1
Motorola Small–Signal Transistors, FETs and Diodes Device Data
This PNP Silicon Epitaxial transistor is designed for use in audio amplifier
applications. The device is housed in the SOT-223 package which is designed for
medium power surface mount applications.
•High Current: 1.5 Amps
•NPN Complement is BCP56
•The SOT-223 Package can be soldered using wave or reflow. The formed leads
absorb thermal stress during soldering, eliminating the possibility of damage to
the die
•Available in 12 mm Tape and Reel
Use BCP53T1 to order the 7 inch/1000 unit reel.
Use BCP53T3 to order the 13 inch/4000 unit reel.
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating Symbol Value Unit
Collector-Emitter Voltage VCEO –80 Vdc
Collector-Base Voltage VCBO –100 Vdc
Emitter-Base Voltage VEBO –5.0 Vdc
Collector Current IC1.5 Adc
Total Power Dissipation @ TA = 25°C(1)
Derate above 25°CPD1.5
12 Watts
mW/°C
Operating and Storage Temperature Range TJ, Tstg –65 to 150 °C
DEVICE MARKING
AH
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance — Junction-to-Ambient (surface mounted) RθJA 83.3 °C/W
Lead Temperature for Soldering, 0.0625″ from case
Time in Solder Bath TL260
10 °C
Sec
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Order this document
by BCP53T1/D
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1996
MEDIUM POWER
PNP SILICON
HIGH CURRENT
TRANSISTOR
SURFACE MOUNT
Motorola Preferred Device
CASE 318E-04, STYLE 1
TO-261AA
123
4
COLLECTOR 2,4
BASE
1
EMITTER 3
REV 1
BCP53T1
2 Motorola Small–Signal Transistors, FETs and Diodes Device Data
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristics Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector-Base Breakdown Voltage (IC = –100 µAdc, IE = 0) V(BR)CBO –100 — — Vdc
Collector-Emitter Breakdown Voltage (IC = –1.0 mAdc, IB = 0) V(BR)CEO –80 — — Vdc
Collector-Emitter Breakdown Voltage (IC = –100 µAdc, RBE = 1.0 kohm) V(BR)CER –100 — — Vdc
Emitter-Base Breakdown Voltage (IE = –10 µAdc, IC = 0) V(BR)EBO –5.0 — — Vdc
Collector-Base Cutoff Current (VCB = –30 Vdc, IE = 0) ICBO — — –100 nAdc
Emitter-Base Cutoff Current (VEB = –5.0 Vdc, IC = 0) IEBO — — –10 µAdc
ON CHARACTERISTICS
DC Current Gain
(IC = –5.0 mAdc, VCE = –2.0 Vdc)
(IC = –150 mAdc, VCE = –2.0 Vdc)
(IC = –500 mAdc, VCE = –2.0 Vdc)
hFE 25
40
25
—
—
—
—
250
—
—
Collector-Emitter Saturation Voltage (IC = –500 mAdc, IB = –50 mAdc) VCE(sat) — — –0.5 Vdc
Base-Emitter On Voltage (IC = –500 mAdc, VCE = –2.0 Vdc) VBE(on) — — –1.0 Vdc
DYNAMIC CHARACTERISTICS
Current-Gain — Bandwidth Product
(IC = –10 mAdc, VCE = –5.0 Vdc, f = 35 MHz) fT— 50 — MHz
TYPICAL ELECTRICAL CHARACTERISTICS
500
200
100
50
201 3 5 10 30 50 100 300 500 1000
IC, COLLECTOR CURRENT (mA)
h , DC CURRENT GAIN
FE
Figure 1. DC Current Gain
IC, COLLECTOR CURRENT (mA)
f , CURRENT GAIN BANDWIDTH PRODUCT (MHz)
T
Figure 2. Current Gain Bandwidth Product
1000
1 10 100
500
300
100
20
50
IC, COLLECTOR CURRENT (mA)
V, VOLTAGE (VOLTS)
Figure 3. Saturation and “ON” Voltages
1000
1
1
0.8
0.6
0.4
0
0.2
10010
120
110
100
90
80
70
60
50
40
30
20
10
02018161412108642
0V, VOLTAGE (VOLTS)
Figure 4. Capacitances
C, CAPACITANCE (pF)
VCE = 2 V
VCE = 2 V
V(BE)sat @ IC/IB = 10
V(BE)on @ VCE = 2 V
V(CE)sat @ IC/IB = 10
Cib
Cob
BCP53T1
3
Motorola Small–Signal Transistors, FETs and Diodes Device Data
INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE
POWER DISSIPATION
The power dissipation of the SOT-223 is a function of the
input pad size. These can vary from the minimum pad size
for soldering to the pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction tempera-
ture of the die, RθJA, the thermal resistance from the device
junction to ambient; and the operating temperature, TA.
Using the values provided on the data sheet for the SOT -223
package, PD can be calculated as follows.
PD = TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T A of 25°C, one can
calculate the power dissipation of the device which in this
case is 1.5 watts.
PD = 150°C – 25°C
83.3°C/W = 1.5 watts
The 83.3°C/W for the SOT-223 package assumes the
recommended collector pad area of 965 sq. mils on a glass
epoxy printed circuit board to achieve a power dissipation of
1.5 watts. If space is at a premium, a more realistic
approach is to use the device at a PD of 833 mW using the
footprint shown. Using a board material such as Thermal
Clad, a power dissipation of 1.6 watts can be achieved using
the same footprint.
MOUNTING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
•Always preheat the device.
•The delta temperature between the preheat and
soldering should be 100°C or less.*
•When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
•The soldering temperature and time should not exceed
260°C for more than 10 seconds.
•When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
•After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
•Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.079
2.0
0.15
3.8
0.248
6.3
0.079
2.0
0.059
1.5 0.059
1.5 0.059
1.5
0.091
2.3
mm
inches
0.091
2.3
SOT–223
BCP53T1
4 Motorola Small–Signal Transistors, FETs and Diodes Device Data
PACKAGE DIMENSIONS
TO-261AA
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
H
S
F
A
B
D
G
L
4
1 2 3
0.08 (0003)
C
MK
J
DIM
AMIN MAX MIN MAX
MILLIMETERS
0.249 0.263 6.30 6.70
INCHES
B0.130 0.145 3.30 3.70
C0.060 0.068 1.50 1.75
D0.024 0.035 0.60 0.89
F0.115 0.126 2.90 3.20
G0.087 0.094 2.20 2.40
H0.0008 0.0040 0.020 0.100
J0.009 0.014 0.24 0.35
K0.060 0.078 1.50 2.00
L0.033 0.041 0.85 1.05
M0 10 0 10
S0.264 0.287 6.70 7.30
_ _ _ _
CASE 318E–04
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “T ypicals” must be validated for each customer application by customer’s technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of
the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such
unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
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BCP53T1/D
*BCP53T1/D*
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