LATB T66B
Hyper Multi TOPLED®
Enhanced optical Power LED (HOP2000 / ATON®)
Non-RoHS compliant version of product will be
discontinued acc. to OS-PD-2005-005.
The product itself will remain within RoHS compliant
version.
2005-04-05 1
Besondere Merkmale
Gehäusetyp: weißes P-LCC-4 Gehäuse;
Kontrasterhöhung durch schwarze Oberfläche
(RGB-Displays) und diffuses Harz
Besonderhei t des B aut eils: additive
Farbmischung durch unabhängige Ansteuerung
aller Chi ps
Wellenlänge: 617 nm (amber),
528 nm (true green) , 470 nm (blau)
Abstrahlwinkel: Lambert scher Strahler (120°)
Technologie: InGaAlP (amber),
InGaN (true green, blau)
optischer Wirkungsgra d: 24 lm/W (amber),
13 lm/W (true green), 3 lm/W (blau)
Gruppierungsparameter: Lichtstärke,
Wellenlänge
Verarbeitungsmethode: r alle
SMT-Bestücktechniken gee ignet
Lötmethode: IR Reflow Löten und
Wellenlöten (TTW)
Vorbehandlung: nach JEDEC Level 2
Gurtung: 8-mm Gurt mit 2000/Rolle, ø180 mm
oder 8000/Rolle, ø33 0 mm
ESD-Festigkeit: ESD-sicher bis 2 kV nach
JESD22-A114-B
Anwendungen
Anzeigen im Innen- und Außenbereich
(z.B. im Verkehrsberei ch; Laufschriftanzeigen)
Leuchtdiodenchips getrennt ansteuerbar
Vol lfarb d is p lays bz w. RGB-Displa y s
Hinterleuchtung (LCD, Displays,
Werbebeleuchtung, Allgem ei nbeleuchtung)
Einkopplung in Lichtleiter
Features
package: whi te P- LC C-4 package;
higher contrast by a black surface
(RGB-Displays) and dif fused resin
feature of the device: additive mixture of color
stimuli by independent driving of each chip
wavelength: 617 nm (amber),
528 nm (true gree n), 470 nm (blue)
viewing angle: Lambertian Emit ter (120°)
technology: InGaAlP (amber),
InGaN (true green, blue)
optical efficiency: 24 lm/W (amber),
13 lm/W (true green), 3 lm/W (blue)
grouping parameter: luminous intensit y,
wavelength
assembly methods: suitable for all
SMT assembly methods
soldering meth ods: IR reflow soldering and
TTW soldering
preconditioning: acc. to JEDEC Level 2
taping: 8 mm tape with 2000/r eel, ø180 mm
or 8000/reel, ø330 mm
ESD-wi t h st and voltage: up to 2 kV acc. to
JESD22-A114-B
Applications
indoor and outdoor displays (e.g. displays for
traffic; light wr iting display s)
LED chips can be controll ed s epar ately
full color displays, RGB-Displays
backlighting (LCD, displays, illu minated
advertising, general lighting)
coupling into light guides
2005-04-05 2
LATB T66B
Anm.: -78 Gesamter Farbbereich, Lieferung in Einzelgruppen (siehe Seite 5)
Note: -78 Total color tolerance range, delivery in single groups (see page 5)
Bestellinformation
Ordering Information
Typ
Type
Emissions-
farbe
Color of Emission
Lichtstärke1) Seite 20
Luminous Intensity1) page 20
IF = 20 mA
IV (mcd)
amber true green blue
LATB T66B amber
true green
blue
180 ...450
180 ...450
45 ...112
Bestellinformation
Ordering Information
Typ
Type Bestellnummer
Ordering Code
LATB T66B-ST-1+ST-78+PQ-78
LATB T66B-ST-1+TU-78+QR-78 Q65110A0152
Q65110A0697
LATB T66B
2005-04-05 3
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Werte
Values Einheit
Unit
amber true
green blue
Betriebstemperatur
Operating temperature range Top – 40 … + 100 °C
Lagertemperatur
Storage temperature range Tstg – 40 … + 100 °C
Sperrschichttemperatur
Junction temperature Tj+ 125 + 125 + 110 °C
Durchlassstrom
Forward current
(TA=25°C)
IF50 20 20 mA
Stoßstrom
Surge current
tp = 10 µs, D = 0.005, TA=25°C
IFM 100 400 300 mA
Sperrspannung2) Seite 20
Reverse voltage2) page 20
(TA=25°C)
VR12 5 5 V
Leistungsaufnahme
Power consumption
(TA=25°C)
Ptot 130 85 85 mW
Wärmewiderstand
Thermal resistance
Sperrschicht/Umgebung3) Seite 20 1 chip on
Junction/ambient3) page 20 3 chips on
Sperrschicht/Lötpad 1 chip on
Junction/solder point 3 chips on
Rth JA
Rth JA
Rth JS
Rth JS
480
770
260
420
530
820
290
470
530
820
290
470
K/W
K/W
K/W
K/W
2005-04-05 4
LATB T66B
Kennwerte
Characteristics
(TA = 25 °C)
Bezeichnung
Parameter Symbol
Symbol Werte
Values Einheit
Unit
amber true
green blue
Wellenlänge des emittierten Lichtes (typ.)
Wavelength at peak emission
IF = 20 mA
λpeak 628 523 465 nm
Dominantwellenlänge4) Seite 20
Dominant wavelength4) page 20
IF = 20 mA
λdom 617
–2/+7 528*
± 9 470
± 6 nm
Spektrale Bandbreite bei 50 % Irel max (typ.)
Spectral bandwidth at 50 % Irel max
IF = 20 mA
∆λ 16 33 25 nm
Abstrahlwinkel bei 50 % IV (Vollwinkel) (typ.)
Viewing angle at 50 % IV
2ϕ120 120 120 Grad
deg.
Durchlassspannung5) Seite 20 (min.)
Forward voltage5) page 20 (typ.)
IF = 20 mA (max.)
VF
VF
VF
2.0
2.4
3.5
4.1
3.6
4.1
V
V
V
Sperrstrom (t yp . )
Reverse current (max.)
VR = 12 V (amber); VR = 5 V (true green / blue)
IR
IR
0.01
10 0.01
10 0.01
10 µA
µA
Temperaturkoeffizient von λpeak (typ.)
Temperature coefficient of λpeak
IF =20 mA; –10°C T 100°C
TCλpeak 0.13 0.04 0.05 nm/K
Temperaturkoeffizient von λdom (typ.)
Temperature coefficient of λdom
IF = 20 mA; –10°C T 100°C
TCλdom 0.06 0.03 0.04 nm/K
Temperaturkoeffizient von VF(typ.)
Temperature coefficient of VF
IF = 20 mA; –10°C T 100°C
TCV– 1.8 – 3.6 – 3.1 mV/K
Optischer Wirkungsgrad (typ.)
Optical efficiency
IF = 20 mA
ηopt 24 13 3lm/W
* Einzelgruppen si ehe Seite 5
Individual groups on page 5
LATB T66B
2005-04-05 5
Wellenlängengruppen (Dominantwellenlänge)4) Seite 20
Wavelength Groups (Dominant Wavelength)4) page 20
Gruppe
Group true green blue Einheit
Unit
min. max. min. max.
7519 528 464 470 nm
8528 537 470 476 nm
Helligkeits-Gruppierungsschema
Brightness Groups
Helligkeitsgruppe
Brightness Group Lichtstärke1) Seite 20
Luminous Intensity1) page 20
IV (mcd)
Lichtstrom6) Seite 20
Luminous Flux6) page 20
ΦV (mlm)
P
Q
R
S
T
U
45 ... 71
71 ...112
112 ...180
180 ...280
280 ...450
450 ...710
170 (typ.)
270 (typ.)
430 (typ.)
680 (typ.)
1075 (typ.)
1700 (typ.)
Anm.: Die Standardlieferform von Serientypen beinhaltet eine Familiengruppe. Einzelne
Helligkeitsgruppen sind nicht bestellbar.
Note: The standard shipping format for serial types includes a family group. Individual brightness
groups cannot be ordered.
Gruppenbezeichnung auf Etikett
Group Name on Label
Beispiel: T-1+S-7+P-7
Example: T-1+S-7+P-7
Helligkeits-
gruppe
Brightness
Group
(amber)
Wellenlänge
(keine
Gruppierung)
Wavelength
(no grouping)
(amber)
Helligkeits-
gruppe
Brightness
Group
(true green)
Wellenlänge
Wavelength
(true green)
Helligkeits-
gruppe
Brightness
Group
(blue)
Wellenlänge
Wavelength
(blue)
T 1 S 7 P 7
Anm.: In einer Verpackungseinheit / Gurt ist immer nur eine Helligkeitsgruppe pro Farbe enthalten.
Note: No packing unit / tape ever contains more than one brightness group per color.
2005-04-05 6
LATB T66B
Relative spektrale Emission6) Seite 20
Relative Spectral Emission6) page 20
V(λ) = spektrale Augenempfindlichkeit / Standard eye response curve
Irel = f (λ); TA = 25 °C; IF = 20 mA
Abstrahlcharakteristik6) Seite 20
Radiation Characteristic6) page 20
Irel = f (ϕ); TA = 25 °C
0
350 nm
λ
OHL01452
I
20
40
60
80
%
100
rel
blue
400 450 500 550 600 650 700
true green
λ
V
amber
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
10˚20˚40˚ 30˚
OHL01660
50˚
60˚
70˚
80˚
90˚
100˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
LATB T66B
2005-04-05 7
Durchlassstrom6) Seite 20
Forward Current6) page 20
IF = f (VF); TA = 25 °C
Relative Lichtstärke6) 7) Seite 20
Relative Luminous Intensity6) 7) page 20
IV/IV(20 mA) = f (IF); TA = 25 °C
Relative Lichtstärke6) Seite 20
Relative Luminous Intensity6) page 20
IV/IV(25 °C) = f (Tj); IF = 20 mA
OHL00590
10-2
10-1
100
101
F
V
102
F
I
mA
2.3
1.3 1.5 1.7 1.9 2.1 V 2.5
OHL01473
I
F
V
V (20 mA)
II
1
10
0
10
-1
10
10
-2
5
5
10
10
510
2
mA 10
amber
true green
blue
OHL01477
0
-40 ˚C
T
(25 ˚C)
I
V
I
V
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
2.0
-20 0 20 40 60 10
0
amber
blue
true green
j
LATB T66B
2005-04-05 8
Dominante Wellenlänge6) Seite 20
Dominant Wavelength6) page 20
blue; λdom = f (IF); TA = 25 °C
Durchlassstrom
Forward Current
IF = f (VF); TA = 25 °C
Dominante Wellenlänge6) Seite 20
Dominant Wavelength6) page 20
true green; λdom = f (IF); TA = 25 °C
I
OHL10503
467
dom
λ
0 mA
nm
20 40 60 80 12
0
468
469
470
471
472
473
474
blue
f
OHL01481
I
F
3.5232.5 5V4.54
V
F
5
mA
102
10-1
5
100
5
101
true green
blue
I
OHL00882
510
dom
λ
0 mA
nm
20 40 60 80 12
0
515
520
525
530
535
540
550
f
true green
LATB T66B
2005-04-05 9
Maximal zulässiger Durchlassstrom
Max. Permissible Forward Current
IF = f (T); 1 chip on
Maximal zulässiger Durchlassstrom
Max. Permissible Forward Current
IF = f (T); 1 chip on
Maximal zulässiger Durchlassstrom
Max. Permissible Forward Current
IF = f (T); 3 chips on
Maximal zulässiger Durchlassstrom
Max. Permissible Forward Current
IF = f (T); 3 chips on
OHL00926
0020 40 60 80 ˚C 100
mA
F
I
T
temp. ambient
T
A
A
amber
blue
10
20
30
40
50
60
true green
OHL00927
0020 40 60 80 ˚C 100
mA
F
I
T
temp. solder point
T
S
S
amber
blue
10
20
30
40
50
60
true green
OHL00928
0020 40 60 80 ˚C 100
mA
F
I
T
temp. ambient
T
A
A
amber
blue
10
20
30
40
50
60
true green
OHL00929
0020 40 60 80 ˚C 100
mA
F
I
T
temp. solder point
T
S
S
amber
blue
10
20
30
40
50
60
true green
LATB T66B
2005-04-05 10
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
amber (1 Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
amber (3 Chips on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
amber (1 Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
amber (3 Chips on)
OHL00193
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
OHL01605
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
OHL01604
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
OHL01606
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
LATB T66B
2005-04-05 11
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
true green (1 Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
true green (3 Chips on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
true green (1Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
true green (3 Chips on)
OHL11400
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.45
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
OHL00930
10-5
p
t
F
I
10-4 10-3 10-2 10-1 100101
0
A
2
10s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.20
OHL11401
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.05
0.10
0.15
0.20
OHL00931
10-5
p
t
F
I
10-4 10-3 10-2 10-1 100101
0
A
2
10s
Dt
P
T
=
T
P
tI
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.045
LATB T66B
2005-04-05 12
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
blue (1 Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
blue (3 Chips on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
blue (1 Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
blue (3 Chips on)
OHL11405
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
Dt
P
T
=
T
P
tI
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.05
0.10
0.15
0.20
0.25
0.35
OHL00932
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
Dt
P
T
=
T
P
tI
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.050
0.100
0.150
0.200
0.250
0.300
0.350
0.450
OHL11406
10-5
p
t
F
I
10-4 10-3 10-2 10-1 100101
0
A
2
10s
Dt
P
T
=
T
P
tI
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.02
0.04
0.06
0.08
0.10
0.14
OHL00934
10-5
p
t
F
I
10-4 10-3 10-2 10-1 100101
0
A
2
10s
Dt
P
T
=
T
P
tI
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.050
0.100
LATB T66B
2005-04-05 13
Farbortgruppen6) Seite 20
Chromaticity Coordinate Groups6) page 20
Die Farbkoordinaten des Mischlichtes können innerhalb des gekennzeichneten Bereichs des Farbdreiecks erwartet
werden.
The color c oordinate s of th e m ix ed light can be expec t ed w it hin the area of the c olor t riangle.
560
560
.4
.2
0
.1
.3
8
7
blue
520
520
.6
.5
.8
.7
.9
true green
530530
7788550550
540540
600
600
620
620
amber 610610
630630
580580
570570
590590
OHA02132
510
505
500
495
490
485
480
460
2005-04-05 14
LATB T66B
Maßzeichnung8) Seite 20
Package Outlines8) page 20
Gewicht / Approx. weight: 35 mg
Gurtung / Polarität und Lage8) Seite 20 Verpackungseinheit 2000/Rolle, ø180 mm
oder 8000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation8) page 20 Packing unit 20 00/reel, ø180 mm
or 8000/reel, ø330 mm
14
23
Package marking
GPLY6900
2.6 (0.102)
2.1 (0.083)
2.3 (0.091)
3.0 (0.118)
0.8 (0.031)
0.6 (0.024)
3.0 (0.118)
3.4 (0.134)
(2.4 (0.094))
3.3 (0.130)
3.7 (0.146)
0.5 (0.020)
1.1 (0.043)
0.1 (0.004) typ
4˚±1
0.18 (0.007) 0.4 (0.016)
0.6 (0.024)
1.7 (0.067)
2.1 (0.083)
0.9 (0.035)
0.7 (0.028)
C
A
C
C
Circuit Diagram
1 Cathode Amber (A)
2 Anode A, T, B
3 Cathode Blue (B)
4 Cathode True Green (T)
OHAY0095
4 (0.157)
2.9 (0.114)
1.5 (0.059) 4 (0.157)
3.6 (0.142)
3.5 (0.138)
2 (0.079)
1.75 (0.069)
8 (0.315)
CA
CC
LATB T66B
2005-04-05 15
Empfohlenes Lötpaddesign8) Seite 20 IR Reflow Löten
Recommended Solder Pad8) page 20 IR Reflow Soldering
Empfohlenes Lötpaddesign8) Seite 20 Wellenlöten (TTW)
Recommended Solder Pad8) page 20 TTW Soldering
OHLPY439
Padgeometrie für
verbesserte Wärmeableitung
improved heat dissipation
Paddesign for
Lötstoplack
Solder resist
1.1 (0.043)
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
3.3 (0.130)
0.5 (0.020)
7.5 (0.295)
0.4 (0.016)
Cathode marking
Kathoden Markierung / Cu Fläche / 12 mm per pad
2
Cu-area
_
<
3.3 (0.130)
OHAY0583
6.1 (0.240)
2.8 (0.110)
2 (0.079)
3 (0.118)
6 (0.236)
3.5 (0.138)
1.5 (0.059
)
2 (0.079)
3.5 (0.138)1 (0.039)
8 (0.315)
2.8 (0.110) 0.5 (0.020)
7.5 (0.295)
Solder resist
Lötstoplack
PCB-direction
Bewegungsrichtung
der Platine
2 (0.079)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for
2
Cu Fläche / > 12 mm per pad
Cu-area
2005-04-05 16
LATB T66B
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil (nach IPC 9501)
IR Reflow Soldering Profile (acc. to IPC 9501)
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
OHLY0597
0
050 100 150 200 25
0
50
100
150
200
250
300
T
t
C
s
240-245 C
10-40 s
183 C
120 to 180 s
defined for Preconditioning: up to 6 K/s
ramp-down rate up to 6 K/s
ramp-up rate up to 6 K/s
defined for Preconditioning: 2-3 K/s
OHLY0598
0
050 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
LATB T66B
2005-04-05 17
Barcode-Produkt-Etikett (BPL)
Barcode-Product-Label (BPL)
Gurtverpackung
Tape and Reel
Tape dimensions in m m (inc h)
W P0P1P2D0E F
4 ± 0.1
(0.157 ± 0. 004) 4 ± 0.1
(0.157 ± 0.004) 2 ± 0.05
(0.079 ± 0.00 2) 1.5 + 0.1
(0.059 + 0. 004) 1.75 ± 0.1
(0.069 ± 0. 004) 3.5 ± 0.05
(0.138 ± 0.002)
Reel dimensions in m m (inc h)
A W Nmin W1W2 max
180 (7) 8 (0.315) 60 (2 .3 62) 8.4 + 2 (0.331 + 0.079) 14.4 (0.567)
330 (13) 8 (0.315) 60 (2 .3 62) 8.4 + 2 (0.331 + 0.079) 14.4 (0.567)
S
am
ple
OHA0204
3
X - X - X(G) GROUP:
Lot Number(1T) LOT NO: (9D) D/C:Date Code
(X) PROD NO: Product Code
(6P) BATCH NO: Batch Number
Lx xxxx
Product Name
Bin1: Bin Information Color 1
Bin2:
Bin3:
ML
2Temp ST
245 C R
260 C T2
Additional TEXT
R077 DEMY
PACKVAR: Packing Type
Product Quantity per Reel(Q)QTY:
Semiconductors
OSRAM Opto
Wavelength Rank
Forward Voltage Rank
Brightness Rank
Bar Code
Bar Code
Bar Code
D
0
2
PP
0
1
P
W
FE
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Gurtvorlauf:
Leader:
Trailer:
Gurtende:
13.0
Direction of unreeling
±0.25
160 mm
160 mm
400 mm
400 mm
8
+ 0.3
– 0.1
2005-04-05 18
LATB T66B
Trockenverpackung und Materialien
Dry Packing Process and Materials
Anm.: Feuchte em pfindliche Produkte sin d ve rpackt in einem Tr oc ke nbeutel zusam men mit ein em T roc k enm it t el und
einer Feuchteindikatorkarte
Bezüglich Trockenverpackung finden Sie weitere Hinweise im Internet und in unserem Short Form Catalog im
Kapitel “Gurtung und Verpackung” unter dem Punkt “Trockenverpackung”. Hier sind Normenbezüge, unter
anderem ein Auszug der JEDEC-No rm , ent halt en.
Note: Moisture-senisitv e product is packed in a dry bag con ta ining desiccant and a humidity ca rd.
Regarding dry pack you will find further information in the internet and in the Short Form Catalog in chapter
“Tape an d Re el” under the topic “Dry Pack”. He re y ou w ill als o f ind t he normativ e ref erences like JE DE C .
Kartonverpackung und Materialien
Transportation Packing and Materials
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode lab
el
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
0245
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
0245
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
OSRAM
Barcode label
Packing
Sealing label
Barcode lab
el
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
LATB T66B
2005-04-05 19
Attention please!
The inform at ion describes the type of co m ponent and sha ll not be c ons idered as assured charac te ristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substa nc es. For inform at ion on the types in qu es t ion please contac t our Sales Organiz at ion.
If printed or download ed, please find the lat es t vers ion in the Internet .
Packing
Please use the recyc ling operat ors known t o you. We can also help y ou – get in touc h with your nearest sale s office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Compo nents use d in life-support de vices or syste ms must be express ly authorize d for such purp ose! Critical
components9) page 20 may only be used in life-s upport devices or s ystems10) page 20 with the expres s written appro val of
OSRAM OS.
Revision History: 2005-04-05
Previous Version: 2004-08-26
Page Subjects (major changes since last revision) Date of change
1ESD-w it hs ta nd v olt age
2order ing inf ormaion
5grouping information
18 annotations 2002-07-23
3, 4 valu e (rev erse voltage f rom 5 V to 1 2 V) 2002-09-18
3, 4 values: forward current, surge current, reverse voltage, power consumption, thermal
resistan ce , forw ard voltage 2002-12-17
7new permissible forward current diagrams, TS (OHL01610 to OHL00927 and
OHL01607 to OHL00929) 2002-12-17
11 amber: new pulse handling diagram, 25°C, 1 chip on (OHL01505 to OHL001 93) 2002-12-17
9true green: new pulse handling diagrams, 25°C (OHL01583 to OHL11400 and
OHL01584 to OHL11401) 2002-12-17
9true green: new pulse handling diagrams, 85°C (OHL01586 to OHL00930 and
OHL01575 to OHL00931) 2002-12-17
10 blue: new pulse handling diagrams, 25°C (OHL01578 to OHL11405 and OHL01579 to
OHL11406) 2002-12-17
10 blue: new pulse handling diagrams, 85°C (OHL01576 to OHL00932 and OHL01577 to
OHL00934) 2002-12-17
8true green and blue: new dominant wav elength diagrams 2002-12-17
5new luminous intensity groups 2003-02-11
2new or deri ng code 2003-02-11
7diagram forward current OHL00737 replaced by OHL00590 2003-02-12
1ESD norm 2003-08-27
3ambient temperature 2003-08-27
all new t emplate 2004-03-09
all Discontinuation of non-RoHS compliant product versions 2005-04-05
LATB T66B
2005-04-05 20
Fußnoten:
1) Helligkeitswerte werden mit einer
Stromeinprägedauer von 25 ms und einer
Genauigk eit von ± 11% erm ittelt.
2) Die LED kann kurzzeitig in Sperrichtung betrieben
werden.
3) RthJA ergibt sich bei Montage auf PC-Board FR 4
(Padgröße 16 mm2 je Pad)
4) Wellenlängen werden mit einer Stromeinprägedauer
von 25 ms und einer Genauigkeit von ±1 nm er m ittelt.
5) Spannungswerte werden mit einer
Stromeinp rägedauer vo n 1 ms und eine r Genauigkeit
von ±0,1 V ermittelt.
6) Wegen d er besonderen Proze ssbedingungen bei der
Herstellung von LED können typische oder abgeleitete
technische Parameter nur aufgrund statistischer
Werte wiedergegeben werden. Diese stimmen nicht
notwendigerweise mit den Werten jedes einzelnen
Produktes überein, dessen Werte sich von typischen
und abgeleiteten Werten oder typischen Kennlinien
unterscheiden können. Falls erforderlich, z.B.
aufgrund technischer Verbesserungen, werden diese
typischen Werte ohne weitere Ankündigung geändert.
7) Im gestrichelten Bereich der Kennlinien muss mit
erhöhten Helligkeitsunterschieden zwischen
Leuchtdioden innerhalb einer Verpackungseinheit
gerechnet werden.
Dimmverhältnis im Gleichstrom-Betrieb max. 5:1 für
amber
8) Maße werden wie folgt angegeben: mm (inch)
9) Ein kritisches Bauteil ist ein Bauteil, das in
lebenserhaltenden Apparaten oder Systemen
eingese tzt wird und de ssen Defekt voraussich tlich zu
einer Fehlfunktion dieses lebenserhaltenden
Apparates oder Systems führen wird oder die
Sicherheit oder Effektivität dieses Apparates oder
Systems beeinträchtigt.
10) Lebens erhaltend e Apparate oder Sy s t em e s ind f ür
(a) die Implantierung in den menschlichen Körper
oder
(b) für die Lebenserhaltung bestimmt.
Falls sie versagen, kann davon ausgegangen werden,
dass die Gesundh eit und d as Le ben des Patienten in
Gefahr ist .
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
Remarks:
1) Brightness groups are tested at a current pulse
duration of 25 ms and a tolera nce of ± 11%.
2) Driving the LED in reverse direction is suitable for
short term application.
3) RthJA results from mounting on PC board FR 4
(pad size 16 mm2 per pad)
4) Wavelengt hs are te sted at a current pulse dura tion of
25 ms and a t oler ance of ±1 nm.
5) Forward voltages are tested at a current pulse
duration of 1 m s and a t olerance of ±0.1 V.
6) Due to the special conditions of the manufacturing
processes of LED, the typical data or calculated
correlations of technical parameters can only reflect
statistical figures. These do not necessarily
correspond to the actual parameters of each single
product, which could differ from the typical data and
calculated correlations or the typical characteristic
line. If requested, e.g. because of technical
improvements, these typ. data will be changed without
any furthe r not ic e.
7) In the range where the line of the graph is broken, you
must expect higher brightness differences between
single LED s w ith in one packing un it.
Dimming range for direct current mode max. 5:1 for
amber
8) Dimensions are specified as follows: mm (inch)
9) A critical component is a component used in a
life-support device or system whose failure can
reasonably be expected to cause the failure of that
life-suppor t device or s ystem, or to aff ect its s afety or
the effectiveness of that device or system.
10) Life support dev ic es or systems are intended
(a) to be implanted in the human body,
or
(b) to support and/o r maintain a nd s ustain hum an life.
If they fail, it is reasonable to assume that the health
and the life of the use r may be endangered.