PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP Soldering 1816 1818 1822 1823 1827 1830 1836 1839 1841 1849 1851 1852 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS (DIL-bent-SIL) DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) SOT157-2 DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 DIP (dual in-line package) DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1 HDIP (heat-dissipating dual in-line package) HDIP18 plastic heat-dissipating dual in-line package; 18 leads SOT398-1 LQFP (low profile quad flat package) LQFP48 plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 LQFP64 plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 LQFP100 plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 LQFP128 plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 PLCC (plastic leaded chip carrier) PLCC44 plastic leaded chip carrier; 44 leads SOT187-2 PLCC68 plastic leaded chip carrier; 68 leads SOT188-2 PLCC84 plastic leaded chip carrier; 84 leads SOT189-2 QFP (quad flat package) QFP44 plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm SOT205-1 QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 QFP64 plastic quad flat package; 64 leads (lead length 1.6 mm); body 14 x 14 x 2.7 mm SOT393-1 QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT318-2 QFP80 plastic quad flat package; 80 leads (lead length 2.35 mm); body 14 x 20 x 2.8 mm SOT318-3 QFP100 plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height SOT317-1 SDIP (shrink dual in-line package) SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1 SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1 SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1 SIL (single in-line) SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1 SIL9P plastic single in-line power package; 9 leads SOT131-2 1996 Nov 05 2 PAGE Philips Semiconductors Package information NAME Package outlines DESCRIPTION VERSION SO (small outline) SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 SO8 plastic small outline package; 8 leads (straight); body width 3.9 mm SOT96-2 SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 SO32 plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 SSOP (shrink small outline package) SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1 SQFP (shrink quad flat package) SQFP208 1996 Nov 05 plastic shrink quad flat package; 208 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm 3 SOT316-1 PAGE Philips Semiconductors Package information Package outlines DBS DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) SOT157-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 v M 9 e1 Z e2 m w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 5.08 e1 e2 2.54 5.08 Eh j L L3 m Q v w x Z (1) 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-03-11 97-12-16 SOT157-2 1996 Nov 05 EUROPEAN PROJECTION 4 Philips Semiconductors Package information Package outlines DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 v M 13 e1 Z e e2 m w M bp 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e e1 e2 Eh j L L3 m Q v w x Z (1) mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 3.4 1.7 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-03-11 97-12-16 SOT141-6 1996 Nov 05 EUROPEAN PROJECTION 5 Philips Semiconductors Package information Package outlines DIP DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1996 Nov 05 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 6 Philips Semiconductors Package information Package outlines DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE 1996 Nov 05 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 7 Philips Semiconductors Package information Package outlines DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 1996 Nov 05 REFERENCES IEC JEDEC EIAJ SC603 8 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Package information Package outlines seating plane handbook, full pagewidthdual in-line package; 28 leads (600 mil) DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 1.7 inches 0.20 0.020 0.16 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT117-1 051G05 MO-015AH 1996 Nov 05 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 9 Philips Semiconductors Package information Package outlines HDIP HDIP18: plastic heat-dissipating dual in-line package; 18 leads SOT398-1 D seating plane ME A2 A A1 L e Z c w M b1 (e 1) b2 b 10 18 MH pin 1 index E 9 1 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.67 0.50 1.05 0.75 0.47 0.38 21.85 21.35 6.5 6.2 2.54 7.62 3.9 3.1 8.32 8.02 8.7 7.7 0.25 1.0 inches 0.19 0.02 0.15 0.06 0.04 0.03 0.02 0.04 0.03 0.02 0.01 0.87 0.84 0.26 0.24 0.10 0.30 0.15 0.12 0.33 0.32 0.34 0.30 0.01 0.04 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 94-04-13 95-01-25 SOT398-1 1996 Nov 05 EUROPEAN PROJECTION 10 Philips Semiconductors Package information Package outlines LQFP LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 c y X 36 25 A 37 24 ZE e E HE A A2 (A 3) A1 w M pin 1 index bp Lp L 13 48 detail X 12 1 ZD e v M A w M bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A max. A1 A2 1.60 0.20 0.05 1.45 1.35 A3 bp c D (1) E (1) 0.25 0.27 0.17 0.18 0.12 7.1 6.9 7.1 6.9 e HD HE 0.5 9.15 8.85 9.15 8.85 L Lp 1.0 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 7 0o 0.95 0.55 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 94-12-19 97-08-01 SOT313-2 1996 Nov 05 EUROPEAN PROJECTION 11 Philips Semiconductors Package information Package outlines LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 wM bp pin 1 index 64 Lp L 17 1 detail X 16 ZD e v M A wM bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A max. A1 A2 1.60 0.20 0.05 1.45 1.35 A3 bp c D (1) E (1) 0.25 0.27 0.17 0.18 0.12 10.1 9.9 10.1 9.9 e 0.5 HD HE 12.15 12.15 11.85 11.85 L Lp 1.0 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 1.45 1.05 7 0o 1.45 1.05 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-12-19 97-08-01 SOT314-2 1996 Nov 05 EUROPEAN PROJECTION 12 Philips Semiconductors Package information Package outlines LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 c y X A 51 75 50 76 ZE e E HE A A2 (A 3) A1 w M bp Lp L pin 1 index 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.20 0.05 1.5 1.3 0.25 0.28 0.16 0.18 0.12 14.1 13.9 14.1 13.9 0.5 HD HE 16.25 16.25 15.75 15.75 L Lp v w y 1.0 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) 1.15 0.85 7 0o 1.15 0.85 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-12-19 97-08-04 SOT407-1 1996 Nov 05 EUROPEAN PROJECTION 13 Philips Semiconductors Package information Package outlines LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 c y X A 65 102 64 103 ZE e E HE A A2 A 1 (A 3) wM Lp bp pin 1 index L detail X 39 128 1 38 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 20.1 19.9 14.1 13.9 0.5 HD HE 22.15 16.15 21.85 15.85 L Lp v w y 1.0 0.75 0.45 0.2 0.12 0.1 Z D(1) Z E(1) 0.81 0.59 7 0o 0.81 0.59 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-04-02 97-08-04 SOT425-1 1996 Nov 05 EUROPEAN PROJECTION 14 Philips Semiconductors Package information Package outlines PLCC PLCC44: plastic leaded chip carrier; 44 leads SOT187-2 eD eE y X 39 A 29 28 40 bp ZE b1 w M 44 1 E HE pin 1 index A A4 A1 e (A 3) 6 18 k 1 Lp k 7 detail X 17 e v M A ZD D B HD v M B 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) Lp v w y 0.51 1.44 1.02 0.18 0.18 0.10 Z D(1) Z E (1) max. max. bp b1 0.25 3.05 0.53 0.33 0.81 0.66 0.180 0.020 0.01 0.165 0.12 0.630 0.630 0.695 0.695 0.048 0.057 0.021 0.032 0.656 0.656 0.020 0.05 0.007 0.007 0.004 0.085 0.085 0.590 0.590 0.685 0.685 0.042 0.040 0.013 0.026 0.650 0.650 A mm 4.57 4.19 inches k1 max. A4 max. UNIT A1 min. 0.51 A3 D (1) E (1) e eD eE HD HE k 16.66 16.66 16.00 16.00 17.65 17.65 1.22 1.27 16.51 16.51 14.99 14.99 17.40 17.40 1.07 2.16 2.16 45 o Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT187-2 112E10 MO-047AC 1996 Nov 05 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-25 97-12-16 15 Philips Semiconductors Package information Package outlines PLCC68: plastic leaded chip carrier; 68 leads SOT188-2 eD eE y X 60 A 44 43 Z E 61 bp b1 w M 68 1 HE E pin 1 index A e A4 A1 (A 3) 9 k1 27 Lp k detail X 10 26 e v M A ZD D B HD v M B 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A A1 min. A3 A4 max. bp b1 mm 4.57 4.19 0.51 0.25 3.30 0.53 0.33 0.81 0.66 0.180 inches 0.020 0.01 0.165 D (1) E (1) e eD eE HD HE k 24.33 24.33 23.62 23.62 25.27 25.27 1.22 1.27 24.13 24.13 22.61 22.61 25.02 25.02 1.07 k1 max. Lp v w y 0.51 1.44 1.02 0.18 0.18 0.10 Z D(1) Z E (1) max. max. 2.16 2.16 45 o 0.930 0.930 0.995 0.995 0.048 0.057 0.021 0.032 0.958 0.958 0.020 0.05 0.007 0.007 0.004 0.085 0.085 0.13 0.890 0.890 0.985 0.985 0.042 0.040 0.013 0.026 0.950 0.950 Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT188-2 112E10 MO-047AC 1996 Nov 05 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-03-11 16 Philips Semiconductors Package information Package outlines PLCC84: plastic leaded chip carrier; 84 leads SOT189-2 eD eE y X 74 A 54 53 Z E 75 bp b1 w M 84 1 HE E pin 1 index e A A4 A1 (A 3) 11 k1 33 Lp k detail X 12 32 e v M A ZD D B HD v M B 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A A1 min. A3 A4 max. bp b1 mm 4.57 4.19 0.51 0.25 3.30 0.53 0.33 0.81 0.66 0.180 inches 0.020 0.01 0.165 D (1) E (1) e eD eE HD HE k 29.41 29.41 28.70 28.70 30.35 30.35 1.22 1.27 29.21 29.21 27.69 27.69 30.10 30.10 1.07 k1 max. Lp v w y 0.51 1.44 1.02 0.18 0.18 0.10 Z D(1) Z E (1) max. max. 2.16 2.16 45 o 1.130 1.130 1.195 1.195 0.048 0.057 0.021 0.032 1.158 1.158 0.020 0.05 0.007 0.007 0.004 0.085 0.085 0.13 1.090 1.090 1.185 1.185 0.042 0.040 0.013 0.026 1.150 1.150 Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-03-11 SOT189-2 1996 Nov 05 EUROPEAN PROJECTION 17 Philips Semiconductors Package information Package outlines QFP QFP44: plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm SOT205-1 c y X 33 A 23 34 22 ZE e E HE A A2 (A 3) A1 wM bp Lp pin 1 index 44 L 12 detail X 1 11 ZD e v M A wM bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 2.60 0.25 0.05 2.3 2.1 0.25 0.50 0.35 0.25 0.14 14.1 13.9 14.1 13.9 1 19.2 18.2 19.2 18.2 2.35 2.0 1.2 0.3 0.15 0.1 Z D (1) Z E (1) 2.4 1.8 2.4 1.8 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC SOT205-1 133E01A 1996 Nov 05 JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-08-01 18 Philips Semiconductors Package information Package outlines QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A max. A1 A2 2.10 0.25 0.05 1.85 1.65 A3 bp c D (1) E (1) 0.25 0.40 0.20 0.25 0.14 10.1 9.9 10.1 9.9 e HD HE 0.8 12.9 12.3 12.9 12.3 L Lp 1.3 0.95 0.55 v 0.15 w 0.15 y 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 o 10 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT307-2 1996 Nov 05 EUROPEAN PROJECTION 19 Philips Semiconductors Package information Package outlines QFP64: plastic quad flat package; 64 leads (lead length 1.6 mm); body 14 x 14 x 2.7 mm SOT393-1 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 wM Lp bp pin 1 index L 17 64 detail X 16 1 w M bp e v M A ZD D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 3.00 0.25 0.10 2.75 2.55 0.25 0.45 0.30 0.23 0.13 14.1 13.9 14.1 13.9 0.8 HD HE L 17.45 17.45 1.60 16.95 16.95 Lp v w y 1.03 0.73 0.16 0.16 0.10 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT393-1 1996 Nov 05 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 96-05-21 97-08-04 MS-022 20 Philips Semiconductors Package information Package outlines QFP80: plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT318-2 c y X 64 A 41 40 65 ZE e E HE A A2 (A 3) A1 wM pin 1 index Lp bp 80 L 25 detail X 24 1 wM bp e ZD v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A max. A1 A2 3.2 0.25 0.05 2.90 2.65 A3 bp c D (1) E (1) 0.25 0.45 0.30 0.25 0.14 20.1 19.9 14.1 13.9 e HD HE 0.8 24.2 23.6 18.2 17.6 L Lp 1.95 1.0 0.6 v 0.2 w 0.2 y 0.1 Z D (1) Z E (1) 1.0 0.6 1.2 0.8 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT318-2 1996 Nov 05 EUROPEAN PROJECTION 21 Philips Semiconductors Package information Package outlines QFP80: plastic quad flat package; 80 leads (lead length 2.35 mm); body 14 x 20 x 2.8 mm SOT318-3 c y X 64 A 41 65 40 ZE e E HE A A2 (A 3) A1 wM pin 1 index Lp bp 80 L 25 detail X 24 1 wM bp e ZD v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A max. A1 A2 3.25 0.30 0.10 2.90 2.65 A3 bp c D (1) E (1) 0.25 0.45 0.30 0.25 0.14 20.1 19.9 14.1 13.9 e HD HE 0.8 25.0 24.4 19.0 18.4 L Lp 2.35 1.4 1.0 v 0.2 w 0.2 y 0.1 Z D (1) Z E (1) 1.0 0.6 1.2 0.8 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-04-25 97-08-01 SOT318-3 1996 Nov 05 EUROPEAN PROJECTION 22 Philips Semiconductors Package information Package outlines QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height SOT317-1 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A max. A1 A2 3.3 0.36 0.10 2.87 2.57 A3 bp c D (1) E (1) 0.25 0.40 0.25 0.25 0.13 20.1 19.9 14.1 13.9 e HD HE 0.65 24.2 23.6 18.2 17.6 L Lp 1.95 1.0 0.6 v 0.2 w 0.15 y 0.1 Z D (1) Z E (1) 0.8 0.4 1.0 0.6 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT317-1 1996 Nov 05 EUROPEAN PROJECTION 23 Philips Semiconductors Package information Package outlines SDIP SDIP32: plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1 ME seating plane D A2 A A1 L c e Z (e 1) w M b1 MH b 17 32 pin 1 index E 1 16 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.8 1.3 0.8 0.53 0.40 0.32 0.23 29.4 28.5 9.1 8.7 1.778 10.16 3.2 2.8 10.7 10.2 12.2 10.5 0.18 1.6 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-04 SOT232-1 1996 Nov 05 EUROPEAN PROJECTION 24 Philips Semiconductors Package information Package outlines seating plane SDIP42: plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 22 42 pin 1 index E 1 21 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.08 0.51 4.0 1.3 0.8 0.53 0.40 0.32 0.23 38.9 38.4 14.0 13.7 1.778 15.24 3.2 2.9 15.80 15.24 17.15 15.90 0.18 1.73 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-02-13 95-02-04 SOT270-1 1996 Nov 05 EUROPEAN PROJECTION 25 Philips Semiconductors Package information Package outlines seating plane SDIP52: plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 27 52 pin 1 index E 1 26 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.08 0.51 4.0 1.3 0.8 0.53 0.40 0.32 0.23 47.9 47.1 14.0 13.7 1.778 15.24 3.2 2.8 15.80 15.24 17.15 15.90 0.18 1.73 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-01-22 95-03-11 SOT247-1 1996 Nov 05 EUROPEAN PROJECTION 26 Philips Semiconductors Package information Package outlines SIL SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q P A2 P1 A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.9 3.4 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.25 1.0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-25 SOT110-1 1996 Nov 05 EUROPEAN PROJECTION 27 Philips Semiconductors Package information Package outlines SIL9P: plastic single in-line power package; 9 leads SOT131-2 non-concave Dh x D Eh view B: mounting base side d A2 seating plane B E j A1 b L c 1 9 e Z Q w M bp 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A1 max. A2 b max. bp c D (1) d Dh E (1) e Eh j L Q w x Z (1) mm 2.0 4.6 4.2 1.1 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 2.54 6 3.4 3.1 17.2 16.5 2.1 1.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-03-11 SOT131-2 1996 Nov 05 EUROPEAN PROJECTION 28 Philips Semiconductors Package information Package outlines SO SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. A1 A2 1.75 0.25 0.10 1.45 1.25 0.010 0.057 0.069 0.004 0.049 A3 bp c D (1) E (2) 0.25 0.49 0.36 0.25 0.19 5.0 4.8 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 e HE 4.0 3.8 1.27 6.2 5.8 0.16 0.15 0.050 L Lp Q 1.05 1.0 0.4 0.7 0.6 0.244 0.039 0.028 0.041 0.228 0.016 0.024 v 0.25 0.01 w 0.25 0.01 y Z (1) 0.1 0.7 0.3 0.028 0.004 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1996 Nov 05 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 29 o 8 0o Philips Semiconductors Package information Package outlines SO8: plastic small outline package; 8 leads (straight); body width 3.9 mm D SOT96-2 E A X c HE v M A Z 8 5 Q A2 pin 1 index L 1 4 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A2 bp c D (1) E (2) e HE L Q v w Z (1) mm 1.45 1.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.4 6.2 1.2 0.7 0.6 0.25 0.25 0.7 0.3 inches 0.057 0.049 0.019 0.0100 0.20 0.014 0.0075 0.19 0.16 0.15 0.050 0.028 0.024 0.01 0.01 0.028 0.012 0.252 0.047 0.244 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-05-22 SOT96-2 1996 Nov 05 EUROPEAN PROJECTION 30 Philips Semiconductors Package information Package outlines SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.244 0.050 0.041 0.228 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC 1996 Nov 05 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 31 o 8 0o Philips Semiconductors Package information Package outlines SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013AA 1996 Nov 05 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 32 Philips Semiconductors Package information Package outlines SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1996 Nov 05 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 33 Philips Semiconductors Package information Package outlines SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013AD 1996 Nov 05 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 34 Philips Semiconductors Package information Package outlines SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE 1996 Nov 05 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 35 Philips Semiconductors Package information Package outlines SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 D E A X c y HE v M A Z 17 32 Q A2 A (A 3) A1 pin 1 index Lp L 16 1 0 detail X w M bp e 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. A1 A2 2.65 0.3 0.1 2.45 2.25 0.10 0.012 0.096 0.004 0.086 A3 bp c D (1) E (1) 0.25 0.49 0.36 0.27 0.18 20.7 20.3 0.01 0.02 0.01 0.011 0.007 0.81 0.80 e HE 7.6 7.4 1.27 10.65 10.00 0.30 0.29 0.419 0.050 0.394 L Lp Q 1.4 1.1 0.4 1.2 1.0 0.043 0.055 0.016 0.047 0.039 v 0.25 0.01 w 0.25 0.01 y Z (1) 0.1 0.95 0.55 0.037 0.004 0.022 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-01-25 97-05-22 SOT287-1 1996 Nov 05 EUROPEAN PROJECTION 36 Philips Semiconductors Package information Package outlines SSOP SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.5 0.15 0 1.4 1.2 0.25 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-04-05 95-02-25 SOT266-1 1996 Nov 05 EUROPEAN PROJECTION 37 o Philips Semiconductors Package information Package outlines SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm D SOT341-1 E A X c HE y v M A Z 28 15 Q A2 A (A 3) A1 pin 1 index Lp L 1 14 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A max. A1 A2 2.0 0.21 0.05 1.80 1.65 A3 bp c D (1) E (1) 0.25 0.38 0.25 0.20 0.09 10.4 10.0 5.4 5.2 e HE 0.65 7.9 7.6 L Lp Q 1.25 1.03 0.63 0.9 0.7 v 0.2 w 0.13 y Z (1) 0.1 1.1 0.7 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT341-1 1996 Nov 05 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AH 38 o Philips Semiconductors Package information Package outlines SQFP SQFP208: plastic shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm SOT316-1 c y X A 156 157 105 104 ZE e E HE A A2 A1 (A 3) wM Lp bp L pin 1 index 208 detail X 53 52 1 ZD wM bp e v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 4.10 0.40 0.25 3.70 3.15 0.25 0.25 0.13 0.23 0.13 28.1 27.9 28.1 27.9 0.5 30.9 30.3 30.9 30.3 1.3 0.70 0.45 0.1 0.1 0.075 Z D (1) Z E (1) 1.45 1.05 8 0o 1.45 1.05 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-04-08 97-08-01 SOT316-1 1996 Nov 05 EUROPEAN PROJECTION 39