SPARK GAPS OPERATING TEMP. 3085 FEATURES Very safe due to self-extinguishing resin Leakage current is very small. Electrostatic capacitance is very small. APPLICATIONS CRT Used to absorb abnormal voltages in the periphery of a CRT ORDERING CODE 1 4 6 8 V mm AG C 2 500 800 F G 15 5 7 VDC 122 252 3 1200 2500 S B K2M K2U K4M K4U 5.0 5.0 6.4 6.4 K K K K 20 5.01 20 5.01 0.60 0.60 0.60 0.60 15 15 P A G 1 5 P C 1 2 2 F S K 2 M 1 2 5 4 6 7 8 1 4 6 8 Type Coating conditions Discharge voltage ToleranceV Lead configuration mm AG Spark gaps 2 C without resin cap with resin cap 15 Type by external dimension 3 Resin material P Alkyd resin 500 800 F G Blank space External dimension 472 3 5 7 Nominal discharge starting voltage VDC Packaging 122 252 1200 2500 S B 6 Type 15, bulk Type 15, taped Blank space K2M K2U K4M K4U Lead type K-formed K-formed K-formed K-formed Lead space 5.0 5.0 6.4 6.4 Diameter 0.60 0.60 0.60 0.60 Length 20Min. 5.01 20Min. 5.01 EXTERNAL DIMENSIONS AG15 K Formed Lead type K2M,K2U,K4M,K4U Capless Type 8 SURGE ABSORBERS Capped Thickness of body3.5max 0.138max Thickness of body40.5 0.1570.020 Unitmminch PART NUMBERS Type EHS Environmental Discharge starting voltageDC Insulation Hazardous Substances AG15P Nominal value V 1200 RoHS 1500 2000 resistance 1 ToleranceV M 500 10000min 800 2500 Lead configuration K K Formed Please specify the coating condition code and the discharge starting voltage code and the tolerance code and the packaging code and the lead configuration code. UL94V-0UL1410phase ll NoteThe material used is a self-extinguishing resin conforming to UL94V-0 and UL1410phase ll regulation 1 Values of AG15 are set at DC500V within 20 seconds. 1 AG15DC500V20 Selection Guide P.14 etc Part Numbers P.473 Electrical Characteristics P.474 Packaging P.475 Reliability Data P.476 Precautions P.478 473 474 ELECTRICAL CHARACTERISTICS PACKAGING Minimum Quantity Type Minimum Quantitypcs AG15 Bulk Taped 1000 1300 K2M Available for K2M type only K2M Taping DimensionsK2M Type 8 SURGE ABSORBERS Symbol Dimensions A 6.80.5 0.2680.020 B 7.00.5 0.2760.020 T 4.00.5 0.1570.020 P 12.71.0 0.5000.039 P0 12.70.3 0.5000.012 P1 3.850.5 0.1520.020 P2 6.351.3 0.2500.051 F W W0 W1 W2 5.00.5 0.1970.020 18.0 1.0 0.5 0.7090.039 0.020 12.0min 0.472min 9.0 0.75 0.354 0.030 0.020 0.5 3.0max 0.118max H 19.60.5 0.7720.020 H0 16.00.5 0.6300.020 D0 4.00.3 0.1570.012 L 11.0max 0.433max 2.0max 0.079max t h1 h2 d 0.750.2 0.0300.008 2.0max 0.079max 0.60.05 0.0240.002 Unitmminch 475 RELIABILITY DATA SPARK GAPS Item Specified Value 1.Operating Temperature Test Methods and Remarks 3085 Range 2.Operating Humidity Range 95%RH max.No dew condensation 3.Storage Temperature 4085 Range 4.Discharge Voltage Within the specified tolerance With the Circuit 1 shown below, conduct measurement with voltage application. 5.Insulation Resistance 10,000 M min. Applied voltage500VDC DurationWithin 20 sec. 6.Capacitance 1pFmax. Measuring frequency10.1MHz Measuring voltage0.55.0Vrms 8 Bias applicationNone Life Discharge Voltage Change Insulation Resistance 8.Damp Heat Discharge Voltage Change Insulation Resistance 9.Terminal Strength With the Circuit 2 shown below, repeat discharge with 20 35 specified voltage, followed by the measurement within 2 to 5 hrs. Number of discharge10,000 times 5000M Temperature402 50 30 Humidity9095RH Duration250 hrs Recovery2 to 5 hrs of recovery under the standard SURGE ABSORBERS 7.Discharge condition after the removal from test chamber. 5000M Apply the tensile force in the direction to draw terminal. No damage Applied force9.8N Tensile Apply the bending force to incline the body to right and left No damage through angle of 90 Torsional Applied force4.9N Circuit 1 Circuit 2 AG15 AG15 R20M R20M C2000pF C10000pF ERefer to individual specification Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 202 of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." 477 1/2 PRECAUTIONS Precautions on the use of Spark Gaps Stages 1. Circuit Design Precautions Technical considerations Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any Spark Gaps to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. Verification of Rated voltageDC rated voltage 1. Spark Gaps has determined electric discharge voltage between metaled Electrode using the insulation resistance of air. Therefore, since a life changes with the energies of input serge, please give me examination enough in the case of use. 2. Since between the Electrode will be in a short state at the time of electric discharge, when using it for a low impedance circuit, the Follow Current occurs and reduce the life of Spark Gaps remarkably. In such a case, please connect low resistance or a 3. Since the voltage which starts electric discharge when the early serge of a standup is actually impressed, since electric discharge delay generates Spark Gaps may become higher than the specified electric discharge start voltage, cautions are required. 4. Since Spark Gaps was developed for serge with small energy, when using it as an object for guidance thunder absorption with the big energy generated on a commercial power supply line, telephone / communication line, etc., it requires cautions enough. 8 SURGE ABSORBERS capacitive varistor in series. Operating Environment precautions 1. Spark Gaps should not be used in the following environments: 1 Environmental conditions to avoid a. exposure to water or salt water. b. exposure to moisture or condensation. c. exposure to corrosive gasessuch as hydrogen sulfide, sulfurous acid, chlorine, and ammonia 2. PCB Design 1. When Spark Gaps are mounted onto a PC board, hole dimensions on the board should match the lead pitch of the component, if not it will cause breakage of the terminals or cracking of terminal roots covered with resin as excess stress travels through the terminal legs. As a result, humidity resistance performance would be lost and may lead to a reduction in insulation resistance and cause a withstand voltage failure. 3. Considerations for automatic insertion Adjustment Automatic Insertion machinesleaded components 1. When inserting Spark Gaps in a PC board by auto-insertion machines the impact load imposed on the capacitors should be minimized to prevent the leads from chucking or clinching. 479 2/2 PRECAUTIONS Precautions on the use of Spark Gaps Stages 4. Soldering Precautions Selection of Flux 1. When soldering Spark Gaps on the board, flux should be applied thinly and evenly. 2. Flux used should be with less than or equal to 0.1 wt% equivalent to Chrolineof halogenated content. Flux having a strong acidity content should not be applied. 3. When using water-soluble flux, special care should be taken to properly clean the boards. Wave Soldering 1.Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions. 2. Do not immerse the entire Spark Gaps in the flux during the Technical considerations 1. Flux is used to increase solderability in wave soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 2. With too much halogenated substanceChlorine, etc.content is used to activate the flux, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors. 3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. 1. If Spark Gaps are used beyond the range of the recommended conditions, heat stresses may cause cracks inside the Spark Gaps, and consequently degrade the reliability of the Spark Gaps. soldering operation. Only solder the lead wires on the bottom of the board. 5. Cleaning Board cleaning conditions are consistent with prescribed usage conditions. 6. Post-cleaning-process Application of resin molding, etc. to the PCB and components. 1. Please contact your local Taiyo Yuden sales office before performing resin coating or molding on mounted capacitors. Please verify on the actual application that the coating process will not adversely affect the component quality. 7. Handling Mechanical considerations 1. Be careful not to subject the Spark Gaps to excessive mechanical shocks. Withstanding voltage failure may result. 2. If Spark Gaps are dropped onto the floor or a hard surface 1-1. The thermal expansion and coefficient of contraction of the molded resin are not necessarily matched with those of the Spark Gaps. The Spark Gaps may be exposed to stresses due to thermal expansion and contraction during and after hardening. This may lower the specified characteristics and insulation resistance or cause reduced withstand voltage by cracking the ceramic or separating the coated resin from the ceramics. 1-2. With some types of mold resins, the resin's decomposition gas or reaction gas may remain inside the resin during the hardening period or while left under normal conditions, causing a deterioration of the capacitor's performance. 1-3. Some mold resins may have poor moisture proofing properties. Please verify the contents of the resins before they are applied. 1-4. Please contact Taiyo Yuden before using if the hardening process temperature of the mold resins is higher than the operating temperature of the Spark Gaps. 8 SURGE ABSORBERS 1. When cleaning the mounted PC boards, make sure that cleaning 1. The resin material used for the outer coating of capacitors is occasionally a wax substance for moisture resistance which can easily be dissolved by some solutions. So before cleaning, special care should be taken to test the component s vulnerability to the solutions used. When using water-soluble flux please clean the PCB with purified water sufficiently and dry thoroughly at the end of the process. Insufficient washing or drying could lower the reliability of the capacitors. 1. Because the Spark Gaps is made of ceramic, mechanical shocks applied to the board may damage or crack the Spark Gaps. 2.Spark Gaps which are dropped onto the floor or a hard surface may develop defects and have a higher risk of failure over time. they should not be used. 8. Storage conditions Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken 1. Under high temperature/high humidity conditions, the decrease in solderability due to the oxidation of terminal electrodes and deterioration of taping and packaging characteristics may be accelerated. to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions: Ambient temperature Below 40 Humidity Below 70% RH. Products should be used within 12 months after delivery. After the above period, the solderability should be checked before using the Spark Gaps. 2. Spark Gaps should not be kept in an environment filled with decomposition gases such assulfurous hydrogen, sulfurous acid, chlorine, ammonia, etc. 3. Spark Gaps should not be kept in a location where they may be exposed to moisture, condensation or direct sunlight. 481