFR (see 4-41).
Section 8.0 “Oscillator Configuration” Updated the default reset values from R/W-0 to R/W-1 for the SELACLK
and APSTSCLR<2:0> bits in the ACLKCON register (see Register 8-5).
Renamed the ROSIDL bit to ROSSLP in the REFOCON register (see
Register 8-6).
Section 9.0 “Power-Saving Features” Updated the last paragraph of Section 9.2.2 “Idle Mode” to clarify when
instruction execution begins.
Added Note 1 to the PMD1 register (see Register 9-1).
Section 10.0 “I/O Ports” Changed the reference to digi tal-only pins to 5V tolerant pins in the
second paragraph of Section 10.2 “Open-Drain Config uration”.
Section 15.0 “High-Speed PWM” Updated the smallest pulse width value from 0x0008 to 0x0009 in Note 1
of the shaded note that follows the MDC register (see Register 15-5).
Updated the smallest pulse width value from 0x0008 to 0x0009 and the
maximum pulse width value from 0x0FFEF to 0x0008 in Note 2 of the
shaded note that follows the PDCx and SDCx registers (see Register 15-7
and Register 15-8).
Added Note 2 and updated the FLTDAT<1:0> and CLDAT<1:0> bits,
changing the word ‘data’ to ‘state’ in the IOCONx register (see
Register 15-14).
Section 18.0 “Universal
Asynchronous Receiver Transmitter
(UART)”
Updated the two baud rate range features to: 10 Mbps to 38 bps at 40
MIPS.
Section 19.0 “High-Speed 10-bit
Analog-to-Digital Converter (ADC)” Updated Note 1 in the ADCPC0 register (see Register 19-5).
Updated Note 3 in the ADCPC1 register (see Register 19-6).
Updated Note 2 in the ADCPC2 and ADCPC3 registers (see Register 19-
7 and Register 19-8).
© 2008-2012 Microchip Technology Inc. DS70318F-page 373
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Section 21.0 “Special Features” Updated the second paragraph and removed the four th paragraph in
Section 21.1 “Configuration Bits”.
Updated the Device Configuration Register Map (see Tab le 21-1).
Section 24.0 “Electrical
Characteristics” Updated the Absolute Maximum Ratings for high temperature and added
Note 4.
Updated Idle Current (IIDLE) Typical values in Table 24-6.
Updated the Typ and Max values for parameter DI50 in the I/O Pin Input
Specifi ca ti ons table (see Table 24-9).
Updated the Typ and Ma x values for parameter DO10 and DO27 and the
Min and Typ values for parameter DO20 in the I/O Pin Output
Specifi cati ons (see Table 24-10).
Added parameter numbers to the Auxiliary PLL Clock Timing
Specifi cati ons (see Table 24-18).
Added parameters numbers and upd ated the Internal RC Accuracy Min,
Typ, and Max values (see Table 24-19 and Table 24-20).
Added parameter numbers, Note 2, updated the Min and Typ paramete r
values for MP31 and MP32, and removed the conditions for MP10 and
MP11 in the High-Speed PWM Module Timing Requirements (see
Table 24-29).
Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics
(see Table 24-14).
Added parameter IM51 to the I2Cx Bus Data Timing Requirements
(Master Mode) (see Table 24-34).
Updated the Max value for parameter AD33 in the 10-bit High-Speed
Analog-to-Digital Module Specifications (see Table 24-36).
Updated the titles and added parameter n umbers to the Comparator and
DAC Module Specifications (see Table 24-38 and Table 24-39) and the
DAC Output Buffer Specifications (see Table 24-40).
TABLE A-3: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 374 © 2008-2012 Microchip Technology Inc.
Revision F (January 2012)
All occurrences of VDDCORE have been removed
throughout the document.
This revision also includes minor typographical and
formatting changes throughout the data sheet text.
All other major changes are referenced by their
respective section in the following table.
TABLE A-4: MAJOR SECTION UPDATES
Section Name Update Description
“16-bit Digit al Signal Cont rollers (up
to 16 KB Flash and up to 2 KB
SRAM) with High-Speed PWM, ADC,
and Comparators”
Added the VTLA package to the dsPIC33FJ16GS404 and
dsPIC33FJ16GS504 devices (see TABLE 1: “dsPIC33FJ06GS101/X02
and dsPIC33FJ16GSX02/X04 Controller Families”).
Added the “Referenced Sources” section.
The following updates were made to the “Pin Dia gra ms” section:
Added 5V tolerant pin shading to pins 24-26 in the 28-pin SPDIP, SOIC
packag e for th e dsPIC33FJ16GS40 2
Updated pin 31 of the 44-pin QFN package for the dsPIC33FJ16GS404
Added VTLA pin diagrams for the dsPIC33FJ16GS404 an d
dsPIC33FJ16GS504 devices
Section 1.0 “Device Overview” Removed the Precision Band Gap Reference from the device block diagram
(see Figure 1-1).
Updated the Pinout I/O Descriptions for AVDD, and AV SS (see Table 1-1).
Section 2.0 “Guidelines for Getting
Started with 16-bit Digital Signal
Controllers”
Updated the Minimum Recommended Connection (see Figure 2-1).
Section 8.0 “Oscillator
Configuration” Updated the Oscillator System Diagram (see Figure 8-1).
Added auxiliary clock configuration restrictions in Section 8.2 “Auxiliary
Clock Generation”.
Updated or added notes regarding register reset on a POR
(see Register 8-1 through Register 8-5).
Section 19.0 “High-Speed 10-bit
Analog-to-Digital Converter (ADC)” Added Note 2 to ADCON: Analog-to-Digital Control Register
(see Register 19-1).
Removed all notes from ADSTAT: Analog-to-Digital Status Register
(see Register 19-2).
Section 20.0 “High-Speed Analog
Comparator” Updated the Comparator Module Block Diagram (see Figure 20-1).
Section 21.0 “Special Features” Add a new paragraph at the beginning of Section 21.1 “Configuration
Bits.
Added the RTSP Effect column to the dsPIC33F Configuration Bits
Description table (see Table 21-2).
Updated the Connections for the On-chip Voltage Regulator diagram
(see Figure 21-1).
Updated the first paragraph of Section 21.7 “In-Circuit Debugger”.
© 2008-2012 Microchip Technology Inc. DS70318F-page 375
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Section 24.0 “Electrical
Characteristics” Updated the Absolute Maximum Ratings.
Updated the Operating MIPS vs. Voltage (see Table 24-1).
Updated parameter DC10 and Note 4, and remo ved parameter DC18 from
the DC Temperature and Voltage Specifications (see Table 24-4).
Updated Note 2 in the IDD Operating Current specification (see Table 24-5).
Updated all T ypical values and Note 2 in the IIDLE Operating Current
specification (see Table 24-6).
Updated T ypical values for parameters DC60d, DC60a, DC60b, and DC60c,
and Note 2 in the IPD Operating Current specification (see Table 24-7).
Added all T ypical values and Note 2 in the IDOZE Operating Current
specification (see Table 24-8).
Updated parameter DI19 and DI50, added parameters DI128, DI129, DI60a,
DI60b, and DI60c, and removed parameter DI57 in the I/O Pin Input
Specificati ons (see Table 24-9).
Revised all I/O Pinout Output Specifications (see Table 24-10).
Added Notes 2 and 3 to the BOR Electrical Characteristics (see Table 24-
11).
Added Note 1 to Internal Voltage Regulator Specifications
(see Table 24-13).
Updated the External Clock Timing diagram (see Figure 24-2).
Added Note 2 to the PLL Clock Timing Specificatio ns (see Table 24-17).
Removed Note 2 from the Internal FRC Accu racy (see Table 24-19).
Updated parameter DO31 and DO32 in the I/O Timing Requirements
(see Table 24-21).
Updated the External Clock Timing Requirements for Timer1, Timer2, and
Timer3 (see Table 24-23, Table 24-24, and Table 24-25, respectively).
Updated parameters OC15 and OC20 in the Simple OC/PWM Mode T iming
Requirements (see Table 24-28).
Revised all SPIx Module Timing Characteristics diagrams and all Timing
Requirements (see Figure 24-11 throug h Figure 24-18 and Table 24-30
through Table 24-37, respectively ).
Added Note 2 to the 10-bit High-Speed ADC Module Specifications (see
Table 24-40).
Added Note 2 to the 10-bit High-Spe ed ADC Module Timing Requirements
(see Table 24-41).
Added Note 2 to the Comparator Module Specifications (see Table 24-42).
Added parameter DA08 and Note 2 in the DAC Module Specifications
(see Table 24-43).
Updated parameter DA16 and Note 2 in the DAC Output Buffer DC
Specifications
(see Table 24-44).
TABLE A-4: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 376 © 2008-2012 Microchip Technology Inc.
Section 26.0 “50 MIPS Electrical
Characteristics” Added new chapter in support of 50 MIPS devices.
Section 27.0 “DC and AC Device
Characteristics Graphs” Added new chapter.
Section 28.0 “Packaging
Information” Added 44-pin VTLA package marking information and diagrams (see
Section 28.1 “Package Marking Information” and Section 28.2
“Package Details”, respectively).
“Product Iden tifi ca tion System” Added the TL package definition.
TABLE A-4: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description
© 2008-2012 Microchip Technology Inc. DS70318F-page 377
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
INDEX
A
AC Characteristics ............................................298, 336, 343
Internal RC Accuracy................................................301
Load Conditions................................................298, 336
Alternate Vector Table (AIVT).............................................95
Arithmetic Logic Unit (ALU).................................................35
Assembler
MPASM Assembler...................................................282
B
Barrel Shifter.......................................................................39
Bit-Reversed Addressing ....................................................74
Example......................................................................75
Implementation ...........................................................74
Sequence Table (16-Entry).........................................75
Block Diagrams
16-bit Timer1 Module................................................181
Comparator...............................................................261
Connections for On-Chip Voltage Regulator.............268
DSP Engine ................................................................36
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
16
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
CPU Core ...........................................................30
I2C.............................................................................224
Input Capture............................................................189
Oscillator System......................................................133
Output Compare .......................................................191
PLL............................................................................135
Reset System..............................................................87
Shared Port Structure......................................... ......153
Simplified Conceptual High-Speed PWM ........... ......197
SPI............................................................................217
Timer2/3 (32-bit) .......................................................185
Type B Timer ............................................................183
Type C Timer............................................................183
UART........................................................................231
Watchdog Timer (WDT)............................................269
Brown-out Reset (BOR)....................................................265
C
C Compilers
MPLAB C18..............................................................282
Clock Switching.................................................................144
Enabling....................................................................144
Sequence..................................................................144
Code Examples
Erasing a Program Memory Page...............................85
Initiating a Programming Sequence............................86
Loading Write Buffers .................................................86
Port Write/Read ........................................................154
PWRSAV Instruction Syntax.....................................145
Code Protection ........................................................265, 271
CodeGuard Security .........................................................265
Configuration Bits..............................................................265
Configuration Register Map ..............................................265
Configuring Analog Port Pins............................................154
CPUControl Registers ........................................................32
CPU Clocking System.......................................................134
PLL Configuration.....................................................135
Selection...................................................................134
Sources.....................................................................134
Customer Change Notification Service............................. 381
Customer Notification Service .......................................... 381
Customer Support............................................................. 381
D
DAC.................................................................................. 262
Output Range........................................................... 262
Data Accumulators and Adder/Subtracter.......................... 37
Data Space Write Saturation...................................... 39
Overflow and Saturation............................................. 37
Round Logic ............................................................... 38
Write Back.................................................................. 38
Data Address Space........................................................... 43
Alignment.................................................................... 43
Memory Map for dsPIC33FJ06GS101/102 Devices with
256 Bytes of RAM............................................... 44
Memory Map for dsPIC33FJ06GS202 Device with 1 KB
RAM ................................................................... 45
Memory Map for dsPIC33FJ16GS402/404/502/504 De-
vices with 2 KB RAM.......................................... 46
Near Data Space........................................................ 43
Software Stack ........................................................... 71
Width .......................................................................... 43
DC and AC Characteristics
Graphs and Tables................................................... 347
DC Characteristics.................................................... 286, 340
Doze Current (IDOZE)........................................ 292, 342
High Temperature..................................................... 332
I/O Pin Input Specifications ...................................... 293
I/O Pin Output Specifications............................ 295, 334
Idle Current (IIDLE)............................................ 290, 341
Operating Current (IDD) .................................... 288, 340
Operating MIPS vs. Voltage..................................... 332
Power-Down Current (IPD)........................................ 291
Power-down Current (IPD)........................................ 333
Program Memory.............................................. 297, 335
Temperature and Voltage......................................... 332
Temperature and Voltage Specifications.................. 287
Thermal Operating Conditions.................................. 332
Development Support....................................................... 281
Doze Mode ....................................................................... 146
DSP Engine....................................................... ................. 35
Multiplier..................................................................... 37
E
EBCONx (Leading-Edge Blanking Control)...................... 214
Electrical Characteristics .......................................... 285, 339
AC............................................................................. 336
AC Characteristics and Timing Parameters ..... 298, 343
BOR.......................................................................... 296
Equations
Device Operating Frequency..................... ............... 134
FOSC Calculation ...................................................... 135
XT with PLL Mode Example..................................... 135
Errata.................................................................................. 13
F
Fail-Safe Clock Monitor (FSCM)....................................... 144
Flash Program Memory...................................................... 81
Control Registers........................................................ 82
Operations.................................................................. 82
Programming Algorithm.............................................. 85
RTSP Operation......................................................... 82
Table Instructions....................................................... 81
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 378 © 2008-2012 Microchip Technology Inc.
Flexible Configuration .......................................................265
H
High Temperature Electrical Characteristics.....................331
High-Speed 10-bit Analog-to-Digital Converter (ADC)......237
High-Speed Analog Comparator.......................................261
High-Speed PWM .............................................................195
I
I/O Ports............................................................................153
Parallel I/O (PIO).......................................................153
Write/Read Timing ....................................................154
I2COperating Modes ......................................................223
Registers...................................................................225
In-Circuit Debugger...........................................................270
In-Circuit Emulation...........................................................265
In-Circuit Serial Programming (ICSP).......................265, 270
Input Capture ....................................................................189
Registers...................................................................190
Input Change Notification..................................................154
Instruction Addressing Modes.............................................71
File Register Instructions .. ..................... .....................71
Fundamental Modes Supported..................................72
MAC Instructions.........................................................72
MCU Instructions ........................................................71
Move and Accumulator Instructions............................72
Other Instructions........................................................72
Instruction Set
Overview...................................................................276
Summary...................................................................273
Instruction-Based Power-Saving Modes...........................145
Idle............................................................................146
Sleep.........................................................................145
Interfacing Program and Data Memory Spaces..................76
Internal RC Oscillator
Use with WDT...........................................................269
Internet Address................................................................381
Interrupt Control and Status Registers................................98
IECx ............................................................................98
IFSx.............................................................................98
INTCON1 ....................................................................98
INTCON2 ....................................................................98
INTTREG ....................................................................98
IPCx ............................................................................98
Interrupt Setup Procedures...............................................132
Initialization...............................................................132
Interrupt Disable........................................................132
Interrupt Service Routine ..........................................132
Trap Service Routine ................................................132
Interrupt Vector Table (IVT) ................................................95
Interrupts Coincident with Power Save Instructions..........146
J
JTAG Boundary Scan Interface ........................................265
JTAG Interface..................................................................270
M
Memory Organization..........................................................41
Microchip Internet Web Site..............................................381
Modulo Addressing .............................................................73
Applicability.................................................................74
Operation Example .....................................................73
Start and End Address...... ..........................................73
W Address Register Selection ....................................73
MPLAB ASM30 Assembler, Linker, Librarian ...................282
MPLAB Integrated Development Environment Software.. 281
MPLAB PM3 Device Programmer.................................... 284
MPLAB REAL ICE In-Circuit Emulator System ................ 283
MPLINK Object Linker/MPLIB Object Librarian......... ....... 282
O
Open-Drain Configuration.......................................... ....... 154
Oscillator Configuration .................................................... 133
Output Compare............................................................... 191
P
Packaging......................................................................... 351
Details....................................................................... 353
Marking..................................................................... 351
Peripheral Module Disable (PMD).................................... 146
Pinout I/O Descriptions (table)............................................ 17
Power-on Reset (POR)....................................................... 92
Power-Saving Features.................................................... 145
Clock Frequency and Switching ............................... 145
Program Address Space..................................................... 41
Construction ............................................................... 76
Data Access from Program Memory Using Program
Space Visibility ................................................... 79
Data Access from Program Memory Using Table Instruc-
tions.................................................................... 78
Data Access from, Address Generation ..................... 77
Memory Maps............................................................. 41
Table Read Instructions
TBLRDH............................................................. 78
TBLRDL.............................................................. 78
Visibility Operation...................................................... 79
Program Memory
Interrupt Vector........................................................... 42
Organization ............................................................... 42
Reset Vector............................................................... 42
R
Reader Response............................................................. 382
Registers
.................................................................................. 214
ACLKCON (Auxiliary Clock Divisor Control)............. 142
ALTDTRx (PWM Alternate Dead-Time).................... 207
Analog-to-Digital Base Register (ADBASE).............. 248
Analog-to-Digital Control Register (ADCON)............ 245
Analog-to-Digital Convert Pair Control Register 0
(ADCPC0)......................................................... 249
Analog-to-Digital Convert Pair Control Register 1
(ADCPC1)......................................................... 252
Analog-to-Digital Convert Pair Control Register 2
(ADCPC2)......................................................... 255
Analog-to-Digital Convert Pair Control Register 3
(ADCPC3)......................................................... 258
Analog-to-Digital Port Configuration Register (ADPCFG)
248
Analog-to-Digital Status Register (ADSTAT)............ 247
CLKDIV (Clock Divisor) ............................................ 139
CMPCPNx (Comparator Control) ............................. 263
CMPDACx (Comparator DAC Control)..................... 264
CORCON (Core Control)...................................... 34, 99
DTRx (PWMx Dead-Time)........................................ 207
FCLCONx (PWMx Fault Current-Limit Control)........ 211
I2CxCON (I2Cx Control)........................................... 226
I2CxMSK (I2Cx Slave Mode Address Mask)............ 230
I2CxSTAT (I2Cx Status)........................................... 228
ICxCON (Input Capture x Control)............................ 190
IEC0 (Interrupt Enable Control 0)............................. 110
© 2008-2012 Microchip Technology Inc. DS70318F-page 379
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
IEC1 (Interrupt Enable Control 1) .............................112
IEC3 (Interrupt Enable Control 3) .............................113
IEC4 (Interrupt Enable Control 4) .............................113
IEC5 (Interrupt Enable Control 5) .............................114
IFS0 (Interrupt Flag Status 0) ...................................103
IFS1 (Interrupt Flag Status 1) ...................................105
IFS3 (Interrupt Flag Status 3) ...................................106
IFS4 (Interrupt Flag Status 4) ...................................106
IFS5 (Interrupt Flag Status 5) ...................................107
IFS6 (Interrupt Flag Status 6) ...........................108, 115
IFS7 (Interrupt Flag Status 7) ...........................109, 116
INTCON1 (Interrupt Control 1)..................................100
INTTREG Interrupt Control and Status.....................131
IOCONx (PWMx I/O Control)....................................209
IPC0 (Interrupt Priority Control 0) .. ...........................117
IPC1 (Interrupt Priority Control 1) .. ...........................118
IPC14 (Interrupt Priority Control 14) .........................123
IPC16 (Interrupt Priority Control 16) .........................123
IPC2 (Interrupt Priority Control 2) .. ...........................119
IPC23 (Interrupt Priority Control 23) .........................124
IPC24 (Interrupt Priority Control 24) .........................125
IPC25 (Interrupt Priority Control 25) .........................126
IPC26 (Interrupt Priority Control 26) .........................127
IPC27 (Interrupt Priority Control 27) .........................128
IPC28 (Interrupt Priority Control 28) .........................129
IPC29 (Interrupt Priority Control 29) .........................130
IPC3 (Interrupt Priority Control 3) .. ...........................120
IPC4 (Interrupt Priority Control 4) .. ...........................121
IPC5 (Interrupt Priority Control 5) .. ...........................122
IPC7 (Interrupt Priority Control 7) .. ...........................122
MDC (PWM Master Duty Cycle)...............................201
NVMCON (Flash Memory Control) .............................83
NVMKEY (Nonvolatile Memory Key) ..........................84
OCxCON (Output Compare x Control) .....................193
OSCCON (Oscillator Control)...................................137
OSCTUN (Oscillator Tuning) .............................. ......141
PLLFBD (PLL Feedback Divisor)..............................140
PMD1 (Peripheral Module Disable Control 1)...........147
PMD2 (Peripheral Module Disable Control 2)...........148
PMD3 (Peripheral Module Disable Control 3)...........149
PMD4 (Peripheral Module Disable Control 4)...........149
PMD6 (Peripheral Module Disable Control 6)...........150
PMD7 (Peripheral Module Disable Control 7)...........151
PTCON (PWM Time Base Control) ..........................199
PWMCAPx (Primary PWMx Time Base Capture).....215
PWMCONx (PWMx Control).....................................202
RCON (Reset Control)................................................88
REFOCON (Reference Oscillator Control) ...............143
RPINR0 (Peripheral Pin Select Input 0)....................159
RPINR1 (Peripheral Pin Select Input 1)....................160
RPINR11 (Peripheral Pin Select Input 11)................163
RPINR18 (Peripheral Pin Select Input 18)................164
RPINR20 (Peripheral Pin Select Input 20)................165
RPINR21 (Peripheral Pin Select Input 21)................166
RPINR29 (Peripheral Pin Select Input 29)................167
RPINR3 (Peripheral Pin Select Input 3)....................161
RPINR30 (Peripheral Pin Select Input 30)................168
RPINR31 (Peripheral Pin Select Input 31)................169
RPINR32 (Peripheral Pin Select Input 32)................170
RPINR33 (Peripheral Pin Select Input 33)................171
RPINR34 (Peripheral Pin Select Input 34)................172
RPINR7 (Peripheral Pin Select Input 7)....................162
RPOR0 (Peripheral Pin Select Output 0)..................172
RPOR1 (Peripheral Pin Select Output 1)..................173
RPOR10 (Peripheral Pin Select Output 10)..............177
RPOR11 (Peripheral Pin Select Output 11) ............. 178
RPOR12 (Peripheral Pin Select Output 12) ............. 178
RPOR13 (Peripheral Pin Select Output 13) ............. 179
RPOR14 (Peripheral Pin Select Output 14) ............. 179
RPOR16 (Peripheral Pin Select Output 16) ............. 180
RPOR17 (Peripheral Pin Select Output 17) ............. 180
RPOR2 (Peripheral Pin Select Output 2) ................. 173
RPOR3 (Peripheral Pin Select Output 3) ................. 174
RPOR4 (Peripheral Pin Select Output 4) ................. 174
RPOR5 (Peripheral Pin Select Output 5) ................. 175
RPOR6 (Peripheral Pin Select Output 6) ................. 175
RPOR7 (Peripheral Pin Select Output 7) ................. 176
RPOR8 (Peripheral Pin Select Output 8) ................. 176
RPOR9 (Peripheral Pin Select Output 9) ................. 177
SEVTCMP (PWM Special Event Compare)............. 201
SPIxCON1 (SPIx Control 1) ..................................... 219
SPIxCON2 (SPIx Control 2) ..................................... 221
SPIxSTAT (SPIx Status and Control)....................... 218
SR (CPU STATUS) .................................................... 99
SR (CPU Status) ........................................................ 32
STRIGx (PWMx Secondary Trigger Compare Value) ....
213
T1CON (Timer1 Control) .......................................... 182
TRGCONx (PWMx Trigger Control) ......................... 208
TRIGx (PWMx Primary Trigger Compare Value) ..... 213
TxCON (Timer Control, x = 2)................................... 186
TyCON (Timer Control, y = 3)................................... 187
UxMODE (UARTx Mode) ......................................... 232
UxSTA (UARTx Status and Control) ........................ 234
Reset
Configuration Mismatch.............................................. 93
Illegal Opcode....................................................... 87, 93
Trap Conflict............................................................... 93
Uninitialized W Register ................................. 87, 93, 94
Reset Sequence................................................ ................. 95
Resets ................................................................................ 87
Resources Required for Digital PFC............................. 23, 26
Resources Required for Digital Phase-Shift ZVT Con verter28
Revision History................................................................ 365
S
Serial Peripheral Interface (SPI)....................................... 217
Software RESET Instruction (SWR)................................... 93
Software Simulator (MPLAB SIM) .................................... 283
Software Stack Pointer, Frame Pointer
CALL Stack Frame..................................................... 71
Special Features of the CPU............................................ 265
Symbols Used in Opcode Descriptions ............................ 274
T
Temperature and Voltage Specifications
AC..................................................................... 298, 336
Timer1 .............................................................................. 181
Timer2/3 ........................................................................... 183
Timing Diagrams
Analog-to-Digital Conversion per Input..................... 327
Brown-out Situations .................................................. 92
External Clock .......................................................... 299
High-Speed PWM..................................................... 309
High-Speed PWM Fault............................................ 309
I/O............................................................................. 302
I2Cx Bus Data (Master Mode).................................. 322
I2Cx Bus Data (Slave Mode).................................... 324
I2Cx Bus Start/Stop Bits (Master Mode)................... 322
I2Cx Bus Start/Stop Bits (Slave Mode)..................... 324
Input Capture (CAPx)............................................... 307
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 380 © 2008-2012 Microchip Technology Inc.
OC/PWM...................................................................308
Output Compare (OCx).............................................307
Reset, Watchdog Timer, Oscillator Start-up Timer and
Power-up Timer ................................................303
Timer1, 2, 3 External Clock.......................................305
Timing Requirements
External Clock...................................................299, 343
I/O .............................................................................302
Input Capture ............................................................307
SPIx Master Mode (CKE = 0)....................................337
SPIx Module Master Mode (CKE = 1).......................337
SPIx Module Slave Mode (CKE = 0).........................338
SPIx Module Slave Mode (CKE = 1).........................338
Timing Specifications
10-bit Analog-to-Digital Conversion Requirements...327
High-Speed PWM Requirements..............................309
I2Cx Bus Data Requirements (Master Mode)...........323
I2Cx Bus Data Requirements (Slave Mode).............325
Output Compare Requirements................................307
PLL Clock..........................................................300, 336
Reset, Watchdog Timer, Oscillator Start-up Timer,
Power-up Timer and Brown-out Reset
Requirements................................................... 304
Simple OC/PWM Mode Requirements............. 308, 346
Timer1 External Clock Requirements............... 305, 344
Timer2 External Clock Requirements............... 306, 345
Timer3 External Clock Requirements............... 306, 345
U
Universal Asynchronous Receiver Transmitter (UART) ... 231
Using the RCON Status Bits............................................... 94
V
Voltage Regulator (On-Chip)............................................ 268
W
Watchdog Time-out Reset (WDTO).................................... 93
Watchdog Timer (WDT)............................................ 265, 269
Programming Considerations................................... 269
WWW Address ................................................................. 381
WWW, On-Line Support..................................................... 13
© 2008-2012 Microchip Technology Inc. DS70318F-page 381
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
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documents, latest software releases and archived
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CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
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registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
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Customers should contact their distributor,
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support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this docume nt.
Technical support is available through the web site
at: http://microchip.com/support
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 382 © 2008-2012 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following info rmation, and use this outline to provide us with your comments about th is document.
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DS70318FdsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
1. What are th e best featu res of this documen t?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of th is document easy to follow? If not, why?
4. What add itions to the document do you think wo uld enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
© 2008-2012 Microchip Technology Inc. DS70318F-page 383
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Architecture: 33 = 16-bit Digital Signal Controller
Flash Memory Family: FJ = Flash program memory, 3.3V
Product Group: GS1 = Switch Mode Power Supply (SMPS) family
GS2 = Switch Mode Power Supply (SMPS) family
GS4 = Switch Mode Power Supply (SMPS) family
GS5 = Switch Mode Power Supply (SMPS) family
Pin Count: 01 = 18-pin
02 = 28-pin
04 = 44-pin
Speed 50 = 50 MIPS
Temperature Range: I = -40°C to+85°C (Industrial)
E=-40°C to+125°C (Extended)
H=-40°C to+150°C (High)
Package: PT = Plastic Thin Quad Flatpack - 10x10x1 mm body (TQFP)
ML = Plastic Quad Flat, No Lead Package - 8x8 mm body (QFN)
MM = Plastic Quad Flat, No Lead Package - 6x6x0.9 mm body (QFN-S)
SO = Plastic Small Outline - Wide - 7.50 mm body (SOIC)
SP = Skinny Plastic Dual In -Line - 300 mil body (SPDIP)
TL = Very Thin Leadless Array - 6x6 mm body (VTLA)
Examples:
a) dsPIC33FJ06GS102-E/SP:
SMPS dsPIC33, 6-Kbyte pro gram
memory, 28-pin, Extended
temperature, SPDIP package.
Microchip Trademark
Architecture
Flash Memory Family
Program Memory Size (KB)
Product Group
Pin Count
Speed (if applicable)
Package
Pattern
dsPIC 33 FJ 06 GS1 02 T - 50 E / SP - XXX
Tape and Reel Flag (if applicable)
Temperature Range
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70318F-page 384 © 2008-2012 Microchip Technology Inc.
NOTES:
© 2008-2012 Microchip Technology Inc. DS70318F-page 385
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defen d, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-61341-970-0
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Dat a
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digit al Millennium Copyright Act. If such acts
allow unauthorized access to you r software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:200 9 certif ication for its worldwide
headquarters, design and wafer fabrication facilities in Chandle r and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperi pherals, nonvola tile memo ry and
analog product s. In addition, Microchip s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS70318F-page 386 © 2008-2012 Microchip Technology Inc.
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Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Microchip:
dsPIC33FJ16GS504-E/ML dsPIC33FJ16GS504-I/PT dsPIC33FJ16GS502-E/MM dsPIC33FJ16GS504-E/PT
dsPIC33FJ16GS402-E/SP dsPIC33FJ16GS402-I/SP dsPIC33FJ16GS402-I/MM dsPIC33FJ16GS404-I/ML
dsPIC33FJ16GS404T-I/ML dsPIC33FJ16GS502-E/SP dsPIC33FJ16GS502T-I/SO dsPIC33FJ16GS402-E/SO
dsPIC33FJ16GS502-E/SO dsPIC33FJ16GS402-E/MM dsPIC33FJ16GS504-I/ML dsPIC33FJ16GS402T-I/SO
dsPIC33FJ16GS502-I/SP dsPIC33FJ16GS504T-I/ML dsPIC33FJ16GS502-I/MM dsPIC33FJ16GS404-E/ML
dsPIC33FJ16GS404-E/PT dsPIC33FJ16GS402T-I/MM dsPIC33FJ16GS502T-I/MM dsPIC33FJ16GS502-I/SO
dsPIC33FJ16GS404T-I/PT dsPIC33FJ16GS504T-I/PT dsPIC33FJ16GS504T-E/TL dsPIC33FJ16GS504T-I/TL
dsPIC33FJ16GS404T-E/TL dsPIC33FJ16GS404T-I/TL dsPIC33FJ16GS404-E/TL dsPIC33FJ16GS404-I/TL
dsPIC33FJ16GS504-E/TL dsPIC33FJ16GS504-I/TL dsPIC33FJ16GS402-50I/MM dsPIC33FJ16GS402-50I/SO
dsPIC33FJ16GS402-50I/SP dsPIC33FJ16GS402-H/MM dsPIC33FJ16GS402-H/SO dsPIC33FJ16GS402-H/SP
dsPIC33FJ16GS402T-50I/MM dsPIC33FJ16GS402T-50I/SO dsPIC33FJ16GS404-50I/ML dsPIC33FJ16GS404-50I/TL
dsPIC33FJ16GS404-H/ML dsPIC33FJ16GS404-H/PT dsPIC33FJ16GS404-H/TL dsPIC33FJ16GS404T-50I/ML
dsPIC33FJ16GS404T-50I/TL dsPIC33FJ16GS502-50I/MM dsPIC33FJ16GS502-50I/SO dsPIC33FJ16GS502-50I/SP
dsPIC33FJ16GS502-H/MM dsPIC33FJ16GS502-H/SO dsPIC33FJ16GS502-H/SP dsPIC33FJ16GS502T-50I/MM
dsPIC33FJ16GS502T-50I/SO dsPIC33FJ16GS504-50I/ML dsPIC33FJ16GS504-50I/TL dsPIC33FJ16GS504-H/ML
dsPIC33FJ16GS504-H/PT dsPIC33FJ16GS504-H/TL dsPIC33FJ16GS504T-50I/ML dsPIC33FJ16GS504T-50I/TL
dsPIC33FJ16GS404-50I/PT dsPIC33FJ16GS404T-50I/PT dsPIC33FJ16GS504-50I/PT dsPIC33FJ16GS504T-50I/PT
dsPIC33FJ06GS202A-I/SS dsPIC33FJ06GS101A-I/P dsPIC33FJ06GS102A-I/TL dsPIC33FJ06GS102A-I/SS
dsPIC33FJ06GS202A-I/SP dsPIC33FJ06GS102A-I/MM dsPIC33FJ06GS202A-I/TL dsPIC33FJ06GS102A-I/SP
dsPIC33FJ06GS101A-I/SO dsPIC33FJ06GS202A-I/SO dsPIC33FJ06GS102A-I/SO dsPIC33FJ06GS202A-I/MM
dsPIC33FJ06GS101A-I/SS dsPIC33FJ06GS101A-E/SO dsPIC33FJ06GS102A-E/SS dsPIC33FJ06GS102AT-I/SS
dsPIC33FJ06GS101A-E/P dsPIC33FJ06GS202A-E/SP dsPIC33FJ06GS102A-E/SP dsPIC33FJ06GS202AT-I/TL
dsPIC33FJ06GS102AT-E/SS dsPIC33FJ06GS202AT-I/MM dsPIC33FJ06GS202A-E/SO dsPIC33FJ06GS101AT-I/SS
dsPIC33FJ06GS101AT-I/SO dsPIC33FJ06GS102AT-E/SO dsPIC33FJ06GS202AT-E/TL dsPIC33FJ06GS102AT-I/SO
dsPIC33FJ06GS202AT-E/MM dsPIC33FJ06GS102AT-I/TL dsPIC33FJ06GS101AT-E/SS dsPIC33FJ06GS102A-E/TL