DATA SH EET
Product specification
Supersedes data of 2000 Jun 06 2000 Dec 04
DISCRETE SEMICONDUCTORS
BGA2022
MMIC mixer
dbook, halfpage
MBD128
2000 Dec 04 2
NXP Semiconductors Product specification
MMIC mixer BGA2022
FEATURES
Large frequenc y range:
– Cellular band (900 MHz)
– PCS band (1900 MHz)
– WLAN band (2.4 GHz)
High isolation
High linearity
High conversion ga in.
APPLICATIONS
Receiver s ide of wireless systems
that require high conversion gain and
high linearity at low supply c urrent,
such as CDMA.
DESCRIPTION
Silicon double poly MMIC mixer in a
6-lead SOT363 plastic package.
PINNING
PIN DESCRIPTION
1 LO - GND
2 LO - signal
3V
S
4IF - out
5 RF - feedback
6 RF - signal
handbook, 4 columns IF-outRF-feedbackRF-signal
456
VS
LO-GND LO-signal
312
BIAS
CONTROL
MBL255
123
654
Top view
Fig.1 Simplified outline (SOT3 63 ) and symbol.
Marking code : A2p.
QUICK REFERENCE DATA
VS= 2.8 V; IS=6mA; P
LO =0dBm; f
RF =1800MHz; f
LO =2080MHz; f
IF =280MHz.
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
Gconv conversion gain 4 6 8 dB
NF noise figure (DSB) 12 dB
IP3output third order intercept point 7dBm
CAUTION
This product is supplied in anti-s tatic packing to prevent damage caused by electrostatic discharge during trans port
and handling.
2000 Dec 04 3
NXP Semiconductors Product specification
MMIC mixer BGA2022
LIMITING VALUES
In accordance with the Absolute Maximum Ra ting System (IEC 60134).
Notes
1. LO and RF signals always AC coupled; 50 source; no external DC voltage supplied to pins 1, 2 and 6.
2. Ts is the temperature at the soldering point of the ground tab.
THERMAL CHARACTE RISTI CS
CHARACTERISTICS
VS= 2.8 V; IS=6mA; T
j=25C; unles s oth erwise specified.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VSsupply voltage 4V
ISsupply current 10 mA
PLO oscillator po wer note 1 10 dBm
PRF RF power note 1 10 dBm
Ptot total power dissipation Ts100 C; note 2 40 mW
Tstg storage temperature 65 +150 C
Tjjunction temperature 150 C
SYMBOL PARAMETER VALUE UNIT
Rth j-s thermal resistance from junction to solder point 375 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
ISsupply current VS=2.8V 468mA
Gconv(p) power conversion gain PRF =25 dBm; PLO =0dBm
880 MHz 5dB
1800MHz 468dB
1950MHz 5dB
2450MHz 6dB
NF noise figure DSB
880 MHz 9dB
1800MHz 12 dB
1950MHz 9dB
2450MHz 9dB
IP3intercept point third order input output referred
880 MHz 4dBm
1800MHz 7dBm
1950MHz 7dBm
2450MHz 10 dBm
VSWRLO return losses at LO port PLO =0dBm; f=0to3GHz 2:1
2000 Dec 04 4
NXP Semiconductors Product specification
MMIC mixer BGA2022
APPLICATION INFORMATION
See applicatio n note number AN0005 9.
List of components (see Fig.2)
COMPONENT APPLICATION BOARD
880 MHz
(IF = 80 MHz) 1800 MHz
(IF = 280 MHz) 1950MHz
(IF = 80 MHz) 2450MHz
(IF = 280 MHz)
R1 1.2 k2.7 k2.2 k3.3 k
R2 22 22 22 18
C1 12 pF 1.2 pF 1.5 pF 1.0 pF
C2 390pF 5.6pF 1.5nF 82pF
C3, C4 39 pF 6.8 pF 6.8 pF 2.7 pF
C5 27pF 2pF 15pF 2.2pF
C6 100 pF 100 pF 10 pF 100 pF
C7 22 nF 22 nF 22 nF 22 nF
C8 56 pF 8.2 pF 10 pF 6.8 pF
L1 10 nH 2.7 nH 2.7 nH 1.8 nH
L2 220 nH 110 nH 150 nH 220 nH
L3 470 nH 120 nH 120 nH
handbook, full pagewidth
MGT575
IF output
BGA2022
IF-outRF-feedbackRF-signal
C2 L1 C1 C5 L3 C6
R1 L2
C7
C8
R2
C3C4
456
VS
LO-GND LO-signal 312
LO input
RF input
Vsupply
BIAS
CONTROL
Fig.2 Application diagra m.
2000 Dec 04 5
NXP Semiconductors Product specification
MMIC mixer BGA2022
handbook, halfpage
0 1000 2000 3000
400
300
100
0
200
−200
−150
−50
0
−100
MGT576
f (MHz)
RRF
(Ω)jX
(Ω)
jX
R
Fig.3 RF input impedance as a function of
frequency; typical values.
ZS=Z
L=50; VS= 2.8 V; PRF =25dBm; T
amb =25C.
handbook, halfpage
6000 200 400 500100 300
104
103
102
10
MGT577
f (MHz)
ZIF
(Ω)
−jX
R
Fig.4 IF output impedance as a function
frequency; typical values.
ZS=Z
L=50; AC coupled; no signal; Tamb =25C.
handbook, halfpage
−20 5
8
−4
0
4
6
−2
2
MGT578
−15 −10 −50
GC
(dB)
PLO (dBm)
Fig.5 Conversion gain as a fu nc tion of oscillator
power; typical values.
ZS=Z
L=50; VS= 2.8 V; PRF = 0 dBm; f = 1800 MHz;
Tamb =25C.
handbook, halfpage
05
10
0
2
MGT579
4
6
8
1234
IS
(mA)
VS (V)
Fig.6 Supply current as a function of the supply
voltage; typical values.
ZS=Z
L=50; AC coupled; no signal; Tamb =25C.
2000 Dec 04 6
NXP Semiconductors Product specification
MMIC mixer BGA2022
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT363 SC-88
wBM
bp
D
e1
e
pin 1
index A
A1
Lp
Q
detail X
HE
E
vMA
AB
y
0 1 2 mm
scale
c
X
132
456
Plastic surface-mounted package; 6 leads SOT363
UNIT A1
max bpcDEe1HELpQywv
mm 0.1 0.30
0.20 2.2
1.8
0.25
0.10 1.35
1.15 0.65
e
1.3 2.2
2.0 0.2 0.10.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15 0.25
0.15
A
1.1
0.8
04-11-08
06-03-16
2000 Dec 04 7
NXP Semiconductors Product specification
MMIC mixer BGA2022
DATA SHEET STATUS
Notes
1. Please consult the most rec ently issued document befor e initiating or completing a design.
2. The product s tatus of device(s ) described in this do cument may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS(1) PRODUCT
STATUS(2) DEFINITION
Objective data sheet Development This document contains data from the objective specification for produc t
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the pr oduct specification.
DEFINITIONS
Product specification The information and da ta
provided in a Product data she et shall define the
specification of the product as agreed between NXP
Semiconductors and its custo m er, unless NXP
Semiconductors and cus to mer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which th e NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and reliable.
However, NXP Semiconduc tors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or conseq uential
damages (including - without limitation - lost profits, lost
savings, busin es s inte rru ption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and prod uct descriptions, at any time and
without notice. This document supersedes and replaces all
information su pplied prior to the publication hereof.
Suitability for use NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critic al sys tems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to res ult in personal inj ur y, de ath or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductor s pr od ucts in such equipment or
application s and therefor e such inclusion and /or use is at
the customer’s own risk.
Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors pro du ct is su itable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and opera ting safeguards to minimi ze the risks
associated with their ap plications and produ cts.
2000 Dec 04 8
NXP Semiconductors Product specification
MMIC mixer BGA2022
NXP Semiconductors does not accept any liability related
to any default, damage, cost s or problem which is based
on any weakness or default in the customer’s applications
or products, or the applic ation or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semic on ductors produc ts in or der to
avoid a default of the app lications and the products or of
the application or use by cust omer’s third party
customer(s). NXP does not accept any liability in this
respect.
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operat ion of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Terms and conditions of commercial sale NXP
Semiconductors products are sold subje ct to the general
terms and conditio ns of commercial sale, as published at
http://www.nxp.com/profile/terms, unless other wise
agreed in a valid written individual agre eme n t. I n cas e an
individual agreeme nt is co nc luded only the terms and
conditions of the resp ective agreement shall apply. NXP
Semiconductors hereby expressly objects to applyi ng the
customer’s general terms and conditions with regard to the
purchase of NXP Semicon ductors produc ts by customer.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for accepta nc e or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick refer ence data The Quick reference data is an
extract of th e product data given in the Li miting values and
Characteristics sections of this document, and as su ch is
not complete, exhaus tive or legally binding.
Non-automotive qualified products Unless this data
sheet expressly states that this specific NXP
Semiconductors product is au tomotive qualified, the
product is not suitable fo r automotive use. It is neither
qualified nor te sted in accorda nce with automot ive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified prod ucts in automotive equip m en t or
applications.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for suc h aut omo tive application s, us e and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use sha ll be solely at
customer’s own ris k, an d (c) customer fully inde mnifies
NXP Semiconductors for an y liability, damages or failed
product clai ms r esult ing fr om cus to mer d esi gn an d us e of
the product for automotive ap plic ations beyond NXP
Semiconductors ’ st andard warranty and NXP
Semiconductors’ product specifications.
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Contact information
For additional information p lease visit: http://www.nxp.com
For sales offices addr esses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in th is do cum en t d oes not fo rm p ar t o f an y q uot ation or co ntract, is believed to b e a ccur ate a nd re liable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other ind us trial or intellectual property rights.
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimer s. No cha ng es were made to the technical content, except for package outline
drawings which were updated to the latest version.
Printed in The Netherlands R77/06/pp9 Date of release: 2000 Dec 04
