Hall ICs
1
Publication date: June 2002 SPC00015AEB
AN48820A
Low current consumption, high sensitivity CMOS Hall IC
Operate by the value of magnetic flux density, regardless of polarity
■Overview
The AN48820A is a Hall IC (a magnetic sensor) which
has 2 times or more sensitivity and a low current consump-
tion of about one three-hundredth compared with our
conventional one.
In this Hall IC, a Hall element, a offset cancel circuit,
an amplifier circuit, a sample and hold circuit, a Schmidt
circuit, and output stage FET are integrated on a single
chip housed in a small package by IC technique.
■Features
•Either North nor South magnetic pole can be selected *
•High sensitivity (6 mT max.) due to offset cancel circuit
and a new sample and hold circuit
•Small current by using intermittent action
(Average supply current: 3.5 µA typ.)
•Small package (SMD)
•Open drain output
■Applications
•Flip type cellular phone, digital video camera
■Block Diagram
Unit: mm
MINI-3DRA (Lead-free package)
2
3
1
0.11+0.10
-
0.05
Seating plane
0 to 0.10
0.40±0.20
1.10+0.30
-
0.10
0.10 to 0.30
1.10+0.20
-
0.10
1.50+0.25
-
0.05
0.40+0.10
-
0.05
(1.45)
0.65±0.15
2.80+0.20
-
0.30
1.90±0.20
0.65±0.15
2.90+0.20
-
0.05
0.95 0.95
0.10
M
0.10
On/Off control
CLK
Hall
element Switch
Amplifier
Sample
hold
1
3
GND
2Out
VCC
■Pin Descriptions
Pin No. Symbol Description
1V
CC Power supply
2 Out Output
3 GND Ground
Magnetic
flux density
Note) *:
AN48820A
output level
Conventional model
output level
S
N
H
L
H
L
AN48820A
2SPC00015AEB
■Recommended Operating Range
Parameter Symbol Range Unit
Supply voltage VCC 2.5 to 3.5 V
■Absolute Maximum Ratings
Parameter Symbol Rating Unit
Supply voltage VCC 5V
Output voltage VOUT 5V
Supply current ICC 5mA
Output current IOUT 15 mA
Power dissipation *1, 2 PD60 mW
Operating ambient temperature *1Topr −25 to +75 °C
Storage temperature *1Tstg −55 to +125 °C
Note) *1: Except for the power dissipation, operating ambient temperature and storage temperature, all ratings are for Ta = 25°C.
*2: Ta = 85°C. For the independent IC without a heat sink. Please use within the range of power dissipation, refering to
PD Ta curve.
■Electrical Characteristics at Ta = 25°C
Parameter Symbol Conditions Min Typ Max Unit
Operating magnetic flux density 1 BH-LS VCC = 3 V  6mT
Operating magnetic flux density 2 *1BH-LN VCC = 3 V −6mT
Operating magnetic flux density 3 *2BL-HS VCC = 3 V 0.5 mT
Operating magnetic flux density 4 *2BL-HN VCC = 3 V − 0.5 mT
Output voltage 1 VOLS VCC = 3 V, IO = 2 mA, B = 6.0 mT 0.1 0.3 V
Output voltage 2 VOLN VCC = 3 V, IO = 2 mA, B = −6.0 mT 0.1 0.3 V
Output current 1 IOHS VCC = 3 V, VO = 3 V, B = 0.5 mT 10 µA
Output current 1 IOHN VCC = 3 V, VO = 3 V, B = − 0.5 mT 10 µA
Supply current 1 *3ICCAVE VCC = 3 V, B = 0.5 mT 3.5 µA
Parameter Symbol Conditions Min Typ Max Unit
Hysteresis width 1 BWS VCC = 3 V 1.2 mT
Hysteresis width 2 BWN VCC = 3 V 1.2 mT
Supply current 2 ICCON VCC = 3 V, B = 0.5 mT 1.4 mA
Supply current 3 ICCOFF VCC = 3 V, B = 0.5 mT 2µA
Operating time tON VCC = 3 V 40 µs
Stop time tOFF VCC = 3 V 41 ms
Note) *1: Symbol BH-LS , BH-LN stands for the operating magnetic flux density where its output level varies from high to low.
*2: Symbol BL-HS , BL-HN stands for the operating magnetic flux density where its output level varies from low to high.
*3: ICCAVE = {ICCON × tON + ICCOFF × tOFF}/{tON + tOFF}
•Design reference data
Note) It will operate normally in approximately 41 ms after power on.
AN48820A
3
SPC00015AEB
■Technical Data
•Position of a Hall element (unit in mm)
Distance from a package surface to sensor part: 0.39 mm (reference value)
A Hall element is placed on the shaded part in the figure.
•Magneto-electro conversion characteristics
0.5
0.5
1.2
0.39
0.5
S
N
BWSBWN
BH-LS
BH-LN
BL-HS
BL-HN
Direction of applied magnetic field Operating magnetic flux density
Output voltage
Applied magnetic flux density B
■Power dissipation of package MINI-3DRA
PD Ta
200
0 25 150
Ambient temperature Ta (°C)
Power dissipation PD (mW)
50 75 100 125
0
25
50
75
100
125
150
175
Independent IC
without a heat sink
Rth(j-a) = 833.3°C/W
PD = 120 mW (25°C)
AN48820A
4SPC00015AEB
■Caution on Use of Hall ICs
The Hall ICs are often used to detect movement. In such cases, the position of the Hall IC may be changed by
exposition to shock or vibration over a long period of time, and it causes the detection level change. To prevent this, fix
the package with adhesives or fix it on a dedicated case.
1. A case using an adhesive
Some kinds of adhesive generate corrosive gas (such as chloric gas) during curing. This corrosive gas corrodes the
aluminum on the surface of the Hall IC, and may cause a functional defect of disconnection.
If Hall IC is to be sealed after installation, attention should be given to the adhesive or resin used for peripherals
and substrate cleaner, as well as to the adhesive used for Hall IC installation. Please confirm the above matter to those
manufacturers before using.
We could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive.
2. Power supply line/Power transmission line
If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line.
In this case, set the capacitor of 0.1 µF to 10 µF near the Hall IC to prevent it.
If a voltage of 18 V or more is thought to be applied to the power supply line (flyback voltage from coil or the ignition
pulse, etc.), avoid it with external components (capacitor, resistor, Zener diode, diode, surge absorbing elements, etc.).
3. On mounting of the surface mount type package (MINI-3DR)
When mounted on the printed circuit board, the Hall IC may be highly stressed by the warp that may occur from
the soldering. This may also cause a change in the operating magnetic flux density and a deterioration of its resistance
to moisture.
4. VCC and GND
Do not reverse VCC and GND. If the VCC and GND pins are reversely connected, this IC will be destroyed. If the
IC GND-pin voltage is set higher than other pin voltage, the IC configuration will become the same as a forward
biased diode. Therefore, it will turn on at the diode forward voltage (approximately 0.7 V), and a large current will
flow through the IC, ending up in its destruction. (This is common to monolithic IC.)
5. Cautions on power-on of Hall IC
When a Hall IC is turned on, the position of the magnet or looseness may change the output of a Hall IC, and a pulse
may be generated. Therefore, care should be given whenever the output state of a Hall IC is critical when the supply
power is on.
6. On using flux in soldering
Choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. The
ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the
disconnection of the aluminum wiring on the surface of an IC chip.
7. On surface treatment of mini-mold package
Surface treatment is available in either smooth or dull finish.
8. On soldering of the surface mount type package
Surface mounting type Hall ICs are apt to change its electrical characteristics due to the stress from soldering at
mounting. Therefore, avoid the mounting by flow (dipping) and a soldering iron. Please mount it by reflow soldering
abiding by its recommended conditions.
CorrectWrong
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the latest specifications satisfy your requirements.
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rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise,
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2002 MAY