Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors Introduction Multilayer Surface Mount Ceramic Capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceramic dielectric materials and firing into a concrete monolithic body, then completed by application of metal end terminations which are fired to assure permanent bonding with the individual internal electrodes. Multilayer ceramic capacitors have various features such as large capacitance values in small sizes and excellent high frequency characteristics. Moreover, chip capacitors can be used on surface mount assembly equipment. Our fully integrated manufacturing and total quality control systems ensure unprecedented high standards of quality and reliability. Chip Capacitor Selection Selection of the most suitable capacitor for any application is based on the following: Dielectric Type The choice of dielectric is largely determined by the temperature stability required. COG (NPO) Capacitance change with temperature is 0-30ppm/C which is less than -0.3%C from -55C to +125C. Typical capacitance change with life is less than -0.1% for NPOs, one-fifth that shown by most other dielectrics. NPO formulations show no aging characteristics. X7R Its temperature variation of capacitance is within 15% from -55C to +125C. This capacitance change in non-linear. Z5U Despite their capacitance instability, Z5U formulations are very popular because of their small size, low ESL, low ESR and excellent frequency response. These features are particularly important for decoupling application where only a minimum capacitance value is required. Y5V Y5V formulations are for general purpose use in a limited temperature range. They have a wide temperature characteristic of +22% - 82% capacitance change over the operating temperature range of -30C to +85C. Y5Vs high dielectric constant allows the manufacture of very high capacitance value (up to 22MF) in small physical sizes. Capacitance Value & Tolerance Determined by circuit requirements. Note that chip prices decrease with lower capacitance value and looser tolerance. Voltage Determined by circuit requirements. Units are designed to exceed the withstanding voltage specification, i.e., the user need not incorporate an additional safety margin. Capacitor Size Select the smallest unit permitted by the circuit constraints that provides the required capacitance and voltage rating. Smaller units are generally less expensive : 0805 is the most economical size. Capacitor Termination Termination choice is largely determined by the chip attachment method. Silver-palladium is adequate for most applications involving soldering or solder reflow. Nickel barrier is standard and recommended for units exposed to repeated solder cycles, to minimize leaching of the termination. 1 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors Construction Solder (SN/PB) plated outer layer; typical thickness 0.003mm to 0.05 mm 90% solder, 10% lead. Nickel Barrier Layer (50 Micro-inches Electroplated Nickel min.) Inner Electrodes Ag Layer Example GMC21 CG 102 J 50 N T M Size Code Dielectric Capacitance (pF) Capacitance Tolerance (EIA Code) Voltage Termination Packaging Code Designates EIA Marked Parts CG (COG)(NPO) X7R Z5U Y5V Capacitance values are represented in 3 digits, and expressed in pF. The first two digits are significant, and the third is the number of zeros. The letter "R" is used as a decimal point. 0R5 5R0 100 101 *NOTE: 2 0.5pF 5pF 10pF 100pF B C D F G H J K M Z 0.1pF for 0.25pF for 0.5pF for 1% for 2% 3% 5% 10% 20% -20%~+80% 10pF 10pF 10pF 10pF 16 25 50 100 200 16 DC 25 DC 50 DC 100 DC 200 DC N 0805 to 2225 Nickel Barrier T Card Board Taping E Embossed Taping Cal-Chip is phasing out marked capacitors as it is not cost effective. Our engineers also believe it weakens the durability of the component over its life due to the laser etching marking techinque used. Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors - Size & Capacitance Table - COG/X7R/Y5V Type Length (L1) GMC04 0402 1.00.05 0.040.002 0.50.05 0.020.002 0.50.1 0.020.004 mm inches mm inches mm inches Width (W) Thickness (H) Termination Band (L2 & L3) Band Gap (L4) (Min) Dielectric Rated Voltage d.c. mm inches mm inches Cap. Range Code 0.5pF 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 150 220 270 330 390 470 560 680 820 1.0F 0p5 1p0 1p2 1p5 1p8 2p2 2p7 3p3 3p9 4p7 5p6 6p8 8p2 100 120 150 180 220 270 330 390 470 560 630 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 154 224 274 334 394 474 564 684 824 105 Min 0.1 0.004 COG 25 50 Max 0.35 0.014 16 0.3 0.012 X7R 25 0402/0603 GMC10 0603 1.60.2 0.0630.008 0.80.2 0.0310.008 0.80.2 0.0310.008 50 Y5V 25 50 Min 0.1 0.004 25 COG 50 100 Max 0.4 0.015 10 0.6 0.015 X7R 16 25 50 16 Y5V 25 50 Minimum and Maximum capacitance values available 3 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors - 50/63, 100, 200V - Size & Capacitance Table - Ultra Stable Dielectric CCE Part Number Type COG GMC21 GMC29 GMC31 GMC32 GMC43 GMC45 GMC55 GMC57 0805 0907 1206 1210 1812 1825 2220 2225 Dimensions Length (L1) mm inches Width (W) mm inches Thickness (H) mm inches Termination Band (L2 & L3) mm inches Band Gap (L4) mm (Min) inches Related Voltage d.c. Cap. Range 0.5pF 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 85 100 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 Notes: 4 Code 0p5 1p0 1p2 1p5 1p8 2p2 2p7 3p3 3p9 4p7 5p6 6p8 8p2 100 120 150 180 220 270 330 390 470 560 630 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 2.0.03 0.080.012 1.250.02 0.050.008 1.3 0.051 Min Max 0.25 0.75 0.01 0.03 0.5 0.019 50 63 100 200 2.30.3 3.20.3 0.090.012 0.1250.012 1.80.3 1.60.2 0.0710.012 0.0630.008 1.3 1.6 0.051 0.063 Min Max Min Max 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 0.5 1.4 0.019 0.055 50 63 100 200 50 63 100 200 3.20.3 4.50.35 0.1250.012 0.180.014 2.50.3 3.20.3 0.100.012 0.1250.012 1.8 1.8 0.07 0.07 Min Max Min Max 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 1.4 2.2 0.055 0.087 50 63 100 200 50 63 100 200 4.50.35 5.70.4 5.70.4 0.180.014 0.2250.016 0.2250.016 6.30.4 5.00.4 6.30.4 0.250.016 0.1970.016 0.250.016 1.8 1.8 1.8 0.07 0.07 0.07 Min Max Min Max Min Max 0.25 0.75 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 0.01 0.03 2.2 2.9 2.9 0.087 0.114 0.114 50 63 100 200 50 63 100 200 50 63 100 200 Minimum and Maximum capacitance values available 1. Capacitance values to the E24 range also available. 2. Higher capacitance values may be available with a corresponding increase in thickness. 3. Sizes 1005 and 1808 are available as a special requirement. 4. Chips to a specified thickness can be supplied as a special requirement. Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors - 50/63, 100, 200V - Size & Capacitance Table - Stable Dielectric Type 0805 0907 1206 1210 1812 1825 2220 X7R 2225 Dimensions Length (L1) mm inches Width (W) mm inches Thickness (H) mm inches Termination Band (L2 & L3) mm inches Band Gap (L4) mm (Min) inches Related Voltage d.c. Cap. Range 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0F 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 Notes: Code 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 227 335 395 475 2.00.3 0.080.012 1.250.2 0.050.008 1.3 0.051 Min Max 0.25 0.75 0.01 0.03 0.5 0.019 50 63 100 200 2.30.3 3.20.3 0.090.012 0.1250.012 1.80.3 1.60.2 0.0710.012 0.0630.008 1.3 1.6 0.051 0.063 Min Max Min Max 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 0.5 1.4 0.019 0.055 50 63 100 200 50 63 100 200 3.20.3 4.50.35 0.1250.012 0.180.014 2.50.3 3.20.3 0.100.012 0.1250.012 1.8 1.8 0.07 0.07 Min Max Min Max 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 1.4 2.2 0.055 0.087 50 63 100 200 50 63 100 200 4.50.35 5.70.4 5.70.4 0.180.014 0.2250.016 0.2250.016 6.30.4 5.00.4 6.30.4 0.250.016 0.1970.016 0.250.016 1.8 1.8 1.8 0.07 0.07 0.07 Min Max Min Max Min Max 0.25 0.75 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 0.01 0.03 2.2 2.9 2.9 0.087 0.114 0.114 50 63 100 200 50 63 100 200 50 63 100 200 Minimum and Maximum capacitance values available 1. Higher capacitance values may be available with a corresponding increase in thickness. 2. Sizes 1005 and 1808 are available as a special requirement. 3. Chips to a specified thickness can be supplied as a special requirement. 5 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors - 50/63, 100, 200V - Size & Capacitance Table - Stable Dielectric CCE Part Number Type Z5U GMC21 GMC29 GMC31 GMC32 GMC43 GMC45 GMC55 GMC57 0805 0907 1206 1210 1812 1825 2220 2225 Dimensions Length (L1) mm inches Width (W) mm inches Thickness (H) mm inches Termination Band (L2 & L3) mm inches Band Gap (L4) mm (Min) inches Related Voltage d.c. Cap. Range Code 1.0nF 1.5 2.2 3.3 4.7 6.8 10 15 22 33 39 47 56 68 100 150 220 330 470 680 1.0F 1.5 2.2 3.3 4.7 5.6 6.8 102 152 222 332 472 682 103 153 223 333 393 473 563 683 104 154 224 334 474 684 105 155 225 335 475 565 685 Notes: 6 2.00.3 0.080.012 1.250.2 0.050.008 1.3 0.051 Min Max 0.25 0.75 0.01 0.03 0.5 0.019 50 63 100 200 2.30.3 3.20.3 0.090.012 0.1250.012 1.80.3 1.60.2 0.0710.012 0.0630.008 1.3 1.6 0.051 0.063 Min Max Min Max 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 0.5 1.4 0.019 0.055 50 63 100 200 50 63 100 200 3.20.3 4.50.35 0.1250.012 0.180.014 2.50.3 3.20.3 0.100.012 0.1250.012 1.8 1.8 0.07 0.07 Min Max Min Max 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 1.4 2.2 0.055 0.087 50 63 100 200 50 63 100 200 4.50.35 5.70.4 5.70.4 0.180.014 0.2250.016 0.2250.016 6.30.4 5.00.4 6.30.4 0.250.016 0.1970.016 0.250.016 1.8 1.8 1.8 0.07 0.07 0.07 Min Max Min Max Min Max 0.25 0.75 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 0.01 0.03 2.2 2.9 2.9 0.087 0.114 0.114 50 63 100 200 50 63 100 200 50 63 100 200 Minimum and Maximum capacitance values available 1. Capacitance values to the E12 range also available. 2. Higher capacitance values may be available with a corresponding increase in thickness. 3. Sizes 1005 and 1808 are available as a special requirement. 4. Chips to a specified thickness can be supplied as a special requirement. Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors - Size & Capacitance Table - Ultra Stable Dielectric COG Dielectric Type 16 & 25V GMC21 GMC31 GMC32 GMC43 GMC55 GMC57 0805 1206 1210 1812 2220 2225 Dimensions Length (L1) mm inches mm inches mm inches Width (W) Thickness (H) Termination Band (L2&L3) mm inches mm inches Band Gap (L4) (Min) Rated Voltage d.c. Cap. Range Code 0.5pF 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 85 100 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 2.00.3 0.080.012 1.250.2 0.050.008 1.3 0.051 Min Max 0.25 0.75 0.01 0.03 0.5 0.019 16 25 3.20.3 3.20.3 4.50.35 5.70.4 0.1250.012 0.1250.012 0.180.014 0.2250.016 1.60.2 2.50.3 3.20.3 5.00.4 0.0630.008 0.100.012 0.1250.012 0.1970.016 1.6 1.8 1.8 1.8 0.063 0.07 0.07 0.07 Min Max Min Max Min Max Min Max 0.25 0.75 0.25 0.75 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 0.01 0.03 0.01 0.03 1.4 1.4 2.2 2.9 0.055 0.055 0.087 0.114 16 25 16 25 16 25 16 25 Minimum and Maximum capacitance values available 5.70.4 0.2250.016 6.30.4 0.250.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114 16 25 0p5 1p0 1p2 1p5 1p8 2p2 2p7 3p3 3p9 4p7 5p6 6p8 8p2 100 120 150 180 220 270 330 390 470 560 630 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 7 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors - Size & Capacitance Table - Stable Dielectric X7R Dielectric Type GMC21 0805 GMC31 1206 2.00.3 0.080.012 1.250.2 0.050.008 1.3 0.051 Min Max 0.25 0.75 0.01 0.03 0.5 0.019 10 16 25 3.20.3 0.1250.012 1.60.2 0.0630.008 1.6 0.063 Min Max 0.25 0.75 0.01 0.03 1.4 0.055 10 16 25 GMC32 1210 GMC43 1812 10, 16 & 25V GMC45 1825 GMC55 2220 GMC57 2225 5.70.4 0.2250.016 5.00.4 0.1970.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114 16 25 5.70.4 0.2250.016 6.30.4 0.250.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114 16 25 Dimensions Length (L1) mm inches mm inches mm inches Width (W) Thickness (H) Termination Band (L2&L3) mm inches mm inches Band Gap (L4) (Min) Rated Voltage d.c Cap. Range Code 100pF 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0F 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 15 22 8 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 565 685 825 106 156 226 3.20.3 4.50.35 4.50.35 0.1250.012 0.180.014 0.180.014 2.50.3 3.20.3 6.30.4 0.100.012 0.1250.012 0.0250.016 1.8 1.8 1.8 0.07 0.07 0.07 Min Max Min Max Min Max 0.25 0.75 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 0.01 0.03 1.4 2.2 2.2 0.055 0.087 0.087 16 25 16 25 16 25 Minimum and Maximum capacitance values available Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors - Size & Capacitance Table - General Purpose Dielectric Z5U/Y5V Dielectric Type GMC21 0805 GMC31 1206 2.00.3 0.080.012 1.250.2 0.050.008 1.3 0.051 Min Max 0.25 0.75 0.01 0.03 0.5 0.019 16 25 3.20.3 0.1250.012 1.60.2 0.0630.008 1.6 0.063 Min Max 0.25 0.75 0.01 0.03 1.4 0.055 10 16 25 GMC32 1210 GMC43 1812 GMC45 1825 10, 16 & 25V GMC55 2220 GMC57 2225 5.70.4 0.2250.016 5.00.4 0.1970.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114 16 25 5.70.4 0.2250.016 6.30.4 0.250.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114 16 25 Dimensions Length (L1) mm inches mm inches mm inches Width (W) Thickness (H) Termination Band (L2&L3) mm inches mm inches Band Gap (L4) (Min) Rated Voltage d.c Cap. Range Code 1.0nF 1.5 2.2 3.3 4.7 6.8 10 15 22 33 47 68 100 150 220 330 470 680 1.0F 1.5 2.2 3.3 4.7 6.8 10 15 22 27 33 39 47 3.20.3 4.50.35 4.50.35 0.1250.012 0.180.014 0.180.014 2.50.3 3.20.3 6.30.4 0.100.012 0.1250.012 0.250.016 1.8 1.8 1.8 0.07 0.07 0.07 Min Max Min Max Min Max 0.25 0.75 0.25 0.75 0.25 0.75 0.01 0.03 0.01 0.03 0.01 0.03 1.4 2.2 2.2 0.055 0.087 0.087 16 25 16 25 16 25 Minimum and Maximum capacitance values available 102 152 222 332 472 682 103 153 223 333 473 683 104 154 224 334 474 684 105 155 225 335 475 685 106 156 226 276 336 396 476 9 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors COG Dielectric Ultra stable class I dielectric: linear temperature coefficient, low loss, negligible change of electrical properties with time, voltage and frequency. Operating Temperature Range Temperature Coefficient -55C to +125C 030ppmC Temperature Voltage Coefficient (cMax @ VDCW) 030ppm/C Dissipation Factor Insulation Resistance 0. 1% Max, *25C, VDCW:: 0.02% Typical >100GF or 1000F, Dielectric withstanding Voltage 2.5 X VDCW Test Parameters Aging Rate 0% per decade hour *C51000pF f=1MHz V=1.0Vrms 0.2Vrms T=25C *C>1000pF f=1KHz V=1.0Vrms 0.2Vrms T=25C whichever is less *125C, VDCW: >10GF or 100F whichever is less 0. 30pp /*C envelope typical T.C CAPACITANCE VS FREQUENCY IR( F) INSULATION RESISTANCE VS TEMP 10K %C Typical I.R 0.2 Minimum I.R. VOLTAGE COEFFICIENT TEMPERATURE COEFFICIENT %C %C 0.2 0.4 0.1 0.1 0.0 0.0 0.0 1K - 0.1 - 0.1 0.4 - 0.2 - 0.2 25 -55 - 15 65 85 0.1K 0 125 50 100 150 25 200 50 100 10 3 10 2 125 10 4 10 5 10 6 Frequency, Hz Temperature, C Bias Voltage(VDC) Temperature, C 75 X7R Dielectric Stable class 11 dielectric (EIA X7R) Operating Temperature Range Temperature Coefficient 55C to +125C 15% Temperature Voltage Coefficient (cMax @ VDCW) Dissipation Factor Insulation Resistance Dielectric withstanding Voltage X7R 2.5%Max, *25C,VDCW:: Not Applicable 1.8% Typical >100GFor 1000F, 2.5 X VDCW Test Parameters Aging Rate <2% per decade hour whichever is less 1KHz, 1.OVrms 0.2Vrms 25C *125C, VDCW: >10GF or 100F whichever is less TEMPERATURE COEFFICIENT %C 15 10 5 0 -5 - 10 - 15 0 -5 -5 1K - 10 - 10 - 15 - 15 - 20 - 55 -15 25 65 85 Temperature C 10 AGING RATE IR( F) INSULATION RESISTANCE VS TEMP %C 10K Typical I.R. Minimum I.R. 0 VOLTAGE COEFFICIENT %C 5 Permissible TC Typical TC 125 0.1K 0 25 50 75 Bias Voltage(VDC) 100 25 50 75 100 Temperature C 125 0.1 1.0 10 10 2 10 3 10 4 10 5 Time After Last Curie Point(Hours) Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors - Z5U (Y5V) Dielectric High capacitance per unit volume: general purpose product Operating Temperature Range Dielectric withstanding Voltage Temperature Coefficient Dissipation Factor Insulation Resistance +22% -82% 3.0% Max, 2.0% Typical 10G or 100F whichever is less, 25C, VDCW -30C to +85C TEMPERATURE COEFFICIENT 2.5 X VDCW 3.0% per decade hour %C 5.0 %C 0 0 - 20 4.0 -5 - 20 3.0 - 40 - 40 - 60 - 90 25 40 55 70 85 Temperature C Packaging (Taping) (Reel Type-Size) 1.0 - 15 - 80 - 30 2.0 - 10 - 60 1KHz, 0.5 Vrms 25C AC VOLTAGE COEFFICIENT AGING RATE DC VOLTAGE COEFFICIENT %C 0 %C Test Parameters Aging Rate 0.0 0 25 50 75 0.1 100 Bias Voltage (VDC) 1.0 10 10 2 10 3 0 0.1 10 4 10 5 Time after last Curie Point (hours) 10 0.5 Test Voltage (Vms) Standard Reel Unit:mm A B C D E W t R O178 O50 min. O13.0 O21.0 0.5 0.8 2.0 0.5 14.9 1.5 0.8 0.2 1.0 2.0 10000 units per reel OPTIONAL Unit:mm A B C D E W t R O250 O50 min. O13.0 O21.0 0.5 0.8 2.0 0.5 10.0 1.5 0.8 0.2 1.0 2.0 Carrier Tape (Standard) * To peel off the cover tape by the method shown in the right figure apply a peel-off force of 20 gf - 60 gf (card board); 35 gf - 75 gf (plastic tape). * The cover tape should not touch the top or bottom of the chip. * If the cover tape has been peeled off it may be difficult to remove the chip due to punch-hole clearance, dirt, and debris. Make sure therefore that no paper waste will adhere to and block the absorption nozzle. * If the cover tape has been peeled off from the top, stick it back on with a suitable adhesive. * Follow the illustration for the start and end of the winding operation. 11 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors * Cardboard carrier tape for 0402, 0603 type and 0805/1206 type Type B F P1 P0 t1 A W E P2 D0 t2 Mounting Hole Unit: mm Quantity per Reel 0402 0.70.2 1.30.2 2.00.05 10000 0603 1.10.2 1.90.2 Angular 4000 +0.1 0805 1.650.2 2.40.2 8.00.3 3.50.05 1.750.1 4.00.1 2.00.05 4.00.1 O1.5 -0 1.1 max 1.4 max Punch Hole 4000 to 5000* 1206 2.00.2 3.60.2 4000 to 5000* *Dependent on chip thickness * Embossed plastic carrier tape for 0805/1206 type and 1210 type Type A B W F E P1 P2 P0 D0 t1 Mounting Hole t2 Angular 3.60.2 8.00.3 3.50.05 1.750.1 4.00.1 2.00.05 4.00.1 O1.5+0.1 0.6max 2.5 max Embossed -0 3.60.2 Hole Unit: mm Quantity per Reel 0805 1.450.2 2.30.2 2000 to 5000* 1206 2.00.2 2000 to 5000* 1210 2.90.2 2000 to 4000* *Dependent on chip thickness * Embossed plastic carrier tape for 1812,1825, 2220 and 2225 type W F E P1 P2 Unit: mm Type A B P0 1812 3.60.2 4.90.2 1825 6.80.3 4.90.2 12.00.3 5.50.05 1.750.1 8.00.1 2.00.05 4.00.1 2220 5.50.3 6.20.3 2225 6.80.3 6.20.3 D0 t1 t2 O1.50. 1 0.6 max. 6.5 max. Mounting Hole Quantity per Reel Angular Embossed Hole 1000 1000 1000 1000 *Dependent on chip thickness 12 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors - All Dielectrics Tape and Reel Packing Quantities Chip Size 178 mm (7") Reel 330 mm (13") Reel 0402 10,000 N/A 0603 4,000 16,000 0805 4,000 12,000 0907 3,000 12,000 1206 4,000 15,000 1210 2,000, 4,000 8,000 1812 1,000 4,000 1825 1,000 4,000 2220 1,000 4,000 2225 1,000 4,000 The tape and reel packing quantities apply to voltages up to 200V rating only. The 0402 and 0603 size chips have similar width and thickness dimensions. 13 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors BULK CASE * Bulk case packaging can reduce the stock space and transportation costs. * The bulk feeding system can increase the productivity. * It can eliminate the components loss. * Structure and Dimension Symbol A B T C D E Dimension 6.80.1 8.80.1 120.1 1.5+0.1, -0 2+0, -0.1 4.70.1 Symbol F W G H L I Dimension 31.5+0.2, -0 36+0. -0.2 190.35 70.35 1100.7 50.35 * Quantity 14 Size 04(0402) 10(0603) Quantity 80,000 15,000 21(0805) T0.85mm T1.0mm 10,000 5,000 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors RELIABILITY AND CONDITIONS TEST Item Specification Capacitance Within tolerance shown by part number code Dissipation Factor (tan or Q) Insulation Resistance(IR) * Class (I) C<30pF:Q400+20xC C30pF:Q1000 * Class (II) B:DF2.5% F:DF5.0% C10,000pF:IR100G C>10,000pF:IR500/C Dielectric Withstanding Voltage There shall be no evidence of damage or flash over during the test Termination Adherence No mechanical damage Bend Strength No mechanical damage Life Test * Class (I) No more than 3% or 0.3pF (High Temperature Loading Test) C whichever is less * Class (II) B:10% max F:30% max * Class (I) C<10pF:Q>200+10xC Q 10C<30pF:Q275+5/2xC or C30pF:Q350 DF * Class (II) B:DF5.0% F:DF7.5% 1000M or 50F, min IR whichever is less Test Method * Class (1) C<1000pF:1MHz10%, 0.5 to 5Vrms C1000pF:1KHz10%, C<1000pF:1K1.00.2Vrms * Class (II) 1KHz10%, 1.00.2Vrms Apply rated voltage for 60 seconds at room temperature and normal humidity. (70% RH max) Apply 3 x rated voltage (Class I) or 2.5 x rated voltage (Class II) to both terminations for 5 seconds. Charge and discharge current are less than 50mA. Care shall be taken to avoid thermal shock. 500g of steady pull is applied in direction of arrow for 1 minute. After soldering capacitor on the glass-epoxy PWB, 2 mm of vending shall be applied for 10 seconds as shown by drawing. Applied 2 x rated voltage at maximum operating temperature for 1000 hours. The surge current shall not exceed 50mA after above testing condition, test samples shall be kept in room temperature for 24 hours (Class I) or 48 hours (Class II), and then shall be measured. 15 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors RELIABILITY AND CONDITIONS TEST Item Specification Moisture Test C Q or DF IR Moisture Resistance Test C Q or DF IR Temperature Cycle C Q or DF IR Solderability Resistance to Solder Heat Test 16 * Class (I) No more than 5% or 0.5pF whichever is larger * Class (II) B:l0% F:30% * Class (I) C<10pF:Q>200+10xC 10C<30pF:Q275+5/2xC C30pF:Q350 * Class (II) B:DF5.0% F:DF7.5% 1000M or 50F, whichever is less * Class (I) No more than 7.5% or 0.75pF whichever is larger * Class (II) B:10% F:30% * Class (I) C<30pF:Q>100+100/3xC C30pF:Q200 * Class (II) B:DF5.0% F:DF7.5% 500M or 25F, min whichever is less * Class (I) No more than 2.5% or 0.25pF whichever is larger * Class (II) B:5% F:20% To satisfy the specified initial value. To satisfy the specified initial value. Termination area shall be at least 95% covered with a new solder coating. There shall be no crack and ceramic exposure of terminated surface by melting. * Class (I) No more than 2.5% or 0.25pF C whichever is larger * Class (II) B:5% F.:20% Q To satisfy the specified or initial value. DF. IR To satisfy the specified initial value. Test Method The capacitors shall be subjected to 40C, 90-95%RH for 500 hours. After above testing condition, samples shall be kept in room temperature for 24 hours (Class I) or 48 hours (Class II), and then shall be measured. Apply rated voltage at 40C, 90-95%RH for 500 hours. The surge current shall not exceed 50mA. After testing with above condition, samples shall be kept in room temperature for 24 hours (Class 1) or 48 hours (Class 11), and then shall be measured. Perform 5 cycles as follow: 1. Room temperature. Dwell for 15 minutes. 2. Minimum operating temperature, dwell for 30 minutes. 3. Room temperature, dwell for 30 minutes. 4. Maximum operating temperature, dwell for 30 minutes. After above testing condition, samples shall be kept in room temperature for 24 hours (Class I) or 48 hours (Class II), and then shall be measured. The capacitors are completely immersed during 40.5 seconds in the molten solder with a temperature of 2305C *Solder: Sn 63. Immerse into molten solder at 2705C for 30.5 seconds. Preheat before immersion. 1. 80~100C for 2 minutes. 2.150~180C for 2 minutes. 3. 2705C for 30.5 seconds. The capacitance, measurement shall be made after sample keeping at room temperature for 24 hours. Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors 1. Temperature / Humidity Control Since dew condensation may occur by the differences in temperature when the products are take out of storage, it is important to maintain a temperaturecontrolled environment. 2. Design of Solder Land Pattern When designing printed circuit boards, the shape and size of the solder lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the probability that the chip will crack. The greater amount of solder, the larger amount of stress on the chip, and the more likely that it will break. Use the following illustrations as guidelines for proper solder land design. APPLICATION MANUAL FOR SURFACE MOUNTING Recommendation of solder land shape and size. 3. Adhesives MLCCs generally require the use of an adhesive to adhere the chips to the circuit board prior to wave soldering. 3-1. Requirements for Adhesives - They must have enough adhesion so that the chips will not fall off or move during the handling of the circuit board. - They must maintain their adhesive strength when exposed to soldering temperatures. - They should not spread or run when applied to the circuit board. - They should have a long pot life. - They should harden quickly. - They should not corrode the circuit board or chip material. - They should be a good insulator. - They should be non-toxic, and not produce harmful gases, nor be harmful when touched. 3-2. Application Method It is important to use the proper amount of adhesive. Too little will cause poor adhesion to the circuit board, and too much may strain the conductor pattern, thereby causing defective soldering. The following illustrations show the proper quantity of adhesive. (Unit: mm) Type 21 31 a 0.2 min 0.2 min b 70~100m 70~100m c >0 >0 3-3. Adhesive Hardening Characteristics To prevent oxidation of the terminations, the adhesive must harden at 160C or less, within 2 minutes or less. 17 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors 4. Mounting 4-1. Mounting Head Pressure Excessive pressure will cause chip capacitors to crack. The pressure between nozzle and chip capacitor will be 300g maximum during mounting. 4-2. Bending Stress Bending of printed circuit board by mounting head when double-sided circuit boards are used, chip capacitors first are mounted and soldered onto one side of the board. When the capacitors are mounted onto the other side, it is important to support the board as shown in the illustration . If the circuit board is not supported, it may bend, causing the already installed capacitors to crack. 5. Flux Although highly activated flux gives better solderability, substances which increase activity may also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended that a mildly activated rosin flux (less than 0.2% chlorine) be used. 6. Soldering Since a multilayer chip ceramic capacitor comes into direct contact with melted solder during soldering, it is exposed to potentially damaging mechanical stress caused by the sudden temperature change. The capacitor may also be subject to silver migration, and to contamination by the flux. Because of these factors, soldering technique is critical. 6-1. Soldering Methods Method Reflow Soldering Flow Soldering Classification Mass reflow * IR/Convection * VPS (Vapor phase) Selective reflow * Hot air/gas * Laser Dual Wave 6-2. Soldering Profile To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. 18 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors 6-3. Manual Soldering Manual Soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operator's carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip. 6-4. Amount of Solder Too much solder Cracks tend to occur due to large stress Amount of solder is adequate Maximum amount of solder Minimum amount of solder Not enough solder Weak holding force may cause bad connections or detaching of the capacitor 6-5. Cooling Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the temperature difference (T) must be less than 100C. 6-6. Cleaning If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This means that the cleaning fluid must be carefully selected, and should always be new. 7. Notes for Separating Multiple, Shared PC Boards A multi-PC board is separated into many individual circuit boards after soldering has been completed. If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. Carefully choose a separation method that minimizes the bending of the circuit board. 19 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors APPLICATION INFORMATION ON SOLDER PAD DESIGN FOR SURFACE MOUNT CHIP CAPACITOR Recommended Pad Dimensions Dimensions (inches) Chip Size L W S T 0402* 0.021 0.022 0.017 0.059 0603* 0.035 0.030 0.030 0.100 0805 0.040 0.050 0.040 0.120 0907 0.040 0.070 0.050 0.130 1206 0.040 0.065 0.080 0.160 1210 0.040 0.100 0.080 0.160 1812* 0.050 0.120 0.130 0.230 1825* 0.050 0.250 0.130 0.230 2220 0.050 0.250 0.130 0.230 2225* 0.050 0.250 0.170 0.270 3640* 0.060 0.400 0.300 0.420 *These sizes are recommended for use with IR and vapor phase soldering only. W (WIDTH) T (TOTAL LENGTH) L S L (LENGTH) (SEPARATION) (LENGTH) NOTICE: Specifications are subject to change without notice. Contact your nearest Cal-Chip Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all safety measures are indicated or that other measures may not be required. Specifications are typical and may not apply to all applications. 20 Cal-Chip Electronics, Incorporated GMC SERIES Multilayer Ceramic Chip Capacitors CHIP MARKING IDENTIFICATION SYSTEM Marking Proposed EIA Standard: Two Position Marking:* Alpha: 1st position significant figures of capacitance in pF Numerical: 2nd position decimal multiplier of capacitance NOTE: 0402, 0603, 0907 available unmarked only. CAPACITANCE Letter 0 1 2 3 4 5 Letter 0 A B C D E 1.0 1.1 1.2 1.3 1.5 10 11 12 13 15 100 110 120 130 150 1000 1100 1200 1300 1500 10,000 11,000 12,000 13,000 15,000 100,000 110,000 120,000 130,000 150,000 F G H J K 1.6 1.8 2.0 2.2 2.4 16 18 20 22 24 160 180 200 220 240 1600 1800 2000 2200 2400 16,000 18,000 20,000 22,000 24,000 160,000 180,000 200,000 220,000 240,000 a b d e f m n t y 2.5 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 L M N P Q 2.7 3.0 3.3 3.6 3.9 27 30 33 36 39 270 300 330 360 390 2700 3000 3300 3600 3900 27,000 30,000 33,000 36,000 39,000 270,000 300,000 330,000 360,000 390,000 R S T U V 4.3 4.7 5.1 5.6 6.2 43 47 51 56 62 430 470 510 560 620 4300 4700 5100 5600 6200 43,000 47,000 51,000 56,000 62,000 430,000 470,000 510,000 560,000 620,000 W X Y Z 6.8 7.5 8.2 9.1 68 75 82 91 680 750 820 910 6800 7500 8200 9100 68,000 75,000 82,000 91,000 680,000 750,000 820,000 910,000 x1.0 1 x10 2 3 4 5 x100 x1000 x10,000 x100,000 21