a
AD7851
*
FUNCTIONAL BLOCK DIAGRAM
AIN (+)
AIN (–)
CREF1
CREF2
CAL
AVDD AGND AGND
DVDD
DGND
AMODE
CLKIN
SLEEP
CONVST
BUSY
SYNC
SM1 SM2 DIN DOUT SCLK POLARITY
CHARGE
REDISTRIBUTION
DAC
COMP
4.096V
REFERENCE
AD7851
BUF
T/H
SAR + ADC
CONTROL
CALIBRATION
MEMORY
AND CONTROLLER
SERIAL INTERFACE/CONTROL REGISTER
REFIN/
REFOUT
14-Bit 333 kSPS
Serial A/D Converter
FEATURES
Single 5 V Supply
333 kSPS Throughput Rate/ⴞ2 LSB DNL—A Grade
285 kSPS Throughput Rate/ⴞ1 LSB DNL—K Grade
A and K Grades Guaranteed to 125ⴗC/238 kSPS
Throughput Rate
Pseudo-Differential Input with Two Input Ranges
System and Self-Calibration with Autocalibration on
Power-Up
Read/Write Capability of Calibration Data
Low Power: 60 mW Typ
Power-Down Mode: 5 W Typ Power Consumption
Flexible Serial Interface: 8051/SPI®/QSPI™/P Compatible
24-Lead PDIP, SOIC, and SSOP Packages
APPLICATIONS
Digital Signal Processing
Speech Recognition and Synthesis
Spectrum Analysis
DSP Servo Control
Instrumentation and Control Systems
High Speed Modems
Automotive
GENERAL DESCRIPTION
The AD7851 is a high speed, 14-bit ADC that operates from a
single 5 V power supply. The ADC powers up with a set of default
conditions at which time it can be operated as a read-only ADC.
The ADC contains self-calibration and system calibration options
to ensure accurate operation over time and temperature and has a
number of power-down options for low power applications.
The AD7851 is capable of a 333 kHz throughput rate. The
input track-and-hold acquires a signal in 0.33 µs and features
a pseudo-differential sampling scheme. The AD7851 has the
added advantage of two input voltage ranges (0 V to V
REF
and
–V
REF
/2 to +V
REF
/2 centered about V
REF
/2). Input signal
range is to V
DD
and the part is capable of converting full
power signals to 20 MHz.
CMOS construction ensures low power dissipation (60 mW typ)
with power-down mode (5 µW typ). The part is available in a
24-lead, 0.3 inch-wide PDIP, a 24-lead SOIC, and a 24-lead
SSOP package.
PRODUCT HIGHLIGHTS
1. Single 5 V supply.
2. Operates with reference voltages from 4 V to V
DD
.
3. Analog input ranges from 0 V to V
DD
.
4. System and self-calibration including power-down mode.
5. Versatile serial I/O port.
REV. B
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700 www.analog.com
Fax: 781/326-8703 © 2004 Analog Devices, Inc. All rights reserved.
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
*Protected by U.S. Patent No. 5,852,415; 5,668,551; 5,600,322; 5,600,275;
and 5,589,785
AD7851
–2– REV. B
TABLE OF CONTENTS
FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . 1
PRODUCT HIGHLIGHTS . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
TIMING SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . 5
TYPICAL TIMING DIAGRAMS . . . . . . . . . . . . . . . . . . . . 6
ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . 7
ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
PINOUTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
TERMINOLOGY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . 9
AD7851 ON-CHIP REGISTERS . . . . . . . . . . . . . . . . . . . . 10
Addressing the On-Chip Registers . . . . . . . . . . . . . . . . . . 10
Writing/Reading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
CONTROL REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
STATUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
CALIBRATION REGISTERS . . . . . . . . . . . . . . . . . . . . . . 13
Addressing the Calibration Registers . . . . . . . . . . . . . . . . 13
Writing to/Reading from the Calibration Registers . . . . . . 13
Adjusting the Offset Calibration Register . . . . . . . . . . . . . 14
Adjusting the Gain Calibration Registers . . . . . . . . . . . . . 14
CIRCUIT INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . 15
CONVERTER DETAILS . . . . . . . . . . . . . . . . . . . . . . . . . . 15
TYPICAL CONNECTION DIAGRAM . . . . . . . . . . . . . . 15
ANALOG INPUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Acquisition Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
DC/AC Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Input Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Transfer Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
REFERENCE SECTION . . . . . . . . . . . . . . . . . . . . . . . . . . 18
AD7851 PERFORMANCE CURVES . . . . . . . . . . . . . . . . 18
POWER-DOWN OPTIONS . . . . . . . . . . . . . . . . . . . . . . . . 19
POWER-UP TIMES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Using an External Reference . . . . . . . . . . . . . . . . . . . . . . 20
Using the Internal (On-Chip) Reference . . . . . . . . . . . . . 20
POWER VS. THROUGHPUT RATE . . . . . . . . . . . . . . . . 20
CALIBRATION SECTION . . . . . . . . . . . . . . . . . . . . . . . . 21
Calibration Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Automatic Calibration on Power-On . . . . . . . . . . . . . . . . 21
Self-Calibration Description . . . . . . . . . . . . . . . . . . . . . . . 21
Self-Calibration Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 22
System Calibration Description . . . . . . . . . . . . . . . . . . . . 22
System Gain and Offset Interaction . . . . . . . . . . . . . . . . . 23
System Calibration Timing . . . . . . . . . . . . . . . . . . . . . . . 23
SERIAL INTERFACE SUMMARY . . . . . . . . . . . . . . . . . . 24
Resetting the Serial Interface . . . . . . . . . . . . . . . . . . . . . . 24
DETAILED TIMING . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Mode 1 (2-Wire 8051 Interface) . . . . . . . . . . . . . . . . . . . 25
Mode 2 (3-Wire SPI/QSPI Interface Mode) . . . . . . . . . . . 26
Mode 3 (QSPI Interface Mode) . . . . . . . . . . . . . . . . . . . . 26
Mode 4 and 5 (Self-Clocking Modes) . . . . . . . . . . . . . . . 27
CONFIGURING THE AD7851 . . . . . . . . . . . . . . . . . . . . . 28
AD7851 as a Read-Only ADC . . . . . . . . . . . . . . . . . . . . . 28
Writing to the AD7851 . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Interface Modes 2 and 3 Configuration . . . . . . . . . . . . . . 29
Interface Mode 1 Configuration . . . . . . . . . . . . . . . . . . . . 30
Interface Modes 4 and 5 Configuration . . . . . . . . . . . . . . 30
MICROPROCESSOR INTERFACING . . . . . . . . . . . . . . . 31
AD7851 to 8XC51/PIC17C42 Interface . . . . . . . . . . . . . . . 31
AD7851 to 68HC11/16/L11/PIC16C42 Interface . . . . . . . . 31
AD7851 to ADSP-21xx Interface . . . . . . . . . . . . . . . . . . . . 32
AD7851 to DSP56000/1/2/L002 Interface . . . . . . . . . . . . . 32
AD7851 to TMS320C20/25/5x/LC5x Interface . . . . . . . . . 32
APPLICATIONS HINTS . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Grounding and Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Evaluating the AD7851 Performance . . . . . . . . . . . . . . . . 33
OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . 34
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
–3–
REV. B
AD7851
A Grade: fCLKIN = 7 MHz (–40ⴗC to +85ⴗC), fSAMPLE = 333 kHz; K Grade: fCLKIN = 6 MHz (0ⴗC to 85ⴗC), fSAMPLE = 285 kHz; A and K Grade: fCLKIN = 5 MHz
(to 125ⴗC), fSAMPLE = 238 kHz; (AVDD = DVDD = 5.0 V ⴞ 5%, REFIN/REFOUT = 4.096 V External Reference; SLEEP = Logic High; TA = TMIN to TMAX,
unless otherwise noted.)
Parameter Version A
1
Version K
1
Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
Signal-to-Noise + Distortion Ratio
3
(SNR) 77 78 dB min Typically SNR Is 79.5 dB.
V
IN
= 10 kHz, Sine Wave, f
SAMPLE
= 333 kHz.
Total Harmonic Distortion (THD) –86 –86 dB max V
IN
= 10 kHz, Sine Wave, f
SAMPLE
= 333 kHz,
typically –96 dB.
Peak Harmonic or Spurious Noise –87 –87 dB max V
IN
= 10 kHz, f
SAMPLE
= 333 kHz.
Intermodulation Distortion (IMD)
Second-Order Terms –86 –90 dB typ fa = 9.983 kHz, fb = 10.05 kHz, f
SAMPLE
= 333 kHz.
Third-Order Terms –86 –90 dB typ fa = 9.983 kHz, fb = 10.05 kHz, f
SAMPLE
= 333 kHz.
Full Power Bandwidth 20 20 MHz typ @ 3 dB.
DC ACCURACY
Resolution 14 14 Bits
Integral Nonlinearity ±2±1LSB max
Differential Nonlinearity ±2±1LSB max Guaranteed No Missed Codes to 14 Bits
Unipolar Offset Error ±10 ±10 LSB max Review: Adjusting the Offset Calibration
Positive Full-Scale Error ±10 ±10 LSB max Register in the Calibration Registers section.
Negative Full-Scale Error ±10 ±10 LSB typ
Bipolar Zero Error ±1±1LSB typ
ANALOG INPUT
Input Voltage Ranges 0 V to V
REF
0 V to V
REF
VAIN(+) – AIN(–) = 0 V to V
REF
, AIN(–) can be
biased up but AIN(+) cannot go below AIN(–).
±V
REF
/2 ±V
REF
/2 V AIN(+) – AIN(–) = –V
REF
/2 to +V
REF
/2, AIN(–)
should be biased up and AIN(+) can go below
AIN(–) but cannot go below 0 V.
Leakage Current ±1±1µA max
Input Capacitance 20 20 pF typ
REFERENCE INPUT/OUTPUT
REF
IN
Input Voltage Range 4/V
DD
4/V
DD
V min/max Functional from 1.2 V.
Input Impedance 150 150 kΩ typ Resistor Connected to Internal Reference Node.
REF
OUT
Output Voltage 3.696/4.496 3.696/4.496 V min/max
REF
OUT
Temperature Coefficient 50 50 ppm/°C typ
LOGIC INPUTS
Input High Voltage, V
INH
V
DD
– 1.0 V
DD
– 1.0 V min
Input Low Voltage, V
INL
0.4 0.4 V max
Input Current, I
IN
±10 ±10 µA max V
IN
= 0 V or V
DD
.
Input Capacitance, C
IN4
10 10 pF max
LOGIC OUTPUTS
Output High Voltage, V
OH
V
DD
– 0.4 V
DD
– 0.4 V min I
SOURCE
= 200 µA.
Output Low Voltage, V
OL
0.4 0.4 V max I
SINK
= 0.8 mA.
Floating State Leakage Current ±10 ±10 µA max
Floating State Output Capacitance
4
10 10 pF max
Output Coding Straight (Natural) Binary Unipolar Input Range.
Twos Complement Bipolar Input Range.
CONVERSION RATE
Conversion Time 2.78 3.25 µs max 19.5 CLKIN Cycles.
Conversion + Track-and-Hold
Acquisition Time 3.0 3.5 µs max 21 CLKIN Cycles Throughput Rate.
SPECIFICATIONS
1, 2
AD7851
–4– REV. B
Parameter Version A
1
Version K
1
Unit Test Conditions/Comments
POWER PERFORMANCE
AV
DD,
DV
DD
4.75/5.25 4.75/5.25 V min/max
I
DD
Normal Mode
4
17 17 mA max AV
DD
= DV
DD
= 4.75 V to 5.25 V. Typically
12 mA.
Sleep Mode
5
With External Clock On 20 20 µA typ Full Power-Down. Power management bits
in control register set as PMGT1 = 1, PMGT0 = 0.
600 600 µA typ Partial Power-Down. Power management bits in
control register set as PMGT1 = 1, PMGT0 = 1.
With External Clock Off 10 10 µA max Typically 1 µA. Full Power-Down. Power
management bits in control register set as
PMGT1 = 1, PMGT0 = 0.
300 300 µA typ Partial Power-Down. Power management bits in
control register set as PMGT1 = 1, PMGT0 = 1.
Normal Mode Power Dissipation 89.25 89.25 mW max V
DD
= 5.25 V: Typically 63 mW; SLEEP = V
DD
.
Sleep Mode Power Dissipation
With External Clock On 105 105 µW typ V
DD
= 5.25 V; SLEEP = 0 V.
With External Clock Off 52.5 52.5 µW max V
DD
= 5.25 V; Typically 5.25 µW; SLEEP = 0 V.
SYSTEM CALIBRATION
Offset Calibration Span
6
+0.05 × V
REF
/–0.05 × V
REF
V max/min Allowable Offset Voltage Span for Calibration.
Gain Calibration Span
6
+1.025 × V
REF
/–0.975 × V
REF
V max/min Allowable Full-Scale Voltage Span for Calibratio
n.
NOTES
1
Temperature ranges as follows: A Version, –40°C to +125°C; K Version, 0°C to 125°C.
2
Specifications apply after calibration.
3
SNR calculation includes distortion and noise components.
4
All digital inputs at DGND except for CONVST, SLEEP, CAL, and SYNC at DV
DD
. No load on the digital outputs. Analog inputs at AGND.
5
CLKIN at DGND when external clock off. All digital inputs at DGND except for CONVST, SLEEP, CAL, and SYNC at DV
DD
. No load on the digital outputs.
Analog inputs at AGND.
6
The offset and gain calibration spans are defined as the range of offset and gain errors that the AD7851 can calibrate. Note also that these are voltage spans and are
not absolute voltages (i.e., the allowable system offset voltage presented at AIN(+) for the system offset error to be adjusted out will be AIN(–) ± 0.05 × V
REF
, and the
allowable system full-scale voltage applied between AIN(+) and AIN(–) for the system full-scale voltage error to be adjusted out will be V
REF
± 0.025 × V
REF
). This is
explained in more detail in the Calibration section of the data sheet.
Specifications subject to change without notice.
–5–
REV. B
AD7851
Descriptions that refer to SCLK↑ (rising) or SCLK↓ (falling) edges are with the POLARITY pin HIGH. For the POLARITY pin
LOW, then the opposite edge of SCLK will apply.
Limit at T
MIN
, T
MAX
Parameter (A, K Versions) Unit Description
f
CLKIN2
500 kHz min Master Clock Frequency
7MHz max
f
SCLK3
10 MHz max Interface Modes 1, 2, 3 (External Serial Clock)
f
CLK IN
MHz max Interface Modes 4, 5 (Internal Serial Clock)
t
14
100 ns min CONVST Pulse Width
t
2
50 ns max CONVST↓ to BUSY↑ Propagation Delay
t
CONVERT
3.25 µs max Conversion Time = 20 t
CLKIN
t
3
–0.4 t
SCLK
ns min SYNC↓ to SCLK↓ Setup Time (Noncontinuous SCLK Input)
±0.4 t
SCLK
ns min/max SYNC↓ to SCLK↓ Setup Time (Continuous SCLK Input)
t
4
0.6 t
SCLK
ns min SYNC↓ to SCLK↓ Setup Time, Interface Mode 4 Only
t
55
30 ns max Delay from SYNC↓ until DOUT Three-State Disabled
t
5A5
30 ns max Delay from SYNC↓ until DIN Three-State Disabled
t
65
45 ns max Data Access Time after SCLK↓
t
7
30 ns min Data Setup Time prior to SCLK↑
t
8
20 ns min Data Valid to SCLK Hold Time
t
96
0.4 t
SCLK
ns min SCLK High Pulse Width (Interface Modes 4 and 5)
t
106
0.4 t
SCLK
ns min SCLK Low Pulse Width (Interface Modes 4 and 5)
t
11
30 ns min SCLK↑ to SYNC↑ Hold Time (Noncontinuous SCLK)
30/0.4 t
SCLK
ns min/max (Continuous SCLK) Does Not Apply to Interface Mode 3
t
11A
50 ns max SCLK↑ to SYNC↑ Hold Time
t
127
50 ns max Delay from SYNC↑ until DOUT Three-State Enabled
t
13
90 ns max Delay from SCLK↑ to DIN Being Configured as Output
t
148
50 ns max Delay from SCLK↑ to DIN Being Configured as Input
t
15
2.5 t
CLKIN
ns max CAL↑ to BUSY↑ Delay
t
16
2.5 t
CLKIN
ns max CONVST↓ to BUSY↑ Delay in Calibration Sequence
t
CAL9
41.7 ms typ Full Self-Calibration Time, Master Clock Dependent
(250026 t
CLKIN
)
t
CAL19
37.04 ms typ Internal DAC Plus System Full-Scale Calibration Time, Master Clock
Dependent (222228 t
CLKIN
)
t
CAL29
4.63 ms typ System Offset Calibration Time, Master Clock Dependent
(27798 t
CLKIN
)
t
DELAY
65 ns max Delay from CLK to SCLK
NOTES
1
Sample tested at 25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD
) and timed from a voltage level of 1.6 V. See
Table X and timing diagrams for different interface modes and calibration.
2
Mark/space ratio for the master clock input is 40/60 to 60/40.
3
For Interface Modes 1, 2, 3, the SCLK maximum frequency will be 10 MHz. For Interface Modes 4 and 5, the SCLK will be an output and the frequency will be f
CLKIN
.
4
The CONVST pulse width will only apply for normal operation. When the part is in power-down mode, a different CONVST pulse width will apply (see Power-
Down section).
5
Measured with the load circuit of Figure 1 and defined as the time required for the output to cross 0.8 V or 2.4 V.
6
For self-clocking mode (Interface Modes 4, 5), the nominal SCLK high and low times will be 0.5 t
SCLK
= 0.5 t
CLKIN
.
7
The time t
12
is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then
extrapolated back to remove the effects of charging or discharging the 50 pF capacitor. This means that t
12
as quoted in the timing characteristics is the true bus
relinquish time of the part and is independent of the bus loading.
8
The time t
14
is derived form the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then
extrapolated back to remove the effects of charging or discharging the 50 pF capacitor. This means that the time quoted in the timing characteristics is the true
delay of the part in turning off the output drivers and configuring the DIN line as an input. Once this time has elapsed , the user can drive the DIN line knowing
that a bus conflict will not occur.
9
The typical time specified for the calibration times is for a master clock of 6 MHz.
Specifications subject to change without notice.
TIMING SPECIFICATIONS
1
(AVDD = DVDD = 5.0 V ⴞ 5%; fCLKIN = 6 MHz, TA = TMIN to TMAX, unless otherwise noted.)
AD7851
–6– REV. B
TYPICAL TIMING DIAGRAMS
Figures 2 and 3 show typical read and write timing diagrams.
Figure 2 shows the reading and writing after conversion in
Interface Modes 2 and 3. To attain the maximum sample rate of
285 kHz in Interface Modes 2 and 3, reading and writing must
be performed during conversion. Figure 3 shows the timing dia-
gram for Interface Modes 4 and 5 with sample rate of 285 kHz.
At least a 330 ns acquisition time must be allowed (the time
from the falling edge of BUSY to the next rising edge of
CONVST) before the next conversion begins to ensure that the
part is settled to the 14-bit level. If the user does not want to
provide the CONVST signal, the conversion can be initiated in
software by writing to the control register.
1.6mA
2.1V
200µA
CL
50pF
TO
OUTPUT
PIN
IOL
IOH
Figure 1. Load Circuit for Digital Output Timing
Specifications
DB15 DB0
DB11
POLARITY PIN LOGIC HIGH
SYNC (I/P)
SCLK (I/P)
t3
BUSY (O/P)
CONVST (I/P)
t2
t5
t11
t6
t9
t10
15
616
t12
DOUT (O/P) DB0DB11
t8
DIN (I/P)
THREE-STATE
THREE-STATE DB15
tCONVERT
tCONVERT = 3.25µs MAX, t1 = 100ns MIN,
t5 = 30ns MAX, t7 = 30ns MIN
t1
t6
t7
Figure 2. Timing Diagram (Typical Read and Write Operation for Interface Modes 2, 3)
POLARITY PIN LOGIC HIGH
SYNC (O/P)
SCLK (O/P)
t4
BUSY (O/P)
CONVST (I/P)
t2
t5
t11
t12
t9
t10
15
616
DOUT (O/P) DB0DB11
t8
DIN (I/P) DB15 DB0
THREE-STATE
DB11
THREE-STATE DB15
tCONVERT
tCONVERT = 3.25µs MAX, t1 = 100ns MIN,
t5 = 30ns MAX, t7 = 30ns MIN
t1
t6
t7
Figure 3. Timing Diagram (Typical Read and Write Operation for Interface Modes 4, 5)
–7–
REV. B
AD7851
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25°C, unless otherwise noted.)
AV
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DV
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Analog Input Voltage to AGND . . . . . –0.3 V to AV
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . –0.3 V to DV
DD
+ 0.3 V
Digital Output Voltage to DGND . . . –0.3 V to DV
DD
+ 0.3 V
REF
IN
/REF
OUT
to AGND . . . . . . . . . . –0.3 V to AV
DD
+ 0.3 V
Input Current to Any Pin Except Supplies
2
. . . . . . . . . ±10 mA
Operating Temperature Range
Commercial (A, K Versions) . . . . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
PDIP Package, Power Dissipation . . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
θ
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . .34.7°C/W
Lead Temperature, (Soldering, 10 secs) . . . . . . . . . . 260°C
SOIC, SSOP Package, Power Dissipation . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . 75°C/W (SOIC), 122.28°C/W (SSOP)
θ
JC
Thermal Impedance . . . 25°C/W (SOIC), 31.25°C/W (SSOP)
PINOUT FOR DIP, SOIC, AND SSOP
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
AD7851
TOP VIEW
(Not to Scale)
CONVST
BUSY
SLEEP
REF
IN
/REF
OUT
AV
DD
AGND
C
REF1
C
REF2
AIN(+)
AIN(–)
NC
AGND
SYNC
SCLK
CLKIN
DIN
DOUT
DGND
DV
DD
CAL
SM2
SM1
POLARITY
AMODE
NC = NO CONNECT
ORDERING GUIDE
1
Linearity
Temperature Error Throughput Throughput Package
Model Range (LSB)
2
Rate (kSPS) at 125ⴗC (kSPS) Description Options
3
AD7851AN –40°C to +85°C±2333 238 PDIP N-24
AD7851KN 0°C to 85°C±1285 238 PDIP N-24
AD7851AR –40°C to +85°C±2333 238 SOIC R-24
AD7851AR-REEL –40°C to +85°C±2333 238 SOIC R-24
AD7851ARZ
3
–40°C to +85°C±2333 238 SOIC R-24
AD7851ARZ-REEL
3
–40°C to +85°C±2333 238 SOIC R-24
AD7851KR 0°C to 85°C±1285 238 SOIC R-24
AD7851KR-REEL 0°C to 85°C±1285 238 SOIC R-24
AD7851KRZ
3
0°C to 85°C±1285 238 SOIC R-24
AD7851KRZ-REEL
3
0°C to 85°C±1285 238 SOIC R-24
AD7851ARS –40°C to +85°C±2333 238 SSOP RS-24
AD7851ARS-REEL –40°C to +85°C±2333 238 SSOP RS-24
EVAL-AD7851CB
4
Evaluation Board
EVAL-CONTROL BRD2
5
Controller Board
NOTES
1
Both A and K Grades are guaranteed up to 125°C, but at a lower throughput of 238 kHz (5 MHz).
2
Linearity error refers to the integral linearity error.
3
Z = Pb-free part.
4
This can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BOARD for evaluation/demonstration purposes.
5
This board is a complete unit allowing a PC to control and communicate with all Analog Devices, Inc. evaluation boards ending in the CB designators. To order a
complete evaluation kit, the particular ADC evaluation board needs to be ordered, e.g., EVAL-AD7851CB, the EVAL-CONTROL BRD2, and a 12 V ac trans-
former. See the Evaluation Board application note for more information.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD7851 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >1.5 kV
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
AD7851
–8– REV. B
TERMINOLOGY
Integral Nonlinearity
This is the maximum deviation from a straight line passing
through the endpoints of the ADC transfer function. The end-
points of the transfer function are zero scale, a point 1/2 LSB
below the first code transition, and full scale, a point 1/2 LSB
above the last code transition.
Differential Nonlinearity
This is the difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Total Unadjusted Error
This is the deviation of the actual code from the ideal code tak-
ing all errors into account (gain, offset, integral nonlinearity, and
other errors) at any point along the transfer function.
Unipolar Offset Error
This is the deviation of the first code transition (00 . . . 000 to
00 . . . 001) from the ideal AIN(+) voltage (AIN(–) + 1/2 LSB)
when operating in unipolar mode.
Positive Full-Scale Error
This applies to unipolar and bipolar modes and is the deviation of
the last code transition from the ideal AIN(+) voltage (AIN(–) +
full scale – 1.5 LSB) after the offset error has been adjusted out.
Negative Full-Scale Error
This applies to bipolar mode only and is the deviation of the
first code transition (10 . . . 000 to 10 . . . 001) from the ideal
AIN(+) voltage (AIN(–) – V
REF
/2 + 0.5 LSB).
Bipolar Zero Error
This is the deviation of the midscale transition (all 1s to all 0s)
from the ideal AIN(+) voltage (AIN(–) – 1/2 LSB).
Track-and-Hold Acquisition Time
The track-and-hold amplifier returns into track mode at the end
of conversion. Track-and-hold acquisition time is the time
required for the output of the track-and-hold amplifier to reach
its final value, within ±1/2 LSB, after the end of conversion.
Signal-to-(Noise + Distortion) Ratio
This is the measured ratio of signal-to-(noise + distortion) at
the output of the ADC. The signal is the rms amplitude of the
fundamental. Noise is the sum of all nonfundamental signals up
to half the sampling frequency (f
S
/2), excluding dc. The ratio is
dependent on the number of quantization levels in the digitiza-
tion process; the more levels, the smaller the quantization noise.
The theoretical signal-to-(noise + distortion) ratio for an ideal
N-bit converter with a sine wave input is given by
Signal-to-(Noise + Distortion) = (6.02 N +1.76)dB
Thus, for a 14-bit converter, this is 86 dB.
Total Harmonic Distortion
Total harmonic distortion (THD) is the ratio of the rms sum of
harmonics to the fundamental. For the AD7851, it is defined as
THD
VVVVV
V
(d ) 20logB =++++
()
2
2
3
2
4
2
5
2
6
2
1
where V
1
is the rms amplitude of the fundamental and V
2
, V
3
,
V
4
, V
5
, and V
6
are the rms amplitudes of the second through the
sixth harmonics.
Peak Harmonic or Spurious Noise
Peak harmonic or spurious noise is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to f
S
/2 and excluding dc) to the rms value of the
fundamental. Normally, the value of this specification is deter-
mined by the largest harmonic in the spectrum, but for parts
where the harmonics are buried in the noise floor, it will be a
noise peak.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and
fb, any active device with nonlinearities will create distortion
products at sum and difference frequencies of mfa ± nfb where
m, n = 0, 1, 2, 3, etc. Intermodulation distortion terms are
those for which neither m nor n are equal to zero. For example,
the second-order terms include (fa + fb) and (fa – fb), while the
third-order terms include (2fa + fb), (2fa – fb), (fa + 2fb), and
(fa – 2fb).
Testing is performed using the CCIF standard where two
input frequencies near the top end of the input bandwidth are
used. In this case, the second-order terms are usually distanced
in frequency from the original sine waves while the third-order
terms are usually at a frequency close to the input frequencies.
As a result, the second- and third-order terms are specified
separately. The calculation of the intermodulation distortion is
as per the THD specification where it is the ratio of the rms
sum of the individual distortion products to the rms amplitude
of the sum of the fundamentals expressed in dBs.
Power Supply Rejection Ratio (PSRR)
PSRR is defined as the ratio of the power in ADC output at fre-
quency f to the power of the full-scale sine wave applied to the
supply voltage (V
DD
). The units are in LSB, % of FS per % of
supply voltage, or expressed logarithmically, in dB (PSRR (dB)
= 10 log (Pf/Pfs)).
Full Power Bandwidth (FPBW)
FPBW is that frequency at which the amplitude of the recon-
structed fundamental (using FFTs and neglecting harmonics
and SNR) is reduced by 3 dB for a full-scale input.
–9–
REV. B
AD7851
PIN FUNCTION DESCRIPTIONS
Pin No. Mnemonic Description
1CONVST Convert Start. Logic input. A low-to-high transition on this input puts the track-and-hold into its hold
mode and starts conversion. When this input is not used, it should be tied to DV
DD
.
2BUSY Busy Output. The busy output is triggered high by the falling edge of CONVST or rising edge of CAL and
remains high until conversion is completed. BUSY is also used to indicate when the AD7851 has completed
its on-chip calibration sequence.
3SLEEP Sleep Input/Low Power Mode. A Logic 0 initiates a sleep and all circuitry is powered down, including the
internal voltage reference, provided there is no conversion or calibration being performed. Calibration data
is retained. A Logic 1 results in normal operation. See Power-Down section for more details.
4REF
IN
/Reference Input/Output. This pin is connected to the internal reference through a series resistor and is the
REF
OUT
reference source for the analog-to-digital converter. The nominal reference voltage is 4.096 V and this appears
at the pin. This pin can be overdriven by an external reference or can be taken as high as AV
DD
. When this
pin is tied to AV
DD
, or when an externally applied reference approaches V
DD
, then the C
REF1
pin should also
be tied to AV
DD
.
5AV
DD
Analog Positive Supply Voltage, 5.0 V ± 5%.
6, 12 AGND Analog Ground. Ground reference for track and hold, reference, and DAC.
7C
REF1
Reference Capacitor (0.1 µF ceramic disc in parallel with a 470 nF tantalum). This external capacitor is
used as a charge source for the internal DAC. The capacitor should be tied between the pin and AGND.
8C
REF2
Reference Capacitor (0.01 µF ceramic disc). This external capacitor is used in conjunction with the on-chip
reference. The capacitor should be tied between the pin and AGND.
9AIN(+) Analog Input. Positive input of the pseudo-differential analog input. Cannot go below AGND or above
AV
DD
at any time and cannot go below AIN(–) when the unipolar input range is selected.
10 AIN(–) Analog Input. Negative input of the pseudo-differential analog input. Cannot go below AGND or above
AV
DD
at any time.
11 NC No Connect Pin.
13 AMODE Analog Mode Pin. This pin allows two different analog input ranges to be selected. A Logic 0 selects range
0 to V
REF
(i.e., AIN(+) – AIN(–) = 0 to V
REF
). In this case, AIN(+) cannot go below AIN(–) and AIN(–)
cannot go below AGND. A Logic 1 selects range –V
REF
/2 to +V
REF
/2 (i.e., AIN(+) – AIN(–) = –V
REF
/2 to
+V
REF
/2). In this case, AIN(+) cannot go below AGND so that AIN(–) needs to be biased to +V
REF
/2 to
allow AIN(+) to go from 0 V to +V
REF
V.
14 POLARITY Serial Clock Polarity. This pin determines the active edge of the serial clock (SCLK). Toggling this pin will
reverse the active edge of the serial clock (SCLK). A Logic 1 means that the serial clock (SCLK) idles high
and a Logic 0 means that the serial clock (SCLK) idles low. It is best to refer to the timing diagrams and
Table IX for the SCLK active edges.
15 SM1 Serial Mode Select Pin. This pin is used in conjunction with the SM2 pin to give different modes of opera-
tion as described in Table X.
16 SM2 Serial Mode Select Pin. This pin is used in conjunction with the SM1 pin to give different modes of opera-
tion as described in Table X.
17 CAL Calibration Input. This pin has an internal pull-up current source of 0.15 µA. A Logic 0 on this pin resets all
calibration control logic and initiates a calibration on its rising edge. There is the option of connecting a 10 nF
capacitor from this pin to DGND to allow for an automatic self-calibration on power-up. This input overrides
all other internal operations. If the autocalibration is not required, then this pin should be tied to a logic high.
18 DV
DD
Digital Supply Voltage, 5.0 V ± 5%.
19 DGND Digital Ground. Ground reference point for digital circuitry.
20 DOUT Serial Data Output. The data output is supplied to this pin as a 16-bit serial word.
21 DIN Serial Data Input. The data to be written is applied to this pin in serial form (16-bit word). This pin can act as
an input pin or as a input and output pin depending on the serial interface mode the part is in (see Table X).
22 CLKIN Master Clock Signal for the Device (6 MHz or 7 MHz). Sets the conversion and calibration times.
23 SCLK Serial Port Clock. Logic input/output. The SCLK pin is configured as an input or output, dependent on the
type of serial data transmission (self-clocking or external-clocking) that has been selected by the SM1 and
SM2 pins. The SCLK idles high or low depending on the state of the POLARITY pin.
24 SYNC This pin can be an input level triggered active low (similar to a chip select in one case and to a frame sync
in the other) or an output (similar to a frame sync) pin depending on SM1, SM2 (see Table X).
AD7851
–10– REV. B
AD7851 ON-CHIP REGISTERS
The AD7851 powers up with a set of default conditions, and the user need not ever write to the device. In this case, the AD7851 will
operate as a read-only ADC. The AD7851 still retains the flexibility for performing a full power-down and a full self-calibration.
Note that the DIN pin should be tied to DGND for operating the AD7851 as a read-only ADC.
Extra features and flexibility, such as performing different power-down options, different types of calibrations, including system cali-
bration, and software conversion starts can be selected by writing to the part.
The AD7851 contains a control register, ADC output data register, status register, test register, and 10 calibration registers.
The control register is write-only, the ADC output data register and the status register are read-only, and the test and calibration
registers are both read/write registers. The test register is used for testing the part and should not be written to.
Addressing the On-Chip Registers
Writing
A write operation to the AD7851 consists of 16 bits. The two MSBs, ADDR0 and ADDR1, are decoded to determine which regis-
ter is addressed, and the subsequent 14 bits of data are written to the addressed register. It is not until all 16 bits are written that
the data is latched into the addressed register. Table I shows the decoding of the address bits, while Figure 4 shows the overall
write register hierarchy.
Table I. Write Register Addressing
ADDR1 ADDR0 Comment
00This combination does not address any register so the subsequent 14 data bits are ignored.
01This combination addresses the TEST REGISTER. The subsequent 14 data bits are written to the test register.
10This combination addresses the CALIBRATION REGISTERS. The subsequent 14 data bits are written
to the selected calibration register.
11This combination addresses the CONTROL REGISTER. The subsequent 14 data bits are written to the
control register.
Reading
To read from the various registers the user must first write to Bits 6 and 7 in the Control Register, RDSLT0 and RDSLT1. These
bits are decoded to determine which register is addressed during a read operation. Table II shows the decoding of the read address
bits while Figure 5 shows the overall read register hierarchy. The power-up status of these bits is 00 so that the default read will be
from the ADC output data register.
Once the read selection bits are set in the control register, all subsequent read operations that follow will be from the selected register
until the read selection bits are changed in the control register.
Table II. Read Register Addressing
RDSLT1 RDSLT0 Comment
00All successive read operations will be from ADC OUTPUT DATA REGISTER. This is the power-up default
setting. There will always be two leading zeros when reading from the ADC output data register.
01All successive read operations will be from TEST REGISTER.
10All successive read operations will be from CALIBRATION REGISTERS.
11All successive read operations will be from STATUS REGISTER.
ADDR1, ADDR0
DECODE
TEST
REGISTER
CONTROL
REGISTER
GAIN (1)
OFFSET (1)
DAC (8)
GAIN (1)
OFFSET (1) OFFSET (1) GAIN (1)
01 10 11
00 01 10 11
CALSLT1, CALSLT0
DECODE
CALIBRATION
REGISTERS
Figure 4. Write Register Hierarchy/Address Decoding
RDSLT1, RDSLT0
DECODE
TEST
REGISTER
CALIBRATION
REGISTERS
STATUS
REGISTER
GAIN (1)
OFFSET (1)
DAC (8)
GAIN (1)
OFFSET (1) OFFSET (1) GAIN (1)
01 10 11
00 01 10 11
CALSLT1, CALSLT0
DECODE
ADC OUTPUT
DATA REGISTER
00
Figure 5. Read Register Hierarchy/Address Decoding
–11–
REV. B
AD7851
CONTROL REGISTER
The arrangement of the control register is shown below. The control register is a write-only register and contains 14 bits of data. The
control register is selected by putting two 1s in ADDR1 and ADDR0. The function of the bits in the control register are described
below. The power-up status of all bits is 0.
MSB
ZERO ZERO ZERO ZERO PMGT1 PMGT0 RDSLT1
RDSLT0 2/3 MODE CONVST CALMD CALSLT1 CALSLT0 STCAL
LSB
Control Register Bit Function Descriptions
Bit No. Mnemonic Comment
13 ZERO These four bits must be set to 0 when writing to the control register.
12 ZERO
11 ZERO
10 ZERO
9PMGT1 Power Management Bits. These two bits are used with the SLEEP pin for putting the part into various
8PMGT0 power-down modes (see Power-Down section for more details).
7RDSLT1 Theses two bits determine which register is addressed for the read operations. See Table II.
6RDSLT0
52/3 MODE Interface Mode Select Bit. With this bit set to 0, Interface Mode 2 is enabled. With this bit set to 1,
Interface Mode 1 is enabled where DIN is used as an output as well as an input. This bit is set to 0 by
default after every read cycle; thus when using Interface Mode 1, this bit needs to be set to 1 in every
write cycle.
4CONVST Conversion Start Bit. A Logic 1 in this bit position starts a single conversion, and this bit is automati-
cally reset to 0 at the end of conversion. This bit may also be used in conjunction with system calibration
(see Calibration section).
3CALMD Calibration Mode Bit. A 0 here selects self-calibration and a 1 selects a system calibration (see Table III).
2CALSLT1 Calibration Selection Bits and Start Calibration Bit. These bits have two functions:
1CALSLT0 With the STCAL bit set to 1, the CALSLT1 and CALSLT0 bits determine the type of calibration per-
0STCAL formed by the part (see Table III). The STCAL bit is automatically reset to 0 at the end of calibration.
With the STCAL bit set to 0, the CALSLT1 and CALSLT0 bits are decoded to address the calibration
register for read/write of calibration coefficients (see section on Calibration Registers for more details).
Table III. Calibration Selection
CALMD CALSLT1 CALSLT0 Calibration Type
00 0 A full internal calibration is initiated where the internal DAC is calibrated followed by the
internal gain error, and finally the internal offset error is calibrated out. This is the default setting.
00 1 Here the internal gain error is calibrated out followed by the internal offset error calibrated
out.
01 0This calibrates out the internal offset error only.
01 1This calibrates out the internal gain error only.
10 0 A full system calibration is initiated here where first the internal DAC is calibrated, fol-
lowed by the system gain error, and finally the system offset error is calibrated out.
10 1Here the system gain error is calibrated out followed by the system offset error.
11 0This calibrates out the system offset error only.
11 1This calibrates out the system gain error only.
AD7851
–12– REV. B
STATUS REGISTER
The arrangement of the status register is shown below. The status register is a read-only register and contains 16 bits of data. The
status register is selected by first writing to the control register and putting two 1s in RDSLT1 and RDSLT0. The function of the
bits in the status register is described below. The power-up status of all bits is 0.
WRITE TO CONTROL REGISTER
SETTING RDSLT0 = RDSLT1 = 1
READ STATUS REGISTER
START
Figure 6. Flowchart for Reading the Status Register
MSB
ZERO BUSY ZERO ZERO ZERO ZERO PMGT1 PMGT0
RDSLT1 RDSLT0 2/3 MODE XCALMD CALSLT1 CALSLT0 STCAL
LSB
Status Register Bit Function Descriptions
Bit No. Mnemonic Comment
15 ZERO This bit is always 0.
14 BUSY Conversion/Calibration Busy Bit. When this bit is 1, this indicates that there is a conversion or calibration
in progress. When this bit is 0, there is no conversion or calibration in progress.
13 ZERO These four bits are always 0.
12 ZERO
11 ZERO
10 ZERO
9PMGT1 Power Management Bits. These bits along with the SLEEP pin will indicate whether the part is in a power-
8PMGT0 down mode. (See Table VI in the Power-Down Options section for description.)
7RDSLT1 Both these bits are always 1 indicating it is the status register that is being read. (See Table II.)
6RDSLT0
52/3 MODE Interface Mode Select Bit. With this bit 0, the device is in Interface Mode 2. With this bit 1, the device is in
Interface Mode 1. This bit is reset to 0 after every read cycle.
4X Don’t care bit.
3CALMD Calibration Mode Bit. A 0 in this bit indicates self-calibration is selected, and 1 in this bit indicates a system
calibration is selected (see Table III).
2CALSLT1 Calibration Selection Bits and Start Calibration Bit. The STCAL bit is read as a 1 if a calibration is in
1CALSLT0 progress and as a 0 if there is no calibration in progress. The CALSLT1 and CALSLT0 bits indicate which
0STCAL of the calibration registers are addressed for reading and writing (see the Calibration Registers section for
more details)
–13–
REV. B
AD7851
CALIBRATION REGISTERS
The AD7851 has 10 calibration registers in all, 8 for the DAC, 1 for the offset, and 1 for gain. Data can be written to or read from all
10 calibration registers. In self- and system calibration, the part automatically modifies the calibration registers; only if the user needs
to modify the calibration registers should an attempt be made to read from and write to the calibration registers.
Addressing the Calibration Registers
The calibration selection bits in the control register, CALSLT1 and CALSLT0, determine which of the calibration registers are
addressed (see Table IV). The addressing applies to both the read and write operations for the calibration registers. The user
should not attempt to read from and write to the calibration registers at the same time.
Table IV. Calibration Register Addressing
CALSLT1 CALSLT0 This Combination Addresses the
0 0Gain (1), Offset (1) and DAC Registers (8). Ten registers in total.
0 1Gain (1) and Offset (1) Registers. Two registers in total.
1 0Offset Register. One register in total.
1 1Gain Register. One register in total.
Writing to/Reading from the Calibration Registers
For writing to the calibration registers, a write to the control reg-
ister is required to set the CALSLT0 and CALSLT1 bits. For
reading from the calibration registers, a write to the control regis-
ter is required to set the CALSLT0 and CALSLT1 bits, but also
to set the RDSLT1 and RDSLT0 bits to 10 (this addresses the
calibration registers for reading). The calibration register pointer
is reset on writing to the control register setting the CALSLT1
and CALSLT0 bits, or upon completion of all the calibration
register write/read operations. When reset, it points to the first
calibration register in the selected write/read sequence. The cali-
bration register pointer will point to the gain calibration register
upon reset in all but one case, this case being where the offset
calibration register is selected on its own (CALSLT1 = 1,
CALSLT0 = 0). Where more than one calibration register is being
accessed, the calibration register pointer will be automatically
incremented after each calibration register write/read operation.
The order in which the 10 calibration registers are arranged is
shown in Figure 7. The user may abort at any time before all
the calibration register write/read operations are completed,
and the next control register write operation will reset the cali-
bration register pointer. The flowchart in Figure 8 shows the
sequence for writing to the calibration registers and Figure 9
shows the sequence for reading.
CAL REGISTER
ADDRESS POINTER
CALIBRATION REGISTERS
GAIN REGISTER
OFFSET REGISTER
DAC 1st MSB REGISTER
DAC 8th MSB REGISTER
(1)
(2)
(3)
(10)
CALIBRATION REGISTER ADDRESS POINTER POSITION IS
DETERMINED BY THE NUMBER OF CALIBRATION REGISTERS
ADDRESSED AND THE NUMBER OF READ/WRITE OPERATIONS.
Figure 7. Calibration Register Arrangement
When reading from the calibration registers there will always be
two leading zeros for each of the registers. When operating in
Serial Interface Mode 1, the read operations to the calibration
registers cannot be aborted. The full number of read operations
must be completed (see the Serial Interface Summary section
for more detail).
START
WRITE TO CAL REGISTER
(ADDR1 = 1, ADDR0 = 0)
FINISHED
LAST
REGISTER
WRITE
OPERATION
OR
ABORT
?
YES
NO
CAL REGISTER POINTER IS
AUTOMATICALLY RESET
WRITE TO CONTROL REGISTER SETTING STCAL = 0
AND CALSLT1, CALSLT0 = 00, 01, 10, 11
CAL REGISTER POINTER IS
AUTOMATICALLY INCREMENTED
Figure 8. Flowchart for Writing to the Calibration Registers
AD7851
–14– REV. B
FINISHED
LAST
REGISTER
WRITE
OPERATION
OR
ABORT
?
YES
NO
CAL REGISTER POINTER IS
AUTOMATICALLY INCREMENTED
READ CAL REGISTER
CAL REGISTER POINTER IS
AUTOMATICALLY RESET
WRITE TO CONTROL REGISTER SETTING STCAL = 0, RDSLT1 = 1,
RDSLT0 = 0, AND CALSLT1, CALSLT0 = 00, 01, 10, 11
START
Figure 9. Flowchart for Reading from the
Calibration Registers
Adjusting the Offset Calibration Register
The offset calibration register contains 16 bits, 2 leading 0s, and
14 data bits. By changing the contents of the offset register, dif-
ferent amounts of offset on the analog input signal can be com-
pensated for. Increasing the number in the offset calibration
register compensates for the negative offset on the analog input
signal, and decreasing the number in the offset calibration regis-
ter compensates for the positive offset on the analog input signal.
The default value of the offset calibration register is approxi-
mately 0010 0000 0000 0000. This is not an exact value, but the
value in the offset register should be close to this value. Each of
the 14 data bits in the offset register is binary weighted; the MSB
has a weighting of 5% of the reference voltage, the MSB-1 has a
weighting of 2.5%, the MSB-2 has a weighting of 1.25%, and so
on down to the LSB which has a weighting of 0.0006%.
This gives a resolution of ±0.0006% of V
REF
approximately.
More accurately the resolution is ±(0.05 × V
REF
)/2
13
V =
±0.015 mV, with a 2.5 V reference. The maximum offset that
can be compensated for is ±5% of the reference voltage, which
equates to ±125 mV with a 2.5 V reference and ±250 mV with
a 5 V reference.
Q. If a +20 mV offset is present in the analog input signal and
the reference voltage is 2.5 V, what code needs to be written
to the offset register to compensate for the offset?
A. The 2.5 V reference implies that the resolution in the off-
set register is 5% × 2.5 V/2
13
= 0.015 mV. 20 mV/
0.015 mV = 1310.72; rounding to the nearest number gives
1311. In binary terms this is 0101 0001 1111, therefore
decrease the offset register by 0101 0001 1111.
This method of compensating for offset in the analog input signal
allows for fine-tuning the offset compensation. If the offset on the
analog input signal is known, there will be no need to apply the
offset voltage to the analog input pins to do a system calibration.
The offset compensation can take place in software.
Adjusting the Gain Calibration Register
The gain calibration register contains 16 bits, 2 leading 0s, and
14 data bits. The data bits are binary weighted as in the offset
calibration register. The gain register value is effectively multi-
plied by the analog input to scale the conversion result over the
full range. Increasing the gain register compensates for a
smaller analog input range and decreasing the gain register
compensates for a larger input range. The maximum analog
input range that the gain register can compensate for is 1.025
times the reference voltage, and the minimum input range is
0.975 times the reference voltage.
–15–
REV. B
AD7851
CIRCUIT INFORMATION
The AD7851 is a fast, 14-bit single-supply ADC. The part
requires an external 6/7 MHz master clock (CLKIN), two
C
REF
capacitors, a CONVST signal to start conversion, and
power supply decoupling capacitors. The part provides the user
with track-and-hold, on-chip reference, calibration features,
ADC, and serial interface logic functions on a single chip. The
ADC section of the AD7851 consists of a conventional succes-
sive approximation converter based around a capacitor DAC.
The AD7851 accepts an analog input range of 0 V to +V
DD
where the reference can be tied to V
DD
. The reference input to
the part is buffered on-chip.
A major advantage of the AD7851 is that a conversion can be
initiated in software as well as applying a signal to the CONVST
pin. Another innovative feature of the AD7851 is self-calibration
on power-up, which is initiated having a capacitor from the
CAL pin to AGND, to give superior dc accuracy (see the
Automatic Calibration on Power-On section). The part is avail-
able in a 24-lead SSOP package which offers the user consider-
able space-saving advantages over alternative solutions.
CONVERTER DETAILS
The master clock for the part must be applied to the CLKIN
pin. Conversion is initiated on the AD7851 by pulsing the
CONVST input or by writing to the control register and setting
the CONVST bit to 1. On the rising edge of CONVST (or at
the end of the control register write operation), the on-chip
track-and-hold goes from track to hold mode. The falling edge
of the CLKIN signal which follows the rising edge of the
CONVST signal initiates the conversion, provided the rising
edge of CONVST occurs at least 10 ns typically before this
CLKIN edge. The conversion cycle will take 18.5 CLKIN peri-
ods from this CLKIN falling edge. If the 10 ns setup time is not
met, the conversion will take 19.5 CLKIN periods. The maxi-
AV
DD
DV
DD
AIN(+)
AIN(–)
AMODE
C
REF1
C
REF2
SLEEP
DIN
DOUT
SYNC
SM1
SM2
CONVST
AGND
DGND
CLKIN
SCLK
REF
IN
/REF
OUT
POLARITY
AD7851
ANALOG (5V)
SUPPLY 0.01F0.1F10F
DV
DD
UNIPOLAR RANGE
0.01F
SERIAL MODE
SELECTION BITS
MASTER
CLOCK
INPUT
CONVERSION
START INPUT
FRAME SYNC OUTPUT
SERIAL DATA OUTPUT
0.1F
CAL
AUTO CAL ON
POWER-UP
INTERNAL/
EXTERNAL
REFERENCE
0V TO V
REF
INPUT
7MHz/6MHz
OSCILLATOR
SERIAL CLOCK OUTPUT
DV
DD
333kHz/285kHz PULSE
GENERATOR
OPTIONAL
EXTERNAL
REFERENCE
AD1584/REF198
0.01F
ANALOG (5V)
SUPPLY 0.1F
10F
DIN AT DGND
=> NO WRITING
TO DEVICE
0.1F470nF
CH1
CH2
CH3
CH4
OSCILLOSCOPE
2 LEADING ZEROS
FOR ADC DATA
Figure 10. Typical Circuit
mum specified conversion time is 3.25 µs (6 MHz ) and 2.8 µs
(7 MHz) for the A and K Grades, respectively, for the AD7851
(19.5 t
CLKIN,
CLKIN = 6 MHz/7 MHz). When a conversion is
completed, the BUSY output goes low, and then the result of
the conversion can be read by accessing the data through the
edge of serial interface. To obtain optimum performance from
the part, the read operation should not occur during the conver-
sion or 500 ns prior to the next CONVST rising edge. How-
ever, the maximum throughput rates are achieved by reading/
writing during conversion, and reading/writing during conver-
sion is likely to degrade the signal-to-(noise + distortion) by
only 0.5 dBs. The AD7851 can operate at throughput rates up
to 333 kHz. For the AD7851, a conversion takes 19.5 CLKIN
periods; 2 CLKIN periods are needed for the acquisition time
giving a full cycle time of 3.59 µs (= 279 kHz, CLKIN = 6 MHz)
for the K grade and 3.08 µs (= 325 kHz, CLKIN = 7 MHz) for
the A grade.
TYPICAL CONNECTION DIAGRAM
Figure 10 shows a typical connection diagram for the AD7851.
The DIN line is tied to DGND so that no data is written to the
part. The AGND and the DGND pins are connected together
at the device for good noise suppression. The CAL pin has a
0.01 µF capacitor to enable an automatic self-calibration on
power-up. The SCLK and SYNC are configured as outputs by
having SM1 and SM2 at DV
DD
. The conversion result is output
in a 16-bit word with 2 leading zeros followed by the MSB of
the 14-bit result. Note that after the AV
DD
and DV
DD
power up,
the part will require approximately 150 ms for the internal refer-
ence to settle and for the automatic calibration on power-up to
be completed.
For applications where power consumption is a major concern, the
SLEEP pin can be connected to DGND. (See the Power-Down
Options section for more detail on low power applications.)
AD7851
–16– REV. B
ANALOG INPUT
The equivalent circuit of the analog input section is shown in
Figure 11. During the acquisition interval, the switches are both
in the track position and the AIN(+) charges the 20 pF capacitor
through the 125 Ω resistance. On the rising edge of CONVST,
Switches SW1 and SW2 go into the hold position retaining
charge on the 20 pF capacitor as a sample of the signal on
AIN(+). The AIN(–) is connected to the 20 pF capacitor, and
this unbalances the voltage at Node A at the input of the com-
parator. The capacitor DAC adjusts during the remainder of the
conversion cycle to restore the voltage at Node A to the correct
value. This action transfers a charge, representing the analog input
signal, to the capacitor DAC which in turn forms a digital repre-
sentation of the analog input signal. The voltage on the AIN(–)
pin directly influences the charge transferred to the capacitor
DAC at the hold instant. If this voltage changes during the con-
version period, the DAC representation of the analog input volt-
age will be altered. Therefore, it is most important that the voltage
on the AIN(–) pin remain constant during the conversion period.
Furthermore, it is recommended that the AIN(–) pin always be
connected to AGND or to a fixed dc voltage.
CAPACITOR
DAC
COMPARATOR
HOLD
TRACK
SW2
NODE A
20pF
SW1
TRACK
HOLD
125⍀
125⍀
AIN(+)
AIN(–)
C
REF2
Figure 11. Analog Input Equivalent Circuit
Acquisition Time
The track and hold amplifier enters its tracking mode on the fall-
ing edge of the BUSY signal. The time required for the track and
hold amplifier to acquire an input signal will depend on how
quickly the 20 pF input capacitance is charged. The acquisition
time is calculated using the formula
t
ACQ
= 9 × (R
IN
+ 125 Ω) × 20 pF
where R
IN
is the source impedance of the input signal, and
125 Ω, 20 pF is the input R, C.
DC/AC Applications
For dc applications, high source impedances are acceptable,
provided there is enough acquisition time between conversions
to charge the 20 pF capacitor. The acquisition time can be cal-
culated from the above formula for different source impedances.
For example, with R
IN
= 5 kΩ, the required acquisition time will
be 922 ns.
For ac applications, removing high frequency components from
the analog input signal is recommended by use of an RC low-pass
filter on the AIN(+) pin, as shown in Figure 13. In applications
where harmonic distortion and signal-to-noise ratio are critical, the
analog input should be driven from a low impedance source. Large
source impedances will significantly affect the ac performance
of the ADC. This may necessitate the use of an input buffer
amplifier. The choice of the op amp will be a function of the
particular application.
When no amplifier is used to drive the analog input, the source
impedance should be limited to low values. The maximum
source impedance will depend on the amount of total harmonic
distortion (THD) that can be tolerated. The THD will increase
as the source impedance increases, and the performance will
degrade. Figure 12 shows a graph of the total harmonic distor-
tion versus the analog input signal frequency for different source
impedances. With the setup as in Figure 13, the THD is at the
–90 dB level. With a source impedance of 1 kΩ and no capacitor
on the AIN(+) pin, the THD increases with frequency.
THD (dB)
INPUT FREQUENCY
(
kHz
)
–50
–60
–110
–100
–80
–90
–70
1 16610 20 50 80
THD VS. FREQUENCY FOR DIFFERENT
SOURCE IMPEDANCES
R
IN
= 560⍀
R
IN
= 10⍀, 10nF
AS IN FIGURE 13
140120100
Figure 12. THD vs. Analog Input Frequency
In a single-supply application (5 V), the V+ and V– of the op amp
can be taken directly from the supplies to the AD7851 which elimi-
nates the need for extra external power supplies. When operating
with rail-to-rail inputs and outputs at frequencies greater than
10 kHz, care must be taken in selecting the particular op amp for
the application. In particular, for single-supply applications the
input amplifiers should be connected in a gain of –1 arrangement
to get the optimum performance. Figure 13 shows the arrangement
for a single-supply application with a 10 Ω and 10 nF low-pass fil-
ter (cutoff frequency 320 kHz) on the AIN(+) pin. Note that the
10 nF is a capacitor with good linearity to ensure good ac
performance. Recommended single-supply op amp is the AD820.
IC1
5V
10k⍀
10k⍀
10k⍀
V+
V–
10k⍀
10⍀
AD820
VIN
–VREF/2 TO +VREF/2
VREF/2
10F0.1F
10nF
(NPO)
TO AIN(+) OF
AD7851
Figure 13. Analog Input Buffering
–17–
REV. B
AD7851
Transfer Functions
For the unipolar range, the designed code transitions occur mid-
way between successive integer LSB values (i.e., 1/2 LSB,
3/2 LSBs, 5/2 LSBs . . . FS –3/2 LSBs). The output coding is
straight binary for the unipolar range with 1 LSB = FS/16384 =
4.096 V/16384 = 0.25 mV when V
REF
= 4.096 V. The ideal
input/output transfer characteristic for the unipolar range is
shown in Figure 16.
+FS – 1LSB
OUTPUT
CODE
0V
111...111
111...110
111...101
111...100
000...011
000...001
000...000
000...010
V
IN
= (AIN(+) – AIN(–)), INPUT VOLTAGE
1LSB
1LSB = FS
16384
Figure 16. AD7851 Unipolar Transfer Characteristic
Figure 15 shows the AD7851’s ±V
REF
/2 bipolar analog input con-
figuration (where AIN(+) cannot go below 0 V, so for the full bipo-
lar range the AIN(–) pin should be biased to +V
REF
/2). Once again
the designed code transitions occur midway between successive
integer LSB values. The output coding is twos complement with
1 LSB = 16384 = 4.096 V/16384 = 0.25 mV. The ideal input/
output transfer characteristic is shown in Figure 17.
FS = V
REF
V
1LSB = FS
16384
OUTPUT
CODE
V
REF
/2
011...111
011...110
000...001
000...000
100...001
100...000
100...010
V
IN
= (AIN(+) – AIN(–)), INPUT VOLTAGE
0V
+ FS – 1 LSB
111...111
(V
REF
/2) – 1 LSB
(V
REF
/2) + 1 LSB
Figure 17. AD7851 Bipolar Transfer Characteristic
Input Ranges
The analog input range for the AD7851 is 0 V to V
REF
in both
the unipolar and bipolar ranges.
The only difference between the unipolar range and the bipolar
range is that in the bipolar range the AIN(–) has to be biased up
to +V
REF
/2 and the output coding is twos complement (see
Table V and Figures 14 and 15). The unipolar or bipolar mode
is selected by the AMODE pin (0 for the unipolar range and 1
for the bipolar range).
Table V. Analog Input Connections
Analog Input Input Connections Connection
Range AIN(+) AIN(–) Diagram AMODE
0 V to V
REF1
V
IN
AGND Figure 8 DGND
±V
REF
/2
2
V
IN
V
REF
/2 Figure 9 DV
DD
NOTES
1
Output code format is straight binary.
2
Range is ±V
REF
/2 biased about V
REF
/2. Output code format is twos complement.
Note that the AIN(–) pin on the AD7851 can be biased up above
AGND in the unipolar mode also, if required. The advantage of
biasing the lower end of the analog input range away from
AGND is that the user does not have to have the analog input
swing all the way down to AGND. This has the advantage in
true single-supply applications that the input amplifier does not
have to swing all the way down to AGND. The upper end of the
analog input range is shifted up by the same amount. Care must
be taken so that the bias applied does not shift the upper end of
the analog input above the AV
DD
supply. In the case where the
reference is the supply, AV
DD
, the AIN(–) must be tied to
AGND in unipolar mode.
AIN(+)
AIN(–)
AMODE
AD7851
UNIPOLAR
ANALOG
INPUT RANGE
SELECTED
DOUT STRAIGHT
BINARY
FORMAT
V
IN
= 0 TO V
REF
TRACK AND HOLD
AMPLIFIER
Figure 14. 0 V to V
REF
Unipolar Input Configuration
TWOS
COMPLEMENT
FORMAT
VREF/2
DVDD
AIN(+)
AIN(–)
AMODE
AD7851
UNIPOLAR
ANALOG
INPUT RANGE
SELECTED
DOUT
VIN = 0 TO VREF
TRACK AND HOLD
AMPLIFIER
Figure 15.
±
V
REF
/2 about V
REF
/2 Bipolar Input Configuration
AD7851
–18– REV. B
REFERENCE SECTION
For specified performance, it is recommended that when using
an external reference this reference should be between 4 V and
the analog supply AV
DD
. The connections for the relevant refer-
ence pins are shown in the typical connection diagrams. If the
internal reference is being used, the REF
IN
/REF
OUT
pin should
have a 100 nF capacitor connected to AGND very close to the
REF
IN
/REF
OUT
pin. These connections are shown in Figure 18.
If the internal reference is required for use external to the ADC,
it should be buffered at the REF
IN
/REF
OUT
pin and a 100 nF
capacitor connected from this pin to AGND. The typical noise
performance for the internal reference with 5 V supplies is
150 nV/√Hz @ 1 kHz and dc noise is 100 µV p-p.
REFIN/REFOUT
AD7851
ANALOG
SUPPLY
5V
AVDD DVDD
0.01F0.1F
10F
CREF1
CREF2
0.01F
0.1F470nF
0.1F
10⍀
Figure 18. Relevant Connections When Using
Internal Reference
The other option is that the REF
IN
/REF
OUT
pin be overdriven
by connecting it to an external reference. This is possible due to
the series resistance from the REF
IN
/REF
OUT
pin to the internal
reference. This external reference can have a range that includes
AV
DD
. When using AV
DD
as the reference source, the 100 nF
capacitor from the REF
IN
/REF
OUT
pin to AGND should be as
close as possible to the REF
IN
/REF
OUT
pin, and also the C
REF1
pin should be connected to AV
DD
to keep this pin at the same
level as the reference. The connections for this arrangement are
shown in Figure 19. When using AV
DD
it may be necessary to
add a resistor in series with the AV
DD
supply. This will have the
effect of filtering the noise associated with the AV
DD
supply.
REF
IN
/REF
OUT
AD7851
ANALOG
SUPPLY
5V
AV
DD
DV
DD
0.01F0.1F
10F
C
REF1
C
REF2
0.01F
0.01F470nF
0.1F
10⍀
10⍀
Figure 19. Relevant Connections When Using AV
DD
as the Reference
AD7851 PERFORMANCE CURVES
Figure 20 shows a typical FFT plot for the AD7851 at 333 kHz
sample rate and 10 kHz input frequency.
FREQUENCY (kHz)
0
–20
–120 0 10020
SNR (dB)
40 60 80
–40
–60
–80
–100
AVDD = DVDD = 5V
f
SAMPLE = 333kHz
f
IN = 10kHz
SNR = 79.5dB
THD = –95.2
Figure 20. FFT Plot
Figure 21 shows the SNR versus frequency for a 5 V supply and
a 4.096 external reference (5 V reference is typically 1 dB better
performance).
INPUT FREQUENCY
(
kHz
)
79
75
0 16620 50 120 140
78
77
76
S(N+D) RATIO (dB)
10 80 100
Figure 21. SNR vs. Frequency
Figure 22 shows the power supply rejection ratio versus fre-
quency for the part. The power supply rejection ratio is defined
as the ratio of the power in ADC output at frequency f to the
power of a full-scale sine wave.
PSRR (dB) = 10 log (Pf/Pfs)
Pf is the power at frequency f in ADC output, Pfs is the power
of a full-scale sine wave. Here a 100 mV peak-to-peak sine wave
is coupled onto the AV
DD
supply while the digital supply is left
unaltered.
–19–
REV. B
AD7851
INPUT FREQUENCY (kHz)
–72
–74
–90
0.91 10013.4 25.7 38.3 50.3
–76
–78
–80
–88
PSRR (dB)
–82
–84
–86
63.5 74.8 87.4
AVDD = DVDD = 5.0V
100mV pk-pk SINEWAVE ON AVDD
REFIN = 4.098 EXT REFERENCE
Figure 22. PSRR vs. Frequency
POWER-DOWN OPTIONS
The AD7851 provides flexible power management to allow the
user to achieve the best power performance for a given throughput
rate. The power management options are selected by programming
the power management bits, PMGT1 and PMGT0, in the con-
trol register and by use of the SLEEP pin. Table VI summarizes
the power-down options that are available and how they can be
selected by using either software, hardware, or a combination of
both. The AD7851 can be fully or partially powered down. When
fully powered down, all the on-chip circuitry is powered down
and I
DD
is 1 µA typ. If a partial power-down is selected, then all
the on-chip circuitry except the reference is powered down and I
DD
is 400 µA typ. The choice of full or partial power-down does not
give any significant improvement in throughput with a power-down
between conversions. (This is discussed in the Power-Up Times
section which follows.) But a partial power-down does allow the
on-chip reference to be used externally even though the rest of the
AD7851 circuitry is powered down. It also allows the AD7851 to
be powered up faster after a long power-down period when using
the on-chip reference. (See the Using the Internal (On-Chip) Ref-
erence section which follows.)
When using the SLEEP pin, the power management bits
PMGT1 and PMGT0 should be set to 0 (default status on
power-up). Bringing the SLEEP pin logic high ensures normal
operation, and the part does not power down at any stage. This
may be necessary if the part is being used at high throughput
rates when it is not possible to power down between conver-
sions. If the user wishes to power down between conversions at
lower throughput rates (that is, <100 kSPS for the AD7851) to
achieve better power performances, then the SLEEP pin should
be tied logic low.
If the power-down options are to be selected in software only,
then the SLEEP pin should be tied logic high. By setting the
power management bits PMGT1 and PMGT0 as shown in
Table VI, a full power-down, full power-up, full power-down
between conversions, and a partial power-down between con-
versions can be selected.
A combination of hardware and software selection can also be
used to achieve the desired effect.
Table VI. Power Management Options
PMGT1 PMGT0 SLEEP
Bit Bit Pin Comment
000Full power-down between
conversions (HW/SW)
001Full power-up (HW/SW)
01XFull power-down between
conversions (SW)
10XFull power-down (SW)
11XPartial power-down between
conversions (SW)
SW = Software selection, HW = Hardware selection.
0V TO VREF
INPUT
DIN AT DGND
=> NO WRITING
TO DEVICE
3-WIRE MODE
SELECTED
CURRENT, I = 12mA TYP
AVDD DVDD
AIN(+)
AIN(–)
AMODE
CREF1
CREF2
SLEEP
DIN
DOUT
SYNC
SM1
SM2
CONVST
AGND
DGND
CLKIN
SCLK
REFIN/REFOUT
POLARITY
AD7851
ANALOG
(5V) 0.01F0.1F
10F
DVDD
UNIPOLAR RANGE
0.01F
SERIAL MODE
SELECTION BITS
MASTER
CLOCK
INPUT
CONVERSION
START INPUT
SERIAL DATA OUTPUT
0.1F
CAL
INTERNAL
REFERENCE
6MHz/7MHz
OSCILLATOR
SERIAL CLOCK OUTPUT
285kHz/333kHz PULSE
GENERATOR
OPTIONAL
EXTERNAL
REFERENCE
0.01F
0.1F470nF
AUTO CAL ON
POWER-UP
REF198
AUTO POWER-
DOWN AFTER
CONVERSION
LOW POWER
C/P
Figure 23. Typical Low Power Circuit
AD7851
–20– REV. B
POWER-UP TIMES
Using an External Reference
When the AD7851 is powered up, the part is powered up
from one of two conditions: first, when the power supplies
are initially powered up and; secondly, when the parts are
powered up from either a hardware or software power-down
(see previous section).
When AV
DD
and DV
DD
are powered up, the AD7851 enters a
mode whereby the CONVST signal initiates a timeout followed
by a self-calibration. The total time taken for this timeout and
calibration is approximately 35 ms (see the Automatic Calibra-
tion on Power-On section). During power-up, the functionality
of the SLEEP pin is disabled, that is, the part will not power
down until the end of the calibration if SLEEP is tied logic low.
The power-up calibration mode can be disabled if the user
writes to the control register before a CONVST signal is applied. If
the timeout and self-calibration are disabled, then the user
must take into account the time required by the AD7851 to
power up before a self-calibration is carried out. This power-up
time is the time taken for the AD7851 to power up when
power is first applied (300 µs typ), or the time it takes the exter-
nal reference to settle to the 14-bit level—whichever is longer.
The AD7851 powers up from a full hardware or software
power-down in 5 µs typ. This limits the throughput which the
part is capable of to 120 kSPS for the K Grade and 126 kSPS
for the A Grade when powering down between conversions.
Figure 24 shows how power-down between conversions is
implemented using the CONVST pin. The user first selects
the power-down between conversions option by using the
SLEEP pin and the power management bits, PMGT1 and
PMGT0, in the control register (see previous section). In this
mode, the AD7851 automatically enters a full power-down at
the end of a conversion, that is, when BUSY goes low. The
falling edge of the next CONVST pulse causes the part to
power up. Assuming the external reference is left powered up,
the AD7851 should be ready for normal operation 5 µs after
this falling edge. The rising edge of CONVST initiates a con-
version so the CONVST pulse should be at least 5 µs wide.
The part automatically powers down on completion of the
conversion. Where the software convert start is used, the part
may be powered up in software before a conversion is initiated.
5s 3.25s
tCONVERT
POWER-UP
TIME
NORMAL
OPERATION
FULL
POWER-DOWN
POWER-UP
TIME
START CONVERSION ON RISING EDGE
POWER UP ON FALLING EDGE
CONVST
BUSY
Figure 24. Using the
CONVST
Pin to Power Up for
a Conversion
Using the Internal (On-Chip) Reference
As in the case of an external reference, the AD7851 can power
up from one of two conditions: power up after the supplies are
connected or power up from a hardware/software power-down.
When using the on-chip reference and powering up when AV
DD
and DV
DD
are first connected, it is recommended that the
power-up calibration mode be disabled as explained previously.
When using the on-chip reference, the power-up time is effec-
tively the time it takes to charge up the external capacitor on the
REF
IN
/REF
OUT
pin. This time is given by the equation
t
UP
= 9 × R × C
where R ≈ 150K and C = external capacitor.
The recommended value of the external capacitor is 100 nF;
this gives a power-up time of approximately 135 ms before a
calibration is initiated and normal operation should commence.
When C
REF
is fully charged, the power-up time from a hardware or
software power-down reduces to 5 µs. This is because an internal
switch opens to provide a high impedance discharge path for the
reference capacitor during power-down—see Figure 25. An added
advantage of the low charge leakage from the reference capacitor
during power-down is that even though the reference is being pow-
ered down between conversions, the reference capacitor holds the
reference voltage to within 0.5 LSBs with throughput rates of 100
samples/second and over with a full power-down between conver-
sions. A high input impedance op amp, such as the AD707, should
be used to buffer this reference capacitor if it is being used exter-
nally. Note, if the AD7851 is left in its powered-down state for
more than 100 ms, the charge on C
REF
will start to leak away and
the power-up time will increase. If this long power-up time is a
problem, the user can use a partial power-down for the last conver-
sion so the reference remains powered up.
AD7851
REFIN/REFOUT
EXTERNAL
CAPACITOR
SWITCH OPENS
DURING POWER-DOWN
BUF
ON-CHIP
REFERENCE
TO OTHER
CIRCUITRY
Figure 25. On-Chip Reference During Power-Down
POWER VS. THROUGHPUT RATE
The main advantage of a full power-down after a conversion is
that it significantly reduces the power consumption of the part
at lower throughput rates. When using this mode of operation,
the AD7851 is only powered up for the duration of the conver-
sion. If the power-up time of the AD7851 is taken to be 5 µs
and it is assumed that the current during power up is 12 mA
typ, then power consumption as a function of throughput can
easily be calculated. The AD7851 has a conversion time of
3.25 µs with a 6 MHz external clock. This means the AD7851
consumes 12 mA typ for 8.25 µs in every conversion cycle if the
parts are powered down at the end of a conversion. The graph
in Figure 26 shows the power consumption of the AD7851 as a
function of throughput. Table VII lists the power consump-
tion for various throughput rates.
–21–
REV. B
AD7851
Table VII. Power Consumption vs. Throughput
Throughput Rate Power AD7851
1kSPS 9 mW
2 kSPS 18 mW
THROUGHPUT RATE
(
Hz
)
100
10
0.0102000200
1
400 600 800 1000 1200 1400 1600 1800
0.1
POWER (mW)
Figure 26. Power vs. Throughput AD7851
NOTE
When setting the power-down mode by writing to the part,
operating in an interface mode other than Interface Modes 4
and 5 is recommended. This way the user has more control to
initiate power-down and power-up commands.
CALIBRATION SECTION
Calibration Overview
The automatic calibration that is performed on power-up ensures
that the calibration options covered in this section will not be
required for a significant number of applications. The user will
not have to initiate a calibration unless the operating conditions
change (CLKIN frequency, analog input mode, reference voltage,
temperature, and supply voltages). The AD7851 has a number of
calibration features that may be required in some applications,
and there are a number of advantages in performing these differ-
ent types of calibration. First, the internal errors in the ADC can
be reduced significantly to give superior dc performance; and
second, system offset and gain errors can be removed. This allows
the user to remove reference errors (whether internal or external
references) and to make use of the full dynamic range of the
AD7851 by adjusting the analog input range of the part for a
specific system.
The AD7851 has two main calibration modes: self-calibration
and system calibration. There are various options in both self-
calibration and system calibration as outlined previously in
Table III. All the calibration functions can be initiated by puls-
ing the CAL pin or by writing to the control register and setting
the STCAL bit to 1. The timing diagrams that follow involve
using the CAL pin.
The duration of each of the different types of calibrations is
given in Table VIII for the AD7851 with a 6 MHz/7 MHz mas-
ter clock. These calibration times are master-clock dependent.
Table VIII. Calibration Times (AD7851 with 6 MHz CLKIN)
Type of Self- or System Calibration Time (ms)
Full 41.7
Gain + Offset 9.26
Offset 4.63
Gain 4.63
Automatic Calibration on Power-On
The CAL pin has a 0.15 µA pull-up current source connected to it
internally to allow for an automatic full self-calibration on power-
on. A full self-calibration will be initiated on power-on if a 10 nF
capacitor is connected from the CAL pin to DGND. The internal
current source connected to the CAL pin charges up the external
capacitor and the time required to charge the external capacitor
will depend on the size of the capacitor itself. This time should be
large enough to ensure that the internal reference is settled before
the calibration is performed. However, if an external reference is
being used, this reference must have stabilized before the auto-
matic calibration is initiated (a larger capacitor on the CAL pin
should be used if the external reference has not settled when the
autocalibration is initiated). Once the capacitor on the CAL pin
has charged, the calibration will be performed and will take 32 ms
(4 MHz CLKIN). Therefore, the autocalibration should be com-
plete before operating the part. After calibration, the part is accu-
rate to the 12-bit level and the specifications quoted on the data
sheet apply. There will be no need to perform another calibra-
tion unless the operating conditions change or unless a system
calibration is required.
Self-Calibration Description
There are a four different calibration options within the self-
calibration mode. There is a full self-calibration where the
DAC, internal offset, and internal gain errors are calibrated
out; there is (Gain + Offset) self-calibration which calibrates
out the internal gain error and then the internal offset errors
(the internal DAC is not calibrated here); and finally, there are
self-offset and self-gain calibrations that calibrate out the inter-
nal offset errors and the internal gain errors, respectively.
The internal capacitor DAC is calibrated by trimming each of the
capacitors in the DAC. It is the ratio of these capacitors to each
other that is critical, and so the calibration algorithm ensures
that this ratio is at a specific value by the end of the calibration
routine. For the offset and gain there are two separate capaci-
tors, one of which is trimmed when an offset or gain calibration
is performed. Again, it is the ratio of these capacitors to the
capacitors in the DAC that is critical and the calibration algo-
rithm ensures that this ratio is at a specified value for both
the offset and gain calibrations.
In bipolar mode, the midscale error is adjusted for an offset cali-
bration and the positive full-scale error is adjusted for the gain
calibration; in unipolar mode, the zero-scale error is adjusted for
an offset calibration and the positive full-scale error is adjusted
for a gain calibration.
AD7851
–22– REV. B
SYSTEM OFFSET
CALIBRATION
SYS OFFSET
VREF – 1LSB
AGND
MAX SYSTEM OFFSET
IS ±5% OF VREF
MAX SYSTEM FULL SCALE
IS ±2.5% FROM VREF
ANALOG
INPUT
RANGE
VREF – 1LSB
ANALOG
INPUT
RANGE
SYS OFFSET
AGND
MAX SYSTEM OFFSET
IS ±5% OF VREF
VREF + SYS OFFSET
Figure 28. System Offset Calibration
Figure 29 shows a system gain calibration (assuming a system
full scale greater than the reference voltage) where the analog
input range has been increased after the system gain calibration
is completed. A system full-scale voltage less than the reference
voltage may also be accounted for a by a system gain calibration.
SYSTEM GAIN
CALIBRATION
VREF – 1LSB
AGND
MAX SYSTEM FULL SCALE
IS ±2.5% FROM VREF
ANALOG
INPUT
RANGE
VREF – 1LSB
ANALOG
INPUT
RANGE
AGND
SYS FULL S.SYS FULL S.
MAX SYSTEM FULL SCALE
IS ±2.5% FROM VREF
Figure 29. System Gain Calibration
Finally in Figure 30 both the system offset and gain are accounted
for by the system offset followed by a system gain calibration.
First the analog input range is shifted upwards by the positive
system offset and then the analog input range is adjusted at the
top end to account for the system full scale.
SYSTEM OFFSET
CALIBRATION
FOLLOWED BY
SYSTEM GAIN
CALIBRATION
SYS OFFSET
VREF – 1LSB
AGND
MAX SYSTEM OFFSET
IS ±5% OF VREF
MAX SYSTEM FULL SCALE
IS ±2.5% FROM VREF
ANALOG
INPUT
RANGE
VREF – 1LSB
ANALOG
INPUT
RANGE
SYS OFFSET
AGND
MAX SYSTEM OFFSET
IS ±5% OF VREF
VREF + SYS OFFSET
SYS F.S.
MAX SYSTEM FULL SCALE
IS ±2.5% FROM VREF
SYS F.S.
Figure 30. System (Gain + Offset) Calibration
Self-Calibration Timing
Figure 27 shows the timing for a full self-calibration. Here the
BUSY line stays high for the full length of the self-calibration. A
self-calibration is initiated by bringing the CAL pin low (which
initiates an internal reset) and then high again or by writing to
the control register and setting the STCAL bit to 1 (note that if
the part is in a power-down mode, the CAL pulse width must
take account of the power-up time). The BUSY line is triggered
high from the rising edge of CAL (or the end of the write to the
control register if calibration is initiated in the software), and
BUSY will go low when the full self-calibration is complete after
a time t
CAL
.
t
1 = 100ns MIN,
t
15 = 2.5
t
CLKIN MAX,
t
CAL = 250026
t
CLKIN
CAL (I/P)
BUSY (O/P)
t1
t15
tCAL
Figure 27. Timing Diagram for Full Self-Calibration
For the self-(gain + offset), self-offset, and self-gain calibrations,
the BUSY line will be triggered high by the rising edge of the
CAL signal (or the end of the write to the control register if cali-
bration is initiated in the software) and will stay high for the full
duration of the self-calibration. The length of time that the BUSY
is high will depend on the type of self-calibration that is initiated.
Typical figures are given in Table VIII. The timing diagrams for
the other self-calibration options will be similar to Figure 27.
System Calibration Description
System calibration allows the user to take out system errors
external to the AD7851 as well as calibrate the errors of the
AD7851 itself. The maximum calibration range for the system
offset errors is ±5% of V
REF
and for the system gain errors is
±2.5% of V
REF
. This means that the maximum allowable system
offset voltage applied between the AIN(+) and AIN(–) pins for
the calibration to adjust out this error is ±0.05 × V
REF
(that is,
the AIN(+) can be 0.05 × V
REF
above AIN(–) or 0.05 × V
REF
below AIN(–)). For the system gain error, the maximum allow-
able system full-scale voltage, in unipolar mode, that can be
applied between AIN(+) and AIN(–) for the calibration to
adjust out this error is V
REF
± 0.025 × V
REF
(that is, the AIN(+)
can be V
REF
+ 0.025 × V
REF
above AIN(–) or V
REF
– 0.025 ×
V
REF
above AIN(–)). If the system offset or system gain errors
are outside the ranges mentioned, the system calibration algo-
rithm will reduce the errors as much as the trim range allows.
Figures 28, 29, and 30 illustrate why a specific type of system
calibration might be used. Figure 28 shows a system offset
calibration (assuming a positive offset) where the analog input
range has been shifted upwards by the system offset after the
system offset calibration is completed. A negative offset may
also be accounted for by a system offset calibration.
–23–
REV. B
AD7851
System Gain and Offset Interaction
The inherent architecture of the AD7851 leads to an interaction
between the system offset and gain errors when a system calibra-
tion is performed. Therefore, it is recommended to perform the
cycle of a system offset calibration followed by a system gain cali-
bration twice. Separate system offset and system gain calibrations
reduce the offset and gain errors to at least the 14-bit level. By
performing a system offset calibration first and a system gain
calibration second, priority is given to reducing the gain error to
zero before reducing the offset error to zero. If the system errors
are small, a system offset calibration would be performed, fol-
lowed by a system gain calibration. If the systems errors are
large (close to the specified limits of the calibration range), this
cycle would be repeated twice to ensure that the offset and gain
errors were reduced to at least the 14-bit level. The advantage of
doing separate system offset and system gain calibrations is that
the user has more control over when the analog inputs need to
be at the required levels, and the CONVST signal does not have
to be used.
Alternatively, a system (gain + offset) calibration can be per-
formed. It is recommended to perform three system (gain +
offset) calibrations to reduce the offset and gain errors to the
14-bit level. For the system (gain + offset) calibration priority
is given to reducing the offset error to 0 before reducing the
gain error to 0. Thus, if the system errors are small then two
system (gain + offset) calibrations will be sufficient. If the
system errors are large (close to the specified limits of the
calibration range), three system (gain + offset) calibrations
may be required to reduce the offset and gain errors to at
least the 14-bit level. There will never be any need to perform
more than three system (offset + gain) calibrations.
In bipolar mode, the midscale error is adjusted for an offset cali-
bration and the positive full-scale error is adjusted for the gain
calibration; in unipolar mode, the zero-scale error is adjusted for
an offset calibration and the positive full-scale error is adjusted
for a gain calibration.
System Calibration Timing
The calibration timing diagram in Figure 31 is for a full system
calibration where the falling edge of CAL initiates an internal
reset before starting a calibration (note that if the part is in power-
down mode the CAL pulse width must take account of the power-up
time). If a full system calibration is performed in the software, it
is easier to perform separate gain and offset calibrations so
that the CONVST bit in the control register does not have to be
programmed in the middle of the system calibration sequence.
The rising edge of CAL starts calibration of the internal DAC
and causes the BUSY line to go high. If the control register is
set for a full system calibration, the CONVST must be used
also. The full-scale system voltage should be applied to the ana-
log input pins from the start of calibration. The BUSY line will
go low once the DAC and system gain calibration are complete.
Next, the system offset voltage is applied to the AIN pin for a
minimum setup time (t
SETUP
) of 100 ns before the rising edge of
the CONVST and remains until the BUSY signal goes low. The
rising edge of the CONVST starts the system offset calibration
section of the full system calibration and also causes the BUSY
signal to go high. The BUSY signal will go low after a time t
CAL2
when the calibration sequence is complete.
The timing for a system (gain + offset) calibration is very similar
to that of Figure 31, the only difference being that the time
t
CAL1
will be replaced by a shorter time of the order of t
CAL2
as
the internal DAC will not be calibrated. The BUSY signal will
signify when the gain calibration is finished and when the part is
ready for the offset calibration.
CONVST (I/P)
AIN (I/P)
t16
tSETUP
CAL (I/P)
BUSY (O/P)
t1
t15
tCAL1 tCAL2
V
SYSTEM FULL SCALE
V
OFFSET
t1
= 100ns MIN,
t14
= 50 MAX,
t15
= 4
tCLKIN
MAX,
tCAL1
= 222228
tCLKIN
MAX,
tCAL2
= 27798
tCLKIN
Figure 31. Timing Diagram for Full System Calibration
The timing diagram for a system offset or system gain calibration is
shown in Figure 32. Here again the CAL is pulsed and the rising
edge of the CAL initiates the calibration sequence (or the calibra-
tion can be initiated in software by writing to the control register).
The rising edge of the CAL causes the BUSY line to go high and it
will stay high until the calibration sequence is finished. The analog
input should be set at the correct level for a minimum setup time
(t
SETUP
) of 100 ns before the rising edge of CAL and stay at the
correct level until the BUSY signal goes low.
AIN (I/P)
tSETUP
CAL (I/P)
BUSY (O/P)
t15
tCAL2
t1
VSYSTEM FULL SCALE OR VSYSTEM OFFSET
Figure 32. Timing Diagram for System Gain or System
Offset Calibration
AD7851
–24– REV. B
SERIAL INTERFACE SUMMARY
Table IX details the five interface modes and the serial clock
edges from which the data is clocked out by the AD7851
(DOUT edge) and that the data is latched in on (DIN edge).
The logic level of the POLARITY pin is shown and it is clear
that this reverses the edges.
In Interface Modes 4 and 5 the SYNC always clocks out the
first data bit and SCLK will clock out the subsequent bits.
In Interface Modes 1, 2, and 3 the SYNC is gated with the SCLK
and the POLARITY pin. Thus, the SYNC may clock out the
MSB of data. Subsequent bits will be clocked out by the serial
clock, SCLK. The conditions for the SYNC clocking out the
MSB of data is as follows.
With the POLARITY pin high, the falling edge of SYNC will
clock out the MSB if the serial clock is low when the SYNC
goes low.
With the POLARITY pin low, the falling edge of SYNC will
clock out the MSB if the serial clock is high when the SYNC
goes low.
Table IX. SCLK Active Edge for Different Interface Modes
Interface POLARITY DOUT DIN
Mode Pin Edge Edge
1, 2, 3 0 SCLK ↑SCLK ↓
1SCLK ↓SCLK ↑
4, 5 0 SCLK ↓SCLK ↑
1SCLK ↑SCLK ↓
Resetting the Serial Interface
When writing to the part via the DIN line there is the possibility
of writing data into the incorrect registers, such as the test regis-
ter for instance, or writing the incorrect data and corrupting the
serial interface. The SYNC pin acts as a reset. Bringing the
SYNC pin high resets the internal shift register. The first data
bit after the next SYNC falling edge will now be the first bit of
a new 16-bit transfer. It is also possible that the test register
contents were altered when the interface was lost. Therefore,
once the serial interface is reset, it may be necessary to write
the 16-bit word 0100 0000 0000 0010 to restore the test regis-
ter to its default value. Now the part and serial interface are
completely reset. It is always useful to retain the ability to pro-
gram the SYNC line from a port of the µController/DSP to have
the ability to reset the serial interface.
Table X summarizes the interface modes provided by the
AD7851. It also outlines the various µP/µC to which the par-
ticular interface is suited.
The interface mode is determined by the serial mode selection
Pins SM1 and SM2. Interface Mode 2 is the default mode.
Note that Interface Mode 1 and 2 have the same combination of
SM1 and SM2. Interface Mode 1 may only be set by program-
ming the control register (see the Control Register section).
External SCLK and SYNC signals (SYNC may be hardwired
low) are required for Interfaces Modes 1, 2, and 3. In Interface
Modes 4 and 5, the AD7851 generates the SCLK and SYNC.
Some of the more popular µProcessors, µControllers, and the
DSP machines that the AD7851 will interface to directly are
mentioned here. This does not cover all µCs, µPs, and DSPs. The
interface mode of the AD7851 that is mentioned here for a
specific µC, µP, or DSP is only a guide and in most cases another
interface mode may work just as well.
A more detailed timing description on each of the interface
modes follows.
Table X. Interface Mode Description
SM1 SM2 Processor Interface
Pin Pin Controller Mode
00 8XC51 1 (2-Wire)
8XL51 DIN Is an Input/
PIC17C42 Output Pin
00 68HC11 2 (3-Wire, SPI/QSPI)
68L11 Default Mode
01 68HC16 3 (QSPI)
PIC16C64 External Serial
ADSP-21xx Clock, SCLK, and
DSP56000 External Frame Sync,
DSP56001 SYNC Are Required
DSP56002
DSP56L002
TMS320C30
10 68HC16 4 (DSP Is Slave)
AD7851 Generates a
Noncontinuous
(16 Clocks) Serial
Clock, SCLK, and the
Frame Sync, SYNC
11 ADSP-21xx 5 (DSP Is Slave)
DSP56000 AD7851 Generates a
DSP56001 Continuous Serial
DSP56002 Clock, SCLK, and the
DSP56L002 Frame Sync, SYNC
TMS320C20
TMS320C25
TMS320C30
TMS320C5X
TMS320LC5X
–25–
REV. B
AD7851
DB15 DB0
DB0 DB15
t
3
DIN (I/O)
t
3
t
11
t
6
116 161
t
5A
t
12
DIN BECOMES AN INPUT
THREE-STATE
t
6
t
11
DIN BECOMES AN OUTPUT
t
3
= –0.4 t
SCLK
MIN (NONCONTINUOUS SCLK) ⴞ0.4 t
SCLK
MIN/MAX (CONTINUOUS SCLK),
t
6
= 45 MAX, t
7
= 30ns
MIN, t
8
= 20
MIN
POLARITY PIN
LOGIC HIGH
SYNC (I/P)
SCLK (I/P)
t
8
t
14
t
7
DATA WRITE DATA READ
Figure 33. Timing Diagram for Read/Write Operation with DIN as an Input/Output (Interface Mode 1, SM1 = SM2 = 0)
DB15 DB0DB0 DB15
DIN (I/O)
t
6
= 45 MAX, t
7
= 30ns
MIN, t
8
= 20
MIN,
t
13
= 90 MAX, t
14
= 50ns
MAX
6
116 161
t
13
t
6
DIN BECOMES AN INPUT
t
6
POLARITY PIN
LOGIC HIGH
SCLK (I/P)
t
8
t
14
t
7
DATA WRITE DATA READ
Figure 34. Timing Diagram for Read/Write Operation with DIN as an Input/Output and
SYNC
Input Tied Low
(Interface Mode 1, SM1 = SM2 = 0)
DETAILED TIMING SECTION
Mode 1 (2-Wire 8051 Interface)
The read and writing takes place on the DIN line and the conver-
sion is initiated by pulsing the CONVST pin (note that in every
write cycle the 2/3 MODE bit must be set to 1). The conversion
may be started by setting the CONVST bit in the control register
to 1 instead of using the CONVST line.
Below in Figure 33 and in Figure 34 are the timing diagrams for
Interface Mode 1 in the 2-wire interface mode. Here the DIN pin
is used for both input and output as shown. The SYNC input is
level-triggered active low and can be pulsed (Figure 33) or can be
constantly low (Figure 34).
In Figure 33, the part samples the input data on the rising edge
of SCLK. After the 16th rising edge of SCLK, the DIN is con-
figured as an output. When the SYNC is taken high, the DIN is
three-stated. Taking SYNC low disables the three-state on the
DIN pin and the first SCLK falling edge clocks out the first data
bit. Once the 16 clocks have been provided, the DIN pin will
automatically revert back to an input after a time t
14
. Note that a
continuous SCLK shown by the dotted waveform in Figure 33
can be used provided the SYNC is low for only 16 clock pulses
in each of the read and write cycles. The POLARITY pin may
be used to change the SCLK edge which the data is sampled on
and clocked out on.
In Figure 34, the SYNC line is tied low permanently, which
results in a different timing arrangement. With SYNC tied low
permanently, the DIN pin will never be three-stated. The 16th
rising edge of SCLK configures the DIN pin as an input or an
output as shown in the diagram. Here no more than 16 SCLK
pulses must occur for each of the read and write operations.
If reading from and writing to the calibration registers in this
interface mode, all the selected calibration registers must be
read from or written to. The read and write operations cannot
be aborted. When reading from the calibration registers, the
DIN pin will remain as an output for the full duration of all
the calibration register read operations. When writing to the
calibration registers, the DIN pin will remain as an input for
the full duration of all the calibration register write operations.
AD7851
–26– REV. B
Mode 2 (3-Wire SPI/QSPI Interface Mode)
Default Interface Mode
Figure 35 shows the timing diagram for Interface Mode 2 which
is the SPI/QSPI interface mode. Here the SYNC input is active
low and may be pulsed or tied permanently low. If SYNC is
permanently low, 16 clock pulses must be applied to the SCLK
pin for the part to operate correctly, and with a pulsed SYNC
input a continuous SCLK may be applied provided SYNC is
low for only 16 SCLK cycles. In Figure 35, the SYNC going
low disables the three-state on the DOUT pin. The first falling
edge of the SCLK after the SYNC going low clocks out the first
leading zero on the DOUT pin. The DOUT pin is three-stated
again a time t
12
after the SYNC goes high. With the DIN pin,
the data input has to be set up a time t
7
before the SCLK rising
edge as the part samples the input data on the SCLK rising edge
in this case. The POLARITY pin may be used to change the
SCLK edge which the data is sampled on and clocked out on. If
resetting the interface is required, the SYNC must be taken high
and then low.
DB0DB10 THREE-STATE
THREE-STATE DB12
DB13DB14DB15 DB11
DB12 DB0DB10DB11DB13DB14DB15
t3 = –0.4 tCLKIN MIN (NONCONTINUOUS SCLK) ±0.4 tSCLK MIN/MAX (CONTINUOUS SCLK),
t6 = 45ns MAX, t7 = 30ns MIN, t8 = 20ns MIN, t11 = 30ns MIN (NONCONTINUOUS SCLK),
30/0.4 tSCLK = ns MIN/MAX (CONTINUOUS SCLK)
POLARITY PIN
LOGIC HIGH
SYNC (I/P)
162345 16
SCLK (I/P)
t9
t5
t11
t3
t10 t12
DOUT (O/P)
t8
DIN (I/P)
t6
t7t8
t6
Figure 35. SPI/QSPI Mode 2 Timing Diagram for Read/Write Operation with DIN Input, DOUT Output, and
SYNC
Input
(SM1 = SM2 = 0)
t3 = –0.4 tCLKIN MIN (NONCONTINUOUS SCLK) ±0.4 tSCLK MIN/MAX (CONTINUOUS SCLK),
t6 = 45ns MAX, t7 = 30ns MIN, t8 = 20ns MIN, t11 = 30ns MIN
DB0DB10 THREE-STATE
THREE-STATE DB12DB13DB14DB15 DB11
DB12 DB0DB10DB11DB13DB14DB15
POLARITY PIN
LOGIC HIGH
SYNC (I/P)
162345 16
SCLK (I/P)
t9
t5
t11
t3
t10 t12
DOUT (O/P)
t8
DIN (I/P)
t6
t7t8
t6
Figure 36. QSPI Mode 3 Timing Diagram for Read/Write Operation with
SYNC
Input Edge Triggered (SM1 = 0, SM2 = 1)
Mode 3 (QSPI Interface Mode)
Figure 36 shows the timing diagram for Interface Mode 3. In
this mode, the DSP is the master and the part is the slave. Here
the SYNC input is edge triggered from high to low, and the 16
clock pulses are counted from this edge. Because the clock
pulses are counted internally, the SYNC signal does not have to
go high after the 16th SCLK rising edge as shown by the dotted
SYNC line. Thus a frame sync that gives a high pulse of one
SCLK cycle minimum duration at the beginning of the read/
write operation may be used. The rising edge of SYNC enables
the three-state on the DOUT pin. The falling edge of SYNC
disables the three-state on the DOUT pin, and data is clocked
out on the falling edge of SCLK. Once SYNC goes high, the
three-state on the DOUT pin is enabled. The data input is
sampled on the rising edge of SCLK and thus has to be valid a
time t
7
before this rising edge. The POLARITY pin may be
used to change the SCLK edge which the data is sampled on
and clocked out on. If resetting the interface is required, the
SYNC must be taken high and then low.
–27–
REV. B
AD7851
MODE 4 and 5 (Self-Clocking Modes)
The timing diagrams in Figure 38 and Figure 39 are for Inter-
face Modes 4 and 5. Interface Mode 4 has a noncontinuous
SCLK output and Interface Mode 5 has a continuous SCLK
output (SCLK is switched off internally during calibration for
both Modes 4 and 5). These modes of operation are especially
different from all the other modes because the SCLK and
SYNC are outputs. The SYNC is generated by the part as is the
SCLK. The master clock at the CLKIN pin is routed directly to
the SCLK pin for Interface Mode 5 (continuous SCLK) and the
CLKIN signal is gated with the SYNC to give the SCLK (non-
continuous) for Interface Mode 4.
The most important point about these two modes of operation
is that the result of the current conversion is clocked out during
the same conversion and a write to the part during this conver-
sion is for the next conversion. The arrangement is shown in
Figure 37. Figure 38 and Figure 39 show more detailed timing
for the arrangement of Figure 37.
WRITE N+1
READ N
3.25s
WRITE N+2
READ N+1
WRITE N+3
READ N+2
THE CONVERSION RESULT DUE TO
WRITE N+1 IS READ HERE
3.25s3.25s
CONVERSION N CONVERSION N+1 CONVERSION N+2
Figure 37.
In Figure 38 the first point to note is that the BUSY, SYNC,
and SCLK are all outputs from the AD7851 with the CONVST
being the only input signal. Conversion is initiated with the
CONVST signal going low. This CONVST falling edge also
triggers the BUSY to go high. The CONVST signal rising edge
triggers the SYNC to go low after a short delay (2.5 t
CLKIN
to
3.5 t
CLKIN
typically) after which the SCLK will clock out the
data on the DOUT pin during conversion. The data on the DIN
pin is also clocked in to the AD7851 by the same SCLK for the
next conversion. The read/write operations must be complete
after 16 clock cycles (which takes 3.25 µs approximately from
the rising edge of CONVST assuming a 6 MHz CLKIN). At
this time, the conversion will be complete, the SYNC will go
high, and the BUSY will go low. The next falling edge of the
CONVST must occur at least 330 ns after the falling edge of
BUSY to allow the track-and-hold amplifier adequate acquisi-
tion time as shown in Figure 38. This gives a throughput time of
3.68 µs. The maximum throughput rate in this case is 272 kHz.
t1
CONVST
(I/P)
SCLK
(O/P)
CONVERSION ENDS
3.25
s LATER
SERIAL READ
AND WRITE
OPERATIONS
OUTPUT SERIAL SHIFT
REGISTER IS RESET
READ OPERATION
SHOULD END 500ns
PRIOR TO NEXT RISING
400ns MIN
BUSY
(O/P)
SYNC
(O/P)
CONVERSION IS INITIATED
AND TRACK-AND-HOLD
GOES INTO HOLD
EDGE OF CONVST
t1
= 100ns MIN
tCONVERT
= 3.25s
Figure 38. Mode 4 and 5 Timing Diagram (SM1 = 1,
SM2 = 1 and 0)
In these interface modes, the part is now the master and the
DSP is the slave. Figure 39 is an expansion of Figure 38. The
AD7851 will ensure SYNC goes low after the rising edge C of
the continuous SCLK (Interface Mode 5) in Figure 39. Only in
the case of a noncontinuous SCLK (Interface Mode 4) will the
time t
4
apply. The first data bit is clocked out from the falling
edge of SYNC. The SCLK rising edge clocks out all subsequent
bits on the DOUT pin. The input data present on the DIN pin
is clocked in on the rising edge of the SCLK. The POLARITY
pin may be used to change the SCLK edge which the data is
sampled on and clocked out on. The SYNC will go high after
the 16th SCLK rising edge and before the falling edge D of the
continuous SCLK in Figure 39. This ensures the part will not
clock in an extra bit from the DIN pin or clock out an extra bit
on the DOUT pin.
DB12 DB0DB10DB11DB13DB14DB15
DB0DB10DB12DB13DB14DB15 DB11 THREE-STATE
THREE-STATE
POLARITY PIN
LOGIC HIGH
SYNC (O/P)
162345 16
SCLK (O/P)
t9
t5
t11A
t4
t10 t12
DOUT (O/P)
t8
DIN (I/P)
t4 = 0.6 tSCLK (NONCONTINUOUS SCLK), t6 = 45ns MAX,
t7 = 30ns MIN, t8 = 20ns MIN , t11A = 50ns MAX
t6
t7t8
D
C
Figure 39. Mode 4 and 5 Timing Diagram for Read/Write with
SYNC
Output and SCLK Output (Continuous and
Noncontinuous, SM1 = 1, SM2 = 1 and 0)
AD7851
–28– REV. B
If the user has control of the CONVST pin but does not want to
exercise it for every conversion, the control register may be used
to start a conversion. Setting the CONVST bit in the control
register to 1 starts a conversion. If the user does not have con-
trol of the CONVST pin, a conversion should not be initiated
by writing to the control register. The reason for this is that the
user may get locked out and not be able to perform any further
write/read operations. When a conversion is started by writing to
the control register, the SYNC goes low and read/write opera-
tions take place while the conversion is in progress. However,
once the conversion is complete, there is no way of writing to
the part unless the CONVST pin is exercised. The CONVST
signal triggers the SYNC signal low which allows read/write
operations to take place. SYNC must be low to perform read/
write operations. The SYNC is triggered low by the CONVST
signal rising edge or by setting the CONVST bit in the control
register to 1. Therefore, if there is not full control of the
CONVST pin, the user may become locked out.
SERIAL
INTERFACE
MODE
?
POWER ON, APPLY CLKIN SIGNAL,
WAIT FOR AUTOMATIC CALIBRATION
DIN CONNECTED TO DGND
NO
YES
START
WAIT FOR BUSY SIGNAL
TO GO LOW
PULSE CONVST PIN
READ
DATA
DURING
CONVERSION
?
WAIT APPROXIMATELY 200ns
AFTER CONVST RISING EDGE
APPLY SYNC (IF REQUIRED), SCLK, AND READ
CONVERSION RESULT ON DOUT PIN
PULSE CONVST PIN
SYNC AUTOMATICALLY GOES LOW
AFTER CONVST RISING EDGE
SCLK AUTOMATICALLY ACTIVE, READ
CONVERSION RESULT ON DOUT PIN
4, 5
2, 3
Figure 40. Flowchart for Setting Up and Reading from the AD7851
CONFIGURING THE AD7851
AD7851 as a Read-Only ADC
The AD7851 contains 14 on-chip registers that can be accessed
via the serial interface. In the majority of applications, it will not
be necessary to access all of these registers. Figure 40 outlines the
sequence used to configure the AD7851 as a read-only ADC. In
this case, there is no writing to the on-chip registers and only the
conversion result data is read from the part. Interface Mode 1
cannot be used in this case as it is necessary to write to the con-
trol register to set Interface Mode 1. Here the CLKIN signal is
applied directly after power-on; the CLKIN signal must be
present to allow the part to perform a calibration. This automatic
calibration will be completed approximately 42 ms after the
AD7851 has powered up (6 MHz CLK).
–29–
REV. B
AD7851
SERIAL
INTERFACE
MODE
?
NO
YES
TRANSFER
DATA
DURING
CONVERSION
?
APPLY SYNC (IF REQUIRED), SCLK, READ
CURRENT CONVERSION RESULT ON DOUT PIN,
AND WRITE ALL 0s ON DIN PIN
WAIT FOR BUSY SIGNAL TO GO LOW
OR WAIT FOR BUSY BIT = 0
APPLY SYNC (IF REQUIRED), SCLK, WRITE TO CONTROL
REGISTER SETTING CONVST BIT TO 1, READ CURRENT
CONVERSION RESULT ON DOUT PIN
2, 3
INITIATE
CONVERSION
IN
SOFTWARE
?
WAIT APPROXIMATELY 200ns
AFTER CONVST RISING EDGE
APPLY SYNC (IF REQUIRED),
SCLK, READ PREVIOUS CONVERSION
RESULT ON DOUT PIN,
AND WRITE ALL 0s ON DIN PIN
NO
YES
TRANSFER
DATA DURING
CONVERSION
APPLY SYNC (IF REQUIRED), SCLK, WRITE TO CONTROL
REGISTER SETTING CONVST BIT TO 1, READ PREVIOUS
CONVERSION RESULT ON DOUT PIN (SEE NOTE)
YES
NO
NOTE: WHEN USING THE SOFTWARE CONVERSION START AND
TRANSFERRING DATA DURING CONVERSION, THE USER MUST ENSURE
THE CONTROL REGISTER WRITE OPERATION EXTENDS BEYOND THE
FALLING EDGE OF BUSY. THE FALLING EDGE OF BUSY RESETS THE
CONVST BIT TO 0 AND ONLY AFTER THIS TIME CAN IT BE REPROGRAMMED
TO 1 TO START THE NEXT CONVERSION.
START
POWER ON, APPLY CLKIN SIGNAL,
WAIT FOR AUTOMATIC CALIBRATION
PULSE CONVST PIN
WAIT FOR BUSY SIGNAL TO GO
LOW OR WAIT FOR BUSY BIT = 0
Figure 41. Flowchart for Setting Up, Reading, and Writing in Interface Modes 2 and 3
Writing to the AD7851
For accessing the on-chip registers, it is necessary to write to the
part. To enable Serial Interface Mode 1, the user must also write
to the part. Figures 41, 42, and 43 shows how to configure the
AD7851 for each of the different serial interface modes. The
continuous loops on all diagrams indicate the sequence for more
than one conversion. The options of using a hardware (pulsing
the CONVST pin) or software (setting the CONVST bit to 1)
conversion start, and reading/writing during or after conversion
are shown in Figures 41 and 42. If the CONVST pin is never
used, then it should be tied to DV
DD
permanently. Where refer-
ence is made to the BUSY bit equal to a Logic 0, to indicate the
end of conversion, the user in this case would poll the BUSY bit
in the status register.
Interface Modes 2 and 3 Configuration
Figure 41 shows the flowchart for configuring the part in Inter-
face Modes 2 and 3. For these interface modes, the read and
write operations take place simultaneously via the serial port.
Writing all 0s ensures that no valid data is written to any of the
registers. When using the software conversion start and transfer-
ring data during conversion, the Figure 41 note must be obeyed.
AD7851
–30– REV. B
Interface Mode 1 Configuration
Figure 42 shows the flowchart for configuring the part in Inter-
face Mode 1. This mode of operation can only be enabled by
writing to the control register and setting the 2/3 MODE bit.
Reading and writing cannot take place simultaneously in this
mode as the DIN pin is used for both reading and writing.
SERIAL
INTERFACE
MODE
?
POWER ON, APPLY CLKIN SIGNAL,
WAIT FOR AUTOMATIC CALIBRATION
NO
YES
WAIT FOR BUSY SIGNAL TO GO
LOW OR WAIT FOR BUSY BIT = 0
READ
DATA
DURING
CONVERSION
?
APPLY SYNC (IF REQUIRED), SCLK, READ
CURRENT CONVERSION RESULT ON DIN PIN
1
INITIATE
CONVERSION
IN
SOFTWARE
?
WAIT APPROXIMATLY 200ns
AFTER CONVST RISING EDGE
OR AFTER END OF CONTROL
REGISTER WRITE
APPLY SYNC (IF REQUIRED),
SCLK, READ PREVIOUS CONVERSION
RESULT ON DIN PIN
NO
YES
APPLY SYNC (IF REQUIRED),
SCLK, WRITE TO CONTROL REGISTER
SETTING THE 2-WIRE MODE
AND CONVST BIT TO 1
START
APPLY SYNC (IF REQUIRED),
SCLK, WRITE TO CONTROL REGISTER
SETTING THE 2-WIRE MODE
PULSE CONVST PIN
Figure 42. Flowchart for Setting Up, Reading, and Writing
in Interface Mode 1
Interface Modes 4 and 5 Configuration
Figure 43 shows the flowchart for configuring the AD7851 in
Interface Modes 4 and 5, the self-clocking modes. In this case, it
is not recommended to use the software conversion start option.
The read and write operations always occur simultaneously and
during conversion.
POWER ON, APPLY CLKIN SIGNAL,
WAIT FOR AUTOMATIC CALIBRATION
SYNC AUTOMATICALLY GOES
LOW AFTER CONVST RISING EDGE
PULSE CONVST PIN
SCLK AUTOMATICALLY ACTIVE, READ CURRENT
CONVERSION RESULT ON DOUT PIN, WRITE
TO CONTROL REGISTER ON DIN PIN
4, 5
START
SERIAL
INTERFACE
MODE
?
Figure 43. Flowchart for Setting Up, Reading, and Writing
in Interface Modes 4 and 5
–31–
REV. B
AD7851
(8XC51/L51)
/PIC17C42
P3.0/DT
P3.1/CK
AD7851
CONVST
CLKIN
SCLK
DIN
SYNC
SM1
SM2
POLARITY
OPTIONAL
7MHz/6MHz
BUSY
(INT0/P3.2)/INT
DGND FOR 8XC51/L51
DVDD FOR PIC17C42
MASTER
SLAVE
OPTIONAL
Figure 45. 8XC51/PIC17C42 Interface
AD7851 to 68HC11/16/L11/PIC16C42 Interface
Figure 46 shows the AD7851 SPI/QSPI interface to the
68HC11/16/L11/PIC16C42. The SYNC line is not used and is
tied to DGND. The µController is configured as the master by
setting the MSTR bit in the SPCR to 1, and thus provides the
serial clock on the SCK pin. For all the µControllers, the CPOL
bit is set to 1, and for the 68HC11/16/L11, the CPHA bit is set
to 1. The CLKIN and CONVST signals can be supplied from
the µController or from separate sources. The BUSY signal can
be used as an interrupt to tell the µController when the conver-
sion is finished, then the reading and writing can take place. If
required, the reading and writing can take place during conver-
sion and there will be no need for the BUSY signal in this case.
For no writing to the part then the DIN pin can be tied perma-
nently low. For the 68HC16 and the QSPI interface, the SM2
pin should be tied high and the SS line tied to the SYNC pin.
The microsequencer on the 68HC16 QSPI port can be used for
performing a number of read and write operations independent
of the CPU and storing the conversion results in memory with-
out taxing the CPU. The typical sequence of events would be
writing to the control register via the DIN line setting a conversion
start and at the same time reading data from the previous conver-
sion on the DOUT line, wait for the conversion to be finished
(3.25 µs with 6 MHz CLKIN), and then repeat the sequence. The
maximum serial frequency will be determined by the data access
and hold times of the µControllers and the AD7851.
68HC11/16/
L11/PIC16C42
SCK
SS
AD7851
CONVST
CLKIN
SCLK
DOUT
BUSY
SM1
SM2
POLARITY
OPTIONAL
7MHz/6MHz
SYNC
MISO
DIN AT DGND FOR
NO WRITING TO PART
MASTER
SLAVE
DIN
DV
DD
OPTIONAL
IRQ
MOSI
DV
DD
FOR HC11, SPI
DGND FOR HC16, QSPI
DV
DD
SPI HC16, QSPI
Figure 46. 68HC11 and 68HC16 Interface
MICROPROCESSOR INTERFACING
In many applications, the user may not require the facility of
writing to the on-chip registers. The user may just want to
hardwire the relevant pins to the appropriate levels and read
the conversion result. In this case, the DIN pin can be tied low
so that the on-chip registers are never used. Now the part will
operate as a nonprogrammable analog-to-digital converter where
the CONVST is applied, a conversion is performed, and the result
may be read using the SCLK to clock out the data from the output
register on to the DOUT pin. Note that the DIN pin cannot be
tied low when using the 2-wire interface mode of operation.
The SCLK can also be connected to the CLKIN pin if the user
does not want to have to provide separate serial and master
clocks in Interface Modes 1, 2, and 3. With this arrangement,
the SYNC signal must be low for 16 SCLK cycles in Interface
Modes 1 and 2 for the read and write operations. For Interface
Mode 3, the SYNC can be low for more than 16 SCLK cycles
for the read and write operations. Note that in Interface Modes 4
and 5 the CLKIN and SCLK cannot be tied together as the
SCLK is an output and the CLKIN is an input.
DIN
DOUT
SYNC
CONVST
CLKIN
SCLK
AD7851
7 MHz/6MHz
MASTER
CLOCK
SYNC SIGNAL
TO GATE
THE SCLK
SERIAL DATA
OUTPUT
CONVERSION
START
Figure 44. Simplified Interface Diagram with DIN
Grounded and SCLK Tied to CLKIN
AD7851 to 8XC51/PIC17C42 Interface
Figure 45 shows the AD7851 interface to the 8XC51/PIC17C42,
which only runs at 5 V. The 8XC51 is in Mode 0 operation.
This is a 2-wire interface consisting of the SCLK and the DIN
which acts as a bidirectional line. The SYNC is tied low. The
BUSY line can be used to give an interrupt driven system but
this would not normally be the case with the 8XC51/PIC17C42.
For the 8XC51, 12 MHz version, the serial clock will run at a
maximum of 1 MHz so that the serial interface to the AD7851
will only be running at 1 MHz. The CLKIN signal must be pro-
vided separately to the AD7851 from a port line on the 8XC51
or from a source other than the 8XC51. Here the SCLK cannot
be tied to the CLKIN as the 8XC51 only provides a noncon-
tinuous serial clock. The CONVST signal can be provided from
an external timer or conversion can be started in software if
required. The sequence of events would typically be writing to
the control register via the DIN line setting a conversion start
and the 2-wire interface mode (this would be performed in two
8-bit writes), wait for the conversion to be finished (3.25 µs with
6MHz CLKIN), read the conversion result data on the DIN line
(this would be performed in two 8-bit reads), and then repeat the
sequence. The maximum serial frequency will be determined by
the data access and hold times of the 8XC51/PIC17C42 and the
AD7851.
AD7851
–32– REV. B
AD7851 to ADSP-21xx Interface
Figure 47 shows the AD7851 interface to the ADSP-21xx. The
ADSP-21xx is the slave and the AD7851 is the master. The
AD7851 is in Interface Mode 5. For the ADSP-21xx, the bits in
the serial port control register should be set up as TFSR = RFSR
= 1 (need a frame sync for every transfer), SLEN = 15 (16-bit
word length), TFSW = RFSW = 1 (alternate framing mode for
transmit and receive operations), INVRFS = INVTFS = 1 (active
low RFS and TFS), IRFS = ITFS = 0 (external RFS and TFS),
and ISCLK = 0 (external serial clock). The CLKIN and
CONVST signals could be supplied from the ADSP-21xx or
from an external source. The AD7851 supplies the SCLK and
the SYNC signals to the ADSP-21xx and the reading and writing
takes place during conversion. The BUSY signal only indicates
when the conversion is finished and may not be required. The
data access and hold times of the ADSP-21xx and the AD7851
allow for a CLKIN of 7 MHz/6 MHz with a 5 V supply.
AD7851
CONVST
CLKIN
SCLK
DOUT
BUSY
SM1
SM2
POLARITY
OPTIONAL
7MHz/6MHz
SYNC
RFS
DIN AT DGND FOR
NO WRITING TO PART
SLAVE
MASTER
OPTIONAL
DIN
DV
DD
OPTIONAL
IRQ
DT
TFS
ADSP-21xx
DR
SCK
Figure 47. ADSP-21xx Interface
AD7851 to DSP56000/1/2/L002 Interface
Figure 48 shows the AD7851 to DSP56000/1/2/L002 interface.
Here the DSP5600x is the master and the AD7851 is the slave.
The AD7851 is in Interface Mode 3. The setting of the bits in
the registers of the DSP5600x would be for synchronous opera-
tion (SYN = 1), internal frame sync (SCD2 = 1), internal clock
(SCKD = 1), 16-bit word length (WL1 = 1, WL0 = 0), frames
sync only active at beginning of the transfer (FSL1 = 0, FSL0 =
1). A gated clock can be used (GCK = 1) or if the SCLK is to
be tied to the CLKIN of the AD7851, then there must be a con-
tinuous clock (GCK = 0). Again the data access and hold times
of the DSP5600x and the AD7851 should allow for an SCLK of
7MHz/6 MHz.
AD7851
CONVST
CLKIN
SCLK
DOUT
BUSY
SM1
SM2
POLARITY
OPTIONAL
7MHz/6MHz
SYNC
DIN AT DGND FOR
NO WRITING TO PART
SLAVE
OPTIONAL
DIN
DV
DD
OPTIONAL
DSP
56000/1/2/L002
SRD
SCK
SC2
MASTER
STD
IRQ
Figure 48. DSP56000/1/2/L002 Interface
AD7851 to TMS320C20/25/5x/LC5x Interface
Figure 49 shows the AD7851 to the TMS320Cxx interface. The
AD7851 is the master and operates in Interface Mode 5. For the
TMS320Cxx, the CLKX, CLKR, FSX, and FSR pins should all
be configured as inputs. The CLKX and the CLKR should be
connected together as should the FSX and FSR. Because the
AD7851 is the master and the reading and writing occurs during
the conversion, the BUSY only indicates when the conversion is
finished and thus may not be required. Again the data access and
hold times of the TMS320Cxx and the AD7851 allow for a
CLKIN of 7 MHz/6 MHz.
AD7851
CONVST
CLKIN
SCLK
DOUT
BUSY
SM1
SM2
POLARITY
OPTIONAL
7MHz/6MHz
SYNC
DIN AT DGND FOR
NO WRITING TO PART
SLAVE MASTER
OPTIONAL
DIN
DVDD
OPTIONAL
DT
FSX
INT0
TMS320C20/
25/5x/LC5x
DR
CLKR
FSR
CLKX
Figure 49. TMS320C20/25/5x Interface
–33–
REV. B
AD7851
Evaluating the AD7851 Performance
The recommended layout for the AD7851 is outlined in the
evaluation board for the AD7851. The evaluation board package
includes a fully assembled and tested evaluation board, documen-
tation, and software for controlling the board from the PC via the
EVAL-CONTROL BOARD. The EVAL-CONTROL BOARD
can be used in conjunction with the AD7851 Evaluation Board,
as well as many other Analog Devices evaluation boards ending in
the CB designator, to demonstrate/evaluate the ac and dc perfor-
mance of the AD7851.
The software allows the user to perform ac (Fast Fourier Trans-
form) and dc (histogram of codes) tests on the AD7851. It also
gives full access to all the AD7851 on-chip registers allowing for
various calibration and power-down options to be programmed.
AD785x Family
All parts are 12 bit, 200 kSPS, 3.0 V to 5.5 V, except the
AD7856 which is 14 bit, 285 kSPS, 5 V supply.
AD7853 – Single-Channel Serial
AD7854 – Single-Channel Parallel
AD7856 – Eight-Channel Serial
AD7858 – Eight-Channel Serial
AD7859 – Eight-Channel Parallel
APPLICATION HINTS
Grounding and Layout
The analog and digital supplies to the AD7851 are independent
and separately pinned out to minimize coupling between the
analog and digital sections of the device. The part has very good
immunity to noise on the power supplies as can be seen by the
PSRR versus frequency graph. However, care should still be
taken with regard to grounding and layout.
The printed circuit board that houses the AD7851 should be
designed such that the analog and digital sections are separated
and confined to certain areas of the board. This facilitates the
use of ground planes that can be separated easily. A minimum
etch technique is generally best for ground planes as it gives the
best shielding. Digital and analog ground planes should only be
joined in one place. If the AD7851 is the only device requiring
an AGND to DGND connection, then the ground planes should
be connected at the AGND and DGND pins of the AD7851. If
the AD7851 is in a system where multiple devices require AGND
to DGND connections, the connection should still be made at
one point only, a star ground point which should be established as
close as possible to the AD7851.
Avoid running digital lines under the device as these will couple
noise onto the die. The analog ground plane should be allowed
to run under the AD7851 to avoid noise coupling. The power
supply lines to the AD7851 should use as large a trace as pos-
sible to provide low impedance paths and reduce the effects of
glitches on the power supply line. Fast switching signals like
clocks should be shielded with digital ground to avoid radiating
noise to other sections of the board and clock signals should
never be run near the analog inputs. Avoid crossover of digital
and analog signals. Traces on opposite sides of the board should
run at right angles to each other. This will reduce the effects of
feedthrough through the board. A microstrip technique is by far
the best but is not always possible with a double-sided board. In
this technique, the component side of the board is dedicated to
ground planes while signals are placed on the solder side.
Good decoupling is also important. All analog supplies should
be decoupled with 10 µF tantalum in parallel with 0.1 µF ca-
pacitors to AGND. All digital supplies should have a 0.1 µF disc
ceramic capacitor to DGND. To achieve the best from these de-
coupling components, they must be placed as close as possible
to the device, ideally right up against the device. In systems
where a common supply voltage is used to drive both the AV
DD
and DV
DD
of the AD7851, it is recommended that the system’s
AV
DD
supply is used. In this case, there should be a 10 Ω resistor
between the AV
DD
pin and DV
DD
pin. This supply should have the
recommended analog supply decoupling capacitors between the
AV
DD
pin of the AD7851 and AGND and the recommended
digital supply decoupling capacitor between the DV
DD
pin of the
AD7851 and DGND.
AD7851
–34– REV. B
OUTLINE DIMENSIONS
24-Lead Plastic Dual In-Line Package [PDIP]
(N-24)
Dimensions shown in inches and (millimeters)
24
112
13
1.185 (30.01)
1.165 (29.59)
1.145 (29.08)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
SEATING
PLANE
0.015 (0.38) MIN
0.180
(4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79) 0.100
(2.54)
BSC
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095AG
24-Lead Standard Small Outline Package [SOIC]
Wide Body
(R-24)
Dimensions shown in millimeters and (inches)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AD
8ⴗ
0ⴗ
0.75 (0.0295)
0.25 (0.0098) ⴛ 45ⴗ
1.27 (0.0500)
0.40 (0.0157)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
1.27 (0.0500)
BSC
24 13
12
1
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
15.60 (0.6142)
15.20 (0.5984)
COPLANARITY
0.10
0.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
–35–
REV. B
AD7851
24-Lead Shrink Small Outline Package [SSOP]
(RS-24)
Dimensions shown in millimeters
24 13
12
1
8.20
7.80
7.40
5.60
5.30
5.00
0.38
0.22 SEATING
PLANE
0.05 MIN 0.65
BSC
2.00 MAX
1.85
1.75
1.65
0.95
0.75
0.55
0.25
0.09
8ⴗ
4ⴗ
0ⴗ
0.10
COPLANARITY
8.50
8.20
7.90
COMPLIANT TO JEDEC STANDARDS MO-150AG
C01332–0–3/04(B)
–36–
Revision History
Location Page
3/04—Data Sheet changed from REV. A to REV. B.
Moved Page Index from Page 33 to Page 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Updated ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Updated TERMINOLOGY section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Updated PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Updated Table II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Updated CONTROL REGISTER section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Updated Status Register Bit Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Updated CIRCUIT INFORMATION section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Updated Figure 10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Updated TYPICAL CONNECTION DIAGRAM section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Updated Figure 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Updated Figure 18 and Figure 19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Updated Figure 23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Updated Automatic Calibration on Power-On section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Updated Mode 4 and 5 section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Updated AD7851 as a Read-Only ADC section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Updated Figure 40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Updated Figure 41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Updated Figures 42 and 43 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Updated Figure 45 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
AD7851
REV. B
