SCDS025R − M AY 1995 − REVISED JANUARY 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D5-Ω Switch Connection Between Two Ports
DTTL-Compatible Input Levels
DDesigned to Be Used in Level-Shifting
Applications
SN54CBTD3384 ...JT OR W PACKAGE
SN74CBTD3384 . . . DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
VCC
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
SN54CBTD3384 . . . FK PACKAGE
(TOP VIEW)
321
13 14
5
6
7
8
9
10
11
2A4
2B4
2B3
NC
2A3
2A2
2B2
1A2
1B2
1B3
NC
1A3
1A4
1B4
4
15 16 17 18
1A5
GND
NC
2OE
2A1
2B1
1A1
1B1
1OE
NC
28 27 26
12
1B5
2B5
2A5
25
24
23
22
21
20
19
VCC
NC − No internal connection
description/ordering information
The ’CBTD3384 devices provide ten bits of high-speed TTL-compatible bus switching. The low on-state
resistance of the switches allows connections to be made without adding propagation delay. A diode to VCC is
integrated on the die to allow for level shifting from 5-V signals at the device inputs to 3.3-V signals at the device
outputs.
These devices are organized as two 5-bit switches with separate output-enable (OE) inputs. When OE is low,
the switch is on, and port A is connected to port B. When OE is high, the switch is open, and the high-impedance
state exists between the two ports.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
SOIC − DW
Tube SN74CBTD3384DW
CBTD3384
SOIC − DW Tape and reel SN74CBTD3384DWR CBTD3384
SSOP − DB Tape and reel SN74CBTD3384DBR CC384
−40°C to 85°CSSOP (QSOP) − DBQ Tape and reel SN74CBTD3384DBQR CBTD3384
−40 C to 85 C
TSSOP − PW
Tube SN74CBTD3384PW
CC384
TSSOP − PW Tape and reel SN74CBTD3384PWR CC384
TVSOP − DGV Tape and reel SN74CBTD3384DGVR CC384
CDIP − JT Tube SNJ54CBTD3384JT SNJ54CBTD3384JT
−55°C to 125°CCFP − W Tube SNJ54CBTD3384W SNJ54CBTD3384W
−55 C to 125 C
LCCC − FK Tube SNJ54CBTD3384FK SNJ54CBTD3384FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%).
"!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%&
&%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-)
%)&%3 ! $,, *$"$#)%)"&.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
*"!-('%& '!#*,$% %! 4 $,, *$"$#)%)"& $") %)&%)-
(,)&& !%/)"1&) !%)-. $,, !%/)" *"!-('%& *"!-('%!
*"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&.
SCDS025R − M AY 1995 − REVISED JANUARY 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
(each 5-bit bus switch)
INPUTS INPUTS/OUTPUTS
1OE 2OE 1B1−1B5 2B1−2B5
L L 1A1−1A5 2A1−2A5
L H 1A1−1A5 Z
HLZ2A1−2A5
H H Z Z
logic diagram (positive logic)
Pin numbers shown are for the DB, DBQ, DGV, DW, JT, PW, and W packages.
32
1A1 1B1
11
1A5
1
1OE
10 1B5
14 15
2A1 2B1
22
2A5
13
2OE
23 2B5
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI/O < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 63°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DBQ package 61°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 46°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 88°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
SCDS025R − M AY 1995 − REVISED JANUARY 2004
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54CBTD3384 SN74CBTD3384
UNIT
MIN MAX MIN MAX
UNIT
VCC Supply voltage 4.5 5.5 4.5 5.5 V
VIH High-level control input voltage 2 2 V
VIL Low-level control input voltage 0.8 0.8 V
TAOperating free-air temperature −55 125 −40 85 °C
In applications with fast edge rates, multiple outputs switching, and operating at high frequencies, the output may have little or no level-shifting
effect.
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
SN54CBTD3384 SN74CBTD3384
UNIT
PARAMETER
TEST CONDITIONS
MIN TYP†MAX MIN TYP†MAX
UNIT
VIK VCC = 4.5 V, II = −18 mA −1.2 −1.2 V
VOH See Figure 2
IIVCC = 5.5 V, VI = 5.5 V or GND ±1±1µA
ICC VCC = 5.5 V, IO = 0, VI = VCC or GND 1.5 1.5 mA
∆ICC‡Control inputs VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND 2.5 2.5 mA
CiControl inputs VI = 3 V or 0 3 3 pF
Cio(OFF) VO = 3 V or 0, OE = VCC 3.5 3.5 pF
VI = 0
II = 64 mA 5 5 7
r
on
§V
CC
= 4.5 V VI = 0 II = 30 mA 5 5 7 Ω
ron
VCC = 4.5 V
VI = 2.4 V, II = 15 mA 35 35 50
†Typical values are at VCC = 5 V, TA = 25°C.
‡This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
§Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lowest voltage of the two (A or B) terminals.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
SN54CBTD3384 SN74CBTD3384
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT) MIN MAX MIN MAX
UNIT
tpd¶A or B B or A 0.25 0.25 ns
ten OE A or B 2.2 9.7 2.3 7 ns
tdis OE A or B 1.5 8.6 1.7 5.3 ns
¶The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
SCDS025R − M AY 1995 − REVISED JANUARY 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOH
VOL
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
7 V
Open
GND
500 Ω
500 Ω
tPLH tPHL
Output
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
3 V
0 V
VOH
VOL
0 V
VOL + 0.3 V
VOH − 0.3 V
0 V
Input
3 V
3.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤10 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤2.5 ns
.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. t
PLH
and t
PHL
are the same as t
pd
.
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V
1.5 V
Figure 1. Load Circuit and Voltage Waveforms
SCDS025R − M AY 1995 − REVISED JANUARY 2004
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
VCC − Supply Voltage − V
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
VOH − Output Voltage High − V
TA = 85°C
VCC − Supply Voltage − V
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
TA = 25°C
6 mA
12 mA
24 mA
VCC − Supply Voltage − V
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
TA = 0°C
100 µA
6 mA
12 mA
24 mA
100 µA
6 mA
12 mA
24 mA
4
3.75
3.5
3.25
3
2.75
2.5
2.25
2
1.75
1.5
4
3.75
3.5
3.25
3
2.75
2.5
2.25
2
1.75
1.5
4
3.75
3.5
3.25
3
2.75
2.5
2.25
2
1.75
1.5
4.5 4.75 5 5.25 5.5 5.75 4.5 4.75 5 5.25 5.5 5.75
4.5 4.75 5 5.25 5.5 5.75
VOH − Output Voltage High − V
VOH − Output Voltage High − V
100 µA
Figure 2. VOH Values
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9752701Q3A ACTIVE LCCC FK 28 1 TBD Call TI Call TI
5962-9752701QKA ACTIVE CFP W 24 1 TBD Call TI Call TI
5962-9752701QLA ACTIVE CDIP JT 24 1 TBD Call TI Call TI
74CBTD3384DBQRE4 ACTIVE SSOP DBQ 24 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
74CBTD3384DBQRG4 ACTIVE SSOP DBQ 24 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
74CBTD3384DGVRE4 ACTIVE TVSOP DGV 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBTD3384DGVRG4 ACTIVE TVSOP DGV 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384DBLE OBSOLETE SSOP DB 24 TBD Call TI Call TI
SN74CBTD3384DBQR ACTIVE SSOP DBQ 24 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74CBTD3384DBR ACTIVE SSOP DB 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384DBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384DGVR ACTIVE TVSOP DGV 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384DW ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384DWE4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384DWG4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384DWR ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74CBTD3384PW ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384PWE4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384PWG4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384PWLE OBSOLETE TSSOP PW 24 TBD Call TI Call TI
SN74CBTD3384PWR ACTIVE TSSOP PW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384PWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTD3384PWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54CBTD3384FK ACTIVE LCCC FK 28 1 TBD POST-PLATE N / A for Pkg Type
SNJ54CBTD3384JT ACTIVE CDIP JT 24 1 TBD A42 N / A for Pkg Type
SNJ54CBTD3384W ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54CBTD3384, SN74CBTD3384 :
•Catalog: SN74CBTD3384
•Military: SN54CBTD3384
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74CBTD3384DBQR SSOP DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74CBTD3384DBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1
SN74CBTD3384DGVR TVSOP DGV 24 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74CBTD3384DWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
SN74CBTD3384PWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74CBTD3384DBQR SSOP DBQ 24 2500 367.0 367.0 38.0
SN74CBTD3384DBR SSOP DB 24 2000 367.0 367.0 38.0
SN74CBTD3384DGVR TVSOP DGV 24 2000 367.0 367.0 35.0
SN74CBTD3384DWR SOIC DW 24 2000 367.0 367.0 45.0
SN74CBTD3384PWR TSSOP PW 24 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JT (R-GDIP-T**) CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
4040110/C 08/96
B
0.200 (5,08) MAX
0.320 (8,13)
0.290 (7,37)
0.130 (3,30) MIN
0.008 (0,20)
0.014 (0,36)
Seating Plane
13
12
0.030 (0,76)
0.070 (1,78)
0.015 (0,38) MIN
A
24
1
0.100 (2,54) MAX
0.023 (0,58)
0.015 (0,38)
0.100 (2,54)
0°–15°
1.440
(37,08)
1.460
0.285
(7,39)
0.291
(36,58)
(7,24)
28
PINS **
1.280
1.240
0.300
0.245
(7,62)
DIM
B MAX
A MAX
A MIN
B MIN (6,22)
24
(32,51)
(31,50)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
MECHANICAL DATA
MCFP007 – OCTOBER 1994
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
W (R-GDFP-F24) CERAMIC DUAL FLATPACK
4040180-5/B 03/95
1.115 (28,32)
0.090 (2,29)
0.375 (9,53)
0.019 (0,48)
0.030 (0,76)
0.045 (1,14)
0.006 (0,15)
0.045 (1,14)
0.015 (0,38)
0.015 (0,38)
0.026 (0,66)
0.004 (0,10)
0.340 (8,64)
0.840 (21,34)
124
0.360 (9,14)
0.240 (6,10)
1312
Base and Seating Plane
30° TYP
0.360 (9,14)
0.240 (6,10)
0.395 (10,03)
0.360 (9,14)
0.640 (16,26)
0.490 (12,45)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
E. Index point is provided on cap for terminal identification only.
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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