AP2301A/AP2311A 2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments The AP2301A and AP2311A are single channel, current-limited, integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB standards and is available with both polarities of Enable input. (Top View) The devices have fast short-circuit response time for improved overall system robustness, and have integrated output discharge function to ensure completely controlled discharging of the output voltage capacitor. They provide a complete protection solution for applications subject to heavy capacitive loads and the prospect of short circuit, and offer reverse current blocking, over-current, over-temperature and short-circuit protection, as well as controlled rise time and undervoltage lockout functionality. A 7ms deglitch capability on the opendrain Flag output prevents false over-current reporting and does not require any external components. GND 1 8 NC IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG SO-8 ( Top View ) GND 1 8 NC IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG MSOP-8 /MSOP-8EP Note: latter with exposed pad (dotted line) All devices are available in SO-8, MSOP-8, MSOP-8EP, U-DFN30308 (Type E) and U-DFN2020-6 packages. (Top View) Features Single Channel Current-Limited Power Switch Output Discharge Function Fast Short-Circuit Response Time: 2s 2.5A Accurate Current Limiting Reverse Current Blocking 70m on-Resistance Input Voltage Range: 2.7V to 5.5V Built-in Soft-Start with 0.6ms Typical Rise Time Over-Current and Thermal Protection Fault Report (FLG) with Blanking Time (7ms Typ) ESD Protection: 2kV HBM, 200V MM Ambient Temperature Range: -40C to +85C SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 (Type E) and U-DFN2020-6: Available in "Green" Molding Compound (No Br, Sb) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. "Green" Device (Note 3) UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified Notes: U-DFN3030-8 (Type E) (Top View) U-DFN2020-6 Applications LCD TVs & Monitors Set-Top-Boxes, Residential Gateways Laptops, Desktops, Servers, e-Readers, Stations, HUBs Printers, Docking 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 1 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Typical Applications Circuit Enable Active High IN Power Supply 2.7V to 5.5V 0.1F 0.1F 10k Load OUT 120F FLG EN ON GND OFF Available Options Part Number Channel Enable Pin (EN) AP2301A 1 Active Low Recommended Maximum Continuous Load Current (A) 2A AP2311A 1 Typical Current Limit (A) Package 2.5A SO-8 MSOP-8 MSOP-8EP U-DFN3030-8 (Type E) U-DFN2020-6 Active High Pin Descriptions Pin Name SO-8, MSOP-8 Pin Number MSOP-8EP, U-DFN3030-8 U-DFN2020-6 (Type E) GND 1 1 2 IN 2, 3 2, 3 1 EN 4 4 3 FLG 5 5 4 OUT 6, 7 6, 7 5 NC 8 8 6 Exposed Pad -- Exposed Pad Exposed Pad AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 Function Ground Voltage Input Pin; Connect a 0.1F or larger ceramic capacitor from IN to GND as close as possible. (all IN pins must be tied together externally) Enable input, active low (AP2301A) or active high (AP2311A) Over-temperature and over-current fault reporting with 7ms deglitch; active low opendrain output. FLG is disabled for 7ms after turn-on. Voltage Output Pin All OUT pins must be tied together externally. NC: No Internal Connection; recommend tie to OUT pins Exposed pad. It should be externally connected to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. 2 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Functional Block Diagram Current Sense IN Discharge Control UVLO Driver EN OUT Current Limit FLG Deglitch Thermal Sense GND Absolute Maximum Ratings (@TA = +25C, unless otherwise specified.) Symbol ESD HBM ESD MM Parameter Human Body Model ESD Protection Machine Model ESD Protection Input Voltage (Note 4) VIN Ratings 2 200 Unit kV V -0.3 to 6.5 V VOUT Output Voltage (Note 4) -0.3 to (VIN +0.3) or 6.5 V VEN , VFLG Enable Voltage (Note 4) -0.3 to (VIN +0.3) or 6.5 V Internal Limited A +150 C -65 to +150 C ILOAD TJ(MAX) TST Notes: Maximum Continuous Load Current Maximum Junction Temperature Storage Temperature Range (Note 5) 4. All voltages referred to GND pin. Maximums are the lower of (VIN +0.3) and 6.5V. 5. UL Recognized Rating from -30C to +70C (Diodes Incorporated qualified TST from -65C to +150C). Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Recommended Operating Conditions (@TA = +25C, unless otherwise specified.) Symbol Parameter Min Max Unit 2.7 5.5 V Output Current 0 2 A V VIN Input Voltage IOUT VIL EN Input Logic Low Voltage 0 0.8 VIH EN Input Logic High Voltage 2 VIN V TA Operating Ambient Temperature -40 +85 C AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 3 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Electrical Characteristics Symbol VUVLO (@TA = +25C, VIN = +5V, CIN = 0.1F, CL = 1F, unless otherwise specified.) Parameter Input UVLO VUVLO Input UVLO Hysteresis Min Typ Max VIN rising Test Conditions 1.6 2.0 2.4 V VIN decreasing -- 50 -- mV 0.1 1 A ISHDN Input Shutdown Current Disabled, OUT = open -- IQ Unit Input Quiescent Current Enabled, OUT = open -- 60 100 A ILEAK Input Leakage Current Disabled, OUT grounded -- 0.1 1 A IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN -- 0.01 1 A TA = +25C -- 70 84 -40C TA +85C -- -- 105 TA = +25C -- 90 108 -40C TA +85C -- -- 135 -40C TA +85C VIN = 5V, IOUT= 2.0A RDS(ON) Switch On-Resistance VIN = 3.3V, IOUT = 2.0A m ILIMIT Over-Load Current Limit (Note 6) 2.05 2.50 2.85 A ITRIG Current Limiting Trigger Threshold Output Current Slew rate (<100A/s) -- 2.5 -- A ISHORT Short-Circuit Current Limit Enabled into short circuit -- 2.75 -- A tSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground) -- 2 -- s VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V -- -- 0.8 V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 -- -- V VIN = 5V, VEN = 0V and 5.5V -- 0.01 1 A ILEAK-EN EN Input Leakage VIN = 5V, VOUT = 4.5V ILEAK-O Output Leakage Current Disabled, VOUT = 0V -- 0.5 1 A tD(ON) Output Turn-on Delay Time CL= 1F, RLOAD = 5 -- 0.1 -- ms tR Output Turn-on Rise Time CL= 1F, RLOAD = 5 -- 0.6 1.5 ms tD(OFF) Output Turn-off Delay Time CL= 1F, RLOAD = 5 -- 0.1 -- ms ms Output Turn-off Fall Time CL= 1F, RLOAD = 5 -- 0.05 0.1 RFLG FLG Output FET on-Resistance IFLG = 10mA -- 25 40 IFOH FLG Off Current VFLG= 5V Assertion or deassertion due to overcurrent and overtemperature condition -- 0.01 1 A 4 7 15 ms ms tF tBLANK FLG Blanking Time tDIS Discharge Time CL= 1F, VIN = 5V, disabled to VOUT < 0.5V -- 0.6 -- RDIS Discharge Resistance (Note 7) VIN = 5V, disabled, IOUT= 1mA -- 105 -- TSHDN Thermal Shutdown Threshold Enabled -- +140 -- C THYS Thermal Shutdown Hysteresis -- -- +20 -- C Thermal Resistance Junction-toAmbient SO-8 (Note 8) MSOP-8 (Note 8) MSOP-8-EP (Note 9) U-DFN3030-8 (Type E) (Note 9) U-DFN2020-6 (Note 10) -- -- -- -- -- 96 130 92 84 90 -- -- -- -- -- C/W C/W C/W C/W C/W JA Notes: 6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN < VUVLO). The discharge function offers a resistive discharge path for the external storage capacitor for limited time. 8. Device mounted on 2" x 2" FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. 9. Device mounted on 2" x 2" FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. 10. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground. AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 4 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Typical Performance Characteristics VEN 50% VEN 50% tD(OFF) tR tD(ON) 90% tD(OFF) tR tF tD(ON) 90% VOUT 50% 50% tF 90% 90% VOUT 10% 10% 10% 10% Figure 1. Voltage Waveforms: AP2301A (Left), AP2311A (Right) All Enable Plots are for Enable Active Low Turn-On Delay and Rise Time Turn-Off Delay and Fall Time TA=25C VIN=5V CL=1F ROUT=2.5 VOUT 2V/div VEN 5V/div TA=25C VIN=5V CL=1F ROUT=2.5 VOUT 2V/div VEN 5V/div Device enabled Device disabled IIN 1A/div IIN 1A/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time TA=25C VIN=5V CL=120F ROUT=2.5 VOUT 2V/div TA=25C VIN=5V CL=120F ROUT=2.5 VOUT 2V/div VEN 5V/div Device enabled Device disabled VEN 5V/div IIN 1A/div Inrush current limit AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 IIN 1A/div 5 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Typical Performance Characteristics (Cont.) Device Enabled Into Short-Circuit Inrush Current TA=25C VIN=5V CL=120F ROUT=1 VEN 5V/div TA=25C VIN=5V ROUT=2.5 VEN 5V/div CL=120F IOUT 1A/div IOUT 1A/div Full-Load to Short-Circuit Transient Response VOUT 2V/div Output short circuited CL=220F CL=470F Short-Circuit to Full-Load Recovery Response TA=25C VIN=5V ROUT=2.5 Output short circuit removed VOUT 2V/div TA=25C VIN=5V ROUT=2.5 IIN 2A/div Device turns off and re-enables into current limit FLG 5V/div IIN 2A/div FLG 5V/div No-Load to Short-Circuit Transient Response VOUT 2V/div IIN 2A/div Short circuit present and device thermal cycles Output short circuited Short-Circuit to No-Load Recovery Response Output short circuit removed TA=25C VIN=5V ROUT=0 VOUT 2V/div TA=25C VIN=5V ROUT=0 Device enters current limit IIN 2A/div FLG 5V/div AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 Short circuit present and device thermal cycles FLG 5V/div 6 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Typical Performance Characteristics (Cont.) Short-Circuit with Blanking Time and Recovery Power ON FLG 5V/div FLG 5V/div TA=25C VIN=5V ROUT=2.5 CL=120F IOUT 1A/div TA=25C VIN=5V VOUT 5V/div VOUT 5V/div IOUT 2A/div VIN 5V/div UVLO Increasing VIN 2V/div UVLO Decreasing TA=25C VIN=5V ROUT=2.5 CL=120F VIN 2V/div IOUT 2A/div TA=25C VIN=5V ROUT=2.5 CL=120F IOUT 2A/div AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 7 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Typical Performance Characteristics (Cont.) Turn-off Time vs. Input voltage Turn-on Time vs. Input voltage 100 Turn-off Time (us) Turn-on Time (us) 90 80 70 60 50 40 CL=1F RL=5 TA=25C 30 20 10 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 260 240 220 200 180 160 140 120 100 80 60 40 20 0 2.0 2.5 3.5 4.0 4.5 5.0 5.5 6.0 5.5 6.0 Fall Time vs. Input voltage 100 90 80 Fall Time (us) Rise Time (us) Rise Time vs. Input voltage 1000 900 800 700 600 500 400 300 200 100 0 2.0 3.0 Input Voltage (V) Input Voltage (V) CL=1F RL=5 TA=25C 70 60 50 40 30 20 10 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Document number: DS37743 Rev. 2 - 2 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage (V) Input Voltage (V) AP2301A/AP2311A 2.0 8 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Typical Performance Characteristics (Cont.) Supply Current,Output Disabled vs. Temperature Supply Current,Output Enabled vs. Temperature Supply Current Output Disabled (uA) Supply Current Output Enabled (uA) 100 VIN=5.5V 90 80 VIN=5V 70 60 50 40 VIN=3.3V VIN=2.7V 30 20 10 0.30 VIN=5.5V 0.25 0.20 VIN=5V 0.15 0.10 0.05 0.00 VIN=3.3V -0.05 VIN=2.7V -0.10 -0.15 -0.20 -0.25 -0.30 0 -50 -25 0 25 50 75 100 -50 125 -25 0 Temperature (C) 50 100 125 3.0 VIN=2.7V VIN=3.3V VIN=5V VIN=5.5V VIN=2.7V 2.9 VIN=3.3V 2.8 2.7 2.6 VIN=5V 2.5 VIN=5.5V 2.4 2.3 2.2 2.1 2.0 -50 -25 0 25 50 75 100 125 -50 -25 Temperature (C) 0 25 50 75 100 125 Temperature (C) Undervoltage Lockout vs. Temperature Threshold Trip Current vs. Input Voltage 2.2 3.5 3.4 CL=120F TA=25C 2.1 2.0 Threshold Trip Current (A) Undervoltage Lockout (V) 75 Short-Circuit Output Current vs. Temperature Short-Circuit Output Current (A) RDS(ON) (m) RDS(ON) vs. Temperature 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 25 Temperature (C) UVLO Rising 1.9 1.8 UVLO Falling 1.7 3.3 3.2 3.1 3.0 2.9 2.8 2.7 2.6 1.6 -50 -25 0 25 50 75 100 125 2.5 Temperature (C) AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 9 of 17 www.diodes.com 2.0 2.5 3.0 3.5 4.0 4.5 Input Voltage (V) 5.0 5.5 6.0 February 2018 (c) Diodes Incorporated AP2301A/AP2311A Application Information Power Supply Considerations A 0.1F to 2.2F X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device maximum input rating during short circuit condition. In this case a 2.2F, or bigger capacitor is recommended. Placing a high-value electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.1F to 1.0F ceramic capacitor improves the immunity of the device to short circuit transients. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an over-current condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2301A/AP2311A senses the short circuit and immediately clamps output current to a certain safe level, namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher inrush current may flow for a very short period of time before the current limit function can react. The input capacitor(s) rapidly discharge through the device, activating current limit circuitry. Protection is achieved by momentarily opening the P-MOS high-side power switch and then gradually turning it on. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2301A/AP2311A is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7ms deglitch timeout. The AP2301A/AP2311A is designed to eliminate false, over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)x I2 Finally, calculate the junction temperature: TJ = PD x RJA + TA Where: TA= Ambient Temperature C RJA = Thermal Resistance PD = Total Power Dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2301A/AP2311A implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +140C due to excessive power dissipation in an over-current or short-circuit condition, the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately +20C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7ms deglitch. Undervoltage Lockout (UVLO) Undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 10 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Application Information (Cont.) Discharge Function The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of the output voltage when either no external output resistance or load resistance is present at the output. Dual-Purpose Port Applications AP2301A/AP2311A is suitable for use in dual-purpose port applications in which a single port is used for data communication between the host and peripheral devices, while simultaneously maintaining a charge to the battery of the peripheral device. An example of this is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. In such dual-purpose port applications, it is important to insure VIN of the AP2301A/AP2311A is ramped to its operating voltage prior to enabling the output. Since the AP2301A/AP2311A includes an embedded discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will be subject to continual discharge whenever the AP2301A/AP311A is disabled. An overstress condition to the device's discharge MOS transistor may result. Ordering Information AP23X1A X - X Enable Channel 0 : Active Low 1 : Active High 1 : 1 Channel Package (Note 12) Package Code SO-8 AP2301AM8-13 AP2301AMP-13 AP2301ASN-7 AP2311AS-13 Package Packing 7 : 7" Tape & Reel S: SO-8 13 : 13" Tape & Reel M8 : MSOP-8 MP : MSOP-8EP FGE : U-DFN3030-8 (Type E) SN : U-DFN2020-6 7"/13'' Tape and Reel Quantity Part Number Suffix Status (Note 11) Alternative S 2500 -13 In Production -- MSOP-8 M8 2500 -13 In Production -- MSOP-8EP MP 2500 -13 In Production -- U-DFN2020-6 SN 3000 -7 In Production -- SO-8 S 2500 -13 In Production -- AP2311AM8-13 MSOP-8 M8 2500 -13 NRND AP2311AMP-13 AP2311AMP-13 MSOP-8EP MP 2500 -13 In Production -- AP2311AFGE-7 U-DFN3030-8 (Type E) FGE 3000 -7 In Production -- U-DFN2020-6 SN 3000 -7 In Production -- Part Number AP2301AS-13 AP2311ASN-7 Notes: 11. AP2301AFGE-7 is End of Life and recommended alternative is AP2311AFGE-7. AP2311AM8-13 is Not Recommended for New Design (NRND) and recommended alternative is AP2311AMP-13. 12. For packaging details, go to our website at: https://www.diodes.com/design/support/packaging/diodes-packaging/. Marking Information (1) SO-8 ( Top view ) 8 7 6 5 Logo Part Number 0 : Active Low 1 : Active High YY WW XX 1 AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week XX : Internal Code AP23X 1 A 2 3 4 11 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Marking Information (Cont.) (2) MSOP-8 (Top View) 8 7 Logo 5 YWX Part Number 0 : Active Low 1 : Active High Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : Internal Code AP23X1A 2 1 (3) 6 3 4 MSOP-8EP (Top View) 8 7 Logo 5 YWXE Part Number 0 : Active Low 1 : Active High AP23X1A 1 (4) 6 2 3 MSOP-8EP Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : Internal Code 4 U-DFN3030-8 (Type E) (Top View) XX YW X (5) XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Part Number Package Identification Code AP2301AFGE-7 AP2311AFGE-7 U-DFN3030-8 (Type E) U-DFN3030-8 (Type E) 3W 3X U-DFN2020-6 (Top View) XX YW X Part Number AP2301ASN-7 AP2311ASN-7 AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Internal Code Package U-DFN2020-6 U-DFN2020-6 12 of 17 www.diodes.com Identification Code 3Y 3Z February 2018 (c) Diodes Incorporated AP2301A/AP2311A Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SO-8 E 1 b es) 7 1 0. A1 e c 4 3 A R Q 45 id All s 9 ( E1 h L E0 Gauge Plane Seating Plane SO-8 Dim Min Max Typ A 1.40 1.50 1.45 A1 0.10 0.20 0.15 b 0.30 0.50 0.40 c 0.15 0.25 0.20 D 4.85 4.95 4.90 E 5.90 6.10 6.00 E1 3.80 3.90 3.85 E0 3.85 3.95 3.90 e --1.27 h -0.35 L 0.62 0.82 0.72 Q 0.60 0.70 0.65 All Dimensions in mm D (2) Package Type: MSOP-8 D 4X 10 0.25 E x Gauge Plane Seating Plane a y L 4X10 Detail C 1 b E3 A3 A2 A e A1 E1 c MSOP-8 Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0 8 4 x 0.750 y 0.750 All Dimensions in mm See Detail C AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 13 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Package Outline Dimensions (Cont.) Please see http://www.diodes.com/package-outlines.html for the latest version. (3) Package Type: MSOP-8EP D D1 E 10 0.25 x 4X E2 Gauge Plane Seating Plane a y L 4X 1 10 8Xb e Detail C E3 A1 A3 c A2 A D E1 See Detail C (4) Package Type: U-DFN3030-8 (Type E) A U-DFN3030-8 Type E Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 2.95 3.05 3.00 D2 2.15 2.35 2.25 E 2.95 3.05 3.00 e 0.65 E2 1.40 1.60 1.50 L 0.30 0.60 0.45 Z 0.40 All Dimensions in mm A3 A1 D D2 L (x8) E E2 Z (x4) (5) MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0 8 4 x 0.750 y 0.750 All Dimensions in mm e b (x8) Package Type: U-DFN2020-6 A1 A3 A Seating Plane D D2 D2/2 R0 E E2 .10 0 E2/2 Pin #1 ID U-DFN2020-6 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 0.15 b 0.20 0.30 0.25 D 1.95 2.075 2.00 D2 1.45 1.65 1.55 e 0.65 E 1.95 2.075 2.00 E2 0.76 0.96 0.86 L 0.30 0.40 0.35 All Dimensions in mm L e AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 b 14 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SO-8 X1 Dimensions Value (in mm) C 1.27 X 0.802 X1 4.612 Y 1.505 Y1 6.50 Y1 Y C X (2) Package Type: MSOP-8 C X Y Dimensions C X Y Y1 Y1 Value (in mm) 0.650 0.450 1.350 5.300 (3) Package Type: MSOP-8EP C X G Dimensions Y Y2 C G X X1 Y Y1 Y2 Y1 X1 AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 15 of 17 www.diodes.com Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 February 2018 (c) Diodes Incorporated AP2301A/AP2311A Suggested Pad Layout (Cont.) Please see http://www.diodes.com/package-outlines.html for the latest version. (4) Package Type: U-DFN3030-8 (Type E) X (x8) C Y (x8) Y1 Dimensions C C1 X Y Y1 Y2 Y2 Value (in mm) 0.65 2.35 0.30 0.65 1.60 2.75 C1 (5) Package Type: U-DFN2020-6 X C G Y Dimensions C G X X1 Y Y1 Y1 Value (in mm) 0.65 0.15 0.37 1.67 0.45 0.90 G X X1 AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 16 of 17 www.diodes.com February 2018 (c) Diodes Incorporated AP2301A/AP2311A IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2018, Diodes Incorporated www.diodes.com AP2301A/AP2311A Document number: DS37743 Rev. 2 - 2 17 of 17 www.diodes.com February 2018 (c) Diodes Incorporated