CPC1135N Single-Pole, Normally Closed 4-Pin SOP OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 350 120 35 Units VP mArms / mADC Description The CPC1135N is a miniature single-pole, normally closed (1-Form-B) solid state relay that uses optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Its optically coupled output, which uses the patented OptoMOS architecture, is controlled by a highly efficient GaAIAs infrared LED. Features * 1500Vrms Input/Output Isolation * Low Drive Power Requirements (TTL/CMOS Compatible) * No Moving Parts * High Reliability * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Small 4-Pin SOP Package * Machine Insertable, Wave Solderable * Tape & Reel Version Available IXYS Integrated Circuits Division's state of the art double-molded vertical construction packaging enables the CPC1135N to be one of the world's smallest 4-pin solid state relays. It offers board space savings over the competitor's larger 4-pin SOP relay. Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Approvals * UL 1577 Approved Component: File E76270 * CSA Certified Component: Certificate 1172007 * EN 60950 Certified Component: TUV Certificate B 10 05 49410 006 Ordering Information Part # CPC1135N CPC1135NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control - Control 1 4 3 2 Load Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 90% 10% toff Pb DS-CPC1135N-R08 ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1135N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Capacitance, Input to Output Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 350 5 50 1 150 400 1 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW pF Vrms C C Derate linearly 3.33 mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current 1 2 3 2 Conditions Symbol Min Typ Max Units t =10ms IL=120mA IF=2mA, VL=350VP IL ILPK RON ILEAK - - 120 350 35 5 mArms / mADC mAP A VL=50V, f=1MHz ton toff COUT - 25 2 2 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.3 0.9 - 0.6 0.55 1.2 - 2 1.4 10 IF=5mA, VL=10V ms pF mA mA V A Load current derates linearly from 120mA @ 25oC to 80mA @ 85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60C) a LED drive current of 4mA is recomended. www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION CPC1135N PERFORMANCE DATA @ 25C (Unless Otherwise Noted) * 25 20 15 10 5 0 15 10 5 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) 15 10 5 0.22 0.23 0.24 0.25 0.26 0.55 0.60 0.65 0.70 5 0.50 0.60 15 10 5 1.10 Typical On-Resistance Distribution (N=50, IL=120mA) 25 20 15 10 5 0 0.45 0.75 35 0.70 0.80 0.90 1.00 Turn-Off Time (ms) 30 20 0 0.50 10 0.27 Typical IF for Switch Dropout (N=50, IL=120mA) 25 0 0.45 15 Turn-On Time (ms) Typical IF for Switch Operation (N=50, IL=120mA) 20 20 0 0.21 Device Count (N) Device Count (N) 25 20 0 1.17 Typical Turn-Off Time (N=50, IF=5mA, IL=120mA) 25 Device Count (N) Device Count (N) Device Count (N) 30 25 Typical Turn-On Time (N=50, IF=5mA, IL=120mA) Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) 0.50 LED Current (mA) 0.55 0.60 0.65 0.70 LED Current (mA) 0.75 28.5 29 29.5 30 30.5 31 31.5 On-Resistance (:) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 365 370 375 380 385 390 Blocking Voltage (VP) 395 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1135N PERFORMANCE DATA @ 25C (Unless Otherwise Noted) * Typical Turn-On Time vs. LED Forward Current (IL=120mA) 0.7 1.8 1.6 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.4 0.3 0.2 0 0.8 -20 0 20 40 60 80 100 0 120 10 15 25 30 35 40 45 50 0 15 20 25 30 35 40 Typical Turn-On Time vs. Temperature (IL=50mA) Typical Turn-Off Time vs. Temperature (IL=50mA) Turn-On Time (ms) 1.5 1.0 0 -20 0 20 40 60 Temperature (C) 80 100 60 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 IF=10mA IF=5mA -40 -20 0 20 40 60 80 100 20 10 Load Current (mA) Load Current (mA) 30 50 0 -50 -100 20 40 60 80 -4 -2 0 2 4 0.014 390 0.012 Leakage (A) 395 385 380 375 Typical Leakage vs. Temperature Measured Across Pins 3&4 (IF=2mA, VL=350V) 0.010 0.008 0.006 0.004 370 0.002 365 -20 0 20 40 60 Temperature (C) 80 100 100 120 140 120 100 80 60 40 0 -40 -20 0 20 40 60 Temperature (C) 80 -20 0 20 40 60 80 Temperature (C) Energy Rating Curve Load Current (A) Typical Blocking Voltage vs. Temperature 0.016 100 Maximum Load Current vs. Temperature (IF=0mA) -40 6 Load Voltage (V) Temperature (C) 400 80 0 -6 100 20 40 60 Temperature (C) 20 -150 0 0 0 160 100 40 50 IF=10mA -20 180 150 45 IF=5mA -40 Typical Load Current vs. Load Voltage (IF=0mA) 50 -20 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 Temperature (C) Typical On-Resistance vs. Temperature (IF=0mA, IL=120mA) -40 10 Typical IF for Switch Operation vs. Temperature (IL=50mA) 2.0 -40 5 LED Forward Current (mA) 0.5 Blocking Voltage (VP) 20 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 LED Forward Current (mA) 2.5 -40 5 Typical Turn-Off Time vs. LED Forward Current (IL=120mA) Temperature (C) Turn-Off Time (ms) 3.0 LED Current (mA) 0.5 0.1 -40 On-Resistance (:) Turn-Off Time (ms) 0.6 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10s 100s 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION CPC1135N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1135N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1135N 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R08 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1135N Mechanical Dimensions CPC1135N 4.089 0.203 (0.161 0.008) Recommended PCB Land Pattern 0.200 0.025 (0.008 0.001) 0.60 (0.0217) 6.096 0.102 (0.240 0.004) 3.810 0.076 (0.150 0.003) 0.432 0.127 (0.017 0.005) 5.60 (0.2205) 1.02 0.025 (0.040 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.30 (0.0512) 2.184 Max (0.086 Max) 2.54 (0.10) Lead to package standoff: 0.0637 0.0383 (0.0025 0.0015) 0.762 0.102 (0.030 0.004) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1135NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1135N-R08 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/14/2012