Issue date: April 2011
TDK MLCC
US Catalog
Version B11
C Series
Open Mode Design
Type: C2012 [EIA CC0805]
C3216 [EIA CC1206]
C3225 [EIA CC1210]
C4532 [EIA CC1812]
C5750 [EIA CC2220]
REMINDERS
Please read before using this product
SAFETY REMINDERS
TDK MLCC US Catalog Version B11Page 180
REMINDERS
1. If you intend to use aproduct listed in this catalog for apurpose that may cause loss of life or other
damage, you must contact our company’s sales window.
2. We may modify products or discontinue production of aproduct listed in this catalog without prior
notification.
3. We provide “Delivery Specification” that explain precautions for the specifications and safety of each
product listed in this catalog.We strongly recommend that you exchange these delivery specifications
with customers that use one of these products.
4. If you plan to export aproduct listed in this catalog, keep in mind that it may be arestricted item according
to the “Foreign Exchange and Foreign Trade Control Law”.In such cases, it is necessary to acquire export
permission in harmony with this law.
5. Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from
our company.
6. We are not responsible for problems that occur related to the intellectual property rights or other rights of
our company or athird party when you use aproduct listed in this catalog.We do not grant license of
these rights.
7. This catalog only applies to products purchased through our company or one of our company’s official
agencies.This catalog does not apply to products that are purchased through other third parties.
TDK MLCC US Catalog Version B11Page 181
C Series
Open Mode Design
Type: C2012, C3216, C3225, C4532, C5750
• Increase resistance to mechanical bending,
temperature cycle, vibration, and electrical stresses
• Available in X7R and X8R dielectrics
• When a chip capacitor is cracked by mechanical
stress such as board bending, open mode construction
helps user reduce the risk of short circuits
• The Open Mode design defines that the L-Gap length
shall be wider than the terminal band width
Applications •Automotive and other high stress
applications
•Battery line circuits with high board
flex stress
Features
Shape &
Dimensions
Dimensions in mm
<Standard>
CrackCrack
Fail ShortFail Short
L-Gap
<Open Mode Design>
Fail Open
CrackCrack
L-Gap
• The Open Mode concept does not guaranteed MLCC
will always fail open. This design is intended to reduce
the risk of the MLCC failing short. All MLCC caution
guidelines apply.
Part Number
Construction
Series Name
C3216 X7R 2A 105 K T 5XXX
Dimensions L x W (mm)
Temperature Characteristic
Rated Voltage (DC)
Nominal Capacitance (pF)
Capacitance Tolerance
Packaging Style
Internal Codes
The capacitance is expressed in three
digit codes and in units of pico Farads
(pF). The first and second digits identify
the first and second significant figures of
the capacitance. The third digit identifies
the multiplier. R designates a decimal
point.
Symbol Design
5Open Mode
Case Code Length Width
C2012 2.00 ±0.20 1.25 ±0.20
C3216 3.20 ±0.20 1.60 ±0.20
C3225 3.20 ±0.40 2.50 ±0.30
C4532 4.50 ±0.40 3.20 ±0.40
C5750 5.70 ±0.40 5.00 ±0.40
Temperature
Characteristics
Capacitance
Change
Temperature
Range
X7R ±15% -55 to +125ºC
X8R ±15% -55 to +150ºC
Voltage Code Voltage (DC)
1C 16V
1E 25V
1H 50V
2A 100V
2E 250V
2J 630V
Termination Code Style
5xxx Open Mode Design
Packaging Code Style
TTape & Reel
Tolerance Code Tolerance
K±10%
M±20%
Capacitance Code Capacitance
0R5 0.5pF
010 1pF
102 1,000pF (1nF)
105 1,000,000pF (1µF)
LBody Length
WBody Width
TBody Height
BTerminal Width
TDK MLCC US Catalog Version B11Page 182
C2012 [EIA CC0805]
Capacitance
Range Chart
TDK Part Number
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C2012X7R1H104KT5 X7R 50V
±10% 1.25 ±0.20
C2012X7R2A102KT5 X7R 100V
±10% 0.85 ±0.10
C2012X7R2A152KT5 X7R 100V
±10% 0.85 ±0.10
C2012X7R2A222KT5 X7R 100V
±10% 0.85 ±0.10
C2012X7R2A332KT5 X7R 100V
±10% 0.85 ±0.10
C2012X7R2A472KT5 X7R 100V
±10% 0.85 ±0.10
C2012X7R2A682KT5 X7R 100V
±10% 0.85 ±0.10
C2012X7R2A103KT5 X7R 100V
±10% 0.85 ±0.10
C2012X7R2A153KT5 X7R 100V
±10% 1.25 ±0.20
C2012X7R2A223KT5 X7R 100V
±10% 1.25 ±0.20
C2012X7R2E102KT5 X7R 250V
±10% 0.85 ±0.10
C2012X7R2E152KT5 X7R 250V
±10% 0.85 ±0.10
C2012X7R2E222KT5 X7R 250V
±10% 0.85 ±0.10
C2012X7R2E332KT5 X7R 250V
±10% 0.85 ±0.10
C2012X7R2E472KT5 X7R 250V
±10% 0.85 ±0.10
C2012X7R2E682KT5 X7R 250V
±10% 1.25 ±0.20
C2012X7R2E103KT5 X7R 250V
±10% 1.25 ±0.20
C2012X7R2E153KT5 X7R 250V
±10% 1.25 ±0.20
C2012X8R1H223KT5 X8R 50V
±10% 0.85 ±0.10
C2012X8R1H333KT5 X8R 50V
±10% 0.85 ±0.10
C2012X8R1H473KT5 X8R 50V
±10% 1.25 ±0.20
C2012X8R1H683KT5 X8R 50V
±10% 1.25 ±0.20
Class 2 (Temperature Stable)
Temperature Characteristics X7R (-55 to +125ºC, ±15%), X8R (-55 to +150ºC, ±15%)
Capacitance
Range Table C2012 [EIA CC0805]
Capacitance Range Chart
Temperature Characteristics: X7R, (±15%), X8R (±15%)
Rated Voltage: 250V (2E), 100V (2A), 50V (1H)
0.85 mm
1.25 mm
Standard Thickness
Capacitance
(pF)
Cap
Code
Tolerance
X7R
X8R
2E
(250V)
2A
(100V)
1H
(50V)
1H
(50V)
1,000 102 K: ±10%
1,500 152
2,200 222
3,300 332
4,700 472
6,800 682
10,000 103
15,000 153
22,000 223
33,000 333
47,000 473
68,000 683
100,000 104
TDK MLCC US Catalog Version B11Page 183
C3216 [EIA CC1206]
Capacitance
Range Chart
TDK Part Number
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C3216X7R1C475MT5 X7R 16V
±20% 1.60 ±0.30
C3216X7R2A333KT5 X7R 100V
±10% 1.15 ±0.10
C3216X7R2A473KT5 X7R 100V
±10% 1.15 ±0.10
C3216X7R2A683KT5 X7R 100V
±10% 1.60 ±0.30
C3216X7R2A104KT5 X7R 100V
±10% 1.60 ±0.30
C3216X7R2A154KT5 X7R 100V
±10% 1.60 ±0.30
C3216X7R2A105KT5 X7R 100V
±10% 1.60 ±0.30
C3216X7R2E153KT5 X7R 250V
±10% 1.15 ±0.10
C3216X7R2E223KT5 X7R 250V
±10% 1.15 ±0.10
C3216X7R2E333KT5 X7R 250V
±10% 1.60 ±0.30
C3216X7R2E473KT5 X7R 250V
±10% 1.60 ±0.30
C3216X7R2E683KT5 X7R 250V
±10% 1.60 ±0.30
C3216X7R2E104KT5 X7R 250V
±10% 1.60 ±0.30
C3216X7R2J102KT5 X7R 630V
±10% 1.15 ±0.10
C3216X7R2J152KT5 X7R 630V
±10% 1.15 ±0.10
C3216X7R2J222KT5 X7R 630V
±10% 1.15 ±0.10
C3216X7R2J332KT5 X7R 630V
±10% 1.15 ±0.10
C3216X7R2J472KT5 X7R 630V
±10% 1.15 ±0.10
C3216X7R2J682KT5 X7R 630V
±10% 1.15 ±0.10
C3216X7R2J103KT5 X7R 630V
±10% 1.15 ±0.10
C3216X7R2J153KT5 X7R 630V
±10% 1.30 ±0.15
C3216X7R2J223KT5 X7R 630V
±10% 1.30 ±0.15
C3216X7R2J333KT5 X7R 630V
±10% 1.60 ±0.30
Class 2 (Temperature Stable)
Temperature Characteristics X7R (-55 to +125ºC, ±15%)
Capacitance
Range Table C3216 [EIA CC1206]
Capacitance Range Chart
Temperature Characteristics: X7R, (±15%)
Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 16V (1C)
1.15 mm
1.30 mm
1.60 mm
Standard Thickness
Capacitance
(pF)
Cap
Code
Tolerance
X7R
2J
(630V)
2E
(250V)
2A
(100V)
1C
(16V)
1,000 102 K: ±10%
1,500 152
2,200 222
3,300 332
4,700 472
6,800 682
10,000 103
15,000 153
22,000 223
33,000 333
47,000 473
68,000 683
100,000 104
150,000 154
1,000,000 105
4,700,000 475
TDK MLCC US Catalog Version B11Page 184
C3225 [EIA CC1210]
Capacitance
Range Chart
TDK Part Number
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C3225X7R1C335KT5 X7R 16V
±10% 2.00 ±0.20
C3225X7R1C475KT5 X7R 16V
±10% 2.50 ±0.30
C3225X7R1E105KT5 X7R 25V
±10% 1.15 ±0.10
C3225X7R1E155KT5 X7R 25V
±10% 1.60 ±0.30
C3225X7R1E225KT5 X7R 25V
±10% 2.00 ±0.20
C3225X7R1H474KT5 X7R 50V
±10% 1.60 ±0.30
C3225X7R1H684KT5 X7R 50V
±10% 2.00 ±0.20
C3225X7R2A334KT5 X7R 100V
±10% 2.00 ±0.20
C3225X7R2A105KT5 X7R 100V
±10% 2.00 ±0.20
C3225X7R2A225KT5 X7R 100V
±10% 2.30 ±0.20
C3225X7R2E104KT5 X7R 250V
±10% 2.00 ±0.20
C3225X7R2E154KT5 X7R 250V
±10% 2.00 ±0.20
C3225X7R2E224KT5 X7R 250V
±10% 2.00 ±0.20
C3225X7R2J473KT5 X7R 630V
±10% 2.00 ±0.20
C3225X7R2J683KT5 X7R 630V
±10% 2.00 ±0.20
Class 2 (Temperature Stable)
Temperature Characteristics X7R (-55 to +125ºC, ±15%)
Capacitance
Range Table C3225 [EIA CC1210]
Capacitance Range Chart
Temperature Characteristics: X7R, (±15%)
Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C)
2.00 mm
2.30 mm
2.50 mm
1.15 mm
1.60 mm
Standard Thickness
Capacitance
(pF)
Cap
Code
Tolerance
X7R
2J
(630V)
2E
(250V)
2A
(100V)
1H
(50V)
1E
(25V)
1C
(16V)
47,000 473 K: ±10%
68,000 683
100,000 104
150,000 154
220,000 224
330,000 334
470,000 474
680,000 684
1,000,000 105
1,500,000 155
2,200,000 225
3,300,000 335
4,700,000 475
Standard Thickness
TDK MLCC US Catalog Version B11Page 185
C4532 [EIA CC1812]
Capacitance
Range Chart
TDK Part Number
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C4532X7R1C685KT5 X7R 16V
±10% 2.00 ±0.20
C4532X7R1C106KT5 X7R 16V
±10% 2.30 ±0.20
C4532X7R1E335KT5 X7R 25V
±10% 1.60 ±0.30
C4532X7R1E475KT5 X7R 25V
±10% 2.00 ±0.20
C4532X7R1H105KT5 X7R 50V
±10% 1.60 ±0.30
C4532X7R1H155KT5 X7R 50V
±10% 2.30 ±0.20
C4532X7R2A684KT5 X7R 100V
±10% 2.30 ±0.20
C4532X7R2E154KT5 X7R 250V
±10% 1.60 ±0.30
C4532X7R2E224KT5 X7R 250V
±10% 2.30 ±0.20
C4532X7R2E334KT5 X7R 250V
±10% 2.30 ±0.20
C4532X7R2E474KT5 X7R 250V
±10% 2.30 ±0.20
C4532X7R2J683KT5 X7R 630V
±10% 1.60 ±0.30
C4532X7R2J104KT5 X7R 630V
±10% 2.30 ±0.20
Class 2 (Temperature Stable)
Temperature Characteristics X7R (-55 to +125ºC, ±15%)
Capacitance
Range Table C4532 [EIA CC1812]
Capacitance Range Chart
Temperature Characteristics: X7R, (±15%)
Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C)
2.00 mm
2.30 mm
1.60 mm
Capacitance
(pF)
Cap
Code
Tolerance
X7R
2J
(630V)
2E
(250V)
2A
(100V)
1H
(50V)
1E
(25V)
1C
(16V)
68,000 683 K: ±10%
100,000 104
150,000 154
220,000 224
330,000 334
470,000 474
680,000 684
1,000,000 105
1,500,000 155
3,300,000 335
4,700,000 475
6,800,000 685
10,000,000 106
TDK MLCC US Catalog Version B11Page 186
C5750 [EIA CC2220]
Capacitance
Range Chart
TDK Part Number
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C5750X7R1C226MT5 X7R 16V
±20% 2.80 ±0.20
C5750X7R1E685KT5 X7R 25V
±10% 1.60 ±0.30
C5750X7R1E106KT5 X7R 25V
±10% 2.00 ±0.20
C5750X7R1E156MT5 X7R 25V
±20% 2.80 ±0.20
C5750X7R1H225KT5 X7R 50V
±10% 1.60 ±0.30
C5750X7R1H335KT5 X7R 50V
±10% 2.30 ±0.20
C5750X7R1H475KT5 X7R 50V
±10% 2.80 ±0.20
C5750X7R2A684KT5 X7R 100V
±10% 1.60 ±0.30
C5750X7R2A105KT5 X7R 100V
±10% 2.30 ±0.20
C5750X7R2A155KT5 X7R 100V
±10% 2.30 ±0.20
C5750X7R2E334KT5 X7R 250V
±10% 1.60 ±0.30
C5750X7R2E474KT5 X7R 250V
±10% 2.30 ±0.20
C5750X7R2E684KT5 X7R 250V
±10% 2.30 ±0.20
C5750X7R2E105KT5 X7R 250V
±10% 2.30 ±0.20
C5750X7R2J154KT5 X7R 630V
±10% 1.60 ±0.30
C5750X7R2J224KT5 X7R 630V
±10% 2.30 ±0.20
Class 2 (Temperature Stable)
Temperature Characteristics X7R (-55 to +125ºC, ±15%)
Capacitance
Range Table C5750 [EIA CC2220]
Capacitance Range Chart
Temperature Characteristics: X7R, (±15%)
Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C)
2.00 mm
2.30 mm
2.80 mm
1.60 mm
Standard Thickness
Capacitance
(pF)
Cap
Code
Tolerance
X7R
2J
(630V)
2E
(250V)
2A
(100V)
1H
(50V)
1E
(25V)
1C
(16V)
150,000 154 K: ±10%
220,000 224
330,000 334
470,000 474
680,000 684
1,000,000 105
1,500,000 155
2,200,000 225
3,300,000 335
4,700,000 475
6,800,000 685
10,000,000 106
15,000,000 156
22,000,000 226
TDK MLCC US Catalog Version B11Page 187
General
Specifications C Series –Open Mode Design
No. Item Performance Test or Inspection Method
1External
Appearance
No defects which may affect
performance.
Inspect with magnifying glass (3×).
2Insulation
Resistance
10,000MΩor 500MΩ•μF min.,
whichever smaller. (As for the
capacitors of rated voltage 16V DC,
10,000 MΩor 100MΩ•μF min.,)
Apply rated voltage for 60s. As for the rated voltage
630V DC, apply 500V DC.
3Voltage Proof Withstand test voltage without
insulation breakdown or other damage.
Above DC voltage shall be applied for 1 to 5s. Charge /
discharge current shall not exceed 50mA.
4Capacitance Within the specified tolerance.
5Dissipation
Factor
(Class 2)
See No.4 in this table for measuring condition.
6Temperature
Characteristics
of Capacitance
(Class 2)
Capacitance Change (%) Capacitance shall be measured by the steps shown in
the following table after thermal equilibrium is obtained
for each step.
∆C be calculated ref. STEP 3 reading
7Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other abnormal
signs.
Reflow solder the capacitors on P.C. board (shown in
Appendix 1a or Appendix 1b) and apply a pushing
force of 5N for 10±1s.
8Bending No mechanical damage. Reflow solder the capacitor on P.C. board (shown in
Appendix 2) and bend it for 1mm.
Rated Voltage Apply voltage
RV ≤ 100V 2.5 ×rated voltage
RV > 100V 1.5 ×rated voltage
Class Rated
Capacitance
Measuring
Frequency
Measuring
voltage
Class 2 C ≤ 10uF 1kHz±10% 1.0±0.2Vrms
C > 10uF 120Hz±20% 0.5±0.2 Vrms
T.C. Rated Voltage (DC) D.F.
X7R
X8R
RV = 25V& 50V 3% max.
RV ≤ 16V 5% max.
No Voltage Applied
X7R: ±15%
X8R: ±15% Step Temperature (ºC)
1Reference temp. ±2
2Min. operating temp. ±2
3Reference temp. ±2
4Max. operating temp. ±2
Pushing force
P.C. board
Capacitor
1
20
50 F
R230
45 45 Unit: mm
TDK MLCC US Catalog Version B11Page 188
General
Specifications C Series –Open Mode Design
No. Item Performance Test or Inspection Method
9Solderability New solder to cover over 75% of
termination.
25% may have pinholes or rough spots
but not concentrated in one spot.
Ceramic surface of “A sections” shall
not be exposed due to melting or
shifting of termination material.
Completely soak both terminations in solder at
235±5ºC for 2±0.5s.
Solder: H63A (JIS Z 3282)
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
10 Resistance to solder heat Completely soak both terminations in solder at
260±5ºC for 5±1s.
Preheating condition
Temp.: 150±10ºC
Time : 1 to 2min.
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
Solder: H63A (JIS Z 3282)
Leave the capacitor in ambient conditions for 6 to 24h
before measurement.
External
appearance
No cracks are allowed and terminations
shall be covered at least 60% with new
solder.
Capacitance
D.F. (Class 2) Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
Proof
No insulation breakdown or other
damage.
11 Vibration Reflow solder the capacitor on P.C. board (shown in
Appendix 1a or Appendix 1b) before testing.
Vibrate the capacitor with amplitude of 1.5mm P-P
sweeping the frequencies from 10Hz to 55Hz and back
to 10Hz after 1min.
Repeat this for 2h each in 3 perpendicular directions.
External
appearance
No mechanical damage.
Capacitance
D.F. (Class 2) Meet the initial spec.
A section
Characteristics Change from the
value before test
Class 2 X7R
X8R ±7.5%
Characteristics Change from the
value before test
Class 2 X7R
X8R ±7.5%
TDK MLCC US Catalog Version B11Page 189
General
Specifications C Series –Open Mode Design
No. Item Performance Test or Inspection Method
12 Temperature cycle Reflow solder the capacitors on a P.C. board (shown in
Appendix 1a or Appendix 1b) before testing.
Expose the capacitor in the conditions in step 1
through step 4, and repeat 5 times consecutively.
Leave the capacitor in ambient conditions for 24±2h
before measurement.
External
appearance
No mechanical damage.
Capacitance
D.F. (Class 2) Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
Proof
No insulation breakdown or other
damage.
13 Moisture Resistance (Steady State) Reflow solder the capacitor on P.C. board (shown in
Appendix 1a or Appendix 1b) before testing.
Leave at temperature 40±2ºC, 90 to 95%RH for 500
+24,0h.
Leave the capacitor in ambient condition for 24±2h
before measurement.
External
appearance
No mechanical damage.
Capacitance
D.F. (Class 2) Characteristics
X7R: 200% of initial spec. max.
X8R: 200% of initial spec. max.
Insulation
Resistance
1,000MΩor 50MΩ•μF min., whichever
smaller. (As for the capacitors of rated
voltage 16V DC, 1,000 MΩor 10MΩ•μF
min.,)
Step Temperature (ºC) Time (min.)
1Min. operating temp. ±330 ±3
2Reference Temp. 2 – 5
3Max. operating temp. ±230 ±2
4Reference Temp. 2 - 5
Characteristics Change from the
value before test
Class 2 X7R
X8R ±7.5%
Characteristics Change from the
value before test
Class 2 X7R
X8R ±12.5%
TDK MLCC US Catalog Version B11Page 190
General
Specifications C Series –Open Mode Design
No. Item Performance Test or Inspection Method
14 Moisture Resistance Reflow solder the capacitors on P.C. board (shown in
Appendix 1a or Appendix 1b) before testing.
Apply the rated voltage at temperature 40±2ºC and 90
to 95%RH for 500 +24,0h.
Charge/discharge current shall not exceed 50mA.
Leave the capacitor in ambient conditions for 24±2h
before measurement.
Voltage conditioning:
Voltage treat the capacitors under testing temperature
and voltage for 1 hour.
Leave the capacitors in ambient condition for 24±2h
before measurement.
Use this measurement for initial value.
External
appearance
No mechanical damage.
Capacitance
D.F. (Class 2) Characteristics
X7R: 200% of initial spec. max.
X8R: 200% of initial spec. max.
Insulation
Resistance
500MΩor 25MΩ•μF min., whichever
smaller. (As for the capacitors of rated
voltage 16V DC, 500 MΩor 5MΩ•μF
min.,)
15 Life Reflow solder the capacitors on P.C. board (shown in
Appendix 1a or Appendix 1b) before testing.
Apply rated voltage at maximum operating temperature
±2ºC for 1,000 +48, 0h. Some items may be tested at
higher voltage (1.2x, 1.5x or 2xRV).
Charge/discharge current shall not exceed 50mA.
Leave the capacitor in ambient conditions for 24±2h
before measurement.
Voltage conditioning:
Voltage treat the capacitors under testing temperature
and voltage for 1 hour.
Leave the capacitors in ambient condition for 24±2h
before measurement.
Use this measurement for initial value.
External
appearance
No mechanical damage.
Capacitance
D.F. (Class 2) Characteristics
X7R: 200% of initial spec. max.
X8R: 200% of initial spec. max.
Insulation
Resistance
1,000MΩor 50MΩ•μF min., whichever
smaller. (As for the capacitors of rated
voltage 16V DC, 1,000 MΩor 10MΩ•μF
min.,)
*As for the initial measurement of capacitors (Class 2) on number 6, 10, 11, 12 and 13, leave capacitor at 150 -10, 0°C for
1 hour and measure the value after leaving capacitor for 24±2h in ambient condition.
Characteristics Change from the
value before test
Class 2 X7R
X8R ±12.5%
Characteristics Change from the
value before test
Class 2 X7R
X8R ±15%
TDK MLCC US Catalog Version B11Page 191
General
Specifications C Series –Open Mode Design
Appendix -1a
P.C. Board for reliability test
Applied for C2012, C3216
Appendix -1b
P.C. Board for reliability test
Applied for C3225, C4532, C5750
Appendix - 2
P.C. Board for bending test
100 mm
Solder Resist Copper
b
a
c
40 mm
Copper
Solder Resist
Slit
40 mm
100 mm
c
b
a
Solder Resist Copper
b
a
1.0 mm
c
40 mm
100 mm
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness: 1.6mm
Copper ( thickness 0.035mm )
Solder resist
Case Code Dimensions (mm)
JIS EIA a b c
C2012 CC0805 1.2 4.0 1.65
C3216 CC1206 2.2 5.0 2.0
C3225 CC1210 2.2 5.0 2.9
C4532 CC1812 3.5 7.0 3.7
C5750 CC2220 4.5 8.0 5.6
TDK MLCC US Catalog Version B11Page 192
Soldering
Information C Series –Open Mode Design
Wave Soldering Unit: mm
Type
Symbol
C2012
[CC0805]
C3216
[CC1206]
A1.0 -1.3 2.1 -2.5
B1.0 -1.2 1.1 -1.3
C0.8 -1.1 1.0 -1.3
• Recommended Soldering Land Pattern • Recommended Soldering Profile
A
B
C
Chip capacitor Solder land
Solder resist
Reflow Soldering Unit: mm
Type
Symbol
C2012
[CC0805]
C3216
[CC1206]
A0.9 -1.2 2.0 -2.4
B0.7 -0.9 1.0 -1.2
C0.9 -1.2 1.1 -1.6
Reflow Soldering Unit: mm
Type
Symbol
C3225
[CC1210]
C4532
[CC1812]
C5750
[CC2220]
A2.0 -2.4 3.1 -3.7 4.1 -4.8
B1.0 -1.2 1.2 -1.4 1.2 -1.4
C1.9 -2.5 2.4 -3.2 4.0 -5.0
Excessive
solder
Higher tensile
force on the chip
capacitor may
cause cracking.
Adequate
solder
Insufficient
solder
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
• Recommended Solder Amount
Recommended soldering duration
Temp./
Dura.
Solder
Wave Soldering Reflow Soldering
Peak temp
(°C)
Duration
(sec.)
Peak temp
(°C)
Duration
(sec.)
Sn-Pb
Solder 250 max. 3 max. 230 max. 20 max.
Lead-Free
Solder 260 max. 5 max. 260 max. 10 max.
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Preheating Condition
Soldering Case Size -JIS (EIA) Temp. (ºC)
Wave
soldering
C2012(CC0805), C3216(CC1206) ∆T ≤ 150
Reflow
soldering
C2012(CC0805), C3216(CC1206) ∆T ≤ 150
C3225(CC1210), C4532(CC1812),
C5750(CC2220) ∆T ≤ 130
Manual
soldering
C2012(CC0805), C3216(CC1206) ∆T ≤ 150
C3225(CC1210), C4532(CC1812),
C5750(CC2220) ∆T ≤ 130
Maximum amount
Minimum amount
Reflow Soldering
Manual soldering
(Solder iron)
∆T
Preheating
3sec. (As short as possible)
0
300
Temp. (ºC)
Wave Soldering
Peak
Temp
0
∆T
Preheating Soldering Natural
cooling
Over 60 sec. Over 60 sec.
Peak Temp time
Temp. (ºC)
Temp (ºC)
0
∆T
Soldering Natural
cooling
Preheating
Peak
Temp
Over 60 sec.
Peak Temp time
TDK MLCC US Catalog Version B11Page 193
Packaging
Information C Series –Open Mode Design
• Carrier Tape Configuration
• Chip Quantity Per Reel and Structure of Reel (Paper & Plastic)
• Peel Back Force (Top Tape)
• Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
• The missing of components shall be less than
0.1%
• Components shall not stick to the cover tape.
• The cover tape shall not protrude beyond the
edges of the carrier tape and shall not cover the
sprocket holes.
Paper carrier tape
Pitch hole
Top cover tape
Bottom cover tape Plastic carrier tape
Top cover tape
Pitch hole
Paper Carrier Tape & Reel Plastic Carrier Tape & Reel
Case Code Chip
Thickness Taping Material Chip quantity (pcs.)
JIS EIA φ178mm (7”) reel φ330mm (13”) reel
C2012 CC0805 0.85 mm Paper/Plastic 4,000 10,000
1.25 mm Plastic 2,000
C3216 CC1206
1.15 mm
Plastic 2,000 10,000
1.30 mm
1.60 mm 8,000
C3225 CC1210
1.15 mm
Plastic
2,000 10,000
1.60 mm 8,000
2.00 mm
1,000 5,0002.30 mm
2.50 mm
C4532 CC1812
1.60 mm
Plastic 1,000 3,0002.00 mm
2.30 mm 500
C5750 CC2220
1.60 mm
Plastic
1,000
3,0002.00 mm
5002.30 mm
2.80 mm 2,000
0~15°
Carrier tape
Top cover tape
Direction & angle of pull
0.05 –0.7 N
Drawing direction Leader
400mm min
Bulk
160mm min.
Chips Bulk
160mm min
TDK MLCC US Catalog Version B11Page 194
Additional
Information C Series –Open Mode Design
• Shape & Dimensions
TDK Corporation established internal product environmental
assurance standards that include the six hazardous
substances banned by the EU RoHS Directive1enforced on
July 1, 2006 along with additional substances independently
banned by TDK and has successfully completed making
general purpose electronic components conform to the
RoHS Directive2.
L
B
G
BW
T
Terminal electrode
Ceramic dielectric
Internal electrode
3
4
5
12
No. NAME MATERIAL
Class 1 Class 2
(1) Ceramic Dielectric CaZrO3BaTiO3
(2) Internal Electrode Nickel (Ni)
(3)
Termination
Copper (Cu)
(4) Nickel (Ni)
(5) Tin (Sn)
• Inside Structure & Material System
Case Code Dimensions (mm)
JIS EIA L W T B G
C2012 CC0805 2.00 1.20 0.85 0.20 min. 0.50 min.
1.25
C3216 CC1206 3.20 1.60
1.15
0.20 min. 1.00 min.1.30
1.60
C3225 CC1210 3.20 2.50
1.15
0.20 min.
1.00 min.
1.60
2.00
2.30 0.30 min.
2.50
C4532 CC1812 4.50 3.20
1.60
0.20 min. 2.00 min.2.00
2.30
C5750 CC2220 5.70 5.00
1.60
0.20 min. 2.00 min.
2.00
2.30
2.80
• Environmental Information
1. Abbreviation for Restriction on Hazardous
Substances, which refers to the regulation EU
Directive 2002/95/EC on hazardous substances by
the European Union (EU) effective from July 1, 2006.
The Directive bans the use of six specific hazardous
substances in electric and electronic devices and
products handled within the EU. The six substances
are lead, mercury, cadmium, hexavalent chromium,
PBB (polybrominated biphenyls), and PBDE
(polybrominated diphenyl ethers).
2. This means that, in conformity with the EU Directive
2002/95/EC, lead, cadmium, mercury, hexavalent
chromium, and specific bromine-based flame
retardants, PBB and PBDE, have not been used,
except for exempted applications.
For REACH (SVHC : 15 substances according to ECHA /
October 2008) : All TDK MLCC do not contain these
15 substances.
For European Directive 2000/53/CE and 2005/673/CE :
Cadmium, Hexavalent Chromium, Mercury, Lead are
not contained in all TDK MLCC.
For European Directive 2003/11/CE : Pentabromodiphenyl-
ether, Octabromodiphenyl-ether are not contained in
all TDK MLCC.