VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology VSMY2943RG VSMY2943G FEATURES * Package type: surface-mount * Package form: GW, RGW * Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.55 * Peak wavelength: p = 940 nm * High reliability * High radiant power * Very high radiant intensity * Angle of half intensity: = 28 DESCRIPTION SurfLightTM As part of the portfolio, the VSMY2943 series are infrared, 940 nm emitting diodes based on GaAlAs surface emitter chip technology with extreme high radiant intensities, high optical power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). * Suitable for high pulse current operation * Terminal configurations: gullwing or reverse gullwing * Package matches with detector VEMD2503X01 series * Floor life: 4 weeks, MSL 2a, according to J-STD-020 * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS * Miniature light barrier * Photointerrupters * Optical switch * Emitter source for proximity sensors * IR illumination PRODUCT SUMMARY COMPONENT Ie (mW/sr) (deg) p (nm) VSMY2943RG 50 28 940 10 VSMY2943G 50 28 940 10 tr (ns) Note * Test conditions see table "Basic Characteristics" ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY2943RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing VSMY2943G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing Note * MOQ: minimum order quantity Rev. 1.1, 08-Dec-17 Document Number: 84252 1 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage IF 100 mA Peak forward current Forward current tp/T = 0.5, tp = 100 s IFM 180 mA Surge forward current tp = 100 s IFSM 1 A PV 180 mW Power dissipation Junction temperature Operating temperature range Tj 100 C Tamb -40 to +85 C Storage temperature range Soldering temperature Thermal resistance junction-to-ambient Tstg -40 to +100 C According to Fig. 7, J-STD-020 Tsd 260 C J-STD-051, soldered on PCB RthJA 250 K/W 100 180 160 IF - Forward Current (mA) PV - Power Dissipation (mW) 200 RthJA = 250 K/W 140 120 100 80 60 40 80 RthJA = 250 K/W 60 40 20 20 0 0 0 20 40 60 80 0 100 20 40 60 80 100 Tamb - Ambient Temperature (C) Tamb - Ambient Temperature (C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT IF = 100 mA, tp = 20 ms VF - 1.4 1.8 V IF = 1 A, tp = 100 s VF - 2.5 - V IF = 100 mA TKVF - -0.7 - mV/K Reverse current Junction capacitance Radiant intensity Radiant power Temperature coefficient of radiant power IR VR = 0 V, f = 1 MHz, E = 0 mW/cm2 IF = 100 mA, tp = 20 ms Not designed for reverse operation A CJ - 55 - pF Ie 27 50 75 mW/sr IF = 1 A, tp = 100 s Ie - 350 - mW/sr IF = 100 mA, tp = 20 ms e - 55 - mW IF = 100 mA TKe - -0.2 - %/K - 28 - deg nm Angle of half intensity Peak wavelength IF = 100 mA p 920 940 960 Spectral bandwidth IF = 30 mA - 50 - nm Temperature coefficient of p IF = 30 mA TKp - 0.25 - nm/K Rise time IF = 100 mA, 20 % to 80 % tr - 10 - ns Fall time IF = 100 mA, 20 % to 80 % tf - 10 - ns Rev. 1.1, 08-Dec-17 Document Number: 84252 2 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 C, unless otherwise specified) Ie, rel - Relative Radiant Intensity 1000 100 10 100% IF = 100 mA 80% 60% 40% 20% 1 0% 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 800 850 900 1000 1050 - Wavelength (nm) VF - Forward Voltage (V) Fig. 3 - Forward Current vs. Forward Voltage Fig. 5 - Relative Radiant Power vs. Wavelength 0 10 10 20 30 tp = 100 s Ie rel - Relative Radiant Intensity Ie,rel - Relative Radiant Intensity (Ie / Ie(100 mA)) 950 1 0.1 40 1.0 0.9 50 0.8 60 70 0.7 - Angular Displacement IF - Forward Current (mA) tp = 100 s 80 0.01 1 10 100 1000 0.6 Fig. 4 - Relative Radiant Intensity vs. Forward Current Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Axis Title 10000 Max. 260 C 255 C 240 C 217 C 2nd line Temperature (C) FLOOR LIFE 245 C 1000 200 1st line 2nd line Max. 30 s 150 Max. 120 s 100 Max. 100 s Max. ramp down 6 C/s 100 10 0 0 50 100 150 200 250 300 Time (s) Fig. 7 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 Rev. 1.1, 08-Dec-17 Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: Tamb < 30 C, RH < 60 % Moisture sensitivity level 2a, according to J-STD-020. DRYING Max. ramp up 3 C/s 19841-1 0 DRYPACK 300 50 0.2 Fig. 6 - Relative Radiant Intensity vs. Angular Displacement SOLDER PROFILE 250 0.4 22688 IF - Forward Current (mA) In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 C (+ 5 C), RH < 5 %. Document Number: 84252 3 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY2943RG 0.4 0.3 0.05 0.1 O 1.8 1.6 2.55 Z 2.2 2.22 5.8 0.8 Exposed copper Z (20 : 1) 2.3 0.4 0.5 2.3 Anode Cathode 0.75 Pin ID 1.7 Solder pad proposal acc. IPC 7351 Technical drawings according to DIN specifications Not indicated tolerances 0.2 O 2.3 0.1 6.7 Drawing-No.: 6.544-5409.03-4 Issue: 3; 02.10.15 Rev. 1.1, 08-Dec-17 Document Number: 84252 4 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY2943G 0.4 0.3 O 1.8 0.05 0.1 1.6 2.55 X 2.22 2.2 4.2 Exposed copper X (20 : 1) 2.3 0.4 0.5 2.3 0.6 Anode Cathode 0.75 Pin ID Technical drawings according to DIN specifications Solder pad proposal acc. IPC 7351 Not indicated tolerances 0.2 2.45 5.15 Drawing-No.: 6.544-5408.03-4 Issue: 3; 02.10.15 Rev. 1.1, 08-Dec-17 Document Number: 84252 5 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2943RG X Reel Unreel direction 0 O 62 0.5 2.5 O 13 0.5 O 330 1 .5 Tape position coming out from reel 6000 pcs / reel Label posted here Technical drawings according to DIN specifications 12.4 1.5 Leader and trailer tape Empty (160 mm min.) Parts mounted Direction of pulling out 4 0.1 O 1.55 0.05 Terminal position in tape Device I Lead I Lead II Cathode Anode Collector Emitter Anode Cathode 2 0.05 X (2 : 1) 1.75 0.1 Empty (400 mm min.) + 0.3 - 0.1 VSMB2943RGX01 VSMF2893RGX01 VSMY2853RG VSMY2943RG VSMY294310RG 3.05 0.1 4 0.1 5.5 0.05 VEMT2x03X01 12 VEMD2x03X01 II Drawing-No.: 9.800-5100.02-4 Issue: 3; 02.10.15 Rev. 1.1, 08-Dec-17 Document Number: 84252 6 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2943G X Reel Unreel direction 0 O 62 0.5 2.5 O 13 0.5 O 330 1 .5 Tape position coming out from reel 6000 pcs / reel Technical drawings according to DIN specifications Label posted here 12.4 1.5 Leader and trailer tape Empty (160 mm min.) Parts mounted Direction of pulling out Terminal position in tape Device O 1.55 0.05 Lead I Lead II Cathode Anode Collector Emitter Anode Cathode I 4 0.1 2 0.05 X (2 : 1) 1.75 0.1 Empty (400 mm min.) VSMB2943GX01 VSMF2893GX01 12 VEMT2x23X01 + 0.3 - 0.1 VEMD2x23X01 VSMY2943G VSMY294310G 3.05 0.1 Drawing-No.: 9.800-5091.21-4 Issue: 3; 02.10.15 Rev. 1.1, 08-Dec-17 4 0.1 5.5 0.05 VSMY2853G II Document Number: 84252 7 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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