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Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. User's Manual The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. H8/38086R Group 16 Hardware Manual Renesas 16-Bit Single-Chip Microcomputer H8 Family/H8/300H Super Low Power Series H8/38086RF H8/38086R H8/38085R H8/38084R H8/38083R Rev.3.00 2006.08 Keep safety first in your circuit designs! 1. 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Rev. 3.00 Aug 23, 2006 Page ii of lxxviii General Precautions on Handling of Product 1. Treatment of NC Pins Note: Do not connect anything to the NC pins. The NC (not connected) pins are either not connected to any of the internal circuitry or are used as test pins or to reduce noise. If something is connected to the NC pins, the operation of the LSI is not guaranteed. 2. Treatment of Unused Input Pins Note: Fix all unused input pins to high or low level. Generally, the input pins of CMOS products are high-impedance input pins. If unused pins are in their open states, intermediate levels are induced by noise in the vicinity, a passthrough current flows internally, and a malfunction may occur. 3. Processing before Initialization Note: When power is first supplied, the product's state is undefined. The states of internal circuits are undefined until full power is supplied throughout the chip and a low level is input on the reset pin. During the period where the states are undefined, the register settings and the output state of each pin are also undefined. Design your system so that it does not malfunction because of processing while it is in this undefined state. For those products which have a reset function, reset the LSI immediately after the power supply has been turned on. 4. Prohibition of Access to Undefined or Reserved Addresses Note: Access to undefined or reserved addresses is prohibited. The undefined or reserved addresses may be used to expand functions, or test registers may have been be allocated to these addresses. Do not access these registers; the system's operation is not guaranteed if they are accessed. Rev. 3.00 Aug 23, 2006 Page iii of lxxviii Configuration of This Manual This manual comprises the following items: 1. General Precautions on Handling of Product 2. Configuration of This Manual 3. Preface 4. Main Revisions for This Edition The list of revisions is a summary of points that have been revised or added to earlier versions. This does not include all of the revised contents. For details, see the actual locations in this manual. 5. Contents 6. Overview 7. Description of Functional Modules * CPU and System-Control Modules * On-Chip Peripheral Modules The configuration of the functional description of each module differs according to the module. However, the generic style includes the following items: i) Feature ii) Input/Output Pin iii) Register Description iv) Operation v) Usage Note When designing an application system that includes this LSI, take notes into account. Each section includes notes in relation to the descriptions given, and usage notes are given, as required, as the final part of each section. 8. List of Registers 9. Electrical Characteristics 10. Appendix 11. Index Rev. 3.00 Aug 23, 2006 Page iv of lxxviii Preface H8/38086R Group is single-chip microcomputers made up of the high-speed H8/300H CPU employing Renesas Technology original architecture as their cores, and the peripheral functions required to configure a system. The H8/300H CPU has an instruction set that is compatible with the H8/300 CPU. Target Users: This manual was written for users who will be using the H8/38086R Group in the design of application systems. Target users are expected to understand the fundamentals of electrical circuits, logical circuits, and microcomputers. Objective: This manual was written to explain the hardware functions and electrical characteristics of the H8/38086R Group to the target users. Refer to the H8/300H Series Software Manual for a detailed description of the instruction set. Notes on reading this manual: * In order to understand the overall functions of the chip Read the manual according to the contents. This manual can be roughly categorized into parts on the CPU, system control functions, peripheral functions, and electrical characteristics. * In order to understand the details of the CPU's functions Read the H8/300H Series Software Manual. * In order to understand the details of a register when its name is known Read the index that is the final part of the manual to find the page number of the entry on the register. The addresses, bits, and initial values of the registers are summarized in section 24, List of Registers. Example: Register name: The following notation is used for cases when the same or a similar function, e.g. serial communication interface, is implemented on more than one channel: XXX_N (XXX is the register name and N is the channel number) Bit order: The MSB is on the left and the LSB is on the right. Rev. 3.00 Aug 23, 2006 Page v of lxxviii Notes: When using an on-chip debugger (such as the E7 or E8) for H8/38086R program development and debugging, the following restrictions must be noted. 1. The NMI pin is reserved for the on-chip debugger, and cannot be used. 2. Pins P16, P36, and P37 cannot be used. In order to use these pins, additional hardware must be provided on the user board. 3. Area H'C000 to H'CFFF is used by the on-chip debugger, and is not available to the user. 4. Area HF380 to HF77F must on no account be accessed. 5. When the on-chip debugger is used, address breaks can be set as either available to the user or for use by the on-chip debugger. If address breaks are set as being used by the on-chip debugger, the address break control registers must not be accessed. 6. When the on-chip debugger is used, NMI is an input pin, P16 and P36 are input pins, and P37 is an output pin. 7. When on-board programming/erasing is performed in boot mode, the SCI3 (P41/RXD and P42/TXD) is used. 8. When using the on-chip debugger, set the FROMCKSTP bit in clock halt register 1 to 1. Related Manuals: The latest versions of all related manuals are available from our web site. Please ensure you have the latest versions of all documents you require. http://www.renesas.com/ H8/38086R Group manuals: Document Title Document No. H8/38086R Group Hardware Manual This manual H8/300H Series Software Manual REJ09B0213 User's manuals for development tools: Document Title Document No. H8S, H8/300 Series C/C++ Compiler, Assembler, Optimizing Linkage Editor User's Manual REJ10B0058 H8S, H8/300 Series Simulator/Debugger User's Manual ADE-702-282 H8S, H8/300 Series High-performance Embedded Workshop 3 Tutorial REJ10B0024 H8S, H8/300 Series High-performance Embedded Workshop 3 User's Manual REJ10B0026 Rev. 3.00 Aug 23, 2006 Page vi of lxxviii Application notes: Document Title Document No. F-ZTAT Microcomputer On-Board Programming REJ05B0523 Rev. 3.00 Aug 23, 2006 Page vii of lxxviii Rev. 3.00 Aug 23, 2006 Page viii of lxxviii Main Revisions for This Edition Item Page Revision (See Manual for Details) All -- (Before) E7 (After) on-chip debugger Preface vi When using an on-chip debugger (such as the E7 or E8) for H8/38086R program development and debugging, ... 1.1 Features 2 * Compact package Table amended 1.2 Internal Block Diagram 3 Code Old Code Body Size Pin Pitch QFP-80 PRQP0080JB-A FP-80A 14 x 14 mm 0.65 mm TQFP-80 PTQP0080KC-A TFP-80C P-TFLGA-85 PTLG0085JA-A TLP-85V Figure 2.1 Memory Map 0.5 mm 0.65 mm Note 2 amended 19 Table amended Pin No. Type FP-80A, TFP-80C TLP-85V Pad No.*1 Pad No.*2 I/O Functions 80 A3 81 80 I/O Pins for the TGR1A input capture input or output compare output, or PWM output. TIOCB1 1 B1 1 1 Input Pins for the TGR1B input capture input. TIOCA2 2 C1 2 2 I/O Pins for the TGR2A input capture input or output compare output, or PWM output. TIOCB2 3 B2 3 3 Input Pins for the TGR2B input capture input. Symbol 16-bit timer TIOCA1 pulse unit (TPU) 2.1 Address Space and Memory Map 12 x 12 mm 7 x 7 mm Remarks 2. The SCK4, SI4, SO4, and NMI pins are not available when the E7 or on-chip debugger is used. Figure1.1 Internal Block Diagram of H8/38076R Group 1.4 Pin Functions Table 1.4 Pin Functions Package 26 Note amended Note: The areas from H'C000 to H'CFFF and from H'F380 to H'F77F are used by the on-chip debugger. They are not available to the user when the on-chip debugger is being used. Rev. 3.00 Aug 23, 2006 Page ix of lxxviii Item Page Revision (See Manual for Details) 2.8.3 Bit-Manipulation 57 Instruction * Prior to executing BSET instruction 59 * Prior to executing BCLR instruction MOV.B #H'80, R0L MOV.B #H'3F, R0L 3.1 Exception Sources and Vector Address 62 Table 3.1 Exception Sources and Vector Address 3.2 Reset 63, 64 3.3 Interrupts 65 Table amended Source Origin Exception Sources Vector Number Vector Address Address break Break conditions satisfied 5 H'000A to H'000B Internal interrupts* 19 to 43 H'0026 to H'0057 Priority Low Replaced Description amended .. The interrupt controller can set interrupts other than NMI to one of three mask levels in order to control multiple interrupts. The interrupt priority registers A to E (IPRA to IPRE) of the interrupt controller set the interrupt mask level. 3.5.1 Notes on Stack 68 Area Use Description amended To save register values, use PUSH.W Rn (MOV.W Rn, @-SP) or PUSH.L ERn (MOV.L ERn, @-SP). To restore register values, use POP.W Rn (MOV.W @SP+, Rn) or POP.L ERn (MOV.L @SP+, ERn). During interrupt exception handling or when an RTE instruction is executed, CCR contents are saved and restored in word size. Section 4 Interrupt Controller 4.1 Features 73 Description amended * Mask levels settable with IPR An interrupt priority register (IPR) is provided for setting interrupt mask levels. Three mask levels can be set for each module for all interrupts except NMI and address break. Rev. 3.00 Aug 23, 2006 Page x of lxxviii Item Page 4.3.8 Interrupt Priority 84 Registers A to E (IPRA to IPRE) Revision (See Manual for Details) Description amended IPR sets mask levels (levels 2 to 0) for interrupts other than NMI and address break. ... Setting a value in the range from H'0 to H'3 in the 2-bit groups of bits 7 and 6, 5 and 4, 3 and 2, and 1 and 0 sets the mask level of the corresponding interrupt. ... Table amended (Before) Priority level (After) Mask level 4.3.9 Interrupt Mask Register (INTM) 85 4.4.1 External Interrupts 86 Table amended (Before) Priority level (After) Mask level (2) WKP7 to WKP0 Interrupts ... The interrupt mask level can be set by IPR. (3) IRQ4, IRQ3, IRQ1, and IRQ0 Interrupts ... The interrupt mask level can be set by IPR. (4) IRQAEC Interrupts ... The interrupt mask level can be set by IPR. 4.4.2 Internal Interrupts 87 * The interrupt mask level can be set by IPR. 4.5 Interrupt Exception Handling Vector Table 87 Description amended ... The lower the vector number, the higher the priority. The priority within a module is fixed. Mask levels for Interrupts other than NMI and address break can be modified by IPR. Rev. 3.00 Aug 23, 2006 Page xi of lxxviii Item Page Revision (See Manual for Details) 4.6 Operation 90 Table amended (Before) priority level (After) mask level Table 4.3 Interrupt Control States 90, 91 Description amended 2. The following control operations are performed by referencing the INTM1 and INTM0 bits in INTM and the I bit in CCR. * When the I bit is set to 1, the interrupt request is held pending. * When the I bit is cleared to 0 and the INTM1 bit is set to 1, interrupts with mask level 1 or below are held pending. * When the I bit is cleared to 0, the INTM1 bit is cleared to 0, and the INTM0 bit is set to 1, interrupt requests with mask level 0 are held pending. * When the I bit, INTM1 bit, and INTM0 bit are all cleared to 0, all interrupt requests are accepted. 3. If contention occurs between interrupts that are not held pending by the INTM1 and INTM0 bits in the INTM register and the I bit in CCR, the interrupt with the highest priority as shown in table 4.2 is selected, regardless of the IPR setting. Figure 4.2 Flowchart of Procedure Up to Interrupt Acceptance 92 Figure amended Program execution state Interrupt generated? No Yes Yes NMI or address break? No INTM1 = 0? INTM0 = 0? No Yes INTM1 = 0? INTM0 = 1? No I = 0? Yes No Yes Mask level 1 or 2 interrupt? No Mask level 2 interrupt? Yes No Yes No I = 0? I = 0? Yes Yes Rev. 3.00 Aug 23, 2006 Page xii of lxxviii No Item Page Revision (See Manual for Details) 4.6.1 Interrupt Exception Handling Sequence 93 Figure amended (Before) Address bus (After) Internal address bus (Before) RD (After) Internal read signal Figure 4.3 Interrupt Exception Handling Sequence 4.6.2 Interrupt Response Times (Before) HWR, LWR (After) Internal write signal (Before) D15 to D0 (After) Internal data bus 94 Table 4.4 Interrupt Response Times (States) Table amended No. Execution Status Number of States 1 Interrupt mask level determination 1 or 2* 1 Note 1 amended 1. One state for internal interrupts and two states for external interrupts. 4.7.2 Instructions that 96 Disable Interrupts Section 5 Clock Pulse Generators 98 Figure amended on-chip oscillator OSC1 OSC2 101 Figure 5.2 Typical Connection to Crystal Resonator 5.2.4 On-Chip Oscillator Selection Method (Supported only by the Masked ROM Version) When an interrupt request is generated, an interrupt is request is sent to the CPU after the interrupt controller has determined the mask level. IRQAEC Figure 5.1 Block Diagram of Clock Pulse Generators (Masked ROM Version) (2) 5.2 System Clock Generator Description amended ROSC OSC (fOSC) Figure amended Frequency 4.19 MHz 102 System clock oscillator Manufacturer C1, C2 Product Type Recommendation Value Kyocera Kinseki HC-491U-S Corporation 22 pF 20% Description amended ... The setting takes effect when the rest is cleared. When the onchip oscillator is selected, ... Rev. 3.00 Aug 23, 2006 Page xiii of lxxviii Item Page Revision (See Manual for Details) 5.3.1 Connecting 32.768-kHz/38.4-kHz Crystal Resonator 103 Description amended Clock pulses can be supplied to the subclock generator by connecting a 32.768-kHz or 38.4-kHz crystal resonator, ... Figure 5.5 Typical Connection to 32.768-kHz/38.4-kHz Crystal Resonator Figure amended Manufacturer Products Name C1, C2 Recommendation Value Equivalent Series Resistance Epson Toyocom C-4-TYPE 7 pF 30 k max C-001R 7 pF 35 k max Frequency 38.4 kHz 32.768 kHz Epson Toyocom Figure 5.6 Equivalent 104 Circuit of 32.768kHz/38.4-kHz Crystal Resonator 104 Figure amended Co = 0.9 pF(typ.) Rs = 35 k (max.) Description added Notes on Use of Subclock Generator Circuit The drive capacity of the subclock generator circuit is limited in order to reduce current consumption when operating in the subclock mode. As a result, there may not be sufficient additional margin to accommodate some resonators. Be sure to select a resonator with an equivalent series resistance (RS) corresponding to that shown in figure 5.6. 5.3.3 External Clock 105 Title amended Input Method 5.4.1 Prescaler S Description amended The output from prescaler S is shared by the on-chip peripheral In active (medium-speed) mode and sleep modules. (medium-speed) mode, 5.5.3 Definition of 108, 109 Replaced Oscillation Stabilization Wait Time 5.5.6 Note on Using Power-On Reset Circuit 110 Description amended The LSI's internal power-on reset circuit can be adjusted by connecting an external capacitor to the RES pin. Adjust the capacitance of the external capacitor to ensure sufficient oscillation stabilization time before reset clearing. For details, see section 22, Power-On Reset Circuit. Rev. 3.00 Aug 23, 2006 Page xiv of lxxviii Item Page 6.1.1 System Control 112 Register 1 (SYSCR1) 6.1.2 System Control Register 2 (SYSCR2) 114 Revision (See Manual for Details) Table amended Bit Bit Name Initial Value R/W Description 6 5 4 STS2 STS1 STS0 0 0 0 R/W R/W R/W When an external clock is to be used, the minimum value (STS2 = 1, STS1 = 0, STS0 = 1) is recommended. If the internal oscillator is used, the settings CTCS2 = 0, STS = 1, and STS0 = 0 are recommended. If the setting other than the recommended value is made, operation may start before the end of the waiting time. Table amended Bit Bit Name Initial Value R/W 4 NESEL 1 R/W Description Noise Elimination Sampling Frequency Select The subclock pulse generator generates the watch clock signal (W) and the system clock pulse generator generates the oscillator clock (OSC). This bit selects the sampling frequency of OSC when W is sampled. When OSC = 2 to 10 MHz, clear this bit to 0. Set it to 1 if the internal oscillator is used. 0: Sampling rate is OSC/16. 1: Sampling rate is OSC/4. 1 SA1 0 R/W Subactive Mode Clock Select 1 and 0 0 SA0 0 R/W Select the operating clock frequency in subactive and subsleep modes. The values of SA1 and SA0 do not change if they are written to in subactive mode. 00: W/8 01: W/4 1X: W/2 6.1.3 Clock Halt Registers 1 and 2 (CKSTPR1 and CKSTPR2) 115 Table amended Bit Bit Name 1 4 Initial Value R/W 1 R/W* 7 S4CKSTP* * 1 FROMCKSTP* *4 1 Description 1 SCI4 Module Standby SCI4 enters standby mode when this bit is cleared to 0. 1 R/W Flash Memory Module Standby Flash memory enters standby mode when this bit is cleared to 0. Rev. 3.00 Aug 23, 2006 Page xv of lxxviii Item Page 6.2 Mode Transitions 118 and States of LSI Figure 6.1 Mode Transition Diagram Table 6.2 Transition Mode after SLEEP Instruction Execution and Interrupt Handling Table 6.3 Internal State in Each Operating Mode 120 Revision (See Manual for Details) Note amended A transition between different modes cannot be made to occur simply because an interrupt request is generated. Make sure to enable interrupt requests. Table amended Transition Mode after State SLEEP Transition Before Instruction Mode due to Transition LSON MSON SSBY TMA3 DTON Execution Interrupt Active (mediumspeed) mode 122 Symbol in Figure 6.1 0 0 0 * 1 Active (highspeed) mode (direct transition) f 0 1 0 * 1 Active (mediumspeed) mode (direct transition) Note amended Subactive Watch Mode Mode Function Peripheral modules Subsleep Mode Standby Mode Functioning/ Functioning/ 8 8 retained* retained* Functioning/ 8 retained* RTC Functioning/ 8 retained* Asynchronous event counter Functioning*5 Functioning Timer F Functioning/ retained*6 TPU Retained WDT Functioning* / retained Functioning* / Functioning* / Functioning* / retained retained retained SCI3/IrDA R eset Functioning/ Functioning/ retained*2 retained*2 7 Functioning*5 Functioning Functioning/r Functioning/ etained*6 retained*6 Retained Retained Retained Retained 7 7 7 Reset Notes: 5. Only incrementing of the external event timer by ECL/ECH and overflow interrupts operate. 6. Functioning if w/4 is selected as an internal clock. Halted and retained otherwise. 7. Functioning if the on-chip oscillator is selected. 8. Functioning if the internal time keeping time-base function is selected and retained if the interval timer is selected. Rev. 3.00 Aug 23, 2006 Page xvi of lxxviii Item Page Revision (See Manual for Details) 6.2.5 Subactive Mode 125 Description amended stops but In subactive mode, the system clock oscillator on-chip peripheral modules other than TPU, IIC2, the A/D converter, the A/D converter, and PWM function. The operating frequency of subactive mode is selected from W/2, W/4, and W/8 by the SA1 and SA0 bits in SYSCR2. 6.3 Direct Transition 126 Description amended ... operating frequency modification in active mode. ... If the direct transition interrupt is disabled by IENR2, no direct transition takes place and a transition is made instead to sleep or watch mode. Note: If a direct transition is attempted while the I bit in CCR is set to 1, the device remains in sleep or watch mode, and recovery is not possible. 6.3.1 Direct Transition 127 from Active (HighSpeed) Mode to Active (Medium-Speed) Mode 6.3.2 Direct Transition 128 from Active (HighSpeed) Mode to Subactive Mode Description amended Example: When OSC/8 is selected as the CPU operating clock following transition Direct transition time = (2 + 1) x 1tosc + 14 x 8tosc = 115tosc Description amended Example: When osc/8 is selected as the CPU operating clock following transition Direct transition time = (2 + 1) x 1tosc + 14 x 1tsubcyc = 3tosc + 14tsubcyc 6.3.3 Direct Transition from Active (MediumSpeed) Mode to Active (High-Speed) Mode Description amended 6.3.4 Direct Transition 129 from Active (MediumSpeed) Mode to Subactive Mode Description amended 6.3.5 Direct Transition from Subactive Mode to Active (High-Speed) Mode 6.3.6 Direct Transition 130 from Subactive Mode to Active (MediumSpeed) Mode Example: When OSC/8 is selected as the CPU operating clock before transition Direct transition time = (2 + 1) x 8tosc + 14 x 1tosc = 38tosc Example: When osc/8 is selected as the CPU operating clock before transition Direct transition time = (2 + 1) x 8tosc + 14 x 1tsubcyc = 24tosc + 14tsubcyc Description amended Example: When w/8 is selected as the CPU operating clock before transition and wait time = 8192 states Direct transition time = (2 + 1) x 8tw + (8192 + 14) x tosc = 24tw + 8206tosc Description amended Example: When w/8 is selected as the CPU operating clock before transition, OSC/8 is selected as the CPU operating clock following transition, and the wait time is 8,192 states Direct transition time = (2 + 1) x 8tw + (8192 + 14) x 8tosc = 24tw + 65648tosc Rev. 3.00 Aug 23, 2006 Page xvii of lxxviii Item Page Revision (See Manual for Details) 7.3 On-Board Programming Modes 142 ... The boot program transfers the programming control program from the externally-connected host to on-chip RAM via SCI3 (channel 2). ... 7.6 Programmer Mode 153 7.8 Notes on Setting 154 Module Standby Mode 9.1.5 Pin Functions Description amended ... with the on-chip 64-kbyte flash memory (FZTAT64V3). 163 Description amended Even if an interrupt source occurs while the interrupt is enabled in module standby mode, program runaway may occur because the vector cannot be fetched. Description amended * P15/TIOCB2 pin TPU Channel 2 Setting Next table (1) Next table (2) Next table (3) PCR15 0 1 0 1 Pin Function P15 input pin P15 output pin P15 input pin P15 output pin TIOCB2 input pin* Note: * When the MD1 and MD0 bits are set to B'00 and the IOB3 bit to 1, the pin function becomes the TIOCB2 input pin. Clear PCR15 to 0 when using TIOCB2 as an input pin. (2) (3) B'0000 B'1xxx TPU Channel 2 Setting MD1, MD0 IOB3 to IOB0 (1) B'00 B'10, B'01, B'11 B'0001 to B'0111 CCLR1, CCLR0 Output Function [Legend] 164 B'xxxx B'xx Setting prohibited x: Don't care. * P14/TIOCA2/TCLKC pin Notes: 1. When the MD1 and MD0 bits are set to B'00 and the IOA3 bit to 1, the pin function becomes the TIOCA2 input pin. Clear PCR14 to 0 when using TIOCA2 as an input pin. 2. When the TPSC2 to TPSC0 bits in TCR_2 are set to B'110, the pin function becomes the TCLKC input pin. Clear PCR14 to 0 when using TCLKC as an input pin. TPU Channel 2 Setting (2) (1) (2) B'1x B'10 B'11 B'0000 B'0100 B'1xxx B'0001 to B'0011 B'0101 to B'0111 B'xx00 Other than B'xx00 Other than B'xx00 CCLR1, CCLR0 Other than B'01 B'01 Output Function Output compare output PWM mode 1* output PWM mode 2 output MD1, MD0 IOA3 to IOA0 [Legend] Note: * Rev. 3.00 Aug 23, 2006 Page xviii of lxxviii B'00 x: Don't care. The output of the TIOCB2 pin is disabled. (1) (1) (2) Item Page Revision (See Manual for Details) 9.1.5 Pin Functions 165 Description amended * P13/TIOCB1/TCLKB pin TPU Channel 1 Setting Next table (1) Next table (2) Next table (3) PCR13 0 1 0 1 Pin Function P13 input pin P13 output pin P13 input pin P13 output pin TIOCB1 input pin TCLKB input pin* Note: * When the TPSC2 to TPSC0 bits in TCR_1 or TCR_2 are set to B'101, the pin function becomes the TCLKB input pin. Clear PCR13 to 0 when using TCLKB as an input pin. TPU Channel 1 Setting (2) (3) B'0000 B'1xxx MD1, MD0 IOB3 to IOB0 (1) B'00 B'10, B'01, B'11 B'0001 to B'0111 CCLR1, CCLR0 Output Function [Legend] 166 B'xxxx B'xx Setting prohibited x: Don't care. * P12/TIOCA1/TCLKA pin Notes: 1. When the MD1 and MD0 bits are set to B'00 and the IOA3 bit to 1, the pin function becomes the TIOCA1 input pin. Clear PCR12 to 0 when using TIOCA1 as an input pin. 2. When the TPSC2 to TPSC0 bits in TCR_1 or TCR_2 are set to B'100, the pin function becomes the TCLKA input pin. Clear PCR12 to 0 when using TCLKA as an input pin. TPU Channel 1 Setting (2) (1) (2) B'1x B'10 B'11 B'0000 B'0100 B'1xxx B'0001 to B'0011 B'0101 to B'0111 B'xx00 Other than B'xx00 Other than B'xx00 CCLR1, CCLR0 Other than B'01 B'01 Output Function Output compare output PWM mode 1* output PWM mode 2 output MD1, MD0 IOA3 to IOA0 [Legend] Note: * B'00 (1) (1) (2) x: Don't care. The output of the TIOCB1 pin is disabled. Rev. 3.00 Aug 23, 2006 Page xix of lxxviii Item Page Revision (See Manual for Details) 9.2.5 Pin Functions 171 Description amended * P32/TXD32/SCL pin The pin function is switched as shown below according to the combination of the PCR32 bit in PCR3, ICE bit in ICRR1, TE bit in SCR32, and SPC32 bit in SPCR. ICE 0 1 SPC32 0 1 x TE x x x PCR32 Pin Function [Legend] Note: * 0 1 x x P32 input pin P32 output pin TXD32 output pin* SCL I/O pin x: Don't care. If SPC32 is set to 1 and TE is cleared to 0, the mark state is entered and 1 is output from the TXD32 output pin. * P31/RXD32/SDA pin The pin function is switched as shown below according to the combination of the PCR31 bit in PCR3, ICE bit in ICCR1, and RE bit in SCR32. ICE 0 RE PCR31 Pin Function [Legend] 172 1 0 1 x 0 1 x x P31 input pin P31 output pin RXD32 output pin SDA I/O pin x: Don't care. * P30/SCK32/TMOW pin The pin function is switched as shown below according to the combination of the TMOW bit in PMR3, PCR30 bit in PCR3, CKE 1 and CKE 0 bits in SCR32, and COM bit in SMR32. TMOW 0 CKE 1 CKE 0 0 COM 0 PCR30 Pin Function [Legend] 9.3.3 Port Mode Register 4 (PMR4) 175 1 0 1 1 x 1 x x x x x 0 1 x x x P30 input pin P30 output pin SCK32 output pin SCK32 input pin TMOW output pin x: Don't care. Description amended Bit Bit Name Initial Value R/W Description 0 TMIF 0 R/W P40/SCK31/TMIF Pin Function Switch Selects whether pin P40/SCK31/TMIF is used as P40/SCK31 or as TMIF. 0: P40/SCK31 I/O pin 1: TMIF input pin Rev. 3.00 Aug 23, 2006 Page xx of lxxviii Item Page Revision (See Manual for Details) 9.3.4 Pin Functions 176 Description amended * P42/TXD31/IrTXD/TMOFH pin TMOFH 0 1 TE x x IrE x Pin Function [Legend] Note: * 1 x 1 x x x P42 input pin P42 output pin TXD31 output pin* IrTXD output pin* TMOFH output pin x: Don't care. If SPC31 is set to 1 and TE is cleared to 0, the mark state is entered, 1 is output from the TXD32 output pin, and 0 is output from the IrTXD pin. * P40/SCK31/TMIF pin 0 CKE1 1 0 COM 1 0 PCR40 Pin Function [Legend] 1 0 CKE0 192 x 0 TMIF 9.8.4 Pin Functions x 0 PCR42 177 1 0 SPC31 1 x x 0 1 x x x x 0 1 x x x x P40 input pin P40 output pin SCK31 output pin SCK31 input pin Setting prohibited TMIF input pin x: Don't care. Description amended * P92/IRQ4 pin IRQ4 0 PCR92 Pin Function 9.9.3 Pin Functions 194, 195 Replaced 9.10.3 Pin Functions 198 1 0 1 0 1 P92 input pin P92 output pin IRQ4 input pin Setting prohibited Description amended * PB2/AN2/IRQ3 pin IRQ3 Other than B'0110 B'0110 x Pin Function PB2 input pin AN2 input pin IRQ3 input pin [Legend] 199 1 0 CH3 to CH0 x: Don't care. * PB1/AN1/IRQ1 pin IRQ1 0 1 CH3 to CH0 Other than B'0101 B'0101 x Pin Function PB1 input pin AN1 input pin IRQ1 input pin [Legend] x: Don't care. Rev. 3.00 Aug 23, 2006 Page xxi of lxxviii Item Page Revision (See Manual for Details) 9.10.3 Pin Functions 199 Description amended * PB0/AN0/IRQ0 pin IRQ0 0 Other than B'0100 B'0100 x Pin Function PB0 input pin AN0 input pin IRQ0 input pin [Legend] 9.11.1 Serial Port Control Register (SPCR) 201 1 CH3 to CH0 x: Don't care. Table amended (Before) output data (After) the output data polarity (Before) input data (After) the input data polarity 9.12.1 How to Handle 202 Unused Pin Description amended * If an unused pin is an output pin, it is recommended to handle it in one of the following ways: Set the output of the unused pin to high and pull it up to Vcc with an external resistor of approximately 100 k. Set the output of the unused pin to low and pull it down to GND with an external resistor of approximately 100 k. 10.3.5 RTC Control 208 Register 1 (RTCCR1) Table amended Bit Bit Name Initial Value R/W Description 3 -- 0 R/W Reserved 2 to 0 -- All 0 -- Only 0 can be written to this bit. Reserved These bits are always read as 0. 10.3.7 Clock Source Select Register (RTCCSR) 210 Description amended ... A free running counter controls start/stop of counter operation by the RUN bit in RTCCR1. When a clock other than w/4 is selected, ... Bit Bit Name Initial Value R/W Description 3 RCS3 1 R/W Clock Source Selection 2 RCS2 0 R/W 0000: /8 Free running counter operation 1 RCS1 0 R/W 0001: /32 Free running counter operation 0 RCS0 0 R/W 0010: /128 Free running counter operation 0011: /256 Free running counter operation 0100: /512 Free running counter operation 0101: /2048 Free running counter operation 0110: /4096 Free running counter operation 0111: /8192 Free running counter operation 1000: w/4 RTC operation Settings other than the above are prohibited. Rev. 3.00 Aug 23, 2006 Page xxii of lxxviii Item Page Revision (See Manual for Details) 10.4.2 Initial Setting Procedure 212 Figure amended Figure 10.3 Initial Setting Procedure RUN in RTCCR1 = 0 RST in RTCCR1 = 1 RST in RTCCR1 = 0 Set RTCCSR, RSECDR, RMINDR, RHRDR, RWKDR, 12/24 in RTCCR1, and PM RUN in RTCCR1 = 1 10.6.2 Notes on Using Interrupts 215 Added 11.6.1 16-Bit Timer Mode 228 Description amended 11.6.2 8-Bit Timer Mode 228 RTC operation is stopped. RTC registers and clock count controller are reset. Clock output and clock source are selected and second, minute, hour, day-of-week, operating mode, and a.m/p.m are set. RTC operation is started. If an OCRFL write and compare match signal generation occur simultaneously, the compare match signal is invalid. However, a compare match signal may or may not be generated when the written data and the counter value match. ... Description amended (1) TCFH, OCRFH If an OCRFH write and compare match signal generation occur simultaneously, the compare match signal is invalid. However, a compare match signal may or may not be generated when the written data and the counter value match. ... 229 Description amended (2) TCFL, OCRFL If an OCRFL write and compare match signal generation occur simultaneously, the compare match signal is invalid. However, a compare match signal may or may not be generated when the written data and the counter value match. ... 11.6.3 Flag Clearing 229 Description amended For ST of (1) formula, please substitute the longest number of execution states in used instruction. Rev. 3.00 Aug 23, 2006 Page xxiii of lxxviii Item Page Revision (See Manual for Details) Section 12 16-Bit Timer Pulse Unit (TPU) 233 Description amended A maximum 2-phase PWM output is possible in combination with synchronous operation 12.1 Features Table 12.1 TPU Functions 234 Table amended Item Compare match output Figure 12.1 Block Diagram of TPU 235 Channel 1 Channel 2 0 output O -- 1 output O -- Toggle output O -- Figure amended Input/output pins Channel 1: Channel 2: TIOCA1 TIOCA2 Input pins Channel 1: Channel 2: 12.2 Input/Output Pins Table 12.2 Pin Configuration 235 TIOCB1 TIOCB2 Table amended Channel Symbol I/O Common TCLKA Input Function External clock A input pin TCLKB Input External clock B input pin TCLKC Input External clock C input pin 1 TIOCA1 I/O TGRA_1 input capture input/output compare output/PWM output pin TIOCB1 Input TGRB_1 input capture input 2 TIOCA2 I/O TGRA_2 input capture input/output compare output/PWM output pin TIOCB2 Input TGRB_2 input capture input Rev. 3.00 Aug 23, 2006 Page xxiv of lxxviii Item Page Revision (See Manual for Details) 12.3.3 Timer I/O Control Register (TIOR) 241 Table amended Description Table 12.7 TIOR_1 (Channel 1) Bit 7 IOB3 Bit 6 IOB2 Bit 5 IOB1 Bit 4 IOB0 TGRB_1 Function 0 0 0 0 Output compare register 1 1 TIOCB1 Pin Function Output disabled Setting prohibited 0 1 1 0 0 1 1 0 1 Table 12.8 TIOR_2 (Channel 2) 242 Table amended Description Bit 7 IOB3 Bit 6 IOB2 Bit 5 IOB1 Bit 4 IOB0 TGRB_2 Function 0 0 0 0 Output compare register 1 1 TIOCB2 Pin Function Output disabled Setting prohibited 0 1 1 0 0 1 1 0 1 12.4.2 8-Bit Registers 250 Description amended Registers other than TCNT and TGR are 8-bit. They can be read and written to in 8-bit units. Examples of 8-bit register access operation are shown in figures . 12.3 and 12.4 Figure 12.5 8-Bit Register Access Operation [CPU TCR and TMDR (16 Bits)] -- Deleted Rev. 3.00 Aug 23, 2006 Page xxv of lxxviii Item Page Revision (See Manual for Details) 12.5.1 Basic Functions 254 Description amended Figure 12.9 shows an example of 1 output. (2) Waveform Output by Compare Match Figure 12.9 Example of 1 Output Operation ... and settings have been made such that 1 is output by . ... compare match A 255 Figure title and figure amended TCNT value H'FFFF TGRA Time H'0000 No change 1 output TIOCA Figure 12.10 Example of Toggle Output Operation 255 No change Figure amended TCNT value Counter cleared by TGRB compare match H'FFFF TGRA Time H'0000 TIOCA 12.5.4 PWM Modes 261 Description amended Table 12.12 PWM Output Registers and Output Pins 262 Table amended (4) Examples of PWM Mode Operation 263 Toggle output In PWM mode 2, PWM output is enabled up to 2 phases. (2) PWM Mode 2 (Before) TIOCB1 (After) -- (Before) TIOCB2 (After) -- Description amended Figure 12.18 shows an example of PWM mode 1 operation. , and 1 is set ........, 0 is set for the TGRA initial output value as the TGRB output value. ... TGRB_2 compare match is set as the TCNT clearing source, and 0 is set for the initial output value and 1 for the output value of the other TGR registers (TGRA_1, TGRB_1, and TGRA_2), outputting a 2-phase PWM waveform. In this case, the value set in TGRB_2 is used as the cycle, ... Rev. 3.00 Aug 23, 2006 Page xxvi of lxxviii Item Page Revision (See Manual for Details) 12.5.4 PWM Modes 264 Figure amended Synchronous clearing by TGRB_2 compare match Figure 12.19 Example of PWM Mode Operation (2) TCNT_1 and TCNT_2 TGRB_2 TGRA_2 TGRA_1 Time H'0000 TIOCA1 TIOCA2 13.3.1 Event Counter PWM Compare Register (ECPWCR) 283 13.3.2 Event Counter PWM Data Register (ECPWDR) 284 Description added Always read or write to this register in word size. 13.3.6 Event Counter 289 H (ECH) Description added Always write to this register in word size. Table amended Bit Bit Name Initial Value R/W Description 7 ECH7 0 R 6 ECH6 0 R 5 ECH5 0 R 4 ECH4 0 R Either the external asynchronous event AEVH pin, /2, /4, or /8, or the overflow signal from lower 8-bit counter ECL can be selected as the input clock source. ECH can be cleared to H'00 by clearing CRCH in ESSCR to 0. 3 ECH3 0 R 2 ECH2 0 R 1 ECH1 0 R 0 ECH0 0 R Rev. 3.00 Aug 23, 2006 Page xxvii of lxxviii Item Page 13.3.7 Event Counter 289 L (ECL) 13.4.4 Event Counter 292 PWM Operation Revision (See Manual for Details) Table amended Bit Bit Name Initial Value R/W Description 7 ECL7 0 R 6 ECL6 0 R 5 ECL5 0 R Either the external asynchronous event AEVL pin, /2, /4, or /8 can be selected as the input clock source. ECL can be cleared to H'00 by clearing CRCL in ESSCR to 0. 4 ECL4 0 R 3 ECL3 0 R 2 ECL2 0 R 1 ECL1 0 R 0 ECL0 0 R Figure amended toff = (T x (Ndr +1)) - tcyc Figure 13.4 Event Counter Operation Waveform Clock input enable time Clock input disable time One conversion period ECPWM input clock cycle Value of ECPWDR Fixed low when Ndr =H'FFFF Ncm: Value of ECPWCR tcyc: System cock () cycle time ton: toff: tcm: T: Ndr: ton tcm = T x (Ncm +1) Table 13.2 Examples 293 of Event Counter PWM Operation 13.5 Operating States 294 of Asynchronous Event Counter Table amended Clock Clock toff = Source Source ECPWCR ECPWDR (T x (Ndr + 1)) tcm = ton = Selection Cycle (T)* Value (Ncm) Value (Ndr) - tcyc T x (Ncm + 1) tcm - toff /2 0.5 s H'7A11 H'16E3 2.92975 ms 15.625 ms 12.69525 ms /4 1 s D'31249 D'5859 5.85975 ms 31.25 ms 25.39025 ms /8 2 s 11.71975 ms 62.5 ms 50.78025 ms /16 4 s 23.43975 ms 125.0 ms 101.56025 ms /32 8 s 46.87975 ms 250.0 ms 203.12025 ms /64 16 s 93.75975 ms 500.0 ms 406.24025 ms Notes: 1. When an asynchronous external event is input, the counter increments. However, an interrupt request is issued when the counter overflows. Table 13.3 Operating States of Asynchronous Event Counter 13.6 Usage Notes 296 Description added 7. If the flash memory version was used with the IRQAEC pin fixed high level and then the chip is replaced with the masked ROM version, the internal oscillator must be used. Rev. 3.00 Aug 23, 2006 Page xxviii of lxxviii Item Page Revision (See Manual for Details) 14.1 Features 297 ... or the WDT on-chip oscillator timer-counter clock. Figure 14.1 Block Diagram of Watchdog Timer 298 Figure amended WDT on-chip oscillator 14.2.1 Timer Control/Status Register WD1 (TCSRWD1) can be selected as the 300 PSS Note * added Bit Bit Name Initial Value R/W Description 2 WDON 0 R/W Watchdog Timer On* TCWD starts counting up when the WDON bit is set to 1 and halts when the WDON bit is cleared to 0. Note: * When transitioning to the watch mode or standby mode while the main internal clock is selected (CKS3 = 1) using timer mode register WD (TMWD), make sure to clear WDON to 0 to halt operation of TCWD. 14.2.2 Timer 302 Control/Status Register WD2 (TCSRWD2) Note 4 amended 14.2.4 Timer Mode Register WD (TMWD) Description amended 14.3.1 Watchdog Timer Mode 303 304 Figure 14.3 Interval Timer Mode Operation Bit Bit Name Initial Value R/W Description 3 CKS3 1 R/W 0XXX: WDT on-chip oscillator: counts on Rosc/2048 2 CKS2 1 R/W 1 CKS1 1 R/W For the WDT on-chip oscillator overflow periods, see section 25, Electrical Characteristics. 0 CKS0 1 R/W In active (medium-speed) mode or sleep (mediumspeed) mode, the setting of B'0XXX and interval timer mode is disabled. Description amended ... The internal reset signal is output for a period of 256 OSC clock cycles. ... Figure 14.2 Example of Watchdog Timer Operation 14.3.2 Interval Timer Mode 4. In subactive mode, clear this flag after setting the CKS3 to CKS0 bits in TMWD to B'0XXX (WDT on-chip oscillator). Figure amended (Before) 512OSC clock cycles (After) 256OSC clock cycles 305 Figure amended (Before) WT/IT = 0 (After) WT/IT = 1 TME = 1 Rev. 3.00 Aug 23, 2006 Page xxix of lxxviii Item Page Section 15 Serial 307 Communication Interface 3 (SCI3, IrDA) Revision (See Manual for Details) Description amended The serial communication interface 3 (SCI3) can handle both asynchronous and clocked synchronous serial communication. ... or an Asynchronous Communication Interface Adapter (ACIA). The SCI3_1 can transmit and receive IrDA ... 15.3.5 Serial Mode Register (SMR) 314 Table amended Bit Bit Name Initial Value R/W Description 2 MP 0 R/W 5-Bit Communication When this bit is set to 1, the 5-bit communication format is enabled. When writing 1 to this bit, always write 1 to bit 5 (RE) at the same time. In addition, 1 must be written to bit 3 (MPIE) in the serial control register (SCR) before writing 1 to this bit. 315 Bit Bit Name Initial Value R/W Description 1 CKS1 0 R/W Clock Select 0 and 1 0 CKS0 0 R/W These bits select the clock source for the on-chip baud rate generator. 00: clock (n = 0) 01: w/2 or w clock (n = 1) 10: /16 clock (n = 2) 11: /64 clock (n = 3) When the setting value is 01 in active (mediumspeed/high-speed) mode and sleep (mediumspeed/high-speed) mode w/2 clock is set. In subacive mode and subsleep mode, w clock is set. The SCI3 is enabled only, when w/2 is selected for the CPU operating clock. For the relationship between the bit rate register setting and the baud rate, see section 15.3.8, Bit Rate Register (BRR). n is the decimal representation of the value of n in BRR (see section 15.3.8, Bit Rate Register (BRR)). 15.3.6 Serial Control Register (SCR) 15.3.7 Serial Status Register (SSR) 317 320 Table amended Bit Bit Name Initial Value R/W Description 3 MPIE 0 R/W Reserved Table amended Bit Bit Name Initial Value R/W Description 1 MPBR 0 R Reserved This bit is read-only and reserved. It cannot be written to. 0 MPBT 0 R/W Reserved The write value should always be 0. Rev. 3.00 Aug 23, 2006 Page xxx of lxxviii Item Page 15.3.8 Bit Rate Register (BRR) 321 Revision (See Manual for Details) Description amended [Asynchronous Mode] Active (medium-speed/high-speed) or sleep (medium-speed/high-speed) OSC -1 32 x 22n x B N= Error (%) = B (bit rate obtained from n, N, ) - R (bit rate in left-hand column in table 15.3) R (bit rate in left-hand column in table 15.3) x 100 Subactive or subsleep OSC -1 64 x 22n x B N= [Legend] B: Bit rate (bit/s) BRR setting for baud rate generator (0 N 255) N: OSC: OSC value (Hz) n: Baud rate generator input clock number (n = 0, 2, or 3) (The relation between n and the clock is shown in table 15.3) Table 15.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1) Table 15.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2) 322 Table amended 32.8kHz Bit Rate (bit/s) n 323 N 38.4kHz Error (%) n N 2MHz 2.097152MHz Error (%) n N Error (%) n N Error (%) 110 -- -- -- -- -- -- 2 35 -1.36 2 36 0.64 150 -- -- -- 0 3 0.00 2 25 0.16 2 26 1.14 200 -- -- -- 0 2 0.00 2 19 -2.34 3 4 2.40 250 0 1 2.50 -- -- -- 0 249 0.00 3 3 2.40 300 -- -- -- 0 1 0.00 0 207 0.16 0 217 0.21 600 -- -- -- 0 0 0.00 0 103 0.16 0 108 0.21 1200 -- -- -- -- -- -- 0 51 0.16 0 54 -0.70 2400 -- -- -- -- -- -- 0 25 0.16 0 26 1.14 Table amended Bit Rate (bit/s) n 2.4576MHz N Error (%) 3MHz n N 3.6864MHz Error (%) n N Error (%) 4MHz n N Error (%) 4.194MHz n N Error (%) 110 3 10 -0.83 2 52 0.50 2 64 0.70 2 70 0.03 2 73 0.63 150 3 7 0.00 2 38 0.16 3 11 0.00 2 51 0.16 2 54 -0.71 200 3 5 0.00 2 28 1.02 3 8 0.00 2 38 0.16 2 40 -0.10 250 2 18 1.05 2 22 1.90 2 28 -0.69 2 30 0.81 2 32 -0.71 300 3 3 0.00 3 4 -2.34 3 5 0.00 2 25 0.16 2 26 1.13 600 3 1 0.00 0 155 0.16 3 2 0.00 0 207 0.16 0 217 0.20 Rev. 3.00 Aug 23, 2006 Page xxxi of lxxviii Item Page Revision (See Manual for Details) 15.3.8 Bit Rate Register (BRR) 324 Table amended 4.9152MHz Table 15.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (3) Table 15.5 Maximum Bit Rate for Each Frequency (Asynchronous Mode) Table 15.6 BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (1) 326 5MHz n N Error (%) 2 106 -0.44 2 108 0.08 2 77 0.16 3 19 0.00 2 58 -0.69 3 14 0.00 46 -0.27 3 11 0.00 38 0.16 3 9 0.00 -2.34 3 4 0.00 2 88 -0.25 2 64 0.16 2 48 -0.35 2 38 0.16 2 2 32 -1.36 2 255 1.73 3 4 2 86 0.31 3 15 0.00 200 3 11 0.00 250 2 37 1.05 300 3 7 0.00 600 3 3 0.00 0 150 N n n 6.144MHz Error (%) N N 110 6MHz Error (%) Error (%) Bit Rate (bit/s) n 1200 3 1 0.00 0 129 0.16 0 155 0.16 2 9 0.00 2400 3 0 0.00 0 64 0.16 0 77 0.16 2 4 0.00 4800 2 1 0.00 0 32 -1.36 0 38 0.16 0 39 0.00 9600 2 0 0.00 2 0 1.73 0 19 -2.34 0 19 0.00 19200 0 7 0.00 0 7 1.73 0 9 -2.34 0 9 0.00 31250 0 4 -1.70 0 4 0.00 0 5 0.00 0 5 2.4 38400 0 3 0.00 0 3 1.73 0 4 -2.34 0 4 0.00 Table amended Setting 327 (MHz) Maximum Bit Rate (bit/s) n N 0.0328 512.5 0 0 0.0384 600 0 0 2 62500 0 0 Table amended 32.8 kHz 2 MHz 38.4 kHz Bit Rate (bit/s) n N Error (%) n N Error (%) n N Error (%) 200 0 20 -2.38 0 23 0.00 2 155 0.16 250 0 15 2.50 0 18 1.05 2 124 0.00 300 0 13 -2.38 0 15 0.00 2 103 0.16 500 0 7 2.50 0 2 62 -0.79 1k 0 3 2.50 2 30 0.81 2.5k 0 199 0.00 Rev. 3.00 Aug 23, 2006 Page xxxii of lxxviii Item Page Revision (See Manual for Details) 15.3.8 Bit Rate Register (BRR) 328 Table and note amended Table 15.6 BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (2) 4 MHz 8 MHz Bit Rate (bit/s) n N Error (%) n N 10k 0 99 0.00 0 199 0.00 Note: * Error (%) 10 MHz n N Error (%) 2 15 -2.34 Continuous transmission/reception is not possible. The value set in BRR is given by the following formula: Active (medium-speed/high-speed) or sleep (medium-speed/high-speed) N= OSC 4 x 22n x B -1 Subactive or subsleep N= B: N: OSC: n: 15.3.9 Serial Port Control Register (SPCR) 330 OSC 8 x 22n x B -1 Bit rate (bit/s) BRR setting for baud rate generator (0 N 255) OSC value (Hz) Baud rate generator input clock number (n = 0, 2, or 3) (The relation between n and the clock is shown in table 15.7.) Table amended Bit Bit Name Initial Value R/W Description 3 SCINV3 0 R/W TXD32 Pin Output Data Inversion Switch Selects whether the polarity of output data of the TXD32 pin is inverted or not. 0: Output data of TXD32 pin is not inverted. 1: Output data of TXD32 pin is inverted. 2 SCINV2 0 R/W RXD32 Pin Input Data Inversion Switch Selects whether the polarity of input data of the RXD32 pin is inverted or not. 0: Output data of RXD32 pin is not inverted. 1: Output data of RXD32 pin is inverted. 1 SCINV1 0 R/W TXD31 Pin Output Data Inversion Switch Selects whether the polarity of output data of the TXD31 pin is inverted or not. 0: Output data of TXD31 pin is not inverted. 1: Output data of TXD31 pin is inverted. 0 SCINV0 0 R/W RXD31 Pin Input Data Inversion Switch Selects whether the polarity of input data of the RXD31 pin is inverted or not. 0: Input data of RXD31 pin is not inverted. 1: Input data of RXD31 pin is inverted. Rev. 3.00 Aug 23, 2006 Page xxxiii of lxxviii Item Page Revision (See Manual for Details) 15.4.1 Clock 334 Table amended Table 15.8 Data Transfer Formats (Asynchronous Mode) Table 15.9 SMR Settings and Corresponding Data Transfer Formats SMR 335 Serial Data Transfer Format and Frame Length CHR PE MP STOP 0 0 1 0 Setting prohibited 0 0 1 1 Setting prohibited 1 0 1 0 Setting prohibited 1 0 1 1 Setting prohibited 1 2 3 4 5 6 7 8 9 SMR Bit 6 CHR Bit 2 MP Bit 5 PE Bit 3 STOP 0 0 1 0 0 Mode Data Length Asynchronous mode Setting prohibited 5-bit data 0 Parity Bit No 1 1 0 1 Stop Bit Length 1 bit 2 bits 0 Setting prohibited 1 0 5-bit data 1 Yes 1 bit 2 bits Figure amended [4] Wait at least one bit interval, then set the TE bit or RE bit in SCR to 1. Setting bits TE and RE enables the TXD31 (TXD32) and RXD31 (RXD32) pins to be used. Also set the RIE, TIE, and bits, ... TEIE Figure 15.4 Sample SCI3 Initialization Flowchart 15.4.3 Data Transmission 12 Data Transfer Format Bit 7 COM 1 337 11 Table amended 1 15.4.2 SCI3 Initialization 10 339 Figure amended No [3] Figure 15.6 Sample Serial Transmission Flowchart (Asynchronous Mode) Break output? Yes Clear PDR to 0 and set PCR to 1 Clear SPC31 (SPC32) bit in SPCR and TE bit in SCR to 0* <End> Note: * When SPC31 (SPC32) in SPCR is cleared to 0, the corresponding pin becomes an I/O port. 15.6 Multiprocessor Communication Function Deleted Rev. 3.00 Aug 23, 2006 Page xxxiv of lxxviii Item Page Revision (See Manual for Details) 15.6.1 Transmission 350 Description amended ... a high-level pulse width of at least 1.41 s to 1.6 s can be specified. Figure 15.16 IrDA Transmission and Reception 351 15.6.2 Reception 351 Figure amended (Before) ... 3/16 bit cycle (After) ... 3/16 bit rate Description amended If a pulse has a high-level width of less than 1.41 s, ... 15.8.2 Mark State and Break Sending 356 Description amended Regardless of the value of TE, when the SPCR31 (SPCR32) bit in SPCR is cleared to 0, the TXD31 (TXD32) pin is used as an I/O port whose direction (input or output) and level are determined by PCR and PDR. This can be used to set the TXD31 (TXD32) pin to mark state (high level) or send a break during serial data transmission. To maintain the communication line at mark state (1) until SPCR31 (SPCR32) in SPCR is set to 1, set both PCR and PDR to 1. As SPCR31 (SPCR32) in SPCR is cleared to 0 at this point, the TXD31 (TXD32) pin becomes an I/O port, and 1 is output from the TXD31 (TXD32) pin. To send a break during serial transmission, first set PCR to 1 and PDR to 0, and then clear SPCR31 (SPCR32) and TE to 0. If TE is cleared to 0 immediately after SPCR31 (SPCR32) is cleared to 0, the transmitter is initialized regardless of the current transmission state after TE is cleared, and when SPCR31 (SPCR32) is cleared to 0 the TXD31 (TXD32) pin becomes an I/O port and 0 is output from it. Rev. 3.00 Aug 23, 2006 Page xxxv of lxxviii Item Page Revision (See Manual for Details) 17.3.2 PWM Data Register (PWDR) 383 Description amended When data is written to the lower 14 bits of PWDR, ... The initial value of PWDR is 0, and it is always read as H'FFFF. Always write to this register in word size. 17.4 Operation 384, 385 Replaced 17.5 PWM Operating 386 States Added 17.6 Usage Notes 18.3.1 A/D Result Register (ADRR) 389 18.7.1 Permissible Signal Source Impedance 398 19.3.1 A/D Data Register (ADDR) 403 19.3.2 BGR Control Register (BGRMR) 404 19.3.4 A/D Start/Status Register (ADSSR) 407 Description added Always read this register in word size. Description amended If a large capacitance is provided externally as a countermeasure, the input load essentially comprises only the internal input resistance of 10 k, and the signal source impedance can be ignored. Description added Always read this register in word size. Note amended ... 1.2 V is approximately 100 s. Table and note amended Bit Bit Name Initial Value R/W Description 2 to 0 Reserved These bits cannot be modified. Note: When the BYPGA bit is set to 1 and the PGA factor is 1, the factor of analog input voltage is also 1. However, analog input voltage is limited to range from 0 to Vref [V] when the BYPGA bit is set to 1 and from 0.2 to 0.9 Vref [V] when the PGA factor is 1. Therefore when the factor of analog input voltage is 1, the setting when the BYPGA bit is set to 1 should be used. Rev. 3.00 Aug 23, 2006 Page xxxvi of lxxviii A/D conversion (1) Set* Read conversion result A/D conversion result (1) Idle Clear* A/D conversion (2) Set* Read conversion result A/D conversion result (2) Idle Page Revision (See Manual for Details) 19.5.2 Continuous Mode 411 Fugure amended Note: * indicates instruction execution by software. ADDR Idle A/D conversion starts Set* Figure 19.2 Example of A/D Conversion Operation (Wait Mode) Channel 1 (Ain1) operating state ADS ADST IENSAD Interrupt (IRRSDADCN) Item Rev. 3.00 Aug 23, 2006 Page xxxvii of lxxviii Item Page Revision (See Manual for Details) 19.6.5 PB5/Vref/REF Pin 414 Newly added 20.3.1 LCD Port Control Register (LPCR) 418 If VREF1 and VREF0 in the ADCR register are set to b'01 or b'11 and the A/D converter is not operating, switch the PB5/Vref/REF pin to PB5 input operation to prevent current from flowing from the pin to GND. Table amended Bit 7: DTS1 Bit 6: DTS0 Bit 5: CMX Duty Cycle Common Drivers Notes* 0 0 0 Static COM1 Leave COM4, COM3, and COM2 in open drain state COM4 to COM1 COM4, COM3, and COM2 output the same waveform as COM1 1 0 COM2 to COM1 Leave COM4 and COM3 in open drain state COM4 to COM1 COM4 outputs the same waveform as COM3, and COM2 outputs the same waveform as COM1 Table 20.2 Duty Cycle and Common Function Selection 1 1/2 duty 1 1 0 0 1/3 duty 1 1 0 1/4 duty COM3 to COM1 Leave COM4 in open drain state COM4 to COM1 Leave COM4 in open drain state COM4 to COM1 -- 1 Note: * 20.3.2 LCD Control Register (LCR) Table 20.4 Frame Frequency Selection 421 If SGS3 to SGS0 are set to B'0000, the power supply voltage level of PA0 to PA3 and COM1 to COM4 is Vcc. If the setting of SGS3 to SGS0 is other than B'0000, the power supply voltage level of PA0 to PA3 and COM1 to COM4 is the LCD drive power supply voltage level. Note 3 amended 3. This is the frame frequency in active (medium-speed, OSC/8) mode when OSC = 2 MHz. Rev. 3.00 Aug 23, 2006 Page xxxviii of lxxviii Item Page Revision (See Manual for Details) 20.3.4 LCD Trimming Register (LTRMR) 424 Note amended Notes: Setting Method for LCD Trimming Register (LTRMR) and BRG Control Register (BGRMR) Assuming the following definitions, V1 initial state voltage: A LTRMR register TRM3 to TRM0: B CTRM2 to CTRM0: C BGRMR register BTRM2 to BTRM0: D rough guidelines for the voltages after trimming are as follows: V1 voltage = A + B + C + 3 x D/1.2 V2 voltage = (A + B + C + 3 x D/1.2) x 2/3 V3 voltage = (A + B + C + 3 x D/1.2) / 3 After monitoring voltage A, set B, C, and D so the V1 voltage is 3 V. The BRG control register is used both for A/D converter REF output adjustment and 3 V constantvoltage power supply circuit adjustment. Therefore, make sure to choose settings that satisfy the specifications for both functions. 20.4.3 3-V Constant- 434 Voltage Power Supply Circuit Note 4 added 20.5 Usage Notes Added 436 4. Initially, the step-up circuit output voltage differs among individual devices due to production variation. Therefore, make sure to adjust the settings of the LCD trimming register (LTRMR) and BRG control register (BGRMR) individually for each device. 20.5.1 Pin Processing when No LCD Controller/Driver Is Used 20.5.2 Pin Processing when No 3 V Constant Voltage Circuit Is Used Rev. 3.00 Aug 23, 2006 Page xxxix of lxxviii Item 2 21.3.5 I C Bus Status Register (ICSR) Page Revision (See Manual for Details) 450 Table amended Bit Bit Name Initial Value R/W Description 3 STOP 0 R/W Stop Condition Detection Flag [Setting conditions] * When a stop condition is detected after completion of a frame transfer in master mode * When a stop condition is detected after the first byte slave address and SAR match following a general call and detection of a start condition in slave mode [Clearing condition] * 22.2.1 Power-On Reset Circuit 476 24.1 Register Addresses (Address Order) 488 Description amended If the RES pin rising time is t, the capacitance (CRES) connected to the RES pin can be computed using the formula below. For information about the on-chip resistor (Rp), see section 25, Electrical Characteristics. The power supply rising time should not exceed half the RES rising time (t). The RES rising time (t) should also equal or exceed the oscillation stabilization time (trc). Table amended Abbreviation Register Name 494 495 Module Bit No. Address Name Data Bus Access Width State Event counter H ECH 8 H'FF96 AEC* 1 8/16 2 Event counter L ECL 8 H'FF97 AEC* 1 8/16 2 Register Name Abbreviation Module Bit No. Address Name Data Bus Access Width State 8-bit timer counter FH TCFH 8 H'FFB8 Timer F 8/16 2 8-bit timer counter FL TCFL 8 H'FFB9 Timer F 8/16 2 Output compare register FH OCRFH 8 H'FFBA Timer F 8/16 2 Output compare register FL OCRFL 8 H'FFBB Timer F 8/16 2 489 24.2 Register Bits When 0 is written in STOP after reading STOP = 1 Table amended Register Abbreviation Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name IPRA IPRA6 IPRA5 IPRA4 IPRA3 IPRA2 IPRA1 IPRA0 Interrupts Register Abbreviation Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name SMR3_2 COM CHR PE PM STOP MP CKS1 CKS0 SCI3_2 BRR3_2 BRR7 BRR6 BRR5 BRR4 BRR3 BRR2 BRR1 BRR0 SCR3_2 TIE RIE TE RE MPIE TEIE CKE1 CKE0 TDR3_2 TDR7 TDR6 TDR5 TDR4 TDR3 TDR2 TDR1 TDR0 SSR3_2 TDRE RDRF OER FER PER TEND MPBR MPBT RDR3_2 RDR7 RDR6 RDR5 RDR4 RDR3 RDR2 RDR1 RDR0 Rev. 3.00 Aug 23, 2006 Page xl of lxxviii IPRA7 Item Page Revision (See Manual for Details) 24.3 Register States in Each Operating Mode 498 Table amended 499 25.1 Absolute Maximum Ratings for F-ZTAT Version Table 25.1 Absolute Maximum Ratings 503 Register Abbreviation Reset Sleep Watch Subactive Subsleep Standby Module SCR4 Initialized SCR4 SCSR4 Initialized TDR4 Initialized RDR4 Initialized TSTR Initialized TSYR Initialized TCR_1 Initialized TMDR_1 Initialized TIOR_1 Initialized TIER_1 Initialized TSR_1_ Initialized TCNT_1 Initialized TGRA_1 Initialized TGRB_1 Initialized TCR_2 Initialized TMDR_2 Initialized TIOR_2 Initialized TIER_2 Initialized TSR_2 Initialized TCNT_2 Initialized TGRA_2 Initialized TGRB_2 Initialized Active TPU TPU_1 TPU_2 Register Abbreviation Reset Active Sleep Watch Subactive Subsleep Standby Module RTCFLG RTC RSECDR RMINDR RHRDR Item Symbol Value Unit Note Power supply voltage VCC -0.3 to +4.3 V Analog power supply voltage AVCC -0.3 to +4.3 V DVCC -0.3 to +4.3 V Input voltage Other than port B Vin -0.3 to VCC +0.3 V Ports B0 to B2 AVin -0.3 to AVCC + 0.3 V Ports B5 to B7 DVin -0.3 to DVCC + 0.3 V Table amended *1 Rev. 3.00 Aug 23, 2006 Page xli of lxxviii Item Page 25.2.1 Power Supply 504 Voltage and Operating Range Revision (See Manual for Details) Note 1 amended ... the minimum value of fosc is 2 MHz. (1) Power Supply Voltage and Oscillation Frequency Range (2) Power Supply Voltage and Operating Frequency Range 505 25.2.2 DC Characteristics 507 Note 1 amended ... the minimum operating frequency ( ) is 2 MHz Condition and table amended VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Table 25.2 DC Characteristics Values Item Symbol Applicable Pins Input high VIH RES, NMI*3, WKP0 voltage Test Condition Min. Typ. Max. Unit 0.9VCC -- VCC + 0.3 V IRQ0, IRQ1, IRQ3 0.9VCC -- AVCC + 0.3 RXD32, RXD31 0 .8VCC -- VCC + 0.3 PB0 to PB2 0.8VCC -- AVCC + 0.3 PB5 to PB7 0.8VCC -- DVCC + 0.3 IRQAEC 0.9VCC -- VCC + 0.3 Notes to WKP7, IRQ4, AEVL, AEVH, TMIF, ADTRG, SCK32, SCK31, SCK4 512 Note 1 amended Mode RES Pin Watch mode VCC Internal State Only time base operates, CPU stops Other Pins LCD Power Supply VCC Halted On-chip WDT oscillator is off Subclock oscillator: crystal resonator TCSRWD1 (WDON) = 0 Standby mode VCC CPU and timers both stop On-chip WDT oscillator is off TCSRWD1 (WDON) = 0 Rev. 3.00 Aug 23, 2006 Page xlii of lxxviii Oscillator Pins System clock oscillator: crystal resonator VCC Halted System clock oscillator: crystal resonator Subclock oscillator: Pin X1 = GND (32KSTOP = 0) Item Page Revision (See Manual for Details) 25.2.3 AC Characteristics 513 Condition amended VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Table 25.3 Control Signal Timing Table 25.4 Serial Interface Timing 2 516 Table 25.5 I C Bus Interface Timing 517 25.2.4 A/D Converter Characteristics 518 Condition amended VCC = 1.8 V to 3.6 V, AVCC= 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = 0.0 V, Ta = -20 to +75C, unless otherwise specified. Condition and table amended VCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Table 25.6 A/D Converter Characteristics. Applicable Item Symbol Pins Conversion time Values Test Condition Min. Typ. Max. Unit AVCC = 2.7 V to 3.6 V VCC = 2.7 V to 3.6 V 6.2 -- 124 s AVCC = 2.0 V to 3.6 V VCC = 2.0 V to 3.6 V 14.7 -- 124 Other than above 31 -- 124 Notes Note 4 amended 4. Conversion time = 31 s 25.2.5 A/D Converter Characteristics Table 25.7 A/D Converter Characteristics 519 Condition added VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. 520 Table amended Values Applicable Item Symbol External Pins Test Condition Min. Typ. Max. Unit Vref 0.2 DVcc -- 0.9 DVcc V Vref -- 18 -- k Notes reference voltage Vref-GND resistance 25.2.6 LCD Characteristics Table 25.8 LCD Characteristics 522 RVref REF Condition amended VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Rev. 3.00 Aug 23, 2006 Page xliii of lxxviii Item Page Revision (See Manual for Details) 25.2.7 Power-On Reset Circuit Characteristics 523 Condition and table amended VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, Ta = -20 to +75C (regular specifications), Ta = -40 to +85C (wide-range specifications), unless otherwise specified. Table 25.9 PowerOn Reset Circuit Characteristics Values Item Symbol Reset voltage V_rst Test Condition Power supply rise time t_vtr Reference Min. Typ. Max. Unit Figure 0.7Vcc 0.8Vcc 0.9Vcc V Figure 25.1 The Vcc rise time should be shorter than half the RES rise time. -- s Reset count time t_out 0.8 Count start time t_cr Adjustable by the value of the external capacitor 8.0 On-chip pull-up Rp of the RES pin. Vcc = 3.0 V 60 100 -- k Figure 22.1 resistance 25.2.8 Watchdog Timer Characteristics 523 VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, ... Table 25.10 Watchdog Timer Characteristics 25.2.9 Flash Memory Characteristics Preliminary 524 Table 25.12 Absolute Maximum Ratings Condition A amended AVCC = 2.7 V to 3.6 V, DVCC = 2.7 V to 3.6 V, VSS = AVSS = 0.0 V, VCC = 2.7 V to 3.6 V (operating voltage range in reading), ... Condition B amended Table 25.11 Flash Memory Characteristics 25.3 Absolute Maximum Ratings for Masked ROM Version Condition amended AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, VCC = 1.8 V to 3.6 V (operating voltage range in reading), ... 526 Table amended Item Symbol Value Unit Note Power supply voltage VCC -0.3 to +4.3 V *1 Analog power supply voltage AVCC -0.3 to +4.3 V DVCC -0.3 to +4.3 V Input voltage Other than port B Vin -0.3 to VCC +0.3 V Ports B0 to B2 AVin -0.3 to AVCC + 0.3 V Ports B5 to B7 DVin -0.3 to DVCC + 0.3 V Rev. 3.00 Aug 23, 2006 Page xliv of lxxviii Item Page 25.4.1 Power Supply 527 Voltage and Operating Range Revision (See Manual for Details) Note 1 amended ... the minimum value of fosc is 2 MHz. (1) Power Supply Voltage and Oscillation Frequency Range (2) Power Supply 528 Voltage and Operating Frequency Range ... the minimum operating frequency () is 2 MHz 25.4.2 DC Characteristics Condition and table amended 530 VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AV SS = 0.0 V, unless otherwise specified. Table 25.13 DC Characteristics Values Item Symbol Applicable Pins Input high VIH RES, NMI, WKP0 to voltage Test Condition Min. Typ. Max. Unit 0.9VCC -- VCC + 0.3 V IRQ0, IRQ1, IRQ2 0.9VCC -- AVCC + 0.3 RXD32, RXD31 0.8VCC -- VCC + 0.3 PB0 to PB2 0.8VCC -- AVCC + 0.3 PB5 to PB7 0.8VCC -- DVCC + 0.3 IRQAEC 0.9VCC -- VCC + 0.3 Notes WKP7, IRQ4, AEVL, AEVH, TMIF, ADTRG, SCK32, SCK31, SCK4 535 Note 1 amended RES Other LCD Power Pins Supply Oscillator Pins Halted System clock oscillator: Mode Pin Internal State Watch mode VCC Only time base operates, CPU VCC stops crystal resonator On-chip WDT oscillator is off Subclock oscillator: crystal resonator TCSRWD1 (WDON) = 0 Standby mode VCC CPU and timers both stop On-chip WDT oscillator is off TCSRWD1 (WDON) = 0 VCC Halted System clock oscillator: crystal resonator Subclock oscillator: Pin X1 = GND (32KSTOP = 0) Rev. 3.00 Aug 23, 2006 Page xlv of lxxviii Item Page Revision (See Manual for Details) 25.4.3 AC Characteristics 536 Conditions and table amended VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AV SS = 0.0 V, unless otherwise specified. Table 25.14 Control Signal Timing Applicable Values Reference Item Symbol Pins Test Condition Min. Typ. Max. Unit System clock fOSC OSC1, OSC2 VCC = 2.7 to 3.6 V 2.0 -- 10.0 MHz Figure oscillation frequency On-chip oscillator ROSC VCC = 1.8 to 3.6 V 2.0 -- 4.2 On-chip oscillator 1.0 -- 10 0.5 -- 4.2 100 -- * 4 is used oscillation frequency VCC = 2.7 to 3.6 V On-chip oscillator is used VCC = 1.8 to 2.7 V OSC clock (OSC) cycle tOSC OSC1, OSC2 VCC = 2.7 to 3.6 V time 500 ns Figure 25.2 *2 (1000) VCC = 1.8 to 3.6 V 238 -- 500 (1000) On-chip oscillator On-chip oscillator tROSC clock (ROSC) cycle time 100 -- 1000 238 -- 2000 *4 is used VCC = 2.7 to 3.6 V On-chip oscillator is used VCC = 1.8 to 2.7 V Applicable 537 Item Symbol Oscillation stabilization trc time 538 Values Reference Pins Test Condition Min. Typ. Max. Unit OSC1, OSC2 Other than above -- -- 50 ms On-chip oscillator is used -- -- 100 s Figure *4 Note 4 amended 4. Characteristics vary due to variations in factors such as temperature, power supply voltage, and production lot. When designing the system, give due consideration to the actual usage conditions. For actual data on this product, please contact a Renesas representative. Table 25.15 Serial Interface Timing 2 Table 25.16 I C Bus Interface Timing 539 Condition amended VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. 540 Condition amended VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = 0.0 V, Ta = -20 to +75C, unless otherwise specified. Rev. 3.00 Aug 23, 2006 Page xlvi of lxxviii Item Page Revision (See Manual for Details) 25.4.4 A/D Converter Characteristics 541 Condition amended Table 25.17 A/D Converter Characteristics 542 25.4.5 A/D Converter Characteristics 543 VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = 0.0 V, unless otherwise specified. Note 4 amended 4. Conversion time = 31 s Condition added and table amended VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AV SS = 0.0 V, unless otherwise specified. Values Applicable Table 25.18 A/D Converter Characteristics Item Symbol Pins Analog power supply DVcc DVcc Test Condition Min. Typ. Max. Unit Notes 2.2/2.7 3.6 V *1 * 8 3.0 -- LSB * -- -7.0 -- voltage Integral lineality error PGA bypass 7 (DVcc = 3.0 V, Vref = 2.7 V, conversion speed = 32 s)* 544 6 Values Applicable Item Symbol Pins Test Condition Min. Typ. Max. Unit Notes Differential lineality PGA bypass -- 1.3 -- LSB * error (DVcc = 3.0 V, -- -0.8 -- -- 10 -- mV *7 -- 28.0 -- mV *7 -- 6 -- mV * -- 7 -- mV -- -20 -- mV -- -44 -- mV REF -- 1.17 -- V Vref 0.2 DVcc -- 7 Vref = 2.7 V, conversion speed = 32 s)*6 PGA bypass Offset error (DVcc = 3.0 V, Vref = 2.7 V, conversion speed = 32 s)*6 P GA bypass Full scale error (DVcc = 3.0 V, Vref = 2.7 V, conversion speed = 32 s)*6 PGA gain error Tad PGA = 1/3, 7 DVcc = 3.0 V PGA = 1, DVcc = 3.0 V PGA = 2, DVcc = 3.0 V PGA = 4, DVcc = 3.0 V Internal reference 4 5 * * voltage External reference 0.9 DVcc V voltage Rev. 3.00 Aug 23, 2006 Page xlvii of lxxviii Item Page Revision (See Manual for Details) 25.4.5 A/D Converter Characteristics 545 Notes amended Notes: 4. BGR stabilization time = 150 s (Ta = 25C, V = 3.0 V) cc Table 25.18 A/D Converter Characteristics The BGR stabilization time is started after setting bit 7 (BTRSTPN) in BGR control register (BGRMR) to 1. The stabilization time may vary due to factors such as the capacitance connected to the REF pin, so careful evaluation is necessary. 5. Before using the system, the internal reference value must be tested because there is dispersion in sample data. 6. This is the value when the BGR is not used. 7. The error for each item varies depending on factors such as temperature, voltage, conversion time, and sample variation. It is therefore necessary to perform careful evaluation under actual usage conditions. 25.4.6 LCD Characteristics 546 VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Table 25.19 LCD Characteristics 25.4.7 Power-On Reset Circuit Characteristics Condition amended 547 Condition and table amended VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, Ta = -20 to +75C (regular specifications), Ta = -40 to +85C (wide-range specifications), unless otherwise specified. Table 25.20 PowerOn Reset Circuit Characteristics Values Reference Min. Typ. Max. Unit Figure V_rst 0.7Vcc 0.8Vcc 0.9Vcc V Figure 25.1 Power supply rise time t_vtr The Vcc rise time should be shorter than half Reset count time t_out 0.8 Count start time t_cr Adjustable by the value of the external On-chip pull-up resistance Rp Item Symbol Reset voltage Test Condition the RES rise time. -- 4.0 s capacitor of the RES pin. 25.4.8 Watchdog Timer Characteristics 548 Vcc = 3.0 V 60 100 -- (Before) On-chip oscillator overflow time (After) WDT on-chip oscillator overflow time Table 25.21 Watchdog Timer Characteristics Rev. 3.00 Aug 23, 2006 Page xlviii of lxxviii k Figure 22.1 Item Page Revision (See Manual for Details) 25.7 Recommended Resonators 552 Table amended Table 25.22 Recommended Crystal Resonators B.1 I/O Port Block Diagrams 590 Frequency (MHz) Manufacturer Product Type 4.194 Kyocera Kinseki Corporation HC-491U-S 10 Kyocera Kinseki Corporation HC-491U-S Figure amended SBY Figure B.2 (g) Port 3 Block Diagram (P30) VCC VCC P30 VSS Figure B.3 (b) Port 4 Block Diagram (P41) 592 Figure amended SBY VCC P41 VSS Rev. 3.00 Aug 23, 2006 Page xlix of lxxviii Rev. 3.00 Aug 23, 2006 Page l of lxxviii Contents Section 1 Overview .................................................................................................................. 1 1.1 1.2 1.3 1.4 Features.................................................................................................................................. 1 Internal Block Diagram.......................................................................................................... 3 Pin Assignment ...................................................................................................................... 4 Pin Functions ....................................................................................................................... 17 Section 2 CPU ......................................................................................................................... 25 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 Address Space and Memory Map ........................................................................................ 26 Register Configuration......................................................................................................... 27 2.2.1 General Registers .................................................................................................... 28 2.2.2 Program Counter (PC) ............................................................................................ 29 2.2.3 Condition-Code Register (CCR) ............................................................................. 29 Data Formats........................................................................................................................ 31 2.3.1 General Register Data Formats ............................................................................... 31 2.3.2 Memory Data Formats ............................................................................................ 33 Instruction Set ...................................................................................................................... 34 2.4.1 Table of Instructions Classified by Function .......................................................... 34 2.4.2 Basic Instruction Formats ....................................................................................... 44 Addressing Modes and Effective Address Calculation ........................................................ 45 2.5.1 Addressing Modes .................................................................................................. 45 2.5.2 Effective Address Calculation ................................................................................ 49 Basic Bus Cycle ................................................................................................................... 51 2.6.1 Access to On-Chip Memory (RAM, ROM)............................................................ 51 2.6.2 On-Chip Peripheral Modules .................................................................................. 52 CPU States ........................................................................................................................... 53 Usage Notes ......................................................................................................................... 54 2.8.1 Notes on Data Access to Empty Areas ................................................................... 54 2.8.2 EEPMOV Instruction.............................................................................................. 54 2.8.3 Bit-Manipulation Instruction .................................................................................. 55 Section 3 Exception Handling ............................................................................................ 61 3.1 3.2 3.3 Exception Sources and Vector Address ............................................................................... 62 Reset..................................................................................................................................... 63 3.2.1 Reset Exception Handling....................................................................................... 63 3.2.2 Interrupt Immediately after Reset ........................................................................... 64 Interrupts.............................................................................................................................. 65 Rev. 3.00 Aug 23, 2006 Page li of lxxviii 3.4 3.5 Stack Status after Exception Handling................................................................................. 66 3.4.1 Interrupt Response Time......................................................................................... 67 Usage Notes ......................................................................................................................... 68 3.5.1 Notes on Stack Area Use ........................................................................................ 68 3.5.2 Notes on Rewriting Port Mode Registers ............................................................... 69 3.5.3 Method for Clearing Interrupt Request Flags ......................................................... 72 Section 4 Interrupt Controller ............................................................................................. 73 4.1 4.2 4.3 4.4 4.5 4.6 4.7 Features................................................................................................................................ 73 Input/Output Pins................................................................................................................. 74 Register Descriptions ........................................................................................................... 74 4.3.1 Interrupt Edge Select Register (IEGR) ................................................................... 75 4.3.2 Wakeup Edge Select Register (WEGR).................................................................. 76 4.3.3 Interrupt Enable Register 1 (IENR1) ...................................................................... 77 4.3.4 Interrupt Enable Register 2 (IENR2) ...................................................................... 78 4.3.5 Interrupt Request Register 1 (IRR1) ....................................................................... 79 4.3.6 Interrupt Request Register 2 (IRR2) ....................................................................... 80 4.3.7 Wakeup Interrupt Request Register (IWPR)........................................................... 82 4.3.8 Interrupt Priority Registers A to E (IPRA to IPRE)................................................ 84 4.3.9 Interrupt Mask Register (INTM) ............................................................................ 85 Interrupt Sources.................................................................................................................. 85 4.4.1 External Interrupts .................................................................................................. 85 4.4.2 Internal Interrupts ................................................................................................... 87 Interrupt Exception Handling Vector Table......................................................................... 87 Operation ............................................................................................................................. 90 4.6.1 Interrupt Exception Handling Sequence ................................................................. 92 4.6.2 Interrupt Response Times ....................................................................................... 94 Usage Notes ......................................................................................................................... 95 4.7.1 Contention between Interrupt Generation and Disabling........................................ 95 4.7.2 Instructions that Disable Interrupts......................................................................... 96 4.7.3 Interrupts during Execution of EEPMOV Instruction ............................................ 96 4.7.4 IENR Clearing ........................................................................................................ 96 Section 5 Clock Pulse Generators...................................................................................... 97 5.1 5.2 Register Description............................................................................................................. 99 5.1.1 SUB32k Control Register (SUB32CR)................................................................... 99 5.1.2 Oscillator Control Register (OSCCR)................................................................... 100 System Clock Generator .................................................................................................... 101 5.2.1 Connecting Crystal Resonator .............................................................................. 101 5.2.2 Connecting Ceramic Resonator ............................................................................ 102 Rev. 3.00 Aug 23, 2006 Page lii of lxxviii 5.2.3 5.2.4 5.3 5.4 5.5 External Clock Input Method................................................................................ 102 On-Chip Oscillator Selection Method (Supported only by the Masked ROM Version) ................................................... 102 Subclock Generator............................................................................................................ 103 5.3.1 Connecting 32.768-kHz/38.4-kHz Crystal Resonator........................................... 103 5.3.2 Pin Connection when not Using Subclock............................................................ 104 5.3.3 External Clock Input Method................................................................................ 105 Prescalers ........................................................................................................................... 105 5.4.1 Prescaler S............................................................................................................. 105 Usage Notes ....................................................................................................................... 106 5.5.1 Note on Resonators............................................................................................... 106 5.5.2 Notes on Board Design ......................................................................................... 108 5.5.3 Definition of Oscillation Stabilization Wait Time ................................................ 108 5.5.4 Note on Subclock Stop State................................................................................. 110 5.5.5 Note on Using Resonator ...................................................................................... 110 5.5.6 Note on Using Power-On Reset Circuit ................................................................ 110 Section 6 Power-Down Modes ......................................................................................... 111 6.1 6.2 6.3 6.4 Register Descriptions ......................................................................................................... 112 6.1.1 System Control Register 1 (SYSCR1) .................................................................. 112 6.1.2 System Control Register 2 (SYSCR2) .................................................................. 114 6.1.3 Clock Halt Registers 1 and 2 (CKSTPR1 and CKSTPR2) ................................... 115 Mode Transitions and States of LSI................................................................................... 117 6.2.1 Sleep Mode ........................................................................................................... 123 6.2.2 Standby Mode ....................................................................................................... 123 6.2.3 Watch Mode.......................................................................................................... 124 6.2.4 Subsleep Mode...................................................................................................... 124 6.2.5 Subactive Mode .................................................................................................... 125 6.2.6 Active (Medium-Speed) Mode ............................................................................. 125 Direct Transition ................................................................................................................ 126 6.3.1 Direct Transition from Active (High-Speed) Mode to Active (Medium-Speed) Mode ..................................................................................................................... 127 6.3.2 Direct Transition from Active (High-Speed) Mode to Subactive Mode............... 128 6.3.3 Direct Transition from Active (Medium-Speed) Mode to Active (High-Speed) Mode ..................................................................................................................... 128 6.3.4 Direct Transition from Active (Medium-Speed) Mode to Subactive Mode ......... 129 6.3.5 Direct Transition from Subactive Mode to Active (High-Speed) Mode............... 129 6.3.6 Direct Transition from Subactive Mode to Active (Medium-Speed) Mode ......... 130 6.3.7 Notes on External Input Signal Changes before/after Direct Transition............... 130 Module Standby Function.................................................................................................. 131 Rev. 3.00 Aug 23, 2006 Page liii of lxxviii 6.5 Usage Notes ....................................................................................................................... 131 6.5.1 Standby Mode Transition and Pin States .............................................................. 131 6.5.2 Notes on External Input Signal Changes before/after Standby Mode................... 132 Section 7 ROM ...................................................................................................................... 135 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 Block Configuration .......................................................................................................... 136 Register Descriptions ......................................................................................................... 138 7.2.1 Flash Memory Control Register 1 (FLMCR1) ..................................................... 138 7.2.2 Flash Memory Control Register 2 (FLMCR2) ..................................................... 139 7.2.3 Erase Block Register 1 (EBR1) ............................................................................ 140 7.2.4 Flash Memory Power Control Register (FLPWCR) ............................................. 141 7.2.5 Flash Memory Enable Register (FENR)............................................................... 141 On-Board Programming Modes......................................................................................... 142 7.3.1 Boot Mode ............................................................................................................ 143 7.3.2 Programming/Erasing in User Program Mode...................................................... 145 Flash Memory Programming/Erasing ................................................................................ 147 7.4.1 Program/Program-Verify ...................................................................................... 147 7.4.2 Erase/Erase-Verify................................................................................................ 150 7.4.3 Interrupt Handling when Programming/Erasing Flash Memory........................... 150 Program/Erase Protection .................................................................................................. 152 7.5.1 Hardware Protection ............................................................................................. 152 7.5.2 Software Protection .............................................................................................. 152 7.5.3 Error Protection .................................................................................................... 152 Programmer Mode ............................................................................................................. 153 Power-Down States for Flash Memory.............................................................................. 153 Notes on Setting Module Standby Mode ........................................................................... 154 Section 8 RAM ...................................................................................................................... 157 Section 9 I/O Ports ............................................................................................................... 159 9.1 9.2 Port 1.................................................................................................................................. 159 9.1.1 Port Data Register 1 (PDR1)................................................................................. 160 9.1.2 Port Control Register 1 (PCR1) ............................................................................ 160 9.1.3 Port Pull-Up Control Register 1 (PUCR1)............................................................ 161 9.1.4 Port Mode Register 1 (PMR1) .............................................................................. 161 9.1.5 Pin Functions ........................................................................................................ 162 9.1.6 Input Pull-Up MOS............................................................................................... 167 Port 3.................................................................................................................................. 168 9.2.1 Port Data Register 3 (PDR3)................................................................................. 168 9.2.2 Port Control Register 3 (PCR3) ............................................................................ 169 Rev. 3.00 Aug 23, 2006 Page liv of lxxviii 9.2.3 Port Pull-Up Control Register 3 (PUCR3)............................................................ 169 9.2.4 Port Mode Register 3 (PMR3) .............................................................................. 170 9.2.5 Pin Functions ........................................................................................................ 170 9.2.6 Input Pull-Up MOS............................................................................................... 172 9.3 Port 4.................................................................................................................................. 173 9.3.1 Port Data Register 4 (PDR4)................................................................................. 173 9.3.2 Port Control Register 4 (PCR4) ............................................................................ 174 9.3.3 Port Mode Register 4 (PMR4) .............................................................................. 175 9.3.4 Pin Functions ........................................................................................................ 176 9.4 Port 5.................................................................................................................................. 177 9.4.1 Port Data Register 5 (PDR5)................................................................................. 178 9.4.2 Port Control Register 5 (PCR5) ............................................................................ 178 9.4.3 Port Pull-Up Control Register 5 (PUCR5)............................................................ 179 9.4.4 Port Mode Register 5 (PMR5) .............................................................................. 179 9.4.5 Pin Functions ........................................................................................................ 180 9.4.6 Input Pull-Up MOS............................................................................................... 181 9.5 Port 6.................................................................................................................................. 181 9.5.1 Port Data Register 6 (PDR6)................................................................................. 182 9.5.2 Port Control Register 6 (PCR6) ............................................................................ 182 9.5.3 Port Pull-Up Control Register 6 (PUCR6)............................................................ 183 9.5.4 Pin Functions ........................................................................................................ 183 9.5.5 Input Pull-Up MOS............................................................................................... 184 9.6 Port 7.................................................................................................................................. 185 9.6.1 Port Data Register 7 (PDR7)................................................................................. 185 9.6.2 Port Control Register 7 (PCR7) ............................................................................ 186 9.6.3 Pin Functions ........................................................................................................ 186 9.7 Port 8.................................................................................................................................. 187 9.7.1 Port Data Register 8 (PDR8)................................................................................. 188 9.7.2 Port Control Register 8 (PCR8) ............................................................................ 188 9.7.3 Pin Functions ........................................................................................................ 189 9.8 Port 9.................................................................................................................................. 190 9.8.1 Port Data Register 9 (PDR9)................................................................................. 190 9.8.2 Port Control Register 9 (PCR9) ............................................................................ 191 9.8.3 Port Mode Register 9 (PMR9) .............................................................................. 191 9.8.4 Pin Functions ........................................................................................................ 192 9.9 Port A................................................................................................................................. 193 9.9.1 Port Data Register A (PDRA)............................................................................... 193 9.9.2 Port Control Register A (PCRA) .......................................................................... 194 9.9.3 Pin Functions ........................................................................................................ 194 9.10 Port B ................................................................................................................................. 196 Rev. 3.00 Aug 23, 2006 Page lv of lxxviii 9.10.1 Port Data Register B (PDRB) ............................................................................... 196 9.10.2 Port Mode Register B (PMRB)............................................................................. 197 9.10.3 Pin Functions ........................................................................................................ 198 9.11 Input/Output Data Inversion .............................................................................................. 200 9.11.1 Serial Port Control Register (SPCR)..................................................................... 200 9.12 Usage Notes ....................................................................................................................... 202 9.12.1 How to Handle Unused Pin .................................................................................. 202 Section 10 Realtime Clock (RTC) ................................................................................... 203 10.1 Features.............................................................................................................................. 203 10.2 Input/Output Pin ................................................................................................................ 204 10.3 Register Descriptions ......................................................................................................... 204 10.3.1 Second Data Register/Free Running Counter Data Register (RSECDR) ............. 205 10.3.2 Minute Data Register (RMINDR)......................................................................... 205 10.3.3 Hour Data Register (RHRDR) .............................................................................. 206 10.3.4 Day-of-Week Data Register (RWKDR) ............................................................... 207 10.3.5 RTC Control Register 1 (RTCCR1) ..................................................................... 208 10.3.6 RTC Control Register 2 (RTCCR2) ..................................................................... 209 10.3.7 Clock Source Select Register (RTCCSR) ............................................................. 210 10.3.8 RTC Interrupt Flag Register (RTCFLG) .............................................................. 211 10.4 Operation ........................................................................................................................... 212 10.4.1 Initial Settings of Registers after Power-On ......................................................... 212 10.4.2 Initial Setting Procedure ....................................................................................... 212 10.4.3 Data Reading Procedure ....................................................................................... 213 10.5 Interrupt Sources................................................................................................................ 214 10.6 Usage Note......................................................................................................................... 215 10.6.1 Note on Clock Count ............................................................................................ 215 10.6.2 Notes on Using Interrupts ..................................................................................... 215 Section 11 Timer F ............................................................................................................... 217 11.1 Features.............................................................................................................................. 217 11.2 Input/Output Pins............................................................................................................... 218 11.3 Register Descriptions ......................................................................................................... 219 11.3.1 Timer Counters FH and FL (TCFH, TCFL) ......................................................... 219 11.3.2 Output Compare Registers FH and FL (OCRFH, OCRFL).................................. 220 11.3.3 Timer Control Register F (TCR)........................................................................... 221 11.3.4 Timer Control/Status Register F (TCSRF) ........................................................... 222 11.4 Operation ........................................................................................................................... 224 11.4.1 Timer F Operation ................................................................................................ 224 11.4.2 TCF Increment Timing ......................................................................................... 225 Rev. 3.00 Aug 23, 2006 Page lvi of lxxviii 11.4.3 TMOFH/TMOFL Output Timing ......................................................................... 226 11.4.4 TCF Clear Timing................................................................................................. 226 11.4.5 Timer Overflow Flag (OVF) Set Timing .............................................................. 226 11.4.6 Compare Match Flag Set Timing.......................................................................... 227 11.5 Timer F Operating States ................................................................................................... 227 11.6 Usage Notes ....................................................................................................................... 228 11.6.1 16-Bit Timer Mode ............................................................................................... 228 11.6.2 8-Bit Timer Mode ................................................................................................. 228 11.6.3 Flag Clearing......................................................................................................... 229 11.6.4 Timer Counter (TCF) Read/Write......................................................................... 231 Section 12 16-Bit Timer Pulse Unit (TPU) ................................................................... 233 12.1 Features.............................................................................................................................. 233 12.2 Input/Output Pins ............................................................................................................... 235 12.3 Register Descriptions ......................................................................................................... 236 12.3.1 Timer Control Register (TCR).............................................................................. 237 12.3.2 Timer Mode Register (TMDR) ............................................................................. 239 12.3.3 Timer I/O Control Register (TIOR) ...................................................................... 240 12.3.4 Timer Interrupt Enable Register (TIER) ............................................................... 245 12.3.5 Timer Status Register (TSR)................................................................................. 246 12.3.6 Timer Counter (TCNT)......................................................................................... 247 12.3.7 Timer General Register (TGR) ............................................................................. 247 12.3.8 Timer Start Register (TSTR)................................................................................. 248 12.3.9 Timer Synchro Register (TSYR) .......................................................................... 249 12.4 Interface to CPU ................................................................................................................ 250 12.4.1 16-Bit Registers .................................................................................................... 250 12.4.2 8-Bit Registers ...................................................................................................... 250 12.5 Operation ........................................................................................................................... 252 12.5.1 Basic Functions..................................................................................................... 252 12.5.2 Synchronous Operation......................................................................................... 257 12.5.3 Operation with Cascaded Connection................................................................... 259 12.5.4 PWM Modes ......................................................................................................... 261 12.6 Interrupt Sources................................................................................................................ 266 12.7 Operation Timing............................................................................................................... 267 12.7.1 Input/Output Timing ............................................................................................. 267 12.7.2 Interrupt Signal Timing ........................................................................................ 270 12.8 Usage Notes ....................................................................................................................... 272 12.8.1 Module Standby Function Setting......................................................................... 272 12.8.2 Input Clock Restrictions ....................................................................................... 272 12.8.3 Caution on Period Setting ..................................................................................... 273 Rev. 3.00 Aug 23, 2006 Page lvii of lxxviii 12.8.4 Contention between TCNT Write and Clear Operation ....................................... 273 12.8.5 Contention between TCNT Write and Increment Operation ................................ 274 12.8.6 Contention between TGR Write and Compare Match .......................................... 275 12.8.7 Contention between TGR Read and Input Capture............................................... 276 12.8.8 Contention between TGR Write and Input Capture.............................................. 277 12.8.9 Contention between Overflow and Counter Clearing........................................... 278 12.8.10 Contention between TCNT Write and Overflow .................................................. 279 12.811 Multiplexing of I/O Pins ....................................................................................... 279 12.8.12 Interrupts when Module Standby Function is Used.............................................. 279 Section 13 Asynchronous Event Counter (AEC) ........................................................ 281 13.1 Features.............................................................................................................................. 281 13.2 Input/Output Pins............................................................................................................... 282 13.3 Register Descriptions ......................................................................................................... 283 13.3.1 Event Counter PWM Compare Register (ECPWCR) ........................................... 283 13.3.2 Event Counter PWM Data Register (ECPWDR).................................................. 284 13.3.3 Input Pin Edge Select Register (AEGSR)............................................................. 285 13.3.4 Event Counter Control Register (ECCR).............................................................. 286 13.3.5 Event Counter Control/Status Register (ECCSR)................................................. 287 13.3.6 Event Counter H (ECH)........................................................................................ 289 13.3.7 Event Counter L (ECL)......................................................................................... 289 13.4 Operation ........................................................................................................................... 290 13.4.1 16-Bit Counter Operation ..................................................................................... 290 13.4.2 8-Bit Counter Operation ....................................................................................... 291 13.4.3 IRQAEC Operation............................................................................................... 292 13.4.4 Event Counter PWM Operation............................................................................ 292 13.4.5 Operation of Clock Input Enable/Disable Function.............................................. 293 13.5 Operating States of Asynchronous Event Counter............................................................. 294 13.6 Usage Notes ....................................................................................................................... 295 Section 14 Watchdog Timer .............................................................................................. 297 14.1 Features.............................................................................................................................. 297 14.2 Register Descriptions ......................................................................................................... 298 14.2.1 Timer Control/Status Register WD1 (TCSRWD1)............................................... 299 14.2.2 Timer Control/Status Register WD2 (TCSRWD2)............................................... 301 14.2.3 Timer Counter WD (TCWD)................................................................................ 303 14.2.4 Timer Mode Register WD (TMWD) .................................................................... 303 14.3 Operation ........................................................................................................................... 304 14.3.1 Watchdog Timer Mode......................................................................................... 304 14.3.2 Interval Timer Mode............................................................................................. 305 Rev. 3.00 Aug 23, 2006 Page lviii of lxxviii 14.3.3 Timing of Overflow Flag (OVF) Setting .............................................................. 305 14.4 Interrupt ............................................................................................................................. 306 14.5 Usage Notes ....................................................................................................................... 306 14.5.1 Switching between Watchdog Timer Mode and Interval Timer Mode................. 306 14.5.2 Module Standby Mode Control ............................................................................ 306 Section 15 Serial Communication Interface 3 (SCI3, IrDA) ................................... 307 15.1 Features.............................................................................................................................. 307 15.2 Input/Output Pins ............................................................................................................... 311 15.3 Register Descriptions ......................................................................................................... 311 15.3.1 Receive Shift Register (RSR) ............................................................................... 312 15.3.2 Receive Data Register (RDR) ............................................................................... 312 15.3.3 Transmit Shift Register (TSR) .............................................................................. 312 15.3.4 Transmit Data Register (TDR).............................................................................. 312 15.3.5 Serial Mode Register (SMR)................................................................................. 313 15.3.6 Serial Control Register (SCR)............................................................................... 316 15.3.7 Serial Status Register (SSR) ................................................................................. 318 15.3.8 Bit Rate Register (BRR) ....................................................................................... 321 15.3.9 Serial Port Control Register (SPCR)..................................................................... 329 15.3.10 IrDA Control Register (IrCR) ............................................................................... 331 15.4 Operation in Asynchronous Mode ..................................................................................... 332 15.4.1 Clock..................................................................................................................... 333 15.4.2 SCI3 Initialization................................................................................................. 337 15.4.3 Data Transmission ................................................................................................ 338 15.4.4 Serial Data Reception ........................................................................................... 340 15.5 Operation in Clocked Synchronous Mode ......................................................................... 344 15.5.1 Clock..................................................................................................................... 344 15.5.2 SCI3 Initialization................................................................................................. 344 15.5.3 Serial Data Transmission ...................................................................................... 345 15.5.4 Serial Data Reception (Clocked Synchronous Mode)........................................... 347 15.5.5 Simultaneous Serial Data Transmission and Reception........................................ 349 15.6 IrDA Operation .................................................................................................................. 350 15.6.1 Transmission......................................................................................................... 350 15.6.2 Reception .............................................................................................................. 351 15.6.3 High-Level Pulse Width Selection........................................................................ 352 15.7 Interrupt Requests .............................................................................................................. 353 15.8 Usage Notes ....................................................................................................................... 356 15.8.1 Break Detection and Processing ........................................................................... 356 15.8.2 Mark State and Break Sending ............................................................................. 356 Rev. 3.00 Aug 23, 2006 Page lix of lxxviii 15.8.3 Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only) ..................................................................... 356 15.8.4 Receive Data Sampling Timing and Reception Margin in Asynchronous Mode..................................................................................................................... 357 15.8.5 Note on Switching SCK31 (SCK32) Pin Function ............................................... 358 15.8.6 Relation between Writing to TDR and Bit TDRE ................................................ 358 15.8.7 Relation between RDR Reading and bit RDRF.................................................... 359 15.8.8 Transmit and Receive Operations when Making State Transition........................ 359 15.8.9 Setting in Subactive or Subsleep Mode ................................................................ 360 15.8.10 Oscillator when Serial Communication Interface 3 is Used (Supported only by the Masked ROM Version) ................................................... 360 Section 16 Serial Communication Interface 4 (SCI4) ............................................... 361 16.1 Features.............................................................................................................................. 361 16.2 Input/Output Pins............................................................................................................... 362 16.3 Register Descriptions ......................................................................................................... 363 16.3.1 Serial Control Register 4 (SCR4) ......................................................................... 363 16.3.2 Serial Control/Status Register 4 (SCSR4) ............................................................ 366 16.3.3 Transmit Data Register 4 (TDR4)......................................................................... 369 16.3.4 Receive Data Register 4 (RDR4) .......................................................................... 369 16.3.5 Shift Register 4 (SR4)........................................................................................... 369 16.4 Operation ........................................................................................................................... 370 16.4.1 Clock..................................................................................................................... 370 16.4.2 Data Transfer Format............................................................................................ 370 16.4.3 Data Transmission/Reception ............................................................................... 371 16.4.4 Data Transmission ................................................................................................ 372 16.4.5 Data Reception...................................................................................................... 374 16.4.6 Simultaneous Data Transmission and Reception.................................................. 376 16.5 Interrupt Sources................................................................................................................ 377 16.6 Usage Notes ....................................................................................................................... 378 16.6.1 Relationship between Writing to TDR4 and TDRE ............................................. 378 16.6.2 Receive Error Flag and Transmission................................................................... 378 16.6.3 Relationship between Reading RDR4 and RDRF ................................................ 378 16.6.4 SCK4 Output Waveform when Internal Clock of /2 is Selected......................... 379 Section 17 14-Bit PWM ..................................................................................................... 381 17.1 Features.............................................................................................................................. 381 17.2 Input/Output Pins............................................................................................................... 382 17.3 Register Descriptions ......................................................................................................... 382 17.3.1 PWM Control Register (PWCR) .......................................................................... 382 Rev. 3.00 Aug 23, 2006 Page lx of lxxviii 17.3.2 PWM Data Register (PWDR) ............................................................................... 383 17.4 Operation ........................................................................................................................... 384 17.4.1 Pulse-Division Type PWM Operating Principle................................................... 384 17.4.2 Pulse-Division Type PWM Setting Method ......................................................... 384 17.4.3 Pulse-Div ision Type PWM Operating ................................................................. 384 17.4.4 Setting for Standard PWM Operation ................................................................... 385 17.5 PWM Operating States....................................................................................................... 386 17.6 Usage Notes ....................................................................................................................... 386 17.6.1 Timing of Effect on PWM Waveform After Writing to PWDR ........................... 386 Section 18 A/D Converter .................................................................................................. 387 18.1 Features.............................................................................................................................. 387 18.2 Input/Output Pins ............................................................................................................... 389 18.3 Register Descriptions ......................................................................................................... 389 18.3.1 A/D Result Register (ADRR) ............................................................................... 389 18.3.2 A/D Mode Register (AMR) .................................................................................. 390 18.3.3 A/D Start Register (ADSR)................................................................................... 391 18.4 Operation ........................................................................................................................... 391 18.4.1 A/D Conversion .................................................................................................... 391 18.4.2 External Trigger Input Timing.............................................................................. 392 18.4.3 Operating States of A/D Converter....................................................................... 392 18.5 Example of Use.................................................................................................................. 393 18.6 A/D Conversion Accuracy Definitions .............................................................................. 396 18.7 Usage Notes ....................................................................................................................... 398 18.7.1 Permissible Signal Source Impedance .................................................................. 398 18.7.2 Influences on Absolute Accuracy ......................................................................... 398 18.7.3 Usage Notes .......................................................................................................... 399 Section 19 A/D Converter ........................................................................................... 401 19.1 Features.............................................................................................................................. 401 19.2 Input/Output Pins ............................................................................................................... 403 19.3 Register Descriptions ......................................................................................................... 403 19.3.1 A/D Data Register (ADDR).................................................................................. 403 19.3.2 BGR Control Register (BGRMR)......................................................................... 404 19.3.3 A/D Control Register (ADCR) ............................................................................. 405 19.3.4 A/D Start/Status Register (ADSSR)...................................................................... 407 19.4 Operation ........................................................................................................................... 408 19.4.1 Wait Mode ............................................................................................................ 408 19.4.2 Continuous Mode.................................................................................................. 408 19.4.3 Operating States of A/D Converter ................................................................. 409 Rev. 3.00 Aug 23, 2006 Page lxi of lxxviii 19.5 Example of Use.................................................................................................................. 409 19.5.1 Wait Mode ............................................................................................................ 409 19.5.2 Continuous Mode.................................................................................................. 410 19.6 Usage Notes ....................................................................................................................... 414 19.6.1 Reference Voltage ................................................................................................ 414 19.6.2 Analog Voltage Stabilization Pin (ACOM Pin).................................................... 414 19.6.3 Module Standby Mode ......................................................................................... 414 19.6.4 Influences on Accuracy ........................................................................................ 414 19.6.5 PB5/Vref/REF Pin ................................................................................................ 414 Section 20 LCD Controller/Driver .................................................................................. 415 20.1 Features.............................................................................................................................. 415 20.2 Input/Output Pins............................................................................................................... 417 20.3 Register Descriptions ......................................................................................................... 417 20.3.1 LCD Port Control Register (LPCR)...................................................................... 418 20.3.2 LCD Control Register (LCR)................................................................................ 419 20.3.3 LCD Control Register 2 (LCR2)........................................................................... 421 20.3.4 LCD Trimming Register (LTRMR)...................................................................... 423 20.3.5 BGR Control Register (BGRMR)......................................................................... 425 20.4 Operation ........................................................................................................................... 426 20.4.1 Settings up to LCD Display .................................................................................. 426 20.4.2 Relationship between LCD RAM and Display..................................................... 428 20.4.3 3-V Constant-Voltage Power Supply Circuit........................................................ 433 20.4.4 Operation in Power-Down Modes ........................................................................ 434 20.4.5 Boosting LCD Drive Power Supply and Fine Adjustment ................................... 435 20.5 Usage Notes ....................................................................................................................... 436 20.5.1 Pin Processing when No LCD Controller/Driver Is Used..................................... 436 20.5.2 20.5.2 Pin Processing when No 3 V Constant Voltage Circuit Is Used................ 436 Section 21 I2C Bus Interface 2 (IIC2) ............................................................................. 437 21.1 Features.............................................................................................................................. 437 21.2 Input/Output Pins............................................................................................................... 439 21.3 Register Descriptions ......................................................................................................... 440 2 21.3.1 I C Bus Control Register 1 (ICCR1)..................................................................... 440 2 21.3.2 I C Bus Control Register 2 (ICCR2)..................................................................... 443 2 21.3.3 I C Bus Mode Register (ICMR)............................................................................ 445 2 21.3.4 I C Bus Interrupt Enable Register (ICIER) ........................................................... 447 2 21.3.5 I C Bus Status Register (ICSR)............................................................................. 449 21.3.6 Slave Address Register (SAR).............................................................................. 451 2 21.3.7 I C Bus Transmit Data Register (ICDRT) ............................................................ 452 Rev. 3.00 Aug 23, 2006 Page lxii of lxxviii 2 21.4 21.5 21.6 21.7 21.3.8 I C Bus Receive Data Register (ICDRR) .............................................................. 452 2 21.3.9 I C Bus Shift Register (ICDRS) ............................................................................ 452 Operation ........................................................................................................................... 453 2 21.4.1 I C Bus Format...................................................................................................... 453 21.4.2 Master Transmit Operation ................................................................................... 454 21.4.3 Master Receive Operation..................................................................................... 456 21.4.4 Slave Transmit Operation ..................................................................................... 459 21.4.5 Slave Receive Operation....................................................................................... 461 21.4.6 Clocked Synchronous Serial Format..................................................................... 463 21.4.7 Noise Canceler ...................................................................................................... 466 21.4.8 Example of Use..................................................................................................... 466 Interrupt Request................................................................................................................ 471 Bit Synchronous Circuit..................................................................................................... 472 Usage Notes ....................................................................................................................... 473 Section 22 Power-On Reset Circuit................................................................................. 475 22.1 Feature ............................................................................................................................... 475 22.2 Operation ........................................................................................................................... 476 22.2.1 Power-On Reset Circuit ........................................................................................ 476 Section 23 Address Break .................................................................................................. 479 23.1 Register Descriptions ......................................................................................................... 480 23.1.1 Address Break Control Register 2 (ABRKCR2)................................................... 480 23.1.2 Address Break Status Register 2 (ABRKSR2) ..................................................... 482 23.1.3 Break Address Registers 2 (BAR2H, BAR2L)..................................................... 482 23.1.4 Break Data Registers 2 (BDR2H, BDR2L) .......................................................... 482 23.2 Operation ........................................................................................................................... 483 23.3 Operating States of Address Break .................................................................................... 484 Section 24 List of Registers ............................................................................................... 485 24.1 Register Addresses (Address Order) .................................................................................. 486 24.2 Register Bits....................................................................................................................... 492 24.3 Register States in Each Operating Mode ........................................................................... 498 Section 25 Electrical Characteristics............................................................................... 503 25.1 Absolute Maximum Ratings for F-ZTAT Version ............................................................ 503 25.2 Electrical Characteristics for F-ZTAT Version.................................................................. 504 25.2.1 Power Supply Voltage and Operating Range........................................................ 504 25.2.2 DC Characteristics ................................................................................................ 507 25.2.3 AC Characteristics ................................................................................................ 513 Rev. 3.00 Aug 23, 2006 Page lxiii of lxxviii 25.3 25.4 25.5 25.6 25.7 25.8 25.2.4 A/D Converter Characteristics.............................................................................. 517 25.2.5 A/D Converter Characteristics ........................................................................ 519 25.2.6 LCD Characteristics.............................................................................................. 522 25.2.7 Power-On Reset Circuit Characteristics ............................................................... 523 25.2.8 Watchdog Timer Characteristics........................................................................... 523 25.2.9 Flash Memory Characteristics Preliminary................................................... 524 Absolute Maximum Ratings for Masked ROM Version ................................................... 526 Electrical Characteristics for Masked ROM Version......................................................... 527 25.4.1 Power Supply Voltage and Operating Range ....................................................... 527 25.4.2 DC Characteristics ................................................................................................ 530 25.4.3 AC Characteristics ................................................................................................ 536 25.4.4 A/D Converter Characteristics.............................................................................. 541 25.4.5 A/D Converter Characteristics ........................................................................ 543 25.4.6 LCD Characteristics.............................................................................................. 546 25.4.7 Power-On Reset Circuit Characteristics ............................................................... 547 25.4.8 Watchdog Timer Characteristics........................................................................... 548 Operation Timing............................................................................................................... 548 Output Load Circuit ........................................................................................................... 551 Recommended Resonator .................................................................................................. 552 Usage Note......................................................................................................................... 552 Appendix ................................................................................................................................... 553 A. B. C. D. E. F. G. Instruction Set .................................................................................................................... 553 A.1 Instruction List.......................................................................................................... 553 A.2 Operation Code Map................................................................................................. 568 A.3 Number of Execution States ..................................................................................... 571 A.4 Combinations of Instructions and Addressing Modes .............................................. 582 I/O Ports............................................................................................................................. 583 B.1 I/O Port Block Diagrams .......................................................................................... 583 B.2 Port States in Each Operating State .......................................................................... 601 Product Code Lineup ......................................................................................................... 602 Package Dimensions .......................................................................................................... 604 Chip Form Specifications .................................................................................................. 608 Bonding Pad Form ............................................................................................................. 609 Chip Tray Specifications.................................................................................................... 610 Index ........................................................................................................................................... 613 Rev. 3.00 Aug 23, 2006 Page lxiv of lxxviii Figures Section 1 Overview Figure 1.1 Internal Block Diagram of H8/38086R Group ........................................................... 3 Figure 1.2 Pin Assignment of H8/38086R Group (FP-80A, TFP-80C)....................................... 4 Figure 1.3 Pin Assignment of H8/38086R Group (TLP-85V)..................................................... 5 Figure 1.4 Pad Assignment of HCD64F38086R (Top View)...................................................... 9 Figure 1.5 Pad Assignment of HCD64338086R (Top View) .................................................... 13 Section 2 CPU Figure 2.1 Memory Map............................................................................................................ 26 Figure 2.2 CPU Registers .......................................................................................................... 27 Figure 2.3 Usage of General Registers ...................................................................................... 28 Figure 2.4 Relationship between Stack Pointer and Stack Area ................................................ 29 Figure 2.5 General Register Data Formats (1) ........................................................................... 31 Figure 2.5 General Register Data Formats (2) ........................................................................... 32 Figure 2.6 Memory Data Formats.............................................................................................. 33 Figure 2.7 Instruction Formats................................................................................................... 44 Figure 2.8 Branch Address Specification in Memory Indirect Mode ........................................ 48 Figure 2.9 On-Chip Memory Access Cycle............................................................................... 51 Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access).................................... 52 Figure 2.11 CPU Operating States............................................................................................... 53 Figure 2.12 State Transitions ....................................................................................................... 54 Figure 2.13 Example of Timer Configuration with Two Registers Allocated to Same Address....................................................................................................... 55 Section 3 Exception Handling Figure 3.1 Reset Exception Handling Sequence........................................................................ 64 Figure 3.2 Interrupt Sources and their Numbers........................................................................ 65 Figure 3.3 Stack Status after Exception Handling ..................................................................... 66 Figure 3.4 Operation when Odd Address is Set in SP ............................................................... 68 Figure 3.5 Port Mode Register (or AEGSR) Setting and Interrupt Request Flag Clearing Procedure.................................................................................................................. 71 Section 4 Interrupt Controller Figure 4.1 Block Diagram of Interrupt Controller ..................................................................... 73 Figure 4.2 Flowchart of Procedure Up to Interrupt Acceptance ................................................ 92 Figure 4.3 Interrupt Exception Handling Sequence................................................................... 93 Rev. 3.00 Aug 23, 2006 Page lxv of lxxviii Figure 4.4 Contention between Interrupt Generation and Disabling ......................................... 95 Section 5 Clock Pulse Generators Figure 5.1 Block Diagram of Clock Pulse Generators (Flash Memory Version) (1) ................ 97 Figure 5.1 Block Diagram of Clock Pulse Generators (Masked ROM Version) (2) ................. 98 Figure 5.2 Typical Connection to Crystal Resonator............................................................... 101 Figure 5.3 Typical Connection to Ceramic Resonator............................................................. 102 Figure 5.4 Example of External Clock Input ........................................................................... 102 Figure 5.5 Typical Connection to 32.768-kHz/38.4-kHz Crystal Resonator........................... 103 Figure 5.6 Equivalent Circuit of 32.768-kHz/38.4-kHz Crystal Resonator............................. 104 Figure 5.7 Pin Connection when not Using Subclock ............................................................. 104 Figure 5.8 Pin Connection when Inputting External Clock ..................................................... 105 Figure 5.9 Example of Crystal and Ceramic Resonator Arrangement..................................... 106 Figure 5.10 Negative Resistance Measurement and Circuit Modification Suggestions ............ 107 Figure 5.11 Example of Incorrect Board Design ....................................................................... 108 Figure 5.12 Oscillation Stabilization Wait Time ....................................................................... 109 Section 6 Power-Down Modes Figure 6.1 Mode Transition Diagram ...................................................................................... 118 Figure 6.2 Standby Mode Transition and Pin States................................................................ 131 Figure 6.3 External Input Signal Capture when Signal Changes before/after Standby Mode or Watch Mode....................................................................................................... 132 Section 7 ROM Figure 7.1 Flash Memory Block Configuration....................................................................... 137 Figure 7.2 Programming/Erasing Flowchart Example in User Program Mode ....................... 146 Figure 7.3 Program/Program-Verify Flowchart ...................................................................... 148 Figure 7.4 Erase/Erase-Verify Flowchart ................................................................................ 151 Figure 7.5 Module Standby Mode Setting............................................................................... 155 Section 9 I/O Ports Figure 9.1 Port 1 Pin Configuration......................................................................................... 159 Figure 9.2 Port 3 Pin Configuration......................................................................................... 168 Figure 9.3 Port 4 Pin Configuration......................................................................................... 173 Figure 9.4 Port 5 Pin Configuration......................................................................................... 177 Figure 9.5 Port 6 Pin Configuration......................................................................................... 181 Figure 9.6 Port 7 Pin Configuration......................................................................................... 185 Figure 9.7 Port 8 Pin Configuration......................................................................................... 187 Figure 9.8 Port 9 Pin Configuration......................................................................................... 190 Figure 9.9 Port A Pin Configuration........................................................................................ 193 Rev. 3.00 Aug 23, 2006 Page lxvi of lxxviii Figure 9.10 Port B Pin Configuration ........................................................................................ 196 Figure 9.11 Input/Output Data Inversion Function.................................................................... 200 Section 10 Figure 10.1 Figure 10.2 Figure 10.3 Figure 10.4 Realtime Clock (RTC) Block Diagram of RTC .......................................................................................... 203 Definition of Time Expression ............................................................................... 208 Initial Setting Procedure ......................................................................................... 212 Example: Reading of Inaccurate Time Data........................................................... 213 Section 11 Figure 11.1 Figure 11.2 Figure 11.3 Timer F Block Diagram of Timer F ..................................................................................... 218 TMOFH/TMOFL Output Timing........................................................................... 226 Clear Interrupt Request Flag when Interrupt Source Generation Signal is Valid ................................................................................................................... 231 Section 12 16-Bit Timer Pulse Unit (TPU) Figure 12.1 Block Diagram of TPU........................................................................................... 235 Figure 12.2 16-Bit Register Access Operation [CPU TCNT (16 Bits)]................................ 250 Figure 12.3 8-Bit Register Access Operation [CPU TCR (Upper 8 Bits)] ........................... 250 Figure 12.4 8-Bit Register Access Operation [CPU TMDR (Lower 8 Bits)] ....................... 251 Figure 12.5 Example of Counter Operation Setting Procedure ................................................. 252 Figure 12.6 Free-Running Counter Operation ........................................................................... 253 Figure 12.7 Periodic Counter Operation .................................................................................... 254 Figure 12.8 Example of Setting Procedure for Waveform Output by Compare Match............. 254 Figure 12.9 Example of 0 Output/1 Output Operation .............................................................. 255 Figure 12.10 Example of Toggle Output Operation .................................................................... 255 Figure 12.11 Example of Setting Procedure for Input Capture Operation................................... 256 Figure 12.12 Example of Input Capture Operation...................................................................... 256 Figure 12.13 Example of Synchronous Operation Setting Procedure ......................................... 257 Figure 12.14 Example of Synchronous Operation....................................................................... 258 Figure 12.15 Setting Procedure for Operation with Cascaded Operation.................................... 259 Figure 12.16 Example of Operation with Cascaded Connection ................................................. 260 Figure 12.17 Example of PWM Mode Setting Procedure ........................................................... 262 Figure 12.18 Example of PWM Mode Operation (1) .................................................................. 263 Figure 12.19 Example of PWM Mode Operation (2) .................................................................. 264 Figure 12.20 Example of PWM Mode Operation (3) .................................................................. 265 Figure 12.21 Count Timing in Internal Clock Operation............................................................. 267 Figure 12.22 Count Timing in External Clock Operation............................................................ 267 Figure 12.23 Output Compare Output Timing............................................................................. 268 Figure 12.24 Input Capture Input Signal Timing......................................................................... 269 Rev. 3.00 Aug 23, 2006 Page lxvii of lxxviii Figure 12.25 Figure 12.26 Figure 12.27 Figure 12.28 Figure 12.29 Figure 12.30 Figure 12.31 Figure 12.32 Figure 12.33 Figure 12.34 Figure 12.35 Figure 12.36 Figure 12.37 Counter Clear Timing (Compare Match) ............................................................... 269 Counter Clear Timing (Input Capture) ................................................................... 270 TGI Interrupt Timing (Compare Match) ................................................................ 270 TGI Interrupt Timing (Input Capture) .................................................................... 271 TCIV Interrupt Setting Timing............................................................................... 271 Timing for Status Flag Clearing by CPU ............................................................... 272 Contention between TCNT Write and Clear Operation ......................................... 273 Contention between TCNT Write and Increment Operation.................................. 274 Contention between TGR Write and Compare Match ........................................... 275 Contention between TGR Read and Input Capture ................................................ 276 Contention between TGR Write and Input Capture ............................................... 277 Contention between Overflow and Counter Clearing ............................................ 278 Contention between TCNT Write and Overflow.................................................... 279 Section 13 Figure 13.1 Figure 13.2 Figure 13.3 Figure 13.4 Figure 13.5 Asynchronous Event Counter (AEC) Block Diagram of Asynchronous Event Counter ................................................... 282 Software Procedure when Using ECH and ECL as 16-Bit Event Counter............. 290 Software Procedure when Using ECH and ECL as 8-Bit Event Counters ............. 291 Event Counter Operation Waveform...................................................................... 292 Example of Clock Control Operation..................................................................... 293 Section 14 Figure 14.1 Figure 14.2 Figure 14.3 Figure 14.4 Watchdog Timer Block Diagram of Watchdog Timer ....................................................................... 298 Example of Watchdog Timer Operation ................................................................ 304 Interval Timer Mode Operation.............................................................................. 305 Timing of OVF Flag Setting .................................................................................. 305 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Figure 15.1 (1) Block Diagram of SCI3_1 .................................................................................. 309 Figure 15.1 (2) Block Diagram of SCI3_2 .................................................................................. 310 Figure 15.2 Data Format in Asynchronous Communication ..................................................... 332 Figure 15.3 Relationship between Output Clock and Transfer Data Phase (Asynchronous Mode) (Example with 8-Bit Data, Parity, Two Stop Bits) ............ 333 Figure 15.4 Sample SCI3 Initialization Flowchart .................................................................... 337 Figure 15.5 Example SCI3 Operation in Transmission in Asynchronous Mode (8-Bit Data, Parity, One Stop Bit) .......................................................................... 338 Figure 15.6 Sample Serial Transmission Flowchart (Asynchronous Mode) ............................. 339 Figure 15.7 Example SCI3 Operation in Reception in Asynchronous Mode (8-Bit Data, Parity, One Stop Bit) .......................................................................... 341 Figure 15.8 Sample Serial Data Reception Flowchart (Asynchronous Mode) (1) .................... 342 Rev. 3.00 Aug 23, 2006 Page lxviii of lxxviii Figure 15.8 Figure 15.9 Figure 15.10 Figure 15.11 Figure 15.12 Figure 15.13 Figure 15.14 Sample Serial Data Reception Flowchart (Asynchronous Mode) (2)..................... 343 Data Format in Clocked Synchronous Communication ......................................... 344 Example of SCI3 Operation in Transmission in Clocked Synchronous Mode....... 345 Sample Serial Transmission Flowchart (Clocked Synchronous Mode) ................. 346 Example of SCI3 Reception Operation in Clocked Synchronous Mode ................ 347 Sample Serial Reception Flowchart (Clocked Synchronous Mode)....................... 348 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations (Clocked Synchronous Mode) ................................................................................ 349 Figure 15.15 IrDA Block Diagram .............................................................................................. 350 Figure 15.16 IrDA Transmission and Reception ......................................................................... 351 Figure 15.17 (a) RDRF Setting and RXI Interrupt ...................................................................... 355 Figure 15.17 (b) TDRE Setting and TXI Interrupt ...................................................................... 355 Figure 15.17 (c) TEND Setting and TEI Interrupt....................................................................... 355 Figure 15.18 Receive Data Sampling Timing in Asynchronous Mode ....................................... 357 Figure 15.19 Relation between RDR Read Timing and Data...................................................... 359 Section 16 Serial Communication Interface 4 (SCI4) Figure 16.1 Block Diagram of SCI4 .......................................................................................... 362 Figure 16.2 Data Transfer Format ............................................................................................. 370 Figure 16.3 Flowchart Example of SCI4 Initialization.............................................................. 371 Figure 16.4 Flowchart Example of Data Transmission ............................................................. 372 Figure 16.5 Transmit Operation Example ................................................................................. 373 Figure 16.6 Flowchart Example of Data Reception................................................................... 374 Figure 16.7 Receive Operation Example ................................................................................... 375 Figure 16.8 Flowchart Example of Simultaneous Transmission and Reception ....................... 376 Figure 16.9 Relationship between Reading RDR4 and RDRF .................................................. 379 Figure 16.10 Transfer Format when Internal Clock of /2 is Selected ........................................ 379 Section 17 Figure 17.1 Figure 17.2 Figure 17.3 14-Bit PWM Block Diagram of 14-Bit PWM.............................................................................. 381 Example of Pulse-Division Type PWM Using Division by Four........................... 384 PWM Output Waveform ........................................................................................ 385 Section 18 Figure 18.1 Figure 18.2 Figure 18.3 Figure 18.4 Figure 18.5 Figure 18.6 A/D Converter Block Diagram of A/D Converter .......................................................................... 388 External Trigger Input Timing ............................................................................... 392 Example of A/D Conversion Operation ................................................................. 394 Flowchart of Procedure for Using A/D Converter (Polling by Software) .............. 395 Flowchart of Procedure for Using A/D Converter (Interrupts Used) ..................... 395 A/D Conversion Accuracy Definitions (1) ............................................................. 397 Rev. 3.00 Aug 23, 2006 Page lxix of lxxviii Figure 18.7 A/D Conversion Accuracy Definitions (2)............................................................. 397 Figure 18.8 Example of Analog Input Circuit ........................................................................... 398 Section 19 Figure 19.1 Figure 19.2 Figure 19.3 Figure 19.4 Figure 19.5 A/D Converter Block Diagram of A/D Converter..................................................................... 402 Example of A/D Conversion Operation (Wait Mode) ...................................... 411 Flowchart of Procedure for Using A/D Converter (Polling by Software) ........ 412 Flowchart of Procedure for Using A/D Converter (Interrupts Used) ............... 412 Example of A/D Conversion Operation (Continuous Mode) ........................... 413 Section 20 Figure 20.1 Figure 20.2 Figure 20.3 Figure 20.4 Figure 20.5 Figure 20.6 Figure 20.7 Figure 20.8 Figure 20.9 LCD Controller/Driver Block Diagram of LCD Controller/Driver ............................................................. 416 Handling of LCD Drive Power Supply when Using 1/2 Duty ............................... 426 LCD RAM Map (1/4 Duty).................................................................................... 428 LCD RAM Map (1/3 Duty).................................................................................... 429 LCD RAM Map (1/2 Duty).................................................................................... 429 LCD RAM Map (Static Mode)............................................................................... 430 Output Waveforms for Each Duty Cycle (A Waveform) ....................................... 431 Output Waveforms for Each Duty Cycle (B Waveform) ....................................... 432 Capacitance Connection when Using 3-V Constant-Voltage Power Supply Circuit..................................................................................................................... 434 Figure 20.10 Connection of External Split Resistor .................................................................... 436 2 Section 21 I C Bus Interface 2 (IIC2) 2 Figure 21.1 Block Diagram of I C Bus Interface 2.................................................................... 438 Figure 21.2 External Circuit Connections of I/O Pins ............................................................... 439 2 Figure 21.3 I C Bus Formats...................................................................................................... 453 2 Figure 21.4 I C Bus Timing ....................................................................................................... 453 Figure 21.5 Master Transmit Mode Operation Timing (1) ........................................................ 455 Figure 21.6 Master Transmit Mode Operation Timing (2) ........................................................ 455 Figure 21.7 Master Receive Mode Operation Timing (1) ......................................................... 457 Figure 21.8 Master Receive Mode Operation Timing (2) ......................................................... 458 Figure 21.9 Slave Transmit Mode Operation Timing (1) .......................................................... 460 Figure 21.10 Slave Transmit Mode Operation Timing (2) .......................................................... 461 Figure 21.11 Slave Receive Mode Operation Timing (1)............................................................ 462 Figure 21.12 Slave Receive Mode Operation Timing (2)............................................................ 462 Figure 21.13 Clocked Synchronous Serial Transfer Format........................................................ 463 Figure 21.14 Transmit Mode Operation Timing.......................................................................... 464 Figure 21.15 Receive Mode Operation Timing ........................................................................... 465 Figure 21.16 Block Diagram of Noise Conceler ......................................................................... 466 Rev. 3.00 Aug 23, 2006 Page lxx of lxxviii Figure 21.17 Figure 21.18 Figure 21.19 Figure 21.20 Figure 21.21 Sample Flowchart for Master Transmit Mode........................................................ 467 Sample Flowchart for Master Receive Mode ......................................................... 468 Sample Flowchart for Slave Transmit Mode.......................................................... 469 Sample Flowchart for Slave Receive Mode ........................................................... 470 Timing of Bit Synchronous Circuit ........................................................................ 472 Section 22 Power-On Reset Circuit Figure 22.1 Power-On Reset Circuit.......................................................................................... 475 Figure 22.2 Power-On Reset Circuit Operation Timing ............................................................ 477 Section 23 Figure 23.1 Figure 23.2 Figure 23.2 Address Break Block Diagram of Address Break........................................................................... 479 Address Break Interrupt Operation Example (1).................................................... 483 Address Break Interrupt Operation Example (2).................................................... 484 Section 25 Figure 25.1 Figure 25.2 Figure 25.3 Figure 25.4 Figure 25.5 Figure 25.6 Figure 25.7 Figure 25.8 Figure 25.9 Electrical Characteristics Power-On Reset Circuit Reset Timing ................................................................... 547 Clock Input Timing ................................................................................................ 548 RES Low Width Timing......................................................................................... 548 Input Timing........................................................................................................... 549 SCK3 Input Clock Timing...................................................................................... 549 SCI3 Input/Output Timing in Clocked Synchronous Mode ................................... 550 Clock Input Timing for TCLKA to TCLKC Pins................................................... 550 2 I C Bus Interface Input/Output Timing .................................................................. 551 Output Load Condition........................................................................................... 551 Appendix Figure B.1 (a) Figure B.1 (b) Figure B.1 (c) Figure B.1 (d) Figure B.2 (a) Figure B.2 (b) Figure B.2 (c) Figure B.2 (d) Figure B.2 (e) Figure B.2 (f) Figure B.2 (g) Figure B.3 (a) Figure B.3 (b) Port 1 Block Diagram (P16) (F-ZTAT Version)................................................. 583 Port 1 Block Diagram (P16) (Masked ROM Version)........................................ 584 Port 1 Block Diagram (P15 to P12) .................................................................... 584 Port 1 Block Diagram (P11, P10) ....................................................................... 585 Port 3 Block Diagram (P37) (F-ZTAT Version)................................................. 586 Port 3 Block Diagram (P37) (Masked ROM Version)........................................ 586 Port 3 Block Diagram (P36) (F-ZTAT Version)................................................. 587 Port 3 Block Diagram (P36) (Masked ROM Version)........................................ 587 Port 3 Block Diagram (P32) ............................................................................... 588 Port 3 Block Diagram (P31) ............................................................................... 589 Port 3 Block Diagram (P30) ............................................................................... 590 Port 4 Block Diagram (P42) ............................................................................... 591 Port 4 Block Diagram (P41) ............................................................................... 592 Rev. 3.00 Aug 23, 2006 Page lxxi of lxxviii Figure B.3 (c) Port 4 Block Diagram (P40) ............................................................................... 593 Figure B.4 Port 5 Block Diagram ......................................................................................... 594 Figure B.5 Port 6 Block Diagram ......................................................................................... 595 Figure B.6 Port 7 Block Diagram ......................................................................................... 595 Figure B.7 Port 8 Block Diagram ......................................................................................... 596 Figure B.8 (a) Port 9 Block Diagram (P93) ............................................................................... 596 Figure B.8 (b) Port 9 Block Diagram (P92) ............................................................................... 597 Figure B.8 (c) Port 9 Block Diagram (P91, P90) ....................................................................... 598 Figure B.9 Port A Block Diagram ........................................................................................ 598 Figure B.10 (a) Port B Block Diagram (PB7, PB6) ..................................................................... 599 Figure B.10 (b) Port B Block Diagram (PB5) .............................................................................. 599 Figure B.10 (c) Port B Block Diagram (PB2 to PB0) .................................................................. 600 Figure D.1 Package Dimensions (FP-80A) .............................................................................. 605 Figure D.2 Package Dimensions (TFP-80C) ............................................................................ 606 Figure D.3 Package Dimensions (TLP-85V)............................................................................ 607 Figure E.1 Cross-Sectional View of Chip (HCD64338086R, HCD64338085R, HCD64338084R, and HCD64338083R)..... 608 Figure E.2 Cross-Sectional View of Chip (HCD64F38086R) ................................................. 608 Figure F.1 Bonding Pad Form (HCD64F38086R, HCD64338086R, HCD64338085R, HCD64338084R, and HCD64338083R)............................................................................................. 609 Figure G.1 Chip Tray Specifications (HCD64338086R, HCD64338085R, HCD64338084R, and HCD64338083R)..... 610 Figure G.2 Chip Tray Specifications (HCD64F38086R) ......................................................... 611 Rev. 3.00 Aug 23, 2006 Page lxxii of lxxviii Tables Section 1 Overview Table 1.1 TLP-85V Pin Correspondence .................................................................................... 6 Table 1.2 Pad Coordinate of HCD64F38086R.......................................................................... 10 Table 1.3 Pad Coordinate of HCD64338086R.......................................................................... 14 Table 1.4 Pin Functions............................................................................................................. 17 Section 2 CPU Table 2.1 Operation Notation.................................................................................................... 34 Table 2.2 Data Transfer Instructions ......................................................................................... 35 Table 2.3 Arithmetic Operations Instructions (1)...................................................................... 36 Table 2.3 Arithmetic Operations Instructions (2)...................................................................... 37 Table 2.4 Logic Operations Instructions ................................................................................... 38 Table 2.5 Shift Instructions ....................................................................................................... 38 Table 2.6 Bit Manipulation Instructions (1) .............................................................................. 39 Table 2.6 Bit Manipulation Instructions (2) .............................................................................. 40 Table 2.7 Branch Instructions ................................................................................................... 41 Table 2.8 System Control Instructions ...................................................................................... 42 Table 2.9 Block Data Transfer Instructions .............................................................................. 43 Table 2.10 Addressing Modes..................................................................................................... 45 Table 2.11 Absolute Address Access Ranges ............................................................................. 47 Table 2.12 Effective Address Calculation (1) ............................................................................. 49 Table 2.12 Effective Address Calculation (2) ............................................................................. 50 Section 3 Exception Handling Table 3.1 Exception Sources and Vector Address .................................................................... 62 Table 3.2 Reset Sources ............................................................................................................ 63 Table 3.3 Interrupt Wait States.................................................................................................. 67 Table 3.4 Conditions under which Interrupt Request Flag is Set to 1 ....................................... 70 Section 4 Interrupt Controller Table 4.1 Pin Configuration ...................................................................................................... 74 Table 4.2 Interrupt Sources, Vector Addresses, and Interrupt Priorities ................................... 88 Table 4.3 Interrupt Control States ............................................................................................. 90 Table 4.4 Interrupt Response Times (States)............................................................................. 94 Rev. 3.00 Aug 23, 2006 Page lxxiii of lxxviii Section 5 Clock Pulse Generators Table 5.1 Selection Method for System Clock Oscillator and On-Chip Oscillator................. 103 Section 6 Power-Down Modes Table 6.1 Operating Frequency and Waiting Time ................................................................. 113 Table 6.2 Transition Mode after SLEEP Instruction Execution and Interrupt Handling ........ 119 Table 6.3 Internal State in Each Operating Mode ................................................................... 122 Section 7 ROM Table 7.1 Setting Programming Modes................................................................................... 142 Table 7.2 Boot Mode Operation.............................................................................................. 144 Table 7.3 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is Possible ................................................................................................................... 145 Table 7.4 Reprogram Data Computation Table ...................................................................... 149 Table 7.5 Additional-Program Data Computation Table ........................................................ 149 Table 7.6 Programming Time ................................................................................................. 149 Table 7.7 Flash Memory Operating States .............................................................................. 154 Section 10 Realtime Clock (RTC) Table 10.1 Pin Configuration .................................................................................................... 204 Table 10.2 Interrupt Sources ..................................................................................................... 214 Section 11 Timer F Table 11.1 Pin Configuration .................................................................................................... 218 Table 11.2 Timer F Operating States ........................................................................................ 227 Section 12 Table 12.1 Table 12.2 Table 12.3 Table 12.4 Table 12.5 Table 12.6 Table 12.7 Table 12.8 Table 12.9 Table 12.10 Table 12.11 Table 12.12 Table 12.13 16-Bit Timer Pulse Unit (TPU) TPU Functions ........................................................................................................ 234 Pin Configuration .................................................................................................... 235 CCLR1 and CCLR0 (Channels 1 and 2) ................................................................. 238 TPSC2 to TPSC0 (Channel 1)................................................................................. 238 TPSC2 to TPSC0 (Channel 2)................................................................................. 239 MD3 to MD0........................................................................................................... 240 TIOR_1 (Channel 1) ............................................................................................... 241 TIOR_2 (Channel 2) ............................................................................................... 242 TIOR_1 (Channel 1) ............................................................................................... 243 TIOR_2 (Channel 2) ............................................................................................... 244 Counter Combination in Operation with Cascaded Connection ............................. 259 PWM Output Registers and Output Pins................................................................. 262 TPU Interrupts......................................................................................................... 266 Rev. 3.00 Aug 23, 2006 Page lxxiv of lxxviii Section 13 Asynchronous Event Counter (AEC) Table 13.1 Pin Configuration .................................................................................................... 282 Table 13.2 Examples of Event Counter PWM Operation ......................................................... 293 Table 13.3 Operating States of Asynchronous Event Counter .................................................. 294 Table 13.4 Maximum Clock Frequency.................................................................................... 295 Section 15 Table 15.1 Table 15.2 Table 15.3 Table 15.3 Table 15.3 Table 15.3 Table 15.4 Table 15.5 Table 15.6 Table 15.6 Table 15.7 Table 15.8 Table 15.9 Table 15.10 Table 15.11 Table 15.12 Table 15.13 Table 15.14 Serial Communication Interface 3 (SCI3, IrDA) SCI3 Channel Configuration ................................................................................... 308 Pin Configuration .................................................................................................... 311 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1)......... 322 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2)......... 323 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (3)......... 324 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (4)......... 325 Relation between n and Clock................................................................................. 325 Maximum Bit Rate for Each Frequency (Asynchronous Mode)............................. 326 BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (1).................. 327 BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (2).................. 328 Relation between n and Clock................................................................................. 329 Data Transfer Formats (Asynchronous Mode)........................................................ 334 SMR Settings and Corresponding Data Transfer Formats ...................................... 335 SMR and SCR Settings and Clock Source Selection .............................................. 336 SSR Status Flags and Receive Data Handling......................................................... 341 IrCKS2 to IrCKS0 Bit Settings ............................................................................... 352 SCI3 Interrupt Requests .......................................................................................... 353 Transmit/Receive Interrupts .................................................................................... 354 Section 16 Serial Communication Interface 4 (SCI4) Table 16.1 Pin Configuration .................................................................................................... 362 Table 16.2 Prescaler Division Ratio and Transfer Clock Cycle (Internal Clock) ..................... 368 Table 16.3 SCI4 Interrupt Sources ............................................................................................ 377 Section 17 14-Bit PWM Table 17.1 Pin Configuration .................................................................................................... 382 Table 17.2 Correspondence Between PWCR, PWRD, and Output Waveform......................... 385 Table 17.3 PWM Operating States............................................................................................ 386 Section 18 A/D Converter Table 18.1 Pin Configuration .................................................................................................... 389 Table 18.2 Operating States of A/D Converter ......................................................................... 392 Rev. 3.00 Aug 23, 2006 Page lxxv of lxxviii Section 19 A/D Converter Table 19.1 Pin Configuration .................................................................................................... 403 Table 19.2 Operating States of A/D Converter ................................................................... 409 Section 20 LCD Controller/Driver Table 20.1 Pin Configuration .................................................................................................... 417 Table 20.2 Duty Cycle and Common Function Selection ......................................................... 418 Table 20.3 Segment Driver Selection ....................................................................................... 419 Table 20.4 Frame Frequency Selection..................................................................................... 421 Table 20.5 Output Levels.......................................................................................................... 433 Table 20.6 Power-Down Modes and Display Operation........................................................... 435 2 Section 21 I C Bus Interface 2 (IIC2) Table 21.1 Pin Configuration .................................................................................................... 439 Table 21.2 Transfer Rate........................................................................................................... 442 Table 21.3 Interrupt Requests ................................................................................................... 471 Table 21.4 Time for Monitoring SCL ....................................................................................... 472 Section 23 Address Break Table 23.1 Access and Data Bus Used...................................................................................... 481 Table 23.2 Operating States of Address Break ......................................................................... 484 Section 25 Table 25.1 Table 25.2 Table 25.3 Table 25.4 Table 25.5 Table 25.6 Table 25.7 Table 25.8 Table 25.9 Table 25.10 Table 25.11 Table 25.12 Table 25.13 Table 25.14 Table 25.15 Table 25.16 Table 25.17 Electrical Characteristics Absolute Maximum Ratings.................................................................................... 503 DC Characteristics .................................................................................................. 507 Control Signal Timing............................................................................................. 513 Serial Interface Timing ........................................................................................... 516 2 I C Bus Interface Timing......................................................................................... 517 A/D Converter Characteristics ................................................................................ 518 A/D Converter Characteristics .......................................................................... 519 LCD Characteristics ................................................................................................ 522 Power-On Reset Circuit Characteristics.................................................................. 523 Watchdog Timer Characteristics ............................................................................. 523 Flash Memory Characteristics................................................................................. 524 Absolute Maximum Ratings.................................................................................... 526 DC Characteristics .................................................................................................. 530 Control Signal Timing............................................................................................. 536 Serial Interface Timing ........................................................................................... 539 2 I C Bus Interface Timing......................................................................................... 540 A/D Converter Characteristics ................................................................................ 541 Rev. 3.00 Aug 23, 2006 Page lxxvi of lxxviii Table 25.18 Table 25.19 Table 25.20 Table 25.21 Table 25.22 Table 25.23 A/D Converter Characteristics........................................................................... 543 LCD Characteristics ................................................................................................ 546 Power-On Reset Circuit Characteristics .................................................................. 547 Watchdog Timer Characteristics ............................................................................. 548 Recommended Crystal Resonators.......................................................................... 552 Recommended Ceramic Resonators........................................................................ 552 Appendix Table A.1 Table A.2 Table A.2 Table A.2 Table A.3 Table A.4 Table A.5 Instruction Set ......................................................................................................... 555 Operation Code Map (1) ......................................................................................... 568 Operation Code Map (2) ......................................................................................... 569 Operation Code Map (3) ......................................................................................... 570 Number of Cycles in Each Instruction .................................................................... 572 Number of Cycles in Each Instruction .................................................................... 573 Combinations of Instructions and Addressing Modes............................................. 582 Rev. 3.00 Aug 23, 2006 Page lxxvii of lxxviii Rev. 3.00 Aug 23, 2006 Page lxxviii of lxxviii Section 1 Overview Section 1 Overview 1.1 Features * High-speed H8/300H central processing unit with an internal 16-bit architecture Upward-compatible with H8/300 CPU on an object level Sixteen 16-bit general registers 62 basic instructions * Various peripheral functions RTC (can be used as a free-running counter) Asynchronous event counter (AEC) LCD controller/driver Timer F 16-bit timer pulse unit (TPU) 14-bit PWM Watchdog timer SCI (Asynchronous or clocked synchronous serial communication interface) 2 2 I C bus interface (conforms to the I C bus interface format that is advocated by Philips Electronics) 10-bit A/D converter 14-bit A/D converter Rev. 3.00 Aug 23, 2006 Page 1 of 616 REJ09B0182-0300 Section 1 Overview * On-chip memory Product Classification Model ROM RAM Flash memory version (F-ZTATTM version) H8/38086RF HD64F38086R 52 kbytes* 2 kbytes Masked ROM version H8/38086R HD64338086R 48 kbytes 2 kbytes H8/38085R HD64338085R 40 kbytes 2 kbytes H8/38084R HD64338084R 32 kbytes 1 kbyte H8/38083R HD64338083R 24 kbytes 1 kbyte TM Note: F-ZTAT is a trademark of Renesas Technology Corp. * 4-kbyte area of 52-kbyte ROM is used for the on-chip debugger. When the on-chip debugger is not used, 52-kbyte area is available. * General I/O ports I/O pins: 55 I/O pins, including 4 large current ports (IOL = 15 mA, @VOL = 1.0 V) Input-only pins: 8 input pins * Supports various power-down states * Compact package Package Code Old Code Body Size Pin Pitch QFP-80 PRQP0080JB-A FP-80A 14 x 14 mm 0.65 mm TQFP-80 PTQP0080KC-A TFP-80C P-TFLGA-85 PTLG0085JA-A TLP-85V Rev. 3.00 Aug 23, 2006 Page 2 of 616 REJ09B0182-0300 12 x 12 mm 7 x 7 mm 0.5 mm 0.65 mm Remarks Section 1 Overview 1.2 Internal Block Diagram X1 X2 OSC1 OSC2 Subclock generator H8/300H CPU System clock generator System clock on-chip generator*3 Port 6 P60/SEG9 P61/SEG10 P62/SEG11 P63/SEG12 P64/SEG13 P65/SEG14 P66/SEG15 P67/SEG16 14-bit PWM2 10-bit A/D converter Realtime clock Asynchronous event counter Timer F I2C bus interface LCD controller/driver SCI3_1/IrDA SCI3_2 Address break SCI4*1 P90/PWM1 P91/PWM2 P92/IRQ4 P93 PA0/COM1 PA1/COM2 PA2/COM3 PA3/COM4 LCD power supply Port 8 14-bit PWM1 P80/SEG25 P81/SEG26 P82/SEG27 P83/SEG28 P84/SEG29 P85/SEG30 P86/SEG31 P87/SEG32 Port 9 Power-on reset circuit Port A Watchdog timer Port 5 IRQAEC P50/WKP0/SEG1 P51/WKP1/SEG2 P52/WKP2/SEG3 P53/WKP3/SEG4 P54/WKP4/SEG5 P55/WKP5/SEG6 P56/WKP6/SEG7 P57/WKP7/SEG8 Port 7 Port 1 Timer pulse unit 14-bit A/D converter Port B P40/SCK31/TMIF P41/RXD31/IrRXD/TMOFL P42/TXD31/IrTXD/TMOFH RAM Port 3 P30/SCK32/TMOW P31/RXD32/SDA P32/TXD32/SCL 1 2 P36/SI4 * * 1 2 * P37/SO4 * ROM Port 4 P10/AEVH P11/AEVL P12/TIOCA1/TCLKA P13/TIOCB1/TCLKB P14/TIOCA2/TCLKC P15/TIOCB2 1 2 P16/SCK4 * * DVcc Vcc AVcc Vss AVss RES TEST/ADTRG 2 NMI * P70/SEG17 P71/SEG18 P72/SEG19 P73/SEG20 P74/SEG21 P75/SEG22 P76/SEG23 P77/SEG24 V1 V2 V3 C1 C2 PB0/AN0/IRQ0 PB1/AN1/IRQ1 PB2/AN2/IRQ3 ACOM PB5/Vref/REF PB6/Ain2 PB7/Ain1 : Large current port (15 mA) Notes: 1. The SCI4 pins, such as SCK4, SI4, and SO4, are supported only by the F-ZTAT version. 2. The SCK4, SI4, SO4, and NMI pins are not available when the E7 or on-chip debugger is used. These pins are not available as ports. 3. Supported only by the masked ROM version. Figure 1.1 Internal Block Diagram of H8/38086R Group Rev. 3.00 Aug 23, 2006 Page 3 of 616 REJ09B0182-0300 Section 1 Overview Pin Assignment 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 FP-80A, TFP-80C (Top view) 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 P61/SEG10 P60/SEG9 P57/WKP7/SEG8 P56/WKP6/SEG7 P55/WKP5/SEG6 P54/WKP4/SEG5 P53/WKP3/SEG4 P52/WKP2/SEG3 P51/WKP1/SEG2 P50/WKP0/SEG1 PA3/COM4 PA2/COM3 PA1/COM2 PA0/COM1 V3 V2 V1 (also used with 3-V booster) C2 C1 Vcc P13/TIOCB1/TCLKB P14/TIOCA2/TCLKC P15/TIOCB2 P16/SCK4 P30/SCK32/TMOW P31/RXD32/SDA P32/TXD32/SCL P36/SI4 P37/SO4 X1 X2 Vss OSC2 OSC1 TEST/ADTRG RES NMI P40/SCK31/TMIF P41/RXD31/IrRXD/TMOFL P42/TXD31/IrTXD/TMOFH 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 P86/SEG31 P87/SEG32 PB7/Ain1 PB6/Ain2 PB5/Vref/REF ACOM DVcc AVss AVcc PB2/AN2/IRQ3 PB1/AN1/IRQ1 PB0/AN0/IRQ0 IRQAEC P90/PWM1 P91/PWM2 P92/IRQ4 P93 P10/AEVH P11/AEVL P12/TIOCA1/TCLKA 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 P85/SEG30 P84/SEG29 P83/SEG28 P82/SEG27 P81/SEG26 P80/SEG25 P77/SEG24 P76/SEG23 P75/SEG22 P74/SEG21 P73/SEG20 P72/SEG19 P71/SEG18 P70/SEG17 P67/SEG16 P66/SEG15 P65/SEG14 P64/SEG13 P63/SEG12 P62/SEG11 1.3 Figure 1.2 Pin Assignment of H8/38086R Group (FP-80A, TFP-80C) Rev. 3.00 Aug 23, 2006 Page 4 of 616 REJ09B0182-0300 Section 1 Overview A10 B10 C10 D10 E10 F10 G10 H10 J10 K10 A9 B9 C9 D9 E9 F9 G9 H9 J9 K9 A8 B8 C8 D8 E8 F8 G8 H8 J8 K8 A7 B7 C7 H7 J7 K7 A6 B6 C6 H6 J6 K6 H5 J5 K5 H4 J4 K4 TLP-85V (Top view) A5 B5 C5 A4 B4 C4 D4 A3 B3 C3 D3 E3 F3 G3 H3 J3 K3 A2 B2 C2 D2 E2 F2 G2 H2 J2 K2 A1 B1 C1 D1 E1 F1 G1 H1 J1 K1 Note: For details on pin correspondence, refer to table 1.1. Figure 1.3 Pin Assignment of H8/38086R Group (TLP-85V) Rev. 3.00 Aug 23, 2006 Page 5 of 616 REJ09B0182-0300 Section 1 Overview Table 1.1 TLP-85V Pin Correspondence Pin Name H8/38086R Group Pin Symbol (TLP-85V) P13/TIOCB1/TCLKB B1 P14/TIOCA2/TCLKC C1 P15/TIOCB2 B2 P16/SCK4 C2 P30/SCK32/TMOW D1 P31/RXD32/SDA D3 P32/TXD32/SCL D2 P36/SI4 E1 P37/SO4 E3 X1 F2 X2 E2 Vss F3 OSC2 G3 OSC1 F1 TEST/ADTRG G2 RES H2 NMI G1 P40/SCK31/TMIF H3 P41/RXD31/IrRXD/TMOFL J1 P42/TXD31/IrTXD/TMOFH H1 NC K1 Vcc K2 C1 K3 C2 J2 V1 J3 V2 K4 V3 H4 PA0/COM1 J4 PA1/COM2 K5 Rev. 3.00 Aug 23, 2006 Page 6 of 616 REJ09B0182-0300 Section 1 Overview Pin Name H8/38086R Group Pin Symbol (TLP-85V) PA2/COM3 H5 PA3/COM4 J6 P50/WKP0/SEG1 J5 P51/WKP1/SEG2 H6 P52/WKP2/SEG3 H7 P53/WKP3/SEG4 K6 P54/WKP4/SEG5 J7 P55/WKP5/SEG6 J8 P56/WKP6/SEG7 K7 P57/WKP7/SEG8 H8 P60/SEG9 K9 P61/SEG10 K8 NC K10 P62/SEG11 J10 P63/SEG12 H10 P64/SEG13 J9 P65/SEG14 H9 P66/SEG15 G10 P67/SEG16 G8 P70/SEG17 G9 P71/SEG18 F10 P72/SEG19 F8 P73/SEG20 E9 P74/SEG21 F9 P75/SEG22 E8 P76/SEG23 D8 P77/SEG24 E10 P80/SEG25 D9 P81/SEG26 C9 P82/SEG27 D10 P83/SEG28 C8 Rev. 3.00 Aug 23, 2006 Page 7 of 616 REJ09B0182-0300 Section 1 Overview Pin Name H8/38086R Group Pin Symbol (TLP-85V) P84/SEG29 B10 P85/SEG30 C10 NC A10 P86/SEG31 A9 P87/SEG32 A8 PB7/Ain1 B9 PB6/Ain2 B8 PB5/Vref/REF A7 ACOM C7 DVcc B7 AVss A6 AVcc C6 PB2/AN2/IRQ3 B5 PB1/AN1/IRQ1 B6 PB0/AN0/IRQ0 C5 IRQAEC C4 P90/PWM1 A5 P91/PWM2 B4 P92/IRQ4 B3 P93 A4 P10/AEVH C3 P11/AEVL A2 P12/TIOCA1/TCLKA A3 NC A1 NC D4 Rev. 3.00 Aug 23, 2006 Page 8 of 616 REJ09B0182-0300 Section 1 Overview 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 Model name 61 1 60 2 59 3 58 4 57 5 56 6 7 55 Y 8 54 9 53 10 52 (0, 0) 11 51 X 50 12 13 14 49 48 15 16 17 47 46 18 45 19 44 43 20 42 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 Product model name Model name on chip HCD64F38086R HD64F38086R Chip size: 4.73mm x 4.73mm Voltage level on the back of the chip: GND : NC pad Figure 1.4 Pad Assignment of HCD64F38086R (Top View) Rev. 3.00 Aug 23, 2006 Page 9 of 616 REJ09B0182-0300 Section 1 Overview Table 1.2 Pad Coordinate of HCD64F38086R Coordinate Pad No. Pad Name X ( m) Y ( m) 1 P13/TIOCB1/TCLKB -2223 1797 2 P14/TIOCA2/TCLKC -2223 1615 3 P15/TIOCB2 -2223 1434 4 P16/SCK4 -2223 1295 5 P30/SCK32/TMOW -2223 1150 6 P31/RXD32/SDA -2223 941 7 P32/TXD32/SCL -2223 732 8 P36/SI4 -2223 523 9 P37/SO4 -2223 314 10 X1 -2223 105 11 X2 -2223 -105 12 Vss -2223 -314 13 Vss -2223 -418 14 OSC2 -2223 -523 15 OSC1 -2223 -732 16 TEST/ADTRG -2223 -941 17 RES -2223 -1150 18 NMI -2223 -1360 19 P40/SCK31/TMIF -2223 -1569 20 P41/RXD31/IrRXD/TMOFL -2223 -1778 21 P42/TXD31/IrTXD/TMOFH -2223 -1987 22 Vcc -1987 -2223 23 C1 -1775 -2223 24 C2 -1569 -2223 25 V1 -1360 -2223 26 V2 -1150 -2223 27 V3 -941 -2223 28 PA0/COM1 -732 -2223 29 PA1/COM2 -523 -2223 Rev. 3.00 Aug 23, 2006 Page 10 of 616 REJ09B0182-0300 Section 1 Overview Coordinate Pad No. Pad Name X ( m) Y ( m) 30 PA2/COM3 -314 -2223 31 PA3/COM4 -105 -2223 32 P50/WKP0/SEG1 105 -2223 33 P51/WKP1/SEG2 314 -2223 34 P52/WKP2/SEG3 523 -2223 35 P53/WKP3/SEG4 732 -2223 36 P54/WKP4/SEG5 941 -2223 37 P55/WKP5/SEG6 1150 -2223 38 P56/WKP6/SEG7 1360 -2223 39 P57/WKP7/SEG8 1569 -2223 40 P60/SEG9 1778 -2223 41 P61/SEG10 1987 -2223 42 P62/SEG11 2223 -1987 43 P63/SEG12 2223 -1778 44 P64/SEG13 2223 -1569 45 P65/SEG14 2223 -1360 46 P66/SEG15 2223 -1150 47 P67/SEG16 2223 -941 48 P70/SEG17 2223 -732 49 P71/SEG18 2223 -523 50 P72/SEG19 2223 -314 51 P73/SEG20 2223 -105 52 P74/SEG21 2223 105 53 P75/SEG22 2223 314 54 P76/SEG23 2223 523 55 P77/SEG24 2223 660 56 P80/SEG25 2223 941 57 P81/SEG26 2223 1222 58 P82/SEG27 2223 1360 59 P83/SEG28 2223 1569 60 P84/SEG29 2223 1778 Rev. 3.00 Aug 23, 2006 Page 11 of 616 REJ09B0182-0300 Section 1 Overview Coordinate Pad No. Pad Name X ( m) Y ( m) 61 P85/SEG30 2223 1987 62 P86/SEG31 1987 2223 63 P87/SEG32 1852 2223 64 PB7/Ain1 1483 2223 65 PB6/Ain2 1341 2223 66 PB5/Vref/REF 1150 2223 67 ACOM 941 2223 68 DVcc 732 2223 69 AVss 523 2223 70 AVcc 314 2223 71 PB2/AN2/IRQ3 105 2223 72 PB1/AN1/IRQ1 -105 2223 73 PB0/AN0/IRQ0 -314 2223 74 IRQAEC -523 2223 75 P90/PWM1 -732 2223 76 P91/PWM2 -941 2223 77 P92/IRQ4 -1150 2223 78 P93 -1360 2223 79 P10/AEVH -1569 2223 80 P11/AEVL -1778 2223 81 P12/TIOCA1/TCLKA -1987 2223 Note: The power supply (Vss) pads in pad numbers 12 and 13 must not be open but connected. When the TEST pad in pad number 16 is not used as the ADTRG pin, it must be connected to the Vss voltage level. If not, this LSI does not operate correctly. When the TEST pad is used as the ADTRG pin, the function should be changed to the ADTRG pin at Vss voltage level during a reset in advance. Rev. 3.00 Aug 23, 2006 Page 12 of 616 REJ09B0182-0300 Section 1 Overview 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 Model name 1 60 2 59 3 58 4 57 5 56 6 55 7 54 Y 8 53 9 52 10 51 11 (0, 0) X 50 12 49 13 48 14 47 15 46 16 45 17 44 18 43 19 42 20 41 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Product model name Model name on chip HCD64338086R HD64338086R Chip size: 3.60mm x 3.69mm Voltage level on the back of the chip: GND Figure 1.5 Pad Assignment of HCD64338086R (Top View) Rev. 3.00 Aug 23, 2006 Page 13 of 616 REJ09B0182-0300 Section 1 Overview Table 1.3 Pad Coordinate of HCD64338086R Coordinate Pad No. Pad Name X ( m) Y ( m) 1 P13/TIOCB1/TCLKB -1683 1484 2 P14/TIOCA2/TCLKC -1683 1328 3 P15/TIOCB2 -1683 1172 4 P16 -1683 1016 5 P30/SCK32/TMOW -1683 859 6 P31/RXD32/SDA -1683 703 7 P32/TXD32/SCL -1683 547 8 P36 -1683 391 9 P37 -1683 234 10 X1 -1683 97 11 X2 -1683 -29 12 VSS -1683 -234 13 OSC2 -1683 -391 14 OSC1 -1683 -575 15 TEST/ADTRG -1683 -703 16 RES -1683 -859 17 NMI -1683 -1016 18 P40/SCK31/TMIF -1683 -1172 19 P41/RXD31/IrRXD/TMOFL -1683 -1328 20 P42/TXD31/IrTXD/TMOFH -1683 -1484 21 VCC -1448 -1728 22 C1 -1208 -1728 23 C2 -1085 -1728 24 V1 -963 -1728 25 V2 -841 -1728 26 V3 -689 -1728 27 PA0/COM1 -536 -1728 28 PA1/COM2 -384 -1728 29 PA2/COM3 -231 -1728 Rev. 3.00 Aug 23, 2006 Page 14 of 616 REJ09B0182-0300 Section 1 Overview Coordinate Pad No. Pad Name X ( m) Y ( m) 30 PA3/COM4 -79 -1728 31 P50/WKP0/SEG1 79 -1728 32 P51/WKP1/SEG2 231 -1728 33 P52/WKP2/SEG3 384 -1728 34 P53/WKP3/SEG4 536 -1728 35 P54/WKP4/SEG5 689 -1728 36 P55/WKP5/SEG6 841 -1728 37 P56/WKP6/SEG7 994 -1728 38 P57/WKP7/SEG8 1146 -1728 39 P60/SEG9 1298 -1728 40 P61/SEG10 1448 -1728 41 P62/SEG11 1683 -1484 42 P63/SEG12 1683 -1328 43 P64/SEG13 1683 -1159 44 P65/SEG14 1683 -1016 45 P66/SEG15 1683 -859 46 P67/SEG16 1683 -703 47 P70/SEG17 1683 -547 48 P71/SEG18 1683 -391 49 P72/SEG19 1683 -234 50 P73/SEG20 1683 -78 51 P74/SEG21 1683 78 52 P75/SEG22 1683 234 53 P76/SEG23 1683 391 54 P77/SEG24 1683 547 55 P80/SEG25 1683 703 56 P81/SEG26 1683 859 57 P82/SEG27 1683 1016 58 P83/SEG28 1683 1172 59 P84/SEG29 1683 1328 Rev. 3.00 Aug 23, 2006 Page 15 of 616 REJ09B0182-0300 Section 1 Overview Coordinate Pad No. Pad Name X ( m) Y ( m) 60 P85/SEG30 1683 1484 61 P86/SEG31 1448 1728 62 P87/SEG32 1298 1728 63 PB7/Ain1 1146 1728 64 PB6/Ain2 994 1728 65 PB5/Vref/REF 841 1728 66 ACOM 689 1728 67 DVCC 536 1728 68 VSS/AVSS 377 1728 69 AVCC 181 1728 70 PB2/AN2/IRQ3 32 1728 71 PB1/AN1/IRQ1 -114 1728 72 PB0/AN0/IRQ0 -231 1728 73 IRQAEC -384 1728 74 P90/PWM1 -536 1728 75 P91/PWM2 -689 1728 76 P92/IRQ4 -841 1728 77 P93 -994 1728 78 P10/AEVH -1146 1728 79 P11/AEVL -1298 1728 80 P12/TIOCA1/TCLKA -1448 1728 Note: The power supply (Vss) pads in pad number 12 must not be open but connected. When the TEST pad in pad number 15 is not used as the ADTRG pin, it must be connected to the Vss voltage level. If not, this LSI does not operate correctly. When the TEST pad is used as the ADTRG pin, the function should be changed to the ADTRG pin at Vss voltage level during a reset in advance. Rev. 3.00 Aug 23, 2006 Page 16 of 616 REJ09B0182-0300 Section 1 Overview 1.4 Table 1.4 Pin Functions Pin Functions Pin No. Type FP-80A, Pad Symbol TFP-80C TLP-85V No.*1 Functions 67 B7 68 67 Input Analog power supply pins for the A/D converter. When the A/D converter is not used, connect this pin to the system power supply. Vcc 21 K2 22 21 Input Power supply pins. Connect this pin to the system power supply. Vss 12 F3 12, 13 12 Input Ground pins. Connect this pin to the system power supply (0 V). AVcc 69 C6 70 69 Input Analog power supply pins for the A/D converter. When the A/D converter is not used, connect this pin to the system power supply. AVss 68 (= Vss) A6 (= Vss) 69 68 Input Ground pins for the A/D converter. Connect this pin to the system power supply (0 V). V1 to V3 24 to 26 J3, K4, H4 25 to 27 24 to Input 26 Power supply pins for the LCD controller/driver. C1 22 K3 23 22 Input Capacitance pins for stepping up the LCD drive power supply. C2 23 J2 24 23 Input OSC1 14 F1 15 14 Input OSC2 13 G3 14 13 Power DVcc supply pins Clock pins Pad No.*2 I/O These pins connect with crystal or ceramic resonator for the system clock, Output or can be used to input an external clock. See section 5, Clock Pulse Generators, for a typical connection. System control X1 10 F2 10 10 X2 11 E2 11 11 These pins connect with a 32.768- or 38.4-kHz crystal resonator for the Output subclock. See section 5, Clock Pulse Generators, for a typical connection. RES 16 H2 17 16 Input Input Reset pins. The power-on reset circuit is incorporated. When externally driven low, the chip is reset. Rev. 3.00 Aug 23, 2006 Page 17 of 616 REJ09B0182-0300 Section 1 Overview Pin No. Type Symbol FP-80A, Pad TFP-80C TLP-85V No.*1 Pad No.*2 I/O Functions System control TEST 15 G2 16 15 Input Test pins. Also used as the ADTRG pin. When this pin is not used as the ADTRG pin, users cannot use this pin. Connect this pin to Vss. When this pin is used as the ADTRG pin, see section 18.4.2, External Trigger Input Timing. Interrupt pins NMI 17 G1 18 17 Input NMI interrupt request pins. Non-maskable interrupt request input pin. IRQ0 72 C5 73 72 Input IRQ1 71 B6 72 71 Input IRQ3 70 B5 71 70 Input IRQ4 76 B3 77 76 Input IRQAEC 73 C4 74 73 Input External interrupt request input pins. Can select the rising or falling edge. Interrupt input pins for the asynchronous event counter. This pin enables the asynchronous event input. In the masked ROM version, this pin controls turning on/off the on-chip oscillator during a reset. WKP0 to WKP7 31 to 38 J5, H6, H7, K6, J7, J8, K7, H8 Rev. 3.00 Aug 23, 2006 Page 18 of 616 REJ09B0182-0300 32 to 39 31 to 38 Input Wakeup interrupt request input pins. Can select the rising or falling edge. Section 1 Overview Pin No. Type Symbol FP-80A, TFP-80C Pad TLP-85V No.*1 Pad No.*2 I/O Functions System control TEST 15 G2 16 15 Input Test pins. Also used as the ADTRG pin. When this pin is not used as the ADTRG pin, users cannot use this pin. Connect this pin to Vss. When this pin is used as the ADTRG pin, see section 18.4.2, External Trigger Input Timing. 80 A3 81 80 I/O Pins for the TGR1A input capture input or output compare output, or PWM output. TIOCB1 1 B1 1 1 Input Pins for the TGR1B input capture input. TIOCA2 2 C1 2 2 I/O Pins for the TGR2A input capture input or output compare output, or PWM output. TIOCB2 3 B2 3 3 Input Pins for the TGR2B input capture input. TCLKA 80 A3 81 80 Input External clock input pins. TCLKB 1 B1 1 1 Input TCLKC 2 C1 2 2 Input TMIF 18 H3 19 18 Input TMOFL 19 J1 20 19 Output Output pins for waveforms generated by the timer FL output compare function. TMOFH 20 H1 21 20 Output Output pins for waveforms generated by the timer FH output compare function. AEVL 79 A2 80 79 Input AEVH 78 C3 79 78 Input TMOW 5 D1 5 5 Output Divided clock output pins for the RTC. 16-bit timer TIOCA1 pulse unit (TPU) Timer F Asynchronous event counter (AEC) RTC Event input pins for input to the timer F counter. Event input pins for input to the asynchronous event counter. Rev. 3.00 Aug 23, 2006 Page 19 of 616 REJ09B0182-0300 Section 1 Overview Pin No. FP-80A, TFP-80C Pad TLP-85V No.*1 Pad No.*2 14-bit PWM PWM1 74 A5 75 74 PWM2 75 B4 76 75 4 C2 4 I/O Transfer clock pins for SCI4 data transmission/reception. When the E7 or on-chip emulator debugger is used, this pin is not available. 8 E1 8 Input SCI4 data input pins. When the E7 or on-chip emulator debugger is used, this pin is not available. 9 E3 9 Output SCI4 data output pins. When the E7 or on-chip emulator debugger is used, this pin is not available. SCK31 18 H3 19 18 I/O SCI3_1 clock I/O pins. RXD31/ IrRXD 19 J1 20 19 Input SCI3_1 data input pins or data input pins for the IrDA format. TXD31/ IrTXD 20 H1 21 20 Output SCI3_1 data output pins or data output pins for the IrDA format. SCK32 5 D1 5 5 I/O SCI3_2 clock I/O pins. RXD32 6 D3 6 6 Input SCI3_2 data input pins. TXD32 7 D2 7 7 Output SCI3_2 data output pins. AN0 to AN2 72 to 70 C5, B6, B5 73 to 71 72 to 70 Input Analog data input pins for the A/D converter. ADTRG 15 G2 16 Input External trigger input pins for the A/D converter. Type Symbol Serial SCK4 communication interface 4 (SCI4) SI4 (F-ZTAT version only) SO4 Serial communication interface 3 (SCI3) A/D converter Rev. 3.00 Aug 23, 2006 Page 20 of 616 REJ09B0182-0300 15 I/O Functions Output Output pins for waveforms generated by the 14-bit PWM in PWM channels Output 1 and 2. Section 1 Overview Pin No. Type Symbol FP-80A, TFP-80C Pad TLP-85V No.*1 Pad No.*2 A/D converter ACOM 66 C7 67 66 Output Pins for stabilizing analog block voltage of the A/D converter. A capacitor should be connected between A/D converter and GND. REF 65 A7 66 65 Output Output pins for internal reference voltage of the A/D converter. These pins output internal reference voltage. Vref 65 A7 66 65 Input External reference voltage pins of the A/D converter. These pins input reference voltage. Ain2 64 B8 65 64 Input Analog input pins for the A/D converter. Ain1 63 B9 64 63 Input Analog input pins for the A/D converter. 6 D3 6 6 I/O IIC data I/O pins. 7 D2 7 7 I/O IIC clock I/O pins. COM1 to 27 to 30 COM4 J4, K5, H5, J6 28 to 31 27 to 30 Output LCD common output pins. SEG1 to SEG8 31 to 38 J5, H6, H7, K6, J7, J8, K7, H8 32 to 39 31 to 38 Output LCD segment output pins. SEG9 to SEG16 39 to 46 40 to 47 39 to K9, K8, 46 J10 H10, J9, H9, G8 Output I2C bus SDA interface 2 SCL (IIC2) LCD controller/ driver I/O Functions SEG17 to 47 to 54 SEG24 G9, F10, F8, E9, F9, E8, D8, E10 48 to 55 47 to 54 Output SEG25 to 55 to 62 SEG32 56 to 63 55 to D9, C9, 62 D10, C8, B10, C10, A9, A8 Output Rev. 3.00 Aug 23, 2006 Page 21 of 616 REJ09B0182-0300 Section 1 Overview Pin No. FP-80A, Pad TFP-80C TLP-85V No.*1 Pad No.*2 I/O Functions I/O 7-bit I/O pins. Input or output can be designated for each bit by means of the port control register 1 (PCR1). 5 to 9 I/O 5-bit I/O pins. Input or output can be designated for each bit by means of the port control register 3 (PCR3). H3, J1, H1 19 to 21 18 to 20 I/O 3-bit I/O pins. Input or output can be designated for each bit by means of the port control register 4 (PCR4). 31 to 38 J5, H6, H7, K6, J7, J8, K7, H8 32 to 39 31 to 38 I/O 8-bit I/O pins. Input or output can be designated for each bit by means of the port control register 5 (PCR5). P60 to P67 39 to 46 40 to 47 39 to K9, K8, 46 J10, H10, J9, H9, G10, G8 I/O 8-bit I/O pins. Input or output can be designated for each bit by means of the port control register 6 (PCR6). P70 to P77 47 to 54 G9, F10, F8, E9, F9, E8, D8, E10 48 to 55 47 to 54 I/O 8-bit I/O pins. Input or output can be designated for each bit by means of the port control register 7 (PCR7). P80 to P87 55 to 62 56 to 63 55 to D9, C9, 62 D10, C8, B10, C10, A9, A8 I/O 8-bit I/O pins. Input or output can be designated for each bit by means of the port control register 8 (PCR8). P90 to P93 74 to 77 A5, B4, B3, A4 I/O 4-bit I/O pins. Input or output can be designated for each bit by means of the port control register 9 (PCR9). Type Symbol I/O ports P10 to P12 78 to 80 C3, A2, A3 79 to 81 78 to 80 P13 to P16 1 to 4 B1, C1, B2, C2 1 to 4 1 to 4 P30 to 5 to 9 P32, P36, P37 D1, D3, D2, E1, E3 5 to 9 P40 to P42 18 to 20 P50 to P57 Rev. 3.00 Aug 23, 2006 Page 22 of 616 REJ09B0182-0300 75 to 78 74 to 77 Section 1 Overview Pin No. Type I/O ports FP-80A, Pad Symbol TFP-80C TLP-85V No.*1 Pad No.*2 PA0 to PA3 27 to 30 J4, K5, H5, J6 28 to 31 27 to 30 PB0 to PB2, PB5 to PB7 72 to 70, 65 to 63 C5, B6, B5, A7, B8, B9 73 to 72 to 71, 66 70 to 64 65 to 63 I/O Functions I/O 4-bit I/O pins. Input or output can be designated for each bit by means of the port control register A (PCRA). Input 6-bit input-only pins Notes: 1. Pad no. for the flash memory version. 2. Pad no. for the masked ROM version. Rev. 3.00 Aug 23, 2006 Page 23 of 616 REJ09B0182-0300 Section 1 Overview Rev. 3.00 Aug 23, 2006 Page 24 of 616 REJ09B0182-0300 Section 2 CPU Section 2 CPU This LSI has an H8/300H CPU with an internal 32-bit architecture that is upward-compatible with the H8/300 CPU, and supports only normal mode, which has a 64-kbyte address space. * Upward-compatible with H8/300 CPUs Can execute H8/300 CPUs object programs Additional eight 16-bit extended registers 32-bit transfer and arithmetic and logic instructions are added Signed multiply and divide instructions are added. * General-register architecture Sixteen 16-bit general registers also usable as sixteen 8-bit registers and eight 16-bit registers, or eight 32-bit registers * Sixty-two basic instructions 8/16/32-bit data transfer and arithmetic and logic instructions Multiply and divide instructions Powerful bit-manipulation instructions * Eight addressing modes Register direct [Rn] Register indirect [@ERn] Register indirect with displacement [@(d:16,ERn) or @(d:24,ERn)] Register indirect with post-increment or pre-decrement [@ERn+ or @-ERn] Absolute address [@aa:8, @aa:16, @aa:24] Immediate [#xx:8, #xx:16, or #xx:32] Program-counter relative [@(d:8,PC) or @(d:16,PC)] Memory indirect [@@aa:8] * 64-kbyte address space * High-speed operation All frequently-used instructions execute in one or two states 8/16/32-bit register-register add/subtract : 2 state 8 x 8-bit register-register multiply : 14 states 16 / 8-bit register-register divide : 14 states 16 x 16-bit register-register multiply : 22 states 32 / 16-bit register-register divide : 22 states CPU30H2C_000220040500 Rev. 3.00 Aug 23, 2006 Page 25 of 616 REJ09B0182-0300 Section 2 CPU * Power-down state Transition to power-down state by SLEEP instruction 2.1 Address Space and Memory Map The address space of this LSI is 64 kbytes, which includes the program area and the data area. Figure 2.1 shows the memory map. HD64338086R (Masked ROM version) HD64F38086R (Flash memory version) H'0000 H'0057 H'0058 Interrupt vector H'0000 H'0057 H'0058 On-chip ROM (52 kbytes) H'BFFF H'C000 H'CFFF H'D000 H'EFFF H'F000 Flash memory Not used Internal I/O registers Interrupt vector On-chip ROM (48 kbytes) H'BFFF H'C000 H'9FFF H'A000 H'F37F H'F380 H'F37F H'F380 Not used H'F77F H'F780 On-chip RAM (3 kbytes) On-chip RAM (2 kbytes) H'F36F H'F370 H'F37F H'F380 LCD RAM (16 bytes) H'F37F H'F380 Not used On-chip RAM (2 kbytes) H'FFFF H'FB7F H'FB80 Internal I/O registers (128 bytes) H'FFFF Not used H'FB7F H'FB80 On-chip RAM (1 kbytes) H'FF7F H'FF80 H'FF7F H'FF80 Internal I/O registers (128 bytes) Internal I/O registers (128 bytes) H'FFFF Not used LCD RAM (16 bytes) H'F77F H'F780 H'FF7F H'FF80 H'FF7F H'FF80 Internal I/O registers H'F09F H'F0A0 Not used H'F77F H'F780 User area Not used Not used LCD RAM (16 bytes) H'F37F H'F380 On-chip ROM (24 kbytes) H'5FFF H6000 Internal I/O registers H'F36F H'F370 H'F36F H'F370 Interrupt vector H'F02F H'F030 H'F09F H'F0A0 Not used LCD RAM (16 bytes) On-chip ROM (32 kbytes) HD64338083R (Masked ROM version) H'0000 H'0057 H'0058 Not used Internal I/O registers Not used LCD RAM (16 bytes) H'7FFF H8000 Interrupt vector H'F02F H'F030 H'F09F H'F0A0 H'F36F H'F370 H'F36F H'F370 H'0000 H'0057 H'0058 Not used H'F02F H'F030 Internal I/O registers Not used Interrupt vector On-chip ROM (40 kbytes) Not used H'F02F H'F030 H'F09F H'F0A0 H'F09F H'F0A0 HD64338084R (Masked ROM version) HD64338085R (Masked ROM version) H'0000 H'0057 H'0058 On-chip RAM (1 kbytes) H'FF7F H'FF80 Internal I/O registers (128 bytes) H'FFFF Internal I/O registers (128 bytes) H'FFFF Note: The areas from H'C000 to H'CFFF and from H'F380 to H'F77F are used by the on-chip debugger. They are not available to the user when the on-chip debugger is being used. Figure 2.1 Memory Map Rev. 3.00 Aug 23, 2006 Page 26 of 616 REJ09B0182-0300 Section 2 CPU 2.2 Register Configuration The H8/300H CPU has the internal registers shown in figure 2.2. There are two types of registers; general registers and control registers. The control registers are a 24-bit program counter (PC), and an 8-bit condition-code register (CCR). General Registers (ERn) 15 0 7 0 7 0 ER0 E0 R0H R0L ER1 E1 R1H R1L ER2 E2 R2H R2L ER3 E3 R3H R3L ER4 E4 R4H R4L ER5 E5 R5H R5L ER6 E6 R6H R6L ER7 E7 R7H R7L (SP) Control Registers (CR) 23 0 PC 7 6 5 4 3 2 1 0 CCR I UI H U N Z V C [Legend] SP: PC: CCR: I: UI: Stack pointer Program counter Condition-code register Interrupt mask bit User bit H: U: N: Z: V: C: Half-carry flag User bit Negative flag Zero flag Overflow flag Carry flag Figure 2.2 CPU Registers Rev. 3.00 Aug 23, 2006 Page 27 of 616 REJ09B0182-0300 Section 2 CPU 2.2.1 General Registers The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally identical and can be used as both address registers and data registers. When a general register is used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. Figure 2.3 illustrates the usage of the general registers. When the general registers are used as 32-bit registers or address registers, they are designated by the letters ER (ER0 to ER7). The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R (R0 to R7). These registers are functionally equivalent, providing a maximum of sixteen 16-bit registers. The E registers (E0 to E7) are also referred to as extended registers. The R registers divide into 8-bit registers designated by the letters RH (R0H to R7H) and RL (R0L to R7L). These registers are functionally equivalent, providing a maximum of sixteen 8-bit registers. The usage of each register can be selected independently. * Address registers * 32-bit registers * 16-bit registers * 8-bit registers E registers (extended registers) (E0 to E7) ER registers (ER0 to ER7) RH registers (R0H to R7H) R registers (R0 to R7) RL registers (R0L to R7L) Figure 2.3 Usage of General Registers General register ER7 has the function of the stack pointer (SP) in addition to its general-register function, and is used implicitly in exception handling and subroutine calls. Figure 2.4 shows the relationship between the stack pointer and the stack area. Rev. 3.00 Aug 23, 2006 Page 28 of 616 REJ09B0182-0300 Section 2 CPU Empty area SP (ER7) Stack area Figure 2.4 Relationship between Stack Pointer and Stack Area 2.2.2 Program Counter (PC) This 24-bit counter indicates the address of the next instruction the CPU will execute. The length of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an instruction is fetched, the least significant PC bit is regarded as 0). The PC is initialized when the start address is loaded by the vector address generated during reset exception-handling sequence. 2.2.3 Condition-Code Register (CCR) This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. The I bit is initialized to 1 by reset exception-handling sequence, but other bits are not initialized. Some instructions leave flag bits unchanged. Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used as branching conditions for conditional branch (Bcc) instructions. For the action of each instruction on the flag bits, see Appendix A.1, Instruction List. Rev. 3.00 Aug 23, 2006 Page 29 of 616 REJ09B0182-0300 Section 2 CPU Bit Bit Name Initial Value R/W Description 7 I 1 R/W Interrupt Mask Bit Masks interrupts other than NMI when set to 1. NMI is accepted regardless of the I bit setting. The I bit is set to 1 at the start of an exception-handling sequence. 6 UI Undefined R/W User Bit Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. 5 H Undefined R/W Half-Carry Flag When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0 otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 27, and cleared to 0 otherwise. 4 U Undefined R/W User Bit Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. 3 N Undefined R/W Negative Flag Stores the value of the most significant bit of data as a sign bit. 2 Z Undefined R/W Zero Flag Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data. 1 V Undefined R/W Overflow Flag Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other times. 0 C Undefined R/W Carry Flag Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by: * Add instructions, to indicate a carry * Subtract instructions, to indicate a borrow * Shift and rotate instructions, to indicate a carry The carry flag is also used as a bit accumulator by bit manipulation instructions. Rev. 3.00 Aug 23, 2006 Page 30 of 616 REJ09B0182-0300 Section 2 CPU 2.3 Data Formats The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, ..., 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two digits of 4-bit BCD data. 2.3.1 General Register Data Formats Figure 2.5 shows the data formats in general registers. Data Type General Register Data Format 7 RnH 1-bit data 0 Don't care 7 6 5 4 3 2 1 0 7 1-bit data RnL 4-bit BCD data RnH 4-bit BCD data RnL Byte data RnH Don't care 7 4 3 Upper 0 7 6 5 4 3 2 1 0 0 Lower Don't care 7 Don't care 7 4 3 Upper 0 Don't care MSB LSB 7 Byte data RnL 0 Lower 0 Don't care MSB LSB Figure 2.5 General Register Data Formats (1) Rev. 3.00 Aug 23, 2006 Page 31 of 616 REJ09B0182-0300 Section 2 CPU Data Type General Register Word data Rn Data Format 15 Word data MSB En 15 MSB Longword data 0 LSB 0 LSB ERn 31 16 15 MSB [Legend] ERn: General register ER En: General register E Rn: General register R RnH: General register RH RnL: General register RL MSB: Most significant bit LSB: Least significant bit Figure 2.5 General Register Data Formats (2) Rev. 3.00 Aug 23, 2006 Page 32 of 616 REJ09B0182-0300 0 LSB Section 2 CPU 2.3.2 Memory Data Formats Figure 2.6 shows the data formats in memory. The H8/300H CPU can access word data and longword data in memory, however word or longword data must begin at an even address. If an attempt is made to access word or longword data at an odd address, an address error does not occur, however the least significant bit of the address is regarded as 0, so access begins the preceding address. This also applies to instruction fetches. When ER7 (SP) is used as an address register to access the stack area, the operand size should be word or longword. Data Type Address Data Format 7 1-bit data Address L 7 Byte data Address L MSB Word data Address 2M MSB 0 6 5 4 3 2 Address 2N 0 LSB LSB Address 2M+1 Longword data 1 MSB Address 2N+1 Address 2N+2 LSB Address 2N+3 Figure 2.6 Memory Data Formats Rev. 3.00 Aug 23, 2006 Page 33 of 616 REJ09B0182-0300 Section 2 CPU 2.4 Instruction Set 2.4.1 Table of Instructions Classified by Function The H8/300H CPU has 62 instructions. Tables 2.2 to 2.9 summarize the instructions in each functional category. The notation used in tables 2.2 to 2.9 is defined in table 2.1. Table 2.1 Operation Notation Symbol Description Rd General register (destination)* Rs General register (source)* Rn General register* ERn General register (32-bit register or address register) (EAd) Destination operand (EAs) Source operand CCR Condition-code register N N (negative) flag in CCR Z Z (zero) flag in CCR V V (overflow) flag in CCR C C (carry) flag in CCR PC Program counter SP Stack pointer #IMM Immediate data disp Displacement + Addition - Subtraction x Multiplication / Division Logical AND Logical OR Logical XOR Move NOT (logical complement) Rev. 3.00 Aug 23, 2006 Page 34 of 616 REJ09B0182-0300 Section 2 CPU Symbol Description :3/:8/:16/:24 3-, 8-, 16-, or 24-bit length Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit registers/address register (ER0 to ER7). Table 2.2 Data Transfer Instructions Instruction Size* Function MOV B/W/L (EAs) Rd, Rs (EAd) Moves data between two general registers or between a general register and memory, or moves immediate data to a general register. MOVFPE B (EAs) Rd Cannot be used in this LSI. MOVTPE B Rs (EAs) Cannot be used in this LSI. POP W/L @SP+ Rn Pops a general register from the stack. POP.W Rn is identical to MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn. PUSH W/L Rn @-SP Pushes a general register onto the stack. PUSH.W Rn is identical to MOV.W Rn, @-SP. PUSH.L ERn is identical to MOV.L ERn, @-SP. Note: * Refers to the operand size. B: Byte W: Word L: Longword Rev. 3.00 Aug 23, 2006 Page 35 of 616 REJ09B0182-0300 Section 2 CPU Table 2.3 Arithmetic Operations Instructions (1) Instruction Size* Function ADD SUB B/W/L Rd Rs Rd, Rd #IMM Rd Performs addition or subtraction on data in two general registers, or on immediate data and data in a general register (immediate byte data cannot be subtracted from byte data in a general register. Use the SUBX or ADD instruction.) ADDX SUBX B Rd Rs C Rd, Rd #IMM C Rd Performs addition or subtraction with carry on byte data in two general registers, or on immediate data and data in a general register. INC DEC B/W/L Rd 1 Rd, Rd 2 Rd Increments or decrements a general register by 1 or 2. (Byte operands can be incremented or decremented by 1 only.) ADDS SUBS L Rd 1 Rd, Rd 2 Rd, Rd 4 Rd Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register. DAA DAS B Rd (decimal adjust) Rd Decimal-adjusts an addition or subtraction result in a general register by referring to the CCR to produce 4-bit BCD data. MULXU B/W Rd x Rs Rd Performs unsigned multiplication on data in two general registers: either 8 bits x 8 bits 16 bits or 16 bits x 16 bits 32 bits. MULXS B/W Rd x Rs Rd Performs signed multiplication on data in two general registers: either 8 bits x 8 bits 16 bits or 16 bits x 16 bits 32 bits. DIVXU B/W Rd / Rs Rd Performs unsigned division on data in two general registers: either 16 bits / 8 bits 8-bit quotient and 8-bit remainder or 32 bits / 16 bits 16-bit quotient and 16-bit remainder. Note: * Refers to the operand size. B: Byte W: Word L: Longword Rev. 3.00 Aug 23, 2006 Page 36 of 616 REJ09B0182-0300 Section 2 CPU Table 2.3 Arithmetic Operations Instructions (2) Instruction Size* Function DIVXS B/W Rd / Rs Rd Performs signed division on data in two general registers: either 16 bits / 8 bits 8-bit quotient and 8-bit remainder or 32 bits / 16 bits 16-bit quotient and 16-bit remainder. CMP B/W/L Rd - Rs, Rd - #IMM Compares data in a general register with data in another general register or with immediate data, and sets CCR bits according to the result. NEG B/W/L 0 - Rd Rd Takes the two's complement (arithmetic complement) of data in a general register. EXTU W/L Rd (zero extension) Rd Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by padding with zeros on the left. EXTS W/L Rd (sign extension) Rd Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by extending the sign bit. Note: * Refers to the operand size. B: Byte W: Word L: Longword Rev. 3.00 Aug 23, 2006 Page 37 of 616 REJ09B0182-0300 Section 2 CPU Table 2.4 Logic Operations Instructions Instruction Size* Function AND B/W/L Rd Rs Rd, Rd #IMM Rd Performs a logical AND operation on a general register and another general register or immediate data. OR B/W/L Rd Rs Rd, Rd #IMM Rd Performs a logical OR operation on a general register and another general register or immediate data. XOR B/W/L Rd Rs Rd, Rd #IMM Rd Performs a logical exclusive OR operation on a general register and another general register or immediate data. NOT B/W/L (Rd) (Rd) Takes the one's complement (logical complement) of general register contents. Note: * Refers to the operand size. B: Byte W: Word L: Longword Table 2.5 Shift Instructions Instruction Size* Function SHAL SHAR B/W/L Rd (shift) Rd Performs an arithmetic shift on general register contents. SHLL SHLR B/W/L Rd (shift) Rd Performs a logical shift on general register contents. ROTL ROTR B/W/L Rd (rotate) Rd Rotates general register contents. ROTXL ROTXR B/W/L Rd (rotate) Rd Rotates general register contents through the carry flag. Note: * Refers to the operand size. B: Byte W: Word L: Longword Rev. 3.00 Aug 23, 2006 Page 38 of 616 REJ09B0182-0300 Section 2 CPU Table 2.6 Bit Manipulation Instructions (1) Instruction Size* Function BSET B 1 (<bit-No.> of <EAd>) Sets a specified bit in a general register or memory operand to 1. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BCLR B 0 (<bit-No.> of <EAd>) Clears a specified bit in a general register or memory operand to 0. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BNOT B (<bit-No.> of <EAd>) (<bit-No.> of <EAd>) Inverts a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BTST B (<bit-No.> of <EAd>) Z Tests a specified bit in a general register or memory operand and sets or clears the Z flag accordingly. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BAND B C (<bit-No.> of <EAd>) C ANDs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. BIAND B C (<bit-No.> of <EAd>) C ANDs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. BOR B C (<bit-No.> of <EAd>) C ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. BIOR B C (<bit-No.> of <EAd>) C ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. The bit number is specified by 3-bit immediate data. Note: * Refers to the operand size. B: Byte Rev. 3.00 Aug 23, 2006 Page 39 of 616 REJ09B0182-0300 Section 2 CPU Table 2.6 Bit Manipulation Instructions (2) Instruction Size* Function BXOR B C (<bit-No.> of <EAd>) C XORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. BIXOR B C (<bit-No.> of <EAd>) C XORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. BLD B (<bit-No.> of <EAd>) C Transfers a specified bit in a general register or memory operand to the carry flag. BILD B (<bit-No.> of <EAd>) C Transfers the inverse of a specified bit in a general register or memory operand to the carry flag. The bit number is specified by 3-bit immediate data. BST B C (<bit-No.> of <EAd>) Transfers the carry flag value to a specified bit in a general register or memory operand. BIST B C (<bit-No.> of <EAd>) Transfers the inverse of the carry flag value to a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data. Note: * Refers to the operand size. B: Byte Rev. 3.00 Aug 23, 2006 Page 40 of 616 REJ09B0182-0300 Section 2 CPU Table 2.7 Branch Instructions Instruction Size Function Bcc* Branches to a specified address if a specified condition is true. The branching conditions are listed below. Mnemonic Description Condition BRA(BT) Always (true) Always BRN(BF) Never (false) Never BHI High CZ=0 BLS Low or same CZ=1 BCC(BHS) Carry clear (high or same) C=0 BCS(BLO) Carry set (low) C=1 BNE Not equal Z=0 BEQ Equal Z=1 BVC Overflow clear V=0 BVS Overflow set V=1 BPL Plus N=0 BMI Minus N=1 BGE Greater or equal NV=0 BLT Less than NV=1 BGT Greater than Z(N V) = 0 BLE Less or equal Z(N V) = 1 JMP Branches unconditionally to a specified address. BSR Branches to a subroutine at a specified address. JSR Branches to a subroutine at a specified address. RTS Returns from a subroutine Note: * Bcc is the general name for conditional branch instructions. Rev. 3.00 Aug 23, 2006 Page 41 of 616 REJ09B0182-0300 Section 2 CPU Table 2.8 System Control Instructions Instruction Size* Function RTE Returns from an exception-handling routine. SLEEP Causes a transition to a power-down state. LDC B/W (EAs) CCR Moves the source operand contents to the CCR. The CCR size is one byte, but in transfer from memory, data is read by word access. STC B/W CCR (EAd) Transfers the CCR contents to a destination location. The condition code register size is one byte, but in transfer to memory, data is written by word access. ANDC B CCR #IMM CCR Logically ANDs the CCR with immediate data. ORC B CCR #IMM CCR Logically ORs the CCR with immediate data. XORC B CCR #IMM CCR Logically XORs the CCR with immediate data. NOP PC + 2 PC Only increments the program counter. Note: * Refers to the operand size. B: Byte W: Word Rev. 3.00 Aug 23, 2006 Page 42 of 616 REJ09B0182-0300 Section 2 CPU Table 2.9 Block Data Transfer Instructions Instruction Size Function EEPMOV.B if R4L 0 then Repeat @ER5+ @ER6+, R4L-1 R4L Until R4L = 0 else next; EEPMOV.W if R4 0 then Repeat @ER5+ @ER6+, R4-1 R4 Until R4 = 0 else next; Transfers a data block. Starting from the address set in ER5, transfers data for the number of bytes set in R4L or R4 to the address location set in ER6. Execution of the next instruction begins as soon as the transfer is completed. Rev. 3.00 Aug 23, 2006 Page 43 of 616 REJ09B0182-0300 Section 2 CPU 2.4.2 Basic Instruction Formats H8/300H CPU instructions consist of 2-byte (1-word) units. An instruction consists of an operation field (op), a register field (r), an effective address extension (EA), and a condition field (cc). Figure 2.7 shows examples of instruction formats. (1) Operation Field Indicates the function of the instruction, the addressing mode, and the operation to be carried out on the operand. The operation field always includes the first four bits of the instruction. Some instructions have two operation fields. (2) Register Field Specifies a general register. Address registers are specified by 3 bits, and data registers by 3 bits or 4 bits. Some instructions have two register fields. Some have no register field. (3) Effective Address Extension 8, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. A24-bit address or displacement is treated as a 32-bit data in which the first 8 bits are 0 (H'00). (4) Condition Field Specifies the branching condition of Bcc instructions. (1) Operation field only op NOP, RTS, etc. (2) Operation field and register fields op rm rn ADD.B Rn, Rm, etc. (3) Operation field, register fields, and effective address extension op rn rm MOV.B @(d:16, Rn), Rm EA(disp) (4) Operation field, effective address extension, and condition field op cc EA(disp) BRA d:8 Figure 2.7 Instruction Formats Rev. 3.00 Aug 23, 2006 Page 44 of 616 REJ09B0182-0300 Section 2 CPU 2.5 Addressing Modes and Effective Address Calculation The following describes the H8/300H CPU. In this LSI, the upper eight bits are ignored in the generated 24-bit address, so the effective address is 16 bits. 2.5.1 Addressing Modes The H8/300H CPU supports the eight addressing modes listed in table 2.10. Each instruction uses a subset of these addressing modes. Addressing modes that can be used differ depending on the instruction. For details, refer to Appendix A.4, Combinations of Instructions and Addressing Modes. Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer instructions can use all addressing modes except program-counter relative and memory indirect. Bit-manipulation instructions use register direct, register indirect, or the absolute addressing mode (@aa:8) to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand. Table 2.10 Addressing Modes No. Addressing Mode Symbol 1 Register direct Rn 2 Register indirect @ERn 3 Register indirect with displacement @(d:16,ERn)/@(d:24,ERn) 4 Register indirect with post-increment Register indirect with pre-decrement @ERn+ @-ERn 5 Absolute address @aa:8/@aa:16/@aa:24 6 Immediate #xx:8/#xx:16/#xx:32 7 Program-counter relative @(d:8,PC)/@(d:16,PC) 8 Memory indirect @@aa:8 (1) Register Direct Rn The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers. Rev. 3.00 Aug 23, 2006 Page 45 of 616 REJ09B0182-0300 Section 2 CPU (2) Register Indirect @ERn The register field of the instruction code specifies an address register (ERn), the lower 24 bits of which contain the address of the operand on memory. (3) Register Indirect with Displacement @(d:16, ERn) or @(d:24, ERn) A 16-bit or 24-bit displacement contained in the instruction is added to an address register (ERn) specified by the register field of the instruction, and the lower 24 bits of the sum the address of a memory operand. A 16-bit displacement is sign-extended when added. (4) Register Indirect with Post-Increment or Pre-Decrement @ERn+ or @-ERn * Register indirect with post-increment@ERn+ The register field of the instruction code specifies an address register (ERn) the lower 24 bits of which contains the address of a memory operand. After the operand is accessed, 1, 2, or 4 is added to the address register contents (32 bits) and the sum is stored in the address register. The value added is 1 for byte access, 2 for word access, or 4 for longword access. For the word or longword access, the register value should be even. * Register indirect with pre-decrement@-ERn The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field in the instruction code, and the lower 24 bits of the result is the address of a memory operand. The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for word access, or 4 for longword access. For the word or longword access, the register value should be even. (5) Absolute Address @aa:8, @aa:16, @aa:24 The instruction code contains the absolute address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24) For an 8-bit absolute address, the upper 16 bits are all assumed to be 1 (H'FFFF). For a 16-bit absolute address the upper 8 bits are a sign extension. A 24-bit absolute address can access the entire address space. The access ranges of absolute addresses for this LSI are those shown in table 2.11, because the upper 8 bits are ignored. Rev. 3.00 Aug 23, 2006 Page 46 of 616 REJ09B0182-0300 Section 2 CPU Table 2.11 Absolute Address Access Ranges Absolute Address Access Range 8 bits (@aa:8) H'FF00 to H'FFFF 16 bits (@aa:16) H'0000 to H'FFFF 24 bits (@aa:24) H'0000 to H'FFFF (6) Immediate #xx:8, #xx:16, or #xx:32 The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an operand. The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit number. (7) Program-Counter Relative @(d:8, PC) or @(d:16, PC) This mode is used in the BSR instruction. An 8-bit or 16-bit displacement contained in the instruction is sign-extended and added to the 24-bit PC contents to generate a branch address. The PC value to which the displacement is added is the address of the first byte of the next instruction, so the possible branching range is -126 to +128 bytes (-63 to +64 words) or -32766 to +32768 bytes (-16383 to +16384 words) from the branch instruction. The resulting value should be an even number. (8) Memory Indirect @@aa:8 This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit absolute address specifying a memory operand. This memory operand contains a branch address. The memory operand is accessed in words, generating a 16-bit branch address. Figure 2.8 shows how to specify branch address for in memory indirect mode. The upper bits of the absolute address are all assumed to be 0, so the address range is 0 to 255 (H'0000 to H'00FF). Note that the first part of the address range is also the exception vector area. Rev. 3.00 Aug 23, 2006 Page 47 of 616 REJ09B0182-0300 Section 2 CPU Specified by @aa:8 Branch address Figure 2.8 Branch Address Specification in Memory Indirect Mode Rev. 3.00 Aug 23, 2006 Page 48 of 616 REJ09B0182-0300 Section 2 CPU 2.5.2 Effective Address Calculation Table 2.12 indicates how effective addresses are calculated in each addressing mode. In this LSI the upper 8 bits of the effective address are ignored in order to generate a 16-bit effective address. Table 2.12 Effective Address Calculation (1) No 1 Addressing Mode and Instruction Format op 2 Effective Address Calculation Effective Address (EA) Register direct(Rn) rm Operand is general register contents. rn Register indirect(@ERn) 0 31 23 0 23 0 23 0 23 0 General register contents op 3 r Register indirect with displacement @(d:16,ERn) or @(d:24,ERn) 0 31 General register contents op r disp 0 31 Sign extension 4 Register indirect with post-increment or pre-decrement *Register indirect with post-increment @ERn+ op 0 31 General register contents r *Register indirect with pre-decrement @-ERn disp 1, 2, or 4 31 0 General register contents op r 1, 2, or 4 The value to be added or subtracted is 1 when the operand is byte size, 2 for word size, and 4 for longword size. Rev. 3.00 Aug 23, 2006 Page 49 of 616 REJ09B0182-0300 Section 2 CPU Table 2.12 Effective Address Calculation (2) No 5 Addressing Mode and Instruction Format Effective Address Calculation Effective Address (EA) Absolute address @aa:8 8 7 23 op abs 0 H'FFFF @aa:16 23 op abs 16 15 0 Sign extension @aa:24 op 0 23 abs 6 Immediate #xx:8/#xx:16/#xx:32 op 7 Operand is immediate data. IMM 23 Program-counter relative 0 PC contents @(d:8,PC)/@(d:16,PC) op disp 23 0 Sign extension 8 disp 23 0 Memory indirect @@aa:8 23 op abs 8 7 0 abs H'0000 15 0 Memory contents [Legend] r, rm,rn : op : disp : IMM : abs : Register field Operation field Displacement Immediate data Absolute address Rev. 3.00 Aug 23, 2006 Page 50 of 616 REJ09B0182-0300 23 16 15 H'00 0 Section 2 CPU 2.6 Basic Bus Cycle CPU operation is synchronized by a system clock () or a subclock (SUB). The period from a rising edge of or SUB to the next rising edge is called one state. A bus cycle consists of two states or three states. The cycle differs depending on whether access is to on-chip memory or to on-chip peripheral modules. 2.6.1 Access to On-Chip Memory (RAM, ROM) Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access in byte or word size. Figure 2.9 shows the on-chip memory access cycle. Bus cycle T1 state T2 state or SUB Internal address bus Address Internal read signal Internal data bus (read access) Read data Internal write signal Internal data bus (write access) Write data Figure 2.9 On-Chip Memory Access Cycle Rev. 3.00 Aug 23, 2006 Page 51 of 616 REJ09B0182-0300 Section 2 CPU 2.6.2 On-Chip Peripheral Modules On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits or 16 bits depending on the register. For description on the data bus width and number of accessing states of each register, refer to section 24.1, Register Addresses (Address Order). Registers with 16-bit data bus width can be accessed by word size only. Registers with 8-bit data bus width can be accessed by byte or word size. When a register with 8-bit data bus width is accessed by word size, a bus cycle occurs twice. In two-state access, the operation timing is the same as that for on-chip memory. Figure 2.10 shows the operation timing in the case of three-state access to an on-chip peripheral module. Bus cycle T1 state T2 state T3 state or SUB Internal address bus Address Internal read signal Internal data bus (read access) Read data Internal write signal Internal data bus (write access) Write data Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access) Rev. 3.00 Aug 23, 2006 Page 52 of 616 REJ09B0182-0300 Section 2 CPU 2.7 CPU States There are four CPU states: the reset state, program execution state, program halt state, and exception-handling state. The program execution state includes active (high-speed or mediumspeed) mode and subactive mode. For the program halt state, there are sleep (high-speed or medium-speed) mode, standby mode, watch mode, and subsleep mode. These states are shown in figure 2.11. Figure 2.12 shows the state transitions. For details on program execution state and program halt state, refer to section 6, Power-Down Modes. For details on exception handling, refer to section 3, Exception Handling. Reset state The CPU is initialized Program execution state Active (high-speed) mode The CPU executes successive program instructions at high speed, synchronized by the system clock Active (medium-speed) mode The CPU executes successive program instructions at reduced speed, synchronized by the system clock Subactive mode The CPU executes successive program instructions at reduced speed, synchronized by the subclock Program halt state A state in which the CPU operation is stopped to reduce power consumption Sleep (high-speed) mode Power-down modes CPU state Sleep (medium-speed) mode Standby mode Watch mode Subsleep mode Exception-handling state A transient state in which the CPU changes the processing flow due to a reset or an interrupt Figure 2.11 CPU Operating States Rev. 3.00 Aug 23, 2006 Page 53 of 616 REJ09B0182-0300 Section 2 CPU Reset cleared Reset state Exception-handling state Reset occurs Reset occurs Reset occurs Interrupt source Program halt state Interrupt source Exceptionhandling complete Program execution state SLEEP instruction executed Figure 2.12 State Transitions 2.8 Usage Notes 2.8.1 Notes on Data Access to Empty Areas The address space of this LSI includes empty areas in addition to the ROM, RAM, and on-chip I/O registers areas available to the user. When data is transferred from CPU to empty areas, the transferred data will be lost. This action may also cause the CPU to malfunction. When data is transferred from an empty area to CPU, the contents of the data cannot be guaranteed. 2.8.2 EEPMOV Instruction EEPMOV is a block-transfer instruction and transfers the byte size of data indicated by R4L, which starts from the address indicated by R5, to the address indicated by R6. Set R4L and R6 so that the end address of the destination address (value of R6 + R4L) does not exceed H'FFFF (the value of R6 must not change from H'FFFF to H'0000 during execution). Rev. 3.00 Aug 23, 2006 Page 54 of 616 REJ09B0182-0300 Section 2 CPU 2.8.3 Bit-Manipulation Instruction The BSET, BCLR, BNOT, BST, and BIST instructions read data from the specified address in byte units, manipulate the data of the target bit, and write data to the same address again in byte units. Special care is required when using these instructions in cases where two registers are assigned to the same address, or when a bit is directly manipulated for a port or a register containing a write-only bit, because this may rewrite data of a bit other than the bit to be manipulated. (1) Bit manipulation for two registers assigned to the same address Example 1: Bit manipulation for the timer load register and timer counter Figure 2.13 shows an example of a timer in which two timer registers are assigned to the same address. When a bit-manipulation instruction accesses the timer load register and timer counter of a reloadable timer, since these two registers share the same address, the following operations takes place. 1. Data is read in byte units. 2. The CPU sets or resets the bit to be manipulated with the bit-manipulation instruction. 3. The written data is written again in byte units to the timer load register. The timer is counting, so the value read is not necessarily the same as the value in the timer load register. As a result, bits other than the intended bit in the timer counter may be modified and the modified value may be written to the timer load register. Read Count clock Timer counter Reload Write Timer load register Internal data bus Figure 2.13 Example of Timer Configuration with Two Registers Allocated to Same Address Rev. 3.00 Aug 23, 2006 Page 55 of 616 REJ09B0182-0300 Section 2 CPU Example 2: When the BSET instruction is executed for port 5 P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at P56. P55 to P50 are output pins and output low-level signals. An example to output a high-level signal at P50 with a BSET instruction is shown below. * Prior to executing BSET instruction P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level Low level PCR5 0 0 1 1 1 1 1 1 PDR5 1 0 0 0 0 0 0 0 * BSET instruction executed instruction BSET #0, @PDR5 The BSET instruction is executed for port 5. * After executing BSET instruction P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level High level PCR5 0 0 1 1 1 1 1 1 PDR5 0 1 0 0 0 0 0 1 * Description on operation 1. When the BSET instruction is executed, first the CPU reads port 5. Since P57 and P56 are input pins, the CPU reads the pin states (low-level and high-level input). P55 to P50 are output pins, so the CPU reads the value in PDR5. In this example PDR5 has a value of H'80, but the value read by the CPU is H'40. 2. Next, the CPU sets bit 0 of the read data to 1, changing the PDR5 data to H'41. Rev. 3.00 Aug 23, 2006 Page 56 of 616 REJ09B0182-0300 Section 2 CPU 3. Finally, the CPU writes H'41 to PDR5, completing execution of BSET instruction. As a result of the BSET instruction, bit 0 in PDR5 becomes 1, and P50 outputs a high-level signal. However, bits 7 and 6 of PDR5 end up with different values. To prevent this problem, store a copy of the PDR5 data in a work area in memory. Perform the bit manipulation on the data in the work area, then write this data to PDR5. * Prior to executing BSET instruction MOV.B MOV.B MOV.B #H'80, R0L R0L, @RAM0 R0L, @PDR5 The PDR5 value (H'80) is written to a work area in memory (RAM0) as well as to PDR5. P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level Low level PCR5 0 0 1 1 1 1 1 1 PDR5 1 0 0 0 0 0 0 0 RAM0 1 0 0 0 0 0 0 0 * BSET instruction executed BSET #0, @RAM0 The BSET instruction is executed designating the PDR5 work area (RAM0). * After executing BSET instruction MOV.B MOV.B @RAM0, R0L R0L, @PDR5 The work area (RAM0) value is written to PDR5. P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level High level PCR5 0 0 1 1 1 1 1 1 PDR5 1 0 0 0 0 0 0 1 RAM0 1 0 0 0 0 0 0 1 Rev. 3.00 Aug 23, 2006 Page 57 of 616 REJ09B0182-0300 Section 2 CPU (2) Bit Manipulation in a Register Containing a Write-Only Bit Example 3: BCLR instruction executed designating port 5 control register PCR5 P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at P56. P55 to P50 are output pins that output low-level signals. An example of setting the P50 pin as an input pin by the BCLR instruction is shown below. It is assumed that a high-level signal will be input to this input pin. * Prior to executing BCLR instruction P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level Low level PCR5 0 0 1 1 1 1 1 1 PDR5 1 0 0 0 0 0 0 0 * BCLR instruction executed BCLR #0, @PCR5 The BCLR instruction is executed for PCR5. * After executing BCLR instruction P57 P56 P55 P54 P53 P52 P51 P50 Input/output Output Output Output Output Output Output Output Input Pin state Low level High level Low level Low level Low level Low level Low level High level PCR5 1 1 1 1 1 1 1 0 PDR5 1 0 0 0 0 0 0 0 * Description on operation 1. When the BCLR instruction is executed, first the CPU reads PCR5. Since PCR5 is a write-only register, the CPU reads a value of H'FF, even though the PCR5 value is actually H'3F. 2. Next, the CPU clears bit 0 in the read data to 0, changing the data to H'FE. 3. Finally, H'FE is written to PCR5 and BCLR instruction execution ends. As a result of this operation, bit 0 in PCR5 becomes 0, making P50 an input port. However, bits 7 and 6 in PCR5 change to 1, so that P57 and P56 change from input pins to output pins. To prevent this problem, store a copy of the PDR5 data in a work area in memory and manipulate data of the bit in the work area, then write this data to PDR5. Rev. 3.00 Aug 23, 2006 Page 58 of 616 REJ09B0182-0300 Section 2 CPU * Prior to executing BCLR instruction MOV.B MOV.B MOV.B #H'3F, R0L R0L, @RAM0 R0L, @PCR5 The PCR5 value (H'3F) is written to a work area in memory (RAM0) as well as to PCR5. P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level Low level PCR5 0 0 1 1 1 1 1 1 PDR5 1 0 0 0 0 0 0 0 RAM0 0 0 1 1 1 1 1 1 * BCLR instruction executed BCLR #0, @RAM0 The BCLR instructions executed for the PCR5 work area (RAM0). * After executing BCLR instruction MOV.B MOV.B @RAM0, R0L R0L, @PCR5 The work area (RAM0) value is written to PCR5. P57 P56 P55 P54 P53 P52 P51 P50 Input/output Input Input Output Output Output Output Output Output Pin state Low level High level Low level Low level Low level Low level Low level High level PCR5 0 0 1 1 1 1 1 0 PDR5 1 0 0 0 0 0 0 0 RAM0 0 0 1 1 1 1 1 0 Rev. 3.00 Aug 23, 2006 Page 59 of 616 REJ09B0182-0300 Section 2 CPU Rev. 3.00 Aug 23, 2006 Page 60 of 616 REJ09B0182-0300 Section 3 Exception Handling Section 3 Exception Handling Exception handling may be caused by a reset or interrupts. * Reset A reset has the highest exception priority. Exception handling starts as soon as the reset is cleared by the RES pin. The chip is also reset when the watchdog timer overflows, and exception handling starts. Exception handling is the same as exception handling by the RES pin. * Interrupts External interrupts other than NMI and internal interrupts other than address break are masked by the I bit in CCR, and kept masked while the I bit is set to 1. Exception handling starts when the current instruction or exception handling ends, if an interrupt request has been issued. Rev. 3.00 Aug 23, 2006 Page 61 of 616 REJ09B0182-0300 Section 3 Exception Handling 3.1 Exception Sources and Vector Address Table 3.1 shows the vector addresses and priority of each exception handling. When more than one interrupt is requested, handling is performed from the interrupt with the highest priority. Table 3.1 Exception Sources and Vector Address Source Origin Exception Sources Vector Number Vector Address Priority Reset RES, Watchdog Timer 0 H'0000 to H'0001 High Reserved for system use Break instructions 1 H'0002 to H'0003 Reserved for system use Break interrupts (mode transition) 2 H'0004 to H'0005 External interrupt NMI 3 H'0006 to H'0007 Reserved for system use Break conditions satisfied 4 H'0008 to H'0009 Address break Break conditions satisfied 5 H'000A to H'000B External interrupts Internal interrupts* Note: * IRQ0 6 H'000C to H'000D IRQ1 7 H'000E to H'000F IRQAEC 8 H'0010 to H'0011 IRQ3 9 H'0012 to H'0013 IRQ4 10 H'0014 to H'0015 WKP0 11 H'0016 to H'0017 WKP1 12 H'0018 to H'0019 WKP2 13 H'001A to H'001B WKP3 14 H'001C to H'001D WKP4 15 H'001E to H'001F WKP5 16 H'0020 to H'0021 WKP6 17 H'0022 to H'0023 WKP7 18 H'0024 to H'0025 19 to 43 H'0026 to H'0057 Low For details on the vector table of internal interrupts, refer to section 4.5, Interrupt Exception Handling Vector Table. Rev. 3.00 Aug 23, 2006 Page 62 of 616 REJ09B0182-0300 Section 3 Exception Handling 3.2 Reset A reset has the highest exception priority. A reset can be triggered by three sources. These are listed in table 3.2. Table 3.2 Reset Sources Reset Source Description RES pin Low-level input Power-on reset circuit Vcc rising edge For details, see section 22, Power-On Reset Circuit. Watchdog timer Counter overflow For details, see section 14, Watchdog Timer. 3.2.1 Reset Exception Handling When a reset source occurs, all processing halts and the LSI enters the reset state. A reset initializes the internal state of the CPU and the registers of on-chip peripheral modules. To ensure that this LSI is reset using the RES pin, proceed as follows. * At power-on, or if the system clock pulse generator is stopped Hold the RES pin low until the operation of the clock pulse generator stabilizes. * If the system clock pulse generator is running Hold the RES pin for the duration of the tREL state specified in the electrical characteristics. When a reset source is generated, reset exception handling starts and the LSI performs the following operations. 1. The internal state of the CPU and the registers of the on-chip peripheral modules are initialized and the I bit in CCR is set to 1. 2. The reset exception handling vector address (H'0000 and H'0001) is read and transferred to the PC, and then program execution starts from the address indicated by the PC. The reset exception handling sequence triggered by the RES pin is shown in figure 3.1. Rev. 3.00 Aug 23, 2006 Page 63 of 616 REJ09B0182-0300 Section 3 Exception Handling Reset cleared Initial program instruction prefetch Vector fetch Internal processing RES Internal address bus (1) (2) Internal read signal Internal write signal Internal data bus (16 bits) (2) (3) (1) Reset exception handling vector address (H'0000) (2) Program start address (3) Initial program instruction Figure 3.1 Reset Exception Handling Sequence 3.2.2 Interrupt Immediately after Reset Immediately after a reset, if an interrupt is accepted before the stack pointer (SP) is initialized, PC and CCR will not be pushed onto the stack correctly, resulting in program runaway. To prevent this, immediately after reset exception handling all interrupts are masked. For this reason, the initial program instruction is always executed immediately after a reset. This instruction should initialize the stack pointer (e.g. MOV.L #xx: 32, SP). Rev. 3.00 Aug 23, 2006 Page 64 of 616 REJ09B0182-0300 Section 3 Exception Handling 3.3 Interrupts The interrupt sources include 14 external interrupts (NMI, IRQ0, IRQ1, IRQ3, IRQ4, IRQAEC, and WKP7 to WKP0) and 26 internal interrupts (for the flash memory version) or 25 internal interrupts (for the masked ROM version) from on-chip peripheral modules. Figure 3.2 shows the interrupt sources and their numbers. The on-chip peripheral modules which require interrupt sources are the watchdog timer (WDT), address break, realtime clock (RTC), 16-bit timer pulse unit (TPU), asynchronous event counter (AEC), timer F, serial communication interface (SCI), A/D converter, and A/D converter. Interrupt vector addresses are allocated to individual sources. NMI is an interrupt with the highest priority and accepted at all times. Interrupts are controlled by the interrupt controller. The interrupt controller can set interrupts other than NMI to one of three mask levels in order to control multiple interrupts. The interrupt priority registers A to E (IPRA to IPRE) of the interrupt controller set the interrupt mask level. For details on interrupts, see section 4, Interrupt Controller. External interrupts NMI (1) IRQ0, IRQ1, IRQ3, IRQ4, and IRQAEC (5) WKP0 to WKP7 (8) Internal interrupts WDT*1 (1) Address break (1) Realtime clock (8) Asynchronous event counter (1) 16-bit timer pulse unit (6) Timer F (2) SCI3 (2) SCI4*2 (1) A/D converter (1) A/D converter (1) SLEEP instruction execution (1) IIC bus (1) Interrupts Notes: ( ) indicates the source number. 1. When the WDT is used as an interval timer, an interrupt request is generated each time the counter overflows. 2. Available only for the F-ZTAT version. Figure 3.2 Interrupt Sources and their Numbers Rev. 3.00 Aug 23, 2006 Page 65 of 616 REJ09B0182-0300 Section 3 Exception Handling 3.4 Stack Status after Exception Handling Figures 3.3 shows the stack after completion of interrupt exception handling. SP - 4 SP (R7) CCR SP - 3 SP + 1 CCR* SP - 2 SP + 2 PCH SP - 1 SP + 3 PCL SP (R7) SP + 4 Even address Stack area Prior to start of interrupt exception handling PC and CCR saved to stack After completion of interrupt exception handling [Legend] PCH : Upper 8 bits of program counter (PC) PCL : Lower 8 bits of program counter (PC) CCR: Condition code register SP: Stack pointer Notes: 1. PC shows the address of the first instruction to be executed upon return from the interrupt handling routine. 2. Register contents must always be saved and restored by word length, starting from an even-numbered address. * Ignored when returning from the interrupt handling routine. Figure 3.3 Stack Status after Exception Handling Rev. 3.00 Aug 23, 2006 Page 66 of 616 REJ09B0182-0300 Section 3 Exception Handling 3.4.1 Interrupt Response Time Table 3.3 shows the number of wait states after an interrupt request flag is set until the first instruction of the interrupt handling-routine is executed. Table 3.3 Interrupt Wait States Item States Total Waiting time for completion of executing instruction* 1 to 23 15 to 37 Saving of PC and CCR to stack 4 Vector fetch 2 Instruction fetch 4 Internal processing 4 Note: * Excluding EEPMOV instruction. Rev. 3.00 Aug 23, 2006 Page 67 of 616 REJ09B0182-0300 Section 3 Exception Handling 3.5 Usage Notes 3.5.1 Notes on Stack Area Use When word data is accessed in this LSI, the least significant bit of the address is regarded as 0. Access to the stack always takes place in word size, so the stack pointer (SP: R7) should never indicate an odd address. To save register values, use PUSH.W Rn (MOV.W Rn, @-SP) or PUSH.L ERn (MOV.L ERn, @-SP). To restore register values, use POP.W Rn (MOV.W @SP+, Rn) or POP.L ERn (MOV.L @SP+, ERn). Setting an odd address in SP may cause a program to crash. An example is shown in figure 3.4. SP SP PCH PC L R1L PC L SP H'FEFC H'FEFD H'FEFF BSR instruction SP set to H'FEFF MOV. B R1L, @-R7 Stack accessed beyond SP Contents of PCH are lost [Legend] PCH: Upper byte of program counter PCL: Lower byte of program counter R1L: General register R1L SP: Stack pointer Figure 3.4 Operation when Odd Address is Set in SP During interrupt exception handling or when an RTE instruction is executed, CCR contents are saved and restored in word size. Both the upper and lower bytes of word data are saved to the stack; on return, the even address contents are restored to CCR while the odd address contents are ignored. Rev. 3.00 Aug 23, 2006 Page 68 of 616 REJ09B0182-0300 Section 3 Exception Handling 3.5.2 Notes on Rewriting Port Mode Registers When a port mode register is rewritten to switch the functions of external interrupt pins and when the value of the ECPWME bit in AEGSR is rewritten to switch between selection and nonselection of IRQAEC, the following points should be observed. When a pin function is switched by rewriting a port mode register that controls an external interrupt pin (IRQ4, IRQ3, IRQ1, IRQ0, or WKP7 to WKP0), the interrupt request flag is set to 1 at the time the pin function is switched, even if no valid interrupt is input at the pin. Be sure to clear the interrupt request flag to 0 after switching the pin function. When the value of the ECPWME bit in AEGSR that sets selection or non-selection of IRQAEC is rewritten, the interrupt request flag may be set to 1, even if a valid edge has not arrived on the selected IRQAEC or IECPWM (PWM output for the asynchronous event counter). Therefore, be sure to clear the interrupt request flag to 0 after switching the pin function. Table 3.4 shows the conditions under which interrupt request flags are set to 1 in this way. Rev. 3.00 Aug 23, 2006 Page 69 of 616 REJ09B0182-0300 Section 3 Exception Handling Table 3.4 Conditions under which Interrupt Request Flag is Set to 1 Interrupt Request Flags Set to 1 IRR1 IRRI4 Conditions When the IRQ4 bit in PMR9 is changed from 0 to 1 while the IRQ4 pin is low and the IEG4 bit in IEGR is 0. When the IRQ4 bit in PMR9 is changed from 1 to 0 while the IRQ4 pin is low and the IEG4 bit in IEGR is 1. IRRI3 When the IRQ3 bit in PMRB is changed from 0 to 1 while the IRQ3 pin is low and the IEG3 bit in IEGR is 0. When the IRQ3 bit in PMRB is changed from 1 to 0 while the IRQ3 pin is low and the IEG3 bit in IEGR is 1. IRREC2 When an edge as designated by the AIEGS1 and AIEGS0 bits in AEGSR is detected because the values of the IRQAEC pin and of IECPWM at switching are different (e.g., when the rising edge has been selected and the ECPWME bit in AEGSR is changed from 1 to 0 while the IRQAEC pin is low and IECPWM is 1). IRRI1 When the IRQ1 bit in PMRB is changed from 0 to 1 while the IRQ1 pin is low and the IEG1 bit in IEGR is 0. When the IRQ1 bit in PMRB is changed from 1 to 0 while the IRQ1 pin is low and the IEG1 bit in IEGR is 1. IRRI0 When the IRQ0 bit in PMRB is changed from 0 to 1 while the IRQ0 pin is low and the IEG0 bit in IEGR is 0. When the IRQ0 bit in PMRB is changed from 1 to 0 while the IRQ0 pin is low and the IEG0 bit in IEGR is 1. IWPR IWPF7 When the WKP7 bit in PMR5 is changed from 0 to 1 while the WKP7 pin is low. IWPF6 When the WKP6 bit in PMR5 is changed from 0 to 1 while the WKP6 pin is low. IWPF5 When the WKP5 bit in PMR5 is changed from 0 to 1 while the WKP5 pin is low. IWPF4 When the WKP4 bit in PMR5 is changed from 0 to 1 while the WKP4 pin is low. IWPF3 When the WKP3 bit in PMR5 is changed from 0 to 1 while the WKP3 pin is low. IWPF2 When the WKP2 bit in PMR5 is changed from 0 to 1 while the WKP2 pin is low. IWPF1 When the WKP1 bit in PMR5 is changed from 0 to 1 while the WKP1 pin is low. IWPF0 When the WKP0 bit in PMR5 is changed from 0 to 1 while the WKP0 pin is low. Rev. 3.00 Aug 23, 2006 Page 70 of 616 REJ09B0182-0300 Section 3 Exception Handling Figure 3.5 shows the procedure for setting a bit in a port mode register and clearing the interrupt request flag. This procedure also applies to AEGSR setting. When switching a pin function, mask the interrupt before setting the bit in the port mode register (or AEGSR). After accessing the port mode register (or AEGSR), execute at least one instruction (e.g., NOP), then clear the interrupt request flag from 1 to 0. If the instruction to clear the flag to 0 is executed immediately after the port mode register (or AEGSR) access without executing an instruction, the flag will not be cleared. An alternative method is to avoid the setting of interrupt request flags when pin functions are switched by keeping the pins at the high level so that the conditions in table 3.3 are not satisfied. However, the procedure in figure 3.5 is recommended because IECPWM is an internal signal and determining its value is complicated. I bit in CCR 1 Interrupts masked. (Another possibility is to disable the relevant interrupt in the interrupt enable register 1.) Set port mode register (or AEGSR) bit Execute NOP instruction After setting the port mode register (or AEGSR) bit, first execute at least one instruction (e.g., NOP), then clear the interrupt request flag to 0 Clear interrupt request flag to 0 I bit in CCR 0 Interrupt mask cleared Figure 3.5 Port Mode Register (or AEGSR) Setting and Interrupt Request Flag Clearing Procedure Rev. 3.00 Aug 23, 2006 Page 71 of 616 REJ09B0182-0300 Section 3 Exception Handling 3.5.3 Method for Clearing Interrupt Request Flags Use the recommended method given below when clearing the flags in interrupt request registers (IRR1, IRR2, and IWPR). * Recommended method Use a single instruction to clear flags. The bit manipulation instruction and byte-size data transfer instruction can be used. Two examples of program code for clearing IRRI1 (bit 1 in IRR1) are given below. BCLR #1, @IRR1:8 MOV.B R1L, @IRR1:8 (set the value of R1L to B'11111101) * Example of a malfunction When flags are cleared with multiple instructions, other flags might be cleared during execution of the instructions, even though they are currently set, and this will cause a malfunction. Here is an example in which IRRI0 is cleared and disabled in the process of clearing IRRI1 (bit 1 in IRR1). MOV.B @IRR1:8,R1L ......... IRRI0 = 0 at this time AND.B #B'11111101,R1L ..... Here, IRRI0 = 1 MOV.B R1L,@IRR1:8 ......... IRRI0 is cleared to 0 In the above example, it is assumed that an IRQ0 interrupt is generated while the AND.B instruction is executing. The IRQ0 interrupt is disabled because, although the original objective is clearing IRRI1, IRRI0 is also cleared. Rev. 3.00 Aug 23, 2006 Page 72 of 616 REJ09B0182-0300 Section 4 Interrupt Controller Section 4 Interrupt Controller 4.1 Features This LSI controls interrupts by the interrupt controller. The interrupt controller has the following features. * Mask levels settable with IPR An interrupt priority register (IPR) is provided for setting interrupt mask levels. Three mask levels can be set for each module for all interrupts except NMI and address break. * Interrupts can be enabled or disabled in three levels by the INTM1 and INTM0 bits in the interrupt mask register (INTM). * Fourteen external interrupts NMI is the highest-priority interrupt, and is accepted at all times. Rising or falling edge sensing can be selected for NMI. Rising or falling edge sensing can be selected for IRQ0, IRQ1, IRQ3, IRQ4, and WKP0 to WKP7. Rising, falling, or both edge sensing can be selected for IRQAEC. A block diagram of the interrupt controller is shown in figure 4.1. NMI/IRQ/ WKP input External interrupt input IENR1 Interrupt request Mask level determination Internal interrupt source TPU, SCI, etc. Vector number I CCR ............ INTM IPR [Legend] IENR1: IPR: CCR: INTM: IRQ enable register 1 Interrupt priority register Condition code register Interrupt mask register Figure 4.1 Block Diagram of Interrupt Controller Rev. 3.00 Aug 23, 2006 Page 73 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.2 Input/Output Pins Table 4.1 shows the pin configuration of the interrupt controller. Table 4.1 Pin Configuration Name I/O Function NMI Input Nonmaskable external interrupt pin Rising or falling edge can be selected IRQAEC Input Maskable external interrupt pin Rising, falling, or both edges can be selected IRQ4 Input IRQ3 Input Maskable external interrupt pins Rising or falling edge can be selected IRQ1 Input IRQ0 Input WKP7 to WKP0 Input 4.3 Maskable external interrupt pins Accepted at a rising or falling edge Register Descriptions The interrupt controller has the following registers. * Interrupt edge select register (IEGR) * Wakeup edge select register (WEGR) * Interrupt enable register 1 (IENR1) * Interrupt enable register 2 (IENR2) * Interrupt request register 1 (IRR1) * Interrupt request register 2 (IRR2) * Wakeup interrupt request register (IWPR) * Interrupt priority register A (IPRA) * Interrupt priority register B (IPRB) * Interrupt priority register C (IPRC) * Interrupt priority register D (IPRD) * Interrupt priority register E (IPRE) * Interrupt mask register (INTM) Rev. 3.00 Aug 23, 2006 Page 74 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.3.1 Interrupt Edge Select Register (IEGR) IEGR selects the sense of an edge that generates interrupt requests of the NMI, TMIF, ADTRG, IRQ4, IRQ3, IRQ1, and IRQ0 pins. Bit Bit Name Initial Value R/W Descriptions 7 NMIEG 0 R/W NMI Edge Select 0: Detects a falling edge of the NMI pin input 1: Detects a rising edge of the NMI pin input 6 TMIFEG 0 R/W TMIF Edge Select 0: Detects a falling edge of the TMIF pin input 1: Detects a rising edge of the TMIF pin input 5 ADTRGNEG 0 R/W ADTRG Edge Select 0: Detects a falling edge of the ADTRG pin input 1: Detects a rising edge of the ADTRG pin input 4 IEG4 0 R/W IRQ4 Edge Select 0: Detects a falling edge of the IRQ4 pin input 1: Detects a rising edge of the IRQ4 pin input 3 IEG3 0 R/W IRQ3 Edge Select 0: Detects a falling edge of the IRQ3 pin input 1: Detects a rising edge of the IRQ3 pin input 2 1 IEG1 0 R/W Reserved IRQ1 Edge Select 0: Detects a falling edge of the IRQ1 pin input 1: Detects a rising edge of the IRQ1 pin input 0 IEG0 0 R/W IRQ0 Edge Select 0: Detects a falling edge of the IRQ0 pin input 1: Detects a rising edge of the IRQ0 pin input Rev. 3.00 Aug 23, 2006 Page 75 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.3.2 Wakeup Edge Select Register (WEGR) WEGR selects the sense of an edge that generates interrupt requests of the WKP7 to WKP0 pins. Bit Bit Name Initial Value R/W 7 WKEGS7 0 R/W Description WKP7 Edge Select 0: Detects a falling edge of the WKP7 pin input 1: Detects a rising edge of the WKP7 pin input 6 WKEGS6 0 R/W WKP6 Edge Select 0: Detects a falling edge of the WKP6 pin input 1: Detects a rising edge of the WKP6 pin input 5 WKEGS5 0 R/W WKP5 Edge Select 0: Detects a falling edge of the WKP5 pin input 1: Detects a rising edge of the WKP5 pin input 4 WKEGS4 0 R/W WKP4 Edge Select 0: Detects a falling edge of the WKP4 pin input 1: Detects a rising edge of the WKP4 pin input 3 WKEGS3 0 R/W WKP3 Edge Select 0: Detects a falling edge of the WKP3 pin input 1: Detects a rising edge of the WKP3 pin input 2 WKEGS2 0 R/W WKP2 Edge Select 0: Detects a falling edge of the WKP2 pin input 1: Detects a rising edge of the WKP2 pin input 1 WKEGS1 0 R/W WKP1 Edge Select 0: Detects a falling edge of the WKP1 pin input 1: Detects a rising edge of the WKP1 pin input 0 WKEGS0 0 R/W WKP0 Edge Select 0: Detects a falling edge of the WKP0 pin input 1: Detects a rising edge of the WKP0 pin input Rev. 3.00 Aug 23, 2006 Page 76 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.3.3 Interrupt Enable Register 1 (IENR1) IENR1 enables the RTC, WKP7 to WKP0, IRQ0, IRQ1, IRQ3, IRQ4, and IRQAEC interrupts. Bit Bit Name Initial Value R/W 7 IENRTC 0 R/W Description RTC Interrupt Request Enable The RTC interrupt request is enabled when this bit is set to 1. 6 1 R/W Reserved This bit is always read as 1. 5 IENWP 0 R/W Wakeup Interrupt Request Enable The WKP7 to WKP0 interrupt requests are enabled when this bit is set to 1. 4 IEN4 0 R/W IRQ4 Interrupt Request Enable The IRQ4 interrupt request is enabled when this bit is set to 1. 3 IEN3 0 R/W IRQ3 Interrupt Request Enable The IRQ3 interrupt request is enabled when this bit is set to 1. 2 IENEC2 0 R/W IRQAEC Interrupt Request Enable The IRQAEC interrupt request is enabled when this bit is set to 1. 1 IEN1 0 R/W IRQ1 Interrupt Request Enable The IRQ1 interrupt request is enabled when this bit is set to 1. 0 IEN0 0 R/W IRQ0 Interrupt Request Enable The IRQ0 interrupt request is enabled when this bit is set to 1. Rev. 3.00 Aug 23, 2006 Page 77 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.3.4 Interrupt Enable Register 2 (IENR2) IENR2 enables the direct transition, A/D converter, timer F, and asynchronous event counter interrupts. Bit Bit Name Initial Value R/W Description 7 IENDT 0 R/W Direct Transition Interrupt Request Enable The direct transition interrupt request is enabled when this bit is set to 1. 6 IENAD 0 R/W A/D Converter Interrupt Request Enable The A/D converter interrupt request is enabled when this bit is set to 1. 5 IENSAD 0 R/W A/D Converter Interrupt Request Enable The A/D converter interrupt request is enabled when this bit is set to 1. 4 -- 1 R/W Reserved This bit is always read as 1. 3 IENTFH 0 R/W Timer FH Interrupt Request Enable The timer FH interrupt request is enabled when this bit is set to 1. 2 IENTFL 0 R/W Timer FL Interrupt Request Enable The timer FL interrupt request is enabled when this bit is set to 1. 1 1 R/W Reserved This bit is always read as 1. 0 IENEC 0 R/W Asynchronous Event Counter Interrupt Request Enable The asynchronous event counter interrupt request is enabled when this bit is set to 1. Rev. 3.00 Aug 23, 2006 Page 78 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.3.5 Interrupt Request Register 1 (IRR1) IRR1 indicates the IRQ0, IRQ1, IRQ3, IRQ4, and IRQAEC interrupt request status. Bit Initial Bit Name Value R/W Description 7 to 5 All 1 R/W Reserved 4 IRRI4 0 These bits are always read as 1. R/(W)* IRQ4 Interrupt Request Flag [Setting condition] When the IRQ4 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit 3 IRRI3 0 R/(W)* IRQ3 Interrupt Request Flag [Setting condition] When the IRQ3 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit 2 IRREC2 0 R/(W)* IRQAEC Interrupt Request Flag [Setting condition] When the IRQAEC pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit 1 IRRI1 0 R/(W)* IRQ1 Interrupt Request Flag [Setting condition] When the IRQ1 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit Rev. 3.00 Aug 23, 2006 Page 79 of 616 REJ09B0182-0300 Section 4 Interrupt Controller Bit Initial Bit Name Value R/W Description 0 IRRI0 R/(W)* IRQ0 Interrupt Request Flag 0 [Setting condition] When the IRQ0 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit Note: 4.3.6 * Only a write of 0 for flag clearing is possible. Interrupt Request Register 2 (IRR2) IRR2 indicates the interrupt request status of the direct transition, A/D converter, timer F, and asynchronous event counter. Bit Bit Name Initial Value R/W Description 7 IRRDT 0 R/(W)* Direct Transition Interrupt Request Flag [Setting condition] When the SLEEP instruction is executed and direct transition is made while the DTON bit in SYSCR2 is set to 1 [Clearing condition] When 0 is written to this bit 6 IRRAD 0 R/(W)* A/D Converter Interrupt Request Flag [Setting condition] When A/D conversion ends [Clearing condition] When 0 is written to this bit 5 IRRSAD 0 R/(W)* A/D Converter Interrupt Request Flag [Setting condition] When A/D conversion ends [Clearing condition] When 0 is written to this bit 4 1 R/W Reserved This bit is always read as 1. Rev. 3.00 Aug 23, 2006 Page 80 of 616 REJ09B0182-0300 Section 4 Interrupt Controller Bit Bit Name Initial Value R/W Description 3 IRRTFH 0 R/(W)* Timer FH Interrupt Request Flag [Setting condition] When the timer FH compare match or overflow occurs [Clearing condition] When 0 is written to this bit 2 IRRTFL 0 R/(W)* Timer FL Interrupt Request Flag [Setting condition] When the timer FL compare match or overflow occurs [Clearing condition] When 0 is written to this bit 1 1 R/W 0 IRREC 0 R/(W)* Reserved This bit is always read as 1. Asynchronous Event Counter Interrupt Request Flag [Setting condition] When the asynchronous event counter overflows [Clearing condition] When 0 is written to this bit Note: * Only a write of 0 for flag clearing is possible. Rev. 3.00 Aug 23, 2006 Page 81 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.3.7 Wakeup Interrupt Request Register (IWPR) IWPR has the WKP7 to WKP0 interrupt request status flags. Bit Bit Name Initial Value R/W 7 IWPF7 0 R/W Description WKP7 Interrupt Request Flag [Setting condition] When the WKP7 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit 6 IWPF6 0 R/W WKP6 Interrupt Request Flag [Setting condition] When the WKP6 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit 5 IWPF5 0 R/W WKP5 Interrupt Request Flag [Setting condition] When the WKP5 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit 4 IWPF4 0 R/W WKP4 Interrupt Request Flag [Setting condition] When the WKP4 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit 3 IWPF3 0 R/W WKP3 Interrupt Request Flag [Setting condition] When the WKP3 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit Rev. 3.00 Aug 23, 2006 Page 82 of 616 REJ09B0182-0300 Section 4 Interrupt Controller Bit Bit Name Initial Value R/W Description 2 IWPF2 0 R/W WKP2 Interrupt Request Flag [Setting condition] When the WKP2 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit 1 IWPF1 0 R/W WKP1 Interrupt Request Flag [Setting condition] When the WKP1 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit 0 IWPF0 0 R/W WKP0 Interrupt Request Flag [Setting condition] When the WKP0 pin is set as the interrupt input pin and the specified edge is detected [Clearing condition] When 0 is written to this bit Rev. 3.00 Aug 23, 2006 Page 83 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.3.8 Interrupt Priority Registers A to E (IPRA to IPRE) IPR sets mask levels (levels 2 to 0) for interrupts other than NMI and address break. The correspondence between interrupt sources and IPR settings is shown in table 4.2. Setting a value in the range from H'0 to H'3 in the 2-bit groups of bits 7 and 6, 5 and 4, 3 and 2, and 1 and 0 sets the mask level of the corresponding interrupt. Bits 3 to 0 in IPRE are reserved. Bit Initial Bit Name Value R/W Description 7 IPRn7 0 R/W 6 IPRn6 0 R/W Set the mask level of the corresponding interrupt source. 00: Mask level 0 (Lowest) 01: Mask level 1 1*: Mask level 2 (Highest) 5 IPRn5 0 R/W 4 IPRn4 0 R/W Set the mask level of the corresponding interrupt source. 00: Mask level 0 (Lowest) 01: Mask level 1 1*: Mask level 2 (Highest) 3 IPRn3 0 R/W 2 IPRn2 0 R/W Set the mask level of the corresponding interrupt source. 00: Mask level 0 (Lowest) 01: Mask level 1 1*: Mask level 2 (Highest) 1 IPRn1 0 R/W 0 IPRn0 0 R/W Set the mask level of the corresponding interrupt source. 00: Mask level 0 (Lowest) 01: Mask level 1 1*: Mask level 2 (Highest) [Legend] *: Don't care. n = A to E Rev. 3.00 Aug 23, 2006 Page 84 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.3.9 Interrupt Mask Register (INTM) INTM is an 8-bit readable/writable register that controls 3-level interrupt masking depending on the combination of the INTM0 and INTM1 bits. Bit Bit Name Initial Value R/W Description 7 to 2 All 1 R/W Reserved 1 INTM1 0 R/W Set the interrupt mask level. 0 INTM0 0 R/W 1*: Mask an interrupt with mask level 1 or less These bits are always read as 1. 01: Mask an interrupt with mask level 0 00: Accept all interrupts [Legend] *: Don't care. 4.4 Interrupt Sources 4.4.1 External Interrupts There are 14 external interrupts: NMI, WKP7 to WKP0, IRQ4, IRQ3, IRQAEC, IRQ1, and IRQ0. (1) NMI Interrupt NMI is the highest-priority interrupt, and is always accepted by the CPU regardless of the state of the I bit in CCR. The NMIEG bit in IEGR can be used to select whether an interrupt is requested at a rising edge or a falling edge on the NMI pin. (2) WKP7 to WKP0 Interrupts WKP7 to WKP0 interrupts are requested by the rising or falling edge input signals at the WKP7 to WKP0 pins. When the rising or falling edge is input while the WKP7 to WKP0 pin functions are selected by PMR5, the corresponding bit in IWPR is set to 1 and an interrupt request is generated. Clearing the IENWP bit in IENR1 to 0 disables the wakeup interrupt request to be accepted. Setting the I bit in CCR to 1 masks all interrupts. Rev. 3.00 Aug 23, 2006 Page 85 of 616 REJ09B0182-0300 Section 4 Interrupt Controller When exception handling for the WKP7 to WKP0 interrupts is accepted, the I bit in CCR is set to 1. The interrupt mask level can be set by IPR. (3) IRQ4, IRQ3, IRQ1, and IRQ0 Interrupts IRQ4, IRQ3, IRQ1, and IRQ0 interrupts are requested by input signals at IRQ4, IRQ3, IRQ1, and IRQ0 pins. Using the IEG4, IEG3, IEG1, and IEG0 bits in IEGR, it is possible to select whether an interrupt is generated by a rising or falling edge at IRQ4, IRQ3, IRQ1, and IRQ0 pins. When the specified edge is input while the IRQ4, IRQ3, IRQ1, and IRQ0 pin functions are selected by PMRB and PMR9, the corresponding bit in IRR1 is set to 1 and an interrupt request is generated. Clearing the IEN4, IEN3, IEN1, and IEN0 bits in IENR1 to 0 disables the interrupt request to be accepted. Setting the I bit in CCR to 1 masks all interrupts. The interrupt mask level can be set by IPR. (4) IRQAEC Interrupts An IRQAEC interrupt is requested by an input signal at the IRQAEC pin or IECPWM (PWM output for the asynchronous event counter). When the IRQAEC pin is used as an external interrupt pin, clear the ECPWME bit in AEGSR to 0. Using the AIEGS1 and AIEGS0 bits in AEGSR, it is possible to select whether an interrupt is generated by a rising edge, falling edge, or both edges. When the IENEC2 bit in IENR1 is set to 1 and the specified edge is input, the corresponding bit in IRR1 is set to 1 and an interrupt request is generated. When exception handling for the IRQAEC interrupt is accepted, the I bit in CCR is set to 1. The interrupt mask level can be set by IPR. Rev. 3.00 Aug 23, 2006 Page 86 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.4.2 Internal Interrupts Internal interrupts generated from the on-chip peripheral modules have the following features: * For each on-chip peripheral module, there are flags that indicate the interrupt request status, and enable bits that select enabling or disabling of these interrupts. Internal interrupts can be controlled independently. If an enable bit is set to 1, an interrupt request is sent to the interrupt controller. * The interrupt mask level can be set by IPR. 4.5 Interrupt Exception Handling Vector Table Table 4.2 shows interrupt exception handling sources, vector addresses, and interrupt priorities. The lower the vector number, the higher the priority. The priority within a module is fixed. Mask levels for interrupts other than NMI and address break can be modified by IPR. Rev. 3.00 Aug 23, 2006 Page 87 of 616 REJ09B0182-0300 Section 4 Interrupt Controller Table 4.2 Interrupt Sources, Vector Addresses, and Interrupt Priorities Origin of Interrupt Source Name Vector Number Vector Address IPR Priority Reset RES, Watchdog Timer 0 H'0000 High NMI NMI 3 H'0006 Address break Break conditions satisfied 5 H'000A External pins IRQ0 6 H'000C IPRA7, IPRA6 IRQ1 7 H'000E IPRA5, IPRA4 IRQAEC 8 H'0010 IPRA3, IPRA2 IRQ3 9 H'0012 IPRA1, IPRA0 IRQ4 10 H'0014 WKP0 11 H'0016 WKP1 12 H'0018 WKP2 13 H'001A WKP3 14 H'001C WKP4 15 H'001E WKP5 16 H'0020 WKP6 17 H'0022 WKP7 18 H'0024 0.25-second overflow 19 H'0026 0.5-second overflow 20 H'0028 Second periodic overflow 21 H'002A Minute periodic overflow 22 H'002C Hour periodic overflow 23 H'002E Day-of-week periodic overflow 24 H'0030 Week periodic overflow 25 H'0032 Free-running overflow 26 H'0034 RTC Rev. 3.00 Aug 23, 2006 Page 88 of 616 REJ09B0182-0300 IPRB7, IPRB6 IPRB5, IPRB4 Low Section 4 Interrupt Controller Origin of Interrupt Source Vector Number Vector Address IPR Priority WDT WDT overflow (interval timer) 27 H'0036 IPRB3, IPRB2 High AEC AEC overflow 28 H'0038 IPRB1, IPRB0 TPU_1 TG1A (TG1A input capture/compare match) 29 H'003A IPRC7, IPRC6 TG1B (TG1B input capture/compare match) 30 H'003C TCI1V (overflow 1) 31 H'003E TG2A (TG2A input capture/compare match) 32 H'0040 TG2B (TG2B input capture/compare match) 33 H'0042 TCI2V (overflow 2) 34 H'0044 Timer FL compare match Timer FL overflow 35 H'0046 Timer FH compare match Timer FH overflow 36 H'0048 SCI4* Receive data full/transmit 37 data empty Transmit end/receive error H'004A IPRC1, IPRC0 SCI3_1 Transmit completion/transmit data empty Receive data full/overrun error Framing error/parity error 38 H'004C IPRD7, IPRD6 SCI3_2 Transmit completion/transmit data empty Receive data full/overrun error Framing error/parity error 39 H'004E IPRD5, IPRD4 IIC2 Transmit data empty/transmit end Receive data full/overrun error NACK detection Arbitration/overrun error 40 H'0050 IPRD3, IPRD2 14-bit A/D converter A/D conversion end 41 H'0052 IPRD1, IPRD0 TPU_2 Timer F Name IPRC5, IPRC4 IPRC3, IPRC2 Low Rev. 3.00 Aug 23, 2006 Page 89 of 616 REJ09B0182-0300 Section 4 Interrupt Controller Origin of Interrupt Source 10-bit A/D converter Name Vector Number Vector Address IPR Priority A/D conversion end 42 H'0054 IPRE7, IPRE6 High 43 H'0056 IPRE5, IPRE4 (SLEEP instruction Direct transition execution) Note: * 4.6 Low Supported only by the F-ZTAT version. Operation NMI and address break interrupts are accepted at all times except in the reset state. In the case of IRQ interrupts, WKP interrupts, and on-chip peripheral module interrupts, an enable bit is provided for each interrupt. Clearing an enable bit to 0 disables the corresponding interrupt request. Interrupt sources for which the enable bits are set to 1 are controlled by the interrupt controller. Table 4.3 shows the interrupt control states. Figure 4.2 shows a flowchart of the interrupt acceptance operation. Four-level interrupt masking is controlled according to the combination of the I bit in CCR and the INTM1 and INTM0 bits in INTM. Table 4.3 Interrupt Control States CCR INTM I INTM1 INTM0 States 1 * * All interrupts other than NMI and address break are masked. 0 1 * Interrupts with mask level 1 or less are masked. 0 1 Interrupts with mask level 0 are masked. 0 0 All interrupts are accepted. [Legend]*: Don't care. 1. If an interrupt source whose enable bit is set to 1 occurs, an interrupt request is sent to the interrupt controller. 2. The following control operations are performed by referencing the INTM1 and INTM0 bits in INTM and the I bit in CCR. * When the I bit is set to 1, the interrupt request is held pending. * When the I bit is cleared to 0 and the INTM1 bit is set to 1, interrupts with mask level 1 or below are held pending. Rev. 3.00 Aug 23, 2006 Page 90 of 616 REJ09B0182-0300 Section 4 Interrupt Controller * When the I bit is cleared to 0, the INTM1 bit is cleared to 0, and the INTM0 bit is set to 1, interrupt requests with mask level 0 are held pending. * When the I bit, INTM1 bit, and INTM0 bit are all cleared to 0, all interrupt requests are accepted. 3. If contention occurs between interrupts that are not held pending by the INTM1 and INTM0 bits in the INTM register and the I bit in CCR, the interrupt with the highest priority as shown in table 4.2 is selected, regardless of the IPR setting. 4. When the CPU accepts an interrupt request, it starts interrupt exception handling after execution of the current instruction has been completed. 5. PC and CCR are saved to the stack area by interrupt exception handling. 6. Next, the I bit in CCR is set to 1. This masks all interrupts except NMI and address break. 7. The CPU generates a vector address for the accepted interrupt and starts interrupt handling by reading the interrupt routine start address in the vector table. Rev. 3.00 Aug 23, 2006 Page 91 of 616 REJ09B0182-0300 Section 4 Interrupt Controller Program execution state Interrupt generated? No Yes Yes NMI or address break? No INTM1 = 0? INTM0 = 0? No Yes INTM1 = 0? INTM0 = 1? Yes No I = 0? Mask level 1 or 2 interrupt? Yes No No Mask level 2 interrupt? No Yes No Yes I = 0? No I = 0? Yes Yes Save PC and CCR I Hold pending 1 Read vector address Branch to interrupt handling routine Figure 4.2 Flowchart of Procedure Up to Interrupt Acceptance 4.6.1 Interrupt Exception Handling Sequence Figure 4.3 shows the interrupt exception handling sequence. The example shown is for the case where the program area and stack area are in external memory with 16-bit and 2-state access space. Rev. 3.00 Aug 23, 2006 Page 92 of 616 REJ09B0182-0300 (4) High (3) (6) (5) Stack (8) (7) (10) (9) Vector fetch (6)(8): Saved PC and saved CCR SP-4 (7): (14): First instruction of interrupt handling rou Interrupt handling routine start address ((13) = (10)(12)) SP-2 (5): (13): (10)(12): Interrupt handling routine start address (Vector address contents) Instruction prefetch address (Not executed.) (14) (13) Instruction prefetch of interrupt handling routine (3): (12) (11) Internal processing (9)(11): Vector address Instruction prefetch address (Not executed. This is the contents of the saved PC and the return address.) (2) (1) Internal processing (2)(4): Instruction code (Not executed.) (1): Internal data bus Internal write signal Internal read signal Internal address bus Interrupt request signal Instruction prefetch Interrupt accepted Interrupt level determination Wait for end of instruction Section 4 Interrupt Controller Figure 4.3 Interrupt Exception Handling Sequence Rev. 3.00 Aug 23, 2006 Page 93 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.6.2 Interrupt Response Times Table 4.4 shows interrupt response times - the interval between generation of an interrupt request and execution of the first instruction in the interrupt handling routine. Table 4.4 Interrupt Response Times (States) No. Execution Status Number of States 1 Interrupt mask level determination 1 or 2* 2 Maximum number of wait states until executing instruction ends 1 to 23 3 PC, CCR stack 4 4 Vector fetch 5 6 1 4 Instruction fetch* 2 Internal processing* 4 3 Total 4 19 to 41 Notes: 1. One state for internal interrupts and two states for external interrupts. 2. Prefetch after interrupt acceptance and interrupt handling routine prefetch. 3. Internal processing after interrupt acceptance and internal processing after vector fetch. Rev. 3.00 Aug 23, 2006 Page 94 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.7 Usage Notes 4.7.1 Contention between Interrupt Generation and Disabling When an interrupt enable bit is cleared to 0 to disable interrupts, the disabling becomes effective after execution of the instruction. When an interrupt enable bit is cleared to 0 by an instruction such as BCLR or MOV, and if an interrupt is generated during execution of the instruction, the interrupt concerned will still be enabled on completion of the instruction, and so interrupt exception handling for that interrupt will be executed on completion of the instruction. However, if there is an interrupt request with higher priority than that interrupt, interrupt exception handling will be executed for the higher-priority interrupt, and the lower-priority interrupt will be ignored. The same also applies when an interrupt source flag is cleared to 0. Figure 4.4 shows an example in which the TGIEA bit in TIER of the 16-bit timer pulse unit (TPU) is cleared to 0. TIER write cycle by CPU TGIA exception handling Internal address bus TIER address Internal write signal TGIEA TGIA TGIA interrupt signal Figure 4.4 Contention between Interrupt Generation and Disabling The above contention will not occur if an enable bit or interrupt source flag is cleared to 0 while the interrupt is masked. Rev. 3.00 Aug 23, 2006 Page 95 of 616 REJ09B0182-0300 Section 4 Interrupt Controller 4.7.2 Instructions that Disable Interrupts The instructions that disable interrupts are LDC, ANDC, ORC, and XORC. When an interrupt request is generated, an interrupt is request is sent to the CPU after the interrupt controller has determined the mask level. At that time, if the CPU is executing an instruction that disables interrupts, the CPU always executes the next instruction after the instruction execution is completed. 4.7.3 Interrupts during Execution of EEPMOV Instruction Interrupt operation differs between the EEPMOV.B instruction and the EEPMOV.W instruction. With the EEPMOV.B instruction, an interrupt request (including NMI) issued during transfer is not accepted until the transfer is completed. With the EEPMOV.W instruction, even if an interrupt request other than the NMI is issued during transfer, the interrupt is not accepted until the transfer is completed. If the NMI interrupt request is issued, NMI exception handling starts at a break in the transfer cycle. The PC value saved on the stack in this case is the address of the next instruction. Therefore, if an NMI interrupt is generated during execution of an EEPMOV.W instruction, the following coding should be used. L1: EEPMOV.W 4.7.4 MOV.W R4,R4 BNE L1 IENR Clearing When an interrupt request is disabled by clearing the interrupt enable register or when the interrupt request register is cleared, the interrupt request should be masked (I bit = 1). If the above operation is executed while the I bit is 0 and contention between the instruction execution and the interrupt request generation occurs, exception handling, which corresponds to the interrupt request generated after instruction execution of the above operation is completed, is executed. Rev. 3.00 Aug 23, 2006 Page 96 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators Section 5 Clock Pulse Generators The clock pulse generator is provided on-chip, including both a system clock pulse generator and a subclock pulse generator. The system clock pulse generator consists of a system clock oscillator, system clock divider, and on-chip oscillator (available only for the masked ROM version). The subclock pulse generator consists of a subclock oscillator and subclock divider. Figure 5.1 (1) shows a block diagram of the clock pulse generators for the flash memory version and figure 5.1 (2) shows that for the masked ROM version. OSC1 OSC2 System clock oscillator OSC (fOSC) System clock divider OSC OSC/8 OSC/16 OSC/32 OSC/64 System clock pulse generator Prescaler S (13 bits) /2 to /8192 w W/2 X1 X2 Subclock oscillator W (fW) Subclock pulse generator Subclock divider W/4 W/8 w/4 SUB w/2 Figure 5.1 Block Diagram of Clock Pulse Generators (Flash Memory Version) (1) CPG0200A_010020040500 Rev. 3.00 Aug 23, 2006 Page 97 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators IRQAEC on-chip oscillator ROSC OSC1 OSC2 System clock oscillator OSC OSC (fOSC) (fOSC) System clock divider OSC OSC/8 OSC/16 OSC/32 OSC/64 System clock pulse generator Prescaler S (13 bits) /2 to /8192 W W/2 X1 X2 Subclock oscillator fW (fW) Subclock divider W/4 W/8 W/4 SUB Subclock pulse generator W/2 Figure 5.1 Block Diagram of Clock Pulse Generators (Masked ROM Version) (2) The basic clock signals that drive the CPU and on-chip peripheral modules are and SUB. The system clock is divided by prescaler S to become a clock signal from /8192 to /2. Both the system clock and subclock signals are provided to the on-chip peripheral modules. Since the on-chip oscillator is available for the masked ROM version, the reference clock can be selected to be output from the on-chip oscillator or system clock oscillator by the input level of the IRQAEC pin. Rev. 3.00 Aug 23, 2006 Page 98 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators 5.1 Register Description * SUB32k control register (SUB32CR) * Oscillator Control Register (OSCCR) 5.1.1 SUB32k Control Register (SUB32CR) SUB32CR controls whether the subclock oscillator operates or stops. Bit Bit Name Initial Value R/W 7 32KSTOP 0 R/W Description Subclock Oscillator Operation Control 0: Subclock oscillator operates 1: Subclock oscillator stops 6 0 R/W Reserved This bit is readable/writable. 5 to 0 All 0 Reserved These bits cannot be modified. Rev. 3.00 Aug 23, 2006 Page 99 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators 5.1.2 Oscillator Control Register (OSCCR) OSCCR contains a flag indicating the selection status of the system clock oscillator and on-chip oscillator, indications the input level of the IRQAEC pin during resets (Supported only by the masked ROM version). Bit Bit Name Initial Value R/W Description 7 to 3 -- All 0 R/W Reserved 2 IRQAECF -- R These bits are readable/writable enable reserves bits. IRQAEC flag This bit indicates the IRQAEC pin input level set during resets. 0: IRQAEC pin set to GND during resets 1: IRQAEC pin set to Vcc during resets 1 OSCF -- R OSC flag This bit indicates the oscillator operating with the system clock pulse generator. 0: System clock oscillator operating (on-chip oscillator stopped) 1: On-chip oscillator operating (system clock oscillator stopped) 0 -- 0 R/W Reserved Never write 1 to this bit, as it can cause the LSI to malfunction. Rev. 3.00 Aug 23, 2006 Page 100 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators 5.2 System Clock Generator Clock pulses can be supplied to the system clock divider either by connecting a crystal or ceramic resonator, or by providing external clock input. As shown in figure 5.1 (2), a system clock oscillator and on-chip oscillator are selectable for the masked ROM version. For the selection method, see section 5.2.4, On-Chip Oscillator Selection Method (Supported only by the Masked ROM Version). 5.2.1 Connecting Crystal Resonator Figure 5.2 shows a typical method of connecting a crystal resonator. An AT-cut parallel-resonance crystal resonator should be used. For details, refer to section 25, Electrical Characteristics. C1 OSC 1 OSC 2 R1 C2 R1 = 1 M 20% Note: Consult with the crystal resonator manufacturer to determine the circuit constants. Frequency 4.19 MHz Manufacturer C1, C2 Product Type Recommendation Value Kyocera Kinseki HC-491U-S Corporation 22 pF 20% Figure 5.2 Typical Connection to Crystal Resonator Rev. 3.00 Aug 23, 2006 Page 101 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators 5.2.2 Connecting Ceramic Resonator Figure 5.3 shows a typical method of connecting a ceramic resonator. C1 Rf = 1 M 20% Note: Consult with the crystal resonator manufacturer to determine the circuit constants. OSC1 Rf C2 OSC2 Frequency Manufacturer Product Type C1, C2 Recommendation Value 4.194 MHz Murata Manufacturing CSTLS4M19G53-B0 15pF (on-chip) Co., Ltd. CSTLS4M19G56-B0 47pF (on-chip) Figure 5.3 Typical Connection to Ceramic Resonator 5.2.3 External Clock Input Method Connect an external clock signal to pin OSC1, and leave pin OSC2 open. Figure 5.4 shows a typical connection. The duty cycle of the external clock signal must be 45 to 55%. OSC1 OSC2 External clock input Open Figure 5.4 Example of External Clock Input 5.2.4 On-Chip Oscillator Selection Method (Supported only by the Masked ROM Version) The on-chip oscillator is selected by the input level of the IRQAEC pin during a reset. The selection method of the system clock oscillator and the on-chip oscillator is listed in table 5.1. The input level of the IRQAEC pin during a reset* should be fixed either to Vcc or GND, depending on the oscillator type to be selected. The setting takes effect when the rest is cleared. When the onchip oscillator is selected, to connect a resonator to OSC1 or OSC2 is not necessary. In this case, the OSC1 pin should be fixed to Vcc or GND. Note: * This reset represents an external reset or power-on reset, but not a reset by the watchdog timer. Rev. 3.00 Aug 23, 2006 Page 102 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators Table 5.1 Selection Method for System Clock Oscillator and On-Chip Oscillator IRQAEC Input Level (during a reset) 0 1 System clock oscillator Enabled Disabled On-chip oscillator Disabled Enabled 5.3 Subclock Generator 5.3.1 Connecting 32.768-kHz/38.4-kHz Crystal Resonator Clock pulses can be supplied to the subclock generator by connecting a 32.768-kHz or 38.4-kHz crystal resonator, as shown in figure 5.5. Notes described in section 5.5.2, Notes on Board Design also apply to this connection. The 32KSTOP bit in the SUB32CR register can stop the subclock oscillator with the subclock oscillator program. To stop the subclock oscillator, set the SUB32CR register in active mode. When restoring from the subclock stopped condition, use the subclock after the oscillation stabilization time has elapsed, as the same as for the power supply. C1 X1 X2 C2 Frequency 38.4 kHz Note: Consult with the crystal resonator manufacturer to determine the circuit constants. Manufacturer Products Name C 1, C 2 Recommendation Value Equivalent Series Resistance Epson Toyocom C-4-TYPE 7 pF 30 k max C-001R 7 pF 35 k max 32.768 kHz Epson Toyocom Figure 5.5 Typical Connection to 32.768-kHz/38.4-kHz Crystal Resonator Figure 5.6 shows the equivalent circuit of the crystal resonator. Rev. 3.00 Aug 23, 2006 Page 103 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators CS LS RS X1 X2 CO C O = 0.9 pF (typ.) R S = 35 k (max.) f W = 32.768 kHz/38.4 kHz Figure 5.6 Equivalent Circuit of 32.768-kHz/38.4-kHz Crystal Resonator Notes on Use of Subclock Generator Circuit The drive capacity of the subclock generator circuit is limited in order to reduce current consumption when operating in the subclock mode. As a result, there may not be sufficient additional margin to accommodate some resonators. Be sure to select a resonator with an equivalent series resistance (RS) corresponding to that shown in figure 5.6. 5.3.2 Pin Connection when not Using Subclock When the subclock is not used, connect the X1 pin to GND and leave the X2 pin open, as shown in figure 5.7. X1 GND X2 Open Figure 5.7 Pin Connection when not Using Subclock Rev. 3.00 Aug 23, 2006 Page 104 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators 5.3.3 External Clock Input Method Connect the external clock to the X1 pin and leave the X2 pin open, as shown in figure 5.8. X1 External clock input X2 Open Figure 5.8 Pin Connection when Inputting External Clock Frequency Subclock ( w) Duty 45% to 55% 5.4 Prescalers This LSI is equipped with an on-chip prescaler (prescaler S). Prescaler S is a 13-bit counter using the system clock () as its input clock. Its prescaled outputs provide internal clock signals for on-chip peripheral modules. 5.4.1 Prescaler S Prescaler S is a 13-bit counter using the system clock () as its input clock. A divided output is used as an internal clock of an on-chip peripheral module. Prescaler S is initialized to H'0000 at a reset, and starts counting up on exit from the reset state. In standby mode, watch mode, subactive mode, and subsleep mode, the system clock pulse generator stops. Prescaler S also stops and is initialized to H'0000. The CPU cannot read from or write to prescaler S. The output from prescaler S is shared by the on-chip peripheral modules. In active (mediumspeed) mode and sleep (medium-speed) mode, the clock input to prescaler S is determined by the division ratio designated by the MA1 and MA0 bits in SYSCR2. Rev. 3.00 Aug 23, 2006 Page 105 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators 5.5 Usage Notes 5.5.1 Note on Resonators Resonator characteristics are closely related to board design and should be carefully evaluated by the user in the masked ROM version and flash memory version, referring to the examples shown in this section. Resonator circuit constants will differ depending on a resonator, stray capacitance in its mounting circuit, and other factors. Suitable constants should be determined in consultation with the resonator manufacturer. Design the circuit so that the oscillator pin is never applied voltages exceeding its maximum rating. Figure 5.9 shows an example of crystal and ceramic resonator arrangement. P37 X1 X2 Vss OSC2 OSC1 TEST (Vss) Figure 5.9 Example of Crystal and Ceramic Resonator Arrangement Rev. 3.00 Aug 23, 2006 Page 106 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators Figure 5.10 (1) shows an example measuring circuit with the negative resistance recommended by the resonator manufacturer. Note that if the negative resistance of the circuit is less than that recommended by the resonator manufacturer, it may be difficult to start the main oscillator. If it is determined that oscillation does not occur because the negative resistance is lower than the level recommended by the resonator manufacturer, the circuit must be modified as shown in figure 5.10 (2) through (4). Which of the modification suggestions to use and the capacitor capacitance should be decided based upon evaluation results such as the negative resistance and the frequency deviation. Modification point OSC1 OSC1 C1 C1 Rf Rf OSC2 OSC2 C2 C2 Negative resistance, addition of -R (1) Negative Resistance Measuring Circuit (2) Oscillator Circuit Modification Suggestion 1 Modification point Modification point C3 OSC1 C1 OSC1 C1 Rf C2 Rf OSC2 (3) Oscillator Circuit Modification Suggestion 2 OSC2 C2 (4) Oscillator Circuit Modification Suggestion 3 Figure 5.10 Negative Resistance Measurement and Circuit Modification Suggestions Rev. 3.00 Aug 23, 2006 Page 107 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators 5.5.2 Notes on Board Design When using a crystal resonator (ceramic resonator), place the resonator and its load capacitors as close as possible to the OSC1 and OSC2 pins. Other signal lines should be routed away from the resonator circuit to prevent induction from interfering with correct oscillation (see figure 5.11). Avoid Signal A Signal B C1 OSC1 C2 OSC2 Figure 5.11 Example of Incorrect Board Design Note: When a crystal resonator or ceramic resonator is connected, consult with the crystal resonator and ceramic resonator manufacturers to determine the circuit constants because the constants differ according to the resonator, stray capacitance of the mounting circuit, and so on. 5.5.3 Definition of Oscillation Stabilization Wait Time Figure 5.12 shows the oscillation waveform (OSC2), system clock (), and microcomputer operating mode when a transition is made from standby mode, watch mode, or subactive mode, to active (high-speed/medium-speed) mode, with an resonator connected to the system clock oscillator. As shown in figure 5.12, when a transition is made from a mode in which the system clock oscillator is halted to active (high-speed/medium-speed) mode, the sum of the following two times (oscillation start time and wait time) is required. (1) Oscillation Start Time The time from the point at which the system clock oscillator oscillation waveform starts to change when an interrupt is generated, until generation of the system clock starts. Rev. 3.00 Aug 23, 2006 Page 108 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators (2) Wait Time The time required for the CPU and peripheral functions to begin operating after generation of the oscillation waveform frequency and system clock have started, the oscillation amplitude has increased, and the oscillation frequency has stabilized. Oscillation waveform (OSC1, OSC2) System clock () Oscillation start time Wait time Operating mode Standby mode, watch mode, or subactive mode Oscillation stabilization wait time Active (high-speed) mode or active (medium-speed) mode Interrupt accepted Figure 5.12 Oscillation Stabilization Wait Time The required the oscillation stabilization time is the same as the "oscillation stabilization time tRC" at power-on specified in the AC characteristics. Set STS2 to STS0 in SYSCR1 so that the duration is equal to or greater than tRC. If a resonator is connected to the system clock oscillator, it is important to carefully evaluate the characteristics of the actual circuitry mounted on the board when a transition is made from standby mode, watch mode, or subactive mode to active (high-speed/medium-speed) mode. Set a wait time that will allow sufficient increase in the oscillation amplitude of OSC1 and OSC2. The oscillation start time will differ depending on the mounted circuitry constants and stray capacitance. Therefore, consult with the manufacturer of the resonator when setting the oscillation stabilization wait time. Rev. 3.00 Aug 23, 2006 Page 109 of 616 REJ09B0182-0300 Section 5 Clock Pulse Generators 5.5.4 Note on Subclock Stop State To stop the subclock, a state transition should not be made except to mode in which the system clock operates. If the state transition is made to other mode, it may result in incorrect operation. 5.5.5 Note on Using Resonator When a microcomputer operates, the internal power supply potential fluctuates slightly in synchronization with the system clock. Depending on the individual resonator characteristics, the oscillation waveform amplitude may not be sufficiently large immediately after the oscillation stabilization wait time, making the oscillation waveform susceptible to influence by fluctuations in the power supply potential. In this state, the oscillation waveform may be disrupted, leading to an unstable system clock and incorrect operation of the microcomputer. If incorrect operation occurs, change the setting of the standby timer select bits 2 to 0 (STS2 to STS0) (bits 6 to 4 in the system control register 1 (SYSCR1)) to give a longer wait time. For example, if incorrect operation occurs with a wait time setting of 1,024 states, check the operation with a wait time setting of 2,048 states or more. If the same kind of incorrect operation occurs after a reset as after a state transition, hold the RES pin low for a longer period. 5.5.6 Note on Using Power-On Reset Circuit The LSI's internal power-on reset circuit can be adjusted by connecting an external capacitor to the RES pin. Adjust the capacitance of the external capacitor to ensure sufficient oscillation stabilization time before reset clearing. For details, see section 22, Power-On Reset Circuit. Rev. 3.00 Aug 23, 2006 Page 110 of 616 REJ09B0182-0300 Section 6 Power-Down Modes Section 6 Power-Down Modes This LSI has eight modes of operation after a reset. These include a normal active (high-speed) mode and seven power-down modes, in which power consumption is significantly reduced. The module standby function reduces power consumption by selectively halting on-chip module functions. * Active (medium-speed) mode The CPU and all on-chip peripheral modules are operable on the system clock. The system clock frequency can be selected from osc/8, osc/16, osc/32, and osc/64. * Subactive mode The CPU and all on-chip peripheral modules are operable on the subclock. The subclock frequency can be selected from w/2, w/4, and w/8. * Sleep (high-speed) mode The CPU halts. On-chip peripheral modules are operable on the system clock. * Sleep (medium-speed) mode The CPU halts. On-chip peripheral modules are operable on the system clock. The system clock frequency can be selected from osc/8, osc/16, osc/32, and osc/64. * Subsleep mode The CPU halts. The on-chip peripheral modules are operable on the subclock. The subclock frequency can be selected from w/2, w/4, and w/8. * Watch mode The CPU halts. The on-chip peripheral modules are operable on the subclock. * Standby mode The CPU and all on-chip peripheral modules halt. * Module standby function Independent of the above modes, power consumption can be reduced by halting on-chip peripheral modules that are not used in module units. Note: In this manual, active (high-speed) mode and active (medium-speed) mode are collectively called active mode. Rev. 3.00 Aug 23, 2006 Page 111 of 616 REJ09B0182-0300 Section 6 Power-Down Modes 6.1 Register Descriptions The registers related to power-down modes are as follows. * System control register 1 (SYSCR1) * System control register 2 (SYSCR2) * Clock halt registers 1 and 2 (CKSTPR1 and CKSTPR2) 6.1.1 System Control Register 1 (SYSCR1) SYSCR1 controls the power-down modes, as well as SYSCR2. Bit Bit Name Initial Value R/W Description 7 SSBY 0 R/W 6 5 4 STS2 STS1 STS0 0 0 0 R/W R/W R/W Software Standby Selects the mode to transit after the execution of the SLEEP instruction. 0: A transition is made to sleep mode or subsleep mode. 1: A transition is made to standby mode or watch mode. For details, see table 6.2. Standby Timer Select 2 to 0 Designate the time the CPU and peripheral modules wait for stable clock operation after exiting from standby mode, subactive mode, subsleep mode, or watch mode to active mode or sleep mode due to an interrupt. The designation should be made according to the operating frequency so that the waiting time is at least equal to the oscillation stabilization time. The relationship between the specified value and the number of wait states is shown in table 6.1. When an external clock is to be used, the minimum value (STS2 = 1, STS1 = 0, STS0 = 1) is recommended. If the internal oscillator is used, the settings CTCS2 = 0, STS = 1, and STS0 = 0 are recommended. If the setting other than the recommended value is made, operation may start before the end of the waiting time. 3 LSON 0 R/W Rev. 3.00 Aug 23, 2006 Page 112 of 616 REJ09B0182-0300 Selects the system clock () or subclock (SUB) as the CPU operating clock when watch mode is cleared. 0: The CPU operates on the system clock () 1: The CPU operates on the subclock (SUB) Section 6 Power-Down Modes Bit Bit Name Initial Value R/W Description 2 TMA3 0 R/W Selects the mode to which the transition is made after the SLEEP instruction is executed with bits SSBY and LSON in SYSCR1 and bits DTON and MSON in SYSCR2. For details, see table 6.2. 1 0 MA1 MA0 1 1 R/W R/W Active Mode Clock Select 1 and 0 Select the operating clock frequency in active (mediumspeed) mode and sleep (medium-speed) mode. The MA1 and MA0 bits should be written to in active (highspeed) mode or subactive mode. 00: OSC/8 01: OSC/16 10: OSC/32 11: OSC/64 Table 6.1 Operating Frequency and Waiting Time Bit Operating Frequency and Waiting Time STS2 STS1 STS0 0 0 0 1 1 0 1 Waiting States 2 MHz 4.194 MHz 10 MHz 8,192 states 4.1 1.953 0.819 1 16,384 states 8.2 3.907 1.638 0 1,024 states 0.512 0.244 0.1024 1 2,048 states 1.024 0.488 0.2048 0 4,096 states 2.048 0.977 0.4096 1 2 states (external clock input) 0.001 0.0005 0.0002 0 8 states 0.004 0.0019 0.0008 1 16 states 0.008 0.0038 0.0016 Note: Time unit is ms. When an external clock is input, bits STS2 to STS0 should be set as external clock input mode before mode transition is executed. When an external clock is not used, these bits should not be set as external clock input mode. Rev. 3.00 Aug 23, 2006 Page 113 of 616 REJ09B0182-0300 Section 6 Power-Down Modes 6.1.2 System Control Register 2 (SYSCR2) SYSCR2 controls the power-down modes, as well as SYSCR1. Bit Bit Name Initial Value R/W Description 7 to 5 All 1 Reserved These bits are always read as 1 and cannot be modified. 4 NESEL 1 R/W Noise Elimination Sampling Frequency Select The subclock pulse generator generates the watch clock signal (W) and the system clock pulse generator generates the oscillator clock (OSC). This bit selects the sampling frequency of OSC when W is sampled. When OSC = 2 to 10 MHz, clear this bit to 0. Set it to 1 if the internal oscillator is used. 0: Sampling rate is OSC/16. 1: Sampling rate is OSC/4. 3 DTON 0 R/W Direct Transfer on Flag Selects the mode to which the transition is made after the SLEEP instruction is executed with bits SSBY, TMA3, and LSON in SYSCR1 and bit MSON in SYSCR2. For details, see table 6.2. 2 MSON 0 R/W Medium Speed on Flag After standby, watch, or sleep mode is cleared, this bit selects active (high-speed) or active (medium-speed) mode. 0: Operation in active (high-speed) mode 1: Operation in active (medium-speed) mode 1 SA1 0 R/W Subactive Mode Clock Select 1 and 0 0 SA0 0 R/W Select the operating clock frequency in subactive and subsleep modes. The values of SA1 and SA0 do not change if they are written to in subactive mode. 00: W/8 01: W/4 1X: W/2 [Legend] X: Don't care. Rev. 3.00 Aug 23, 2006 Page 114 of 616 REJ09B0182-0300 Section 6 Power-Down Modes 6.1.3 Clock Halt Registers 1 and 2 (CKSTPR1 and CKSTPR2) CKSTPR1 and CKSTPR2 allow the on-chip peripheral modules to enter the standby state in module units. * CKSTPR1 Bit 7 Initial Value Bit Name 1 S4CKSTP* * 4 1 R/W R/W* Description 1 SCI4 Module Standby SCI4 enters standby mode when this bit is cleared to 0. 6 S31CKSTP 1 R/W SCI3 Module Standby* 2 SCI31 enters standby mode when this bit is cleared to 0. 5 S32CKSTP 1 R/W SCI3 Module Standby* 2 SCI32 enters standby mode when this bit is cleared to 1 0.* 4 ADCKSTP 1 R/W A/D Converter Module Standby A/D converter enters standby mode when this bit is cleared to 0. 3 DADCKSTP 1 R/W A/D Converter Module Standby A/D converter enters standby mode when this bit is cleared to 0. 2 TFCKSTP 1 R/W Timer F Module Standby Timer F enters standby mode when this bit is cleared to 0. 1 FROMCKSTP*1 *4 1 R/W Flash Memory Module Standby Flash memory enters standby mode when this bit is cleared to 0. 0 RTCCKSTP 1 R/W RTC Module Standby RTC enters standby mode when this bit is cleared to 0. Rev. 3.00 Aug 23, 2006 Page 115 of 616 REJ09B0182-0300 Section 6 Power-Down Modes * CKSTPR2 Initial Value Bit Bit Name 7 ADBCKSTP 1 R/W Description R/W Address Break Module Standby The address break enters standby mode when this bit is cleared to 0. 6 TPUCKSTP 1 R/W TPU Module Standby The TPU enters standby mode when this bit is cleared to 0. 5 IICCKSTP 1 R/W IIC2 Module Standby The IIC2 enters standby mode when this bit is cleared to 0. 4 PW2CKSTP 1 R/W PWM2 Module Standby The PWM2 enters standby mode when this bit is cleared to 0. 3 AECCKSTP 1 R/W Asynchronous Event Counter Module Standby The asynchronous event counter enters standby mode when this bit is cleared to 0. 2 WDCKSTP 1 R/W* 3 Watchdog Timer Module Standby The watchdog timer enters standby mode when this bit is cleared to 0. 1 PW1CKSTP 1 R/W PWM1 Module Standby The PWM1 enters standby mode when this bit is cleared to 0. 0 LDCKSTP 1 R/W LCD Module Standby The LCD controller/driver enters standby mode when this bit is cleared to 0. Notes: 1. This is a reserved bit which is not readable/writable in the masked ROM version. 2. When the SCI module standby is set, all registers in the SCI3 enter the reset state. 3. This bit is valid when the WDON bit in TCSRW is 0. If this bit is cleared to 0 while the WDON bit is set to 1 (while the watchdog timer is operating), this bit is cleared to 0. However, the watchdog timer does not enter module standby mode and continues operating. When the watchdog timer stops operating and the WDON bit is cleared to 0 by software, this bit is valid and the watchdog timer enters module standby mode. 4. This bit should be set to 1 when the on-chip debugger is used. Rev. 3.00 Aug 23, 2006 Page 116 of 616 REJ09B0182-0300 Section 6 Power-Down Modes 6.2 Mode Transitions and States of LSI Figure 6.1 shows the possible transitions among these operating modes. A transition is made from the program execution state to the program halt state of the program by executing a SLEEP instruction. Interrupts allow for returning from the program halt state to the program execution state of the program. A direct transition between active mode and subactive mode, which are both program execution states, can be made without halting the program. RES input enables transitions from a mode to the reset state. Table 6.2 shows the transition conditions of each mode after the SLEEP instruction is executed and a mode to return by an interrupt. Table 6.3 shows the internal states of the LSI in each mode. Rev. 3.00 Aug 23, 2006 Page 117 of 616 REJ09B0182-0300 Section 6 Power-Down Modes Program execution state Reset state Program SLEEP d instruction halt state Standby Active (high-speed mode) a EP ion E t SL truc s in g d SLEEP instruction f SLEEP instruction P n EE tio SL truc s in SLEEP instruction Sleep (high-speed) mode 3 4 mode Program halt state SLEEP instruction a 4 b SLEEP b instruction Active (medium-speed) mode e SLEEP instruction 1 Sleep (medium-speed) mode j SLEEP instruction S ins LE tru EP cti on e i 1 SLEEP instruction SLEEP instruction c Subactive 1 mode SLEEP instruction i h SLEEP instruction e SLEEP instruction Watch 3 : Transition is made after exception handling is executed. Mode Transition Conditions (1) Subsleep mode 2 mode Power-down modes Mode Transition Conditions (2) Interrupt Sources LSON MSON SSBY TMA3 DTON a 0 0 0 * 0 b 0 1 0 * 0 c 1 * 0 1 0 d 0 * 1 0 0 e * * 1 1 0 f 0 0 0 * 1 3 All interrupts g 0 1 0 * 1 4 IRQ1, IRQ0, WKP7 to WKP0 h 0 1 1 1 1 i 1 * 1 1 1 j 0 0 1 1 1 RTC, timer F, IRQ0 interrupt, Asynchronous event counter, WKP7 to WKP0 interrupts 2 RTC, timer F, TPU, SCI3 interrupt, IRQ4, IRQ3, IRQ1, IRQ0, IRQAEC interrupts, WKP7 to WKP0 interrupts, Asynchronous event counter interrupts, Asynchronous event counter 1 * Don't care Note: A transition between different modes cannot be made to occur simply because an interrupt request is generated. Make sure to enable interrupt requests. Figure 6.1 Mode Transition Diagram Rev. 3.00 Aug 23, 2006 Page 118 of 616 REJ09B0182-0300 Section 6 Power-Down Modes Table 6.2 Transition Mode after SLEEP Instruction Execution and Interrupt Handling Transition Mode after State SLEEP Transition Before Instruction Mode due to Transition LSON MSON SSBY TMA3 DTON Execution Interrupt Active (highspeed) mode Symbol in Figure 6.1 0 0 0 * 0 Sleep (highspeed) mode Active (highspeed) mode a 0 1 0 * 0 Sleep (mediumspeed) mode Active (medium- b speed) mode 0 0 1 0 0 Standby mode Active (highspeed) mode 0 1 1 0 0 Standby mode Active (medium- d speed) mode 0 0 1 1 0 Watch mode Active (highspeed) mode 0 1 1 1 0 Watch mode Active (medium- e speed) mode 1 * 1 1 0 Watch mode Subactive mode e 0 0 0 * 1 Active (highspeed) mode (direct transition) 0 1 0 * 1 Active (mediumspeed) mode (direct transition) g 1 * 1 1 1 Subactive mode (direct transition) i d e Rev. 3.00 Aug 23, 2006 Page 119 of 616 REJ09B0182-0300 Section 6 Power-Down Modes Transition Mode after State SLEEP Transition Before Instruction Mode due to Transition LSON MSON SSBY TMA3 DTON Execution Interrupt Active (mediumspeed) mode Symbol in Figure 6.1 0 0 0 * 0 Sleep (highspeed) mode Active (highspeed) mode 0 1 0 * 0 Sleep (mediumspeed) mode Active (medium- b speed) mode 0 0 1 0 0 Standby mode Active (highspeed) mode 0 1 1 0 0 Standby mode Active (medium- d speed) mode 0 0 1 1 0 Watch mode Active (highspeed) mode 0 1 1 1 0 Watch mode Active (medium- e speed) mode 1 1 1 1 0 Watch mode Subactive mode e 0 0 0 * 1 Active (highspeed) mode (direct transition) f 0 1 0 * 1 Active (mediumspeed) mode (direct transition) 1 * 1 1 1 Subactive mode (direct transition) i Rev. 3.00 Aug 23, 2006 Page 120 of 616 REJ09B0182-0300 a d e Section 6 Power-Down Modes Transition Mode after State SLEEP Transition Before Instruction Mode due to Transition LSON MSON SSBY TMA3 DTON Execution Interrupt Subactive mode [Legend] Symbol in Figure 6.1 1 * 0 1 0 Subsleep mode Subactive mode c 0 0 1 1 0 Watch mode Active (highspeed) mode 0 1 1 1 0 Watch mode Active (medium- e speed) mode 1 * 1 1 0 Watch mode Subactive mode e 0 0 1 1 1 Active (highspeed) mode (direct transition) j 0 1 1 1 1 Active (mediumspeed) mode (direct transition) h 1 * 1 1 1 Subactive mode (direct transition) e *: Don't care. Rev. 3.00 Aug 23, 2006 Page 121 of 616 REJ09B0182-0300 Section 6 Power-Down Modes Table 6.3 Internal State in Each Operating Mode Active Mode Sleep Mode Function MediumHigh-speed speed High-speed Mediumspeed Subactive Watch Mode Mode Subsleep Mode Standby Mode System clock oscillator Functioning Functioning Functioning Functioning Halted Halted Halted Halted Subclock oscillator Functioning Functioning Functioning Functioning Functioning Functioning Functioning Functioning CPU Functioning Functioning Halted Halted Halted Functioning Halted Halted Retained Retained Retained Retained Retained Instructions RAM Registers Retained*1 I/O External interrupts IRQ0 Functioning Functioning Functioning Functioning Functioning Functioning Functioning Functioning Retained*4 IRQ1 Retained*4 IRQ3 IRQ4 IRQAEC WKP7 to WKP0 Peripheral module RTC Functioning Functioning Functioning Functioning Functioning Functioning Functioning/ retained*8 Functioning/ Functioning/ retained*8 retained*8 Functioning/ retained*8 Asynchronous event counter Functioning*5 Functioning Timer F Functioning/ retained*6 TPU Retained WDT Functioning* / Functioning* / Functioning* / Functioning* / retained retained SCI3/IrDA Reset Functioning/ Functioning/ retained*2 retained*2 IIC2 Retained Retained Retained Retained PWM Retained Retained Retained Retained A/D converter Retained Retained Retained Retained A/D converter Retained Retained Retained Retained LCD Functioning/ retained*3 Functioning/ Functioning/ retained*3 retained*3 7 Functioning*5 Functioning Functioning/ Functioning/ retained*6 retained*6 Retained Retained Retained Retained 7 7 retained 7 retained Reset Retained Notes: 1. Register contents are retained. Output is the high-impedance state. 2. Functioning if W/2 is selected as an internal clock, or halted and retained otherwise. 3. Functioning if w, w/2, or w/4 is selected as a clock to be used. Halted and retained otherwise. 4. An external interrupt request is ignored. Contents of the interrupt request register are not affected. 5. Only incrementing of the external event timer by ECL/ECH and overflow interrupts operate. 6. Functioning if w/4 is selected as an internal clock. Halted and retained otherwise. 7. Functioning if the on-chip oscillator is selected. 8. Functioning if the internal time keeping time-base function is selected and retained if the interval timer is selected. Rev. 3.00 Aug 23, 2006 Page 122 of 616 REJ09B0182-0300 Section 6 Power-Down Modes 6.2.1 Sleep Mode In sleep mode, CPU operation is halted but the system clock oscillator, subclock oscillator, and on-chip peripheral modules function. In sleep (medium-speed) mode, the on-chip peripheral modules function at the clock frequency set by the MA1 and MA0 bits in SYSCR1. CPU register contents are retained. Sleep mode is cleared by an interrupt. When an interrupt is requested, sleep mode is cleared and interrupt exception handling starts. Sleep mode is not cleared if the I bit in CCR is set to 1 or the requested interrupt is disabled by the interrupt enable bit. After sleep mode is cleared, a transition is made from sleep (high-speed) mode to active (high-speed) mode or from sleep (medium-speed) mode to active (medium-speed) mode. When the RES pin goes low, the CPU goes into the reset state and sleep mode is cleared. Since an interrupt request signal is synchronous with the system clock, the maximum time of 2/ (s) may be delayed from the point at which an interrupt request signal occurs until the interrupt exception handling is started. Furthermore, it sometimes operates with half state early timing at the time of transition to sleep (medium-speed) mode. 6.2.2 Standby Mode In standby mode, the system clock oscillator stops, so the CPU and on-chip peripheral modules stop functioning when the WDT disables the on-chip oscillator operation. However, as long as the rated voltage is supplied, the contents of CPU registers, on-chip RAM, and some on-chip peripheral module registers are retained. On-chip RAM contents will be retained as long as the voltage set by the RAM data retention voltage is provided. The I/O ports go to the high-impedance state. Standby mode is cleared by an interrupt. When an interrupt is requested, the system clock pulse generator starts. After the time set in bits STS2 to STS0 in SYSCR1 has elapsed, standby mode is cleared and interrupt exception handling starts. After standby mode is cleared, a transition is made to active (high-speed) or active (medium-speed) mode according to the MSON bit in SYSCR2. Standby mode is not cleared if the I bit in CCR is set to 1 or the requested interrupt is disabled by the interrupt enable bit. When the RES pin goes low, the system clock oscillator starts. Since system clock signals are supplied to the entire chip as soon as the system clock oscillator starts functioning, the RES pin must be kept low until the system clock oscillator output stabilizes (except when the power-on Rev. 3.00 Aug 23, 2006 Page 123 of 616 REJ09B0182-0300 Section 6 Power-Down Modes reset circuit is used). After the oscillator output has stabilized, the CPU starts reset exception handling if the RES pin is driven high (except when the power-on reset circuit is used). 6.2.3 Watch Mode In watch mode, the system clock oscillator (when the WDT disables the on-chip oscillator operation) and CPU operation stop and on-chip peripheral modules stop functioning except for the RTC, timer F, asynchronous event counter, and LCD controller/driver. However, as long as the rated voltage is supplied, the contents of CPU registers, some on-chip peripheral module registers, and on-chip RAM are retained. The I/O ports retain their state before the transition. Watch mode is cleared by an interrupt. When an interrupt is requested, watch mode is cleared and interrupt exception handling starts. When watch mode is cleared by an interrupt, a transition is made to active (high-speed) mode, active (medium-speed) mode, or subactive mode depending on the settings of the LSON bit in SYSCR1 and the MSON bit in SYSCR2. When the transition is made to active mode, after the time set in bits STS2 to STS0 in SYSCR1 has elapsed, interrupt exception handling starts. Watch mode is not cleared if the I bit in CCR is set to 1 or the requested interrupt is disabled by the interrupt enable register. When the RES pin goes low, the system clock pulse generator starts. Since system clock signals are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator output has stabilized, the CPU starts reset exception handling if the RES pin is driven high. 6.2.4 Subsleep Mode In subsleep mode, the CPU operation stops but on-chip peripheral modules other than TPU, IIC2, the A/D converter, the A/D converter and PWM function. As long as a required voltage is applied, the contents of CPU registers, the on-chip RAM, and some registers of the on-chip peripheral modules are retained. I/O ports keep the same states as before the transition. Subsleep mode is cleared by an interrupt. When an interrupt is requested, subsleep mode is cleared and interrupt exception handling starts. After subsleep mode is cleared, a transition is made to subactive mode. Subsleep mode is not cleared if the I bit in CCR is set to 1 or the requested interrupt is disabled by the interrupt enable register. When the RES pin goes low, the system clock pulse generator starts. Since system clock signals are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator output has stabilized, the CPU starts reset exception handling if the RES pin is driven high. Rev. 3.00 Aug 23, 2006 Page 124 of 616 REJ09B0182-0300 Section 6 Power-Down Modes 6.2.5 Subactive Mode In subactive mode, the system clock oscillator stops but on-chip peripheral modules other than TPU, IIC2, the A/D converter, the A/D converter, and PWM function. As long as a required voltage is applied, the contents of some registers of the on-chip peripheral modules are retained. Subactive mode is cleared by the SLEEP instruction. When subacitve mode is cleared, a transition to subsleep mode, active mode, or watch mode is made, depending on the combination of bits SSBY, LSON, and TMA3 in SYSCR1 and bits MSON and DTON in SYSCR2. Subactive mode is not cleared if the I bit in CCR is set to 1 or the requested interrupt is disabled by the interrupt enable register. When the RES pin goes low, the system clock pulse generator starts. Since system clock signals are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator output has stabilized, the CPU starts reset exception handling if the RES pin is driven high. The operating frequency of subactive mode is selected from W/2, W/4, and W/8 by the SA1 and SA0 bits in SYSCR2. 6.2.6 Active (Medium-Speed) Mode In active (medium-speed) mode, the system clock oscillator, subclock oscillator, CPU, and onchip peripheral module function. Active (medium-speed) mode is cleared by the SLEEP instruction. When active (medium-speed) mode is cleared, a transition to standby mode is made depending on the combination of bits SSBY, LSON, and TMA3 in SYSCR1, a transition to watch mode is made depending on the combination of bits SSBY and TMA3 in SYSCR1, or a transition to sleep mode is made depending on the combination of bits SSBY and LSON in SYSCR1. Moreover, a transition to active (high-speed) mode or subactive mode is made by a direct transition. Active (medium-sleep) mode is not cleared if the I bit in CCR is set to 1 or the requested interrupt is disabled in the interrupt enable register. When the RES pin goes low, the CPU goes into the reset state and active (medium-sleep) mode is cleared. Furthermore, it sometimes operates with half state early timing at the time of transition to active (medium-speed) mode. In active (medium-speed) mode, the on-chip peripheral modules function at the clock frequency set by the MA1 and MA0 bits in SYSCR1. Rev. 3.00 Aug 23, 2006 Page 125 of 616 REJ09B0182-0300 Section 6 Power-Down Modes 6.3 Direct Transition The CPU can execute programs in two modes: active and subactive mode. A direct transition is a transition between these two modes without stopping program execution. A direct transition can be made by executing a SLEEP instruction while the DTON bit in SYSCR2 is set to 1. The direct transition also enables operating frequency modification in active mode. If the direct transition interrupt is disabled by IENR2, no direct transition takes place and a transition is made instead to sleep or watch mode. Note: If a direct transition is attempted while the I bit in CCR is set to 1, the device remains in sleep or watch mode, and recovery is not possible. (1) Direct transfer from active (high-speed) mode to active (medium-speed) mode When a SLEEP instruction is executed in active (high-speed) mode while the SSBY and LSON bits in SYSCR1 are cleared to 0 and the MSON and DTON bits in SYSCR2 are set to 1, a transition is made to active (medium-speed) mode via sleep mode. (2) Direct transfer from active (medium-speed) mode to active (high-speed) mode When a SLEEP instruction is executed in active (medium-speed) mode while the SSBY and LSON bits in SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is cleared to 0, and the DTON bit in SYSCR2 is set to 1, a transition is made to active (high-speed) mode via sleep mode. (3) Direct transfer from active (high-speed) mode to subactive mode When a SLEEP instruction is executed in active (high-speed) mode while the SSBY, TMA3, and LSON bits in SYSCR1 are set to 1 and the DTON bit in SYSCR2 is set to 1, a transition is made to subactive mode via watch mode. (4) Direct transfer from subactive mode to active (high-speed) mode When a SLEEP instruction is executed in subactive mode while the SSBY and TMA3 bits in SYSCR1 are set to 1, the LSON bit in SYSCR1 is cleared to 0, the MSON bit in SYSCR2 is cleared to 0, and the DTON bit in SYSCR2 is set to 1, a transition is made directly to active (highspeed) mode via watch mode after the waiting time set in bits STS2 to STS0 in SYSCR1 has elapsed. (5) Direct transfer from active (medium-speed) mode to subactive mode When a SLEEP instruction is executed in active (medium-speed) mode while the SSBY, TMA3, and LSON bits in SYSCR1 are set to 1 and the DTON bit in SYSCR2 is set to 1, a transition is made to subactive mode via watch mode. Rev. 3.00 Aug 23, 2006 Page 126 of 616 REJ09B0182-0300 Section 6 Power-Down Modes (6) Direct transfer from subactive mode to active (medium-speed) mode When a SLEEP instruction is executed in subactive mode while the SSBY and TMA3 bits in SYSCR1 are set to 1, the LSON bit in SYSCR1 is cleared to 0, and the MSON and DTON bits in SYSCR2 are set to 1, a transition is made directly to active (medium-speed) mode via watch mode after the waiting time set in bits STS2 to STS0 in SYSCR1 has elapsed. 6.3.1 Direct Transition from Active (High-Speed) Mode to Active (Medium-Speed) Mode The time from the start of SLEEP instruction execution to the end of interrupt exception handling (the direct transition time) is calculated by equation (1). Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal processing states)} x (tcyc before transition) + (Number of interrupt exception handling execution states) x (tcyc after transition) .....................(1) Example: When OSC/8 is selected as the CPU operating clock following transition Direct transition time = (2 + 1) x 1tosc + 14 x 8tosc = 115tosc [Legend] tosc: OSC clock cycle time tcyc: System clock () cycle time Rev. 3.00 Aug 23, 2006 Page 127 of 616 REJ09B0182-0300 Section 6 Power-Down Modes 6.3.2 Direct Transition from Active (High-Speed) Mode to Subactive Mode The time from the start of SLEEP instruction execution to the end of interrupt exception handling (the direct transition time) is calculated by equation (2). Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal processing states)} x (tcyc before transition) + (Number of interrupt exception handling execution states) x (tsubcyc after transition) .....................(2) Example: When osc/8 is selected as the CPU operating clock following transition Direct transition time = (2 + 1) x 1tosc + 14 x 1tsubcyc = 3tosc + 14tsubcyc [Legend] tosc: OSC clock cycle time tsubcyc: Subclock (SUB) cycle time 6.3.3 Direct Transition from Active (Medium-Speed) Mode to Active (High-Speed) Mode The time from the start of SLEEP instruction execution to the end of interrupt exception handling (the direct transition time) is calculated by equation (3). Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal processing states)} x (tcyc before transition) + (Number of interrupt exception handling execution states) x (tcyc after transition) ....................(3) Example: When OSC/8 is selected as the CPU operating clock before transition Direct transition time = (2 + 1) x 8tosc + 14 x 1tosc = 38tosc [Legend] tosc: OSC clock cycle time tcyc: System clock () cycle time Rev. 3.00 Aug 23, 2006 Page 128 of 616 REJ09B0182-0300 Section 6 Power-Down Modes 6.3.4 Direct Transition from Active (Medium-Speed) Mode to Subactive Mode The time from the start of SLEEP instruction execution to the end of interrupt exception handling (the direct transition time) is calculated by equation (4). Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal processing states)} x (tcyc before transition) + (Number of interrupt exception handling execution states) x (tsubcyc after transition) .....................(4) Example: When osc/8 is selected as the CPU operating clock before transition Direct transition time = (2 + 1) x 8tosc + 14 x 1tsubcyc = 24tosc + 14tsubcyc [Legend] tosc: OSC clock cycle time tsubcyc: Subclock (SUB) cycle time 6.3.5 Direct Transition from Subactive Mode to Active (High-Speed) Mode The time from the start of SLEEP instruction execution to the end of interrupt exception handling (the direct transition time) is calculated by equation (5). Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal processing states)} x (tsubcyc before transition) + {(Wait time set in bits STS2 to STS0) + (Number of interrupt exception handling execution states)} x (tcyc after transition) ....................(5) Example: When w/8 is selected as the CPU operating clock before transition and wait time = 8192 states Direct transition time = (2 + 1) x 8tw + (8192 + 14) x tosc = 24tw + 8206tosc [Legend] tosc: OSC clock cycle time tw: Watch clock cycle time tcyc: System clock () cycle time tsubcyc: Subclock (SUB) cycle time Rev. 3.00 Aug 23, 2006 Page 129 of 616 REJ09B0182-0300 Section 6 Power-Down Modes 6.3.6 Direct Transition from Subactive Mode to Active (Medium-Speed) Mode The time from the start of SLEEP instruction execution to the end of interrupt exception handling (the direct transition time) is calculated by equation (6). Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal processing states)} x (tsubcyc before transition) + {(Wait time set in bits STS2 to STS0) + (Number of interrupt exception handling execution states)} x (tcyc after transition) ....................(6) Example: When w/8 is selected as the CPU operating clock before transition, OSC/8 is selected as the CPU operating clock following transition, and the wait time is 8,192 states Direct transition time = (2 + 1) x 8tw + (8192 + 14) x 8tosc = 24tw + 65648tosc [Legend] tosc: OSC clock cycle time tw: Watch clock cycle time tcyc: System clock () cycle time tsubcyc: Subclock (SUB) cycle time 6.3.7 (1) Notes on External Input Signal Changes before/after Direct Transition Direct transition from active (high-speed) mode to subactive mode Since the mode transition is performed via watch mode, see section 6.5.2, Notes on External Input Signal Changes before/after Standby Mode. (2) Direct transition from active (medium-speed) mode to subactive mode Since the mode transition is performed via watch mode, see section 6.5.2, Notes on External Input Signal Changes before/after Standby Mode. (3) Direct transition from subactive mode to active (high-speed) mode Since the mode transition is performed via watch mode, see section 6.5.2, Notes on External Input Signal Changes before/after Standby Mode. Rev. 3.00 Aug 23, 2006 Page 130 of 616 REJ09B0182-0300 Section 6 Power-Down Modes (4) Direct transition from subactive mode to active (medium-speed) mode Since the mode transition is performed via watch mode, see section 6.5.2, Notes on External Input Signal Changes before/after Standby Mode. 6.4 Module Standby Function The module-standby function can be set to any peripheral module. In module standby mode, the clock supply to modules stops to enter the power-down mode. Module standby mode enables each on-chip peripheral module to enter the standby state by clearing a bit that corresponds to each module in CKSTPR1 and CKSTPR2 to 0 and cancels the mode by setting the bit to 1. (See section 6.1.3, Clock Halt Registers 1 and 2 (CKSTPR1 and CKSTPR2).) 6.5 Usage Notes 6.5.1 Standby Mode Transition and Pin States When a SLEEP instruction is executed in active (high-speed) mode or active (medium-speed) mode while the SSBY and TMA3 bits in SYSCR1 are set to 1 and the LSON bit in SYSCR1 is cleared to 0, a transition is made to standby mode. At the same time, pins go to the highimpedance state (except pins for which the pull-up MOS is designated as on). Figure 6.2 shows the timing in this case. Internal data bus SLEEP instruction fetch Next instruction fetch SLEEP instruction execution Pins Internal processing Port output High-impedance Active (high-speed) mode or active (medium-speed) mode Standby mode Figure 6.2 Standby Mode Transition and Pin States Rev. 3.00 Aug 23, 2006 Page 131 of 616 REJ09B0182-0300 Section 6 Power-Down Modes 6.5.2 (1) Notes on External Input Signal Changes before/after Standby Mode When External Input Signal Changes before/after Standby Mode or Watch Mode When an external input signal such as IRQ, WKP, or IRQAEC is input, both the high- and lowlevel widths of the signal must be at least two cycles of system clock or subclock SUB (referred to together in this section as the internal clock). As the internal clock stops in standby mode and watch mode, the width of external input signals requires careful attention when a transition is made via these operating modes. Ensure that external input signals conform to the conditions stated in (3), Recommended Timing of External Input Signals, below. (2) When External Input Signals cannot be Captured because Internal Clock Stops The case of falling edge capture is shown in figure 6.3. As shown in the case marked "Capture not possible," when an external input signal falls immediately after a transition to active mode or subactive mode, after oscillation is started by an interrupt via a different signal, the external input signal cannot be captured if the high-level width at that point is less than 2 tcyc or 2 tsubcyc. (3) Recommended Timing of External Input Signals To ensure dependable capture of an external input signal, high- and low-level signal widths of at least 2 tcyc or 2 tsubcyc are necessary before a transition is made to standby mode or watch mode, as shown in "Capture possible: case 1." External input signal capture is also possible with the timing shown in "Capture possible: case 2" and "Capture possible: case 3," in which a 2 tcyc or 2 tsubcyc level width is secured. Active (high-speed, medium-speed) Operating mode mode or subactive mode tcyc tsubcyc tcyc tsubcyc Standby mode or watch mode tcyc tsubcyc Wait for oscActive (high-speed, medium-speed) illation mode or subactive mode stabilization tcyc tsubcyc or SUB External input signal Capture possible: case 1 Capture possible: case 2 Capture possible: case 3 Capture not possible Interrupt by different signal Figure 6.3 External Input Signal Capture when Signal Changes before/after Standby Mode or Watch Mode Rev. 3.00 Aug 23, 2006 Page 132 of 616 REJ09B0182-0300 Section 6 Power-Down Modes (4) Input Pins to which these Notes Apply IRQ4, IRQ3, IRQ1, IRQ0, WKP7 to WKP0, IRQAEC, TMIF, ADTRG, TIOCA1, TIOCB1, TIOCA2 and TIOCB2. Rev. 3.00 Aug 23, 2006 Page 133 of 616 REJ09B0182-0300 Section 6 Power-Down Modes Rev. 3.00 Aug 23, 2006 Page 134 of 616 REJ09B0182-0300 Section 7 ROM Section 7 ROM The features of the 52-kbyte flash memory built into the flash memory (F-ZTAT) version are summarized below. * Programming/erase methods The flash memory is programmed 128 bytes at a time. Erase is performed in single-block units. The flash memory is configured as follows: 1 kbyte x 4 blocks, 28 kbytes x 1 block, 16 kbytes x 1 block, and 4 kbytes x 1 block. To erase the entire flash memory, each block must be erased in turn. * On-board programming On-board programming/erasing can be done in boot mode, in which the boot program built into the chip is started to erase or program of the entire flash memory. In normal user program mode, individual blocks can be erased or programmed. * Programmer mode Flash memory can be programmed/erased in programmer mode using a PROM programmer, as well as in on-board programming mode. * Automatic bit rate adjustment For data transfer in boot mode, this LSI's bit rate can be automatically adjusted to match the transfer bit rate of the host. * Programming/erasing protection Sets software protection against flash memory programming/erasing. * Power-down mode Operation of the power supply circuit can be partly halted in subactive mode. As a result, flash memory can be read with low power consumption. * Module standby mode Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) When the on-chip debugger is used, the bit 1 (FROMCKSTP) in clock stop register 1 (CKSTPR1) should be set to 1. ROM3560A_000220040500 Rev. 3.00 Aug 23, 2006 Page 135 of 616 REJ09B0182-0300 Section 7 ROM 7.1 Block Configuration Figure 7.1 shows the block configuration of flash memory. The thick lines indicate erasing units, the narrow lines indicate programming units, and the values are addresses. The 52-kbyte flash memory is divided into 1 kbyte x 4 blocks, 28 kbytes x 1 block, 16 kbytes x 1 block, and 4 kbytes x 1 block. Erasing is performed in these units. Programming is performed in 128-byte units starting from an address with lower eight bits H'00 or H'80. Rev. 3.00 Aug 23, 2006 Page 136 of 616 REJ09B0182-0300 Section 7 ROM Erase unit H'0000 H'0001 H'0002 H'0080 H'0081 H'0082 H'0380 H'0381 H'0382 H'0400 H'0401 H'0402 H'0480 H'0481 H'0482 H'0780 H'0781 H'0782 H'0800 H'0801 H'0802 H'0880 H'0881 H'0882 H'0B80 H'0B81 H'0B82 H'0C00 H'0C01 H'0C02 H'0C80 H'0C81 H'0C82 H'0F80 H'0F81 H'0F82 H'1000 H'1001 H'1002 H'1080 H'1081 H'1082 Programming unit: 128 bytes H'007F H'00FF 1 kbyte Erase unit H'03FF Programming unit: 128 bytes H'047F H'04FF 1 kbyte Erase unit H'07FF Programming unit: 128 bytes H'087F H'08FF 1 kbyte Erase unit H'0BFF Programming unit: 128 bytes H'0C7F H'0CFF 1 kbyte Erase unit H'0FFF Programming unit: 128 bytes H'107F H'10FF 28 kbytes Erase unit H'7F80 H'7F81 H'7F82 H'8000 H'8001 H'8002 H'8080 H'8081 H'8082 H'80FF H'7FFF Programming unit: 128 bytes H'807F 16 kbytes H'BF80 H'BF81 H'BF82 H'C000 H'C001 H'C002 H'BFFF H'C07F Erase unit H'C080 H'C081 H'C082 H'C0FF 4 kbytes H'CF80 H'CF81 H'CF82 H'CFFF Figure 7.1 Flash Memory Block Configuration Rev. 3.00 Aug 23, 2006 Page 137 of 616 REJ09B0182-0300 Section 7 ROM 7.2 Register Descriptions The flash memory has the following registers. * Flash memory control register 1 (FLMCR1) * Flash memory control register 2 (FLMCR2) * Erase block register 1 (EBR1) * Flash memory power control register (FLPWCR) * Flash memory enable register (FENR) 7.2.1 Flash Memory Control Register 1 (FLMCR1) FLMCR1 is a register that makes the flash memory change to program mode, program-verify mode, erase mode, or erase-verify mode. For details on register setting, refer to section 7.4, Flash Memory Programming/Erasing. Bit Bit Name Initial Value R/W Description 7 0 Reserved This bit is always read as 0. 6 SWE 0 R/W Software Write Enable When this bit is set to 1, flash memory programming/erasing is enabled. When this bit is cleared to 0, other FLMCR1 register bits and all EBR1 bits cannot be set. 5 ESU 0 R/W Erase Setup When this bit is set to 1, the flash memory changes to the erase setup state. When it is cleared to 0, the erase setup state is cancelled. Set this bit to 1 before setting the E bit to 1 in FLMCR1. 4 PSU 0 R/W Program Setup When this bit is set to 1, the flash memory changes to the program setup state. When it is cleared to 0, the program setup state is cancelled. Set this bit to 1 before setting the P bit in FLMCR1. 3 EV 0 R/W Erase-Verify When this bit is set to 1, the flash memory changes to erase-verify mode. When it is cleared to 0, erase-verify mode is cancelled. Rev. 3.00 Aug 23, 2006 Page 138 of 616 REJ09B0182-0300 Section 7 ROM Bit Bit Name Initial Value R/W Description 2 PV 0 R/W Program-Verify When this bit is set to 1, the flash memory changes to program-verify mode. When it is cleared to 0, programverify mode is cancelled. 1 E 0 R/W Erase When this bit is set to 1 while SWE=1 and ESU=1, the flash memory changes to erase mode. When it is cleared to 0, erase mode is cancelled. 0 P 0 R/W Program When this bit is set to 1 while SWE=1 and PSU=1, the flash memory changes to program mode. When it is cleared to 0, program mode is cancelled. 7.2.2 Flash Memory Control Register 2 (FLMCR2) FLMCR2 is a register that displays the state of flash memory programming/erasing. FLMCR2 is a read-only register, and should not be written to. Bit Bit Name Initial Value R/W Description 7 FLER 0 R Flash Memory Error Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state. See section 7.5.3, Error Protection, for details. 6 to 0 All 0 Reserved These bits are always read as 0. Rev. 3.00 Aug 23, 2006 Page 139 of 616 REJ09B0182-0300 Section 7 ROM 7.2.3 Erase Block Register 1 (EBR1) EBR1 specifies the flash memory erase area block. EBR1 is initialized to H'00 when the SWE bit in FLMCR1 is 0. Do not set more than one bit at a time, as this will cause all the bits in EBR1 to be automatically cleared to 0. Bit Bit Name Initial Value R/W Description 7 0 Reserved This bit is always read as 0. 6 EB6 0 R/W When this bit is set to 1, 4 kbytes of H'C000 to H'CFFF will be erased. 5 EB5 0 R/W When this bit is set to 1, 16 kbytes of H'8000 to H'BFFF will be erased. 4 EB4 0 R/W When this bit is set to 1, 28 kbytes of H'1000 to H'7FFF will be erased. 3 EB3 0 R/W When this bit is set to 1, 1 kbyte of H'0C00 to H'0FFF will be erased. 2 EB2 0 R/W When this bit is set to 1, 1 kbyte of H'0800 to H'0BFF will be erased. 1 EB1 0 R/W When this bit is set to 1, 1 kbyte of H'0400 to H'07FF will be erased. 0 EB0 0 R/W When this bit is set to 1, 1 kbyte of H'0000 to H'03FF will be erased. Rev. 3.00 Aug 23, 2006 Page 140 of 616 REJ09B0182-0300 Section 7 ROM 7.2.4 Flash Memory Power Control Register (FLPWCR) FLPWCR enables or disables a transition to the flash memory power-down mode when the LSI switches to subactive mode. There are two modes: mode in which operation of the power supply circuit of flash memory is partly halted in power-down mode and flash memory can be read, and mode in which even if a transition is made to subactive mode, operation of the power supply circuit of flash memory is retained and flash memory can be read. Bit Bit Name Initial Value R/W Description 7 PDWND 0 R/W Power-Down Disable When this bit is 0 and a transition is made to subactive mode, the flash memory enters the power-down mode. When this bit is 1, the flash memory remains in the normal mode even after a transition is made to subactive mode. 6 to 0 All 0 Reserved These bits are always read as 0. 7.2.5 Flash Memory Enable Register (FENR) Bit 7 (FLSHE) in FENR enables or disables the CPU access to the flash memory control registers, FLMCR1, FLMCR2, EBR1, and FLPWCR. Bit Bit Name Initial Value R/W Description 7 FLSHE 0 R/W Flash Memory Control Register Enable Flash memory control registers can be accessed when this bit is set to 1. Flash memory control registers cannot be accessed when this bit is set to 0. 6 to 0 All 0 Reserved These bits are always read as 0. Rev. 3.00 Aug 23, 2006 Page 141 of 616 REJ09B0182-0300 Section 7 ROM 7.3 On-Board Programming Modes There are two modes for programming/erasing of the flash memory; boot mode, which enables onboard programming/erasing, and programmer mode, in which programming/erasing is performed with a PROM programmer. On-board programming/erasing can also be performed in user program mode. At reset-start in reset mode, this LSI changes to a mode depending on the TEST pin settings, NMI pin settings, and input level of each port, as shown in table 7.1. The input level of each pin must be defined four states before the reset ends. When changing to boot mode, the boot program built into this LSI is initiated. The boot program transfers the programming control program from the externally-connected host to on-chip RAM via SCI3 (channel 2). After erasing the entire flash memory, the programming control program is executed. This can be used for programming initial values in the on-board state or for a forcible return when programming/erasing can no longer be done in user program mode. In user program mode, individual blocks can be erased and programmed by branching to the user program/erase control program prepared by the user. Table 7.1 Setting Programming Modes TEST NMI P36 PB0 PB1 PB2 LSI State after Reset End 0 1 X X X X User Mode 0 0 1 X X X Boot Mode 1 X X 0 0 0 Programmer Mode [Legend] X: Don't care. Rev. 3.00 Aug 23, 2006 Page 142 of 616 REJ09B0182-0300 Section 7 ROM 7.3.1 Boot Mode Table 7.2 shows the boot mode operations between reset end and branching to the programming control program. 1. When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. Prepare a programming control program in accordance with the description in section 7.4, Flash Memory Programming/Erasing. 2. SCI3 should be set to asynchronous mode, and the transfer format as follows: 8-bit data, 1 stop bit, and no parity. The inversion function of TXD and RXD pins by SPCR is set to "Not to be inverted," so do not put the circuit for inverting a value between the host and this LSI. 3. When the boot program is initiated, the chip measures the low-level period of asynchronous SCI communication data (H'00) transmitted continuously from the host. The chip then calculates the bit rate of transmission from the host, and adjusts the SCI3 bit rate to match that of the host. The reset should end with the RXD pin high. The RXD and TXD pins should be pulled up on the board if necessary. After the reset is complete, it takes approximately 100 states before the chip is ready to measure the low-level period. 4. After matching the bit rates, the chip transmits one H'00 byte to the host to indicate the completion of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the chip. If reception could not be performed normally, initiate boot mode again by a reset. Depending on the host's transfer bit rate and system clock frequency of this LSI, there will be a discrepancy between the bit rates of the host and the chip. To operate the SCI properly, set the host's transfer bit rate and system clock frequency of this LSI within the ranges listed in table 7.3. 5. In boot mode, a part of the on-chip RAM area is used by the boot program. The area H'F780 to H'FEEF is the area to which the programming control program is transferred from the host. The boot program area cannot be used until the execution state in boot mode switches to the programming control program. 6. Before branching to the programming control program, the chip terminates transfer operations by SCI3 (by clearing the RE and TE bits in SCR to 0), however the adjusted bit rate value remains set in BRR. Therefore, the programming control program can still use it for transfer of program data or verify data with the host. The TXD pin is high (PCR42 = 1, P42 = 1). The contents of the CPU general registers are undefined immediately after branching to the programming control program. These registers must be initialized at the beginning of the programming control program, as the stack pointer (SP), in particular, is used implicitly in subroutine calls, etc. 7. Boot mode can be cleared by a reset. End the reset after driving the reset pin low, waiting at least 20 states, and then setting the NMI pin. Boot mode is also cleared when a WDT overflow occurs. Rev. 3.00 Aug 23, 2006 Page 143 of 616 REJ09B0182-0300 Section 7 ROM Do not change the TEST pin and NMI pin input levels in boot mode. 8. Boot Mode Operation Host Operation Communication Contents Processing Contents Transfer of number of bytes of programming control program Flash memory erase Bit rate adjustment Boot mode initiation Item Table 7.2 LSI Operation Processing Contents Branches to boot program at reset-start. Boot program initiation Continuously transmits data H'00 at specified bit rate. Transmits data H'55 when data H'00 is received error-free. H'00, H'00 . . . H'00 H'00 H'55 Boot program erase error H'AA reception Transmits number of bytes (N) of programming control program to be transferred as 2-byte data (low-order byte following high-order byte) Transmits 1-byte of programming control program (repeated for N times) H'AA reception H'FF H'AA Upper bytes, lower bytes Echoback H'XX Echoback H'AA * Measures low-level period of receive data H'00. * Calculates bit rate and sets BRR in SCI3. * Transmits data H'00 to host as adjustment end indication. H'55 reception. Checks flash memory data, erases all flash memory blocks in case of written data existing, and transmits data H'AA to host. (If erase could not be done, transmits data H'FF to host and aborts operation.) Echobacks the 2-byte data received to host. Echobacks received data to host and also transfers it to RAM. (repeated for N times) Transmits data H'AA to host. Branches to programming control program transferred to on-chip RAM and starts execution. Rev. 3.00 Aug 23, 2006 Page 144 of 616 REJ09B0182-0300 Section 7 ROM Table 7.3 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is Possible Host Bit Rate System Clock Frequency Range of LSI 9,600 bps 8 to 10 MHz 4,800 bps 4 to 10 MHz 2,400 bps 2 to 10 MHz 7.3.2 Programming/Erasing in User Program Mode On-board programming/erasing of an individual flash memory block can also be performed in user program mode by branching to a user program/erase control program. The user must set branching conditions and provide on-board means of supplying programming data. The flash memory must contain the user program/erase control program or a program that provides the user program/erase control program from external memory. As the flash memory itself cannot be read during programming/erasing, transfer the user program/erase control program to on-chip RAM, as in boot mode. Figure 7.2 shows a sample procedure for programming/erasing in user program mode. Prepare a user program/erase control program in accordance with the description in section 7.4, Flash Memory Programming/Erasing. Rev. 3.00 Aug 23, 2006 Page 145 of 616 REJ09B0182-0300 Section 7 ROM Reset-start No Program/erase? Yes Transfer user program/erase control program to RAM Branch to flash memory application program Branch to user program/erase control program in RAM Execute user program/erase control program (flash memory rewrite) Branch to flash memory application program Figure 7.2 Programming/Erasing Flowchart Example in User Program Mode Rev. 3.00 Aug 23, 2006 Page 146 of 616 REJ09B0182-0300 Section 7 ROM 7.4 Flash Memory Programming/Erasing A software method using the CPU is employed to program and erase flash memory in the onboard programming modes. Depending on the FLMCR1 setting, the flash memory operates in one of the following four modes: Program mode, program-verify mode, erase mode, and erase-verify mode. The programming control program in boot mode and the user program/erase control program in user program mode use these operating modes in combination to perform programming/erasing. Flash memory programming and erasing should be performed in accordance with the descriptions in section 7.4.1, Program/Program-Verify and section 7.4.2, Erase/Erase-Verify, respectively. 7.4.1 Program/Program-Verify When writing data or programs to the flash memory, the program/program-verify flowchart shown in figure 7.3 should be followed. Performing programming operations according to this flowchart will enable data or programs to be written to the flash memory without subjecting the chip to voltage stress or sacrificing program data reliability. 1. Programming must be done to an empty address. Do not reprogram an address to which programming has already been performed. 2. Programming should be carried out 128 bytes at a time. A 128-byte data transfer must be performed even if writing fewer than 128 bytes. In this case, H'FF data must be written to the extra addresses. 3. Prepare the following data storage areas in RAM: A 128-byte programming data area, a 128byte reprogramming data area, and a 128-byte additional-programming data area. Perform reprogramming data computation according to table 7.4, and additional programming data computation according to table 7.5. 4. Consecutively transfer 128 bytes of data in byte units from the reprogramming data area or additional-programming data area to the flash memory. The program address and 128-byte data are latched in the flash memory. The lower 8 bits of the start address in the flash memory destination area must be H'00 or H'80. 5. The time during which the P bit is set to 1 is the programming time. Table 7.6 shows the allowable programming times. 6. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc. An overflow cycle of approximately 6.6 ms is allowed. 7. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 2 bits are B'00. Verify data can be read in words or in longwords from the address to which a dummy write was performed. Rev. 3.00 Aug 23, 2006 Page 147 of 616 REJ09B0182-0300 Section 7 ROM 8. The maximum number of repetitions of the program/program-verify sequence of the same bit is 1,000. Write pulse application subroutine START Apply Write Pulse Set SWE bit in FLMCR1 WDT enable Wait 1 s Set PSU bit in FLMCR1 Store 128-byte program data in program data area and reprogram data area * Wait 50 s n= 1 Set P bit in FLMCR1 m= 0 Wait (Wait time=programming time) Write 128-byte data in RAM reprogram data area consecutively to flash memory Clear P bit in FLMCR1 Wait 5 s Apply Write pulse Clear PSU bit in FLMCR1 Set PV bit in FLMCR1 Wait 4 s Wait 5 s Disable WDT Set block start address as verify address End Sub H'FF dummy write to verify address nn+1 Wait 2 s * Read verify data Increment address No Verify data = write data? m=1 Yes n6? No Yes Additional-programming data computation Reprogram data computation No 128-byte data verification completed? Yes Clear PV bit in FLMCR1 Wait 2 s n 6? No Yes Successively write 128-byte data from additionalprogramming data area in RAM to flash memory Sub-Routine-Call Apply Write Pulse m= 0 ? Yes Clear SWE bit in FLMCR1 No n 1000 ? Wait 100 s Wait 100 s End of programming Programming failure Note: *The RTS instruction must not be used during the following 1. and 2. periods. 1. A period between 128-byte data programming to flash memory and the P bit clearing 2. A period between dummy writing of H'FF to a verify address and verify data reading Figure 7.3 Program/Program-Verify Flowchart Rev. 3.00 Aug 23, 2006 Page 148 of 616 REJ09B0182-0300 Yes No Clear SWE bit in FLMCR1 Section 7 ROM Table 7.4 Reprogram Data Computation Table Program Data Verify Data Reprogram Data Comments 0 0 1 Programming completed 0 1 0 Reprogram bit 1 0 1 1 1 1 Remains in erased state Table 7.5 Additional-Program Data Computation Table Reprogram Data Verify Data Additional-Program Data Comments 0 0 0 Additional-program bit 0 1 1 No additional programming 1 0 1 No additional programming 1 1 1 No additional programming n Programming (Number of Writes) Time In Additional Programming Comments 1 to 6 30 10 7 to 1,000 200 Table 7.6 Programming Time Note: Time shown in s. Rev. 3.00 Aug 23, 2006 Page 149 of 616 REJ09B0182-0300 Section 7 ROM 7.4.2 Erase/Erase-Verify When erasing flash memory, the erase/erase-verify flowchart shown in figure 7.4 should be followed. 1. Prewriting (setting erase block data to all 0s) is not necessary. 2. Erasing is performed in block units. Make only a single-bit specification in the erase block register (EBR1). To erase multiple blocks, each block must be erased in turn. 3. The time during which the E bit is set to 1 is the flash memory erase time. 4. The watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. An overflow cycle of approximately 19.8 ms is allowed. 5. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower two bits are B'00. Verify data can be read in longwords from the address to which a dummy write was performed. 6. If the read data is not erased successfully, set erase mode again, and repeat the erase/eraseverify sequence as before. The maximum number of repetitions of the erase/erase-verify sequence is 100. 7.4.3 Interrupt Handling when Programming/Erasing Flash Memory All interrupts, including the NMI interrupt, are disabled while flash memory is being programmed or erased, or while the boot program is executing, for the following three reasons: 1. Interrupt during programming/erasing may cause a violation of the programming or erasing algorithm, with the result that normal operation cannot be assured. 2. If interrupt exception handling starts before the vector address is written or during programming/erasing, a correct vector cannot be fetched and the CPU malfunctions. 3. If an interrupt occurs during boot program execution, normal boot mode sequence cannot be carried out. Rev. 3.00 Aug 23, 2006 Page 150 of 616 REJ09B0182-0300 Section 7 ROM Erase start SWE bit 1 Wait 1 s n1 Set EBR1 Enable WDT ESU bit 1 Wait 100 s E bit 1 Wait 10 ms E bit 0 Wait 10 s ESU bit 10 10 s Disable WDT EV bit 1 Wait 20 s Set block start address as verify address H'FF dummy write to verify address Wait 2 s * nn+1 Read verify data No Verify data + all 1s ? Increment address Yes No Last address of block ? Yes No EV bit 0 EV bit 0 Wait 4 s Wait 4s All erase block erased ? n 100 ? Yes No Yes SWE bit 0 SWE bit 0 Wait 100 s Wait 100 s End of erasing Erase failure Note: * The RTS instruction must not be used during a period between dummy writing of H'FF to a verify address and verify data reading. Figure 7.4 Erase/Erase-Verify Flowchart Rev. 3.00 Aug 23, 2006 Page 151 of 616 REJ09B0182-0300 Section 7 ROM 7.5 Program/Erase Protection There are three kinds of flash memory program/erase protection; hardware protection, software protection, and error protection. 7.5.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted because of a transition to reset, subactive mode, subsleep mode, or standby mode. Flash memory control register 1 (FLMCR1), flash memory control register 2 (FLMCR2), and erase block register 1 (EBR1) are initialized. In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the AC Characteristics section. 7.5.2 Software Protection Software protection can be implemented against programming/erasing of all flash memory blocks by clearing the SWE bit in FLMCR1. When software protection is in effect, setting the P or E bit in FLMCR1 does not cause a transition to program mode or erase mode. By setting the erase block register 1 (EBR1), erase protection can be set for individual blocks. When EBR1 is set to H'00, erase protection is set for all blocks. 7.5.3 Error Protection In error protection, an error is detected when CPU runaway occurs during flash memory programming/erasing, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is forcibly aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. When the following errors are detected during programming/erasing of flash memory, the FLER bit in FLMCR2 is set to 1, and the error protection state is entered. * When the flash memory of the relevant address area is read during programming/erasing (including vector read and instruction fetch) * Immediately after exception handling excluding a reset during programming/erasing * When a SLEEP instruction is executed during programming/erasing Rev. 3.00 Aug 23, 2006 Page 152 of 616 REJ09B0182-0300 Section 7 ROM The FLMCR1, FLMCR2, and EBR1 settings are retained, however program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be reentered by re-setting the P or E bit. However, PV and EV bit settings are retained, and a transition can be made to verify mode. Error protection can be cleared only by a reset. 7.6 Programmer Mode In programmer mode, a PROM programmer can be used to perform programming/erasing via a socket adapter, just as a discrete flash memory. Use a PROM programmer that supports the MCU device type with the on-chip 64-kbyte flash memory (FZTAT64V3). 7.7 Power-Down States for Flash Memory In user mode, the flash memory will operate in either of the following states: * Normal operating mode The flash memory can be read and written to at high speed. * Power-down operating mode The power supply circuit of flash memory can be partly halted. As a result, flash memory can be read with low power consumption. * Standby mode All flash memory circuits are halted. Table 7.7 shows the correspondence between the operating modes of this LSI and the flash memory. In subactive mode, the flash memory can be set to operate in power-down mode with the PDWND bit in FLPWCR. When the flash memory returns to its normal operating state from power-down mode or standby mode, a period to stabilize operation of the power supply circuits that were stopped is needed. When the flash memory returns to its normal operating state, bits STS2 to STS0 in SYSCR1 must be set to provide a wait time of at least 20 s, even when the external clock is being used. Rev. 3.00 Aug 23, 2006 Page 153 of 616 REJ09B0182-0300 Section 7 ROM Table 7.7 Flash Memory Operating States Flash Memory Operating State LSI Operating State PDWND = 0 (Initial Value) PDWND = 1 Active mode Normal operating mode Normal operating mode Subactive mode Power-down mode Normal operating mode Sleep mode Normal operating mode Normal operating mode Subsleep mode Standby mode Standby mode Standby mode Standby mode Standby mode 7.8 Notes on Setting Module Standby Mode When the flash memory is set to enter module standby mode, the system clock supply is stopped to the module, the function is stopped, and the state is the same as that in standby mode. Also program operation is stopped in the flash memory. Therefore operation program should be transferred to the RAM and the program should run in the RAM. Then the flash memory should be set to enter module standby mode. Even if an interrupt source occurs while the interrupt is enabled in module standby mode, program runaway may occur because the vector cannot be fetched. Before the flash memory is set to enter module standby mode, the corresponding bit in the interrupt enable register should be cleared to 0 and the I bit in CCR should be set to 1. Then after the flash memory enters module standby mode, NMI and address break interrupt requests should not be generated. Figure 7.5 shows a module standby mode setting. Rev. 3.00 Aug 23, 2006 Page 154 of 616 REJ09B0182-0300 Section 7 ROM Transfer execution program to RAM (user area) Clear corresponding bit in interrupt enable register to 0 Set I bit in CCR to 1 Jump to address of execution program in RAM Clear FROMCKSTP bit in CRSTPR1 to 0 Figure 7.5 Module Standby Mode Setting Rev. 3.00 Aug 23, 2006 Page 155 of 616 REJ09B0182-0300 Section 7 ROM Rev. 3.00 Aug 23, 2006 Page 156 of 616 REJ09B0182-0300 Section 8 RAM Section 8 RAM This LSI has an on-chip high-speed static RAM. The RAM is connected to the CPU by a 16-bit data bus, enabling two-state access by the CPU to both byte data and word data. Product Classification RAM Size RAM Address Flash memory version H8/38086RF 3 kbytes H'F380 to H'FF7F Masked ROM version H8/38086R 2 kbytes H'F780 to H'FF7F H8/38085R 2 kbytes H'F780 to H'FF7F H8/38084R 1 kbyte H'FB80 to H'FF7F H8/38083R 1 kbyte H'FB80 to H'FF7F RAM0500A_000120030300 Rev. 3.00 Aug 23, 2006 Page 157 of 616 REJ09B0182-0300 Section 8 RAM Rev. 3.00 Aug 23, 2006 Page 158 of 616 REJ09B0182-0300 Section 9 I/O Ports Section 9 I/O Ports The H8/38086R Group has 55 general I/O ports and six general input-only ports. Port 9 is a large current port, which can drive 15 mA (@VOL = 1.0 V) when a low level signal is output. Any of these ports can become an input port immediately after a reset. They can also be used as I/O pins of the on-chip peripheral modules or external interrupt input pins, and these functions can be switched depending on the register settings. The registers for selecting these functions can be divided into two types: those included in I/O ports and those included in each on-chip peripheral module. General I/O ports are comprised of the port control register for controlling inputs/outputs and the port data register for storing output data and can select inputs/outputs in bit units. For details on the execution of bit manipulation instructions to the port data register (PDR), see section 2.8.3, Bit-Manipulation Instruction. For details on block diagrams for each port, see Appendix B.1, I/O Port Block Diagrams. 9.1 Port 1 Port 1 is an I/O port also functioning as an SCI4 I/O pin, TPU I/O pin, and asynchronous event counter input pin. Figure 9.1 shows its pin configuration. P16/SCK4 Port 1 P15/TIOCB2 P14/TIOCA2/TCLKC P13/TIOCB1/TCLKB P12/TIOCA1/TCLKA P11/AEVL P10/AEVH Figure 9.1 Port 1 Pin Configuration Port 1 has the following registers. * Port data register 1 (PDR1) * Port control register 1 (PCR1) * Port pull-up control register 1 (PUCR1) * Port mode register 1 (PMR1) Rev. 3.00 Aug 23, 2006 Page 159 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.1.1 Port Data Register 1 (PDR1) PDR1 is a register that stores data of port 1. Bit Bit Name Initial Value R/W Description 7 1 6 P16 0 R/W 5 P15 0 R/W If port 1 is read while PCR1 bits are set to 1, the values stored in PDR1 are read, regardless of the actual pin states. If port 1 is read while PCR1 bits are cleared to 0, the pin states are read. 4 P14 0 R/W 3 P13 0 R/W 2 P12 0 R/W 1 P11 0 R/W 0 P10 0 R/W 9.1.2 Port Control Register 1 (PCR1) Bit 7 is reserved. This bit is always read as 1 and cannot be modified. PCR1 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 1. Bit Bit Name Initial Value R/W Description 7 1 6 PCR16 0 W 5 PCR15 0 W 4 PCR14 0 W Setting a PCR1 bit to 1 makes the corresponding pin (P16 to P10) an output pin, while clearing the bit to 0 makes the pin an input pin. The settings in PCR1 and in PDR1 are valid when the corresponding pin is designated as a general I/O pin. 3 PCR13 0 W 2 PCR12 0 W 1 PCR11 0 W 0 PCR10 0 W Rev. 3.00 Aug 23, 2006 Page 160 of 616 REJ09B0182-0300 PCR1 is a write-only register. These bits are always read as 1. Bit 7 is reserved. This bit cannot be modified. Section 9 I/O Ports 9.1.3 Port Pull-Up Control Register 1 (PUCR1) PUCR1 controls the pull-up MOS of the port 1 pins in bit units. Bit Bit Name Initial Value R/W Description 7 1 6 PUCR16 0 R/W 5 PUCR15 0 R/W When a PCR1 bit is cleared to 0, setting the corresponding PUCR1 bit to 1 turns on the pull-up MOS for the corresponding pin, while clearing the bit to 0 turns off the pull-up MOS. 4 PUCR14 0 R/W 3 PUCR13 0 R/W 2 PUCR12 0 R/W 1 PUCR11 0 R/W 0 PUCR10 0 R/W 9.1.4 Port Mode Register 1 (PMR1) Bit 7 is reserved. This bit is always read as 1 and cannot be modified. PMR1 controls the selection of functions for port 1 pins. Bit Bit Name Initial Value R/W Description 7 to 2 All 1 Reserved 1 AEVL 0 R/W These bits are always read as 1 and cannot be modified. P11/AEVL Pin Function Switch Selects whether pin P11/AEVL is used as P11 or as AEVL. 0: P11 I/O pin 1: AEVL input pin 0 AEVH 0 R/W P10/AEVH Pin Function Switch Selects whether pin P10/AEVH is used as P10 or as AEVH. 0: P10 I/O pin 1: AEVH input pin Rev. 3.00 Aug 23, 2006 Page 161 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.1.5 Pin Functions The relationship between the register settings and the port functions is shown below. * P16/SCK4 pin The pin function is switched as shown below according to the combination of the CKS3 to CKS0 bits in SCSR4 and PCR16 bit in PCR1. CKS3* 1 1* 1 B'111* x Other than B'111* PCR16 0 P16 input pin 0* 1 CKS2 to CKS0* Pin Function 1 1 P16 output pin SCK4 input pin* [Legend] x: Don't care. TM Notes: 1. Supported only by the F-ZTAT version. 2. Only port function is available for the masked ROM version. Rev. 3.00 Aug 23, 2006 Page 162 of 616 REJ09B0182-0300 1 x* 1 1 x 2 SCK4 output 2 pin* Section 9 I/O Ports * P15/TIOCB2 pin The pin function is switched as shown below according to the combination of the TPU channel 2 setting by the MD1 and MD0 bits in TMDR_2, IOB3 to IOB0 bits in TIOR_2, and CCLR1 and CCLR0 bits in TCR_2, and the PCR15 bit in PCR1. TPU Channel 2 Setting Next table (1) Next table (2) Next table (3) PCR15 0 1 0 1 Pin Function P15 input pin P15 output pin P15 input pin P15 output pin TIOCB2 input pin* Note: * When the MD1 and MD0 bits are set to B'00 and the IOB3 bit to 1, the pin function becomes the TIOCB2 input pin. Clear PCR15 to 0 when using TIOCB2 as an input pin. TPU Channel 2 Setting (2) (3) MD1, MD0 IOB3 to IOB0 B'00 B'0000 B'1xxx CCLR1, CCLR0 Output Function [Legend] (1) B'10, B'01, B'11 B'0001 to B'0111 B'xxxx B'xx Setting prohibited x: Don't care. Rev. 3.00 Aug 23, 2006 Page 163 of 616 REJ09B0182-0300 Section 9 I/O Ports * P14/TIOCA2/TCLKC pin The pin function is switched as shown below according to the combination of the TPU channel 2 setting by the MD1 and MD0 bits in TMDR_2, IOA3 to IOA0 bits in TIOR_2, and CCLR1 and CCLR0 bits in TCR_2, the TPSC2 to TPSC0 bits in TCR_2, and the PCR14 bit in PCR1. TPU Channel 2 Setting Next table (1) 0 1 TIOCA2 output pin P14 input pin P14 output pin PCR14 Pin Function Next table (2) TIOCA2 input pin* TCLKC input pin* 1 2 Notes: 1. When the MD1 and MD0 bits are set to B'00 and the IOA3 bit to 1, the pin function becomes the TIOCA2 input pin. Clear PCR14 to 0 when using TIOCA2 as an input pin. 2. When the TPSC2 to TPSC0 bits in TCR_2 are set to B'110, the pin function becomes the TCLKC input pin. Clear PCR14 to 0 when using TCLKC as an input pin. TPU Channel 2 Setting (2) (1) (2) B'1x B'10 B'11 B'0000 B'0100 B'1xxx B'0001 to B'0011 B'0101 to B'0111 B'xx00 Other than B'xx00 Other than B'xx00 CCLR1, CCLR0 Other than B'01 B'01 Output Function Output compare output PWM mode 1* output PWM mode 2 output MD1, MD0 IOA3 to IOA0 [Legend] Note: * B'00 x: Don't care. The output of the TIOCB2 pin is disabled. Rev. 3.00 Aug 23, 2006 Page 164 of 616 REJ09B0182-0300 (1) (1) (2) Section 9 I/O Ports * P13/TIOCB1/TCLKB pin The pin function is switched as shown below according to the combination of the TPU channel 1 setting by the MD1 and MD0 bits in TMDR_1, IOB3 to IOB0 bits in TIOR_1, and CCLR1 and CCLR0 bits in TCR_1, the TPSC2 to TPSC0 bits in TCR_1 and TCR_2, and the PCR13 bit in PCR1. TPU Channel 1 Setting Next table (1) Next table (2) Next table (3) PCR13 0 1 0 1 Pin Function P13 input pin P13 output pin P13 input pin P13 output pin TIOCB1 input pin TCLKB input pin* Note: * When the TPSC2 to TPSC0 bits in TCR_1 or TCR_2 are set to B'101, the pin function becomes the TCLKB input pin. Clear PCR13 to 0 when using TCLKB as an input pin. TPU Channel 1 Setting (2) (3) MD1, MD0 IOB3 to IOB0 B'00 B'0000 B'1xxx CCLR1, CCLR0 Output Function [Legend] (1) B'10, B'01, B'11 B'0001 to B'0111 B'xxxx B'xx Setting prohibited x: Don't care. Rev. 3.00 Aug 23, 2006 Page 165 of 616 REJ09B0182-0300 Section 9 I/O Ports * P12/TIOCA1/TCLKA pin The pin function is switched as shown below according to the combination of the TPU channel 1 setting by the MD1 and MD0 bits in TMDR_1, IOA3 to IOA0 bits in TIOR_1, and CCLR1 and CCLR0 bits in TCR_1, the TPSC2 to TPSC0 bits in TCR_1 and TCR_2, and the PCR12 bit in PCR1. TPU Channel 1 Setting Next table (1) 0 1 TIOCA1 output pin P12 input pin P12 output pin PCR12 Pin Function Next table (2) TIOCA1 input pin* 1 2 TCLKA input pin* Notes: 1. When the MD1 and MD0 bits are set to B'00 and the IOA3 bit to 1, the pin function becomes the TIOCA1 input pin. Clear PCR12 to 0 when using TIOCA1 as an input pin. 2. When the TPSC2 to TPSC0 bits in TCR_1 or TCR_2 are set to B'100, the pin function becomes the TCLKA input pin. Clear PCR12 to 0 when using TCLKA as an input pin. TPU Channel 1 Setting (2) MD1, MD0 IOA3 to IOA0 (1) B'00 (2) (1) (1) (2) B'1x B'10 B'11 Other than B'xx00 B'0000 B'0100 B'1xxx B'0001 to B'0011 B'0101 to B'0111 B'xx00 Other than B'xx00 CCLR1, CCLR0 Other than B'01 B'01 Output Function Output compare output PWM mode 1* output PWM mode 2 output [Legend] Note: * x: Don't care. The output of the TIOCB1 pin is disabled. Rev. 3.00 Aug 23, 2006 Page 166 of 616 REJ09B0182-0300 Section 9 I/O Ports * P11/AEVL pin The pin function is switched as shown below according to the combination of the AEVL bit in PMR1 and PCR11 bit in PCR. AEVL 0 PCR11 Pin Function [Legend] 1 0 1 x P11 input pin P11 output pin AEVL input pin x: Don't care. * P10/AEVH pin The pin function is switched as shown below according to the combination of the AEVH bit in PMR1 and PCR10 bit in PCR. AEVH 0 PCR10 Pin Function [Legend] 9.1.6 1 0 1 x P10 input pin P10 output pin AEVH input pin x: Don't care. Input Pull-Up MOS Port 1 has an on-chip input pull-up MOS function that can be controlled by software. When a PCR1 bit is cleared to 0, setting the corresponding PUCR1 bit to 1 turns on the input pull-up MOS for that pin. The input pull-up MOS function is in the off state after a reset. (n = 6 to 0) PCR1n 0 PUCR1n Input Pull-Up MOS [Legend] 1 0 1 x Off On Off x: Don't care. Rev. 3.00 Aug 23, 2006 Page 167 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.2 Port 3 Port 3 is an I/O port also functioning as an SCI4 I/O pin, SCI3_2 I/O pin, IIC2 I/O pin, and RTC output pin. Figure 9.2 shows its pin configuration. P37/SO4 Port 3 P36/SI4 P32/TXD32/SCL P31/RXD32/SDA P30/SCK32/TMOW Figure 9.2 Port 3 Pin Configuration Port 3 has the following registers. * Port data register 3 (PDR3) * Port control register 3 (PCR3) * Port pull-up control register 3 (PUCR3) * Port mode register 3 (PMR3) 9.2.1 Port Data Register 3 (PDR3) PDR3 is a register that stores data of port 3. Bit Bit Name Initial Value R/W Description 7 P37 0 R/W 6 P36 0 R/W 5 1 If port 3 is read while PCR3 bits are set to 1, the values stored in PDR3 are read, regardless of the actual pin states. If port 3 is read while PCR3 bits are cleared to 0, the pin states are read. 4 1 3 1 2 P32 0 R/W 1 P31 0 R/W 0 P30 0 R/W Rev. 3.00 Aug 23, 2006 Page 168 of 616 REJ09B0182-0300 Bits 5 to 3 are reserved. These bits are always read as 1 and cannot be modified. Section 9 I/O Ports 9.2.2 Port Control Register 3 (PCR3) PCR3 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 3. Bit Bit Name Initial Value R/W Description 7 PCR37 0 W 6 PCR36 0 W 5 1 4 1 Setting a PCR3 bit to 1 makes the corresponding pin (P37, P36, P32 to P30) an output pin, while clearing the bit to 0 makes the pin an input pin. The settings in PCR3 and in PDR3 are valid when the corresponding pin is designated as a general I/O pin. 3 1 2 PCR32 0 W 1 PCR31 0 W 0 PCR30 0 W 9.2.3 Port Pull-Up Control Register 3 (PUCR3) PCR3 is a write-only register. These bits are always read as 1. Bits 5 to 3 are reserved. These bits cannot be modified. PUCR3 controls the pull-up MOS of the port 3 pins in bit units. Bit Bit Name Initial Value R/W Description 7 PUCR37 0 R/W 6 PUCR36 0 R/W 5 1 When a PCR3 bit is cleared to 0, setting the corresponding PUCR3 bit to 1 turns on the pull-up MOS for the corresponding pin, while clearing the bit to 0 turns off the pull-up MOS. 4 1 3 1 2 1 1 1 0 PUCR30 0 R/W Bits 5 to 1 are reserved. These bits are always read as 1 and cannot be modified. Rev. 3.00 Aug 23, 2006 Page 169 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.2.4 Port Mode Register 3 (PMR3) PMR3 controls the selection of functions for port 3 pins. Bit Bit Name Initial Value R/W Description 7 to 1 All 1 Reserved These bits are always read as 1 and cannot be modified. 0 TMOW 0 R/W P30/SCK32/TMOW Pin Function Switch Selects whether pin P30/SCK32/TMOW is used as P30/SCK32 or as TMOW. 0: P30/SCK32 I/O pin 1: TMOW output pin 9.2.5 Pin Functions The relationship between the register settings and the port functions is shown below. * P37/SO4 pin The pin function is switched as shown below according to the combination of the TE bit in SCR4 and PCR37 bit in PCR3. TE* 1 PCR37 Pin Function 0* 1 1* 0 1 x P37 input pin P37 output pin SO4 output pin* [Legend] x: Don't care. TM Notes: 1. Supported only by the F-ZTAT version. 2. Only port function is available for the masked ROM version. Rev. 3.00 Aug 23, 2006 Page 170 of 616 REJ09B0182-0300 1 2 Section 9 I/O Ports * P36/SI4 pin The pin function is switched as shown below according to the combination of the RE bit in SCR4 and PCR36 bit in PCR3. RE* 1 0* PCR36 Pin Function 1 1* 1 0 1 x P36 input pin P36 output pin SI4 input pin* 2 [Legend] x: Don't care. TM Notes: 1. Supported only by the F-ZTAT version. 2. Only port function is available for the masked ROM version. * P32/TXD32/SCL pin The pin function is switched as shown below according to the combination of the PCR32 bit in PCR3, ICE bit in ICRR1, TE bit in SCR32, and SPC32 bit in SPCR. ICE 0 1 SPC32 0 1 x TE x x x PCR32 Pin Function [Legend] Note: * 0 1 x x P32 input pin P32 output pin TXD32 output pin* SCL I/O pin x: Don't care. If SPC32 is set to 1 and TE is cleared to 0, the mark state is entered and 1 is output from the TXD32 output pin. * P31/RXD32/SDA pin The pin function is switched as shown below according to the combination of the PCR31 bit in PCR3, ICE bit in ICCR1, and RE bit in SCR32. ICE 0 RE 0 PCR31 Pin Function [Legend] 1 1 x 0 1 x x P31 input pin P31 output pin RXD32 output pin SDA I/O pin x: Don't care. Rev. 3.00 Aug 23, 2006 Page 171 of 616 REJ09B0182-0300 Section 9 I/O Ports * P30/SCK32/TMOW pin The pin function is switched as shown below according to the combination of the TMOW bit in PMR3, PCR30 bit in PCR3, CKE1 and CKE0 bits in SCR32, and COM bit in SMR32. TMOW 0 CKE1 0 CKE0 0 COM 0 PCR30 Pin Function [Legend] 9.2.6 1 1 1 x 1 x x x x x 0 1 x x x P30 input pin P30 output pin SCK32 output pin SCK32 input pin TMOW output pin x: Don't care. Input Pull-Up MOS Port 3 has an on-chip input pull-up MOS function that can be controlled by software. When a PCR3 bit is cleared to 0, setting the corresponding PUCR3 bit to 1 turns on the input pull-up MOS for that pin. The input pull-up MOS function is in the off state after a reset. (n = 7, 6, 0) PCR3n 0 PUCR3n Input Pull-Up MOS [Legend] 0 1 x Off On Off x: Don't care. Rev. 3.00 Aug 23, 2006 Page 172 of 616 REJ09B0182-0300 1 Section 9 I/O Ports 9.3 Port 4 Port 4 is an I/O port also functioning as an SCI3_1 data I/O pin and timer F I/O pin. Figure 9.3 shows its pin configuration. Port 4 P42/TXD31/IrTXD/TMOFH P41/RXD31/IrRXD/TMOFL P40/SCK31/TMIF Figure 9.3 Port 4 Pin Configuration Port 4 has the following registers. * Port data register 4 (PDR4) * Port control register 4 (PCR4) * Port mode register 4 (PMR4) 9.3.1 Port Data Register 4 (PDR4) PDR4 is a register that stores data of port 4. Bit Bit Name Initial Value R/W Description 7 to 3 All 1 Reserved These bits are always read as 1 and cannot be modified. 2 P42 0 R/W 1 P41 0 R/W 0 P40 0 R/W If port 4 is read while PCR4 bits are set to 1, the values stored in PDR4 are read, regardless of the actual pin states. If port 4 is read while PCR4 bits are cleared to 0, the pin states are read. Rev. 3.00 Aug 23, 2006 Page 173 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.3.2 Port Control Register 4 (PCR4) PCR4 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 4. Bit Bit Name Initial Value R/W Description 7 to 3 All 1 Reserved These bits are always read as 1 and cannot be modified. 2 PCR42 0 W 1 PCR41 0 W 0 PCR40 0 W Setting a PCR4 bit to 1 makes the corresponding pin an output pin, while clearing the bit to 0 makes the pin an input pin. The settings in PCR4 and in PDR4 are valid when the corresponding pin is designated as a general I/O pin. PCR4 is a write-only register. These bits are always read as 1. Rev. 3.00 Aug 23, 2006 Page 174 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.3.3 Port Mode Register 4 (PMR4) PMR4 controls the selection of functions for port 4 pins. Bit Bit Name Initial Value R/W Description 7 to 3 All 1 Reserved These bits are always read as 1 and cannot be modified. 2 TMOFH 0 R/W P42/TXD31/IrTXD/TMOFH Pin Function Switch Selects whether pin P42/TXD31/IrTXD/TMOFH is used as P42 or TXD31/IrTXD, or as TMOFH. 0: P42 I/O pin or TXD31/IrTXD output pin 1: TMOFH output pin 1 TMOFL 0 R/W P41/RXD31/IrRXD/TMOFL Pin Function Switch Selects whether pin P41/RXD31/IrRXD/TMOFL is used as P41 or RXD31/IrRXD, or as TMOFL. 0: P41 I/O pin or RXD31/IrRXD input pin 1: TMOFL output pin 0 TMIF 0 R/W P40/SCK31/TMIF Pin Function Switch Selects whether pin P40/SCK31/TMIF is used as P40/SCK31 or as TMIF. 0: P40/SCK31 I/O pin 1: TMIF input pin Rev. 3.00 Aug 23, 2006 Page 175 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.3.4 Pin Functions The relationship between the register settings and the port functions is shown below. * P42/TXD31/IrTXD/TMOFH pin The pin function is switched as shown below according to the combination of the TMOFH bit in PMR4, PCR42 bit in PCR4, IrE bit in IrCR, TE bit in SCR3, and SPC31 bit in SPCR. TMOFH 0 1 SPC31 0 1 x TE x x x IrE x PCR42 Pin Function [Legend] Note: * 0 1 x 0 1 x x x P42 input pin P42 output pin TXD31 output pin* IrTXD output pin* TMOFH output pin x: Don't care. If SPC31 is set to 1 and TE is cleared to 0, the mark state is entered, 1 is output from the TXD32 output pin, and 0 is output from the IrTXD pin. * P41/RXD31/IrRXD/TMOFL pin The pin function is switched as shown below according to the combination of the TMOFL bit in PMR4, PCR41 bit in PCR4, IrE bit in IrCR, and RE bit in SCR3. TMOFL 0 RE 0 IrE x PCR41 Pin Function [Legend] x 0 1 x 0 1 x x x P41 input pin P41 output pin RXD31 input pin IrRXD input pin TMOFL output pin x: Don't care. Rev. 3.00 Aug 23, 2006 Page 176 of 616 REJ09B0182-0300 1 1 Section 9 I/O Ports * P40/SCK31/TMIF pin The pin function is switched as shown below according to the combination of the TMIF bit in PMR4, PCR40 bit in PCR4, CKE1 and CKE0 bits in SCR3, and COM bit in SMR3. TMIF 0 CKE1 0 CKE0 0 PCR40 Pin Function 9.4 1 0 COM [Legend] 1 1 x 1 0 1 x x x x x 0 1 x x x x P40 input pin P40 output pin SCK31 output pin SCK31 input pin Setting prohibited TMIF input pin x: Don't care. Port 5 Port 5 is an I/O port also functioning as a wakeup interrupt input pin and LCD segment output pin. Figure 9.4 shows its pin configuration. P57/WKP7/SEG8 P56/WKP6/SEG7 Port 5 P55/WKP5/SEG6 P54/WKP4/SEG5 P53/WKP3/SEG4 P52/WKP2/SEG3 P51/WKP1/SEG2 P50/WKP0/SEG1 Figure 9.4 Port 5 Pin Configuration Port 5 has the following registers. * Port data register 5 (PDR5) * Port control register 5 (PCR5) * Port pull-up control register 5 (PUCR5) * Port mode register 5 (PMR5) Rev. 3.00 Aug 23, 2006 Page 177 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.4.1 Port Data Register 5 (PDR5) PDR5 is a register that stores data of port 5. Bit Bit Name Initial Value R/W Description 7 P57 0 R/W 6 P56 0 R/W 5 P55 0 R/W If port 5 is read while PCR5 bits are set to 1, the values stored in PDR5 are read, regardless of the actual pin states. If port 5 is read while PCR5 bits are cleared to 0, the pin states are read. 4 P54 0 R/W 3 P53 0 R/W 2 P52 0 R/W 1 P51 0 R/W 0 P50 0 R/W 9.4.2 Port Control Register 5 (PCR5) PCR5 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 5. Bit Bit Name Initial Value R/W Description 7 PCR57 0 W 6 PCR56 0 W 5 PCR55 0 W 4 PCR54 0 W Setting a PCR5 bit to 1 makes the corresponding pin an output pin, while clearing the bit to 0 makes the pin an input pin. The settings in PCR5 and in PDR5 are valid when the corresponding pin is designated as a general I/O pin. 3 PCR53 0 W 2 PCR52 0 W 1 PCR51 0 W 0 PCR50 0 W Rev. 3.00 Aug 23, 2006 Page 178 of 616 REJ09B0182-0300 PCR5 is a write-only register. These bits are always read as 1. Section 9 I/O Ports 9.4.3 Port Pull-Up Control Register 5 (PUCR5) PUCR5 controls the pull-up MOS of the port 5 pins in bit units. Bit Bit Name Initial Value R/W Description 7 PUCR57 0 R/W 6 PUCR56 0 R/W 5 PUCR55 0 R/W When a PCR5 bit is cleared to 0, setting the corresponding PUCR5 bit to 1 turns on the pull-up MOS for the corresponding pin, while clearing the bit to 0 turns off the pull-up MOS. 4 PUCR54 0 R/W 3 PUCR53 0 R/W 2 PUCR52 0 R/W 1 PUCR51 0 R/W 0 PUCR50 0 R/W 9.4.4 Port Mode Register 5 (PMR5) PMR5 controls the selection of functions for port 5 pins. Bit Bit Name Initial Value R/W Description 7 WKP7 0 R/W P5n/WKPn/SEGn+1 Pin Function Switch 6 WKP6 0 R/W 5 WKP5 0 R/W 4 WKP4 0 R/W When pin P5n/WKPn/SEGn+1 is not used as SEGn+1, these bits select whether the pin is used as P5n or WKPn. 3 WKP3 0 R/W 2 WKP2 0 R/W 1 WKP1 0 R/W 0 WKP0 0 R/W 0: P5n I/O pin 1: WKPn input pin (n = 7 to 0) Note: For use as SEGn+1, see section 20.3.1, LCD Port Control Register (LPCR). Rev. 3.00 Aug 23, 2006 Page 179 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.4.5 Pin Functions The relationship between the register settings and the port functions is shown below. * P57/WKP7/SEG8 to P54/WKP4/SEG5 pins The pin function is switched as shown below according to the combination of the WKPn bit in PMR5, PCR5n bit in PCR5, and SGS3 to SGS0 bits in LPCR. (n = 7 to 4) SGS3 to SGS0 Other than B'0010, B'0011, B'0100, B'0101, B'0110, B'0111, B'1000, B'1001 WKPn 0 PCR5n Pin Function [Legend] B'0010, B'0011, B'0100, B'0101, B'0110, B'0111, B'1000, B'1001 1 x 0 1 x x P5n input pin P5n output pin WKPn input pin SEGn+1 output pin x: Don't care. * P53/WKP3/SEG4 to P50/WKP0/SEG1 pins The pin function is switched as shown below according to the combination of the WKPm bit in PMR5, PCR5m bit in PCR5, and SGS3 to SGS0 bits in LPCR. (m = 3 to 0) SGS3 to SGS0 Other than B'0001, B'0010, B'0011, B'0100, B'0101, B'0110, B'0111, B'1000 WKPm 0 PCR5m Pin Function [Legend] 1 x 0 1 x x P5m input pin P5m output pin WKPm input pin SEGm+1 output pin x: Don't care. Rev. 3.00 Aug 23, 2006 Page 180 of 616 REJ09B0182-0300 B'0001, B'0010, B'0011, B'0100, B'0101, B'0110, B'0111, B'1000 Section 9 I/O Ports 9.4.6 Input Pull-Up MOS Port 5 has an on-chip input pull-up MOS function that can be controlled by software. When the PCR5 bit is cleared to 0, setting the corresponding PUCR5 bit to 1 turns on the input pull-up MOS for that pin. The input pull-up MOS function is in the off state after a reset. (n = 7 to 0) PCR5n 0 PUCR5n Input Pull-Up MOS [Legend] 9.5 1 0 1 x Off On Off x: Don't care. Port 6 Port 6 is an I/O port also functioning as an LCD segment output pin. Figure 9.5 shows its pin configuration. P67/SEG16 P66/SEG15 Port 6 P65/SEG14 P64/SEG13 P63/SEG12 P62/SEG11 P61/SEG10 P60/SEG9 Figure 9.5 Port 6 Pin Configuration Port 6 has the following registers. * Port data register 6 (PDR6) * Port control register 6 (PCR6) * Port pull-up control register 6 (PUCR6) Rev. 3.00 Aug 23, 2006 Page 181 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.5.1 Port Data Register 6 (PDR6) PDR6 is a register that stores data of port 6. Bit Bit Name Initial Value R/W Description 7 P67 0 R/W 6 P66 0 R/W 5 P65 0 R/W If port 6 is read while PCR6 bits are set to 1, the values stored in PDR6 are read, regardless of the actual pin states. If port 6 is read while PCR6 bits are cleared to 0, the pin states are read. 4 P64 0 R/W 3 P63 0 R/W 2 P62 0 R/W 1 P61 0 R/W 0 P60 0 R/W 9.5.2 Port Control Register 6 (PCR6) PCR6 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 6. Bit Bit Name Initial Value R/W Description 7 PCR67 0 W 6 PCR66 0 W 5 PCR65 0 W 4 PCR64 0 W Setting a PCR6 bit to 1 makes the corresponding pin an output pin, while clearing the bit to 0 makes the pin an input pin. The settings in PCR6 and in PDR6 are valid when the corresponding pin is designated as a general I/O pin. 3 PCR63 0 W 2 PCR62 0 W 1 PCR61 0 W 0 PCR60 0 W Rev. 3.00 Aug 23, 2006 Page 182 of 616 REJ09B0182-0300 PCR6 is a write-only register. These bits are always read as 1. Section 9 I/O Ports 9.5.3 Port Pull-Up Control Register 6 (PUCR6) PUCR6 controls the pull-up MOS of the port 6 pins in bit units. Bit Bit Name Initial Value R/W Description 7 PUCR67 0 R/W 6 PUCR66 0 R/W 5 PUCR65 0 R/W When a PCR6 bit is cleared to 0, setting the corresponding PUCR6 bit to 1 turns on the pull-up MOS for the corresponding pin, while clearing the bit to 0 turns off the pull-up MOS. 4 PUCR64 0 R/W 3 PUCR63 0 R/W 2 PUCR62 0 R/W 1 PUCR61 0 R/W 0 PUCR60 0 R/W 9.5.4 Pin Functions The relationship between the register settings and the port functions is shown below. * P67/SEG16 to P64/SEG13 pins The pin function is switched as shown below according to the combination of the PCR6n bit in PCR6 and SGS3 to SGS0 bits in LPCR. (n = 7 to 4) SGS3 to SGS0 Other than B'0100, B'0101, B'0110, B'0111, B'1000, B'1001, B'1010, B'1011 PCR6n Pin Function [Legend] B'0100, B'0101, B'0110, B'0111, B'1000, B'1001, B'1010, B'1011 0 1 x P6n input pin P6n output pin SEGn+9 output pin x: Don't care. Rev. 3.00 Aug 23, 2006 Page 183 of 616 REJ09B0182-0300 Section 9 I/O Ports * P63/SEG12 to P60/SEG9 pins The pin function is switched as shown below according to the combination of the PCR6m bit in PCR6 and SGS3 to SGS0 bits in LPCR. (m = 3 to 0) SGS3 to SGS0 Other than B'0011, B'0100, B'0101, B'0110, B'0111, B'1000, B'1001, B'1010 PCR6m Pin Function [Legend] 9.5.5 B'0011, B'0100, B'0101, B'0110, B'0111, B'1000, B'1001, B'1010 0 1 x P6m input pin P6m output pin SEGm+9 output pin x: Don't care. Input Pull-Up MOS Port 6 has an on-chip input pull-up MOS function that can be controlled by software. When the PCR6 bit is cleared to 0, setting the corresponding PUCR6 bit to 1 turns on the input pull-up MOS for that pin. The input pull-up MOS function is in the off state after a reset. (n = 7 to 0) PCR6n 0 PUCR6n Input Pull-Up MOS [Legend] 0 1 x Off On Off x: Don't care. Rev. 3.00 Aug 23, 2006 Page 184 of 616 REJ09B0182-0300 1 Section 9 I/O Ports 9.6 Port 7 Port 7 is an I/O port also functioning as an LCD segment output pin. Figure 9.6 shows its pin configuration. P77/SEG24 P76/SEG23 Port 7 P75/SEG22 P74/SEG21 P73/SEG20 P72/SEG19 P71/SEG18 P70/SEG17 Figure 9.6 Port 7 Pin Configuration Port 7 has the following registers. * Port data register 7 (PDR7) * Port control register 7 (PCR7) 9.6.1 Port Data Register 7 (PDR7) PDR7 is a register that stores data of port 7. Bit Bit Name Initial Value R/W Description 7 P77 0 R/W 6 P76 0 R/W 5 P75 0 R/W If port 7 is read while PCR7 bits are set to 1, the values stored in PDR7 are read, regardless of the actual pin states. If port 7 is read while PCR7 bits are cleared to 0, the pin states are read. 4 P74 0 R/W 3 P73 0 R/W 2 P72 0 R/W 1 P71 0 R/W 0 P70 0 R/W Rev. 3.00 Aug 23, 2006 Page 185 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.6.2 Port Control Register 7 (PCR7) PCR7 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 7. Bit Bit Name Initial Value R/W Description 7 PCR77 0 W 6 PCR76 0 W 5 PCR75 0 W 4 PCR74 0 W Setting a PCR7 bit to 1 makes the corresponding pin an output pin, while clearing the bit to 0 makes the pin an input pin. The settings in PCR7 and in PDR7 are valid when the corresponding pin is designated as a general I/O pin. 3 PCR73 0 W 2 PCR72 0 W 1 PCR71 0 W 0 PCR70 0 W 9.6.3 Pin Functions PCR7 is a write-only register. These bits are always read as 1. The relationship between the register settings and the port functions is shown below. * P77/SEG24 to P74/SEG21 pins The pin function is switched as shown below according to the combination of the PCR7n bit in PCR7 and SGS3 to SGS0 bits in LPCR. (n = 7 to 4) SGS3 to SGS0 Other than B'0110, B'0111, B'1000, B'1001, B'1010, B'1011, B'1100, B'1101 PCR7n Pin Function [Legend] 0 1 x P7n input pin P7n output pin SEGn+17 output pin x: Don't care. Rev. 3.00 Aug 23, 2006 Page 186 of 616 REJ09B0182-0300 B'0110, B'0111, B'1000, B'1001, B'1010, B'1011, B'1100, B'1101 Section 9 I/O Ports * P73/SEG20 to P70/SEG17 pins The pin function is switched as shown below according to the combination of the PCR7m bit in PCR7 and SGS3 to SGS0 bits in LPCR. (m = 3 to 0) SGS3 to SGS0 Other than B'0101, B'0110, B'0111, B'1000, B'1001, B'1010, B'1011, B'1100 PCR7m Pin Function [Legend] 9.7 B'0101, B'0110, B'0111, B'1000, B'1001, B'1010, B'1011, B'1100 0 1 x P7m input pin P7m output pin SEGm+17 output pin x: Don't care. Port 8 Port 8 is an I/O port also functioning as an LCD segment output pin. Figure 9.7 shows its pin configuration. P87/SEG32 P86/SEG31 Port 8 P85/SEG30 P84/SEG29 P83/SEG28 P82/SEG27 P81/SEG26 P80/SEG25 Figure 9.7 Port 8 Pin Configuration Port 8 has the following registers. * Port data register 8 (PDR8) * Port control register 8 (PCR8) Rev. 3.00 Aug 23, 2006 Page 187 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.7.1 Port Data Register 8 (PDR8) PDR8 is a register that stores data of port 8. Bit Bit Name Initial Value R/W Description 7 P87 0 R/W 6 P86 0 R/W 5 P85 0 R/W If port 8 is read while PCR8 bits are set to 1, the values stored in PDR8 are read, regardless of the actual pin states. If port 8 is read while PCR8 bits are cleared to 0, the pin states are read. 4 P84 0 R/W 3 P83 0 R/W 2 P82 0 R/W 1 P81 0 R/W 0 P80 0 R/W 9.7.2 Port Control Register 8 (PCR8) PCR8 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 8. Bit Bit Name Initial Value R/W Description 7 PCR87 0 W 6 PCR86 0 W 5 PCR85 0 W 4 PCR84 0 W Setting a PCR8 bit to 1 makes the corresponding pin (P87 to P80) an output pin, while clearing the bit to 0 makes the pin an input pin. The settings in PCR8 and in PDR8 are valid when the corresponding pin is designated as a general I/O pin. 3 PCR83 0 W 2 PCR82 0 W 1 PCR81 0 W 0 PCR80 0 W Rev. 3.00 Aug 23, 2006 Page 188 of 616 REJ09B0182-0300 PCR8 is a write-only register. These bits are always read as 1. Section 9 I/O Ports 9.7.3 Pin Functions The relationship between the register settings and the port functions is shown below. * P87/SEG32 to P84/SEG29 pins The pin function is switched as shown below according to the combination of the PCR8n bit in PCR8 and SGS3 to SGS0 bits in LPCR. (n = 7 to 4) SGS3 to SGS0 Other than B'1000, B'1001, B'1010, B'1011, B'1100, B'1101, B'1110, B'1111 PCR8n Pin Function [Legend] B'1000, B'1001, B'1010, B'1011, B'1100, B'1101, B'1110, B'1111 0 1 x P8n input pin P8n output pin SEGn+25 output pin x: Don't care. * P83/SEG28 to P80/SEG25 pins The pin function is switched as shown below according to the combination of the PCR8m bit in PCR8 and SGS3 to SGS0 bits in LPCR. (m = 3 to 0) SGS3 to SGS0 Other than B'0111, B'1000, B'1001, B'1010, B'1011, B'1100, B'1101, B'1110 PCR8m Pin Function [Legend] B'0111, B'1000, B'1001, B'1010, B'1011, B'1100, B'1101, B'1110 0 1 x P8m input pin P8m output pin SEGm+25 output pin x: Don't care. Rev. 3.00 Aug 23, 2006 Page 189 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.8 Port 9 Port 9 is an I/O port also functioning as an external interrupt input pin and PWM output pin. Figure 9.8 shows its pin configuration. Port 9 P93 P92/IRQ4 P91/PWM2 P90/PWM1 Figure 9.8 Port 9 Pin Configuration Port 9 has the following registers. * Port data register 9 (PDR9) * Port control register 9 (PCR9) * Port mode register 9 (PMR9) 9.8.1 Port Data Register 9 (PDR9) PDR9 is a register that stores data of port 9. Bit Bit Name Initial Value R/W Description 7 to 4 All 1 Reserved These bits are always read as 1 and cannot be modified. 3 P93 1 R/W 2 P92 1 R/W 1 P91 1 R/W 0 P90 1 R/W Rev. 3.00 Aug 23, 2006 Page 190 of 616 REJ09B0182-0300 If port 9 is read while PCR9 bits are set to 1, the values stored in PDR9 are read, regardless of the actual pin states. If port 9 is read while PCR9 bits are cleared to 0, the pin states are read. Section 9 I/O Ports 9.8.2 Port Control Register 9 (PCR9) PCR9 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 9. Bit Bit Name Initial Value R/W Description 7 to 4 All 1 Reserved These bits are always read as 1 and cannot be modified. 3 PCR93 0 W 2 PCR92 0 W 1 PCR91 0 W 0 PCR90 0 W Setting a PCR9 bit to 1 makes the corresponding pin an output pin, while clearing the bit to 0 makes the pin an input pin. The settings in PCR9 and in PDR9 are valid when the corresponding pin is designated as a general I/O pin. PCR9 is a write-only register. These bits are always read as 1. 9.8.3 Port Mode Register 9 (PMR9) PMR9 controls the selection of functions for port 9 pins. Bit Bit Name Initial Value R/W Description 7 to 4 All 1 Reserved These bits are always read as 1 and cannot be modified. 3 0 R/W Reserved Although this bit is readable/writable, 1 should not be written to this bit. 2 IRQ4 0 R/W P92/IRQ4 Pin Function Switch Selects whether pin P92/IRQ4 is used as P92 or as IRQ4. 0: P92 I/O pin 1: IRQ4 input pin 1 PWM2 0 R/W P9n/PWMn+1 Pin Function Switch 0 PWM1 0 R/W Select whether pin P9n/PWMn+1 is used as P9n or as PWMn+1. (n = 1, 0) 0: P9n I/O pin 1: PWMn+1 output pin Rev. 3.00 Aug 23, 2006 Page 191 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.8.4 Pin Functions The relationship between the register settings and the port functions is shown below. * P93 pin The pin function is switched as shown below according to the PCR93 bit in PCR9. PCR93 Pin Function 0 1 P93 input pin P93 output pin * P92/IRQ4 pin The pin function is switched as shown below according to the combination of the IRQ4 bit in PMR9 and PCR92 bit in PCR9. IRQ4 0 PCR92 Pin Function 1 0 1 0 1 P92 input pin P92 output pin IRQ4 input pin Setting prohibited * P91/PWM2, P90/PWM1 pins The pin function is switched as shown below according to the combination of the PWMn+1 bit in PMR9 and PCR9n bit in PCR9. (n = 1, 0) PWMn+1 0 PCR9n Pin Function [Legend] 0 1 x P9n input pin P9n output pin PWMn+1 output pin x: Don't care. Rev. 3.00 Aug 23, 2006 Page 192 of 616 REJ09B0182-0300 1 Section 9 I/O Ports 9.9 Port A Port A is an I/O port also functioning as an LCD common output pin. Figure 9.9 shows its pin configuration. Port A PA3/COM4 PA2/COM3 PA1/COM2 PA0/COM1 Figure 9.9 Port A Pin Configuration Port A has the following registers. * Port data register A (PDRA) * Port control register A (PCRA) 9.9.1 Port Data Register A (PDRA) PDRA is a register that stores data of port A. Bit Bit Name Initial Value R/W Description 7 to 4 All 1 Reserved These bits are always read as 1 and cannot be modified. 3 PA3 0 R/W 2 PA2 0 R/W 1 PA1 0 R/W 0 PA0 0 R/W If port A is read while PCRA bits are set to 1, the values stored in PDRA are read, regardless of the actual pin states. If port A is read while PCRA bits are cleared to 0, the pin states are read. Rev. 3.00 Aug 23, 2006 Page 193 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.9.2 Port Control Register A (PCRA) PCRA selects inputs/outputs in bit units for pins to be used as general I/O ports of port A. Bit Bit Name Initial Value R/W Description 7 to 4 All 1 Reserved These bits are always read as 1 and cannot be modified. 3 PCRA3 0 W 2 PCRA2 0 W 1 PCRA1 0 W 0 PCRA0 0 W Setting a PCRA bit to 1 makes the corresponding pin an output pin, while clearing the bit to 0 makes the pin an input pin. The settings in PCRA and in PDRA are valid when the corresponding pin is designated as a general I/O pin. PCRA is a write-only register. These bits are always read as 1. 9.9.3 Pin Functions The relationship between the register settings and the port functions is shown below. * PA3/COM4 pin The pin function depends on bit PCRA3 in PCRA and bits DTS1 and DTS0, bit CMX, and bits SGS3 to SGS0 in LPCR. DTS1 to DTS0, CMX x SGS3 to SGS0 PCRA3 Pin Function Other than B'000, B'010, B'10* B'0000 B'000, B'010, B'10* Other than B'0000 0 1 x 0 1 PA3 input 1 pin* PA3 output 1 pin* COM4 output pin Leave 2 open* Leave 2 open* [Legend] x: Don't care. Note: 1. The board power supply level is Vcc. 2. The board power supply level is the LCD drive power supply voltage level. Rev. 3.00 Aug 23, 2006 Page 194 of 616 REJ09B0182-0300 Section 9 I/O Ports * PA2/COM3 pin The pin function depends on bit PCRA2 in PCRA and bits DTS1 and DTS0, bit CMX, and bits SGS3 to SGS0 in LPCR. DTS1 to DTS0, CMX x SGS3 to SGS0 PCRA2 Pin Function Other than B'000, B'010 B'0000 B'000, B'010 Other than B'0000 0 1 x 0 1 PA2 input 1 pin* PA2 output 1 pin* COM3 output pin Leave 2 open* Leave 2 open* [Legend] x: Don't care. Note: 1. The board power supply level is Vcc. 2. The board power supply level is the LCD drive power supply voltage level. * PA1/COM2 pin The pin function depends on bit PCRA1 in PCRA and bits DTS1 and DTS0, bit CMX, and bits SGS3 to SGS0 in LPCR. DTS1 to DTS0, CMX x SGS3 to SGS0 PCRA1 Pin Function Other than B'000 B'0000 B'000 Other than B'0000 0 1 x 0 1 PA1 input 1 pin* PA1 output 1 pin* COM2 output pin Leave 2 open* Leave 2 open* [Legend] x: Don't care. Note: 1. The board power supply level is Vcc. 2. The board power supply level is the LCD drive power supply voltage level. * PA0/COM1 pin The pin function depends on bit PCRA0 in PCRA and bits DTS1 and DTS0, bit CMX, and bits SGS3 to SGS0 in LPCR. DTS1 to DTS0, CMX x SGS3 to SGS0 PCRA0 Pin Function [Legend] B'0000 Other than B'0000 0 1 x PA0 input pin PA0 output pin COM1 output pin x: Don't care. Rev. 3.00 Aug 23, 2006 Page 195 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.10 Port B Port B is an I/O port also functioning as an interrupt input pin, analog input pin, output pin for internal reference voltage of the A/D converter and external reference voltage of the A/D converter. Figure 9.10 shows its pin configuration. PB7/Ain1 PB6/Ain2 Port B PB5/Vref/REF ACOM PB2/AN2/IRQ3 PB1/AN1/IRQ1 PB0/AN0/IRQ0 Figure 9.10 Port B Pin Configuration Port B has the following registers. * Port data register B (PDRB) * Port mode register B (PMRB) 9.10.1 Port Data Register B (PDRB) PDRB is a register that stores data of port B. Bit Bit Name Initial Value 7 PB7 Undefined R 6 PB6 Undefined R 5 PB5 Undefined R 4 Undefined 3 Undefined 2 PB2 Undefined R 1 PB1 Undefined R 0 PB0 Undefined R R/W Rev. 3.00 Aug 23, 2006 Page 196 of 616 REJ09B0182-0300 Description Reading PDRB always gives the pin states. However, if a port B pin is selected as an analog input channel by the CH3 to CH0 bits in AMR of the A/D converter or the AIN1 and AIN0 bits in ADSSR of the A/D converter, that pin is read as 0 regardless of the input voltage. If bit 5 is selected as an external reference voltage (Vref) by the VREF1 and VREF0 bits in ADCR of the A/D converter, the pin is read as 0 regardless of the input voltage. Section 9 I/O Ports 9.10.2 Port Mode Register B (PMRB) PMRB controls the selection of the port B pin functions. Bit Bit Name Initial Value R/W Description 7 to 5 All 1 Reserved These bits are always read as 1 and cannot be modified. 4 ADTSTCHG 0 R/W TEST/ADTRG Pin Function Switch Selects whether pin TEST/ADTRG is used as TEST or as ADTRG. 0: TEST pin 1: ADTRG input pin For details on the setting of the ADTRG input pin, refer to section 18.4.2, External Trigger Input Timing. 3 1 Reserved This bit is always read as 1 and cannot be modified. 2 IRQ3 0 R/W PB2/AN2/IRQ3 Pin Function Switch Selects whether pin PB2/AN2/IRQ3 is used as PB2/AN2 or as IRQ3. 0: PB2/AN2 input pin 1: IRQ3 input pin 1 IRQ1 0 R/W PB1/AN1/IRQ1 Pin Function Switch Selects whether pin PB1/AN1/IRQ1 is used as PB1/AN1 or as IRQ1. 0: PB1/AN1 input pin 1: IRQ1 input pin 0 IRQ0 0 R/W PB0/AN0/IRQ0 Pin Function Switch Selects whether pin PB0/AN0/IRQ0 is used as PB0/AN0 or as IRQ0. 0: PB0/AN0 input pin 1: IRQ0 input pin Rev. 3.00 Aug 23, 2006 Page 197 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.10.3 Pin Functions The relationship between the register settings and the port functions is shown below. * PB7/Ain1 pin The pin function is switched as shown below according to the AIN1 and AIN2 bits in ADSSR. AIN1 and AIN2 Pin Function Other than B'01 B'01 PB7 input pin Ain1 input pin * PB6/Ain2 pin The pin function is switched as shown below according to the AIN1 and AIN2 bits in ADSSR. AIN1 and AIN2 Pin Function Other than B'10 B'10 PB6 input pin Ain2 input pin * PB5/Vref/REF pin The pin function is switched as shown below according to the VREF1 and VREF2 bits in ADCR. VREF1 and VREF2 Other than B'00 B'01 B'10, B'11 Pin Function PB5 input pin Vref input pin REF output pin Note: When these bits are set to B'10 or B'11, the PB5/Vref/REF pin functions as a REF output pin. Thus the power should not be input to the pin. If the power is input, it is short-circuited internally with the REF output and will cause a failure. * PB2/AN2/IRQ3 pin The pin function is switched as shown below according to the combination of the CH3 to CH0 bits in AMR and IRQ3 bit in PMRB. IRQ3 0 1 CH3 to CH0 Other than B'0110 B'0110 x Pin Function PB2 input pin AN2 input pin IRQ3 input pin [Legend] x: Don't care. Rev. 3.00 Aug 23, 2006 Page 198 of 616 REJ09B0182-0300 Section 9 I/O Ports * PB1/AN1/IRQ1 pin The pin function is switched as shown below according to the combination of the CH3 to CH0 bits in AMR and IRQ1 bit in PMRB. IRQ1 0 1 CH3 to CH0 Other than B'0101 B'0101 x Pin Function PB1 input pin AN1 input pin IRQ1 input pin [Legend] x: Don't care. * PB0/AN0/IRQ0 pin The pin function is switched as shown below according to the combination of the CH3 to CH0 bits in AMR and IRQ0 bit in PMRB. IRQ0 0 1 CH3 to CH0 Other than B'0100 B'0100 x Pin Function PB0 input pin AN0 input pin IRQ0 input pin [Legend] x: Don't care. Rev. 3.00 Aug 23, 2006 Page 199 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.11 Input/Output Data Inversion 9.11.1 Serial Port Control Register (SPCR) SPCR switches input/output data inversion of the RXD (IrRXD) and TXD (IrTXD) pins. Figure 9.11 shows a input/output data inversion function. SCINV0 SCINV2 RXD32 RXD31/IrRXD P31/RXD32 P41/RXD31/IrRXD SCINV1 SCINV3 P32/TXD32 P42/TXD31/IrTXD TXD32 TXD31/IrTXD Figure 9.11 Input/Output Data Inversion Function Bit Bit Name Initial Value R/W Description 7, 6 All 1 Reserved These bits are always read as 1 and cannot be modified. 5 SPC32 0 R/W P32/TXD32/SCL Pin Function Switch Selects whether pin P32/TXD32/SCL is used as P32/SCL or as TXD32. 0: P32/SCL I/O pin 1: TXD32 output pin* Note: * Set the TE32 bit in SCR32 after setting this bit to 1. 4 SPC31 0 R/W P42/TXD31/IrTXD/TMOFH Pin Function Switch Selects whether pin P42/TXD31/IrTXD/TMOFH is used as P42/TMOFH or as TXD31/IrTXD. 0: P42 I/O pin or TMOFH output pin 1: TXD31/IrTXD output pin* Note: * Set the TE bit in SCR3 after setting this bit to 1. Rev. 3.00 Aug 23, 2006 Page 200 of 616 REJ09B0182-0300 Section 9 I/O Ports Bit Bit Name Initial Value R/W Description 3 SCINV3 0 R/W TXD32 Pin Output Data Inversion Switch Specifies whether the output data polarity of the TXD32 pin is to be inverted or not. 0: TXD32 output data is not inverted 1: TXD32 output data is inverted 2 SCINV2 0 R/W RXD32 Pin Input Data Inversion Switch Specifies whether the input data polarity of the RXD32 pin is to be inverted or not. 0: RXD32 input data is not inverted 1: RXD32 input data is inverted 1 SCINV1 0 R/W TXD31/IrTXD Pin Output Data Inversion Switch Specifies whether the output data polarity of the TXD31/IrTXD pin is to be inverted or not. 0: TXD31/IrTXD output data is not inverted 1: TXD31/IrTXD output data is inverted 0 SCINV0 0 R/W RXD31/IrRXD Pin Input Data Inversion Switch Specifies whether the input data polarity of the RXD31/ IrRXD pin is to be inverted or not. 0: RXD31/IrRXD input data is not inverted 1: RXD31/IrRXD input data is inverted Note: When the serial port control register is modified, the data being input or output up to that point is inverted immediately after the modification, and an invalid data change is input or output. When modifying the serial port control register, modification must be made in a state in which data changes are invalidated. Rev. 3.00 Aug 23, 2006 Page 201 of 616 REJ09B0182-0300 Section 9 I/O Ports 9.12 9.12.1 Usage Notes How to Handle Unused Pin If an I/O pin not used by the user system is floating, pull it up or down. * If an unused pin is an input pin, it is recommended to handle it in one of the following ways: Pull it up to Vcc with an on-chip pull-up MOS. Pull it up to Vcc with an external resistor of approximately 100 k. Pull it down to Vss with an external resistor of approximately 100 k. For a pin also used by the A/D converter, pull it up to AVcc. With an external resistor of approximately 100 k. * If an unused pin is an output pin, it is recommended to handle it in one of the following ways: Set the output of the unused pin to high and pull it up to Vcc with an external resistor of approximately 100 k. Set the output of the unused pin to low and pull it down to GND with an external resistor of approximately 100 k. Rev. 3.00 Aug 23, 2006 Page 202 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) Section 10 Realtime Clock (RTC) The realtime clock (RTC) is a timer used to count time ranging from a second to a week. Interrupts can be generated ranging from 0.25 seconds to a week. Figure 10.1 shows the block diagram of the RTC. 10.1 Features * Counts seconds, minutes, hours, and day-of-week * Start/stop function * Reset function * Readable/writable counter of seconds, minutes, hours, and day-of-week with BCD codes * Periodic (0.25 seconds, 0.5 seconds, one second, minute, hour, day, and week) interrupts * 8-bit free running counter * Selection of clock source * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) PSS 32-kHz oscillator circuit RTCCSR 1/4 RMINDR RHRDR TMOW Clock count control circuit RWKDR Internal data bus RSECDR RTCCR1 RTCCR2 RTCFLG [Legend] RTCCSR: Clock source select register RSECDR: Second date register/ free running counter data register RMINDR: Minute date register RHRDR: Hour date register Interrupt control circuit RWKDR: RTCCR1: RTCCR2: RTCFLG: PSS: Interrupt Day-of-week date register RTC control register 1 RTC control register 2 RTC interrupt flag register Prescaler S Figure 10.1 Block Diagram of RTC RTC3000A_0000220040500 Rev. 3.00 Aug 23, 2006 Page 203 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) 10.2 Input/Output Pin Table 10.1 shows the RTC input/output pin. Table 10.1 Pin Configuration Name Abbreviation I/O Function Clock output TMOW Output RTC divided clock output 10.3 Register Descriptions The RTC has the following registers. * Second data register/free running counter data register (RSECDR) * Minute data register (RMINDR) * Hour data register (RHRDR) * Day-of-week data register (RWKDR) * RTC control register 1 (RTCCR1) * RTC control register 2 (RTCCR2) * Clock source select register (RTCCSR) * RTC Interrupt flag register (RTCFLG) Rev. 3.00 Aug 23, 2006 Page 204 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) 10.3.1 Second Data Register/Free Running Counter Data Register (RSECDR) RSECDR counts the BCD-coded second value. The setting range is decimal 00 to 59. It is an 8-bit read register used as a counter, when it operates as a free running counter. For more information on reading seconds, minutes, hours, and day-of-week, see section 10.4.3, Data Reading Procedure. Bit Bit Name Initial Value R/W Description 7 BSY -- R RTC Busy This bit is set to 1 when the RTC is updating (operating) the values of second, minute, hour, and day-of-week data registers. When this bit is 0, the values of second, minute, hour, and day-of-week data registers must be adopted. 6 5 4 3 2 1 0 SC12 SC11 SC10 SC03 SC02 SC01 SC00 -- -- -- -- -- -- -- R/W R/W R/W R/W R/W R/W R/W Counting Ten's Position of Seconds Counts on 0 to 5 for 60-second counting. 10.3.2 Minute Data Register (RMINDR) Counting One's Position of Seconds Counts on 0 to 9 once per second. When a carry is generated, 1 is added to the ten's position. RMINDR counts the BCD-coded minute value on the carry generated once per minute by the RSECDR counting. The setting range is decimal 00 to 59. Bit Bit Name Initial Value R/W Description 7 BSY -- R RTC Busy This bit is set to 1 when the RTC is updating (operating) the values of second, minute, hour, and day-of-week data registers. When this bit is 0, the values of second, minute, hour, and day-of-week data registers must be adopted. 6 5 4 3 2 1 0 MN12 MN11 MN10 MN03 MN02 MN01 MN00 -- -- -- -- -- -- -- R/W R/W R/W R/W R/W R/W R/W Counting Ten's Position of Minutes Counts on 0 to 5 for 60-minute counting. Counting One's Position of Minutes Counts on 0 to 9 once per minute. When a carry is generated, 1 is added to the ten's position. Rev. 3.00 Aug 23, 2006 Page 205 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) 10.3.3 Hour Data Register (RHRDR) RHRDR counts the BCD-coded hour value on the carry generated once per hour by RMINDR. The setting range is either decimal 00 to 11 or 00 to 23 by the selection of the 12/24 bit in RTCCR1. Bit Bit Name Initial Value R/W Description 7 BSY -- R RTC Busy This bit is set to 1 when the RTC is updating (operating) the values of second, minute, hour, and day-of-week data registers. When this bit is 0, the values of second, minute, hour, and day-of-week data registers must be adopted. 6 -- 0 -- Reserved This bit is always read as 0. 5 HR11 -- R/W Counting Ten's Position of Hours 4 HR10 -- R/W Counts on 0 to 2 for ten's position of hours. 3 HR03 -- R/W Counting One's Position of Hours 2 HR02 -- R/W 1 HR01 -- R/W Counts on 0 to 9 once per hour. When a carry is generated, 1 is added to the ten's position. 0 HR00 -- R/W Rev. 3.00 Aug 23, 2006 Page 206 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) 10.3.4 Day-of-Week Data Register (RWKDR) RWKDR counts the BCD-coded day-of-week value on the carry generated once per day by RHRDR. The setting range is decimal 0 to 6 using bits WK2 to WK0. Bit Bit Name Initial Value R/W Description 7 BSY -- R RTC Busy This bit is set to 1 when the RTC is updating (operating) the values of second, minute, hour, and day-of-week data registers. When this bit is 0, the values of second, minute, hour, and day-of-week data registers must be adopted. 6 to 3 -- All 0 -- Reserved These bits are always read as 0. 2 WK2 -- R/W Day-of-Week Counting 1 WK1 -- R/W Day-of-week is indicated with a binary code 0 WK0 -- R/W 000: Sunday 001: Monday 010: Tuesday 011: Wednesday 100: Thursday 101: Friday 110: Saturday 111: Setting prohibited Rev. 3.00 Aug 23, 2006 Page 207 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) 10.3.5 RTC Control Register 1 (RTCCR1) RTCCR1 controls start/stop and reset of the clock timer. For the definition of time expression, see figure 10.2. Bit Bit Name Initial Value R/W Description 7 RUN -- R/W RTC Operation Start 0: Stops RTC operation 1: Starts RTC operation 6 12/24 -- R/W Operating Mode 0: RTC operates in 12-hour mode. RHRDR counts on 0 to 11. 1: RTC operates in 24-hour mode. RHRDR counts on 0 to 23. 5 PM -- R/W A.m./P.m. 0: Indicates a.m. when RTC is in the 12-hour mode. 1: Indicates p.m. when RTC is in the 12-hour mode. 4 RST 0 R/W Reset 0: Normal operation 1: Resets registers and control circuits except RTCCSR and this bit. Clear this bit to 0 after having been set to 1. 3 -- 0 R/W Reserved Only 0 can be written to this bit. 2 to 0 -- All 0 -- Reserved These bits are always read as 0. Noon 24-hour count 0 12-hour count 0 PM 1 1 2 2 3 3 4 4 5 6 7 5 6 7 0 (Morning) 8 8 9 10 11 12 13 14 15 16 17 9 10 11 0 1 2 3 4 5 1 (Afternoon) 24-hour count 18 19 20 21 22 23 0 12-hour count 6 7 8 9 10 11 0 1 (Afternoon) 0 PM Figure 10.2 Definition of Time Expression Rev. 3.00 Aug 23, 2006 Page 208 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) 10.3.6 RTC Control Register 2 (RTCCR2) RTCCR2 controls RTC periodic interrupts of week, day, hour, minute, one second, 0.5 seconds, and 0.25 seconds. Enabling interrupts of week, day, hour, minute, one second, 0.5 seconds, and 0.25 seconds sets the corresponding flag to 1 in the RTC interrupt flag register (RTCFLG) when an interrupt occurs. It also controls an overflow interrupt of a free running counter when RTC operates as a free running counter. Bit Bit Name Initial Value R/W Description 7 FOIE -- R/W Free Running Counter Overflow Interrupt Enable 0: Disables an overflow interrupt 1: Enables an overflow interrupt 6 WKIE -- R/W Week Periodic Interrupt Enable 0: Disables a week periodic interrupt 1: Enables a week periodic interrupt 5 DYIE -- R/W Day Periodic Interrupt Enable 0: Disables a day periodic interrupt 1: Enables a day periodic interrupt 4 HRIE -- R/W Hour Periodic Interrupt Enable 0: Disables an hour periodic interrupt 1: Enables an hour periodic interrupt 3 MNIE -- R/W Minute Periodic Interrupt Enable 0: Disables a minute periodic interrupt 1: Enables a minute periodic interrupt 2 1SEIE -- R/W One-Second Periodic Interrupt Enable 0: Disables a one-second periodic interrupt 1: Enables a one-second periodic interrupt 1 05SEIE -- R/W 0.5-Second Periodic Interrupt Enable 0: Disables a 0.5-second periodic interrupt 1: Enables a 0.5-second periodic interrupt 0 025SEIE -- R/W 0.25-Second Periodic Interrupt Enable 0: Disables a 0.25-second periodic interrupt 1: Enables a 0.25-second periodic interrupt Rev. 3.00 Aug 23, 2006 Page 209 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) 10.3.7 Clock Source Select Register (RTCCSR) RTCCSR selects clock source. A free running counter controls start/stop of counter operation by the RUN bit in RTCCR1. When a clock other than w/4 is selected, the RTC is disabled and operates as an 8-bit free running counter. When the RTC operates as an 8-bit free running counter, RSECDR enables counter values to be read. An interrupt can be generated by setting 1 to the FOIE bit in RTCCR2 and enabling an overflow interrupt of the free running counter. A clock in which the system clock is divided by 32, 16, 8, or 4 is output in active or sleep mode. Bit Bit Name Initial Value R/W Description 7 -- 0 -- Reserved 6 RCS6 0 R/W Clock Output Selection 5 RCS5 0 R/W 4 SUB32K 0 R/W Select a clock output from the TMOW pin when setting the TMOW bit in PMR3 to 1. This bit is always read as 0. 000: /4 010: /8 100: /16 110: /32 xx1: w 3 RCS3 1 R/W Clock Source Selection 2 RCS2 0 R/W 0000: /8 Free running counter operation 1 RCS1 0 R/W 0001: /32 Free running counter operation 0 RCS0 0 R/W 0010: /128 Free running counter operation 0011: /256 Free running counter operation 0100: /512 Free running counter operation 0101: /2048 Free running counter operation 0110: /4096 Free running counter operation 0111: /8192 Free running counter operation 1000: w/4 RTC operation Settings other than the above are prohibited. [Legend] x: Don't care. Rev. 3.00 Aug 23, 2006 Page 210 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) 10.3.8 RTC Interrupt Flag Register (RTCFLG) RTCFLG sets the corresponding flag when an interrupt occurs. Each flag is not cleared automatically even if the interrupt is accepted. To clear the flag, 0 should be written to the flag. Bit Bit Name Initial Value R/W Description 7 FOIFG R/W* 6 WKIFG R/W* 5 DYIFG R/W* 4 HRIFG R/W* 3 MNIFG R/W* 2 SEIFG R/W* 1 05SEIFG R/W* 0 025SEIFG R/W* [Setting condition] When a free running counter overflows [Clearing condition] 0 is written to FOIFG when FOIFG = 1 [Setting condition] When a week periodic interrupt occurs [Clearing condition] 0 is written to WKIFG when WKIFG = 1 [Setting condition] When a day periodic interrupt occurs [Clearing condition] 0 is written to DYIFG when DYIFG = 1 [Setting condition] When an hour periodic interrupt occurs [Clearing condition] 0 is written to HRIFG when HRIFG = 1 [Setting condition] When a minute periodic interrupt occurs [Clearing condition] 0 is written to MNIFG when MNIFG = 1 [Setting condition] When a one-second periodic interrupt occurs [Clearing condition] 0 is written to SEIFG when SEIFG = 1 [Setting condition] When a 0.5-second periodic interrupt occurs [Clearing condition] 0 is written to 05SEIFG when 05SEIFG = 1 [Setting condition] When a 0.25-second periodic interrupt occurs [Clearing condition] 0 is written to 025SEIFG when 025SEIFG = 1 Note: * Only 0 can be written to clear the flag. Rev. 3.00 Aug 23, 2006 Page 211 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) 10.4 Operation 10.4.1 Initial Settings of Registers after Power-On The RTC registers that store second, minute, hour, and day-of week data are not reset by a RES input. Therefore, all registers must be set to their initial values after power-on. 10.4.2 Initial Setting Procedure Figure 10.3 shows the procedure for the initial setting of the RTC. To set the RTC again, also follow this procedure. RUN in RTCCR1 = 0 RST in RTCCR1 = 1 RST in RTCCR1 = 0 Set RTCCSR, RSECDR, RMINDR, RHRDR, RWKDR, 12/24 in RTCCR1, and PM RUN in RTCCR1 = 1 RTC operation is stopped. RTC registers and clock count controller are reset. Clock output and clock source are selected and second, minute, hour, day-of-week, operating mode, and a.m/p.m are set. RTC operation is started. Figure 10.3 Initial Setting Procedure Rev. 3.00 Aug 23, 2006 Page 212 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) 10.4.3 Data Reading Procedure When the seconds, minutes, hours, or day-of-week datum is updated while time data is being read, the data obtained may not be correct, and so the time data must be read again. Figure 10.4 shows an example in which correct data is not obtained. In this example, since only RSECDR is read after data update, about 1-minute inconsistency occurs. To avoid reading in this timing, the following processing must be performed. 1. Check the setting of the BSY bit, and when the BSY bit changes from 1 to 0, read from the second, minute, hour, and day-of-week registers. When about 62.5 ms is passed after the BSY bit is set to 1, the registers are updated, and the BSY bit is cleared to 0. 2. Making use of interrupts, read from the second, minute, hour, and day-of week registers after the corresponding flag of RTCFLG is set to 1 and the BSY bit is confirmed to be 0. 3. Read from the second, minute, hour, and day-of week registers twice in a row, and if there is no change in the read data, the read data is used. Before update RWKDR = H'03, RHDDR = H'13, RMINDR = H'46, RSECDR = H'59 Processing flow BSY bit = 0 (1) Day-of-week data register read H'03 (2) Hour data register read H'13 (3) Minute data register read H'46 BSY bit -> 1 (under data update) After update RWKDR = H'03, RHDDR = H'13, RMINDR = H'47, RSECDR = H'00 BSY bit -> 0 (4) Second data register read H'00 Figure 10.4 Example: Reading of Inaccurate Time Data Rev. 3.00 Aug 23, 2006 Page 213 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) 10.5 Interrupt Sources There are eight kinds of RTC interrupts: a free-running counter overflow, week interrupt, day interrupt, hour interrupt, minute interrupt, one-second interrupt, 0.5-second interrupt, and 0.25second interrupt. When using an interrupt, initiate the RTC last after other registers are set. When an interrupt request of the RTC occurs, the corresponding flag in RTCFLG is set to 1. When clearing the flag, write 0. Table 10.2 shows a interrupt sources. Table 10.2 Interrupt Sources Interrupt Name Interrupt Source Interrupt Enable Bit Overflow interrupt Occurs when the free running counter is overflown. FOIE Week periodic interrupt Occurs every week when the day-of-week date WKIE register value becomes 0. Day periodic interrupt Occurs every day when the day-of-week date register is counted. Hour periodic interrupt Occurs every hour when the hour date register HRIE is counted. Minute periodic interrupt Occurs every minute when the minute date register is counted. MNIE One-second periodic interrupt Occurs every second when the one-second date register is counted. 1SEIE 0.5-second periodic interrupt Occurs every 0.5 seconds. 05SEIE 0.25-second periodic interrupt Occurs every 0.25 seconds. 025SEIE Rev. 3.00 Aug 23, 2006 Page 214 of 616 REJ09B0182-0300 DYIE Section 10 Realtime Clock (RTC) 10.6 Usage Note 10.6.1 Note on Clock Count The subclock must be connected to the 32.768-kHz resonator. When the 38.4-kHz resonator etc. is connected, the correct time count is not possible. 10.6.2 Notes on Using Interrupts The RTC register is not initialized by a reset trigged by the RES pin, the power-on reset circuit, or a WDT overflow. As a result, its contents are undefined after power-on. Therefore, when using the RTC interrupt, always initialize the RTC register before setting IENRTC in IENR1 to 1. Rev. 3.00 Aug 23, 2006 Page 215 of 616 REJ09B0182-0300 Section 10 Realtime Clock (RTC) Rev. 3.00 Aug 23, 2006 Page 216 of 616 REJ09B0182-0300 Section 11 Timer F Section 11 Timer F The timer F is a 16-bit timer having an output compare function. The timer F also provides for external event counting, and counter resetting, interrupt request generation, toggle output, etc., using compare match signals. Thus, it can be applied to various systems. The timer F can also be used as two independent 8-bit timers (timer FH and timer FL). Figure 11.1 shows a block diagram of the timer F. 11.1 Features * Choice of five counter input clocks Internal clocks (/32, /16, /4, and W/4) or external clocks can be selected. * Toggle output function Toggle output is performed to the TMOFH or TMOFL pin using a compare match signal. The initial value of toggle output can be set. * Counter resetting by a compare match signal * Two interrupt sources: One compare match, one overflow * Choice of 16-bit or 8-bit mode by settings of bits CKSH2 to CKSH0 in TCRF * Can operate in watch mode, subactive mode, and subsleep mode When W/4 is selected as an internal clock, the timer F can operate in watch mode, subactive mode, and subsleep mode. * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) Rev. 3.00 Aug 23, 2006 Page 217 of 616 REJ09B0182-0300 Section 11 Timer F PSS IRRTFL TCRF W/4 TMIF TCFL Toggle circuit Comparator Internal data bus TMOFL OCRFL TCFH Toggle circuit TMOFH Comparator [Legend] TCRF: TCSRF: TCFH: TCFL: OCRFH: OCRFL: IRRTFH: IRRTFL: PSS: OCRFH Timer control register F Timer control status register F 8-bit timer counter FH 8-bit timer counter FL Output compare register FH Output compare register FL Timer FH interrupt request flag Timer FL interrupt request flag Prescaler S TCSRF IRRTFH Figure 11.1 Block Diagram of Timer F 11.2 Input/Output Pins Table 11.1 shows the input/output pins of the timer F. Table 11.1 Pin Configuration Name Abbreviation I/O Function Timer F event input TMIF Input Event input pin to TCFL Timer FH output TMOFH Output Timer FH toggle output pin Timer FL output TMOFL Output Timer FL toggle output pin Rev. 3.00 Aug 23, 2006 Page 218 of 616 REJ09B0182-0300 Match Section 11 Timer F 11.3 Register Descriptions The timer F has the following registers. * Timer counters FH and FL (TCFH, TCFL) * Output compare registers FH and FL (OCRFH, OCRFL) * Timer control register F (TCRF) * Timer control/status register F (TCSRF) 11.3.1 Timer Counters FH and FL (TCFH, TCFL) TCF is a 16-bit read/write up-counter configured by cascaded connection of 8-bit timer counters TCFH and TCFL. In addition to the use of TCF as a 16-bit counter with TCFH as the upper 8 bits and TCFL as the lower 8 bits, TCFH and TCFL can also be used as independent 8-bit counters. TCFH and TCFL are initialized to H'00 upon a reset. (1) 16-Bit Mode (TCF) When CKSH2 is cleared to 0 in TCRF, TCF operates as a 16-bit counter. The TCF input clock is selected by bits CKSL2 to CKSL0 in TCRF. TCF can be cleared in the event of a compare match by means of CCLRH in TCSRF. When TCF overflows from H'FFFF to H'0000, OVFH is set to 1 in TCSRF. If OVIEH in TCSRF is 1 at this time, IRRTFH is set to 1 in IRR2, and if IENTFH in IENR2 is 1, an interrupt request is sent to the CPU. (2) 8-Bit Mode (TCFH/TCFL) When CKSH2 is set to 1 in TCRF, TCFH and TCFL operate as two independent 8-bit counters. The TCFH (TCFL) input clock is selected by bits CKSH2 to CKSH0 (CKSL2 to CKSL0) in TCRF. TCFH (TCFL) can be cleared in the event of a compare match by means of CCLRH (CCLRL) in TCSRF. When TCFH (TCFL) overflows from H'FF to H'00, OVFH (OVFL) is set to 1 in TCSRF. If OVIEH (OVIEL) in TCSRF is 1 at this time, IRRTFH (IRRTFL) is set to 1 in IRR2, and if IENTFH (IENTFL) in IENR2 is 1, an interrupt request is sent to the CPU. Rev. 3.00 Aug 23, 2006 Page 219 of 616 REJ09B0182-0300 Section 11 Timer F 11.3.2 Output Compare Registers FH and FL (OCRFH, OCRFL) OCRF is a 16-bit read/write register composed of the two registers OCRFH and OCRFL. In addition to the use of OCRF as a 16-bit register with OCRFH as the upper 8 bits and OCRFL as the lower 8 bits, OCRFH and OCRFL can also be used as independent 8-bit registers. (1) 16-Bit Mode (OCRF) When CKSH2 is cleared to 0 in TCRF, OCRF operates as a 16-bit register. OCRF contents are constantly compared with TCF, and when both values match, CMFH is set to 1 in TCSRF. At the same time, IRRTFH is set to 1 in IRR2. If IENTFH in IENR2 is 1 at this time, an interrupt request is sent to the CPU. Toggle output can be provided from the TMOFH pin by means of compare matches, and the output level can be set by means of the TOLH bit in TCRF. (2) 8-Bit Mode (OCRFH/OCRFL) When CKSH2 is set to 1 in TCRF, OCRFH and OCRFL operate as two independent 8-bit registers. OCRFH contents are compared with TCFH, and OCRFL contents are with TCFL. When the OCRFH (OCRFL) and TCFH (TCFL) values match, CMFH (CMFL) is set to 1 in TCSRF. At the same time, IRRTFH (IRRTFL) is set to 1 in IRR2. If IENTFH (IENTFL) in IENR2 is 1 at this time, an interrupt request is sent to the CPU. Toggle output can be provided from the TMOFH pin (TMOFL pin) by means of compare matches, and the output level can be set by means of the TOLH (TOLL) bit in TCRF. Rev. 3.00 Aug 23, 2006 Page 220 of 616 REJ09B0182-0300 Section 11 Timer F 11.3.3 Timer Control Register F (TCR) TCRF switches between 16-bit mode and 8-bit mode, selects the input clock from among four internal clock sources, and selects the output level of the TMOFH and TMOFL pins. Bit Bit Name Initial Value R/W Description 7 TOLH 0 W Toggle Output Level H Sets the TMOFH pin output level. 0: Low level 1: High level 6 5 4 CKSH2 CKSH1 CKSH0 0 0 0 W W W Clock Select H Select the clock input to TCFH from among four internal clock sources or TCFL overflow. 000: 16-bit mode, counting on TCFL overflow signal 001: 16-bit mode, counting on TCFL overflow signal 010: 16-bit mode, counting on TCFL overflow signal 011: Using prohibited 100: 8-bit mode, counting on /32 101: 8-bit mode, counting on /16 110: 8-bit mode, counting on /4 111: 8-bit mode, counting on W/4 3 TOLL 0 W Toggle Output Level L Sets the TMOFL pin output level. 0: Low level 1: High level Rev. 3.00 Aug 23, 2006 Page 221 of 616 REJ09B0182-0300 Section 11 Timer F Bit Bit Name Initial Value R/W Description 2 1 0 CKSL2 CKSL1 CKSL0 0 0 0 W W W Clock Select L Select the clock input to TCFL from among four internal clock sources or external event input. 000: Counting on a rising or falling edge of an external event (TMIF pin)* 001: Counting on a rising or falling edge of an external event (TMIF pin)* 010: Counting on a rising or falling edge of an external event (TMIF pin)* 011: Using prohibited 100: Internal clock: counting on /32 101: Internal clock: counting on /16 110: Internal clock: counting on /4 111: Internal clock: counting on W/4 Note: 11.3.4 * The TMIFEG bit in IEGR selects which edge of an external event is used for counting. Timer Control/Status Register F (TCSRF) TCSRF performs counter clear selection, overflow flag setting, and compare match flag setting, and controls enabling of overflow interrupt requests. Bit Bit Name Initial Value R/W Description 7 OVFH 0 R/W* Timer Overflow Flag H [Setting condition] When TCFH overflows from H'FF to H'00 [Clearing condition] When this bit is written to 0 after reading OVFH = 1 6 CMFH 0 R/W* Compare Match Flag H This is a status flag indicating that TCFH has matched OCRFH. [Setting condition] When the TCFH value matches the OCRFH value [Clearing condition] When this bit is written to 0 after reading CMFH = 1 Rev. 3.00 Aug 23, 2006 Page 222 of 616 REJ09B0182-0300 Section 11 Timer F Bit Bit Name Initial Value R/W Description 5 OVIEH 0 R/W Timer Overflow Interrupt Enable H Selects enabling or disabling of interrupt generation when TCFH overflows. 0: TCFH overflow interrupt request is disabled 1: TCFH overflow interrupt request is enabled 4 CCLRH 0 R/W Counter Clear H In 16-bit mode, this bit selects whether TCF is cleared when TCF and OCRF match. In 8-bit mode, this bit selects whether TCFH is cleared when TCFH and OCRFH match. In 16-bit mode: 0: TCF clearing by compare match is disabled 1: TCF clearing by compare match is enabled In 8-bit mode: 0: TCFH clearing by compare match is disabled 1: TCFH clearing by compare match is enabled 3 OVFL 0 R/W* Timer Overflow Flag L This is a status flag indicating that TCFL has overflowed. [Setting condition] When TCFL overflows from H'FF to H'00 [Clearing condition] When this bit is written to 0 after reading OVFL = 1 2 CMFL 0 R/W* Compare Match Flag L This is a status flag indicating that TCFL has matched OCRFL. [Setting condition] When the TCFL value matches the OCRFL value [Clearing condition] When this bit is written to 0 after reading CMFL = 1 Rev. 3.00 Aug 23, 2006 Page 223 of 616 REJ09B0182-0300 Section 11 Timer F Bit Bit Name Initial Value R/W Description 1 OVIEL 0 R/W Timer Overflow Interrupt Enable L Selects enabling or disabling of interrupt generation when TCFL overflows. 0: TCFL overflow interrupt request is disabled 1: TCFL overflow interrupt request is enabled 0 CCLRL 0 R/W Counter Clear L Selects whether TCFL is cleared when TCFL and OCRFL match. 0: TCFL clearing by compare match is disabled 1: TCFL clearing by compare match is enabled Note: * 11.4 Only 0 can be written to clear the flag. Operation The timer F is a 16-bit counter that increments on each input clock pulse. The timer F value is constantly compared with the value set in the output compare register F, and the counter can be cleared, an interrupt requested, or port output toggled, when the two values match. The timer F can also be used as two independent 8-bit timers. 11.4.1 Timer F Operation The timer F has two operating modes, 16-bit timer mode and 8-bit timer mode. The operation in each of these modes is described below. (1) Operation in 16-Bit Timer Mode When the CKSH2 bit is cleared to 0 in TCRF, the timer F operates as a 16-bit timer. Following a reset, TCF is initialized to H'0000, OCRF to H'FFFF, and TCRF and TCSRF to H'00. The counter is incremented by an input signal from an external event (TMIF pin). The TMIFEG bit in IEGR selects which edge of an external event is used for counting. The timer F operating clock can be selected from internal clocks or external events according to settings of bits CKSL2 to CKSL0 in TCRF. OCRF contents are constantly compared with TCF, and when both values match, CMFH is set to 1 in TCSRF. If IENTFH in IENR2 is 1 at this time, an interrupt request is sent to the CPU, and at Rev. 3.00 Aug 23, 2006 Page 224 of 616 REJ09B0182-0300 Section 11 Timer F the same time, TMOFH pin output is toggled. If CCLRH in TCSRF is 1, TCF is cleared. The output level of the TMOFH pin can be set by the TOLH bit in TCRF. When TCF overflows from H'FFFF to H'0000, OVFH is set to 1 in TCSRF. If OVIEH in TCSRF and IENTFH in IENR2 are both 1, an interrupt request is sent to the CPU. (2) Operation in 8-Bit Timer Mode When CKSH2 is set to 1 in TCRF, TCF operates as two independent 8-bit timers, TCFH and TCFL. The TCFH/TCFL input clock is selected by CKSH2 to CKSH0/CKSL2 to CKSL0 in TCRF. When the OCRFH/OCRFL and TCFH/TCFL values match, CMFH/CMFL is set to 1 in TCSRF. If IENTFH/IENTFL in IENR2 is 1, an interrupt request is sent to the CPU, and at the same time, TMOFH pin/TMOFL pin output is toggled. If CCLRH/CCLRL in TCSRF is 1, TCFH/TCFL is cleared. The output level of the TMOFH pin/TMOFL pin can be set by TOLH/TOLL in TCRF. When TCFH/TCFL overflows from H'FF to H'00, OVFH/OVFL is set to 1 in TCSRF. If OVIEH/OVIEL in TCSRF and IENTFH/IENTFL in IENR2 are both 1, an interrupt request is sent to the CPU. 11.4.2 (1) TCF Increment Timing Internal Clock Operation TCF is incremented by internal clock or external event input. Bits CKSH2 to CKSH0 or CKSL2 to CKSL0 in TCRF select one of internal clock sources (/32, /16, /4, or W/4) created by dividing the system clock ( or W). (2) External Event Operation When the CKSL2 bit in TCRF is cleared to 0, external event input is selected. The counter is incremented at both rising and falling edges of external events. The TMIFEG bit in IEGR selects which edge of an external event is used for counting. The external event pulse width requires clock time longer than 2 system clocks (), or 2 subclocks (SUB), depending on the operating mode. Note that an external event does not operate correctly with the lower pulse width. Rev. 3.00 Aug 23, 2006 Page 225 of 616 REJ09B0182-0300 Section 11 Timer F 11.4.3 TMOFH/TMOFL Output Timing In TMOFH/TMOFL output, the value set in TOLH/TOLL in TCRF is output. The output is toggled by the occurrence of a compare match. Figure 11.2 shows the output timing. TMIF (TMIFEG = 1) Count input clock N TCF OCRF N+1 N N N Compare match signal TMOFH, TMOFL Figure 11.2 TMOFH/TMOFL Output Timing 11.4.4 TCF Clear Timing TCF can be cleared by a compare match with OCRF. 11.4.5 Timer Overflow Flag (OVF) Set Timing OVF is set to 1 when TCF overflows from H'FFFF to H'0000. Rev. 3.00 Aug 23, 2006 Page 226 of 616 REJ09B0182-0300 N+1 Section 11 Timer F 11.4.6 Compare Match Flag Set Timing The compare match flag (CMFH or CMFL) is set to 1 when the TCF and OCRF values match. The compare match signal is generated in the last state during which the values match (when TCF is updated from the matching value to a new value). When TCF matches OCRF, the compare match signal is not generated until the next counter clock. 11.5 Timer F Operating States The timer F operating states are shown in table 11.2. Table 11.2 Timer F Operating States Operating Mode Reset Active Sleep Watch Sub-active Sub-sleep Standby Module Standby TCF Reset Functions* Functions* Functions/ Functions/ Functions/ Halted Halted Halted* Halted* Halted* OCRF Reset Functions Retained Retained Functions Retained Retained Retained TCRF Reset Functions Retained Retained Functions Retained Retained Retained TCSRF Reset Functions Retained Retained Functions Retained Retained Retained Note: * When W/4 is selected as the TCF internal clock in active mode or sleep mode, since the system clock and internal clock are mutually asynchronous, synchronization is maintained by a synchronization circuit. This results in a maximum count cycle error of 1/ (s). When the counter is operated in subactive mode, watch mode, or subsleep mode, W /4 must be selected as the internal clock. The counter will not operate if any other internal clock is selected. Rev. 3.00 Aug 23, 2006 Page 227 of 616 REJ09B0182-0300 Section 11 Timer F 11.6 Usage Notes The following types of contention and operation can occur when the timer F is used. 11.6.1 16-Bit Timer Mode In toggle output, TMOFH pin output is toggled when all 16 bits match and a compare match signal is generated. If a TCRF write by a MOV instruction and generation of the compare match signal occur simultaneously, TOLH data is output to the TMOFH pin as a result of the TCRF write. TMOFL pin output is unstable in 16-bit mode, and should not be used; the TMOFL pin should be used as a port pin. If an OCRFL write and compare match signal generation occur simultaneously, the compare match signal is invalid. However, a compare match signal may or may not be generated when the written data and the counter value match. As the compare match signal is output in synchronization with the TCFL clock, a compare match will not result in compare match signal generation if the clock is stopped. Compare match flag CMFH is set when all 16 bits match and a compare match signal is generated. Compare match flag CMFL is set if the setting conditions for the lower 8 bits are satisfied. When TCF overflows, OVFH is set. OVFL is set if the setting conditions are satisfied when the lower 8 bits overflow. If a TCFL write and overflow signal output occur simultaneously, the overflow signal is not output. 11.6.2 (1) 8-Bit Timer Mode TCFH, OCRFH In toggle output, TMOFH pin output is toggled when a compare match occurs. If a TCRF write by a MOV instruction and generation of the compare match signal occur simultaneously, TOLH data is output to the TMOFH pin as a result of the TCRF write. If an OCRFH write and compare match signal generation occur simultaneously, the compare match signal is invalid. However, a compare match signal may or may not be generated when the written data and the counter value match. The compare match signal is output in synchronization with the TCFH clock. If a TCFH write and overflow signal output occur simultaneously, the overflow signal is not output. Rev. 3.00 Aug 23, 2006 Page 228 of 616 REJ09B0182-0300 Section 11 Timer F (2) TCFL, OCRFL In toggle output, TMOFL pin output is toggled when a compare match occurs. If a TCRF write by a MOV instruction and generation of the compare match signal occur simultaneously, TOLL data is output to the TMOFL pin as a result of the TCRF write. If an OCRFL write and compare match signal generation occur simultaneously, the compare match signal is invalid. However, a compare match signal may or may not be generated when the written data and the counter value match. As the compare match signal is output in synchronization with the TCFL clock, a compare match will not result in compare match signal generation if the clock is stopped. If a TCFL write and overflow signal output occur simultaneously, the overflow signal is not output. 11.6.3 Flag Clearing When W/4 is selected as the internal clock, "Interrupt source generation signal" will be operated with W and the signal will be outputted with W width. And, "Overflow signal" and "Compare match signal" are controlled with 2 cycles of W signals. Those signals are output with 2-cycle width of W (figure 11.3) In active (high-speed, medium-speed) mode, even if you cleared interrupt request flag during the term of validity of "Interrupt source generation signal", same interrupt request flag is set. (1 in figure 11.3) And, the timer overflow flag and compare match flag cannot be cleared during the term of validity of "Overflow signal" and "Compare match signal". For interrupt request flag is set right after interrupt request is cleared, interrupt process to one time timer FH, timer FL interrupt might be repeated. (2 in figure 11.3) Therefore, to definitely clear interrupt request flag in active (high-speed, medium-speed) mode, clear should be processed after the time that calculated with below (1) formula. And, to definitely clear timer overflow flag and compare match flag, clear should be processed after read timer control status register F (TCSRF) after the time that calculated with below (1) formula. For ST of (1) formula, please substitute the longest number of execution states in used instruction. In subactive mode, there are not limitation for interrupt request flag, timer overflow flag, and compare match flag clear. Rev. 3.00 Aug 23, 2006 Page 229 of 616 REJ09B0182-0300 Section 11 Timer F The term of validity of "Interrupt source generation signal" = 1 cycle of W + waiting time for completion of executing instruction + interrupt time synchronized with = 1/W + ST x (1/) + (2/) (second).....(1) ST: Executing number of execution states Method 1 is recommended to operate for time efficiency. Method 1 1. Prohibit interrupt in interrupt handling routine (set IENFH, IENFL to 0). 2. After program process returned normal handling, clear interrupt request flags (IRRTFH, IRRTFL) after more than that calculated with (1) formula. 3. After reading the timer control status register F (TCSRF), clear the timer overflow flags (OVFH, OVFL) and compare match flags (CMFH, CMFL). 4. Enable interrupts (set IENFH, IENFL to 1). Method 2 1. Set interrupt handling routine time to more than time that calculated with (1) formula. 2. Clear interrupt request flags (IRRTFH, IRRTFL) at the end of interrupt handling routine. 3. After read timer control status register F (TCSRF), clear timer overflow flags (OVFH, OVFL) and compare match flags (CMFH, CMFL). All above attentions are also applied in 16-bit mode and 8-bit mode. Rev. 3.00 Aug 23, 2006 Page 230 of 616 REJ09B0182-0300 Section 11 Timer F Interrupt request flag clear 2 Program processing Interrupt Interrupt request flag clear Interrupt Normal W Interrupt source generation signal (internal signal, nega-active) Overflow signal, compare match signal (internal signal, nega-active) Interrupt request flag (IRRTFH, IRRTFL) 1 Figure 11.3 Clear Interrupt Request Flag when Interrupt Source Generation Signal is Valid 11.6.4 Timer Counter (TCF) Read/Write When W/4 is selected as the internal clock in active (high-speed, medium-speed) mode, write on TCF is impossible. And when reading TCF, as the system clock and internal clock are mutually asynchronous, TCF synchronizes with synchronization circuit. This results in a maximum TCF read value error of 1. When reading or writing TCF in active (high-speed, medium-speed) mode is needed, please select the internal clock except for W/4 before read/write is performed. In subactive mode, even if W /4 is selected as the internal clock, TCF can be read from or written to normally. Rev. 3.00 Aug 23, 2006 Page 231 of 616 REJ09B0182-0300 Section 11 Timer F Rev. 3.00 Aug 23, 2006 Page 232 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Section 12 16-Bit Timer Pulse Unit (TPU) The H8/38086R Group have an on-chip 16-bit timer pulse unit (TPU) comprised of two 16-bit timer channels. The function list of the TPU is shown in table 12.1. A block diagram of the TPU is shown in figure 12.1. 12.1 Features * Maximum 4-pulse input/output * Selection of 7 or 8 counter input clocks for each channel * The following operations can be set for each channel: Waveform output at compare match Input capture function Counter clear operation Multiple timer counters (TCNT) can be written to simultaneously Simultaneous clearing by compare match and input capture is possible Register synchronous input/output is possible by synchronous counter operation PWM output with any duty level is possible A maximum 2-phase PWM output is possible in combination with synchronous operation * Operation with cascaded connection * Fast access via internal 16-bit bus * 6-type interrupt sources * Register data can be transmitted automatically * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) TIMTPU3B_000020020700 Rev. 3.00 Aug 23, 2006 Page 233 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Table 12.1 TPU Functions Item Channel 1 Channel 2 Count clock /1 /4 /16 /64 /256 TCLKA TCLKB /1 /4 /16 /64 /1024 TCLKA TCLKB TCLKC General registers (TGR) TGRA_1 TGRB_1 TGRA_2 TGRB_2 I/O pins TIOCA1 TIOCB1 TIOCA2 TIOCB2 Counter clear function TGR compare match or input capture TGR compare match or input capture Compare match output 0 output O -- 1 output O -- Toggle output O -- Input capture function O O Synchronous operation O O PWM mode O 3 sources O 3 sources * Compare match or input capture 1A * Compare match or input capture 2A * Compare match or input capture 1B * Compare match or input capture 2B * Overflow * Overflow Interrupt sources Rev. 3.00 Aug 23, 2006 Page 234 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) TGRB TGRB TCNT TCNT TGRA TSR Module data bus TIER TIER TSR TIOR TIOR TGRA Bus interface Internal data bus TSTR Control logic TMDR Channel 2 TCR TMDR Common [Legend] TSTR: Timer start register TSYR: Timer synchro register TCR: Timer control register TMDR: Timer mode register TCNT: Timer counter Channel 1 Input pins Channel 1: TIOCB1 Channel 2: TIOCB2 TCR Input/output pins Channel 1: TIOCA1 Channel 2: TIOCA2 Control logic for channels 1 and 2 External clock: /4 /16 /64 /256 /1024 TCLKA TCLKB TCLKC TSYR Clock input Internal clock: /1 Interrupt request signals Channel 1: TGI1A TGI1B TCI1V Channel 2: TGI2A TGI2B TCI2V TIOR: Timer I/O control registers TIER: Timer interrupt enable register TSR: Timer status register TGR (A, B): TImer general registers (A, B) Figure 12.1 Block Diagram of TPU 12.2 Input/Output Pins Table 12.2 Pin Configuration Channel Symbol I/O Function Common TCLKA Input External clock A input pin TCLKB Input External clock B input pin TCLKC Input External clock C input pin TIOCA1 I/O TGRA_1 input capture input/output compare output/PWM output pin TIOCB1 Input TGRB_1 input capture input TIOCA2 I/O TGRA_2 input capture input/output compare output/PWM output pin TIOCB2 Input TGRB_2 input capture input 1 2 Rev. 3.00 Aug 23, 2006 Page 235 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.3 Register Descriptions The TPU has the following registers for each channel. Channel 1: * Timer control register_1 (TCR_1) * Timer mode register_1 (TMDR_1) * Timer I/O control register_1 (TIOR_1) * Timer interrupt enable register_1 (TIER_1) * Timer status register_1 (TSR_1) * Timer counter_1 (TCNT_1) * Timer general register A_1 (TGRA_1) * Timer general register B_1 (TGRB_1) Channel 2: * Timer control register_2 (TCR_2) * Timer mode register_2 (TMDR_2) * Timer I/O control register_2 (TIOR_2) * Timer interrupt enable register_2 (TIER_2) * Timer status register_2 (TSR_2) * Timer counter_2 (TCNT_2) * Timer general register A_2 (TGRA_2) * Timer general register B_2 (TGRB_2) Common: * Timer start register (TSTR) * Timer synchro register (TSYR) Rev. 3.00 Aug 23, 2006 Page 236 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.3.1 Timer Control Register (TCR) TCR controls TCNT operation for each channel. The TPU has a total of two TCR registers, one for each channel. TCR should be set when TCNT operation is stopped. Bit Bit Name Initial Value R/W Description 7 0 Reserved 6 CCLR1 0 R/W Counter Clear 1 and 0 5 CCLR0 0 R/W These bits select the TCNT counter clearing source. See table 12.3 for details. 4 CKEG1 0 R/W Clock Edge 1 and 0 3 CKEG0 0 R/W These bits select the input clock edge. When the internal clock is counted using both edges, the input clock period is halved (e.g. /4 both edges = /2 rising edge). Internal clock edge selection is valid when the input clock is /4 or slower. If the input clock is /1, this setting is ignored and count at a rising edge is selected. This bit is always read as 0 and cannot be modified. 00: Count at rising edge 01: Count at falling edge 1X: Count at both edges [Legend] X: Don't care 2 TPSC2 0 R/W Timer Prescaler 2 to 0 1 TPSC1 0 R/W 0 TPSC0 0 R/W These bits select the TCNT counter clock. The clock source can be selected independently for each channel. See tables12.4 and 12.5 for details. Rev. 3.00 Aug 23, 2006 Page 237 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Table 12.3 CCLR1 and CCLR0 (Channels 1 and 2) Channel Bit 6 CCLR1 Bit 5 CCLR0 Description 1, 2 0 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation* 1 Note: * Synchronous operation is selected by setting the SYNC bit in TSYR to 1. Table 12.4 TPSC2 to TPSC0 (Channel 1) Bit 2 Channel TPSC2 Bit 1 TPSC1 Bit 0 TPSC0 Description 1 0 0 Internal clock: counts on /1 1 Internal clock: counts on /4 0 Internal clock: counts on /16 1 Internal clock: counts on /64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKB pin input 0 Internal clock: counts on /256 1 Counts on TCNT_2 overflow 0 1 1 0 1 Rev. 3.00 Aug 23, 2006 Page 238 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Table 12.5 TPSC2 to TPSC0 (Channel 2) Bit 2 Channel TPSC2 Bit 1 TPSC1 Bit 0 TPSC0 Description 2 0 0 Internal clock: counts on /1 1 Internal clock: counts on /4 0 Internal clock: counts on /16 1 Internal clock: counts on /64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKB pin input 0 External clock: counts on TCLKC pin input 1 Internal clock: counts on /1024 0 1 1 0 1 12.3.2 Timer Mode Register (TMDR) TMDR sets the operating mode for each channel. The TPU has a total of two TMDR registers, one for each channel. TMDR should be set when TCNT operation is stopped. Bit Bit Name Initial Value R/W Description 7, 6 All 1 Reserved These bits are always read as 1 and cannot be modified. 5, 4 All 0 Reserved These bits are always read as 0 and cannot be modified. 3, 2 All 0 Reserved The write value should always be 0. 1 MD1 0 R/W Modes 1 and 0 0 MD0 0 R/W These bits set the timer operating mode. See table 12.6 for details. Rev. 3.00 Aug 23, 2006 Page 239 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Table 12.6 MD3 to MD0 Bit 1 MD1 Bit 0 MD0 Description 0 0 Normal operation 1 Reserved 0 PWM mode 1 1 PWM mode 2 1 12.3.3 Timer I/O Control Register (TIOR) TIOR controls TGR. The TPU has a total of two TIOR registers, one for each channel. Care is required as TIOR is affected by the TMDR setting. The initial output specified by TIOR is valid when the counter is stopped (the CST bit in TSTR is cleared to 0). Note also that, in PWM mode 2, the output at the point at which the counter is cleared to 0 is specified. * TIOR_1, TIOR_2 Bit Bit Name Initial Value R/W Description 7 IOB3 All 0 R/W I/O Control B3 to B0 6 IOB2 R/W Specify the function of TGRB. 5 IOB1 R/W For details, refer to tables 12.7 and 12.8. 4 IOB0 R/W 3 IOA3 2 All 0 R/W I/O Control A3 to A0 IOA2 R/W Specify the function of TGRA. 1 IOA1 R/W For details, refer to tables 12.9 and 12.10. 0 IOA0 R/W Rev. 3.00 Aug 23, 2006 Page 240 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Table 12.7 TIOR_1 (Channel 1) Description Bit 7 IOB3 Bit 6 IOB2 Bit 5 IOB1 Bit 4 IOB0 TGRB_1 Function 0 0 0 0 Output compare register 1 1 0 0 0 TIOCB1 Pin Function Output disabled Setting prohibited 1 1 1 1 0 1 1 0 0 0 Input capture Capture input source is TIOCB1 pin register Input capture at rising edge 1 Capture input source is TIOCB1 pin Input capture at falling edge 1 X Capture input source is TIOCB1 pin Input capture at both edges 1 X X Setting prohibited [Legend] X: Don't care Rev. 3.00 Aug 23, 2006 Page 241 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Table 12.8 TIOR_2 (Channel 2) Description Bit 7 IOB3 Bit 6 IOB2 Bit 5 IOB1 Bit 4 IOB0 TGRB_2 Function 0 0 0 0 Output compare register 1 1 0 0 0 TIOCB2 Pin Function Output disabled Setting prohibited 1 1 1 1 0 1 1 X 0 0 Input capture Capture input source is TIOCB2 pin register Input capture at rising edge 1 Capture input source is TIOCB2 pin Input capture at falling edge 1 X Capture input source is TIOCB2 pin Input capture at both edges [Legend] X: Don't care Rev. 3.00 Aug 23, 2006 Page 242 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Table 12.9 TIOR_1 (Channel 1) Description Bit 3 IOA3 Bit 2 IOA2 Bit 1 IOA1 Bit 0 IOA0 TGRA_1 Function 0 0 0 0 Output compare register 1 TIOCA1 Pin Function Output disabled Initial output is 0 0 output at compare match 1 0 Initial output is 0 1 output at compare match 1 Initial output is 0 Toggle output at compare match 1 0 0 Output disabled 1 Initial output is 1 0 output at compare match 1 0 Initial output is 1 1 output at compare match 1 Initial output is 1 Toggle output at compare match 1 0 0 0 1 Input capture register Capture input source is TIOCA1 pin Input capture at rising edge Capture input source is TIOCA1 pin Input capture at falling edge 1 X Capture input source is TIOCA1 pin Input capture at both edges 1 X X Setting prohibited [Legend] X: Don't care Rev. 3.00 Aug 23, 2006 Page 243 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Table 12.10 TIOR_2 (Channel 2) Description Bit 3 IOA3 Bit 2 IOA2 Bit 1 IOA1 Bit 0 IOA0 TGRA_2 Function 0 0 0 0 Output compare register 1 TIOCA2 Pin Function Output disabled Initial output is 0 0 output at compare match 1 0 Initial output is 0 1 output at compare match 1 Initial output is 0 Toggle output at compare match 1 0 0 Output disabled 1 Initial output is 1 0 output at compare match 1 0 Initial output is 1 1 output at compare match 1 Initial output is 1 Toggle output at compare match 1 X 0 0 Input capture Capture input source is TIOCA2 pin register Input capture at rising edge 1 Capture input source is TIOCA2 pin Input capture at falling edge 1 X Capture input source is TIOCA2 pin Input capture at both edges [Legend] X: Don't care Rev. 3.00 Aug 23, 2006 Page 244 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.3.4 Timer Interrupt Enable Register (TIER) TIER controls enabling or disabling of interrupt requests for each channel. The TPU has a total of two TIER registers, one for each channel. Bit Bit Name Initial Value R/W Description 7 0 R/W Reserved 6 1 This bit is readable/writable. Reserved This bit is always read as 1 and cannot be modified. 5 0 Reserved The write value should always be 0. 4 TCIEV 0 R/W Overflow Interrupt Enable Enables or disables interrupt requests (TCIV) by the TCFV flag when the TCFV flag in TSR is set to 1. 0: Interrupt requests (TCIV) by TCFV disabled 1: Interrupt requests (TCIV) by TCFV enabled 3, 2 All 0 Reserved These bits are always read as 0 and cannot be modified. 1 TGIEB 0 R/W TGR Interrupt Enable B Enables or disables interrupt requests (TGIB) by the TGFB bit when the TGFB bit in TSR is set to 1. 0: Interrupt requests (TGIB) by TGFB bit disabled 1: Interrupt requests (TGIB) by TGFB bit enabled 0 TGIEA 0 R/W TGR Interrupt Enable A Enables or disables interrupt requests (TGIA) by the TGFA bit when the TGFA bit in TSR is set to 1. 0: Interrupt requests (TGIA) by TGFA bit disabled 1: Interrupt requests (TGIA) by TGFA bit enabled Rev. 3.00 Aug 23, 2006 Page 245 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.3.5 Timer Status Register (TSR) TSR indicates the status for each channel. The TPU has a total of two TSR registers, one for each channel. Bit Bit Name Initial Value R/W Description 7, 6 All 1 Reserved 5 0 These bits are always read as 1 and cannot be modified. Reserved This bit is always read as 0 and cannot be modified. 4 TCFV 0 R/(W)* Overflow Flag Status flag that indicates that TCNT overflow has occurred. [Setting condition] When the TCNT value overflows (changes from H'FFFF to H'0000 ) [Clearing condition] When 0 is written to TCFV after reading TCFV = 1 3, 2 All 0 Reserved These bits are always read as 0 and cannot be modified. 1 TGFB 0 R/(W)* Input Capture/Output Compare Flag B Status flag that indicates the occurrence of TGRB input capture or compare match. [Setting conditions] * When TCNT = TGRB and TGRB is functioning as output compare register * When TCNT value is transferred to TGRB by input capture signal and TGRB is functioning as input capture register [Clearing condition] * Rev. 3.00 Aug 23, 2006 Page 246 of 616 REJ09B0182-0300 When 0 is written to TGFB after reading TGFB = 1 Section 12 16-Bit Timer Pulse Unit (TPU) Bit Bit Name Initial value R/W 0 TGFA 0 R/(W)* Input Capture/Output Compare Flag A Description Status flag that indicates the occurrence of TGRA input capture or compare match. [Setting conditions] * When TCNT = TGRA and TGRA is functioning as output compare register * When TCNT value is transferred to TGRA by input capture signal and TGRA is functioning as input capture register [Clearing condition] * Note: 12.3.6 * When 0 is written to TGFA after reading TGFA = 1 Only 0 can be written to clear the flag. Timer Counter (TCNT) TCNT is a 16-bit readable/writable counter. The TPU has a total of two TCNT counters, one for each channel. TCNT is initialized to H'0000 by a reset or in hardware standby mode. TCNT cannot be accessed in 8-bit units; it must always be accessed in 16-bit units. 12.3.7 Timer General Register (TGR) TGR is a 16-bit readable/writable register, functioning as either output compare or input capture register. The TPU has a total of four TGR registers, two for each channel. TGR is initialized to H'FFFF by a reset. TGR cannot be accessed in 8-bit units; it must always be accessed in 16-bit units. Rev. 3.00 Aug 23, 2006 Page 247 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.3.8 Timer Start Register (TSTR) TSTR selects TCNT operation/stoppage for channels 1 and 2. TCNT starts counting for channel in which the corresponding bit is set to 1. When setting the operating mode in TMDR or setting the TCNT count clock in TCR, first stop the TCNT operation. Bit Bit Name Initial Value R/W Description 7 to 3 All 0 Reserved The write value should always be 0. 2 CST2 0 R/W Counter Start 2 and 1 1 CST1 0 R/W These bits select operation or stoppage for TCNT. If 0 is written to the CST bit during operation with the TIOC pin designated for output, the counter stops but the output compare output level of the TIOC pin is retained. If TIOR is written to when the CST bit is cleared to 0, the pin output level will be changed to the set initial output value. 0: TCNT_n count operation is stopped 1: TCNT_n performs count operation (n = 2 or 1) 0 0 Reserved The write value should always be 0. Rev. 3.00 Aug 23, 2006 Page 248 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.3.9 Timer Synchro Register (TSYR) TSYR selects independent operation or synchronous operation of TCNT for each channel. Synchronous operation is performed for channel in which the corresponding bit in TSYR is set to 1. Bit Bit Name Initial Value R/W Description 7 to 3 All 0 Reserved The write value should always be 0. 2 SYNC2 0 R/W Timer Synchro 2 and 1 1 SYNC1 0 R/W These bits select whether operation is independent of or synchronized with other channels. When synchronous operation is selected, the TCNT synchronous presetting of multiple channels, and synchronous clearing by counter clearing on another channel, are possible. To set synchronous operation, the SYNC bits must be set to 1. To set synchronous clearing, in addition to the SYNC bit, the TCNT clearing source must also be set by means of bits CCLR1 and CCLR0 in TCR. 0: TCNT_n operates independently (TCNT presetting/ clearing is unrelated to other channels) 1: TCNT_n performs synchronous operation TCNT synchronous presetting/synchronous clearing is possible (n = 2 or 1) 0 0 Reserved The write value should always be 0. Rev. 3.00 Aug 23, 2006 Page 249 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.4 Interface to CPU 12.4.1 16-Bit Registers TCNT and TGR are 16-bit registers. As the data bus to the CPU is 16 bits wide, these registers cannot be read or written to in 8-bit units; 16-bit access must always be used. An example of 16-bit register access operation is shown in figure 12.2. CPU Internal data bus H L Module data bus Bus interface TCNTH TCNTL Figure 12.2 16-Bit Register Access Operation [CPU TCNT (16 Bits)] 12.4.2 8-Bit Registers Registers other than TCNT and TGR are 8-bit. They can be read and written to in 8-bit units. Examples of 8-bit register access operation are shown in figures 12.3 and 12.4. Internal data bus CPU H L Module data bus Bus interface TCR Figure 12.3 8-Bit Register Access Operation [CPU TCR (Upper 8 Bits)] Rev. 3.00 Aug 23, 2006 Page 250 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) CPU Internal data bus H L Module data bus Bus interface TMDR Figure 12.4 8-Bit Register Access Operation [CPU TMDR (Lower 8 Bits)] Rev. 3.00 Aug 23, 2006 Page 251 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.5 Operation 12.5.1 Basic Functions Each channel has TCNT and TGR. TCNT performs up-counting, and is also capable of freerunning operation, periodic counting, and external event counting. TGR can be used as an input capture register or output compare register. (1) Counter Operation When one of bits CST1 and CST2 is set to 1 in TSTR, TCNT for the corresponding channel begins counting. TCNT can operate as a free-running counter, periodic counter, for example. (a) Example of Count Operation Setting Procedure Figure 12.5 shows an example of the count operation setting procedure. Operation selection Select counter clock [1] Periodic counter Select counter clearing source Free-running counter [2] [3] Select output compare register Set period [4] Start count operation [5] <Periodic counter> Start count operation <Free-running counter> [1] Select the counter clock with bits TPSC2 to TPSC0 in TCR. At the same time, select the input clock edge with bits CKEG1 and CKEG0 in TCR. [2] For periodic counter operation, select TGR to be used as the TCNT clearing source with bits CCLR1 and CCLR0 in TCR. [3] Designate TGR selected in [2] as an output compare register by means of TIOR. [4] Set the periodic counter cycle in TGR selected in [2]. [5] Set the CST bit in TSTR to 1 to start the counter operation. Figure 12.5 Example of Counter Operation Setting Procedure Rev. 3.00 Aug 23, 2006 Page 252 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) (b) Free-Running Count Operation and Periodic Count Operation Immediately after a reset, the TPU's TCNT counters are all designated as free-running counters. When the relevant bit in TSTR is set to 1, the corresponding TCNT starts up-count operation as a free-running counter. When TCNT overflows (from H'FFFF to H'0000), the TCFV bit in TSR is set to 1. If the value of the corresponding TCIEV bit in TIER is 1 at this point, the TPU requests an interrupt. After overflow, TCNT starts counting up again from H'0000. Figure 12.6 illustrates free-running counter operation. TCNT value H'FFFF H'0000 Time CST bit TCFV Figure 12.6 Free-Running Counter Operation When compare match is selected as the TCNT clearing source, TCNT for the relevant channel performs periodic count operation. TGR for setting the period is designated as an output compare register, and counter clearing by compare match is selected by means of bits CCLR0 and CCLR1 in TCR. After the settings have been made, TCNT starts up-count operation as a periodic counter when the corresponding bit in TSTR is set to 1. When the count value matches the value in TGR, the TGF bit in TSR is set to 1 and TCNT is cleared to H'0000. If the value of the corresponding TGIE bit in TIER is 1 at this point, the TPU requests an interrupt. After a compare match, TCNT starts counting up again from H'0000. Figure 12.7 illustrates periodic counter operation. Rev. 3.00 Aug 23, 2006 Page 253 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) TCNT value Counter cleared by TGR compare match TGR H'0000 Time CST bit Flag cleared by software TGF Figure 12.7 Periodic Counter Operation (2) Waveform Output by Compare Match The TPU can perform 0, 1, or toggle output from the corresponding output pin using compare match. (a) Example of Setting Procedure for Waveform Output by Compare Match Figure 12.8 shows an example of the setting procedure for waveform output by compare match. Input selection [1] Select waveform output mode [2] [3] Set output timing [1] Select 0 output or 1 output for initial value, and 0 output, 1 output, or toggle output, by for compare match output value means of TIOR. The set initial value is output at the TIOC pin until the first compare match occurs. [2] Set the timing for compare match generation in TGR. [3] Set the CST bit in TSTR to 1 to start the count operation. Start count operation < Waveform output > Figure 12.8 Example of Setting Procedure for Waveform Output by Compare Match (b) Examples of Waveform Output Operation Figure 12.9 shows an example of 1 output. In this example, TCNT has been designated as a free-running counter, and settings have been made such that 1 is output by compare match A. When the set level and the pin level match, the pin level does not change. Rev. 3.00 Aug 23, 2006 Page 254 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) TCNT value H'FFFF TGRA Time H'0000 No change No change 1 output TIOCA Figure 12.9 Example of 0 Output/1 Output Operation Figure 12.10 shows an example of toggle output. In this example, TCNT has been designated as a periodic counter (with counter clearing on compare match A), and settings have been made such that the output is toggled by compare match A. TCNT value Counter cleared by TGRB compare match H'FFFF TGRA Time H'0000 Toggle output TIOCA Figure 12.10 Example of Toggle Output Operation (3) Input Capture Function The TCNT value can be transferred to TGR on detection of the TIOC pin input edge. Rising edge, falling edge, or both edges can be selected as the detected edge. (a) Example of Input Capture Operation Setting Procedure Figure 12.11 shows an example of the setting procedure for input capture operation. Rev. 3.00 Aug 23, 2006 Page 255 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Input selection Select input capture input Start count [1] Designate TGR as an input capture register by means of TIOR, and select the input capture source and, rising edge, falling edge, or both edges as the input signal edge. [1] [2] Set the CST bit in TSTR to 1 to start the count operation. [2] <Input capture operation> Figure 12.11 Example of Setting Procedure for Input Capture Operation (b) Example of Input Capture Operation Figure 12.12 shows an example of input capture operation. In this example, both rising and falling edges have been selected as the input capture input edge of the TIOCA pin, the falling edge has been selected as the input capture input edge of the TIOCB pin, and counter clearing by TGRB input capture has been designated for TCNT. Counter cleared by TIOCB input (falling edge) TCNT value H'0180 H'0160 H'0010 H'0005 Time H'0000 TIOCA TGRA H'0005 H'0160 H'0010 TIOCB TGRB H'0180 Figure 12.12 Example of Input Capture Operation Rev. 3.00 Aug 23, 2006 Page 256 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.5.2 Synchronous Operation In synchronous operation, the values in multiple TCNT counters can be rewritten simultaneously (synchronous presetting). Also, multiple TCNT counters can be cleared simultaneously by making the appropriate setting in TCR (synchronous clearing). Synchronous operation enables TGR to be incremented with respect to a single time base. Synchronous operation can be set for each channel. (1) Example of Synchronous Operation Setting Procedure Figure 12.13 shows an example of the synchronous operation setting procedure. Synchronous operation selection Set synchronous operation [1] Synchronous presetting Set TCNT Synchronous clearing [2] Clearing source generation channel? No Yes <Synchronous presetting> Select counter clearing source [3] Set synchronous counter clearing [4] Start count [5] Start count [5] <Counter clearing> <Synchronous clearing> [1] Set 1 to the SYNC bits in TSYR corresponding to the channels to be designated for synchronous operation. [2] When the TCNT counter of any of the channels designated for synchronous operation is written to, the same value is simultaneously written to the other TCNT counters. [3] Use bits CCLR1 and CCLR0 in TCR to specify TCNT clearing by input capture/output compare, etc. [4] Use bits CCLR1 and CCLR0 in TCR to designate synchronous clearing for the counter clearing source. [5] Set 1 to the CST bits in TSTR for the relevant channels, to start the count operation. Figure 12.13 Example of Synchronous Operation Setting Procedure Rev. 3.00 Aug 23, 2006 Page 257 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) (2) Example of Synchronous Operation Figure 12.14 shows an example of synchronous operation. In this example, synchronous operation and PWM mode 1 have been designated for channels 1 and 2, TGRB_1 compare match has been set as the channel 1 counter clearing source, and synchronous clearing has been set for the channel 2 counter clearing source. Two-phase PWM waveforms are output from pins TIOC1A and TIOC2A. At this time, synchronous presetting, and synchronous clearing by TGRB_1 compare match, are performed for channel 1 and 2 TCNT counters, and the data set in TGRB_1 is used as the PWM cycle. For details on PWM modes, see section 12.5.4, PWM Modes. Synchronous clearing by TGRB_1 compare match TCNT_1 and TCNT_2 TGRB_1 TGRB_2 TGRA_1 TGRA_2 Time H'0000 TIOCA1 TIOCA2 Figure 12.14 Example of Synchronous Operation Rev. 3.00 Aug 23, 2006 Page 258 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.5.3 Operation with Cascaded Connection Operation as a 32-bit counter can be performed by cascading two 16-bit counter channels. This function is enabled when the TPSC2 to TPSC0 bits in TCR are set to count on TCNT2 overflow for the channel 1 counter clock. Table 12.11 shows the counter combination used in operation with the cascaded connection. Table 12.11 Counter Combination in Operation with Cascaded Connection Combination Upper 16 bits Lower 16 bits Channel 1 and channel 2 TCNT1 TCNT2 (1) Setting Procedure for Operation with Cascaded Connection Figure 12.15 shows the setting procedure for cascaded connection operation. Operation with cascaded connection [1] Set bits TPSC2 to TPSC0 in TCR in channel 1 to B'111 to select to count on TCNT2 overflow. Set operation with cascaded connection [1] Start count [2] [2] Set 1 to the CST bit in TSTR corresponding the upper and lower channels to start counting. <Operation with cascaded connection> Figure 12.15 Setting Procedure for Operation with Cascaded Operation Rev. 3.00 Aug 23, 2006 Page 259 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) (2) Example of Operation with Cascaded Connection Figure 12.16 shows an example of operation with cascaded connection, where TCNT1 is set to count TCNT2 overflow, TCRA_1 and TCRA_2 are set to be input capture registers, and the TIOC pin rising edge is selected. If rising edges are input simultaneously to the TIOCA1 and TIOCA2 pins, the upper 16 bits of 32bit data are transferred to TGRA_1 and the lower 16 bits are transferred to TGRA_2. TCNT1 clock TCNT1 H'03A1 H'03A2 TCNT2 clock TCNT2 H'FFFF H'0000 H'0001 TIOCA1 TIOCA2 TGRA_1 TGRA_2 H'03A2 H'0000 Figure 12.16 Example of Operation with Cascaded Connection Rev. 3.00 Aug 23, 2006 Page 260 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.5.4 PWM Modes In PWM mode, PWM waveforms are output from the output pins. The output level can be selected as 0, 1, or toggle output in response to a compare match of each TGR. Designating TGR compare match as the counter clearing source enables the period to be set in that register. All channels can be designated for PWM mode independently. Synchronous operation is also possible. There are two PWM modes, as described below. (1) PWM Mode 1 PWM output is generated from the TIOCA pin by pairing TGRA with TGRB. The level specified by bits IOA0 to IOA3 in TIOR is output from the TIOCA pin at compare match A, and the level specified by bits IOB0 to IOB3 in TIOR is output at compare match B. The initial output value is the value set in TGRA. If the set values of paired TGRs are identical, the output value does not change even if a compare match occurs. In PWM mode 1, PWM output is enabled up to 2 phases. (2) PWM Mode 2 PWM output is generated using one TGR as the cycle register and the others as duty registers. The output specified in TIOR is performed by means of compare matches. Upon counter clearing by a synchronization register compare match, the output value of each pin is the initial value set in TIOR. If the set values of the cycle and duty registers are identical, the output value does not change even if a compare match occurs. In PWM mode 2, PWM output is enabled up to 2 phases. The correspondence between PWM output pins and registers is shown in table 12.12. Rev. 3.00 Aug 23, 2006 Page 261 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Table 12.12 PWM Output Registers and Output Pins Output Pins Channel Registers PWM Mode 1 PWM Mode 2* 1 TGRA_1 TIOCA1 TIOCA1 TGRB_1 2 -- TGRA_2 TIOCA2 TGRB_2 Note: (3) * TIOCA2 -- In PWM mode 2, PWM output is not possible for TGR in which the period is set. Example of PWM Mode Setting Procedure Figure 12.17 shows an example of the PWM mode setting procedure. PWM mode Select counter clock [1] Select counter clearing source [2] Select waveform output level [3] Set TGR [4] Set PWM mode [5] Start count [6] [1] Select the counter clock with bits TPSC2 to TPSC0 in TCR. At the same time, select the input clock edge with bits CKEG1 and CKEG0 in TCR. [2] Use bits CCLR1 and CCLR0 in TCR to select the TGR to be used as the TCNT clearing source. [3] Use TIOR to designate the TGR as an output compare register, and select the initial value and output value. [4] Set the cycle in the TGR selected in [2], and set the duty in the other TGR. [5] Select the PWM mode with bits MD3 to MD0 in TMDR. [6] Set the CST bit in TSTR to 1 start the count operation. <PWM mode> Figure 12.17 Example of PWM Mode Setting Procedure Rev. 3.00 Aug 23, 2006 Page 262 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) (4) Examples of PWM Mode Operation Figure 12.18 shows an example of PWM mode 1 operation. In this example, TGRA compare match is set as the TCNT clearing source, 0 is set for the TGRA initial output value, and 1 is set as the TGRB output value. In this case, the value set in TGRA is used as the period, and the values set in TGRB are used as the duty levels. TCNT value Counter cleared by TGRA compare match TGRA TGRB H'0000 Time TIOCA Figure 12.18 Example of PWM Mode Operation (1) Figure 12.19 shows an example of PWM mode 2 operation. In this example, synchronous operation is designated for channels 1 and 2, TGRB_2 compare match is set as the TCNT clearing source, and 0 is set for the initial output value and 1 for the output value of the other TGR registers (TGRA_1, TGRB_1, and TGRA_2), outputting a 2-phase PWM waveform. In this case, the value set in TGRB_2 is used as the cycle, and the values set in the other TGRs are used as the duty levels. Rev. 3.00 Aug 23, 2006 Page 263 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Synchronous clearing by TGRB_2 compare match TCNT_1 and TCNT_2 TGRB_2 TGRA_2 TGRA_1 Time H'0000 TIOCA1 TIOCA2 Figure 12.19 Example of PWM Mode Operation (2) Rev. 3.00 Aug 23, 2006 Page 264 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Figure 12.20 shows examples of PWM waveform output with 0% duty and 100% duty in PWM mode. TCNT value TGRB rewritten TGRA TGRB TGRB rewritten TGRB rewritten H'0000 Time 0% duty TIOCA Output does not change when cycle register and duty register compare matches occur simultaneously TCNT value TGRB rewritten TGRA TGRB rewritten TGRB rewritten TGRB H'0000 Time 100% duty TIOCA Output does not change when cycle register and duty register compare matches occur simultaneously TCNT value TGRB rewritten TGRA TGRB rewritten TGRB TGRB rewritten Time H'0000 TIOCA 100% duty 0% duty Figure 12.20 Example of PWM Mode Operation (3) Rev. 3.00 Aug 23, 2006 Page 265 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.6 Interrupt Sources There are two kinds of TPU interrupt source; TGR input capture/compare match and TCNT overflow. Each interrupt source has its own status flag and enable/disable bit, allowing the generation of interrupt request signals to be enabled or disabled individually. When an interrupt source is generated, the corresponding status flag in TSR is set to 1. If the corresponding enable/disable bit in TIER is set to 1 at this time, an interrupt is requested. The interrupt request is cleared by clearing the status flag to 0. Channel priority can be changed by the interrupt controller, however the priority within a channel is fixed. For details, see section 4, Interrupt Controller. Table 12.13 lists the TPU interrupt sources. Table 12.13 TPU Interrupts Channel Name Interrupt Source 1 TGI1A TGRA_1 input capture/compare match TGFA_1 TGI1B TGRB_1 input capture/compare match TGFB_1 TCI1V TCNT_1 overflow TCFV_1 TGI2A TGRA_2 input capture/compare match TGFA_2 TGI2B TGRB_2 input capture/compare match TGFB_2 TCI2V TCNT_2 overflow TCFV_2 2 (1) Interrupt Flag Priority High Low Input Capture/Compare Match Interrupt An interrupt is requested if the TGIE bit in TIER is set to 1 when the TGF flag in TSR is set to 1 by the occurrence of a TGR input capture/compare match on a particular channel. The interrupt request is cleared by clearing the TGF flag to 0. The TPU has a total of four input capture/compare match interrupts, two for each channel. (2) Overflow Interrupt An interrupt is requested if the TCIEV bit in TIER is set to 1 when the TCFV flag in TSR is set to 1 by the occurrence of TCNT overflow on a channel. The interrupt request is cleared by clearing the TCFV flag to 0. The TPU has a total of two overflow interrupts, one for each channel. Rev. 3.00 Aug 23, 2006 Page 266 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.7 Operation Timing 12.7.1 Input/Output Timing (1) TCNT Count Timing Figure 12.21 shows TCNT count timing in internal clock operation, and figure 12.22 shows TCNT count timing in external clock operation. Internal clock Rising edge Falling edge TCNT input clock N-1 TCNT N N+1 N+2 Figure 12.21 Count Timing in Internal Clock Operation External clock Rising edge Falling edge Falling edge TCNT input clock TCNT N-1 N N+1 N+2 Figure 12.22 Count Timing in External Clock Operation Rev. 3.00 Aug 23, 2006 Page 267 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) (2) Output Compare Output Timing A compare match signal is generated in the last state in which TCNT and TGR match (the point at which the count value matched by TCNT is updated). When a compare match signal is generated, the output value set in TIOR is output at the output compare output pin (TIOC pin). After a match between TCNT and TGR, the compare match signal is not generated until the TCNT input clock is generated. Figure 12.23 shows output compare output timing. TCNT input clock TCNT TGR N N+1 N Compare match signal TIOC pin Figure 12.23 Output Compare Output Timing Rev. 3.00 Aug 23, 2006 Page 268 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) (3) Input Capture Signal Timing Figure 12.24 shows input capture signal timing. Input capture input Input capture signal TCNT N N+1 N+2 N TGR N+2 Figure 12.24 Input Capture Input Signal Timing (4) Timing for Counter Clearing by Compare Match/Input Capture Figure 12.25 shows the timing when counter clearing on compare match is specified, and figure 12.26 shows the timing when counter clearing on input capture is specified. Compare match signal Counter clear signal TCNT N TGR N H'0000 Figure 12.25 Counter Clear Timing (Compare Match) Rev. 3.00 Aug 23, 2006 Page 269 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Input capture signal Counter clear signal H'0000 N TCNT N TGR Figure 12.26 Counter Clear Timing (Input Capture) 12.7.2 (1) Interrupt Signal Timing TGF Flag Setting Timing in Case of Compare Match Figure 12.27 shows the timing for setting of the TGF flag in TSR on compare match, and TGI interrupt request signal timing. TCNT input clock TCNT N TGR N N+1 Compare match signal TGF flag TGI interrupt Figure 12.27 TGI Interrupt Timing (Compare Match) Rev. 3.00 Aug 23, 2006 Page 270 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) (2) TGF Flag Setting Timing in Case of Input Capture Figure 12.28 shows the timing for setting of the TGF flag in TSR on input capture, and TGI interrupt request signal timing. Input capture signal N TCNT TGR N TGF flag TGI interrupt Figure 12.28 TGI Interrupt Timing (Input Capture) (3) TCFV Flag Setting Timing Figure 12.29 shows the timing for setting of the TCFV flag in TSR on overflow, and TCIV interrupt request signal timing. TCNT input clock TCNT (overflow) H'FFFF H'0000 Overflow signal TCFV flag TCIV interrupt Figure 12.29 TCIV Interrupt Setting Timing Rev. 3.00 Aug 23, 2006 Page 271 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) (4) Status Flag Clearing Timing After a status flag is read as 1 by the CPU, it is cleared by writing 0 to it. Figure 12.30 shows the timing for status flag clearing by the CPU. TSR write cycle T2 T1 TSR address Address Write signal Status flag Interrupt request signal Figure 12.30 Timing for Status Flag Clearing by CPU 12.8 12.8.1 Usage Notes Module Standby Function Setting TPU operation can be disabled or enabled using the clock stop register. The initial setting is for the TPU to operate. Register access is enabled by clearing the module standby function. For details, refer to section 6.4, Module Standby Function. 12.8.2 Input Clock Restrictions The input clock pulse width must be at least 1.5 states in the case of single-edge detection, and at least 2.5 states in the case of both-edge detection. The TPU will not operate properly at narrower pulse widths. Rev. 3.00 Aug 23, 2006 Page 272 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.8.3 Caution on Period Setting When counter clearing on compare match is set, TCNT is cleared in the last state in which it matches the TGR value (the point at which the count value matched by TCNT is updated). Consequently, the actual counter frequency is given by the following formula: f= (N + 1) Where 12.8.4 f: Counter frequency : Operating frequency N: TGR set value Contention between TCNT Write and Clear Operation If the counter clear signal is generated in the T2 state of a TCNT write cycle, TCNT clearing takes priority and the TCNT write is not performed. Figure 12.31 shows the timing in this case. TCNT write cycle T1 T2 TCNT address Address Write signal Counter clear signal TCNT N H'0000 Figure 12.31 Contention between TCNT Write and Clear Operation Rev. 3.00 Aug 23, 2006 Page 273 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.8.5 Contention between TCNT Write and Increment Operation If incrementing occurs in the T2 state of a TCNT write cycle, the TCNT write takes priority and TCNT is not incremented. Figure 12.32 shows the timing in this case. TCNT write cycle T1 T2 TCNT address Address Write signal TCNT input clock TCNT N M TCNT write data Figure 12.32 Contention between TCNT Write and Increment Operation Rev. 3.00 Aug 23, 2006 Page 274 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.8.6 Contention between TGR Write and Compare Match If a compare match occurs in the T2 state of a TGR write cycle, the TGR write takes priority and the compare match signal is inhibited. A compare match does not occur even if the previous value is written. Figure 12.33 shows the timing in this case. TGR write cycle T1 T2 TGR address Address Write signal Compare match signal Inhibited TCNT N N+1 TGR N M TGR write data Figure 12.33 Contention between TGR Write and Compare Match Rev. 3.00 Aug 23, 2006 Page 275 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.8.7 Contention between TGR Read and Input Capture If an input capture signal is generated in the T1 state of a TGR read cycle, data that is read will be data after input capture transfer. Figure 12.34 shows the timing in this case. TGR read cycle T2 T1 TGR address Address Read signal Input capture signal TGR Internal data bus X M M Figure 12.34 Contention between TGR Read and Input Capture Rev. 3.00 Aug 23, 2006 Page 276 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.8.8 Contention between TGR Write and Input Capture If an input capture signal is generated in the T2 state of a TGR write cycle, the input capture operation takes priority and the write to TGR is not performed. Figure 12.35 shows the timing in this case. TGR write cycle T2 T1 Address TGR address Write signal Input capture signal TCNT TGR M M Figure 12.35 Contention between TGR Write and Input Capture Rev. 3.00 Aug 23, 2006 Page 277 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.8.9 Contention between Overflow and Counter Clearing If overflow and counter clearing occur simultaneously, the TCFV flag in TSR is not set and TCNT clearing takes priority. Figure 12.36 shows the operation timing when a TGR compare match is specified as the clearing source, and when H'FFFF is set in TGR. TCNT input clock TCNT H'FFFF H'0000 Counter clear signal TGF TCFV Disabled Figure 12.36 Contention between Overflow and Counter Clearing Rev. 3.00 Aug 23, 2006 Page 278 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) 12.8.10 Contention between TCNT Write and Overflow If there is an up-count in the T2 state of a TCNT write cycle and overflow occurs, the TCNT write takes priority and the TCFV flag in TSR is not set. Figure 12.37 shows the operation timing when there is contention between TCNT write and overflow. TCNT write cycle T2 T1 TCNT address Address Write signal TCNT TCNT write data H'FFFF M TCFV flag Figure 12.37 Contention between TCNT Write and Overflow 12.8.11 Multiplexing of I/O Pins The TIOCA1 I/O pin is multiplexed with the TCLKA input pin, the TIOCB1 I/O pin with the TCLKB input pin, and the TIOCA2 I/O pin with the TCLKC input pin. When an external clock is input, compare match output should not be performed from a multiplexed pin. 12.8.12 Interrupts when Module Standby Function is Used If the module standby function is used when an interrupt has been requested, it will not be possible to clear the CPU interrupt source. Interrupts should therefore be disabled before using the module standby function. Rev. 3.00 Aug 23, 2006 Page 279 of 616 REJ09B0182-0300 Section 12 16-Bit Timer Pulse Unit (TPU) Rev. 3.00 Aug 23, 2006 Page 280 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) Section 13 Asynchronous Event Counter (AEC) The asynchronous event counter (AEC) is an event counter that is incremented by external event clock or internal clock input. Figure 13.1 shows a block diagram of the asynchronous event counter. 13.1 Features * Can count asynchronous events Can count external events input asynchronously without regard to the operation of system clocks () or subclocks (SUB). * Can be used as two-channel independent 8-bit event counter or single-channel independent 16bit event counter. * Event/clock input is enabled when IRQAEC goes high or event counter PWM output (IECPWM) goes high. * Both edge sensing can be used for IRQAEC or event counter PWM output (IECPWM) interrupts. When the asynchronous counter is not used, they can be used as independent interrupts. * When an event counter PWM is used, event clock input enabling/disabling can be controlled at a constant cycle. * Selection of four clock sources Three internal clocks (/2, /4, or /8) or external event can be selected. * Both edge counting is possible for the AEVL and AEVH pins. * Counter resetting and halting of the count-up function can be controlled by software. * Automatic interrupt generation on detection of an event counter overflow * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) * The IRQAEC pin can select the on-chip oscillator and the system clock oscillator during a reset, though this function does not apply to a reset by the watchdog timer. (Supported only by the masked ROM version.) Rev. 3.00 Aug 23, 2006 Page 281 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) IRREC ECCR PSS ECCSR OVH AEVH AEVL Edge sensing circuit OVL ECH (8 bits) CK ECL (8 bits) CK Edge sensing circuit IRQAEC IECPWM Edge sensing circuit To CPU interrupt (IRREC2) Internal data bus /2 /4, /8 ECPWCR PWM waveform generator /2, /4, /8, /16, /32, /64 ECPWDR AEGSR [Legend] ECPWCR: Event counter PWM compare register ECL: Event counter L ECPWDR: Event counter PWM data register ECCR: Event counter control register AEGSR: Input pin edge select register ECH: Event counter H ECCSR: Event counter control/status register Figure 13.1 Block Diagram of Asynchronous Event Counter 13.2 Input/Output Pins Table 13.1 shows the pin configuration of the asynchronous event counter. Table 13.1 Pin Configuration Name Abbreviation I/O Function Asynchronous event AEVH input H Input Event input pin for input to event counter H Asynchronous event AEVL input L Input Event input pin for input to event counter L Event input enable interrupt input Input IRQAEC Rev. 3.00 Aug 23, 2006 Page 282 of 616 REJ09B0182-0300 Input pin for interrupt enabling event input Input pin to select the on-chip oscillator and the system clock oscillator (supported only by the masked ROM version) Section 13 Asynchronous Event Counter (AEC) 13.3 Register Descriptions The asynchronous event counter has the following registers. * Event counter PWM compare register (ECPWCR) * Event counter PWM data register (ECPWDR) * Input pin edge select register (AEGSR) * Event counter control register (ECCR) * Event counter control/status register (ECCSR) * Event counter H (ECH) * Event counter L (ECL) 13.3.1 Event Counter PWM Compare Register (ECPWCR) ECPWCR sets the one conversion period of the event counter PWM waveform. Always read or write to this register in word size. Bit Bit Name 15 Initial Value R/W Description ECPWCR15 1 R/W 14 ECPWCR14 1 R/W One Conversion Period of Event Counter PWM Waveform 13 ECPWCR13 1 R/W 12 ECPWCR12 1 R/W 11 ECPWCR11 1 R/W 10 ECPWCR10 1 R/W 9 ECPWCR9 1 R/W 8 ECPWCR8 1 R/W 7 ECPWCR7 1 R/W 6 ECPWCR6 1 R/W 5 ECPWCR5 1 R/W 4 ECPWCR4 1 R/W 3 ECPWCR3 1 R/W 2 ECPWCR2 1 R/W 1 ECPWCR1 1 R/W 0 ECPWCR0 1 R/W When the ECPWME bit in AEGSR is 1, the event counter PWM is operating and therefore ECPWCR should not be modified. When changing the conversion period, the event counter PWM must be halted by clearing the ECPWME bit in AEGSR to 0 before modifying ECPWCR. Rev. 3.00 Aug 23, 2006 Page 283 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) 13.3.2 Event Counter PWM Data Register (ECPWDR) ECPWDR controls data of the event counter PWM waveform generator. Always write to this register in word size. Bit Bit Name Initial Value R/W Description 15 ECPWDR15 0 W 14 ECPWDR14 0 W Data Control of Event Counter PWM Waveform Generator 13 ECPWDR13 0 W 12 ECPWDR12 0 W 11 ECPWDR11 0 W 10 ECPWDR10 0 W 9 ECPWDR9 0 W 8 ECPWDR8 0 W 7 ECPWDR7 0 W 6 ECPWDR6 0 W 5 ECPWDR5 0 W 4 ECPWDR4 0 W 3 ECPWDR3 0 W 2 ECPWDR2 0 W 1 ECPWDR1 0 W 0 ECPWDR0 0 W Rev. 3.00 Aug 23, 2006 Page 284 of 616 REJ09B0182-0300 When the ECPWME bit in AEGSR is 1, the event counter PWM is operating and therefore ECPWDR should not be modified. When changing the conversion cycle, the event counter PWM must be halted by clearing the ECPWME bit in AEGSR to 0 before modifying ECPWDR. Section 13 Asynchronous Event Counter (AEC) 13.3.3 Input Pin Edge Select Register (AEGSR) AEGSR selects rising, falling, or both edge sensing for the AEVH, AEVL, and IRQAEC pins. Bit Bit Name Initial Value R/W Description 7 AHEGS1 0 R/W AEC Edge Select H 6 AHEGS0 0 R/W Select rising, falling, or both edge sensing for the AEVH pin. 00: Falling edge on AEVH pin is sensed 01: Rising edge on AEVH pin is sensed 10: Both edges on AEVH pin are sensed 11: Setting prohibited 5 ALEGS1 0 R/W AEC Edge Select L 4 ALEGS0 0 R/W Select rising, falling, or both edge sensing for the AEVL pin. 00: Falling edge on AEVL pin is sensed 01: Rising edge on AEVL pin is sensed 10: Both edges on AEVL pin are sensed 11: Setting prohibited 3 AIEGS1 0 R/W IRQAEC Edge Select 2 AIEGS0 0 R/W Select rising, falling, or both edge sensing for the IRQAEC pin. 00: Falling edge on IRQAEC pin is sensed 01: Rising edge on IRQAEC pin is sensed 10: Both edges on IRQAEC pin are sensed 11: Setting prohibited 1 ECPWME 0 R/W Event Counter PWM Enable Controls operation of event counter PWM and selection of IRQAEC. 0: AEC PWM halted, IRQAEC selected 1: AEC PWM enabled, IRQAEC not selected 0 0 R/W Reserved This bit can be read from or written to. However, this bit should not be set to 1. Rev. 3.00 Aug 23, 2006 Page 285 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) 13.3.4 Event Counter Control Register (ECCR) ECCR controls the counter input clock and IRQAEC/IECPWM. Bit Bit Name Initial Value R/W Description 7 ACKH1 0 R/W AEC Clock Select H 6 ACKH0 0 R/W Select the clock used by ECH. 00: AEVH pin input 01: /2 10: /4 11: /8 5 ACKL1 0 R/W AEC Clock Select L 4 ACKL0 0 R/W Select the clock used by ECL. 00: AEVL pin input 01: /2 10: /4 11: /8 3 PWCK2 0 R/W Event Counter PWM Clock Select 2 PWCK1 0 R/W Select the event counter PWM clock. 1 PWCK0 0 R/W 000: /2 001: /4 010: /8 011: /16 1X0: /32 1X1 /64 0 0 R/W Reserved This bit can be read from or written to. However, this bit should not be set to 1. [Legend] X: Don't care. Rev. 3.00 Aug 23, 2006 Page 286 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) 13.3.5 Event Counter Control/Status Register (ECCSR) ECCSR controls counter overflow detection, counter resetting, and count-up function. Bit Bit Name Initial Value R/W Description 7 OVH 0 R/W* Counter Overflow H This is a status flag indicating that ECH has overflowed. [Setting condition] When ECH overflows from H'FF to H'00 [Clearing condition] When this bit is written to 0 after reading OVH = 1 6 OVL 0 R/W* Counter Overflow L This is a status flag indicating that ECL has overflowed. [Setting condition] When ECL overflows from H'FF to H'00 while CH2 is set to 1 [Clearing condition] When this bit is written to 0 after reading OVL = 1 5 0 R/W Reserved Although this bit is readable/writable, it should not be set to 1. 4 CH2 0 R/W Channel Select Selects how ECH and ECL event counters are used 0: ECH and ECL are used together as a single-channel 16-bit event counter 1: ECH and ECL are used as two-channel 8-bit event counter 3 CUEH 0 R/W Count-Up Enable H Enables event clock input to ECH. 0: ECH event clock input is disabled (ECH value is retained) 1: ECH event clock input is enabled Rev. 3.00 Aug 23, 2006 Page 287 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) Bit Bit Name Initial Value R/W Description 2 CUEL 0 R/W Count-Up Enable L Enables event clock input to ECL. 0: ECL event clock input is disabled (ECL value is retained) 1: ECL event clock input is enabled 1 CRCH 0 R/W Counter Reset Control H Controls resetting of ECH. 0: ECH is reset 1: ECH reset is cleared and count-up function is enabled 0 CRCL 0 R/W Counter Reset Control L Controls resetting of ECL. 0: ECL is reset 1: ECL reset is cleared and count-up function is enabled Note: * Only 0 can be written to clear the flag. Rev. 3.00 Aug 23, 2006 Page 288 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) 13.3.6 Event Counter H (ECH) ECH is an 8-bit read-only up-counter that operates as an independent 8-bit event counter. ECH also operates as the upper 8-bit up-counter of a 16-bit event counter configured in combination with ECL. Bit Bit Name Initial Value R/W Description 7 ECH7 0 R 6 ECH6 0 R 5 ECH5 0 R 4 ECH4 0 R Either the external asynchronous event AEVH pin, /2, /4, or /8, or the overflow signal from lower 8-bit counter ECL can be selected as the input clock source. ECH can be cleared to H'00 by clearing CRCH in ESSCR to 0. 3 ECH3 0 R 2 ECH2 0 R 1 ECH1 0 R 0 ECH0 0 R 13.3.7 Event Counter L (ECL) ECL is an 8-bit read-only up-counter that operates as an independent 8-bit event counter. ECL also operates as the upper 8-bit up-counter of a 16-bit event counter configured in combination with ECH. Bit Bit Name Initial Value R/W Description 7 ECL7 0 R 6 ECL6 0 R 5 ECL5 0 R Either the external asynchronous event AEVL pin, /2, /4, or /8 can be selected as the input clock source. ECL can be cleared to H'00 by clearing CRCL in ESSCR to 0. 4 ECL4 0 R 3 ECL3 0 R 2 ECL2 0 R 1 ECL1 0 R 0 ECL0 0 R Rev. 3.00 Aug 23, 2006 Page 289 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) 13.4 Operation 13.4.1 16-Bit Counter Operation When bit CH2 is cleared to 0 in ECCSR, ECH and ECL operate as a 16-bit event counter. Any of four input clock sources--/2, /4, /8, or AEVL pin input--can be selected by means of bits ACKL1 and ACKL0 in ECCR. When AEVL pin input is selected, input sensing is selected with bits ALEGS1 and ALEGS0. Note that the input clock is enabled when IRQAEC is high or IECPWM is high. When IRQAEC is low or IECPWM is low, the input clock is not input to the counter, which therefore does not operate. Figure 13.2 shows the software procedure when ECH and ECL are used as a 16-bit event counter. Start Clear CH2 to 0 Set ACKL1, ACKL0, ALEGS1, and ALEGS0 Clear CUEH, CUEL, CRCH, and CRCL to 0 Clear OVH and OVL to 0 Set CUEH, CUEL, CRCH, and CRCL to 1 End Figure 13.2 Software Procedure when Using ECH and ECL as 16-Bit Event Counter As CH2 is cleared to 0 by a reset, ECH and ECL operate as a 16-bit event counter after a reset, and as ACKL1 and ACKL0 are cleared to B'00, the operating clock is asynchronous event input from the AEVL pin (using falling edge sensing). When the next clock is input after the count value reaches H'FF in both ECH and ECL, ECH and ECL overflow from H'FFFF to H'0000, the OVH flag is set to 1 in ECCSR, the ECH and ECL count values each return to H'00, and counting up is restarted. When an overflow occurs, the IRREC bit is set to 1 in IRR2. If the IENEC bit in IENR2 is 1 at this time, an interrupt request is sent to the CPU. Rev. 3.00 Aug 23, 2006 Page 290 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) 13.4.2 8-Bit Counter Operation When bit CH2 is set to 1 in ECCSR, ECH and ECL operate as independent 8-bit event counters. /2, /4, /8, or AEVH pin input can be selected as the input clock source for ECH by means of bits ACKH1 and ACKH0 in ECCR, and /2, /4, /8, or AEVL pin input can be selected as the input clock source for ECL by means of bits ACKL1 and ACKL0 in ECCR. Input sensing is selected with bits AHEGS1 and AHEGS0 when AEVH pin input is selected, and with bits ALEGS1 and ALEGS0 when AEVL pin input is selected. Note that the input clock is enabled when IRQAEC is high or IECPWM is high. When IRQAEC is low or IECPWM is low, the input clock is not input to the counter, which therefore does not operate. Figure 13.3 shows the software procedure when ECH and ECL are used as 8-bit event counters. Start Set CH2 to 1 Set ACKH1, ACKH0, ACKL1, ACKL0, AHEGS1, AHEGS0, ALEGS1, and ALEGS0 Clear CUEH, CUEL, CRCH, and CRCL to 0 Clear OVH and OVL to 0 Set CUEH, CUEL, CRCH, and CRCL to 1 End Figure 13.3 Software Procedure when Using ECH and ECL as 8-Bit Event Counters When the next clock is input after the ECH count value reaches H'FF, ECH overflows, the OVH flag is set to 1 in ECCSR, the ECH count value returns to H'00, and counting up is restarted. Similarly, when the next clock is input after the ECL count value reaches H'FF, ECL overflows, the OVL flag is set to 1 in ECCSR, the ECL count value returns to H'00, and counting up is restarted. When an overflow occurs, the IRREC bit is set to 1 in IRR2. If the IENEC bit in IENR2 is 1 at this time, an interrupt request is sent to the CPU. Rev. 3.00 Aug 23, 2006 Page 291 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) 13.4.3 IRQAEC Operation When the ECPWME bit in AEGSR is 0, the ECH and ECL input clocks are enabled when IRQAEC goes high. When IRQAEC goes low, the input clocks are not input to the counters, and so ECH and ECL do not count. ECH and ECL count operations can therefore be controlled from outside by controlling IRQAEC. In this case, ECH and ECL cannot be controlled individually. IRQAEC can also operate as an interrupt source. Interrupt enabling is controlled by IENEC2 in IENR1. When an IRQAEC interrupt is generated, IRR1 interrupt request flag IRREC2 is set to 1. If IENEC2 in IENR1 is set to 1 at this time, an interrupt request is sent to the CPU. Rising, falling, or both edge sensing can be selected for the IRQAEC input pin with bits AIAGS1 and AIAGS0 in AEGSR. 13.4.4 Event Counter PWM Operation When the ECPWME bit in AEGSR is 1, the ECH and ECL input clocks are enabled when event counter PWM output (IECPWM) is high. When IECPWM is low, the input clocks are not input to the counters, and so ECH and ECL do not count. ECH and ECL count operations can therefore be controlled cyclically from outside by controlling event counter PWM. In this case, ECH and ECL cannot be controlled individually. IECPWM can also operate as an interrupt source. Interrupt enabling is controlled by IENEC2 in IENR1. When an IECPWM interrupt is generated, IRR1 interrupt request flag IRREC2 is set to 1. If IENEC2 in IENR1 is set to 1 at this time, an interrupt request is sent to the CPU. Rising, falling, or both edge detection can be selected for IECPWM interrupt sensing with bits AIAGS1 and AIAGS0 in AEGSR. Figure 13.4 and table 13.2 show examples of event counter PWM operation. toff = (T x (Ndr +1)) - tcyc ton tcm = T x (Ncm +1) ton: toff: tcm: T: Ndr: Clock input enable time Clock input disable time One conversion period ECPWM input clock cycle Value of ECPWDR Fixed low when Ndr =H'FFFF Ncm: Value of ECPWCR tcyc: System clock () cycle time Figure 13.4 Event Counter Operation Waveform Rev. 3.00 Aug 23, 2006 Page 292 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) Note: Ndr and Ncm above must be set so that Ndr < Ncm. If the settings do not satisfy this condition, the output of the event counter PWM is fixed low. Table 13.2 Examples of Event Counter PWM Operation Conditions: fosc = 4 MHz, f = 4 MHz, high-speed active mode, ECPWCR value (Ncm) = H'7A11, ECPWDR value (Ndr) = H'16E3 Clock Clock toff = Source Source ECPWCR ECPWDR (T x (Ndr + 1)) tcm = ton = Selection Cycle (T)* Value (Ncm) Value (Ndr) - tcyc T x (Ncm + 1) tcm - toff /2 0.5 s H'7A11 H'16E3 2.92975 ms 15.625 ms 12.69525 ms /4 1 s D'31249 D'5859 5.85975 ms 31.25 ms 25.39025 ms /8 2 s 11.71975 ms 62.5 ms 50.78025 ms /16 4 s 23.43975 ms 125.0 ms 101.56025 ms /32 8 s 46.87975 ms 250.0 ms 203.12025 ms /64 16 s 93.75975 ms 500.0 ms 406.24025 ms Note: 13.4.5 * toff minimum width Operation of Clock Input Enable/Disable Function The clock input to the event counter can be controlled by the IRQAEC pin when ECPWME in AEGSR is 0, and by the event counter PWM output, IECPWM when ECPWME in AEGSR is 1. As this function forcibly terminates the clock input by each signal, a maximum error of one count will occur depending on the IRQAEC or IECPWM timing. Figure 13.5 shows an example of the operation. Input event IRQAEC or IECPWM Edge generated by clock return Actually counted clock source Counter value N N+1 N+2 N+3 N+4 N+5 N+6 Clock stopped Figure 13.5 Example of Clock Control Operation Rev. 3.00 Aug 23, 2006 Page 293 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) 13.5 Operating States of Asynchronous Event Counter The operating states of the asynchronous event counter are shown in table 13.3. Table 13.3 Operating States of Asynchronous Event Counter Operating Mode Reset Active Sleep Watch AEGSR Reset Functions Functions Retained* ECCR Reset Functions Functions 1 Functions 1 Retained* Reset Functions Functions Retained* ECH Reset Functions Functions Functions* * Reset Functions Functions 2 1 2 Functions 2 2 Retained 1 Retained Retained* 1 Functions Functions* 1 Retained* Functions Functions 1 Functions* * Retained* Functions* 2 Functions* 2 Retained 1 2 Halted 1 2 Halted Functions* * Functions* * Reset Functions Functions Retained* Functions Functions Retained* Retained*4 Event counter Reset Functions Functions Retained Retained Retained Retained Retained IRQAEC 3 Functions Functions 1 ECCSR ECL Module Standby Sub-active Sub-sleep Standby 3 PWM Notes: 1. When an asynchronous external event is input, the counter increments. However, an interrupt request is issued when the counter overflows. 2. Functions when asynchronous external events are selected; halted and retained otherwise. 3. Clock control by IRQAEC operates, but interrupts do not. 4. As the clock is stopped in module standby mode, IRQAEC has no effect. Rev. 3.00 Aug 23, 2006 Page 294 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) 13.6 Usage Notes 1. When reading the values in ECH and ECL, first clear bits CUEH and CUEL to 0 in ECCSR in 8-bit mode and clear bit CUEL to 0 in 16-bit mode to prevent asynchronous event input to the counter. The correct value will not be returned if the event counter increments while being read. 2. For input to the AEVH and AEVL pins, use a clock with a frequency of up to 4.2 MHz within the range from 1.8 to 3.6 V and up to 10 MHz within the range from 2.7 to 3.6 V. For the high and low widths of the clock, see section 25, Electrical Characteristics. The duty cycle is arbitrary. Table 13.4 shows a maximum clock frequency. Table 13.4 Maximum Clock Frequency Mode Maximum Clock Frequency Input to AEVH/AEVL Pin Active (high-speed), sleep (high-speed) 10 MHz Active (medium-speed), sleep (medium-speed) (OSC/8) 2 * fOSC (OSC/16) fOSC (OSC/32) 1/2 * fOSC fOSC = 1 MHz to 4 MHz (OSC/64) 1/4 * fOSC Watch, subactive, subsleep, standby (W/2) 1000 kHz (W/4) 500 kHz (W/8) 250 kHz W = 32.768 kHz or 38.4 kHz 3. When AEC uses with 16-bit mode, set CUEH in ECCSR to 1 first, set CRCH in ECCSR to 1 second, or set both CUEH and CRCH to 1 at same time before clock input. When AEC is operating on 16-bit mode, do not change CUEH. Otherwise, ECH will be miscounted up. 4. When ECPWME in AEGSR is 1, the event counter PWM is operating and therefore ECPWCR and ECPWDR should not be modified. When changing the data, clear the ECPWME bit in AEGSR to 0 (halt the event counter PWM) before modifying these registers. 5. The event counter PWM data register and event counter PWM compare register must be set so that event counter PWM data register < event counter PWM compare register. If the settings do not satisfy this condition, do not set ECPWME to 1 in AEGSR. Rev. 3.00 Aug 23, 2006 Page 295 of 616 REJ09B0182-0300 Section 13 Asynchronous Event Counter (AEC) 6. As synchronization is established internally when an IRQAEC interrupt is generated, a maximum error of 1 tcyc will occur between clock halting and interrupt acceptance. 7. If the flash memory version was used with the IRQAEC pin fixed high level and then the chip is replaced with the masked ROM version, the internal oscillator must be used. Rev. 3.00 Aug 23, 2006 Page 296 of 616 REJ09B0182-0300 Section 14 Watchdog Timer Section 14 Watchdog Timer This LSI incorporates the watchdog timer (WDT). The WDT is an 8-bit timer that can generate an internal reset signal if a system becomes uncontrolled and prevents the CPU from writing to the timer counter, thus allowing it to overflow. When this watchdog timer function is not needed, the WDT can be used as an interval timer. In interval timer operation, an interval timer interrupt is generated each time the counter overflows. 14.1 Features The WDT features are described below. * Selectable from nine counter input clocks Eight internal clock sources (/64, /128, /256, /512, /1024, /2048, /4096, and /8192) or the WDT on-chip oscillator can be selected as the timer-counter clock. * Watchdog timer mode If the counter overflows, this LSI is internally reset. * Interval timer mode If the counter overflows, an interval timer interrupt is generated. * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) Figure 14.1 shows a block diagram of the WDT. WDT0110A_010020040500 Rev. 3.00 Aug 23, 2006 Page 297 of 616 REJ09B0182-0300 Section 14 Watchdog Timer TCSRWD1 PSS TCWD Internal data bus TMWD WDT on-chip oscillator TCSRWD2 [Legend] TCSRWD1: TCSRWD2: TCWD: TMWD: PSS: Timer control/status register WD1 Timer control/status register WD2 Timer counter WD Timer mode register WD Prescaler S Interrupt/reset control Figure 14.1 Block Diagram of Watchdog Timer 14.2 Register Descriptions The watchdog timer has the following registers. * Timer control/status register WD1 (TCSRWD1) * Timer control/status register WD2 (TCSRWD2) * Timer counter WD (TCWD) * Timer mode register WD (TMWD) Rev. 3.00 Aug 23, 2006 Page 298 of 616 REJ09B0182-0300 Internal reset signal or interrupt request signal Section 14 Watchdog Timer 14.2.1 Timer Control/Status Register WD1 (TCSRWD1) TCSRWD1 performs the TCSRWD1 and TCWD write control. TCSRWD1 also controls the watchdog timer operation and indicates the operating state. TCSRWD1 must be rewritten by using the MOV instruction. The bit manipulation instruction cannot be used to change the setting value. Bit Bit Name Initial Value R/W Description 7 B6WI 1 R/W Bit 6 Write Inhibit The TCWE bit can be written only when the write value of the B6WI bit is 0. This bit is always read as 1. 6 TCWE 0 R/W Timer Counter WD Write Enable TCWD can be written when the TCWE bit is set to 1. When writing data to this bit, the write value for bit 7 must be 0. 5 B4WI 1 R/W Bit 4 Write Inhibit The TCSRWE bit can be written only when the write value of the B4WI bit is 0. This bit is always read as 1. 4 TCSRWE 0 R/W Timer Control/Status Register WD Write Enable The WDON and WRST bits can be written when the TCSRWE bit is set to 1. When writing data to this bit, the write value for bit 5 must be 0. 3 B2WI 1 R/W Bit 2 Write Inhibit The WDON bit can be written only when the write value of the B2WI bit is 0. This bit is always read as 1. Rev. 3.00 Aug 23, 2006 Page 299 of 616 REJ09B0182-0300 Section 14 Watchdog Timer Bit Bit Name Initial Value R/W Description 2 WDON 0 R/W Watchdog Timer On* TCWD starts counting up when the WDON bit is set to 1 and halts when the WDON bit is cleared to 0. [Setting condition] When 1 is written to the WDON bit and 0 to the B2WI bit while the TCSRWE bit is 1 [Clearing conditions] 1 B0WI 1 R/W * Reset by RES pin * When 0 is written to the WDON bit and 0 to the B2WI bit while the TCSRWE bit is 1 Bit 0 Write Inhibit The WRST bit can be written only when the write value of the B0WI bit is 0. This bit is always read as 1. 0 WRST 0 R/W Watchdog Timer Reset [Setting condition] When TCWD overflows and an internal reset signal is generated [Clearing conditions] Note: * * Reset by RES pin * When 0 is written to the WRST bit and 0 to the B0WI bit while the TCSRWE bit is 1 When transitioning to the watch mode or standby mode while the main internal clock is selected (CKS3 = 1) using timer mode register WD (TMWD), make sure to clear WDON to 0 to halt operation of TCWD. Rev. 3.00 Aug 23, 2006 Page 300 of 616 REJ09B0182-0300 Section 14 Watchdog Timer 14.2.2 Timer Control/Status Register WD2 (TCSRWD2) TCSRWD2 performs the TCSRWD2 write control, mode switching, and interrupt control. TCSRWD2 must be rewritten by using the MOV instruction. The bit manipulation instruction cannot be used to change the setting value. Bit Bit Name Initial Value 7 OVF 0 R/(W)* Overflow Flag Indicates that TCWD has overflowed (changes from H'FF to H'00). [Setting condition] When TCWD overflows (changes from H'FF to H'00) When internal reset request generation is selected in watchdog timer mode, this bit is cleared automatically by the internal reset after it has been set. [Clearing condition] * When TCSRWD2 is read when OVF = 1, then 0 is 4 written to OVF* 6 B5WI 1 5 WT/IT 0 4 B3WI 1 3 IEOVF 0 R/(W)* Bit 5 Write Inhibit The WT/IT bit can be written only when the write value of the B5WI bit is 0. This bit is always read as 1. 3 R/(W)* Timer Mode Select Selects whether the WDT is used as a watchdog timer or interval timer. 0: Watchdog timer mode 1: Interval timer mode 2 R/(W)* Bit 3 Write Inhibit The IEOVF bit can be written only when the write value of the B3WI bit is 0. This bit is always read as 1. 3 R/(W)* Overflow Interrupt Enable Enables or disables an overflow interrupt request in interval timer mode. 0: Disables an overflow interrupt 1: Enables an overflow interrupt R/W Description 1 2 Rev. 3.00 Aug 23, 2006 Page 301 of 616 REJ09B0182-0300 Section 14 Watchdog Timer Bit Bit Name Initial Value R/W Description 2 to 0 All 1 Reserved These bits are always read as 1. Notes: 1. Only 0 can be written to clear the flag. 2. Write operation is necessary because this bit controls data writing to other bit. This bit is always read as 1. 3. Writing is possible only when the write conditions are satisfied. 4. In subactive mode, clear this flag after setting the CKS3 to CKS0 bits in TMWD to B'0XXX (WDT on-chip oscillator). Rev. 3.00 Aug 23, 2006 Page 302 of 616 REJ09B0182-0300 Section 14 Watchdog Timer 14.2.3 Timer Counter WD (TCWD) TCWD is an 8-bit readable/writable up-counter. When TCWD overflows from H'FF to H'00, the internal reset signal is generated in watchdog timer mode, the WRST bit in TCSRWD1 is set to 1, and the OVF bit in TCSRWD2 is set to 1. TCWD is initialized to H'00. 14.2.4 Timer Mode Register WD (TMWD) TMWD selects the input clock. Bit Bit Name Initial Value R/W Description 7 to 4 All 1 Reserved These bits are always read as 1. 3 CKS3 1 R/W Clock Select 3 to 0 2 CKS2 1 R/W Select the clock to be input to TCWD. 1 CKS1 1 R/W 1000: Internal clock: counts on /64 0 CKS0 1 R/W 1001: Internal clock: counts on /128 1010: Internal clock: counts on /256 1011: Internal clock: counts on /512 1100: Internal clock: counts on /1024 1101: Internal clock: counts on /2048 1110: Internal clock: counts on /4096 1111: Internal clock: counts on /8192 0XXX: WDT on-chip oscillator: counts on ROSC/2048 For the WDT on-chip oscillator overflow periods, see section 25, Electrical Characteristics. In active (medium-speed) mode or sleep (mediumspeed) mode, the setting of B'0XXX and interval timer mode is disabled. [Legend] X: Don't care. Rev. 3.00 Aug 23, 2006 Page 303 of 616 REJ09B0182-0300 Section 14 Watchdog Timer 14.3 Operation 14.3.1 Watchdog Timer Mode The watchdog timer is provided with an 8-bit up-counter. To use it as the watchdog timer, clear the WT/IT bit in TCSRWD2 to 0. (To write the WT/IT bit, two write accesses are required.) If 1 is written to the WDON bit and 0 to the B2WI bit simultaneously when the TCSRWE bit in TCSRWD1 is set to 1, TCWD begins counting up. (To operate the watchdog timer, two write accesses to TCSRWD1 are required.) When a clock pulse is input after the TCWD count value has reached H'FF, the watchdog timer overflows and an internal reset signal is generated. The internal reset signal is output for a period of 256 osc clock cycles. TCWD is a writable counter, and when a value is set in TCWD, the count-up starts from that value. An overflow period in the range of 1 to 256 input clock cycles can therefore be set, according to the TCWD set value. Figure 14.2 shows an example of watchdog timer operation. Example: With 30-ms overflow period when = 4 MHz 4 x 106 8192 x 30 x 10-3 = 14.6 Therefore, 256 - 15 = 241 (H'F1) is set in TCW. TCWD overflow H'FF H'F1 TCWD count value H'00 Start H'F1 written to TCWD H'F1 written to TCWD Reset generated Internal reset signal 256 osc clock cycles Figure 14.2 Example of Watchdog Timer Operation Rev. 3.00 Aug 23, 2006 Page 304 of 616 REJ09B0182-0300 Section 14 Watchdog Timer 14.3.2 Interval Timer Mode Figure 14.3 shows the operation in interval timer mode. To use the WDT as an interval timer, set the WT/IT bit in TCSRWD2 to 1. When the WDT is used as an interval timer, an interval timer interrupt request is generated each time the TCNT overflows. Therefore, an interval timer interrupt can be generated at intervals. H'FF TCNT count value Time H'00 WT/IT = 1 Interval timer Interval timer Interval timer Interval timer Interval timer interrupt interrupt interrupt interrupt interrupt request generated request generated request generated request generated request generated Figure 14.3 Interval Timer Mode Operation 14.3.3 Timing of Overflow Flag (OVF) Setting Figure 14.4 shows the timing of the OVF flag setting. The OVF flag in TCSRWD2 is set to 1 if TCNT overflows. At the same time, a reset signal is output in watchdog timer mode and an interval timer interrupt is generated in interval timer mode. H'FF TCNT H'00 Overflow signal OVF Figure 14.4 Timing of OVF Flag Setting Rev. 3.00 Aug 23, 2006 Page 305 of 616 REJ09B0182-0300 Section 14 Watchdog Timer 14.4 Interrupt During interval timer mode operation, an overflow generates an interval timer interrupt. The interval timer interrupt is requested whenever the OVF flag is set to 1 while the IEOVF bit in TCSRWD2 is set to 1. The OVF flag must be cleared to 0 in the interrupt handling routine. 14.5 Usage Notes 14.5.1 Switching between Watchdog Timer Mode and Interval Timer Mode If the mode is switched between watchdog timer and interval timer, while the WDT is operating, errors could occur in the incrementation. Software must stop the watchdog timer (by clearing the WDON bit to 0) before switching the mode. 14.5.2 Module Standby Mode Control The WDCKSTP bit in CKSTPR2 is valid when the WDON bit in the timer control/status register 1 (TCSRWD1) is cleared to 0. The WDCKSTP bit can be cleared to 0 while the WDON bit is set to 1 (while the watchdog timer is operating). However, the watchdog timer does not enter module standby mode but continues operating. When the WDON bit is cleared to 0 by software after the watchdog timer stops operating, the WDCKSTP bit is valid at the same time and the watchdog timer enters module standby mode. Rev. 3.00 Aug 23, 2006 Page 306 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Section 15 Serial Communication Interface 3 (SCI3, IrDA) The serial communication interface 3 (SCI3) can handle both asynchronous and clocked synchronous serial communication. In the asynchronous method, serial data communication can be carried out using standard asynchronous communication chips such as a Universal Asynchronous Receiver/Transmitter (UART) or an Asynchronous Communication Interface Adapter (ACIA). The SCI3_1 can transmit and receive IrDA communication waveforms based on the Infrared Data Association (IrDA) standard version 1.0. 15.1 Features * Choice of asynchronous or clocked synchronous serial communication mode * Full-duplex communication capability The transmitter and receiver are mutually independent, enabling transmission and reception to be executed simultaneously. Double-buffering is used in both the transmitter and the receiver, enabling continuous transmission and continuous reception of serial data. * On-chip baud rate generator allows any bit rate to be selected * On-chip baud rate generator, internal clock, or external clock can be selected as a transfer clock source. * Six interrupt sources Transmit-end, transmit-data-empty, receive-data-full, overrun error, framing error, and parity error. * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) Asynchronous mode * Data length: 7, 8, or 5 bits * Stop bit length: 1 or 2 bits * Parity: Even, odd, or none * Receive error detection: Parity, overrun, and framing errors * Break detection: Break can be detected by reading the RXD32 pin level directly in the case of a framing error Note: When using serial communication interface 3 in the masked ROM version, do not use the on-chip oscillator. SCI0012A_010020040500 Rev. 3.00 Aug 23, 2006 Page 307 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Clocked synchronous mode * Data length: 8 bits * Receive error detection: Overrun errors detected Table 15.1 SCI3 Channel Configuration 1 Channel Abbreviation Pin* Channel 1 SCI3_1 SCK31 RXD31 TXD31 Channel 2 SCI3_2 SCK32 RXD32 TXD32 2 Register* Register Address SMR3_1 H'FF98 BRR3_1 H'FF99 SCR3_1 H'FF9A TDR3_1 H'FF9B SSR3_1 H'FF9C RDR3_1 H'FF9D RSR3_1 TSR3_1 IrCR H'FFA7 SMR3_2 H'FFA8 BRR3_2 H'FFA9 SCR3_2 H'FFAA TDR3_2 H'FFAB SSR3_2 H'FFAC RDR3_2 H'FFAD RSR3_2 TSR3_2 Notes: 1. Pin names SCK3, RXD3, and TXD3 are used in the text for all channels, omitting the channel designation. 2. In the text, channel description is omitted for registers and bits. Rev. 3.00 Aug 23, 2006 Page 308 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Figure 15.1 (1) shows a block diagram of the SCI3_1 and figure 15.1 (2) shows that of the SCI3_2. SCK31 Internal clock (/64, /16, w/2, ) External clock Baud rate generator BRC3_1 BRR3_1 SMR3_1 Transmit/receive control circuit SCR3_1 SSR3_1 TXD31 TSR3_1 TDR3_1 RSR3_1 RDR3_1 Internal data bus Clock SPCR IrCR Interrupt request (TEI31, TXI31, RXI31, ERI31) RXD31 [Legend] RSR3_1: Receive shift register 3_1 RDR3_1:Receive data register 3_1 TSR3_1: Transmit shift register 3_1 TDR3_1: Transmit data register 3_1 SMR3_1:Serial mode register 3_1 SCR3_1: Serial control register 3_1 SSR3_1: Serial status register 3_1 BRR3_1: Bit rate register 3_1 BRC3_1: Bit rate counter 3_1 SPCR: Serial port control register IrDA control register IrCR: Figure 15.1 (1) Block Diagram of SCI3_1 Rev. 3.00 Aug 23, 2006 Page 309 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) SCK32 Internal clock (/64, /16, w/2, ) External clock Baud rate generator BRC3_2 BRR3_2 SMR3_2 Transmit/receive control circuit SCR3_2 SSR3_2 TXD32 RXD32 TSR3_2 TDR3_2 RSR3_2 RDR3_2 Internal data bus Clock SPCR Interrupt request (TEI32, TXI32, RXI32, ERI32) [Legend] RSR3_2: RDR3_2: TSR3_2: TDR3_2: SMR3_2: SCR3_2: SSR3_2: BRR3_2: BRC3_2: SPCR: Receive shift register 3_2 Receive data register 3_2 Transmit shift register 3_2 Transmit data register 3_2 Serial mode register 3_2 Serial control register 3_2 Serial status register 3_2 Bit rate register 3_2 Bit rate counter 3_2 Serial port control register Figure 15.1 (2) Block Diagram of SCI3_2 Rev. 3.00 Aug 23, 2006 Page 310 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.2 Input/Output Pins Table 15.2 shows the SCI3 pin configuration. Table 15.2 Pin Configuration Pin Name Abbreviation I/O Function SCI3 clock SCK31, SCK32 I/O SCI3 clock input/output SCI3 receive data input RXD31, RXD32 Input SCI3 receive data input SCI3 transmit data output TXD31, TXD32 Output SCI3 transmit data output 15.3 Register Descriptions The SCI3 has the following registers for each channel. * Receive shift register 3 (RSR3)* * Receive data register 3 (RDR3)* * Transmit shift register 3 (TSR3)* * Transmit data register 3 (TDR3)* * Serial mode register 3 (SMR3)* * Serial control register 3 (SCR3)* * Serial status register 3 (SSR3)* * Bit rate register 3 (BRR3)* * Serial port control register (SPCR) * IrDA control register (IrCR) Note: * These register names are abbreviated to RSR, RDR, TSR, TDR, SMR, SCR, SSR, and BRR in the text. Rev. 3.00 Aug 23, 2006 Page 311 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.3.1 Receive Shift Register (RSR) RSR is a shift register that receives serial data input from the RXD31 or RXD32 pin and converts it into parallel data. When one byte of data has been received, it is transferred to RDR automatically. RSR cannot be directly accessed by the CPU. 15.3.2 Receive Data Register (RDR) RDR is an 8-bit register that stores receive data. When the SCI3 has received one byte of serial data, it transfers the received serial data from RSR to RDR, where it is stored. After this, RSR is receive-enabled. As RSR and RDR function as a double buffer in this way, continuous receive operations are possible. After confirming that the RDRF bit in SSR is set to 1, read RDR only once. RDR cannot be written to by the CPU. RDR is initialized to H'00. RDR is initialized to H'00 by a reset or in standby mode, watch mode, or module standby mode. 15.3.3 Transmit Shift Register (TSR) TSR is a shift register that transmits serial data. To perform serial data transmission, the SCI3 first transfers transmit data from TDR to TSR automatically, then sends the data that starts from the LSB to the TXD31 or TXD32 pin. Data transfer from TDR to TSR is not performed if no data has been written to TDR (if the TDRE bit in SSR is set to 1). TSR cannot be directly accessed by the CPU. 15.3.4 Transmit Data Register (TDR) TDR is an 8-bit register that stores data for transmission. When the SCI3 detects that TSR is empty, it transfers the transmit data written in TDR to TSR and starts transmission. The doublebuffered structure of TDR and TSR enables continuous serial transmission. If the next transmit data has already been written to TDR during transmission of one-frame data, the SCI3 transfers the written data to TSR to continue transmission. To achieve reliable serial transmission, write transmit data to TDR only once after confirming that the TDRE bit in SSR is set to 1. TDR is initialized to H'FF. TDR is initialized to H'FF by a reset or in standby mode, watch mode, or module standby mode. Rev. 3.00 Aug 23, 2006 Page 312 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.3.5 Serial Mode Register (SMR) SMR sets the SCI3's serial communication format and selects the clock source for the on-chip baud rate generator. SMR is initialized to H'00 by a reset or in standby mode, watch mode, or module standby mode. Bit Bit Name Initial Value R/W 7 COM 0 R/W Description Communication Mode 0: Asynchronous mode 1: Clocked synchronous mode 6 CHR 0 R/W Character Length (enabled only in asynchronous mode) 0: Selects 8 or 5 bits as the data length. 1: Selects 7 or 5 bits as the data length. When 7-bit data is selected. the MSB (bit 7) in TDR is not transmitted. To select 5 bits as the data length, set 1 to both the PE and MP bits. The three most significant bits (bits 7, 6, and 5) in TDR are not transmitted. In clocked synchronous mode, the data length is fixed to 8 bits regardless of the CHR bit setting. 5 PE 0 R/W Parity Enable (enabled only in asynchronous mode) When this bit is set to 1, the parity bit is added to transmit data before transmission, and the parity bit is checked in reception. In clocked synchronous mode, parity bit addition and checking is not performed regardless of the PE bit setting. Rev. 3.00 Aug 23, 2006 Page 313 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Bit Bit Name Initial Value R/W Description 4 PM 0 R/W Parity Mode (enabled only when the PE bit is 1 in asynchronous mode) 0: Selects even parity. 1: Selects odd parity. When even parity is selected, a parity bit is added in transmission so that the total numver of 1 bits in the transmit data plus the parity bit is an even number, in reception, a check is carried out to confirm that the number of 1 bits in the receive data plus the parity bit is an enen number. When odd parity is selected, a parity bit is added in transmission so that the total numver of 1 bits in the transmit data plus the parity bit is an odd numver, in reception, a check is carried out to confirm that the numver of 1bits in the receive data plus the parity bit is an odd numver. If parity bit addition and checking is disabled in clocked synchronous mode and asynchronous mode, the PM bit setting is invalid. 3 STOP 0 R/W Stop Bit Length (enabled only in asynchronous mode) Selects the stop bit length in transmission. 0: 1 stop bit 1: 2 stop bits For reception, only the first stop bit is checked, regardless of the value in the bit. If the second stop bit is 0, it is treated as the start bit of the next transmit character. 2 MP 0 R/W 5-Bit Communication When this bit is set to 1, the 5-bit communication format is enabled. When writing 1 to this bit, always write 1 to bit 5 (RE) at the same time. In addition, 1 must be written to bit 3 (MPIE) in the serial control register (SCR) before writing 1 to this bit. Rev. 3.00 Aug 23, 2006 Page 314 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Bit Bit Name Initial Value R/W Description 1 CKS1 0 R/W Clock Select 0 and 1 0 CKS0 0 R/W These bits select the clock source for the on-chip baud rate generator. 00: clock (n = 0) 01: w/2 or w clock (n = 1) 10: /16 clock (n = 2) 11: /64 clock (n = 3) When the setting value is 01 in active (mediumspeed/high-speed) mode and sleep (mediumspeed/high-speed) mode w/2 clock is set. In subacive mode and subsleep mode, w clock is set. The SCI3 is enabled only, when w/2 is selected for the CPU operating clock. For the relationship between the bit rate register setting and the baud rate, see section 15.3.8, Bit Rate Register (BRR). n is the decimal representation of the value of n in BRR (see section 15.3.8, Bit Rate Register (BRR)). Rev. 3.00 Aug 23, 2006 Page 315 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.3.6 Serial Control Register (SCR) SCR enables or disables SCI3 transfer operations and interrupt requests, and selects the transfer clock source. For details on interrupt requests, refer to section 15.8, Interrupt Requests. SCR is initialized to H'00 by a reset or in standby mode, watch mode, or module standby mode. Bit Bit Name Initial Value R/W 7 TIE 0 R/W Description Transmit Interrupt Enable When this bit is set to 1, the TXI (TXI32) interrupt request is enabled. TXI (TXI32) can be released by clearing the TDRE it or TI bit to 0. 6 RIE 0 R/W Receive Interrupt Enable When this bit is set to 1, RXI and ERI interrupt requests are enabled. RXI (RXI32) and ERI (ERI32) can be released by clearing the RDRF bit or the FER, PER, or OER error flag to 0, or by clearing the RIE bit to 0. 5 TE 0 R/W Transmit Enable When this bit is set to 1, transmission is enabled. When this bit is 0, the TDRE bit in SSR is fixed at 1. When transmit data is written to TDR while this bit is 1, Bit TDRE in SSR is cleared to 0 and serial data tansmission is started. Be sure to carry out SMR settings, and setting of bit SPC31 or SPC32 in SPCR, to decide the transmission format before setting bit TE to 1. 4 RE 0 R/W Receive Enable When this bit is set to 1, reception is enabled. In this state, serial data reception is started when a start bit is detected in asynchronous mode or serial clock input is detected in clocked synchronous mode. Be sure to carry out the SMR settings to decide the reception format before setting bit RE to 1. Note that the RDRF, FER, PER, and OER flags in SSR are not affected when bit RE is cleared to 0, and retain their previous state Rev. 3.00 Aug 23, 2006 Page 316 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Bit Bit Name Initial Value R/W Description 3 MPIE 0 R/W Reserved 2 TEIE 0 R/W Transmit End Interrupt Enable When this bit is set to 1, the TEI interrupt request is enabled. TEI can be released by clearing bit TDRE to 0 and clearing bit TEND to 0 in SSR, or by clearing bit TEIE to 0. 1 CKE1 0 R/W Clock Enable 0 and 1 0 CKE0 0 R/W Select the clock source. Asynchronous mode: 00: Internal baud rate generator (SCK31 or SCK32 pin functions as an I/O port) 01: Internal baud rate generator (Outputs a clock of the same frequency as the bit rate from the SCK31 or SCK32 pin) 10: External clock (Inputs a clock with a frequency 16 times the bit rate from the SCK31 or SCK32 pin) 11: Reserved Clocked synchronous mode: 00: Internal clock (SCK31 or SCK32 pin functions as clock output) 01: Reserved 10: External clock (SCK31 or SCK32 pin functions as clock input) 11: Reserved Rev. 3.00 Aug 23, 2006 Page 317 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.3.7 Serial Status Register (SSR) SSR consists of status flags of the SCI3 and multiprocessor bits for transfer. 1 cannot be written to flags TDRE, RDRF, OER, PER, and FER; they can only be cleared. SSR is initialized to H'84 by a reset or in standby mode, watch mode, or module standby mode. Bit Bit Name Initial Value R/W 7 TDRE 1 R/(W)* Transmit Data Register Empty Description Indicates that transmit data is stored in TDR. [Setting conditions] * When the TE bit in SCR is 0 * When data is transferred from TDR to TSR [Clearing conditions] 6 RDRF 0 * When 0 is written to TDRE after reading TDRE = 1 * When the transmit data is written to TDR R/(W)* Receive Data Register Full Indicates that the received data is stored in RDR. [Setting condition] * When serial reception ends normally and receive data is transferred from RSR to RDR [Clearing conditions] * When 0 is written to RDRF after reading RDRF = 1 When data is read from RDR If an error is detected in reception, or if the RE bit in SCR has been cleared to 0, RDR and bit RDRF are not affected and retain their previous state. Note that if data reception is completed while bit RDRF is still set to 1, an overrun error (OER) will occur and the receive data will be lost. Rev. 3.00 Aug 23, 2006 Page 318 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Bit Bit Name Initial Value R/W 5 OER 0 R/(W)* Overrun Error Description [Setting condition] * When an overrun error occurs in reception [Clearing condition] * When 0 is written to OER after reading OER = 1 When bit RE in SCR is cleared to 0, bit OER is not affected and retains its previous state. When an overrun error occurs, RDR retains the receive data it held before the overrun error occurred, and data received after the error is lost. Reception cannot be continued with bit OER set to 1, and in clocked synchronous mode, transmission cannot be continued either. 4 FER 0 R/(W)* Framing Error [Setting condition] * When a framing error occurs in reception [Clearing condition] * When 0 is written to FER after reading FER = 1 When bit RE in SCR is cleared to 0, bit FER is not affected and retains its previous state. Note that, in 2-stop-bit mode, only the first stop bit is checked for a value of 1, and the second stop bit is not checked. When a framing error occurs, the receive data is transferred to RDR but bit RDRF is not set. Reception cannot be continued with bit FER set to 1. In clocked synchronous mode, neither transmission nor reception is possible when bit FER is set to 1. Rev. 3.00 Aug 23, 2006 Page 319 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Bit Bit Name Initial Value R/W 3 PER 0 R/(W)* Parity Error Description [Setting condition] * When a parity error is generated during reception [Clearing condition] * When 0 is written to PER after reading PER = 1 When bit RE in SCR is cleared to 0, bit PER is not affected and retains its previous state. * 2 TEND 1 R Receive data in which a parity error has occurred is still transferred to RDR, but bit RDRF is not set. Reception cannot be continued with bit PER set to 1. In clocked synchronous mode, neither transmission nor reception is possible when bit PER is set to 1. Transmit End [Setting conditions] * When the TE bit in SCR is 0 * When TDRE = 1 at transmission of the last bit of a 1-byte serial transmit character [Clearing conditions] 1 MPBR 0 R * When 0 is written to TDRE after readingTDRE = 1 * When the transmit data is written to TDR Reserved This bit is read-only and reserved. It cannot be written to. 0 MPBT 0 R/W Reserved The write value should always be 0. Note: * Only 0 can be written to clear the flag. Rev. 3.00 Aug 23, 2006 Page 320 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.3.8 Bit Rate Register (BRR) BRR is an 8-bit readable/writable register that adjusts the bit rate. BRR is initialized to H'FF. Table 15.3 shows the relationship between the N setting in BRR and the n setting in bits CKS1 and CKS0 in SMR in asynchronous mode. Table 15.5 shows the maximum bit rate for each frequency in asynchronous mode. The values shown in both tables 15.3 and 15.5 are values in active (high-speed) mode. Table 15.6 shows the relationship between the N setting in BRR and the n setting in bits CKS1 and CKS0 in SMR in clocked synchronous mode. The values shown in table 15.6 are values in active (high-speed) mode. The N setting in BRR and error for other operating frequencies and bit rates can be obtained by the following formulas: [Asynchronous Mode] Active (medium-speed/high-speed) or sleep (medium-speed/high-speed): N= OSC -1 32 x 22n x B Error (%) = B (bit rate obtained from n, N, ) - R (bit rate in left-hand column in table 15.3) R (bit rate in left-hand column in table 15.3) x 100 Subactive or subsleep: N= [Legend] B: N: OSC -1 64 x 22n x B Bit rate (bit/s) BRR setting for baud rate generator (0 N 255) OSC: osc value (Hz) n: Baud rate generator input clock number (n = 0, 2, or 3) (The relation between n and the clock is shown in table 15.3) Rev. 3.00 Aug 23, 2006 Page 321 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1) 32.8kHz 38.4kHz 2MHz 2.097152MHz Bit Rate (bit/s) n N Error (%) n N Error (%) n N Error (%) n N Error (%) 110 -- -- -- -- -- -- 2 35 -1.36 2 36 0.64 150 -- -- -- 0 3 0.00 2 25 0.16 2 26 1.14 200 -- -- -- 0 2 0.00 2 19 -2.34 3 4 2.40 250 0 1 2.50 -- -- -- 0 249 0.00 3 3 2.40 300 -- -- -- 0 1 0.00 0 207 0.16 0 217 0.21 600 -- -- -- 0 0 0.00 0 103 0.16 0 108 0.21 1200 -- -- -- -- -- -- 0 51 0.16 0 54 -0.70 2400 -- -- -- -- -- -- 0 25 0.16 0 26 1.14 4800 -- -- -- -- -- -- 0 12 0.16 0 13 -2.48 9600 -- -- -- -- -- -- -- -- -- 0 6 -2.48 19200 -- -- -- -- -- -- -- -- -- -- -- -- 31250 -- -- -- -- -- -- 0 1 0.00 -- -- -- 38400 -- -- -- -- -- -- -- -- -- -- -- -- Rev. 3.00 Aug 23, 2006 Page 322 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2) Bit Rate (bit/s) n 2.4576MHz N 3MHz 3.6864MHz 4MHz 4.194MHz Error (%) n N Error (%) n N Error (%) n N Error (%) n N Error (%) 110 3 10 -0.83 2 52 0.50 2 64 0.70 2 70 0.03 2 73 0.63 150 3 7 0.00 2 38 0.16 3 11 0.00 2 51 0.16 2 54 -0.71 200 3 5 0.00 2 28 1.02 3 8 0.00 2 38 0.16 2 40 -0.10 250 2 18 1.05 2 22 1.90 2 28 -0.69 2 30 0.81 2 32 -0.71 300 3 3 0.00 3 4 -2.34 3 5 0.00 2 25 0.16 2 26 1.13 600 3 1 0.00 0 155 0.16 3 2 0.00 0 207 0.16 0 217 0.20 1200 3 0 0.00 0 77 0.16 2 5 0.00 0 103 0.16 0 108 0.20 2400 2 1 0.00 0 38 0.16 2 2 0.00 0 51 0.16 0 54 -0.71 4800 2 0 0.00 0 19 -2.34 0 23 0.00 0 25 0.16 0 26 1.13 9600 0 7 0.00 0 9 -2.34 0 11 0.00 0 12 0.16 0 13 -2.48 19200 0 3 0.00 0 4 -2.34 0 5 0.00 -- -- -- 0 6 -2.48 31250 -- -- -- 0 2 0.00 -- -- -- 0 0.00 -- -- -- 38400 0 0.00 -- -- -- 0 2 0.00 -- -- -- -- -- -- 1 3 Rev. 3.00 Aug 23, 2006 Page 323 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (3) 4.9152MHz 5MHz 6MHz 6.144MHz Bit Rate (bit/s) n N Error (%) n N Error (%) n N Error (%) n N Error (%) 110 2 86 0.31 2 88 -0.25 2 106 -0.44 2 108 0.08 150 3 15 0.00 2 64 0.16 2 77 0.16 3 19 0.00 200 3 11 0.00 2 48 -0.35 2 58 -0.69 3 14 0.00 250 2 37 1.05 2 38 0.16 2 46 -0.27 3 11 0.00 300 3 7 0.00 2 32 -1.36 2 38 0.16 3 9 0.00 600 3 3 0.00 0 255 1.73 3 4 -2.34 3 4 0.00 1200 3 1 0.00 0 129 0.16 0 155 0.16 2 9 0.00 2400 3 0 0.00 0 64 0.16 0 77 0.16 2 4 0.00 4800 2 1 0.00 0 32 -1.36 0 38 0.16 0 39 0.00 9600 2 0 0.00 2 0 1.73 0 19 -2.34 0 19 0.00 19200 0 7 0.00 0 7 1.73 0 9 -2.34 0 9 0.00 31250 0 4 -1.70 0 4 0.00 0 5 0.00 0 5 2.4 38400 0 3 0.00 0 3 1.73 0 4 -2.34 0 4 0.00 Rev. 3.00 Aug 23, 2006 Page 324 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (4) 7.3728MHz 8MHz 9.8304MHz 10MHz Bit Rate (bit/s) n N Error (%) n N Error (%) n N Error (%) n N Error (%) 110 2 130 -0.07 2 141 0.03 2 174 -0.26 2 177 -0.25 150 3 23 0.00 2 103 0.16 3 31 0.00 2 129 0.16 200 3 17 0.00 2 77 0.16 3 23 0.00 2 97 -0.35 250 2 57 -0.69 2 62 -0.79 2 76 -0.26 2 77 0.16 300 3 11 0.00 2 51 0.16 3 15 0.00 2 64 0.16 600 3 5 0.00 2 25 0.16 3 7 0.00 2 32 -1.36 1200 3 2 0.00 2 12 0.16 3 3 0.00 2 15 1.73 2400 2 5 0.00 0 103 0.16 3 1 0.00 0 129 0.16 4800 2 2 0.00 0 51 0.16 3 0 0.00 0 64 0.16 9600 0 23 0.00 0 25 0.16 2 1 0.00 0 32 -1.36 19200 0 11 0.00 0 12 0.16 2 0 0.00 0 15 1.73 31250 -- -- -- 0 7 0.00 0 9 -1.70 0 9 0.00 38400 0 5 0.00 -- -- -- 0 7 0.00 0 7 1.73 Table 15.4 Relation between n and Clock SMR Setting CKS1 CKS0 0 0 0 1 /16 1 0 /64 1 1 n Clock 0 0 W/2* /W* 2 3 1 2 Notes: 1. W/2 clock in active (medium-speed/high-speed) mode and sleep (medium-speed/highspeed) mode 2. W clock in subactive mode and subsleep mode In subactive or subsleep mode, the SCI3 can be operated only when CPU clock is W/2. Rev. 3.00 Aug 23, 2006 Page 325 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.5 Maximum Bit Rate for Each Frequency (Asynchronous Mode) Setting (MHz) Maximum Bit Rate (bit/s) 0.0328 512.5 0 0 0.0384 600 0 0 2 62500 0 0 2.097152 65535 0 0 2.4576 76800 0 0 3 93750 0 0 3.6864 115200 0 0 4 125000 0 0 4.194 131065 0 0 4.9152 153595 0 0 5 156250 0 0 6 187500 0 0 6.144 192000 0 0 7.3728 230400 0 0 8 250000 0 0 9.8304 307200 0 0 312500 0 0 10 Note: * When CKS1 = 0 and CKS0 = 1 in SMR Rev. 3.00 Aug 23, 2006 Page 326 of 616 REJ09B0182-0300 n N Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.6 BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (1) 32.8 kHz 38.4 kHz 2 MHz Bit Rate (bit/s) n N Error (%) n N Error (%) n N Error (%) 200 0 20 -2.38 0 23 0.00 2 155 0.16 250 0 15 2.50 0 18 1.05 2 124 0.00 300 0 13 -2.38 0 15 0.00 2 103 0.16 500 0 7 2.50 0 2 62 -0.79 1k 0 3 2.50 2 30 0.81 2.5k 0 199 0.00 5k 0 99 0.00 10k 0 49 0.00 25k 0 19 0.00 50k 0 9 0.00 100k 0 4 0.00 250k 0 1 0.00 500k 0* 0* 0.00* 1M Note: * Continuous transmission/reception is not possible. Rev. 3.00 Aug 23, 2006 Page 327 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.6 BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (2) 4 MHz 8 MHz Bit Rate (bit/s) n N Error (%) n N 200 3 77 0.16 3 250 2 249 0.00 300 2 500 n N Error (%) 155 0.16 3 194 0.16 3 124 0.00 3 155 0.16 207 0.16 3 103 0.16 3 129 0.16 2 124 0.00 2 249 0.00 3 77 0.16 1k 2 62 -0.79 2 124 0.00 2 155 0.16 2.5k 2 24 0.00 2 49 0.00 2 62 -0.79 5k 0 199 0.00 2 24 0.00 2 30 0.81 10k 0 99 0.00 0 199 0.00 2 15 -2.34 25k 0 39 0.00 0 79 0.00 0 99 0.00 50k 0 19 0.00 0 39 0.00 0 49 0.00 100k 0 9 0.00 0 19 0.00 0 24 0.00 250k 0 3 0.00 0 7 0.00 0 9 0.00 500k 0 1 0.00 0 3 0.00 0 4 0.00 0* 0* 0.00* 0 1 0.00 1M Note: * Error (%) 10 MHz Continuous transmission/reception is not possible. The value set in BRR is given by the following formula. Active (medium-speed/high-speed) or sleep (medium-speed/high-speed): N= OSC 4 x 22n x B Subactive or subsleep: OSC N= 8 x 22n x B B: N: OSC: n: -1 -1 Bit rate (bit/s) BRR setting for baud rate generator (0 N 255) osc value (Hz) Baud rate generator input clock number (n = 0, 2, or 3) (The relation between n and the clock is shown in table 15.7.) Rev. 3.00 Aug 23, 2006 Page 328 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.7 Relation between n and Clock SMR Setting CKS1 CKS0 0 0 0 1 /16 1 0 /64 1 1 n Clock 0 0 W/2* /W* 2 3 1 2 Notes: 1. W/2 clock in active (medium-speed/high-speed) mode and sleep (medium-speed/highspeed) mode 2. W clock in subactive or subsleep mode In subactive or subsleep mode, the SCI3_1 and SCI3_2 can be operated only when CPU clock is W/2. 15.3.9 Serial Port Control Register (SPCR) SPCR selects the functions of the TXD32 and TXD31 pins. Bit Bit Name Initial Value R/W Description 7 1 Reserved 6 1 These bits are always read as 1 and cannot be modified. 5 SPC32 0 R/W P32/TXD33 Pin Function Switch Selects whether pin P32/TXD32 is used as P32 or as TXD32. 0: P32 I/O pin 1: TXD32 output pin Set the TE32 bit in SCR32 after setting this bit to 1. 4 SPC31 0 R/W P42/TXD31 Pin Function Switch Selects whether pin P42/TXD31 is used as P42 or as TXD31. 0: P42 I/O pin 1: TXD31 output pin Set the TE bit in SCR after setting this bit to 1. Rev. 3.00 Aug 23, 2006 Page 329 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Bit Bit Name Initial Value R/W Description 3 SCINV3 0 R/W TXD32 Pin Output Data Inversion Switch Selects whether the polarity of output data of the TXD32 pin is inverted or not. 0: Output data of TXD32 pin is not inverted. 1: Output data of TXD32 pin is inverted. 2 SCINV2 0 R/W RXD32 Pin Input Data Inversion Switch Selects whether the polarity of input data of the RXD32 pin is inverted or not. 0: Output data of RXD32 pin is not inverted. 1: Output data of RXD32 pin is inverted. 1 SCINV1 0 R/W TXD31 Pin Output Data Inversion Switch Selects whether the polarity of output data of the TXD31 pin is inverted or not. 0: Output data of TXD31 pin is not inverted. 1: Output data of TXD31 pin is inverted. 0 SCINV0 0 R/W RXD31 Pin Input Data Inversion Switch Selects whether the polarity of input data of the RXD31 pin is inverted or not. 0: Input data of RXD31 pin is not inverted. 1: Input data of RXD31 pin is inverted. Note: When the serial port control register is modified, the data being input or output up to that point is inverted immediately after the modification, and an invalid data change is input or output. When modifying the serial port control register, modification must be made in a state in which data changes are invalidated. Rev. 3.00 Aug 23, 2006 Page 330 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.3.10 IrDA Control Register (IrCR) IrCR controls the IrDA operation of the SCI3_1. Bit Bit Name Initial Value R/W 7 IrE 0 R/W Description IrDA Enable Selects whether the SCI3_1 I/O pins function as the SCI or IrDA. 0: TXD31/IrTXD or RXD31/IrRXD pin functions as TXD31 or RXD31 1: TXD31/IrTXD or RXD31/IrRXD pin functions as IrTXD or IrRXD 6 IrCKS2 0 R/W IrDA Clock Select 5 IrCKS1 0 R/W 4 IrCKS0 0 R/W If the IrDA function is enabled, these bits set the highpulse width when encoding the IrTXD output pulse. 000: Bit rate x 3/16 001: /2 010: /4 011: /8 100: /16 101: Setting prohibited 11x: Setting prohibited 3 to 0 0 Reserved These bits are always read as 0 and cannot be modified. [Legend] x: Don't care. Rev. 3.00 Aug 23, 2006 Page 331 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.4 Operation in Asynchronous Mode Figure 15.2 shows the general format for asynchronous serial communication. One frame consists of a start bit (low level), followed by data (in LSB-first order), a parity bit (high or low level), and finally stop bits (high level). In asynchronous mode, synchronization is performed at the falling edge of the start bit during reception. The data is sampled on the 8th pulse of a clock with a frequency 16 times the bit period, so that the transfer data is latched at the center of each bit. Inside the SCI3, the transmitter and receiver are independent units, enabling full duplex. Both the transmitter and the receiver also have a double-buffered structure, so data can be read or written during transmission or reception, enabling continuous data transfer. Table 15.8 shows the 16 data transfer formats that can be set in asynchronous mode. The format is selected by the settings in SMR as shown in table 15.9. LSB Serial Start data bit 1 bit MSB Transmit/receive data 5, 7, or 8 bits 1 Parity bit 1 bit, or none Stop bit 1 or 2 bits One unit of transfer data (character or frame) Figure 15.2 Data Format in Asynchronous Communication Rev. 3.00 Aug 23, 2006 Page 332 of 616 REJ09B0182-0300 Mark state Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.4.1 Clock Either an internal clock generated by the on-chip baud rate generator or an external clock input at the SCK31 (SCK32) pin can be selected as the SCI3's serial clock source, according to the setting of the COM bit in SMR and the CKE0 and CKE1 bits in SCR. When an external clock is input at the SCK31 (SCK32) pin, the clock frequency should be 16 times the bit rate used. For details on selection of the clock source, see table 15.10. When the SCI3 is operated on an internal clock, the clock can be output from the SCK31 (SCK32) pin. The frequency of the clock output in this case is equal to the bit rate, and the phase is such that the rising edge of the clock is in the middle of the transfer data, as shown in figure 15.3. Clock Serial data 0 D0 D1 D2 D3 D4 D5 D6 D7 0/1 1 1 1 character (frame) Figure 15.3 Relationship between Output Clock and Transfer Data Phase (Asynchronous Mode) (Example with 8-Bit Data, Parity, Two Stop Bits) Rev. 3.00 Aug 23, 2006 Page 333 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.8 Data Transfer Formats (Asynchronous Mode) SMR Serial Data Transfer Format and Frame Length CHR PE MP STOP 1 0 0 0 0 START 8-bit data STOP 0 0 0 1 START 8-bit data STOP STOP 0 0 1 0 Setting prohibited 0 0 1 1 Setting prohibited 0 1 0 0 START 8-bit data P STOP 0 1 0 1 START 8-bit data P STOP 0 1 1 0 START 5-bit data STOP 0 1 1 1 START 5-bit data STOP 1 0 0 0 START 7-bit data STOP 1 0 0 1 START 7-bit data STOP STOP 1 0 1 0 Setting prohibited 1 0 1 1 Setting prohibited 1 1 0 0 START 7-bit data P STOP 1 1 0 1 START 7-bit data P STOP 1 1 1 0 START 5-bit data P STOP 1 1 1 1 START 5-bit data P STOP [Legend] START: Start bit STOP: Stop bit P: Parity bit MPB: Multiprocessor bit Rev. 3.00 Aug 23, 2006 Page 334 of 616 REJ09B0182-0300 2 3 4 5 6 7 8 9 10 11 STOP STOP STOP 12 STOP Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.9 SMR Settings and Corresponding Data Transfer Formats SMR Data Transfer Format Bit 7 COM Bit 6 CHR Bit 2 MP Bit 5 PE Bit 3 STOP Mode Data Length Parity Bit Stop Bit Length 0 0 0 0 0 8-bit data 1 bit 1 1 Asynchronous mode No 2 bits Yes 0 1 1 0 2 bits 0 7-bit data No 1 1 1 0 1 0 Yes 0 0 1 Setting prohibited 0 5-bit data No 0 Setting prohibited 5-bit data 0 Yes 1 1 * [Legend] 0 * * 1 bit 2 bits 1 1 1 bit 2 bits 1 1 1 bit 2 bits 1 0 1 bit 1 bit 2 bits Clocked synchronous mode 8-bit data No No *: Don't care. Rev. 3.00 Aug 23, 2006 Page 335 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.10 SMR and SCR Settings and Clock Source Selection SMR SCR Transmit/Receive Clock Bit 7 Bit 1 Bit 0 COM CKE1 CKE0 Mode Clock Source SCK Pin Function 0 0 0 Asynchronous mode Internal I/O port (SCK31 or SCK32 pin not used) 1 1 Outputs clock with same frequency as bit rate 1 0 External 0 0 Inputs clock with frequency 16 times bit rate 1 0 Clocked Internal synchronous mode External 0 1 1 Reserved (Do not specify these combinations) 1 0 1 1 1 1 Rev. 3.00 Aug 23, 2006 Page 336 of 616 REJ09B0182-0300 Outputs serial clock Inputs serial clock Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.4.2 SCI3 Initialization Follow the flowchart as shown in figure 15.4 to initialize the SCI3. When the TE bit is cleared to 0, the TDRE flag is set to 1. Note that clearing the RE bit to 0 does not initialize the contents of the RDRF, PER, FER, and OER flags, or the contents of RDR. When the external clock is used in asynchronous mode, the clock must be supplied even during initialization. When the external clock is used in clocked synchronous mode, the clock must not be supplied during initialization. [1] Start initialization When the clock output is selected in asynchronous mode, clock is output immediately after CKE1 and CKE0 settings are made. When the clock output is selected at reception in clocked synchronous mode, clock is output immediately after CKE1, CKE0, and RE are set to 1. Clear TE and RE bits in SCR to 0 [1] Set CKE1 and CKE0 bits in SCR3 Set data transfer format in SMR [2] Set value in BRR [3] Wait [2] Set the data transfer format in SMR. [3] Write a value corresponding to the bit rate to BRR. Not necessary if an external clock is used. [4] Wait at least one bit interval, then set the TE bit or RE bit in SCR to 1. Setting bits TE and RE enables the TXD31 (TXD32) and RXD31 (RXD32) pins to be used. Also set the RIE, TIE, and TEIE bits, depending on whether interrupts are required. In asynchronous mode, the bits are marked at transmission and idled at reception to wait for the start bit. No 1-bit interval elapsed? Yes Set SPC32 (SPC31) bit in SPCR to 1 Set TE and RE bits in SCR to 1, and set RIE, TIE, TEIE, and MPIE bits. [4] Set the clock selection in SCR. Be sure to clear bits RIE, TIE, TEIE, and MPIE, and bits TE and RE, to 0. <Initialization completion> Figure 15.4 Sample SCI3 Initialization Flowchart Rev. 3.00 Aug 23, 2006 Page 337 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.4.3 Data Transmission Figure 15.5 shows an example of operation for transmission in asynchronous mode. In transmission, the SCI3 operates as described below. 1. The SCI3 monitors the TDRE flag in SSR. If the flag is cleared to 0, the SCI3 recognizes that data has been written to TDR, and transfers the data from TDR to TSR. 2. After transferring data from TDR to TSR, the SCI3 sets the TDRE flag to 1 and starts transmission. If the TIE bit in SCR is set to 1 at this time, a TXI31 (TXI32) interrupt request is generated. Continuous transmission is possible because the TXI31 (TXI32) interrupt routine writes next transmit data to TDR before transmission of the current transmit data has been completed. 3. The SCI3 checks the TDRE flag at the timing for sending the stop bit. 4. If the TDRE flag is 0, the data is transferred from TDR to TSR, the stop bit is sent, and then serial transmission of the next frame is started. 5. If the TDRE flag is 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the "mark state" is entered, in which 1 is output. If the TEIE bit in SCR is set to 1 at this time, a TEI interrupt request is generated. 6. igure 15.6 shows a sample flowchart for transmission in asynchronous mode. Start bit Serial data 1 0 Transmit data D0 D1 D7 1 frame Parity Stop Start bit bit bit 0/1 1 0 Transmit data D0 D1 D7 Parity Stop bit bit 0/1 1 Mark state 1 1 frame TDRE TEND LSI TXI31 (TXI32) operation interrupt request User generated processing TDRE flag cleared to 0 TXI31 (TXI32) interrupt request generated TEI31 (TEI32) interrupt request generated Data written to TDR Figure 15.5 Example SCI3 Operation in Transmission in Asynchronous Mode (8-Bit Data, Parity, One Stop Bit) Rev. 3.00 Aug 23, 2006 Page 338 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Start transmission Set SPC32 (SPC31) bit in SPCR to 1 [1] Read TDRE flag in SSR No TDRE = 1 Yes Write transmit data to TDR Yes [2] All data transmitted? No Read TEND flag in SSR [1] Read SSR and check that the TDRE flag is set to 1, then write transmit data to TDR. When data is written to TDR, the TDRE flag is automaticaly cleared to 0. (After the TE bit is set to 1, one frame of 1 is output, then transmission is possible.) [2] To continue serial transmission, read 1 from the TDRE flag to confirm that writing is possible, then write data to TDR. When data is written to TDR, the TDRE flag is automaticaly cleared to 0. [3] To output a break in serial transmission, after setting PCR to 1 and PDR to 0, clear the TE bit in SCR to 0. No TEND = 1 Yes [3] No Break output? Yes Clear PDR to 0 and set PCR to 1 Clear SPC31 (SPC32) bit in SPCR and TE bit in SCR to 0* <End> Note: * When SPC31 (SPC32) in SPCR is cleared to 0, the corresponding pin becomes an I/O port. Figure 15.6 Sample Serial Transmission Flowchart (Asynchronous Mode) Rev. 3.00 Aug 23, 2006 Page 339 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.4.4 Serial Data Reception Figure 15.7 shows an example of operation for reception in asynchronous mode. In serial reception, the SCI operates as described below. 1. The SCI3 monitors the communication line. If a start bit is detected, the SCI3 performs internal synchronization, receives data in RSR, and checks the parity bit and stop bit. * Parity check The SCI3 checks that the number of 1 bits in the receive data conforms to the parity (odd or even) set in bit PM in the serial mode register (SMR). * Stop bit check The SCI3 checks that the stop bit is 1. If two stop bits are used, only the first is checked. * Status check The SCI3 checks that bit RDRF is set to 0, indicating that the receive data can be transferred from RSR to RDR. 2. If an overrun error occurs (when reception of the next data is completed while the RDRF flag is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR is set to 1 at this time, an ERI31 (ERI32) interrupt request is generated. Receive data is not transferred to RDR. 3. If a parity error is detected, the PER bit in SSR is set to 1 and receive data is transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an ERI31 (ERI32) interrupt request is generated. 4. If a framing error is detected (when the stop bit is 0), the FER bit in SSR is set to 1 and receive data is transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an ERI31 (ERI32) interrupt request is generated. 5. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an RXI31 (RXI32) interrupt request is generated. Continuous reception is possible because the RXI31 (RXI32) interrupt routine reads the receive data transferred to RDR before reception of the next receive data has been completed. Rev. 3.00 Aug 23, 2006 Page 340 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Start bit Serial data 1 0 Receive data D0 D1 D7 Parity Stop Start bit bit bit 0/1 1 0 Receive data D0 D1 1 frame Parity Stop bit bit D7 0/1 Mark state (idle state) 0 1 1 frame RDRF FER LSI operation RXI31 (RXI32) RDRF cleared to 0 request User processing 0 stop bit detected RDR data read ERI request in response to framing error Framing error processing Figure 15.7 Example SCI3 Operation in Reception in Asynchronous Mode (8-Bit Data, Parity, One Stop Bit) Table 15.11 shows the states of the SSR status flags and receive data handling when a receive error is detected. If a receive error is detected, the RDRF flag retains its state before receiving data. Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the OER, FER, PER, and RDRF bits to 0 before resuming reception. Figure 15.8 shows a sample flowchart for serial data reception. Table 15.11 SSR Status Flags and Receive Data Handling SSR Status Flag RDRF* OER FER PER Receive Data Receive Error Type 1 1 0 0 Lost Overrun error 0 0 1 0 Transferred to RDR Framing error 0 0 0 1 Transferred to RDR Parity error 1 1 1 0 Lost Overrun error + framing error 1 1 0 1 Lost Overrun error + parity error 0 0 1 1 Transferred to RDR Framing error + parity error 1 1 1 1 Lost Overrun error + framing error + parity error Note: * The RDRF flag retains the state it had before data reception. However, note that if RDR is read after an overrun error has occurred in a frame because reading of the receive data in the previous frame was delayed, the RDRF flag will be cleared to 0. Rev. 3.00 Aug 23, 2006 Page 341 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Start reception Read OER, PER, and FER flags in SSR [1] Yes OER+PER+FER = 1 [4] No Error processing (Continued on next page) Read RDRF flag in SSR [2] No RDRF = 1 Yes Read receive data in RDR [1] Read the OER, PER, and FER flags in SSR to identify the error. If a receive error occurs, performs the appropriate error processing. [2] Read SSR and check that RDRF = 1, then read the receive data in RDR. The RDRF flag is cleared automatically. [3] To continue serial reception, before the stop bit for the current frame is received, read the RDRF flag and read RDR. The RDRF flag is cleared automatically. [4] If a receive error occurs, read the OER, PER, and FER flags in SSR to identify the error. After performing the appropriate error processing, ensure that the OER, PER, and FER flags are all cleared to 0. Reception cannot be resumed if any of these flags are set to 1. In the case of a framing error, a break can be detected by reading the value of the input port corresponding to the RXD31 (RXD32) pin. Yes All data received? [3] No (A) Clear RE bit in SCR to 0 <End> Figure 15.8 Sample Serial Data Reception Flowchart (Asynchronous Mode) (1) Rev. 3.00 Aug 23, 2006 Page 342 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) [4] Error processing No OER = 1 Yes Overrun error processing No FER = 1 Yes Yes Break? No Framing error processing No PER = 1 Yes Parity error processing (A) Clear OER, PER, and FER flags in SSR to 0 <End> Figure 15.8 Sample Serial Data Reception Flowchart (Asynchronous Mode) (2) Rev. 3.00 Aug 23, 2006 Page 343 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.5 Operation in Clocked Synchronous Mode Figure 15.9 shows the general format for clocked synchronous communication. In clocked synchronous mode, data is transmitted or received synchronous with clock pulses. A single character in the transmit data consists of the 8-bit data starting from the LSB. In clocked synchronous serial communication, data on the transmission line is output from one falling edge of the serial clock to the next. In clocked synchronous mode, the SCI3 receives data in synchronous with the rising edge of the serial clock. After 8-bit data is output, the transmission line holds the MSB state. In clocked synchronous mode, no parity or multiprocessor bit is added. Inside the SCI3, the transmitter and receiver are independent units, enabling full-duplex communication through the use of a common clock. Both the transmitter and the receiver also have a doublebuffered structure, so data can be read or written during transmission or reception, enabling continuous data transfer. 8-bit One unit of transfer data (character or frame) * * Synchronization clock LSB Bit 0 Serial data MSB Bit 1 Don't care Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Don't care Note: * High except in continuous transfer Figure 15.9 Data Format in Clocked Synchronous Communication 15.5.1 Clock Either an internal clock generated by the on-chip baud rate generator or an external synchronization clock input at the SCK31 (SCK32) pin can be selected, according to the setting of the COM bit in SMR and CKE0 and CKE1 bits in SCR. When the SCI3 is operated on an internal clock, the serial clock is output from the SCK31 (SCK32) pin. Eight serial clock pulses are output in the transfer of one character, and when no transfer is performed the clock is fixed high. 15.5.2 SCI3 Initialization Before transmitting and receiving data, the SCI3 should be initialized as described in a sample flowchart in figure 15.4. Rev. 3.00 Aug 23, 2006 Page 344 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.5.3 Serial Data Transmission Figure 15.10 shows an example of SCI3 operation for transmission in clocked synchronous mode. In serial transmission, the SCI3 operates as described below. 1. The SCI3 monitors the TDRE flag in SSR, and if the flag is 0, the SCI recognizes that data has been written to TDR, and transfers the data from TDR to TSR. 2. The SCI3 sets the TDRE flag to 1 and starts transmission. If the TIE bit in SCR is set to 1 at this time, a TXI31 (TXI32) interrupt request is generated. 3. 8-bit data is sent from the TXD31 (TXD32) pin synchronized with the output clock when output clock mode has been specified, and synchronized with the input clock when use of an external clock has been specified. Serial data is transmitted sequentially from the LSB (bit 0), from the TXD31 (TXD32) pin. 4. The SCI checks the TDRE flag at the timing for sending the MSB (bit 7). 5. If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission of the next frame is started. 6. If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, and the TDRE flag maintains the output state of the last bit. If the TEIE bit in SCR is set to 1 at this time, a TEI31 (TEI32) is generated. 7. The SCK31 (SCK32) pin is fixed high. Figure 15.11 shows a sample flowchart for serial data transmission. Even if the TDRE flag is cleared to 0, transmission will not start while a receive error flag (OER, FER, or PER) is set to 1. Make sure that the receive error flags are cleared to 0 before starting transmission. Serial clock Serial data Bit 0 Bit 1 Bit 7 Bit 0 Bit 1 1 frame Bit 6 Bit 7 1 frame TDRE TEND TXI31 (TXI32) LSI operation interrupt request generated User processing TDRE flag cleared to 0 TXI31 (TXI32) interrupt request generated TEI31 (TEI32) interrupt request generated Data written to TDR Figure 15.10 Example of SCI3 Operation in Transmission in Clocked Synchronous Mode Rev. 3.00 Aug 23, 2006 Page 345 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Start transmission Set SPC32 (SPC31) bit in SPCR to 1 [1] [1] Read TDRE flag in SSR No TDRE = 1 [2] Yes Write transmit data to TDR [2] All data transmitted? Read SSR and check that the TDRE flag is set to 1, then write transmit data to TDR. When data is written to TDR, the TDRE flag is automatically cleared to 0. When clock output is selected and data is written to TDR, clocks are output to start the data transmission. To continue serial transmission, be sure to read 1 from the TDRE flag to confirm that writing is possible, then write data to TDR. When data is written to TDR, the TDRE flag is automatically cleared to 0. Yes No Read TEND flag in SSR No TEND = 1 Yes Clear TE bit in SCR to 0 <End> Figure 15.11 Sample Serial Transmission Flowchart (Clocked Synchronous Mode) Rev. 3.00 Aug 23, 2006 Page 346 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.5.4 Serial Data Reception (Clocked Synchronous Mode) Figure 15.12 shows an example of SCI3 operation for reception in clocked synchronous mode. In serial reception, the SCI3 operates as described below. 1. The SCI3 performs internal initialization synchronous with a synchronous clock input or output, starts receiving data. 2. The SCI3 stores the received data in RSR. 3. If an overrun error occurs (when reception of the next data is completed while the RDRF flag in SSR is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR is set to 1 at this time, an ERI31 (ERI32) interrupt request is generated, receive data is not transferred to RDR, and the RDRF flag remains to be set to 1. 4. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an RXI31 (RXI32) interrupt request is generated. Serial clock Serial data Bit 7 Bit 0 Bit 7 Bit 0 Bit 1 Bit 6 1 frame Bit 7 1 frame RDRF OER LSI operation User processing RDRF flag RXI31 (RXI32) cleared interrupt to 0 request generated RDR data read ERI interrupt request generated by overrun error RXI31 (RXI32)interrupt request generated RDR data has not been read (RDRF = 1) Overrun error processing Figure 15.12 Example of SCI3 Reception Operation in Clocked Synchronous Mode Rev. 3.00 Aug 23, 2006 Page 347 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the OER, FER, PER, and RDRF bits to 0 before resuming reception. Figure 15.13 shows a sample flowchart for serial data reception. Start reception [1] [1] Read OER flag in SSR [2] Yes OER = 1? [4] No [3] Overrun error processing (Continued below) Read RDRF flag in SSR [2] [4] No RDRF = 1? Yes Read the OER flag in SSR to determine if there is an error. If an overrun error has occurred, execute overrun error processing. Read SSR and check that the RDRF flag is set to 1, then read the receive data in RDR. When data is read from RDR, the RDRF flag is automatically cleared to 0. To continue serial reception, before the MSB (bit 7) of the current frame is received, reading the RDRF flag and reading RDR should be finished. When data is read from RDR, the RDRF flag is automatically cleared to 0. If an overrun error occurs, read the OER flag in SSR, and after performing the appropriate error processing, clear the OER flag to 0. Reception cannot be resumed if the OER flag is set to 1. Read receive data in RDR Yes Data reception continued? [3] No Clear RE bit in SCR to 0 <End> [4] Start overrun error processing Overrun error processing Clear OER flag in SSR to 0 <End> Figure 15.13 Sample Serial Reception Flowchart (Clocked Synchronous Mode) Rev. 3.00 Aug 23, 2006 Page 348 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.5.5 Simultaneous Serial Data Transmission and Reception Figure 15.14 shows a sample flowchart for simultaneous serial transmit and receive operations. The following procedure should be used for simultaneous serial data transmit and receive operations. To switch from transmit mode to simultaneous transmit and receive mode, after checking that the SCI3 has finished transmission and the TDRE and TEND flags are set to 1, clear TE to 0. Then simultaneously set TE and RE to 1 with a single instruction. To switch from receive mode to simultaneous transmit and receive mode, after checking that the SCI3 has finished reception, clear RE to 0. Then after checking that the RDRF and receive error flags (OER, FER, and PER) are cleared to 0, simultaneously set TE and RE to 1 with a single instruction. Start transmission/reception Set SPC32 (SPC31) bit in SPCR to 1 No No Yes Read SSR and check that the TDRE flag is set to 1, then write transmit data to TDR. When data is written to TDR, the Read TDRE flag in SSR [1] TDRE flag is automatically cleared to 0. [2] Read SSR and check that the RDRF TDRE = 1 flag is set to 1, then read the receive data in RDR. Yes When data is read from RDR, the RDRF flag is automatically cleared to Write transmit data to TDR 0. [3] To continue serial transmission/ reception, before the MSB (bit 7) of Read OER flag in SSR the current frame is received, finish reading the RDRF flag, reading RDR. Yes Also, before the MSB (bit 7) of the OER = 1 [4] current frame is transmitted, read 1 from the TDRE flag to confirm that Overrun error processing No writing is possible. Then write data to TDR. When data is written to TDR, the Read RDRF flag in SSR [2] TDRE flag is automatically cleared to 0. When data is read from RDR, the RDRF flag is automatically cleared to RDRF = 1 0. [4] If an overrun error occurs, read the Yes OER flag in SSR, and after performing the appropriate error processing, clear the OER flag to 0. Read receive data in RDR Transmission/reception cannot be resumed if the OER flag is set to 1. For overrun error processing, see figure 15.13. Data transmission/reception continued? [1] [3] No Clear TE and RE bits in SCR to 0 <End> Figure 15.14 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations (Clocked Synchronous Mode) Rev. 3.00 Aug 23, 2006 Page 349 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.6 IrDA Operation IrDA operation can be used with the SCI3_1. Figure 15.15 shows an IrDA block diagram. If the IrDA function is enabled using the IrE bit in IrCR, the TXD31 and RXD31 pins in the SCI3_1 are allowed to encode and decode the waveform based on the IrDA standard version 1.0 (function as the IrTXD and IrRXD pins). Connecting these pins to the infrared data transceiver/receiver achieves infrared data communication based on the system defined by the IrDA standard version 1.0. In the system defined by the IrDA standard version 1.0, communication is started at a transfer rate of 9600 bps, which can be modified as required. The IrDA interface provided by this LSI does not incorporate the capability of automatic modification of the transfer rate; the transfer rate must be modified through programming. IrDA TXD31/IrTXD Phase inversion Pulse encoder RXD31/IrRXD Phase inversion Pulse decoder SCI3_1 TXD RXD IrCR Figure 15.15 IrDA Block Diagram 15.6.1 Transmission During transmission, the output signals from the SCI (UART frames) are converted to IR frames using the IrDA interface (see figure 15.16). For serial data of level 0, a high-level pulse having a width of 3/16 of the bit rate (1-bit interval) is output (initial setting). The high-level pulse can be selected using the IrCKS2 to IrCKS0 bits in IrCR. The high-level pulse width is defined to be 1.41 s at minimum and (3/16 + 2.5%) x bit rate or (3/16 x bit rate) +1.08 s at maximum. For example, when the frequency of system clock is 10 MHz, a high-level pulse width of at least 1.41 s to 1.6 s can be specified. For serial data of level 1, no pulses are output. Rev. 3.00 Aug 23, 2006 Page 350 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) UART frame Data Start bit 0 1 0 1 0 0 Stop bit 1 Transmission 1 0 1 Reception IR frame Data Start bit 0 Bit cycle 1 0 1 0 0 Stop bit 1 1 0 1 Pulse width is 1.6 s to 3/16 bit rate Figure 15.16 IrDA Transmission and Reception 15.6.2 Reception During reception, IR frames are converted to UART frames using the IrDA interface before inputting to the SCI3_1. Data of level 0 is output each time a high-level pulse is detected and data of level 1 is output when no pulse is detected in a bit cycle. If a pulse has a high-level width of less than 1.41 s, the minimum width allowed, the pulse is recognized as level 0. Rev. 3.00 Aug 23, 2006 Page 351 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.6.3 High-Level Pulse Width Selection Table 15.12 shows possible settings for bits IrCKS2 to IrCKS0 (minimum pulse width), and this LSI's operating frequencies and bit rates, for making the pulse width shorter than 3/16 times the bit rate in transmission. Table 15.12 IrCKS2 to IrCKS0 Bit Settings Bit Rate (bps) (Upper Row) / Bit Interval x 3/16 (s) (Lower Row) Operating Frequency (MHz) 2400 9600 19200 38400 78.13 19.53 9.77 4.88 2 010 010 010 010 2.097152 010 010 010 010 2.4576 010 010 010 010 3 011 011 011 011 3.6864 011 011 011 011 4.194 011 011 011 011 4.9152 011 011 011 011 5 011 011 011 011 6 100 100 100 100 6.144 100 100 100 100 7.3728 100 100 100 100 8 100 100 100 100 9.8304 100 100 100 100 10 100 100 100 100 Rev. 3.00 Aug 23, 2006 Page 352 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.7 Interrupt Requests The SCI3 creates the following six interrupt requests: transmit end, transmit data empty, receive data full, and receive errors (overrun error, framing error, and parity error). Table 15.13 shows the interrupt sources. Table 15.13 SCI3 Interrupt Requests Interrupt Requests Abbreviation Interrupt Sources Receive Data Full RXI Setting RDRF in SSR Transmit Data Empty TXI Setting TDRE in SSR Transmission End TEI Setting TEND in SSR Receive Error ERI Setting OER, FER, and PER in SSR Each interrupt request can be enabled or disabled by means of bits TIE and RIE in SCR. When the TDRE bit in SSR is set to 1, a TXI31 (TXI32) interrupt is requested. When the TEND bit in SSR is set to 1, a TEI31 (TEI32) interrupt is requested. These two interrupts are generated during transmission. The initial value of the TDRE flag in SSR is 1. Thus, when the TIE bit in SCR is set to 1 before transferring the transmit data to TDR, a TXI31 (TXI32) interrupt request is generated even if the transmit data is not ready. The initial value of the TEND flag in SSR is 1. Thus, when the TEIE bit in SCR is set to 1 before transferring the transmit data to TDR, a TEI31 (TEI32) interrupt request is generated even if the transmit data has not been sent. It is possible to make use of the most of these interrupt requests efficiently by transferring the transmit data to TDR in the interrupt routine. To prevent the generation of these interrupt requests (TXI31 and TEI31), set the enable bits (TIE and TEIE) that correspond to these interrupt requests to 1, after transferring the transmit data to TDR. When the RDRF bit in SSR is set to 1, an RXI31 (RXI32) interrupt is requested, and if any of bits OER, PER, and FER is set to 1, an ERI31 (ERI32) interrupt is requested. These two interrupt requests are generated during reception. The SCI3 can carry out continuous reception using an RXI31 (RXI32) and continuous transmission using a TXI31 (TXI32). These interrupts are shown in table 15.14. Rev. 3.00 Aug 23, 2006 Page 353 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) Table 15.14 Transmit/Receive Interrupts Interrupt Flags Interrupt Request Conditions Notes RXI31 RDRF (RXI32) RIE When serial reception is performed normally and receive data is transferred from RSR to RDR, bit RDRF is set to 1, and if bit RIE is set to 1 at this time, an RXI31 (RXI32) is enabled and an interrupt is requested. (See figure 15.17 (a).) The RXI31 (RXI32) interrupt routine reads the receive data transferred to RDR and clears bit RDRF to 0. Continuous reception can be performed by repeating the above operations until reception of the next RSR data is completed. TXI31 TDRE (TXI32) TIE When TSR is found to be empty (on completion of the previous transmission) and the transmit data placed in TDR is transferred to TSR, bit TDRE is set to 1. If bit TIE is set to 1 at this time, a TXI31 (TXI32) is enabled and an interrupt is requested. (See figure 15.17 (b).) The TXI31 (TXI32) interrupt routine writes the next transmit data to TDR and clears bit TDRE to 0. Continuous transmission can be performed by repeating the above operations until the data transferred to TSR has been transmitted. TEI31 TEND (TEI32) TEIE When the last bit of the character in TSR is transmitted, if bit TDRE is set to 1, bit TEND is set to 1. If bit TEIE is set to 1 at this time, a TEI31 (TEI32) is enabled and an interrupt is requested. (See figure 15.17 (c).) A TEI31 (TEI32) indicates that the next transmit data has not been written to TDR when the last bit of the transmit character in TSR is transmitted. Rev. 3.00 Aug 23, 2006 Page 354 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) RDR RDR RSR (reception completed, transfer) RSR (reception in progress) RXD31 (RXD32) pin RXD31 (RXD32) pin RDRF RDRF = 0 1 (RXI request when RIE = 1) Figure 15.17 (a) RDRF Setting and RXI Interrupt TDR (next transmit data) TDR TSR (transmission in progress) TSR (transmission completed, transfer) TXD31 (TXD32) pin TXD31 (TXD32) pin TDRE TDRE = 0 1 (TXI request when TIE = 1) Figure 15.17 (b) TDRE Setting and TXI Interrupt TDR TDR TSR (transmission in progress) TSR (transmission completed) TXD31 (TXD32) pin TXD31 (TXD32) pin TEND TEND = 0 1 (TEI request when TEIE = 1) Figure 15.17 (c) TEND Setting and TEI Interrupt Rev. 3.00 Aug 23, 2006 Page 355 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.8 Usage Notes 15.8.1 Break Detection and Processing When framing error detection is performed, a break can be detected by reading the RXD31 (RXD32) pin value directly. In a break, the input from the RXD31 (RXD32) pin becomes all 0, setting the FER flag, and possibly the PER flag. Note that as the SCI3 continues the receive operation after receiving a break, even if the FER flag is cleared to 0, it will be set to 1 again. 15.8.2 Mark State and Break Sending Regardless of the value of TE, when the SPCR31 (SPCR32) bit in SPCR is cleared to 0, the TXD31 (TXD32) pin is used as an I/O port whose direction (input or output) and level are determined by PCR and PDR. This can be used to set the TXD31 (TXD32) pin to mark state (high level) or send a break during serial data transmission. To maintain the communication line at mark state (1) until SPCR31 (SPCR32) in SPCR is set to 1, set both PCR and PDR to 1. As SPCR31 (SPCR32) in SPCR is cleared to 0 at this point, the TXD31 (TXD32) pin becomes an I/O port, and 1 is output from the TXD31 (TXD32) pin. To send a break during serial transmission, first set PCR to 1 and PDR to 0, and then clear SPCR31 (SPCR32) and TE to 0. If TE is cleared to 0 immediately after SPCR31 (SPCR32) is cleared to 0, the transmitter is initialized regardless of the current transmission state after TE is cleared, and when SPCR31 (SPCR32) is cleared to 0 the TXD31 (TXD32) pin becomes an I/O port and 0 is output from it. 15.8.3 Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only) Transmission cannot be started when a receive error flag (OER, PER, or FER) is set to 1, even if the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting transmission. Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared to 0. Rev. 3.00 Aug 23, 2006 Page 356 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.8.4 Receive Data Sampling Timing and Reception Margin in Asynchronous Mode In asynchronous mode, the SCI3 operates on a basic clock with a frequency of 16 times the transfer rate. In reception, the SCI3 samples the falling edge of the start bit using the basic clock, and performs internal synchronization. Receive data is latched internally at the rising edge of the 8th pulse of the basic clock as shown in figure 15.18. Thus, the reception margin in asynchronous mode is given by formula (1) below. 1 D - 0.5 M = (0.5 - )- - (L - 0.5) F x 100(%) 2N N Where N: D: L: F: ... Formula (1) Ratio of bit rate to clock (N = 16) Clock duty (D = 0.5 to 1.0) Frame length (L = 9 to 12) Absolute value of clock rate deviation Assuming values of F (absolute value of clock rate deviation) = 0 and D (clock duty) = 0.5 in formula (1), the reception margin can be given by the formula. M = {0.5 - 1/(2 x 16)} x 100 [%] = 46.875% However, this is only the computed value, and a margin of 20% to 30% should be allowed for in system design. 16 clocks 8 clocks 0 7 15 0 7 15 0 Internal basic clock Receive data (RXD31/RXD32) Start bit D0 D1 Synchronization sampling timing Data sampling timing Figure 15.18 Receive Data Sampling Timing in Asynchronous Mode Rev. 3.00 Aug 23, 2006 Page 357 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.8.5 Note on Switching SCK31 (SCK32) Pin Function If pin SCK31 (SCK32) is used as a clock output pin by the SCI3 in clocked synchronous mode and is then switched to a general input/output pin (a pin with a different function), the pin outputs a low level signal for half a system clock () cycle immediately after it is switched. This can be prevented by either of the following methods according to the situation. (1) When SCK31 (SCK32) Function is Switched from Clock Output to Non Clock-Output When stopping data transfer, issue one instruction to clear bits TE and RE to 0 and to set bits CKE1 and CKE0 in SCR to 1 and 0, respectively. In this case, bit COM in SMR should be left 1. The above prevents the SCK31 (SCK32) pin from being used as a general input/output pin. To avoid an intermediate level of voltage from being applied to the SCK31 (SCK32) pin, the line connected to the SCK31 (SCK32) pin should be pulled up to the VCC level via a resistor, or supplied with output from an external device. (2) When SCK31 (SCK32) Function is Switched from Clock Output to General Input/Output When stopping data transfer, 1. Issue one instruction to clear bits TE and RE to 0 and to set bits CKE1 and CKE0 in SCR to 1 and 0, respectively. 2. Clear bit COM in SMR to 0 3. Clear bits CKE1 and CKE0 in SCR to 0. Note that special care is also needed here to avoid an intermediate level of voltage from being applied to the SCK31 (SCK32) pin. 15.8.6 Relation between Writing to TDR and Bit TDRE Bit TDRE in the serial status register (SSR) is a status flag that indicates that data for serial transmission has not been prepared in TDR. When data is written to TDR, bit TDRE is cleared to 0 automatically. When the SCI3 transfers data from TDR to TSR, bit TDRE is set to 1. Data can be written to TDR irrespective of the state of bit TDRE, but if new data is written to TDR while bit TDRE is cleared to 0, the data previously stored in TDR will be lost if it has not yet been transferred to TSR. Accordingly, to ensure that serial transmission is performed dependably, you should first check that bit TDRE is set to 1, then write the transmit data to TDR only once (not two or more times). Rev. 3.00 Aug 23, 2006 Page 358 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.8.7 Relation between RDR Reading and bit RDRF In a receive operation, the SCI3 continually checks the RDRF flag. If bit RDRF is cleared to 0 when reception of one frame ends, normal data reception is completed. If bit RDRF is set to 1, this indicates that an overrun error has occurred. When the contents of RDR are read, bit RDRF is cleared to 0 automatically. Therefore, if RDR is read more than once, the second and subsequent read operations will be performed while bit RDRF is cleared to 0. Note that, when an RDR read is performed while bit RDRF is cleared to 0, if the read operation coincides with completion of reception of a frame, the next frame of data may be read. This is shown in figure 15.19. Communication line Frame 1 Frame 2 Frame 3 Data 1 Data 2 Data 3 Data 1 Data 2 RDRF RDR (A) RDR read (B) RDR read Data 1 is read at point (A) Data 2 is read at point (B) Figure 15.19 Relation between RDR Read Timing and Data In this case, only a single RDR read operation (not two or more) should be performed after first checking that bit RDRF is set to 1. If two or more reads are performed, the data read the first time should be transferred to RAM, etc., and the RAM contents used. Also, ensure that there is sufficient margin in an RDR read operation before reception of the next frame is completed. To be precise in terms of timing, the RDR read should be completed before bit 7 is transferred in clocked synchronous mode, or before the STOP bit is transferred in asynchronous mode. 15.8.8 Transmit and Receive Operations when Making State Transition Make sure that transmit and receive operations have completely finished before carrying out state transition processing. Rev. 3.00 Aug 23, 2006 Page 359 of 616 REJ09B0182-0300 Section 15 Serial Communication Interface 3 (SCI3, IrDA) 15.8.9 Setting in Subactive or Subsleep Mode In subactive or subsleep mode, the SCI3 can operate only when the CPU clock is W/2. The SA1 bit in SYSCR2 should be set to 1. 15.8.10 Oscillator when Serial Communication Interface 3 is Used (Supported only by the Masked ROM Version) When serial communication interface 3 is used in the masked ROM version, do not use the onchip oscillator. For details on selecting the system clock oscillator or on-chip oscillator, see section 5.2.4, On-Chip Oscillator Selection Method (Supported only by the Masked ROM Version). Rev. 3.00 Aug 23, 2006 Page 360 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) Section 16 Serial Communication Interface 4 (SCI4) The serial communication interface 4 (SCI4) can handle clocked synchronous serial communication with the 8-bit buffer. The SCI4 is supported only by the F-ZTAT version. When the on-chip emulator debugger etc. is used, the SCK4, SI4, and SO4 pins in SCI4 are used by the system. Therefore the SCI4 is not available for the user. 16.1 Features * Eight internal clocks (/1024, /256, /64, /32, /16, /8, /4, /2) or external clock can be selected as a clock source. * Receive error detection: Overrun errors detected * Four interrupt sources Transmit-end, transmit-data-empty, receive-data-full, and overrun error * Full-duplex communication capability Buffering is used in both the transmitter and the receiver, enabling continuous transmission and continuous reception of serial data. * When the on-chip emulator debugger etc. is not used, the SCI4 is available for the user. * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) Rev. 3.00 Aug 23, 2006 Page 361 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) Figure 16.1 shows a block diagram of the SCI4. PSS SCSR4 SCK4 SCR4 TDR4 SR4 SI4 SO4 Internal data bus Transmit/receive control circuit RDR4 TEI TXI RXI ERI [Legend] SCSR4: Serial control status register 4 SCR4: Serial control register 4 TDR4: Transmit data register 4 SR4: Shift register 4 RDR4: Receive data register 4 Figure 16.1 Block Diagram of SCI4 16.2 Input/Output Pins Table 16.1 shows the SCI4 pin configuration. Table 16.1 Pin Configuration Pin Name Abbreviation I/O Function SCI4 clock SCK4 I/O SCI4 clock input/output SCI4 data input SI4 Input SCI4 receive data input SCI4 data output SO4 Output SCI4 transmit data output Rev. 3.00 Aug 23, 2006 Page 362 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) 16.3 Register Descriptions The SCI4 has the following registers. * Serial control register 4 (SCR4) * Serial control/status register 4 (SCSR4) * Transmit data register 4 (TDR4) * Receive data register 4 (RDR4) * Shift Register 4 (SR4) 16.3.1 Serial Control Register 4 (SCR4) SCR4 enables or disables interrupt requests and controls SCI4 transfer operations. Bit Bit Name Initial Value R/W Description 7 TIE 0 R/W Transmit Interrupt Enable Enables or disables a transmit data empty interrupt (TXI) request when serial transmit data is transferred from TDR4 to SR4 and the TDRE flag in SCSR4 is set to 1. TXI can be cleared by clearing the TDRE flag in SCSR4 to 0 after the flag is read as 1 or clearing this bit to 0. 0: Transmit data empty interrupt (TXI) request disabled 1: Transmit data empty interrupt (TXI) request enabled 6 RIE 0 R/W Receive Interrupt Enable Enables or disables a receive data full interrupt (RXI) request and receive error interrupt (ERI) request when serial receive data is transferred from SR4 to RDR4 and the RDRF flag in SCSR4 is set to 1. RXI and ERI can be cleared by clearing the RDRF or ORER flag in SCSR4 to 0 after the flag is read as 1 or clearing this bit to 0. 0: Receive data full interrupt (RXI) request and receive error interrupt (ERI) request disabled 1: Receive data full interrupt (RXI) request and receive error interrupt (ERI) request enabled Rev. 3.00 Aug 23, 2006 Page 363 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) Bit Bit Name Initial Value R/W Description 5 TEIE 0 R/W Transmit End Interrupt Enable Enables or disables a transmit end interrupt (TEI) request when there is no valid transmit data in TDR4 during transmission of MSB data. TEI can be cleared by clearing the TEND flag in SCSR4 to 0 after the flag is read as 1 or clearing this bit to 0. 0: Transmit end interrupt (TEI) request disabled 1: Transmit end interrupt (TEI) request enabled 4 SOL 0 R/W Extended Data Sets the output level of the SO4 pin. When this bit is read, the output level of the SO4 pin is read. The output of the SO4 pin retains the value of the last bit of transmit data after transmission is completed. However, if this bit is changed before or after transmission, the output level of the SO4 pin can be changed. When the output level of the SO4 pin is changed, the SOLP bit should be cleared to 0 and the MOV instruction should be used. Note that this bit should not be changed during transmission because incorrect operation may occur. [When reading] 0: The output level of the SO4 pin is low. 1: The output level of the SO4 pin is high. [When writing] 0: The output level of the SO4 pin is changed to low. 1: The output level of the SO4 pin is changed to high. 3 SOLP 1 R/W SOL Write Protect Controls change of the output level of the SO4 pin due to the change of the SOL bit. When the output level of the SO4 pin is changed, the setting of SOL = 1 and SOLP = 0 or SOL = 0 and SOLP = 0 is made by the MOV instruction. This bit is always read as 1. 0: When writing, the output level is changed according to the value of the SOL pin. 1: When reading, this bit is always read as 1 and cannot be modified. Rev. 3.00 Aug 23, 2006 Page 364 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) Bit Bit Name Initial Value R/W Description 2 SRES 0 R/W Forcible Reset When the internal sequencer is forcibly initialized, 1 should be written to this bit. When 1 is written to this flag, the internal sequencer is forcibly reset and then this flag is automatically cleared to 0. Note that the values of the internal registers are retained. (The TDRE flag in SCSR4 is set to 1 and the RDRF, ORER, and TEND flags are cleared to 0. The TE and RE bits in SCR4 are cleared to 0.) 0: Normal operation 1: Internal sequencer is forcibly reset 1 TE 0 R/W Transmit Enable Enables or disables start of the SCI4 serial transmission. When this bit is cleared to 0, the TERE flag in SCSR4 is fixed to 1. When transmit data is written to TDR4 while this bit is set to 1, the TDRE flag in SCSR4 is automatically cleared to 0 and serial data transmission is started. 0: Transmission disabled (SO4 pin functions as I/O port) 1: Transmission enabled (SO4 pin functions as transmit data pin) 0 RE 0 R/W Receive Enable Enables or disables start of the SCI4 serial reception. Note that the RDRF and ORER flags in SCSR4 are not affected even if this bit is cleared to 0, and retain their previous state. Serial data reception is started when the synchronous clock input is detected while this bit is set to 1 (when an external clock is selected). When an internal clock is selected, the synchronous clock is output and serial data reception is started. 0: Reception disabled (SI4 pin functions as I/O port) 1: Reception enabled (SI4 pin functions as receive data pin) Rev. 3.00 Aug 23, 2006 Page 365 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) 16.3.2 Serial Control/Status Register 4 (SCSR4) SCSR4 indicates the operating state and error state, selects the clock source, and controls the prescaler division ratio. SCSR4 can be read from or written to by the CPU at any time. 1 cannot be written to flags TDRE, RDRF, ORER, and TEND. To clear these flags to 0, 1 should be read from them in advance. Bit Bit Name Initial Value R/W 7 TDRE 1 R/(W)* Transmit Data Empty Description Indicates that data is transferred from TDR4 to SR4 and the next serial transmit data can be written to TDR4. [Setting conditions] * When the TE bit in SCR4 is 0 * When data is transferred from TDR4 to SR4 and data can be written to TDR4 [Clearing conditions] 6 RDRF 0 * When 0 is written to TDRE after reading TDRE = 1 * When data is written to TDR4 R/(W)* Receive Data Full Indicates that the receive data is stored in RDR4. [Setting condition] * When serial reception ends normally and receive data is transferred from SR4 to RDR4 [Clearing conditions] Rev. 3.00 Aug 23, 2006 Page 366 of 616 REJ09B0182-0300 * When 0 is written to RDRF after reading RDRF = 1 * When data is read from RDR4 Section 16 Serial Communication Interface 4 (SCI4) Bit Bit Name Initial Value R/W 5 ORER 0 R/(W)* Overrun Error Description Indicates that an overrun error occurs during reception and then abnormal termination occurs. In transfer mode, the output level of the SO4 pin is fixed to low while this flag is set to 1. When the RE bit in SCR4 is cleared to 0, the ORER flag is not affected and retains its previous state. When RDR4 retains the receive data it held before the overrun error occurred, and data received after the error is lost. Reception cannot be continued with the ORER flag set to 1, and transmission cannot be continued either. [Setting condition] * When the next serial reception is completed while RDRF = 1 [Clearing condition] * 4 TEND 0 When 0 is written to ORER after reading ORER = 1 R/(W)* Transmit End Indicates that the TDRE flag has been set to 1 at transmission of the last bit of transmit data. [Setting condition] * When TDRE = 1 at transmission of the last bit of transmit data [Clearing conditions] * When 0 is written to TEND after reading TEND = 1 * When data is written to TDR4 with an instruction 3 CKS3 1 R/W Clock Source Select and Pin Function 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W Select the clock source to be supplied and set the input/output for the SCK4 pin. The prescaler division ratio and transfer clock cycle when an internal clock is selected are shown in table 16.2. When an external clock is selected, the external clock cycle should be at least 4/. Note: * Only 0 can be written to clear the flag. Rev. 3.00 Aug 23, 2006 Page 367 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) Table 16.2 shows a prescaler division ratio and transfer clock cycle. Table 16.2 Prescaler Division Ratio and Transfer Clock Cycle (Internal Clock) Bit 3 Bit 2 Bit 1 Bit 0 CKS3 CKS2 CKS1 0 0 0 Transfer Clock Cycle Function CKS0 Prescaler Division Ratio = 5 MHz = 2.5 MHz Clock Resource Pin Function 0 0 /1024 204.8 s 409.6 s Internal clock SCK4 output pin 0 0 1 /256 51.2 s 102.4 s Internal clock SCK4 output pin 0 0 1 0 /64 12.8 s 25.6 s Internal clock SCK4 output pin 0 0 1 1 /32 6.4 s 12.8 s Internal clock SCK4 output pin 0 1 0 0 /16 3.2 s 6.4 s Internal clock SCK4 output pin 0 1 0 1 /8 1.6 s 3.2 s Internal clock SCK4 output pin 0 1 1 0 /4 0.8 s 1.6 s Internal clock SCK4 output pin 0 1 1 1 /2 0.8 s Internal clock SCK4 output pin 1 0 0 0 I/O port (initial value) 1 0 0 1 I/O port 1 0 1 0 I/O port 1 0 1 1 I/O port 1 1 0 0 I/O port 1 1 0 1 I/O port 1 1 1 0 I/O port 1 1 1 1 Rev. 3.00 Aug 23, 2006 Page 368 of 616 REJ09B0182-0300 External clock SCK4 input pin Section 16 Serial Communication Interface 4 (SCI4) 16.3.3 Transmit Data Register 4 (TDR4) TDR4 is an 8-bit register that stores data for serial transmission. When the SCI4 detects that SR4 is empty, it transfers the transmit data written in TDR4 to SR4 and starts serial transmission. If the next transmit data is written to TDR4 while serial data in SR4 is being transmitted, continuous serial transmission is possible. TDR4 can be read from or written to by the CPU at any time. TDR4 is initialized to H'FF. 16.3.4 Receive Data Register 4 (RDR4) RDR4 is an 8-bit register that stores receive data. When the SCI4 has received one byte of serial data, it transfers the received serial data from SR4 to RDR4, where it is stored. Then receive operation is completed. After this, SR4 is receive-enabled. RDR4 cannot be written to by the CPU. RDR4 is initialized to H'00. 16.3.5 Shift Register 4 (SR4) SR4 is a register that receives or transmits serial data. SR4 cannot be directly read from or written to by the CPU. Rev. 3.00 Aug 23, 2006 Page 369 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) 16.4 Operation The SCI4 is a serial communication interface that transmits and receives data in synchronization with a clock pulse and is suitable for high-speed serial communication. The data transfer format is fixed to 8-bit data. The internal clock or external clock can be selected as a clock source. An overrun error during reception can be detected. The transmit and receive units are configured with double buffering mechanism. Since the mechanism enables to write data during transmission and to read data during reception, data is consecutively transmitted and received. 16.4.1 Clock The eight internal clocks or an external clock can be selected as a transfer clock. When the external clock is selected, the SCK4 pin is a clock input pin. When the internal clock is selected, the SCK4 pin is a synchronous clock output pin. The synchronous clock is output eight pulses for 1-character transmission or reception. While neither transmission nor reception is being performed, the signal is fixed high. When the internal clock or external clock is not selected according to the combination of the CKS3 to CKS0 bits in SCSR4, the SCK4 pin functions as an I/O port. 16.4.2 Data Transfer Format Figure 16.2 shows the SCI4 transfer format. SCK4 SO4/SI4 Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Figure 16.2 Data Transfer Format In clocked synchronous communication, data on the communication line is output from the falling edge to the next falling edge of the synchronous clock. The data is guaranteed to be settled at the rising edge of the synchronous clock. One character starts with the LSB and ends with the MSB. After transmitting the MSB, the communication line retains the MSB level. The SCI4 latches data at the rising edge of the synchronous clock on reception. The data transfer format is fixed to 8-bit data. While transmission is stopped, the output level on the SO4 pin can be changed by the SOL setting in SCR4. Rev. 3.00 Aug 23, 2006 Page 370 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) 16.4.3 Data Transmission/Reception Before data transmission and reception, clear the TE and RE bits in SCR4 to 0 and then initialize as the following procedure of figure 16.3. Note: Before changing operating modes or communication format, the TE and RE bits must be cleared to 0. Clearing the TE bit to 0 sets the TDRE flag to 1. Note that clearing the RE bit to 0 does not affect the RDRF or ORER flag and the contents of RDR4. When the external clock is used, the clock must not be supplied during operation including initialization. Start of Initialization Clear TE and RE bits in SCR4 to 0 Clear CKS3 to CKS0 bits in SCSR4 to 0 Set TE and RE bits in SCR4 to 1. Set RIE, TIE, and TEIE bits. <Transmission/reception started> Figure 16.3 Flowchart Example of SCI4 Initialization Rev. 3.00 Aug 23, 2006 Page 371 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) 16.4.4 Data Transmission Figure 16.4 shows an example flowchart of data transmission. Data transmission should be performed as the following procedure after the SCI4 initialization. Initialization [1] [1] Start transmission (TE = 1) Read TDRE in SCSR4 [2] [2] [3] TDRE = 1? No Pin SO4 functions as output pin for transmit data After reading SCSR4 and confirming TDRE = 1, write transmit data in TDR4. Writing data in TDR4 clears the TDRE bit to 0 automatically. At this time, the clock is output to start data transmission. To consecutively transmit data, read TDRE = 1 to confirm that TDR4 is ready. After that, write data in TDR4. Writing data in TDR4 clears the TDRE bit to 0 automatically. Yes Write transmit data in TDR4 TDRE bit cleared to 0 automatically Data transferred from TDR4 to SR4 Start transmission by setting TDRE bit to 1 Transmission will continue? Yes [3] No Read TEND in SCSR4 TEND = 1? No Yes TEI occurs (TEIE = 1) Clear TE bit in SCR4 to 0 <Transmission completed> Note: Hatching area indicates SCI internal operation. Figure 16.4 Flowchart Example of Data Transmission Rev. 3.00 Aug 23, 2006 Page 372 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) During transmission, the SCI4 operates as shown below. 1. The SCI4 sets the TE bit to 1 and clears the TDRE flag to 0 when transmit data is written to in TDR4 to transmit data from TDR4 to SR4. After that, the SCI4 sets the TDRE flag to 1 to start transmission. At this time, when the TIE bit in SCR4 is set to 1, a TXI is generated. 2. In clock output mode, the SCI4 outputs eight pulses of the synchronous clock. When the external clock is selected, the SCI4 outputs data in synchronization with the input clock. 3. Serial data is output from the LSB (bit 0) to MSB (bit 7) on pin SO4. The SCI4 checks the TDRE flag at the timing of outputting the MSB (bit 7). 4. When TDRE = 0, data in TDR4 is transmitted to SR4 and then the data of the next frame starts to be transmitted. When TDRE = 1, the SCI4 sets the TEND bit to 1 and holds the output level after transmitting the MSB (bit 7). At this time, when the TEIE bit in SCR4 is set to 1, a TEI is generated. 5. After the transmission, the output level on pin SCK4 is fixed high. Note: Transmission cannot be performed when the error flag (ORER) which indicates the data reception status is set to 1. Before transmission, confirm that the ORER flag is cleared to 0. Figure 16.5 shows the example of transmission operation. Synchronous clock Serial data Bit 0 Bit 1 Bit 7 Bit 0 Bit 1 Bit 6 Bit 7 1 frame 1 frame TDRE TEND LSI operation User operation TXI generated TDRE cleared TXI generated TEI generated Data written to TDR4 Figure 16.5 Transmit Operation Example Rev. 3.00 Aug 23, 2006 Page 373 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) 16.4.5 Data Reception Figure 16.6 shows an example flowchart of data reception. Data reception should be performed as the following procedure after the SCI4 initialization. Initialization [1] [1] Start reception (RE = 1) Read ORER in SCSR4 ORER = 1? [2] Yes [3] Error processing No Read RDRF in SCSR4 No (Shown below) [4] Pin SI4 functions as input pin for receive data [2][3] When a reception error occurs, read the ORER flag in SCSR4 and then clears the ORER flag to 0 after executing the error processing. When the ORER flag is set to 1, both transmission and reception cannot be restarted. [4] After reading SCSR4 and confirming RDRF = 1, read the receive data in RDR4. The RDRF flag is automatically cleared to 0. Changes in the RDRF flag from 0 to 1 can be notified by an RXI interrupt. [5] To consecutively receive data, reading the RDRF flag and RDR4 must be completed before receiving the MSB (bit 7) of the current frame. RDRF = 1? Yes Read received data in RDR4 RDRF cleared to 0 automatically Yes Data transfer will continue? [5] No Clear RE bit in SCR4 to 0 <Reception completed> Error processing [3] Overrun error processing Clear ORER flag in SCSR4 to 0 <Completed> Note: Hatching area indicates SCI internal operation. Figure 16.6 Flowchart Example of Data Reception Rev. 3.00 Aug 23, 2006 Page 374 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) During reception, the SCI4 operates as shown below. 1. The SCI4 initialization is performed in synchronization with the synchronous clock input or output and starts reception. 2. The SCI4 stores received data from the LSB to MSB of SR4. 3. After reception, the SCI4 checks that RDRF = 0 and whether receive data is ready for being transferred from SR4 to RDR4. 4. When confirms that an overrun error has not occurred, the RDRF bit is set to 1 and the received data is stored in RDR4. At this time, when the RIE bit in SCR4 is set to 1, an RXI is generated. When an overrun error is detected by checking, the ORER flag is set to 1. The RDRF bit retains the previously set value. If the RIE bit in SCR4 is set to 1, an ERI is generated. 5. An overrun error is detected when the next data reception is completed with the RDRF bit in SCSR4 set to 1. The received data is not transferred from SR4 to RDR4. Note: Reception cannot be performed when the error flag is set to 1. Before reception, confirm that the ORER and RDRF flags are cleared to 0. Figure 16.7 shows an operation example of reception. Synchronous clock Serial data Bit 7 Bit 0 Bit 7 1 frame Bit 0 Bit 1 Bit 6 Bit 7 1 frame RDRF ORER LSI operation User operation RXI generated RDRF cleared Data read from RDR4 RXI generated ERI generated by overrun error RDR4 has not been read from (RDRF = 1) Overrun error processing Figure 16.7 Receive Operation Example Rev. 3.00 Aug 23, 2006 Page 375 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) 16.4.6 Simultaneous Data Transmission and Reception Figure 16.8 shows an example flowchart of simultaneous data transmission and reception. Simultaneous data transmission and reception should be performed as the following procedure after the SCI4 initialization. [1] [1] Initialization Start transmission (TE = 1, RE = 1) [2] [2] Read TDRE in SCSR4 TDRE = 1? No [3] Yes Write transmit data in TDR4 [4] TDRE bit cleared to 0 automatically Data transferred from TDR4 to SR4 [5] Start transmission/reception by setting TDRE bit to 1 Read ORER in SCSR4 ORER = 1? Yes Error processing No Read RDRF in SCSR4 No Pin SO4 functions as output pin for transmit data and pin SI4 functions as input pin for receive data. Simultaneous transmission and reception is enabled. After reading SCSR4 and confirming TDRE = 1, write transmit data in TDR4. Writing data in TDR4 clears the TDRE bit to 0 automatically. At this time, the clock is output to start data transfer. When a reception error occurs, read the ORER flag in SCSR4 and then clear the ORER flag to 0 after executing the error processing. When the ORER flag is set to 1, both transmission and reception cannot be restarted. After reading SCSR4 and confirming RDRF = 1, read receive data in RDR4 and clear the RDRF flag to 0. An RXI interrupt can also be used to confirm that the RDRF flag value has been changed from 0 to 1. To consecutively transmit and receive data, the following operation must be completed: reading the RDRF flag and reading RDR4 before receiving the MSB (bit 7) of the current frame: confirming that TDR4 is ready for writing by reading TDRE = 1 before transmitting the MSB (bit 7) and writing data to TDR4 to clear the TDRE flag to 0. [3] [4] RDRF = 1? Yes Read received data in RDR4 RDRF cleared to 0 automatically Data transfer will continue? Yes [5] No Clear TE and RE bits in SCR4 to 0 Note: Hatching area indicates SCI internal operation. <Transmission and reception completed> Figure 16.8 Flowchart Example of Simultaneous Transmission and Reception Rev. 3.00 Aug 23, 2006 Page 376 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) Notes: 1. When switching from transmission to simultaneous data transmission and reception, confirm that the SCI4 completes transmission and both the TDRE and TEND bits are set to 1. After that, clear the TE bit to 0 and then set both the TE and RE bits to 1. 2. When switching from reception to simultaneous data transmission and reception, confirm that the SCI4 completes reception and both the RDRF and ORER flags are cleared to 0 after clearing the RE bit to 0. After that, set both the TE and RE bits to 1. 16.5 Interrupt Sources The SCI4 has four interrupt sources: transmit end, transmit data empty, receive data full, and receive error (overrun error). Table 16.3 lists the descriptions of the interrupt sources. Table 16.3 SCI4 Interrupt Sources Abbreviation Condition Interrupt Source RXI RIE = 1 Receive data full (RDRF) TXI TIE = 1 Transmit data empty (TDRE) TEI TEIE = 1 Transmit end (TEND) ERI RIE = 1 Receive error (ORER) The interrupt requests can be enabled/disabled by the TIE and RIE bits in SCR4. When the TDRE flag in SCSR4 is set to 1, a TXI is generated. When the TEND bit in SCSR4 is set to 1, a TEI is generated. These two interrupt requests are generated during transmission. The TDRE flag in SCSR4 is initialized to 1. Therefore, if a TXI request is enabled by setting the TIE bit in SCR4 to 1 before transmit data is transferred to TDR4, a TXI is generated even when transmit data is not ready. If transmit data is transferred to TDR4 in the interrupt handling routine, these interrupt requests can be effectively used. To avoid the occurrence of the interrupt requests (TXI and TEI), clear the corresponding interrupt enable bits (TIE and TEIE) to 0 after transmit data is transferred to TDR4. When the RDRF bit in SCSR4 is set to 1, an RXI is generated. When the ORER flag is set to 1, an ERI is generated. These two interrupt requests are generated during reception. Rev. 3.00 Aug 23, 2006 Page 377 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) 16.6 Usage Notes When using the SCI4, keep in mind the following. 16.6.1 Relationship between Writing to TDR4 and TDRE The TDRE flag in SCSR4 is a status flag that indicates that data to be transmitted has not been stored in TDR4. When writing data to TDR4, the TDRE flag is automatically cleared to 0. The TDRE flag is set to 1 when the SCI4 transfers data from TDR4 to SR4. Data is written to TDR4 regardless of the TDRE flag value. However, if data is written to TDR4 with TDRE = 0, the previous data is lost unless the previous data has been transferred to SR4. Accordingly, to ensure transmission, writing transmit data to TDR4 must be performed once after confirming that the TDRE flag has been set to 1. (Do not write more than once.) 16.6.2 Receive Error Flag and Transmission While the receive error flag (ORER) is set to 1, transmission cannot be started even if the TDRE flag is cleared to 0. To start transmission, the ORER flag must be cleared to 0. Note that the ORER flag cannot be cleared to 0 even if the RE bit is cleared to 0. 16.6.3 Relationship between Reading RDR4 and RDRF The SCI4 always checks the RDRF flag status during reception. When the RDRF flag is cleared to 0 at the end of a frame, the reception is completed without error. When the RDRF flag is set to 1, it indicates that an overrun has occurred. Since reading RDR4 clears the RDRF flag to 0 automatically, if RDR4 is read twice or more, the data is read with the RDRF flag cleared to 0. In this case, when the timing of the read operation matches that of the data reception of the next frame, the read data may be the next frame data. Figure 16.9 shows this operation. Rev. 3.00 Aug 23, 2006 Page 378 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) Number of transfer Frame 1 Frame 2 Frame 3 Data 1 Data 2 Data 3 Data 1 Data 2 RDRF RDR4 (A) RDR4 read (B) RDR4 read At the timing of (A), data 1 is read. At the timing of (B), data 2 is read. Figure 16.9 Relationship between Reading RDR4 and RDRF In this case, RDR4 must be read only once after confirming RDRF = 1. If reading RDR4 twice or more, store the read data in the RAM, and use the stored data. In addition, there should be a margin from the timing of reading RDR4 to completion of the next frame reception. (Reading RDR4 should be completed before the bit 7 transfer.) 16.6.4 SCK4 Output Waveform when Internal Clock of /2 is Selected When the internal clock of /2 is selected by the CKS3 to CKS0 bits in SCSR4 and continuous transmission or reception is performed, one pulse of high period is lengthened after eight pulses of the clock has been output as shown in figure 16.10. SCK4 SO4/SI4 Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit0 Bit1 Bit2 Figure 16.10 Transfer Format when Internal Clock of /2 is Selected Rev. 3.00 Aug 23, 2006 Page 379 of 616 REJ09B0182-0300 Section 16 Serial Communication Interface 4 (SCI4) Rev. 3.00 Aug 23, 2006 Page 380 of 616 REJ09B0182-0300 Section 17 14-Bit PWM Section 17 14-Bit PWM This LSI has an on-chip 14-bit pulse width modulator (PWM) with two channels. Connecting the PWM to the low-pass filter enables the PWM to be used as a D/A converter. The standard PWM or pulse-division type PWM can be selected by software. Figure 17.1 shows a block diagram of the 14-bit PWM. 17.1 Features * Choice of four conversion periods A conversion period of 131,072/ with a minimum modulation width of 8/, a conversion period of 65,536/ with a minimum modulation width of 4/, a conversion period of 32,768/ with a minimum modulation width of 2/, or a conversion period of 16,384/ with a minimum modulation width of 1/, can be selected. * Pulse division method for less ripple * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) * The standard PWM or pulse-division type PWM can be selected by software. /2 /4 /8 /16 Internal data bus PWDR PWM waveform generator PWCR PWM Pulse-division type waveform Standard waveform Asynchronous event counter [Legend] PWDR: PWCR: PWM data register PWM control register PWM waveform generator Figure 17.1 Block Diagram of 14-Bit PWM Rev. 3.00 Aug 23, 2006 Page 381 of 616 REJ09B0182-0300 Section 17 14-Bit PWM 17.2 Input/Output Pins Table 17.1 shows the 14-bit PWM pin configuration. Table 17.1 Pin Configuration Name Abbreviation I/O Function PWM1 output pin PWM1 Output Standard PWM/pulse-division type PWM waveform output (PWM1) PWM2 output pin PWM2 Output Standard PWM/pulse-division type PWM waveform output (PWM2) 17.3 Register Descriptions The 14-bit PWM has the following registers. * PWM1 control register (PWCR1) * PWM1 data register (PWDR1) * PWM2 control register (PWCR2) * PWM2 data register (PWDR2) 17.3.1 PWM Control Register (PWCR) PWCR selects the input clocks and selects whether the standard PWM or pulse-division type PWM is used. Bit Bit Name Initial Value R/W Description 7 to 3 All 1 Reserved These bits are always read as 1 and cannot be modified. 2 PWCRm2 0 W PWM Output Waveform Select Selects whether the standard PWM waveform or pulsedivision type PWM waveform is output. 0: Pulse-division type PWM waveform is output 1: Standard PWM waveform is output Rev. 3.00 Aug 23, 2006 Page 382 of 616 REJ09B0182-0300 Section 17 14-Bit PWM Bit Bit Name Initial Value R/W Description 1 PWCRm1 0 W Clock Select 1 and 0 0 PWCRm0 0 W Select the clock supplied to the 14-bit PWM. These bits are write-only bits and always read as 1. 00: The input clock is /2 (t* = 2/) A conversion period is 16,384/, with a minimum modulation width of 1/ 01: The input clock is /4 (t* = 4/) A conversion period is 32,768/, with a minimum modulation width of 2/ 10: The input clock is /8 (t* = 8/) A conversion period is 65,536/, with a minimum modulation width of 4/ 11: The input clock is /16 (t* = 16/) A conversion period is 131,072/, with a minimum modulation width of 8/ Note: 17.3.2 * t: Period of PWM clock input m = 2 or 1 PWM Data Register (PWDR) PWDR is a 14-bit write-only register. PWDR indicates high level width in one PWM waveform cycle when the pulse-division type PWM is selected. When data is written to the lower 14 bits of PWDR, the contents are latched in the PWM waveform generator and the PWM waveform generation data is updated. The initial value of PWDR is 0, and it is always read as H'FFFF. Always write to this register in word size. Rev. 3.00 Aug 23, 2006 Page 383 of 616 REJ09B0182-0300 Section 17 14-Bit PWM 17.4 Operation 17.4.1 Pulse-Division Type PWM Operating Principle In pulse-division type PWM, the high and low periods of normal PWM output are divided into equal segments and output alternately. This is done to reduce ripple when using a low-pass filter as a D/A converter. Figure 17.2 shows an example of division by four. With 14-bit PWM, the division is into 64 pulses. One conversion period Normal PWM (1) Pulse-division type PWM (division by four) (1) (2) (5) (3) (2) (6) (4) (3) (5) (7) (6) (4) (7) (8) (8) Figure 17.2 Example of Pulse-Division Type PWM Using Division by Four 17.4.2 Pulse-Division Type PWM Setting Method When using the pulse-division type PWM, set the registers in this sequence: 1. Set the PWM1 or PWM2 bit in PMR9 (corresponding to the PWM channel used) to 1 to set the P90/PWM1 or P91/PWM2 pin to function as a PWM pin. 2. Set PWCR to define one conversion period. 3. Set the output waveform data in PWDR. When the data is written to PWDR, the contents are latched in the PWM waveform generator, and the PWM waveform generation data is updated. 17.4.3 Pulse-Div ision Type PWM Operating One conversion period consists of 64 pulses, as shown in figure 17.3. The total high-level width during this period (TH) corresponds to the data in PWDR. Table 17.2 shows this relation. Rev. 3.00 Aug 23, 2006 Page 384 of 616 REJ09B0182-0300 Section 17 14-Bit PWM One conversion period tf1 tf2 tH1 tH2 tf63 tH3 tH63 tf64 tH64 TH = tH1 + tH2 + tH3 + . . . tH64 tf1 = tf2 = tf3 . . . = tH64 Figure 17.3 PWM Output Waveform Table 17.2 Correspondence Between PWCR, PWRD, and Output Waveform PWCRm Setting Value PWCRm1 PWCRm0 One Conversion Period [tcyc] TH [tcyc] tfn (n = 1 to 64) [tcyc] 0 0 16384 (PWDRm+64) * 1 256 0 1 32768 (PWDRm+64) * 2 512 1 0 65536 (PWDRm+64) * 4 1024 1 1 131072 (PWDRm+64) * 8 2048 Note: m = 2, 1 17.4.4 Setting for Standard PWM Operation When using the standard PWM, set the registers in this sequence: 1. Set the PWM1 or PWM2 bit in PMR9 (according to the PWM channel used) to 1 to set the P90/PWM1 or P91/PWM2 pin to function as a PWM pin. 2. Set PWCRm2 to 1 to select the standard PWM waveform. (m = 2 or 1) 3. Set the event counter PWM in the asynchronous event counter. For the setting method, see description of the event counter PWM operation in the asynchronous event counter. 4. The PWM pin outputs the PWM waveform set by the event counter. Note: When the standard waveform is used, 16-bit counter operation, 8-bit counter operation, and IRQAEC operation for the asynchronous event counter are not available because the PWM for the asynchronous event counter is used. When the IECPWM signal of the asynchronous event counter goes high, ECH and ECL increment. However, when the signal goes low, these counters stop. (For details, refer to section 13.4, Operation.) Rev. 3.00 Aug 23, 2006 Page 385 of 616 REJ09B0182-0300 Section 17 14-Bit PWM 17.5 PWM Operating States The PWM operating states are shown in table 17.3. Table 17.3 PWM Operating States Operating Mode Reset Active Sleep Watch Subactive Subsleep Standby Module Standby PWCRm Reset Functions Functions Retained Functions* Retained Retained Retained PWDRm Reset Functions Functions Retained Retained Retained Retained Retained Notes: m = 2 or 1 * Write-enabled 17.6 Usage Notes 17.6.1 Timing of Effect on PWM Waveform After Writing to PWDR If PWDR is rewritten during PWM waveform output, the effects on the PWM waveform are as follows, depending on the timing of the write operation: (1) Write performed during low-level output. New setting takes effect from next pulse. (2) Write performed during low-level output. a. Duty increased. New setting takes effect immediately after write. b. Duty decreased. * High width at time of write exceeds PWDR high width after write. High-level output for one pulse period. * High width at time of write does not exceed PWDR high width after write. New setting takes effect immediately after write. Rev. 3.00 Aug 23, 2006 Page 386 of 616 REJ09B0182-0300 Section 18 A/D Converter Section 18 A/D Converter This LSI includes a successive approximation type 10-bit A/D converter that allows up to three analog input channels to be selected. The block diagram of the A/D converter is shown in figure 18.1. 18.1 Features * 10-bit resolution * Input channels: Three channels * High-speed conversion: 12.4 s per channel (at 5-MHz operation) * Sample and hold function * Conversion start method A/D conversion can be started by software and external trigger. * Interrupt source An A/D conversion end interrupt request can be generated. * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) ADCMS4AA_000020040500 Rev. 3.00 Aug 23, 2006 Page 387 of 616 REJ09B0182-0300 Section 18 A/D Converter ADTRG AMR ADSR AN0 Internal data bus Multiplexer AN1 AN2 AVCC + Comparator Control logic - AVCC Reference voltage AVSS ADRR AVSS [Legend] AMR: ADSR: ADRR: IRRAD: A/D mode register A/D start register A/D result register A/D conversion end interrupt request flag Figure 18.1 Block Diagram of A/D Converter Rev. 3.00 Aug 23, 2006 Page 388 of 616 REJ09B0182-0300 IRRAD Section 18 A/D Converter 18.2 Input/Output Pins Table 18.1 shows the input pins used by the A/D converter. Table 18.1 Pin Configuration Pin Name Abbreviation I/O Function Analog power supply pin AVcc Input Power supply and reference voltage of analog part Analog ground pin AVss Input Ground and reference voltage of analog part Analog input pin 0 Analog input pin 1 AN0 AN1 Input Input Analog input pins Analog input pin 2 External trigger input pin AN2 ADTRG Input Input 18.3 External trigger input that controls the A/D conversion start. Register Descriptions The A/D converter has the following registers. * A/D result register (ADRR) * A/D mode register (AMR) * A/D start register (ADSR) 18.3.1 A/D Result Register (ADRR) ADRR is a 16-bit read-only register that stores the results of A/D conversion. The upper 10 bits of the data are stored in ADRR. ADRR can be read by the CPU at any time, but the ADRR value during A/D conversion is undefined. After A/D conversion is completed, the conversion result is stored as 10-bit data, and this data is retained until the next conversion operation starts. The initial value of ADRR is undefined. Always read this register in word size. Rev. 3.00 Aug 23, 2006 Page 389 of 616 REJ09B0182-0300 Section 18 A/D Converter 18.3.2 A/D Mode Register (AMR) AMR sets the A/D conversion time, and selects the external trigger and analog input pins. Bit Bit Name Initial Value R/W 7 CKS 0 R/W Description Clock Select Selects the clock source for A/D conversion. 0: /4 (conversion time = 62 states (max.) (basic clock = )) 1: /2 (conversion time = 31 states (max.) (basic clock = )) 6 TRGE 0 R/W External Trigger Select Enables or disables the A/D conversion start by the external trigger input. 0: Disables the A/D conversion start by the external trigger input. 1: Starts A/D conversion at the rising or falling edge of the ADTRG pin The edge of the ADTRG pin is selected by the ADTRGNEG bit in IEGR. 5 1 Reserved 4 1 These bits are always read as 1 and cannot be modified. 3 CH3 0 R/W Channel Select 3 to 0 2 CH2 0 R/W Select the analog input channel. 1 CH1 0 R/W 00xx: No channel selected 0 CH0 0 R/W 0100: AN0 0101: AN1 0110: AN2 0111: Using prohibited 1xxx: Using prohibited The channel selection should be made while the ADSF bit is cleared to 0. [Legend] x: Don't care. Rev. 3.00 Aug 23, 2006 Page 390 of 616 REJ09B0182-0300 Section 18 A/D Converter 18.3.3 A/D Start Register (ADSR) ADSR starts and stops the A/D conversion. Bit Bit Name Initial Value R/W Description 7 ADSF 0 R/W When this bit is set to 1, A/D conversion is started. When conversion is completed, the converted data is set in ADRR and at the same time this bit is cleared to 0. If this bit is written to 0, A/D conversion can be forcibly terminated. 6 to 0 All 1 Reserved These bits are always read as 1 and cannot be modified. 18.4 Operation The A/D converter operates by successive approximation with 10-bit resolution. When changing the conversion time or analog input channel, in order to prevent incorrect operation, first clear the bit ADSF to 0 in ADSR. 18.4.1 A/D Conversion 1. A/D conversion is started from the selected channel when the ADSF bit in ADSR is set to 1, according to software. 2. When A/D conversion is completed, the result is transferred to the A/D result register. 3. On completion of conversion, the IRRAD flag in IRR2 is set to 1. If the IENAD bit in IENR2 is set to 1 at this time, an A/D conversion end interrupt request is generated. 4. The ADSF bit remains set to 1 during A/D conversion. When A/D conversion ends, the ADSF bit is automatically cleared to 0 and the A/D converter enters the wait state. Rev. 3.00 Aug 23, 2006 Page 391 of 616 REJ09B0182-0300 Section 18 A/D Converter 18.4.2 External Trigger Input Timing The A/D converter can also start A/D conversion by input of an external trigger signal. External trigger input is enabled at the ADTRG pin when the ADTSTCHG bit in PMRB is set to 1* and TRGE bit in AMR is set to 1. Then when the input signal edge designated in the ADTRGNEG bit in IEGR is detected at the ADTRG pin, the ADSF bit in ADSR will be set to 1, starting A/D conversion. Figure 18.2 shows the timing. Note: * The ADTRG input pin is shared with the TEST pin. Therefore when the pin is used as the ADTRG pin, reset should be cleared while the 0-fixed or 1-fixed signal is input to the TEST pin. Then the ADTSTCHG bit should be set to 1 after the TEST signal is fixed. ADTRG (when ADTRGNEG = 0) ADSF A/D conversion Figure 18.2 External Trigger Input Timing 18.4.3 Operating States of A/D Converter Table 18.2 shows the operating states of the A/D converter. Table 18.2 Operating States of A/D Converter Operating Mode Reset Active Sleep Watch Subactive Subsleep Standby Module Standby AMR Reset Functions Functions Retained Retained Retained Retained Retained ADSR Reset Functions Functions Retained Retained Retained Retained Retained ADRR Retained* Functions Functions Retained Retained Retained Retained Retained Note: * Undefined at a power-on reset. Rev. 3.00 Aug 23, 2006 Page 392 of 616 REJ09B0182-0300 Section 18 A/D Converter 18.5 Example of Use An example of how the A/D converter can be used is given below, using channel 1 (pin AN1) as the analog input channel. Figure 18.3 shows the operation timing. 1. Bits CH3 to CH0 in the A/D mode register (AMR) are set to 0101, making pin AN1 the analog input channel. A/D interrupts are enabled by setting bit IENAD to 1, and A/D conversion is started by setting bit ADSF to 1. 2. When A/D conversion is completed, bit IRRAD is set to 1, and the A/D conversion result is stored in ADRR. At the same time bit ADSF is cleared to 0, and the A/D converter goes to the idle state. 3. Bit IENAD = 1, so an A/D conversion end interrupt is requested. 4. The A/D interrupt handling routine starts. 5. The A/D conversion result is read and processed. 6. The A/D interrupt handling routine ends. If bit ADSF is set to 1 again afterward, A/D conversion starts and steps 2 through 6 take place. Figures 18.4 and 18.5 show flowcharts of procedures for using the A/D converter. Rev. 3.00 Aug 23, 2006 Page 393 of 616 REJ09B0182-0300 REJ09B0182-0300 Rev. 3.00 Aug 23, 2006 Page 394 of 616 Idle A/D conversion starts A/D conversion (1) Set* Set* Note: * indicates instruction execution by software. ADRR Channel 1 (AN1) operating state ADSF IENAD Interrupt (IRRAD) A/D conversion result (1) Read conversion result Idle A/D conversion (2) Set* Read conversion result A/D conversion result (2) Idle Section 18 A/D Converter Figure 18.3 Example of A/D Conversion Operation Section 18 A/D Converter Start Set A/D conversion speed and input channel Disable A/D conversion end interrupt Start A/D conversion Read ADSR No ADSF = 0? Yes Read ADRR data Yes Perform A/D conversion? No End Figure 18.4 Flowchart of Procedure for Using A/D Converter (Polling by Software) Start Set A/D conversion speed and input channel Enable A/D conversion end interrupt Start A/D conversion A/D conversion end interrupt generated? Yes No Clear IRRAD bit in IRR2 to 0 Read ADRR data Yes Perform A/D conversion? No End Figure 18.5 Flowchart of Procedure for Using A/D Converter (Interrupts Used) Rev. 3.00 Aug 23, 2006 Page 395 of 616 REJ09B0182-0300 Section 18 A/D Converter 18.6 A/D Conversion Accuracy Definitions This LSI's A/D conversion accuracy definitions are given below. * Resolution The number of A/D converter digital output codes * Quantization error The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 18.6). * Offset error The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output changes from the minimum voltage value 0000000000 to 0000000001 (see figure 18.7). * Full-scale error The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output changes from 1111111110 to 1111111111 (see figure 18.7). * Nonlinearity error The error with respect to the ideal A/D conversion characteristics between zero voltage and full-scale voltage. Does not include offset error, full-scale error, or quantization error. * Absolute accuracy The deviation between the digital value and the analog input value. Includes offset error, fullscale error, quantization error, and nonlinearity error. Rev. 3.00 Aug 23, 2006 Page 396 of 616 REJ09B0182-0300 Section 18 A/D Converter Digital output Ideal A/D conversion characteristic 111 110 101 100 011 010 Quantization error 001 000 1 8 2 8 3 8 4 8 5 8 6 8 7 FS 8 Analog input voltage Figure 18.6 A/D Conversion Accuracy Definitions (1) Digital output Full-scale error Ideal A/D conversion characterist Nonlinearity error Actual A/D conversion characteristic Offset error FS Analog input voltage Figure 18.7 A/D Conversion Accuracy Definitions (2) Rev. 3.00 Aug 23, 2006 Page 397 of 616 REJ09B0182-0300 Section 18 A/D Converter 18.7 18.7.1 Usage Notes Permissible Signal Source Impedance This LSI's analog input is designed such that conversion accuracy is guaranteed for an input signal for which the signal source impedance is 10 k or less. This specification is provided to enable the A/D converter's sample-and-hold circuit input capacitance to be charged within the sampling time; if the sensor output impedance exceeds 10 k, charging may be insufficient and it may not be possible to guarantee A/D conversion accuracy. If a large capacitance is provided externally as a countermeasure, the input load essentially comprises only the internal input resistance of 10 k, and the signal source impedance can be ignored. However, as a low-pass filter effect is obtained in this case, it may not be possible to follow an analog signal with a large differential coefficient (e.g., 5 mV/s or greater) (see figure 18.8). When converting a high-speed analog signal, a lowimpedance buffer should be inserted. 18.7.2 Influences on Absolute Accuracy Adding capacitance results in coupling with GND, and therefore noise in GND may adversely affect absolute accuracy. Be sure to make the connection to an electrically stable GND. Care is also required to ensure that filter circuits do not interfere with digital signals or act as antennas on the mounting board. This LSI Sensor output impedance up to 10 k A/D converter equivalent circuit 10 k Sensor input Low-pass filter C up to 0.1 F Cin = 15 pF Figure 18.8 Example of Analog Input Circuit Rev. 3.00 Aug 23, 2006 Page 398 of 616 REJ09B0182-0300 48 pF Section 18 A/D Converter 18.7.3 Usage Notes 1. ADRR should be read only when the ADSF bit in ADSR is cleared to 0. 2. Changing the digital input signal at an adjacent pin during A/D conversion may adversely affect conversion accuracy. 3. When A/D conversion is started after clearing module standby mode, wait for 10 clock cycles before starting A/D conversion. 4. In active mode and sleep mode, the analog power supply current flows in the ladder resistance even when the A/D converter is on standby. Therefore, if the A/D converter is not used, it is recommended that AVcc be connected to the system power supply and the ADCKSTP bit be cleared to 0 in CKSTPR1. Rev. 3.00 Aug 23, 2006 Page 399 of 616 REJ09B0182-0300 Section 18 A/D Converter Rev. 3.00 Aug 23, 2006 Page 400 of 616 REJ09B0182-0300 Section 19 A/D Converter Section 19 A/D Converter This LSI includes a modulation ( modulation or SDM) type 14-bit A/D converter that allows up to two analog input channels to be selected. Note that the A/D converter is not available for the audio equipment. The block diagram of the A/D converter is shown in figure 19.1. 19.1 Features * 14-bit resolution * Two input channels * Conversion method: Secondary and 320-times oversampling type * Conversion time: 200 s per channel (at 1.6 MHz operation) * Interrupt source An A/D conversion end interrupt request can be generated. * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) ADCMS3AA_000020040600 Rev. 3.00 Aug 23, 2006 Page 401 of 616 REJ09B0182-0300 Section 19 A/D Converter System clock () PSS fovs = /2, /4, /8, /16, /32 fovs = IRRSDADCN Programmable gain amplifier Ain1 Multiplexer Vref/REF Clock interrupt control circuit PGA Reference voltage generator Dout (16 bits; 14 bits are valid) Secondary A/D converter ADCR ACOM ADSSR ADDR (16 bits) LCD drive power supply circuit Buffer Band-gap reference circuit LCD BGRMR [Legend] ADCR: ADSSR: IRRSDADCN: ADDR: BGRMR: A/D control register A/D start/status register A/D conversion end interrupt request flag A/D data register BGA control register Figure 19.1 Block Diagram of A/D Converter Rev. 3.00 Aug 23, 2006 Page 402 of 616 REJ09B0182-0300 Internal data bus Ain2 Section 19 A/D Converter 19.2 Input/Output Pins Table 19.1 shows the pins used by the A/D converter. Table 19.1 Pin Configuration Pin Name Abbreviation I/O Function Reference voltage pin Vref Input External reference voltage input Internal reference voltage output pin REF Output Internal reference voltage output Analog voltage stabilization pin Analog input pin 1 ACOM Output Ain1 Input Stabilization capacitance connection (for 0.1F capacitor connection) Analog input pins Analog input pin 2 Ain2 DVcc Input Input Power supply pin Analog power supply pin for the A/D converter 19.3 Register Descriptions The A/D converter has the following registers. * A/D data register (ADDR) * BGR control register (BGRMR) * A/D control register (ADCR) * A/D start/status register (ADSSR) 19.3.1 A/D Data Register (ADDR) ADDR is a 16-bit read-only register that stores the results of A/D conversion. ADDR can be read by the CPU at any time, but the ADDR value during A/D conversion is undefined. After A/D conversion is completed, 14-bit data of the conversion result is stored in upper 14 bits in ADDR, and this data is retained until the next conversion operation starts. The initial value of ADDR is undefined. Always read this register in word size. Rev. 3.00 Aug 23, 2006 Page 403 of 616 REJ09B0182-0300 Section 19 A/D Converter 19.3.2 BGR Control Register (BGRMR) BGRMR controls operation of the band-gap reference circuit (BGR) and adjusts the internal reference voltage output from the REF pin (BGR output voltage). Bit Bit Name Initial Value R/W 7 BGRSTPN* 0 R/W Description Band-Gap Reference Circuit Control Sets operation or stop of the band-gap reference circuit. 0: Band-gap reference circuit stops 1: Band-gap reference circuit operates 6 to 3 2 BTRM2 0 R/W BGR Output Voltage Trimming 1 BTRM1 0 R/W Adjust approximately 1.2-V BGR output voltage. 0 BTRM0 0 R/W 000: 0 V All 1 Reserved These bits are always read as 1 and cannot be modified. 001: +0.14 V 010: +0.09 V 011: +0.04 V 100: -0.04 V 101: -0.09 V 110: -0.14 V 111: -0.18 V Note: * When the BGRSTPN bit is 0 (when the band-gap reference circuit is halted), the 3-V constant-voltage power supply circuit of the LCD is halted. The time from the point at which the BGRSTPN bit is set to 1 until the BGR output voltage is stabilized to approximately 1.2 V is approximately 100 s. Rev. 3.00 Aug 23, 2006 Page 404 of 616 REJ09B0182-0300 Section 19 A/D Converter 19.3.3 A/D Control Register (ADCR) ADCR sets the conversion mode, PGA multiplication ratio, and reference voltage, and selects the analog input channel and oversampling frequency. Bit Bit Name Initial Value R/W Description 7 MOD 0 Conversion Mode Select R/W Sets the conversion mode. When the MOD bit is set to 1, A/D conversion is executed regardless of the ADS bit in ADSSR. 0: Wait mode 1: Continuous mode 6 OVS2 0 R/W Oversampling Frequency Select 5 OVS1 0 R/W Select the oversampling frequency. 4 OVS0 0 R/W 000: 001: /2 010: /4 011: /8 100: /16 101: /32 11x: Setting prohibited Rev. 3.00 Aug 23, 2006 Page 405 of 616 REJ09B0182-0300 Section 19 A/D Converter Bit Bit Name Initial Value R/W Description 3 VREF1 0 R/W 2 VREF0 0 R/W PB5/Vref/REF Pin Function Switch and Reference Voltage Select These bits specify whether the PB5/Vref/REF pin functions as a PB5 pin, Vref pin, or REF pin. In addition, these bits select the external reference voltage (Vref) or internal reference voltage (REF) as the reference voltage of the A/D converter. When the REF is to be selected, set these bits after the BGRSTPN bit in BGRMR has been set to 1 to operate the BGR. 00: Functions as a PB5 input pin 01: Functions as a Vref input pin, and the external reference voltage (Vref) is input to the reference generator 10: Functions as a REF output pin 11: Functions as a REF output pin, and the internal reference voltage (REF) is input to the reference generator When these bits are set to B'11, the REF voltage is input to the reference voltage generator in the A/D converter at the same timing as the internal reference voltage (REF) is output from the REF pin. To operate the A/D converter with the internal reference voltage (REF), set these bits to B'11. 1 PGA1 0 R/W PGA Gain Select 0 PGA0 0 R/W Set the analog input voltage multiplication ratio ranging from 1/3 times to 4 times. 00: 1 time 01: 2 times 10: 4 times 11: 1/3 times [Legend] x: Don't care. Rev. 3.00 Aug 23, 2006 Page 406 of 616 REJ09B0182-0300 Section 19 A/D Converter 19.3.4 A/D Start/Status Register (ADSSR) ADSSR consists of the A/D conversion status flag, analog input channel select bit, and bypass select bit. Bit Bit Name Initial Value R/W Description 7 ADS 0 R/W A/D Start When this bit is set to 1 in wait mode (the MOD bit in ADCR is cleared to 0), A/D conversion is started. 6 ADST 0 R A/D Status Flag When this bit is read in wait mode (the MOD bit in ADCR is cleared to 0), A/D conversion status can be identified. 0: In the idle state 1: During A/D conversion 5 AIN1 0 R/W Analog Input Channel Select 4 AIN0 0 R/W Select the analog input channel. 00: Not selected 01: Ain1 10: Ain2 11: Not selected 3 BYPGA 0 R/W PGA Bypass Select Selects whether the analog input is to the PGA or secondary A/D converter. 0: To the PGA 1: To the secondary A/D converter 2 to 0 Reserved These bits cannot be modified. Note: When the BYPGA bit is set to 1 and the PGA factor is 1, the factor of analog input voltage is also 1. However, analog input voltage is limited to range from 0 to Vref [V] when the BYPGA bit is set to 1 and from 0.2 to 0.9 Vref [V] when the PGA factor is 1. Therefore when the factor of analog input voltage is 1, the setting when the BYPGA bit is set to 1 should be used. Rev. 3.00 Aug 23, 2006 Page 407 of 616 REJ09B0182-0300 Section 19 A/D Converter 19.4 Operation The A/D converter uses the modulator and converts the analog input voltage range specified by the Vref pin to digital data with 14-bit resolution. The A/D converter is configured of two blocks: the analog block whose main part is a modulator and digital block consisted of the digital filter control circuit. In the analog block, voltage of the analog input pins (Vin1 and Vin2) is sampled by the frequency 320 times the conversion frequency (oversampling frequency) and then converted to the 1-bit digital row with the secondary modulator. The conversion result is output as 14-bit data with unsigned binary coded to ADDR via the decimation filter in the digital block. The ADD13 bit in ADDR is MSB and the ADD0 bit is LSB. 19.4.1 Wait Mode In wait mode, A/D conversion is executed once for the specified one analog input channel as follows. 1. A/D conversion is started from the selected channel when the ADS bit in ADSSR is set to 1, according to software. 2. When A/D conversion is completed, the result is transferred to the A/D data register. 3. On completion of conversion, the IRRSAD flag in IRR2 is set to 1. If the IENSAD bit in IENR2 is set to 1 at this time, an A/D conversion end interrupt request is generated. 4. The ADST bit remains set to 1 during A/D conversion. When A/D conversion ends, the ADS bit is automatically cleared to 0 and the A/D converter enters the wait state. 19.4.2 Continuous Mode In continuous mode, A/D conversion is executed continuously for the specified single analog input channel as follows. 1. A/D conversion is started from the selected channel when the MOD bit in ADCR is set to 1, according to software. 2. When A/D conversion is completed, the result is transferred to the A/D data register. 3. On completion of conversion, the IRRSAD flag in IRR2 is set to 1. If the IENSAD bit in IENR2 is set to 1 at this time, an A/D conversion end interrupt request is generated. 4. Then steps 2 and 3 are repeated. To stop continuous mode, a reset should be executed, a transition should be made to watch, subactive, subsleep, or standby mode, or the MOD bit in ADCR should be cleared to 0. Rev. 3.00 Aug 23, 2006 Page 408 of 616 REJ09B0182-0300 Section 19 A/D Converter Operating States of A/D Converter 19.4.3 Table 19.2 shows the operating states of the A/D converter. Table 19.2 Operating States of A/D Converter Operating Mode Reset Active Sleep Watch Sub-active Sub-sleep Standby Module Standby ADCR Reset Functions Retained Retained Retained Retained Retained Retained ADSSR Reset Functions Functions Retained Retained Retained Retained Retained ADDR Retained* Functions Functions Retained Retained Retained Retained Retained BGRMR Reset Functions Retained Retained Functions Retained Retained Retained Note: * Undefined at a power-on reset. 19.5 Example of Use 19.5.1 Wait Mode An example of how the A/D converter can be used is given below, using channel 1 (pin Ain1) as the analog input channel. Figure 19.2 shows the operation timing. 1. The AIN1 and AIN0 bits in ADSSR are set to B'01, making pin Ain1 the analog input channel. A/D conversion is started (the ADS bit is set to 1) by setting the IENSAD bit to 1. 2. When A/D conversion is completed, the IRRSAD bit is set to 1, and the A/D conversion result is stored in ADDR. At the same time the ADST bit is cleared to 0, and the A/D converter enters the idle state. 3. The IENSAD bit is set to 1, so an A/D conversion end interrupt is requested. 4. The A/D interrupt handling routine starts. 5. The A/D conversion result is read and processed. 6. The A/D interrupt handling routine ends. If the ADS bit is cleared to 0 and then set to 1, A/D conversion starts and steps 2 to 6 take place. Figures 19.3 and 19.4 show flowcharts of procedures for using the A/D converter. Rev. 3.00 Aug 23, 2006 Page 409 of 616 REJ09B0182-0300 Section 19 A/D Converter 19.5.2 Continuous Mode An example of how the A/D converter can be used is given below, using channel 1 (pin Ain1) as the analog input channel. Figure 19.5 shows the operation timing. 1. The AIN1 and AIN0 bits in ADSSR are set to B'01, making pin Ain1 the analog input channel. The IENSAD bit is set to 1. 2. A/D conversion is started (the MOD bit in ADCR is set to 1). 3. When A/D conversion is completed, the IRRSAD bit is set to 1, and the A/D conversion result is stored in ADDR. 4. The IENSAD bit is set to 1, so an A/D conversion end interrupt is requested. 5. The A/D interrupt handling routine starts. 6. The A/D conversion result is read and processed. 7. The A/D interrupt handling routine ends. Then steps 3 to 7 are repeated. To stop continuous mode, a reset should be executed, a transition should be made to watch, subactive, subsleep, or standby mode, or the MOD bit in ADCR should be cleared to 0. Rev. 3.00 Aug 23, 2006 Page 410 of 616 REJ09B0182-0300 Idle A/D conversion starts A/D conversion (1) Set* Set* Note: * indicates instruction execution by software. ADDR Channel 1 (Ain1) operating state ADS ADST IENSAD Interrupt (IRRSDADCN) Read conversion result A/D conversion result (1) Idle Clear* A/D conversion (2) Set* Read conversion result A/D conversion result (2) Idle Section 19 A/D Converter Figure 19.2 Example of A/D Conversion Operation (Wait Mode) Rev. 3.00 Aug 23, 2006 Page 411 of 616 REJ09B0182-0300 Section 19 A/D Converter Start Set A/D conversion speed and input channel Disable A/D conversion end interrupt Start A/D conversion Read ADSSR No ADDR = 0? Yes Read ADRR data Yes Perform A/D conversion? No End Figure 19.3 Flowchart of Procedure for Using A/D Converter (Polling by Software) Start Set A/D conversion speed and input channel Enable A/D conversion end interrupt Start A/D conversion Yes A/D conversion end interrupt generated? No Clear IRRSAD bit in IRR2 to 0 Read ADDR data Yes Perform A/D conversion? No End Figure 19.4 Flowchart of Procedure for Using A/D Converter (Interrupts Used) Rev. 3.00 Aug 23, 2006 Page 412 of 616 REJ09B0182-0300 Set* Set* A/D conversion (1) Note: * indicates instruction execution by software. ADDR Idle A/D conversion starts Channel 1 (Ain1) operating state MOD IENSAD Interrupt (IRRSDADCN) Read conversion result A/D conversion result (1) A/D conversion (2) Read conversion result A/D conversion result (2) A/D conversion (3) Section 19 A/D Converter Figure 19.5 Example of A/D Conversion Operation (Continuous Mode) Rev. 3.00 Aug 23, 2006 Page 413 of 616 REJ09B0182-0300 Section 19 A/D Converter 19.6 19.6.1 Usage Notes Reference Voltage In normal operation, pulse current of several A flows to the Vref pin which is the reference power supply pin. Connect the reference voltage which can apply stable voltage to the Vref pin. 19.6.2 Analog Voltage Stabilization Pin (ACOM Pin) The ACOM pin is used to connect a capacitor (0.1 F) to GND because of the internal amplifier phase compensation of the A/D Converter. Do not connect the ACOM pin to the devices other than capacitors or circuits. 19.6.3 Module Standby Mode When A/D conversion is started after clearing module standby mode, wait for 10 clock cycles before starting A/D conversion. When this module is in module standby mode, registers cannot be written. 19.6.4 Influences on Accuracy 1. Changing the digital input signal at an adjacent pin during A/D conversion may adversely affect conversion accuracy. 2. Noise in GND may adversely affect accuracy. Be sure to make the connection to an electrically stable GND. Care is also required to ensure that filter circuits do not interfere with digital signals or act as antennas on the mounting board. 19.6.5 PB5/Vref/REF Pin If VREF1 and VREF0 in the ADCR register are set to b'01 or b'11 and the A/D converter is not operating, switch the PB5/Vref/REF pin to PB5 input operation to prevent current from flowing from the pin to GND. Rev. 3.00 Aug 23, 2006 Page 414 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Section 20 LCD Controller/Driver This LSI has an on-chip segment-type LCD control circuit, LCD driver, and power supply circuit, enabling it to directly drive an LCD panel. 20.1 Features * Display capacity Duty Cycle Internal Driver Static 32 SEG 1/2 32 SEG 1/3 32 SEG 1/4 32 SEG * LCD RAM capacity 8 bits x 16 bytes (128 bits) * Word access to LCD RAM * The segment output pins can be used as ports. SEG32 to SEG1 pins can be used as ports in groups of four. * Common output pins not used because of the duty cycle can be used for common doublebuffering (parallel connection). With 1/2 duty, parallel connection of COM1 to COM2, and of COM3 to COM4, can be used In static mode, parallel connection of COM1 to COM2, COM3, and COM4 can be used * Choice of 11 frame frequencies * A or B waveform selectable by software * On-chip power supply split-resistor * Display possible in operating modes other than standby mode * On-chip 3-V constant-voltage power supply circuit This power circuit can constantly supply 3 V to LCD drive power supply without using Vcc voltage. * Output of the 3-V constant-voltage power supply circuit adjustable * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) LCDSG02A_000120040500 Rev. 3.00 Aug 23, 2006 Page 415 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Figure 20.1 shows a block diagram of the LCD controller/driver. Vcc LCD drive power supply (On-chip 3-V constant-voltage power supply circuit) C1 C2 V1 V2 V3 Vss /2 to /256 Common data latch w, w/2, and w/4 Common driver LTRMR Internal data bus LPCR LCR LCR2 Display timing generator 32-bit shift register LCD RAM 16 bytes LCD port control register LCD control register LCD control register 2 LCD trimming register BGR control register Figure 20.1 Block Diagram of LCD Controller/Driver Rev. 3.00 Aug 23, 2006 Page 416 of 616 Segment driver SEG1 SEGn (n = 1 to 32) REJ09B0182-0300 COM4 SEG32 SEG31 SEG30 SEG29 SEG28 BGRMR [Legend] LPCR: LCR: LCR2: LTRMR: BGRMR: COM1 Section 20 LCD Controller/Driver 20.2 Input/Output Pins Table 20.1 shows the LCD controller/driver pin configuration. Table 20.1 Pin Configuration Name Symbol Segment output pins SEG32 to SEG1 Output Common output pins COM4 to COM1 Output LCD power supply pins V1, V2, V3 -- Used when a bypass capacitor is connected externally, and when an external power supply circuit is used LCD step-up capacitance pins C1, C2 -- Capacitance pins for stepping up the LCD drive power supply 20.3 I/O Function LCD segment drive pins All pins are multiplexed as port pins (setting programmable) LCD common drive pins Pins can be used in parallel with static or 1/2 duty Register Descriptions The LCD controller/driver has the following registers. * LCD port control register (LPCR) * LCD control register (LCR) * LCD control register 2 (LCR2) * LCD trimming register (LTRMR) * BGR control register (BGRMR) * LCDRAM Rev. 3.00 Aug 23, 2006 Page 417 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver 20.3.1 LCD Port Control Register (LPCR) LPCR selects the duty cycle, LCD driver, and pin functions. Bit Bit Name Initial Value R/W Description 7 DTS1 0 R/W Duty Cycle Select 1 and 0 6 DTS0 0 R/W Common Function Select 5 CMX 0 R/W The combination of DTS1 and DTS0 selects static, 1/2, 1/3, or 1/4 duty. CMX specifies whether or not the same waveform is to be output from multiple pins to increase the common drive power when not all common pins are used because of the duty setting. For details, see table 20.2. 4 -- -- W Reserved Only 0 can be written to this bit. 3 SGS3 0 R/W Segment Driver Select 3 to 0 2 SGS2 0 R/W Select the segment drivers to be used. 1 SGS1 0 R/W For details, see table 20.3. 0 SGS0 0 R/W Table 20.2 Duty Cycle and Common Function Selection Bit 7: DTS1 Bit 6: DTS0 Bit 5: CMX Duty Cycle Common Drivers Notes* 0 0 0 Static COM1 Leave COM4, COM3, and COM2 in open drain state COM4 to COM1 COM4, COM3, and COM2 output the same waveform as COM1 COM2 to COM1 Leave COM4 and COM3 in open drain state COM4 to COM1 COM4 outputs the same waveform as COM3, and COM2 outputs the same waveform as COM1 1 1 0 1/2 duty 1 1 0 0 1/3 duty 1 1 0 1/4 duty COM3 to COM1 Leave COM4 in open drain state COM4 to COM1 Leave COM4 in open drain state COM4 to COM1 -- 1 Note: * If SGS3 to SGS0 are set to B'0000, the power supply voltage level of PA0 to PA3 and COM1 to COM4 is Vcc. If the setting of SGS3 to SGS0 is other than B'0000, the power supply voltage level of PA0 to PA3 and COM1 to COM4 is the LCD drive power supply voltage level. Rev. 3.00 Aug 23, 2006 Page 418 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Table 20.3 Segment Driver Selection Function of Pins SEG32 to SEG1 Bit 3: Bit 2: Bit 1: Bit 0: SGS3 SGS2 SGS1 SGS0 0 0 0 1 1 0 1 1 0 0 1 1 0 1 20.3.2 SEG32 to SEG28 to SEG24 to SEG20 to SEG16 to SEG12 to SEG8 to SEG21 SEG17 SEG13 SEG9 SEG5 SEG29 SEG25 SEG4 to SEG1 0 Port Port Port Port Port Port Port Port 1 Port Port Port Port Port Port Port SEG 0 Port Port Port Port Port Port SEG SEG 1 Port Port Port Port Port SEG SEG SEG 0 Port Port Port Port SEG SEG SEG SEG 1 Port Port Port SEG SEG SEG SEG SEG 0 Port Port SEG SEG SEG SEG SEG SEG 1 Port SEG SEG SEG SEG SEG SEG SEG 0 SEG SEG SEG SEG SEG SEG SEG SEG 1 SEG SEG SEG SEG SEG SEG SEG Port 0 SEG SEG SEG SEG SEG SEG Port Port 1 SEG SEG SEG SEG SEG Port Port Port 0 SEG SEG SEG SEG Port Port Port Port 1 SEG SEG SEG Port Port Port Port Port 0 SEG SEG Port Port Port Port Port Port 1 SEG Port Port Port Port Port Port Port LCD Control Register (LCR) LCR controls LCD drive power supply and display data, and selects the frame frequency. Bit Bit Name Initial Value R/W Description 7 -- 1 -- Reserved This bit is always read as 1 and cannot be modified. 6 PSW 0 R/W LCD Drive Power Supply Control Can be used to turn off the LCD drive power supply when LCD display is not required in power-down mode, or when an external power supply is used. When the ACT bit is cleared to 0 or in standby mode, the LCD drive power supply is turned off regardless of the setting of this bit. 0: LCD drive power supply is turned off 1: LCD drive power supply is turned on Rev. 3.00 Aug 23, 2006 Page 419 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Bit Bit Name Initial Value R/W Description 5 ACT 0 R/W Display Function Activate Specifies whether or not the LCD controller/driver is used. Clearing this bit to 0 halts operation of the LCD controller/driver. The LCD drive power supply is also turned off, regardless of the setting of the PSW bit. However, register contents are retained. 0: LCD controller/driver halts 1: LCD controller/driver operates 4 DISP 0 R/W Display Data Control Specifies whether the LCD RAM contents are displayed or blank data is displayed regardless of the LCD RAM contents. 0: Blank data is displayed 1: LCD RAM data is displayed 3 CKS3 0 R/W Frame Frequency Select 3 to 0 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W Select the operating clock and the frame frequency. However, in subactive mode, watch mode, and subsleep mode, the system clock () is halted. Therefore display operations are not performed if one of the clocks from /2 to /256 is selected. If LCD display is required in these modes, W, W/2, or W/4 must be selected as the operating clock. For details, see table 20.4. Rev. 3.00 Aug 23, 2006 Page 420 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Table 20.4 Frame Frequency Selection Frame Frequency* Bit 3: CKS3 Bit 2: CKS2 Bit 1: CKS1 Bit 0: CKS0 Operating Clock = 2 MHz 0 X 0 0 W 128 Hz* 1 W/2 64 Hz* 2 64 Hz* 2 1 X W/4 32 Hz* 2 32 Hz* 2 0 0 /2 -- 244 Hz 1 /4 977 Hz 122 Hz 0 /8 488 Hz 61 Hz 1 /16 244 Hz 30.5 Hz 0 0 /32 122 Hz -- 1 /64 61 Hz -- 1 0 /128 30.5 Hz -- 1 /256 -- -- 1 0 1 1 2 1 = 250 kHz* 128 Hz* 3 2 [Legend] X: Don't care Notes: 1. When 1/3 duty is selected, the frame frequency is 4/3 times the value shown. 2. This is the frame frequency when W = 32.768 kHz. 3. This is the frame frequency in active (medium-speed, OSC/8) mode when OSC = 2 MHz. 20.3.3 LCD Control Register 2 (LCR2) LCR2 controls switching between the A waveform and B waveform, selection of the step-up clock for the 3-V constant-voltage circuit, connection with the LCD power-supply split resistor, and turning on or off 3-V constant-voltage power supply. Rev. 3.00 Aug 23, 2006 Page 421 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Bit Bit Name Initial Value R/W Description 7 LCDAB 0 R/W A Waveform/B Waveform Switching Control Specifies whether the A waveform or B waveform is used as the LCD drive waveform. 0: Drive using A waveform 1: Drive using B waveform 6 HCKS 0 R/W Step-Up Clock Selection for 3-V Constant-Voltage Power Supply Circuit Selects a step-up clock for use in the 3-V constantvoltage power supply circuit. The step-up clock is obtained by dividing the clock selected by the CKS3 to CKS0 bits in LCR into 4 or 8. 0: Divided into 4 1: Divided into 8 5 CHG 0 R/W Connection Control of LCD Power-Supply Split Resistor Selects whether an LCD power-supply split resistor is disconnected or connected from or to LCD drive power supply. 0: Disconnected 1: Connected 4 SUPS 0 R/W 3-V Constant-Voltage Power Supply Control Can be used to turn off the 3-V constant-voltage power supply when LCD display is not required in powerdown mode, or when an external power supply is used. When the BGRSTPN bit in BGRMR is cleared to 0 or in standby mode, the 3-V constant-voltage power supply is turned off regardless of the setting of this bit. 0: 3-V constant-voltage power supply is turned off 1: 3-V constant-voltage power supply is turned on 3 to 0 -- -- W Reserved Only 0 can be written to these bits. Rev. 3.00 Aug 23, 2006 Page 422 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver 20.3.4 LCD Trimming Register (LTRMR) LTRMR adjusts 3-V constant-voltage used for LCD drive power supply and trims the output voltage adjustment of 3-V constant-voltage power supply circuit. Bit Bit Name Initial Value R/W Description 7 TRM3 0 R/W 6 TRM2 0 R/W Output Voltage Adjustment of 3-V Constant-Voltage Power Supply Circuit* 5 TRM1 0 R/W 4 TRM0 0 R/W By adjusting reference voltage that generates 3-V constant voltage, LCD drive power supply can be set to 3 V. Following values indicate the voltage of the V1 pin. Set this register so that the voltage on the V1 pin should be 3 V. 0000: 3.00 V 1000: 3.48 V 0001: 2.94 V 1001: 3.42 V 0010: 2.88 V 1010: 3.36 V 0011: 2.85 V 1011: 3.30 V 0100: 2.79 V 1100: 3.24 V 0101: 2.76 V 1101: 3.18 V 0110: 2.70 V 1110: 3.12 V 0111: 2.67 V 1111: 3.06 V 3 -- 1 -- Reserved This bit is always read as 1 and cannot be modified. Rev. 3.00 Aug 23, 2006 Page 423 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Bit Bit Name Initial Value R/W Description 2 CTRM2 0 R/W 1 CTRM1 0 R/W Variable Voltage Adjustment of 3-V Constant-Voltage Power Supply* 0 CTRM0 0 R/W The LCD drive power supply adjusted by the TRM bits can further be adjusted. If an LCD panel does not function normally due to a temperature in which LCD is used, set these bits to adjust it. 000: 3.00 V 001: 3.09 V 010: 3.18 V 011: 3.27 V 100: 2.64 V 101: 2.73 V 110: 2.82 V 111: 2.91 V Notes: Setting Method for LCD Trimming Register (LTRMR) and BRG Control Register (BGRMR) Assuming the following definitions, V1 initial state voltage: A LTRMR register TRM3 to TRM0: B CTRM2 to CTRM0: C BGRMR register BTRM2 to BTRM0: D rough guidelines for the voltages after trimming are as follows: V1 voltage = A + B + C + 3 x D/1.2 V2 voltage = (A + B + C + 3 x D/1.2) x 2/3 V3 voltage = (A + B + C + 3 x D/1.2) / 3 After monitoring voltage A, set B, C, and D so the V1 voltage is 3 V. The BRG control register is used both for A/D converter REF output adjustment and 3 V constant-voltage power supply circuit adjustment. Therefore, make sure to choose settings that satisfy the specifications for both functions. * These are approximate values and are not guaranteed. Therefore these values should be used as reference values. Rev. 3.00 Aug 23, 2006 Page 424 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver 20.3.5 BGR Control Register (BGRMR) BGRMR controls whether the band-gap reference circuit (BGR) which generates the reference voltage of the 3-V constant-voltage power supply and A/D converter operates or halts, and adjusts the reference voltage. Bit Bit Name Initial Value R/W Description 7 BGRSTPN 0 R/W Band-Gap Reference Circuit Control Controls whether the band-gap reference circuit operates or halts. 0: Band-gap reference circuit halts 1: Band-gap reference circuit operates 6 to 3 All 1 Reserved These bits are always read as 1 and cannot be modified. 2 BTRM2 0 R/W BGR Output Voltage Trimming 1 BTRM1 0 R/W BGR Output Voltage Trimming 0 BTRM0 0 R/W Adjust approximately 1.2-V BGR output voltage. 000: 0 V 001: +0.14 V 010: +0.09 V 011: +0.04 V 100: -0.04 V 101: -0.09 V 110: -0.14 V 111: -0.18 V Notes: Setting Method for LCD Trimming Register (LTRMR) Assuming the following definitions, V1 initial state voltage: A LTRMR register TRM3 to TRM0: B CTRM2 to CTRM0: C rough guidelines for the voltages after trimming are as follows: V1 voltage = A + B + C V2 voltage = (A + B + C) x 2/3 V3 voltage = (A + B + C) / 3 After monitoring voltage A, set B and C so the V1 voltage is 3 V. Rev. 3.00 Aug 23, 2006 Page 425 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver * These are approximate values and are not guaranteed. Therefore these values should be used as reference values. 20.4 Operation 20.4.1 Settings up to LCD Display To perform LCD display, the hardware and software related items described below must first be determined. (1) Hardware Settings (a) Using 1/2 duty When 1/2 duty is used, interconnect pins V2 and V3 as shown in figure 20.2. VCC V1 V2 V3 VSS Figure 20.2 Handling of LCD Drive Power Supply when Using 1/2 Duty (b) Large-Panel Display As the impedance of the on-chip power supply split-resistor is large, it may not be suitable for driving a panel which requires a current more than the current value calculated by the on-chip power supply split-resistor and voltage of the LCD power supply. If the display lacks sharpness when using a large panel, refer to section 20.4.5, Boosting LCD Drive Power Supply and Fine Adjustment. When static or 1/2 duty is selected, the common output drive capability can be increased. Set CMX to 1 when selecting the duty cycle. In this mode, with a static duty cycle pins COM4 to COM1 output the same waveform, and with 1/2 duty the COM1 waveform is output from pins COM2 and COM1, and the COM2 waveform is output from pins COM4 and COM3. Rev. 3.00 Aug 23, 2006 Page 426 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver (c) LCD Drive Power Supply Setting With this LSI, there are two ways of providing LCD power: by using the on-chip power supply circuit, or by using an external power supply circuit. When an external power supply circuit is used for the LCD drive power supply, connect the external power supply to the V1 pin. (2) Software Settings (a) Duty Selection Any of four duty cycles--static, 1/2 duty, 1/3 duty, or 1/4 duty--can be selected with bits DTS1 and DTS0. (b) Segment Driver Selection The segment drivers to be used can be selected with bits SGS3 to SGS0. (c) Frame Frequency Selection The frame frequency can be selected by setting bits CKS3 to CKS0. The frame frequency should be selected in accordance with the LCD panel specification. For the clock selection method in watch mode, subactive mode, and subsleep mode, see section 20.4.4, Operation in Power-Down Modes. (d) A or B Waveform Selection Either the A or B waveform can be selected as the LCD waveform to be used by means of LCDAB. (e) LCD Drive Power Supply Selection When an external power supply circuit is used, turn the LCD drive power supply off with the PSW bit. Rev. 3.00 Aug 23, 2006 Page 427 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver 20.4.2 Relationship between LCD RAM and Display The relationship between the LCD RAM and the display segments differs according to the duty cycle. LCD RAM maps for the different duty cycles are shown in figures 20.3 to 20.6. After setting the registers required for display, data is written to the part corresponding to the duty using the same kind of instruction as for ordinary RAM, and display is started automatically when turned on. Word- or byte-access instructions can be used for RAM setting. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 H'F370 SEG2 SEG2 SEG2 SEG2 SEG1 SEG1 SEG1 SEG1 H'F37F SEG32 SEG32 SEG32 SEG32 SEG31 SEG31 SEG31 SEG31 COM4 COM3 COM2 COM1 COM4 COM3 COM2 COM1 Figure 20.3 LCD RAM Map (1/4 Duty) Rev. 3.00 Aug 23, 2006 Page 428 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Bit 7 Bit 6 Bit 5 Bit 4 H'F370 SEG2 SEG2 H'F37F SEG32 COM3 Bit 3 Bit 2 Bit 1 Bit 0 SEG2 SEG1 SEG1 SEG1 SEG32 SEG32 SEG31 SEG31 SEG31 COM2 COM1 COM3 COM2 COM1 Space not used for display Figure 20.4 LCD RAM Map (1/3 Duty) H'F370 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 SEG4 SEG4 SEG3 SEG3 SEG2 SEG2 SEG1 SEG1 Display space H'F377 SEG32 SEG32 SEG31 SEG31 SEG30 SEG30 SEG29 SEG29 Space not used for display H'F37F COM2 COM1 COM2 COM1 COM2 COM1 COM2 COM1 Figure 20.5 LCD RAM Map (1/2 Duty) Rev. 3.00 Aug 23, 2006 Page 429 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver H'F370 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 SEG8 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 Display space H'F373 SEG32 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 Space not used for display H'F37F COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 Figure 20.6 LCD RAM Map (Static Mode) Rev. 3.00 Aug 23, 2006 Page 430 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Figure 20.7 shows a output waveforms for each duty cycle (A waveform). 1 frame 1 frame M M Data Data COM1 V1 V2 V3 VSS COM1 V1 V2 V3 VSS COM2 V1 V2 V3 VSS COM2 V1 V2 V3 VSS COM3 V1 V2 V3 VSS COM3 V1 V2 V3 VSS COM4 V1 V2 V3 VSS SEGn V1 V2 V3 VSS SEGn V1 V2 V3 VSS (b) Waveform with 1/3 duty (a) Waveform with 1/4 duty 1 frame 1 frame M M Data Data COM1 V1 V2,V3 VSS COM1 COM2 V1 V2,V3 VSS SEGn V1 V2,V3 VSS SEGn (c) Waveform with 1/2 duty V1 VSS V1 VSS (d) Waveform with static output M: LCD alternation signal Figure 20.7 Output Waveforms for Each Duty Cycle (A Waveform) Rev. 3.00 Aug 23, 2006 Page 431 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Figure 20.8 shows a output waveforms for each duty cycle (B waveform). 1 frame 1 frame 1 frame 1 frame 1 frame 1 frame 1 frame 1 frame M M Data Data COM1 V1 V2 V3 VSS COM1 V1 V2 V3 VSS COM2 V1 V2 V3 VSS COM2 V1 V2 V3 VSS COM3 V1 V2 V3 VSS COM3 V1 V2 V3 VSS COM4 V1 V2 V3 VSS SEGn V1 V2 V3 VSS SEGn V1 V2 V3 VSS (a) Waveform with 1/4 duty (b) Waveform with 1/3 duty 1 frame 1 frame 1 frame 1 frame 1 frame 1 frame 1 frame 1 frame M M Data Data COM1 COM2 V1 V2,V3 VSS COM1 V1 V2,V3 VSS SEGn V1 V2,V3 VSS SEGn V1 VSS V1 VSS (d) Waveform with static output M: LCD alternation signal (c) Waveform with 1/2 duty Figure 20.8 Output Waveforms for Each Duty Cycle (B Waveform) Rev. 3.00 Aug 23, 2006 Page 432 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Table 20.5 shows a output levels. Table 20.5 Output Levels Static 1/2 duty 1/3 duty 1/4 duty M: 20.4.3 Data 0 0 1 1 M 0 1 0 1 Common output V1 VSS V1 VSS Segment output V1 VSS VSS V1 Common output V2, V3 V2, V3 V1 VSS Segment output V1 VSS VSS V1 Common output V3 V2 V1 VSS Segment output V2 V3 VSS V1 Common output V3 V2 V1 VSS Segment output V2 V3 VSS V1 LCD alternation signal 3-V Constant-Voltage Power Supply Circuit This LSI incorporates a 3-V constant-voltage power supply circuit consisting of a band gap reference circuit (BGR), a triple step-up circuit, etc. This allows the 3 V constant voltage to drive LCD driver independently of Vcc. Before activating a step-up circuit, LCD controller/driver operates and set the duty cycle, pin function of the LCD driver or I/O, display data, frame frequencies, etc. Insert a capacitance of 0.1 F between the C1 pin and C2 pin, and connect a capacitance of 0.1 F to each of V1, V2, and V3 pins. (See figure 20.9.) After this setting, setting the BGRSTPN bit in the BGR control register (BGRMR) to 1 activates the band gap reference circuit, generating 1 V constant voltage (VLCD3) at the V3 pin. Furthermore, selecting the step-up circuit clock of the LCD control register 2 (LCR2) and setting the SUPS bit to 1 activates the triple step-up circuit, generating 2 V constant voltage, twice VLCD3, at the V2 pin, and generating 3 V constant voltage, triple VLCD3, at the V1 pin. Rev. 3.00 Aug 23, 2006 Page 433 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Notes: 1. Power supply might be insufficient when a large panel is driven. In this case, use Vcc for power supply, or use an external power supply circuit. 2. Do not use a polarized capacitance such as an electrolytic capacitor for connection between the C1 pin and C2 pin. 3. A 3-V constant-voltage power supply circuit is turned on by SUSP bit regardless of the setting of the PSW bit. 4. Initially, the step-up circuit output voltage differs among individual devices due to production variation. Therefore, make sure to adjust the settings of the LCD trimming register (LTRMR) and BRG control register (BGRMR) individually for each device. C1 C C2 V1 V2 V3 C C C C: 0.1 F Figure 20.9 Capacitance Connection when Using 3-V Constant-Voltage Power Supply Circuit 20.4.4 Operation in Power-Down Modes In this LSI, the LCD controller/driver can be operated even in the power-down modes. The operating state of the LCD controller/driver in the power-down modes is summarized in table 20.6. In subactive mode, watch mode, and subsleep mode, the system clock oscillator stops, and therefore, unless W, W/2, or W/4 has been selected by bits CKS3 to CKS0, the clock will not be supplied and display will halt. The subclock can be turned on or off by setting the 32KSTOP bit in the SUB32K control register (SUB32CR). When it is turned off, display will halt. Since there is a possibility that a direct current will be applied to the LCD panel in this case, it is essential to ensure that the subclock is turned on and W, W/2, or W/4 is selected. In active (medium-speed) mode, the system clock is switched, and therefore bits CKS3 to CKS0 must be modified to ensure that the frame frequency does not change. Rev. 3.00 Aug 23, 2006 Page 434 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver Table 20.6 Power-Down Modes and Display Operation Module Mode Clock Display operation Reset Active Sleep Watch Subactive Subsleep Standby Standby Runs Runs Runs Stops Stops Stops Stops Stops* 4 w Runs Runs Runs Runs* 4 ACT = 0 Stops Stops Stops Stops ACT = 1 Stops 5 Runs* 5 Runs* Stops 3 5 Functions Functions Functions* * 5 Stops 3 5 Functions* * 3 5 Functions* * Stops* 1 Stops* Stops* 2 Stops Stops* 2 Stops Notes: 1. The subclock oscillator does not stop, but clock supply is halted. 2. The LCD drive power supply is turned off regardless of the setting of the PSW bit. 3. Display operation is performed only if W, W/2, or W/4 is selected as the operating clock. 4. The clock supplied to the LCD stops. 5. When the 32KSTOP bit in SUB32CR is set to 1, the subclock W halts and display operation halts. 20.4.5 Boosting LCD Drive Power Supply and Fine Adjustment When a large panel is driven, the on-chip power supply capacity may be insufficient. In this case, the power supply impedance must be reduced. This can be done by connecting bypass capacitors of around 0.1 to 0.3 F to pins V1 to V3, as shown in figure 20.10, or by adding a split resistor externally. The voltage on the V1 pin can further be adjusted by connecting a variable resistor (VR) between the VCC and V1 pins. Rev. 3.00 Aug 23, 2006 Page 435 of 616 REJ09B0182-0300 Section 20 LCD Controller/Driver VCC VR V1 R This LSI R = several k to several M V2 R C = 0.1 to 0.3 F V3 R VSS Figure 20.10 Connection of External Split Resistor 20.5 Usage Notes 20.5.1 Pin Processing when No LCD Controller/Driver Is Used (1) V1, V2, V3 Connect to GND. In this case, CHG in LCR2 should not be changed from its initial value of 0 (LCD power-supply split resistor disconnected). (2) C1, C2 Leave open. 20.5.2 Pin Processing when No 3 V Constant Voltage Circuit Is Used Leave pins C1 and C2 open. Rev. 3.00 Aug 23, 2006 Page 436 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 2 Section 21 I C Bus Interface 2 (IIC2) 2 2 The I C bus interface 2 conforms to and provides a subset of the Philips I C bus (inter-IC bus) 2 interface functions. The register configuration that controls the I C bus differs partly from the 2 Philips configuration, however. Figure 21.1 shows a block diagram of the I C bus interface 2. Figure 21.2 shows an example of I/O pin connections to external circuits. 21.1 Features * Selection of I C format or clocked synchronous serial format 2 * Continuous transmission/reception Since the shift register, transmit data register, and receive data register are independent from each other, the continuous transmission/reception can be performed. * Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) 2 I C bus format * Start and stop conditions generated automatically in master mode * Selection of acknowledge output levels when receiving * Automatic loading of acknowledge bit when transmitting * Bit synchronization/wait function In master mode, the state of SCL is monitored per bit, and the timing is synchronized automatically. If transmission/reception is not yet possible, set the SCL to low until preparations are completed. * Six interrupt sources Transmit data empty (including slave-address match), transmit end, receive data full (including slave-address match), arbitration lost, NACK detection, and stop condition detection * Direct bus drive Two pins, SCL and SDA pins, function as CMOS outputs in normal operation (when the port/serial function is selected) and NMOS outputs when the bus drive function is selected. Clocked synchronous format * Four interrupt sources Transmit-data-empty, transmit-end, receive-data-full, and overrun error IFIIC10A_000020020200 Rev. 3.00 Aug 23, 2006 Page 437 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Transfer clock generation circuit SCL Transmission/ reception control circuit Output control ICCR1 ICCR2 ICMR Internal data bus Noise canceler ICDRT SDA Output control SAR ICDRS Address comparator Noise canceler ICDRR Bus state decision circuit Arbitration decision circuit [Legend] ICCR1: ICCR2: ICMR: ICSR: ICIER: ICDRT: ICDRR: ICDRS: SAR: I2C bus control register 1 I2C bus control register 2 I2C bus mode register I2C bus status register I2C bus interrupt enable register I2C bus transmit data register I2C bus receive data register I2C bus shift register Slave address register ICSR ICIER Interrupt generator 2 Figure 21.1 Block Diagram of I C Bus Interface 2 Rev. 3.00 Aug 23, 2006 Page 438 of 616 REJ09B0182-0300 Interrupt request Section 21 I2C Bus Interface 2 (IIC2) Vcc SCL in Vcc SCL SCL SDA SDA SDA in (Master) SCL SDA SDA out SCL in SCL out SCL SDA SCL out SCL in SCL out SDA in SDA in SDA out SDA out (Slave 1) (Slave 2) Figure 21.2 External Circuit Connections of I/O Pins 21.2 Input/Output Pins 2 Table 21.1 summarizes the input/output pins used by the I C bus interface 2. Table 21.1 Pin Configuration Name Abbreviation I/O Function Serial clock pin SCL I/O IIC serial clock input/output Serial data pin SDA I/O IIC serial data input/output Rev. 3.00 Aug 23, 2006 Page 439 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.3 Register Descriptions 2 The I C bus interface 2 has the following registers. * I C bus control register 1 (ICCR1) 2 * I C bus control register 2 (ICCR2) 2 * I C bus mode register (ICMR) 2 * I C bus interrupt enable register (ICIER) 2 * I C bus status register (ICSR) 2 * Slave address register (SAR) * I C bus transmit data register (ICDRT) 2 * I C bus receive data register (ICDRR) 2 * I C bus shift register (ICDRS) 2 21.3.1 2 I C Bus Control Register 1 (ICCR1) 2 ICCR1 enables or disables the I C bus interface 2, controls transmission or reception, and selects master or slave mode, transmission or reception, and transfer clock frequency in master mode. Bit Bit Name Initial Value R/W Description 7 ICE 0 R/W I C Bus Interface 2 Enable 2 0: This module is halted. (SCL and SDA pins are set to the port/serial function.) 1: This bit is enabled for transfer operations. (SCL and SDA pins are bus drive state.) 6 RCVD 0 R/W Reception Disable This bit enables or disables the next operation when TRS is 0 and ICDRR is read. 0: Enables next reception 1: Disables next reception Rev. 3.00 Aug 23, 2006 Page 440 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W Description 5 MST 0 R/W Master/Slave Select 4 TRS 0 R/W Transmit/Receive Select 2 In master mode with the I C bus format, when arbitration is lost, MST and TRS are both reset by hardware, causing a transition to slave receive mode. Modification of the TRS bit should be made between transfer frames. After data receive has been started in slave receive mode, when the first seven bits of the receive data agree with the slave address that is set to SAR and the eighth bit is 1, TRS is automatically set to 1. If an overrun error occurs in master mode with the clock synchronous serial format, MST is cleared to 0 and slave receive mode is entered. Operating modes are described below according to MST and TRS combination. When clocked synchronous serial format is selected and MST is 1, clock is output. 00: Slave receive mode 01: Slave transmit mode 10: Master receive mode 11: Master transmit mode 3 CKS3 0 R/W Transfer Clock Select 3 to 0 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W In master mode, set these bits according to the necessary transfer rate (see table 21.2). In slave mode, these bits are used to secure the data setup time in transmission mode. When CKS3 = 0, the data setup time is 10 tcyc and when CKS3 = 1, the data setup time is 20 tcyc. Rev. 3.00 Aug 23, 2006 Page 441 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Table 21.2 Transfer Rate Bit 3 Bit 2 Bit 1 Bit 0 CKS3 CKS2 CKS1 CKS0 Clock = 2 MHz = 5 MHz = 10 MHz 0 0 0 0 /28 71.4 kHz 179 kHz 357 kHz 1 /40 50.0 kHz 125 kHz 250 kHz 1 1 0 1 1 0 0 1 1 0 1 0 /48 41.7 kHz 104 kHz 208 kHz 1 /64 31.3 kHz 78.1 kHz 156 kHz 0 /80 25.0 kHz 62.5 kHz 125 kHz 1 /100 20.0 kHz 50.0 kHz 100 kHz 0 /112 17.9 kHz 44.6 kHz 89.3 kHz 1 /128 15.6 kHz 39.1 kHz 78.1 kHz 0 /56 35.7 kHz 89.3 kHz 179 kHz 1 /80 25.0 kHz 62.5 kHz 125 kHz 0 /96 20.8 kHz 52.1 kHz 104 kHz 1 /128 15.6 kHz 39.1 kHz 78.1 kHz 0 /160 12.5 kHz 31.3 kHz 62.5 kHz 1 /200 10.0 kHz 25.0 kHz 50.0 kHz 0 /224 8.9 kHz 22.3 kHz 44.6 kHz 1 /256 7.8 kHz 19.5 kHz 39.1 kHz Rev. 3.00 Aug 23, 2006 Page 442 of 616 REJ09B0182-0300 Transfer Rate Section 21 I2C Bus Interface 2 (IIC2) 21.3.2 2 I C Bus Control Register 2 (ICCR2) ICCR1 issues start/stop conditions, manipulates the SDA pin, monitors the SCL pin, and controls 2 reset in the control part of the I C bus interface 2. Bit Bit Name Initial Value R/W Description 7 BBSY 0 R/W Bus Busy 2 This bit enables to confirm whether the I C bus is occupied or released and to issue start/stop conditions in master mode. With the clocked synchronous serial 2 format, this bit has no meaning. With the I C bus format, this bit is set to 1 when the SDA level changes from high to low under the condition of SCL = high, assuming that the start condition has been issued. This bit is cleared to 0 when the SDA level changes from low to high under the condition of SCL = high, assuming that the stop condition has been issued. Write 1 to BBSY and 0 to SCP to issue a start condition. Follow this procedure when also re-transmitting a start condition. Write 0 in BBSY and 0 in SCP to issue a stop condition. To issue start/stop conditions, use the MOV instruction. 6 SCP 1 R/W Start/Stop Issue Condition Disable The SCP bit controls the issue of start/stop conditions in master mode. To issue a start condition, write 1 in BBSY and 0 in SCP. A retransmit start condition is issued in the same way. To issue a stop condition, write 0 in BBSY and 0 in SCP. This bit is always read as 1. If 1 is written, the data is not stored. 5 SDAO 1 R/W SDA Output Value Control This bit is used with SDAOP when modifying output level of SDA. This bit should not be manipulated during transfer. 0: When reading, SDA pin outputs low. When writing, SDA pin is changed to output low. 1: When reading, SDA pin outputs high. When writing, SDA pin is changed to output Hi-Z (outputs high by external pull-up resistance). Rev. 3.00 Aug 23, 2006 Page 443 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W 4 SDAOP 1 R/W Description SDAO Write Protect This bit controls change of output level of the SDA pin by modifying the SDAO bit. To change the output level, clear SDAO and SDAOP to 0 or set SDAO to 1 and clear SDAOP to 0 by the MOV instruction. This bit is always read as 1. 3 SCLO 1 R This bit monitors SCL output level. When SCLO is 1, SCL pin outputs high. When SCLO is 0, SCL pin outputs low. 2 1 Reserved This bit is always read as 1, and cannot be modified. 1 IICRST 0 R/W IIC Control Part Reset 2 This bit resets the control part except for I C registers. If this bit is set to 1 when hang-up occurs because of 2 2 communication failure during I C operation, I C control part can be reset without setting ports and initializing registers. 0 1 Reserved This bit is always read as 1, and cannot be modified. Rev. 3.00 Aug 23, 2006 Page 444 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.3.3 2 I C Bus Mode Register (ICMR) ICMR selects whether the MSB or LSB is transferred first, performs master mode wait control, and selects the transfer bit count. Bit Bit Name Initial Value R/W Description 7 MLS 0 R/W MSB-First/LSB-First Select 0: MSB-first 1: LSB-first 2 Set this bit to 0 when the I C bus format is used. 6 WAIT 0 R/W Wait Insertion Bit 2 In master mode with the I C bus format, this bit selects whether to insert a wait after data transfer except the acknowledge bit. When WAIT is set to 1, after the fall of the clock for the final data bit, low period is extended for two transfer clocks. If WAIT is cleared to 0, data and acknowledge bits are transferred consecutively with no wait inserted. The setting of this bit is invalid in slave mode with the 2 I C bus format or with the clocked synchronous serial format. 5, 4 All 1 Reserved These bits are always read as 1, and cannot be modified. 3 BCWP 1 R/W BC Write Protect This bit controls the BC2 to BC0 modifications. When modifying BC2 to BC0, this bit should be cleared to 0 and use the MOV instruction. In clock synchronous serial mode, BC should not be modified. 0: When writing, values of BC2 to BC0 are set. 1: When reading, 1 is always read. When writing, settings of BC2 to BC0 are invalid. Rev. 3.00 Aug 23, 2006 Page 445 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W Description 2 BC2 0 R/W Bit Counter 2 to 0 1 BC1 0 R/W 0 BC0 0 R/W These bits specify the number of bits to be transferred next. When read, the remaining number of transfer bits 2 is indicated. With the I C bus format, the data is transferred with one addition acknowledge bit. Bit BC2 to BC0 settings should be made during an interval between transfer frames. If bits BC2 to BC0 are set to a value other than 000, the setting should be made while the SCL pin is low. The value returns to 000 at the end of a data transfer, including the acknowledge bit. With the clock synchronous serial format, these bits should not be modified. 2 Rev. 3.00 Aug 23, 2006 Page 446 of 616 REJ09B0182-0300 I C Bus Format Clock Synchronous Serial Format 000: 9 bits 000: 8 bits 001: 2 bits 001: 1 bits 010: 3 bits 010: 2 bits 011: 4 bits 011: 3 bits 100: 5 bits 100: 4 bits 101: 6 bits 101: 5 bits 110: 7 bits 110: 6 bits 111: 8 bits 111: 7 bits Section 21 I2C Bus Interface 2 (IIC2) 21.3.4 2 I C Bus Interrupt Enable Register (ICIER) ICIER enables or disables interrupt sources and acknowledge bits, sets acknowledge bits to be transferred, and confirms acknowledge bits to be received. Bit Bit Name Initial Value R/W Description 7 TIE 0 R/W Transmit Interrupt Enable When the TDRE bit in ICSR is set to 1, this bit enables or disables the transmit data empty interrupt (TXI). 0: Transmit data empty interrupt request (TXI) is disabled. 1: Transmit data empty interrupt request (TXI) is enabled. 6 TEIE 0 R/W Transmit End Interrupt Enable This bit enables or disables the transmit end interrupt (TEI) at the rising of the ninth clock while the TDRE bit in ICSR is 1. TEI can be canceled by clearing the TEND bit or the TEIE bit to 0. 0: Transmit end interrupt request (TEI) is disabled. 1: Transmit end interrupt request (TEI) is enabled. 5 RIE 0 R/W Receive Interrupt Enable This bit enables or disables the receive data full interrupt request (RXI) and the overrun error interrupt request (ERI) with the clocked synchronous format, when a receive data is transferred from ICDRS to ICDRR and the RDRF bit in ICSR is set to 1. RXI can be canceled by clearing the RDRF or RIE bit to 0. 0: Receive data full interrupt request (RXI) and overrun error interrupt request (ERI) with the clocked synchronous format are disabled. 1: Receive data full interrupt request (RXI) and overrun error interrupt request (ERI) with the clocked synchronous format are enabled. Rev. 3.00 Aug 23, 2006 Page 447 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W Description 4 NAKIE 0 R/W NACK Receive Interrupt Enable This bit enables or disables the NACK receive interrupt request (NAKI) and the overrun error (setting of the OVE bit in ICSR) interrupt request (ERI) with the clocked synchronous format, when the NACKF and AL bits in ICSR are set to 1. NAKI can be canceled by clearing the NACKF, OVE, or NAKIE bit to 0. 0: NACK receive interrupt request (NAKI) is disabled. 1: NACK receive interrupt request (NAKI) is enabled. 3 STIE 0 R/W Stop Condition Detection Interrupt Enable 0: Stop condition detection interrupt request (STPI) is disabled. 1: Stop condition detection interrupt request (STPI) is enabled. 2 ACKE 0 R/W Acknowledge Bit Judgement Select 0: The value of the receive acknowledge bit is ignored, and continuous transfer is performed. 1: If the receive acknowledge bit is 1, continuous transfer is halted. 1 ACKBR 0 R Receive Acknowledge In transmit mode, this bit stores the acknowledge data that are returned by the receive device. This bit cannot be modified. 0: Receive acknowledge = 0 1: Receive acknowledge = 1 0 ACKBT 0 R/W Transmit Acknowledge In receive mode, this bit specifies the bit to be sent at the acknowledge timing. 0: 0 is sent at the acknowledge timing. 1: 1 is sent at the acknowledge timing. Rev. 3.00 Aug 23, 2006 Page 448 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.3.5 2 I C Bus Status Register (ICSR) ICSR performs confirmation of interrupt request flags and status. Bit Bit Name Initial Value R/W 7 TDRE 0 R/W Description Transmit Data Register Empty [Setting condition] * When data is transferred from ICDRT to ICDRS and ICDRT becomes empty * When TRS is set * When a start condition (including re-transfer) has been issued * When transmit mode is entered from receive mode in slave mode [Clearing conditions] 6 TEND 0 R/W * When 0 is written in TDRE after reading TDRE = 1 * When data is written to ICDRT with an instruction Transmit End [Setting conditions] * When the ninth clock of SCL rises with the I C bus format while the TDRE flag is 1 * When the final bit of transmit frame is sent with the clock synchronous serial format 2 [Clearing conditions] 5 RDRF 0 R/W * When 0 is written in TEND after reading TEND = 1 * When data is written to ICDRT with an instruction Receive Data Register Full [Setting condition] * When a receive data is transferred from ICDRS to ICDRR [Clearing conditions] * When 0 is written in RDRF after reading RDRF = 1 * When ICDRR is read with an instruction Rev. 3.00 Aug 23, 2006 Page 449 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W Description 4 NACKF 0 R/W No Acknowledge Detection Flag [Setting condition] * When no acknowledge is detected from the receive device in transmission while the ACKE bit in ICIER is 1 [Clearing condition] * 3 STOP 0 R/W When 0 is written in NACKF after reading NACKF = 1 Stop Condition Detection Flag [Setting conditions] * When a stop condition is detected after completion of a frame transfer in master mode * When a stop condition is detected after the first byte slave address and SAR match following a general call and detection of a start condition in slave mode [Clearing condition] * 2 AL/OVE 0 R/W When 0 is written in STOP after reading STOP = 1 Arbitration Lost Flag/Overrun Error Flag This flag indicates that arbitration was lost in master mode 2 with the I C bus format and that the final bit has been received while RDRF = 1 with the clocked synchronous format. When two or more master devices attempt to seize the bus 2 at nearly the same time, if the I C bus interface detects data differing from the data it sent, it sets AL to 1 to indicate that the bus has been taken by another master. [Setting conditions] * If the internal SDA and SDA pin disagree at the rise of SCL in master transmit mode * When the SDA pin outputs high in master mode while a start condition is detected * When the final bit is received with the clocked synchronous format while RDRF = 1 [Clearing condition] * Rev. 3.00 Aug 23, 2006 Page 450 of 616 REJ09B0182-0300 When 0 is written in AL/OVE after reading AL/OVE=1 Section 21 I2C Bus Interface 2 (IIC2) Bit Bit Name Initial Value R/W Description 1 AAS 0 R/W Slave Address Recognition Flag In slave receive mode, this flag is set to 1 if the first frame following a start condition matches bits SVA6 to SVA0 in SAR. [Setting conditions] * When the slave address is detected in slave receive mode * When the general call address is detected in slave receive mode. [Clearing condition] * 0 ADZ 0 R/W When 0 is written in AAS after reading AAS=1 General Call Address Recognition Flag 2 This bit is valid in I C bus format slave receive mode. [Setting condition] * When the general call address is detected in slave receive mode [Clearing conditions] * 21.3.6 When 0 is written in ADZ after reading ADZ=1 Slave Address Register (SAR) SAR selects the communication format and sets the slave address. When the chip is in slave mode 2 with the I C bus format, if the upper 7 bits of SAR match the upper 7 bits of the first frame received after a start condition, the chip operates as the slave device. Initial Value R/W Description SVA6 to SVA0 All 0 R/W Slave Address 6 to 0 FS 0 Bit Bit Name 7 to 1 0 These bits set a unique address in bits SVA6 to SVA0, differing form the addresses of other slave devices 2 connected to the I C bus. R/W Format Select 2 0: I C bus format is selected. 1: Clocked synchronous serial format is selected. Rev. 3.00 Aug 23, 2006 Page 451 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.3.7 2 I C Bus Transmit Data Register (ICDRT) ICDRT is an 8-bit readable/writable register that stores the transmit data. When ICDRT detects the space in the shift register (ICDRS), it transfers the transmit data which is written in ICDRT to ICDRS and starts transferring data. If the next transfer data is written to ICDRT during transferring data of ICDRS, continuous transfer is possible. If the MLS bit of ICMR is set to 1 and when the data is written to ICDRT, the MSB/LSB inverted data is read. The initial value of ICDRT is H'FF. The initial value of ICDRT is H'FF. 21.3.8 2 I C Bus Receive Data Register (ICDRR) ICDRR is an 8-bit register that stores the receive data. When data of one byte is received, ICDRR transfers the receive data from ICDRS to ICDRR and the next data can be received. ICDRR is a receive-only register, therefore the CPU cannot write to this register. The initial value of ICDRR is H'FF. 21.3.9 2 I C Bus Shift Register (ICDRS) ICDRS is a register that is used to transfer/receive data. In transmission, data is transferred from ICDRT to ICDRS and the data is sent from the SDA pin. In reception, data is transferred from ICDRS to ICDRR after data of one byte is received. This register cannot be read directly from the CPU. Rev. 3.00 Aug 23, 2006 Page 452 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.4 Operation 2 2 The I C bus interface can communicate either in I C bus mode or clocked synchronous serial mode by setting FS in SAR. 21.4.1 2 I C Bus Format 2 2 Figure 21.3 shows the I C bus formats. Figure 21.4 shows the I C bus timing. The first frame following a start condition always consists of 8 bits. (a) I2C bus format (FS = 0) S SLA R/W A DATA A A/A P 1 7 1 1 n 1 1 1 n: Transfer bit count (n = 1 to 8) m: Transfer frame count (m 1) m 1 (b) I2C bus format (Start condition retransmission, FS = 0) S SLA R/W A DATA A/A S SLA R/W A DATA A/A P 1 7 1 1 n1 1 1 7 1 1 n2 1 1 1 m1 1 m2 n1 and n2: Transfer bit count (n1 and n2 = 1 to 8) m1 and m2: Transfer frame count (m1 and m2 1) 2 Figure 21.3 I C Bus Formats SDA SCL S 1 to 7 8 9 SLA R/W A 1 to 7 8 DATA 9 1 to 7 A DATA 8 9 A P 2 Figure 21.4 I C Bus Timing Rev. 3.00 Aug 23, 2006 Page 453 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) [Legend] S: Start condition. The master device drives SDA from high to low while SCL is high. SLA: Slave address R/W: Indicates the direction of data transfer: from the slave device to the master device when R/W is 1, or from the master device to the slave device when R/W is 0. A: Acknowledge. The receive device drives SDA to low. DATA:Transfer data P: 21.4.2 Stop condition. The master device drives SDA from low to high while SCL is high. Master Transmit Operation In master transmit mode, the master device outputs the transmit clock and transmit data, and the slave device returns an acknowledge signal. For master transmit mode operation timing, refer to figures 21.5 and 21.6. The transmission procedure and operations in master transmit mode are described below. 1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0 bits in ICCR1 to 1. (Initial setting) 2. Read the BBSY flag in ICCR2 to confirm that the bus is free. Set the MST and TRS bits in ICCR1 to select master transmit mode. Then, write 1 to BBSY and 0 to SCP using MOV instruction. (Start condition issued) This generates the start condition. 3. After confirming that TDRE in ICSR has been set, write the transmit data (the first byte data show the slave address and R/W) to ICDRT. At this time, TDRE is automatically cleared to 0, and data is transferred from ICDRT to ICDRS. TDRE is set again. 4. When transmission of one byte data is completed while TDRE is 1, TEND in ICSR is set to 1 at the rise of the 9th transmit clock pulse. Read the ACKBR bit in ICIER, and confirm that the slave device has been selected. Then, write second byte data to ICDRT. When ACKBR is 1, the slave device has not been acknowledged, so issue the stop condition. To issue the stop condition, write 0 to BBSY and SCP using MOV instruction. SCL is fixed low until the transmit data is prepared or the stop condition is issued. 5. The transmit data after the second byte is written to ICDRT every time TDRE is set. 6. Write the number of bytes to be transmitted to ICDRT. Wait until TEND is set (the end of last byte data transmission) while TDRE is 1, or wait for NACK (NACKF in ICSR = 1) from the receive device while ACKE in ICIER is 1. Then, issue the stop condition to clear TEND or NACKF. 7. When the STOP bit in ICSR is set to 1, the operation returns to the slave receive mode. Rev. 3.00 Aug 23, 2006 Page 454 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) SCL (Master output) 1 2 3 4 5 6 SDA (Master output) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 7 8 Bit 1 Slave address 9 1 Bit 0 2 Bit 7 Bit 6 R/W SDA (Slave output) A TDRE TEND Address + R/W ICDRT ICDRS Data 1 Address + R/W User processing [2] Instruction of start condition issuance Data 2 Data 1 [4] Write data to ICDRT (second byte) [5] Write data to ICDRT (third byte) [3] Write data to ICDRT (first byte) Figure 21.5 Master Transmit Mode Operation Timing (1) SCL (Master output) 9 SDA (Master output) SDA (Slave output) 1 2 3 4 5 6 7 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 8 9 Bit 0 A/A A TDRE TEND Data n ICDRT ICDRS Data n User [5] Write data to ICDRT processing [6] Issue stop condition. Clear TEND. [7] Set slave receive mode Figure 21.6 Master Transmit Mode Operation Timing (2) Rev. 3.00 Aug 23, 2006 Page 455 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.4.3 Master Receive Operation In master receive mode, the master device outputs the receive clock, receives data from the slave device, and returns an acknowledge signal. For master receive mode operation timing, refer to figures 21.7 and 21.8. The reception procedure and operations in master receive mode are shown below. 1. Clear the TEND bit in ICSR to 0, then clear the TRS bit in ICCR1 to 0 to switch from master transmit mode to master receive mode. Then, clear the TDRE bit to 0 and set the ACKBT bit in ICIER. 2. When ICDRR is read (dummy data read), reception is started, and the receive clock is output, and data received, in synchronization with the internal clock. The master device outputs the level specified by ACKBT in ICIER to SDA, at the 9th receive clock pulse. 3. After the reception of first frame data is completed, the RDRF bit in ICST is set to 1 at the rise of 9th receive clock pulse. At this time, the receive data is read by reading ICDRR, and RDRF is cleared to 0. 4. The continuous reception is performed by reading ICDRR every time RDRF is set. If 8th receive clock pulse falls after reading ICDRR by the other processing while RDRF is 1, SCL is fixed low until ICDRR is read. 5. If next frame is the last receive data, set the RCVD bit in ICCR1 and set the ACKBT bit in ICIER. to 1 before reading ICDRR. This enables the issuance of the stop condition after the next reception. 6. When the RDRF bit is set to 1 at rise of the 9th receive clock pulse, and clearing the STOP bit in ICSR issue the stage condition. 7. When the STOP bit in ICSR is set to 1, read ICDRR. Then clear the RCVD bit to 0. 8. Clear the MST bit in ICCR1 and then, the operation returns to the slave receive mode. Rev. 3.00 Aug 23, 2006 Page 456 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Master transmit mode SCL (Master output) Master receive mode 9 1 2 3 4 5 6 7 8 SDA (Master output) SDA (Slave output) 9 1 A A Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 TDRE TEND TRS RDRF ICDRS Data 1 ICDRR User processing Data 1 [3] Read ICDRR [1] Clear TDRE after clearing [2] Read ICDRR (dummy read) TEND and TRS Figure 21.7 Master Receive Mode Operation Timing (1) Rev. 3.00 Aug 23, 2006 Page 457 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) SCL (Master output) 9 SDA (Master output) A SDA (Slave output) 1 2 3 4 5 6 7 8 9 A/A Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 RDRF RCVD ICDRS Data n Data n-1 ICDRR User processing Data n Data n-1 [5] Read ICDRR after setting RCVD [7] Read ICDRR, and clear RCVD [6] Issue stop condition [8] Set slave receive mode Figure 21.8 Master Receive Mode Operation Timing (2) Rev. 3.00 Aug 23, 2006 Page 458 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.4.4 Slave Transmit Operation In slave transmit mode, the slave device outputs the transmit data, while the master device outputs the receive clock and returns an acknowledge signal. For slave transmit mode operation timing, refer to figures 21.9 and 21.10. The transmission procedure and operations in slave transmit mode are described below. 1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0 bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive mode, and wait until the slave address matches. 2. When the slave address matches in the first frame following detection of the start condition, the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th clock pulse. At this time, if the 8th bit data (R/W) is 1, the TRS and ICSR bits in ICCR1 are set to 1, and the mode changes to slave transmit mode automatically. The continuous transmission is performed by writing transmit data to ICDRT every time TDRE is set. 3. If TDRE is set after writing last transmit data to ICDRT, wait until TEND in ICSR is set to 1, with TDRE = 1. When TEND is set, clear TEND. 4. Clear TRS for the end processing, and read ICDRR (dummy read). SCL is free. 5. Clear TDRE. Rev. 3.00 Aug 23, 2006 Page 459 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Slave receive mode SCL (Master output) Slave transmit mode 9 1 2 3 4 5 6 7 8 SDA (Master output) 9 1 A SCL (Slave output) SDA (Slave output) A Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 TDRE TEND TRS Data 1 ICDRT ICDRS Data 2 Data 1 Data 3 Data 2 ICDRR User processing [2] Write data to ICDRT (data 1) [2] Write data to ICDRT (data 2) [2] Write data to ICDRT (data 3) Figure 21.9 Slave Transmit Mode Operation Timing (1) Rev. 3.00 Aug 23, 2006 Page 460 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Slave receive mode Slave transmit mode SCL (Master output) 9 SDA (Master output) A 1 2 3 4 5 6 7 8 9 A SCL (Slave output) SDA (Slave output) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 TDRE TEND TRS ICDRT ICDRS Data n ICDRR User processing [3] Clear TEND [4] Read ICDRR (dummy read) [5] Clear TDRE after clearing TRS Figure 21.10 Slave Transmit Mode Operation Timing (2) 21.4.5 Slave Receive Operation In slave receive mode, the master device outputs the transmit clock and transmit data, and the slave device returns an acknowledge signal. For slave receive mode operation timing, refer to figures 21.11 and 21.12. The reception procedure and operations in slave receive mode are described below. 1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0 bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive mode, and wait until the slave address matches. 2. When the slave address matches in the first frame following detection of the start condition, the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th clock pulse. At the same time, RDRF in ICSR is set to read ICDRR (dummy read). (Since the read data show the slave address and R/W, it is not used.) Rev. 3.00 Aug 23, 2006 Page 461 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 3. Read ICDRR every time RDRF is set. If 8th receive clock pulse falls while RDRF is 1, SCL is fixed low until ICDRR is read. The change of the acknowledge before reading ICDRR, to be returned to the master device, is reflected to the next transmit frame. 4. The last byte data is read by reading ICDRR. SCL (Master output) 9 SDA (Master output) 1 2 3 4 5 6 7 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 9 1 Bit 7 SCL (Slave output) SDA (Slave output) A A RDRF ICDRS Data 1 Data 2 ICDRR User processing Data 1 [2] Read ICDRR [2] Read ICDRR (dummy read) Figure 21.11 Slave Receive Mode Operation Timing (1) SCL (Master output) 9 SDA (Master output) 1 2 3 4 5 6 7 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 9 SCL (Slave output) SDA (Slave output) A A RDRF ICDRS Data 2 Data 1 ICDRR Data 1 User processing [3] Set ACKBT [3] Read ICDRR [4] Read ICDRR Figure 21.12 Slave Receive Mode Operation Timing (2) Rev. 3.00 Aug 23, 2006 Page 462 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.4.6 Clocked Synchronous Serial Format This module can be operated with the clocked synchronous serial format, by setting the FS bit in SAR to 1. When the MST bit in ICCR1 is 1, the transfer clock output from SCL is selected. When MST is 0, the external clock input is selected. (1) Data Transfer Format Figure 21.13 shows the clocked synchronous serial transfer format. The transfer data is output from the rise to the fall of the SCL clock, and the data at the rising edge of the SCL clock is guaranteed. The MLS bit in ICMR sets the order of data transfer, in either the MSB first or LSB first. The output level of SDA can be changed during the transfer wait, by the SDAO bit in ICCR2. SCL SDA Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Figure 21.13 Clocked Synchronous Serial Transfer Format Rev. 3.00 Aug 23, 2006 Page 463 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) (2) Transmit Operation In transmit mode, transmit data is output from SDA, in synchronization with the fall of the transfer clock. The transfer clock is output when MST in ICCR1 is 1, and is input when MST is 0. For transmit mode operation timing, refer to figure 21.14. The transmission procedure and operations in transmit mode are described below. 1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial setting) 2. Set the TRS bit in ICCR1 to select the transmit mode. Then, TDRE in ICSR is set. 3. Confirm that TDRE has been set. Then, write the transmit data to ICDRT. The data is transferred from ICDRT to ICDRS, and TDRE is set automatically. The continuous transmission is performed by writing data to ICDRT every time TDRE is set. When changing from transmit mode to receive mode, clear TRS while TDRE is 1. SCL 1 2 7 8 1 7 8 1 SDA (Output) Bit 0 Bit 1 Bit 6 Bit 7 Bit 0 Bit 6 Bit 7 Bit 0 TRS TDRE Data 1 ICDRT Data 1 ICDRS User processing Data 2 [3] Write data [3] Write data to ICDRT to ICDRT [2] Set TRS Data 3 Data 2 Data 3 [3] Write data to ICDRT Figure 21.14 Transmit Mode Operation Timing Rev. 3.00 Aug 23, 2006 Page 464 of 616 REJ09B0182-0300 [3] Write data to ICDRT Section 21 I2C Bus Interface 2 (IIC2) (3) Receive Operation In receive mode, data is latched at the rise of the transfer clock. The transfer clock is output when MST in ICCR1 is 1, and is input when MST is 0. For receive mode operation timing, refer to figure 21.15. The reception procedure and operations in receive mode are described below. 1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial setting) 2. When the transfer clock is output, set MST to 1 to start outputting the receive clock. 3. When the receive operation is completed, data is transferred from ICDRS to ICDRR and RDRF in ICSR is set. When MST = 1, the next byte can be received, so the clock is continually output. The continuous reception is performed by reading ICDRR every time RDRF is set. When the 8th clock is risen while RDRF is 1, the overrun is detected and AL/OVE in ICSR is set. At this time, the previous reception data is retained in ICDRR. 4. To stop receiving when MST = 1, set RCVD in ICCR1 to 1, then read ICDRR. Then, SCL is fixed high after receiving the next byte data. SCL 1 2 7 8 1 7 8 SDA (Input) Bit 0 Bit 1 Bit 6 Bit 7 Bit 0 Bit 6 Bit 7 1 2 Bit 0 MST TRS RDRF ICDRS Data 1 Data 3 Data 1 ICDRR User processing Data 2 [2] Set MST (when outputting the clock) [3] Read ICDRR Data 2 [3] Read ICDRR Figure 21.15 Receive Mode Operation Timing Rev. 3.00 Aug 23, 2006 Page 465 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.4.7 Noise Canceler The logic levels at the SCL and SDA pins are routed through noise cancelers before being latched internally. Figure 21.16 shows a block diagram of the noise canceler circuit. The noise canceler consists of two cascaded latches and a match detector. The SCL (or SDA) input signal is sampled on the system clock, but is not passed forward to the next circuit unless the outputs of both latches agree. If they do not agree, the previous value is held. Sampling clock C SCL or SDA input signal D C Q Q D Latch Latch Match detector Internal SCL or SDA signal System clock period Sampling clock Figure 21.16 Block Diagram of Noise Conceler 21.4.8 Example of Use 2 Flowcharts in respective modes that use the I C bus interface are shown in figures 21.17 to 21.20. Rev. 3.00 Aug 23, 2006 Page 466 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Start Initialize [1] Test the status of the SCL and SDA lines. [2] Set master transmit mode. [3] Issue the start candition. [2] [4] Set the first byte (slave address + R/W) of transmit data. Write 1 to BBSY and 0 to SCP. [3] [5] Wait for 1 byte to be transmitted. Write transmit data in ICDRT [4] [6] Test the acknowledge transferred from the specified slave device. [7] Set the second and subsequent bytes (except for the final byte) of transmit data. [8] Wait for ICDRT empty. [9] Set the last byte of transmit data. Read BBSY in ICCR2 [1] No BBSY=0 ? Yes Set MST and TRS in ICCR1 to 1. Read TEND in ICSR [5] No TEND=1 ? Yes Read ACKBR in ICIER [6] ACKBR=0 ? [10] Wait for last byte to be transmitted. No [11] Clear the TEND flag. Yes Transmit mode? Yes No Write transmit data in ICDRT Mater receive mode [7] [13] Issue the stop condition. Read TDRE in ICSR No [8] TDRE=1 ? Yes No [12] Clear the STOP flag. [14] Wait for the creation of stop condition. [15] Set slave receive mode. Clear TDRE. Last byte? [9] Yes Write transmit data in ICDRT Read TEND in ICSR No [10] TEND=1 ? Yes Clear TEND in ICSR [11] Clear STOP in ICSR [12] Write 0 to BBSY and SCP [13] Read STOP in ICSR No [14] STOP=1 ? Yes Set MST to 1 and TRS to 0 in ICCR1 [15] Clear TDRE in ICSR End Figure 21.17 Sample Flowchart for Master Transmit Mode Rev. 3.00 Aug 23, 2006 Page 467 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Mater receive mode [1] Clear TEND, select master receive mode, and then clear TDRE.* [2] Set acknowledge to the transmit device.* [3] Dummy-read ICDDR.* [4] Wait for 1 byte to be received [5] Check whether it is the (last receive - 1). [6] Read the receive data. [7] Set acknowledge of the final byte. Disable continuous reception (RCVD = 1). [8] Read the (final byte - 1) of receive data. [9] Wait for the last byte to be receive. Clear TEND in ICSR Clear TRS in ICCR1 to 0 [1] Clear TDRE in ICSR Clear ACKBT in ICIER to 0 [2] Dummy-read ICDRR [3] Read RDRF in ICSR No [4] RDRF=1 ? Yes Last receive - 1? No Read ICDRR Yes [5] [10] Clear the STOP flag. [6] [11] Issue the stop condition. [12] Wait for the creation of stop condition. Set ACKBT in ICIER to 1 [7] Set RCVD in ICCR1 to 1 Read ICDRR [13] Read the last byte of receive data. [14] Clear RCVD. [8] [15] Set slave receive mode. Read RDRF in ICSR No RDRF=1 ? [9] Yes Clear STOP in ICSR. Write 0 to BBSY and SCP [10] [11] Read STOP in ICSR No [12] STOP=1 ? Yes Read ICDRR [13] Clear RCVD in ICCR1 to 0 [14] Clear MST in ICCR1 to 0 [15] Note: When 1 byte is received, skip steps [2] to [6] after [1] and then jump to step [7]. In step [8], dummy-read ICDRR. * Do not activate an interrupt during the execution of steps [1] to [3]. End Figure 21.18 Sample Flowchart for Master Receive Mode Rev. 3.00 Aug 23, 2006 Page 468 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) [1] Clear the AAS flag. Slave transmit mode Clear AAS in ICSR [1] Write transmit data in ICDRT [2] [3] Wait for ICDRT empty. [4] Set the last byte of transmit data. Read TDRE in ICSR No [5] Wait for the last byte to be transmitted. [3] TDRE=1 ? Yes No [6] Clear the TEND flag . [7] Set slave receive mode. Last byte? Yes [2] Set transmit data for ICDRT (except for the last data). [8] Dummy-read ICDRR to release the SCL line. [4] [9] Clear the TDRE flag. Write transmit data in ICDRT Read TEND in ICSR No [5] TEND=1 ? Yes Clear TEND in ICSR [6] Clear TRS in ICCR1 to 0 [7] Dummy read ICDRR [8] Clear TDRE in ICSR [9] End Figure 21.19 Sample Flowchart for Slave Transmit Mode Rev. 3.00 Aug 23, 2006 Page 469 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Slave receive mode [1] Clear the AAS flag. Clear AAS in ICSR [1] Clear ACKBT in ICIER to 0 [2] Dummy-read ICDRR [3] [2] Set acknowledge to the transmit device. [3] Dummy-read ICDRR. [5] Check whether it is the (last receive - 1). Read RDRF in ICSR No [4] RDRF=1 ? [6] Read the receive data. [7] Set acknowledge of the last byte. Yes Last receive - 1? [4] Wait for 1 byte to be received. Yes No Read ICDRR [5] [8] Read the (last byte - 1) of receive data. [9] Wait the last byte to be received. [6] [10] Read for the last byte of receive data. Set ACKBT in ICIER to 1 [7] Read ICDRR [8] Read RDRF in ICSR No [9] RDRF=1 ? Yes Read ICDRR [10] Note: When 1 byte is received, skip steps [2] to [6] after [1] and then jump to step [7]. In step [8], dummy-read ICDRR. End Figure 21.20 Sample Flowchart for Slave Receive Mode Rev. 3.00 Aug 23, 2006 Page 470 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.5 Interrupt Request There are six interrupt requests in this module; transmit data empty, transmit end, receive data full, NACK receive, STOP recognition, and arbitration lost/overrun. Table 21.3 shows the contents of each interrupt request. Table 21.3 Interrupt Requests Interrupt Request Abbreviation Interrupt Condition Clocked Synchronous 2 I C Mode Mode Transmit Data Empty TXI (TDRE=1) * (TIE=1) ! ! Transmit End TEI (TEND=1) * (TEIE=1) ! ! Receive Data Full RXI (RDRF=1) * (RIE=1) ! ! STOP Recognition STPI (STOP=1) (STIE=1) ! x NACK Receive NAKI {(NACKF=1)+(AL=1)} (NAKIE=1) Arbitration Lost/Overrun * * ! x ! ! When interrupt conditions described in table 21.3 are 1 and the I bit in CCR is 0, the CPU executes interrupt exception processing. Interrupt sources should be cleared in the exception processing. TDRE and TEND are automatically cleared to 0 by writing the transmit data to ICDRT. RDRF are automatically cleared to 0 by reading ICDRR. TDRE is set to 1 again at the same time when transmit data is written to ICDRT. When TDRE is cleared to 0, then an excessive data of one byte may be transmitted. Rev. 3.00 Aug 23, 2006 Page 471 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.6 Bit Synchronous Circuit In master mode,this module has a possibility that high level period may be short in the two states described below. * When SCL is driven to low by the slave device * When the rising speed of SCL is lowered by the load of the SCL line (load capacitance or pullup resistance) Therefore, it monitors SCL and communicates by bit with synchronization. Figure 21.21 shows the timing of the bit synchronous circuit and table 21.4 shows the time when SCL output changes from low to Hi-Z then SCL is monitored. SCL monitor timing reference clock VIH SCL Internal SCL Figure 21.21 Timing of Bit Synchronous Circuit Table 21.4 Time for Monitoring SCL CKS3 CKS2 Time for Monitoring SCL 0 0 7.5 tcyc 1 19.5 tcyc 0 17.5 tcyc 1 41.5 tcyc 1 Rev. 3.00 Aug 23, 2006 Page 472 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) 21.7 Usage Notes 1. Confirm the ninth falling edge of the clock before issuing a stop or a repeated start condition. The ninth falling edge can be confirmed by monitoring the SCLO bit in the I2C bus control register B (ICCRB). If a stop or a repeated start condition is issued at certain timing in either of the following cases, the stop or repeated start condition may be issued incorrectly. The rising time of the SCL signal exceeds the time given in section 21.6, Bit Synchronous Circuit, because of the load on the SCL bus (load capacitance or pull-up resistance). The bit synchronous circuit is activated because a slave device holds the SCL bus low during the eighth clock. 2. The WAIT bit in the I2C bus mode register (ICMR) must be held 0. If the WAIT bit is set to 1, when a slave device holds the SCL signal low more than one transfer clock cycle during the eighth clock, the high level period of the ninth clock may be shorter than a given period. Rev. 3.00 Aug 23, 2006 Page 473 of 616 REJ09B0182-0300 Section 21 I2C Bus Interface 2 (IIC2) Rev. 3.00 Aug 23, 2006 Page 474 of 616 REJ09B0182-0300 Section 22 Power-On Reset Circuit Section 22 Power-On Reset Circuit This LSI has an on-chip power-on reset circuit. A block diagram of the power-on reset circuit is shown in figure 22.1. 22.1 Feature * Power-on reset circuit An internal reset signal is generated at turning the power on by externally connecting a capacitor. Vcc Rp (Recommended) RES CRES System clock 3-bit counter Internal reset signal Voltage detector Figure 22.1 Power-On Reset Circuit PSCKT11A_000120040500 Rev. 3.00 Aug 23, 2006 Page 475 of 616 REJ09B0182-0300 Section 22 Power-On Reset Circuit 22.2 22.2.1 Operation Power-On Reset Circuit The operation timing of the power-on reset circuit is shown in figure 22.2. As the power supply voltage rises, the capacitor, which is externally connected to the RES pin, is gradually charged through the on-chip pull-up resistor (100 k). The low level of the RES pin is sent to the chip and the whole chip is reset. When the level of the RES pin reaches to the predetermined level, a voltage detection circuit detects it. Then a 3-bit counter starts counting up. When the 3-bit counter counts for 8 times, an overflow signal is generated and an internal reset signal is cleared. If the RES pin rising time is t, the capacitance (CRES) connected to the RES pin can be computed using the formula below. For information about the on-chip resistor (Rp), see section 25, Electrical Characteristics. The power supply rising time should not exceed half the RES rising time (t). The RES rising time (t) should also equal or exceed the oscillation stabilization time (trc). CRES = t Rp (t > trc, t > t_vtr x 2) Note: Adjust the capacitor connected to the RES pin so that t_vtr x 2 exceeds the oscillation stabilization time. Note that the power supply voltage (Vcc) must fall below Vpor = 100 mV and rise after charge on the RES pin is removed. To remove charge on the RES pin, it is recommended that the diode should be placed near Vcc. If the power supply voltage (Vcc) rises from the point above Vpor, a power-on reset may not occur. Rev. 3.00 Aug 23, 2006 Page 476 of 616 REJ09B0182-0300 Section 22 Power-On Reset Circuit t_vtr Vcc t_vtr x 2 RES V_rst Internal reset signal t_cr t_out (eight states) Figure 22.2 Power-On Reset Circuit Operation Timing Rev. 3.00 Aug 23, 2006 Page 477 of 616 REJ09B0182-0300 Section 22 Power-On Reset Circuit Rev. 3.00 Aug 23, 2006 Page 478 of 616 REJ09B0182-0300 Section 23 Address Break Section 23 Address Break The address break simplifies on-board program debugging. It requests an address break interrupt when the set break condition is satisfied. The interrupt request is not affected by the I bit in CCR. Break conditions that can be set include instruction execution at a specific address and a combination of access and data at a specific address. With the address break function, the execution start point of a program containing a bug is detected and execution is branched to the correcting program. Use of module standby mode enables this module to be placed in standby mode independently when not used. (For details, refer to section 6.4, Module Standby Function.) Figure 23.1 shows a block diagram of the address break. Internal address bus Comparator BAR2L ABRKCR2 Interrupt generation control circuit ABRKSR2 BDR2H Internal data bus BAR2H BDR2L Comparator Interrupt [Legend] BAR2H, BAR2L: BDR2H, BDR2L: ABRKCR2: ABRKSR2: Break address register 2 Break data register 2 Address break control register 2 Address break status register 2 Figure 23.1 Block Diagram of Address Break ABK0002A_000020030700 Rev. 3.00 Aug 23, 2006 Page 479 of 616 REJ09B0182-0300 Section 23 Address Break 23.1 Register Descriptions The address break has the following registers. * Address break control register 2 (ABRKCR2) * Address break status register 2 (ABRKSR2) * Break address register 2 (BAR2H, BAR2L) * Break data register 2 (BDR2H, BDR2L) 23.1.1 Address Break Control Register 2 (ABRKCR2) ABRKCR2 sets address break conditions. Bit Bit Name Initial Value R/W Description 7 RTINTE2 1 R/W RTE Interrupt Enable When this bit is 0, the interrupt immediately after executing RTE is masked and then one instruction must be executed. When this bit is 1, the interrupt is not masked. 6 CSEL21 0 R/W Condition Select 1 and 0 5 CSEL20 0 R/W These bits set address break conditions. 00: Instruction execution cycle (no data comparison) 01: CPU data read cycle 10: CPU data write cycle 11: CPU data read/write cycle 4 ACMP22 0 R/W Address Compare Condition Select 2 to 0 3 ACMP21 0 R/W 2 ACMP20 0 R/W These bits set the comparison condition between the address set in BAR2 and the internal address bus. 000: Compares 16-bit addresses 001: Compares upper 12-bit addresses 010: Compares upper 8-bit addresses 011: Compares upper 4-bit addresses 1xx: Setting prohibited Rev. 3.00 Aug 23, 2006 Page 480 of 616 REJ09B0182-0300 Section 23 Address Break Bit Bit Name Initial Value R/W Description 1 DCMP21 0 R/W Data Compare Condition Select 1 and 0 0 DCMP20 0 R/W These bits set the comparison condition between the data set in BDR2 and the internal data bus. 00: No data comparison 01: Compares lower 8-bit data between BDR2L and data bus 10: Compares upper 8-bit data between BDR2H and data bus 11: Compares 16-bit data between BDR2 and data bus [Legend] x: Don't care. When an address break is set in the data read cycle or data write cycle, the data bus used will depend on the combination of the byte/word access and address. Table 23.1 shows the access and data bus used. When an I/O register space with an 8-bit data bus width is accessed in word size, a byte access is generated twice. For details on data widths of each register, see section 24.1, Register Addresses (Address Order). Table 23.1 Access and Data Bus Used Word Access Byte Access Even Address Odd Address Even Address Odd Address ROM space Upper 8 bits Lower 8 bits Upper 8 bits Upper 8 bits RAM space Upper 8 bits Lower 8 bits Upper 8 bits Upper 8 bits I/O register with 8-bit data bus width Upper 8 bits Upper 8 bits Upper 8 bits Upper 8 bits I/O register with 1 16-bit data bus width* Upper 8 bits Lower 8 bits -- -- I/O register with 2 16-bit data bus width* Upper 8 bits Lower 8 bits Upper 8 bits Upper 8 bits Notes: 1. Registers whose addresses do not range from H'FF96 and H'FF97, and H'FFB8 to H'FFBB with 16-bit data bus width. 2. Registers whose addresses range from H'FF96 and H'FF97, and H'FFB8 to H'FFBB. Rev. 3.00 Aug 23, 2006 Page 481 of 616 REJ09B0182-0300 Section 23 Address Break 23.1.2 Address Break Status Register 2 (ABRKSR2) ABRKSR2 consists of the address break interrupt flag and the address break interrupt enable bit. Bit Bit Name Initial Value R/W 7 ABIF2 0 R/W Description Address Break Interrupt Flag [Setting condition] When the condition set in ABRKCR2 is satisfied [Clearing condition] When 0 is written after ABIF=1 is read 6 ABIE2 0 R/W Address Break Interrupt Enable When this bit is 1, an address break interrupt request is enabled. 5 to 0 -- All 1 -- Reserved These bits are always read as 1. 23.1.3 Break Address Registers 2 (BAR2H, BAR2L) BAR2H and BAR2L are 16-bit read/write registers that set the address for generating an address break interrupt. When setting the address break condition to the instruction execution cycle, set the first byte address of the instruction. The initial value of this register is H'FFFF. 23.1.4 Break Data Registers 2 (BDR2H, BDR2L) BDR2H and BDR2L are 16-bit read/write registers that set the data for generating an address break interrupt. BDR2H is compared with the upper 8-bit data bus. BDR2L is compared with the lower 8-bit data bus. When memory or registers are accessed by byte, the upper 8-bit data bus is used for even and odd addresses in the data transmission. Therefore, comparison data must be set in BDR2H for byte access. For word access, the data bus used depends on the address. See section 23.1.1, Address Break Control Register 2 (ABRKCR2), for details. The initial value of this register is undefined. Rev. 3.00 Aug 23, 2006 Page 482 of 616 REJ09B0182-0300 Section 23 Address Break 23.2 Operation When the ABIF2 and ABIE2 bits in ABRKSR2 are set to 1, the address break function generates an interrupt request to the CPU. The ABIF2 bit in ABRKSR2 is set to 1 by the combination of the address set in BAR2, the data set in BDR2, and the conditions set in ABRKCR2. When the interrupt request is accepted, interrupt exception handling starts after the instruction being executed ends. The address break interrupt is not masked by the I bit in CCR of the CPU. Figures 23.2 show the operation examples of the address break interrupt setting. When the address break is specified in instruction execution cycle Register setting * ABRKCR2 = H'80 * BAR2 = H'025A Program 0258 * 025A 025C 0260 0262 : NOP NOP MOV.W @H'025A,R0 NOP NOP : Underline indicates the address to be stacked. NOP MOV MOV NOP instruc- instruc- instruc- instruction tion 1 tion 2 Internal tion prefetch prefetch prefetch prefetch processing Stack save Address bus 0258 025A 025C 025E SP-2 SP-4 Interrupt request Interrupt acceptance Figure 23.2 Address Break Interrupt Operation Example (1) Rev. 3.00 Aug 23, 2006 Page 483 of 616 REJ09B0182-0300 Section 23 Address Break When the address break is specified in the data read cycle Register setting * ABRKCR2 = H'A0 * BAR2 = H'025A Program 0258 025A * 025C 0260 0262 : NOP NOP MOV.W @H'025A,R0 NOP Underline indicates the address NOP to be stacked. : MOV NOP MOV NOP Next MOV instruc- instruc- instruc- instruc- instruc- instrution 2 tion tion tion ction Internal Stack tion 1 prefetch prefetch prefetch execution prefetch prefetch processing save Address bus 025C 025E 0260 025A 0262 0264 SP-2 Interrupt request Interrupt acceptance Figure 23.2 Address Break Interrupt Operation Example (2) 23.3 Operating States of Address Break The operating states of the address break are shown in table 23.2. Table 23.2 Operating States of Address Break Operating Mode Reset Active Sleep Watch Subactive Sub-sleep Standby Module Standby ABRKCR2 Reset Functions Retained Retained Functions Retained Retained Retained ABRKSR2 Reset Functions Retained Retained Functions Retained Retained Retained BAR2H Reset Functions Retained Retained Functions Retained Retained Retained BAR2L Reset Functions Retained Retained Functions Retained Retained Retained BDR2H Retained* Functions Retained Retained Functions Retained Retained Retained BDR2L Retained* Functions Retained Retained Functions Retained Retained Retained Note: * Undefined at a power-on reset Rev. 3.00 Aug 23, 2006 Page 484 of 616 REJ09B0182-0300 Section 24 List of Registers Section 24 List of Registers The register list gives information on the on-chip I/O register addresses, how the register bits are configured, and the register states in each operating mode. The information is given as shown below. 1. Register addresses (address order) * Registers are listed from the lower allocation addresses. * Registers are classified by functional modules. * The data bus width is indicated. * The number of access states is indicated. 2. Register bits * Bit configurations of the registers are described in the same order as the register addresses. * Reserved bits are indicated by in the bit name column. * When registers consist of 16 bits, bits are described from the MSB side. 3. Register states in each operating mode * Register states are described in the same order as the register addresses. * The register states described here are for the basic operating modes. If there is a specific reset for an on-chip peripheral module, refer to the section on that on-chip peripheral module. Rev. 3.00 Aug 23, 2006 Page 485 of 616 REJ09B0182-0300 Section 24 List of Registers 24.1 Register Addresses (Address Order) The data bus width indicates the number of bits by which the register is accessed. The number of access states indicates the number of states based on the specified reference clock. Register Name Abbreviation Module Bit No. Address Name Data Bus Access Width State Serial control register 4 SCR4 8 H'F00C SCI4 8 2 Serial control/status register 4 SCSR4 8 H'F00D SCI4 8 2 Transmit data register 4 TDR4 8 H'F00E SCI4 8 2 Receive data register 4 RDR4 8 H'F00F SCI4 8 2 Flash memory control register 1 FLMCR1 8 H'F020 ROM 8 2 Flash memory control register 2 FLMCR2 8 H'F021 ROM 8 2 Flash memory power control register FLPWCR 8 H'F022 ROM 8 2 Erase block register1 EBR1 8 H'F023 ROM 8 2 Flash memory enable register FENR 8 H'F02B ROM 8 2 Timer start register TSTR 8 H'F030 TPU 8 2 Timer synchro register TSYR 8 H'F031 TPU 8 2 Timer control register_1 TCR_1 8 H'F040 TPU_1 8 2 Timer mode register_1 TMDR_1 8 H'F041 TPU_1 8 2 Timer I/O control register_1 TIOR_1 8 H'F042 TPU_1 8 2 Timer interrupt enable register_1 TIER_1 8 H'F044 TPU_1 8 2 Timer status register_1 TSR_1 8 H'F045 TPU_1 8 2 Timer counter_1 TCNT_1 16 H'F046 TPU_1 16 2 Timer general register A_1 TGRA_1 16 H'F048 TPU_1 16 2 Timer general register B_1 TGRB_1 16 H'F04A TPU_1 16 2 Timer control register_2 TCR_2 8 H'F050 TPU_2 8 2 Timer mode register_2 TMDR_2 8 H'F051 TPU_2 8 2 Timer I/O control register_2 TIOR_2 8 H'F052 TPU_2 8 2 Timer interrupt enable register_2 TIER_2 8 H'F054 TPU_2 8 2 Timer status register_2 TSR_2 8 H'F055 TPU_2 8 2 Timer counter_2 TCNT_2 16 H'F056 TPU_2 16 2 Rev. 3.00 Aug 23, 2006 Page 486 of 616 REJ09B0182-0300 Section 24 List of Registers Register Name Abbreviation Module Bit No. Address Name Data Bus Access Width State Timer general register A_2 TGRA_2 16 H'F058 TPU_2 16 2 Timer general register B_2 TGRB_2 16 H'F05A TPU_2 16 2 A/D control register ADCR 8 H'F060 A/D converter 8 2 A/D start/status register ADSSR 8 H'F061 A/D converter 8 2 A/D data register ADDR 16 H'F062 A/D converter 16 2 RTC interrupt flag register RTCFLG 8 H'F067 RTC 8 2 Second data register/free running RSECDR counter data register 8 H'F068 RTC 8 2 Minute data register RMINDR 8 H'F069 RTC 8 2 Hour data register RHRDR 8 H'F06A RTC 8 2 Day-of-week data register RWKDR 8 H'F06B RTC 8 2 RTC control register 1 RTCCR1 8 H'F06C RTC 8 2 RTC control register 2 RTCCR2 8 H'F06D RTC 8 2 SUB32k control register SUB32CR 8 H'F06E Clock pulse 8 generator 2 Clock source select register RTCCSR 8 H'F06F RTC 8 2 2 ICCR1 8 H'F078 IIC2 8 2 2 I C bus control register 1 I C bus control register 2 ICCR2 8 H'F079 IIC2 8 2 2 ICMR 8 H'F07A IIC2 8 2 2 ICIER 8 H'F07B IIC2 8 2 2 I C bus status register ICSR 8 H'F07C IIC2 8 2 Slave address register I C bus mode register I C bus interrupt enable register SAR 8 H'F07D IIC2 8 2 2 ICDRT 8 H'F07E IIC2 8 2 2 I C bus receive data register ICDRR 8 H'F07F IIC2 8 2 Interrupt priority register A IPRA 8 H'F080 Interrupts 8 2 Interrupt priority register B IPRB 8 H'F081 Interrupts 8 2 Interrupt priority register C IPRC 8 H'F082 Interrupts 8 2 Interrupt priority register D IPRD 8 H'F083 Interrupts 8 2 Interrupt priority register E IPRE 8 H'F084 Interrupts 8 2 I C bus transmit data register Rev. 3.00 Aug 23, 2006 Page 487 of 616 REJ09B0182-0300 Section 24 List of Registers Register Name Address break control register 2 ABRKCR2 8 H'F096 Address break 8 2 Address break status register 2 ABRKSR2 8 H'F097 Address break 8 2 Break address register 2H BAR2H 8 H'F098 Address break 8 2 Break address register 2L BAR2L 8 H'F099 Address break 8 2 Break data register 2H BDR2H 8 H'F09A Address break 8 2 Break data register 2L BDR2L 8 H'F09B Address break 8 2 Event counter PWM compare register ECPWCR 16 H'FF8C AEC* 1 16 2 Event counter PWM data register ECPWDR 16 H'FF8E AEC* 1 16 2 Wakeup edge select register WEGR 8 H'FF90 Interrupts 8 2 Serial port control register SPCR 8 H'FF91 SCI3 Input pin edge select register Event counter control register AEGSR ECCR Module Bit No. Address Name Data Bus Access Width State Abbreviation 8 8 H'FF92 H'FF94 8 2 AEC* 1 8 2 AEC* 1 8 2 8 2 Event counter control/status register ECCSR 8 H'FF95 AEC* 1 Event counter H ECH 8 H'FF96 AEC* 1 8/16 2 1 8/16 2 Event counter L ECL 8 H'FF97 AEC* Serial mode register 3_1 SMR3_1 8 H'FF98 SCI3_1 8 3 Bit rate register 3_1 BRR3_1 8 H'FF99 SCI3_1 8 3 Serial control register 3_1 SCR3_1 8 H'FF9A SCI3_1 8 3 Transmit data register 3_1 TDR3_1 8 H'FF9B SCI3_1 8 3 Serial status register 3_1 SSR3_1 8 H'FF9C SCI3_1 8 3 Receive data register 3_1 RDR3_1 8 H'FF9D SCI3_1 LCD port control register LCD control register LCD control register 2 LCD trimming register LPCR LCR LCR2 LTRMR Rev. 3.00 Aug 23, 2006 Page 488 of 616 REJ09B0182-0300 8 8 8 8 H'FFA0 H'FFA1 H'FFA2 H'FFA3 8 3 LCD* 3 8 2 LCD* 3 8 2 LCD* 3 8 2 LCD* 3 8 2 Section 24 List of Registers Register Name Abbreviation Module Bit No. Address Name BGR control register BGRMR 8 H'FFA4 LCD* IrDA control register IrCR 8 H'FFA7 Serial mode register 3_2 SMR3_2 8 Bit rate register 3_2 BRR3_2 8 Serial control register 3_2 SCR3_2 Transmit data register 3_2 3 Data Bus Access Width State 8 2 IrDA 8 3 H'FFA8 SCI3_2 8 3 H'FFA9 SCI3_2 8 3 8 H'FFAA SCI3_2 8 3 TDR3_2 8 H'FFAB SCI3_2 8 3 Serial status register 3_2 SSR3_2 8 H'FFAC SCI3_2 8 3 Receive data register 3_2 RDR3_2 8 H'FFAD SCI3_2 Timer mode register WD TMWD 8 Timer control/status register WD1 TCSRWD1 8 H'FFB0 H'FFB1 8 3 WDT* 2 8 2 WDT* 2 8 2 8 2 8 2 Timer control/status register WD2 TCSRWD2 8 H'FFB2 WDT* 2 Timer counter WD TCWD 8 H'FFB3 WDT* 2 Timer control register F TCRF 8 H'FFB6 Timer F 8 2 Timer control/status register F TCSRF 8 H'FFB7 Timer F 8 2 8-bit timer counter FH TCFH 8 H'FFB8 Timer F 8/16 2 8-bit timer counter FL TCFL 8 H'FFB9 Timer F 8/16 2 Output compare register FH OCRFH 8 H'FFBA Timer F 8/16 2 Output compare register FL OCRFL 8 H'FFBB Timer F 8/16 2 A/D result register ADRR 16 H'FFBC A/D converter 16 2 A/D mode register AMR 8 H'FFBE A/D converter 8 2 A/D start register ADSR 8 H'FFBF A/D converter 8 2 Port mode register 1 PMR1 8 H'FFC0 I/O ports 8 2 Oscillator Control Register OSCCR 8 H'FFC1 Clock pulse 8 generator 2 Port mode register 3 PMR3 8 H'FFC2 I/O ports 8 2 Port mode register 4 PMR4 8 H'FFC3 I/O ports 8 2 Port mode register 5 PMR5 8 H'FFC4 I/O ports 8 2 Port mode register 9 PMR9 8 H'FFC8 I/O ports 8 2 Port mode register B PMRB 8 H'FFCA I/O ports 8 2 Rev. 3.00 Aug 23, 2006 Page 489 of 616 REJ09B0182-0300 Section 24 List of Registers Data Bus Access Width State Register Name Abbreviation Module Bit No. Address Name PWM2 control register PWCR22 8 H'FFCD 14-bit PWM 8 2 PWM2 data register PWDR2 16 H'FFCE 14-bit PWM 16 2 PWM1 control register PWCR1 8 H'FFD0 14-bit PWM 8 2 PWM1 data register PWDR1 16 H'FFD2 14-bit PWM 16 2 Port data register 1 PDR1 8 H'FFD4 I/O ports 8 2 Port data register 3 PDR3 8 H'FFD6 I/O ports 8 2 Port data register 4 PDR4 8 H'FFD7 I/O ports 8 2 Port data register 5 PDR5 8 H'FFD8 I/O ports 8 2 Port data register 6 PDR6 8 H'FFD9 I/O ports 8 2 Port data register 7 PDR7 8 H'FFDA I/O ports 8 2 Port data register 8 PDR8 8 H'FFDB I/O ports 8 2 Port data register 9 PDR9 8 H'FFDC I/O ports 8 2 Port data register A PDRA 8 H'FFDD I/O ports 8 2 Port data register B PDRB 8 H'FFDE I/O ports 8 2 Port pull-up control register 1 PUCR1 8 H'FFE0 I/O ports 8 2 Port pull-up control register 3 PUCR3 8 H'FFE1 I/O ports 8 2 Port pull-up control register 5 PUCR5 8 H'FFE2 I/O ports 8 2 Port pull-up control register 6 PUCR6 8 H'FFE3 I/O ports 8 2 Port control register 1 PCR1 8 H'FFE4 I/O ports 8 2 Port control register 3 PCR3 8 H'FFE6 I/O ports 8 2 Port control register 4 PCR4 8 H'FFE7 I/O ports 8 2 Port control register 5 PCR5 8 H'FFE8 I/O ports 8 2 Port control register 6 PCR6 8 H'FFE9 I/O ports 8 2 Port control register 7 PCR7 8 H'FFEA I/O ports 8 2 Port control register 8 PCR8 8 H'FFEB I/O ports 8 2 Port control register 9 PCR9 8 H'FFEC I/O ports 8 2 Port control register A PCRA 8 H'FFED I/O ports 8 2 System control register 1 SYSCR1 8 H'FFF0 System 8 2 System control register 2 SYSCR2 8 H'FFF1 System 8 2 IRQ edge select register IEGR 8 H'FFF2 Interrupts 8 2 Rev. 3.00 Aug 23, 2006 Page 490 of 616 REJ09B0182-0300 Section 24 List of Registers Register Name Abbreviation Module Bit No. Address Name Data Bus Access Width State Interrupt enable register 1 IENR1 8 H'FFF3 Interrupts 8 2 Interrupt enable register 2 IENR2 8 H'FFF4 Interrupts 8 2 Interrupt mask register INTM 8 H'FFF5 Interrupts 8 2 Interrupt request register 1 IRR1 8 H'FFF6 Interrupts 8 2 Interrupt request register 2 IRR2 8 H'FFF7 Interrupts 8 2 8 H'FFF9 Interrupts 8 2 Clock stop register 1 CKSTPR1 8 H'FFFA System 8 2 Clock stop register 2 CKSTPR2 8 H'FFFB System 8 2 Wakeup interrupt request register IWPR Notes: 1. AEC: Asynchronous event counter 2. WDT: Watchdog timer 3. LCD: LCD controller/driver Rev. 3.00 Aug 23, 2006 Page 491 of 616 REJ09B0182-0300 Section 24 List of Registers 24.2 Register Bits Register bit names of the on-chip peripheral modules are described below. Register Abbreviation Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name SCR4 TIE RIE TEIE SOL SOLP SRES TE RE SCI4 SCSR4 TDRE RDRF ORER TEND CKS3 CKS2 CKS1 CKS0 TDR4 TDR47 TDR46 TDR45 TDR44 TDR43 TDR42 TDR41 TDR40 RDR4 RDR47 RDR46 RDR45 RDR44 RDR43 RDR42 RDR41 RDR40 FLMCR1 SWE ESU PSU EV PV E P FLMCR2 FLER FLPWCR PDWND EBR1 EB6 EB5 EB4 EB3 EB2 EB1 EB0 FENR FLSHE TSTR CST2 CST1 TSYR SYNC2 SYNC1 TCR_1 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TMDR_1 MD1 MD0 TIOR_1 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 TIER_1 TCIEV TGIEB TGIEA TSR_1_ TCFV TGFB TGFA TCNT_1 Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 TGRA_1 TGRB_1 Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 TCR_2 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TMDR_2 MD1 MD0 TIOR_2 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 TIER_2 TCIEV TGIEB TGIEA TSR_2 TCFV TGFB TGFA Rev. 3.00 Aug 23, 2006 Page 492 of 616 REJ09B0182-0300 ROM TPU TPU_1 TPU_2 Section 24 List of Registers Register Abbreviation Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name TPU_2 Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 ADCR MOD OVS2 OVS1 OVS0 VREF1 VREF0 PGA1 PGA0 ADSSR ADS ADST AIN1 AIN0 BYPGA TCNT_2 TGRA_2 TGRB_2 ADDR A/D converter ADD13 ADD12 ADD11 ADD10 ADD9 ADD8 ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0 RTCFLG FOIFG WKIFG DYIFG HRIFG MNIFG SEIFG 05SEIFG 025SEIFG RTC RSECDR BSY SC12 SC11 SC10 SC03 SC02 SC01 SC00 RMINDR BSY MN12 MN11 MN10 MN03 MN02 MN01 MN00 RHRDR BSY HR11 HR10 HR03 HR02 HR01 HR00 RWKDR BSY WK2 WK1 WK0 RTCCR1 RUN 12/24 PM RST RTCCR2 FOIE WKIE SUB32CR 32KSTOP DYIE HRIE MNIE 1SEIE 05SEIE 025SEIE Clock pulse generator RTCCSR RCS6 RCS5 SUB32K RCS3 RCS2 RCS1 RCS0 RTC ICCR1 ICE RCVD MST TRS CKS3 CKS2 CKS1 CKS0 IIC2 ICCR2 BBSY SCP SDAO SDAOP SCLO IICRST ICMR MLS WAIT BCWP BC2 BC1 BC0 ICIER TIE TEIE RIE NAKIE STIE ACKE ACKBR ACKBT ICSR TDRE TEND RDRF NACKF STOP AL/OVE AAS ADZ SAR SVA6 SVA5 SVA4 SVA3 SVA2 SVA1 SVA0 FS ICDRT ICDRT7 ICDRT6 ICDRT5 ICDRT4 ICDRT3 ICDRT2 ICDRT1 ICDRT0 ICDRR ICDRR7 ICDRR6 ICDRR5 ICDRR4 ICDRR3 ICDRR2 ICDRR1 ICDRR0 Rev. 3.00 Aug 23, 2006 Page 493 of 616 REJ09B0182-0300 Section 24 List of Registers Register Abbreviation Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name IPRA IPRA7 IPRA6 IPRA5 IPRA4 IPRA3 IPRA2 IPRA1 IPRA0 Interrupts IPRB IPRB7 IPRB6 IPRB5 IPRB4 IPRB3 IPRB2 IPRB1 IPRB0 IPRC IPRC7 IPRC6 IPRC5 IPRC4 IPRC3 IPRC2 IPRC1 IPRC0 IPRD IPRD7 IPRD6 IPRD5 IPRD4 IPRD3 IPRD2 IPRD1 IPRD0 IPRE IPRE7 IPRE6 IPRE5 IPRE4 ABRKCR2 RTINTE2 CSEL21 CSEL20 ABRKSR2 ABIF2 ACMP22 ACMP21 ACMP20 DCMP21 DCMP20 Address break BAR2H BARH27 BARH26 BARH25 BARH24 BARH23 BARH22 BARH21 BARH20 BAR2L BARL27 BARL20 BDR2H BDRH27 BDRH26 BDRH25 BDRH24 BDRH23 BDRH22 BDRH21 BDRH20 BDR2L BDRL27 BDRL26 BDRL25 BDRL24 BDRL23 BDRL22 BDRL21 BDRL20 ECPWCR ECPWCR15 ECPWCR14 ECPWCR13 ECPWCR12 ECPWCR11 ECPWCR10 ECPWCR9 ECPWCR8 ECPWCR7 ECPWCR1 ECPWCR0 ECPWDR15 ECPWDR14 ECPWDR13 ECPWDR12 ECPWDR11 ECPWDR10 ECPWDR9 ECPWDR8 ECPWDR7 ECPWDR6 ECPWDR5 ECPWDR4 ECPWDR3 ECPWDR2 ECPWDR1 ECPWDR0 WKEGS7 WKEGS6 WKEGS5 WKEGS4 WKEGS3 WKEGS2 WKEGS1 WKEGS0 Interrupts SPCR SPC32 SPC31 SCINV3 SCINV2 SCINV1 SCINV0 SCI3 AEGSR AHEGS1 AHEGS0 ALEGS1 ALEGS0 AIEGS1 AIEGS0 ECPWME ECCR ACKH1 ACKH0 ACKL1 ACKL0 PWCK2 PWCK1 PWCK0 ECCSR OVH OVL CH2 CUEH CUEL CRCH CRCL ECH ECH7 ECH6 ECH5 ECH4 ECH3 ECH2 ECH1 ECH0 ECL ECL7 ECL6 ECL5 ECL4 ECL3 ECL2 ECL1 ECL0 SMR3_1 COM CHR PE PM STOP MP CKS1 CKS0 BRR3_1 BRR7 BRR6 BRR5 BRR4 BRR3 BRR2 BRR1 BRR0 ECPWDR WEGR ABIE2 BARL26 ECPWCR6 BARL25 ECPWCR5 BARL24 ECPWCR4 BARL23 ECPWCR3 BARL22 ECPWCR2 BARL21 SCR3_1 TIE RIE TE RE MPIE TEIE CKE1 CKE0 TDR3_1 TDR7 TDR6 TDR5 TDR4 TDR3 TDR2 TDR1 TDR0 SSR3_1 TDRE RDRF OER FER PER TEND MPBR MPBT RDR3_1 RDR7 RDR6 RDR5 RDR4 RDR3 RDR2 RDR1 RDR0 Rev. 3.00 Aug 23, 2006 Page 494 of 616 REJ09B0182-0300 AEC*1 AEC*1 SCI3_1 Section 24 List of Registers Register Abbreviation Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name LPCR DTS1 DTS0 CMX SGS3 SGS2 SGS1 SGS0 LCD*3 LCR PSW ACT DISP CKS3 CKS2 CKS1 CKS0 LCR2 LCDAB HCKS CHG SUPS LTRMR TRM3 TRM2 TRM1 TRM0 CTRM2 CTRM1 CTRM0 BGRMR BGRSTPN BTRM2 BTRM1 BTRM0 IrCR IrE IrCKS2 IrCKS1 IrCKS0 IrDA SMR3_2 COM CHR PE PM STOP MP CKS1 CKS0 SCI3_2 BRR3_2 BRR7 BRR6 BRR5 BRR4 BRR3 BRR2 BRR1 BRR0 SCR3_2 TIE RIE TE RE MPIE TEIE CKE1 CKE0 TDR3_2 TDR7 TDR6 TDR5 TDR4 TDR3 TDR2 TDR1 TDR0 SSR3_2 TDRE RDRF OER FER PER TEND MPBR MPBT RDR3_2 RDR7 RDR6 RDR5 RDR4 RDR3 RDR2 RDR1 RDR0 TMWD CKS3 CKS2 CKS1 CKS0 TCSRWD1 B6WI TCWE B4WI TCSRWE B2WI WDON BOWI WRST TCSRWD2 OVF B5WI WT/IT B3WI IEOVF TCWD TCW7 TCW6 TCW5 TCW4 TCW3 TCW2 TCW1 TCW0 WDT*2 Timer F TCRF TOLH CKSH2 CKSH1 CKSH0 TOLL CKSL2 CKSL1 CKSL0 TCSRF OVFH CMFH OVIEH CCLRH OVFL CMFL OVIEL CCLRL TCFH TCFH7 TCFH6 TCFH5 TCFH4 TCFH3 TCFH2 TCFH1 TCFH0 TCFL TCFL7 TCFL6 TCFL5 TCFL4 TCFL3 TCFL2 TCFL1 TCFL0 OCRFH OCRFH7 OCRFH6 OCRFH5 OCRFH4 OCRFH3 OCRFH2 OCRFH1 OCRFH0 OCRFL OCRFL7 OCRFL6 OCRFL5 OCRFL4 OCRFL3 OCRFL2 OCRFL1 OCRFL0 ADRR ADR9 ADR8 ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0 AMR CKS TRGE CH3 CH2 CH1 CH0 ADSR ADSF PMR1 AEVL AEVH I/O ports OSCCR IRQAECF OSCF -- Clock pulse A/D converter generator Rev. 3.00 Aug 23, 2006 Page 495 of 616 REJ09B0182-0300 Section 24 List of Registers Register Abbreviation Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name I/O ports PMR3 TMOW PMR4 TMOFH TMOFL TMIF PMR5 WKP7 WKP6 WKP5 WKP4 WKP3 WKP2 WKP1 WKP0 PMR9 IRQ4 PWM2 PWM1 PMRB ADTSTCHG IRQ3 IRQ1 IRQ0 PWCR22 PWDR2 PWCR22 PWCR21 PWCR20 14-bit PWM PWDR213 PWDR212 PWDR211 PWDR210 PWDR29 PWDR28 PWDR27 PWDR26 PWDR25 PWDR24 PWDR23 PWDR22 PWDR21 PWDR20 PWCR1 PWDR1 PWDR113 PWDR112 PWDR111 PWDR110 PWDR19 PWDR18 PWCR12 PWCR11 PWCR10 PWDR17 PWDR16 PWDR15 PWDR14 PWDR13 PWDR12 PWDR11 PWDR10 PDR1 P16 P15 P14 P13 P12 P11 P10 PDR3 P37 P36 P32 P31 P30 PDR4 P42 P41 P40 PDR5 P57 P56 P55 P54 P53 P52 P51 P50 PDR6 P67 P66 P65 P64 P63 P62 P61 P60 PDR7 P77 P76 P75 P74 P73 P72 P71 P70 PDR8 P87 P86 P85 P84 P83 P82 P81 P80 PDR9 P93 P92 P91 P90 PDRA PA3 PA2 PA1 PA0 PDRB PB7 PB6 PB5 PB2 PB1 PB0 PUCR1 PUCR16 PUCR15 PUCR14 PUCR13 PUCR12 PUCR11 PUCR10 PUCR3 PUCR37 PUCR36 PUCR5 PUCR57 PUCR56 PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50 PUCR30 PUCR6 PUCR67 PUCR66 PUCR65 PUCR64 PUCR63 PUCR62 PUCR61 PUCR60 PCR1 PCR16 PCR15 PCR14 PCR13 PCR12 PCR11 PCR10 PCR3 PCR37 PCR36 PCR32 PCR31 PCR30 PCR4 PCR42 PCR41 PCR40 PCR5 PCR57 PCR56 PCR55 PCR54 PCR53 PCR52 PCR51 PCR50 PCR6 PCR67 PCR66 PCR65 PCR64 PCR63 PCR62 PCR61 PCR60 PCR7 PCR77 PCR76 PCR75 PCR74 PCR73 PCR72 PCR71 PCR70 Rev. 3.00 Aug 23, 2006 Page 496 of 616 REJ09B0182-0300 I/O ports Section 24 List of Registers Register Abbreviation Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name I/O ports PCR8 PCR87 PCR86 PCR85 PCR84 PCR83 PCR82 PCR81 PCR80 PCR9 PCR93 PCR92 PCR91 PCR90 PCRA PCRA3 PCRA2 PCRA1 PCRA0 SYSCR1 SSBY STS2 STS1 STS0 LSON TMA3 MA1 MA0 SYSCR2 NESEL DTON MSON SA1 SA0 IEGR NMIEG TMIFG ADTRGNEG IEG4 IEG3 IEG1 IEG0 IENR1 IENRTC IENWP IEN4 IEN3 IENEC2 IEN1 IEN0 IENR2 IENDT IENAD IENSAD IENTFH IENTFL IENEC INTM IRR1 IRR4 IRR3 IRREC2 IRRI1 IRR2 IRRDT IRRAD IRRSAD IRRTFH IRRTFL IWPR IWPF7 IWPF6 IWPF5 IWPF4 IWPF3 CKSTPR1 S4CKSTP* CKSTPR2 ADBCKSTP TPUCKSTP IICCKSTP Notes: 1. 2. 3. 4. 4 S31CKSTP S32CKSTP ADCKSTP -- IWPF2 TFCKSTP INTM1 PW2CKSTP AECCKSTP WDCKSTP PW1CKSTP Interrupts INTM0 IRRI0 IRREC IWPF1 FROMCKSTP* System IWPF0 4 RTCCKSTP System LDCKSTP AEC: Asynchronous event counter WDT: Watchdog timer LCD: LCD controller/driver This bit is available only for the flash memory version. In the masked ROM version, this bit is reserved. Rev. 3.00 Aug 23, 2006 Page 497 of 616 REJ09B0182-0300 Section 24 List of Registers 24.3 Register States in Each Operating Mode Register Abbreviation Reset SCR4 Active Sleep Watch Subactive Subsleep Standby Module Initialized SCR4 SCSR4 Initialized TDR4 Initialized RDR4 Initialized FLMCR1 Initialized Initialized ROM FLMCR2 Initialized FLPWCR Initialized EBR1 Initialized Initialized FENR Initialized TSTR Initialized TSYR Initialized TCR_1 Initialized TMDR_1 Initialized TIOR_1 Initialized TIER_1 Initialized TSR_1_ Initialized TCNT_1 Initialized TGRA_1 Initialized TGRB_1 Initialized TCR_2 Initialized TMDR_2 Initialized TIOR_2 Initialized TIER_2 Initialized TSR_2 Initialized TCNT_2 Initialized TGRA_2 Initialized TGRB_2 Initialized Rev. 3.00 Aug 23, 2006 Page 498 of 616 REJ09B0182-0300 TPU TPU_1 TPU_2 Section 24 List of Registers Register Abbreviation Reset Active Sleep Watch Subactive Subsleep Standby Module A/D converter ADCR Initialized ADSSR Initialized ADDR RTCFLG RSECDR RMINDR RHRDR RWKDR RTCCR1 RTCCR2 SUB32CR Initialized Clock pulse generator RTCCSR Initialized RTC ICCR1 Initialized IIC2 ICCR2 Initialized ICMR Initialized ICIER Initialized ICSR Initialized SAR Initialized ICDRT Initialized ICDRR Initialized IPRA Initialized IPRB Initialized IPRC Initialized IPRD Initialized IPRE Initialized ABRKCR2 Initialized ABRKSR2 Initialized BAR2H Initialized BAR2L Initialized BDR2H BDR2L RTC Interrupts Address break Rev. 3.00 Aug 23, 2006 Page 499 of 616 REJ09B0182-0300 Section 24 List of Registers Register Abbreviation Reset ECPWCR Active Sleep Watch Subactive Subsleep Standby Module Initialized AEC*1 ECPWDR Initialized WEGR Initialized Interrupts SPCR Initialized SCI3 AEGSR Initialized AEC*1 ECCR Initialized ECCSR Initialized ECH Initialized ECL Initialized SMR3_1 Initialized Initialized Initialized SCI3_1 BRR3_1 Initialized Initialized Initialized SCR3_1 Initialized Initialized Initialized TDR3_1 Initialized Initialized Initialized SSR3_1 Initialized Initialized Initialized RDR3_1 Initialized Initialized Initialized LPCR Initialized LCR Initialized LCR2 Initialized LTRMR Initialized BGRMR Initialized IrCR Initialized Initialized Initialized IrDA SMR3_2 Initialized Initialized Initialized SCI3_2 BRR3_2 Initialized Initialized Initialized SCR3_2 Initialized Initialized Initialized TDR3_2 Initialized Initialized Initialized SSR3_2 Initialized Initialized Initialized RDR3_2 Initialized Initialized Initialized TMWD Initialized TCSRWD1 Initialized TCSRWD2 Initialized TCWD Initialized Rev. 3.00 Aug 23, 2006 Page 500 of 616 REJ09B0182-0300 LCD*3 WDT*2 Section 24 List of Registers Register Abbreviation Reset Active Sleep Watch Subactive Subsleep Standby Module Timer F TCRF Initialized TCSRF Initialized TCFH Initialized TCFL Initialized OCRFH Initialized OCRFL Initialized ADRR AMR Initialized ADSR Initialized PMR1 Initialized PMR3 Initialized PMR4 Initialized PMR5 Initialized PMR9 Initialized PMRB Initialized PWCR2 Initialized PWDR2 Initialized PWCR1 Initialized PWDR1 Initialized PDR1 Initialized I/O ports OSCCR Initialized Clock pulse generator PDR3 Initialized I/O ports PDR4 Initialized PDR5 Initialized PDR6 Initialized PDR7 Initialized PDR8 Initialized PDR9 Initialized PDRA Initialized PDRB Initialized A/D converter I/O ports 14-bit PWM Rev. 3.00 Aug 23, 2006 Page 501 of 616 REJ09B0182-0300 Section 24 List of Registers Register Abbreviation Reset PUCR1 PUCR3 Active Sleep Watch Subactive Subsleep Standby Module Initialized I/O ports Initialized PUCR5 Initialized PUCR6 Initialized PCR1 Initialized PCR3 Initialized PCR4 Initialized PCR5 Initialized PCR6 Initialized PCR7 Initialized PCR8 Initialized PCR9 Initialized PCRA Initialized SYSCR1 Initialized SYSCR2 Initialized IEGR Initialized IENR1 Initialized IENR2 Initialized INTM Initialized IRR1 Initialized IRR2 Initialized IWPR Initialized CKSTPR1 Initialized CKSTPR2 Initialized Notes: is not initialized. 1. AEC: Asynchronous event counter 2. WDT: Watchdog timer 3. LCD: LCD controller/driver Rev. 3.00 Aug 23, 2006 Page 502 of 616 REJ09B0182-0300 System Interrupts System Section 25 Electrical Characteristics Section 25 Electrical Characteristics 25.1 Absolute Maximum Ratings for F-ZTAT Version Table 25.1 lists the absolute maximum ratings. Table 25.1 Absolute Maximum Ratings Item Symbol Value Unit Note Power supply voltage VCC -0.3 to +4.3 V Analog power supply voltage AVCC -0.3 to +4.3 V DVCC -0.3 to +4.3 V Other than port B Vin -0.3 to VCC +0.3 V Ports B0 to B2 AVin -0.3 to AVCC + 0.3 V Ports B5 to B7 DVin -0.3 to DVCC + 0.3 V Topr -20 to +75 2 (regular specifications)* C Input voltage Operating temperature *1 -40 to +85 2 (wide-range specifications)* +75 3 (products shipped as chips)* Storage temperature Tstg -55 to +125 C Notes: 1. Permanent damage may occur to the chip if absolute maximum ratings are exceeded. Normal operation should be under the conditions specified in Electrical Characteristics. Exceeding these values can result in incorrect operation and reduced reliability. 2. When the operating voltage (Vcc) for reading the flash memory is from 2.7 V to 3.6 V, the operating temperature (Ta) for programming/erasing ranges from -20 to +75C. When the operating voltage (Vcc) for reading the flash memory is from 1.8 V to 3.6 V, the operating temperature (Ta) for programming/erasing ranges from -20 to +50C. 3. Power may be applied when the temperature is between -20 to +75C. Rev. 3.00 Aug 23, 2006 Page 503 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.2 Electrical Characteristics for F-ZTAT Version 25.2.1 Power Supply Voltage and Operating Range The power supply voltage and operating range are indicated by the shaded region in the figures. (1) Power Supply Voltage and Oscillation Frequency Range 38.4 fW (kHz) fosc (MHz) [10-MHz version] 10.0 32.768 4.2 2.0 1.8 2.7 3.6 VCC (V) 2.7 * Active (high-speed) mode * All operating mode * Sleep (high-speed) mode * Refer to no. 2 in the note. * Refer to no.1 in the note. [4-MHz version] fosc (MHz) 1.8 10.0 4.2 2.0 1.8 2.7 3.6 VCC (V) * Active (high-speed) mode * Sleep (high-speed) mode * Refer to no.1 in the note. Rev. 3.00 Aug 23, 2006 Page 504 of 616 REJ09B0182-0300 3.6 VCC (V) Notes: 1.The fosc values are those when a resonator is used; when an external clock is used, the minimum value of fosc is 2 MHz. 2. When a resonator is used, hold VCC at 2.2 V to 3.6 V from power-on until the oscillation settling time has elapsed. Section 25 Electrical Characteristics (2) Power Supply Voltage and Operating Frequency Range (MHz) [10-MHz version] 19.2 10 16.384 4.2 2.0 (1.0) 2.7 3.6 VCC (V) * Active (high-speed) mode * Sleep (high-speed) mode (except CPU) * Refer to no.1 in the note. 9.6 SUB (kHz) 1.8 8.192 (MHz) 4.8 1250 4.096 525 1.8 2.7 31.25 (15.625) 1.8 2.7 3.6 VCC (V) * Active (medium-speed) mode * Sleep (medium-speed) mode (except A/D converter) * Refer to no.2 in the note. * Subactive mode * Subsleep mode (except CPU) * Watch mode (except CPU) Notes: 1. The value in parentheses is the minimum operating frequency when an external clock is input. When using a resonator, the minimum operating frequency ( ) is 2 MHz [4-MHz version] (MHz) 3.6 VCC (V) 10 2. The value in parentheses is the minimum operating frequency when an external clock is input. When using a resonator, the minimum operating frequency ( ) is 31.25 kHz. 4.2 2.0 (1.0) 1.8 2.7 3.6 VCC (V) (MHz) * Active (high-speed) mode * Sleep (high-speed) mode (except CPU) * Refer to no.1 in the note. 1250 525 31.25 (15.625) 1.8 2.7 3.6 VCC (V) * Active (medium-speed) mode * Sleep (medium-speed) mode (except A/D converter) * Refer to no.2 in the note. Rev. 3.00 Aug 23, 2006 Page 505 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics (3) Analog Power Supply Voltage and A/D Converter Operating Frequency Range [10-MHz version] (MHz) (MHz) 10.0 4.2 2.0 (1.0) 1.8 2.7 1250 31.25 (15.625) 3.6 AVCC(V) 2.7 * Active (high-speed) mode * Active (medium-speed) mode * Sleep (high-speed) mode * Sleep (medium-speed) mode * Refer to no.1 in the note. * Refer to no.2 in the note. 3.6 AVCC(V) [4-MHz version] (MHz) (MHz) 10.0 4.2 2.0 (1.0) 1.8 2.7 525 31.25 (15.625) 3.6 AVCC(V) 2.7 * Active (high-speed) mode * Active (medium-speed) mode * Sleep (high-speed) mode * Sleep (medium-speed) mode * Refer to no.1 in the note. * Refer to no.2 in the note. Notes: 1. The minimum operating frequency () is 2 MHz when using a resonator; and 1 MHz when using an external clock. 2. The minimum operating frequency () is 31.25 kHz when using a resonator; and 15.625 kHz when using an external clock. Rev. 3.00 Aug 23, 2006 Page 506 of 616 REJ09B0182-0300 3.6 AVCC(V) Section 25 Electrical Characteristics 25.2.2 DC Characteristics Table 25.2 lists the DC characteristics. Table 25.2 DC Characteristics VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Values Item Input high voltage Symbol Applicable Pins VIH RES, NMI* , WKP0 Test Condition Min. Typ. Max. Unit 0.9VCC -- VCC + 0.3 V IRQ0, IRQ1, IRQ3 0.9VCC -- AVCC + 0.3 RXD32, RXD31 0.8VCC -- VCC + 0.3 OSC1 0.9VCC -- VCC + 0.3 0.9VCC -- VCC + 0.3 0.8VCC -- VCC + 0.3 PB0 to PB2 0.8VCC -- AVCC + 0.3 PB5 to PB7 0.8VCC -- DVCC + 0.3 IRQAEC 0.9VCC -- VCC + 0.3 3 Notes to WKP7, IRQ4, AEVL, AEVH, TMIF, ADTRG, SCK32, SCK31, SCK4 X1 P10 to P16, VCC = 2.7 to 3.6 V P30 to P32, P36, P37, P40 to P42, P50 to P57, P60 to P67, P70 to P77, P80 to P87, P90 to P93, PA0 to PA3, TCLKA, TCLKB, TCLKC, TIOCA1, TIOCA2, TIOCB1, TIOCB2, SCL, SDA Rev. 3.00 Aug 23, 2006 Page 507 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Applicable Item Input low Symbol Pins VIL RES, NMI* , Values Test Condition Min. Typ. Max. Unit -0.3 -- 0.1VCC V RXD32, RXD31 -0.3 -- 0.2VCC OSC1 -0.3 -- 0.1VCC -0.3 -- 0.1VCC -0.3 -- 0.2VCC VCC - 1.0 -- -- VCC - 0.3 -- -- VCC - 1.0 -- -- VCC - 0.3 -- -- 3 WKP0 to WKP7, voltage IRQ0, IRQ1, IRQ3, IRQ4, IRQAEC, AEVL, AEVH, TMIF, ADTRG, SCK32, SCK31, SCK4 X1 VCC = 2.7 to 3.6 V P10 to P16, P30 to P32, P36, P37, P40 to P42, P50 to P57, P60 to P67, P70 to P77, P80 to P87, P90 to P93, PA0 to PA3, TCLKA, TCLKB, TCLKC, TIOCA1, TIOCB1, TIOCA2, TIOCB2, SCL, SDA, PB0 to PB2, PB5 to PB7 Output high VOH voltage P10 to P16, -IOH = 1.0 mA P30 to P32, VCC = 2.7 to 3.6 V P36, P37, -IOH = 0.1 mA P50 to P57, VCC = 1.8 to 3.6 V P60 to P67, P70 to P77, P80 to P87, PA0 to PA3 P90 to P93 IOH = 1.0 mA VCC = 2.7 to 3.6 V IOH = 0.1 mA Rev. 3.00 Aug 23, 2006 Page 508 of 616 REJ09B0182-0300 V Notes Section 25 Electrical Characteristics Applicable Values Item Symbol Pins Test Condition Min. Typ. Max. Unit Output low VOL P10 to P16, IOL = 0.4 mA -- -- 0.5 V IOL = 15 mA, -- -- 1.0 -- -- 0.5 IOL = 8 mA -- -- 0.5 VCC = 2.0 to 3.6 V -- -- 0.4 -- -- 0.2Vcc -- -- 1.0 -- -- 1.0 30 -- 180 voltage Notes P30 to P32, P36, P37, P40 to P42, P50 to P57, P60 to P67, P70 to P77, P80 to P87, PA0 to PA3 P90 to P93 VCC = 2.7 to 3.6 V IOL = 10 mA, VCC = 2.2 to 3.6 V SCL, SDA IOL = 3.0 mA VCC = 1.8 to 2.0 V IOL = 3.0 mA NMI*3 OSC1, X1, VIN = 0.5 V to leakage P10 to P16, VCC - 0.5 V current P30 to P32, Input/output | IIL | A P36, P37, P40 to P42, P50 to P57, P60 to P67, P70 to P77, P80 to P87, IRQAEC, PA0 to PA3, P90 to P93 Pull-up MOS current -Ip PB0 to PB2, VIN = 0.5 V to PB5 to PB7 AVCC - 0.5 V P10 to P16, VCC = 3.0 V, P30, VIN = 0 V A P36, P37, P50 to P57, P60 to P67 Rev. 3.00 Aug 23, 2006 Page 509 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Applicable Item Input capacitance* Active mode Values Symbol Pins Test Condition Min. Typ. Max. Unit CIN All input pins f = 1 MHz, -- -- 15.0 pF except power VIN =0 V, supply pin Ta = 25C VCC Active (high-speed) -- 1.1 -- mA 3 IOPE1 current consumption Notes *1*2*4 mode, Max. VCC = 1.8 V, guideline = fOSC = 2 MHz 1.1 x typ. Active (high-speed) -- 3.0 *1*2 -- mode, Max. VCC = 3.0 V, guideline = fOSC = 4 MHz 1.1 x typ. Active (high-speed) -- 6.6 10 -- 0.4 -- *1*2 mode, VCC = 3.0 V, fOSC = 10 MHz IOPE2 VCC Active (medium- mA *1*2*4 speed) mode, Max. VCC = 1.8 V, guideline = fOSC = 2 MHz, 1.1 x typ. osc/64 Active (medium- -- 0.7 1 2 -- ** speed) mode, Max. VCC = 3.0 V, guideline = fOSC = 4 MHz, 1.1 x typ. osc/64 Active (medium- -- 1.1 1.8 -- 0.7 -- 1 2 ** speed) mode, VCC = 3.0 V, fOSC = 10 MHz, osc/64 Sleep mode ISLEEP current VCC VCC= 1.8 V, fOSC= 2 MHz mA 1 2 4 *** Max. consumption guideline = 1.1 x typ. VCC= 3.0 V, -- 1.7 -- fOSC= 4 MHz *1*2 Max. guideline = 1.1 x typ. VCC= 3.0 V, fOSC= 10 MHz Rev. 3.00 Aug 23, 2006 Page 510 of 616 REJ09B0182-0300 -- 3.5 5.0 *1*2 Section 25 Electrical Characteristics Applicable Values Item Symbol Pins Test Condition Min. Typ. Max. Unit Notes Subactive mode current consumption ISUB VCC VCC = 1.8 V, LCD on, 32-kHz crystal resonator (SUB = w/2) -- 5.9 -- A ** Reference value VCC = 2.7 V, LCD on, 32-kHz crystal resonator (SUB = w/8) -- 10 -- ** Reference value VCC = 2.7 V, LCD on, 32-kHz crystal resonator (SUB = w/2) -- 25 50 ** 1 2 1 2 1 2 1 2 Subsleep mode current consumption ISUBSP VCC VCC = 2.7 V, LCD on, 32-kHz crystal resonator (SUB = w/2) -- 4.8 16.0 A ** Watch mode current consumption IWATCH VCC VCC = 1.8 V, Ta = 25C, 32-kHz crystal resonator, LCD not used -- 0.4 -- A *1*2*4 Reference value VCC = 2.7 V, 32-kHz crystal resonator, LCD not used -- 2.0 6.0 VCC = 1.8 V, Ta = 25C, 32-kHz crystal resonator not used -- 0.4 -- VCC = 3.0 V, Ta = 25C, 32-kHz crystal resonator not used -- 0.6 -- *1*2 Reference value 32-kHz crystal resonator not used -- 1.0 5.0 *1*2 Vcc = 3.0 V 32KSTOP = 1 -- 0.3 -- *1*2 Reference value 1.5 -- -- Standby mode ISTBY current consumption RAM data retaining voltage VRAM VCC VCC *1*2 A *1*2 Reference value V Rev. 3.00 Aug 23, 2006 Page 511 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Applicable Item Symbol Pins Allowable output low current (per pin) IOL Allowable IOL output low Test Condition Min. Typ. Max. Unit Output pins except port 9 -- -- 0.5 mA P90 to P93 -- -- 15.0 Output pins -- -- 20.0 Notes mA except port 9 current (total) Allowable Values -IOH Port 9 -- -- 60.0 All output pins VCC = 2.7 V to 3.6 V -- -- 2.0 VCC = 1.8 V to 3.6 V -- -- 0.2 -- -- 10.0 mA output high current (per pin) - IOH Allowable All output pins mA output high current (total) Notes: 1. Pin states during current measurement. Mode Active (high-speed) mode (IOPE1) RES Pin Internal State Other Pins LCD Power Supply VCC Only CPU operates VCC Halted On-chip WDT oscillator is off System clock oscillator: crystal resonator Subclock oscillator: Pin X1 = GND Active (medium-speed) mode (IOPE2) Sleep mode Oscillator Pins VCC Only on-chip timers operate VCC Halted VCC Halted VCC Halted VCC Halted VCC Halted On-chip WDT oscillator is off Subactive mode VCC Only CPU operates On-chip WDT oscillator is off Subsleep mode VCC Only on-chip timers operate, CPU stops System clock oscillator: crystal resonator Subclock oscillator: crystal resonator On-chip WDT oscillator is off Watch mode VCC Only time base operates, CPU stops On-chip WDT oscillator is off TCSRWD1 (WDON) = 0 Standby mode VCC CPU and timers both stop On-chip WDT oscillator is off TCSRWD1 (WDON) = 0 2. Excludes current in pull-up MOS transistors and output buffers. 3. Except for the package for the TLP-85V. 4. Supported only by the 4MHz version. Rev. 3.00 Aug 23, 2006 Page 512 of 616 REJ09B0182-0300 System clock oscillator: crystal resonator Subclock oscillator: Pin X1 = GND (32KSTOP = 0) Section 25 Electrical Characteristics 25.2.3 AC Characteristics Table 25.3 lists the control signal timing, table 25.4 lists the serial interface timing, and table 25.5 2 lists the I C bus interface timing. Table 25.3 Control Signal Timing VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Applicable Values Reference Item Symbol Pins Test Condition Min. Typ. Max. Unit System clock fOSC OSC1, OSC2 VCC = 2.7 to 3.6 V 2.0 -- 10.0 MHz VCC = 1.8 to 3.6 V 2.0 -- 4.2 VCC = 2.7 to 3.6 V 100 -- 500 Figure oscillation frequency OSC clock (OSC) cycle tOSC OSC1, OSC2 time ns VCC = 1.8 to 3.6 V 238 -- Figure 25.2 *2 (1000) 500 (1000) System clock () cycle tcyc time Subclock oscillation fW X1, X2 1 -- 64 tOSC -- -- 64 s -- 32.768 -- kHz frequency or 38.4 Watch clock (W) cycle tW X1, X2 -- time Subclock (SUB) cycle 30.5 or -- s Figure 25.2 *1 26.0 tsubcyc 2 -- 8 tW 2 -- -- tcyc time Instruction cycle time tsubcyc Oscillation stabilization trc time OSC1, OSC2 Crystal resonator -- 0.8 2.0 -- 1.2 3 -- 20 45 -- 80 -- -- -- 50 ms (VCC = 2.7 to 3.6 V) Crystal resonator (VCC = 2.2 to 3.6 V) Ceramic resonator s (VCC = 2.2 to 3.6 V) Ceramic resonator (other than above) Other than above ms Rev. 3.00 Aug 23, 2006 Page 513 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Applicable Item Symbol Oscillation stabilization trc tCPH Reference Pins Test Condition Min. Typ. Max. Unit Figure X1, X2 VCC = 2.2 to 3.6 V -- -- 2.0 s Figure 5.7 Other than above -- 4 -- VCC = 2.7 to 3.6 V 40 -- -- ns Figure 25.2 VCC = 1.8 to 3.6 V 95 -- -- -- 15.26 -- s ns time External clock high Values OSC1 width X1 or 13.02 External clock low tCPL OSC1 VCC = 2.7 to 3.6 V 40 -- -- VCC = 1.8 to 3.6 V 95 -- -- -- 15.26 -- s ns Figure 25.2 width X1 or 13.02 External clock F time tCPr OSC1 VCC = 2.7 to 3.6 V -- -- 10 VCC = 1.8 to 3.6 V -- -- 24 X1 External clock fall time tCPf -- -- 55.0 ns VCC = 2.7 to 3.6 V -- -- 10 ns VCC = 1.8 to 3.6 V -- -- 24 X1 -- -- 55.0 ns OSC1 Figure 25.2 Figure 25.2 RES pin low width tREL RES 10 -- -- tcyc Figure 25.3*3 Input pin high width tIH IRQ0, IRQ1, 2 -- -- tcyc Figure 25.4 NMI, IRQ3, IRQ4, tsubcyc IRQAEC, WKP0 to WKP7, TMIF, ADTRG AEVL, AEVH VCC = 2.7 to 3.6 V VCC = 1.8 to 3.6 V tTCKWH TCLKA, TCLKB, Single edge specified TCLKC, 50 -- -- 110 -- -- 1.5 -- -- 2.5 -- -- TIOCA1, TIOCB1, TIOCA2, TIOCB2 Both edges specified Rev. 3.00 Aug 23, 2006 Page 514 of 616 REJ09B0182-0300 ns tcyc Figure 25.7 Section 25 Electrical Characteristics Applicable Item Symbol Pins Input pin low width tIL IRQ0, IRQ1, Values Test Condition Reference Min. Typ. Max. Unit Figure 2 -- -- tcyc Figure 25.4 NMI, tsubcyc IRQ3, IRQ4, IRQAEC, WKP0 to WKP7, TMIF, ADTRG AEVL, AEVH tTCKWL VCC = 2.7 to 3.6 V 50 -- -- VCC = 1.8 to 3.6 V 110 -- -- 1.5 -- -- 2.5 -- -- TCLKA, TCLKB, Single edge TCLKC, ns tcyc Figure 25.7 specified TIOCA1, TIOCB1, TIOCA2, TIOCB2 Both edges specified Notes: 1. Selected with the SA1 and SA0 bits in the system control register 2 (SYSCR2). 2. The value in parentheses is tOSC (max.) when an external clock is used. 3. For details on the power-on reset characteristics, refer to table 25.9 and figure 25.1. Rev. 3.00 Aug 23, 2006 Page 515 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Table 25.4 Serial Interface Timing VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Values Item Input clock cycle Symbol Asynchronous Test Condition tscyc Clocked Reference Min. Typ. Max. Unit Figure 4 -- -- tcyc or Figure 25.5 6 -- -- t subcyc synchronous Input clock pulse width tSCKW 0.4 -- 0.6 Transmit data delay time tTXD -- -- 1 (clocked synchronous) Receive data setup time tscyc Figure 25.5 tcyc or Figure 25.6 tsubcyc tRXS 238 -- -- ns Figure 25.6 -- -- ns Figure 25.6 (clocked synchronous) VCC = 2.7 to 3.6 V Receive data hold time tRXH 100 238 (clocked synchronous) VCC = 2.7 to 3.6 V Rev. 3.00 Aug 23, 2006 Page 516 of 616 REJ09B0182-0300 100 Section 25 Electrical Characteristics 2 Table 25.5 I C Bus Interface Timing VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = 0.0 V, Ta = -20 to +75C, unless otherwise specified. Test Item Symbol SCL input cycle time Reference Min. Typ. Max. Unit Figure tSCL 12tcyc + 600 -- -- ns Figure 25.8 SCL input high width tSCLH 3tcyc + 300 -- -- ns SCL input low width tSCLL 5tcyc + 300 -- -- ns SCL and SDA input fall time tSf -- -- 300 ns SCL and SDA input spike pulse removal time tSP -- -- 1tcyc ns SDA input bus-free time tBUF 5tcyc -- -- ns Start condition input hold time tSTAH 3tcyc -- -- ns Retransmission start condition input setup time tSTAS 3tcyc -- -- ns Setup time for stop condition tSTOS input 3tcyc -- -- ns Data-input setup time tSDAS 1tcyc + 20 -- -- ns Data-input hold time tSDAH 0 -- -- ns Capacitive load of SCL and SDA Cb 0 -- 400 pF SCL and SDA output fall time tSf -- -- 300 ns 25.2.4 Condition Values A/D Converter Characteristics Table 25.6 lists the A/D converter characteristics. Rev. 3.00 Aug 23, 2006 Page 517 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Table 25.6 A/D Converter Characteristics VCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Applicable Item Symbol Pins Values Test Condition Min. Typ. Max. Unit Notes * Analog power supply voltage AVCC AVCC 1.8 -- 3.6 V Analog input voltage AVIN AN0 to AN2 -0.3 -- AVCC + 0.3 V Analog power supply current AIOPE AVCC -- -- 1.0 mA AISTOP1 AVCC -- 600 -- A AVCC = 3.0 V 1 2 * Reference value AISTOP2 AVCC -- -- 5 A Analog input capacitance CAIN AN0 to AN2 -- -- 15.0 pF Allowable signal source impedance RAIN -- -- 10.0 k -- -- 10 Bits AVCC = 2.7 V to 3.6 V VCC = 2.7 V to 3.6 V -- -- 3.5 LSB AVCC = 2.0 V to 3.6 V VCC = 2.0 V to 3.6 V -- -- 5.5 Other than above -- -- 7.5 -- -- 0.5 LSB AVCC = 2.7 V to 3.6 V VCC = 2.7 V to 3.6 V -- -- 4.0 LSB AVCC = 2.0 V to 3.6 V VCC = 2.0 V to 3.6 V -- -- 6.0 Other than above -- -- 8.0 AVCC = 2.7 V to 3.6 V VCC = 2.7 V to 3.6 V 6.2 -- 124 AVCC = 2.0 V to 3.6 V VCC = 2.0 V to 3.6 V 14.7 -- 124 Other than above 31 -- 124 Resolution (data length) Nonlinearity error Quantization error Absolute accuracy Conversion time 3 * *4 *4 s Notes: 1. Set AVCC = VCC when the A/D converter is not used. 2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle. 3. AISTOP2 is the current at a reset and in standby, watch, subactive, and subsleep modes while the A/D converter is idle. 4. Conversion time = 31 s. Rev. 3.00 Aug 23, 2006 Page 518 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.2.5 A/D Converter Characteristics Table 25.7 lists the A/D converter characteristics. Table 25.7 A/D Converter Characteristics VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Values Applicable Item Symbol Pins Analog power DVcc DVcc Test Condition supply voltage Analog power Min. Typ. Max. Unit Notes 2.2/ 3.6 V *1*4 2.0 mA 2.7 DIOPE DVcc supply current PGA not used, BGR = OFF, Reference value DVcc = 3.0 V, DISTOP1 DVcc fOVS = 2.0 MHz 0.1 A *2 Reference value DISTOP2 DVcc 0.1 A *3 Reference value Resolution Oversampling fOVS DVcc = 2.2 to 3.6 V, 14 14 14 Bits 0.25 4.2 MHz 0.25 10 MHz 0.78 13.125 kHz 0.78 31.25 kHz 76.19 1280 s 32.0 1280 s -- 3.0 -- LSB -- -7.0 -- Vcc = 2.2 to 3.6 V frequency DVcc = 2.7 to 3.6 V, Vcc = 2.7 to 3.6 V Sampling frequency fS DVcc = 2.2 to 3.6 V, Vcc = 2.2 to 3.6 V DVcc = 2.7 to 3.6 V, Vcc = 2.7 to 3.6 V Conversion speed DVcc = 2.2 to 3.6 V, Vcc = 2.2 to 3.6 V DVcc = 2.7 to 3.6 V, Vcc = 2.7 to 3.6 V Integral lineality PGA bypass error (DVcc = 3.0 V, Vref = 2.7 V, conversion speed = 32 s)*7 Rev. 3.00 Aug 23, 2006 Page 519 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Values Applicable Item Symbol Pins Test Condition Min. Typ. Max. Unit Differential PGA bypass -- 1.3 -- LSB lineality error (DVcc = 3.0 V, -- -0.8 -- -- 10 -- mV -- 28.0 -- mV -- 1/3 -- V/V -- 1 -- V/V -- 2 -- V/V -- 4 -- V/V -- 16 -- mV -- -4 -- mV -- -8 -- mV -- -18 -- mV REF -- 1.17 -- V Vref 0.2 DVcc -- 0.9 DVcc V Vref -- 18 -- k Vref = 2.7 V, conversion speed = 32 s)*7 Offset error PGA bypass Notes (DVcc = 3.0 V, Vref = 2.7 V, conversion speed = 32 s)*7 Full scale error PGA bypass (DVcc = 3.0 V, Vref = 2.7 V, conversion speed = 32 s)* 7 PGA gain PGA gain error Tad PGA = 1/3, DVcc = 3.0 V PGA = 1, DVcc = 3.0 V PGA = 2, DVcc = 3.0 V PGA = 4, DVcc = 3.0 V Internal reference voltage External reference voltage Vref-GND RVref resistance REF Rev. 3.00 Aug 23, 2006 Page 520 of 616 REJ09B0182-0300 *5*6 Section 25 Electrical Characteristics Values Applicable Item Symbol Pins Test Condition Min. Typ. Max. Unit Analog data input Ain Ain1, Ain2 PGA = 1/3 0.6 -- 2.7 Vref V Notes (2.7 Vref < voltage DVcc) 2.7 REF (2.7 REF < DVcc) PGA = 1, bypass 0.2 -- Vref V REF PGA = 2 0.1 -- 0.5 Vref V 0.5 REF PGA = 4 0.05 -- 0.25 Vref V 0.25 REF Operating Ta 0 -- 50 C temperature Notes: 1. Set DVcc = Vcc when the A/D converter is not used. 2. DISTOP1 is the current in active and sleep modes while the A/D converter is idle. 3. DISTOP2 is the current at a reset and in standby, watch, subactive, and subsleep modes while the A/D converter is idle. 4. Minimum values are 2.2 V and 2.7 V for the 4 MHz version and 10 MHz version, respectively. DVcc should be connected to Vcc when the A/D converter is not used. 5. BGR stabilization time = 10 s (Ta = 25C, Vcc = 3.0 V) The BGR stabilization time is started after setting bit 7 (BTRSTPN) in BGR control register (BGRMR) to 1. 6. Before using the system, the internal reference value must be tested because there is dispersion in sample data. 7. This is the value when the BGR is not used. Rev. 3.00 Aug 23, 2006 Page 521 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.2.6 LCD Characteristics Table 25.8 shows the LCD characteristics. Table 25.8 LCD Characteristics VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Values Applicable Item Symbol Pins Test Condition Min. Typ. Max. Unit Notes Segment driver drop VDS SEG1 to ID = 2 A -- -- 0.6 V * SEG32 V1 = 2.7 V to 3.6 V COM1 to ID = 2 A -- -- 0.3 V *1 COM4 V1 = 2.7 V to 3.6 V 1.5 3.0 7.0 M 2.2 -- 3.6 V *2 voltage Common driver drop VDC voltage LCD power supply RLCD Between V1 and VSS 1 split-resistance LCD display voltage VLCD V1 V3 power supply VLCD3 V3 Between V3 and VSS 0.9 1.0 1.1 V *3*4 VLCD2 V2 Between V2 and VSS -- 2.0 -- V *3*4 -- V *3*4 -- A voltage V2 power supply (VLCD3 x 2) voltage V1 power supply VLCD1 V1 Between V1 and VSS -- 3-V constant voltage 3.0 (VLCD3 x 3) voltage ILCD Vcc LCD power supply circuit current Vcc = 3.0 V Booster clock: -- 20 Reference value*4*5 125 kHz consumption Notes: 1. The voltage drop from power supply pins V1, V2, V3, and VSS to each segment pin or common pin. 2. When the LCD display voltage is supplied from an external power source, ensure that the following relationship is maintained: V1 V2 V3 VSS. 3. The value when the LCD power supply split-resistor is separated and 3-V constant voltage power supply circuit is driven. 4. For details on the register (BGRMR) setting range when the voltage of the V3 pin is set to 1.0 V, refer to section 20.3.5, BGR Control Register (BGRMR). 5. Includes the current consumption of the band-gap reference circuit (BGR) (operation). Rev. 3.00 Aug 23, 2006 Page 522 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.2.7 Power-On Reset Circuit Characteristics Table 25.9 lists the power-on reset circuit characteristics. Table 25.9 Power-On Reset Circuit Characteristics VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, Ta = -20 to +75C (regular specifications), Ta = -40 to +85C (wide-range specifications), unless otherwise specified. Values Item Symbol Reset voltage V_rst Test Condition Power supply rise time t_vtr Reference Min. Typ. Max. Unit Figure 0.7Vcc 0.8Vcc 0.9Vcc V Figure 25.1 The Vcc rise time should be shorter than half the RES rise time. Reset count time t_out Count start time t_cr 0.8 -- s 8.0 Adjustable by the value of the external capacitor of the RES pin. On-chip pull-up Rp Vcc = 3.0 V 60 100 -- k Figure 22.1 resistance 25.2.8 Watchdog Timer Characteristics Table 25.10 Watchdog Timer Characteristics VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, Ta = -20 to +75C (regular specifications), Ta = -40 to +85C (wide-range specifications), unless otherwise specified. Applicable Item Symbol On-chip oscillator tovf Pins Values Test Condition Min. Typ. Max. Unit 0.2 0.4 -- s Notes overflow time Rev. 3.00 Aug 23, 2006 Page 523 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.2.9 Flash Memory Characteristics Preliminary Table 25.11 lists the flash memory characteristics. Table 25.11 Flash Memory Characteristics Condition A: AVCC = 2.7 V to 3.6 V, DVCC = 2.7 V to 3.6 V, VSS = AVSS = 0.0 V, VCC = 2.7 V to 3.6 V (operating voltage range in reading), VCC = 3.0 V to 3.6 V (operating voltage range in programming/erasing), Ta = -20 to +75C (operating temperature range in programming/erasing: regular specifications, wide-range specifications, products shipped as chips) Condition B: AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, VCC = 1.8 V to 3.6 V (operating voltage range in reading), VCC = 3.0 V to 3.6 V (operating voltage range in programming/erasing), Ta = -20 to +50C (operating temperature range in programming/erasing: regular specifications, wide-range specifications) Test Item Symbol Min. Typ. Max. Unit Programming time (per 128 bytes)*1*2*4 tP -- 7 200 ms Erase time (per block)*1*3*6 tE -- 100 1200 ms Maximum number of reprogrammings NWEC 1000*8*11 10000*9 -- 100*8*12 10000*9 -- tDRP 10*10 -- -- Years s Data retention time Programming Wait time after SWE bit setting* 1 Condition Values Times x 1 -- -- Wait time after PSU bit setting*1 y 50 -- -- s Wait time after P bit setting*1*4 z1 1n6 28 30 32 s z2 7 n 1000 198 200 202 s z3 Additionalprogramming 8 10 12 s 5 -- -- s 1 Wait time after PSU bit clear* 5 -- -- s Wait time after PV bit setting*1 4 -- -- s Wait time after dummy write*1 2 -- -- s Wait time after PV bit clear* 2 -- -- s Wait time after SWE bit clear*1 100 -- -- s Maximum programming count*1*4*5 N -- -- 1000 Times Wait time after P bit clear*1 1 Rev. 3.00 Aug 23, 2006 Page 524 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Test Item Min. Typ. Max. Unit x Symbol 1 -- -- s y 100 -- -- s z 10 -- 100 ms 10 -- -- s 1 10 -- -- s 1 20 -- -- s 2 -- -- s Wait time after EV bit clear* 4 -- -- s Wait time after SWE bit clear*1 100 -- -- s N -- -- 120 Times Wait time after SWE bit setting*1 Erase Values 1 Wait time after ESU bit setting* 1 Wait time after E bit setting* * Wait time after E bit clear* 6 1 Wait time after ESU bit clear* Wait time after EV bit setting* Wait time after dummy write*1 1 1 6 7 Maximum erase count* * * Condition Notes: 1. 2. Make the time settings in accordance with the program/erase algorithms. The programming time for 128 bytes. (Indicates the total time for which the P bit in the flash memory control register 1 (FLMCR1) is set. The program-verify time is not included.) 3. The time required to erase one block. (Indicates the total time for which the E bit in the flash memory control register 1 (FLMCR1) is set. The erase-verify time is not included.) 4. Programming time maximum value (tP (max.)) = wait time after P bit setting (z) x maximum number of programmings (N) 5. Set the maximum number of programmings (N) according to the actual set values of z1, z2, and z3, so that it does not exceed the programming time maximum value (tP (max.)). The wait time after P bit setting (z1, z2) should be changed as follows according to the value of the number of programmings (n). Number of programmings (n) 1n6 z1 = 30 s 7 n 1000 z2 = 200 s 6. Erase time maximum value (tE (max.)) = wait time after E bit setting (z) x maximum number of erases (N) 7. Set the maximum number of erases (N) according to the actual set value of (z), so that it does not exceed the erase time maximum value (tE (max.)). 8. The minimum number of times in which all characteristics are guaranteed following reprogramming. (The guarantee covers the range from 1 to the minimum value.) 9. Reference value at 25C. (Guideline showing number of reprogrammings over which functioning will be retained under normal circumstances.) 10. Data retention characteristics within the range indicated in the specifications, including the minimum value for reprogrammings. 11. Applies to an operating voltage range when reading data of 2.7 to 3.6 V. 12. Applies to an operating voltage range when reading data of 1.8 to 3.6 V. Rev. 3.00 Aug 23, 2006 Page 525 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.3 Absolute Maximum Ratings for Masked ROM Version Table 25.12 lists the absolute maximum ratings. Table 25.12 Absolute Maximum Ratings Item Symbol Value Unit Note Power supply voltage VCC -0.3 to +4.3 V *1 Analog power supply voltage AVCC -0.3 to +4.3 V DVCC -0.3 to +4.3 V Vin -0.3 to VCC +0.3 V Ports B0 to B2 AVin -0.3 to AVCC + 0.3 V Ports B5 to B7 DVin -0.3 to DVCC + 0.3 V Topr -20 to +75 (regular specifications) C Input voltage Other than port B Operating temperature -40 to +85 (wide-range specifications) +75 (products shipped as chips)*2 Storage temperature Tstg -55 to +125 C Notes: 1. Permanent damage may occur to the chip if absolute maximum ratings are exceeded. Normal operation should be under the conditions specified in Electrical Characteristics. Exceeding these values can result in incorrect operation and reduced reliability. 2. Power may be applied when the temperature is between -20 and +75C. Rev. 3.00 Aug 23, 2006 Page 526 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.4 Electrical Characteristics for Masked ROM Version 25.4.1 Power Supply Voltage and Operating Range The power supply voltage and operating range are indicated by the shaded region in the figures. (1) Power Supply Voltage and Oscillation Frequency Range fW (kHz) fosc (MHz) 38.4 10.0 32.768 4.2 2.0 1.8 2.7 3.6 VCC (V) 1.8 2.7 * Active (high-speed) mode * All operating mode * Sleep (high-speed) mode * Refer to no.2 in the note. * Refer to no.1 in the note. 3.6 VCC (V) Notes: 1.The fosc values are those when a resonator is used; when an external clock is used, the minimum value of fosc is 2 MHz. 2. When a resonator is used, hold VCC at 2.2 V to 3.6 V from power-on until the oscillation settling time has elapsed. Rev. 3.00 Aug 23, 2006 Page 527 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics (MHz) (2) Power Supply Voltage and Operating Frequency Range 19.2 10 16.384 4.2 2.0 (1.0) 2.7 3.6 VCC (V) * Active (high-speed) mode * Sleep (high-speed) mode (except CPU) * Refer to no.1 in the note. 9.6 SUB (kHz) 1.8 8.192 (MHz) 4.8 1250 4.096 525 1.8 2.7 31.25 (15.625) 3.6 VCC (V) 1.8 2.7 3.6 VCC (V) * Active (medium-speed) mode * Sleep (medium-speed) mode (except A/D converter) * Refer to no.2 in the note. * Subactive mode * Subsleep mode (except CPU) * Watch mode (except CPU) Notes: 1. The value in parentheses is the minimum operating frequency when an external clock is input. When using a resonator, the minimum operating frequency ( ) is 2 MHz. 2. The value in parentheses is the minimum operating frequency when an external clock is input. When using a resonator, the minimum operating frequency ( ) is 31.25 kHz. Rev. 3.00 Aug 23, 2006 Page 528 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Analog Power Supply Voltage and A/D Converter Operating Frequency Range 10.0 1250 (MHz) (MHz) (3) 4.2 2.0 (1.0) 1.8 2.7 525 31.25 (15.625) 3.6 AVCC(V) 2.7 * Active (high-speed) mode * Active (medium-speed) mode * Sleep (high-speed) mode * Sleep (medium-speed) mode * Refer to no.1 in the note. * Refer to no.2 in the note. 3.6 AVCC(V) Notes: 1. The minimum operating frequency () is 2 MHz when using a resonator; and 1 MHz when using an external clock. 2. The minimum operating frequency () is 31.25 kHz when using a resonator; and 15.625 kHz when using an external clock. Rev. 3.00 Aug 23, 2006 Page 529 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.4.2 DC Characteristics Table 25.13 lists the DC characteristics. Table 25.13 DC Characteristics VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Values Item Symbol Input high VIH voltage Applicable Pins Test Condition Min. Typ. Max. Unit 0.9VCC -- VCC + 0.3 V IRQ0, IRQ1, IRQ2 0.9VCC -- AVCC + 0.3 RXD32, RXD31 0.8VCC -- VCC + 0.3 OSC1 0.9VCC -- VCC + 0.3 0.9VCC -- VCC + 0.3 0.8VCC -- VCC + 0.3 PB0 to PB2 0.8VCC -- AVCC + 0.3 PB5 to PB7 0.8VCC -- DVCC + 0.3 IRQAEC 0.9VCC -- VCC + 0.3 RES, NMI, WKP0 to WKP7, IRQ4, AEVL, AEVH, TMIF, ADTRG, SCK32, SCK31, SCK4 X1 P10 to P16, VCC = 2.7 to 3.6 V P30 to P32, P36, P37, P40 to P42, P50 to P57, P60 to P67, P70 to P77, P80 to P87, P90 to P93, PA0 to PA3, TCLKA, TCLKB, TCLKC, TIOCA1, TIOCA2, TIOCB1, TIOCB2, SCL, SDA Rev. 3.00 Aug 23, 2006 Page 530 of 616 REJ09B0182-0300 Notes Section 25 Electrical Characteristics Values Item Symbol Input low VIL Applicable Pins Test Condition RES, NMI, WKP0 to Min. Typ. Max. Unit -0.3 -- 0.1VCC V -0.3 -- 0.2VCC Notes WKP7, IRQ0, IRQ1, voltage IRQ3, IRQ4, IRQAEC, AEVL, AEVH, TMIF, ADTRG, SCK32, SCK31, SCK4 RXD32, RXD31 OSC1 X1 VCC = 2.7 to 3.6 V P10 to P16, -0.3 -- 0.1VCC -0.3 -- 0.1VCC -0.3 -- 0.2VCC VCC - 1.0 -- -- P30 to P32, P36, P37, P40 to P42, P50 to P57, P60 to P67, P70 to P77, P80 to P87, P90 to P93, PA0 to PA3, TCLKA, TCLKB, TCLKC, TIOCA1, TIOCB1, TIOCA2, TIOCB2, SCL, SDA, PB0 to PB2, PB5 to PB7 Output high voltage VOH P10 to P16, -IOH = 1.0 mA P30 to P32, VCC = 2.7 to 3.6 V P36, P37, -IOH = 0.1 mA VCC - 0.3 -- -- -IOH = 1.0 mA VCC - 1.0 -- -- VCC - 0.3 -- -- P40 to P42, V P50 to P57, P60 to P67, P70 to P77, P80 to P87, PA0 to PA3 P90 to P93 VCC = 2.7 to 3.6 V -IOH = 0.1 mA Rev. 3.00 Aug 23, 2006 Page 531 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Values Item Symbol Applicable Pins Test Condition Min. Typ. Max. Unit Output low VOL P10 to P16, IOL = 0.4 mA -- -- 0.5 V IOL = 15 mA -- -- 1.0 -- -- 0.5 -- -- 0.5 -- -- 0.4 -- -- 0.2VCC -- -- 1.0 -- -- 1.0 30 -- 180 A -- -- 15.0 pF voltage P30 to P32, P36, P37, P40 to P42, P50 to P57, P60 to P67, P70 to P77, P80 to P87, PA0 to PA3 P90 to P93 VCC = 2.7 to 3.6 V IOL = 10 mA VCC = 2.2 to 3.6 V IOL = 8.0 mA VCC = 1.8 to 3.6 V SCL, SDA VCC = 2.0 to 3.6 V V IOL = 3.0 mA VCC = 1.8 to 2.0 V IOL = 3.0 mA NMI, OSC1, X1, VIN = 0.5 V to leakage P10 to P16, VCC - 0.5 V current P30 to P32, Input/output | IIL | A P36, P37, P40 to P42, P50 to P57, P60 to P67, P70 to P77, P80 to P87, IRQAEC, PA0 to PA3, P90 to P93 Pull-up MOS -Ip current PB0 to PB2, VIN = 0.5 V to PB5 to PB7 AVCC - 0.5 V P10 to P16, VCC = 3.0 V, P30, VIN = 0 V P36, P37, P50 to P57, P60 to P67 Input capacitance* CIN 3 All input pins except f = 1 MHz, power supply pin VIN =0 V, Ta = 25C Rev. 3.00 Aug 23, 2006 Page 532 of 616 REJ09B0182-0300 Notes Section 25 Electrical Characteristics Values Item Symbol Applicable Pins Test Condition Min. Active mode IOPE1 VCC Active (high-speed) mode, -- Typ. Max. Unit Notes 0.7 -- mA *1*2 current VCC = 1.8 V, Max. consumption fOSC = 2 MHz guideline = 1.1 x typ. Active (high-speed) mode, -- 2.6 *1*2 -- VCC = 3.0 V, Max. fOSC = 4 MHz guideline = 1.1 x typ. Active (high-speed) mode, -- 6.6 10.0 0.2 -- 1 2 ** VCC = 3.0 V, fOSC = 10 MHz IOPE2 VCC Active (medium-speed) -- mA 1 2 ** mode, Max. VCC = 1.8 V, guideline = fOSC = 2 MHz, 1.1 x typ. osc/64 Active (medium-speed) -- 0.4 *1*2 -- mode, Max. VCC = 3.0 V, guideline = fOSC = 4 MHz, 1.1 x typ. osc/64 Active (medium-speed) -- 0.8 1.8 -- 0.3 -- *1*2 mode, VCC = 3.0 V, fOSC = 10 MHz, osc/64 Sleep mode current ISLEEP VCC VCC= 1.8 V, fOSC= 2 MHz mA 1 2 ** Max. consumption guideline = 1.1 x typ. VCC= 3.0 V, -- 1.2 -- fOSC= 4 MHz *1*2 Max. guideline = 1.1 x typ. VCC= 3.0 V, -- 3.0 5.0 1 2 ** fOSC= 10 MHz Rev. 3.00 Aug 23, 2006 Page 533 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Values Item Symbol Applicable Pins Test Condition Min. Typ. Max. Unit Notes Subactive ISUB VCC VCC = 1.8 V, -- 5.9 -- A *1*2 mode current LCD on, 32-kHz crystal Reference consumption resonator (SUB = w/2) value VCC = 2.7 V, -- 5.7 1 2 -- ** LCD on, 32-kHz crystal Reference resonator (SUB = w/8) value VCC = 2.7 V, *1*2 -- 10.9 50 -- 4.5 10 A ** -- 0.5 -- A *1*2 LCD on, 32-kHz crystal resonator (SUB = w/2) Subsleep ISUBSP VCC VCC = 2.7 V, mode current LCD on, 32-kHz crystal consumption resonator (SUB = w/2) Watch mode IWATCH VCC VCC = 1.8 V, 1 2 current Ta = 25C, Reference consumption 32-kHz crystal resonator, value LCD not used VCC = 2.7 V, -- 1.6 6.0 -- 0.4 -- *1*2 32-kHz crystal resonator, LCD not used Standby mode ISTBY VCC VCC = 1.8 V, A *1*2 current Ta = 25C, Reference consumption 32-kHz crystal resonator value not used VCC = 3.0 V, -- 0.6 *1*2 -- Ta = 25C, Reference 32-kHz crystal resonator value not used 32-kHz crystal resonator -- 1.0 5.0 *1*2 -- 0.3 -- ** not used VCC = 3.0 V 1 2 Reference 32KSTOP = 1 value RAM data VRAM VCC 1.5 -- -- V IOL Output pins -- -- 0.5 mA -- -- 15.0 retaining voltage Allowable output low current (per pin) except port 9 P90 to P93 Rev. 3.00 Aug 23, 2006 Page 534 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Values Item Symbol Applicable Pins Allowable IOL Output pins output low Test Condition Min. Typ. Max. Unit -- -- 20.0 mA -- -- 60.0 VCC = 2.7 to 3.6 V -- -- 2.0 VCC = 1.8 to 3.6 V -- -- 0.2 -- -- 10.0 Notes except port 9 current (total) Port 9 -IOH Allowable All output pins mA output high current (per pin) - IOH Allowable All output pins mA output high current (total) Notes: 1. Pin states during current measurement. RES Other LCD Power Mode Pin Internal State Pins Supply Oscillator Pins Active (high-speed) VCC Only CPU operates VCC Halted System clock oscillator: mode (IOPE1) crystal resonator On-chip WDT oscillator is off Active (medium-speed) Subclock oscillator: mode (IOPE2) Pin X1 = GND Sleep mode VCC Only on-chip timers operate VCC Halted VCC Halted On-chip WDT oscillator is off Subactive mode VCC Only CPU operates Subsleep mode VCC Only on-chip timers operate, System clock oscillator: crystal resonator On-chip WDT oscillator is off VCC Halted Only time base operates, CPU VCC Halted CPU stops Subclock oscillator: crystal resonator On-chip WDT oscillator is off Watch mode VCC stops On-chip WDT oscillator is off TCSRWD1 (WDON) = 0 Standby mode VCC CPU and timers both stop VCC Halted System clock oscillator: crystal resonator On-chip WDT oscillator is off Subclock oscillator: TCSRWD1 (WDON) = 0 Pin X1 = GND (32KSTOP = 0) 2. Excludes current in pull-up MOS transistors and output buffers. 3. Except for the package for the TLP-85V. Rev. 3.00 Aug 23, 2006 Page 535 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.4.3 AC Characteristics Table 25.14 lists the control signal timing, table 25.15 lists the serial interface timing, and table 2 25.16 lists the I C bus interface timing. Table 25.14 Control Signal Timing VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Applicable Values Reference Item Symbol Pins Test Condition Min. Typ. Max. Unit System clock oscillation frequency fOSC OSC1, OSC2 VCC = 2.7 to 3.6 V 2.0 -- 10.0 MHz VCC = 1.8 to 3.6 V 2.0 -- 4.2 On-chip oscillator is used VCC = 2.7 to 3.6 V 1.0 -- 10 On-chip oscillator is used VCC = 1.8 to 2.7 V 0.5 -- 4.2 VCC = 2.7 to 3.6 V 100 -- 500 (1000) VCC = 1.8 to 3.6 V 238 -- 500 (1000) On-chip oscillator is used VCC = 2.7 to 3.6 V 100 -- 1000 On-chip oscillator is used VCC = 1.8 to 2.7 V 238 -- 2000 1 -- 64 tOSC -- -- 64 s On-chip oscillator oscillation frequency ROSC OSC clock (OSC) cycle tOSC time OSC1, OSC2 On-chip oscillator tROSC clock (ROSC) cycle time Figure 4 * ns Figure 25.2 2 * *4 System clock () cycle time tcyc Subclock oscillation frequency fW X1, X2 -- 32.768 -- or 38.4 kHz Figure 25.7 Watch clock (W) cycle tW time X1, X2 -- 30.5 or -- 26.0 s Figure 25.2 2 -- 8 tW *1 2 -- -- tcyc tsubcyc Subclock (SUB) cycle time tsubcyc Instruction cycle time Rev. 3.00 Aug 23, 2006 Page 536 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Applicable Item Symbol Oscillation stabilization trc time tCPH Test Condition Min. Typ. Max. Unit OSC1, OSC2 Crystal resonator VCC = 2.7 to 3.6 V -- 0.8 2.0 ms Crystal resonator VCC = 2.2 to 3.6 V -- 1.2 3.0 Ceramic resonator VCC = 2.2 to 3.6 V -- 20 45 Ceramic resonator Other than above -- 80 -- Other than above -- -- 50 ms On-chip oscillator is used -- -- 100 s * s Figure 5.7 ns Figure 25.2 OSC1 VCC = 2.2 to 3.6 V -- -- 2.0 Other than above -- 4 -- VCC = 2.7 to 3.6 V 40 -- -- VCC = 1.8 to 3.6 V X1 External clock low width tCPL OSC1 VCC = 2.7 to 3.6 V VCC = 1.8 to 3.6 V tCPr RES pin low width tREL -- -- 15.26 or 13.02 -- s 40 -- -- ns -- -- 15.26 or 13.02 -- s VCC = 2.7 to 3.6 V -- -- 10 ns VCC = 1.8 to 3.6 V -- -- 24 -- -- 55.0 ns VCC = 2.7 to 3.6 V -- -- 10 ns VCC = 1.8 to 3.6 V -- -- 24 X1 -- -- 55.0 ns RES 10 -- -- tcyc X1 External clock fall time tCPf 95 -- 95 OSC1 OSC1 Figure s -- X1 External clock rise time Reference Pins X1, X2 External clock high width Values 4 Figure 25.2 Figure 25.2 Figure 25.2 Figure 25.3*3 Rev. 3.00 Aug 23, 2006 Page 537 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Applicable Item Symbol Pins Input pin high width tIH IRQ0, IRQ1, NMI, IRQ3, IRQ4, IRQAEC, WKP0 to WKP7, TMIF, ADTRG Input pin low width tIL Test Condition Typ. Figure Unit Figure 2 -- -- tcyc tsubcyc Figure 25.4 VCC = 2.7 to 3.6 V 50 -- -- ns VCC = 1.8 to 3.6 V 110 -- -- TCLKA, TCLKB, Single edge specified TCLKC, TIOCA1, TIOCB1, TIOCA2, TIOCB2 1.5 -- -- Both edges specified 2.5 -- -- 2 -- 50 IRQ0, IRQ1, NMI, IRQ3, IRQ4, IRQAEC, WKP0 to WKP7, TMIF, ADTRG AEVL, AEVH VCC = 2.7 to 3.6 V VCC = 1.8 to 3.6 V tTCKWL Notes: 1. 2. 3. 4. Reference Min. AEVL, AEVH tTCKWH Values tcyc Figure 25.7 -- tcyc tsubcyc Figure 25.4 -- -- ns 110 -- -- TCLKA, TCLKB, Single edge specified TCLKC, TIOCA1, TIOCB1, TIOCA2, TIOCB2 1.5 -- -- Both edges specified 2.5 -- -- tcyc Figure 25.7 Selected with the SA1 and SA0 bits in the system control register 2 (SYSCR2). The value in parentheses is tOSC (max.) when an external clock is used. For details on the power-on reset characteristics, refer to table 25.20 and figure 25.1. Characteristics vary due to variations in factors such as temperature, power supply voltage, and production lot. When designing the system, give due consideration to the actual usage conditions. For actual data on this product, please contact a Renesas representative. Rev. 3.00 Aug 23, 2006 Page 538 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Table 25.15 Serial Interface Timing VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Values Item Input clock cycle Symbol Asynchronous Test Condition tscyc Clocked Reference Min. Typ. Max. Unit Figure 4 -- -- tcyc or tsubcyc Figure 25.5 6 -- -- 0.4 -- 0.6 tscyc Figure 25.5 -- 1 tcyc or tsubcyc Figure 25.6 -- -- ns Figure 25.6 -- -- ns Figure 25.6 synchronous Input clock pulse width tSCKW Transmit data delay time tTXD (clocked synchronous) Receive data setup time tRXS 238 (clocked synchronous) VCC = 2.7 to 3.6 V Receive data hold time tRXH 100 238 (clocked synchronous) VCC = 2.7 to 3.6 V 100 Rev. 3.00 Aug 23, 2006 Page 539 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 2 Table 25.16 I C Bus Interface Timing VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = 0.0 V, Ta = -20 to +75C, unless otherwise specified. Test Item Symbol SCL input cycle time Condition Values Reference Min. Typ. Max. Unit Figure tSCL 12tcyc + 600 -- -- ns Figure 25.8 SCL input high width tSCLH 3tcyc + 300 -- -- ns SCL input low width tSCLL 5tcyc + 300 -- -- ns SCL and SDA input fall time tSf -- -- 300 ns SCL and SDA input spike pulse removal time tSP -- -- 1tcyc ns SDA input bus-free time tBUF 5tcyc -- -- ns Start condition input hold time tSTAH 3tcyc -- -- ns Retransmission start condition input setup time tSTAS 3tcyc -- -- ns Setup time for stop condition tSTOS input 3tcyc -- -- ns Data-input setup time tSDAS 1tcyc + 20 -- -- ns Data-input hold time tSDAH 0 -- -- ns Capacitive load of SCL and SDA Cb 0 -- 400 pF SCL and SDA output fall time tSf -- -- 300 ns Rev. 3.00 Aug 23, 2006 Page 540 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.4.4 A/D Converter Characteristics Table 25.17 lists the A/D converter characteristics. Table 25.17 A/D Converter Characteristics VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Applicable Item Symbol Pins Values Test Condition Min. Typ. Max. Unit Notes * 1 * 2 Analog power supply voltage AVCC AVCC 1.8 -- 3.6 V Analog input voltage AVIN AN0 to AN2 -0.3 -- AVCC + 0.3 V AIOPE AVCC AISTOP1 AVCC Analog power supply current AVCC = 3.0 V -- -- 1.0 mA -- 600 -- A Reference value AISTOP2 AVCC -- -- 5 A Analog input capacitance CAIN AN0 to AN7 -- -- 15.0 pF Allowable signal source impedance RAIN -- -- 10.0 k -- -- 10 Bits AVCC = 2.7 V to 3.6 V VCC = 2.7 V to 3.6 V -- -- 3.5 LSB AVCC = 2.0 V to 3.6 V VCC = 2.0 V to 3.6 V -- -- 5.5 Other than above -- -- 7.5 -- -- 0.5 LSB AVCC = 2.7 V to 3.6 V VCC = 2.7 V to 3.6 V -- -- 4.0 LSB AVCC = 2.0 V to 3.6 V VCC = 2.0 V to 3.6 V -- -- 6.0 Other than above -- -- 8.0 Resolution (data length) Nonlinearity error Quantization error Absolute accuracy 3 * 4 * 4 * Rev. 3.00 Aug 23, 2006 Page 541 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Applicable Item Symbol Pins Conversion time Values Test Condition Min. Typ. Max. Unit AVCC = 2.7 V to 3.6 V VCC = 2.7 V to 3.6 V 6.2 -- 124 s AVCC = 2.2 V to 3.6 V VCC = 2.2 V to 3.6 V 14.7 -- 124 Other than above 31 -- 124 Notes Notes: 1. Set AVCC = VCC when the A/D converter is not used. 2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle. 3. AISTOP2 is the current at a reset and in standby, watch, subactive, and subsleep modes while the A/D converter is idle. 4. Conversion time = 31 s Rev. 3.00 Aug 23, 2006 Page 542 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.4.5 A/D Converter Characteristics Table 25.18 lists the A/D converter characteristics. Table 25.18 A/D Converter Characteristics VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Values Applicable Item Symbol Pins Analog power supply DVcc DVcc DIOPE DVcc Test Condition Min. Typ. Max. Unit Notes 2.2/2.7 3.6 V *1 *8 2.0 mA voltage Analog power supply current PGA not used, DISTOP1 DVcc DVcc = 3.0 V, fOVS = 2.0 MHz Reference value BGR = OFF, 0.1 A *2 Reference value DISTOP2 DVcc 0.1 A *3 Reference value Resolution Oversampling frequency fOVS DVcc = 2.2 to 3.6 V, 14 14 14 Bits 0.25 4.2 MHz 0.25 10 MHz 0.78 13.125 kHz 0.78 31.25 kHz 76.19 1280 s 32.0 1280 s -- 3.0 -- LSB -- -7.0 -- Vcc = 2.2 to 3.6 V DVcc = 2.7 to 3.6 V, Vcc = 2.7 to 3.6 V Sampling frequency fS DVcc = 2.2 to 3.6 V, Vcc = 2.2 to 3.6 V DVcc = 2.7 to 3.6 V, Vcc = 2.7 to 3.6 V Conversion speed DVcc = 2.2 to 3.6 V, Vcc = 2.2 to 3.6 V DVcc = 2.7 to 3.6 V, Vcc = 2.7 to 3.6 V Integral lineality error PGA bypass *7 (DVcc = 3.0 V, Vref = 2.7 V, conversion speed = 32 s)* 6 Rev. 3.00 Aug 23, 2006 Page 543 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics Values Applicable Item Symbol Pins Test Condition Min. Typ. Max. Unit Notes Differential lineality PGA bypass -- 1.3 -- LSB *7 error (DVcc = 3.0 V, -- -0.8 -- -- 10 -- mV * 7 -- 28.0 -- mV * 7 -- 1/3 -- V/V -- 1 -- V/V -- 2 -- V/V -- 4 -- V/V -- 6 -- mV -- 7 -- mV -- -20 -- mV -- -44 -- mV REF -- 1.17 -- V Vref 0.2 DVcc -- Vref = 2.7 V, conversion speed = 32 s)*6 Offset error PGA bypass (DVcc = 3.0 V, Vref = 2.7 V, conversion speed = 32 s)* 6 Full scale error PGA bypass (DVcc = 3.0 V, Vref = 2.7 V, conversion speed = 32 s)* 6 PGA gain PGA gain error Tad PGA = 1/3, *7 DVcc = 3.0 V PGA = 1, DVcc = 3.0 V PGA = 2, DVcc = 3.0 V PGA = 4, DVcc = 3.0 V Internal reference voltage External reference voltage Rev. 3.00 Aug 23, 2006 Page 544 of 616 REJ09B0182-0300 0.9 DVcc V *4 *5 Section 25 Electrical Characteristics Values Applicable Item Symbol Pins Test Condition Min. Typ. Analog data input Ain Ain1, Ain2 PGA = 1/3 0.6 -- Max. Unit 2.7 Vref V Notes (2.7 Vref voltage < DVcc) 2.7 REF (2.7 REF < DVcc) PGA = 1, bypass 0.2 -- Vref V REF PGA = 2 0.1 -- 0.5 Vref V 0.5 REF PGA = 4 0.05 -- 0.25 Vref V 0.25 REF Operating temperature Ta 0 -- 50 C Notes: 1. Set DV = V when the A/D converter is not used. 2. DISTOP1 is the current in active and sleep modes while the A/D converter is idle. 3. DISTOP2 is the current at a reset and in standby, watch, subactive, and subsleep modes while the A/D converter is idle. 4. BGR stabilization time = 150 s (Ta = 25C, V = 3.0 V) The BGR stabilization time is started after setting bit 7 (BTRSTPN) in BGR control register (BGRMR) to 1. The stabilization time may vary due to factors such as the capacitance connected to the REF pin, so careful evaluation is necessary. 5. Before using the system, the internal reference value must be tested because there is dispersion in sample data. 6. This is the value when the BGR is not used. 7. The error for each item varies depending on factors such as temperature, voltage, conversion time, and sample variation. It is therefore necessary to perform careful evaluation under actual usage conditions. cc cc cc Rev. 3.00 Aug 23, 2006 Page 545 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.4.6 LCD Characteristics Table 25.19 shows the LCD characteristics. Table 25.19 LCD Characteristics VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified. Values Applicable Item Symbol Pins Test Condition Min. Typ. Max. Unit Notes Segment driver drop VDS SEG1 to ID = 2 A -- -- 0.6 V * SEG32 V1 = 2.7 V to 3.6 V COM1 to ID = 2 A -- -- 0.3 V *1 COM4 V1 = 2.7 V to 3.6 V 1.5 3.0 7.0 M 2.2 -- 3.6 V *2 voltage Common driver drop VDC voltage LCD power supply split- RLCD Between V1 and VSS 1 resistance LCD display voltage VLCD V1 V3 power supply VLCD3 V3 Between V3 and VSS 0.9 1.0 1.1 V *3*4 VLCD2 V2 Between V2 and VSS -- 2.0 -- V *3*4 -- V ** -- A Reference voltage V2 power supply (VLCD3 x voltage 2) V1 power supply VLCD1 V1 Between V1 and VSS -- 3.0 3 4 (VLCD3 x voltage 3) 3-V constant voltage ILCD Vcc LCD power supply circuit current VCC = 3.0 V -- 20 4 5 Booster clock: value* * 125 kHz consumption Notes: 1. The voltage drop from power supply pins V1, V2, V3, and VSS to each segment pin or common pin. 2. When the LCD display voltage is supplied from an external power source, ensure that the following relationship is maintained: V1 V2 V3 VSS. 3. The value when the LCD power supply split-resistor is separated and 3-V constant voltage power supply circuit is driven. 4. For details on the register (BGRMR) setting range when the voltage of the V3 pin is set to 1.0 V, refer to section 20.3.5, BGR Control Register (BGRMR). 5. Includes the current consumption of the band-gap reference circuit (BGR) (operation). Rev. 3.00 Aug 23, 2006 Page 546 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.4.7 Power-On Reset Circuit Characteristics Table 25.20 lists the power-on reset circuit characteristics. Table 25.20 Power-On Reset Circuit Characteristics VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, Ta = -20 to +75C (regular specifications), Ta = -40 to +85C (wide-range specifications), unless otherwise specified. Values Item Symbol Reset voltage Power supply rise time Test Condition Reference Min. Typ. Max. Unit Figure V_rst 0.7Vcc 0.8Vcc 0.9Vcc V Figure 25.1 t_vtr The Vcc rise time should be shorter than half the RES rise time. Reset count time t_out Count start time t_cr 0.8 -- 4.0 s Adjustable by the value of the external capacitor of the RES pin. On-chip pull-up resistance Rp Vcc = 3.0 V 60 100 -- k Figure 22.1 t_vtr Vcc t_vtr x 2 RES V_rst Internal reset signal t_cr t_out (eight states) Figure 25.1 Power-On Reset Circuit Reset Timing Rev. 3.00 Aug 23, 2006 Page 547 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.4.8 Watchdog Timer Characteristics Table 25.21 Watchdog Timer Characteristics VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, VSS = AVSS = 0.0 V, Ta = -20 to +75C (regular specifications), Ta = -40 to +85C (wide-range specifications), unless otherwise specified. Applicable Item Symbol WDT on-chip oscillator tovf Values Pins Test Condition Min. Typ. Max. Unit 0.2 0.4 -- s overflow time 25.5 Operation Timing Figures 25.2 to 25.7 show operation timings. t OSC, tw V IH OSC1 x1 V IL t CPH t CPL t CPr t CPf Figure 25.2 Clock Input Timing RES V IL t REL Figure 25.3 RES Low Width Timing Rev. 3.00 Aug 23, 2006 Page 548 of 616 REJ09B0182-0300 Notes Section 25 Electrical Characteristics NMI, IRQ0, IRQ1, IRQ3, V IRQ4,TMIF, ADTRG, WKP0 to WKP7, IRQAEC, AEVL, AEVH V IH IL t IL t IH Figure 25.4 Input Timing t SCKW SCK31 SCK32 t scyc Figure 25.5 SCK3 Input Clock Timing Rev. 3.00 Aug 23, 2006 Page 549 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics t scyc SCK31 SCK32 VIH or VOH* VIL or VOL* t TXD VOH* VOL* TXD31 TXD32 (transmit data) t RXS t RXH RXD31 RXD32 (receive data) Note: * Output timing reference levels Output high VOH = 1/2 Vcc + 0.2 V Output low VOL = 0.8 V Load conditions are shown in figure 25.9. Figure 25.6 SCI3 Input/Output Timing in Clocked Synchronous Mode TCLKA to TCLKC tTCKWL tTCKWH Figure 25.7 Clock Input Timing for TCLKA to TCLKC Pins Rev. 3.00 Aug 23, 2006 Page 550 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics VIH SDA VIL tBUF tSTAH tSCLH tSP tSTAS tSTOS SCL P* S* tSf Sr* tSCLL P* tSDAS tSr tSCL tSDAH Note: * S, P, and Sr represent the following: S: Start condition P: Stop condition Sr: Retransmission start condition 2 Figure 25.8 I C Bus Interface Input/Output Timing 25.6 Output Load Circuit VCC 2.4 k LSI output pin 30 pF 12 k Figure 25.9 Output Load Condition Rev. 3.00 Aug 23, 2006 Page 551 of 616 REJ09B0182-0300 Section 25 Electrical Characteristics 25.7 Recommended Resonator Table 25.22 Recommended Crystal Resonators Frequency (MHz) Manufacturer Product Type 4.194 Kyocera Kinseki Corporation HC-491U-S 10 Kyocera Kinseki Corporation HC-491U-S Table 25.23 Recommended Ceramic Resonators Frequency (MHz) Manufacturer Product Type 2 Murata Manufacturing Co., Ltd. CSTCC2M00G53-B0 Murata Manufacturing Co., Ltd. CSTCC2M00G56-B0 Murata Manufacturing Co., Ltd. CSTLS4M19G53-B0 Murata Manufacturing Co., Ltd. CSTLS4M19G56-B0 Murata Manufacturing Co., Ltd. CSTLS10M0G53-B0 Murata Manufacturing Co., Ltd. CSTLS10M0G56-B0 4.194 10 25.8 Usage Note The F-ZTAT and masked ROM versions satisfy the electrical characteristics shown in this manual, but actual electrical characteristic values, operating margins, noise margins, and other properties may vary due to differences in manufacturing process, on-chip ROM, layout patterns, and so on. When system evaluation testing is carried out using the F-ZTAT version, the same evaluation testing should also be conducted for the masked ROM version when changing over to that version. Rev. 3.00 Aug 23, 2006 Page 552 of 616 REJ09B0182-0300 Appendix Appendix A. Instruction Set A.1 Instruction List Condition Code Symbol Description Rd General destination register Rs General source register Rn General register ERd General destination register (address register or 32-bit register) ERs General source register (address register or 32-bit register) ERn General register (32-bit register) (EAd) Destination operand (EAs) Source operand PC Program counter SP Stack pointer CCR Condition-code register N N (negative) flag in CCR Z Z (zero) flag in CCR V V (overflow) flag in CCR C C (carry) flag in CCR disp Displacement Transfer from the operand on the left to the operand on the right, or transition from the state on the left to the state on the right + Addition of the operands on both sides - Subtraction of the operand on the right from the operand on the left x Multiplication of the operands on both sides / Division of the operand on the left by the operand on the right Logical AND of the operands on both sides Logical OR of the operands on both sides Logical exclusive OR of the operands on both sides Rev. 3.00 Aug 23, 2006 Page 553 of 616 REJ09B0182-0300 Appendix Symbol Description NOT (logical complement) ( ), < > Contents of operand Note: General registers include 8-bit registers (R0H to R7H and R0L to R7L) and 16-bit registers (R0 to R7 and E0 to E7). Symbol Description Condition Code Notation (cont) Changed according to execution result * Undetermined (no guaranteed value) 0 Cleared to 0 1 Set to 1 -- Not affected by execution of the instruction Varies depending on conditions, described in notes Rev. 3.00 Aug 23, 2006 Page 554 of 616 REJ09B0182-0300 Appendix Table A.1 Instruction Set 1. Data Transfer Instructions Condition Code MOV.B @(d:16, ERs), Rd B 4 @(d:16, ERs) Rd8 -- -- MOV.B @(d:24, ERs), Rd B 8 @(d:24, ERs) Rd8 -- -- MOV.B @ERs+, Rd B @ERs Rd8 ERs32+1 ERs32 -- -- MOV.B @aa:8, Rd B 2 @aa:8 Rd8 -- -- MOV.B @aa:16, Rd B 4 @aa:16 Rd8 -- -- MOV.B @aa:24, Rd B 6 @aa:24 Rd8 -- -- MOV.B Rs, @ERd B Rs8 @ERd -- -- MOV.B Rs, @(d:16, ERd) B 4 Rs8 @(d:16, ERd) -- -- MOV.B Rs, @(d:24, ERd) B 8 Rs8 @(d:24, ERd) -- -- MOV.B Rs, @-ERd B ERd32-1 ERd32 Rs8 @ERd -- -- MOV.B Rs, @aa:8 B 2 Rs8 @aa:8 -- -- MOV.B Rs, @aa:16 B 4 Rs8 @aa:16 -- -- MOV.B Rs, @aa:24 B 6 Rs8 @aa:24 -- -- MOV.W #xx:16, Rd W 4 #xx:16 Rd16 -- -- MOV.W Rs, Rd W Rs16 Rd16 -- -- MOV.W @ERs, Rd W @ERs Rd16 -- -- 2 2 2 2 2 2 MOV.W @(d:16, ERs), Rd W 4 @(d:16, ERs) Rd16 -- -- MOV.W @(d:24, ERs), Rd W 8 @(d:24, ERs) Rd16 -- -- @ERs Rd16 ERs32+2 @ERd32 -- -- MOV.W @ERs+, Rd W MOV.W @aa:16, Rd W 4 @aa:16 Rd16 -- -- MOV.W @aa:24, Rd W 6 @aa:24 Rd16 -- -- MOV.W Rs, @ERd W Rs16 @ERd -- -- 2 2 MOV.W Rs, @(d:16, ERd) W 4 Rs16 @(d:16, ERd) -- -- MOV.W Rs, @(d:24, ERd) W 8 Rs16 @(d:24, ERd) -- -- 0 -- 0 -- 0 -- Advanced -- -- B @ERs Rd8 MOV.B @ERs, Rd 2 -- -- B C 0 -- Rs8 Rd8 MOV.B Rs, Rd V Z I N -- -- H #xx:8 Rd8 Normal -- @@aa @(d, PC) Operation @aa @-ERn/@ERn+ @(d, ERn) @ERn 2 Rn B No. of States*1 MOV MOV.B #xx:8, Rd #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 0 -- 2 0 -- 4 0 -- 6 0 -- 10 0 -- 6 4 0 -- 6 0 -- 8 0 -- 4 0 -- 6 0 -- 10 0 -- 6 4 0 -- 6 0 -- 8 0 -- 4 0 -- 2 0 -- 4 0 -- 6 0 -- 10 0 -- 6 6 0 -- 8 0 -- 4 0 -- 6 0 -- 10 Rev. 3.00 Aug 23, 2006 Page 555 of 616 REJ09B0182-0300 Appendix No. of States*1 Condition Code -- -- @(d:24, ERs) ERd32 -- -- @ERs ERd32 ERs32+4 ERs32 -- -- 6 @aa:16 ERd32 -- -- 8 @aa:24 ERd32 -- -- ERs32 @ERd -- -- ERs32 @(d:16, ERd) -- -- ERs32 @(d:24, ERd) -- -- ERd32-4 ERd32 ERs32 @ERd -- -- 6 ERs32 @aa:16 -- -- 8 ERs32 @aa:24 -- -- 0 -- 0 -- POP POP.W Rn W 2 @SP Rn16 SP+2 SP -- -- POP.L ERn L 4 @SP ERn32 SP+4 SP -- -- 0 -- PUSH PUSH.W Rn W 2 SP-2 SP Rn16 @SP -- -- 0 -- PUSH.L ERn L 4 SP-4 SP ERn32 @SP -- -- 0 -- MOVFPE MOVFPE @aa:16, Rd B 4 Cannot be used in this LSI Cannot be used in this LSI MOVTPE MOVTPE Rs, @aa:16 B 4 Cannot be used in this LSI Cannot be used in this LSI W MOV.W Rs, @aa:16 W MOV.W Rs, @aa:24 W MOV.L #xx:32, ERd L MOV.L ERs, ERd L MOV.L @ERs, ERd L MOV.L @(d:16, ERs), ERd L 6 MOV.L @(d:24, ERs), ERd L 10 MOV.L @ERs+, ERd L MOV.L @aa:16, ERd L MOV.L @aa:24, ERd L MOV.L ERs, @ERd L MOV.L ERs, @(d:16, ERd) L 6 MOV.L ERs, @(d:24, ERd) L 10 MOV.L ERs, @-ERd L MOV.L ERs, @aa:16 L MOV.L ERs, @aa:24 L 2 6 2 4 4 4 Rev. 3.00 Aug 23, 2006 Page 556 of 616 REJ09B0182-0300 4 Advanced @(d:16, ERs) ERd32 -- -- @ERs ERd32 -- -- ERs32 ERd32 -- -- #xx:32 ERd32 0 -- -- -- -- -- Rs16 @aa:24 Rs16 @aa:16 6 C 4 V Z I N -- -- H ERd32-2 ERd32 Rs16 @ERd 0 -- MOV MOV.W Rs, @-ERd Normal -- @@aa @(d, PC) Operation @aa @-ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 6 6 0 -- 8 0 -- 6 0 -- 2 0 -- 8 0 -- 10 0 -- 14 0 -- 10 10 0 -- 12 0 -- 8 0 -- 10 0 -- 14 0 -- 10 10 0 -- 12 0 -- 6 10 6 10 Appendix 2. Arithmetic Instructions No. of States*1 Condition Code Z V C -- (2) ERd32+ERs32 ERd32 -- (2) (3) Rd16+Rs16 Rd16 -- (1) ERd32+#xx:32 ERd32 2 Rd8+#xx:8 +C Rd8 -- 2 B 2 Rd8+Rs8 +C Rd8 -- ADDS ADDS.L #1, ERd L 2 ERd32+1 ERd32 -- -- -- -- -- -- 2 ADDS.L #2, ERd L 2 ERd32+2 ERd32 -- -- -- -- -- -- 2 ADDS.L #4, ERd L 2 ERd32+4 ERd32 -- -- -- -- -- -- 2 INC.B Rd B 2 Rd8+1 Rd8 -- -- INC.W #1, Rd W 2 Rd16+1 Rd16 -- -- INC.W #2, Rd W 2 Rd16+2 Rd16 -- -- INC.L #1, ERd L 2 ERd32+1 ERd32 -- -- INC.L #2, ERd L 2 ERd32+2 ERd32 -- -- DAA DAA Rd B 2 Rd8 decimal adjust Rd8 -- * SUB SUB.B Rs, Rd B 2 SUB.W #xx:16, Rd W 4 SUB.W Rs, Rd W SUB.L #xx:32, ERd L SUB.L ERs, ERd L ADD.W Rs, Rd W ADD.L #xx:32, ERd L ADD.L ERs, ERd L ADDX ADDX.B #xx:8, Rd ADDX.B Rs, Rd 6 2 2 Rd8-Rs8 Rd8 -- Rd16-#xx:16 Rd16 -- (1) Rd16-Rs16 Rd16 -- (1) (3) 2 4 2 6 2 -- 2 -- 2 -- 2 -- 2 -- 2 * -- 2 -- SUBS SUBS.L #1, ERd L 2 ERd32-1 ERd32 -- -- -- -- -- -- 2 SUBS.L #2, ERd L 2 ERd32-2 ERd32 -- -- -- -- -- -- 2 SUBS.L #4, ERd L 2 ERd32-4 ERd32 -- -- -- -- -- -- 2 B 2 Rd8-1 Rd8 -- -- DEC.W #1, Rd W 2 Rd16-1 Rd16 -- -- DEC.W #2, Rd W 2 Rd16-2 Rd16 -- -- 2 ERd32-ERs32 ERd32 -- (2) Rd8-#xx:8-C Rd8 -- 2 (3) (3) DEC DEC.B Rd ERd32-#xx:32 ERd32 -- (2) 6 Rd8-Rs8-C Rd8 SUBX.B Rs, Rd B 2 SUBX SUBX.B #xx:8, Rd 2 2 B INC B 2 W 4 ADD.W #xx:16, Rd 2 B ADD.B Rs, Rd ADD ADD.B #xx:8, Rd -- (1) Rd16+#xx:16 Rd16 2 -- Rd8+Rs8 Rd8 -- Advanced N I Rd8+#xx:8 Rd8 Normal H -- @@aa @(d, PC) Operation @aa @-ERn/@ERn+ @(d, ERn) 2 @ERn B Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 4 2 6 2 2 2 -- 2 -- 2 -- 2 Rev. 3.00 Aug 23, 2006 Page 557 of 616 REJ09B0182-0300 Appendix No. of States*1 Condition Code Advanced V C ERd32-1 ERd32 -- -- L 2 ERd32-2 ERd32 -- -- -- 2 DAS.Rd B 2 Rd8 decimal adjust Rd8 -- * 2 DEC.L #2, ERd -- * -- 2 B 2 Rd8 x Rs8 Rd16 (unsigned multiplication) -- -- -- -- -- -- 14 W 2 Rd16 x Rs16 ERd32 (unsigned multiplication) -- -- -- -- -- -- 22 B 4 Rd8 x Rs8 Rd16 (signed multiplication) -- -- W 4 Rd16 x Rs16 ERd32 (signed multiplication) -- -- B 2 W DIVXU DIVXU. B Rs, Rd DIVXU. W Rs, ERd DIVXS DIVXS. B Rs, Rd DIVXS. W Rs, ERd CMP CMP.B #xx:8, Rd 16 -- -- 24 Rd16 / Rs8 Rd16 (RdH: remainder, RdL: quotient) (unsigned division) -- -- (6) (7) -- -- 14 2 ERd32 / Rs16 ERd32 (Ed: remainder, Rd: quotient) (unsigned division) -- -- (6) (7) -- -- 22 B 4 Rd16 / Rs8 Rd16 (RdH: remainder, RdL: quotient) (signed division) -- -- (8) (7) -- -- 16 W 4 ERd32 / Rs16 ERd32 (Ed: remainder, Rd: quotient) (signed division) -- -- (8) (7) -- -- 24 Rd8-#xx:8 -- Rd8-Rs8 -- Rd16-#xx:16 -- (1) Rd16-Rs16 -- (1) ERd32-#xx:32 -- (2) ERd32-ERs32 -- (2) B 2 CMP.B Rs, Rd B CMP.W #xx:16, Rd W 4 CMP.W Rs, Rd W CMP.L #xx:32, ERd L CMP.L ERs, ERd L 2 2 6 2 Rev. 3.00 Aug 23, 2006 Page 558 of 616 REJ09B0182-0300 MULXS. W Rs, ERd -- -- MULXS MULXS. B Rs, Rd MULXU. W Rs, ERd MULXU MULXU. B Rs, Rd DAS I Normal Z 2 N L H DEC DEC.L #1, ERd -- @@aa @(d, PC) Operation @aa @-ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 2 4 2 4 2 Appendix No. of States*1 Condition Code W 2 0-Rd16 Rd16 -- NEG.L ERd L 2 0-ERd32 ERd32 -- EXTU EXTU.W Rd W 2 0 (<bits 15 to 8> of Rd16) -- -- 0 EXTU.L ERd L 2 0 (<bits 31 to 16> of ERd32) -- -- 0 EXTS EXTS.W Rd W 2 (<bit 7> of Rd16) (<bits 15 to 8> of Rd16) -- -- EXTS.L ERd L 2 (<bit 15> of ERd32) (<bits 31 to 16> of ERd32) -- -- Advanced NEG.W Rd Normal C -- V 0-Rd8 Rd8 2 0 -- 2 2 0 -- 2 H B 0 -- 2 Z I NEG NEG.B Rd N -- @@aa @(d, PC) Operation @aa @-ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 0 -- 2 2 2 Rev. 3.00 Aug 23, 2006 Page 559 of 616 REJ09B0182-0300 Appendix 3. Logic Instructions AND.B Rs, Rd B AND.W #xx:16, Rd W 4 AND.W Rs, Rd W AND.L #xx:32, ERd L AND.L ERs, ERd L OR.B #xx:8, Rd B OR.B Rs, Rd B OR.W #xx:16, Rd W 4 OR.W Rs, Rd W OR.L #xx:32, ERd L OR.L ERs, ERd L XOR.B #xx:8, Rd B XOR.B Rs, Rd B XOR.W #xx:16, Rd W 4 XOR.W Rs, Rd W XOR.L #xx:32, ERd L XOR.L ERs, ERd L 4 ERd32ERs32 ERd32 -- -- NOT.B Rd B 2 Rd8 Rd8 -- -- NOT.W Rd W 2 Rd16 Rd16 -- -- NOT.L ERd L 2 Rd32 Rd32 -- -- Z Rd8Rs8 Rd8 -- -- Rd16#xx:16 Rd16 -- -- Rd16Rs16 Rd16 -- -- 4 2 2 2 ERd32ERs32 ERd32 -- -- Rd8#xx:8 Rd8 -- -- Rd8Rs8 Rd8 -- -- Rd16#xx:16 Rd16 -- -- Rd16Rs16 Rd16 -- -- ERd32#xx:32 ERd32 -- -- 6 4 2 2 2 ERd32ERs32 ERd32 -- -- Rd8#xx:8 Rd8 -- -- Rd8Rs8 Rd8 -- -- Rd16#xx:16 Rd16 -- -- Rd16Rs16 Rd16 -- -- ERd32#xx:32 ERd32 -- -- 6 V C Advanced I Normal -- @@aa @(d, PC) @aa N -- -- ERd32#xx:32 ERd32 -- -- 6 Rev. 3.00 Aug 23, 2006 Page 560 of 616 REJ09B0182-0300 H Rd8#xx:8 Rd8 2 Operation NOT 2 @(d, ERn) 2 @ERn B Rn #xx XOR Condition Code Operand Size OR No. of States*1 AND.B #xx:8, Rd Mnemonic AND @-ERn/@ERn+ Addressing Mode and Instruction Length (bytes) 0 -- 2 0 -- 2 0 -- 4 0 -- 2 0 -- 6 0 -- 4 0 -- 2 0 -- 2 0 -- 4 0 -- 2 0 -- 6 0 -- 4 0 -- 2 0 -- 2 0 -- 4 0 -- 2 0 -- 6 0 -- 4 0 -- 2 0 -- 2 0 -- 2 Appendix 4. Shift Instructions W 2 SHAL.L ERd L 2 SHAR SHAR.B Rd B 2 SHAR.W Rd W 2 SHAR.L ERd L 2 SHLL SHLL.B Rd B 2 SHLL.W Rd W 2 SHLL.L ERd L 2 SHLR SHLR.B Rd B 2 SHLR.W Rd W 2 SHLR.L ERd L 2 ROTXL ROTXL.B Rd B 2 ROTXL.W Rd W 2 ROTXL.L ERd L 2 B 2 ROTXR.W Rd W 2 ROTXR.L ERd L 2 ROTL ROTL.B Rd B 2 ROTL.W Rd W 2 ROTL.L ERd L 2 ROTR ROTR.B Rd B 2 ROTR.W Rd W 2 ROTR.L ERd L 2 ROTXR ROTXR.B Rd 0 MSB LSB V C -- -- -- -- -- -- C MSB -- -- LSB -- -- -- -- C 0 MSB LSB -- -- -- -- -- -- 0 C MSB LSB -- -- -- -- -- -- C -- -- MSB LSB -- -- -- -- C MSB LSB -- -- -- -- -- -- C -- -- MSB LSB -- -- -- -- C MSB LSB -- -- -- -- 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Advanced Z Normal -- @@aa @(d, PC) @aa @-ERn/@ERn+ @(d, ERn) I C N SHAL.W Rd H -- -- 2 Condition Code Operation B No. of States*1 SHAL SHAL.B Rd @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Rev. 3.00 Aug 23, 2006 Page 561 of 616 REJ09B0182-0300 Appendix 5. Bit-Manipulation Instructions B BSET #xx:3, @aa:8 B BSET Rn, Rd B BSET Rn, @ERd B BSET Rn, @aa:8 B B BCLR #xx:3, @ERd B BCLR #xx:3, @aa:8 B BCLR Rn, Rd B BCLR Rn, @ERd B BCLR Rn, @aa:8 B BNOT BNOT #xx:3, Rd B BNOT #xx:3, @ERd B BNOT #xx:3, @aa:8 B BNOT Rn, Rd B BNOT Rn, @ERd B BNOT Rn, @aa:8 B BTST BTST #xx:3, Rd B BTST #xx:3, @ERd B BTST #xx:3, @aa:8 B BTST Rn, Rd B BTST Rn, @ERd B BTST Rn, @aa:8 B BLD #xx:3, Rd B 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 H N Z V C Advanced I Normal -- @@aa @(d, PC) @aa @-ERn/@ERn+ @(d, ERn) @ERn Rn 2 Rev. 3.00 Aug 23, 2006 Page 562 of 616 REJ09B0182-0300 Condition Code Operation (#xx:3 of Rd8) 1 -- -- -- -- -- -- 2 (#xx:3 of @ERd) 1 -- -- -- -- -- -- 8 (#xx:3 of @aa:8) 1 -- -- -- -- -- -- 8 (Rn8 of Rd8) 1 -- -- -- -- -- -- 2 (Rn8 of @ERd) 1 -- -- -- -- -- -- 8 (Rn8 of @aa:8) 1 -- -- -- -- -- -- 8 (#xx:3 of Rd8) 0 -- -- -- -- -- -- 2 (#xx:3 of @ERd) 0 -- -- -- -- -- -- 8 (#xx:3 of @aa:8) 0 -- -- -- -- -- -- 8 (Rn8 of Rd8) 0 -- -- -- -- -- -- 2 (Rn8 of @ERd) 0 -- -- -- -- -- -- 8 (Rn8 of @aa:8) 0 -- -- -- -- -- -- 8 (#xx:3 of Rd8) (#xx:3 of Rd8) -- -- -- -- -- -- 2 (#xx:3 of @ERd) (#xx:3 of @ERd) -- -- -- -- -- -- 8 (#xx:3 of @aa:8) (#xx:3 of @aa:8) -- -- -- -- -- -- 8 (Rn8 of Rd8) (Rn8 of Rd8) -- -- -- -- -- -- 2 (Rn8 of @ERd) (Rn8 of @ERd) -- -- -- -- -- -- 8 (Rn8 of @aa:8) (Rn8 of @aa:8) -- -- -- -- -- -- 8 (#xx:3 of Rd8) Z -- -- -- (#xx:3 of @ERd) Z -- -- -- (#xx:3 of @aa:8) Z -- -- -- (Rn8 of @Rd8) Z -- -- -- (Rn8 of @ERd) Z -- -- -- (Rn8 of @aa:8) Z -- -- -- (#xx:3 of Rd8) C -- -- -- -- -- -- -- 2 -- -- 6 -- -- 6 -- -- 2 -- -- 6 -- -- 6 BSET #xx:3, @ERd BCLR BCLR #xx:3, Rd BLD B No. of States*1 BSET BSET #xx:3, Rd #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 Appendix B BLD #xx:3, @aa:8 B BILD BILD #xx:3, Rd BST BILD #xx:3, @ERd B BILD #xx:3, @aa:8 B BST #xx:3, Rd B BST #xx:3, @ERd B BST #xx:3, @aa:8 B BIST BIST #xx:3, Rd B BIST #xx:3, @ERd B BIST #xx:3, @aa:8 B BAND BAND #xx:3, Rd B BAND #xx:3, @ERd B BAND #xx:3, @aa:8 B BIAND BIAND #xx:3, Rd BOR B B BIAND #xx:3, @ERd B BIAND #xx:3, @aa:8 B BOR #xx:3, Rd B BOR #xx:3, @ERd B BOR #xx:3, @aa:8 B BIOR BIOR #xx:3, Rd B BIOR #xx:3, @ERd B BIOR #xx:3, @aa:8 B BXOR BXOR #xx:3, Rd B BXOR #xx:3, @ERd B BXOR #xx:3, @aa:8 B BIXOR BIXOR #xx:3, Rd B BIXOR #xx:3, @ERd B BIXOR #xx:3, @aa:8 B 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 H N Z V C (#xx:3 of @ERd) C -- -- -- -- -- 6 (#xx:3 of @aa:8) C -- -- -- -- -- (#xx:3 of Rd8) C -- -- -- -- -- (#xx:3 of @ERd) C -- -- -- -- -- (#xx:3 of @aa:8) C -- -- -- -- -- C (#xx:3 of Rd8) -- -- -- -- -- -- 2 C (#xx:3 of @ERd24) -- -- -- -- -- -- 8 C (#xx:3 of @aa:8) -- -- -- -- -- -- 8 C (#xx:3 of Rd8) -- -- -- -- -- -- 2 C (#xx:3 of @ERd24) -- -- -- -- -- -- 8 C (#xx:3 of @aa:8) -- -- -- -- -- -- 8 C(#xx:3 of Rd8) C -- -- -- -- -- 2 C(#xx:3 of @ERd24) C -- -- -- -- -- C(#xx:3 of @aa:8) C -- -- -- -- -- C (#xx:3 of Rd8) C -- -- -- -- -- C (#xx:3 of @ERd24) C -- -- -- -- -- 4 4 2 4 4 2 C (#xx:3 of @aa:8) C -- -- -- -- -- C(#xx:3 of Rd8) C -- -- -- -- -- C(#xx:3 of @ERd24) C -- -- -- -- -- C(#xx:3 of @aa:8) C -- -- -- -- -- C (#xx:3 of Rd8) C -- -- -- -- -- C (#xx:3 of @ERd24) C -- -- -- -- -- 4 4 2 4 4 2 C (#xx:3 of @aa:8) C -- -- -- -- -- C(#xx:3 of Rd8) C -- -- -- -- -- C(#xx:3 of @ERd24) C -- -- -- -- -- C(#xx:3 of @aa:8) C -- -- -- -- -- C (#xx:3 of Rd8) C -- -- -- -- -- C (#xx:3 of @ERd24) C -- -- -- -- -- 4 4 Advanced I Normal -- @@aa @(d, PC) @aa @-ERn/@ERn+ @(d, ERn) @ERn Rn Condition Code Operation BLD #xx:3, @ERd No. of States*1 BLD #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) C (#xx:3 of @aa:8) C -- -- -- -- -- 6 2 6 6 6 6 2 6 6 2 6 6 2 6 6 2 6 6 2 6 6 Rev. 3.00 Aug 23, 2006 Page 563 of 616 REJ09B0182-0300 Appendix 6. Branching Instructions Bcc No. of States*1 Condition Code BRA d:8 (BT d:8) -- 2 BRA d:16 (BT d:16) -- 4 BRN d:8 (BF d:8) -- 2 BRN d:16 (BF d:16) -- 4 BHI d:8 -- 2 BHI d:16 -- 4 BLS d:8 -- 2 BLS d:16 -- 4 BCC d:8 (BHS d:8) -- 2 BCC d:16 (BHS d:16) -- 4 BCS d:8 (BLO d:8) -- 2 BCS d:16 (BLO d:16) -- 4 BNE d:8 -- 2 BNE d:16 -- 4 BEQ d:8 -- 2 BEQ d:16 -- 4 BVC d:8 -- 2 BVC d:16 -- 4 BVS d:8 -- 2 BVS d:16 -- 4 BPL d:8 -- 2 BPL d:16 -- 4 BMI d:8 -- 2 BMI d:16 -- 4 BGE d:8 -- 2 BGE d:16 -- 4 BLT d:8 -- 2 BLT d:16 -- BGT d:8 I H N Z V C -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 -- -- -- -- -- -- 6 -- -- -- -- -- -- 4 4 -- -- -- -- -- -- 6 -- 2 Z (NV) = 0 -- -- -- -- -- -- 4 BGT d:16 -- 4 -- -- -- -- -- -- 6 BLE d:8 -- 2 Z (NV) = 1 -- -- -- -- -- -- 4 BLE d:16 -- 4 -- -- -- -- -- -- 6 Rev. 3.00 Aug 23, 2006 Page 564 of 616 REJ09B0182-0300 If condition Always is true then PC PC+d Never else next; Advanced Branch Condition Normal -- @@aa @(d, PC) Operation @aa @-ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) C Z = 0 C Z = 1 C=0 C=1 Z=0 Z=1 V=0 V=1 N=0 N=1 NV = 0 NV = 1 Appendix JMP BSR JSR RTS JMP @ERn -- JMP @aa:24 -- JMP @@aa:8 -- BSR d:8 -- BSR d:16 -- JSR @ERn -- JSR @aa:24 -- JSR @@aa:8 -- RTS -- No. of States*1 Condition Code H N Z V C Advanced I Normal -- @@aa @(d, PC) Operation @aa @-ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) PC ERn -- -- -- -- -- -- PC aa:24 -- -- -- -- -- -- PC @aa:8 -- -- -- -- -- -- 8 10 2 PC @-SP PC PC+d:8 -- -- -- -- -- -- 6 8 4 PC @-SP PC PC+d:16 -- -- -- -- -- -- 8 10 PC @-SP PC ERn -- -- -- -- -- -- 6 8 PC @-SP PC aa:24 -- -- -- -- -- -- 8 10 PC @-SP PC @aa:8 -- -- -- -- -- -- 8 12 2 PC @SP+ -- -- -- -- -- -- 8 10 2 4 2 2 4 2 4 6 Rev. 3.00 Aug 23, 2006 Page 565 of 616 REJ09B0182-0300 Appendix 7. System Control Instructions @(d:24, ERs) CCR LDC @ERs+, CCR W LDC @aa:16, CCR W 6 @aa:16 CCR LDC @aa:24, CCR W 8 @aa:24 CCR @ERs CCR ERs32+2 ERs32 4 2 Advanced Normal 10 W LDC @(d:24, ERs), CCR @(d:16, ERs) CCR 6 W LDC @(d:16, ERs), CCR @ERs CCR 4 W 10 2 LDC @ERs, CCR Rs8 CCR 2 C B V B LDC Rs, CCR Z #xx:8 CCR 2 LDC #xx:8, CCR N Transition to powerdown state H -- @@aa @(d, PC) @aa @-ERn/@ERn+ @(d, ERn) @ERn Rn -- I 2 2 6 8 12 8 8 10 CCR Rd8 2 CCR @ERd 6 6 CCR @(d:16, ERd) 8 STC CCR, @(d:24, ERd) W 10 CCR @(d:24, ERd) 12 STC CCR, @-ERd W ERd32-2 ERd32 CCR @ERd 8 STC CCR, @aa:16 W 6 CCR @aa:16 8 STC CCR, @aa:24 W 8 CCR @aa:24 10 ANDC ANDC #xx:8, CCR B 2 CCR#xx:8 CCR B 2 CCR#xx:8 CCR B 2 CCR#xx:8 CCR 2 PC PC+2 ORC ORC #xx:8, CCR XORC XORC #xx:8, CCR NOP NOP 4 -- Rev. 3.00 Aug 23, 2006 Page 566 of 616 REJ09B0182-0300 W STC CCR, @(d:16, ERd) 4 W B STC CCR, @ERd STC CCR, Rd STC CCR @SP+ PC @SP+ LDC -- SLEEP SLEEP Condition Code Operation RTE No. of States*1 RTE #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 2 2 2 Appendix 8. Block Transfer Instructions EEPMOV No. of States*1 H N Z V C Normal -- @@aa @(d, PC) I EEPMOV. B -- 4 if R4L 0 then repeat @R5 @R6 R5+1 R5 R6+1 R6 R4L-1 R4L until R4L=0 else next -- -- -- -- -- -- 8+ 4n*2 EEPMOV. W -- 4 if R4 0 then repeat @R5 @R6 R5+1 R5 R6+1 R6 R4-1 R4 until R4=0 else next -- -- -- -- -- -- 8+ 4n*2 Advanced Condition Code Operation @aa @-ERn/@ERn+ @(d, ERn) @ERn Rn #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) Notes: 1. The number of states in cases where the instruction code and its operands are located in on-chip memory is shown here. For other cases, see Appendix A.3, Number of Execution States. 2. n is the value set in register R4L or R4. (1) (2) (3) (4) (5) Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0. Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0. Retains its previous value when the result is zero; otherwise cleared to 0. Set to 1 when the adjustment produces a carry; otherwise retains its previous value. The number of states required for execution of an instruction that transfers data in synchronization with the E clock is variable. (6) Set to 1 when the divisor is negative; otherwise cleared to 0. (7) Set to 1 when the divisor is zero; otherwise cleared to 0. (8) Set to 1 when the quotient is negative; otherwise cleared to 0. Rev. 3.00 Aug 23, 2006 Page 567 of 616 REJ09B0182-0300 REJ09B0182-0300 Rev. 3.00 Aug 23, 2006 Page 568 of 616 MULXU 5 STC Table A.2 (2) LDC 3 SUBX OR XOR AND MOV C D E F BILD BIST BLD BST TRAPA BEQ B BIAND BAND AND RTE BNE CMP BIXOR BXOR XOR BSR BCS A BIOR BOR OR RTS BCC MOV.B Table A.2 (2) LDC 7 ADDX BTST DIVXU BLS AND.B ANDC 6 9 BCLR MULXU BHI XOR.B XORC 5 ADD BNOT DIVXU BRN OR.B ORC 4 8 7 BSET BRA 6 2 1 Table A.2 Table A.2 Table A.2 Table A.2 (2) (2) (2) (2) NOP 4 3 2 1 0 0 MOV BVS 9 B JMP BPL BMI MOV Table A.2 Table A.2 (2) (2) Table A.2 Table A.2 (2) (2) A Table A.2 Table A.2 EEPMOV (2) (2) SUB ADD Table A.2 (2) BVC 8 BSR BGE C CMP MOV Instruction when most significant bit of BH is 1. Instruction when most significant bit of BH is 0. E JSR BGT SUBX ADDX Table A.2 (3) BLT D BLE Table A.2 (2) Table A.2 (2) F Table A.2 AL 1st byte 2nd byte AH AL BH BL A.2 AH Instruction code: Appendix Operation Code Map Operation Code Map (1) MOV 7A BRA 58 MOV DAS 1F 79 SUBS 1B 1 CMP CMP ADD BHI 2 ADD BRN NOT 17 DEC ROTXR 13 1A ROTXL 12 DAA 0F SHLR ADDS 0B 11 INC 0A SHLL MOV 01 10 0 SUB SUB BLS OR OR XOR XOR BCS AND AND BEQ BVC SUB 9 BVS NEG NOT DEC ROTR ROTXR DEC ROTL ADDS SLEEP 8 ROTXL EXTU INC 7 SHAR BNE 6 SHLR EXTU INC 5 SHAL BCC LDC/STC 4 SHLL 3 1st byte 2nd byte AH AL BH BL BPL A MOV BMI NEG CMP SUB ROTR ROTL SHAR C D BGE BLT DEC EXTS INC Table A-2 Table A-2 (3) (3) ADD SHAL B BGT E BLE DEC EXTS INC Table A-2 (3) F Table A.2 BH AH AL Instruction code: Appendix Operation Code Map (2) Rev. 3.00 Aug 23, 2006 Page 569 of 616 REJ09B0182-0300 REJ09B0182-0300 Rev. 3.00 Aug 23, 2006 Page 570 of 616 DIVXS 3 BSET 7Faa7 * 2 BNOT BNOT BCLR BCLR Notes: 1. r is the register designation field. 2. aa is the absolute address field. BSET 7Faa6 * 2 BTST BCLR 7Eaa7 * 2 BNOT BTST BSET 7Dr07 * 1 7Eaa6 * 2 BSET 7Dr06 * 1 BTST BCLR MULXS 2 7Cr07 * 1 BNOT DIVXS 1 BTST MULXS 0 7Cr06 * 1 01F06 01D05 01C05 01406 CL BIOR BOR BIOR BOR OR 4 BIXOR BXOR BIXOR BXOR XOR 5 BIAND BAND BIAND BAND AND 6 7 BIST BILD BST BLD BIST BILD BST BLD 1st byte 2nd byte 3rd byte 4th byte AH AL BH BL CH CL DH DL 8 LDC STC 9 A LDC STC B C LDC STC D E LDC STC F Instruction when most significant bit of DH is 1. Instruction when most significant bit of DH is 0. Table A.2 AH ALBH BLCH Instruction code: Appendix Operation Code Map (3) Appendix A.3 Number of Execution States The status of execution for each instruction of the H8/300H CPU and the method of calculating the number of states required for instruction execution are shown below. Table A.4 shows the number of cycles of each type occurring in each instruction, such as instruction fetch and data read/write. Table A.3 shows the number of states required for each cycle. The total number of states required for execution of an instruction can be calculated by the following expression: Execution states = I x SI + J x SJ + K x SK + L x SL + M x SM + N x SN Examples: When instruction is fetched from on-chip ROM, and an on-chip RAM is accessed. BSET #0, @FF00 From table A.4: I = L = 2, J = K = M = N= 0 From table A.3: SI = 2, SL = 2 Number of states required for execution = 2 x 2 + 2 x 2 = 8 When instruction is fetched from on-chip ROM, branch address is read from on-chip ROM, and on-chip RAM is used for stack area. JSR @@ 30 From table A.4: I = 2, J = K = 1, L=M=N=0 From table A.3: SI = SJ = SK = 2 Number of states required for execution = 2 x 2 + 1 x 2+ 1 x 2 = 8 Rev. 3.00 Aug 23, 2006 Page 571 of 616 REJ09B0182-0300 Appendix Table A.3 Number of Cycles in Each Instruction Access Location Execution Status (Instruction Cycle) On-Chip Memory On-Chip Peripheral Module 2 -- Instruction fetch SI Branch address read SJ Stack operation SK Byte data access SL 2 or 3* Word data access SM -- Internal operation SN Note: * 1 Depends on which on-chip peripheral module is accessed. See section 24.1, Register Addresses (Address Order). Rev. 3.00 Aug 23, 2006 Page 572 of 616 REJ09B0182-0300 Appendix Table A.4 Number of Cycles in Each Instruction Instruction Mnemonic Instruction Fetch I ADD ADD.B #xx:8, Rd 1 ADD.B Rs, Rd 1 ADD.W #xx:16, Rd 2 ADD.W Rs, Rd 1 ADD.L #xx:32, ERd 3 ADD.L ERs, ERd 1 ADDS ADDS #1/2/4, ERd 1 ADDX ADDX #xx:8, Rd 1 ADDX Rs, Rd 1 AND.B #xx:8, Rd 1 AND.B Rs, Rd 1 AND.W #xx:16, Rd 2 AND.W Rs, Rd 1 AND.L #xx:32, ERd 3 AND.L ERs, ERd 2 ANDC ANDC #xx:8, CCR 1 BAND BAND #xx:3, Rd 1 BAND #xx:3, @ERd 2 1 BAND #xx:3, @aa:8 2 1 BRA d:8 (BT d:8) 2 BRN d:8 (BF d:8) 2 BHI d:8 2 BLS d:8 2 BCC d:8 (BHS d:8) 2 BCS d:8 (BLO d:8) 2 BNE d:8 2 BEQ d:8 2 BVC d:8 2 BVS d:8 2 BPL d:8 2 BMI d:8 2 BGE d:8 2 AND Bcc Branch Stack Addr. Read Operation J K Byte Data Access L Word Data Access M Internal Operation N Rev. 3.00 Aug 23, 2006 Page 573 of 616 REJ09B0182-0300 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N Bcc BLT d:8 2 BGT d:8 2 BLE d:8 2 BRA d:16(BT d:16) 2 2 BRN d:16(BF d:16) 2 2 BHI d:16 2 2 BLS d:16 2 2 BCC d:16(BHS d:16) 2 2 BCS d:16(BLO d:16) 2 2 BNE d:16 2 2 BEQ d:16 2 2 BVC d:16 2 2 BVS d:16 2 2 BPL d:16 2 2 BMI d:16 2 2 BGE d:16 2 2 BLT d:16 2 2 BGT d:16 2 2 BLE d:16 2 2 BCLR #xx:3, Rd 1 BCLR #xx:3, @ERd 2 2 BCLR #xx:3, @aa:8 2 2 BCLR Rn, Rd 1 BCLR Rn, @ERd 2 2 BCLR Rn, @aa:8 2 2 BIAND #xx:3, Rd 1 BIAND #xx:3, @ERd 2 1 BIAND #xx:3, @aa:8 2 1 BILD #xx:3, Rd 1 BILD #xx:3, @ERd 2 1 BILD #xx:3, @aa:8 2 1 BCLR BIAND BILD Rev. 3.00 Aug 23, 2006 Page 574 of 616 REJ09B0182-0300 Stack K Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N BIOR BIOR #xx:3, Rd 1 BIOR #xx:3, @ERd 2 1 BIOR #xx:3, @aa:8 2 1 BIST #xx:3, Rd 1 BIST #xx:3, @ERd 2 2 BIST #xx:3, @aa:8 2 2 BIXOR #xx:3, Rd 1 BIXOR #xx:3, @ERd 2 1 BIXOR #xx:3, @aa:8 2 1 BLD #xx:3, Rd 1 BLD #xx:3, @ERd 2 1 BLD #xx:3, @aa:8 2 1 BNOT #xx:3, Rd 1 BNOT #xx:3, @ERd 2 2 BNOT #xx:3, @aa:8 2 2 BNOT Rn, Rd 1 BNOT Rn, @ERd 2 2 BNOT Rn, @aa:8 2 2 BOR #xx:3, Rd 1 BOR #xx:3, @ERd 2 1 BOR #xx:3, @aa:8 2 1 BSET #xx:3, Rd 1 BSET #xx:3, @ERd 2 2 BSET #xx:3, @aa:8 2 2 BSET Rn, Rd 1 BSET Rn, @ERd 2 2 BSET Rn, @aa:8 2 2 BSR d:8 2 1 BSR d:16 2 1 BST #xx:3, Rd 1 BST #xx:3, @ERd 2 2 BST #xx:3, @aa:8 2 2 BIST BIXOR BLD BNOT BOR BSET BSR BST Stack K 2 Rev. 3.00 Aug 23, 2006 Page 575 of 616 REJ09B0182-0300 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N BTST BTST #xx:3, Rd 1 BTST #xx:3, @ERd 2 1 BTST #xx:3, @aa:8 2 1 BTST Rn, Rd 1 BTST Rn, @ERd 2 1 1 BXOR CMP BTST Rn, @aa:8 2 1 BXOR #xx:3, @ERd 2 1 BXOR #xx:3, @aa:8 2 1 CMP.B #xx:8, Rd 1 CMP.B Rs, Rd 1 CMP.W #xx:16, Rd 2 CMP.W Rs, Rd 1 CMP.L #xx:32, ERd 3 CMP.L ERs, ERd 1 DAA Rd 1 DAS DAS Rd 1 DEC DEC.B Rd 1 DEC.W #1/2, Rd 1 DEC.L #1/2, ERd 1 DIVXU EEPMOV EXTS EXTU K BXOR #xx:3, Rd DAA DUVXS Stack DIVXS.B Rs, Rd 2 12 DIVXS.W Rs, ERd 2 20 DIVXU.B Rs, Rd 1 12 DIVXU.W Rs, ERd 1 20 1 EEPMOV.B 2 2n+2* EEPMOV.W 2 2n+2*1 EXTS.W Rd 1 EXTS.L ERd 1 EXTU.W Rd 1 EXTU.L ERd 1 Rev. 3.00 Aug 23, 2006 Page 576 of 616 REJ09B0182-0300 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N INC INC.B Rd 1 INC.W #1/2, Rd 1 INC.L #1/2, ERd 1 JMP @ERn 2 JMP @aa:24 2 JMP @@aa:8 2 JMP JSR LDC MOV Stack K 2 1 2 JSR @ERn 2 1 JSR @aa:24 2 1 JSR @@aa:8 2 LDC #xx:8, CCR 1 LDC Rs, CCR 1 LDC@ERs, CCR 2 1 LDC@(d:16, ERs), CCR 3 1 LDC@(d:24,ERs), CCR 5 1 LDC@ERs+, CCR 2 1 LDC@aa:16, CCR 3 1 LDC@aa:24, CCR 4 1 MOV.B #xx:8, Rd 1 MOV.B Rs, Rd 1 MOV.B @ERs, Rd 1 1 MOV.B @(d:16, ERs), Rd 2 1 MOV.B @(d:24, ERs), Rd 4 1 MOV.B @ERs+, Rd 1 1 MOV.B @aa:8, Rd 1 1 MOV.B @aa:16, Rd 2 1 MOV.B @aa:24, Rd 3 1 MOV.B Rs, @Erd 1 1 MOV.B Rs, @(d:16, ERd) 2 1 MOV.B Rs, @(d:24, ERd) 4 1 MOV.B Rs, @-ERd 1 1 MOV.B Rs, @aa:8 1 1 1 2 1 2 2 2 Rev. 3.00 Aug 23, 2006 Page 577 of 616 REJ09B0182-0300 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N MOV MOV.B Rs, @aa:16 2 1 MOV.B Rs, @aa:24 3 1 MOV.W #xx:16, Rd 2 MOV.W Rs, Rd 1 MOV.W @ERs, Rd 1 1 MOV.W @(d:16,ERs), Rd 2 1 MOV.W @(d:24,ERs), Rd 4 1 MOV.W @ERs+, Rd 1 1 MOV.W @aa:16, Rd 2 1 MOV.W @aa:24, Rd 3 1 MOV.W Rs, @ERd 1 1 MOV.W Rs, @(d:16,ERd) 2 1 MOV.W Rs, @(d:24,ERd) 4 1 MOV Stack K MOV.W Rs, @-ERd 1 1 MOV.W Rs, @aa:16 2 1 MOV.W Rs, @aa:24 3 1 MOV.L #xx:32, ERd 3 MOV.L ERs, ERd 1 MOV.L @ERs, ERd 2 2 MOV.L @(d:16,ERs), ERd 3 2 MOV.L @(d:24,ERs), ERd 5 2 MOV.L @ERs+, ERd 2 2 MOV.L @aa:16, ERd 3 2 MOV.L @aa:24, ERd 4 2 MOV.L ERs,@ERd 2 2 MOV.L ERs, @(d:16,ERd) 3 2 MOV.L ERs, @(d:24,ERd) 5 2 MOV.L ERs, @-ERd 2 2 MOV.L ERs, @aa:16 3 2 4 2 MOV.L ERs, @aa:24 MOVFPE MOVFPE @aa:16, Rd* MOVTPE MOVTPE Rs,@aa:16*2 2 2 1 2 1 Rev. 3.00 Aug 23, 2006 Page 578 of 616 REJ09B0182-0300 2 2 2 2 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N MULXS MULXS.B Rs, Rd 2 12 MULXS.W Rs, ERd 2 20 MULXU.B Rs, Rd 1 12 MULXU.W Rs, ERd 1 20 NEG.B Rd 1 NEG.W Rd 1 MULXU NEG NEG.L ERd 1 NOP NOP 1 NOT NOT.B Rd 1 NOT.W Rd 1 NOT.L ERd 1 OR Stack K OR.B #xx:8, Rd 1 OR.B Rs, Rd 1 OR.W #xx:16, Rd 2 OR.W Rs, Rd 1 OR.L #xx:32, ERd 3 OR.L ERs, ERd 2 ORC ORC #xx:8, CCR 1 POP POP.W Rn 1 1 2 POP.L ERn 2 2 2 PUSH.W Rn 1 1 2 PUSH.L ERn 2 2 2 ROTL.B Rd 1 ROTL.W Rd 1 ROTL.L ERd 1 ROTR.B Rd 1 ROTR.W Rd 1 ROTR.L ERd 1 ROTXL.B Rd 1 ROTXL.W Rd 1 ROTXL.L ERd 1 PUSH ROTL ROTR ROTXL Rev. 3.00 Aug 23, 2006 Page 579 of 616 REJ09B0182-0300 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N ROTXR ROTXR.B Rd 1 ROTXR.W Rd 1 ROTXR.L ERd 1 RTE RTE 2 2 2 RTS RTS 2 1 2 SHAL SHAL.B Rd 1 SHAL.W Rd 1 SHAL.L ERd 1 SHAR.B Rd 1 SHAR.W Rd 1 SHAR.L ERd 1 SHAR SHLL SHLR SHLL.B Rd 1 SHLL.W Rd 1 SHLL.L ERd 1 SHLR.B Rd 1 SHLR.W Rd 1 Stack K SHLR.L ERd 1 SLEEP SLEEP 1 STC STC CCR, Rd 1 STC CCR, @ERd 2 1 STC CCR, @(d:16,ERd) 3 1 STC CCR, @(d:24,ERd) 5 1 STC CCR,@-ERd 2 1 STC CCR, @aa:16 3 1 STC CCR, @aa:24 4 1 SUB.B Rs, Rd 1 SUB.W #xx:16, Rd 2 SUB.W Rs, Rd 1 SUB.L #xx:32, ERd 3 SUB.L ERs, ERd 1 SUBS #1/2/4, ERd 1 SUB SUBS Rev. 3.00 Aug 23, 2006 Page 580 of 616 REJ09B0182-0300 2 Appendix Instruction Branch Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation Instruction Mnemonic I J L M N SUBX SUBX #xx:8, Rd 1 SUBX. Rs, Rd 1 XOR.B #xx:8, Rd 1 XOR.B Rs, Rd 1 XOR.W #xx:16, Rd 2 XOR.W Rs, Rd 1 XOR.L #xx:32, ERd 3 XOR.L ERs, ERd 2 XORC #xx:8, CCR 1 XOR XORC Stack K Notes: 1. n: Specified value in R4L. The source and destination operands are accessed n+1 times respectively. 2. It can not be used in this LSI. Rev. 3.00 Aug 23, 2006 Page 581 of 616 REJ09B0182-0300 Appendix A.4 Combinations of Instructions and Addressing Modes Table A.5 Combinations of Instructions and Addressing Modes -- Arithmetic operations BWL BWL WL BWL B B -- L -- BWL -- B -- BW ADD, CMP SUB ADDX, SUBX ADDS, SUBS INC, DEC DAA, DAS MULXU, MULXS, DIVXU, DIVXS NEG EXTU, EXTS Logical AND, OR, XOR operations NOT Shift operations Bit manipulations Branching BCC, BSR instructions JMP, JSR System control instructions RTS RTE SLEEP LDC STC ANDC, ORC, XORC NOP Block data transfer instructions -- -- -- -- -- -- -- -- -- -- -- B -- B -- -- -- -- -- -- -- -- -- WL -- -- -- -- -- BWL BWL -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- BWL WL BWL BWL BWL B -- -- -- -- -- -- B -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- B -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- B B -- W W -- W W -- W W -- W W -- -- -- -- W W -- W W -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Rev. 3.00 Aug 23, 2006 Page 582 of 616 REJ09B0182-0300 -- -- @@aa:8 B -- @(d:16.PC) BWL BWL BWL BWL BWL BWL -- -- -- -- -- -- -- -- -- -- -- -- @(d:8.PC) Data MOV transfer POP, PUSH instructions MOVFPE, MOVTPE @aa:24 @aa:16 @aa:8 @ERn+/@ERn @(d:24.ERn) @ERn Rn Instructions #xx Functions @(d:16.ERn) Addressing Mode -- -- BW Appendix B. I/O Ports B.1 I/O Port Block Diagrams SBY (Low at a reset or in standby mode) PUCR16 VCC P16 PDR16 VSS PCR16 Internal data bus VCC SCI4 module PDR1: Port data register 1 PCR1: Port control register 1 SCKO4 SCKI4 SCKIE SCKOE PUCR1: Port pull-up control register 1 Figure B.1 (a) Port 1 Block Diagram (P16) (F-ZTAT Version) Rev. 3.00 Aug 23, 2006 Page 583 of 616 REJ09B0182-0300 Appendix SBY PUCR16 VCC VCC P16 Internal data bus PDR16 PCR16 VSS PDR1: Port data register 1 PCR1: Port control register 1 PUCR1: Port pull-up control register 1 Figure B.1 (b) Port 1 Block Diagram (P16) (Masked ROM Version) SBY TPU module TO1AE (P12) TO1BE (P13) TO2AE (P14) TO2BE (P15) PUCR1n VCC P1n PDR1n VSS PCR1n PDR1: Port data register 1 PCR1: Port control register 1 PUCR1: Port pull-up control register 1 n = 5 to 2 Figure B.1 (c) Port 1 Block Diagram (P15 to P12) Rev. 3.00 Aug 23, 2006 Page 584 of 616 REJ09B0182-0300 Internal data bus VCC TO1A (P12) TO1B (P13) TO2A (P14) TO2B (P15) TI1A (P12) TI1B (P13) TI2A (P14) TI2B (P15) TCLKA (P12) TCLKB (P13) TCLKC (P14) Appendix SBY PUCR1n VCC VCC P1n PDR1n VSS PCR1n Internal data bus PMR1n AEC module AEVH(P10) AEVL(P11) PDR1: Port data register 1 PCR1: Port control register 1 PMR1: Port mode register 1 PUCR1: Port pull-up control register 1 n = 1, 0 Figure B.1 (d) Port 1 Block Diagram (P11, P10) Rev. 3.00 Aug 23, 2006 Page 585 of 616 REJ09B0182-0300 Appendix SBY PUCR37 VCC P37 Internal data bus VCC PDR37 VSS PCR37 SCI4 module SO4 TE4 PDR3: Port data register 3 PCR3: Port control register 3 PUCR3: Port pull-up control register 3 Figure B.2 (a) Port 3 Block Diagram (P37) (F-ZTAT Version) SBY PUCR37 VCC PDR37 P37 PCR37 VSS PDR3: Port data register 3 PCR3: Port control register 3 PUCR3: Port pull-up control register 3 Figure B.2 (b) Port 3 Block Diagram (P37) (Masked ROM Version) Rev. 3.00 Aug 23, 2006 Page 586 of 616 REJ09B0182-0300 Internal data bus VCC Appendix SBY PUCR36 VCC P36 Internal data bus VCC PDR36 VSS PCR36 SCI4 module SI RE PDR3: Port data register 3 PCR3: Port control register 3 PUCR3: Port pull-up control register 3 Figure B.2 (c) Port 3 Block Diagram (P36) (F-ZTAT Version) SBY PUCR36 VCC VCC P36 Internal data bus PDR36 PCR36 VSS PDR3: Port data register 3 PCR3: Port control register 3 PUCR3: Port pull-up control register 3 Figure B.2 (d) Port 3 Block Diagram (P36) (Masked ROM Version) Rev. 3.00 Aug 23, 2006 Page 587 of 616 REJ09B0182-0300 Appendix SBY SPC32 SCI3_2 module VCC TXD32 P32 PDR32 Internal data bus SCINV3 PCR32 VSS I2C bus 2 module ICE SCLO SCLI VSS PDR3: Port data register 3 PCR: Port control register 3 Figure B.2 (e) Port 3 Block Diagram (P32) Rev. 3.00 Aug 23, 2006 Page 588 of 616 REJ09B0182-0300 Appendix SBY SCI3_2 module VCC PDR31 VSS PCR31 Internal data bus P31 RE32 RXD32 SCINV2 VSS I2C bus 2 module ICE SDAO SDAI PDR3: Port data register 3 PCR3: Port control register 3 Figure B.2 (f) Port 3 Block Diagram (P31) Rev. 3.00 Aug 23, 2006 Page 589 of 616 REJ09B0182-0300 Appendix SBY PUCR30 VCC VCC RTC module P30 PDR30 VSS PCR30 Internal data bus PMR30 TMOW SCI3_2 module SCKIE32 SCKOE32 SCKO32 SCKI32 PDR3: Port data register 3 PCR3: Port control register 3 PMR3: Port mode register 3 PUCR3: Port pull-up control register 3 Figure B.2 (g) Port 3 Block Diagram (P30) Rev. 3.00 Aug 23, 2006 Page 590 of 616 REJ09B0182-0300 Appendix Timer F module SBY TMOFH SCINV1 VCC SPC31 SCI3_1 module P42 PDR42 PCR42 Internal data bus TXD31/IrTXD VSS PMR42 PDR4: Port data register 4 PCR4: Port contol register 4 PMR4: Port mode register 4 Figure B.3 (a) Port 4 Block Diagram (P42) Rev. 3.00 Aug 23, 2006 Page 591 of 616 REJ09B0182-0300 Appendix SBY SCI3_1 module VCC RE31 RXD31/IrRXD PMR41 P41 PCR41 VSS Internal data bus PDR41 Timer F module TMOFL PDR4: Port data register 4 SCINV0 PCR4: Port control register 4 PMR4: Port mode register 4 Figure B.3 (b) Port 4 Block Diagram (P41) Rev. 3.00 Aug 23, 2006 Page 592 of 616 REJ09B0182-0300 Appendix SBY SCI3_1 module SCKIE31 SCKOE31 VCC SCKO31 SCKI31 P40 PCR40 VSS PMR40 Internal data bus PDR40 Timer F module TMIF PDR4: Port data register 4 PCR4: Port control register 4 PMR4: Port mode register 4 Figure B.3 (c) Port 4 Block Diagram (P40) Rev. 3.00 Aug 23, 2006 Page 593 of 616 REJ09B0182-0300 Appendix SBY PUCR5n VCC VCC PMR5n P5n VSS PCR5n Internal data bus PDR5n WKPn PDR5: Port data register 5 PCR5: Port control register 5 PMR5: Port mode register 5 PUCR5: Port pull-up control register 5 n = 7 to 0 Figure B.4 Port 5 Block Diagram Rev. 3.00 Aug 23, 2006 Page 594 of 616 REJ09B0182-0300 Appendix SBY PUCR6n VCC PCR6n P6n Internal data bus PDR6n VCC VSS PDR6: Port data register 6 PCR6: Port control register 6 PUCR6: Port pull-up control register 6 n = 7 to 0 Figure B.5 Port 6 Block Diagram SBY VCC PCR7n P7n Internal data bus PDR7n VSS PDR7: Port data register 7 PCR7: Port control register 7 n = 7 to 0 Figure B.6 Port 7 Block Diagram Rev. 3.00 Aug 23, 2006 Page 595 of 616 REJ09B0182-0300 Appendix SBY PDR8n PCR8n P8n Internal data bus VCC VSS PDR8: Port data register 8 PCR8: Port control register 8 n = 7 to 0 Figure B.7 Port 8 Block Diagram SBY PDR93 PCR93 P93 VSS PDR9: Port data register 9 PCR9: Port control register 9 Figure B.8 (a) Port 9 Block Diagram (P93) Rev. 3.00 Aug 23, 2006 Page 596 of 616 REJ09B0182-0300 Internal data bus VCC Appendix SBY VCC P92 PDR92 VSS PCR92 Internal data bus PMR92 IRQ4 PDR9: Port data register 9 PCR9: Port control register 9 PMR9: Port mode register 9 Figure B.8 (b) Port 9 Block Diagram (P92) Rev. 3.00 Aug 23, 2006 Page 597 of 616 REJ09B0182-0300 Appendix PWM module SBY PWMn+1 VCC P9n Internal data bus PMR9n PDR9n VSS PCR9n PDR9: Port data register 9 PCR9: Port control register 9 PMR9: Port mode register 9 n = 1, 0 Figure B.8 (c) Port 9 Block Diagram (P91, P90) SBY VCC PCRAn PAn VSS PDRA: Port data register A PCRA: Port control register A n = 3 to 0 Figure B.9 Port A Block Diagram Rev. 3.00 Aug 23, 2006 Page 598 of 616 REJ09B0182-0300 Internal data bus PDRAn Internal data bus Appendix PBn A/D module DEC ADSSR5, ADSSR4 Ain1, Ain2 n = 7, 6 Internal data bus Figure B.10 (a) Port B Block Diagram (PB7, PB6) PB5 A/D module DEC ADCR3, ADCR2 Vref Figure B.10 (b) Port B Block Diagram (PB5) Rev. 3.00 Aug 23, 2006 Page 599 of 616 REJ09B0182-0300 Appendix PMRBn PBn Internal data bus IRQm A/D module DEC AMR3 to AMR0 VIN n = 2 to 0 m = 3, 1, 0 Figure B.10 (c) Port B Block Diagram (PB2 to PB0) Rev. 3.00 Aug 23, 2006 Page 600 of 616 REJ09B0182-0300 Appendix B.2 Port States in Each Operating State Sleep Active (High-Speed/ Port P16 to P10 (High-Speed/ Reset Medium-Speed) Subsleep High Retained Retained impedance P37, P36, High P32 to P30 impedance P42 to P40 High High Retained Retained High Retained Retained High Retained Retained High Retained Retained High Retained Retained High Retained Retained High PB2 to PB0 impedance Notes: * Retained Functioning Functioning Retained Functioning Functioning Retained Functioning Functioning Retained Functioning Functioning Retained Functioning Functioning Retained Functioning Functioning Retained Functioning Functioning Retained Functioning Functioning Retained High High impedance High High High High High High High impedance* Retained Retained High impedance* Retained Retained impedance PB7 to PB5, Functioning impedance* impedance PA3 to PA0 Functioning impedance* impedance P93 to P90 High impedance* impedance P87 to P80 Watch impedance* impedance P77 to P70 Medium-Speed) impedance* impedance P67 to P60 Subactive impedance* impedance P57 to P50 Standby High impedance* High impedance High High impedance impedance* impedance impedance Registers are retained and output level is high impedance. Rev. 3.00 Aug 23, 2006 Page 601 of 616 REJ09B0182-0300 Appendix C. Product Code Lineup Package Product Classification H8/38086R H8/38086R Group Product Code Flash memory Regular specifications HD64F38086RH4 version Wide-range Model Marking (Package Code) F38086H4 80 pin QFP (FP-80A) HD64F38086RH10 F38086H10 HD64F38086RW4 F38086W4 HD64F38086RW10 F38086W10 HD64F38086RLP4V F38086RLP4V HD64F38086RLP10V F38086RLP10V HCD64F38086RC4 -- Chip HCD64F38086RC10 -- Chip HD64F38086RH10W F38086H10 80 pin QFP (FP-80A) HD64F38086RW10W F38086R10 80 pin TQFP (TFP-80C) HD64F38086RLP10WV F38086RLP10WV 80 pin P-TFLGA 80 pin TQFP (TFP-80C) 80 pin P-TFLGA (TLP-85V) specifications (TLP-85V) Masked ROM Regular specifications HD64338086RH version 38086(***)H 80 pin QFP (FP-80A) HD64338086RW 38086(***)W 80 pin TQFP (TFP-80C) HD64338086RLPV 38086R(***)LPV 80 pin P-TFLGA (TLP-85V) Wide-range specifications HCD64338086R -- Chip HD64338086RHW 38086(***)H 80 pin QFP (FP-80A) HD64338086RWW 38086(***)W 80 pin TQFP (TFP-80C) HD64338086RLPWV 38086R(***)LPWV 80 pin P-TFLGA (TLP-85V) Rev. 3.00 Aug 23, 2006 Page 602 of 616 REJ09B0182-0300 Appendix Package Product Classification H8/38086R H8/38085R Group Product Code Model Marking (Package Code) 38085(***)H 80 pin QFP (FP-80A) HD64338085RW 38085(***)W 80 pin TQFP (TFP-80C) HD64338085RLPV 38085R(***)LPV 80 pin P-TFLGA Masked ROM Regular specifications HD64338085RH version (TLP-85V) Wide-range specifications HCD64338085R -- Chip HD64338085RHW 38085(***)H 80 pin QFP (FP-80A) HD64338085RWW 38085(***)W 80 pin TQFP (TFP-80C) HD64338085RLPWV 38085R(***)LPWV 80 pin P-TFLGA (TLP-85V) H8/38084R Masked ROM Regular specifications HD64338084RH version 38084(***)H 80 pin QFP (FP-80A) HD64338084RW 38084(***)W 80 pin TQFP (TFP-80C) HD64338084RLPV 38084R(***)LPV 80 pin P-TFLGA (TLP-85V) Wide-range HCD64338084R -- Chip HD64338084RHW 38084(***)H 80 pin QFP (FP-80A) HD64338084RWW 38084(***)W 80 pin TQFP (TFP-80C) HD64338084RLPWV 38084R(***)LPWV 80 pin P-TFLGA specifications (TLP-85V) H8/38083R Masked ROM Regular specifications HD64338083RH version 38083(***)H 80 pin QFP (FP-80A) HD64338083RW 38083(***)W 80 pin TQFP (TFP-80C) HD64338083RLPV 38083R(***)LPV 80 pin P-TFLGA (TLP-85V) Wide-range HCD64338083R -- Chip HD64338083RHW 38083(***)H 80 pin QFP (FP-80A) HD64338083RWW 38083(***)W 80 pin TQFP (TFP-80C) HD64338083RLPWV 38083R(***)LPWV 80 pin P-TFLGA specifications (TLP-85V) [Legend] (***): ROM code Rev. 3.00 Aug 23, 2006 Page 603 of 616 REJ09B0182-0300 Appendix D. Package Dimensions The package dimensions that are shown in the Renesas Semiconductor Packages Data Book have priority. Rev. 3.00 Aug 23, 2006 Page 604 of 616 REJ09B0182-0300 80 e 1 ZD D y *3 bp 20 41 x 21 40 M F MASS[Typ.] 1.2g Detail F L1 L Terminal cross section b1 bp 17.2 17.2 16.9 16.9 HD HE L1 1.6 0.8 0.83 ZE L 0.83 ZD 1.1 0.12 8 0.10 0.65 0.22 y 0.5 0 0.15 0.17 0.30 0.40 0.25 3.05 17.5 17.5 Max x e c1 c 0.12 0.32 0.24 bp b1 0.10 0.00 A1 A 2.70 14 14 Nom Dimension in Millimeters Min A2 E D Reference Symbol NOTE) 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. c1 HD E *2 61 60 *1 Previous Code FP-80A/FP-80AV A2 A1 c HE ZE RENESAS Code PRQP0080JB-A c JEITA Package Code P-QFP80-14x14-0.65 Appendix Figure D.1 Package Dimensions (FP-80A) Rev. 3.00 Aug 23, 2006 Page 605 of 616 REJ09B0182-0300 A Figure D.2 Package Dimensions (TFP-80C) 80 e ZD 1 HD Index mark D y *3 bp 20 41 x F M 21 40 E *2 61 60 *1 Previous Code TFP-80C/TFP-80CV MASS[Typ.] 0.4g Detail F L1 L Terminal cross section b1 bp 13.8 L1 1.0 0.5 1.25 ZE L 1.25 ZD 0.6 0.10 8 0.22 0.10 0.5 0.15 0.17 y 0.4 0 0.12 0.27 0.20 1.20 14.2 14.2 Max x e c1 c 0.20 0.17 b1 0.10 0.22 0.00 bp 14.0 14.0 A1 A 13.8 A2 HD 12 1.00 E HE 12 Nom Dimension in Millimeters Min D Reference Symbol NOTE) 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. c1 A A2 HE ZE RENESAS Code PTQP0080KC-A c REJ09B0182-0300 A1 Rev. 3.00 Aug 23, 2006 Page 606 of 616 c JEITA Package Code P-TQFP80-12x12-0.50 Appendix Appendix JEITA Package Code P-TFLGA85-7x7-0.65 RENESAS Code PTLG0085JA-A Previous Code TLP-85V MASS[Typ.] 0.1g D w S B E w S A x4 v y1 S A S y S ZD e A K Reference Symbol e J H G B F E Dimension in Millimeters Min Nom D 7.0 E 7.0 Max v 0.15 w 0.20 A 1.20 A1 D 0.65 e C ZE b B A 0.30 0.35 0.40 x 0.08 y 0.10 y1 0.2 SD 1 2 3 4 5 6 b 7 8 9 10 SE xM S A B ZD 0.575 ZE 0.575 Figure D.3 Package Dimensions (TLP-85V) Rev. 3.00 Aug 23, 2006 Page 607 of 616 REJ09B0182-0300 Appendix E. Chip Form Specifications Maximum dimensions in chip's plane X direction: TBD Y direction: TBD Max 0.03 0.28 0.02 X direction: TBD Y direction: TBD Unit: mm Figure E.1 Cross-Sectional View of Chip (HCD64338086R, HCD64338085R, HCD64338084R, and HCD64338083R) Maximum dimensions in chip's plane X direction: 4.73 0.25 Y direction: 4.73 0.25 Max 0.03 0.28 0.02 X direction: 4.73 0.05 Y direction: 4.73 0.05 Unit: mm Figure E.2 Cross-Sectional View of Chip (HCD64F38086R) Rev. 3.00 Aug 23, 2006 Page 608 of 616 REJ09B0182-0300 Appendix F. Bonding Pad Form Bonding area 5 m 65 m Metallic film is visible from here 65 m 5 m Figure F.1 Bonding Pad Form (HCD64F38086R, HCD64338086R, HCD64338085R, HCD64338084R, and HCD64338083R) Rev. 3.00 Aug 23, 2006 Page 609 of 616 REJ09B0182-0300 Appendix G. Chip Tray Specifications 3.69 51 51 3.60 5.50 0.1 6.25 0.1 1.8 0.1 0.38 0.05 3.80 0.05 5.50 0.1 6.25 0.1 X' 4.0 0.1 X 3.83 0.05 Chip tray code Nissen Chemitec Corporation Product code: CT193 Characteristic engraving: CT2038038-038N Unit: mm Cross-sectional view: X to X' Figure G.1 Chip Tray Specifications (HCD64338086R, HCD64338085R, HCD64338084R, and HCD64338083R) Rev. 3.00 Aug 23, 2006 Page 610 of 616 REJ09B0182-0300 Appendix 51 Chip Product name 4.73 Chip orientation 51 4.73 6.3 0.1 6.6 0.1 Cross-sectional view: X to X' 1.8 0.1 0.6 0.1 5.3 0.05 6.3 0.1 6.6 0.1 X' 4.0 0.1 X 5.3 0.05 Chip tray code Manufactured by DAINIPPON INK AND CHEMICALS, INCORPORATED Product code: CT030 Characteristic engraving: 2CT053053-060 Unit: mm Figure G.2 Chip Tray Specifications (HCD64F38086R) Rev. 3.00 Aug 23, 2006 Page 611 of 616 REJ09B0182-0300 Appendix Rev. 3.00 Aug 23, 2006 Page 612 of 616 REJ09B0182-0300 Index Numerics and symbol D A/D converter ................................... 401 16-bit timer mode ................................... 224 16-bit timer pulse unit............................. 233 8-bit timer mode ..................................... 225 Data reading procedure ........................... 213 Data transfer instructions .......................... 35 E A A/D converter ......................................... 387 Absolute address....................................... 46 Acknowledge .......................................... 454 Address break ......................................... 479 Addressing modes..................................... 45 Arithmetic operations instructions............ 36 Asynchronous Event Counter (AEC)...... 281 Asynchronous mode ............................... 332 B Bit manipulation instructions.................... 39 Bit rate .................................................... 321 Bit synchronous circuit ........................... 472 Block data transfer instructions ................ 43 Boot mode............................................... 143 Boot program.......................................... 142 Branch instructions ................................... 41 Break....................................................... 356 C Clock pulse generators.............................. 97 Clocked synchronous mode .................... 344 Clocked synchronous serial format......... 463 Condition field .......................................... 44 Condition-code register (CCR) ................. 29 CPU .......................................................... 25 Effective address ....................................... 49 Effective address extension....................... 44 Erase/erase-verify.................................... 150 Erasing units............................................ 136 Error protection....................................... 152 Exception handling ................................... 61 F Flash memory.......................................... 135 Framing error .......................................... 340 Free-running count operation.................. 253 G General registers ....................................... 28 H Hardware protection................................ 152 I I/O ports .................................................. 159 I2C bus format ......................................... 453 I2C bus interface 2 (IIC2)........................ 437 Immediate ................................................. 47 Initial setting procedure .......................... 212 Instruction set............................................ 34 Rev. 3.00 Aug 23, 2006 Page 613 of 616 REJ09B0182-0300 Interrupt mask bit (I)................................. 29 IrDA........................................................ 350 Programmer mode................................... 153 Programming units.................................. 136 Programming/erasing in user program mode ....................................................... 145 L Large current ports...................................... 2 LCD controller/driver ............................. 415 LCD display............................................ 426 LCD RAM .............................................. 428 Logic operations instructions.................... 38 M Mark state ............................................... 356 Memory indirect ....................................... 47 Memory map ............................................ 26 Module standby function ........................ 131 N Noise canceler......................................... 466 O On-board programming modes............... 142 Operation field.......................................... 44 Overrun error .......................................... 340 P Package....................................................... 2 Parity error.............................................. 340 Pin assignment............................................ 4 Power-down modes ................................ 111 Power-down states.................................. 153 Power-on reset circuit ............................. 476 Program counter (PC) ............................... 29 Program/program-verify ......................... 147 Program-counter relative .......................... 47 Rev. 3.00 Aug 23, 2006 Page 614 of 616 REJ09B0182-0300 R RAM ....................................................... 157 Realtime clock (RTC) ............................. 203 Register direct ........................................... 45 Register field............................................. 44 Register indirect ........................................ 46 Register indirect with displacement .......... 46 Register indirect with post-increment ....... 46 Register indirect with pre-decrement ........ 46 Registers ABRKCR2 .................. 480, 488, 494, 499 ABRKSR2 .................. 482, 488, 494, 499 ADRR ......................... 389, 489, 495, 501 ADSR.......................... 391, 489, 495, 501 AEGSR ....................... 285, 488, 494, 500 AMR ........................... 390, 489, 495, 501 BAR2H ....................... 482, 488, 494, 499 BAR2L........................ 482, 488, 494, 499 BDR2H ....................... 482, 488, 494, 499 BDR2L........................ 482, 488, 494, 499 BGRMR ...................... 425, 489, 495, 500 BRR ............................ 321, 489, 495, 500 CKSTPR1 ................... 115, 491, 497, 502 CKSTPR2 ................... 115, 491, 497, 502 EBR1........................... 140, 486, 492, 498 ECCR .......................... 286, 488, 494, 500 ECCSR........................ 287, 488, 494, 500 ECH ............................ 289, 488, 494, 500 ECL............................. 289, 488, 494, 500 ECPWCR .................... 283, 488, 494, 500 ECPWDR.................... 284, 488, 494, 500 FENR .......................... 141, 486, 492, 498 FLMCR1..................... 138, 486, 492, 498 FLMCR2..................... 139, 486, 492, 498 FLPWCR .................... 141, 486, 492, 498 ICCR1......................... 440, 487, 493, 499 ICCR2......................... 443, 487, 493, 499 ICDRR ........................ 452, 487, 493, 499 ICDRS ................................................ 452 ICDRT ........................ 452, 487, 493, 499 ICIER.......................... 447, 487, 493, 499 ICMR .......................... 445, 487, 493, 499 ICSR ........................... 449, 487, 493, 499 IEGR............................. 75, 490, 497, 502 IENR............................. 77, 491, 497, 502 INTM............................ 85, 491, 497, 502 IPR................................ 84, 487, 494, 499 IrCR ............................ 331, 489, 495, 500 IRR................................ 79, 491, 497, 502 IWPR ............................ 82, 491, 497, 502 LCR ............................ 419, 488, 495, 500 LCR2 .......................... 421, 488, 495, 500 LPCR .......................... 418, 488, 495, 500 LTRMR ...................... 423, 488, 495, 500 OCR ............................ 220, 489, 495, 501 OSCCR ....................... 100, 489, 495, 501 PCR1........................... 160, 490, 496, 502 PCR3........................... 169, 490, 496, 502 PCR4........................... 174, 490, 496, 502 PCR5........................... 178, 490, 496, 502 PCR6........................... 182, 490, 496, 502 PCR7........................... 186, 490, 496, 502 PCR8........................... 188, 490, 497, 502 PCR9........................... 191, 490, 497, 502 PCRA.......................... 194, 490, 497, 502 PDR1 .......................... 160, 490, 496, 501 PDR3 .......................... 168, 490, 496, 501 PDR4 .......................... 173, 490, 496, 501 PDR5 .......................... 178, 490, 496, 501 PDR6 .......................... 182, 490, 496, 501 PDR7 .......................... 185, 490, 496, 501 PDR8 .......................... 188, 490, 496, 501 PDR9 .......................... 190, 490, 496, 501 PDRA.......................... 193, 490, 496, 501 PDRB .......................... 196, 490, 496, 501 PMR1 .......................... 161, 489, 495, 501 PMR3 .......................... 170, 489, 496, 501 PMR4 .......................... 175, 489, 496, 501 PMR5 .......................... 179, 489, 496, 501 PMR9 .......................... 191, 489, 496, 501 PMRB ......................... 197, 489, 496, 501 PUCR1 ........................ 161, 490, 496, 502 PUCR3 ........................ 169, 490, 496, 502 PUCR5 ........................ 179, 490, 496, 502 PUCR6 ........................ 183, 490, 496, 502 PWCR ......................... 382, 490, 496, 501 PWDR......................... 383, 490, 496, 501 RDR ............................ 312, 489, 495, 500 RHRDR....................... 206, 487, 493, 499 RMINDR..................... 205, 487, 493, 499 RSECDR ..................... 205, 487, 493, 499 RSR..................................................... 312 RTCCR1 ..................... 208, 487, 493, 499 RTCCR2 ..................... 209, 487, 493, 499 RTCCSR ..................... 210, 487, 493, 499 RTCFLG ..................... 211, 487, 493, 499 RWKDR...................... 207, 487, 493, 499 SAR............................. 451, 487, 493, 499 SCR3 ................... 316, 488, 489, 495, 500 SCR4 ........................... 363, 486, 492, 498 SCSR4......................... 366, 486, 492, 498 SMR ............................ 313, 489, 495, 500 SPCR........................... 329, 488, 494, 500 SSR ............................. 318, 489, 495, 500 SUB32CR ..................... 99, 487, 493, 499 SYSCR1...................... 112, 490, 497, 502 SYSCR2...................... 114, 490, 497, 502 TC ............................... 219, 489, 495, 501 TCNT .......................... 247, 486, 492, 498 TCR............................. 237, 486, 492, 498 TCRF .......................... 221, 489, 495, 501 TCSRF ........................ 222, 489, 495, 501 TCSRWD.................... 299, 489, 495, 500 TCWD......................... 303, 489, 495, 500 Rev. 3.00 Aug 23, 2006 Page 615 of 616 REJ09B0182-0300 TDR .............................312, 489, 495, 500 TGR .............................247, 486, 492, 498 TIER ............................245, 486, 492, 498 TIOR............................240, 486, 492, 498 TMDR..........................239, 486, 492, 498 TMWD ........................303, 489, 495, 500 TSR..............................246, 486, 492, 498 TSTR ...........................248, 486, 492, 498 TSYR...........................249, 486, 492, 498 WEGR ...........................76, 488, 494, 500 ROM ....................................................... 135 S Serial Communication Interface 3 (SCI3, IrDA)........................................... 307 Serial Communication Interface 4 (SCI4) ..................................................... 361 Shift instructions....................................... 38 Slave address .......................................... 454 Sleep mode ............................................. 123 Software protection................................. 152 Stack pointer (SP)..................................... 28 Standby mode ......................................... 123 Rev. 3.00 Aug 23, 2006 Page 616 of 616 REJ09B0182-0300 Start condition......................................... 454 Stop condition ......................................... 454 Subactive mode....................................... 125 Subclock generator.................................. 103 Subsleep mode ........................................ 124 System clock generator ........................... 101 System control instructions....................... 42 T Timer F ................................................... 217 Toggle output.......................................... 254 Transfer rate............................................ 442 V Vector address........................................... 62 W Watchdog timer....................................... 297 Waveform output by compare match...... 254 Renesas 16-Bit Single-Chip Microcomputer Hardware Manual H8/38086R Group Publication Date: Rev.1.00, Jul. 09, 2004 Rev.3.00, August 23, 2006 Published by: Sales Strategic Planning Div. Renesas Technology Corp. Edited by: Customer Support Department Global Strategic Communication Div. Renesas Solutions Corp. (c)2006. Renesas Technology Corp., All rights reserved. Printed in Japan. Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan RENESAS SALES OFFICES http://www.renesas.com Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. 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