BD3650FP-ME2 - ROHM Co., Ltd. - Datasheet.Directory

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Power Management ICs for Automotive Body Control

LDO

Regulator

BD3650FP-M

●Description

The BD3650FP-M is low-saturation regulator.

This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a

thermal shutdown circuit that protects the IC from thermal damage due to overloading.

●Features

1) Output Current: 0.3A

2) High Output Voltage Precision : ±2%

3) Low saturation with PDMOS output

4) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits

5) Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading

6) Low ESR Capacitor

7) TO252-3 packaging

●Applications

Onboard devices (vehicle equipment, car stereos, satellite navigation s ystems, etc.)

●Absolute maximum ratings(Ta=25℃)

Parameter Symbol Ratings Unit

Supply voltage *1 Vcc -0.3～+36.0 V

Power dissipation *2 Pd 1.2 W

Operating temperature range Topr -40～+125 ℃

Storage temperature range Tstg -55～+150 ℃

Maximum Junction Temperature Tjmax 150 ℃

*1 Not to exceed Pd.

*2 TO252-3:Reduced by 9.6mW /℃ over Ta = 25℃, when mounted on glass epoxy board: 70mm×70mm×1.6mm.

●Operating conditions(Ta=-40～+125℃)

Parameter Symbol Min. Max. Unit

Supply Voltage *3 Vcc 5.6 30.0 V

Output current Io 0 0.3 A

*3 Consider the voltage drop (dropout voltage) due to the output current.

NOTE: This product is not designed for protection against radioactive rays.

No.10039EAT08

Technical Note

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BD3650FP-M

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●Electrical characteristics

Unless otherwise specified, Ta=-40～+125℃,Vcc=10V, Io=0mA setting

Parameter Symbol Min Typ Max Unit Conditions

Bias Current Ib － 0.5 1.0 mA

Output voltage Vo 4.90 5.00 5.10 V Io=200mA

Dropout Voltage ΔVd － 0.2 0.4 V Vcc=Vo×0.95, Io=200mA

Ripple Rejection R.R. 45 60 － dB

f=120Hz, ein=1Vrms,

Io=100mA

Line Regulation Reg.I － 5 35 mV Vcc=5.6→30V

Load Regulation Reg.L － 10 50 mV Io=10mA→300mA

Technical Note

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BD3650FP-M

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●Reference data

Unless otherwise specified, Ta=-40℃～+125℃, Vcc=10V, Io=0mA

Fig.1 Circuit Current Fig.2 Line Reg ulation

(Io=0mA) Fig.3 Line Regulation

(Io=200mA)

Fig.4 Load Stability

Fig.5 Dropout Voltage

(Vcc=4.75V)

(Io=0mA→300mA)

Fig.6 Ripple Rejection

(Io=100mA)

Fig.7 Output Voltage

Temperature Characteristics Fig.8 Ci

cuit Current

(lo=0mA→300 mA) Fig.9 Thermal Shutdown

Circuit Characteristics

100 1000 10000 100000 1000000

FREQUENCY: f [Hz]

RI PP LE REJECTION: R. R.[dB ]

100

150

200

250

300

0 100 200 300

O UT PUT CURRE NT: Io[ mA]

DROPOUT VOLTAGE: ΔVd[mV]

0.0

1.0

2.0

3.0

4.0

5.0

6.0

0 250 500 750 1000 1250 1500

O UTPUT CURRENT: Io [mA]

OUTPUT VOLTAGE: Vo[V]

-40℃

125℃

25℃

-40℃

25℃ 125℃ 125℃

25℃

-40℃

0.0

1.0

2.0

3.0

4.0

5.0

6.0

024681012141618202224262830

SUPPLY VOLTAGE: Vcc[V]

OUTPUT VOLTAGE: Vo[V]

0.0

1.0

2.0

3.0

4.0

5.0

6.0

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

SUPPLY VOLTAGE: Vcc[V]

OUTPUT VOLTAGE: Vo[V]

0.0

0.2

0.4

0.6

0.8

1.0

024681012141618202224262830

SUPPLY VOLTAGE: Vcc[V]

CI RCUIT CURRE NT: Ib+I FEEDBACK_R[mA]

25℃

125℃

-40℃

125℃

25℃

-40℃

125℃

25℃

0.0

1.0

2.0

3.0

4.0

5.0

6.0

130 140 150 160 170 180 190

AMBIENT TEM PERATURE: Ta[℃]

OUTPUT VOLTAGE: Vo[V]

0.0

1.0

2.0

3.0

4.0

5.0

6.0

-40 -20 0 20 40 60 80 100 120

AMBIENT TEMPERATURE: Ta [℃]

OUTPUT VOLTAGE: Vo[V]

0.0

0.2

0.4

0.6

0.8

1.0

0 50 100 150 200 250 300

O UTPUT CURRE NT : io[ mA]

CI RCUIT CURRE NT: Ib[ mA]

125℃ 25℃

-40℃

Technical Note

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BD3650FP-M

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●Measurement circuit for electrical data

Vcc

GND

2.2 µF 4.7 µF

Vcc

GND

2.2µF

Vcc

GND

2.2 µF

Vcc

GND

2.2 µF

Vcc

GND

2.2 µF

Vcc

GND

2.2 µF

Vcc

GND

2.2 µF

Vcc

GND

2.2µF

Vcc

GND

2.2 µF

200mA

4.75V 100mA

10V 10V 10V

10V 10V

1Vrms

4.7µF 4.7 µF

4.7µF 4.7 µF 4.7 µF

4.7µF 4.7µF 4.7µF

Measurement Circuit of Fig.1 Measurement Circuit of Fig.2 Measurement Circuit of Fig.3

Measurement Circuit of Fig.4 Measurement Circuit of Fig.5 Measurement Circuit of Fig.6

Measurement Circuit of Fig.7 Measurement Circuit of Fig.8 Measurement Circuit of Fig.9

Technical Note

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BD3650FP-M

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●Block Diagram

Fig.10

Pin No. Pin Name Function

1 Vcc Power supply pin

2 N.C. N.C. pin

3 Vo Output pin

FIN GND GND

●Package d imension (TOP VIEW)

●I/O Equivalent Circuits (Resistance value is typical value. )

FIN

1 2

Vcc N.C. 3

GND

VREF：Bandgap Reference

TSD：Thermal Sh ut Down Circuit

Driver：Power Transist or Driv er

OCP：Over Current Protection Circuit

TSD

OCP

DRIVER

VREF

100 kΩ

Vo pin

Vcc

Vcc pin

Vcc

83.5 kΩ

15kΩ

Technical Note

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BD3650FP-M

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0 25 50 75 100 125 150

Ambient Temperature: Ta(℃)

Power Dissipation: Pd (W)

①1.85

②3.50

③4.80

●Thermal Dissipation Curve

When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.11 and Fig.12.

The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC

at temperatures less than the maximum junction temperature Tjmax.

Fig.11 and Fig.12 shows the acceptable loss and heat reducing characteristics of the TO252-3 package. Even when the

ambient temperature Ta is a normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please

operate the IC at temperatures less than the acceptable loss Pd.

The calculation method for power consumption Pc(W) is as follows :(Fig.12③)

Pc=(Vcc－Vo)×Io+Vcc×Ib

Acceptable loss Pd≧Pc

Solving this for load current Io in order to operate within the acceptable loss,

OCC

OVV IbVPd

I



≦

(Please refer to Figs.8 for Ib.)

It is then possible to find the maximum load current IOMAX with respect to the

applied voltage Vcc at the time of thermal design.

Calculation E xample)

When Ta=85℃, Vcc=10V, Vo=5V

5Ib10469.2

IO

≦

IO≦300mA (Ib:0.5mA)

Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating

temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :

Pc=VCC×(Ib+Ishort) (Please refer to Fig.4 for Ishort.)

Fig.12③:θja=26.0℃/W → -38.4mW/℃

25℃=4.80W → 85℃=2.496W

VCC:

Vo:

Io:

Ib:

Ishort:

Input voltage

Output voltage

Load current

Circuit current

Short current

Fig.11 Fig.12

(Reference Data)

ローム標準基板実装

基板サイズ:70mm×70mm×1.6mm

銅箔面積:7mm×7mm

TO252S-3 θja=104.2(℃/W)

0 25 50 75 100 125 150

Ambient Temperature: Ta(℃)

Power Dissipation: Pd (W)

1.20

ROHM standard board

Board size:70mm×70mm×1.6mm

foil area:7mm×7mm

①2-layer board(back surface copper foil area:15mm×15mm)

②2-layer board(back surface copper foil area:70mm×70mm)

③4-layer board(back surface copper foil area:70mm×70mm)

①θja=67.6(℃/W)

②θja=35.7(℃/W)

③θja=26.0(℃/W

ROHM standard board

Board size：70mm×70mm×1.6mm

foil area:7mm×7mm

TO252-3:θja=104.2(℃/W)

Technical Note

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BD3650FP-M

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●Notes for use

1. Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may

result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open

mode) when such damage is suffered. If operational valu es are expected to exceed t he maximum ratings for the dev ice,

consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.

2. Elect rical characteristics described in thes e specifications may var y, dependi ng on temperature, suppl y voltage, e xte rnal

circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.

3. GND potential

The potential of the GND pin must be the minimum potential in the system in all operating conditions.

Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics.

4. Ground wiring pattern

When using both small-signal and large-current GND traces, the two ground traces should be routed separately but

connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused

by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage.

The power supply and ground lines must be as short and thick as possible to reduce line impedance.

5. Inter-pin shorts and mounting errors

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in

damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by

poor soldering or foreign objects) may result in damage to t he IC.

6. Operation in strong electromagnetic fields

Using this product in strong electromag netic fields may cause IC malfunct ion. Caut ion should b e exercis ed in appl icat i o ns

where strong electromagnetic fields may be present.

7. Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a lo w-impedance pin may subject the IC to

stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be

turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent

damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

8. Thermal consideration

Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions.

Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc)

Tjmax : Maximum junction temperature=150[ ℃] , Ta : Peripheral temperature[℃] ,

θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],

Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current

Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja

Power dissipation : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib

9. Vcc pin

Insert a capacitor(capacitor≧2.2µF～) between the Vcc and GND pins.

The appropriate capacitance value varies by application. Be sure to allow a sufficient margin for input voltage levels .

Technical Note

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BD3650FP-M

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10. Output pins

It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable

capacitance values range from 4.7µF to 1000µF. Ceramic capacitors can be used as long as their ESR value is low

enough to prevent oscillation (0.001Ω to 2Ω). Abrupt fluctuations in input voltage and load conditions may affect the

output voltage.

Output capacitance values should be det ermined only through sufficient testing of the actual application.

11. Over current protection circuit (OCP)

The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output

capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit

output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other

component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.

However, the IC should not be used in applications characterized by the continuous or transitive operation of the

protection circuits.

12. Thermal shutdown circuit (TSD)

The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of

thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used

after this function has activated, or in applications where the operation of this circuit is assumed.

13. Applications or inspection processes where the potent ial of the Vcc pin or other p ins may be reversed from their normal

state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in

case Vcc is shorted with the GND pin while the external ca pacitor is charged. I nsert a diode in series with Vcc to prevent

reverse current flo w, or insert b ypass diodes between Vcc and each pin.

※Operation Notes10 Measurement circuit

Cout

(4.7µF～)

Vcc Vo

GND

Cin

(2.2µF～)

ESR Io (ROUT)

(0.001Ω～)

Vcc

(5.6～30V)

Cout_ESR vs Io(reference data)

Vcc=5.6V～30V Ta=-40℃～+125℃

Io=0A～0.3A

Cin=2.2µF～100µF Cout=4.7µF～100µF

Stable operat in g reg ion

0.001

0.01

0.1

0 50 100 150 200 250 300

Io(mA)

Cout_ESR(O）

Unstable operating region

Technical Note

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BD3650FP-M

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14. Positive voltage surges on VCC pin

A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 36V

on the VCC pin.

15. Negative voltage surges on VCC pin

A schot tky barrier diode shou ld be inserted bet ween VCC and GND for protect ion against voltages lower than GND on the

VCC pin.

16. Output protection diode

Loads with large inductance compo nents may cause reverse current flow during startup or shutdown. In such cases, a

protection diode should be inserted on the output to protect the IC.

17. Regarding input pins of the IC

This monolithic IC contains P+ isolation and P substrate layers bet ween adjacent eleme nts in order to keep them isolat ed.

PN junctions are formed at the int ersection of t hese P layers wit h the N la ye rs of other elements, creatin g parasitic diod es

and/or transistors. For example (refer to the fi gure below):

○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode

○When GND > Pin B, the PN junction operates as a parasitic transistor

Parasitic diodes occur i nevitabl y in t he structure of the IC, a nd t he op erat io n of t hes e parasit ic di odes c a n result in m ut ual

interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Vcc

GND

Vcc

GND

Parasitic elements

(Pin A)

Parasitic elements

or transistors

(Pin B)

P+ P+

Parasitic elements

or transistors

P substrate

(Pin B)

CBE

T ransi stor (NPN)

(Pin A)

N N

P+ P+

Resistor

Parasitic elements

GND GND

GND

Example of Simple Monolithic IC Architecture

Technical Note

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BD3650FP-M

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●Ordering part number

B D 3 6 5 0 F P - M E 2

ROHM

model Name Part No.

Package

FP : TO252-3

Packaging and forming spec ification

E2: Embossed tape and reel

Datasheet

Notice - Rev.004

Notice

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

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representative.

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[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

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H2S, NH3, SO2, and NO2

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residue after soldering

[h] Use of the Products in places subject to dew condensation

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5. Please verify and confirm cha racteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding nor mal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Po wer Dissipation (P d) depe nding on Ambient temperature (T a). When us ed in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for fai lure induced under deviant conditio n from what is defined in

this document.

Datasheet

Notice - Rev.004

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlor ine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specificati on

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable f or any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

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isolation from charged objects, setting of Ionizer, friction prevention and temperatur e / humidity control).

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[a] the Products are exposed to sea winds or corrosive gases, i ncluding Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended b y ROHM

[c] the Products are exposed to direct sunshine o r condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommen de d storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

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QR code printed on ROHM Products label is for ROHM’s internal use only.

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When disposing Products pl ease dispose them properly using a n authorized industry waste company.

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Datasheet

Notice - Rev.004

Other Precaution

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