BC846-T - NXP - Datasheet.Directory

1. Product profile

1.1 General description

NPN general-purpose transistors in Surface-Mounted Device (SMD) plastic packages.

[1] Valid for all available selection groups.

1.2 Features and benefits

General-purpose transistors

SMD plastic packages

Two different gain selections

1.3 Applications

General-purpose switching and amplification

1.4 Quick reference data

BC846 series

65 V, 100 mA NPN general-purpose transistors

Rev. 9 — 25 September 2012 Product data sheet

Table 1. Product overview

Type number[1] Package PNP complement

NXP JEITA JEDEC

BC846 SOT23 - TO-236AB BC856

BC846W SOT323 SC-70 - BC856W

BC846T SOT416 SC-75 - BC856T

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VCEO collector-emitter voltage open base - - 65 V

ICcollector current - - 100 mA

hFE DC current gain VCE =5V; I

C=2mA 110 - 450

hFE group A 110 180 220

hFE group B 200 290 450

Product data sheet Rev. 9 — 25 September 2012 2 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

2. Pinning information

3. Ordering information

[1] Valid for all available selection groups.

4. Marking

[1] * = placeholder for manufacturing site code

Table 3. Pinning

Pin Description Simplified outline Graphic symbol

SOT23, SOT323, SOT416

1base

2emitter

3 collector

006aaa144

sym021

Tabl e 4. Ordering information

Type number[1] Package

Name Description Version

BC846 - plastic surface-mounted package; 3 leads SOT23

BC846W SC-70 plastic surface-mounted package; 3 leads SOT323

BC846T SC-75 plastic surface-mounted package; 3 leads SOT416

Table 5. Marking codes

Type number Marking code[1]

BC846 1D*

BC846A 1A*

BC846B 1B*

BC846W 1D*

BC846AW 1A*

BC846BW 1B*

BC846T 1M

BC846AT 1A

BC846BT 1B

Product data sheet Rev. 9 — 25 September 2012 3 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

5. Limiting values

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCBO collector-base voltage open emitter - 80 V

VCEO collector-emitter voltage open base - 65 V

VEBO emitter-base voltage open collector - 6 V

ICcollector current - 100 mA

ICM peak collector current single pulse;

tp1ms -200mA

IBM peak base current single pulse;

tp1ms -200mA

Ptot total power dissipation Tamb 25 C[1]

SOT23 - 250 mW

SOT323 - 200 mW

SOT416 - 150 mW

Tjjunction temperature - 150 C

Tamb ambient temperature 65 +150 C

Tstg storage temperature 65 +150 C

Table 7. Thermal characteris tics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1]

SOT23 - - 500 K/W

SOT323 - - 625 K/W

SOT416 - - 833 K/W

Product data sheet Rev. 9 — 25 September 2012 4 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

7. Characteristics

[1] Pulse test: tp300 s; = 0.02.

[2] VBEsat decreases by approximately 1.7 mV/K with increasing temperature.

[3] VBE decreases by approximately 2 mV/K with increasing temperature.

Table 8. Characteristics

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

ICBO collector-base cut-off

current VCB =30V; I

E=0A - - 15 nA

VCB =30V; I

E=0A;

Tj= 150 C--5A

IEBO emitter-base cut-of f

current VEB =5V; I

C= 0 A - - 100 nA

hFE DC current gain VCE =5V; I

C=10A

hFE group A - 180 -

hFE group B - 290 -

DC current gain VCE =5V; I

C=2mA 110 - 450

hFE group A 110 180 220

hFE group B 200 290 450

VCEsat collector-emitter

saturation voltage IC=10mA; I

B=0.5mA - 90 200 mV

IC=100mA; I

B=5mA [1] - 200 400 mV

VBEsat base-emitter

saturation voltage IC=10mA; I

B=0.5mA [2] - 760 - mV

IC=100mA; I

B=5mA [2] - 900 - mV

VBE base-emitter vo ltage IC=2mA; V

CE =5V [3] 580 660 700 mV

IC=10mA; V

CE =5V [3] --770mV

fTtransition frequency VCE =5V; I

C=10mA;

f=100MHz 100--MHz

Cccollector capacitance VCB =10V; I

E=i

e=0A;

f=1MHz - 23pF

Ceemitter capacitance VEB =0.5V; I

C=i

c=0A;

f=1MHz -11-pF

NF n oise figure IC=200A; VCE =5V;

RS=2 k; f = 1 kHz;

B=200Hz

-210dB

Product data sheet Rev. 9 — 25 September 2012 5 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

VCE =5V

(1) Tamb = 150 C

(2) Tamb =25C

(3) Tamb =55 C

VCE =5V

(1) Tamb =55 C

(2) Tamb =25C

(3) Tamb = 150 C

Fig 1. Selection A: DC current gain as a function of

collector current; typical valu es Fig 2. Selection A: Base-emitter voltage as a function

of collector current; typica l values

IC/IB=20

(1) Tamb = 150 C

(2) Tamb =25C

(3) Tamb =55 C

IC/IB=10

(1) Tamb =55 C

(2) Tamb =25C

(3) Tamb = 150 C

Fig 3. Selection A: Collector-emitter saturation

voltage as a function of collector current;

typical valu e s

Fig 4. Selection A: Base-emitter saturation voltage

as a function of collector current; typical

values

mgt723

10−111010

2103

IC (mA)

400

300

200

100

hFE

(1)

(2)

(3)

mgt724

10−111010

2103

IC (mA)

1200

1000

800

600

400

200

VBE

(mV)

(1)

(2)

(3)

103

102

mgt725

10−111010

2103

IC (mA)

VCEsat

(mV)

(1)

(2)

(3)

mgt726

10−111010

2103

IC (mA)

1200

1000

800

600

400

200

VBEsat

(mV)

(1)

(2)

(3)

Product data sheet Rev. 9 — 25 September 2012 6 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

VCE =5V

(1) Tamb = 150 C

(2) Tamb =25C

(3) Tamb =55 C

VCE =5V

(1) Tamb =55 C

(2) Tamb =25C

(3) Tamb = 150 C

Fig 5. Selection B: DC current gain as a function of

collector current; typical valu es Fig 6. Selection B: Base-emitter voltage as a function

of collector current; typica l values

IC/IB=20

(1) Tamb = 150 C

(2) Tamb =25C

(3) Tamb =55 C

IC/IB=10

(1) Tamb =55 C

(2) Tamb =25C

(3) Tamb = 150 C

Fig 7. Selection B: Collector-emitter saturation

voltage as a function of collector current;

typical valu e s

Fig 8. Selection B: Base-emitter saturation voltage

as a function of collector current; typical

values

mgt727

10−111010

2103

IC (mA)

600

500

400

300

200

100

hFE

(1)

(2)

(3)

1200

1000

800

600

400

200

mgt728

10−210−111010

2103

IC (mA)

VBE

(mV)

(1)

(2)

(3)

104

103

102

mgt729

10−111010

2103

IC (mA)

VCEsat

(mV)

(1)

(2)

(3)

mgt730

10−111010

2103

IC (mA)

1200

1000

800

600

400

200

VBEsat

(mV)

(1)

(2)

(3)

Product data sheet Rev. 9 — 25 September 2012 7 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

8. Package outline

Fig 9. Package outline SOT23 (TO-236AB)

Fig 10. Package outline SOT323 (SC-70)

04-11-04Dimensions in mm

0.45

0.15

1.9

1.1

0.9

3.0

2.8

2.5

2.1 1.4

1.2

0.48

0.38 0.15

0.09

04-11-04Dimensions in mm

0.45

0.15

1.1

0.8

2.2

1.8

2.2

2.0 1.35

1.15

1.3

0.4

0.3 0.25

0.10

Product data sheet Rev. 9 — 25 September 2012 8 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

9. Packing information

[1] For further information and the availability of packing methods, see Section 13.

[2] Valid for all available selection groups.

Fig 11. Package outline SOT416 (SC-75)

04-11-04Dimensions in mm

0.95

0.60

1.8

1.4

1.75

1.45 0.9

0.7

0.25

0.10

0.30

0.15

30.45

0.15

Table 9. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type

number[2] Package Description Packing quantity

1000 3000 4000

BC846 SOT23 4 mm pitch, 8 mm tape and reel -215 - -235

BC846W SOT323 4 mm pitch, 8 mm tape and reel -115 - -135

BC846T SOT416 4 mm pitch, 8 mm tape and reel -115 - -135

Product data sheet Rev. 9 — 25 September 2012 9 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

10. Soldering

Fig 12. Reflow soldering foo tprin t SOT23 (TO-236AB)

Fig 13. W ave soldering footprint SOT23 (TO-236AB)

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3×)

0.6

(3×)

0.6

(3×)

0.7

(3×)

3.3

2.9

1.7

1.9

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2×)

1.2

(2×)

2.2

2.6

Dimensions in mm

Product data sheet Rev. 9 — 25 September 2012 10 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

Fig 14. Reflow soldering footprint SOT323 (SC-70)

Fig 15. W ave soldering footprint SOT323 (SC-70)

solder lands

solder resist

occupied area

solder paste

sot323_fr

2.65

2.35 0.6

(3×)

0.5

(3×)

0.55

(3×)

1.325

1.85

1.3

Dimensions in mm

sot323_fw

3.65 2.1

1.425

(3×)

4.6

(2×)

2.575

1.8

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Product data sheet Rev. 9 — 25 September 2012 11 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

Fig 16. Reflow soldering footprint SOT416 (SC-75)

solder lands

solder resist

occupied area

solder paste

sot416_fr

0.85

1.7

2.2

0.5

(3×)

0.6

(3×)

1.3

Dimensions in mm

Product data sheet Rev. 9 — 25 September 2012 12 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

11. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BC846_SER v.9 20120925 Product data sheet - BC846_SER v.8

Modifications: •Table 6 “Limiting values”: Ptot values corrected

BC846_SER v.8 20120424 Product data sheet BC846_BC546_SER v.7

BC846_BC546_SER v.7 20091117 Product data sheet - BC846_BC546_SER v.6

BC846_BC546_SER v.6 20060207 Product data sheet - -

Product data sheet Rev. 8 — 25 September 2012 13 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

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Limited warr a nty and liability — Information in this document is believed to

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consequences of use of such information. NXP Se miconductors takes no

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Notwithstanding any damages that customer might incur for any reason

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malfunction of an NXP Semiconductors product can reasonably be expected

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damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

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NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

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products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

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applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

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construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 8 — 25 September 2012 14 of 15

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and st andards, customer

(a) shall use the product without NXP Semicond uctors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BC846 series

65 V, 100 mA NPN general-purpose transist ors

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 September 2012

Document id entifier: BC846_SER

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

9 Packing information . . . . . . . . . . . . . . . . . . . . . 8

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

13 Contact information. . . . . . . . . . . . . . . . . . . . . 14

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15