BD18IA5WEFJ-E2 - ROHM Semiconductor

BD18IA5WEFJ

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

1/19

Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･14･001 9.July.2012 Rev.001

500mA Variable / Fixed Output

LDO Regulator

BDxxIA5WEFJ

●General Description

BDxxIA5WEFJ series are a LDO regulator with output current 0.5A. The output accuracy is ±1% of output voltage. With

external resistance, it is available to set the output voltage at random (from 0.8V to 4.5V) and also provides output voltage

fixed type without external resistance. It is used for the wide applications of digital appliances. It has package type:

HTSOP-J8. Over current protection (for protecting the IC destruction by output short circuit), circuit current ON/OFF switch

(for setting the circuit 0µA at shutdown mode), and thermal shutdown circuit (for protecting IC from heat destruction by over

load condition) are all built in. It is usable for ceramic capacitor and enables to improve smaller set and long-life.

●Features

■ High accuracy reference voltage circuit

■ Built-in Over Current Protection circuit (OCP)

■ Built-in Thermal Shut Down circuit (TSD)

■ With shut down switch

●Key Specifications

 Input Power Supply Voltage range: 2.4V to 5.5V

 Output voltage range(Variable type): 0.8V to 4.5V

 Output voltage(Fixed type):

1.0V/1.2V/1.5V/1.8V/2.5V/3.0V/3.3V

 Output current: 0.5A (Max.)

 Shutdown current: 0μA (Typ.)

 Operating temperature range: -25℃ to +85℃

●Typica l A pplication Circuit

●Package (Typ.) (Typ.) (Max.)

HTSOP-J8 4.90mm x 6.00mm x 1.00mm

HTSOP-J8

VO VCC

GND FIN R2

COUT

CIN

CIN,COUT : Ceramic Capacitor

VO VCC

GND FIN

S COUT

CIN

CIN,COUT : Ceramic Capacitor

Output voltage variable type Output voltage fixed type

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

●Ordering Information

B D x x I A 5 W E F J - E 2

Part

Number

Output

voltage

00 : Variable

10:1.0V

12:1.2V

15:1.5V

18:1.8V

25:2.5V

30:3.0V

33:3.3V

Voltage

resistance

I:7V

Output

current

A5:0.5A

Shutdown

switch

“W”：Built in

Package

EFJ ：HTSOP-J8

Packaging and forming specification

E2:Emboss tape reel

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

●Block Diagram

BD00IA5WEFJ(Output voltage variable type)

●Pin Configuration

●Pin Description

Pin No. Pin name Pin Function

1 VO Output pin

2 FB Feedback pin

3 GND GND pin

4 N.C. Non Connection (Used to connect GND or OPEN state.)

5 EN Enable pin

6 N.C. Non Connection (Used to connect GND or OPEN state.)

7 N.C. Non Connection (Used to connect GND or OPEN state.)

8 VCC Input pin

Reverse FIN Substrate(Connect to GND)

TOP VIEW

GND

N.C.

VCC

Fig.1 Block Diagram

GND

TSD

OCP

SOFT

START

VCC

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

●Block Diagram

BDxxIA5WEFJ(Output voltage fixed type)

●Pin Configuration

●Pin Description

Pin No. Pin name Pin Function

1 VO Output pin

2 VO_S Output voltage monitor pin

3 GND GND pin

4 N.C. Non Connection (Used to connect GND or OPEN state.)

5 EN Enable pin

6 N.C. Non Connection (Used to connect GND or OPEN state.)

7 N.C. Non Connection (Used to connect GND or OPEN state.)

8 VCC Input pin

Reverse FIN Substrate(Connect to GND)

TOP VIEW

VO_S

GND

N.C.

VCC

GND

TSD

OCP

SOFT

START

VCC

VO_S

Fig.2 Block Diagram

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

●Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Ratings Unit

Power supply voltage VCC 7.0 *1 V

EN voltage VEN 7.0 V

Power dissipation HTSOP-J8 Pd *2 2110

*2 mW

Operating Temperature Range Topr -25 to +85 ℃

Storage Temperature Range Tstg -55 to +150 ℃

Junction Temperature Tjmax +150 ℃

*1 Not to exceed Pd

*2 Reduced by 16.9mW/℃ for each increase in Ta of 1℃ over 25℃. (when mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer)

● Recommended Operating Ratings (Ta=25℃)

Ratings

Parameter Symbol

Min. Max.

Unit

Input power supply voltage VCC 2.4 5.5 V

EN voltage VEN 0.0 5.5 V

Output voltage setting range VO 0.8 4.5 V

Output current IO 0.0 0.5 A

● Electrical Characteristics (Unless otherwise noted, Ta=25℃, EN=3V, VCC=3.3V, R1=16kΩ, R2=7.5kΩ)

Limits

Parameter Symbol Min. Typ. Max.

Unit Conditions

Circuit current at shutdown mode ISD - 0 5 µA VEN=0V, OFF mode

Bias current ICC - 250 500 µA

Line regulation Reg.I - 25 50 mV VCC =( VO+0.6V )→5.5V

Load regulation Reg IO- 25 75 mV IO=0→0.5A

Minimun dropout Voltage VCO - 0.4 0.6 V VCC =3.3V, IO =0.5A

Output reference voltage(Variable type) VFB 0.792 0.800 0.808 V IO=0A

Output voltage(Fixed type) VO Vo×0.99 Vo Vo×1.01 V IO=0A

EN Low voltage VEN _Low 0 - 0.8 V

EN High voltage VEN _High 2.4 - 5.5 V

EN Bias current IEN 1 3 9 µA

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

Fig.5

Input sequence 1

Co=1µF

●Typical Performance Curves

(Unless otherwise noted, Ta=25℃, EN=3V, VCC=3.3V, R1=16kΩ, R2=7.5kΩ)

Fig.3

Transient Response (0→1.0A)

Co=1µF

Fig.4

Transient Response (1.0→0A)

Co=1µF

Fig.6

OFF sequence 1

Co=1µF

VO VO

VEN VEN

VCC VCC

VO VO

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

Fig.9

Ta-VO (IO=0mA)

Fig.10

Ta-ICC

Fig.8

OFF sequence 2

Co=1µF

Fig.7

Input sequence 2

Co=1µF

VEN VEN

VCC VCC

VO[V]

ICC[µA]

Ta[℃] Ta[℃]

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

Fig.12

Ta-IEN

Fig.13

IO-VO

Fig.14

VCC-ISD

(VEN=0V)

Fig.11

Ta-ISD

(VEN=0V)

Ta[℃]

ISD [µA]

Ta[℃]

IEN[µA]

VCC[V]

ISD [µA]

VO[V]

O[A]

9/19

BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

Fig.16

TSD (IO=0mA)

Fig.17

OCP

Fig.18

Minimum dropout Voltage 1

(VCC=3.3V, IO=-0.5A)

Fig.15

VCC-VO (IO=0mA)

VO[V]

VCC[V] Ta[℃]

Ta[℃]

O[A]

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

Fig.22

Minimum dropout Voltage 2

(VCC=2.4V, Ta=25℃)

Fig.20

IO-ICC

Fig.21

PSRR(IO=0mA)

O[A]

0.01

0.10

1.00

10.00

0 0.1 0.2 0.3 0.4 0.5

Io [A]

ESR [Ω]

Safety area

Fig.19

ESR Condencer

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

Fig.24

Minimum dropout Voltage 4

(VCC=5.0V, Ta=25℃)

Fig.23

Minimum dropout Voltage 3

(VCC=3.3V, Ta=25℃)

O[A] I

O[A]

12/19

BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

●Power dissipation

◎HTSOP-J8

Thermal design should allow operation within the following conditions. Note that the temperatures listed are the allowed

temperature limits, and thermal design should allow sufficient margin from the limits.

1. Ambient temperature Ta can be no higher than 85℃.

2. Chip junction temperature (Tj) can be no higher than 150℃.

Chip junction temperature can be determined as follows:

Calculation based on ambient temperature (Ta)

Tj=Ta+θj-a×W

＜Reference values＞

θj-a：HTSOP-J8 153.2℃/W

113.6℃/W

59.2℃/W

33.3℃/W

1-layer substrate (copper foil density 0mm×0mm)

2-layer substrate (copper foil density 15mm×15mm)

2-layer substrate (copper foil density 70mm×70mm)

4-layer substrate (copper foil density 70mm×70mm)

Substrate size: 70mm×70mm×1.6mm (substrate with thermal via)

Most of the heat loss that occurs in the BDxxIA5WEFJ series are generated from the output Pch FET. Power loss is

determined by the total VCC-VO voltage and output current. Be sure to confirm the system input and output voltage and the

output current conditions in relation to the heat dissipation characteristics of the VCC and VO in the design. Bearing in mind

that heat dissipation may vary substantially depending on the substrate employed (due to the power package incorporated

in the

BDxxIA5WEFJ make certain to factor conditions such as substrate size into the thermal design.

Power consumption [W] = Input voltage (VCC) - Output voltage (VO) ×IO (Ave)

Example) Where VCC=3.3V, VO=2.5V, IO(Ave) = 0.1A,

Power consumption [W] = 3.3V - 2.5V ×0.1A

=0.08[W]

Measure condition: mounted on a ROHM board,

and IC

Substrate size: 70mm × 70mm × 1.6mm

(Substrate with thermal via)

・Solder the substrate and package reverse

exposure heat radiation part

① IC only

θj-a=249.5℃/W

② 1-layer（copper foil are :0mm×0mm）

θj-a=153.2℃/W

③ 2-layer（copper foil are :15mm×15mm）

θj-a=113.6℃/W

④ 2-layer（copper foil are :70mm×70mm）

θj-a=59.2℃/W

⑤ 4-layer（copper foil are :70mm×70mm）

θj-a=33.3℃/W

Power Dissipation :Pd [W]

0 25 50 75 100 125 150

2.0

3.0

4.0

①0.50W

周囲温度:Ta [℃]

1.0

①0.50W

②0.82W

③1.10W

④2.11W

⑤3.76W

Ambient Temperature :Ta [℃]

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

●Input-to-Output Capacitor

It is recommended that a capacitor is placed nearby pin between Input pin and GND, output pin and GND.

A capacitor, between input pin and GND, is valid when the power supply impedance is high or drawing is long. Also as for a

capacitor, between output pin and GND, the greater the capacity, more sustainable the line regulation and it makes

improvement of characteristics by load change. However, please check by mounted on a board for the actual application.

Ceramic capacitor usually has difference, thermal characteristics and series bias characteristics, and moreover capacity

decreases gradually by using conditions.

For more detail, please be sure to inquire the manufacturer, and select the best ceramic capacitor.

●Equivalent Series Resistance ESR (Ceramic Capacitor etc.)

ESR – IO characteristics

Please attach an anti-oscillation capacitor between VOand

GND. Capacitor usually has ESR(Equivalent Series

Resistance), and operates stable in ESR-IOrange, showed

right. Generally, ESR of ceramic, tantalum and electronic

capacitor etc. is different for each, so please be sure to check

a capacitor which is going to use, and use it inside the stable

operating region, showed right. Then, please evaluate for the

actual application.

DC Bias Voltage [V]

Ceramic capacitor capacity – DC bias characteristics

(Characteristics example)

-100

-90

-80

-70

-60

-50

-40

-30

-20

-10

0 1 2 3 4

Rated Voltage：10V

B1 characteristics

Rated Voltage：4V

X6S characteristics

Capacitance Change [%]

Rated Voltage:10V

F characteristics

Rated Voltage：6.3V

B characteristics

Rated Voltage：10V

0.01

0.10

1.00

10.00

00.1 0.2 0.3 0.4 0.5

Io [A]

ESR [Ω]

Safety area

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

●Evaluation Boa r d Circuit

●Evaluation Board Parts List

Designation Value Part No. Company Designation Value Part No. Company

R1 16kΩ MCR01PZPZF1602 ROHM C4 ‐ ‐ ‐

R2 7.5kΩ MCR01PZPZF7501 ROHM C5 1μF CM105B105K16A KYOCERA

R3 ‐ ‐ ‐ C6 ‐ ‐ ‐

R4 ‐ ‐ ‐ C7 ‐ ‐ ‐

R5 ‐ ‐ ‐ C8 ‐ ‐ ‐

R6 ‐ ‐ ‐ C9 ‐ ‐ ‐

C1 1μF CM105B105K16A KYOCERA C10 ‐ ‐ ‐

C2 ‐ ‐ U1

‐ BD00IA5WEFJ ROHM

C3 ‐ ‐ U2

‐ ‐ ‐

●Board Layout

・Input capacitor CIN of VCC (Vin) should be placed very close to VCC(VIN) pin as possible, and used broad wiring pattern.

Output capacitor COUT also should be placed close to IC pin as possible. In case connected to inner layer GND plane,

please use several through hole.

・FB pin has comparatively high impedance, and is apt to be effected by noise, so floating capacity should be minimum as

possible. Please be careful in wiring drawing

・Please take GND pattern space widely, and design layout to be able to increase radiation efficiency.

・For output voltage setting

Output voltage can be set by FB pin voltage(0.800V typ.)and external resistance R1, R2.

(The use of resistors with R1+R2=1k to 90k is recommended)

VO = VFB× R1+R2

N.C

GND

FB N.C

N.C.

1 VCC

GND

SW1

FIN

GND

(

VCC VIN )

CIN

R1 R2

COUT

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

●I/O Equivalent Circuits (Output Voltage Vairable type)

8pin(VCC) / 1pin(VO) 2pin(FB) 5pin(EN)

●I/O Equivalent Circuits (Output Voltage Fix e d type )

2pin(FB)

8pin(VCC)

1pn(VO)

5pin(EN) 520kΩ

480kΩ

8pin(VCC) / 1pin(VO) 2pin(VO_S) 5pin(EN)

8pin(VCC)

1pin(VO)

2pin(VO_S) 5pin(EN) 520kΩ

480kΩ

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

●Operational Notes

(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If

any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,

such as fuses.

(2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply

lines. An external direction diode can be added.

(3) Power supply lines

Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,

separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals

to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the

circuit, not that capacitance characteristic values are reduced at low temperatures.

(4) GND voltage

The potential of GND pin must be minimum potential in all operating conditions.

(5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

(6) Off leak in high temperature.

Off-leak in high temperature may increase because of manufacturing of IC diviation.

Design in cousideration with graph of typ, worst is shown below.

(7) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error or if pins are shorted together.

(8) Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

(9) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(10) Thermal shutdown circuit

The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is

designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.

Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit

is assumed.

TSD ON Temperature[℃] (typ.) Hysteresis Temperature [℃] (typ.)

BDxxIA5WEFJ 175 15

Ta-Ileak

0.1

0.2

0.3

0.4

0.5

25 50 75 100 125 150

Temperature (℃)

Ileak (mA)

typ

worst

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

(11) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.

Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or

removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic

measure. Use similar precaution when transporting or storing the IC.

(12) Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated.

P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic

diode or transistor. For example, the relation between each potential is as follows:

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes

operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.

(13) Ground Wiring Pattern.

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change

the GND wiring pattern of any external components, either.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

Resistor Transistor (NPN)

N N N P+ P

P substrate

GND

Parasitic element

Pin A

NP+

P+

P substrate

GND

Parasitic element

Pin B CB

GND

Pin A

aras

iti

element

Pin B

Other adjacent elements

B C

GND

aras

iti

element

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

●Physical Dimension Tape and Reel Information

●Marking Diagram

xx Product Name

00 BD00IA5WEFJ

10 BD10IA5WEFJ

12 BD12IA5WEFJ

15 BD15IA5WEFJ

18 BD18IA5WEFJ

25 BD25IA5WEFJ

30 BD30IA5WEFJ

33 BD33IA5WEFJ

(Unit : mm)

HTSOP-J8

0.08 S

0.08

1.0MAX

0.85±0.05

1.27

0.08±0.08

0.42 +0.05

0.04

1.05±0.2

0.65±0.15

−

0.17 +0.05

0.03

234

568

(MAX 5.25 include BURR)

0.545

(3.2)

4.9±0.1

6.0±0.2

(2.4)

3.9±0.1

1PIN MARK

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

()

Direction of feed

Reel 1pin

HTSOP-J8(TOP VIEW)

xxIA5W

Part Number Marking

LOT Number

1PIN MARK

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BDxxIA5WEFJ Datasheet

TSZ02201-0R6R0A600170-1-2

www.rohm.com

TSZ22111･15･001 9.July.2012 Rev.001

●Revision History

Date Revision Changes

9.July.2012 001 New Release

Datasheet

Notice - Rev.003

Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Datasheet

Notice - Rev.003

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Property Rights

1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Datasheet

Notice - Rev.003

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Mouser Electronics

Authorized Distributor

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