CC400
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CC400
Single Chip High Performance RF Transceiver
Applications
• UHF wireless data transmitters and
receivers
• Wireless alarm and security systems
• 315 / 426 / 429 / 433 MHz ISM/SRD
band systems
• Point of sale terminals
• Remote control systems
• Home security and automation
• Low power telemetry
• AMR – Automatic Meter Reading
• Environmental control
Product Description
CC400
is a single-chip high performance,
half-duplex, FSK, UHF transceiver
designed for low power and low-voltage
wireless applications. The circuit is mainly
intended for the ISM (Industrial, Scientific
and Medical) frequency bands at 315, 418
and 433 MHz, but can easily be
programmed for operation at other
frequency bands in the 300 - 500 MHz
range.
The main operating parameters of
CC400
can be programmed via a serial interface,
thus making
CC400
a very flexible and
easy to use component. In a typical
system
CC400
will be used together with a
microcontroller and a few external passive
components.
CC400
is based on Chipcon’s SmartRF®
technology.
Features
• Single chip RF transceiver
• Frequency range 300 – 500 MHz
• High sensitivity (typical -110 dBm)
• Programmable output power up to 25
mW (14 dBm)
• Small size (SSOP-28 package)
• Low supply voltage (2.7 V to 3.3 V)
• Very few external components required
• FSK modulation
• Very low phase noise
• Data-rate up to 9.6 kbps
• Suitable for both narrow and wide band
systems
• Suitable for frequency hopping
protocols
• Frequency-Lock indicator
• Development kit available
• Easy-to-use software (SmartRF Studio)
for generating the
CC400
configuration
data
CC400
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Table of Contents
1. ABSOLUTE MAXIMUM RATINGS ................................................................................ 4
2. OPERATING CONDITIONS........................................................................................... 4
3. ELECTRICAL SPECIFICATIONS.................................................................................. 4
4. GENERAL CHARACTERISTICS................................................................................... 5
5. RF RECEIVE SECTION ................................................................................................. 5
6. RF TRANSMIT SECTION .............................................................................................. 6
7. IF SECTION.................................................................................................................... 6
8. FREQUENCY SYNTHESISER SECTION...................................................................... 7
9. DC CHARACTERISTICS ............................................................................................... 7
10. PIN ASSIGNMENT......................................................................................................... 8
11. CIRCUIT DESCRIPTION................................................................................................ 9
12. CONFIGURATION OVERVIEW................................................................................... 10
13. CONFIGURATION SOFTWARE.................................................................................. 10
14. 3-WIRE SERIAL INTERFACE ..................................................................................... 11
15. MICROCONTROLLER INTERFACE ........................................................................... 13
15.1. CONNECTING THE MICROCONTROLLER ............................................................ 13
15.2. DATA TRANSMISSION ............................................................................................ 13
15.3. DATA RECEPTION................................................................................................... 13
16. APPLICATION CIRCUIT.............................................................................................. 14
16.1. INPUT / OUTPUT MATCHING ................................................................................. 14
16.2. SYNTHESIZER LOOP FILTER AND VCO TANK .................................................... 14
16.3. ADDITIONAL FILTERING......................................................................................... 14
16.4. VOLTAGE SUPPLY DECOUPLING ......................................................................... 14
17. RECEIVER SENSITIVITY ............................................................................................ 15
18. OUTPUT POWER ........................................................................................................ 16
19. INPUT / OUTPUT MATCHING..................................................................................... 16
20. OPTIONAL LC FILTER................................................................................................ 17
21. CRYSTAL OSCILLATOR ............................................................................................ 17
22. LOOP FILTER .............................................................................................................. 18
23. BLOCKING................................................................................................................... 18
24. PLL LOCK INDICATOR............................................................................................... 19
25. ANTENNA CONSIDERATIONS................................................................................... 19
26. SYSTEM CONSIDERATIONS AND GUIDELINES ..................................................... 20
26.1. LOW-COST SYSTEMS............................................................................................. 20
26.2. BATTERY OPERATED SYSTEMS .......................................................................... 20
26.3. NARROW BAND SYSTEMS .................................................................................... 20
26.4. HIGH RELIABILITY SYSTEMS ................................................................................ 20
26.5. SPREAD SPECTRUM FREQUENCY HOPPING SYSTEMS .................................. 20
27. DEMODULATOR PRECHARGING FOR REDUCED TURN-ON TIME ...................... 21
28. PCB LAYOUT RECOMMENDATIONS........................................................................ 22
CC400
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29. CONFIGURATION REGISTERS.................................................................................. 22
30. PACKAGE DESCRIPTION (SSOP-28) ....................................................................... 28
31. SOLDERING INFORMATION...................................................................................... 28
32. PLASTIC TUBE SPECIFICATION............................................................................... 29
33. CARRIER TAPE AND REEL SPECIFICATION .......................................................... 29
34. ORDERING INFORMATION ........................................................................................ 29
35. GENERAL INFORMATION.......................................................................................... 30
35.1. DOCUMENT HISTORY ............................................................................................ 30
35.2. PRODUCT STATUS DEFINITIONS ......................................................................... 30
35.3. DISCLAIMER ............................................................................................................ 30
35.4. TRADEMARKS ......................................................................................................... 31
35.5. LIFE SUPPORT POLICY.......................................................................................... 31
36. ADDRESS INFORMATION.......................................................................................... 32
CC400
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1. Absolute Maximum Ratings
The absolute maximum ratings given in Table 1 must under no circumstances be violated.
Stress exceeding one or more of the limiting values may cause permanent damage to the
device.
Parameter Min. Max. Units Condition
Supply voltage, VDD -0.3 7.0 V
Voltage on any pin -0.3 VDD+0.3,
max 7.0
V
Input RF level 10 dBm
Storage temperature range -50 150 °C
Reflow solder temperature 260 °C T = 10 s
Table 1: Absolute Maximum Ratings
Caution! ESD sensitive device.
Precaution should be used when handling
the device in order to prevent permanent
damage.
2. Operating Conditions
The operating conditions for
CC400
are listed in Table 2 below.
Parameter Min. Max. Units Condition
Operating ambient temperature -30 85 °C
Table 2: Operating Conditions
3. Electrical Specifications
Tc = 25°C, VDD = 3.0V if nothing else stated. Measured on Chipcon’s
CC400DB
reference
design.
Parameter
Min. Typ. Max. Unit Condition
Supply voltage
2.7
3.0
3.3
V
V
Recommended operation voltage
Operating limits
Current Consumption,
receive mode
23 mA
Current Consumption,
average in receive mode using
polling
230 µA 1:100 receive to power down ratio
Current Consumption,
transmit mode:
P=1 mW (0 dBm)
P=4 mW (6 dBm)
P=10 mW (10 dBm)
P=20 mW (13 dBm)
P=25 mW (14 dBm)
33
44
59
68
77
mA
mA
mA
mA
mA
The output power is delivered to
a 50 Ω load
Current Consumption,
Power Down
23
0.2
2
µA
µA
Oscillator core on
Oscillator core off
Table 3: Electrical Specifications
CC400
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4. General Characteristics
The general characteristics of
CC400
are listed in Table 4 below.
Parameter
Min. Typ. Max. Unit Condition
RF Frequency Range
300 315
418
433.92
500 MHz Programmable in steps of 250 Hz
Transmit data rate
0.3 2.4 9.6 kbps Manchester code is required. (9.6
kbps equals 19.2 kBaud using
Manchester code)
Table 4: General Characteristics
5. RF Receive Section
Tc = 25°C, VDD = 3.0V if nothing else stated. Measured on Chipcon’s
CC400DB
reference
design.
Parameter
Min. Typ. Max. Unit Condition
Receiver Sensitivity -110 dBm Measured at 433.92 MHz and a
data rate of 1.2 kbps, 60 kHz IF
and 20 kHz frequency separation
with a bit error rate better than 10-
3. For other settings see p.15.
Cascaded noise figure 3 dB
LO leakage -39 dBm Measured conducted on
CC400DB. Radiated LO leakage
depends on external components
placement.
Input impedance 39 Ω
+4.9 pF
Receive mode, series equivalent.
For matching details see “Input/
output matching” p. 16.
Turn on time 500
3
5
30
µs
ms
ms
ms
With precharging, 9.6 kbps
Without precharging, 9.6 kbps
With precharging, 1.2 kbps
Without precharging, 1.2 kbps
See “Demodulator precharging
for reduced turn-on time” p. 21.
Blocking / Desensitization
±1 MHz
±2 MHz
±5 MHz
±10 MHz
30
35
50
60
dB
dB
dB
dB
Complies with EN 300 220 class
2 receiver requirements.
See p. 18 for more details.
Table 5: RF Receive Section
CC400
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6. RF Transmit Section
Tc = 25°C, VDD = 3.0V if nothing else stated. Measured on Chipcon’s
CC400DB
reference
design.
Parameter
Min. Typ. Max. Unit Condition
Binary FSK frequency separation 0 10 200 kHz The frequency corresponding to
the digital "0" is denoted f0, while
f1 corresponds to a digital "1".
The frequency separation is f1-f0.
The RF carrier frequency, fc, is
then given by fc=(f0+f1)/2.
(The frequency deviation is given
by fd=+/-(f1-f0)/2 )
The frequency separation is
programmable in steps of 1 kHz.
Programmable output power -5 14 dBm Delivered to matched load.
The output power is
programmable in steps of 1 dB.
RF output impedance 400 Ω ||
3 pF
Transmit mode, parallel
equivalent. For matching details
see “Input/ output matching” p.16.
Harmonics -30 dBc When transmitting high output
power levels an external LC or
SAW filter may be used to reduce
harmonics emission to comply
with ISM requirements. See p.
17.
Table 6: RF Transmit Section
7. IF Section
Parameter
Min. Typ. Max. Unit Condition
Intermediate frequency (IF) 60
200
455
kHz
kHz
kHz
The IF is programmable. Either
60 kHz, 200 kHz or 455 kHz can
be chosen.
An optional external IF filter can
be used if 455 kHz is chosen.
The impedance level is 1.5 kΩ
Table 7: IF Section
CC400
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8. Frequency Synthesiser Section
Tc = 25°C @ VDD = 3.0 V if nothing else is stated. Measured on Chipcon’s
CC400DB
reference design.
Parameter
Min. Typ. Max. Unit Condition
Crystal Oscillator Frequency 4 12 13 MHz
Crystal frequency accuracy
requirement
+/- 50
ppm The crystal frequency accuracy
and drift (ageing and temperature
dependency) will determine the
frequency accuracy of the
transmitted signal.
Crystal operation Parallel C151 and C161 are loading
capacitors, see page 17.
Crystal load capacitance 20
16
12
pF
pF
pF
4-6 MHz
6-10 MHz
10-13 MHz
Crystal oscillator start-up time 3 6 ms 12 MHz, 12 pF load
Output signal phase noise -70
-90
-81
-107
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
10 kHz offset from carrier
100 kHz offset from carrier
Loop filter BW = 16 kHz
10 kHz offset from carrier
100 kHz offset from carrier
Loop filter BW = 3 kHz
RX / TX turn time 100 µs
PLL turn-on time, crystal oscillator
off in power down mode
4 ms
PLL turn-on time, crystal oscillator
on in power down mode
2 ms It is recommended to wait at least
8 ms (6 ms crystal oscillator start-
up time and 2 ms PLL turn-on
time) before checking the PLL
Lock Indicator at the LOCK pin.
Please refer to chapter “PLL Lock
Indicator” on page 16 for a further
description.
Table 8: Frequency Synthesiser Section
9. DC Characteristics
The DC Characteristics of
CC400
are listed in Table 10 below. Tc = 25°C if nothing else
stated.
Parameter
Min. Typ. Max. Unit Condition
Logic "0" input voltage 0 0.3*VDD V
Logic "1" input voltage 0.7*VDD VDD V
Logic "0" output voltage 0 0.4 V Output current -2.5 mA,
3.0 V supply voltage
Logic "1" output voltage 2.5 VDD V Output current 2.5 mA,
3.0 V supply voltage
Logic "0" input current NA -1 µA Input signal equals GND
Logic "1" input current NA 1 µA Input signal equals VDD
Table 9: DC Characteristics
CC400
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10. Pin Assignment
Pin no. Pin name Pin type Description
1 AVDD Power (A) Power supply (3V) for analog modules (Mixer, IF, demodulator)
2 AGND Ground (A) Ground connection (0V) for analog modules (substrate)
3 AGND Ground (A) Ground connection (0V) for analog modules (Mixer, IF,
demodulator)
4 AGND Ground (A) Ground connection (0V) for analog modules (LNA and PA)
5 RF_IN RF Input RF signal input from antenna (external ac-coupling)
6 RF_OUT RF output RF signal output to antenna (external bias)
7 AVDD Power (A) Power supply (3V) for analog modules (LNA and PA)
8 AVDD Power (A) Power supply (3V) for analog modules (VCO)
9 VCO_IN Analog input External VCO-tank input
10 AGND Ground (A) Ground connection (0V) for analog modules (VCO)
11 AGND Ground (A) Ground connection (0V) for analog modules (Prescaler)
12 CHP_OUT Analog output Charge pump current output
13 AVDD Power (A) Power supply (3V) for analog modules (Prescaler)
14 AVDD Power (A) Power supply (3V) for analog modules (XOSC)
15 XOSC_Q1 Analog input Crystal, pin 1, or external clock input
16 XOSC_Q2 Analog output Crystal, pin 2
17 AGND Ground (A) Ground connection (0V) for analog modules (XOSC)
18 DGND Ground (D) Ground connection (0V) for digital modules (substrate)
19 LOCK Digital output PLL Lock Indicator. Output is high when PLL is in lock. Please
refer to chapter “PLL Lock Indicator” on page 16 for a further
description.
20 DGND Ground (D) Ground connection (0V) for digital modules (Digital)
21 DVDD Power (D) Power supply (3V) for digital modules (Digital)
22 DVDD Power (D) Power supply (3V) for digital modules (Guard)
23 DIO Digital
input/output (bi-
directional)
Data input in transmit mode
Demodulator output in receive mode
24 CLOCK Digital input Programming clock for 3-wire bus
25 PDATA Digital input Programming data for 3-wire bus
26 STROBE Digital input Programming strobe (Load) for 3-wire bus
27 IF_IN Analog input Input to IF chain (from external ceramic filter). The input
impedance is 1.5 kΩ so a direct connection to an external ceramic
filter is possible
28 IF_OUT Analog output Output from first amplifier in IF-chain (to external ceramic filter).
The output impedance is 1.5 kΩ so a direct connection to an
external ceramic filter is possible
A=Analog, D=Digital
Figure 1: Pin-out top view
1
14 15
AVDD
AGND
AGND
AGND
RF_IN
RF_OUT
AVDD
AVDD
VCO_IN
AGND
AGND
AVDD
CHP_OUT
AVDD
CC400
2
3
4
6
5
7
8
9
11
12
13
10
28 IF_OUT
IF_IN
STROBE
PDATA
CLOCK
DIO
DVDD
DVDD
DGND
LOCK
DGND
XOSC_Q2
AGND
XOSC_Q1
27
26
25
23
24
22
21
20
18
17
16
19
CC400
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11. Circuit Description
Figure 2: Simplified block diagram of the
CC400
.
A simplified block diagram of
CC400
is
shown in Figure 2. Only signal pins are
shown.
In receive mode
CC400
is configured as a
traditional heterodyne receiver. The RF
input signal is amplified by the low-noise
amplifier (LNA) and converted down to the
intermediate frequency (IF) by the mixer
(MIXER). In the intermediate frequency
stage (IF STAGE) this downconverted
signal is amplified and filtered before being
fed to the demodulator (DEMOD). As an
option an external IF filter can be used for
improved performance. After demodulation
CC400
outputs the raw digital demodulated
data on the pin DIO. Synchronisation and
final qualification of the demodulated data
is done by the interfacing digital system
(microcontroller).
In transmit mode the voltage controlled
oscillator (VCO) output signal is fed
directly to the power amplifier (PA). The
RF output is frequency shift keyed (FSK)
by the digital bit stream fed to the pin DIO.
The internal T/R switch circuitry makes the
antenna interface and matching very easy.
The frequency synthesiser generates the
local oscillator signal which is fed to the
MIXER in receive mode and to PA in
transmit mode. The frequency synthesiser
consists of a crystal oscillator (XOSC),
phase detector (PD), charge pump
(CHARGE PUMP), VCO, and frequency
dividers (/R and /N). An external crystal
must be connected to XOSC, and an
external LC-tank with a varactor diode is
required for the VCO. For flexibility the
loop filter is external.
For chip configuration
CC400
includes a 3-
wire digital serial interface (CONTROL).
CLOCK, PDATA, STROBE
LNA
PA
DEMOD
VCO
Freq. divider
PD OSC
~
/N
MIXER
CHARGE
PUMP
VCO_IN
RF_IN
DIO
CHP_OUT
LOCK
IF STAGE
RF_OUT
IF_OUT IF_IN
3
CONTROL
XOSC_Q2
XOSC_Q1
/R
CC400
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12. Configuration Overview
CC400
can be configured to achieve the best performance for different applications. Through
the programmable configuration registers the following key parameters can be programmed:
• Receive/Transmit mode.
• RF output power level.
• Power amplifier operation class (A, AB,
B or C).
• Frequency synthesiser key parameters:
RF output frequency, FSK modulation
frequency separation (deviation),
crystal oscillator reference frequency.
• Power-down/power-up mode.
• Reference oscillator on or off in power
down mode (when on, shorter
frequency synthesiser start-up time is
achieved).
• The IF (intermediate frequency) can be
set to either 60 kHz or 200 kHz using
on-chip filters, or 455 kHz using an
external filter.
• Data rate can be selected.
• Synthesiser lock indicator mode. The
lock detection can be enabled/disabled.
When enabled, two lock detection
modes can be chosen, either "mono-
stable" or continuous.
• In receive mode precharging of the
demodulator can be used to achieve
faster settling time (see p.21).
13. Configuration Software
Chipcon will provide users of
CC400
with a
program, SmartRF Studio (Windows
interface) that generates all necessary
CC400
configuration data based on the
user's selections of various parameters.
Based on the selections 8 hexadecimal
numbers are generated. These
hexadecimal numbers will then be the
necessary input to the microcontroller for
configuration of
CC400
. In addition the
program will provide the user with the
component values needed for the PLL
loop filter and the input/output matching
circuit.
Figure 3 shows the user interface of the
CC400
configuration software.
Figure 3: SmartRF Studio user interface.
CC400
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14. 3-wire Serial Interface
CC400
is programmed via a simple 3-wire
interface (STROBE, PDATA and CLOCK).
A full configuration of
CC400
requires
sending 8 data frames of 16 bits each.
With a clock rate of 2 MHz the time
needed for a full configuration will
therefore be less than 100 µs. Setting the
device in power down mode requires
sending one frame only and will therefore
take less than 10 µs.
In each write-cycle 16 bits are sent on the
PDATA-line. The three most significant
bits of each data frame (bit15, bit14 and
bit13) are the address-bits. Bit15 is the
MSB of the address and is sent as the first
bit. See Figure 4.
A timing diagram for the programming is
shown in Figure 5. The clocking of the
data on PDATA is done on the negative
edge of CLOCK. When the last bit, bit0, of
the sixteen bits has been loaded, the
STROBE-pulse must be brought high and
then low to load the data.
The configuration data will be valid after a
programmed power-down mode, but not
when the power-supply is turned off. When
changing mode, only the frames that are
different need to be programmed.
The timing specifications are given in
Table 10.
CLOCK
PDATA
STROBE
000 001 111011
Address
first
frame
(000)
Data
first
frame
Address
last
frame
(111)
Data
last
frame
Address
second
frame
(001)
Data
second
frame
M
S
B
L
S
B
L
S
B
L
S
B
M
S
B
M
S
B
L
S
B
Figure 4: Serial data transfer (full configuration).
CLOCK
STROBE
PDATA BIT 0BIT 1 BIT 15 BIT 14
TSD THD
TCS TSCTS,min
TCL,min TCH,min
Figure 5: Timing diagram, serial interface.
CC400
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Parameter Symbol
Min Max Units Conditions
CLOCK,
clock
frequency
FCLOCK
- 2 MHz
CLOCK low
pulse
duration
TCL,min 50 ns The minimum time CLOCK can be low.
CLOCK high
pulse
duration
TCH,min 50 ns The minimum time CLOCK can be high.
PDATA setup
time
TSD
5 - ns The minimum time data on PDATA must be ready
before the negative edge of CLOCK.
PDATA hold
time
THD 5 - ns The minimum time data must be held at PDATA,
after the negative edge of CLOCK.
CLOCK to
STROBE
time
TCS 5 - ns The minimum time after the negative edge of
CLOCK before positive edge of STROBE.
STROBE to
CLOCK time
TSC 5 - ns The minimum time after the negative edge of
STROBE before negative edge of CLOCK.
STROBE
pulse
duration
TS,min 50 ns The minimum time STROBE can be high.
Rise time Trise 100 ns The maximum rise time for CLOCK and STROBE
Fall time Tfall 100 ns The maximum fall time for CLOCK and STROBE
Note: The set-up- and hold-times refer to 50% of VDD.
Table 10: Serial interface, timing specification.
CC400
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15. Microcontroller Interface
Used in a typical system,
CC400
will
interface to a microcontroller. This
microcontroller must be able to:
• Program the
CC400
into different
modes via the 3-wire serial interface
(PDATA, STROBE, CLOCK).
• Operate with the bidirectional data pin
DIO.
• Perform oversampling of the de-
modulator output (on pin DIO), recover
the clock corresponding to the actual
datarate, and perform data quali-
fication (on Manchester encoded
data).
• Data to be sent must be Manchester
encoded.
• Optionally the microcontroller can
monitor the frequency lock status from
pin LOCK.
• Optionally the microcontroller can
perform precharging of the receiver in
order to reduce the turn-on time (see
p.21).
15.1. Connecting the microcontroller
The microcontroller uses 3 output pins for
the serial interface (PDATA, STROBE and
CLOCK). A bi-directional pin is used for
data to be transmitted and data received
(DIO). Optionally another pin can be used
to monitor the LOCK signal. This signal is
logic level high when the PLL is in lock.
See Figure 7.
15.2. Data transmission
The data to be sent has to be Manchester
encoded (also known as bi-phase-level
coding). The Manchester code ensures
that the signal has a constant DC
component that is necessary for the FSK
demodulator. The Manchester code is
based on transitions; a “0” is encoded as a
low-to-high transition, a “1” is encoded as
a high-to-low transition. See Figure 6.
When the DIO is logic level high, the upper
FSK frequency is transmitted. The lower
frequency is transmitted when DIO is low.
Note that the receiver data output is
inverted when using low-side LO, which is
default using SmartRF Studio.
15.3. Data reception
The output of the demodulator (DIO) is a
digital signal (alternating between 0 V and
VDD). For small input signals, there will be
some noise on this signal, located at the
edges of the digital signal. The datarate of
this signal may be up to 9.6 kbps. Due to
the Manchester coding, the fundamental
frequency of the signal is also 9.6 kHz. An
oversampling of 4-8 times the frequency of
the demodulator-output is recommended.
I.e. the sampling frequency should be at
least 40-80 kHz for 9.6 kbps. For a lower
datarate the sampling frequency can be
reduced.
In a typical application the data output is
sampled by the microcontroller, and stored
in an accumulating register. The length of
this register will typically be 4-8 bits
(depending on the oversampling ratio).
The qualification of the data (decide
whether the signal is “0” or “1”) can be
based on comparing the number of 0’s
with the number of 1’s. See Application
Note AN008 “Oversampling and data
decision for the CC400/CC900” for more
details.
Time
TX
data
10110001101
Figure 6: Manchester encoding. Figure 7: Microcontroller interface.
CC400
PDATA
CLOCK
STROBE
DIO
LOCK
Micro-
controller
CC400
SWRS050 Page 14 of 32
16. Application Circuit
Very few external components are
required for operation of
CC400
. A typical
application circuit for 433.92 MHz
operation is shown in Figure 8. 1.2 kbps
data rate and 20 kHz FSK separation are
used. Typical component values are
shown in Table 11.
16.1. Input / output matching
L51 and C51 are the input match for the
receiver, and L61 and C61 are the output
match for the transmitter. An internal T/R
switch circuitry makes it possible to
connect the input and output together
matching to 50Ω. See “Input/output
matching” p.16 for details.
16.2. Synthesizer loop filter and VCO
tank
The PLL loop filter consists of C121-C123
and R121-R123. The Component values
are easily calculated using the SmartRF
Studio software.
The VCO tank consists of C91-C93, L91
and the varactor (VAR). C91 determines
the coupling to the internal VCO amplifier,
and thus the VCO loop gain. This loop
gain is also controlled by the ‘VCO gain’
setting in SmartRF Studio, by changing
the amplifier current. C92 together with the
varactor’s capacitance ratio determines
the VCO sensitivity (MHz/V). The
sensitivity should be 20 MHz/V. L91 and
C93 is used to set the absolute range of
the VCO. See Application Note AN012
“VCO fine-tuning CC400 and CC900” for
more details.
16.3. Additional filtering
Additional external components (e.g.
ceramic IF-filter, RF LC or SAW-filter) may
be used in order to improve the
performance for specific applications. See
also “Optional LC filter” p.17 for further
information.
16.4. Voltage supply decoupling
C10-C12, C24-C25, C210 and C211 are
voltage supply de-coupling capacitors.
These capacitors should be placed as
close as possible to the voltage supply
pins of
CC400
. The
CC400DB
should be
used as a reference design.
LC or SAW
FILTER
1
14 15
AVDD
AGND
AGND
AGND
RF_IN
RF_OUT
AVDD
AVDD
VCO_IN
AGND
AGND
AVDD
CHP_OUT
AVDD
IF_OUT
IF_IN
STROBE
PDATA
CLOCK
DIO
DVDD
DVDD
DGND
LOCK
DGND
XOSC_Q2
AGND
XOSC_Q1
C51L51
L61 C61
XTAL
C122
C121
R121
R122
C123
R123
C91
C92
L91
VAR
C93
TO/FROM
MICROCONTROLLER
2
3
4
6
5
7
8
9
11
12
13
10
28
27
26
25
23
24
22
21
20
18
17
16
19
C151 C161
Monopole
antenna
CC400
AVDD=3V
DVDD=3V
C10 C11 C12
C210 C211
455kHz
Optional
Optional
C24 C25
R7
LC or SAW
FILTER
1
14 15
AVDD
AGND
AGND
AGND
RF_IN
RF_OUT
AVDD
AVDD
VCO_IN
AGND
AGND
AVDD
CHP_OUT
AVDD
IF_OUT
IF_IN
STROBE
PDATA
CLOCK
DIO
DVDD
DVDD
DGND
LOCK
DGND
XOSC_Q2
AGND
XOSC_Q1
C51L51
L61 C61
XTALXTAL
C122
C121
R121
R122
C123
R123
C91
C92
L91
VAR
C93
TO/FROM
MICROCONTROLLER
2
3
4
6
5
7
8
9
11
12
13
10
28
27
26
25
23
24
22
21
20
18
17
16
19
C151 C161
Monopole
antenna
CC400
AVDD=3VAVDD=3V
DVDD=3V
C10 C11 C12
C210 C211
455kHz
Optional
Optional
C24 C25
R7
Figure 8: Typical
CC400
application for 433.92 MHz operation.
CC400
SWRS050 Page 15 of 32
Item Description
C10 1 nF, X7R, 0603
C11 33 nF, X7R, 0603
C12 4.7 nF, NP0, 1206
C24 33 pF, NP0, 0603
C25 220 pF, NP0, 0603
C51 220 pF, NP0, 0603
C61 12 pF, NP0, 0603
C91 4.7 pF, NP0, 06035
C92 8.2 pF, NP0, 0603
C93 3.9 pF, NP0, 0603
C121 33 nF, X7R, 0603
C122 1.5 nF, X7R, 0603
C123 330 pF, NP0, 0603
C161 15 pF, NP0, 0603
C151 15 pF, NP0, 0603
C210 1 nF, X7R, 0603
C211 33 nF, X7R, 0603
L51 39 nH, 0805
L61 6.8 nH, 0805
L91 10 nH, 0805
R7 10 kΩ, 0603 (optional)
R121 5.6 kΩ, 0603
R122 27 kΩ, 0603
R123 22 kΩ, 0603
VAR KV1837K, TOKO or similar
XTAL 12 MHz crystal, 12 pF load
Table 11: Bill of materials for the application circuit.
17. Receiver sensitivity
The receiver sensitivity depends on which
IF frequency and IF filter that has been
selected (60, 200 or 455 kHz). It also
depends on the data rate (0.3 – 9.6 kbps)
and the FSK frequency separation (0 –
200 kHz). Frequency separation is twice
the frequency deviation (for example, 20
kHz separation is +/-10 kHz deviation).
Some typical figures are shown in Table
12.
Data rate IF frequency Separation CC400
60 kHz 20 kHz -110 dBm
200 kHz 40 kHz -103 dBm
1.2 kbps
455 kHz ext 12 kHz -108 dBm
60 kHz 30 kHz -110 dBm
200 kHz 40 kHz -103 dBm
2.4 kbps
455 kHz ext 20 kHz -103 dBm
200 kHz 40 kHz -101 dBm 4.8 kbps
455 kHz ext 20 kHz -99 dBm
9.6 kbps 200 kHz 40 kHz -97 dBm
Table 12: Sensitivity for different IF frequency, data rates and separation.
In a narrow band system with very low
frequency separation (less than 10 kHz)
the sensitivity will drop. To insure proper
operation the separation should always be
larger than 5 kHz (+/- 2.5 kHz deviation).
For even smaller separation, or to improve
the sensitivity, an external narrow band
demodulator should be used. See
Application Note AN005 “Selecting system
parameters and system configurations
using CC400 / CC900” for more
information on narrow band systems.
CC400
SWRS050 Page 16 of 32
18. Output power
The output power is controlled through
several parameters in the configuration
registers. Table 13 shows recommended
settings for the different output powers.
Register
Output power Class E9:8 F1:0 C8,A7:6,D12:11
-5 A 00 00 01011
-4 AB 01 00 00100
-3 AB 01 01 00101
-2 AB 01 01 00110
-1 AB 01 01 00111
0 B 10 10 00011
1 B 10 10 00100
2 B 10 10 00101
3 B 10 10 00110
4 B 10 10 00111
5 B 10 10 01000
6 B 10 10 01001
7 B 10 10 01010
8 C 11 11 01001
9 C 11 11 01010
10 C 11 11 01100
11 C 11 11 01111
12 C 11 11 10001
13 C 11 11 10101
14 C 11 11 11011
Table 13: Output power settings.
19. Input / Output Matching
Four passive external components
combined with the internal T/R switch
circuitry ensures match in both RX and TX
mode. The matching network for 433.92
MHz is shown in Figure 9. The component
values may have to be optimised to
include layout parasitics. Matching
components for other frequencies can be
found using the configuration software.
See also Application Note AN013
“Matching CC400 CC900” for more details.
L61C61
RF_IN
RF_OUT
AVDD
TO ANTENNA C51L51
CC40
0
C51=220 pF
C61=12 pF
L51=39 nH
L61=6.8 nH
f = 433.92 MHz
Figure 9: Input/output matching network.
CC400
SWRS050 Page 17 of 32
20. Optional LC Filter
An optional LC filter may be added
between the antenna and the matching
network in certain applications. The filter
will reduce the emission of harmonics and
increase the receiver selectivity.
The filter for use at 433.92 MHz is shown
in Figure 10. The component values may
have to be optimised to include layout
parasitics. The filter is designed for 50Ω
terminations.
Figure 10: LC filter.
21. Crystal oscillator
An external clock signal or the internal
crystal oscillator can be used as main
frequency reference. An external clock
signal should be connected to XOSC_Q1,
while XOSC_Q2 should be left open. The
crystal frequency must be in the range 4 -
13 MHz.
Using the internal crystal oscillator, the
crystal must be connected between
XOSC_Q1 and XOSC_Q2. The oscillator
is designed for parallel mode operation of
the crystal. In addition loading capacitors
(C151 and C161) for the crystal are
required. The loading capacitor values
depend on the total load capacitance, CL,
specified for the crystal. The total load
capacitance seen between the crystal
terminals should equal CL for the crystal to
oscillate at the specified frequency.
parasiticL C
CC
C+
+
=
161151
11
1
The parasitic capacitance is constituted by
the pins input capacitance and PCB stray
capacitance. Typically the total parasitic
capacitance is 4.5 pF. A trimming
capacitor may be placed across C151 for
initial tuning if necessary.
The crystal oscillator circuit is shown in
Figure 11. Typical component values for
different values of CL are given in Table
14.
The initial tolerance, temperature drift,
ageing and load pulling should be carefully
specified in order to meet the required
frequency accuracy in a certain
application. By specifying the total
expected frequency accuracy in SmartRF
Studio together with data rate and
frequency separation, the software will
calculate the total bandwidth and compare
to the available IF bandwidth. The
software will report any contradictions and
a more accurate crystal will be
recommended if required.
C161C151
XTAL
XOSC_Q1 XOSC_Q2
Figure 11: Crystal oscillator circuit.
L52
C53
f = 433.92 MHz
C52=15 pF
C53=22
p
F
L52=8.2 nH
C52
CC400
SWRS050 Page 18 of 32
Item CL= 12 pF CL= 16 pF CL= 22 pF
C151 15 pF 22 pF 33 pF
C161 15 pF 22 pF 33 pF
Table 14: Crystal oscillator component values.
22. Loop filter
The loop filter is a lead-lag type of filter.
The calculations for the loop filter
components are done in the SmartRF
Studio software.
See Application Note AN012 “VCO fine
tuning for CC400 and CC900” for more
detailed information. A spreadsheet,
CC400_CC900_Loop_Filter_1_0.xls, is
available from Chipcon that will calculate
the loop filter components for a desired
bandwidth with different constants than the
default values in SmartRF Studio.
23. Blocking
-10
0
10
20
30
40
50
60
70
80
90
420 425 430 435 440 445 450
Frequency
dBc
FM
CW
Requirement
IF =60 kHz, Separation = 20 kHz. Data
rate = 1.2 kbps. Interfering signal is CW
(no modulation) or FM modulation.
-10
0
10
20
30
40
50
60
70
80
420 425 430 435 440 445 450
Frequency
dBc
FM
CW
Requirement
IF =200 kHz, Separation = 40 kHz. Data
rate = 1.2 kbps. Interfering signal is CW
(no modulation) or FM modulation.
-10
0
10
20
30
40
50
60
70
420 425 430 435 440 445 450
Freque ncy
dBc
FM
CW
Requirement
IF =455 kHz external, Separation = 12
kHz. Data rate = 1.2 kbps. Interfering
signal is CW (no modulation) or FM
modulation.
CC400
SWRS050 Page 19 of 32
24. PLL Lock Indicator
The
CC400
PLL lock indicator is available
on the LOCK pin. The PLL lock signal is
not 100% conclusive. That is, if the LOCK
signal indicates lock (i.e. a high signal on
the LOCK pin) the PLL has locked to the
desired frequency. However, situations
might arise where the lock signal does not
indicate lock (i.e. a low signal on the
LOCK pin) when in fact the PLL has
locked to the desired frequency.
25. Antenna Considerations
The
CC400
can be used together with
various types of antennas. The most
common antennas for short-range
communication are monopole, helical and
loop antennas.
Monopole antennas are resonant
antennas with a length corresponding to
one quarter of the electrical wavelength
(λ/4). They are very easy to design and
can be implemented simply as a “piece of
wire” or integrated into the PCB.
Non-resonant monopole antennas shorter
than λ/4 can also be used, but at the
expense of range. In size and cost critical
applications such an antenna may very
well be integrated into the PCB.
Helical antennas can be thought of as a
combination of a monopole and a loop
antenna. They are a good compromise in
size critical applications. But helical
antennas tend to be more difficult to
optimise than the simple monopole.
Loop antennas are easy to integrate into
the PCB, but are less effective due to
difficult impedance matching because of
their very low radiation resistance.
For low power applications the λ/4-
monopole antenna is recommended giving
the best range and because of its
simplicity.
The length of the λ/4-monopole antenna is
given by:
L = 7125 / f
where f is in MHz, giving the length in cm.
An antenna for 433.92 MHz should be
16.4 cm.
The antenna should be connected as
close as possible to the IC. If the antenna
is located away from the input pin the
antenna should be matched to the feeding
transmission line. See Application Note
AN003 “Antennas” for more details.
CC400
SWRS050 Page 20 of 32
26. System Considerations and Guidelines
26.1. Low-cost systems
In systems where low cost is of great
importance the 200 kHz IF should be
used. The oscillator crystal can then be a
low cost crystal with 50 ppm frequency
tolerance.
26.2. Battery operated systems
In low power applications the power down
mode should be used when not being
active. Depending on the start-up time
requirement, the oscillator core can be
powered during power down. Precharging
of the demodulator may also be used to
reduce the receiver turn-on time, see
description p.21.
26.3. Narrow band systems
CC400
is also suitable for use in narrow
band systems. However, it is then required
to use a crystal with low temperature drift
and ageing. A trimmer capacitor in the
crystal oscillator circuit (in parallel with
C151) may also be necessary to set the
initial frequency.
It is also possible to include an external IF-
filter at 455 kHz. This should be a ceramic
filter with 1.5 kΩ input/output impedance
connected between IF_OUT and IF_IN.
Typical bandwidth is 30 kHz. Due to the
high Q of such a filter, a better selectivity
can be achieved. See Application Note
AN005 “Selecting system parameters and
system configurations using CC400 /
CC900” for more details.
26.4. High reliability systems
Using a SAW filter as a preselector will
improve the communication reliability in
harsh environments by reducing the
probability of blocking.
26.5. Spread spectrum frequency
hopping systems
Due to the very fast frequency shift
properties of the PLL, the
CC400
may very
well be used in frequency hopping
systems.
CC400
SWRS050 Page 21 of 32
27. Demodulator Precharging For Reduced Turn-on Time
The demodulator data slicer has an
internal AC coupling giving a time constant
of approximately 30 periods of the bit rate
period. This means that before proper
demodulation can take place, a minimum
of 30 start-bits has to be received.
In critical applications where the start-up
time should be decreased in order to
reduce the power consumption, this time
constant can be reduced to 5 periods
using the optional precharging possibility.
The precharging is done during data
reception by setting the precharging bit in
the configuration register active with
duration of at least 5 bit periods.
Data received
without
precharging
PRECHARGE
Time
Data
transmitted
5 bit periods
t1 t2 t3
Data validData not valid
Data validData not valid
5 bit periodes 30 bit periodes
Data received with
precharging
Figure 12: Demodulation using precharging.
In the example shown in Figure 12, data is
transmitted continuously from the
transmitter (all 1’s). At t=t1 the receiver is
turned on, and then the precharging is
kept on for about 5 bit periods. At t=t2 the
received data is valid and precharging is
turned off. When not using precharging,
data is not valid until 30 bit periods, at t=t3.
CC400
SWRS050 Page 22 of 32
28. PCB Layout Recommendations
A two layer PCB is highly recommended.
The bottom layer of the PCB should be the
“ground-layer”.
The top layer should be used for signal
routing, and the open areas should be
filled with metallization connected to
ground using several vias.
The ground pins should be connected to
ground as close as possible to the
package pin. The decoupling capacitors
should also be placed as close as possible
to the supply pins and connected to the
ground plane by separate vias.
The external components should be as
small as possible and surface mount
devices should be used.
Precaution should be used when placing
the microcontroller in order to avoid
interference with the RF circuitry.
In most applications the ground plane can
be one common plane, but in certain
applications where the ground plane for
the digital circuitry is expected to be noisy,
the ground plane may be split in an
analogue and a digital part. All AGND pins
and AVDD decoupling capacitors should
be connected to the analogue ground
plane. All DGND pins and DVDD
decoupling capacitors should be
connected to the digital ground. The
connection between the two ground
planes should be implemented as a star
connection with the power supply ground.
The
CC400DB
reference design is available
from Chipcon’s web site, and should be
used as a guideline for PCB layout.
29. Configuration registers
The configuration of
CC400
is done by programming the 8 13-bit configuration registers. The
configuration data based on selected system parameters are most easily found by using the
SmartRF Studio software. A complete description of the registers is given in the following
tables.
REGISTER OVERVIEW
Address Register Name Description
000 A Main control register
001 B General control register
010 C General control register
011 D General control register
100 E General control register
101 F General control register
110 G General control register
111 H General control register
CC400
SWRS050 Page 23 of 32
Register A
REGISTER NAME Default
value
Active Description
A[12] PD - H Power Down
0 = Chip Enable
1 = Chip Disable (only reference oscillator core on)
A[11] RXTX - Receive/Transmit-mode control
0 = Receive mode
1 = Transmit mode
A[10:8] S[2:0] 000 Synthesiser test modes (apply when TDEM2=0)
Modus (000):
Normal operation: Rx/Tx.
Modus (001):
Divided signal from VCO at PD input monitored at LOCK pin.
Modulation (control of A-counter) is disabled.
Modus (010):
Divided signal from VCO at PD input monitored at LOCK pin.
Modulation (control of A-counter) is enabled.
Modus (011):
Output from reference divider monitored at LOCK pin.
Modus (100):
Signal at TX_DATA pin used as modulation control overriding
the signal from the dual-modulus divider. Output monitored at
LOCK pin.
Modus (101):
Output from prescaler monitored at LOCK pin.
Modulation (A-divider control) disabled.
Modus (110):
Output from prescaler monitored at LOCK pin.
Modulation (A-divider control) disabled.
Modus (111):
Shift register data output monitored at LOCK pin.
A[7:6] PA[3:2] - PA gain programming. Part of PA4:PA0. (PA1:PA0 is in frame
D, PA4 is in frame C)
A[5:4] LNA[1:0] 10 LNA bias current and gain
00 = 0.94mA=I0
01 = 1.5* I0=1.40mA
10 = 2* I0 =1.87mA (nominal setting)
11 = 3* I0=2.81mA
A[3:2] MIX[1:0] 10 MIXER bias current and gain
00 = 0.36mA
01 = 0.54mA
10 = 0.72mA (nominal setting)
11 = 1.08mA
A[1:0] LO[1:0] 10 LO drive (peak-differential = peak-peak single-ended)
00 = 144mV
01 = 288mV
10 = 432mV (nominal setting)
11 = 720mV
CC400
SWRS050 Page 24 of 32
Register B
REGISTER NAME Default
value
Active Description
B[12:11] AB[1:0] 00 Antibacklash pulse width
00 = 0ns (nominal setting)
01 = 2.7ns
10 = 4.8ns
11 = 10.9ns
Tolerance (+200% / - 70%)
B[10:7] A[3:0] - A-counter
B[6:0] M[6:0] - M-counter
Register C
REGISTER NAME Default
value
Active Description
C[12] RESSYN 0 Synthesiser reset
0 = Normal operation
1 = Reset synthesiser
C[11:9] V[3:1] - VCO gain programmering.
LSB-bit VO = “0”.
000= maximum gain
111=minimum gain
Reduce gain to reduce LO spurious emission
C[8] PA[4] - PA gain programmering. Part of PA4:PA0
C[7] FSIG - Charge pump polarity
0 = Add charge when VREF leads FVCO (Normal)
1 = Sink charge when VREF leads FVCO
C[6:5] CHP[1:0] 10 Charge pump current:
00 = 10µA
01 = 20µA
10 = 40µA (nominal setting)
11 = 80µA
C[4] PDX - H Reference oscillator power down
0 = Power on even during main power down
1 = Power down (during main power down)
C[3:0] R[3:0] - R-divider
Register D
REGISTER NAME Default
value
Active Description
D[12:11] PA[1:0] - PA gain programming. Part PA4
D[10:0] K10:0] - K-counter
K10 er sign bit (0=positive, 1 negative).
Negative K must be 2’s complement
Register E
REGISTER NAME Default
value
Active Description
E[12] LW 0 PLL Lock-Window tolerance
0 = 21ns (Normal setting)
1 = 44ns
E[11] LM - Lock mode
(Lock is reset when PLL is reprogrammed).
0 = Single shot
1 = Continuous
E[10] LH - Lock detection enable
0 = Lock detection enabled
1 = Lock detection disabled (LOCK=1)
CC400
SWRS050 Page 25 of 32
REGISTER NAME Default
value
Active Description
E[9:8] PACL[1:0] - PA “class”
00 = Class A
01 = Class AB
10 = Class B
11 = Class C
E[7:0] D[7:0] - D-counter
Frequency seperation programming
Register F
REGISTER NAME Default
value
Active Description
F[12:11] DCLK[1:0] - Demodulator shift register clock selection
00 = External clock (25MHz) at TX_DATA.
01 = 12.8 MHz from crystal oscillator
10 = 25 MHz from prescaler
11 = 12.5MHz from prescaler
F[10:9] DEMIF[1:0] - Demodulator phase shift / IF control
00 = 60kHz IF
01 = 200kHz IF
10 = 455kHz IF
11 = Test modes using DCLK1:DCLK0
F[8:6] TDEM[2:0] 000 Test modes for demodulator. Output is monitored at LOCK
pin. See also S2:S0 in frame A.
TDEM2=0: As described for S2:S0 in frame A
TDEM2=1 : Demodulator test modes.
Modus (000):
Normal setting.
Modus (0XX):
Test as for S2:S0 in frame A monitored at LOCK pin.
Modus (100):
Demodulator input monitored at LOCK pin.
Modus (101):
Phase shifted signal monitored at LOCK pin.
Modus (110):
Phase detector output monitored at LOCK pin.
Modus (111):
Demodulator output at LOCK pin. IF input at TX_DATA.
F[5:3] PAIMP[2:0] - PA capacitor array.
Array is active in RX or TX depending on INVARRAY.
000 = 0pF
001 = 1.25pF
010 = 2.5pF
011 = 3.75pF
100 = 5pF
101 = 6.25pF
110 = 7.5pF
111 = 8.75pF
F[2] INVARRAY - PA capacitor array activation.
0 = Capacitor array active in RX mode
1 = Capacitor array active in TX mode
F[1:0] PAEC[1:0] - PA buffer amplifier drive level
00 = 3mA
01 = 5mA
10 = 8mA
11 = 11mA
CC400
SWRS050 Page 26 of 32
Register G
REGISTER NAME Default
value
Active Description
G[12:11] IFQ[1:0] - IF filter Q-value
00 = low
01 =
10 =
11 = high
G[10:9] IFG[1:0] - IF amplifer gain
00 = lowest
01 =
10 =
11 = highest
G[8:6] LPIF[2:0] - IF filter low-pass cut-off
000 = lowest
001 =
010 =
011 =
100 =
101 =
110 =
111 = highest
G[5:3] HPIF[2:0] - IF filter high-pass cut-off
000 = lowest
001 =
010 =
011 =
100 =
101 =
110 =
111 = highest
G[2:0] MIF[2:0] - IF mode control, external filter selection
000 = Differential input, 1. Ceramic filter
001 = Single-ended input 1. ceramic filter
010 = Differential input, 1. and 2. ceramic filter
(NA)
011 = Single-ended input, 1. and 2. ceramic filter
(NA)
100 = Differential input, no ceramic filters filters
101 = Single-ended input, no ceramic filters
110 = NA
111 = Single-ended input, 1. Ceramic filter
Register H
REGISTER NAME Default
value
Active Description
H[12:10] LPDEM[2:0] - Demodulator data filter cut-off (low pass)
000 = 5.8kHz
001 = 9.3kHz
010 = 13.9kHz
011 = 19.9kHz
100 = 28.0kHz
101 = 36.2kHz
110 = 64.8kHz
111 = 134.2kHz
H[9] FASTACIDF 0 Demodulator datafilter AC coupling time constant
(Precharge)
0 = Normal/high time constant
1 = Low time constant (precharge)
CC400
SWRS050 Page 27 of 32
REGISTER NAME Default
value
Active Description
H[8] TOPFILT - Demodulator data filter topology
AC coupling by-pass
0 = Two AC couplings
1 = One AC coupling
H[7:6] HYSTDEM[1:0] - Demodulator data slicer comparator hysteresis
00 = 0mV
01 = 15mV
10 = 40mV
11 = 100mV
H[5:4] HPDEM[1:0] - Demodulator data filter high-pass cut-off
00 = 30Hz
01 = 60Hz
10 = 120Hz
11 = 240Hz
H[3] EXTACDF 0 Demodulator external AC-coupling
0 = Internal
1 = Eksternal (NA)
H[2] IFSIGEXT 0 IF test mode
IF signal input at TX_DATA pin
Use LOCK pin as demodulator output
0 = Normal
1 = Test mode
H[1] QUADSWING - Quadrature detector output level
0 = VDD (normal setting)
1 = Reduced amplitude (VDD/2)
H[0] IFDOFF 0 IF and demodulator Power Down (overrided by global power
down).
0 = IF and demodulator active (if PD=0 and RxTx=0). Normal
setting.
1 = IF and demodulator power down
CC400
SWRS050 Page 28 of 32
30. Package Description (SSOP-28)
10.50
9.90
Figure 13: Package Dimensions Drawing
NOTES:
A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.1mm.
D. Falls within JEDEC MO-150.
31. Soldering Information
The recommended reflow soldering profiles for SnPb eutectic and Pb-free soldering for Small
Body SMD packages are according to IPC/JEDEC J-STD-020C.
CC400
SWRS050 Page 29 of 32
32. Plastic Tube Specification
SSOP 5.3mm (.208”) antistatic tube.
Tube Specification
Package Tube Width Tube Height Tube
Length
Units per Tube
SSOP 28 10.6 4 mm 20” 47
Table 15: Plastic Tube Specification
33. Carrier Tape and Reel Specification
Carrier tape and reel is in accordance with EIA Specification 481.
Tape and Reel Specification
Package Tape Width Component
Pitch
Hole
Pitch
Reel
Diameter
Units per Reel
SSOP 28 24 mm 12 mm 4 mm 13” 2000
Table 16: Carrier Tape and Reel Specification
34. Ordering Information
Ordering part number Description
CC400-STB2 CC400 8inch wafer, SSOP28 package, standard leaded assembly,
tubes with 47 pcs per tube
CC400-STR2 CC400 8inch wafer, SSOP28 package, standard leaded assembly, T&R
with 2000 pcs per reel
CC400-RTB2 CC400 8inch wafer, SSOP28 package, RoHS compliant Pb-free
assembly, tubes with 47 pcs per tube
CC400-RTR2 CC400 8inch wafer, SSOP28 package, RoHS compliant Pb-free
assembly, T&R with 2000 pcs per reel
CC400DK CC400 Development Kit
CC400SK CC400 Sample Kit ( 5 pcs.)
Table 17: Ordering Information
CC400
SWRS050 Page 30 of 32
35. General Information
35.1. Document History
Revision Date Description/Changes
3.2 2005-05-25
Updated the following performance figures:
• Power Down current
• Receive current
• Transmit curren
• Sensitivity
• LO leakage
New varactor component (PB-free) added
Soldering information updated
New ordering information added
Document history added from revision 3.2 of the data sheet
Product Status Definitions added
Disclaimer updated
Address Information updated
Table 18: Document History
35.2. Product Status Definitions
Data Sheet Identification Product Status Definition
Advance Information Planned or Under
Development
This data sheet contains the design specifications for product development.
Specifications may change in any manner without notice.
Preliminary Engineering
Samples and First
Production
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Chipcon reserves the right to make changes at
any time without notice in order to improve design and supply the best
possible product.
No Identification Noted Full Production This data sheet contains the final specifications. Chipcon reserves the right
to make changes at any time without notice in order to improve design and
supply the best possible product.
Obsolete Not In Production This data sheet contains specifications on a product that has been
discontinued by Chipcon. The data sheet is printed for reference
information only.
Table 19: Product Status Definitions
35.3. Disclaimer
Chipcon AS believes the information contained herein is correct and accurate at the time of this printing. However,
Chipcon AS reserves the right to make changes to this product without notice. Chipcon AS does not assume any
responsibility for the use of the described product.; neither does it convey any license under its patent rights, or the
rights of others. The latest updates are available at the Chipcon website or by contacting Chipcon directly.
As far as possible, major changes of product specifications and functionality, will be stated in product specific Errata
Notes published at the Chipcon website. Customers are encouraged to sign up to the Developers Newsletter for the
most recent updates on products and support tools.
When a product is discontinued this will be done according to Chipcon’s procedure for obsolete products as
described in Chipcon’s Quality Manual. This includes informing about last-time-buy options. The Quality Manual can
be downloaded from Chipcon’s website.
Compliance with regulations is dependent on complete system performance. It is the customer's responsibility to
ensure that the system complies with regulations.
CC400
SWRS050 Page 31 of 32
35.4. Trademarks
SmartRF
®
is a registered trademark of Chipcon AS. SmartRF
®
is Chipcon's RF technology platform with RF library
cells, modules and design expertise. Based on SmartRF
®
technology Chipcon develops standard component RF
circuits as well as full custom ASICs based on customer requirements and this technology.
All other trademarks, registered trademarks and product names are the sole property of their respective owners.
35.5. Life Support Policy
This Chipcon product is not designed for use in life support appliances, devices, or other systems where malfunction
can reasonably be expected to result in significant personal injury to the user, or as a critical component in any life
support device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness. Chipcon AS customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Chipcon AS for any damages resulting
from any improper use or sale.
