DR1050-100-R - EATON - Datasheet.Directory

Technical Data 4139 Effective April 2016

Supersedes March 2007

DR1050

Shielded power inductors

Description

• Shielded drum core

• Inductance range from 0.7 μH to 1000 μH

• Current range from 0.43 A to 13.5 A

• 10.5 mm x 10.3 mm footprint surface mount

package in a 5.0 mm height

• Ferrite core material

• Halogen free, lead free, RoHS compliant

Applications

• LED/LCD backlighting

• High definition televisions (HDTV)

• Server and desktop power supplies

• Graphics cards and battery powered systems

• Point-of-load (POL) modules

• Printers and peripherals

• Portable electronics

Environmental Data

• Storage temperature range (Component):

-40 °C to +125 °C

• Operating temperature range: -40 °C to +125 °C

(ambient plus self-temperature rise)

• Solder reflow temperature: J-STD-020D

compliant

HALOGEN

FREE

Technical Data 4139

Effective April 2016

DR1050

Shielded power inductors

www.eaton.com/elx

Product Specifications

Part Number5

OCL1

(μH) ±30%

Irms

(A)

Isat

(A)

DCR (mΩ)

typical

@ 20°C

DCR (mΩ)

maximum

@ 20°C K-factor4

DR1050-R80-R 0.70 9.70 13.5 3.2 4.0 20.47

DR1050-1R5-R 1.37 8.60 10.5 4.0 5.0 14.62

DR1050-2R2-R 2.27 7.52 9.3 5.6 6.8 11.37

DR1050-3R3-R 3.21 6.50 8.2 8.0 10 9.30

DR1050-4R7-R 4.43 6.13 6.7 10 12 7.87

DR1050-6R8-R 6.30 5.45 5.8 13 17 6.82

DR1050-8R2-R 8.09 5.24 5.0 15 19 6.02

DR1050-100-R 10.1 4.80 4.6 18 23 5.39

DR1050-120-R 11.6 3.94 4.1 24 30 4.87

DR1050-150-R 14.8 3.80 3.7 26 33 4.45

DR1050-180-R 17.5 3.39 3.3 33 41 4.09

DR1050-220-R 23.5 3.12 3.0 39 48 3.53

DR1050-270-R 26.9 2.82 2.8 43 53 3.30

DR1050-330-R 34.3 2.56 2.5 58 72 2.92

DR1050-390-R 38.3 2.35 2.35 61 76 2.77

DR1050-470-R 47.1 2.06 2.10 89 111 2.50

DR1050-560-R 56.7 1.96 1.94 98 123 2.27

DR1050-680-R 67.2 1.84 1.70 111 139 2.09

DR1050-820-R 84.4 1.60 1.58 147 184 1.86

DR1050-101-R 97.5 1.52 1.45 164 205 1.73

DR1050-121-R 118 1.30 1.30 223 279 1.57

DR1050-151-R 149 1.26 1.15 238 298 1.40

DR1050-181-R 184 1.18 1.08 273 341 1.26

DR1050-221-R 222 1.00 0.98 377 472 1.15

DR1050-271-R 264 0.96 0.90 410 513 1.06

DR1050-331-R 321 0.83 0.80 554 693 0.96

DR1050-391-R 397 0.76 0.72 648 810 0.86

DR1050-471-R 481 0.64 0.62 855 1069 0.78

DR1050-561-R 573 0.62 0.60 970 1213 0.72

DR1050-681-R 708 0.56 0.55 1095 1369 0.64

DR1050-821-R 819 0.54 0.50 1185 1481 0.60

DR1050-102-R 1000 0.43 0.48 1528 1950 0.54

1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C

2. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents.

PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the

temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating

conditions verified in the end application.

3. Isat: Peak current for approximately 35% rolloff @ +25 °C

4. K-factor: K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (mT),

K: (K-factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps).

5. Part Number Definition: DR1050-xxx-R

DR1050 = Product code and size

-xxx= inductance value in μH, R= decimal point,

If no R is present then last character equals number of zeros

-R suffix = RoHS compliant

Technical Data 4139

Effective April 2016

DR1050

Shielded power inductors

www.eaton.com/elx

Dimensions (mm)

Part marking: inductance value in uH. R = decimal point. If no R is present then last character equals number of zeroes.

wwlly = date code, R = revision level

Do not route traces or vias underneath the inductor

Packaging information (mm)

Supplied in tape and reel packaging , 500 parts per 13” diameter reel

Technical Data 4139

Effective April 2016

DR1050

Shielded power inductors

www.eaton.com/elx

Temperature rise vs. total loss

100

120

140

160

0.00.2 0.40.6 0.81.0 1.2

Temperature Rise (°C)

Total Loss (W)

1MHz 500kHz

300kHz

200kHz

100kHz

0.001

0.01

0.1

0001001011

Bp-p (mT)

Core Loss (W)

Core loss vs. Bp-p

Technical Data 4139

Effective April 2016

DR1050

Shielded power inductors

www.eaton.com/elx

Inductance characteristics

20%

40%

60%

80%

100%

120%

0% 20% 40% 60% 80% 100% 120

% of OCL

% of I

sat

% of OCL vs. % of I

sat

-40 °C

+25 °C

+85 °C

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/elx

Printed in USA

Publication No. 4139

April 2016

Eaton is a registered trademark.

All other trademarks are property

of their respective owners.

DR1050

Shielded power inductors

Technical Data 4139

Effective April 2016

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Temperature

TC -5°C

Time 25°C to Peak Time

°C

Tsmin

Tsmax

Preheat

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Solder reflow profile

Reference JDEC J-STD-020D

Profile Feature Standard SnPb Solder Lead (Pb) Free Solder

Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

• Temperature max. (Tsmax) 150°C 200°C

• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds

Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.

Liquidous temperature (Tl)

Time at liquidous (tL)

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (TP)* Table 1 Table 2

Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**

Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.

Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Table 1 - Standard SnPb Solder (Tc)

Package

Thickness

Volume

mm3

<350

Volume

mm3

≥350

<2.5mm) 235°C 220°C

≥2.5mm 220°C 220°C

Table 2 - Lead (Pb) Free Solder (Tc)

Package

Thickness

Volume

mm3

<350

Volume

mm3

350 - 2000

Volume

mm3

>2000

<1.6mm 260°C 260°C 260°C

1.6 – 2.5mm 260°C 250°C 245°C

>2.5mm 250°C 245°C 245°C