TL/F/6436
54LS670/DM54LS670/DM74LS670 TRI-STATE 4-by-4 Register Files
June 1989
54LS670/DM54LS670/DM74LS670
TRI-STATEÉ4-by-4 Register Files
General Description
These register files are organized as 4 words of 4 bits each,
and separate on-chip decoding is provided for addressing
the four word locations to either write-in or retrieve data.
This permits writing into one location, and reading from an-
other word location, simultaneously.
Four data inputs are available to supply the word to be
stored. Location of the word is determined by the write se-
lect inputs A and B, in conjunction with a write-enable sig-
nal. Data applied at the inputs should be in its true form.
That is, if a high level signal is desired from the output, a
high level is applied at the data input for that particular bit
location. The latch inputs are arranged so that new data will
be accepted only if both internal address gate inputs are
high. When this condition exists, data at the D input is trans-
ferred to the latch output. When the write-enable input, GW,
is high, the data inputs are inhibited and their levels can
cause no change in the information stored in the internal
latches. When the read-enable input, GR, is high, the data
outputs are inhibited and go into the high impedance state.
The individual address lines permit direct acquisition of data
stored in any four of the latches. Four individual decoding
gates are used to complete the address for reading a word.
When the read address is made in conjunction with the
read-enable signal, the word appears at the four outputs.
This arrangementÐdata entry addressing separate from
data read addressing and individual sense line Ð eliminates
recovery times, permits simultaneous reading and writing,
and is limited in speed only by the write time (27 ns typical)
and the read time (24 ns typical). The register file has a non-
volatile readout in that data is not lost when addressed.
All inputs (except read enable and write enable) are buff-
ered to lower the drive requirements to one normal Series
54LS/74LS load, and input clamping diodes minimize
switching transients to simplify system design. High speed,
double ended AND-OR-INVERT gates are employed for the
read-address function and have high sink current, TRI-
STATE outputs. Up to 128 of these outputs may be wire-
AND connected for increasing the capacity up to 512 words.
Any number of these registers may be paralleled to provide
n-bit word length.
Features
YAlternate Military/Aerospace device (54LS670) is avail-
able. Contact a National Semiconductor Sales Office/
Distributor for specifications.
YFor use as:
Scratch pad memory
Buffer storage between processors
Bit storage in fast multiplication designs
YSeparate read/write addressing permits simultaneous
reading and writing
YOrganized as 4 words of 4 bits
YExpandable to 512 words of n-bits
YTRI-STATE versions of DM54LS170/DM74LS170
YFast access times 20 ns typ
Connection Diagram
Dual-In-Line Package
TL/F/64361
Order Number 54LS670DMQB, 54LS670FMQB,
54LS670LMQB, DM54LS670J, DM54LS670W,
DM74LS670M or DM74LS670N
See NS Package Number E20A,
J16A, M16A, N16A or W16A
Function Tables
WRITE TABLE (SEE NOTES A, B, AND C)
Write Inputs Word
WBWAGW0123
LLLQ
e
DQ
0Q
0Q
0
LHL Q
0Q
e
DQ
0Q
0
HLL Q
0Q
0Q
e
DQ
0
HHL Q
0Q
0Q
0Q
e
D
XXH Q
0Q
0Q
0Q
0
READ TABLE (SEE NOTES A AND D)
Read Inputs Outputs
RBRAGRQ1 Q2 Q3 Q4
L L L WOB1 WOB2 WOB3 WOB4
L H L W1B1 W1B2 W1B3 W1B4
H L L W2B1 W2B2 W2B3 W2B4
H H L W3B1 W3B2 W3B3 W3B4
XXH Z Z Z Z
Note A: HeHigh Level, L eLow Level, X eDon’t Care, Z eHigh
Impedance (Off).
Note B: (Q eD) eThe four selected internal flip-flop outputs will assume
the states applied to the four external data inputs.
Note C: Q0eThe level of Q before the indicated input conditions were
established.
Note D: WOB1 eThe first bit of word 0, etc.
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
Absolute Maximum Ratings (Note)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage 7V
Input Voltage 7V
Operating Free Air Temperature Range
DM54LS and 54LS b55§Ctoa
125§C
DM74LS 0§Ctoa
70§C
Storage Temperature Range b65§Ctoa
150§C
Note:
The ‘‘Absolute Maximum Ratings’’ are those values
beyond which the safety of the device cannot be guaran-
teed. The device should not be operated at these limits. The
parametric values defined in the ‘‘Electrical Characteristics’’
table are not guaranteed at the absolute maximum ratings.
The ‘‘Recommended Operating Conditions’’ table will define
the conditions for actual device operation.
Recommended Operating Conditions
Symbol Parameter DM54LS670 DM74LS670 Units
Min Nom Max Min Nom Max
VCC Supply Voltage 4.5 5 5.5 4.75 5 5.25 V
VIH High Level Input Voltage 2 2 V
VIL Low Level Input Voltage 0.7 0.8 V
IOH High Level Output Current b1b2.6 mA
IOL Low Level Output Current 12 24 mA
tWWrite Enable Pulse Width 25 25 ns
(Note 3)
tSU Setup Time Data 10 10 ns
(Notes1&3) W
A
,W
B15 15
tHHold Time Data 15 15 ns
(Notes1&3) W
A
,W
B55
t
LATCH Latch Time for New Data 25 25 ns
(Notes2&3)
T
AFree Air Operating b55 125 0 70 §C
Temperature
Note 1: Times are with respect to the Write-Enable input. Write-Select time will protect the data written into the previous address. If protection of data in the
previous address, tSETUP (WA,W
B
) can be ignored. As any address selection sustained for the final 30 ns of the Write-Enable pulse and during tH(WA,W
B
) will
result in data being written into that location. Depending on the duration of the input conditions, one or a number of previous addresses may have been written into.
Note 2: Latch time is the time allowed for the internal output of the latch to assume the state of new data. This is important only when attempting to read from a
location immediately after that location has received new data.
Note 3: TAe25§C and VCC e5V.
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units
(Note 1)
VIInput Clamp Voltage VCC eMin, IIeb
18 mA b1.5 V
VOH High Level Output Voltage VCC eMin, IOH eMax 2.4 3.4 V
VIL eMax, VIH eMin
VOL Low Level Output Voltage VCC eMin, IOL eMax DM54 0.25 0.4 V
IOL eMax, VIH eMin DM74 0.34 0.5
IIInput Current @Max VCC eMax D, R or W 0.1
Input Voltage VIe7V GW0.2 mA
GR0.3
IIH High Level Input Current VCC eMax D, R or W 20
VIe2.7V GW40 mA
GR60
2
Electrical Characteristics
over recommended operating free air temperature (unless otherwise noted) (Continued)
Symbol Parameter Conditions Min Typ Max Units
(Note 1)
IIL Low Level Input Current VCC eMax D, R, or W b0.4
VIe0.4V GWb0.8 mA
GRb1.2
IOZH Off-State Output Current VCC eMax, VOe2.7V
with High Level Output VIH eMin, VIL eMax 20 mA
Voltage Applied
IOZL Off-State Output Current VCC eMax, VOe0.4V
with Low Level Output VIH eMin, VIL eMax b20 mA
Voltage Applied
IOS Short Circuit VCC eMax DM54 b20 b100 mA
Output Current (Note 2) DM74 b20 b100
ICC Supply Current VCC eMax (Note 3) 30 50 mA
Switching Characteristics at VCC e5V and TAe25§C (See Section 1 for Test Waveforms and Output Load)
RLe667X
Symbol Parameter From (Input) CLe45 pF CLe150 pF Units
To (Output)
Min Max Min Max
tPLH Propagation Delay Time Read Select 40 50 ns
Low to High Level Output to Q
tPHL Propagation Delay Time Read Select 45 55 ns
High to Low Level Output to Q
tPLH Propagation Delay Time Write Enable 45 55 ns
Low to High Level Output to Q
tPHL Propagation Delay Time Write Enable 50 60 ns
High to Low Level Output to Q
tPLH Propagation Delay Time Data 45 55 ns
Low to High Level Output to Q
tPHL Propagation Delay Time Data 40 50 ns
High to Low Level Output to Q
tPZH Output Enable Time Read Enable 35 45 ns
to High Level Output to Any Q
tPZL Output Enable Time Read Enable 40 50 ns
to Low Level Output to Any Q
tPHZ Output Disable Time from Read Enable 50 ns
High Level Output (Note 4) to Any Q
tPLZ Output Disable Time from Read Enable 35 ns
Low Level Output (Note 4) to Any Q
Note 1: All typicals are at VCC e5V, TAe25§C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
Note 3: ICC is measured with 4.5V applied to all DATA inputs and both ENABLE inputs, all ADDRESS inputs are grounded and all outputs are open.
Note 4: CLe5 pF.
3
Logic Diagram
TL/F/64362
4
5
Physical Dimensions inches (millimeters)
Ceramic Leadless Chip Carrier Package (E)
Order Number 54LS670LMQB
NS Package Number E20A
16-Lead Ceramic Dual-In-Line Package (J)
Order Number 54LS670DMQB or DM54LS670J
NS Package Number J16A
6
Physical Dimensions inches (millimeters) (Continued)
16-Lead Small Outline Molded Package (M)
Order Number DM74LS670M
NS Package Number M16A
16-Lead Molded Dual-In-Line Package (N)
Order Number DM74LS670N
NS Package Number N16E
7
54LS670/DM54LS670/DM74LS670 TRI-STATE 4-by-4 Register Files
Physical Dimensions inches (millimeters) (Continued)
16-Lead Ceramic Flat Package (J)
Order Number 54LS670FMQB or DM54LS670W
NS Package Number W16A
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