472
1
P C 1 2 2 F
2
57
8
6
3 4
K 2 M
A G Sー1 5
形名表記法 ORDERING CODE
用途 APPLICATIONS
特長 FEATURES
・自己消火性樹脂を用い、安全性が高い
・もれ電流が極めて小さい
・静電容量が極めて小さい
スパークギャップ
SPARK GAPS
OPERATING TEMP. ー30〜＋85℃
AG スパークギャップ
被覆状態
6
放電電圧許容差［V］
48
F
G
±500
±800
リード形状［mm］
K2M
K2U
K4M
K4U
形状
Kフォーミング
Kフォーミング
Kフォーミング
Kフォーミング
間隔
5.0
5.0
6.4
6.4
長さ
20以上
5.0±1
20以上
5.0±1
径
0.60
0.60
0.60
0.60
2
外径形状
15 外形寸法毎の各タイプ
P アルキド樹脂
3
樹脂材料
5
公称放電開始電圧［VDC］
7
包装
・CRT周辺の異常電圧吸収
△＝スペース
Sー 15タイプ単品（袋詰め）
Bー 15タイプテーピング品
△＝スペース
△ 樹脂キャップなし
C 樹脂キャップ付
122 1200
252 2500
・Very safe due to self-extinguishing resin
・Leakage current is very small.
・Electrostatic capacitance is very small.
・Used to absorb abnormal voltages in the periphery of a CRT
AG Spark gaps
Type Coating conditions
6
48
Lead configuration［mm］
K2M
K2U
K4M
K4U
Lead type
K-formed
K-formed
K-formed
K-formed
Lead space
5.0
5.0
6.4
6.4
Length
20Min.
5.0±1
20Min.
5.0±1
Diameter
0.60
0.60
0.60
0.60
2
External dimension
15
P Alkyd resin
3
Resin material
7 6
Packaging
Sー Type 15, bulk
Bー Type 15, taped
△＝Blank space
△ without resin cap
C with resin cap
1
形式
Type by external dimen-
sion
122 1200
252 2500
Nominal discharge
starting voltage［VDC］
Discharge voltage
Tolerance ［V］
F
G
±500
±800
△＝Blank space
5
1
SURGE ABSORBERS
8
473
P.473
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信頼性
Reliability Data
使用上の注意
Precautions
P.474 P.475 P.476 P.478
セレクションガイド
Selection Guide
P.14
etc
外形寸法 EXTERNAL DIMENSIONS
AG15
Kフォーミング Formed
K2M,K2U,K4M,K4U
Type
リード線
Lead type
アイテム一覧 PART NUMBERS
形名の□には被覆状態、◯には放電開始電圧、◇には許容差、☆には包装、▽にはリード形状記号が入ります。
□Please specify the coating condition code and ○ the discharge starting voltage code and ◇ the tolerance code and ☆ the packaging code and ▽ the
lead configuration code.
（注）使用している材料は自己消火性樹脂で、UL94V-0、UL1410（phase ll 規制）を保証するものです。
Note：The material used is a self-extinguishing resin conforming to UL94V-0 and UL1410（phase ll regulation）
＊1 AG15はDC500V20秒以内の値です。
Unit：mm（inch）
キャップレス
Capless
キャップ付き
Capped
本体の厚さ
Thickness of body：3.5max
（0.138max）
本体の厚さ
Thickness of body：4±0.5
（0.157±0.020）
＊1 Values of AG15 are set at DC500V within 20 seconds.
形 式
Type
放電開始電圧
Discharge starting voltage （DC）
公称値
Nominal value［V］
1200 1500 2000
2500
許容差
Tolerance［V］
± 500
± 800
絶縁抵抗
Insulation
resistance
［MΩ］＊1
リード形状
Lead configuration
Kフォーミング K Formed
AG15P□◯◯◯◇☆ー▽▽▽
EHS
（Environmental
Hazardous
Substances）
RoHS 10000min
474
特性図 ELECTRICAL CHARACTERISTICS
SURGE ABSORBERS
8
475
梱包 PACKAGING
最小受注単位数 Minimum Quantity
Type
AG15
袋詰め Bulk
1000
テーピング Taped
1300※
最小受注単位数 Minimum Quantity ［pcs］
※K2Mタイプのみ
記号
Symbol
A
B
T
P
P0
P1
P2
F
W
W0
W1
W2
H
H0
φD0
L
ℓ
t
△h1
△h2
d
6.8±0.5 （0.268±0.020）
7.0±0.5 （0.276±0.020）
4.0±0.5 （0.157±0.020）
12.7±1.0 （0.500±0.039）
12.7±0.3 （0.500±0.012）
3.85±0.5 （0.152±0.020）
6.35±1.3 （0.250±0.051）
5.0±0.5 （0.197±0.020）
18.0 （0.709 ）
12.0min （0.472min）
9.0 （0.354 ）
3.0max （0.118max）
19.6±0.5 （0.772±0.020）
16.0±0.5 （0.630±0.020）
4.0±0.3 （0.157±0.012）
11.0max （0.433max）
2.0max （0.079max）
0.75±0.2 （0.030±0.008）
2.0max （0.079max）
0.6±0.05 （0.024±0.002）
寸法
Dimensions
＋0.039
ー0.020
＋0.75
ー 0.5
＋1.0
ー0.5
＋0.030
ー 0.020
テーピング寸法 （K2Mタイプ） Taping Dimensions（K2M Type）
※Available for K2M type only
Unit：mm（inch）
SURGE ABSORBERS
8
477
RELIABILITY DATA
SPARK GAPS
Specified Value
Item Test Methods and Remarks
1.Operating Temperature
Range
2.Operating Humidity Range
3.Storage Temperature
Range
4.Discharge Voltage
5.Insulation Resistance
6.Capacitance
7.Discharge
Life
8.Damp Heat
9.Terminal
Strength Tensile
Torsional
No damage
No damage
ー30℃〜＋85℃
95%RH max. （No dew condensation）
ー40℃〜＋85℃
Within the specified tolerance
10,000 MΩ min.
1pFmax.
With the Circuit 1 shown below, conduct measurement
with voltage application.
Applied voltage：500VDC
Duration：Within 20 sec.
Measuring frequency：1±0.1MHz
Measuring voltage：0.5〜5.0Vrms
Bias application：None
With the Circuit 2 shown below, repeat discharge with
specified voltage, followed by the measurement within
2 to 5 hrs.
Number of discharge：10,000 times
Temperature：40±2℃
Humidity：90〜95％RH
Duration：250 hrs
Recovery：2 to 5 hrs of recovery under the standard
condition after the removal from test chamber.
Apply the tensile force in the direction to draw terminal.
Applied force：9.8N
Apply the bending force to incline the body to right and left
through angle of 90°
Applied force：4.9N
Circuit 2Circuit 1
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃
of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
Discharge
Voltage
Change
Insulation
Resistance
Discharge
Voltage
Change
Insulation
Resistance 5000MΩ
5000MΩ
％
ー35
＋20
ー30
＋50
AG15
R：20MΩ
C：10000pF
E：Refer to individual specification
AG15
R：20MΩ
C：2000pF
％
PRECAUTIONS
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1/2
Technical considerationsStages Precautions
Precautions on the use of Spark Gaps
1. Circuit Design ◆Verification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear reac-
tors, etc. may cause serious harm to human life or have severe
social ramifications. As such, any Spark Gaps to be used in
such equipment may require higher safety and/or reliability
considerations and should be clearly differentiated from com-
ponents used in general purpose applications.
◆Verification of Rated voltage （DC rated voltage）
1. Spark Gaps has determined electric discharge voltage be-
tween metaled Electrode using the insulation resistance of air.
Therefore, since a life changes with the energies of input serge,
please give me examination enough in the case of use.
2. Since between the Electrode will be in a short state at the time
of electric discharge, when using it for a low impedance circuit,
the Follow Current occurs and reduce the life of Spark Gaps
remarkably. In such a case, please connect low resistance or a
capacitive varistor in series.
3. Since the voltage which starts electric discharge when the
early serge of a standup is actually impressed, since electric
discharge delay generates Spark Gaps may become higher
than the specified electric discharge start voltage, cautions are
required.
4. Since Spark Gaps was developed for serge with small energy,
when using it as an object for guidance thunder absorption
with the big energy generated on a commercial power supply
line, telephone / communication line, etc., it requires cautions
enough.
◆Operating Environment precautions
1. Spark Gaps should not be used in the following environments:
（1）Environmental conditions to avoid
a. exposure to water or salt water.
b. exposure to moisture or condensation.
c. exposure to corrosive gases （such as hydrogen sulfide, sulfu-
rous acid, chlorine, and ammonia）
2. PCB Design 1. When Spark Gaps are mounted onto a PC board, hole dimen-
sions on the board should match the lead pitch of the compo-
nent, if not it will cause breakage of the terminals or cracking
of terminal roots covered with resin as excess stress travels
through the terminal legs. As a result, humidity resistance
performance would be lost and may lead to a reduction in
insulation resistance and cause a withstand voltage failure.
3. Considerations for automatic
insertion
◆Adjustment Automatic Insertion machines （leaded components）
1. When inserting Spark Gaps in a PC board by auto-insertion
machines the impact load imposed on the capacitors should
be minimized to prevent the leads from chucking or clinching.
PRECAUTIONS
SURGE ABSORBERS
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481
4. Soldering ◆Selection of Flux
1. When soldering Spark Gaps on the board, flux should be
applied thinly and evenly.
2. Flux used should be with less than or equal to 0.1 wt%
（equivalent to Chroline） of halogenated content. Flux hav-
ing a strong acidity content should not be applied.
3. When using water-soluble flux, special care should be taken
to properly clean the boards.
◆Wave Soldering
1.Temperature, time, amount of solder, etc. are specified in
accordance with the following recommended conditions.
2. Do not immerse the entire Spark Gaps in the flux during the
soldering operation. Only solder the lead wires on the bot-
tom of the board.
1. Flux is used to increase solderability in wave soldering, but if too much is applied, a large
amount of flux gas may be emitted and may detrimentally affect solderability. To minimize
the amount of flux applied, it is recommended to use a flux-bubbling system.
2. With too much halogenated substance （Chlorine, etc.） content is used to activate the
flux, an excessive amount of residue after soldering may lead to corrosion of the terminal
electrodes or degradation of insulation resistance on the surface of the capacitors.
3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the
residue on the surface of capacitors in high humidity conditions may cause a degradation
of insulation resistance and therefore affect the reliability of the components. The clean-
ing methods and the capability of the machines used should also be considered carefully
when selecting water-soluble flux.
1. If Spark Gaps are used beyond the range of the recommended conditions, heat stresses
may cause cracks inside the Spark Gaps, and consequently degrade the reliability of the
Spark Gaps.
5. Cleaning ◆Board cleaning
1. When cleaning the mounted PC boards, make sure that cleaning
conditions are consistent with prescribed usage conditions.
1. The resin material used for the outer coating of capacitors is occasionally a wax sub-
stance for moisture resistance which can easily be dissolved by some solutions. So
before cleaning, special care should be taken to test the components vulnerability to
the solutions used.
When using water-soluble flux please clean the PCB with purified water sufficiently
and dry thoroughly at the end of the process. Insufficient washing or drying could
lower the reliability of the capacitors.
6. Post-cleaning-process ◆Application of resin molding, etc. to the PCB and compo-
nents.
1. Please contact your local Taiyo Yuden sales office before
performing resin coating or molding on mounted capacitors.
Please verify on the actual application that the coating pro-
cess will not adversely affect the component quality.
2/2
1-1. The thermal expansion and coefficient of contraction of the molded resin are not nec-
essarily matched with those of the Spark Gaps. The Spark Gaps may be exposed to
stresses due to thermal expansion and contraction during and after hardening. This may
lower the specified characteristics and insulation resistance or cause reduced withstand
voltage by cracking the ceramic or separating the coated resin from the ceramics.
1-2. With some types of mold resins, the resin's decomposition gas or reaction gas may
remain inside the resin during the hardening period or while left under normal conditions,
causing a deterioration of the capacitor's performance.
1-3. Some mold resins may have poor moisture proofing properties. Please verify the con-
tents of the resins before they are applied.
1-4. Please contact Taiyo Yuden before using if the hardening process temperature of the
mold resins is higher than the operating temperature of the Spark Gaps.
Technical considerationsStages Precautions
Precautions on the use of Spark Gaps
◆Mechanical considerations
1. Be careful not to subject the Spark Gaps to excessive me-
chanical shocks. Withstanding voltage failure may result.
2. If Spark Gaps are dropped onto the floor or a hard surface
they should not be used.
1. Because the Spark Gaps is made of ceramic, mechanical shocks applied to the
board may damage or crack the Spark Gaps.
2.Spark Gaps which are dropped onto the floor or a hard surface may develop defects
and have a higher risk of failure over time.
7. Handling
1. Under high temperature/high humidity conditions, the decrease in solderability due to
the oxidation of terminal electrodes and deterioration of taping and packaging char-
acteristics may be accelerated.
◆Storage
1. To maintain the solderability of terminal electrodes and to keep
the packaging material in good condition, care must be taken
to control temperature and humidity in the storage area. Hu-
midity should especially be kept as low as possible. Recom-
mended conditions: Ambient temperature Below 40 ℃ Humid-
ity Below 70% RH. Products should be used within 12 months
after delivery. After the above period, the solderability should
be checked before using the Spark Gaps.
2. Spark Gaps should not be kept in an environment filled with
decomposition gases such as （sulfurous hydrogen, sulfurous
acid, chlorine, ammonia, etc.）
3. Spark Gaps should not be kept in a location where they may
be exposed to moisture, condensation or direct sunlight.
8. Storage conditions
