1
Data sheet acquired from Harris Semiconductor
SCHS141B
Features
Hysteresis on Clock Inputs for Improved Noise
Immunity and Increased Input Rise and Fall Times
Asynchronous Set and Reset
Complementary Outputs
Buffered Inputs
Typical fMAX = 60MHz at VCC = 5V, CL = 15pF,
TA = 25oC
Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Wide Operating T emperature Range . . . -55oC to 125oC
Balanced Propagation Delay and Transition Times
Significant Power Reduction Compared to LSTTL
Logic ICs
HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il1µA at VOL, VOH
Description
The ’HC112 and ’HCT112 utilize silicon-gate CMOS
technology to achieve operating speeds equivalent to LSTTL
parts. They exhibit the low power consumption of standard
CMOS integrated circuits, together with the ability to drive 10
LSTTL loads.
These flip-flops have independent J, K, Set, Reset, and
Clock inputs and Q and Q outputs. They change state on the
negative-going transition of the clock pulse. Set and Reset
are accomplished asynchronously by low-level inputs.
The HCT logic family is functionally as well as pin-
compatible with the standard LS logic family.
.
Pinout CD54HC112, CD54HCT112
(CERDIP)
CD74HC112
(PDIP, SOP)
CD74HCT112
(PDIP)
TOP VIEW
Ordering Information
PART NUMBER TEMP. RANGE
(oC) PACKAGE
CD54HC112F3A -55 to 125 16 Ld CERDIP
CD74HC112E -55 to 125 16 Ld PDIP
CD74HC112NSR -55 to 125 16 Ld SOP
CD54HCT112F3A -55 to 125 16 Ld CERDIP
CD74HCT112E -55 to 125 16 Ld PDIP
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Wafer and die is available which meets all electrical specifica-
tions. Please contact your local TI sales office or customer ser-
vice for ordering information.
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
1CP
1K
1J
1S
1Q
1Q
GND
2Q
VCC
2R
2CP
2K
2J
2S
2Q
1R
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2002, Texas Instruments Incorporated
CD54/74HC112,
CD54/74HCT112
Dual J-K Flip-Flop with Set and Reset
Negative-Edge Trigger
[ /Title
(CD74
HC112
,
CD74
HCT11
2)
/
Sub-
j
ect
(Dual
J-K
Flip-
Flop
with
Setand
Reset
Nega-
March 1998 - Revised March 2002
2
Functional Diagram
TRUTH TABLE
INPUTS OUTPUTS
S R CP J K Q Q
LHXXXHL
HLXXXLH
LLX X X H (Note 3) H (Note 3)
HHL L No Change
HHHL
HHLH
HHH H Toggle
H H H X X No Change
NOTE:
H = High Level (Steady State)
L = Low Level (Steady State)
X = Don’t Care
= High-to-Low Transition
3. Output states unpredictable if both S and R go High simultaneously after both being low at the same time.
1S
2S
2R
4
10
5
61Q
1Q
14
15
1R
2K 12
13
9
72Q
2Q
2CP
F/F 1
F/F 2
GND = 8
VCC = 16
2J 11
1K 2
1
1CP
1J 3
CD54/74HC112, CD54/74HCT112
3
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, IO
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time, tr, tf
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max)
Package Thermal Impedance, θJA (see Note 4):
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67oC/W
SOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
Maximum Junction Temperature (Hermetic Package or Die) . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
4. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER SYMBOL
TEST
CONDITIONS
VCC (V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HC TYPES
High Level Input
Voltage VIH - - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V
6 4.2 - - 4.2 - 4.2 - V
Low Level Input
Voltage VIL - - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V
6 - - 1.8 - 1.8 - 1.8 V
High Level Output
Voltage
CMOS Loads
VOH VIH or
VIL -0.02 2 1.9 - - 1.9 - 1.9 - V
4.5 4.4 - - 4.4 - 4.4 - V
6 5.9 - - 5.9 - 5.9 - V
High Level Output
Voltage
TTL Loads
---------V
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
Low Level Output
Voltage
CMOS Loads
VOL VIH or
VIL 0.02 2 - - 0.1 - 0.1 - 0.1 V
4.5 - - 0.1 - 0.1 - 0.1 V
6 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
---------V
4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIVCC or
GND -6--±0.1 - ±1-±1µA
CD54/74HC112, CD54/74HCT112
4
Quiescent Device
Current ICC VCC or
GND 0 6 - - 4 - 40 - 80 µA
HCT TYPES
High Level Input
Voltage VIH - - 4.5 to
5.5 2-- 2 - 2 - V
Low Level Input
Voltage VIL - - 4.5 to
5.5 - - 0.8 - 0.8 - 0.8 V
High Level Output
Voltage
CMOS Loads
VOH VIH or
VIL - 4.5 4.4 - - 4.4 - 4.4 - V
High Level Output
Voltage
TTL Loads
-0.02 4.5 3.98 - - 3.84 - 3.7 - V
Low Level Output
Voltage CMOS Loads VOL VIH or
VIL -4 4.5 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
0.02 4.5 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIVCC
and
GND
4 5.5 - ±0.1 - ±1-±1µA
Quiescent Device
Current ICC VCC or
GND 0 5.5 - - 4 - 40 - 80 µA
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
ICC VCC
- 2.1 - 4.5 to
5.5 - 100 360 - 450 - 490 µA
NOTE:
5. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
DC Electrical Specifications (Continued)
PARAMETER SYMBOL
TEST
CONDITIONS
VCC (V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HCT Input Loading Table
INPUT UNIT LOADS
1S, 2S 0.5
1K, 2K 0.6
1R, 2R 0.65
1J, 2J, 1CP, 2CP 1
NOTE: Unit Load is ICC limit specified in DC Electrical Specifica-
tions table, e.g., 360µA max at 25oC.
Prerequisite For Switching Specifications
PARAMETER SYMBOL TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
HC TYPES
Pulse Width CP tW- 2 80 - - 100 - 120 - ns
4.5 16 - - 20 - 24 - ns
6 14 - - 17 - 20 - ns
CD54/74HC112, CD54/74HCT112
5
Pulse Width R, St
W- 2 80 - - 100 - 120 - ns
4.5 16 - - 20 - 24 - ns
6 14 - - 17 - 20 - ns
Setup Time J, K, to CP tSU - 2 80 - - 100 - 120 - ns
4.5 16 - - 20 - 24 - ns
6 14 - - 17 - 20 - ns
Hold Time J, K, to CP tH-20--0-0-ns
4.5 0 - - 0 - 0 - ns
60--0-0-ns
Removal Time R to CP, S to CP tREM - 2 80 - - 100 - 120 - ns
4.5 16 - - 20 - 24 - ns
6 14 - - 17 - 20 - ns
CP Frequency fMAX - 2 6 - - 5 - 4 - MHz
4.5 30 - - 25 - 20 - MHz
6 35 - - 29 - 23 - MHz
HCT TYPES
Pulse Width CP tSU - 4.5 16 - - 20 - 24 - ns
Pulse Width R, St
W- 4.5 18 - - 23 - 27 - ns
Setup Time J, K, to CP tH- 4.5 16 - - 20 - 24 - ns
Hold Time J, K, to CP tREM - 4.5 3 - - 3 - 3 - ns
Removal Time R to CP, S to CP tW- 4.5 20 - - 25 - 30 - ns
CP Frequency fMAX - 4.5 30 - - 25 - 20 - MHz
Switching Specifications Input tr, tf = 6ns
PARAMETER SYMBOL TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
HC TYPES
Propagation Delay,
CP to Q, Q tPLH, tPHL CL= 50pF 2 - - 175 - 220 - 265 ns
CL= 50pF 4.5 - - 35 - 44 - 53 ns
CL= 15pF 5 - 14 - ----ns
CL= 50pF 6 - - 30 - 37 - 45 ns
Propagation Delay,
S to Q, QtPLH, tPHL CL= 50pF 2 - - 155 - 195 - 235 ns
CL= 50pF 4.5 - - 31 - 39 - 47 ns
CL= 15pF 5 - 13 - ----ns
CL= 50pF 6 - - 26 - 33 - 40 ns
Propagation Delay,
R to Q, QtPLH, tPHL CL= 50pF 2 - - 180 - 225 - 270 ns
CL= 50pF 4.5 - - 36 - 45 - 54 ns
CL= 15pF 5 - 15 - ----ns
CL= 50pF 6 - - 31 - 38 - 46 ns
Prerequisite For Switching Specifications (Continued)
PARAMETER SYMBOL TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
CD54/74HC112, CD54/74HCT112
6
Output Transition Time tTLH, tTHL CL= 50pF 2 - - 75 - 95 - 110 ns
CL= 50pF 4.5 - - 15 - 19 - 22 ns
CL= 50pF 6 - - 13 - 16 - 19 ns
Input Capacitance CI- - - - 10 - 10 - 10 pF
CP Frequency fMAX CL = 15pF 5 - 60 - ----MHz
Power Dissipation Capacitance
(Notes 6, 7) CPD - 5-12-----pF
HCT TYPES
Propagation Delay,
CP to Q, Q tPLH, tPHL CL= 50pF 4.5 - - 35 - 44 - 53 ns
CL = 15pF 5 - 14 - ----ns
Propagation Delay,
S to Q, QtPLH, tPHL CL= 50pF 4.5 - - 32 - 40 - 48 ns
CL = 15pF 5 - 13 - ----ns
Propagation Delay,
R to Q, QtPLH, tPHL CL= 50pF 4.5 - - 37 - 46 - 56 ns
CL = 15pF 5 - 14 - ----ns
Output Transition Time tTLH, tTHL CL= 50pF 4.5 - - 15 - 19 - 22 ns
Input Capacitance CI- - - - 10 - 10 - 10 pF
CP Frequency fMAX CL = 15pF 5 - 60 - ----MHz
Power Dissipation Capacitance
(Notes 6, 7) CPD - 5-20-----pF
NOTES:
6. CPD is used to determine the dynamic power consumption, per flip-flop.
7. PD = CPD VCC2 fi + ΣCLfowhere fi = input frequency, fo = output frequency, CL = output load capacitance, VCC = supply voltage.
Switching Specifications Input tr, tf = 6ns (Continued)
PARAMETER SYMBOL TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
Test Circuits and Waveforms
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
CLOCK 90% 50%
10% GND
VCC
trCLtfCL
50% 50%
tWL tWH
10%
tWL + tWH =fCL
I
CLOCK 2.7V 1.3V
0.3V GND
3V
trCL= 6ns tfCL= 6ns
1.3V 1.3V
tWL tWH
0.3V
tWL + tWH =fCL
I
CD54/74HC112, CD54/74HCT112
7
FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
Test Circuits and Waveforms (Continued)
tPHL tPLH
tTHL tTLH
90%
50%
10%
50%
10%
INVERTING
OUTPUT
INPUT
GND
VCC
tr = 6ns tf = 6ns
90%
tPHL tPLH
tTHL tTLH
2.7V
1.3V
0.3V
1.3V
10%
INVERTING
OUTPUT
INPUT
GND
3V
tr = 6ns tf = 6ns
90%
trCLtfCL
GND
VCC
GND
VCC
50%
90%
10%
GND
CLOCK
INPUT
DATA
INPUT
OUTPUT
SET, RESET
OR PRESET
VCC 50%
50%
90%
10%
50%
90%
tREM
tPLH
tSU(H)
tTLH tTHL
tH(L)
tPHL
IC CL
50pF
tSU(L)
tH(H)
trCLtfCL
GND
3V
GND
3V
1.3V
2.7V
0.3V
GND
CLOCK
INPUT
DATA
INPUT
OUTPUT
SET, RESET
OR PRESET
3V 1.3V
1.3V
1.3V
90%
10%
1.3V
90%
tREM
tPLH
tSU(H)
tTLH tTHL
tH(L)
tPHL
IC CL
50pF
tSU(L)
1.3V
tH(H)
1.3V
CD54/74HC112, CD54/74HCT112
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TIs terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TIs standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding thirdparty products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2002, Texas Instruments Incorporated