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FEATURES
DSupports PCI, PCI−X 1.0 and PCI−X 2.0 Slots
DInternal Power Switches for −12 V, 12 V, 3.3 V
Aux
DControl for Power FETs for 5 V, 3.3 V, and
VIO
DOverload Protection on All Supplies
DCurrent Regulation on 3.3 V, 5 V and VIO
Supplies
DSoft Start to Minimize Inrush Current
DProgrammable Slew Rate for 3.3 V, 5 V, 12 V,
VIO and Vaux Supplies
DDirect Control of All Functions
DVIO Selection Based on Card Type
D80-Lead PowerPadt HTSSOP Package
DNarrow Package that Fits Between PCI Slots
APPLICATIONS
DHot Plug Slots in Servers
DESCRIPTION
Each TPS2343 contains main supply power
control, auxiliary supply power control, power
FETs for 12-V, −12-V and auxiliary 3.3-V supplies,
VIO control, and digital control for two slots.
The main power control circuits start with all
supplies off and all outputs are held off until
PGOOD is asserted, indicating that system
supplies are valid. Then, when power enable is
asserted, the control circuit applies constant
current to the gates of the power FETs, allowing
each FET to ramp load voltage linearly. Each
supply can be programmed for a desired ramp
rate by selecting the appropriate gate capacitor.
The TPS2343 monitors load current and regulates
peak current to prevent disturbances to the
system power rails. If load current remains
regulated for longer than 5 ms, that slot is latched
off.
Logic inputs to the TPS2343 access all functions
of the TPS2343. All status information from the
TPS2343 is available on logic outputs.
SIMPLIFIED APPLICATION DIAGRAM
PCI-X 2.0 SLOT PCI-X 2.0 SLOT
12V3.3VAUX
TPS2343
−12V
CONTROL
LOGIC
CONTROL 12V 3.3VAUX−12V
5 V 3.3 V 1.5 V
VIO
5 V3.3 V1.5 V
VIO
! " #$%! " &$'(#! )!%
)$#!" # ! "&%##!" &% !*% !%" %+" "!$%!"
"!)) ,!- )$#! &#%"". )%" ! %#%""(- #($)%
!%"!. (( &%!%"
Copyright 2005, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPadt is a trademark of Texas Instruments Incorporated.
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DESCRIPTION (CONT.)
Auxiliary power control circuits switch, ramp, and monitor 3.3-V auxiliary power to each slot and control data
switches that connect slot power management event (PME) outputs to the main PME bus after auxiliary supply
is ramped. PME is disconnected when a board is turned off or a fault occurs on the board’s auxiliary power. A
fault on auxiliary power also shuts off main power to that board.
VIO control consists of gate drivers to select between 3.3 V and 1.5 V in response to command and current
limiting circuitry to shut down a slot in the event of over current. Each TPS2343 contains power FETs for 12 V,
−12 V, and auxiliary 3.3 V for two slots. These power FETs are short-circuit protected, slew rate controlled, and
over-temperature protected.
The TPS2343 includes novel current limiting circuitry that limits instantaneous peak current and only shuts off
the slot if the current remains out of spec for an extended time.
ORDERING INFORMATION
TA
PACKAGE(1)
T
AHTSSOP (DDP)
−40°C to +85°C TPS2343DDP
(1) Add suffix R to device type (e.g. TPS2343DDPR) to specify taped and reeled.
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SIMPLIFIED BLOCK DIAGRAM
3 23VAUXI
To Slot B
+
2.2 V
SQ
QR
AUX FAULT
LATCH
2.5 ms
Turn−Off Delay
+
3VAUXA
10 ms
Turn−On Delay
77 PMEA
OVERCURRENT SENSE
63 P12VGA
+
+
665VSA
67
5VISA
SQ
QR
MAIN
FAULT
LATCH
Thermal
Shutdown
64 P12VINA
62 P12VOA
60 M12VOA
61 M12VINA
OVER−
CURRENT
SENSE
43
42
10
PWRGND1
59
ANAGND2
40
DIGVCC 41
DIGGND1
2.9 V
71
PWRGND2
ALEDENA
47SWA
23
ANAGND1
25
DIGGND2
+
743VSA
753VISA
68VIOSA
69VIOISA
70
733VIOGA
15VIOGA
1 3VAUXGA
56
DIGGND3
Slot A shown
Slot B is identical
+
54 FAULTA
53
48PWRENA
PLEDENA
50PCIXCAPA
45
46
PWRLEDA
ATTLEDA
PCIXCAP
Decoder
57
55
51
PCIXCAP1A
PCIXCAP2A
PCIXCAP3A
To Logic
AUXFLTA
78
PMEOA
65
5VGA
22MISET
100
mAI−limit
threshold
763VGA
44VIOSELA
49 PWROFFA
52 OUTUVAP12VOA
5VISA
3VISA
VIOIS
OUTPUTS
LOW
M12VOA
P12VOA
5VISA
3VISA
OUTPUT
UV
In this drawing, circuits related to many functions are oversimplified. See the Application Section of the data
sheet for a more detailed representations of these functions.
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted){}
PARAMETER TPS2343 UNIT
Input voltage range, P12VIN −0.5 to 15
M12VIN −15.0 to 0.5
All others −0.5 to 7
V
Output voltage range, P12VO, 5VG, 3VG, 15VIOG, 3VIOG −0.5 t o V P12VIN + 0.5 V
P12VG −0.5 to 28
M12VO −15 to 0.5
Output current, FAULT, OUTUV, PWROFF 50 mA
Output current pulse, P12VO (dc internally limited) 3
M12VO 0.8 A
3VAUX 2
A
Operating junction temperature range, TJ−40 to 100
Storage temperature range, Tstg −65 to 150 °C
Lead temperature soldering 1.6 mm (1/16 inch) from case for 10 seconds 260
C
†Stresses beyond those listed under ”absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under ”recommended operating conditions” is not
implied. Exposure to Absolute Maximum Rated conditions for extended periods may affect device reliability
‡All voltages are with respect to DIGGND.
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
TEST METHOD MIN UNIT
Human body model (HBM) 2 kV
Charged device model (CDM) 1 kV
RECOMMENDED OPERATING CONDITIONS
PARAMETER MIN TYP MAX UNIT
Input supply, M12VINA, M12VINB −10.8 −12 −13.2
P12VINA, P12VINB 10.8 12 13.2
V
DIGVCC, 3VAUXI 3.0 3.3 3.6 V
V5IN 4.75 5.00 5.25
Load current, PWRLEDA, PWRLEDB, ATTLEDA, ATTLEDB 0 24
P12VOA, P12VOB 0 1100
mA
M12VOA, M12VOB 0 −100 mA
3VAUXA, 3VAUXB 0 375
THERMAL SHUTDOWN
PARAMETER TYP UNIT
Junction temperature shutdown 150 °C
Junction temperature − cooldown restart 140 °C
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DISSIPATION RATING TABLE
PACKAGE TATHERMAL RESISTANCE
JUNCTION T O CASE ΘJC
THERMAL RESISTANCE
JUNCTION TO AMBIENT
(NOTE 1) ΘJA
THERMAL RESISTANCE
JUNCTION TO AMBIENT
(NOTE 2) ΘJA
HTSSOP−80 (DDP) −40 _C to 85 _C1.4 _C/W 23 _C/W 32 _C/W
Note 1: Thermal resistance measured using an 8-layer PC board following the layout recommendations in TI Publication PowerPAD Thermally
Enhanced Package Technical Brief SLMA002.
Note 2: Thermal resistance measured using an 8-layer PC board using only top PC board copper to spread the heat.
SERIAL MODE PINOUT
DIGVCC 40
PLEDENB 39
ALEDENB 38
PCIXCAP2B 26
FAULTB 27
AUXFLTB 28
M12VOB 21
MISET 22
ANAGND1 23
PCIXCAP1B 24
DIGGND2 25
5VGB 16
P12VINB 17
P12VGB 18
P12VOB 19
M12VINB 20
15VIOGB 11
VIOISB 12
VIOSB 13
5VISB 14
5VSB 15
3VAUXGA 1
3VAUXA 2
3VAUXI 3
3VAUXGB 4
3VAUXB 5
3VGB 6
3VISB 7
3VSB 8
3VIOGB 9
PWRGND1 10 71 PWRGND2
72 V5IN
73 3VIOGA
74 3VSA
75 3VISA
76 3VGA
77 PMEA
78 PMEOA
79 PMEOB
80 PMEB
70 15VIOGA
69 VIOISA
68 VIOSA
67 5VISA
66 5VSA
43 ALEDENA
42 PLEDENA
41 DIGGND1
64 P12VINA
63 P12VGA
62 P12VOA
61 M12VINA
60 M12VOA
59 ANAGND2
58 PGOOD
57 PCIXCAP1A
56 DIGGND3
55 PCIXCAP2A
54 FAULTA
53 AUXFLTA
65 5VGA
OUTUVB 29
VIOSELB 37
PWRLEDB 36
ATTLEDB 35
SWB 34
PWRENB 33
PWROFFB 32
PCIXCAP3B 30
PCIXCAPB 31
52 OUTUVA
44 VIOSELA
51 PCIXCAP3A
50 PCIXCAPA
49 PWROFFA
48 PWRENA
47 SWA
46 ATTLEDA
45 PWRLEDA
HTSSOP-80 DDP Package (Top View)
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ELECTRICAL CHARACTERISTICS,
P12VIN = 12 V, DIGVCC = 3.3 V, M12VIN = −12 V, 3VAUXIN = 3.3 V, V5IN = 5 V, RMISET = 6.04 kΩ, all outputs
unloaded, TA = −40_C to 85_C, (unless otherwise noted) (1)(2)(3)
5-V Main Supply
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
5VS−5VIS overcurrent threshold (5 V) 43 53 63 mV
5VIS voltage fault threshold 4.25 4.5 4.75 V
5VS input bias current PWREN = high −100 100
A
5VIS input bias current PWREN = high 100 250 400 µA
5VIS bleed current PWREN = low, 5VIS = 5V 8 60 mA
5VG charge current PWREN = high, 5VG = 5 V −70 −100 −130 µA
5VG discharge resistance 0.1 V < V5VG < 0.5 V 1.5 4 15 Ω
5VG good threshold 11 11.5 12 V
V5IN supply current 2 6 mA
5VIS low comparator threshold PWREN = low 0.075 0.100 0.150 V
3.3-V Main Supply
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
3VS−3VIS overcurrent threshold (3.3 V) 48 63 76 mV
3VIS voltage fault threshold 2.5 2.7 2.9 V
3VS input bias current PWREN = high −100 100
A
3VIS input bias current PWREN = high 100 290 400 µA
3VIS bleed current PWREN = low, 3VIS = 3.3 V 8 40 mA
3VG charge current PWREN = high, 3VG = 5 V −70 −100 −130 µA
3VG discharge resistance 0.1 V < V3VG < 0.5 V 1.5 4 15 Ω
DIGVCC supply current 1.2 3 mA
3VIS low comparator threshold PWREN = low 0.075 0.100 0.150 V
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ELECTRICAL CHARACTERISTICS,
P12VIN = 12 V, DIGVCC = 3.3 V, M12VIN = −12 V, 3VAUXIN = 3.3 V, V5IN = 5 V, RMISET = 6.04 kΩ, all outputs
unloaded, TA = −40_C to 85_C, (unless otherwise noted) (1)(2)(3)
12-V Main Supply
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
12-V internal switch on resistance
TA = TJ = 25_C, P12VG > 18 V 0.18 0.30
Ω
12-V internal switch on resistance TA = −40 _C to 85 _C, P12VG > 18 V 0.4 Ω
12-V overcurrent threshold 1.25 1.50 1.75 A
P12VIN supply current, outputs off PWREN = low 1.8 3 mA
P12VG gate good threshold 17.5 19.0 20.5
V
P12VO fault threshold After P12VG and 5V3VG good 9.75 10.15 10.45 V
P12VG gate charge current PWREN = high −5 −10 −20 µA
P12VG gate discharge resistance 0.1 V < VP12VG < 0.5V 1.5 4 15 Ω
Turn-on time
PWREN = high to P12VO = 11.4 V,
CP12VG = 22 nF 28 55
ms
Turn-on time PWREN = high to P12VO = 11.4 V,
CP12VG = 0 nF 0.5 2.0 ms
Turn-off time PWREN = low to P12VO low comparator
trip, CP12VG = 22 nF 1.5 3.5 µs
P12VO bleed current PWREN = low, P12VO = 12 V 8 20 mA
P12VO low comparator threshold PWREN = low 0.075 0.100 0.150 V
P12VO turn-on slew rate CP12VG = 0 pF, 10% to 90% measurement 2 V/ms
−12-V Main Supply
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
−12-V internal switch on-resistance
TA = TJ = 25_C, steady state 0.50 0.75
Ω
−12-V internal switch on-resistance TA = −40 _C to 85 _C, steady state 0.9 Ω
−12-V overcurrent threshold 0.15 0.20 0.25 A
M12VIN supply current, outputs off PWREN = low 1000 2000 µA
M12VO turn-on slew rate(4) CP12VG = 22 nF, 10% to 90% measurement 0.30 0.68 1.10 V/ms
Turn-on time CP12VG = 22 n F, PWREN = high to M12VO =
−10.4 V, RL = 120 Ω 12 18 37 ms
Turn-off time PWREN = low to M12VO low comparator trip 1.5 3.5 µs
M12VO bleed current PWREN = low, M12VO = −12 V −8 −20 mA
M12VO low comparator threshold PWREN = low −0.075 −0.100 −0.150 V
NOTES: (1). All voltages are with respect to DIGGND unless otherwise stated.
(2) Currents are positive into and negative out of the specified terminal.
(3) When references to lines of individual slots are given without the slot identifier, the statement applies to lines on each slot.
(4) −12-V main supply turn on is controlled by the +12-V main supply turn on, so the –12-V main supply slew rate is a function of CP12VG.
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ELECTRICAL CHARACTERISTICS,
P12VIN = 12 V, DIGVCC = 3.3 V, M12VIN = −12 V, 3VAUXIN = 3.3 V, V5IN = 5 V, RMISET = 6.04 kΩ, all outputs
unloaded, TA = −40_C to 85_C, (unless otherwise noted) (1)(2)(3)
VIO Supply
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
15VG, 3VIOG output voltage high 11.5 11.9 V
VIOS – VIOIS overcurrent threshold
(1.5 V operation) 20.0 23.5 27.0 mV
15VIOG, 3VIOG turn-off resistance PWREN = low, 0.1 V < VVIOG,
VVIOG < 0.5 V 10 50 100 Ω
VIOS input bias current PWREN = high, VIOSEL = low, test circuit
Figure 7 −100 20 100
A
VIOIS input bias current PWREN = high, VIOSEL = low, test circuit
Figure 7 −100 20 200 µA
VIOIS bleed current PWREN = low, VIOIS =1.5 V 8 20 mA
VIOIS low comparator threshold PWREN = low 0.075 0.100 0.150
VIOIS fault threshold 1.275 1.325 1.375 V
15VIOG low voltage PWREN = low 0.1 1.0
V
15VIOG, 3VIOG gate charge current 7 10 13 µA
Power Fault Response
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Overcurrent fault detection time
12 V 2 6.5
Overcurrent fault detection time −12 V, i = 250 mA 4 12 µs
Overcurrent response time to regulate 5 V, 3.3 V, Vio 1 3
µs
Overcurrent fault detection time 5 V, 3.3 V, Vio 3 8 ms
Overcurrent fault clearing time 5 V, 3.3 V, Vio 50 150 µs
NOTES: (1) All voltages are with respect to DIGGND unless otherwise stated.
(2) Currents are positive into and negative out of the specified terminal.
(3) When references to lines of individual slots are given without the slot identifier, the statement applies to lines on each slot.
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ELECTRICAL CHARACTERISTICS,
P12VIN = 12 V, DIGVCC = 3.3 V, M12VIN = −12 V, 3VAUXIN = 3.3 V, V5IN = 5 V, RMISET = 6.04 kΩ, all outputs
unloaded, TA = −40_C to 85_C, (unless otherwise noted) (1)(2)(3)
3.3 VAUX and PME
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
3VAUX overcurrent threshold 0.8 1.1 1.45 A
3VAUXI to 3VAUX switch on resistance SW = low, 3VAUXG = 10 V 300 400 mΩ
3VAUXI undervoltage threshold SW = low 1.9 2.2 2.9 V
3VAUXI supply current, 3VAUX off SW = high 1000 2000
A
3VAUXG turn-on current SW = low, 3VAUXG = 3.3 V −3 −5 −7 µA
3VAUXG turn-off resistance SW = high, 0.1 V < 3VAUXG < 0.5 V 3 8 30 Ω
3VAUX turn-on time with no gate capacitor C3VAUXG = 0 pF, 10% to 90% measurement 200 350 µs
3VAUX turn-on slew rate with gate capacitor C3VAUXG = 22 n F, 10% to 90% measurement 0.13 0.23 0.32 V/ms
3VAUX bleed current SW = high, 3VAUX = 3.0 V 8 28 mA
3VAUX turn-off time from SW From SW > 2.0 V to 3VAUX < 0.5 V,
C3VAUXG = 22 nF 1.2 5.0 ms
3VAUX turn-off time from Fault From 3VAUX overcurrent fault 17 25 µs
PME turn-on time from 3VAUX From 3VAUX > 3.0 V, C3VAUX = 150 µF 6 10 17 ms
PME turn-off time from SW From SW > 2.0 V 4
s
PME turn-off time from Fault From 3VAUX overcurrent fault 4µs
PME switch on resistance SW = low 10 20 Ω
3VAUX output rising threshold to PME switch
closed 2.5 3.0 V
DC Logic Characteristics
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input high voltage (all digital inputs) 2.0
Input low voltage (all digital inputs) 0.8
Input hysteresis (PGOOD) 0.15 0.60
Output high voltage (all push-pull outputs) IL = 4 mA 2.4 2.8 V
Output low voltage (ATTLED, PWRLED)
IL = 8 mA 0.5
V
Output low voltage (ATTLED, PWRLED)IL = 24 mA 0.4 0.8
Output low voltage (all other outputs) IL = 4 mA 0.2 0.5
Input pull-up resistor impedance For inputs with pull-up resistors (see pin de-
scriptions) 30 200 kΩ
PCIXCAP threshold between 33 MHz and 533
MHz 0.3 0.4 0.5
PCIXCAP threshold between 533 MHz and 266
MHz 1.1 1.2 1.3
V
PCIXCAP threshold between 266 MHz and 66
MHz 1.95 2.05 2.15 V
PCIXCAP threshold between 66 MHz and 133
MHz 2.8 2.9 3.0
NOTES: (1). All voltages are with respect to DIGGND unless otherwise stated.
(2) Currents are positive into and negative out of the specified terminal.
(3) When references to lines of individual slots are given without the slot identifier, the statement applies to lines on each slot.
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TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NUMBER NAME
I/O
DESCRIPTION
1 3VAUXGA I/O This pin is connected to the gate of the slot A 3VAUX internal power FET. Connect a capacitor from
this pin to PWRGND to program the slot A 3VAUX ramp rate. The recommended capacitor value is
22 nF for 0.23 V/ms ramp rate.
2 3VAUXA O This output supplies 3VAUX power to slot A when enabled and is pulled low by an internal FET
when there is a fault on slot A 3VAUX or when SWA is opened.
3 3VAUXI I Connect this power input to 3.3 V power to drive 3VAUX loads. Connect a 0.1-µF capacitor from
this pin to PWRGND.
4 3VAUXGB I/O This pin is connected to the gate of the slot B 3VAUX internal power FET. Connect a capacitor from
this pin to PWRGND to program the slot B 3VAUX ramp rate. The recommended capacitor value is
22 nF for 0.23 V/ms ramp rate.
5 3VAUXB O This output supplies 3VAUX power to slot B when enabled and is pulled low by an internal FET
when there is a fault on slot B 3VAUX or when SWB is opened.
6 3VGB I/O Gate drive for the 3-V slot B FET switch. Ramp rate is programmed by an external capacitor in
series with a 15-kΩ resistor connected from this pin to PWRGND. A capacitor value of 270 nF sets
0.37 V/ms ramp rate.
7 3VISB I
This pin in conjunction with the 3VSB pin senses the current to the 3.3-V slot B. It connects to the
load side of the 3.3-V current sense resistor. The recommended current sense resistor value is
6 mΩ. When PWRENB is false or FAULTB is true, this pin is discharged to PWRGND by an internal
FET. A 0.01-µF capacitor from this pin to ANAGND is recommended.
8 3VSB I This pin in conjunction with the 3VISB pin senses the current to the 3.3-V slot B main power load.
Connect to the source of the 3.3-V FET switch. A 0.01-µF capacitor from this pin to ANAGND is
recommended.
9 3VIOGB I/O Gate drive for the 3.3-V VIO slot B FET switches. Ramp rate is programmed by the external capaci-
tor connected from 3VIOGB to PWRGND. The recommended capacitor value is 22 nF for a 0.45
V/ms ramp rate.
10 PWRGND1 GND Ground for high-current paths including discharge current of external gate capacitors.
11 15VIOGB I/O Gate drive for the 1.5-V VIO slot B FET switches. Ramp rate is programmed by the external capaci-
tor connected from 15VIOGB to PWRGND. The recommended capacitor value is 22 nF for a 0.45
V/ms ramp rate.
12 VIOISB I
This pin in conjunction with the VIOSB pin senses the current to VIO slot B. It connects to the load
side of the VIO current sense resistor. The recommended current sense resistor value is 6 mΩ.
When PWRENB is false or FAULTB is true, this pin is discharged to PWRGND by an internal FET.
A 0.01-µF capacitor from this pin to ANAGND is recommended.
13 VIOSB I This pin in conjunction with the VIOISB pin senses the current to VIO slot B. Connect to the current
sense resistor at the Vio FET switch. A 0.01-µF capacitor from this pin to ANAGND is recommen-
ded.
14 5VISB I
This pin in conjunction with the 5VSB pin senses the current to the 5-V slot B main power load. It
connects to the load side of the 5-V current sense resistor. The recommended current sense resis-
tor value is 6 mΩ. When PWRENB is false or FAULTB is true, this pin is discharged to PWRGND by
an internal FET. A 0.01-µF capacitor from this pin to ANAGND is recommended.
15 5VSB I This pin in conjunction with the 5VISB pin senses the current to the 5-V slot B main power load. It
connects to the source of the 5-V FET switch. A 0.01-µF capacitor from this pin to ANAGND is re-
commended.
16 5VGB I/O Gate drive for the 5-V slot B FET switch. Ramp rate is programmed by an external capacitor in
series with a 15-kΩ resistor connected from this pin to PWRGND. A capacitor value of 270 nF sets
0.37 V/ms ramp rate.
17 P12VINB I The 12-V power input to slot B. This input must be connected to P12VINA. Connect a 0.1-µF ca-
pacitor from this pin to PWRGND.
18 P12VGB I/O
This pin is connected to the gate of the slot B 12-V internal power FET. Connect a capacitor from
this pin to PWRGND to program the slot B 12-V and −12-V power ramp rate. The recommended
capacitor value is 22 nF for 0.45 V/ms ramp rate on 12 V and a 0.68 V/ms ramp rate on −12-V pow-
er.
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TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NUMBER NAME
I/O
DESCRIPTION
19 P12VOB O This output delivers 12-V power to slot B when enabled and is pulled to PWRGND by an internal
FET when PWRRNB is false or FAULTB is true.
20 M12VINB I Connect this power input to −12-V power to drive slot B. This input must be connected to M12VINA.
Connect a 0.1-µF capacitor from this pin to PWRGND.
21 M12VOB O This output delivers −12-V power to slot B when enabled and is pulled to PWRGND by an internal
FET when PWRRNB is false or FAULTB is true. Turn-on of −12-V power tracks turn-on of 12-V
power and is controlled by the capacitor on P12VGB.
22 MISET I/O
This pin programs current limit for 12-V, 5-V, 3.3-V, and −12-V main supplies. MISET does not con-
trol 3.3VAUX or VIO current limit. The recommended resistor from MISET to ANAGND is 6.04 kΩ
±1%. Increasing the value of this resistor raises the current-limit thresholds for the supplies listed
above proportionately. MISET resistor is 12 kΩ maximum.
23 ANAGND1 GND Ground for low-level signals including the current sense circuits and the voltage reference.
24 PCIXCAP1B O This pin indicates bit 1 of the PCIXCAPB state.
25 DIGGND2 GND This pin is the ground return for the digital circuits in the TPS2343.
26 PCIXCAP2B O This pin indicates bit 2 of the PCIXCAPB state.
27 FAULTB O This is an open-drain output that is low if there is a fault on the main power to slot B. This pin has
an internal 100-kΩ pull-up resistor to DIGVCC.
28 AUXFLTB O This open-drain output is low if there is a fault on VAUX power to slot B. This pin has an internal
100-kΩ pull-up resistor to DIGVCC and hysteresis.
29 OUTUVB O This open-drain output is low if slot B outputs are below normal operating range. This pin has an
internal 100-kΩ pull-up resistor to DIGVCC.
30 PCIXCAP3B O This pin indicates bit 3 of the PCIXCAPB state.
31 PCIXCAPB I This pin is the input to a 5-level A/D converter that determines the speed and mode of the inserted
B slot card based on the impedance from this pin to ANAGND. The operation of this pin meets the
specifications of the PCI−X Local Bus Specification, revision 2.0.
32 PWROFFB O This output is low when all of the slot B power outputs are discharged.
33 PWRENB I This pin enables main power for slot B when high. This pin has an internal 100-kΩ pull-up resistor
to DIGVCC and hysteresis. When low, FAULTB is clearded and OUTUVB is asserted.
34 SWB I This input enables 3.3-V VAUX power to slot B. When low, AUXFLTB is cleared. This pin has an
internal 100-kΩ pull-up resistor to 3VAUXI and hysteresis.
35 ATTLEDB O
This output is an open-drain power output that directly drives the slot B attention indicator LED. This
pin indicates the slot B LED attention indicator output signal from ALEDENB. This signal pulls low
with up to 24 mA of drive when asserted and is pulled high by an on-chip 100-kΩ resistor to V5IN
when deasserted.
36 PWRLEDB O This open-drain active-low power output directly drives the slot B power indicator LED. This pin
indicates the slot B power LED output from PLEDENB. This signal pulls low with up to 24 mA of
drive when asserted and is pulled high by an on-chip 100-kΩ resistor to V5IN when deasserted.
37 VIOSELB I This pin selects 3.3 V VIO for slot B when high, 1.5 V when low.
38 ALEDENB I This pin controls ATTLEDB. When this input is high, the LED is on (low).
39 PLEDENB I This pin controls PWRLEDB. When this input is high, the LED is on (low).
40 DIGVCC I This pin is the 3.3-V main power input to the TPS2343. Bypass this pin to DIGGND with a 0.1-µF
ceramic capacitor close to the TPS2343.
41 DIGGND1 GND This pin is the ground return for the digital circuits in the TPS2343.
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TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NUMBER NAME
I/O
DESCRIPTION
42 PLEDENA I This pin controls PWRLEDA. When this input is high, the LED is on (low).
43 ALEDENA I This pin controls ATTLEDA. When this input is high, the LED is on (low).
44 VIOSELA I This pin selects 3.3 V VIO for slot A when high, 1.5 V when low.
45 PWRLEDA O
This output is an open−drain active−low power output that directly drives the slot A power indicator
LED. This pin indicates the slot A power LED output from PLEDENA. This signal pulls low with up
to 24 mA of drive when asserted and is pulled high by an on-chip 100-kΩ resistor to V5IN when
deasserted.
46 ATTLEDA O
This open-drain power output directly drives the slot A attention indicator LED. This pin indicates
the slot A LED attention indicator output signal from ALEDENA. This signal pulls low with up to 24
mA of drive when asserted and is pulled high by an on-chip 100-kΩ resistor to V5IN when deas-
serted.
47 SWA I This input enables 3.3-V Aux power to slot A. When low, AUXFLTA is cleared. This pin has an inter-
nal 100-kΩ pull-up resistor to 3VAUXI and hysteresis.
48 PWRENA I This pin enables main power for slot A when high. When low, FAULTA is cleared and OUTUVA is
asserted. This pin has an internal 100-kΩ pull-up resistor to DIGVCC and hysteresis.
49 PWROFFA O This output is low when all of the slot A power outputs are discharged.
50 PCIXCAPA I This pin is the input to a 5-level A/D converter that determines the speed and mode of the inserted
A slot card based on the impedance from this pin to ANAGND. The operation of this pin meets the
specifications of the PCI−X Local Bus Specification, revision 2.0.
51 PCIXCAP3A O This pin indicates bit 3 of the PCIXCAPA state.
52 OUTUVA O This open−drain output is low if slot A main outputs are below normal operating range. This pin has
an internal 100-kΩ pull-up resistor to DIGVCC.
53 AUXFLTA O This is an open-drain output that is low if there is a fault on VAUX power to slot A. This pin has an
internal 100-kΩ pull-up resistor to DIGVCC.
54 FAULTA O This is an open-drain output that is low if there is a fault on the main power to slot A. This pin has
an internal 100-kΩ pull-up resistor to DIGVCC.
55 PCIXCAP2A O This pin indicates bit 2 of the PCIXCAPA state.
56 DIGGND3 GND This pin is the ground return for the digital circuits in the TPS2343.
57 PCIXCAP1A O This pin indicates bit 1 of the PCIXCAPA state.
58 PGOOD I This input is asserted when power is good in the whole system. This pin has an internal 100-kΩ
pull-up resistor to DIGVCC and hysteresis.
59 ANAGND2 GND Ground for low-level signals including the current sense circuits and the voltage reference.
60 M12VOA O This output delivers −12-V power to slot A when enabled and is pulled to PWRGND by an internal
FET when PWRENA is false or FAULTA is true. Turn-on of −12-V power tracks turn-on of 12-V
power and is controlled by the capacitor on P12VGA.
61 M12VINA I Connect this power input to −12-V power to drive slot A. This input must be connected to M12VINB.
Connect a 0.1-µF capacitor from this pin to PWRGND.
62 P12VOA O This output delivers 12-V power to slot A when enabled and is pulled to PWRGND by an internal
FET when PWRENA is false or FAULTA is true.
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TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NUMBER NAME
I/O
DESCRIPTION
63 P12VGA I/O
This pin is connected to the gate of the slot A 12-V internal power FET. Connect a capacitor from
this pin to PWRGND to program the slot A 12-V and −12-V power ramp rate. The recommended
capacitor value is 22 nF for 0.45-V/ms ramp rate on 12 V and a 0.68-V/ms ramp rate on −12-V pow-
er.
64 P12VINA I The 12-V power input to slot A. This input must be connected to P12VINB. Connect a 0.1-µF ca-
pacitor from this pin to PWRGND.
65 5VGA I/O Gate drive for the 5-V slot A FET switch. Ramp rate is programmed by an external capacitor in
series with a 15-Ω resistor connected from this pin to PWRGND. A capacitor value of 270 nF sets
0.37-V/ms ramp rate.
66 5VSA I This pin in conjunction with the 5VISA pin senses the current to the 5-V slot A. It connects to the
source of the 5-V FET switch. A 0.01-µF capacitor from this pin to ANAGND is recommended.
67 5VISA I
This pin in conjunction with the 5VSA pin senses the current to the 5-V slot A. It connects to the
load side of the 5-V current sense resistor. The recommended current sense resistor value is 6mΩ.
When PWRENA is false or FAULTA is true, this pin is discharged to PWRGND by an internal FET.
A 0.01-µF capacitor from this pin to ANAGND is recommended.
68 VIOSA I This pin in conjunction with the VIOISA pin senses the current to VIO slot A. Connect to the current
sense resistor at the Vio FET switch. A 0.01-µF capacitor from this pin to ANAGND is recommen-
ded.
69 VIOISA I This pin in conjunction with the VIOSA pin senses the current to VIO slot A. It connects to the load
side of the VIO current sense resistor. The recommended current sense resistor value is 6 mΩ. VIO
bleed is connected to this pin. A 0.01-µF capacitor from this pin to ANAGND is recommended.
70 15VIOGA I/O Gate drive for the 1.5-V VIO slot A FET switches. Ramp rate is programmed by the external capaci-
tor connected from 15VIOGA to PWRGND. The recommended capacitor value is 22 nF for a
0.45-V/ms ramp rate.
71 PWRGND2 GND Ground for high-current paths including discharge current of external gate capacitors.
72 V5IN I Connect this power input to 5-V power. This input is used to bias analog circuits. Connect a 0.1-µF
capacitor from this pin to PWRGND.
73 3VIOGA I/O Gate drive for the 3.3-V VIO slot A FET switches. Ramp rate is programmed by the external capaci-
tor connected from 3VIOGA to PWRGND. The recommended capacitor value is 22 nF for a 0.45-V/
ms ramp rate.
74 3VSA I This pin in conjunction with the 3VISA pin senses the current to the 3.3-V slot A main power load.
Connect to the source of the 3.3-V FET switch. A 0.01-µF capacitor from this pin to ANAGND is
recommended.
75 3VISA I
This pin in conjunction with the 3VSA pin senses the current to the 3.3-V slot A. It connects to the
load side of the 3.3-V current sense resistor. The recommended current sense resistor value is
6 mΩ. When PWRENA is false or FAULTA is true, this pin is discharged to PWRGND by an internal
FET. A 0.01-µF capacitor from this pin to ANAGND is recommended.
76 3VGA I/O Gate drive for the 3.3-V slot A FET switch. Ramp rate is programmed by an external capacitor in
series with a 15-kΩ resistor connected from this pin to PWRGND. A capacitor value of 270 nF sets
0.37-V/ms ramp rate.
77 PMEA I This input connects to the slot A power management event (PME) signal. This pin is internally
pulled up to 3VAUXA with a 100-kΩ resistor.
78 PMEOA O This output is connected to PMEA by a bus switch that is closed after slot A 3VAUX voltage is good
and opens immediately when there is a fault on slot A 3VAUX or SWA opens.
79 PMEOB O This output is connected to PMEB by a bus switch that is closed after slot B 3VAUX voltage is good
and opens immediately when there is a fault on slot B 3VAUX or SWB opens.
80 PMEB I This input connects to the slot B power management event (PME) signal. This pin is internally
pulled up to 3VAUXB with a 100-kΩ resistor.
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APPLICATION INFORMATION
Turn-On Sequence
Main power to the slot turns on when all input supplies are active and power is commanded, by asserting
PWRENx. The charge pump combined with the P12VGx capacitor produces a linear voltage ramp on P12VGx,
which produces a linear ramping of the 12-V output and the −12-V output. At the same time, a current source
on 5VG combined with the 5VG capacitor produces a linear voltage ramp on 5VG and a current source on 3VG
combined with the 3VG capacitor produces a linear voltage ramp on 3VG, which produces a linear ramping of
the 3.3-V and 5-V main outputs.
During this time, if any main slot current exceeds the appropriate over-current threshold for more than the
over-current sensitivity time, the slot latches off and remains off until the logic command is turned off and on
again.
When P12VGx exceeds the 12-V gate good threshold, 5VG exceeds the 5-V good threshold, and 3VG exceeds
the 3-V gate good threshold, outputs should be fully ramped and the power MOSFETs should be fully enhanced.
+12-V Supply Control
The TPS2343 integrates an N-channel power MOSFET for the 12-V supply and a voltage multiplying charge
pump to drive the gate of the power MOSFET to 20 V. Inrush current for the 12-V supply is controlled because
the slew rate of the 12-V supply is limited. The slew rate for the 12-V supply is set by the capacitor from P12VG
to AGND.
Slew rate can be estimated as:
dV
dt +IGATE
CP12VGx
where CP12VGx is the capacitor from P12VGx to AGND and IGATE is the P12VGx gate charge current.
PCI specifications allow for 12-V supply adapter card bulk capacitance of up to 300 µF. This load capacitance
causes additional inrush current of:
IINRUSH +CLOAD dV
dt +300 mF IGATE
CP12VGx
Using the r e c o m m e n d e d value for CP12VGx = 0.022 µF and the typical value for IGATE = 10 µA, average inrush
current can be estimated as:
IINRUSH +300 mF 10 mA
0.022 mF+0.136 A
An internal current−sense circuit monitors the 12-V supply. The over-current threshold for the 12-V supply is
directly proportional to the resistor from MISET to AGND. Raising the MISET resistor simultaneously raises the
current limit threshold for the 12-V, 5-V, 3.3-V and −12-V supplies. For example, to raise the nominal output
current from the 12-V supply by 20%, increase the MISET resistor 20%. This resistor can be as high as 12 kΩ
if necessary.
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APPLICATION INFORMATION
−12-V Supply Control
The TPS2343 integrates an N-channel power MOSFET for the −12-V supply. This switch turns on when
PWRENx is asserted and turns off when PWRENx is deasserted or when there is a fault on any main power
supply to the slot.
Like the 12-V supply, inrush for the −12-V supply is controlled by controlling turn-on slew rate. The −12-V supply
tracks the 12-V supply, so the slew rates of these supplies are directly related. To insure that the power MOSFET
for the −12-V supply fully enhances, the tracking amplifier has a gain of approximately 1.4, producing a −12-V
supply slew rate 40% higher than the 12-V supply slew rate.
PCI specifications allow for −12-V supply adapter card bulk capacitance of up to 150 µF. This load capacitance
causes additional inrush current of:
IINRUSH +CLOAD dV
dt +150 mF IGATE
CP12VG
1.4
Using the recommended value for CP12VG = 0.022 µF and the typical value for IGATE = 10 µA, average inrush
current can be estimated as:
IINRUSH +150 mF 10 mA
0.022 mF 1.4 +0.095 A
An internal current-sense circuit monitors the −12-V supply. The over-current threshold for the −12-V supply is
directly proportional to the resistor from MISET to AGND. Raising the MISET resistor simultaneously raises the
current limit threshold for the 12-V, 5-V, 3.3-V and −12-V supplies. For example, to raise the nominal output
current from the −12-V supply by 20%, increase the MISET resistor 20%. This resistor can be as high as 12 kΩ
if necessary.
+5-V Main Supply Control
The TPS2343 uses external N-channel power MOSFETs for the 5-V supply. Inrush current for this supply is
controlled because the slew rate of the supplies is limited. This slew rate is set by the capacitor from 5VGx to
AGND. Slew rate can be estimated as:
dV
dt +IGATE
C5VG
where C5VG is the capacitor from 5VGx to AGND and IGATE is the 5VGx gate charge current.
PCI specifications allow for 5-V supply adapter card bulk capacitance of up to 3000 µF. This load capacitance
causes additional inrush current of:
IINRUSH +CLOAD dV
dt +3000 mF IGATE
C5VGx
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APPLICATION INFORMATION
Using the recommended value for C5VGx = 0.27 µF and the typical value for IGATE = 100 µA, average inrush
current can be estimated as:
IINRUSH +3000 mF 100 mA
0.27 mF+1.11 A
An external current-sense resistor monitors the 5-V supply. The calculation of external resistor values is shown
in the determining component values section. The over-current thresholds is directly proportional to the resistor
from MISET to AGND and inversely proportional to the current-sense resistor. Raising the MISET resistor
simultaneously raises the current limit threshold for the 12-V, 5-V, 3.3-V and −12-V supplies. This resistor can
be as high as 12 kΩ if necessary.
+3.3-V Main Supply Control
The TPS2343 uses external N-channel power MOSFETs for the 3.3-V supply. Inrush current for this supply is
controlled because the slew rate of the supply is limited. These slew rates are set by the capacitor from 3VGx
to AGND. Slew rate can be estimated as:
dV
dt +IGATE
C3VGx
where C3VGx is the capacitor from 3VGx to AGND and IGATE is the 3VGx gate charge current.
PCI specifications allow for 3.3-V supply adapter card bulk capacitance of u p t o 3000 µF. This load capacitance
causes additional inrush current of:
IINRUSH +CLOAD dV
dt +3000 mF IGATE
C3VGx
Using the recommended value for C3VGx = 0.27 µF and the typical value for IGATE = 100 µA, average inrush
current can be estimated as:
IINRUSH +3000 mF 100 mA
0.27 mF+1.11 A
An external current-sense resistor monitors the 3.3-V supply. The calculation of external resistor values is
shown in the determining component values section.The over-current threshold is directly proportional to the
resistor from MISET to AGND and inversely proportional to the current-sense resistor. Raising the MISET
resistor simultaneously raises the current limit threshold for the 12-V, 5-V, 3.3-V and −12-V supplies. This
resistor can be as high as 12 kΩ if necessary.
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APPLICATION INFORMATION
+1.5-V and +3.3-V VIO Supply Control
VIO is frequently used to power VIO for both the slot and the bridge so that there is minimal drop between the
slot and the bridge VIO supplies. When calculating the current-limit threshold for VIO, take into account the
current consumption of the slot and the bridge.
The TPS2343 uses external N-channel power MOSFETs for the 1.5-V and 3.3-V VIO supplies. Inrush current
for these supplies is controlled because the slew rate of the supplies are limited. Refer to the VIO Power
Selection in the Application Section.
Both 1.5-V and 3.3-V VIO slew rates are usually set to the same value capacitor, C VIOGx to AGND and on 3VIOGx
to AGND. IGATE is 10 µA for both 15VIOGx and 3VIOGx. Slew rate can be estimated as:
dV
dt +IGATE
CVIOGx
PCI specifications allow for 1.5-V and 3.3-V VIO supply adapter card bulk capacitance of up to 150 µF. This load
capacitance causes additional inrush current of:
IINRUSH +CLOAD dV
dt +150 mF IGATE
CVIOGx
Using the recommended value for CVIOGx = 0.022 µF and the typical value for IGATE = 5 µA, average inrush
current can be estimated as:
IINRUSH +150 mF 10 mA
0.022 mF+0.068A
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APPLICATION INFORMATION
3VAUX Supply Control
The TPS2343 3VAUX supply is completely independent of the main supply. Supply status and faults on main
supplies have no effect on 3VAUX and faults on 3VAUX have no effect on main supply operation.
The TPS2343 uses internal power MOSFETs for the 3VAUX supply and voltage multiplying charge pumps to
drive the gates of the power MOSFETs to 8 V. Inrush current for the 3VAUX supply is controlled because the
slew rate of the 3VAUX supply is limited. This slew rate is set by the capacitor from 3VAUXGx to AGND. Slew
rate can be estimated as:
dV
dt +IGATE
C3VAUXGx
where C3VAUXGx is the capacitor from 3VAUXGx to AGND and IGATE is the 3VAUXG gate charge current.
Inrush current caused by this slewing and any adapter card load capacitance can be estimated as:
PCI specifications allow for 3.3VAUX supply adapter card bulk capacitance of up to 150 µF. This load
capacitance causes additional inrush current of:
IINRUSH +CLOAD dV
dt +CLOAD 5mA
C3VAUXGx
Using the recommended value for C3VAUXGx = 0.022 µF and the typical value for IGATE = 5 µA, average inrush
current can be estamated as:
IRUSH +150 mF 5mA
0.022 mF+0.034 A
The 3VAUXx current-sense threshold is internally set and can not be adjusted.
When main power is applied to the TPS2343, all gates are actively held low. When main power is removed,
leakage current can potentially raise gate voltage, but because main power is not applied, no malfunction
occurs. This is noted here as floating gates may be observed during bench testing, but ths is not an application
problem.
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APPLICATION INFORMATION
Layout Considerations
It is important to use good layout practices regarding device placement and etch routing of the
backplane/system board to optimize the performance of the hot plug circuit. Some of the key considerations
are listed here:
DDecoupling capacitors should be located close to the device.
DAny protection devices (e.g. zener clamps) should be located close to the device.
DTo reduce insertion loss across the hot plug interface, use wide traces for the supply and return current
paths. A power plane can be used for the supply return or PWRGND nodes.
DAdditional copper placed at the land patterns of the sense resistors and pass FETs can significantly reduce
the thermal impedance of these devices, reducing temperature rise in the module and improving overall
reliability.
DBecause typical values for current sense resistors can be very low (6 mΩ typical), board trace resistance
between elements in the supply current paths becomes significant. To achieve maximum accuracy of the
overload thresholds, good Kelvin connections to the resistors should be used for the current sense inputs
to the device. The current sense traces should connect symmetrically to the sense resistor land pattern,
in close proximity to the element leads, not upstream or downstream from the device.
TPS2343
TPS2343
LOAD CURRENT PATH
SENSE
RESISTOR
LOAD CURRENT PATH
3VSA
3VISA
3VSA
3VISA
UDG−02154
Figure 1. Connecting the Sense Resistors
These recommended layouts provide force-and-sense (Kelvin) connection to the current sense resistor to
minimize circuit board trace resistance.
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APPLICATION INFORMATION
Power and Grounding
Connect all TPS2343 grounds directly to the digital ground plane on the circuit board through the shortest path
possible. Also connect P12VINA, P12VINB, M12VINA and M12VINB directly to the appropriate power plane
through the shortest path possible. A 0.1-µF decoupling capacitor is recommended on each of these power pins,
as close to the pin as possible.
Thermal Model
The TPS2343 is packaged in the HTSSOP-80 PowerPadt small outline package. The PowerPadt package
is a thermally enhanced standard size device package designed to eliminate the use of bulky heatsinks and
slugs traditionally used in thermal packages. This package can be easily mounted using standard printed circuit
board (PCB) assembly techniques, and can be removed and replaced using standard repair procedures.
The leadframe die pad is exposed on the bottom of the device. This provides an extremely low thermal
resistance between the die and the thermal pad. The thermal pad can be soldered directly to the PCB for
heatsinking. In addition, through the use of thermal vias, the thermal pad can be directly connected to a power
plane or special heat sink structure designed into the PCB. On the TPS2343, the die substrate is internally
connected to the −12-V input supply. Therefore the power plane or heatsink connected to the thermal pad on
the bottom of the device must also connect to the −12-V input supply (recommended) or float independent of
any supply (acceptable).
The thermal performance can be modeled by determining the thermal resistance between the die and the
ambient environment. Thermal resistances are measures of how effectively an object dissipates heat. Typically,
the larger the device, the more surface area available for power dissipation and the lower the object’s thermal
resistance. Figure 3 illustrates the thermal path and resistances from the die, TJ through the printed circuit board
to the ambient air.
UDG−02156
−12 VIN or Floating
ÌÌÌ
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Ì
Ì
Ì
Ì
ÌÌ
Ì
ÌÌ
ÌÌ
ÌÌ
Ì
ÌÌ
ÌÌ
ÌÌ
ÌÌ
ÌÌ
ÌÌ
ÌÌ
ÌÌ
ÌÌ
ÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌÌ
ÌÌ
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ÌÌ
Ì
Ì
Ì
ÑÑ
ÑÑ
Solder
Copper
Trace
Via Thermal V ia Heatsink/Copper Plane
Die
PD
(Watts)
Die Junction Temperature
Die Case Temperature
PCB Pad Temperature
PCB Heatsink Temperature
Ambient Air Temperature
TJ
qJ
C
TC
qC
P
TP
qP
H
TH
qH
A
TA
TPS2343 80 HTSSOP PowerPadt
Figure 2. PowerPADt Thermal Model
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APPLICATION INFORMATION
Technical Brief PowerPADt Thermally Enhanced Package (SLMA002) can be used as a guide to model the
TPS2343 thermal resistance.
17,10
16,90
5,40
4.70 6,20
6,00
DDP PowerPad 80 Pin
NOTE:
The pad is centered in both directions with the pins. The tolerance includes both the size and the
centering.
When mounted to a copper pad with solder on a PCB with two ounce traces, the TPS2343 exhibits thermal
resistance from junction to ambient of 29°C/W. When the TPS2343 is mounted to a conventional PCB with
solder mask under the package and only the lead tips soldered to traces, the TPS2343 exhibits thermal
resistance from junction to ambient of 35°C/W.
Refer to Technical Briefs: PowerPADt Thermally Enhanced Package SLMA003 and PowerPADt Made Easy
SLMA004 for more information on using this PowerPadt package.
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APPLICATION INFORMATION
Determining Component Values
Load Conditions
Table 1. Load Conditions for Determining Component Values
SUPPLY DRIVER ILOAD
(A) ITRIP
(A) CLOAD
(µF) SR
(V/s)
+12 V 0.500 1.50 300 250
+5 V 5.000 7.00 3000 200
+3.3 V 7.600 10.0 3000 200
−12 V 0.100 0.20 150 200
+3.3 Vaux 0.375 1.10 150 5000
+1.5 VIO 1.500 4.00 150 200
+3.3-V Supply
Overload Trip Point with MISET = 6.04 kW
Desired ITRIP (nom) ≅ 10 A
RSENSE +VRTRIP (nom)
ITRIP (nom)
+63 mV
10 A +0.0063 WNChoose 6 mW, 2% sense resistor
ITRIP(min) +VTRIP (min)
RSENSE (max)
+48 mV
6.12 mW+7.84 A
ITRIP(max) +VTRIP (max)
RSENSE (min)
+76 mV
5.88 mW+12.93 A
+5-V Supply
Overload Trip Point with MISET = 6.04 kW
Desired ITRIP (nom) ≅ 7 A
RSENSE +VRTRIP (nom)
ITRIP (nom)
+53 mV
7A +0.00589 WNChoose 6 mW, 2% sense resistor.
ITRIP(min) +VTRIP (min)
RSENSE (max)
+43 mV
6.12 mW+7.03 A
ITRIP(max) +VTRIP (max)
RSENSE (min)
+63 mV
5.88 mW+10.71 A
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APPLICATION INFORMATION
3.3 Volt or 1.55 Volt Supply for VIO
Overload trip point with MISET = 6.04 kW.
Desired ITRIP(nom) = 4 A
RSENSE +VTRIP(nom)
ITRIP(nom)
+23.5 mV
4.0 A +0.00598W
Choose 0.006 Ω
ITRIP(min) +20 mV
0.00612 W+3.27 AMIN
ITRIP(max) +27 mV
0.00588 W+4.594 AMIN
Thermal Shutdown
Under normal operating consitions, the power dissipation in the TS2343 is low enough that the junction
temperature ( T J) is not more than 15°C above air temperature (TA). However, in the case of a load that exceeds
PCI specifications (but remains under the TPS2343 overcurrent threshold) power dissipation can be higher. To
prevent any damage from an out-of-specification load or severe rise in ambient temperature, the TPS2343
contains two independent thermal shutdown circuits, one for each main supply slot. VAUX is not affected by the
thermal shutdown.
The highest power dissipation in the TPS2343 is from the 12-V power FET so that TPS2343 temperature sense
elements are integrated closely with these FETs. These sensors indicate when the temperature at these
transistors exceeds approximately 150°C, due either to average device power dissipation, 12-V power FET
power dissipation, or a combination of both.
When excessive junction temperature is detected in one slot, that slot’s fault latch is set and remains set until
the junction temperature drops by approximately 10°C and the slot is then restarted. The other slot is not
affected by this event.
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APPLICATION INFORMATION
S3
S6
SLUS644B − FEBRUAR Y 2005 − MAY 2005
25
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APPLICATION INFORMATION
MOSFET Selection
All external power MOSFETs are N-channel devices. Gate resistors are not required.
Hot plug can cause excessive voltage spikes on the input and output of the FET. During a short circuit, an
excessive current spike can occur before current limit turns off the output. Although the duration is usually very
small, the energy can be large and cause big voltage fluctuations. The MOSFET will operate at high current and
high drain to source voltage which could violate the safe operating area of the device and cause breakdown.
To ensure safe operation of the external MOSFET, the drain-to-source voltage rating should be reasonably
higher than VIN. A 2-to-1 or 3-to-1 ratio of the VDSS to VIN is recommended.
VDSS > 2 x VIN
The current rating of the FET at the maximum case temperature (usually 70°C − 100°C), ID, should be at least
2 x ITRIP(max) (see RSENSE Calculations Section).
ID at TC(max) > 2 x ITRIP(max)
The gate-to-source voltage rating, VGS of the FET should be at least 10 V because the TPS2343 gate voltages
can be as high as 12 V and the source voltage as low as 3.3 V, a difference of 8.7 V.
VGS > 10 V
Another important parameter in choosing a FET is the on-resistance, R DS(on). The lower the RDS(on), the smaller
the power dissipation of the FET and the easier to maintain the PCI recommended bus voltage. The lowest
RDS(on) FETs are the most expensive. To calculate the FET RDS(on), note the lower limit for each slot voltage
specified in the PCI−X Electrical and Mechanical Addendum.
Table 2.
SUPPLY VOLTAGE PCI TOLERANCE SUPPLY TOLERANCE MAXIMUM OPERATING CUR-
RENT
+5 V ±0.25 V ±3% 5.0 A
+3.3 V ±0.3 V ±3% 7.6 A
VIO = 3.3 ±0.3 V ±3% 3.5 A
VIO = 1.5 ±0.075 V ±3% 1.5 A
SLUS644B − FEBRUAR Y 2005 − MAY 2005
26 www.ti.com
APPLICATION INFORMATION
The difference between the lower limit of both the system power supply and the PCI specification slot voltage
value is the system voltage budget. System power supplies specified with slightly high output voltage increases
the system voltage budget making the FETs RDS(on) less critical. To calculate the RDS(on), sum the voltage drop
due to contact resistance of the power input connector, the PCI connector, and the sense resistor. This sum is
subtracted from the system voltage budget to give the VRDS(on) and ultimately the RDS(on).
+−
+−
+−
−+
V−Power Conn
V−Power Conn
V−RDS ON
RDS ON
V−RSENSE
RSENSE
PS Connector
R = 0.002 Ohms
Power Supply
Limits 5 V+/−3%
5.15 V to 4.85 V
+
−
8
8
Slot
V−PCIconn
V−PCIconn
R = 0.02 Ohm/pin
PCI Limit
5.25 V to 4.75 V
4
4
Figure 3.
Terms
Terms are defined below referenced by an example calculation.
DSystem voltage budget = PCI lower limit − power supply lower limit
DSystem voltage drop= V power connector + V PCI connector + VRSENSE
(For power and ground paths)
DVRDS(on) = system voltage budget − system voltage drop
DRDS(on) = VRDS(on)/max operating current
SLUS644B − FEBRUAR Y 2005 − MAY 2005
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APPLICATION INFORMATION
Example Calculation of RDS(on) for the 5.0 V Main:
DPS low voltage 5.0 V − 3% = 4.85 V
DPCI spec lowest voltage to add in card = 4.75 V
DSystem voltage budget = 4.85 V − 4.75 V = 0.1 V
DPCI bus has 8 pins for 5.0 A, 5.0 A/8 pins = 0.625 A/pin
DContact resistance = 20 mΩ, .625 A x 0.020 Ω = 12.5 mV
DVPCI connector = 12.5 mV + 12.5 mV (return path) = 25 mV
DV power connector = 5.0 A/4 pins = 1.25 A/pin
DPin contact resistance = 0.002 Ω,
DV power connector = 1.25A x 0.002 Ω = 2.5 mV, 2.5 mV x 2 = 5 mV
DVRSENSE = 5.0 A x 0.006 Ω = 30 mV
DSystem voltage budget = VPCI connector + V power connector + VRSENSE +VRDS(on)
D100 = 25 + 5 + 30 + VRDS(on),
DVRDS(on) = 40 mV
DRDS(on) = 0.040 V/5 A = 8 mΩ
Systems have different parameters but calculating RDS(on) for the different voltages using these assumptions
gives the following results.
Table 3.
VOLTAGE RDS(on)
+5 V 8 mΩ
+3.3 V 12 mΩ
+3.3 VIO 12 mΩ
+1.5 VIO 4 mΩ
FET Heatsink
Place a layer of copper on the circuit board under the surface mount FET and solder the FET to the board for
good thermal connection. Connect the copper to an inner voltage layer at the same potential or if possible, an
area of copper on the other side of the board.
Decoupling Capacitors
Decoupling is required on the power inputs to the TPS2343. Use 0.1-µF capacitors on the 12 V, −12 V, 5 V, 3.3 V
main and 3.3-VAUX and 1.5-VAUX inputs and keep them close to the TPS2343 voltage input pins.
The pin descriptions for the TPS2343 signal outputs recommend 0.01-µF decoupling capacitors. These are not
required.
SLUS644B − FEBRUAR Y 2005 − MAY 2005
28 www.ti.com
APPLICATION INFORMATION
PCI−X Capability Selection
The PCI−X Local Bus 2.0 specification describes how the PCIXCAP pins program board operating mode using
resistors on the board. The TPS2343 decodes the resistor values and communicates this to the slot controller
using logic signals.
Five different operating modes are allowed under PCI−X 2.0. These modes are compatible with the three
existing PCI and PCI−X 1.0 modes and add operation at 266 MHz and 533 MHz. The PCI−X 2.0 specification
requires that PCIXCAP pins are pulled up to 3.3 V with a 3.3-kΩ, 5% resistor on the backplane or systemboard.
This pull-up resistor combined with the resistor on the board creates a voltage divider as shown in Table 4.
Table 4.
MODE BUS SPEED BOARD CONNECTION ON PCIXCAP PIN PCIXCAP PIN NOMINAL VOLTAGE
PCI 2.2 33 MHz/66 MHz ground 0 V
PCI−X 1.0 66 MHz 10 kΩ 1% to ground 2.481 V
PCI−X 1.0 133 MHz open circuit 3.300 V
PCI−X 2.0 266 MHz 3.16 kΩ 1% to ground 1.614 V
PCI−X 2.0 533 MHz 1.02 kΩ 1% to ground 0.779 V
The TPS2343 detects these five different modes using four comparators. These comparators have voltage
thresholds between the nominal voltage points, as shown in the electrical characteristics table. These
thresholds are proportional to DIGVCC voltage, so any supply variations are compensated by equivalent
variation in the voltage thresholds. The voltage thresholds are far from the nominal voltage, so there is noise
margin in mode selection. The table below shows these margins with a 3.3-kΩ, 5% pull-up resistor and the
voltage threshold ranges shown in the electrical characteristic table.
Table 5.
MODE WINDOW PCIXCAP VOLTAGE NOISE MARGIN
33 MHz to 533 MHz 0.279 V
533 MHz to 266 MHz 0.314 V
266 MHz to 66 MHz 0.331 V
66 MHz to 133 MHz 0.319 V
PCIXCAP Outputs
The PCIXCAPxn outputs directly communicate the PCIXCAP resistances according to Table 6.
Table 6.
MODE BUS SPEED PCIXCAPx1
(PINS 48, 13) PCIXCAPx2
(PINS 46, 15) PCIXCAPx3
(PINS 43, 18)
PCI 2.2 33 MHz/66 MHz 0 0 0
PCI−X 1.0 66 MHz 1 0 0
PCI−X 1.0 133 MHz 1 1 0
PCI−X 2.0 266 MHz 0 0 1
PCI−X 2.0 533 MHz 1 0 1
If desired, PCIXCAPx3 can be connected to VIOSEL through an inverter to automatically set VIO based on
adapter card type.
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29
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APPLICATION INFORMATION
Power Stage Design
Adapter card current is a combination of static adapter card current consumption plus inrush current caused
by the supply voltage ramping into the adapter card decoupling capacitance. The TPS2343 implements current
limiting on each supply. For the 5-V, 3.3-V and VIO supplies, user-supplied 6-mΩ resistors sense current. For
the other supplies, current-sense resistors are integrated into the TPS2343. The current sense thresholds of
the 5-V, 3.3-V, 12-V, and −12-V supplies are programmed by one user-supplied resistor connected from MISET
to GROUND. The TPS2343 implements slew-rate control using on-chip current sources and user-supplied
capacitors. Each supply is controlled by the slew rate capacitor for that supply except for the −12-V supply, which
tracks the 12-V supply.
Using the recommended current-sense resistors, current-threshold resistor, and slew-rate control capacitors
implements a system with slew rates that meet PCI specifications and can deliver power to any adapter card
that meets PCI specifications. If a unique adapter card produces premature current limiting with the
recommended programming components, current-limit thresholds can be increased by increasing the value of
the resistor connected to MISET or inrush current can be reduced by raising the value of the appropriate
slew-rate control capacitors.
56
64
57
65
53
72
51
65
6230555273
3VAUXI M12VINA P12VINA DIGVCC V5IN
5VGA
5VSA
5VISA
3VSA
3VISA
P12VOA
M12VOA
3VAUXA
+5V In+3.3V In
6 mΩ
6 mΩ
15
kΩ
0.27µF
IRF7460
or
Si4410DY
IRF7460
or
Si4410DY
5 V
to Slot
3.3 V
to Slot
12 V
to Slot
−12 V
to Slot
3.3V Aux
to Slot
Aux
+3.3V In −12V In +12V In
50 61 80 71 54
P12VGA
3VAUXGA
0.022 µF
0.022 µF
TPS2342
ANAGND PWRGND PWRGND
11
6.04 kΩ
MISET
76
3VGA
15 Ω
0.27µF
Figure 4. Typical TPS2343 Application Showing Power, Slew-Rate Control and Current-Limit
Programming Components (one slot shown)
SLUS644B − FEBRUAR Y 2005 − MAY 2005
30 www.ti.com
APPLICATION INFORMATION
Current Regulation and Over Current Protection
In the event of excessively high slot current for the 3.3-V main, 5-V main, or VIO supplies, the TPS2343 regulates
load current at the maximum specified current for a fixed 5 ms. If the current does not reduce below the maximum
in that time, the TPS2343 shuts down main power to that slot. This minimizes the risk of power rail droop on
adjacent slots while at the same time allowing marginal cards to continue to function through brief, high-current
demands.
Control of high-current demand is accomplished using closed-loop regulation of the gate voltage, as shown in
the block diagram below.
+++
67
66
75
74
69
68
SQ
QR
100ms
Delay
5ms
Delay SQ
QR
Main
Fault
Latch
Regulation
Mode
Latch
VIOSA
VIOISA
3VSA
3VISA
5VSA
5VISA
Fault
23mV
63mV
53mV
3ms
Delay
Over Temperature
−12V Over Current
+12V Over Current
PWREN
+
+
+
65
5VGA
76
3VGA
70
15VIOGA
73
3VIOGA
Figure 5. Current Regulation Functional Block Diagram (one slot shown)
Once an overload has been detected on one of these three supplies, the regulation mode latch is set, and gate
voltage is reduced. At the same time, a 5-ms timer starts. If the timer elapses without the load current reducing,
the main fault latch is set, and the slot latchs off until power is shut o ff and restarted by the host. If the overload
reduces for more than 100 µs, the regulation mode latch clears and the 5-ms timer resets.
For excessively-high slot current on the 12-V main, −12-V main, and 3.3-V auxiliary supplies, the TPS2343
shuts down 3 µs after the fault to prevent disturbance to power on the backplane or damage to the TPS2343.
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APPLICATION INFORMATION
VIO Power Selection
PCI−X Local Bus specification revision 2.0 requires that VIO be 3.3 V when the slot is operating in 33-MHz,
66-MHz, or 133-MHz modes and 1.5 V when the slot is operating in 266-MHz or 533-MHz modes. The TPS2343
provides signals to drive external power FETs to select between 3.3 V and 1.5 V for VIO.
To prevent body-diode conduction from the 3.3-V supply to the 1.5-V supply when 3.3 V is delivered to VIO, the
1.5-V VIO switch uses two power FETs in blocking-series connection. To minimize voltage loss, low
on-resistance FETs are required (such as IRF1302S or Si4430DY). It is helpful to anticipate the voltage drop
in the FETs and adjust the 1.5-V VIO power source for slightly greater than 1.5 V, for example 1.55 V ±25 mV.
6mW
15VIOG
3VIOG
VIOIS
VIOS
1.55V
3.3V
+
To
Slot
VIO
10mA
10 mAIRF1302S
or Si4430DY
IRF7460 or
Si4410DY
23mV
22 nF
22 nF
Figure 6. VIO Application Diagram (one slot shown)
When PWREN is asserted, depending on VIOSEL, either 15VIOG or 3VIOG ramps up concurrently with the
other main power supplies. When PWREN is deasserted, 15VIOG or 3VIOG ramps down concurrently with the
other main power supplies.
Gate slewing caps are used on the VIO channels. One cap is used for the 3VIOGx and another for the 15VIOGx
in order to set the slew rate properly for a 1.5-V or 3.3-V channel. There is only one charging current on VIO
which is set at 10 µA and switched between the two pins depending on the VIOSELx input.
PCI specifications limit adapter card VIO capacitance to 150 µF. It is recommended that the backplane also have
between 1 0 µF and 50 µF of bypass capacitance on VIO to minimize transients. The capacitance on each gate
is 2 2 nF, producing a gate slew rate of approximately 0.45 V/ms. The averagelimits VIO capacitive inrush current
is approximately 68 mA.
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32 www.ti.com
APPLICATION INFORMATION
Digital Communications
53
Vaux
Control
A/D Converter
and Decoder
VIO Selection
and Control
LED Drivers
77
57
55
51
54
52
49
Main Power
Control
46
45
OUTUVA
PWRLEDA
PWROFFA
FAULTA
ATTLEDA
PCIXCAP3A
PCIXCAP2A
PCIXCAP1A
AUXFLTA
PMEAPMEOA
SWA
PCIXCAPA
PWRENA
78
48
47
50
44
43
42
VIOSELA
ALEDENA
PLEDENA
FROM
SLOT
FROM
HOT PLUG
CONTROLLER
3.3V
TO HOT PLUG
CONTROLLER
3.3V
270 3.3V
270
Figure 7. Digital Interface Application Diagram (one slot shown)
SLUS644B − FEBRUAR Y 2005 − MAY 2005
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APPLICATION INFORMATION
Power Cycling and PME
The PCI power management specification defines a signal called PME (power management event) to allow
requests for power state changes to be communicated from the slot back to the system. The TPS2343 provides
a slot-specific PMEx input and a gated PMEOx output that can be monitored by the system. The gated PMEOx
output is enabled a delay after the SWx slot switch closes (SWx low) as shown in the timing diagram below. The
purpose of the delay is to ensure that 3.3-VAUX power is stable to the slot before connecting PMEx the signal.
If the PMEx signal was presented to the system while 3.3-VAUX power was still ramping up, a false trigger could result.The
3.3-VAUX circuitry provides over current fault detection. In the event of an over current fault on VAUX, the slot
3.3-VAUX and PME signals are immediately disconnected. The fault state is latched internally in the TPS2343
and is cleared either by opening the SWx slot switch or by removing the 3.3-VAUX power to the TPS2343.
PME ENABLE
10 ms
TYP
2.5 ms
TYP
10 ms
TYP
SWx
3VAUXx
Auxfltx
VAUX and PME Gating
When SWx is closed (low), 3VAUXx power is immediately applied to the slot with controlled slew rate, minimizing
inrush current into 3VAUXx bypass capacitors. After 3VAUXx power completes ramping up, a delay timer starts.
At the end of the delay timer cycle, the PMEx enable switches close, allowing connection of the PMEx signal
to the PMEOx output. Multiple PMEOx output pins can be connected to the same node, creating a PME bus
that can be connected to a master system interrupt input.When SWx is opened (high) or if there is a power fault
on slot x, the PMEx enable switch for that slot is immediately opened and the 3VAUXx power for that slot is
removed. Although these events happen at approximately the same time, the 3VAUXx power should remain
high until the PMEx switch is open so that falling 3VAUXx power does not cause a nuisance PMEx interrupt.
To insure that 3VAUXx remains high during a power fault, 3VAUXx should have a bypass capacitance of at least
20 µF. If the capacitor is not available on the inserted card, it should be provided on the system board.The PME
circuit operates independently of any of the main power supplies.
SLUS644B − FEBRUAR Y 2005 − MAY 2005
34 www.ti.com
TYPICAL CHARACTERISTICS
Figure 8
t − Time − 5 ms/div.
5 V/div.
SLOT VOLTAGE TURN ON FROM PWREN
12 V
5 V
3.3 V
12 V
Figure 9
t − Time − 5 µs/div.
5 V/div.
TURN OFF FROM 12 V OVERCURRENT
+12
FAULT
OUTUV
PWROFF
Figure 10
t − Time − 1 ms/div.
5 V/div.
5 V TURN OFF FOR 5 V OVERCURRENT
5 V
FAULT
OUTUV
PWROFF
Figure 11
t − Time − 20 µs/div.
5 V/div.
5 V AT COARSE REGULATION ON 5 V OVERCURRENT
5 V
FAULT
OUTUV
PWROFF
SLUS644B − FEBRUAR Y 2005 − MAY 2005
35
www.ti.com
TYPICAL CHARACTERISTICS
Figure 12
t − Time − 1 ms/div.
5 V/div.
12 V TURN OFF FOR 5 V OVERCURRENT
12 V
FAULT
OUTUV
PWROFF
Figure 13
t − Time − 5 µs/div.
5 V/div.
5 V TURN OFF FOR 12 V OVERCURRENT
5 V
FAULT
OUTUV
PWROFF
Figure 14
t − Time − 1 ms/div.
2 V/div.
1.5 V FOR VIO OVERCURRENT
1.5 VIO
FAULT
OUTUV
PWROFF
Figure 15
t − Time − 5 µs/div.
2 V/div.
VAUX FOR VAUX OVERCURRENT
VAUX
AUXFLT
LOAD APPLIED
SLUS644B − FEBRUAR Y 2005 − MAY 2005
36 www.ti.com
TYPICAL CHARACTERISTICS
Figure 16
t − Time − 2 ms/div.
2 V/div.
VAUX ON FROM SW
VAUX
VAUX GATE
SW
Figure 17
t − Time − 0.1 ms/div.
VAUX OFF FROM SW
2 V/div. VAUX
VAUX GATE
SW
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPS2343DDP ACTIVE HTSSOP DDP 80 28 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
TPS2343DDPG3 ACTIVE HTSSOP DDP 80 28 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
TPS2343DDPR ACTIVE HTSSOP DDP 80 2000 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
TPS2343DDPRG3 ACTIVE HTSSOP DDP 80 2000 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Jul-2006
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS2343DDPR HTSSOP DDP 80 2000 330.0 24.4 8.4 17.3 1.7 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS2343DDPR HTSSOP DDP 80 2000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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