To our custo mers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corpor ation took over all the business of both
companies. Therefore, althoug h the old com pany name remains in this docum ent, it is a valid
Renesas Electronics document. W e appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
5. When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Ren esas E lectronics assumes no liability whatsoever for any da mages
incurred by you resulting from errors in or omissions from the information included herein.
7. Renesas Electronics products are classified acco rding to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, et c.
“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electro nic app liances; machine tool s; p ersonal electron ic equipment; and indu strial robots .
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”: Aircraft; aerospace equ i pment; submersible repeaters; nu clear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
interven tion (e.g. excision, et c.), and any oth er applications or purposes that pose a direct th reat to human life.
8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific chara cterist ics such as the o ccurren ce of failure at a certai n rate an d malfunct ion s under certai n u se cond ition s. Further,
Renesas Electronics pr oducts are not subject to radiation resi stance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
10. Please contact a Renesas Electronics sales office for det ai ls as to enviro nmental matters such as the en vi ronmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as us ed in this document means Renesas Electronics Corporation and also includes its majo ri ty-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
REJ03G0348-0400 Rev.4.00 Dec 10, 200 8
Page 1 of 8
CR05AS-8
Thyristor
Low Power Use REJ03G0348-0400
Rev.4.00
Dec 10, 2008
Features
• IT (AV) : 0.5 A
• VDRM : 400 V
• IGT : 100 µA
• Non-Insulated Type
• Planar Passivation Type
Outline
RENESAS Package code:
PLZZ0004
C
A-A
(
Package name:
U
PAK
)
2
4
1
3
RENESAS Package code:
LZZ0004CB-A
(
Package name:
SOT-
2
4
1
3
2, 4
1
3
1. Cathode
2. Anode
3. Gate
4. Anode
de: de:
PLZPLZ
OT-89OT-89
))
44
OL
O
OL
OL
OL P
O
Applications
Solid state relay, strobe flasher, igniter, and hybrid IC
Maximum Ratings
Voltage class
Parameter Symbol
8 (Mark CD) Unit
Repetitive peak reverse voltage VRRM 400 V
Non-repetitive peak reverse v oltag e VRSM 500 V
DC reverse voltage VR (DC) 320 V
Repetitive peak off-state voltageNote1 V
DRM 400 V
DC off-state voltageNote1 V
D (DC) 320 V
CR05AS-8
REJ03G0348-0400 Rev.4.00 Dec 10, 200 8
Page 2 of 8
Parameter Symbol Ratings Unit Conditions
RMS on-state current IT (RMS) 0.79 A
Average on-state current IT (AV) 0.5 A
Commercial frequency, sine half wave
180° conduction, Ta = 57°CNote2
Surge on-state current ITSM 10 A
60Hz sine half wave 1 full cycle,
peak value, non-repetitive
I2t for fusing I2t 0.4 A2s Value corresponding to 1 cycl e of half
wave 60Hz, surge on-state current
Peak gate power dissipation PGM 0.1 W
Average gate power dissipation PG (AV) 0.01 W
Peak gate forward voltage VFGM 6 V
Peak gate reverse voltage VRGM 6 V
Peak gate forward current IFGM 0.1 A
Junction temperature Tj – 40 to +125 °C
Storage temperature Tstg – 40 to +125 °C
Mass — 50 mg Typical value
Notes: 1. With gate to cathode resistance RGK = 1 kΩ.
Electrical Characteristics
Rated value
Parameter Symbol
Min. Typ. Max. Unit Test conditions
Repetitive peak reverse current IRRM — — 0.1 mA Tj = 125°C, VRRM applied
Repetitive peak off-state current IDRM — — 0.1 mA
Tj = 125°C, VDRM applied,
RGK = 1 kΩ
On-state voltage VTM — — 1.9 V
Ta = 25°C, ITM = 1.5 A,
instantaneous value
Gate trigger voltage VGT — — 0.8 V
Tj = 25°C, VD = 6 V,
IT = 0.1 ANote4
Gate non-trigger voltage VGD 0.2 — — V
Tj = 125°C, VD = 1/2 VDRM,
RGK = 1 kΩ
Gate trigger current IGT 20 — 100Note3 µA Tj = 25°C, VD = 6 V,
IT = 0.1 ANote4
Holding current IH — — 3 mA
Tj = 25°C, VD = 12 V,
RGK = 1 kΩ
Thermal resistance Rth (j-a) — — 70 °C/W Junction to ambientNote2
Notes: 2. Soldering with ceramic plate (25 mm × 25 mm × t0.7 mm).
3. If special values of IGT are required, choose it em E from those listed in the table below if possible.
Item B E
IGT (µA) 20 to 50 20 to 100
The above values do not include the current flowing through the 1 kΩ resistance between the gate and
cathode.
4. IGT, VGT measurement circuit.
3V
DC
I
GS
I
GT
6V
DC
60
Ω
V
GT
2
1
T
UT
1k
Ω
R
GK
A
3
A2
V1
A1
S
witc
h
Switch 1 : IGT measurement
Switch 2 : VGT measurement
(Inner resistance of voltage meter is about 1kΩ)
CR05AS-8
REJ03G0348-0400 Rev.4.00 Dec 10, 200 8
Page 3 of 8
Performance Curves
Maximum On-State Characteristics
On-State Current (A)
On-State Voltage (V)
Rated Surge On-State Current
Surge On-State Current (A)
Conduction Time (Cycles at 60Hz)
Maximum Transient Thermal Impedance
Characteristics (Junction to ambient)
Transient Thermal Impedance (°C/W)
Time (s)
Gate Trigger Voltage vs.
Junction Temperature
Gate Trigger Voltage (V)
Junction Temperature (°C)
Gate Voltage (V)
Gate Current (mA)
Gate Trigger Current vs.
Junction Temperature
Junction Temperature (°C)
Gate Characteristics
× 100 (%)
Gate Trigger Current (Tj = t°C)
Gate Trigger Current (Tj = 25°C)
10
0
25710
1
4
2
10
2
4325743
6
8
10
3
1
5
7
9
0
501 423
10
2
7
5
3
2
10
1
7
5
3
2
10
0
7
5
3
2
10
–1
Ta = 25°C
10
2
10
–2
10
0
10
1
10
1
7
5
3
2
10
–1
7
5
3
2
10
0
7
5
3
2
7
5
3
2
10
–2
23 57 23 57
10
–1
10
2
23 57 23 57
V
FGM
= 6V
V
GT
= 0.8V
I
GT
= 100µA
(Tj = 25°C)
P
GM
= 0.1W
V
GD
= 0.2V I
FGM
= 0.1A
1.0
0.8
0.7
0.6
0.3
0.4
0.1
0160
–40–20 20 80 140120
0.2
0.5
0.9
06040 100
60–20–40–60 0 20 40 80 100 120 140
10
3
7
5
3
2
10
2
7
5
3
2
10
1
7
5
3
2
10
0
2310
0
5710
1
23 5710
2
23 5710
3
10
1
2310
–3
5710
–2
23 5710
–1
23 5710
0
10
3
7
5
3
2
10
2
7
5
3
2
7
5
3
2
10
0
25
×
25
×
t0.7
Aluminum Board
P
G(AV)
= 0.01W
Typical Example
Distribution
Typical Example
CR05AS-8
REJ03G0348-0400 Rev.4.00 Dec 10, 200 8
Page 4 of 8
Maximum Average Power Dissipation
(Single-Phase Half Wave)
Average Power Dissipation (W)
Average On-State Current (A) Average On-State Current (A)
Maximum Average Power Dissipation
(Single-Phase Full Wave)
Average Power Dissipation (W)
Average On-State Current (A)
Allowable Ambient Temperature vs.
Average On-State Current
(Single-Phase Full Wave)
Allowable Ambient Temperature vs.
Average On-State Current
(Single-Phase Half Wave)
Ambient Temperature (°C)Ambient Temperature (°C) Ambient Temperature (°C)
Average On-State Current (A)
Average On-State Current (A)
Maximum Average Power Dissipation
(Rectangular Wave)
Average Power Dissipation (W)
Average On-State Current (A)
Allowable Ambient Temperature vs.
Average On-State Current
(Rectangular Wave)
1.5
1.0
0.5
00.8
00.2 0.4 0.6 0.70.1 0.3 0.5
θ = 30° 60° 120°
90° 180°
270°
DC
1.5
1.0
0.5
00.8
00.2 0.4 0.6 0.70.1 0.3 0.5
θ = 30° 60° 120°
90°
180°
160
120
60
40
20
140
100
80
00.8
00.2 0.4 0.6
θ = 30°
60° 120°
90° 180°
160
120
60
40
20
140
100
80
00.8
00.2 0.4 0.6
θ = 30°
DC
270°60°
1.5
0.5
1.0
00.8
0 0.2 0.4 0.6 0.70.1 0.3 0.5
θ = 30° 60° 90° 180°
120°
160
120
60
40
20
140
100
80
00.8
00.2 0.4 0.6
θ = 30°
60° 120°
90° 180°
θ
360°
Resistive,
inductive loads
θ
360°
Resistive,
inductive loads
Natural convection
25×25×t0.7
Aluminum Board
25×25×t0.7
Aluminum Board
25×25×t0.7
Aluminum Board
θ θ
360°
Resistive loads
θ
360°
Resistive,
inductive loads
θ θ
360°
Resistive loads
Natural convection
θ
360°
Resistive, inductive loads
Natural convection
120°
180°90°
CR05AS-8
REJ03G0348-0400 Rev.4.00 Dec 10, 200 8
Page 5 of 8
Breakover Voltage vs.
Gate to Cathode Resistance
Gate to Cathode Resistance (kΩ)
× 100 (%)
Breakover Voltage (RGK = rkΩ)
Breakover Voltage (RGK = 1kΩ)
Breakover Voltage vs.
Junction Temperature
Junction Temperature (°C)
× 100 (%)
Breakover Voltage (Tj = t°C)
Breakover Voltage (Tj = 25°C)
Holding Current vs.
Junction Temperature
Holding Current (mA)
Junction Temperature (°C)
Holding Current vs.
Gate to Cathode Resistance
Gate to Cathode Resistance (kΩ)
× 100 (%)
Holding Current (RGK = rkΩ)
Holding Current (RGK = 1kΩ)
Breakover Voltage vs.
Rate of Rise of Off-State Voltage
Rate of Rise of Off-State Voltage (V/µs)
× 100 (%)
Breakover Voltage (dv/dt = vV/µs)
Breakover Voltage (dv/dt = 1V/µs)
160
120
60
40
20
140
100
80
0160
–40 0 40 80 120140–20 20 60 100
2310
–1
5710
0
23 5710
1
23 5710
2
120
0
80
100
40
60
20
2310
0
5710
1
23 5710
2
23 5710
3
120
0
80
100
40
60
20
# 1
# 2
Typical Example
# 1 IGT(25°C = 10µA)
# 2 IGT(25°C = 66µA)
Tj = 125°C, RGK = 1kΩ
60–20–40
–60 0 20 40 80 100 120140
10
2
7
5
3
2
10
1
7
5
3
2
10
0
7
5
3
2
10
–1
2310
–1
5710
0
23 5710
1
23 5710
2
500
0
200
300
400
100
# 1
# 2
160
120
100
40
60
20
0160
–40–20 20 80 140120
80
140
06040 100
Junction Temperature (°C)
× 100 (%)
Repetitive Peak Reverse Voltage (Tj = t°C)
Repetitive Peak Reverse Voltage (Tj = 25°C)
Repetitive Peak Reverse Voltage vs.
Junction Temperature
R
GK = 1kΩ
Typical Example Typical Example
Tj = 125°C
Distribution
Typical Example
Tj = 25°C
IH (25°C) = 1mA
IGT(25°C) = 25µA
Tj = 25°C
Typical Example
IGT(25°C) IH(1kΩ)
13µA1.6mA
59µA1.8mA
# 1
# 2
Typical Example
CR05AS-8
REJ03G0348-0400 Rev.4.00 Dec 10, 200 8
Page 6 of 8
Gate Trigger Current vs.
Gate Current Pulse Width
× 100 (%)
Gate Trigger Current (tw)
Gate Trigger Current (DC)
Gate Current Pulse Width (µs)
10
2
22310
0
45 710
1
345 7
10
2
7
5
10
3
4
3
2
7
5
2
4
3
10
1
# 1
# 2
Tj = 25°C
Typical Example
IGT(25°C)
10µA
66µA
# 1
# 2
CR05AS-8
REJ03G0348-0400 Rev.4.00 Dec 10, 200 8
Page 7 of 8
Package Dimensions
4.5 ± 0.1
1.8 Max 1.5 ± 0.1
0.44 Max
0.44 Max
0.48 Max
0.53 Max
1.5 1.5
3.0
2.5 ± 0.1
4.25 Max
0.8 Min
φ1
0.4
(1.5)
(2.5)
(0.4)
(0.2)
Previous Code
PLZZ0004CA-A UPAK / UPAKV
MASS[Typ.]
0.050gSC-62
RENESAS CodeJEITA Package Code Unit: mm
Package Name
UPAK
SC
-62
0
.4
8g
MA
SS
[Typ.
]
P
LZZ0004
C
B-A
RENE
S
A
S
C
odeJEITA Package
C
ode Previous
C
ode Unit: mm
4.6Max
0.48Max
0.58Max
3.0
1.5
4.2Ma
2.5
1.6 ± 0.2
0.4
+0.03
–0.05
P
acka
g
e Name
SO
T-
89
EOL PKG
L P
OL
OL
L
OL
OL
L
L
OL
L
OL
L
L
L
K
K
K
PK
P
P
P
PK
PK
PK
PK
P
P
P
P
O
OL
O
O
O
O
K
KG
PK
K
K
OL
OL
OL
OL
L
L
L
L
L
L
O
K
K
K
K
K
K
O
O
O
O
O
O
Max
0
.
8
Min
n
55
±±
0
.1
0.1
1
.5
1.5
±±
0
.
1 0.1
CR05AS-8
REJ03G0348-0400 Rev.4.00 Dec 10, 200 8
Page 8 of 8
Order Code
Lead form Standard packing Quantity Standard order code Standard order
code example
Surface-mounted type Taping 4000 Type name – ET +Direction (1 or 2) + 4 CR05AS-8-ET14
Note : Please confirm the specification about the s hipp ing in detail.
Notes:
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes
warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property
rights or any other rights of Renesas or any third party with respect to the information in this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,
but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass
destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws
and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be
disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a
result of errors or omissions in the information included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability
of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular
application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications
or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality
and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or
undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall
have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing
applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,
movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages
arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain
rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage
caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software
alone is very difficult, please evaluate the safety of the final products or system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as
swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products.
Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have
any other inquiries.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7858/7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2377-3473
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 3518-3399
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1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
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