TLV2450, TLV2451, TLV2452, TLV2453, TLV2454, TLV2455, TLV245xA
FAMILY OF 23-µA 220-kHz RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS218B – DECEMBER 1998 – REVISED JUNE 1999
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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Supply Current...23 µA/Channel
D
Gain-Bandwidth Product...220 kHz
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Output Drive Capability...±10 mA
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Input Offset Voltage ...20 µV (typ)
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VDD Range...2.7 V to 6 V
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Power Supply Rejection Ratio...106 dB
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Ultra-Low Power Shutdown Mode
IDD . . . 16 nA/ch
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Rail-To-Rail Input/Output (RRIO)
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Ultra-Small Packaging
– 5 or 6 Pin SOT-23 (TLV2450/1)
– 8 or 10 Pin MSOP (TLV2452/3)
description
The TLV245x is a family of rail-to-rail input/output operational amplifiers that set a new performance point for
supply current and ac performance. These devices consume a mere 23 µA/channel while of fering 220 kHz of
gain bandwidth product; much higher than competitive devices with similar supply current levels. Along with
increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of
older micropower rail-to-rail input/output operational amplifiers. The TLV245x can swing to within 250 mV of
each supply rail while driving a 2.5-mA load. Both the inputs and outputs swing rail-to-rail for increased dynamic
range in low-voltage applications. This performance makes the TLV245x family ideal for portable medical
equipment, patient monitoring systems, and data acquisition circuits.
Three members of the family (TLV2450/3/5) offer a shutdown terminal for conserving battery life in portable
applications. During shutdown, the outputs are placed in a high-impedance state and the amplifier consumes
only 16 nA/channel. The family is fully specified at 3 V and 5 V across an expanded industrial temperature range
(–40°C to 125°C). The singles and duals are available in the SOT23 and MSOP packages, while the quads are
available in TSSOP. The TL V2450 offers an amplifier with shutdown functionality all in a 6-pin SOT23 package,
making it perfect for high density circuits.
FAMILY PACKAGE TABLE
NUMBER OF PACKAGE TYPES
UNIVERSAL
CHANNELS PDIP SOIC SOT-23 TSSOP MSOP
EVM BOARD
TLV2450 1 8 8 6‡— — Yes UNIV-OPAMP–2
TLV2451 1 8 8 5 — — — UNIV-OPAMP–1
TLV2452 2 8 8 — — 8 — UNIV-OPAMP–1
TLV2453 2 14 14 — — 10 Yes UNIV-OPAMP–2
TLV2454 4 14 14 — 14 — — —
TLV2455 4 16 16 — 16 — Yes —
‡This device is in the Product Preview stage of development. Contact your local TI sales office for availability.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
This document contains information on products in more than one phase
of development. The status of each device is indicated on the page(s)
specifying its electrical characteristics.
Copyright 1999, Texas Instruments Incorporated
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2
4
6
(TOP VIEW)
1
OUT
GND
IN+
VDD+
IN–
TLV2450
DBV† PACKAGE
5SHDN
†This device is in the Product Preview
stage of development. Please contact
your local TI sales office for availability.