© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
1Publication Order Number:
MC10H180/D
MC10H180
Dual 2−Bit Adder/Subtractor
Description
The MC10H180 is a high−speed, low−power, general−purpose
adder/ subtractor. It is designed to be used in special purpose
adders/subtractors or in high−speed multiplier arrays.
Inputs for each adder are Carry−in, Operand A, and Operand B;
outputs are Sum, Sum and Carry−out. The common select inputs serve
as a control line to Invert A for subtract, and a control line to Invert B.
Features
•Propagation Delay, 1.8 ns Typical, Operand and Select to Output
•Power Dissipation, 360 mW Typical MC10H180
•Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•Voltage Compensated
•MECL 10K™ Compatible
•Pb−Free Packages are Available*
LOGIC DIAGRAM
DIP PIN ASSIGNMENT
S1
S0
COUT
CIN
A0
B0
SELA
VEE
VCC
S0
S1
COUT
CIN
A1
B1
SELB
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
10
S1
S0
CIN
BO
AO
SELB
SELA
VCC = PIN 16
VEE = PIN 8
7
9
5
4
6
15
2
11
12
3
14
1
13
SELA
SELB
A1
B1
CIN
S0
COUT
S1
COUT
POSITIVE LOGIC ONLY
A’ = A SELA = ASELA
B’ = B SELB = BSELB
S=C
IN (A’ B’ + A’ B’) +
CIN(A’ B’ + A’ B’)
COUT = CINA’ + CINB’ + A’ B’
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
CDIP−16
L SUFFIX
CASE 620A
MARKING DIAGRAMS*
PDIP−16
P SUFFIX
CASE 648
http://onsemi.com
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
16
1
16
1
MC10H180P
AWLYYWWG
1
16
MC10H180L
AWLYYWW
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G= Pb−Free Package
PLLC−20
FN SUFFIX
CASE 775
20 110H180G
AWLYYWW
120
MC10H180
http://onsemi.com
2
Table 1. MAXIMUM RATINGS
Symbol Characteristic Rating Unit
VEE Power Supply (VCC = 0) −8.0 to 0 Vdc
VIInput Voltage (VCC = 0) 0 to VEE Vdc
Iout Output Current − Continuous
− Surge
50
100
mA
TAOperating Temperature Range 0 to +75 °C
Tstg Storage Temperature Range − Plastic
− Ceramic
−55 to +150
−55 to +165
°C
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
IEPower Supply Current −95 −86 −95 mA
IinH Input Current High
Pins 4, 12
Pins 7, 9
Pins 5, 6, 10, 11
−
−
−
665
515
410
−
−
−
417
320
255
−
−
−
417
320
255
mA
IinL Input Current Low 0.5 −0.5 −0.3 −mA
VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc
VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc
VIH High Input Voltage (1) −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc
VIL Low Input Voltage (1) −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50 W resistor to −2.0 V.
Table 3. AC PARAMETERS
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
tpd Propagation Delay
Operand to Output
Select to Output
Carry−in to Output
0.6
0.6
0.4
2.4
2.2
1.6
0.7
0.7
0.4
2.5
2.3
1.7
0.8
0.8
0.4
2.8
2.6
1.8
ns
trRise Time 0.5 2.0 0.5 2.1 0.5 2.2 ns
tfFall Time 0.5 2.0 0.5 2.1 0.5 2.2 ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
MC10H180
http://onsemi.com
3
Table 4. FUNCTION SELECT TABLE
Table 5. TRUTH TABLE
SelASelBFunc-
tion
H S = A plus B
INPUTS
FUNCTION
SelASelBA0 B0 Cin S0 S0 Cout
ADD
SUBTRACT
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
H
H
H
H
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
H
L
L
H
L
H
H
L
L
H
H
L
H
L
L
H
L
H
H
L
H
L
L
H
H
L
L
H
L
H
H
L
L
L
L
H
L
H
H
H
L
H
L
L
H
H
L
H
H
L
L
H
L
H
L
S = A minus B
S = B minus A
S = 0 minus A minus B
INPUTS
FUNCTION
SelASelBA0 B0 Cin S0 S0 Cout
REVERSE
SUBTRACT
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
H
H
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
H
L
H
L
L
H
H
L
L
H
L
H
H
L
H
L
L
H
L
H
H
L
L
H
H
L
H
L
L
H
L
H
H
H
L
L
L
H
H
H
L
H
L
H
L
L
ORDERING INFORMATION
Device Package Shipping†
MC10H180FN PLLC−20 46 Units / Rail
MC10H180FNG PLLC−20
(Pb−Free)
46 Units / Rail
MC10H180L CDIP−16 25 Unit / Rail
MC10H180P PDIP−16 25 Unit / Rail
MC10H180PG PDIP−16
(Pb−Free)
25 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC10H180
http://onsemi.com
4
PACKAGE DIMENSIONS
−M−
−N−
−L−
Y BRK
W
V
D
D
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
S
L−M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D−D
20 1
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
S
L−M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
−T−SEATING
PLANE
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1
20 LEAD PLLC
CASE 775−02
ISSUE E
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 −−− 0.51 −−−
K0.025 −−− 0.64 −−−
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y−−− 0.020 −−− 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 −−− 1.02 −−−
____
MC10H180
http://onsemi.com
5
PACKAGE DIMENSIONS
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
F
E
N
K
C
SEATING
PLANE
A
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C−−− 0.200 −−− 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
A
B
A
B
16
1
9
8
G
16X D
B
M
0.25 (0.010) T
T
16X J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
B
FC
S
H
GD
J
L
M
16 PL
SEATING
18
916
K
PLANE
−T−
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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PUBLICATION ORDERING INFORMATION
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2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
MC10H180/D
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
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