Semiconductor Components Industries, LLC, 2013
June, 2013 − Rev. 1
1Publication Order Number:
NCV8703/D
NCV8703
300 mA, Ultra-Low Quiescent
Current, IQ 12 mA, Ultra-Low
Noise, LDO Voltage Regulator
The NCV8703 is a low noise, low power consumption and low
dropout Linear Voltage Regulator. With its excellent noise and PSRR
specifications, the device is ideal for use in products utilizing RF
receivers, imaging sensors, audio processors or any component
requiring an extremely clean power supply. The NCV8703 uses an
innovative Adaptive Ground Current circuit to ensure ultra low
ground current during light load conditions.
Features
Operating Input Voltage Range: 2.0 V to 5.5 V
Available in Fixed Voltage Options: 0.8 to 3.5 V
Contact Factory for Other Voltage Options
Ultra−Low Quiescent Current of Typ. 12 mA
Ultra−Low Noise: 13 mVRMS from 100 Hz to 100 kHz
Very Low Dropout: 180 mV Typical at 300 mA
2% Accuracy Over Load/Line/Temperature
High PSRR: 68 dB at 1 kHz
Internal Soft−Start to Limit the Turn−On Inrush Current
Thermal Shutdown and Current Limit Protections
Stable with a 1 mF Ceramic Output Capacitor
Available in TSOP−5 and XDFN 1.5 x 1.5 mm Package
Active Output Discharge for Fast Turn−Off
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
Typical Applications
Satellite Radio Receivers, GPS
Rear View Camera, Electronic Mirrors, Lane Change Detectors
Portable Entertainment Systems
Other Battery Powered Applications
Figure 1. Typical Application Schematic
IN
EN
OUT
GND
NCV8703 1 mF
1 mFCOUT
VOUT
CIN
VIN
Ceramic
ON
OFF
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See detailed ordering and shipping information in the package
dimensions section on page 15 of this data sheet.
ORDERING INFORMATION
TSOP−5
SN SUFFIX
CASE 483
X, XXX = Specific Device Code
M = Date Code
A = Assembly Location
Y = Year
W = Work Week
G= Pb−Free Package
1
5
XXXAYW
G
MARKING DIAGRAMS
XDFN6
MX SUFFIX
CASE 711AE
X M
G
1
PIN CONNECTIONS
5−Pin TSOP−5
(Top View)
6−Pin XDFN 1.5 x 1.5 mm
(Top View)
OUT
N/C
N/C
IN
EN
GND
IN
EN
N/C
OUT
GND
1
1
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Figure 2. Simplified Schematic Block Diagram
IN
THERMAL
SHUTDOWN
UVLO
MOSFET
DRIVER WITH
CURRENT LIMIT
AUTO LOW
POWER MODE
INTEGRATED
SOFT−START
ACTIVE
DISCHARGE
EN
BANDGAP
REFERENCE
ENABLE
LOGIC
EN
OUT
GND
Table 1. PIN FUNCTION DESCRIPTION
Pin No.
XDFN6
Pin No.
TSOP−5
Pin
Name Description
1 5 OUT Regulated output voltage pin. A small 1 mF ceramic capacitor is needed from this pin
to ground to assure stability.
2 4 N/C Not connected.
3 2 GND Power supply ground. Connected to the die through the lead frame. Soldered to the
copper plane allows for effective heat dissipation.
4 3 EN Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V
puts the regulator into shutdown mode.
5 N/C Not connected. This pin can be tied to ground to improve thermal dissipation.
6 1 IN Input pin. A small capacitor is needed from this pin to ground to assure stability.
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) VIN −0.3 V to 6 V V
Output Voltage VOUT −0.3 V to VIN + 0.3 V V
Enable Input VEN −0.3 V to VIN + 0.3 V V
Output Short Circuit Duration tSC Indefinite s
Maximum Junction Temperature TJ(MAX) 125 C
Storage Temperature TSTG −55 to 150 C
ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V
ESD Capability, Machine Model (Note 2) ESDMM 200 V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
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Table 3. THERMAL CHARACTERISTICS (Note 3)
Rating Symbol Value Unit
Thermal Characteristics, TSOP−5,
Thermal Resistance, Junction−to−Air
Thermal Characterization Parameter, Junction−to−Lead (Pin 2)
qJA
yJL
241
129
C/W
Thermal Characteristics, XDFN6 1.5 x 1.5 mm
Thermal Resistance, Junction−to−Air
Thermal Characterization Parameter, Junction−to−Board
qJA
yJB
146
77
C/W
3. Single component mounted on 1 oz, FR4 PCB with 645 mm2 Cu area.
Table 4. ELECTRICAL CHARACTERISTICS
(−40C TJ 125C; VIN = VOUT(NOM) + 0.5 V or 2.0 V, whichever is greater; VEN = 0.9 V, IOUT = 10 mA, CIN = COUT = 1 mF unless
otherwise noted. Typical values are at TJ = +25C.) (Note 4)
Parameter Test Conditions Symbol Min Typ Max Unit
Operating Input Voltage VIN 2.0 5.5 V
Undervoltage Lock−out VIN rising UVLO 1.2 1.6 1.9 V
Output Voltage Accuracy VOUT + 0.5 V VIN 5.5 V, IOUT = 0 − 300 mA VOUT −2 +2 %
Line Regulation VOUT + 0.5 V VIN 4.5 V, IOUT = 10 mA RegLINE 450 mV/V
VOUT + 0.5 V VIN 5.5 V, IOUT = 10 mA RegLINE 600 mV/V
Load Regulation IOUT = 0 mA to 300 mA RegLOAD 20 mV/mA
Load Transient IOUT = 1 mA to 300 mA or 300 mA to 1 mA in
1 ms, COUT = 1 mF
TranLOAD −100/
+150
mV
Dropout Voltage (Note 5) IOUT = 300 mA, VOUT(nom) = 2.5 V VDO 180 300 mV
Output Current Limit VOUT = 90% VOUT(nom) ICL 310 450 750 mA
Quiescent Current IOUT = 0 mA IQ12 20 mA
Ground Current IOUT = 300 mA IGND 200 mA
Shutdown Current VEN 0.4 V, TJ = +25C IDIS 0.12 mA
VEN 0 V, VIN = 2.0 to 4.5 V, TJ = −40 to +85C IDIS 0.55 2 mA
EN Pin Threshold Voltage
High Threshold
Low Threshold
VEN Voltage Increasing
VEN Voltage Decreasing
VEN_HI
VEN_LO
0.9
0.4
V
EN Pin Input Current VEN = 5.5 V IEN 100 500 nA
Turn−On Time COUT = 1.0 mF, from assertion EN pin to 98%
VOUT(nom)
tON 200 ms
Power Supply Rejection Ratio VIN = 3 V, VOUT = 2.5 V
IOUT = 300 mA
f = 100 Hz
f = 1 kHz
f = 10 kHz
PSRR 70
68
53
dB
Output Noise Voltage VOUT = 2.5 V, VIN = 3 V, IOUT = 300 mA
f = 100 Hz to 100 kHz
VN13 mVrms
Thermal Shutdown Temperature Temperature increasing from TJ = +25C TSD 160 C
Thermal Shutdown Hysteresis Temperature falling from TSD TSDH −20 −C
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TJ = TA
= 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.5 V.
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TYPICAL CHARACTERISTICS
Figure 3. Output Voltage Noise Spectral Density for VOUT = 0.8 V, COUT = 1 mF
FREQUENCY (kHz)
100 10001010.10.01
0.001
0.01
0.1
1
10
Figure 4. Output Voltage Noise Spectral Density for VOUT = 0.8 V, COUT = 4.7 mF
Figure 5. Output Voltage Noise Spectral Density for VOUT = 3.3 V, COUT = 1 mF
OUTPUT VOLTAGE NOISE (mV/rtHz)
VIN = 2.0 V
VOUT = 0.8 V
CIN = COUT = 1 mF
MLCC, X7R,
1206 size
IOUT = 1 mA
IOUT = 10 mA
IOUT = 300 mA
1 mA 18.45 17.77
10 mA 17.18 16.43
300 mA 14.14 13.11
10 Hz − 100 kHz 100 Hz − 100 kHz
RMS Output Noise (mVRMS)
IOUT
FREQUENCY (kHz)
10001001010.10.01
0.001
0.01
0.1
1
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
VIN = 2.0 V
VOUT = 0.8 V
CIN = 1 mF
COUT = 4.7 mF
MLCC, X7R,
1206 size
IOUT = 1 mA
IOUT = 10 mA
IOUT = 300 mA 1 mA 14.07 13.14
10 mA 16.59 15.83
300 mA 15.46 14.53
10 Hz − 100 kHz 100 Hz − 100 kHz
RMS Output Noise (mVRMS)
IOUT
FREQUENCY (kHz)
10001001010.10.01
0.001
0.01
0.1
1
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
VIN = 3.8 V
VOUT = 3.3 V
CIN = COUT = 1 mF
MLCC, X7R,
1206 size
IOUT = 1 mA
IOUT = 10 mA
IOUT = 300 mA
1 mA 20.29 17.06
10 mA 19.76 16.11
300 mA 18.74 15.46
10 Hz − 100 kHz 100 Hz − 100 kHz
RMS Output Noise (mVRMS)
IOUT
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TYPICAL CHARACTERISTICS
Figure 6. Output Voltage Noise Spectral Density for VOUT = 3.3 V, COUT = 4.7 mF
FREQUENCY (kHz)
100 10001010.10.01
0.001
0.01
0.1
1
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
IOUT = 1 mA
IOUT = 10 mA
IOUT = 300 mA
1 mA 17.64 13.52
10 mA 19.54 15.96
300 mA 21.50 18.71
10 Hz − 100 kHz 100 Hz − 100 kHz
RMS Output Noise (mVRMS)
IOUT
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 4.7 mF
MLCC, X7R,
1206 size
Figure 7. Ground Current vs. Output Current Figure 8. Ground Current vs. Output Current
from 0 mA to 2 mA
Figure 9. Ground Current vs. Output Current
at Temperatures
Figure 10. Ground Current vs. Output Current
0 mA to 2 mA at Temperatures
IOUT
, OUTPUT CURRENT (mA) IOUT
, OUTPUT CURRENT (mA)
300250200150100500
0
35
105
140
210
245
315
1.751.501.251.000.750.500.250
0
20
40
60
80
120
160
IOUT
, OUTPUT CURRENT (mA) IOUT
, OUTPUT CURRENT (mA)
2702101801209060300
0
30
60
120
150
180
240
270
1.751.501.251.000.750.500.250
0
20
40
60
80
100
120
160
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
70
175
350
280
VOUT = 0.8 V
VOUT = 3.3 V
VOUT = 2.5 V
150 240 300
90
210
VIN = VOUT + 0.5 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R,
1206 size
VIN = VOUT + 0.5 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R,
1206 size
2.00
100
140
2.00
140
TJ = 25C
TJ = −40C
TJ = 125C
VIN = VOUT + 0.5 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R,
1206 size
VOUT = 0.8 V
VOUT = 3.3 V VOUT = 2.5 V
VIN = VOUT + 0.5 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R,
1206 size
TJ = 25C
TJ = −40C
TJ = 125C
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TYPICAL CHARACTERISTICS
Figure 11. Quiescent Current vs. Temperature Figure 12. Quiescent Current vs. Input Voltage
TJ, JUNCTION TEMPERATURE (C) VIN, INPUT VOLTAGE (V)
100806040200−20−40
9.0
9.5
10.0
11.0
11.5
12.5
13.5
14.0
Figure 13. Output Voltage vs. Input Voltage Figure 14. Output Voltage vs. Temperature –
0.8 V
VIN, INPUT VOLTAGE (V) TJ, JUNCTION TEMPERATURE (C)
5.04.53.52.52.01.00.50
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
100806040200−20−40
0.795
0.796
0.798
0.799
0.800
0.802
0.804
0.805
Figure 15. Output Voltage vs. Temperature –
2.5 V
Figure 16. Output Voltage vs. Temperature –
3.3 V
TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C)
120806040200−20−40
2.4965
2.4975
2.4985
2.4995
2.5005
2.5015
2.5025
2.5035
120806040200−20−40
3.2850
3.2875
3.2900
3.2925
3.2950
3.2975
3.3025
3.3050
Iq, QUIESCENT CURRENT (mA)
Iq, QUIESCENT CURRENT (mA)
VOUT
, OUTPUT VOLTAGE (V)
VOUT
, OUTPUT VOLTAGE (V)
VOUT
, OUTPUT VOLTAGE (V)
VOUT
, OUTPUT VOLTAGE (V)
120 140
0.797
0.801
0.803
VIN = 2 V
VOUT = 0.8 V
CIN = 1 mF
COUT = 1 mF
100 140
VIN = VOUT + 0.5 V
VOUT = 2.5 V
CIN = 1 mF
COUT = 1 mF
100 140
3.3000
VIN = VOUT + 0.5 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
120 140
10.5
12.0
13.0
VIN = VOUT + 0.5 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R
1206 size
VOUT = 2.5 V
VOUT = 0.8 V
VOUT = 3.3 V
1.5 3.0 4.0 5.5 6.0
CIN = 1 mF
COUT = 1 mF
MLCC, X7R
1206 size VOUT = 2.5 V
VOUT = 0.8 V
VOUT = 3.3 V
VIN, INPUT VOLTAGE (V)
65432
0
10
20
30
40
CIN = 1 mF
COUT = 1 mF
VOUT = 3.3 V
MLCC, X7R
1206 size
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TYPICAL CHARACTERISTICS
Figure 17. Line Regulation vs. Temperature −
1.8 V
Figure 18. Line Regulation vs. Temperature –
2.8 V
TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C)
1201008060200−20−40
0
100
300
400
600
700
800
1000
1201008040200−20−40
0
100
300
400
600
700
900
1000
Figure 19. Line Regulation vs. Temperature –
3.3 V
Figure 20. Load Regulation vs. Temperature –
1.8 V
TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C)
1201008060200−20−40
0
200
400
600
800
1000
1200
100806040200−20−40
0
2
6
8
10
14
18
20
Figure 21. Load Regulation vs. Temperature –
2.8 V
Figure 22. Load Regulation vs. Temperature –
3.3 V
TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C)
1201006040200−20−40
0
2
4
8
12
14
18
20
120806040200−20−40
0
2
4
6
12
14
18
20
REGLINE (mV/V)
REGLINE (mV/V)
REGLINE (mV/V)
REGLOAD (mV)
REGLOAD (mV)
REGLOAD (mV)
VOUT = 1.8 V
VIN = 2.3 to 5.5 V
CIN = 1 mF
COUT = 1 mF
IOUT = 10 mA
40 140
200
500
900
60 140
200
500
800
VOUT = 2.8 V
VIN = 3.3 to 5.5 V
CIN = 1 mF
COUT = 1 mF
IOUT = 10 mA
40 140
VOUT = 3.3 V
VIN = 3.8 to 5.5 V
CIN = 1 mF
COUT = 1 mF
IOUT = 10 mA
120 140
4
12
16
VOUT = 1.8 V
VIN = 2.3 V
CIN = 1 mF
COUT = 1 mF
IOUT = 0 mA to 300 mA
80 140
6
10
16
VOUT = 2.8 V
VIN = 3.3 V
CIN = 1 mF
COUT = 1 mF
IOUT = 0 mA to 300 mA
100 140
8
10
16
VOUT = 3.3 V
VIN = 3.8 V
CIN = 1 mF
COUT = 1 mF
IOUT = 0 mA to 300 mA
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TYPICAL CHARACTERISTICS
Figure 23. Dropout vs. Output Current – 2.5 V Figure 24. Dropout vs. Temperature – 2.5 V
IOUT
, OUTPUT CURRENT (mA) TJ, JUNCTION TEMPERATURE (C)
250200150100 300500
0
50
100
150
200
250
1401208060400−20−40
0
25
50
100
125
150
200
250
Figure 25. Enable Threshold − High Figure 26. Enable Threshold − Low
TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C)
100806040200−20−40
550
575
600
625
650
700
725
750
Figure 27. Output Current Limit Figure 28. Short Circuit Limit
TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C)
1201008040200−20−40
300
350
400
450
500
550
600
1201006040200−20−40
300
350
400
450
500
550
600
VDROP
, DROPOUT VOLTAGE (mV)
VDROP
, DROPOUT VOLTAGE (mV)
VEN, ENABLE VOLTAGE (mV)ICL, CURRENT LIMIT (mA)
ISHORT
, SHORT CIRCUIT CURRENT (mA)
TJ = 25C
TJ = −40C
TJ = 125C
VOUT = 2.5 V
CIN = 1 mF
COUT = 1 mF
VOUT = 2.5 V
CIN = 1 mF
COUT = 1 mF
IOUT = 300 mA
IOUT = 200 mA
IOUT = 100 mA
10020
75
175
225
120 140
675
VOUT = 3.3 V
VIN = 3.8 V
CIN = 1 mF
COUT = 1 mF
IOUT = 10 mA
100806040200−20−40
550
575
600
625
650
700
725
750
VEN, ENABLE VOLTAGE (mV)
120 140
675
VOUT = 3.3 V
VIN = 3.8 V
CIN = 1 mF
COUT = 1 mF
IOUT = 10 mA
60 140
VIN = 2.3 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R,
size 1206
80 140
VIN = 2.3 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R,
size 1206
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TYPICAL CHARACTERISTICS
Figure 29. Power Supply Rejection Ratio,
VOUT = 1.8 V
Figure 30. Power Supply Rejection Ratio,
VOUT = 2.5 V
Figure 31. Power Supply Rejection Ratio,
VOUT = 3.3 V
Figure 32. Power Supply Rejection Ratio,
VOUT = 3.3 V, IOUT = 10 mA
Figure 33. Power Supply Rejection Ratio,
VOUT = 3.3 V, IOUT = 300 mA
Figure 34. Output Capacitor ESR vs. Output
Current
IOUT
, OUTPUT CURRENT (mA)
300250200150100500
0.1
1
10
ESR (W)
VIN = 5.5 V
CIN = COUT = 1 mF
MLCC, X7R, 1206 size
Unstable Region
Stable Region
VOUT = 0.8 V
VOUT = 3.3 V
F, FREQUENCY (kHz) F, FREQUENCY (kHz)
10,00010001001010.10.01
0
10
30
40
50
70
80
100
10,00010001001010.10.01
0
10
30
40
60
70
90
100
F, FREQUENCY (kHz) F, FREQUENCY (kHz)
10,00010001001010.10.01
0
10
30
40
50
70
80
100
10,00010001001010.10.01
0
10
30
40
60
70
90
100
F, FREQUENCY (kHz)
10,00010001001010.10.01
0
10
30
40
60
70
80
100
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
20
50
90
VIN = 3.8 V
VOUT = 3.3 V
CIN = none
MLCC, X7R,
1206 size
Cout = 1mF
Cout = 4.7m
Cout = 10m
20
50
80
VIN = 3.8 V
VOUT = 3.3 V
CIN = none
MLCC, X7R,
1206 size
Cout = 1mF
Cout = 4.7m
Cout = 10m
20
60
90 Iout = 1 mA
Iout = 10 mA
Iout = 100 mA
Iout = 200 mA
Iout = 300 mA
VIN = 2.3 V
VOUT = 1.8 V
CIN = none
COUT = 1 mF
MLCC, X7R,
1206 size
20
50
80
Iout = 1 mA
Iout = 10 mA
Iout = 100 mA
Iout = 200 mA
Iout = 300 mA
VIN = 3.0 V
VOUT = 2.5 V
CIN = none
COUT = 1 mF
MLCC, X7R,
1206 size
Iout = 1 mA
Iout = 10 mA
Iout = 100 mA
Iout = 200 mA
Iout = 300 mA
VIN = 3.8 V
VOUT = 3.3 V
CIN = none
COUT = 1 mF
MLCC, X7R,
1206 size
20
60
90
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TYPICAL CHARACTERISTICS
VIN = 3.8 V
VOUT = 3.3 V
VEN = 0.9 V
IOUT = 10 mA
CIN = 1 mF
Figure 35. Enable Turn−on Response −
COUT = 1 mF
Figure 36. Enable Turn−on Response –
COUT = 4.7 mF
Figure 37. Enable Turn−on Response –
COUT = 10 mF
Figure 38. Enable Turn−off Response
Figure 39. Line Transient Response – Rising
Edge, VOUT = 3.3 V
Figure 40. Line Transient Response – Falling
Edge, VOUT = 3.3 V
VIN = 3.8 V to 4.8 V
VOUT = 3.3 V
IOUT = 10 mA
CIN = 1 mF
COUT = 1 mF
VIN = 3.8 V
VOUT = 3.3 V
VEN = 0.9 V
IOUT = 10 mA
CIN = 1 mF
COUT = 1 mF
1 V / div 600 mV / div
100 ms / div
VOUT
VEN
IINRUSH
100 mA / div
1 V / div 600 mV / div
VIN = 3.8 V
VOUT = 3.3 V
VEN = 0.9 V
IOUT = 10 mA
CIN = 1 mF
COUT = 1 mF
VOUT
VEN
IINRUSH
VIN = 3.8 V
VOUT = 3.3 V
VEN = 0.9 V
IOUT = 10 mA
CIN = 1 mF
COUT = 4.7 mF
100 ms / div
100 mA / div
100 ms / div
1 V / div 600 mV / div
VOUT
VEN
IINRUSH
100 mA / div
1 V / div 600 mV / div
1 ms / div
VOUT
VEN
IOUT
COUT = 4.7 mF
COUT = 1 mF
2 ms / div
20 mV / div 500 mV / div
VOUT
VIN
tFALL = 1 ms
20 mV / div 500 mV / div
2 ms / div
VOUT
VIN
trise = 1 ms
VIN = 3.8 V to 4.8 V
VOUT = 3.3 V
IOUT = 10 mA
CIN = 1 mF
COUT = 1 mF
100 mA / div
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TYPICAL CHARACTERISTICS
Figure 41. Load Transient Response − Rising
Edge, VOUT = 0.8 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
Figure 42. Load Transient Response – Falling
Edge, VOUT = 0.8 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
Figure 43. Load Transient Response − Rising
Edge, VOUT = 0.8 V, IOUT = 1 mA to 300 mA,
tRISE = 1 ms, 10 ms
Figure 44. Load Transient Response – Rising
Edge, VOUT = 3.3 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
Figure 45. Load Transient Response – Falling
Edge, VOUT = 3.3 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
Figure 46. Load Transient Response – Rising
Edge, VOUT = 3.3 V, IOUT = 1 mA to 300 mA,
tRISE = 1 ms, 10 ms
40 mV / div 100 mA / div
40 mV / div 100 mA / div
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
Cout = 1 mF (MLCC)
10 ms / div
trise = 10 ms
trise = 1 ms
50 ms / div
40 mV / div 100 mA / div
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
VOUT
IOUT
40 mV / div 100 mA / div
VOUT
IOUT
VOUT
IOUT
20 ms / div
20 ms / div
COUT = 4.7 mF
COUT = 1 mF
40 mV / div 100 mA / div
10 ms / div
40 mV / div 100 mA / div
VOUT
IOUT
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 4.7 mF
COUT = 1 mF
VOUT
IOUT
50 ms / div
COUT = 4.7 mF
COUT = 1 mF
VIN = 2 V
VOUT = 0.8 V
CIN = 1 mF (MLCC)
trise = 10 ms
trise = 1 ms
VIN = 2 V
VOUT = 0.8 V
CIN = 1 mF (MLCC)
Cout = 1 mF (MLCC)
VOUT
IOUT
VIN = 2 V
VOUT = 0.8 V
CIN = 1 mF (MLCC)
COUT = 4.7 mF
COUT = 1 mF
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TYPICAL CHARACTERISTICS
Figure 47. Turn−on/off − Slow Rising VIN Figure 48. Short Circuit and Thermal
Shutdown
600 mV / div
5 ms / div
VOUT = 3.3 V
IOUT = 1 mA
CIN = 1 mF (MLCC)
Cout = 1 mF (MLCC)
VOUT
VIN
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
Cout = 1 mF (MLCC)
10 ms / div
300 mA / div 300 mV / div
VOUT
IOUT
Short Circuit
Thermal Shutdown
APPLICATIONS INFORMATION
General
The NCV8703 is a high performance 300 mA Low
Dropout Linear Regulator. This device delivers excellent
noise and dynamic performance. Thanks to its adaptive
ground current feature the device consumes only 12 mA of
quiescent current at no−load condition. The regulator
features ultra−low noise of 13 mVRMS, PSRR of 68 dB at
1 kHz and very good load/line transient performance. Such
excellent dynamic parameters and small package size make
the device an ideal choice for powering the precision analog
and noise sensitive circuitry in portable applications. The
LDO achieves this ultra low noise level output without the
need for a noise bypass capacitor. A logic EN input provides
ON/OFF control of the output voltage. When the EN is low the
device consumes as low as typ. 120 nA from the IN pin. The
device is fully protected in case of output overload, output
short circuit condition and overheating, assuring a very
robust design.
Input Capacitor Selection (CIN)
It is recommended to connect a minimum of 1 mF Ceramic
X5R or X7R capacitor close to the IN pin of the device. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the min. /max. ESR of the input
capacitor but it is recommended to use ceramic capacitors
for their low ESR and ESL. A good input capacitor will limit
the influence of input trace inductance and source resistance
during sudden load current changes. Larger input capacitor
may be necessary if fast and large load transients are
encountered in the application.
Output Decoupling (COUT)
The NCV8703 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCV8703 is designed to
remain stable with minimum effective capacitance of 0.1 mF
to account for changes with temperature, DC bias and
package size. Especially for small package size capacitors
such as 0402 the effective capacitance drops rapidly with the
applied DC bias. Refer to the Figure 49, for the capacitance
vs. package size and DC bias voltage dependence.
Figure 49. Capacitance Change vs. DC Bias
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 900 m. Larger
NCV8703
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13
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR as shown in
typical characteristics. It is not recommended to use
tantalum capacitors on the output due to their large ESR. The
equivalent series resistance of tantalum capacitors is also
strongly dependent on the temperature, increasing at low
temperature. The tantalum capacitors are generally more
costly than ceramic capacitors.
No−load Operation
The regulator remains stable and regulates the output
voltage properly within the 2% tolerance limits even with
no external load applied to the output.
Enable Operation
The EN pin is used to enable/disable the LDO and to
deactivate/activate the active discharge function.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The
active discharge transistor is active so that the output voltage
VOUT is pulled to GND through a 320 resistor. In the
disable state the device consumes as low as typ. 120 nA from
the VIN.
If the EN pin voltage >0.9 V the device is guaranteed to
be enabled. The NCV8703 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 110 nA which assures that the device is
turned−off when the EN pin is not connected. Build in 2 mV
hysteresis into the EN prevents from periodic on/off
oscillations that can occur due to noise.
In the case where the EN function isn’t required the EN
should be tied directly to IN.
Undervoltage Lockout
The internal UVLO circuitry assures that the device
becomes disabled when the VIN falls below typ. 1.5 V. When
the VIN voltage ramps−up the NCV8703 becomes enabled,
if VIN rises above typ. 1.6 V. The 100 mV hysteresis prevents
from on/off oscillations that can occur due to noise on VIN
line.
Output Current Limit
Output Current is internally limited within the IC to a
typical 490 mA. The NCV8703 will source this amount of
current measured when the output voltage drops on the 90%
of the nominal VOUT. When the Output Voltage is directly
shorted to ground (VOUT = 0 V), the short circuit protection
will limit the output current to 520 mA (typ). The current
limit and short circuit protection will work properly up to
VIN = 5.5 V at TA = 25C. There is no limitation for the short
circuit duration.
Internal Soft−Start circuit
NCV8703 contains an internal soft−start circuitry to
protect against large inrush currents which could otherwise
flow during the start−up of the regulator. Soft−start feature
protects against power bus disturbances and assures a
controlled and monotonic rise of the output voltage.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD − 160C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU − 140C typical).
Once the IC temperature falls below the 140C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCV8703 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCV8703 can
handle is given by:
PD(MAX) +ƪTJ(MAX) *TAƫ
qJA
(eq. 1)
The power dissipated by the NCV8703 for given
application conditions can be calculated from the following
equations:
PD[VINǒIGND@IOUTǓ)IOUTǒVIN *VOUTǓ(eq. 2)
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0.20
0.25
0.30
0.35
0.40
0.45
0.50
150
200
250
300
350
400
450
0 100 200 300 400 500 600 700
Figure 50. qJA and PD(MAX) vs. Copper Area (TSOP−5)
qJA, Junction to Ambient
Thermal Resistance (C/W)
PCB Copper Area (mm2)
PD(MAX), Maximum Power
Dissipation (W)
qJA, 2 OZ Cu
qJA, 1 OZ Cu
PD(MAX), TA = 25C, 1 OZ Cu
PD(MAX), TA = 25C, 2 OZ Cu
0.30
0.40
0.50
0.60
0.70
0.80
0.90
100
150
200
250
300
350
400
0 100 200 300 400 500 600 700 800
Figure 51. qJA vs. Copper Area (XDFN6)
qJA, Junction to Ambient
Thermal Resistance (C/W)
PCB Copper Area (mm2)
PD(MAX), Maximum Power
Dissipation (W)
qJA, 2 OZ Cu
qJA, 1 OZ Cu
PD(MAX), TA = 25C, 1 OZ Cu
PD(MAX), TA = 25C, 2 OZ Cu
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
Load Regulation
The NCV8703 features very good load regulation of
typically 6 mV in 0 mA to 300 mA range. In order to achieve
this very good load regulation a special attention to PCB
design is necessary. The trace resistance from the OUT pin
to the point of load can easily approach 100 m which will
cause 30 mV voltage drop at full load current, deteriorating
the excellent load regulation.
Line Regulation
The IC features very good line regulation of 0.6 mV/V
measured from VIN = VOUT + 0.5 V to 5.5 V. For battery
operated applications it may be important that the line
regulation from VIN = VOUT + 0.5 V up to 4.5 V is only
0.45 mV/V.
Power Supply Rejection Ratio
The NCV8703 features very good Power Supply
Rejection ratio. If desired the PSRR at higher frequencies in
the range 100 kHz – 10 MHz can be tuned by the selection
of COUT capacitor and proper PCB layout.
Output Noise
The IC is designed for ultra−low noise output voltage
without external noise filter capacitor (Cnr). Figures 3 − 6
shows NCV8703 noise performance. Generally the noise
performance in the indicated frequency range improves with
increasing output current.
Although even at IOUT = 1 mA the noise levels are below
20 mVRMS.
Turn−On Time
The turn−on time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT(NOM), COUT, TA.
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PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from Equation 2.
ORDERING INFORMATION
Device* Voltage Option Marking Package Shipping†
NCV8703MX18TCG 1.8 V J
XDFN6 3000 / Tape & Reel
NCV8703MX28TCG 2.8 V K
NCV8703MX30TCG 3.0 V L
NCV8703MX33TCG 3.3 V P
NCV8703SN18T1G 1.8 V VEC
TSOP5 3000 / Tape & Reel
NCV8703SN28T1G 2.8 V VED
NCV8703SN30T1G 3.0 V VEE
NCV8703SN33T1G 3.3 V VEF
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
NCV8703
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PACKAGE DIMENSIONS
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.10 AND 0.20mm FROM TERMINAL TIP.
C
A
SEATING
PLANE
D
E
0.10 C
A3
A1
2X
2X 0.10 C
XDFN6 1.5x1.5, 0.5P
CASE 711AE
ISSUE A
DIM
A
MIN MAX
MILLIMETERS
0.35 0.45
A1 0.00 0.05
A3 0.13 REF
b0.20 0.30
D
E
e
L
PIN ONE
REFERENCE
0.05 C
0.05 C
A0.10 C
NOTE 3
L2
e
b
B
3
6
6X
1
4
0.05 C
MOUNTING FOOTPRINT*
L1
1.50 BSC
1.50 BSC
0.50 BSC
0.40 0.60
--- 0.15
BOTTOM VIEW
L
5X
DIMENSIONS: MILLIMETERS
0.73
6X 0.35
5X
1.80
0.50
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
ÉÉ
ÉÉ
ÉÉ
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL B
DETAIL A
L2 0.50 0.70
TOP VIEW
B
SIDE VIEW RECOMMENDED
0.83
A
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PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM MIN MAX
MILLIMETERS
A3.00 BSC
B1.50 BSC
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
M0 10
S2.50 3.00
123
54 S
A
G
B
D
H
C
J
__
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
CSEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
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PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NCV8703/D
LITERATURE FULFILLMENT:
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P.O. Box 5163, Denver, Colorado 80217 USA
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