INTEGRATED CIRCUITS DIVISION
DS-IXD_604SI_SIA-R04 www.ixysic.com 1
Features
•AEC Q100 Qualified
•4A Source/Sink Drive Current
•Wide Operating Voltage Range: 4.5V to 35V
•AEC Q100 Grade 1 -40°C to +125°C Operating
Temperature Range
•Logic Input Withstands Negative Swing of up to 5V
•Outputs Ma y be Connected in Parallel for Higher
Drive Current
•Matched Rise and Fall Times
•Low Propaga tion Delay Time
•Low, 10A Supply Current
•Low Output Impedance
Features
•Automotive DC/DC regulators
•Electronic Power Steering
•Electric Vehicle Power Train Driv es
•Brushless DC motors
Description
The IXD_604SI and IXD_604SIA are automotive
grade, dual high-speed gate driv ers that are qualified
according to AEC Q100 standards. Each of t he two
outputs can source and sink 4A of cur rent, while
producing rise and f all times of less than 10ns. The
outputs and inputs are rated to 35V. The input of each
driver is virtually immune to latch-up, and proprietary
circuitry eliminates cross-conduction and
"shoot-through." The IXD_604 has a Grade 1, -40°C
to +125°C ambient operating te mper at ure range.
The IXDD604 is a dual non-inv e rting driver with an
enable. The IXDN604 is a dual non-inverting driver,
the IXDI604 is a dual in verting driver , and the IXDF604
has one inverting driver and one non-inverting driver.
The AEC Q100 qualified IXD_604SIA is available in a
standard 8-pin SOIC package, and the IXD_604SI is
available in an 8-pin Pow er SOI C package with an
e xpo sed met al back.
Ordering Information
Part Number Logic
Configuration Package Type Packing
Method Quantity
IXDD604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDD604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDD604SIA 8-Pin SOIC Tube 100
IXDD604SIATR 8-Pin SOIC Tape & Reel 2000
IXDF604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDF604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDF604SIA 8-Pin SOIC Tube 100
IXDF604SIATR 8-Pin SOIC Tape & Reel 2000
IXDI604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDI604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDI604SIA 8-Pin SOIC Tube 100
IXDI604SIATR 8-Pin SOIC Tape & Reel 2000
IXDN604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDN604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDN604SIA 8-Pin SOIC Tube 100
IXDN604SIATR 8-Pin SOIC Tape & Reel 2000
ENA
INA
ENB
INB
OUTA
OUTB
A
B
INA
INB
A
B
OUTA
OUTB
INA
INB
A
B
OUTA
OUTB
INA
INB
OUTA
OUTB
A
B
IXD_604SI & SIA
Automotive Grade
4-Ampere, Dual Low-Side, Ultrafast MOSFET Drivers
INTEGRATED CIRCUITS DIVISION
IXD_604SI & SIA
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1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Electrical Characteristics: -40°C < TA < +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 IXDD604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 IXDI604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3 IXDF604. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.4 IXDN604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
INTEGRATED CIRCUITS DIVISION
IXD_604SI & SIA
R04 www.ixysic.com 3
1 Specifications
1.1 Pin Configurations 1.2 Pin Definitions
1.3 Absolute Maximum Ratings
Absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress r a tings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
IXDD604SI/SIA
ENA
INA
GND
INB
ENB
OUTA
V
CC
OUTB
1
4
3
2
8
5
6
7
A
B
IXDF604SI/SIA
NC
INA
GND
INB
NC
OUTA
V
CC
OUTB
1
4
3
2
8
5
6
7
A
B
IXDI604SI/SIA
NC
INA
GND
INB
NC
OUTA
V
CC
OUTB
1
4
3
2
8
5
6
7
A
B
IXDN604SI/SIA
NC
INA
GND
INB
NC
OUTA
V
CC
OUTB
1
4
3
2
8
5
6
7
A
B
Pin Name Description
INA Channel A Logic Input
INB Channel B Logic Input
ENA
Channel A Enable Input -
Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
ENB
Channel B Enable Input -
Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
OUTA
OUTA
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
OUTB
OUTB
Channel B Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC Supply Voltage - Provides power to the device
GND Ground - Common ground reference for the
device
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC -0.3 40 V
Input Voltage VINx , VENx -5 VCC+0.3 V
Output Current IOUT -±4A
Output Pulsed Current (0.5s) Iout_pulsed -±5A
Junction Temperature TJ-55 +150 °C
Storage Temperature TSTG -65 +150 °C
Parameter Symbol Range Units
Supply Voltage VCC 4.5 to 35 V
Operating Temperature Range T
A-40 to +125 °C
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IXD_604SI & SIA
1.5 Electrical Ch ara ct e ri st ic s: TA = 25°C
Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
1.6 Electrical Ch ara ct e ri st ic s: -40°C < TA < +125°C
Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
Parameter Conditions Symbol Minimum Typical Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - V
Input Voltage, Low 4.5V < VCC < 18V VIL --0.8
Input Current 0V < VIN < VCC IIN --±10A
High EN Input Voltage IXDD604 only VENH 2/3VCC --
V
Low EN Input Voltage IXDD604 only VENL --
1/3VCC
Output Voltage, High - VOH VCC-0.025 --
V
Output Voltage, Low - VOL - - 0.025
Output Resistance, High State VCC=18V, IOUT=-10mA ROH -1.32.5
Output Resistance, Low State VCC=18V, IOUT=10mA ROL -1.12
Output Current, Continuous Limited by package power
dissipation IDC --±1A
Rise Time VCC=18V, CLOAD=1000pF tr-916
ns
Fall Time VCC=18V, CLOAD=1000pF tf-814
On-Time Propagation Delay VCC=18V, CLOAD=1000pF tondly -2950
Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toffdly -3550
Enable to Output-High Delay Time IXDD604 only, VCC=18V tENOH -3555
Disable to High Impedance State Delay Time IXDD604 only, VCC=18V tDOLD -4055
Enable Pull-Up Resistor - REN -200-k
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-13mA
VCC=18V, VIN=0V -<110
A
VCC=18V, VIN=VCC -<110
Parameter Conditions Symbol Minimum Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.3 - V
Input Voltage, Low 4.5V < VCC < 18V VIL -0.65
Input Current 0V < VIN < VCC IIN -10 10 A
Output Voltage, High - VOH VCC-0.025 -V
Output Voltage, Low - VOL -0.025
Output Resistance, High State VCC=18V, IOUT=-10mA ROH -3
Output Resistance, Low State VCC=18V, IOUT=10mA ROL -2.5
Output Current, Continuous Limited by package power
dissipation IDC -±1A
Rise Time VCC=18V, CLOAD=1000pF tr-16
ns
Fall Time VCC=18V, CLOAD=1000pF tf-14
On-Time Propagation Delay VCC=18V, CLOAD=1000pF tondly -65
Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toffdly -65
Enable to Output-High Delay Time IXDD604 only, VCC=18V tENOH -65
Disable to High Impedance State Delay Time IXDD604 only, VCC=18V tDOLD -65
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-3.5mA
VCC=18V, VIN=0V -150
A
VCC=18V, VIN=VCC -150
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1.7 Thermal Characteristics
2 IXD_604 Performance
2.1 Timing Diagrams
2.2 Characteristics Test Diagram
Package Parameter Symbol Rating Units
SI (8-Pin Power SOIC) Thermal Resistance, Junction-to-Ambient JA 85
°C/W
SIA (8-Pin SOIC) 120
SI (8-Pin Power SOIC) Thermal Resistance, Junction-to-Case JC 10
10%
90%
t
ondly
t
offdly
t
f
t
r
V
IH
V
IL
INx
OUTx
10%
90%
t
ondly
t
offdly
t
r
t
f
V
IH
V
IL
INx
OUTx
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3 Block Diagrams & Truth Tab les
3.1 IXDD604
3.2 IXDI604
3.3 IXDF604
3.4 IXDN604
INXENXOUTX
0 1 or open 0
1 1 or open 1
00
Z
10
Z
INXOUTX
01
10
200kΩ
ENA
INA
GND
INB
ENB
OUTA
V
CC
OUTB
V
CC
V
CC
IXDD604
200kΩ
V
CC
INA
GND
INB
OUTA
VCC
OUTB
VCC
IXDI604
INA OUTA
01
10
INB OUTB
00
11
INXOUTX
00
11
INA
GND
INB
OUTA
V
CC
OUTB
V
CC
IXDF604
INA
GND
INB
OUTA
VCC
OUTB
VCC
IXDN604
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4 Typical Performance Characteristics
Load Capacitance (pF)
0 2000 4000 6000 8000 10000
Rise Time (ns)
0
20
40
60
80
100
120
A&B Rise Time vs. Load Capacitance
at V arious VCC Levels
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=24V
VCC=35V
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Rise & Fall Times (ns)
4
5
6
7
8
9
10
A&B Rise and Fall Times
vs. Temperature
(Input=0-5V, VCC=18V, CL=1nF)
tr
tf
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Fall Time (ns)
0
20
40
60
80
100
120
A&B Fall Times vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
CL=10nF
CL=1nF
CL=470pF
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Rise Time (ns)
0
20
40
60
80
100
120
A&B Rise Times vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
CL=10nF
CL=1nF
CL=470pF
Load Capacitance (pF)
0 2000 4000 6000 8000 10000
Fall Time (ns)
0
20
40
60
80
100
120
A&B Fall Time vs. Load Capacitance
at V arious VCC Levels
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=24V
VCC=35V
Supply V oltage (V)
0 5 10 15 20 25 30 35
Input Threshold (V)
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2 Input Threshold vs. Supply Voltage
VIH
VIL
Temperature (ºC)
-40 -20 0 20 40 60 80100120140
Input Threshold V oltage (V)
1.7
1.9
2.1
2.3
2.5
2.7
2.9
Input Threshold V oltage
vs. Temperature
(VCC=18V, CL=1nF)
Min VIH
Max VIL
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Propagation Delay (ns)
20
25
30
35
40
45
50 Propagation Delay vs. Temperature
toffdly
tondly
Input V oltage (V)
246810 12
Propagation Delay (ns)
20
30
40
50
60
70
Propagation Delay vs. Input Voltage
(VCC=15V, CL=1nF)
tondly
toffdly
Supply V oltage (V)
0 5 10 15 20 25 30 35
Propagation Delay (ns)
20
40
60
80
100
120
140
160
Propagation Delay vs. Supply Voltage
(VIN=0-5V, CL=1nF, f=1kHz)
toffdly
tondly
Supply V oltage (V)
0 5 10 15 20 25 30 35
Enable Threshold (V)
0
2
4
6
8
10
12
14
16
18
20
22 Enable Threshold vs. Supply Voltage
VENH
VENL
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Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(VCC=35V)
CL=10nF
CL=1nF
CL=470pF
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
350
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=8V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
350
400
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=12V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
350
400
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=18V)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=2MHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
1
10
100
1000
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=35V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(VCC=18V)
CL=10nF
CL=1nF
CL=470pF
Supply V oltage (V)
0 5 10 15 20 25 30 35
Output Source Current (A)
0
-2
-4
-6
-8
-10
Output Source Current
vs. Supply Voltage
(CL=10nF)
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Dynamic Supply Current
vs. Temperature
(VCC=18V, VIN=5V, f=1khz, CL=1nF)
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Quiescent Supply Current
vs. Temperature
(VCC=18V)
VIN=3.5V
VIN=5V
VIN=10V
VIN=0V & 18V
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(VCC=8V)
CL=10nF
CL=1nF
CL=470pF
Frequency (kHz)
1 10 100 1000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(VCC=12V)
CL=10nF
CL=1nF
CL=470pF
Supply V oltage (V)
0 5 10 15 20 25 30 35
Output Sink Current (A)
0
2
4
6
8
10
Output Sink Current
vs. Supply Voltage
(CL=10nF)
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Supply V oltage (V)
0 5 10 15 20 25 30 35
Resistance (Ω)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
High State Output Resistance
vs. Supply Voltage
(IOUT= -10mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Output Sink Current (A)
2.0
3.0
4.0
5.0
6.0
Output Sink Current
vs. Temperature
(VCC=18V, CL=10nF)
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Output Source Current (A)
2
3
4
5
6
Output Source Current
vs. Temperature
(VCC=18V, CL=10nF)
Supply V oltage (V)
0 5 10 15 20 25 30 35
Resistance (Ω)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Low State Output Resistance
vs. Supply Voltage
(IOUT= +10mA)
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5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moistur e ing r ession. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moistu re se nsitivity according to the latest
v ersion o f the joint indust ry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.
We test all of our products to t he maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operab le life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
5.2 ESD Sensitivi ty
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
5.3 Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5) ºC or greater. The classification temperature sets the Maximum Bo dy
Temperature allow ed for this device during lead-free ref low processes. For through-hole de vices, and an y other
processes, the guidelines of J-STD- 020 must be observed.
5.4 Board Was h
IXYS Integr ated Circu it s Division recommends t he use of no-clean f lux formulations. Board washing to reduce or
remove flux residue following the solder reflow process is accep table provided proper precautions ar e taken to
pre vent damage to the device. These pr ecautions include but are not limited to: using a lo w pressure wash and
providing a follow up bak e cycle suff icien t to remove any moistur e trapped within the device due to the washing
process. Due to the v ariability of the wash par ameters used to clean the board, determination of the bake temper ature
and duration necessary to remove the moisture trapped within the package is the responsibility of the user
(assembler) . Cleaning or drying methods that employ ultrasonic energy ma y damage the de vice and should not be
used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
Device Moisture Sensitivity Level (MSL) Classification
IXD_604SI & IXD_604SIA MSL 1
Device Classification Temperature (TC)Dwell Time (tp)Max Reflow Cycles
IXD_604SI & IXD_604SIA 260°C 30 seconds 3
INTEGRATED CIRCUITS DIVISION
IXD_604SI & SIA
R04 www.ixysic.com 11
5.5 Mechanical Dimensions
5.5.1 SIA Package (8-Pin SOIC)
5.5.2 SI Package (8-Pin Power SOIC with Exposed Metal Back)
Dimensions
MIN / MAX
1.75 MAX
(0.069 MAX)
1.25 MIN
(0.049 MIN)
0.10 / 0.25
(0.004 / 0.010)
0.10
(0.004)
4
4.80 / 5.00
(0.189 / 0.197)
TOP VIEW
PIN #1
5.80 / 6.20
(0.228 / 0.244)
5
3.80 / 4.00
(0.150 / 0.157)
0.31 / 0.51
(0.012 / 0.020)
8x
SEATING PLANE
GAUGE PLANE
8°- 0°
0.10 / 0.25
(0.004 / 0.010)
0.40 / 1.27
(0.016 / 0.050)
A
0.25
(0.010)
PCB Land Pattern
1.55
(0.061)
0.60
(0.024)
3.75
(0.148)
A
Notes:
1. Controlling dimension: millimeters.
2. All dimensions are in mm (inches).
3. This package conforms to JEDEC Standard MS-012, variation AA, Rev. F.
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.
6. Lead thickness includes plating.
6x
1.27
0.05
Dimensions
MIN / MAX
1.70 MAX
(0.067 MAX)
1.25 MIN
(0.049 MIN)
0 / 0.15
(0 / 0.006)
0.10
(0.004)
4
4.80 / 5.00
(0.189 / 0.197)
TOP VIEW
PIN #1
5.80 / 6.20
(0.228 / 0.244)
5
3.80 / 4.00
(0.150 / 0.157)
0.31 / 0.51
(0.012 / 0.020)
8x
BOTTOM VIEW
2.05 / 2.41
(0.081 / 0.095)
2.81 / 3.30
(0.111 / 0.130)
SEATING PLANE
GAUGE PLANE
8°- 0°
0.10 / 0.25
(0.004 / 0.010)
0.40 / 1.27
(0.016 / 0.050)
A
0.25
(0.010)
PCB Land Pattern
1.55
(0.061)
0.60
(0.024)
3.85
(0.152) 2.23
(0.088)
3.055
(0.120)
A
6x
1.27
0.05
Notes:
1. Controlling dimension: millimeters.
2. All dimensions are in mm (inches).
3. This package conforms to JEDEC Standard MS-012, variation BA, Rev. F.
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.
6. The exposed metal pad on the back of the package should be connected to GND. It is not suitable for carrying current.
7. Lead thickness includes plating.
INTEGRATED CIRCUITS DIVISION
12 www.ixysic.com R04
IXD_604SI & SIA
5.5.3 Tape & Reel Information for SI and SIA Packages
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K0= 2.10
(0.083)
W=12.00
(0.472)
B0=5.30
(0.209)
User Direction of Feed
A0=6.50
(0.256) P1=8.00
(0.315)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representati ons or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatso ever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_604SI_SIA-R04
©Copyright 2017, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
10/25/2017