Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LMS33460 SNVS158E - MARCH 2001 - REVISED DECEMBER 2016 LMS33460 3-V Undervoltage Detector 1 Features 3 Description * * * * * * * The LMS33460 device is an undervoltage detector with a 3V threshold and extremely low power consumption. The LMS33460 is specifically designed to accurately monitor power supplies. It is especially suited to battery-powered systems where low quiescent current and small size are required. This IC generates an active output whenever the input voltage drops below 3 V. 1 Ultra-Low Power 3-V Detection Input Voltage From 0.8 V to 7 V Open-Drain Output Ultra-Small 5-Pin SC70 Package Extended Temperature Range (-40C to 85C) Ultra-Low Quiescent Current (1 A Typical) This part uses a precision on-chip voltage reference and a comparator to measure the input voltage. Builtin hysteresis helps to prevent erratic operation in the presence of noise. The UVD is available in the ultraminiature 5-pin SC70 package. 2 Applications * * * * * * * Low Battery Voltage Detectors Power Fail Indicators Processor Reset Generators Battery Backup Controls Battery-Operated Equipment Hand-Held Instruments Undervoltage Detectors Device Information(1) PART NUMBER LMS33460 PACKAGE SC70 (5) BODY SIZE (NOM) 2.00 mm x 1.25 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application SC70 Package VDD R 470 k: VIN VOUT LMS33460 GND VDD RESET CPU GND Copyright (c) 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMS33460 SNVS158E - MARCH 2001 - REVISED DECEMBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 3 3 3 4 4 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 6 7.1 Overview ................................................................... 6 7.2 Functional Block Diagram ......................................... 7 7.3 Feature Description................................................... 7 7.4 Device Functional Modes.......................................... 7 8 Application and Implementation .......................... 8 8.1 Application Information.............................................. 8 8.2 Typical Application .................................................... 8 9 Power Supply Recommendations........................ 9 10 Layout..................................................................... 9 10.1 Layout Guidelines ................................................... 9 10.2 Layout Example ...................................................... 9 11 Device and Documentation Support ................. 10 11.1 11.2 11.3 11.4 11.5 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 10 10 10 10 10 12 Mechanical, Packaging, and Orderable Information ........................................................... 10 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (April 2013) to Revision E Page * Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1 * Deleted Ordering Information table; see POA at the end of the data sheet........................................................................... 1 * Added Thermal Information table ........................................................................................................................................... 4 * Changed RJA value From: 478 To: 275.5 .............................................................................................................................. 4 Changes from Revision C (April 2013) to Revision D * 2 Page Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1 Submit Documentation Feedback Copyright (c) 2001-2016, Texas Instruments Incorporated Product Folder Links: LMS33460 LMS33460 www.ti.com SNVS158E - MARCH 2001 - REVISED DECEMBER 2016 5 Pin Configuration and Functions DCK Package 5-Pin SC70 Top View NC 1 GND 2 GND 3 5 VIN 4 VOUT Not to scale Pin Functions PIN NAME NO. I/O DESCRIPTION GND 2 -- Internally connected to ground. Can be left floating or connected to GND (pin 3). GND 3 -- Ground NC 1 -- No connection VIN 5 I Input supply VOUT 4 O Voltage output 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MAX UNIT Input voltage to GND MIN 8 V Output voltage to GND 8 V Output continuous output current 30 mA Vapor phase IR convection reflow 240 C Junction temperature, TJ 150 C 150 C Storage temperature, Tstg (1) -65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 2500 Machine model 200 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions TJ Operating junction temperature MIN MAX -40 85 Submit Documentation Feedback Copyright (c) 2001-2016, Texas Instruments Incorporated Product Folder Links: LMS33460 UNIT C 3 LMS33460 SNVS158E - MARCH 2001 - REVISED DECEMBER 2016 www.ti.com 6.4 Thermal Information LMS33460 THERMAL METRIC (1) DCK (SC70) UNIT 5 PINS RJA Junction-to-ambient thermal resistance 275.5 C/W RJC(top) Junction-to-case (top) thermal resistance 102.5 C/W RJB Junction-to-board thermal resistance 54 C/W JT Junction-to-top characterization parameter 2.7 C/W JB Junction-to-board characterization parameter 53.3 C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics TJ = 25C (unless otherwise noted) MIN TYP MAX UNIT VDET Detector threshold PARAMETER VIN falling TEST CONDITIONS 2.85 3 3.15 V VHYS Detector voltage hysteresis VIN rising 0.095 0.155 0.215 V IIN Input supply current VIN = 2.87 V VIN(MAX) 1 2.2 A VIN = 4.7 V 1.2 3.6 A VIN = 7 V (1) 25 200 A 7 V 0.7 1.1 1 1.3 Maximum operating voltage VIN(MIN) Minimum operating voltage IOUT(LOW) Output current low tPDHL Output delay time (output transition high to low ) CL = 10 pF, RL = 470 k VDET/T Detect voltage temperature coefficient TJ = -40C to 85C (1) 4 TJ = -40C to 85C VOUT = 0.05 V, VIN = 1.1 V VOUT = 0.5 V, VIN = 1.5 V 0.01 0.6 2 11 130 120 V mA 200 s PPM/C Quiescent current increases substantially above 5.5 V, but is very low in the normal range below 5.5 V. Submit Documentation Feedback Copyright (c) 2001-2016, Texas Instruments Incorporated Product Folder Links: LMS33460 LMS33460 www.ti.com SNVS158E - MARCH 2001 - REVISED DECEMBER 2016 6.6 Typical Characteristics TA = 25C, RL = 470 k, and CL = 10 pF (unless otherwise noted) 100 3.30 (VIN RISING) SUPPLY CURRENT (A) DETECTOR THRESHOLD (V) 3.25 3.20 3.15 VHYS 3.10 10 1 VDET (VIN FALLING) 3.05 0.1 3.00 -50 -25 0 25 50 75 100 0 2 4 6 8 10 INPUT VOLTAGE VIN (V) TEMPERATURE (C) Figure 2. Supply Current vs Input Voltage Figure 1. Detector Threshold vs Temperature 300 300 VIN 250 tPDHL OUTPUT DELAY TIME (s) OUTPUT DELAY TIME (s) 250 VOUT 200 150 100 tPDHL 50 tPDLH 200 VOUT 150 tPDLH 100 50 0 -40 VIN 0 -15 10 35 60 85 -40 110 -15 10 35 60 85 110 TEMPERATURE (C) TEMPERATURE (C) Figure 3. Propagation Delay Time (tPDHL) vs Temperature Figure 4. Propagation Delay Time (tPDLH) vs Temperature Figure 5. VOUT(LOW) vs VIN Submit Documentation Feedback Copyright (c) 2001-2016, Texas Instruments Incorporated Product Folder Links: LMS33460 5 LMS33460 SNVS158E - MARCH 2001 - REVISED DECEMBER 2016 www.ti.com 7 Detailed Description 7.1 Overview The LMS33460 is a micropower undervoltage-sensing circuit with an open-drain output configuration, which requires a pull resistor. The LMS33460 features a voltage reference, a comparator with precise thresholds and built-in hysteresis to prevent erratic reset operation. INPUT VOLTAGE 5.0V VHYS VIN Rising Threshold VIN Falling Threshold VDET VIN(MIN) 0V TIME OUTPUT VOLTAGE 5.0V tPDHL 2.5V tPDLH 0.5V 0V TIME Figure 6. Propagation Delay Timing Diagram +5.0 V RL 470 k: LMS33640 VIN VOUT GND CL 10 pF Copyright (c) 2016, Texas Instruments Incorporated Figure 7. Propagation Delay Test Circuit 6 Submit Documentation Feedback Copyright (c) 2001-2016, Texas Instruments Incorporated Product Folder Links: LMS33460 LMS33460 www.ti.com SNVS158E - MARCH 2001 - REVISED DECEMBER 2016 7.2 Functional Block Diagram VIN LMS33460 VOUT VREF + - GND Copyright (c) 2016, Texas Instruments Incorporated 7.3 Feature Description The input supply (VIN) is the voltage that is being monitored and as it decreases past 3 V, the active-low output (VOUT) transitions to a logic low state. When VIN rises above 3 V plus the built-in hysterisis, VOUT returns to its original state of logic high. The LMS33460 has built-in hysteresis when the input supply is coming back up to help prevent erratic output operation when the input voltage crosses the threshold. The LMS33460 is useful in a variety of applications that require low voltage detection and is suited for batterypowered systems where low quiescent current and small package size is required. It can also be used as a precision reset circuit for microcontroller applications. 7.4 Device Functional Modes 7.4.1 Start Up As the input voltage (VIN) ramps up, the output (VOUT) remains logic low until VIN reaches 3.15 V due to the builtin hysteresis (nominally 150 mV). After VIN crosses that threshold, VOUT remains logic high until VIN drops below the 3-V threshold. The hysteresis only applies to the VIN rising threshold. Submit Documentation Feedback Copyright (c) 2001-2016, Texas Instruments Incorporated Product Folder Links: LMS33460 7 LMS33460 SNVS158E - MARCH 2001 - REVISED DECEMBER 2016 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information This device is ideal to use in battery-powered or microprocessor based systems and can be used as a low voltage indicator or reset circuit. 8.2 Typical Application VDD R 470 k: VIN VDD RESET VOUT CPU LMS33460 GND GND Copyright (c) 2016, Texas Instruments Incorporated Figure 8. Typical Application Schematic 8.2.1 Design Requirements For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters PARAMETER EXAMPLE VALUE Input supply voltage maximum 7V VOUT maximum 7V VOUT minimum 0V Pullup resistor 470 k 8.2.2 Detailed Design Procedure The LMS33460 is a very easy to use low voltage detector. All that required is the input supply voltage and a pullup resistor at the output. TI recommends 470 k for the pullup resistor. 8 Submit Documentation Feedback Copyright (c) 2001-2016, Texas Instruments Incorporated Product Folder Links: LMS33460 LMS33460 www.ti.com SNVS158E - MARCH 2001 - REVISED DECEMBER 2016 8.2.3 Application Curve RL = 475 k * See Figure 4 for tPDLH values ** See Figure 3 for tPDHL values Figure 9. LMS33460 Turnon 9 Power Supply Recommendations The input of the LMS33460 is designed to handle up to the recommended supply voltage of 7 V and remain in the recommended input voltage range during operation. No input capacitor is required. 10 Layout 10.1 Layout Guidelines Place the output pullup resistor, and delay capacitor if used, as close as possible to the IC. Keep traces short between the IC and the components used at the output to ensure the timing delay is as accurate as possible. 10.2 Layout Example VIN R1 VOUT GND Figure 10. Layout Example Diagram Submit Documentation Feedback Copyright (c) 2001-2016, Texas Instruments Incorporated Product Folder Links: LMS33460 9 LMS33460 SNVS158E - MARCH 2001 - REVISED DECEMBER 2016 www.ti.com 11 Device and Documentation Support 11.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 10 Submit Documentation Feedback Copyright (c) 2001-2016, Texas Instruments Incorporated Product Folder Links: LMS33460 PACKAGE OPTION ADDENDUM www.ti.com 18-Feb-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LMS33460MG NRND SC70 DCK 5 1000 TBD Call TI Call TI -40 to 85 C33 LMS33460MG/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 C33 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 18-Feb-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMS33460MG SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LMS33460MG/NOPB SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Feb-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMS33460MG SC70 DCK 5 1000 210.0 185.0 35.0 LMS33460MG/NOPB SC70 DCK 5 1000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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