Small Surface-Mount
Rectifiers
S-FLAT and M-FLAT Series
TM TM
Toda y’s mobile and office automation equipment is becoming e ver smaller
and slimmer. In response to this market trend, Toshiba ha v e developed an
ultra-small surface-mount S-Flat package rectifier which allo ws high-density
mounting.Toshiba off er a slim, miniature S-FLAT pac kage with a height of
0.98 mm (typ .) and a mounting area 50% smaller than that of existing
Toshiba products.The M-FLAT pac kage has been achieved the height of
0.98 mm (appro ximately the half of existing I-FLAT package) and high
current capacity (up to 5 A).
Applications
Features
General-Purpose
Rectification
Reverse connection protection
Free-wheeling
Power Zener Diodes
Approx. 7.5 V: Voltage regulation
12 V~18 V: Gate protection for
power MOSFETs
24 V~47 V: Surge absorption
SBD/HED
portable products
Reverse-current protection
Secondary rectification
DC-DC converter
S-FLATTM Features
Toshiba offer a slim, miniature S-FLAT package with a height of 0.98 mm (typ.) and a mounting area 50% smaller than an
existing I-FLAT packag.
M-FLATTM Features
The M-FLAT package has been developed the I-FLAT as a base. By reducing the height to 0.98 mm (approximately the
half of existing I-FLAT package) and optimizing the internal package frame, Toshiba have produced a device which offers
high current capacity (up to 5 A) and lower power dissipation.
Common Features
High surge current capability due to solder clamp structure.
Flat pins allow stable mounting on the PCB
New
Conventional
0.981.6
2.6
3.5
0.982.4
3.8
4.7
1.92.4
4.3
4.7
S-FLATTM M-FLATTM I-FLAT
Package comparison (Toshiba products only) (Unit: mm)
S-FLAT
TM
M-FLAT
TM
S-FL
Type
General - Purpose
SBDs
Power zener diodes
HEDs
0
0.1
1
10
0.
iF(A)
0
0.0001
0.001
0.01
0.1
1
10
100
Reverse Curlent IR(mA)
SBD IR -
(actual d
Lo
iF - vF chara
2
ner Diodes
Voltage regulation
ate protection for
ower MOSFETs
urge absorption
% smaller than an
proximately the
evice which offers
(Unit: mm)
M-FLAT
TM
Line-up
S-FLAT
CRG01
CRG02
CRS01
CRS02
CRS03
CRS04
CRS05
CRS06
CRS07
CRS08
CRS09
CRZ ser
CRH01
0.7A/100V
0.7A/400V
1A/30V
1A/30V
1A/30V
1A/40V
1A/30V
1A/20V
1A/20V
1.5A/30V
1.5A/30V
0.7W/7.5~47V
1A/200V
Type Prodect Number Ratings Features
Small package
Small package
Low - VF Type (VFM = 0.37 V@0.7 A,IRRM = 1.5 mA@30 V)
Trench-SBD (VFM = 0.40 V@0.7 A,IRRM = 0.05 mA@30 V)
Low - IR Type (VFM = 0.45 V@0.7 A,IRRM = 0.1 mA@30 V)
40 V withstand voltage SBD (VFM = 0.49 V@0.7 A,IRRM = 0.1 mA@40 V)
Low - IR Type (VFM = 0.45 V@1 A,IRRM = 5µA@5 V)
Low - VF Type (VFM = 0.36 V@1 A,IRRM = 1 mA@20 V)
Low - VF Type (VFM = 0.33 V@1 A,IRRM = 1 mA@20 V)
Low - VF Type (VFM = 0.36 V@1.5 A,IRRM = 1.0 mA@30 V)
Low - IR Type (VFM = 0.46 V@1.5 A,IRRM = 0.05 mA@30 V)
High surge-protection capability
High-speed, high-efficiency rectifiers (trr = 35 ns max VFM = 0.98 V@1.0 A)
General - Purpose
SBDs
Power zener diodes
HEDs
0
0.1
1
10
0.2 0.4 0.6 0.8
vF(V)
iF(A)
1 1.2 1.4
CRS04 CRS02
CRS09 CRS03
0
0.1
1
10
0.2 0.4 0.6 0.8
vF(V)
iF(A)
1 1.2 1.4
CRS02
CRS01
CRS06
CRS08
CRS09
CRS08
CRS06
CRS03
CRS02
CRS01
0
0.0001
0.001
0.01
0.1
1
10
100
20 40 60 80 100 120
Junction Temperature Tj(˚C)
Reverse Curlent IR(mA)
CRS09
CRS08
CRS06
CRS03
CRS02
CRS01
0
0.0001
0.001
0.01
0.1
1
10
100
20 40 60 80 100 120
Junction Temperature Tj(˚C)
Reverse Curlent IR(mA)
SBD IR - Tj@VR = 5 V (Tj = 25˚C)
(actual data for reference only) SBD IR - Tj@VR = 10 V (Tj = 25˚C)
(actual data for reference only)
Low - IR Type SBD
iF - vF charactevistics (Tj = 25˚C) (max) Low - VF Type SBD
iF - vF charactevistics (Tj = 25˚C) (max)
TM
3
Line-up
M-FLAT
CMS01
CMS02
CMS03
CMS04
CMS05
CMS06
CMS07
CMS08
CMS09
CMS10
CMS11
3A/30V Low - VF SBD
3A/30V Trench SBD
3A/30V Low - IR SBD
5A/30V Low - VF SBD
5A/30V Low - IR SBD
2A/30V Low - VF SBD
2A/30V Low - IR SBD
1A/30V Low - VF SBD
1A/30V Low - IR SBD
1A/40V Normal SBD
2A/40V Normal SBD
Type Prodect Number Ratings Features
VFM = 0.37 V@3 A,IRRM = 5 mA@30 V
VFM = 0.40 V@3 A,IRRM = 0.5 mA@30 V
VFM = 0.45 V@3 A,IRRM = 0.5 mA@30 V
VFM = 0.37 V@5 A,IRRM = 8 mA@30 V
VFM = 0.45 V@5 A,IRRM = 0.8 mA@30 V
VFM = 0.37 V@2 A,IRRM = 3 mA@30 V
VFM = 0.45 V@2 A,IRRM = 0.5 mA@30 V
VFM = 0.37 V@1 A,IRRM = 1.5 mA@30 V
VFM = 0.45 V@1 A,IRRM = 0.5 mA@30 V
VFM = 0.55 V@1 A,IRRM = 0.5 mA@40 V
VFM = 0.55 V@2 A,IRRM = 0.5 mA@40 V
SBDs
SBD IR - Tj@VR = 5 V (Tj = 25˚C)
(actual data for reference only) SBD IR - Tj@VR = 15 V (Tj = 25˚C)
(actual data for reference only)
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0.1
1
10
vF(V)
iF(A)
CMS09
(1 A low - IR)
CMS06
(2 A low - VF)
CMS08
(1 A low - VF)
CMS07
(2 A low - IR)
CMS06/CMS07/CMS08/CMS09
iF - vF Charactevistics (Tj = 25˚C) (max)
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0.1
1
10
vF(V)
iF(A)
CMS01
(3 A low - VF)
CMS02
(3 A trench)
CMS03
(3 A low - IR)
CMS01/CMS02/CMS03
iF - vF Charactevistics (Tj = 25˚C) (max)
20 40 60 80 100
0.0001
0.001
0.01
0.1
1
10
100
Junction Temperature Tj(˚C)
Reverse Curlent IR(mA)
CMS09 (1 A low - IR)
CMS10 (1 A - 40 V)
CMS08 (1 A low - VF)
CMS07 (2 A low - IR)
CMS06 (2 A low - VF)
CMS03 (3 A low - IR)
CMS01 (3 A low - VF)
20 40 60 80 100
0.0001
0.001
0.01
0.1
1
10
100
Junction Temperature Tj(˚C)
Reverse Curlent IR(mA)
CMS09 (1 A low - IR)
CMS10 (1 A - 40 V)
CMS08 (1 A low - VF)
CMS07 (2 A low - IR)
CMS06 (2 A low - VF)
CMS03 (3 A low - IR)
CMS01 (3 A low - VF)
CMS01
CMS02
CMS03
CMS04
CMS05
CMS06
CMS07
CMS08
CMS09
CMS10
CMS11
Product
Number IF
S-F
CRY7.5
CRY8.2
CRY9.1
CRZ10
CRZ11
CRZ12
CRZ13
CRZ15
CRZ16
CRZ18
CRZ20
CRZ22
CRZ24
CRZ27
CRZ30
CRZ33
CRZ36
CRZ39
CRZ43
CRZ47
6
7
8
9
1
1
1
1
1
1
2
2
2
3
3
3
4
Product
Number m
S
SBDs
HEDs
General-
purpose
recfifiers
CRS01
CRS02
CRS03
CRS04
CRS05
CRS06
CRS07
CRS08
CRS09
CRH01
CRG01
CRG02
Type Product
Number
TM
4
Tj = 25˚C)
ce only)
0.6 0.7 0.8
CMS09
1 A low - IR)
R)
/CMS09
= 25˚C) (max)
80 100
CMS09 (1 A low - IR)
CMS10 (1 A - 40 V)
CMS08 (1 A low - VF)
CMS07 (2 A low - IR)
CMS06 (2 A low - VF)
CMS03 (3 A low - IR)
CMS01 (3 A low - VF)
M-FLAT
TM
Electrical Characteristics of SBDs
CMS01
CMS02
CMS03
CMS04
CMS05
CMS06
CMS07
CMS08
CMS09
CMS10
CMS11
3
3
3
5
5
2
2
1
1
1
2
30
30
30
30
30
30
30
30
30
40
40
40
40
40
60
60
40
40
25
25
25
40
-40~125
-40~125
-40~150
-40~125
-40~150
-40~125
-40~150
-40~125
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
0.37
0.4
0.45
0.37
0.45
0.37
0.45
0.37
0.45
0.55
0.55
3
3
3
5
5
2
2
1
1
1
2
5
0.5
0.5
8
0.8
3
0.5
1.5
0.5
0.5
0.5
30
30
30
30
30
30
30
30
30
40
40
Product
Number IF(AV)
(A) VRRM
(V) IFSM
(A) Tj
(˚C) Tstg
(˚C) VFM
(V) IFM(A) IRRM
(mA) VRRM(V)
Maximum Ratings Electrical Characteristics
S-FLAT
TM
Electrical Charactevistics of Zener Diodes
CRY7.5
CRY8.2
CRY9.1
CRZ10
CRZ11
CRZ12
CRZ13
CRZ15
CRZ16
CRZ18
CRZ20
CRZ22
CRZ24
CRZ27
CRZ30
CRZ33
CRZ36
CRZ39
CRZ43
CRZ47
6.75
7.38
8.19
9
9.9
10.8
11.7
13.5
14.4
16.2
18
19.8
21.6
24.3
27
29.7
32.4
35.1
38.7
42.3
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
8.25
9.02
10.01
11
12.1
13.2
14.3
16.5
17.6
19.8
22
24.2
26.4
29.7
33
36.3
39.6
42.9
47.3
51.7
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
9
8
7
6
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
4.5
4.9
5.5
6
7
8
9
10
11
13
14
16
17
19
21
26.4
28.8
31.2
34.4
37.6
Product
Number min typ. max
Zener Voltage
VZ
(V)
measuring current
IZ
(mA)
VF
(V)
max
measuring current
IF
(A)
IR
(µA)
max
measuring current
VR
(V)
Forward Voltage Reverse Current
S-FLAT
TM
Electrical Characteristics of Rectifiers
SBDs
HEDs
General-
purpose
recfifiers
1
1
1
1
1
1
1
1.5
1.5
1
0.7
0.7
CRS01
CRS02
CRS03
CRS04
CRS05
CRS06
CRS07
CRS08
CRS09
CRH01
CRG01
CRG02
30
30
30
40
30
20
20
30
30
200
100
400
20
20
20
20
20
20
30
30
30
15
15
15
-40~125
-40~125
-40~150
-40~150
-40~150
-40~125
-40~125
-40~125
-40~150
-40~150
-40~150
-40~150
-40~125
-40~125
-40~150
-40~150
-40~150
-40~125
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
0.37
0.4
0.45
0.49
0.45
0.36
0.33
0.36
0.46
0.98
1.1
1.1
0.7
0.7
0.7
0.7
1
1
1
1.5
1.5
1
0.7
0.7
1.5
0.05
0.1
0.1
0.005
1
1
1
0.05
0.01
0.01
0.01
-
-
-
-
-
-
-
-
-
35
-
-
30
30
30
40
5
20
20
30
30
200
100
400
Type Product
Number IF(AV)
(A) VRRM
(V) IFSM
(A) Tj
(˚C) Tstg
(˚C) VFM
(V) IFM(A) IRRM
(mA) trr
(ns)VRRM(V)
Maximum Ratings Electrical Characteristics
5
3.8 ± 0.1
1.75 ± 0.1
2.4 +0.2
-0.1 1
0.16
2
4.7 ± 0.2
0.65 ± 0.20.65 ± 0.2
0.98 ± 0.1
0~0.1
1: Anode
2: Cathode
Soldering pad dimensions
(reference only)
Unit: mm
1.4 3.0 1.4
1.4
Package Dimensions
S-FLAT
TM
Embossed Tape Packing(TE85R,TE85L)
S-FLAT
TM
M-FLAT
TM
2.6 ± 0.1
0.9 ± 0.1
1.6 +0.2
-0.1 1
0.16
2
3.5 ± 0.2
0.65 ± 0.20.65 ± 0.2
1.2
1.2 2.8
0.98 ± 0.1
0~0.1
1: Anode
2: Cathode
Soldering pad dimensions
(reference only)
Unit: mm
Item Symbol
Device Recess
Length
Width
Diameter
Pitch
Diameter
Pitch
Lateral position
Lengthwise direction
Crosswise direction
Width
Thickness
Depth
Angle
Curvature
Inside bottom surface
Inside bottom surface
Internal space
—
—
Cumulative pitch error rate: ± 0.2 mm max / 10 pitches
Distance between tape edge and center of the recess
Distance between recess center and feed hole center
Distance between recess center and feed hole center
—
—
—
—
—
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Dimension Remarks
1.9 ± 0.1
3.8 ± 0.1
ø1.1 ± 0.1
4.0 ± 0.1
4.0 ± 0.1
1.75 ± 0.1
2.0 ± 0.1
3.5 ± 0.1
8.0 ± 0.3
0.2 ± 0.05
1.25 ± 0.1
5˚max
R0.3 max
Feed Hole
Center - line Gap
Carrier Tape
ø1.5
+0.1
-0
Trailing empty length
more than 10 pitches
Leading empty length: 200 mm(min)
Leader: 400 mm(min)
Tape dimensions
Leader and trailer dimensions
Reel dimensions
F
HE
L
K
ø160
ø60 ± 1
13 ± 0.2
1.2 ± 0.5
9.0 ± 0.3
1.2 ± 0.5
Position of label
ø180 ± 3
3 ± 0.2
5 ± 0.2
18min
ø76
4 ± 0.2
*1 *3
*1 2 ± 0.2
*2 4 ± 0.5
*3 ø44
*2
A
D
CL
R type
type
B
GI
J
M
NN
M
MM
N
N
ø180 ± 3
ø3
ø3ø10
110
85
Tepe feed direction
Unit: mm
Unit: mm
M
Item
Device Recess
L
C
Feed Hole
Center - line Gap
Carrier Tape
Tape dimension
Leader and traile
GI
J
MM
N
N
Tepe
6
p
ad dimensions
only)
Unit: mm
3.0 1.4
1.4
L
)
10 pitches
h
e recess
o
le center
o
le center
Position of label
*
3
0
± 3
ø3
ø10
85
Unit: mm
Unit: mm
M-FLAT
TM
Embossed Tape Packing(TE12R,TE12L)
Item Symbol
Device Recess
Length
Width
Diameter
Pitch
Diameter
Pitch
Lateral position
Lengthwise direction
Crosswise direction
Width
Thickness
Depth
Angle
Curvature
Inside bottom surface
Inside bottom surface
Internal space
—
—
Cumulative pitch error rate: ± 0.2 mm max / 10 pitches
Distance between tape edge and center of the recess
Distance between recess center and feed hole center
Distance between recess center and feed hole center
—
—
—
—
—
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Dimension Remarks
2.7 ± 0.1
5.0 ± 0.1
ø1.5 ± 0.1
4.0 ± 0.1
ø1.5 + 0.1
4.0 ± 0.1
1.75 ± 0.1
2.0 ± 0.05
5.5 ± 0.05
12.0 ± 0.3
0.3 ± 0.05
1.25 ± 0.1
2˚max
R0.2 max
Feed Hole
Center - line Gap
Carrier Tape
Tape dimensions
Leader and trailer dimensions
Reel dimensions
Trailing empty length: 180 mm(min)
Leading empty length: 180 mm(min)
Leader: 400 mm(min)
F
HE
L
K
ø160
ø60 ± 1
13 ± 0.2
1.2 ± 0.5
13 ± 0.3
1.2 ± 0.5
Position of label
ø180 ± 3
3 ± 0.2
5 ± 0.2
18min
ø76
4 ± 0.2
*1 *3
*1 2 ± 0.2
*2 4 ± 0.5
*3 ø44
*2
A
D
CL
R type
type
B
GI
J
M
NN
M
MM
N
N
ø180 ± 3
ø3
ø3ø10
110
85
Tepe feed direction
Unit: mm
Unit: mm
7
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1-20041 Agrate Brianza Milan, Italy
Tel: (039)68701 Fax:(039)6870205
Toshiba Electronics España, S.A.
Parque Empresarial San Fernando Edificio Europa,
1a Planta, ES-28831 Madrid, Spain
Tel: (91)660-6700 Fax:(91)660-6799
Toshiba Electronics(UK) Limited
Riverside Way, Camberley Surrey,
GU15 3YA, U.K.
Tel: (01276)69-4600 Fax: (01276)69-4800
Toshiba Electronics Scandinavia AB
Gustavslundsvägen 12, 2nd Floor
S-161 15 Bromma, Sweden
Tel: (08)704-0900 Fax: (08)80-8459
Toshiba Electronics Asia
(Singapore) Pte. Ltd.
Singapore Head Office
438B Alexandra Road, #06-08/12 Alexandra
Technopark, Singapore 119968
Tel: (278)5252 Fax: (271)5155
Bangkok Office
135 Moo 5 Bangkadi Industrial Park, Tivanon Rd.,
Bangkadi Amphur Muang Pathumthani, Bangkok, 12000,
Thailand
Tel: (02)501-1635 Fax: (02)501-1638
Toshiba Electronics Trading
(Malaysia)Sdn. Bhd.
Kuala Lumpur Head Office
Suite W1203, Wisma Consplant, No.2,
Jalan SS 16/4, Subang Jaya, 47500 Petaling Jaya,
Selangor Darul Ehsan, Malaysia
Tel: (3)731-6311 Fax: (3)731-6307
Penang Office
Suite 13-1, 13th Floor, Menard Penang Garden,
42-A, Jalan Sultan Ahmad Shah,
100 50 Penang, Malaysia
Tel: 4-226-8523 Fax: 4-226-8515
Toshiba Electronics Philippines, Inc.
26th Floor, Citibank Tower, Valero Street, Makati,
Manila, Philippines
Tel: (02)750-5510 Fax: (02)750-5511
Toshiba Electronics Asia, Ltd.
Hong Kong Head Office
Level 11, Top Glory Insurance Building, Grand Century
Place, No.193, Prince Edward Road West,
Mong Kok, Kowloon, Hong Kong
Tel: 2375-6111 Fax: 2375-0969
Beijing Office
Rm 714, Beijing Fortune Building,
No.5 Dong San Huan Bei-Lu, Chao Yang District,
Beijing, 100004, China
Tel: (010)6590-8795 Fax: (010)6590-8791
Chengdu Office
Unit F, 18th Floor, New Times Plaza, 42 Wenwu Road,
Xinhua Avenue, Chengdu, 610017, China
Tel: (028)675-1773 Fax: (028)675-1065
Shenzhen Office
Rm 3010-3012, Office Tower Shun Hing Square,
Di Wang Commercial Centre, 333 ShenNan
East Road, Shenzhen, 518008, China
Tel: (0755)246-1582 Fax: (0755)246-1581
Toshiba Electronics Korea Corporation
Seoul Head Office
14/F, KEC B/D, 257-7 Yangjae-Dong,
Seocho-ku, Seoul, Korea
Tel: (02)589-4334 Fax: (02)589-4302
Gumi Office
6/F, Ssangyong Investment Securities B/D,
56 Songjung-Dong, Gumi City
Kyeongbuk, Korea
Tel: (82)54-456-7613 Fax: (82)54-456-7617
Toshiba Technology Development
(Shanghai) Co., Ltd.
23F, Shanghai Senmao International Building, 101
Yin Cheng East Road, Pudong New Area, Shanghai,
200120, China
Tel: (021)6841-0666 Fax: (021)6841-5002
Tsurong Xiamen Xiangyu Trading
Co., Ltd.
8N, Xiamen SEZ Bonded Goods Market Building,
Xiamen, Fujian, 361006, China
Tel: (0592)562-3798 Fax: (0592)562-3799
Toshiba Electronics Taiwan
Corporation
Taipei Head Office
17F, Union Enterprise Plaza Bldg. 109
Min Sheng East Rd., Section 3, 0446 Taipei,
Taiwan
Tel: (02)514-9988 Fax: (02)514-7892
Kaohsiung Office
16F-A, Chung-Cheng Bldg., Chung-Cheng 3Rd.,
80027, Kaohsiung, Taiwan
Tel: (07)222-0826 Fax: (07)223-0046
The information contained herein is subject to change without notice.
The information contained herein is presented only as a guide for the applications of our products.
No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in
general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the
responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for
the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of
human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used
within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind
the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor
Reliability Handbook" etc..
The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).
These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or
reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage
include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments,
combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of Toshiba products listed
in this document shall be made at the customer’s own risk.
Website: http://doc.semicon.toshiba.co.jp/indexus.htm
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