N.C. No internal connection
See mechanical drawings for dimensions.
DBV PACKAGE
(TOP VIEW)
2
5
34Y
1
A
GND
N.C. VCC
DCK PACKAGE
(TOP VIEW)
34
2
Y
1
GND
A
N.C. 5VCC
DRL PACKAGE
(TOP VIEW)
2
A
1
N.C.
34
GND Y
5VCC
DRY PACKAGE
(TOP VIEW)
AN.C.
N.C. 6
5
4
2
3
GND Y
VCC
1N.C.
GND
DSF PACKAGE
(TOP VIEW)
A
VCC
Y
N.C.
6
5
4
2
3
1
DNU – Do not use
YZP PACKAGE
(TOP VIEW)
A
GND
DNU VCC
Y
C2C1
B1 B2
A1 A2
YZV PACKAGE
(TOP VIEW)
A
GND Y
VCC
A1 A2
B1 B2
SN74LVC1G06
www.ti.com
SCES295U JUNE 2000REVISED JUNE 2011
SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
Check for Samples: SN74LVC1G06
1FEATURES
2Available in the Texas Instruments Ioff Supports Live Insertion, Partial Power
NanoFreePackage Down Mode, and Back Drive Protection
Supports 5-V VCC Operation Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Input and Open-Drain Output Accept
Voltages up to 5.5 V ESD Protection Exceeds JESD 22
Max tpd of 4 ns at 3.3 V 2000-V Human-Body Model (A114-A)
Low Power Consumption, 10-μA Max ICC 200-V Machine Model (A115-A)
±24-mA Output Drive at 3.3 V 1000-V Charged-Device Model (C101)
Table 1. YZP PACKAGE TERMINAL
ASSIGNMENTS
1 2
ADNU VCC
BA No ball
CGND Y
Table 2. YZV PACKAGE TERMINAL
ASSIGNMENTS
1 2
AA VCC
BGND Y
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright ©20002011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
A Y
2 4
A Y
2 4
SN74LVC1G06
SCES295U JUNE 2000REVISED JUNE 2011
www.ti.com
DESCRIPTION/ORDERING INFORMATION
This single inverter buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the die as the
package.
The output of the SN74LVC1G06 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff.The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TAPACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3)
NanoFree WCSP (DSBGA) Reel of 3000 SN74LVC1G06YZPR _ _ _CT_
0.23-mm Large Bump YZP (Pb-free)
NanoFree WCSP (DSBGA) _ _ _ _
Reel of 3000 SN74LVC1G06YZVR
0.23-mm Large Bump YZV (Pb-free) CT
Reel of 3000 SN74LVC1G06DBVR
SOT (SOT-23) DBV C06_
Reel of 250 SN74LVC1G06DBVT
40°C to 85°CReel of 3000 SN74LVC1G06DCKR
SOT (SC-70) DCK CT_
Reel of 250 SN74LVC1G06DCKT
SOT (SOT-553) DRL Reel of 4000 SN74LVC1G06DRLR CT_
µQFN DSF Reel of 5000 SN74LVC1G06DSFR CT
QFN DRY Reel of 5000 SN74LVC1G06DRYR CT
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2
has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Table 3. FUNCTION TABLE
INPUT OUTPUT
A Y
H L
L Z
LOGIC DIAGRAM (POSITIVE LOGIC)
DBV, DCK, DSF, DRY, DRL, and YZP PACKAGE
YZV PACKAGE
2Copyright ©20002011, Texas Instruments Incorporated
SN74LVC1G06
www.ti.com
SCES295U JUNE 2000REVISED JUNE 2011
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage range 0.5 6.5 V
VIInput voltage range(2) 0.5 6.5 V
VOVoltage range applied to any output in the high-impedance or power-off state(2) 0.5 6.5 V
VOVoltage range applied to any output in the high or low state(2) (3) 0.5 6.5 V
IIK Input clamp current VI<050 mA
IOK Output clamp current VO<050 mA
IOContinuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
DBV package 206
DCK package 252
DRL package 142
θJA Package thermal impedance(4) YZP package 132 °C/W
YZV package 123
DSF package 300
DRY package 234
Tstg Storage temperature range 65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions"is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
MIN MAX UNIT
Operating 1.65 5.5
VCC Supply voltage V
Data retention only 1.5
VCC = 1.65 V to 1.95 V 0.65 ×VCC
VCC = 2.3 V to 2.7 V 1.7
VIH High-level input voltage V
VCC = 3 V to 3.6 V 2
VCC = 4.5 V to 5.5 V 0.7 ×VCC
VCC = 1.65 V to 1.95 V 0.35 ×VCC
VCC = 2.3 V to 2.7 V 0.7
VIL Low-level input voltage V
VCC = 3 V to 3.6 V 0.8
VCC = 4.5 V to 5.5 V 0.3 ×VCC
VIInput voltage 0 5.5 V
VOOutput voltage 0 5.5 V
VCC = 1.65 V 4
VCC = 2.3 V 8
IOL Low-level output current 16 mA
VCC = 3 V 24
VCC = 4.5 V 32
VCC = 1.8 V ±0.15 V, 2.5 V ±0.2 V 20
Δt/Δv Input transition rise or fall rate VCC = 3.3 V ±0.3 V 10 ns/V
VCC = 5 V ±0.5 V 5
TAOperating free-air temperature 40 85 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Copyright ©20002011, Texas Instruments Incorporated 3
SN74LVC1G06
SCES295U JUNE 2000REVISED JUNE 2011
www.ti.com
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
IOL = 100 μA 1.65 V to 5.5 V 0.1
IOL = 4 mA 1.65 V 0.45
IOL = 8 mA 2.3 V 0.3
VOL V
IOL = 16 mA 0.4
3 V
IOL = 24 mA 0.55
IOL = 32 mA 4.5 V 0.55
IIA input VI= 5.5 V or GND 0 to 5.5 V ±1μA
Ioff VIor VO= 5.5 V 0 ±10 μA
ICC VI= 5.5 V or GND, IO= 0 1.65 V to 5.5 V 10 μA
ΔICC One input at VCC 0.6 V, Other inputs at VCC or GND 3 V to 5.5 V 500 μA
CiVI= VCC or GND 3.3 V 4 pF
CoVO= VCC or GND 3.3 V 5 pF
(1) All typical values are at VCC = 3.3 V, TA= 25°C.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
FROM TO ±0.15 V ±0.2 V ±0.3 V ±0.5 V
PARAMETER UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX
tpd A Y 2.2 6.5 1.1 4 1.2 4 1 3 ns
Operating Characteristics
TA= 25°CVCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
PARAMETER TEST CONDITIONS UNIT
TYP TYP TYP TYP
Cpd Power dissipation capacitance f = 10 MHz 3 3 4 6 pF
4Copyright ©20002011, Texas Instruments Incorporated
VM
th
tsu
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
S1 VLOAD
Open
GND
RL
RL
Data Input
Timing Input VI
0 V
VI
0 V
0 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VI
0 V
Input
Output
Waveform 1
S1 at VLOAD
(see Note B)
Output
Waveform 2
S1 at VLOAD
(see Note B)
VOL
tPZL
tPZH
tPLZ
tPHZ
VLOAD/2
0 V
VOL + V
VLOAD/2 − V
0 V
VI
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 .
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VMVM
VMVM
VMVM
VM
VMVM
VM
VM
VM
VI
VM
VM
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
1 k
500
500
500
VCC RL
2 × VCC
2 × VCC
6 V
2 × VCC
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V
VCC
VCC
3 V
VCC
VI
VCC/2
VCC/2
1.5 V
VCC/2
VM
tr/tf
2 ns
2 ns
2.5 ns
2.5 ns
INPUT
tPZL (see Notes E and F)
tPLZ (see Notes E and G)
tPHZ/tPZH
VLOAD
VLOAD
VLOAD
TEST S1
VLOAD/2
SN74LVC1G06
www.ti.com
SCES295U JUNE 2000REVISED JUNE 2011
PARAMETER MEASUREMENT INFORMATION
(OPEN DRAIN)
Figure 1. Load Circuit and Voltage Waveforms
Copyright ©20002011, Texas Instruments Incorporated 5
PACKAGE OPTION ADDENDUM
www.ti.com 1-Jun-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC1G06DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKT ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DRLR ACTIVE SOT DRL 5 4000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DRLRG4 ACTIVE SOT DRL 5 4000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DRYR ACTIVE SON DRY 6 5000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DSFR ACTIVE SON DSF 6 5000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 1-Jun-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC1G06YZVR ACTIVE DSBGA YZV 4 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC1G06 :
Enhanced Product: SN74LVC1G06-EP
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC1G06DBVR SOT-23 DBV 5 3000 178.0 9.2 3.3 3.2 1.55 4.0 8.0 Q3
SN74LVC1G06DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G06DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G06DBVT SOT-23 DBV 5 250 178.0 9.2 3.3 3.2 1.55 4.0 8.0 Q3
SN74LVC1G06DCKR SC70 DCK 5 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74LVC1G06DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
SN74LVC1G06DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC1G06DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC1G06DCKT SC70 DCK 5 250 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74LVC1G06DCKT SC70 DCK 5 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
SN74LVC1G06DRLR SOT DRL 5 4000 180.0 9.5 1.78 1.78 0.69 4.0 8.0 Q3
SN74LVC1G06DRLR SOT DRL 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
SN74LVC1G06DRYR SON DRY 6 5000 180.0 9.5 1.15 1.6 0.75 4.0 8.0 Q1
SN74LVC1G06DSFR SON DSF 6 5000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2
SN74LVC1G06YZPR DSBGA YZP 5 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1
SN74LVC1G06YZVR DSBGA YZV 4 3000 180.0 8.4 1.02 1.02 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jun-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC1G06DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
SN74LVC1G06DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
SN74LVC1G06DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
SN74LVC1G06DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
SN74LVC1G06DCKR SC70 DCK 5 3000 180.0 180.0 18.0
SN74LVC1G06DCKR SC70 DCK 5 3000 205.0 200.0 33.0
SN74LVC1G06DCKR SC70 DCK 5 3000 180.0 180.0 18.0
SN74LVC1G06DCKT SC70 DCK 5 250 180.0 180.0 18.0
SN74LVC1G06DCKT SC70 DCK 5 250 180.0 180.0 18.0
SN74LVC1G06DCKT SC70 DCK 5 250 205.0 200.0 33.0
SN74LVC1G06DRLR SOT DRL 5 4000 180.0 180.0 30.0
SN74LVC1G06DRLR SOT DRL 5 4000 202.0 201.0 28.0
SN74LVC1G06DRYR SON DRY 6 5000 180.0 180.0 30.0
SN74LVC1G06DSFR SON DSF 6 5000 180.0 180.0 30.0
SN74LVC1G06YZPR DSBGA YZP 5 3000 220.0 220.0 34.0
SN74LVC1G06YZVR DSBGA YZV 4 3000 220.0 220.0 34.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jun-2012
Pack Materials-Page 2