LTC2203/LTC2202
1
22032fd
16-Bit, 25Msps/10Msps ADCs
The LTC
®
2203/LTC2202 are 25Msps/10Msps, sampling
16-bit A/D converters designed for digitizing high frequen-
cy, wide dynamic range signals with input frequencies up
to 380MHz. The input range of the ADC can be optimized
with the PGA front end.
The LTC2203/LTC2202 are perfect for demanding app-
lications, with AC performance that includes 81.6dB
SNR and 100dB spurious free dynamic range (SFDR).
Maximum DC specs include ±4LSB INL, ±1LSB DNL (no
missing codes).
A separate output power supply allows the CMOS output
swing to range from 0.5V to 3.6V.
A single-ended CLK input controls converter operation. An
optional clock duty cycle stabilizer allows high performance
at full speed with a wide range of clock duty cycles.
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 4843302, 6949965B1.
n Telecommunications
n Receivers
n Cellular Base Stations
n Spectrum Analysis
n Imaging Systems
n ATE
n Sample Rate: 25Msps/10Msps
n 81.6dB SNR and 100dB SFDR (2.5V Range)
n SFDR 90dB at 70MHz (1.667VP-P Input Range)
n PGA Front End (2.5VP-P or 1.667VP-P Input Range)
n 380MHz Full Power Bandwidth S/H
n Optional Internal Dither
n Optional Data Output Randomizer
n Single 3.3V Supply
n Power Dissipation: 220mW/140mW
n Clock Duty Cycle Stabilizer
n Out-of-Range Indicator
n Pin Compatible Family
25Msps: LTC2203 (16-Bit)
10Msps: LTC2202 (16-Bit)
n 48-Pin (7mm × 7mm) QFN Package
+
S/H
AMP
CORRECTION
LOGIC AND
SHIFT REGISTER
OUTPUT
DRIVERS
16-BIT
PIPELINED
ADC CORE
INTERNAL ADC
REFERENCE
GENERATOR
1.25V
COMMON MODE
BIAS VOLTAGE
CLOCK/DUTY
CYCLE
CONTROL
CLK PGA SHDN DITH MODE RAND
VCM
ANALOG
INPUT
22032 TA01
D15
D0
CMOS
OUTPUTS
0.5V TO 3.6V
3.3V
3.3V
SENSE
OGND
OVDD
2.2μF 1μF
1μF F F
VDD
GND
ADC CONTROL INPUTS
AIN +
AIN
OF
CLKOUT+
CLKOUT–
OE
FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 TA02
LTC2203: 128K Point FFT,
fIN = 5.1MHz, –1dBFS, PGA = 0
FEATURES DESCRIPTION
APPLICATIONS
TYPICAL APPLICATION
LTC2203/LTC2202
2
22032fd
TOP VIEW
UK PACKAGE
48-LEAD
(
7mm s 7mm
)
PLASTIC QFN
SENSE 1
VCM 2
VDD 3
VDD 4
GND 5
AIN+ 6
AIN7
GND 8
GND 9
CLK 10
GND 11
VDD 12
36 OVDD
35 D11
34 D10
33 D9
32 D8
31 OGND
30 CLKOUT+
29 CLKOUT
28 D7
27 D6
26 D5
25 OVDD
48 GND
47 PGA
46 RAND
45 MODE
44 OE
43 OF
42 D15
41 D14
40 D13
39 D12
38 OGND
37 OVDD
VDD 13
VDD 14
GND 15
SHDN 16
DITH 17
D0 18
D1 19
D2 20
D3 21
D4 22
OGND 23
OVDD 24
49
EXPOSED PAD IS GND (PIN 49)
MUST BE SOLDERED TO PCB BOARD
TJMAX = 150°C, θJA = 29°C/W
Supply Voltage (VDD) .................................. 0.3V to 4V
Digital Output Supply Voltage (OVDD) ......... 0.3V to 4V
Digital Output Ground Voltage (OGND) ....... 0.3V to 1V
Analog Input Voltage (Note 3) .... 0.3V to (VDD + 0.3V)
Digital Input Voltage ................... 0.3V to (VDD + 0.3V)
Digital Output Voltage ............... 0.3V to (OVDD + 0.3V)
Power Dissipation ............................................2000mW
Operating Temperature Range
LTC2203C/LTC2202C ............................. 0°C to 70°C
LTC2203I/LTC2202I ............................40°C to 85°C
Storage Temperature Range ................. 65°C to 150°C
OVDD = VDD (Notes 1 and 2)
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION
ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC2203CUK#PBF LTC2203CUK#TRPBF LTC2203UK 48-Lead (7mm × 7mm) Plastic QFN 0°C to 70°C
LTC2202CUK#PBF LTC2202CUK#TRPBF LTC2202UK 48-Lead (7mm × 7mm) Plastic QFN 0°C to 70°C
LTC2203IUK#PBF LTC2203IUK#TRPBF LTC2203UK 48-Lead (7mm × 7mm) Plastic QFN 40°C to 85°C
LTC2202IUK#PBF LTC2202IUK#TRPBF LTC2202UK 48-Lead (7mm × 7mm) Plastic QFN 40°C to 85°C
LEAD BASED FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC2203CUK LTC2203CUK#TR LTC2203UK 48-Lead (7mm × 7mm) Plastic QFN 0°C to 70°C
LTC2202CUK LTC2202CUK#TR LTC2202UK 48-Lead (7mm × 7mm) Plastic QFN 0°C to 70°C
LTC2203IUK LTC2203IUK#TR LTC2203UK 48-Lead (7mm × 7mm) Plastic QFN 40°C to 85°C
LTC2202IUK LTC2202IUK#TR LTC2202UK 48-Lead (7mm × 7mm) Plastic QFN 40°C to 85°C
Consult LTC Marketing for parts specifi ed with wider operating temperature ranges. *The temperature grade is identifi ed by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifi cations, go to: http://www.linear.com/tapeandreel/
LTC2203/LTC2202
3
22032fd
CONVERTER CHARACTERISTICS
PARAMETER CONDITIONS MIN TYP MAX UNITS
Resolution (No missing codes) 16
Integral Linearity Error Differential Analog Input (Note 5) TA = 25°C ±1.2 ±4.0 LSB
Integral Linearity Error Differential Analog Input (Note 5) l±1.5 ±4.5 LSB
Differential Linearity Error Differential Analog Input l±0.3 ±1 LSB
Offset Error (Note 6) l±2 ±10 mV
Offset Drift ±10 μV/°C
Gain Error External Reference l±0.2 ±1.5 %FS
Full-Scale Drift Internal Reference
External Reference
±30
±15
ppm/°C
ppm/°C
Transition Noise External Reference (2.5V Range, PGA = 0) 1.92 LSBRMS
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VIN Analog Input Range (AIN+ AIN)3.135V ≤ VDD ≤ 3.465V 1.667 or 2.5 VP-P
VIN, CM Analog Input Common Mode Differential Input (Note 7) l1 1.25 1.5 V
IIN Analog Input Leakage Current 0V ≤ AIN+, AIN≤ VDD (Note 9) l–1 1 μA
ISENSE SENSE Input Leakage Current 0V ≤ SENSE ≤ VDD (Note 10) l–3 3 μA
IMODE MODE Pin Pull-Down Current to GND 10 μA
IOE OE Pin Pull-Down Current to GND 10 μA
CIN Analog Input Capacitance Sample Mode CLK = 0
Hold Mode CLK = 0
10.5
1.4
pF
pF
tAP Sample-and-Hold
Acquisition Delay Time
0.9 ns
tJITTER Sample-and-Hold
Acquisition Delay Time Jitter
200 fSRMS
CMRR Analog Input
Common Mode Rejection Ratio
1V < (AIN+ = AIN) <1.5V 80 dB
BW-3dB Full Power Bandwidth Rs < 20Ω 380 MHz
SYMBOL PARAMETER CONDITIONS MIN
LTC2203
TYP MAX MIN
LTC2202
TYP MAX UNITS
SNR Signal-to-Noise Ratio 1MHz Input (2.25V Range, PGA = 0)
1MHz Input (1.667V Range, PGA = 1)
81.6
79.4
81.6
79.4
dBFS
dBFS
5MHz Input (2.5V Range, PGA = 0)
5MHz Input (1.667V Range, PGA = 1)
l80 81.6
79.4
80 81.6
79.4
dBFS
dBFS
12.5MHz Input (2.5V Range, PGA = 0)
12.5MHz Input (1.667V Range, PGA = 1)
81.4
79.3
81.4
79.3
dBFS
dBFS
30MHz Input (2.5V Range, PGA = 0)
30MHz Input (1.667V Range, PGA = 1) l77.5
80.8
78.9 77.5
80.8
78.9
dBFS
dBFS
70MHz Input (2.5V Range, PGA = 0)
70MHz Input (1.667V Range, PGA =1 )
78.3
77.2
78.3
77.2
dBFS
dBFS
ANALOG INPUT
DYNAMIC ACCURACY
The l denotes the specifi cations which apply over the full operating temperature range,
otherwise specifi cations are at TA = 25°C. AIN = –1dBFS. (Note 4)
The l denotes the specifi cations which apply over the full operating temperature range, otherwise
specifi cations are at TA = 25°C. (Note 4)
The
l denotes the specifi cations which apply over the full operating
temperature range, otherwise specifi cations are at TA = 25°C. (Note 4)
LTC2203/LTC2202
4
22032fd
The l denotes the specifi cations which apply over the full operating temperature range,
otherwise specifi cations are at TA = 25°C. AIN = –1dBFS. (Note 4)
DYNAMIC ACCURACY
SYMBOL PARAMETER CONDITIONS MIN
LTC2203
TYP MAX MIN
LTC2202
TYP MAX UNITS
SFDR Spurious Free
Dynamic Range
2nd or 3rd Harmonic
1MHz Input (2.5V Range, PGA = 0)
1MHz Input (1.667V Range, PGA = 1)
100
100
100
100
dBc
dBc
5MHz Input (2.5V Range, PGA = 0)
5MHz Input (2.5V Range, PGA = 0)
5MHz Input (1.667V Range, PGA = 1)
l85
87
100
100
100
85
87
100
100
100
dBc
dBc
dBc
12.5MHz Input (2.5V Range, PGA = 0)
12.5MHz Input (1.667V Range, PGA = 1)
95
100
95
100
dBc
dBc
30MHz Input (2.5V Range, PGA = 0)
30MHz Input (1.667V Range, PGA = 1) l85
90
95 85
90
95
dBc
dBc
70MHz Input (2.5V Range, PGA = 0)
70MHz Input (1.667V Range, PGA = 1)
85
90
85
90
dBc
dBc
SFDR Spurious Free
Dynamic Range
4th Harmonic or Higher
1MHz Input (2.5V Range, PGA = 0)
1MHz Input (1.667V Range, PGA = 1)
100
100
100
100
dBc
dBc
5MHz Input (2.5V Range, PGA = 0)
5MHz Input (1.667V Range, PGA = 1)
l90 100
100
90 100
100
dBc
dBc
12.5MHz Input (2.5V Range, PGA = 0)
12.5MHz Input (1.667V Range, PGA = 1)
100
100
100
100
dBc
dBc
30MHz Input (2.5V Range, PGA = 0)
30MHz Input (1.667V Range, PGA = 1) l90
100
100 90
100
100
dBc
dBc
70MHz Input (2.5V Range, PGA = 0)
70MHz Input (1.667V Range, PGA = 1)
90
90
90
90
dBc
dBc
S/(N+D) Signal-to-Noise
Plus Distortion Ratio
1MHz Input (2.5V Range, PGA = 0)
1MHz Input (1.667V Range, PGA = 1)
81.5
79.3
81.5
79.3
dBFS
dBFS
5MHz Input (2.5V Range, PGA = 0)
5MHz Input (1.667V Range, PGA = 1)
l79.7 81.5
79.3
79.7 81.5
79.3
dBFS
dBFS
12.5MHz Input (2.5V Range, PGA = 0)
12.5MHz Input (1.667V Range, PGA = 1)
81.3
79.2
81.3
79.2
dBFS
dBFS
30MHz Input (2.5V Range, PGA = 0)
30MHz Input (1.667V Range, PGA = 1) l77.2
80.6
78.6 77.2
80.6
78.6
dBFS
dBFS
70MHz Input (2.5V Range, PGA = 0)
70MHz Input (1.667V Range, PGA = 1)
78.1
77
78.1
77
dBFS
dBFS
SFDR Spurious Free
Dynamic Range
at –25dBFS
Dither “OFF”
1MHz Input (2.5V Range, PGA = 0)
1MHz Input (1.667V Range, PGA = 1)
105
105
105
105
dBFS
dBFS
5MHz Input (2.5V Range, PGA = 0)
5MHz Input (1.667V Range, PGA = 1)
105
105
105
105
dBFS
dBFS
12.5MHz Input (2.5V Range, PGA = 0)
12.5MHz Input (1.667V Range, PGA = 1)
105
105
105
105
dBFS
dBFS
30MHz Input (2.5V Range, PGA = 0)
30MHz Input (1.667V Range, PGA = 1)
105
105
105
105
dBFS
dBFS
70MHz Input (2.5V Range, PGA = 0)
70MHz Input (1.667V Range, PGA = 1)
100
100
100
100
dBFS
dBFS
LTC2203/LTC2202
5
22032fd
PARAMETER CONDITIONS MIN TYP MAX UNITS
VCM Output Voltage IOUT = 0 1.15 1.25 1.35 V
VCM Output Tempco IOUT = 0 ±40 ppm/°C
VCM Line Regulation 3.135V ≤ VDD ≤ 3.465V 1 mV/ V
VCM Output Resistance 1mA ≤ | IOUT | ≤ 1mA 2 Ω
COMMON MODE BIAS CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
LOGIC INPUTS (CLK, OE, DITH, PGA, SHDN, RAND)
VIH High Level Input Voltage VDD = 3.3V l2V
VIL Low Level Input Voltage VDD = 3.3V l0.8 V
IIN Digital Input Current VIN = 0V to VDD l±10 μA
CIN Digital Input Capacitance (Note 7) 1.5 pF
LOGIC OUTPUTS
OVDD = 3.3V
VOH High Level Output Voltage VDD = 3.3V IO = –10μA
I
O = –200μA l3.1
3.299
3.29
V
V
VOL Low Level Output Voltage VDD = 3.3V IO = 160μA
I
O = 1.6mA l
0.01
0.10 0.4
V
V
ISOURCE Output Source Current VOUT = 0V 50 mA
ISINK Output Sink Current VOUT = 3.3V 50 mA
OVDD = 2.5V
VOH High Level Output Voltage VDD = 3.3V IO = –200μA 2.49 V
VOL Low Level Output Voltage VDD = 3.3V IO = 1.60mA 0.1 V
OVDD = 1.8V
VOH High Level Output Voltage VDD = 3.3V IO = –200μA 1.79 V
VOL Low Level Output Voltage VDD = 3.3V IO = 1.60mA 0.1 V
DIGITAL INPUTS AND DIGITAL OUTPUTS
SYMBOL PARAMETER CONDITIONS MIN
LTC2203
TYP MAX MIN
LTC2202
TYP MAX UNITS
SFDR Spurious Free
Dynamic Range
at –25dBFS
Dither “ON”
1MHz Input (2.5V Range, PGA = 0)
1MHz Input (1.667V Range, PGA = 1)
115
115
115
115
dBFS
dBFS
5MHz Input (2.5V Range, PGA = 0)
5MHz Input (1.667V Range, PGA = 1)
l100 115
115
100 115
115
dBFS
dBFS
12.5MHz Input (2.5V Range, PGA = 0)
12.5MHz Input (1.667V Range, PGA = 1)
115
115
115
115
dBFS
dBFS
30MHz Input (2.5V Range, PGA = 0)
30MHz Input (1.667V Range, PGA = 1)
115
115
115
115
dBFS
dBFS
70MHz Input (2.5V Range, PGA = 0)
70MHz Input (1.667V Range, PGA = 1)
110
110
110
110
dBFS
dBFS
DYNAMIC ACCURACY
The l denotes the specifi cations which apply over the full operating temperature range,
otherwise specifi cations are at TA = 25°C. AIN = –1dBFS. (Note 4)
The l denotes the specifi cations which apply over
the full operating temperature range, otherwise specifi cations are at TA = 25°C. (Note 4)
The l denotes the specifi cations which apply over the
full operating temperature range, otherwise specifi cations are at TA = 25°C. (Note 4)
LTC2203/LTC2202
6
22032fd
TIMING CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltage values are with respect to GND, with GND and OGND
shorted (unless otherwise noted).
Note 3: When these pin voltages are taken below GND or above VDD, they
will be clamped by internal diodes. This product can handle input currents
of greater than 100mA below GND or above VDD without latchup.
Note 4: VDD = 3.3V, fSAMPLE = 25MHz (LTC2203), 10MHz (LTC2202),
input range = 2.5VP-P with differential drive (PGA = 0), unless otherwise
specifi ed.
Note 5: Integral nonlinearity is defi ned as the deviation of a code from a
“best fi t straight line” to the transfer curve. The deviation is measured from
the center of the quantization band.
Note 6: Offset error is the offset voltage measured from –1/2LSB when the
output code fl ickers between 0000 0000 0000 0000 and 1111 1111 1111
1111 in 2’s complement output mode.
Note 7: Guaranteed by design, not subject to test.
Note 8: Recommended operating conditions.
Note 9: Dynamic current from switched capacitor inputs is large compared
to DC leakage current, and will vary with sample rate.
Note 10: Leakage current will experience transient at power up. Keep
resistance < 1K Ω.
The l denotes the specifi cations which apply over the full operating temperature
range, otherwise specifi cations are at TA = 25°C. (Note 4)
The
l denotes the specifi cations which apply over the full operating temperature
range, otherwise specifi cations are at TA = 25°C. AIN = –1dBFS. (Note 4)
SYMBOL PARAMETER CONDITIONS MIN
LTC2203
TYP MAX MIN
LTC2202
TYP MAX UNITS
VDD Analog Supply Voltage l3.135 3.3 3.465 3.135 3.3 3.465 V
PSHDN Shutdown Power SHDN = VDD, CLK = VDD 22mW
OVDD Output Supply Voltage l0.5 3.6 0.5 3.6 V
IVDD Analog Supply Current l66 80 42 50 mA
PDIS Power Dissipation l220 264 140 165 mW
POWER REQUIREMENTS
SYMBOL PARAMETER CONDITIONS MIN
LTC2203
TYP MAX MIN
LTC2202
TYP MAX UNITS
fSSampling Frequency l1 25 1 10 MHz
tLCLK Low Time Duty Cycle Stabilizer Off
Duty Cycle Stabilizer On
l
l
18.9
5
20
20
500
500
40
5
50
50
500
500
ns
ns
tHCLK High Time Duty Cycle Stabilizer Off
Duty Cycle Stabilizer On
l
l
18.9
5
20
20
500
500
40
5
50
50
500
500
ns
ns
tAP Sample-and-Hold
Aperture Delay
0.9 0.9 ns
tDCLK to DATA Delay CL = 5pF (Note 7) l1.3 3.1 4.9 1.3 3.1 4.9 ns
tCCLK to CLKOUT Delay CL = 5pF (Note 7) l1.3 3.1 4.9 1.3 3.1 4.9 ns
tSKEW DATA to CLKOUT Skew CL = 5pF (Note 7) l0.6 0 0.6 0.6 0 0.6 ns
DATA Access Time
Bus Relinquish Time
CL = 5pF (Note 7)
(Note 7)
l
l
5
5
15
15
5
5
15
15
ns
ns
Pipeline
Latency
7 7 Cycles
LTC2203/LTC2202
7
22032fd
LTC2203: Integral Nonlinearity
(INL) vs Output Code
LTC2203: Differential Nonlinearity
(DNL) vs Output Code
LTC2203: AC Grounded Input
Histogram (256k Samples)
LTC2203: 128K Point FFT,
fIN = 1MHz, –1dBFS, PGA = 0
LTC2203: 128K Point FFT,
fIN = 1MHz, –10dBFS, PGA = 0
LTC2203: 128K Point FFT,
fIN = 1MHz, –20dBFS, PGA = 0
CODE
0
INL ERROR (LSB)
0.0
0.5
1.0
65536
22032 G01
0.5
–1.0
–2.0 16384 32768 49152
–1.5
2.0
1.5
CODE
0
–1.0
DNL ERROR (LSB)
0.8
0.4
0.2
0.0
1.0
0.4
16384 32768
22032 G02
0.6
0.6
0.8
0.2
49152 6553
6
OUTPUT CODE
32812
0
COUNT
10000
20000
30000
40000
50000
60000
32816 32820 32824 32828
22032 G03
32832
FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 GO4 FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 GO5 FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 GO6
tAP
ANALOG
INPUT
tH
tD
tC
tL
N – 7 N – 6 N – 5 N – 4 N – 3
CLK
CLKOUT+
CLKOUT
D0-D15, OF
22032 TD01
N + 1
N + 2
N + 4
N + 3
N
TIMING DIAGRAM
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2203/LTC2202
8
22032fd
LTC2203: 128K Point FFT,
fIN = 5.1MHz, –20dBFS, PGA = 0,
Internal Dither “On”
LTC2203: 32K Point 2-Tone FFT,
fIN = 4.9MHz and 30.1MHz,
–7dBFS, PGA = 0
LTC2203: 32K Point 2-Tone FFT,
fIN = 4.9MHz and 30.1MHz,
–15dBFS, PGA = 0
LTC2203: SFDR vs Input Level,
fIN = 5MHz, PGA = 0, Dither “Off”
LTC2203: SFDR vs Input Level,
fIN = 5MHz, PGA = 0, Dither “On”
LTC2203: 32K Point FFT,
fIN = 12.4MHz, –1dBFS, PGA = 0
FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G10 FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G11 FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G12
INPUT LEVEL (dBFS)
–70
SFDR (dBc AND dBFS)
80
100
120
22032 G13
60
40
60 –50 40 –30 –20 –10 0
20
0
140
INPUT LEVEL (dBFS)
–70
SFDR (dBc AND dBFS)
80
100
120
22032 G14
60
40
60 50 40 –30 –20 –10 0
20
0
140
FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G15
LTC2203: 128K Point FFT,
fIN = 5.1MHz, –1dBFS, PGA = 0
FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 GO7
LTC2203: 128K Point FFT,
fIN = 5.1MHz, –10dBFS, PGA = 0
LTC2203: 128K Point FFT,
fIN = 5.1MHz, –20dBFS, PGA = 0,
Internal Dither “Off”
FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 GO8 FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 GO9
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2203/LTC2202
9
22032fd
LTC2203: 32K Point FFT,
fIN = 12.4MHz, –10dBFS, PGA = 0
LTC2203: 32K Point FFT,
fIN = 12.4MHz, –20dBFS, PGA = 0
LTC2203: SFDR vs Input Level,
fIN = 12.7MHz, PGA = 0,
Dither “Off”
FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G16 FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G17 INPUT LEVEL (dBFS)
–70
SFDR (dBc AND dBFS)
80
100
120
22032 G18
60
40
60 50 40 –30 –20 –10 0
20
0
140
LTC2203: SFDR vs Input Level,
fIN = 12.7MHz, PGA = 0,
Dither “On”
LTC2203: 32K Point FFT,
fIN = 30MHz, –1dBFS, PGA = 1
LTC2203: 32K Point FFT,
fIN = 30MHz, –10dBFS, PGA = 1
LTC2203: 32K Point FFT,
fIN = 30MHz, –20dBFS, PGA = 1
LTC2203: SFDR vs Input Level,
fIN = 30.1MHz, PGA = 0,
Dither “Off”
LTC2203: SFDR vs Input Level,
fIN = 30.1MHz, PGA = 0,
Dither “On”
INPUT LEVEL (dBFS)
–70
SFDR (dBc AND dBFS)
80
100
120
22032 G19
60
40
60 –50 40 –30 –20 –10 0
20
0
140
FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G20 FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G21
FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G22 INPUT LEVEL (dBFS)
–80
SFDR (dBc AND dBFS)
80
100
120
22032 G23
60
40
–70 60 50 40 –30 –20 –10 0
20
0
140
INPUT LEVEL (dBFS)
–70
SFDR (dBc AND dBFS)
80
100
120
22032 G24
60
40
60 50 40 –30 –20 –10 0
20
0
140
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2203/LTC2202
10
22032fd
LTC2203: 32K Point 2-Tone FFT,
fIN = 44.9MHz and 70.1MHz,
–7dBFS, PGA = 0
LTC2203: 32K Point 2-Tone FFT,
fIN = 44.9MHz and 70.1MHz,
–15dBFS, PGA = 0
LTC2203: SFDR vs Input Level,
fIN = 70.1MHz, PGA = 0,
Dither “Off”
LTC2203: SFDR vs Input Level,
fIN = 70.1MHz, PGA = 0,
Dither “On”
LTC2203: SFDR (HD2 or HD3)
vs Input Frequency LTC2203: SNR vs Input Frequency
FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G28 FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G29 INPUT LEVEL (dBFS)
–70 –60 –50 –40 –30 –20 –10 0
SFDR (dbc AND dBFS)
80
100
120
22032 G30
60
40
20
0
140
INPUT LEVEL (dBFS)
–70
SFDR (dBc AND dBFS)
80
100
120
22032 G31
60
40
60 50 40 –30 –20 –10 0
20
0
140
INPUT FREQUENCY (MHz)
0
SFDR (dBc)
85
90
95
60 100
22032 G32
80
75
70 20 40 80
100
105
110
PGA = 1
PGA = 0
INPUT FREQUENCY (MHz)
0
73
SNR (dBFS)
74
76
77
78
80
82
22032 G33
75
40
20 100 120
60 140
79
80
81
PGA = 0
PGA = 1
LTC2203: 32K Point FFT,
fIN = 70.1MHz, –1dBFS, PGA = 1
LTC2203: 32K Point FFT,
fIN = 70.1MHz, –10dBFS, PGA = 1
LTC2203: 32K Point FFT,
fIN = 70.1MHz, –20dBFS, PGA = 1
FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G25 FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G26 FREQUENCY(MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–10
–30
–50
–70
–90
–110
–130
–40
26
–20
–60
4810 12
22032 G27
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2203/LTC2202
11
22032fd
LTC2203: SNR and SFDR
vs Sample Rate
LTC2203: SNR and SFDR vs
Supply Voltage (VDD), fIN = 5MHz
LTC2203: IVDD vs Sample Rate,
5MHz Sine Wave, –1dBFS
SAMPLE RATE (Msps)
0
75
SNR AND SFDR (dBFS)
80
90
95
100
110
525 35
22032 G34
85
105
20 45 50
10 15 30 40
SFDR
RATED MAX
SNR
SUPPLY VOLTAGE (V)
2.8
SNR SFDR (dBFS)
95
100
105
3.4 3.5
22032 G35
90
85
2.9 3.0 3.1 3.2 3.3 3.6
80
75
110
SFDR
LOWER LIMIT UPPER LIMIT
SNR
SAMPLE RATE (Msps)
0
IVDD (mA)
65
70
75
20
22032 G36
60
55
50 510 15 25
LTC2203: Normalized Full
Scale vs Temperature, Internal
Reference, 5 Units
LTC2203: Offset Voltage
vs Temperature, 5 Units
LTC2203: SFDR vs Input Common
Mode Voltage, fIN = 5MHz,
–1dBFS, PGA = 0
LTC2202: Integral Nonlinearity
(INL) vs Output Code
LTC2202: Differential Nonlinearity
(DNL) vs Output Code
LTC2202: AC Grounded Input
Histogram (256K Samples)
TEMPERATURE (°C)
–40
0.99
NORMALIZED FULL SCALE
0.995
1
1.005
1.01
–20 0 20 40
22032 G37
60 80
TEMPERATURE (˚C)
–40
OFFSET VOLTAGE (mV)
2
4
6
20 60
22032 G38
0
–2
–20 0 40 80
–4
–6
INPUT COMMON MODE VOLTAGE (V)
0.5
60
SFDR (dBc)
70
80
90
0.75 11.25 1.50
22032 G39
1.75
100
110
65
75
85
95
105
2
CODE
0
INL ERROR (LSB)
0
0.5
1.0
65536
22032 G40
–0.5
–1.0
–2.0 16384 32768 49152
–1.5
2.0
1.5
CODE
0
1.0
DNL ERROR (LSB)
0.8
0.4
0.2
0
1.0
0.4
16384 32768
22032 G41
0.6
0.6
0.8
0.2
49152 65536
OUTPUT CODE
32793
COUNT
40000
35000
30000
25000
15000
5000
45000
50000
32797
22032 G42
20000
10000
032801 32805 32809
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2203/LTC2202
12
22032fd
LTC2203: 128K Point FFT,
fIN = 5.1MHz, –20dBFS, PGA = 0,
Internal Dither “On”
LTC2202: 32K Point 2-Tone FFT,
fIN = 5.1MHz and 15.2MHz,
–7dBFS, PGA = 0
LTC2202: 32K Point 2-Tone FFT,
fIN = 5.1MHz and 15.2MHz,
–15dBFS, PGA = 0
LTC2202: SFDR vs Input Level,
fIN = 5MHz, PGA = 0, Dither “Off”
LTC2202: SFDR vs Input Level,
fIN = 5MHz, PGA = 0, Dither “On”
LTC2202: 32K Point FFT,
fIN = 12.4MHz, –1dBFS, PGA = 0
FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G46 FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G47 FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G48
INPUT LEVEL (dBFS)
–70
0
SFDR (dBc AND dBFS)
20
40
60
80
60 40 –20 0
22032 G49
100
120
50 –30 –10
INPUT LEVEL (dBFS)
–70
0
SFDR (dBc AND dBFS)
40
20
60
80
100
60 40 –20 0
22032 G50
120
140
50 –30 –10
FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G51
LTC2202: 128K Point FFT,
fIN = 5.1MHz, –1dBFS, PGA = 0
LTC2202: 128K Point FFT,
fIN = 5.1MHz, –10dBFS, PGA = 0
LTC2202: 128K Point FFT,
fIN = 5.1MHz, –20dBFS, PGA = 0,
Internal Dither “Off”
FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G43 FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G44 FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G45
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2203/LTC2202
13
22032fd
LTC2202: 32K Point FFT,
fIN = 12.4MHz, –10dBFS, PGA = 0 LTC2202: 32K Point FFT,
fIN = 12.4MHz, –20dBFS, PGA = 0
LTC2202: SFDR vs Input Level,
fIN = 12.4MHz, PGA = 0,
Dither “Off
FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G52 FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G53 INPUT LEVEL (dBFS)
–70
0
SFDR (dBc AND dBFS)
20
40
60
80
–60 –40 –20 0
22032 G54
100
120
–50 –30 –10
LTC2202: 32K Point FFT,
fIN = 30.5MHz, –1dBFS, PGA = 1
LTC2202: 32K Point FFT,
fIN = 30.5MHz, –10dBFS, PGA = 1
LTC2202: 32K Point FFT,
fIN = 30.5MHz, –20dBFS, PGA = 1
LTC2202: SFDR vs Input Level,
fIN = 30.1MHz, PGA = 0,
Dither “Off”
LTC2202: SFDR vs Input Level,
fIN = 30.1MHz, PGA = 0,
Dither “On”
LTC2202: 32K Point FFT,
fIN = 70.1MHz, –1dBFS, PGA = 1
FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G55 FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G56 FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G57
INPUT LEVEL (dBFS)
–70
0
SFDR (dBc AND dBFS)
40
20
60
80
100
60 40 –20 0
22032 G58
120
140
50 –30 –10
INPUT LEVEL (dBFS)
–70
0
SFDR (dBc AND dBFS)
40
20
60
80
100
60 40 –20 0
22032 G59
120
140
50 –30 –10
FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G60
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2203/LTC2202
14
22032fd
LTC2202: 32K Point 2-Tone FFT,
fIN = 60.2MHz and 70.1MHz,
–15dBFS, PGA = 0
LTC2202: SFDR vs Input Level,
fIN = 70.1MHz, PGA = 0,
Dither “Off”
LTC2202: SFDR vs Input Level,
fIN = 70.1MHz, PGA = 0,
Dither “On”
LTC2202: SFDR (HD2 or HD3)
vs Input Frequency LTC2202: SNR vs Input Frequency
FREQUENCY (MHz)
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
–20
–60
–130
–110
–90
–10
–50
–30
–70
22032 G64
02 4
INPUT LEVEL (dBFS)
–80
0
SFDR (dBc AND dBFS)
40
20
60
80
100
–60 –40 –20 0
22032 G65
120
140
–70 50 –30 –10
INPUT LEVEL (dBFS)
–80
0
SFDR (dBc AND dBFS)
40
20
60
80
100
–60 –40 –20 0
22032 G66
120
140
–70 50 –30 –10
INPUT FREQUENCY (MHz)
0
SFDR(dBc)
85
90
95
60 100
22032 G67
80
75
70 20 40 80
100
105
110
PGA = 0
PGA = 1
INPUT FREQUENCY (MHz)
0
73
SNR (dBFS)
74
76
77
78
80
82
22032 G68
75
40
20 100 120
60 140
79
80
81
PGA = 0
PGA = 1
LTC2202: 32K Point 2-Tone FFT,
fIN = 60.2MHz and 70.1MHz,
–7dBFS, PGA = 0
FREQUENCY (MHz)
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
–20
–60
–130
–110
–90
–10
–50
–30
–70
22032 G63
02 4
LTC2202: 32K Point FFT,
fIN = 70.1MHz, –10dBFS, PGA = 1
LTC2202: 32K Point FFT,
fIN = 70.1MHz, –20dBFS, PGA = 1
FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G61 FREQUENCY (MHz)
0
–140
AMPLITUDE (dBFS)
–120
–100
–80
0
–40
134
–20
–60
–130
–110
–90
–10
–50
–30
–70
25
22032 G62
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2203/LTC2202
15
22032fd
LTC2202: SNR and SFDR
vs Sample Rate
LTC2202: SNR and SFDR vs
Supply Voltage (VDD), fIN = 5MHz
LTC2202: IVDD vs Sample Rate,
5MHz Sine Wave, –1dBFS
LTC2202: Normalized Full
Scale vs Temperature, Internal
Reference, 5 Units
SAMPLE RATE (Msps)
0
100
105
110
16
22032 G69
95
90
4 8 12 20
85
80
75
SNR AND SFDR (dBFS)
SFDR
RATED MAX
SNR
SUPPLY VOLTAGE (V)
2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
SNR SFDR (dBFS)
95
100
105
22032 G70
90
85
80
75
110
SFDR
LOWER LIMIT UPPER LIMIT
SNR
SAMPLE RATE (Msps)
0
IVDD (mA)
46
48
50
8
22032 G71
44
42
45
47
49
43
41
40 24610
TEMPERATURE (°C)
–40
0.99
NORMALIZED FULL SCALE
0.995
1
1.005
1.01
20 0 20 40
22032 G72
60 80
TEMPERATURE (˚C)
–40
OFFSET VOLTAGE (mV)
2
4
6
20 60
22032 G73
0
–2
–20 0 40 80
–4
–6
INPUT COMMON MODE VOLTAGE (V)
0.5
60
SFDR (dBc)
70
80
90
0.75 11.25 1.50
22032 G74
1.75
100
110
65
75
85
95
105
2
LTC2202: Offset Voltage
vs Temperature, 5 Units
LTC2202: SFDR vs Input Common
Mode Voltage, fIN = 5MHz,
–1dBFS, PGA = 0
TYPICAL PERFORMANCE CHARACTERISTICS
TIME AFTER WAKE-UP OR CLOCK START (μs)
0
FULL-SCALE ERROR (%)
0.2
0.6
1.0
400
22032 G75
–0.2
–0.6
0
0.4
0.8
–0.4
–0.8
–1.0 10050 200150 300 350 450
250 500
TIME FROM WAKE-UP OR CLOCK START (μs)
0
FULL-SCALE ERROR (%)
1
3
5
800
22032 G76
–1
–3
0
2
4
–2
–4
–5 200100 400300 600 700 900
500 1000
Mid-Scale Settling After Wake
Up from Shutdown or Starting
Encode Clock
Full-Scale Settling After Wake
Up from Shutdown or Starting
Encode Clock
LTC2203/LTC2202
16
22032fd
SENSE (Pin 1): Reference Mode Select and External Refer-
ence Input. Tie SENSE to VDD with 1k Ω or less to select
the internal 2.5V bandgap reference. An external reference
of 2.5V or 1.25V may be used; both reference values will
set a full scale ADC range of 2.5V (PGA = 0).
VCM (Pin 2): 1.25V Output. Optimum voltage for input com-
mon mode. Must be bypassed to ground with a minimum
of 2.2μF. Ceramic chip capacitors are recommended.
VDD (Pins 3, 4, 12, 13, 14): 3.3V Analog Supply Pin.
Bypass to GND with 0.1μF ceramic chip capacitors.
GND (Pins 5, 8, 9, 11, 15, 48, 49): ADC Power
Ground.
AIN+ (Pin 6): Positive Differential Analog Input.
AIN (Pin 7): Negative Differential Analog Input.
CLK (Pin 10): Clock Input. The hold phase of the sample-
and-hold circuit begins on the falling edge. The output
data may be latched on the rising edge of CLK.
SHDN (Pin 16): Power Shutdown Pin. SHDN = low results
in normal operation. SHDN = high results in powered
down analog circuitry and the digital outputs are placed
in a high impedance state.
DITH (Pin 17): Internal Dither Enable Pin. DITH = low
disables internal dither. DITH = high enables internal
dither. Refer to Internal Dither section of this data sheet
for details on dither operation.
D0-D15 (Pins 18-22, 26-28, 32-35 and 39-42): Digital
Outputs. D15 is the MSB.
OGND (Pins 23, 31 and 38): Output Driver Ground.
OVDD (Pins 24, 25, 36, 37): Positive Supply for the Output
Drivers. Bypass to ground with 0.1μF capacitor.
CLKOUT (Pin 29): Data Valid Output. CLKOUT will toggle
at the sample rate. Latch the data on the falling edge of
CLKOUT.
CLKOUT+ (Pin 30): Inverted Data Valid Output. CLKOUT+
will toggle at the sample rate. Latch the data on the rising
edge of CLKOUT+.
OF (Pin 43): Over/Under Flow Digital Output. OF is high
when an over or under fl ow has occurred.
OE (Pin 44): Output Enable Pin. Low enables the digital
output drivers. High puts digital outputs in Hi-Z state.
MODE (Pin 45): Output Format and Clock Duty Cycle
Stabilizer Selection Pin. Connecting MODE to 0V selects
offset binary output format and disables the clock duty
cycle stabilizer. Connecting MODE to 1/3VDD selects offset
binary output format and enables the clock duty cycle sta-
bilizer. Connecting MODE to 2/3VDD selects 2’s complement
output format and enables the clock duty cycle stabilizer.
Connecting MODE to VDD selects 2’s complement output
format and disables the clock duty cycle stabilizer.
RAND (Pin 46): Digital Output Randomization Selection Pin.
RAND low results in normal operation. RAND high selects
D1-D15 to be EXCLUSIVE-ORed with D0 (the LSB). The
output can be decoded by again applying an XOR operation
between the LSB and all other bits. The mode of operation
reduces the effects of digital output interference.
PGA (Pin 47): Programmable Gain Amplifi er Control Pin. Low
selects a front-end gain of 1, input range of 2.5VP-P. High
selects a front-end gain of 1.5, input range of 1.667VP-P.
GND (Exposed Pad, Pin 49): ADC Power Ground. The ex-
posed pad on the bottom of the package must be soldered
to ground.
PIN FUNCTIONS
LTC2203/LTC2202
17
22032fd
Figure 1. Functional Block Diagram
ADC CLOCKS
LOW JITTER
CLOCK
DRIVER
DITHER
SIGNAL
GENERATOR
FIRST PIPELINED
ADC STAGE
FIFTH PIPELINED
ADC STAGE
FOURTH PIPELINED
ADC STAGE
SECOND PIPELINED
ADC STAGE
CLK
CORRECTION LOGIC
AND
SHIFT REGISTER
DITHM0DE
OGND
CLKOUT+
CLKOUT
OF
D15
D14
OVDD
D1
D0
22032 F01
INPUT
S/H
AIN
AIN+
THIRD PIPELINED
ADC STAGE
OUTPUT
DRIVERS
CONTROL
LOGIC
PGA RAND
SHDN
VDD
GND
PGA
SENSE
VCM BUFFER
ADC
REFERENCE
VOLTAGE
REFERENCE
RANGE
SELECT
OE
BLOCK DIAGRAM
LTC2203/LTC2202
18
22032fd
DYNAMIC PERFORMANCE
Signal-to-Noise Plus Distortion Ratio
The signal-to-noise plus distortion ratio [S/(N+D)] is the
ratio between the RMS amplitude of the fundamental input
frequency and the RMS amplitude of all other frequency
components at the ADC output. The output is band lim-
ited to frequencies above DC to below half the sampling
frequency.
Signal-to-Noise Ratio
The signal-to-noise (SNR) is the ratio between the RMS
amplitude of the fundamental input frequency and the RMS
amplitude of all other frequency components, except the
rst fi ve harmonics.
Total Harmonic Distortion
Total harmonic distortion is the ratio of the RMS sum
of all harmonics of the input signal to the fundamental
itself. The out-of-band harmonics alias into the frequency
band between DC and half the sampling frequency. THD
is expressed as:
THD = –20Log
(
(V22 + V32 + V42 + ... VN2)/V1
)
where V1 is the RMS amplitude of the fundamental fre-
quency and V2 through VN are the amplitudes of the second
through nth harmonics.
Intermodulation Distortion
If the ADC input signal consists of more than one spectral
component, the ADC transfer function nonlinearity can
produce intermodulation distortion (IMD) in addition to
THD. IMD is the change in one sinusoidal input caused
by the presence of another sinusoidal input at a different
frequency.
If two pure sine waves of frequencies fa and fb are ap-
plied to the ADC input, nonlinearities in the ADC transfer
function can create distortion products at the sum and
difference frequencies of mfa ± nfb, where m and n =
0, 1, 2, 3, etc. For example, the 3rd order IMD terms
include (2fa + fb), (fa + 2fb), (2fa - fb) and (fa - 2fb). The
3rd order IMD is defi ned as the ratio of the RMS value
of either input tone to the RMS value of the largest 3rd
order IMD product.
Spurious Free Dynamic Range (SFDR)
The ratio of the RMS input signal amplitude to the RMS
value of the peak spurious spectral component expressed
in dBc. SFDR may also be calculated relative to full scale
and expressed in dBFS.
Full Power Bandwidth
The Full Power bandwidth is that input frequency at which
the amplitude of the reconstructed fundamental is reduced
by 3dB for a full scale input signal.
Aperture Delay Time
The time from when CLK reaches 0.45 of VDD to the
instant that the input signal is held by the sample-and-
hold circuit.
Aperture Delay Jitter
The variation in the aperture delay time from conversion
to conversion. This random variation will result in noise
when sampling an AC input. The signal to noise ratio due
to the jitter alone will be:
SNRJITTER = –20log (2π • fIN • tJITTER)
APPLICATIONS INFORMATION
LTC2203/LTC2202
19
22032fd
CONVERTER OPERATION
The LTC2203/LTC2202 are CMOS pipelined multistep con-
verters with a front-end PGA. As shown in Figure 1, the
converter has fi ve pipelined ADC stages; a sampled analog
input will result in a digitized value seven cycles later (see the
Timing Diagram section). The analog input is differential
for improved common mode noise immunity and to
maximize the input range. Additionally, the differential
input drive will reduce even order harmonics of the
sample-and-hold circuit.
Each pipelined stage shown in Figure 1 contains an ADC,
a reconstruction DAC and an interstage amplifi er. In
operation, the ADC quantizes the input to the stage and
the quantized value is subtracted from the input by the
DAC to produce a residue. The residue is amplifi ed and
output by the residue amplifi er. Successive stages oper-
ate out of phase so that when odd stages are outputting
their residue, the even stages are acquiring that residue
and vice versa.
The phase of operation is determined by the state of the
CLK input pin.
When CLK is high, the analog input is sampled differen-
tially directly onto the input sample-and-hold capacitors,
inside the “input S/H” shown in the block diagram. At the
instant that CLK transitions from high to low, the volt-
age on the sample capacitors is held. While CLK is low,
the held input voltage is buffered by the S/H amplifi er
which drives the fi rst pipelined ADC stage. The fi rst stage
acquires the output of the S/H amplifi er during the low
phase of CLK. When CLK goes back high, the fi rst stage
produces its residue which is acquired by the second stage.
At the same time, the input S/H goes back to acquiring
the analog input. When CLK goes low, the second stage
produces its residue which is acquired by the third stage.
An identical process is repeated for the third and fourth
stages, resulting in a fourth stage residue that is sent to
the fi fth stage for fi nal evaluation.
Each ADC stage following the fi rst has additional range to
accommodate fl ash and amplifi er offset errors. Results
from all of the ADC stages are digitally delayed such that
the results can be properly combined in the correction
logic before being sent to the output buffer.
SAMPLE/HOLD OPERATION AND INPUT DRIVE
Sample/Hold Operation
Figure 2 shows an equivalent circuit for the LTC2203/
LTC2202 CMOS differential sample and hold. The differ-
ential analog inputs are sampled directly onto sampling
capacitors (CSAMPLE) through NMOS transitors. The
capacitors shown attached to each input (CPARASITIC) are
the summation of all other capacitance associated with
each input.
During the sample phase when CLK is high, the NMOS
transistors connect the analog inputs to the sampling
capacitors and they charge to, and track the differential
input voltage. When CLK transitions from high to low, the
sampled input voltage is held on the sampling capacitors.
During the hold phase when CLK is high, the sampling
capacitors are disconnected from the input and the held
voltage is passed to the ADC core for processing. As CLK
transitions from low to high, the inputs are reconnected to
the sampling capacitors to acquire a new sample. Since
the sampling capacitors still hold the previous sample,
a charging glitch proportional to the change in voltage
between samples will be seen at this time at the input of
the converter. If the change between the last sample and
Figure 2. Equivalent Input Circuit
LTC2203/LTC2202
CLK
22032 F02
VDD
VDD
RPARASITIC
RPARASITIC
AIN+
AIN
CPARASITIC
1.4pF
CPARASITIC
1.4pF
CSAMPLE
9.1pF
CSAMPLE
9.1pF
RON
20Ω
RON
20Ω
APPLICATIONS INFORMATION
LTC2203/LTC2202
20
22032fd
the new sample is small, the charging glitch seen at the
input will be small. If the input change is large, such as
the change seen with input frequencies near Nyquist, then
a larger charging glitch will be seen.
Common Mode Bias
The ADC sample-and-hold circuit requires differential
drive to achieve specifi ed performance. Each input may
swing ±0.625V for the 2.5V range (PGA = 0) or ±0.417V
for the 1.667V range (PGA = 1), around a common mode
voltage of 1.25V. The VCM output pin (Pin 3) is designed
to provide the common mode bias level. VCM can be tied
directly to the center tap of a transformer to set the DC
input level or as a reference level to an op amp differential
driver circuit. The VCM pin must be bypassed to ground
close to the ADC with 2.2μF or greater.
Input Drive Impedence
As with all high performance, high speed ADCs the
dynamic performance of the LTC2203/LTC2202 can be
infl uenced by the input drive circuitry, particularly the
second and third harmonics. Source impedance and
input reactance can infl uence SFDR. At the rising edge of
CLK the sample and hold circuit will connect the 9.1pF
sampling capacitor to the input pin and start the sampling
period. The sampling period ends when CLK falls, hold-
ing the sampled input on the sampling capacitor. Ideally,
the input circuitry should be fast enough to fully charge
the sampling capacitor during the sampling period
1/(2FCLK); however, this is not always possible and the
incomplete settling may degrade the SFDR. The sampling
glitch has been designed to be as linear as possible to
minimize the effects of incomplete settling.
For the best performance it is recomended to have a source
impedence of 100Ω or less for each input. The source
impedence should be matched for the differential inputs.
Poor matching will result in higher even order harmonics,
especially the second.
INPUT DRIVE CIRCUITS
Figure 3 shows the LTC2203/LTC2202 being driven by an RF
transformer with a center-tapped secondary. The secondary
center tap is DC biased with VCM, setting the ADC input
signal at its optimum DC level. Figure 3 shows a 1:1 turns
ratio transformer. Other turns ratios can be used; however,
as the turns ratio increases so does the impedance seen by
the ADC. Source impedance greater than 50Ω can reduce
the input bandwidth and increase high frequency distor-
tion. A disadvantage of using a transformer is the loss of
low frequency response. Most small RF transformers have
poor performance at frequencies below 1MHz.
Figure 3. Single-Ended to Differential Conversion
Using a Transformer. Recommended for Input
Frequencies from 1MHz to 100MHz
LTC2203/
LTC2202
ANALOG
INPUT
T1 = COILCRAFT WBCI-IT OR
MA/COM ETC1-1T.
RESISTORS, CAPACITORS ARE
0402 PACKAGE SIZE, EXCEPT 2.2μF.
22032 F03
0.1μF
2.2μF
12pF
12pF
12pF
0.1μF
T1
1:1
25Ω
25Ω
25Ω
25Ω
VCM
AIN+
AIN
Figure 4. Using a Transmission Line Balun Transformer.
Recommended for Input Frequencies from 50MHz to 250MHz
0.1μF
AIN+
AIN
4.7pF
2.2μF
4.7pF
4.7pF
VCM
ANALOG
INPUT
0.1μF
0.1μF
T1
1:1
T1 = MA/COM ETC1-1-13.
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE,
EXCEPT 2.2F.
22032 F04
25Ω
25Ω
25Ω
10Ω
10Ω
25Ω
LTC2203/
LTC2202
Center-tapped transformers provide a convenient means
of DC biasing the secondary; however, they often show
poor balance at high input frequencies, resulting in large
2nd order harmonics.
Figure 4 shows transformer coupling using a transmis-
sion line balun transformer. This type of transformer has
much better high frequency response and balance than fl ux
coupled center tap transformers. Coupling capacitors are
added at the ground and input primary terminals to allow
the secondary terminals to be biased at 1.25V.
APPLICATIONS INFORMATION
LTC2203/LTC2202
21
22032fd
Figure 5 demonstrates the use of an LTC1994 differential
amplifi er to convert a single ended input signal into a
differential input signal. The advantage of this method is
that it provides low frequency input response; however,
the limited gain bandwidth of any op amp will limit the
SFDR at high input frequencies.
The internal programmable gain amplifi er provides the
internal reference voltage for the ADC. This amplifi er has
very stringent settling requirements and is not accessible
for external use.
Figure 5. DC Coupled Input with Differential Amplifi er
VCM
22032 F05
+
+
CM LT1994
499Ω
100pF
100pF
100pF
2.2 μF
499Ω
523Ω 25Ω
25Ω
499Ω
53.6Ω
AIN+
AIN
LTC2203/
LTC2202
Figure 6. Reference Circuit
PGA
1.25V
SENSE
VCM BUFFER
INTERNAL
ADC
REFERENCE
RANGE
SELECT
AND GAIN
CONTROL
2.5V
BANDGAP
REFERENCE
2.2μF
TIE TO VDD TO USE
INTERNAL 2.5V
REFERENCE
OR INPUT FOR
EXTERNAL 2.5V
REFERENCE
OR INPUT FOR
EXTERNAL 1.25V
REFERENCE
22032 F07
LTC2203/LTC2202
Figure 7. A 2.25V Range ADC with
an External 2.5V Reference
VCM
SENSE
1.25V
3.3V
2.2μF
2.2μF
F
22032 F08
LT1461-2.5
26
4
LTC2203/
LTC2202
The SENSE pin can be driven ±5% around the nominal 2.5V
or 1.25V external reference input. This adjustment range
can be used to trim the ADC gain error or other system
gain errors. When selecting the internal reference, the
SENSE pin should be tied to VDD as close to the converter
as possible. If the sense pin is driven externally it should
be bypassed to ground as close to the device as possible
with at least a 1μF ceramic capacitor.
APPLICATIONS INFORMATION
The 25Ω resistors and 12pF capacitor on the analog
inputs serve two purposes: isolating the drive circuitry
from the sample-and-hold charging glitches and limiting
the wideband noise at the converter input.
Reference Operation
Figure 6 shows the LTC2203/LTC2202 reference circuitry
consisting of a 2.5V bandgap reference, a programmable
gain amplifi er and control circuit. The LTC2203/LTC2202
has three modes of reference operation: Internal Refer-
ence, 1.25V external reference or 2.5V external reference.
To use the internal reference, tie the SENSE pin to VDD. To
use the external reference, simply apply either a 1.25V or
2.5V reference voltage to the SENSE input pin. Both 1.25V
and 2.5V applied to SENSE will result in a full scale range
of 2.5VP-P (PGA = 0). A 1.25V output, VCM, is provided
for a common mode bias for input drive circuitry. An
external bypass capacitor is required for the VCM output.
This provides a high frequency low impedance path to
ground for internal and external circuitry. This is also the
compensation capacitor for the reference; it will not be
stable without this capacitor. The minimum value required
for stability is 2.2μF.
LTC2203/LTC2202
22
22032fd
In applications where jitter is critical, such as when digi-
tizing high input frequencies, use as large an amplitude
as possible. It is also helpful to drive the CLK pin with a
low-jitter high frequency source which has been divided
down to the appropriate sample rate. If the ADC is clocked
with a sinusoidal signal, fi lter the CLK signal to reduce
wideband noise and distortion products generated by
the source.
Maximum and Minimum Conversion Rates
The maximum conversion rate for the LTC2203 is 25Msps.
The maximum conversion rate for the LTC2202 is 10Msps.
For the ADC to operate properly the CLK signal should have
a 50% (±5%) duty cycle. Each half cycle must have at least
18.9ns for the LTC2203 internal circuitry to have enough
settling time for proper operation. For the LTC2202, each
half cycle must be at least 40ns.
An on-chip clock duty cycle stabilizer may be activated if
the input clock does not have a 50% duty cycle. This circuit
uses the falling edge of CLK pin to sample the analog input.
The rising edge of CLK is ignored and an internal rising
edge is generated by a phase-locked loop. The input clock
duty cycle can vary from 30% to 70% and the clock duty
cycle stabilizer will maintain a constant 50% internal duty
cycle. If the clock is turned off for a long period of time,
the duty cycle stabilizer circuit will require one hundred
clock cycles for the PLL to lock onto the input clock. To
use the clock duty cycle stabilizer, the MODE pin must be
connected to 1/3VDD or 2/3VDD using external resistors.
The lower limit of the LTC2203/LTC2202 sample rate is
determined by droop of the sample and hold circuits. The
pipelined architecture of this ADC relies on storing analog
signals on small valued capacitors. Junction leakage will
discharge the capacitors. The specifi ed minimum operating
frequency for the LTC2203/LTC2202 is 1Msps.
Figure 8. Sinusoidal Single-Ended CLK Drive
CLK
0.1μF
0.1μF
4.7μF
1k
1k
FERRITE
BEAD
CLEAN 3.3V
SUPPLY
SINUSOIDAL
CLOCK
INPUT
22032 F09
NC7SVU04
56Ω
LTC2203/
LTC2202
PGA Pin
The PGA pin selects between two gain settings for the ADC
front-end. PGA = 0 selects an input range of 2.5VP-P; PGA =
1 selects an input range of 1.667VP-P. The 2.5V input range
has the best SNR; however, the distortion will be higher for
input frequencies above 100MHz. For applications with high
input frequencies, the low input range will have improved
distortion; however, the SNR will be 2.4dB worse. See the
Typical Performance Characteristics section.
Driving the Clock Input
The CLK input can be driven directly with a CMOS or TTL
level signal. A sinusoidal clock can also be used along with a
low-jitter squaring circuit before the CLK pin (Figure 8).
The noise performance of the LTC2203/2202 can depend
on the clock signal quality as much as on the analog
input. Any noise present on the clock signal will result in
additional aperture jitter that will be RMS summed with
the inherent ADC aperture jitter.
APPLICATIONS INFORMATION
LTC2203/LTC2202
23
22032fd
Data Format
The LTC2203/LTC2202 parallel digital output can be
selected for offset binary or 2’s complement format. The
format is selected with the MODE pin. This pin has a four
level logic input, centered at 0, 1/3VDD, 2/3VDD and VDD.
An external resistor divider can be user to set the 1/3VDD
and 2/3VDD logic levels. Table 1 shows the logic states
for the MODE pin.
Table 1. MODE Pin Function
MODE OUTPUT FORMAT
CLOCK DUTY
CYCLE STABILIZER
0(GND) Offset Binary Off
1/3VDD Offset Binary On
2/3VDD 2’s Complement On
VDD 2’s Complement Off
Overfl ow Bit
An overfl ow output bit (OF) indicates when the converter
is over-ranged or under-ranged. A logic high on the OF
pin indicates an overfl ow or underfl ow.
Output Clock
The ADC has a delayed version of the CLK input available
as a digital output. Both a noninverted version, CLKOUT+
and an inverted version CLKOUT are provided. The
CLKOUT+/CLKOUT can be used to synchronize the
converter data to the digital system. This is necesary
when using a sinusoidal clock. Data can be latched on the
rising edge of CLKOUT+ or the falling edge of CLKOUT.
CLKOUT+ falls and CLKOUT rises as the data outputs
are updated.
DIGITAL OUTPUTS
Digital Output Buffers
Figure 9 shows an equivalent circuit for a single output
buffer in CMOS Mode. Each buffer is powered by OVDD
and OGND, isolated from the ADC power and ground. The
additional N-channel transistor in the output driver allows
operation down to low voltages. The internal resistor in
series with the output makes the output appear as 50Ω
to external circuitry and eliminates the need for external
damping resistors.
As with all high speed/high resolution converters, the
digital output loading can affect the performance. The
digital outputs of the LTC2203/LTC2202 should drive a
minimum capacitive load to avoid possible interaction
between the digital outputs and sensitive input circuitry.
The output should be buffered with a device such as a
ALVCH16373 CMOS latch. For full speed operation the
capacitive load should be kept under 10pF. A resistor in
series with the output may be used but is not required
since the ADC has a series resistor of 43Ω on chip.
Lower OVDD voltages will also help reduce interference
from the digital outputs.
22032 F10
OVDD
VDD VDD
0.1μF
TYPICAL
DATA
OUTPUT
OGND
43Ω
OVDD 0.5V
TO 3.6V
PREDRIVER
LOGIC
DATA
FROM
LATCH
LTC2203/LTC2202
Figure 9. Equivalent Circuit for a Digital Output Buffer
APPLICATIONS INFORMATION
LTC2203/LTC2202
24
22032fd
Digital Output Randomizer
Interference from the ADC digital outputs is sometimes
unavoidable. Interference from the digital outputs may be
from capacitive or inductive coupling or coupling through
the ground plane. Even a tiny coupling factor can result in
discernible unwanted tones in the ADC output spectrum.
By randomizing the digital output before it is transmitted
off chip, these unwanted tones can be randomized, trading
a slight increase in the noise fl oor for a large reduction
in unwanted tone amplitude.
CLKOUT
OF
D15/D0
D14/D0
D2/D0
D1/D0
D0D0
D1
RAND = HIGH,
SCRAMBLE
ENABLED
D2
D14
D15
OF
CLKOUT
RAND
22032 F11
LTC2203/LTC2202
Figure 10. Functional Equivalent of Digital Output Randomizer
The digital output is “Randomized” by applying an exclu-
sive-OR logic operation between the LSB and all other data
output bits. To decode, the reverse operation is applied;
that is, an exclusive-OR operation is applied between the
LSB and all other bits. The LSB, OF and CLKOUT output
are not affected. The output Randomizer function is active
when the RAND pin is high.
APPLICATIONS INFORMATION
LTC2203/LTC2202
25
22032fd
Figure 11. Descrambling a Scrambled Digital Output
D1
D0
D2
D14
D15
PC BOARD
FPGA
CLKOUT
OF
D15/D0
D14/D0
D2/D0
D1/D0
D0
22032 F12
LTC2203/
LTC2202
Output Driver Power
Separate output power and ground pins allow the output
drivers to be isolated from the analog circuitry. The power
supply for the digital output buffers, OVDD, should be tied
to the same power supply as for the logic being driven. For
example, if the converter is driving a DSP powered by a
1.8V supply, then OVDD should be tied to that same 1.8V
supply. In CMOS mode OVDD can be powered with any
logic voltage up to 3.6V. OGND can be powered with any
voltage from ground up to 1V and must be less than OVDD.
The logic outputs will swing between OGND and OVDD.
APPLICATIONS INFORMATION
LTC2203/LTC2202
26
22032fd
Figure 12. Functional Equivalent Block Diagram of
Internal Dither Circuit
S/H
AMP
DIGITAL
SUMMATION OUTPUT
DRIVERS
MULTIBIT DEEP
PSEUDO-RANDOM
NUMBER
GENERATOR
16-BIT
PIPELINED
ADC CORE
PRECISION
DAC
CLOCK/DUTY
CYCLE
CONTROL
CLKOUT+
CLKOUT
OF
D15
D0
CLK
DITHER ENABLE
HIGH = DITHER ON
LOW = DITHER OFF
DITH
ANALOG
AIN+
AIN
INPUT
22032 F13
LTC2203/LTC2202
Internal Dither
The LTC2203/LTC2202 are 16-bit ADCs with very linear
transfer functions; however, at low input levels even
slight imperfections in the transfer function will result in
unwanted tones. Small errors in the transfer function are
usually a result of ADC element mismatches. An optional
internal dither mode can be enabled to randomize the
input’s location on the ADC transfer curve, resulting in
improved SFDR for low signal levels.
As shown in Figure 12, the output of the sample-and-hold
amplifi er is summed with the output of a dither DAC. The
dither DAC is driven by a long sequence pseudo-random
number generator; the random number fed to the dither
DAC is also subtracted from the ADC result. If the dither
DAC is precisely calibrated to the ADC, very little of the
dither signal will be seen at the output. The dither signal
that does leak through will appear as white noise. The dither
DAC is calibrated to result in less than 0.5dB elevation in
the noise fl oor of the ADC, as compared to the noise fl oor
with dither off.
Grounding and Bypassing
The LTC2203/LTC2202 require a printed circuit board with a
clean unbroken ground plane; a multilayer board with an
internal ground plane is recommended. The pinout of the
LTC2203/LTC2202 has been optimized for a fl owthrough
layout so that the interaction between inputs and digital
outputs is minimized. Layout for the printed circuit board
should ensure that digital and analog signal lines are
separated as much as possible. In particular, care should
be taken not to run any digital track alongside an analog
signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used
at the VDD, VCM, and OVDD pins. Bypass capacitors must
be located as close to the pins as possible. The traces
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
The LTC2203/LTC2202 differential inputs should run
parallel and close to each other. The input traces should
be as short as possible to minimize capacitance and to
minimize noise pickup.
Heat Transfer
Most of the heat generated by the LTC2203/LTC2202 is
transferred from the die through the bottom-side exposed
pad. For good electrical and thermal performance, the
exposed pad must be soldered to a large grounded pad
on the PC board. It is critical that the exposed pad and all
ground pins are connected to a ground plane of suffi cient
area with as many vias as possible.
APPLICATIONS INFORMATION
LTC2203/LTC2202
27
22032fd
9
20
20
8
7
6
5
4
3
2
1
A7
VCC
U2
74VCX245BQX
U1*
EXPOSED PAD
OVP
OVP
A6
A5
A4
A3
A2
A1
A0
B7
24
3
1
5
3
2
1
B6
B5
B4
B3
B2
B1
B0
10
9
8
7
6
5
4
3
2
1
10
11
12
13
14
15
16
17
18
19
11
12
13
14
15
16
17
18
19
GND
J1
3201S-40G1
U6
24LC025
U5
NC7SV86P5X
U4
NC7SV86P5X
1
RN1A, 33
RN1B, 33
RN1C, 33
RN1D, 33
RN2A, 33
RN2B, 33
RN2C, 33
RN2D, 33
RN3A, 33
RN3B, 33
RN3C, 33
RN3D, 33
RN4A, 33
RN4B, 33
RN4C, 33
RN4D, 33
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
VCC
U3
74VCX245BQX
OVP
8
1
2
7
6
5
1
5
3
4
2
3
4
VCC
WP
SCL
SDA
A0
R17
10K
R18
10K
R19
10K
R5
33
A1
A2
A3
A7
A6
A5
A4
A3
A2
A1
A0
B7
B6
B5
B4
B3
B2
B1
B0
GND
OE T/R
OE T/R
OVDD
D11
D10
D9
D8
OGND
CLKOUT +
CLKOUT –
D7
D6
D5
OVDD
SENSE
C1
0.1μF
VCM
VDD
VDD
GND
AIN +
AIN –
GND
GND/ENC +
GND/ENC –
GND
VDD
1
2
3
4
5
6
7
8
9
10
11
12
36
35
34
33
32
31
30
29
28
27
26
25
GND
PGA
RAND
MODE
OE
OF
D15
D14
D13
D12
OGND
OVDD
13
14
15
16
17
18
19
20
21
22
23
24
49
48
47
46
45
44
43
42
41
40
39
38
37
VDD
VDD
GND
SHDN
DITH
D0
D1
D2
D3
D4
OGND
OVDD
JP6
DITH
VDD
VDD
VDD
3
2
1
GND
JP6
DITH
VDD
3
3
J3
1
2
4
R20
10k
R21
10k
2
1
GND C19
0.1μF
C14
0.1μF
GND
C18
0.1μF
C17
0.1μF
C8
2.2μF
C2
2.2μF
C16
0.1μF
C15
0.1μF
C28
0.1μF
C13
0.1μF
OGND
1
2
3
4
8
71
6
5
VDD
OVP
OVP
E3
E1
E4
U7
LT1763 R25
OUT
ADJ
GND
VDD
+ 3.3V
R29
1k
R30
OPEN
R28
33
ENCODE
INPUT
GND
BYP
IN
GND
GND
SHDN
C21
0.01μF
C22
1.0μF
C20
10μF
6.3V
C27
100μF
6.3V OPT
C23
4.7μF
R23
100K
R22
105K
+
VDD
OSC1
OPT.
VDD VDD
R33 *
EN FO
GND
C9
0.1μF
C3
8.2pF
C5
8.2pF
C7
8.2pF
J4
J2
R12
OPEN
R11
OPEN
R24
OPEN
R32
0
R27
10Ω R8
51Ω
5.1Ω
R10
5.1Ω
R9
OPEN
R26
10Ω
1
2
3
5T1
ANALOG
INPUT
DCIN+
ETC1-1T
4
C4
C6
C26
0.1μF
C25
0.1μF 22032 F014
OPEN
VDD
JP2
SENSE
JP4
RAND
JP3
PGA
VDD
VDD
R31
OVDD
2
1
2
2
R6
OPEN
R7
1K
R1
10K
R2
10K
R3
1K
R4
OPEN
OVP
GND
33
GND GND
ASSEMBLY TYPE
* VERSION TABLE
U1 R33 INPUT FREQUENCY BITS MSPS
DC919A-A LTC2207CUK 0.01μF DC < AIN < 70MHz 16 105
DC919A-B LTC2206CUK 0.01μF DC < AIN < 70MHz 16 80
DC919A-C LTC2205CUK 0.01μF DC < AIN < 70MHz 16 65
DC919A-D LTC2204CUK 0.01μF DC < AIN < 70MHz 16 40
DC919A-E LTC2203CUK DC < AIN < 70MHz 16 25
DC919A-F LTC2202CUK DC < AIN < 70MHz 16 10
OPEN
OPEN
R13
OPEN
Evaluation Circuit Schematic of the LTC2203/LTC2202
APPLICATIONS INFORMATION
LTC2203/LTC2202
28
22032fd
Silkscreen Top
Silkscreen Topside
APPLICATIONS INFORMATION
LTC2203/LTC2202
29
22032fd
Inner Layer 2
Inner Layer 3
APPLICATIONS INFORMATION
LTC2203/LTC2202
30
22032fd
Silkscreen Bottom Side
Silkscreen Bottom
APPLICATIONS INFORMATION
LTC2203/LTC2202
31
22032fd
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UK Package
48-Lead Plastic QFN (7mm × 7mm)
(Reference LTC DWG # 05-08-1704)
7.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WKKD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 TOP MARK
(SEE NOTE 6)
PIN 1
CHAMFER
C = 0.35
0.40 ± 0.10
4847
1
2
BOTTOM VIEW—EXPOSED PAD
5.50 REF
(4-SIDES)
0.75 ± 0.05 R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UK48) QFN 0406 REV C
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
5.50 REF
(4 SIDES) 6.10 ±0.05 7.50 ±0.05
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
5.15 ± 0.10
5.15 ± 0.10
5.15 ± 0.05
5.15 ± 0.05
R = 0.10
TYP
LTC2203/LTC2202
32
22032fd
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2009
LT 0909 REV D • PRINTED IN USA
PART NUMBER DESCRIPTION COMMENTS
LTC1748 14-Bit, 80Msps ADC 76.3dB SNR, 90dB SFDR, 48-Pin TSSOP Package
LTC1750 14-Bit, 80Msps Wideband ADC Up to 500MHz IF Undersampling, 90dB SFDR
LT1993-2 High Speed Differential Op Amp 800MHz BW, 70dBc Distortion at 70MHz, 6dB Gain
LT1994 Low Noise, Low Distortion Fully
Differential Input/Output Amplifi er/Driver
Low Distortion: –94dBc at 1MHz
LTC2204 16-Bit, 40Msps, 3.3V ADC 480mW, 79.1dB SNR, 100dB SFDR, 48-Pin QFN
LTC2205 16-Bit, 65Msps, 3.3V ADC 610mW, 79dB SNR, 100dB SFDR, 48-Pin QFN
LTC2206 16-Bit, 80Msps, 3.3V ADC 725mW, 77.9dB SNR, 100dB SFDR, 48-Pin QFN
LTC2207 16-Bit, 105Msps, 3.3V ADC 900mW, 77.9dB SNR, 100dB SFDR, 48-Pin QFN
LTC2208 16-Bit, 130Msps, 3,3V ADC, LVDS Outputs 1250mW, 77.1dB SNR, 100dB SFDR, 64-Pin QFN
LTC2220-1 12-Bit, 185Msps, 3.3V ADC, LVDS Outputs 910mW, 67.7dB SNR, 80dB SFDR, 64-Pin QFN
LTC2224 12-Bit, 135Msps, 3.3V ADC, High IF Sampling 630mW, 67.6dB SNR, 84dB SFDR, 48-Pin QFN
LTC2242-12 12-Bit, 250Msps, 2.5V ADC, LVDS Outputs 740mW, 65.4dB SNR, 84dB SFDR, 64-Pin QFN
LTC2255 14-Bit, 125Msps, 3V ADC, Lowest Power 395mW, 72.5dB SNR, 88dB SFDR, 32-Pin QFN
LTC2284 14-Bit, Dual, 105Msps, 3V ADC, Low Crosstalk 540mW, 72.4dB SNR, 88dB SFDR, 64-pin QFN
LT5512 DC-3GHz High Signal Level
Downconverting Mixer
DC to 3GHz, 21dBm IIP3, Integrated LO Buffer
LT5514 Ultralow Distortion IF Amplifi er/ADC Driver
with Digitally Controlled Gain
450MHz to 1dB BW, 47dB OIP3, Digital Gain Control 10.5dB to 33dB in 1.5dB/Step
LT5515 1.5GHz to 2.5GHz Direct Conversion
Quadrature Demodulator
High IIP3: 20dBm at 1.9GHz, Integrated LO Quadrature Generator
LT5516 800MHz to 1.5GHz Direct Conversion
Quadrature Demodulator
High IIP3: 21.5dBm at 900MHz, Integrated LO Quadrature Generator
LT5517 40MHz to 900MHz Direct Conversion
Quadrature Demodulator
High IIP3: 21dBm at 800MHz, Integrated LO Quadrature Generator
LT5522 600MHz to 2.7GHz High Linearity
Downconverting Mixer
4.5V to 5.25V Supply, 25dBm IIP3 at 900MHz. NF = 12.5dB, 50Ω Single Ended
RF and LO Ports
RELATED PARTS