REVISIONS
LTR DESCRIPTION DATE (YR-MO-DA) APPROVED
A
Add case out lin es, terminal connections and thermal resistance values for case
outlines 2 and 3. For device type 01, 02, and 03, add subgroup 3 to IIH and IIL te st,
add RDS1 test, add VISO test, delete VCT te st, chan g e RL and CL test conditions fo r
tON(A) and tOFF(A) test s, change CL test con d i tion for tON(EN) and tOFF(EN) tests, change
value of ID for RDS1 test, chang e value of ID and VS for RDS2 test, add test condition
circuits. Editorial changes throughout.
88-08-26
D. A. DiCen zo
B
Add device type s 07, 08, and 09. Table I change s. Editoria l Changes throughout.
93-06-28
M. A. Frye
C
Changes in accordance with NOR 5962-R061-95.
95-01-25
M. A. Frye
D
Changes in accordance with NOR 5962-R032-96.
96-01-09
M. A. Frye
E
Incorpora te NOR’s and current requireme nts. Editorial changes thro ughout. - drw
02-12-30
Raymond Mo nnin
REV E E E
SHEET 35 36 37
REV E E E E E E E E E E E E E E E E E E E E
SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
REV STATUS REV E E E E E E E E E E E E E E
OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14
PMIC N/A PREPARED BY
Marcia B. Ke lleher
DEF ENS E SUPP L Y CE NTE R CO L UMBUS
STANDA RD
MICROCIRCUIT
DRAWING
CHECKED BY
Ray Monnin
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
D. A. DiCen zo
MICROCIRCUIT , L INE A R, CMO S ,
MULTIPLEXER/DEMULTIPLEXER,
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
86-06-30
MONOL ITHIC S IL ICO N
AMSC N/A
REVISION LEVEL
E SIZE
A CAGE CODE
67268
5962-85131
SHEET
1 OF
37
DSCC FORM 2233
APR 97 5962-E118-03
DISTRIBUTION STATEMENT A. Approve d for public relea se; distribution is unlimited.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 2
DSCC FORM 2234
APR 97
1. SCOPE
1.1 Scope. This dra w ing describes device require m ents for M IL-STD- 883 com plia nt, non-JAN clas s level B microcircuit s in
accordance with MIL-PRF-38535, appe ndix A.
1.2 Par t or Ident ifyi ng Num ber (PIN). The comple te PIN is as s hown in the following ex a mple:
5962-85131 01 E A
Drawing number
Device type
(see 1.2. 1) Ca se outli ne
(see 1.2. 2) Lead finish
(see 1.2. 3)
1.2.1 De vice types. The device types identify the circuit function as follows:
Device type Generic number Circuit function
01 HI546 Single 16-channel MUX/DEMUX with overvolt age protection
02 HI547 Dif fe rential 8-channel MUX/DEMUX with overvoltage prote ction
03 HI549 Dif fe rential 4-channel MUX/DEMUX with overvoltage prote ction
04 HI5116 Si ngle 16-cha nnel MUX/DEMUX with overvoltage prote ction
05 HI5216 Di ff er entia l 8-cha nnel MUX/DEMUX with overvoltage prote ction
06 HI5208 Di ff er entia l 4-cha nnel MUX/DEMUX with overvoltage prote ction
07 HI506 Single 16-channel MUX/DEMUX
08 HI507 Dif fe rential 8-channel MUX/DEMUX
09 HI509 Dif fe rential 4-channel MUX/DEMUX
1.2.2 Ca se out li nes. The case outlines are as de signat ed in MI L-STD- 1835 and as follows:
Outline letter Descriptive designator Terminals Package style
E GDIP-T16 or CDIP-T16 16 Dual-in-line
X GDIP-T28 or CDIP-T28 28 Dual-in-line
2 CQCC1-N 20 20 Square leadless chip car rier
3 CQCC1-N 28 28 Square leadless chip car rier
1.2.3 Le ad finish. The lea d finish is a s spe cified in MIL-PRF-38535, appe ndix A.
1.3 Absolute m axi m um ratings.
Supply vol ta ge between +V and -V................................................................... +44 V
Supply vol tage between +V and gr ound:
Device types 01-03, 07-09 ............................................................................ +22 V
Device types 04-06........................................................................................ +20 V
Supply voltage between -V and ground:
Device types 01-03, 07-09 ............................................................................ -25 V
Device types 04-06........................................................................................ -20 V
Digital input voltage range ( VA, VEN):
Device types 01-03, 07-09 ............................................................................ [(-V) -4 V) to (+V) +4 V]
or 20 mA whicheve r comes first
Device types 04-06........................................................................................ -V to +V or 20 mA whicheve r comes first
Analog input volt age range (VS):
Device types 01-03........................................................................................ [(-V) -20 V) to (+V) +20 V]
Device types 04-06........................................................................................ [(-V) -25 V) to (+V) +25 V]
Device types 07-09........................................................................................ [(-V) -2 V) to (+V) +2 V]
STANDA RD
MICROCIRCUIT DRAWING
SIZE
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5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 3
DSCC FORM 2234
APR 97
Continuous curr ent, source or drain................................................................. 20 mA
Peak curr ent, sour ce or drain, pulsed, 1 ms,
10 percent duty cycle max................................................................................ 40 mA
Storage temperature range............................................................................... -65°C to +150°C
Maxim um power dissipation (PD):
Case E........................................................................................................... 1.25 W
Case X........................................................................................................... 2 W
Case 2............................................................................................................ 1.32 W
Case 3............................................................................................................ 1.23 W
Derating factor:
Case E........................................................................................................... 12.5 mW/°C above TA = +75°C
Case X........................................................................................................... 20 mW/°C above TA = +75°C
Case 2............................................................................................................ 13.2 mW/°C above TA = +75°C
Case 3............................................................................................................ 12.3 mW/°C above TA = +75°C
Thermal resistance, junction-to-case (
θ
JC):
Cases E, X, 2, and 3 ..................................................................................... See MIL-STD-1835
Therm al re sist ance, junct ion-t o-ambient (
θ
JA):
Case E........................................................................................................... 80°C/W
Case X........................................................................................................... 50°C/W
Case 2............................................................................................................ 76°C/W
Case 3............................................................................................................ 81°C/W
Lead temper ature ( solder ing, 10 s econds)....................................................... +275°C
Junction temperature (TJ)................................................................................. +175°C
1.4 Recommended ope rating conditions.
Supply voltage bet ween +V a nd ground........................................................... +15 V
Supply voltage between -V and ground............................................................ -15 V
V
REF (device ty pes 01 and 02 only)................................................................... open
V
AL(max )............................................................................................................ 0.8 V
V
AH(min):
Device types 01-03........................................................................................ 4.0 V
Device types 04-09........................................................................................ 2.4 V
V
EN:
Device types 01-03........................................................................................ 4.0 V
Device types 04-09........................................................................................ 2.4 V
Ambient opera ting tem pera tur e ra nge (TA)....................................................... -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specifica tion, standa rds, and handbooks . The foll owing specifica tion, sta ndards, a nd handbooks form a pa rt
of this drawing to the exte nt spe cified he re in. Unles s otherwise specifie d, t he iss ues of the se docume nts a re t hose list ed in the
is sue of the Department of Defense Index of Specif icat ions and St andar ds ( DoDISS) and s upplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuit s, Manufacturing, General Specifica tion for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Inte rf ace Standard Electronic Component Case O utlines.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 4
DSCC FORM 2234
APR 97
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - Li st of St andard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwis e indicat ed, copie s of the s pecifica tion, sta ndards, a nd handbooks a re a vaila ble from the Standardizat ion
Docume nt Or der Desk, 700 Robbins Avenue, Building 4D, Phila delphia, PA 19111-5094. )
2.2 Order of pr ece dence. In the event of a confli ct between the tex t of this drawing and the references ci te d herein, the tex t of
this dr awing ta kes prece dence. Nothing in this docume nt, however, supe rse des applica ble laws a nd regulations unles s a s pecific
exe mption has been obtained.
3. REQUIREMENTS
3.1 Ite m requirem ents. The individual item requir ement s sha ll be in accor dance wit h M IL-PRF- 38535, a ppendix A for non-JAN
clas s level B devices a nd as s pecified herein. Product built to t his dra wing that is pr oduced by a Qualified Manufacturer Listing
(QM L) certified a nd qualified ma nufacturer or a manufacturer who has been granted trans itional certifica tion to MIL-PRF-38535
ma y be proce sse d as QML product in accor dance with the manufacturer s appr oved progr am plan and qua li fyi ng activity appr ova l
in accordance wit h M IL-PRF- 38535. This QML f low as document ed in the Q uality Manage m ent (QM) plan may make
modifi cati ons to the requirements herein. These modifications shal l not affect form, fit, or function of the dev ice. These
modifica tions shall not a ff ect the PIN as described herein. A "Q" or "QML" ce rt ification mark in accor dance with MIL-PRF-38535 is
required to identify when t he QM L flow option is us ed.
3.2 Design, construction, and physical di m ensions . The des ign, cons tr uction, and physical di m ensions s hall be as specif ied in
MIL-PRF-38535, appendix A and herein.
3.2.1. Case outlines. The case outlines shall be in accor dance wit h 1.2. 2 herein.
3.2.2. Terminal connections. The term inal connect ions shall be as specif ied on figure 1.
3.2.3. Trut h tables. The trut h tables shall be as specifie d on figure 2.
3.3 Elect rical per for mance cha racteris tics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and sha ll a pply over the f ull ambient operating temperature r ange.
3.4 Elect rical t est requirem ent s. The electrical test requirements shall be t he subgroups spe cified in t able II . The e lect rical test s
for e ach subgroup ar e des cribed in t able I.
3.5 Marking. M arki ng sha ll be in accor dance with MIL- PRF-38535, appendix A. The pa rt shall be mar ked with the PIN list ed in
1.2 her ein. In addit ion, the manufacturer's PIN may also be mar ked as lis te d in MIL- HDBK-103 ( see 6.6 herein). For packa ges
where marking of t he entire SMD PIN number is not fea sible due to spa ce lim ita tions, the m anufact urer has the opt ion of not
ma rking the "5962-" on the device.
3.5.1 Ce rt ification/compliance ma rk. A com plia nce indicat or “ C ” s hall be marke d on all non-JAN de vices buil t in compl iance t o
MIL-PRF-38535, appendix A. The compliance indicator “ C ” s hall be r eplaced with a "Q" or "Q M L" ce rt ification mark in accordance
wit h MIL-PRF- 38535 to identify when the QML flow option is used.
3.6 Cer tifica te of com plia nce. A certificat e of com plia nce shall be required fr om a manufacturer in order to be list ed as an
approved source of supply in MIL-HDBK- 103 (s ee 6.6 her ein). The certifi cate of compliance s ubm itt ed t o DSCC-VA pr ior t o li st ing
as an a pproved s ource of supply shall affirm that the manuf act urer ' s product meet s t he requirements of MIL- PRF-38535, appendix
A and the require m ents her ein.
3.7 Cer tifica te of conform ance. A cer tifica te of confor m ance as require d in MIL- PRF-38535, appendix A shall be pr ovide d with
each lot of microcircuits delive red t o this drawing.
3.8 Notifica tion of change. Notification of change to DSCC-VA shall be require d in accorda nce with MIL-PRF-38535, appendix
A.
3.9 Ver ification and re view. DSCC, DSCC's agent, and the acquiri ng activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristi cs.
Test
Symbol
Condit ions 1/
-55°C ≤ TA ≤ +125°C
-V = -15 V, +V = +15 V
Group A
subgroups
Device
type
Limits Unit
unles s otherwise specifie d Min Max
Input leakage current 2/ IIH Meas ure inputs seque ntially, 1, 2, 3 01, 02,
03, 04, 1.0 µA
connect all unused inputs to
GND 05, 07,
08, 09
1, 3 06 -1.0 1.0
2 -10.0 10.0
IIL 1, 2, 3 01, 02,
03, 04, 1.0
05, 07,
08, 09
1, 3 06 -1.0 1.0
2 -10.0 10.0
Leakage current into the
source terminal of an “OFF”
switch +IS(OFF) VS = +10 V, VEN = 0.8 V, a ll
unused inputs = -10 V,
VD = -10 V 1 01, 02,
03, 07,
08, 09 -10 +10 nA
04, 05,
06 -1 +1
2, 3 All -50 +50
-IS(OFF) VS = -10 V, VEN = 0.8 V, a ll
unused inputs = +10 V,
VD = +10 V 1 01, 02,
03, 07,
08, 09 -10 +10
04, 05,
06 -1 +1
2, 3 All -50 +50
Leakage current into the
drain terminal of an “OFF”
switch +ID(OFF) VD = +10 V, VEN = 0.8 V, all
unused inputs = -10 V 1 01, 02,
03, 07,
08, 09 -10 +10 nA
04, 05,
-2 +2
06 -1 +1
2, 3
01, 04,
07 -300 +300
02, 08 -200 +200
03, 06,
09 -100 +100
05 -150 +150
See footnot es at end of table.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristi cs - cont inued.
Test
Symbol
Condit ions 1/
-55°C ≤ TA ≤ +125°C
-V = -15 V, +V = +15 V
Group A
subgroups
Device
type
Limits Unit
unles s otherwise specifie d Min Max
Leakage current into the
drain terminal of an “OFF”
switch -ID(OFF) VD = -10 V, VEN = 0.8 V, all
unused inputs = +10 V 1 01, 02,
03, 07,
08, 09 -10 +10 nA
04, 05,
-2 +2
06 -1 +1
2, 3
01, 04,
07 -300 +300
02, 08 -200 +200
03, 06,
09 -100 +100
05 -150 +150
Leakage current from an
“ON” driver into the switch
(drain) +ID(ON) VD = +10 V, VS = +10 V, all
unused inputs = -10 V 1 01, 02,
03, 07,
08, 09 -10 +10 nA
04, 05,
06 -2 +2
2, 3
01, 04,
07 -300 +300
02, 08 -200 +200
03, 06,
09 -100 +100
05 -150 +150
-ID(ON) VD = -10 V, VS = -10 V, all
unused inputs = +10 V 1 01, 02,
03, 07,
08, 09 -10 +10
04, 05,
06 -2 +2
2, 3
01, 04,
07 -300 +300
02, 08 -200 +200
03, 06,
09 -100 +100
05 -150 +150
See footnot es at end of table.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristi cs - cont inued.
Test
Symbol
Condit ions 1/
-55°C ≤ TA ≤ +125°C
-V = -15 V, +V = +15 V
Group A
subgroups
Device
type
Limits Unit
unles s otherwise specifie d Min Max
Overvoltage protected,
leakage current into the
+ID(OFF)
overvoltage
VS =+33 V, VD = 0 V,
VEN = 0. 8 V, VS applied at
≤
25% dut y cycle 1, 2, 3 01, 02,
03, -2.0 +2.0 µA
drain te rminal of an
“OFF” switch VS =+25 V, VD = 0 V,
VEN = 0. 8 V 1, 3 04, 05,
06 -2.0 +2.0
2 -5 +5
-ID(OFF)
overvoltage
VS =-33 V, VD = 0 V,
VEN = 0. 8 V, VS applied at
≤
25% dut y cycle 1, 2, 3 01, 02,
03, -2.0 +2.0
VS =-25 V, VD = 0 V,
VEN = 0. 8 V 1, 3 04, 05,
06 -2.0 +2.0
2 -5 +5
Positiv e supply current +I VA = 0 V, VEN = 4.0 V 1, 2, 3 01, 02,
03 2.0 mA
V
A = 0 V, VEN = 2.4 V 04, 05 2.0
07, 08 3.0
09 2.4
V
A = 5 V, VEN = 2.4 V 06 2.0
Negative s upply cur rent -I VA = 0 V, V EN = 4.0 V 1, 2, 3 01, 02,
03 -1.0 mA
V
A = 0 V, VEN = 2.4 V 04, 05,
07, 08,
09 -1.0
V
A = 5 V, VEN = 2.4 V 06 -1.0
Standby positive s upply
current +ISBY V
A = 0 V, VEN = 0 V 1, 2, 3 01, 02,
03, 04,
05, 06 2.0 mA
07, 08 3.0
09 2.4
Standby negative s upply
current -ISBY V
A = 0 V, VEN = 0 V 1, 2, 3 All -1.0 mA
See footnot es at end of table.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 8
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristi cs - cont inued.
Test
Symbol
Condit ions 1/
-55°C ≤ TA ≤ +125°C
-V = -15 V, +V = +15 V
Group A
subgroups
Device
type
Limits Unit
unless otherw ise s pecified Min Ma x
Switch “ON” resi stance +RDS1 V
S = +10 V, ID = -100 µA 1 01, 02,
03, 1.5 k
Ω
2, 3 1.8
V
S = +10 V, ID = +100 µA 1 04, 05,
06 1.5
2, 3 2.0
V
S = +10 V, ID = -1 mA 1 07, 08,
09 300
Ω
2, 3 400
-RDS1 V
S = -10 V, ID = +100 µA 1 01, 02,
03, 1.5 k
Ω
2, 3 1.8
V
S = -10 V, ID = -100 µA 1 04, 05,
06 1.5
2, 3 2.0
V
S = -10 V, ID = +1 mA 1 07, 08,
09 300
Ω
2, 3 400
+RDS2 +V = +10 V, -V = - 10 V, 1, 3 04, 05,
06 2.2 k
Ω
3/ VS = +5.0 V, ID = +100 µA 2 2.4
-RDS2 +V = +10 V, -V = -10 V, 1, 3 04, 05,
06 2.2
3/ VS = -5.0 V, I D = -100 µA 2 2.4
Difference in switch “ON”
resistance between
channels
∆
RDS1 TA = +25°C
(+RDS1 max) – (+RDS1 min) X 100
+RDS1 Ave 1 01. 02,
03 7 %
TA = +25°
C
(-RDS1 max) – (-RDS1 min) X 100 -
RDS1 Av e 7
Capacitance: CA +V = -V = 0 V, f = 1 MHz, 4 01, 02,
03 15 pF
Address TA = +25°C, See 4.3. 1c 04, 05,
06 3/ 10
07, 08 12
09 10
See footnot es at end of table.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
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5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 9
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristi cs - cont inued.
Test
Symbol
Condit ions 1/
-55°C ≤ TA ≤ +125°C
-V = -15 V, +V = +15 V
Group A
subgroups
Device
type
Limits Unit
unles s otherwise specifie d Min Max
Capacitance: COS +V = -V = 0 V, f = 1 M H z, 4 01 85 pF
Output switch TA = +25°C, See 4.3.1c 02, 08 50
03, 09 25
04, 05,
06 3/ 85
07 90
Capacitance: CIS +V = -V = 0 V, f = 1 MHz, 4 01, 02,
03 15 pF
Input switch TA = +25°C, See 4.3.1c 04, 05,
06 3/ 10
07, 08,
09 12
Charge transfer error VCTE VS = GND, VGEN = 0 V to 5 V,
TA = +25°C 3/ 7 All 10 mV
Off isolat ion VISO VEN = 0. 8 V, VS = 7 Vrms,
RL = 1 k
Ω
, CL = 15 pF,
f = 100 kHz, TA = +25°C 3/ 7 01, 02,
03, 07,
08, 09 -50 dB
Single cha nnel isolation VISO VEN = 0 V, VGEN = 1 Vp-p,
RL = 200
Ω
, f = 200 kHz ,
TA = +25°C 3/ 7 04, 05,
06 -50 dB
Crosstalk between
channels VCT VGEN = 1 Vp-p, f = 200 kHz,
TA = +25°C 3/ 7 04, 05,
06 -50 dB
Break-before-make time
delay tD T
A = +25°C, See figure 3 9 01, 02,
03, 5 ns
04, 05,
06 3/ 5
RL = 1 k
Ω
, CL = 50 pF,
TA = +25°C, See figure 3 07, 08,
09 25
Propagation delay times :
Address inputs to I/O tON(A) R
L = 10 k
Ω
, CL = 50 pF 9 01, 02,
03, 07 500 ns
channels t ime s: tOFF(A) See figure 4 10, 11 08, 09 1,000
R
L = 1 k
Ω
, CL = 100 pF 9 04, 05,
06 1,000
See figure 4 10, 11 1,500
See footnot es at end of table.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
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5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 10
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristi cs - cont inued.
Test
Symbol
Condit ions 1/
-55°C ≤ TA ≤ +125°C
-V = -15 V, +V = +15 V
Group A
subgroups
Device
type
Limits Unit
unles s otherwise specifie d Min Max
Enable to I/O tON(EN) R
L = 1 k
Ω
, CL = 50 pF 9 01,02,
03, 07 500 ns
tOFF(EN) See figure 4 10, 11 08, 09 1,000
R
L = 1 k
Ω
, CL = 100 pF 9 04, 05
06 700
See figure 4 10, 11 1,000
1/ For de vice types 01 and 02, VREF = open. For device types 01, 02, and 03, VEN = 4. 0 V unless otherw ise s pecified. For device
types 04, 05, 06, 07, 08 and 09, V EN = 2.4 V unless othe rwise s pecif ied. For device types 04, 05, and 06, curr ent flowing in
either direction betwee n any associate d input and output t erminals of the s w itch s hall be 30 mA.
2/ Input current of one input mode .
3/ Guaranteed, if not tested, to the l imits s pecified.
STANDA RD
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DEFENSE SUPPLY CENTER COLUMBUS
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E SHEET 11
DSCC FORM 2234
APR 97
Case
outline E X X X X 2 3 3 3 3
Device
ty pe 03, 06,
09 01 02 04, 07 05, 08 03, 06,
09 01 02 07 08
Terminal
number Terminal symbol
1 A0 V+ V+ V+ V+ NC V+ V+ V+ V+
2 Enable NC OUT B NC OUT B A0 NC OUT B NC OUT B
3 V- NC NC NC NC Enable NC NC NC NC
4 IN 1A IN 16 IN 8B I N 16 I N 8B V- IN 16 IN 8B IN 16 I N 8B
5 IN 2A IN 15 I N 7B I N 15 I N 7B IN 1A I N 15 IN 7B IN 15 I N 7B
6 IN 3A IN 14 IN 6B I N 14 IN 6B NC IN 14 IN 6B I N 14 IN 6B
7 IN 4A IN 13 I N 5B I N 13 I N 5B IN 2A I N 13 IN 5B IN 13 I N 5B
8 OUT A IN 12 IN 4B I N 12 IN 4B I N 3A I N 12 I N 4B I N 12 IN 4B
9 OUT B IN 11 IN 3B I N 11 IN 3B I N 4A I N 11 I N 3B I N 11 IN 3B
10 I N 4B I N 10 IN 2B IN 10 I N 2B OUT A IN 10 IN 2B IN 10 I N 2B
11 I N 3B I N 9 IN 1B I N 9 IN 1B NC IN 9 IN 1B IN 9 IN 1B
12 IN 2B GND GND GND GND OUT B GND GND GND GND
13 IN 1B VREF V
REF NC NC IN 4B VREF V
REF NC NC
14 V+ A3 NC A3 NC IN 3B A3 NC A3 NC
15 GND A2 A2 A2 A2 IN 2B A2 A2 A2 A2
16 A1 A1 A1 A1 A1 NC A1 A1 A1 A1
17 --- A0 A0 A0 A0 IN 1B A0 A0 A0 A0
18 --- Enable Enable Enable Enable V+ Enable Enable Enable Enable
19 --- I N 1 IN 1A IN 1 IN 1A GND IN 1 IN 1A I N 1 I N 1A
20 --- I N 2 IN 2A IN 2 IN 2A A1 IN 2 I N 2A IN 2 IN 2A
21 --- IN 3 I N 3A IN 3 IN 3A --- IN 3 IN 3A I N 3 I N 3A
22 --- IN 4 I N 4A IN 4 IN 4A --- IN 4 IN 4A I N 4 I N 4A
23 --- IN 5 I N 5A IN 5 IN 5A --- IN 5 IN 5A I N 5 I N 5A
24 --- IN 6 I N 6A IN 6 IN 6A --- IN 6 IN 6A I N 6 I N 6A
25 --- IN 7 I N 7A IN 7 IN 7A --- IN 7 IN 7A I N 7 I N 7A
26 --- IN 8 I N 8A IN 8 IN 8A --- IN 8 IN 8A I N 8 I N 8A
27 --- V- V- V- V- --- V- V- V- V-
28 --- OUT OUT A OUT OUT A --- OUT OUT A OUT OUT A
FIGURE 1. Te rminal connections.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 12
DSCC FORM 2234
APR 97
Device type s 01, 04, and 07 Device type s 02, 05, and 08
A3 A2 A1 A0 EN CHANNEL
SELECTED A2 A1 A0 EN CHANNEL
SELECTED
X X X X L NONE X X X L NONE
L L L L H 1 L L L H 1A, 1B
L L L H H 2 L L H H 2A, 2B
L L H L H 3 L H L H 3A, 3B
L L H H H 4 L H H H 4A, 4B
L H L L H 5 H L L H 5A, 5B
L H L H H 6 H L H H 6A, 6B
L H H L H 7 H H L H 7A, 7B
L H H H H 8 H H H H 8A, 8B
H L L L H 9
H L L H H 10
H L H L H 11
H L H H H 12
H H L L H 13
H H L H H 14
H H H L H 15
H H H H H 16
Device type s 03, 06, and 09
A1 A0 EN CHANNEL
SELECTED
X X L NONE
L L H 1A, 1B
L H H 2A, 2B
H L H 3A, 3B
H H H 4A, 4B
FIGURE 2. Truth tables.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 13
DSCC FORM 2234
APR 97
FIGURE 3. Break-before-make test circuit and waveforms.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 14
DSCC FORM 2234
APR 97
FIGURE 3. Break-before-make test circuit and waveforms – continued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 15
DSCC FORM 2234
APR 97
FIGURE 3. Break-before-make test circuit and waveforms – continued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 16
DSCC FORM 2234
APR 97
FIGURE 3. Break-before-make test circuit and waveforms – continued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 17
DSCC FORM 2234
APR 97
FIGURE 3. Break-before-make test circuit and waveforms – continued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 18
DSCC FORM 2234
APR 97
FIGURE 3. Break-before-make test circuit and waveforms – continued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 19
DSCC FORM 2234
APR 97
FIGURE 3. Break-before-make test circuit and waveforms – continued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 20
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 21
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 22
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 23
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 24
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 25
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 26
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 27
DSCC FORM 2234
APR 97
28
27
26
25
24
23
22
21
20
19
18
17
16
15
2
3
4
5
6
7
8
9
10
11
12
13
14
1+V
NC
OUT B
IN 8B
IN 6B
IN 5B
IN 4B
IN 3B
IN 2B
IN 1B
GND
NC
NC
OUT A
-V
IN 8A
IN 7A
IN 6A
IN 5A
IN 4A
IN 3A
IN 2A
IN 1A
A0
A1
A2
EN
+15 V -15 V
+5 V
PU L SE G EN
( ADDRESS I NPUT S TO I/O )
100
pF
( ENABLE T O I/O)
I/O
GND
+10 V
-10 V
-10 V
+10 V
GND
1k 100
pF
-10 V
+10 V
GND
.
-10 V
+10 V
GND
28
27
26
25
24
23
22
21
20
19
18
17
16
15
2
3
4
5
6
7
8
9
10
11
12
13
14
1+V
NC
OUT B
IN 8B
IN 7B
IN 6B
IN 5B
IN 4B
IN 3B
IN 2B
IN 1B
GND
NC
NC
OUT A
-V
IN 8A
IN 7A
IN 6A
IN 5A
IN 4A
IN 3A
IN 2A
IN 1A
A0
A1
A2
EN
+15 V -15 V 100
pF
I/O
-10 V
+10 V
GND
1k 100
pF
-10 V
+10 V
GND
PULSE
GEN
+5 V
IN 7B
1 k
1 k
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 28
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 29
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 30
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 31
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 32
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 33
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 34
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 35
DSCC FORM 2234
APR 97
FIGURE 4. Switching times tes t circuits – cont inued.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 36
DSCC FORM 2234
APR 97
4. QUALITY ASSURANCE PROVISI O NS
4.1 Sampli ng and inspe ction. Sam pli ng and inspection proce dures shall be in accordance with MIL- PRF-38535,
appendix A.
4.2 Scre ening. Screening sha ll be in accorda nce with method 5004 of MIL-STD- 883, and s hall be conducted on all devi ces
prior to quality conform ance inspe ction. The following additional criteria shall apply:
a. Burn- in te st, met hod 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the m anufacturer under document revision level
control and shall be made ava il able t o the pr epar ing or acquiring a ctiv ity upon re quest. The tes t circuit shall spe cify the
input s, output s, bia ses, and powe r diss ipat ion, as applicable, in accorda nce with the inte nt spe cified in t est method
1015 of MIL-STD- 883.
(2) TA = +125°C, minimum.
b. Interim and final electrical te s t parameters s hall be as specified in table II herein, except interim el ectri cal parameter tests
prior to burn- in are optional at the discret ion of t he manufact urer .
TABLE II. El e ctri cal te s t re quirements.
MIL-STD-883 t est re quirements Subgroups
(in accordance w ith
MIL-STD-883, m ethod 5005,
table I)
Interim ele ctrical parameters
(method 5004) 1
Final electrical te s t parameters
(method 5004) 1*, 2, 3, 9
Group A tes t r equire ments
(method 5005) 1, 2, 3, 4, 7, 9, 10**, 11**
Groups C and D end-point
el e ctrical parameters
(method 5005) 1
* PDA applies to subgroup 1.
** Subgr oups 10 and 11, if not tes ted, shall be guar anteed t o the
specified limits in table I.
4.3 Quality conform ance inspe ction. Qua li ty conform ance inspe ction shall be in accorda nce with method 5005 of MIL-STD-
883 including groups A, B, C, a nd D inspect ions. The f ollowing additiona l criteria s hall apply.
4.3.1 Gr oup A inspection.
a. Tests shall be as specified in table II herein.
b. Subgr oups 5, 6, and 8 in table I, me thod 5005 of M IL-STD- 883 shall be omitted.
c. Subgroup 4 ca pacitance m easurement s shall be m easured only for the initial t est and af ter proces s or design changes
which may af fect capacit ance.
d. Subgr oups 7 shall include ver ification of t he truth table.
STANDA RD
MICROCIRCUIT DRAWING
SIZE
A
5962-85131
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OH IO 43216-5000 REVISION LEVEL
E SHEET 37
DSCC FORM 2234
APR 97
4.3.2 Gr oups C and D inspections.
a. End- point electrica l par amet ers shall be as specif ied in table II he rein.
b. St eady-sta te lif e test conditions, method 1005 of MIL-STD- 883.
(1) Te st condi tion A, B, C, or D. The test circuit shall be maintained by the manufacturer under document r evision level
control and shall be made ava il able t o the pr epar ing or acquiring a ctiv ity upon re quest. The tes t circuit shall spe cify
the inputs, out puts , bias es, and power dissipation, a s applicable, in accor dance wit h the intent s pecified in t est
me thod 1005 of M IL-STD- 883.
(2) TA = +125°C, minimum.
(3) Te st duration: 1, 000 hours, except as per mitt ed by m ethod 1005 of MIL-STD- 883.
5. PACKAGING
5.1 Packaging requirements. The re quirement s f or packa ging shall be in accor dance wit h M IL-PRF- 38535, appe ndix A.
6. NOTES
6.1 Inte nded use . Microcircuits conforming to th is dr awing are intende d for use for Government m icrocircuit applicat ions
(original equipment ), design applications, a nd logis tics purposes .
6.2 Replaceability. Microcircuits cov ered by this drawing will replace the same generic device covered by a contractor-prepared
specificat ion or dr awing.
6.3 Configura tion control of SMD's. All propos ed changes to exi sting SMD's will be coordinated with the users of record for the
individual documents. This coordination will be accomplished using DD Form 1692, Engine ering Cha nge Proposal.
6.4 Recor d of us ers. Military and industr ial use rs s hall infor m Defense Supply Center Columbus when a syst em application
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for
coordinat ion and dist ribution of changes to t he drawings. Us ers of drawings covering microe lect ronics de vices (FSC 5962) s hould
contact DSCC-VA, telephone (614) 692-0544.
6.5 Comm ents. Comment s on t his dra wing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614)
692-0547.
6.6 Approved s ources of supply. Appr oved sources of supply are li st ed in MIL-HDBK- 103. The vendors listed in MIL-HDBK-
103 have agr eed to this drawing and a certifica te of com plia nce (see 3. 6 here in) has been submitted t o and accepted by DSCC-
VA.
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 02-12-30
Approved sour ces of supply for SM D 5962-85131 are list ed below f or immediat e acquisit ion i nfor m at ion only and s hall
be added to MIL-HDBK- 103 and QML-38535 during the ne xt re vis ion. MIL-HDBK-103 and QML-38535 will be revised
to incl ude the addition or delet ion of sources. The vendors lis te d below have agreed to this drawing and a ce rt ificate of
compliance ha s been submitt ed t o and acce pte d by DSCC-VA. This bulletin i s superse ded by the next dated revis ion of
MIL-HDBK-103 and QML-38535.
Standard
microcir cuit dr awing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
Similar
military specification
PIN
5962-85131013A 34371 HI4-546/883
5962-8513101XA 34371 HI1-546/883 M38510/19002BXA
5962-85131023A 34371 HI4-547/883
5962-8513102XA 34371 HI1-547/883 M38510/19004BXA
5962-85131032A 34371 HI4-549/883
5962-8513103EA 34371 HI1-549/883 M38510/19006BEA
5962-8513104XA 3/ IH5116MJI M38510/19002BXA
5962-8513105XA 3/ IH5216MJI M38510/19004BXA
5962-85131062C 1ES66 MAX359MLP/883B
1ES66 MAX359MJE/883B
5962-8513106EA 3/ IH5208MJE
M38510/19006BEA
5962-85131073A 34371 HI4-506/883
5962-85131073C 1ES66 DG506AAZ/883B
5962-8513107XA 34371 HI1-506/883 M38510/19001BXA
5962-85131083A 34371 HI4-507/883
5962-85131083C 1ES66 DG507AAZ/883B
5962-8513108XA 34371 HI1-507/883 M38510/19003BXA
5962-85131092A 34371 HI4-509/883
5962-85131092C 1ES66 DG509AAZ/883B
5962-8513109EA 34371 HI1-509/883 M38510/19008BEA
1/ The lea d finish shown for e ach PIN re pres ent ing
a hermetic package is the most readil y available
from the manufacturer l isted for that part. If the
desire d lead finish is not li sted conta ct t he vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquir ed to this number m ay not
satis fy the perfor m ance require m ents of this dra w ing.
3/ Not availa ble from an approved source of supply.
Page 1 of 2
STANDARD MICROCIRCUIT DRAWING BULLETIN - continued
Vendor CAGE Vendor name
numbe r and address
34371 Intersil Corporation
2401 Palm Bay Blvd
PO Box 883
Me lbourne, FL 32902-0883
1ES66 Ma xim Inte gra ted Products
120 San G abriel Dr
Sunnyvale, CA 94086-5125
The infor m ation contained her ein is dissemi nate d for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
inf ormat ion bullet in.
Page 2 of 2
