MBRS1100T3G, SBRS81100T3G, MBRS190T3G, SBRS8190T3G Preferred Devices Schottky Power Rectifier http://onsemi.com Surface Mount Power Package Schottky Power Rectifiers employ the use of the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. These state-of-the-art devices have the following features: SCHOTTKY BARRIER RECTIFIER 1.0 AMPERE 90, 100 VOLTS Features Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction High Blocking Voltage - 100 Volts 175C Operating Junction Temperature Guardring for Stress Protection AEC-Q101 Qualified and PPAP Capable SBRS8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements All Packages are Pb-Free* Mechanical Characteristics Case: Epoxy, Molded Weight: 95 mg (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Shipped in 12 mm Tape and Reel, 2,500 units per reel Cathode Polarity Band SMB CASE 403A MARKING DIAGRAM AYWW B1xG G B1 x = Device Code = C for MBRS1100T3 9 for MBRS190T3 A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 - Rev. 10 1 Publication Order Number: MBRS1100T3/D MBRS1100T3G, SBRS81100T3G, MBRS190T3G, SBRS8190T3G MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MBRS190T3 MBRS1100T3 VRRM VRWM VR Average Rectified Forward Current TL = 163C TL = 148C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction Temperature (Note 1) Voltage Rate of Change Value Unit V 90 100 A 1.0 2.0 A 50 TJ -65 to +175 C dv/dt 10 V/ns Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RqJA. THERMAL CHARACTERISTICS Characteristic Thermal Resistance - Junction-to-Lead (TL = 25C) Symbol Value Unit RqJL 22 C/W ELECTRICAL CHARACTERISTICS Symbol Value Unit Maximum Instantaneous Forward Voltage (Note 2) (iF = 1.0 A, TJ = 25C) Characteristic VF 0.75 V Maximum Instantaneous Reverse Current (Note 2) (Rated dc Voltage, TJ = 25C) (Rated dc Voltage, TJ = 100C) IR mA 0.5 5.0 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. ORDERING INFORMATION Marking Package Shipping MBRS1100T3G B1C SMB (Pb-Free) 2,500 Tape & Reel SBRS81100T3G B1C SMB (Pb-Free) 2,500 Tape & Reel MBRS190T3G B19 SMB (Pb-Free) 2,500 Tape & Reel SBRS8190T3G B19 SMB (Pb-Free) 2,500 Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 MBRS1100T3G, SBRS81100T3G, MBRS190T3G, SBRS8190T3G 1K 400 200 100 40 20 10 4 2 1 0.4 0.2 0.1 0.04 0.02 0.01 20 10 TJ = 150C 5 2 100C 1 0.5 25C 0.2 0.1 0.05 0.02 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 TJ = 150C I R , REVERSE CURRENT ( A) i F, INSTANTANEOUS FORWARD CURRENT (AMPS) TYPICAL ELECTRICAL CHARACTERISTICS 1 1.1 1.2 1.3 125C 100C 25C 0 10 20 30 40 50 60 70 80 vF, INSTANTANEOUS VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current* 90 100 I F(AV) , AVERAGE FORWARD CURRENT (AMPS) 3.2 2.8 TJ = 100C 2.4 2.0 SQUARE WAVE 1.6 DC 1.2 0.8 0.4 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 2.0 DC 1.5 1.0 SQUARE WAVE 0.5 0 145 150 155 160 165 170 175 IF(AV), AVERAGE FORWARD CURRENT (AMPS) TC, CASE TEMPERATURE (C) Figure 3. Power Dissipation Figure 4. Current Derating, Case, Per Leg C, CAPACITANCE (pF) PF(AV), AVERAGE POWER DISSIPATION (WATTS) *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these curves if VR is sufficient below rated VR. 280 260 240 220 200 180 160 140 120 100 80 60 40 20 0 NOTE: TYPICAL CAPACITANCE NOTE: AT 0 V = 270 pF 0.1 0.2 0.5 1 2 5 10 20 VR, REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance http://onsemi.com 3 50 100 180 MBRS1100T3G, SBRS81100T3G, MBRS190T3G, SBRS8190T3G PACKAGE DIMENSIONS SMB CASE 403A-03 ISSUE H HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. E b DIM A A1 b c D E HE L L1 D POLARITY INDICATOR OPTIONAL AS NEEDED MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.20 2.28 0.10 0.19 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.087 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.090 0.007 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 A1 c SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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