Product Standards
Zener Diode
DZ2J3300L
Absolute Maximum Ratings Ta = 25 C
*1 Mounted on glass epoxy print board ( 45 mm 45 mm 1 mm )
Solder in ( Recommended land pattern )
*2 Test method : IEC61000_4_2
( C = 150 pF, R = 330 , Contact discharge : 10 times )
Electrical Characteristics Ta = 25 C 3 C
Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.
Absolute frequency of input and output is 5 MHz.
The temperature must be controlled 25 C for VZ mesurement.
VZ value measured at other temperature must be adjusted to VZ (25 C).
VZ guaranted 20 ms after current flow Rank classification
Tj = 25 C to 150 C
Page
Note)
*1
*2
Temperature coefficient of zener voltage *3
*3
Note) 1.
2.
3.
Code M 0
Rank M No-rank
34.6533.80
Marking symbol HR HG
VZ 32.20 to 31.35 to
0.05
A
IR VR = 25 V
mW
Operating ambient temperature Topr -40 to C
C
ESD
+150
+85
8
Total power dissipation *1 PT 200
Junction temperature Tj 150
Electrostatic discharge *2
C
Repetitive peak forward current IFRM 200 mA
Storage temperature Tstg -55 to
kV
SZ IZ = 2 mA
Zener voltage *1, *2 VZ IZ = 2 mA
Zener operating resistance RZ IZ = 2 mA
Reverse current
Packaging
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
Parameter Symbol Rating Unit
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)
Marking Symbol: HG or HR
Code
1. Cathode
―
Panasonic
DZ2J3300L
Silicon epitaxial planar type
For constant voltage / For surge absorption circuit
Features
Low zener operating resistance Rz
Excellent rising characteristics of zener current Iz
Halogen-free / RoHS compliant
SMini2-F5-B
JEITA SC-90A
2. Anode
1of4
Unit: mm
Min Typ
V
Parameter Symbol Conditions
Forward voltage VF IF = 10 mA
Unit
31.35
Max
34.65
1.0
Internal Connection
32.0 mV/C
V
200
200
Zener rise operating resistance RZK IZ = 0.5 mA
2.5
1.25
0.7
1.7
0.13
0.35
0.5
2
1
1
2
Doc No.
TT4-EA-11565
Revision.
3
Established
2009-10-14
Revised
2013-07-16
Product Standards
Zener Diode
DZ2J3300L
Technical Data ( reference )
Page 2 of 4
PT - Ta
0
50
100
150
200
250
0 20 40 60 80 100 120 140 160 180 200
Ambient temperature Ta (°C)
Total power dissipation PT (mW)
Mounted on glass epoxy print board.
Board size : 45 mm × 45 mm x 1 mm
Solder in : land pattern
IF - VF
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
0.0 0.2 0.4 0.6 0.8 1.0 1.2
Forward voltage VF (V)
Forward current IF (A)
Ta = 25 °C
IR - VR
1.E-12
1.E-11
1.E-10
1.E-09
1.E-08
1.E-07
1.E-06
0 5 10 15 20 25
Reverse voltage VR (V)
Reverse current IR (A)
Ta = 25 °C
IZ - VZ
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
20 25 30 35 40 45
Zener voltage VZ (V)
Zener current IZ (A)
Ta = 125 °C
85 °C
-40 °C
25 °C
SZ - IZ
15
20
25
30
35
40
0246810
Zener current IZ (mA)
Temparature coefficient of zener voltage
SZ (mV/°C)
RZ - IZ
1
10
100
1000
0.0001 0.001 0.01 0.1
Zener current IZ (A)
Zener operating resistance RZ )
Ta = 25 °C
Doc No.
TT4-EA-11565
Revision.
3
Established
2009-10-14
Revised
2013-07-16
Product Standards
Zener Diode
DZ2J3300L
Technical Data ( reference )
Page 3 of 4
Rth - t
1
10
100
1000
0.001 0.01 0.1 1 10 100 1000
Time t (s)
Thermal resistance Rth (°C/W)
(1)
Rth(j-l) = 80 °C/W
(1) Non-heat sink
(2) Mounted on glass epoxy print board.
Board size : 45 mm × 45 mm x 1 mm
Solder in : land pattern
(2)
PZSM - tw
0.1
1
10
100
100 1000 10000
Pulse width tw (μs)
Non-repetitive reverse surge power
dissipation PZSM (W)
Ta = 25 °C
Ct - VR
0
2
4
6
8
10
12
14
16
0 5 10 15 20 25 30
Reverse voltage VR (V)
Terminal capacitance Ct (pF)
Ta = 25 °C
f = 1 MHz
Doc No.
TT4-EA-11565
Revision.
3
Established
2009-10-14
Revised
2013-07-16
Product Standards
Zener Diode
DZ2J3300L
Unit: mm
Page
SMini2-F5-B
4
4of
Land Pattern (Reference) (Unit: mm)
2.5±0.2
0.35±0.05
0.50±0.05
0.13+0.05
-0.02
0.4±0.1
0.7±0.1
(0.15)
1.25±0.10
1.7±0.1
(5°)
(5°)
0 to 0.05
1
2
2.4
0.90.9
1.1
0.9
Doc No.
TT4-EA-11565
Revision.
3
Established
2009-10-14
Revised
2013-07-16
Request for your special attention and precautions
in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the
laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit
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Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the
infringement upon any such right owned by any other company which may arise as a result of the use of technical
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(3) The products described in this book are intended to be used for general applications (such as office equipment,
communications equipment, measuring instruments and household appliances), or for specific applications as expressly
stated in this book.
Please consult with our sales staff in advance for information on the following applications, moreover please exchange
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automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in
which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly
jeopardize life or harm the human body.
Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held
responsible for any damage incurred as a result of or in connection with your using the products described in this book
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(4) The products and product specifications described in this book are subject to change without notice for modification
and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-
to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating
conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed
the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down
and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design,
arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages,
for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors
(ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do
not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board.
When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed
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No.010618