201208 Chip Bead For High Current CIC41 Series (4516/ EIA 1806) APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN CIC series is used for high current. (~ 3A) 2.7~3.3mm 1.2~2.0mm 1.4~2.4mm 1.4~2.4mm DIMENSION Type 41 Dimension [mm] L W t d 4.50.2 1.60.2 1.60.2 0.50.3 DESCRIPTION Thickness Impedance DC Resistance Rated Current (mm) ()25%@100MHz () Max. (mA) Max. CIC41P260 1.60.2 26 0.01 6000 CIC41P600 1.60.2 60 0.01 6000 CIC41P750 1.60.2 75 0.01 6000 CIC41P800 1.60.2 80 0.01 6000 CIC41P910 1.60.2 91 0.025 3000 CIC41P111 1.60.2 110 0.025 3000 CIC41P121 1.60.2 120 0.025 3000 CIC41P151 1.60.2 150 0.025 3000 CIC41P181 1.60.2 180 0.025 3000 CIC41P221 1.60.2 220 0.05 2000 CIC41P301 1.60.2 300 0.05 2000 CIC41P471 1.60.2 470 0.05 2000 CIC41P601 1.60.2 600 0.08 1500 Part no. Ver 201208 Thickness Impedance DC Resistance Rated Current (mm) ()25%@100MHz () Max. (mA) Max. CIC41J400 1.60.2 40 0.01 6000 CIC41J600 1.60.2 60 0.01 6000 CIC41J800 1.60.2 80 0.01 6000 CIC41J910 1.60.2 91 0.02 6000 CIC41J121 1.60.2 120 0.03 3000 CIC41J151 1.60.2 150 0.03 3000 CIC41J221 1.60.2 220 0.04 2500 CIC41J301 1.60.2 300 0.04 2500 CIC41J471 1.60.2 470 0.04 2500 CIC41J601 1.60.2 600 0.04 2500 Part no. CHARACTERISTIC DATA Ver 201208 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (6) (7) C (2) 41 P (3) (4) 121 (5) N E (6) (7) Chip Beads (2) For High current(C:~3A) Dimension (4) Material Code Nominal impedance (300:30, 121:120 ) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) Ver 201208 RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Embossed Taping Quantity(pcs/reel) 1,000 NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.