FR1AA thru FR1MA SURFACE MOUNT FAST RECOVERY RECTIFIER REVERSE VOLTAGE - 50 to 1000 Volts FORWARD CURRENT - 1.0 Ampere FEATURES SMA FLAT * Very low profile package - 0.9mm * Glass passivated chip * For surface mounted applications * Low reverse leakage current * Low forward voltage drop * High current capability * Fast switching for high efficiency SMA FLAT MECHANICAL DATA * Case: JEDEC DO-221AC * Case Material: "Green" molding compound, UL DIM. MIN. MAX. A 0.90 1.10 B 1.25 1.65 C 0.15 0.40 D 2.25 2.95 E 4.80 5.60 E1 3.95 4.60 L 0.75 1.50 All dimension in millimeter flammability classification 94V-0, (No Br. Sb. Cl.) Moisture Sensitivity: Level 1 per J-STD-020C * * Terminals: Lead Free Plating (Matte Tin Finish.) * Reliability tested in accordance with AEC-Q101 * Component in accordance to RoHs 2002/95/EC MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25C ambient temperature unless otherwise specified. PARAMETER SYMBOL FR1AA FR1BA FR1DA FR1GA FR1JA FR1KA FR1MA UNIT Device marking code Note FR1AA FR1BA FR1DA FR1GA FR1JA FR1KA FR1MA --- Maximum Repetitive Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 V VDC 50 100 200 400 600 800 1000 V Maximum DC Blocking Voltage Average Rectified Output Current @TL=125C Peak Forward Surge Current 8.3ms single half sine-wave Operating junction temperature range Storage temperature range PARAMETER TEST CONDITIONS I(AV) 1.0 A IFSM 30 A TJ -55 to +150 C TSTG -55 to +150 C SYMBOL Max. UNIT Forward Voltage (1) IF=1.0A Tj=25C VF 1.3 V Leakage Current (1) VR=VDC Tj=25C Tj=125C IR 5 200 uA Maximum Reverse Recovery Time (Note 2) THERMAL CHARACTERISTIC TRR 150 250 500 ns SYMBOL Typical UNIT CJ 15 pF Typical thermal resistance _ Junction to Case (4) RJC 26 C/W Typical thermal resistance _ Junction to Ambient (4) RJA 85 C/W Typical thermal resistance _ Junction to Lead (4) RJL 18 C/W Typical junction capacitance (3) REV. 3, Sep-2012, KSEP01 Note : (1) (2) (3) (4) 300us Pulse width, 2% Duty cycle. Reverse Recovery Test Conditions:IF=0.5A,IR=1.0A,IRR=0.25A. Measured at 1.0MHz and applied reverse voltage of 4.0V DC. Thermal Resistance test performed in accordance with JESD-51. Unit mounted on 0.75t glass-epoxy substrate with foot print copper pad. RJL is measured at the lead of cathode band, RJC is measured at the top centre of body. RATING AND CHARACTERISTIC CURVES FR1AA~FR1MA FIG.1- FORWARD CURRENT DERATING CURVE FIG.2- MAXIMUM NON-REPETITIV E SURGE CURRENT 35 PEAK FORWARD SURGE CURRENT, (A) AVERAGE FORWARD CURRENT, (A) 1.2 30 1 25 0.8 Mounted on glass-epoxy substrate with 1oz/ft2_foot print copper pad. 0.6 20 15 0.4 10 RESISTIVE OR INDUCTIVE LOAD 0.2 8.3ms Single Half-Wave 5 0 0 0 25 50 75 100 125 1 150 10 FIG.3- TYPICAL FORWORD CHARACTERISTICS FIG.4- TYPICAL JUNCTION CAPACITANCE 10 100 10 CAPACITANCE, (pF) Tj=125C 1 0.1 Tj=25C Tj=25C, f=1MHz 0.01 1 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 1 10 INSTANTANEOUS FORWARD VOLTAGE, (V) REVERSE VOLTAGE, (V) FIG.5- TYPICAL REVERSE CHARACTERISTICS 0.1 INSTANTANEOUS REVERSE CURRENT, (uA) INSTANTANEOUS FORWARD CURRENT, (A) 100 NUMBER OF CYCLES AT 60Hz LEAD TEMAERATURE, () Tj=125C Tj=100C 0.01 Tj=75C 0.001 Tj=50C 0.0001 Tj=25C 0.00001 10 30 50 70 90 110 PERCENT O F RAT ED PEAK REVERSE VOLTAG E, (V) 130 100 Legal Disclaimer Notice FR1AA~FR1MA Important Notice and Disclaimer LSC reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design, purchase or use. LSC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does LSC assume any liability for application assistance or customer product design. LSC does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of LSC. LSC products are not authorized for use as critical components in life support devices or systems without express written approval of LSC.