ASMT-QWB2-Nxxxx Super 0.5W White Power PLCC-4 Surface Mount LED Indicator Data Sheet Description Features The Super 0.5W White Power PLCC-4 SMT LED is first white mid-Power PLCC-4 SMT LEDs using InGaN chip technology. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED. x Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9mm) x High reliability package with enhanced silicone resin encapsulation x High brightness with optimum flux performance using InGaN chip technologies x Available in Cool White x High optical efficiency 30lm/W x Available in 8mm carrier tape and 7 inch reel x Low Thermal Resistance 60 qC/W x Super wide viewing angle at 120q The Super 0.5W White Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin, to provide close uniformity. x JEDEC MSL 2a Applications 1. Interior automotive a. Instrument panel backlighting b. Central console backlighting c. Navigation and audio system backlighting d. Dome/Map lighting e. Push button backlighting f. Puddle lamp g. Glove compartment illumination 2. Exterior automotive a. Number plate illumination b. Rear reverse lamp indicator 3. Electronic signs and signals a. Decorative lighting 4. Office automation, home appliances, industrial equipment a. Panel/button backlighting b. Display backlighting CAUTION: ASMT-QWB2-Nxxxx LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. 1 Package Drawing 1.9 0.2 2.2 0.2 A C C 1.15 0.2 0.97 0.56 (TYP.) I 2.4 3.2 0.2 3.6 0.2 0.41 (TYP.) A 0.6 0.3 0.79 0.3 2.8 0.2 0.7 CATHODE MARKING Note: 1. All Dimensions in millimeters. 2. Lead Polarity as shown in Figure 11. 3. Terminal Finish: Ag plating 4. Encapsulation material: Silicone resin Figure 1. Package Drawing Table 1. Device Selection Guide (TJ = 25 C) Luminous Flux, )V [1] (lm) Color Part Number Min. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA) Dice Technology White ASMT-QWB2-NEF0E 11.5 17.0 19.5 150 InGaN Notes: 1. )V is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance = 12% Part Numbering System A S M T - Q X1 B 2 - N X2 X3 X4 X5 Packaging Option Colour Bin Selection Max. Flux Bin Selection Min. Flux Bin Selection Color W - Cool White 2 Table 2. Absolute Maximum Ratings (TA = 25 C) Parameters ASMT-QWB2-Nxxxx DC Forward Current [1] 150 mA Peak Forward Current [2] 300 mA Power Dissipation 513 mW Reverse Voltage Not Recommended for Reverse Bias Junction Temperature 125 C Operating Temperature -40 C to +110 C Storage Temperature -40 C to +110 C Notes: 1. Derate Linearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz Table 3. Optical Characteristics (TJ = 25 C) Color Part Number Dice Technology White ASMT-QWB2-Nxxxx InGaN Typical Chromaticity Coordinates [1] Viewing Angle 2O1/2[1] (Degrees) Luminous Efficiency Ke (lm/W) Total Flux / Luminous Intensity FV (lm) / IV (cd) x y Typ. Typ. Typ. 0.31 0.31 120 30 2.85 Notes: 1. T1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Table 4. Electrical Characteristics (TJ = 25 C) Forward Voltage VF (Volts) @ IF = 150 mA Part Number Typ. Max. Thermal Resistance RTJ-P (C/W) ASMT-QWB2-Nxxxx 3.6 4.1 60 1.0 350 0.9 300 FORWARD CURRENT - mA RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 250 200 150 100 50 0.1 0.0 380 400 420 440 460 480 500 520 540 560 580 600 620 640 660 680 700 720 740 760 780 0 0 1 2 3 4 FORWARD VOLTAGE - V WAVELENGTH - nm Figure 2. Relative Intensity Vs. Wavelength 3 Figure 3. Forward Current Vs. Forward Voltage. 5 1.4 1.2 1.2 NORMALIZED LUMINOUS INTENSITY RELATIVE LUMINOUS FLUX (NORMALIZATION AT 150mA) 1.0 0.8 0.6 0.4 0.2 1 0.8 0.6 0.4 0.2 0 0 0 25 50 75 100 DC FORWARD CURRENT - mA 125 150 Figure 4. Relative Flux vs. Forward Current -50 140 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 100 125 160 RJA = 90C/W 120 RJA = 110C/W 100 80 60 40 20 140 120 RJP = 60C/W 100 80 60 40 20 0 0 0 20 40 60 80 AMBIENT TEMPERATURE - C 100 120 Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 125C, RTJ-A = 90C/W and 110 C/W. 0 20 40 60 80 SOLDER POINT TEMPERATURE - C 100 120 Figure 6b. Maximum forward current vs. solder point temperature. Derated Based on TJMAX = 125C, RTJP=60C/W 0.25 1 0.2 0.9 0.8 0.15 0.1 0.05 0 -50 -25 0 25 50 -0.05 -0.1 -0.15 JUNCTION TEMPERATURE - C Figure 7. Forward Voltage Shift Vs. Temperature. 75 100 NORMALIZED INTENSITY FORWARD VOLTAGE SHIFT - V 0 25 50 75 JUNCTION TEMPERATURE - C Figure 5. Relative Intensity Vs. Temperature 160 4 -25 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 8. Radiation Pattern 90 TEMPERATURE 10 to 30 SEC. D 217 C 200 C 255 - 260C 3C/SEC. MAX. 6C/SEC. MAX. 150 C 3C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J - STD-020C) Figure 10. Recommended Pb-free Reflow Soldering Profile Note: Diameter "D" should be smaller than 2.2mm Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components Figure 9. Recommended Pick and Place Nozzle Size 2.4 0.6 0.9 X 6 1.3 x 6 A A A 0.4 A 1.1 C C C C C CATHODE MARKING 0.3 SOLDER MASK A ANODE C CATHODE Figure 11. Recommended Soldering Pad Pattern 5 4.6 C CATHODE MARKING MINIMUM 55 mm2 OF CATHODE PAD FOR IMPROVED HEAT DISSIPATION TRAILER COMPONENT LEADER 200 mm MIN. FOR O180 REEL. 200 mm MIN. FOR O330 REEL. 480 mm MIN. FOR O180 REEL. 960 mm MIN. FOR O330 REEL. C A USER FEED DIRECTION Figure 12. Tape Leader and Trailer Dimensions O1.5 +0.1 -0 4 0.1 4 0.1 2 0.05 1.75 0.1 2.29 0.1 C C A A 3.5 0.05 8 +0.3 -0.1 3.8 0.1 +0.1 3.05 0.1 O1 -0 0.229 0.01 8 ALL DIMENSIONS IN mm. Figure 13. Tape Dimensions USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 14. Reeling Orientation 6 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). Device Color (X1) W Cool White Flux Bin Select (X2X3) Individual reel will contain parts from one bin only X2 Min Flux Bin X3 Max Flux Bin Flux Bin Limits Bin ID Min. (lm) Max. (lm) A 4.30 5.50 B 5.50 7.00 C 7.00 9.00 D 9.00 11.50 E 11.50 15.00 F 15.00 19.50 G 19.50 25.50 H 25.50 33.00 J 33.00 43.00 K 43.00 56.00 L 56.00 73.00 Tolerance of each bin limit = 12% B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - "10%" is Not blue and "5%" HIC indicator turns pink. - The LEDs are exposed to condition of >30C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 605C for 20 hours. 7 Color Bin Select (X4) Individual reel will contain parts from one full bin only. 0 Full Distribution A 1 and 2 only B 2 and 3 only C 3 and 4 only D 4 and 5 only E 5 and 6 only G 1, 2 and 3 only H 2, 3 and 4 only J 3, 4 and 5 only K 4, 5 and 6 only M 1, 2, 3 and 4 only N 2, 3, 4 and 5 only P 3, 4, 5 and 6 only R 1, 2, 3, 4 and 5 only S 2, 3, 4, 5 and 6 only Z Special Color Bin Color Bin Limits VF Bin Limits Bin ID 1 2 3 4 5 6 7 8 Limits (Chromaticity Coordinates) Bin ID Min. Max. x 0.296 0.291 0.310 0.313 S5 3.20 3.50 y 0.259 0.268 0.297 0.284 S6 3.50 3.80 x 0.291 0.285 0.307 0.310 S7 3.80 4.10 y 0.268 0.279 0.312 0.297 x 0.313 0.310 0.330 0.330 y 0.284 0.297 0.330 0.310 Tolerance of each bin limit = 0.1V Packaging Option (X5) x 0.310 0.307 0.330 0.330 Option Test Current Package Type Reel Size y 0.297 0.312 0.347 0.330 E 150mA Top Mount 7 Inch x 0.330 0.330 0.338 0.352 y 0.310 0.330 0.342 0.344 x 0.330 0.330 0.347 0.345 y 0.330 0.347 0.371 0.352 x 0.352 0.338 0.364 0.360 y 0.344 0.342 0.380 0.357 x 0.345 0.347 0.367 0.364 y 0.352 0.371 0.401 0.380 Y - COORDINATE Tolerance of each bin limit = 0.02 X - COORDINATE For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2009 Avago Technologies. All rights reserved. AV02-0209EN - September 29, 2009