METALLURGICALLY BONDED GLASS
SURFACE MOUNT 500 mW ZENERS
WWW.Microsemi .COM
SCOTTSDALE DIVISION
1N5221UR-1 thru 1N5281BUR-1,e3
(or MLL5221-1 thru MLL5281B-1,e3)
1N5221UR thru 1N5281BUR
DESCRIPTION APPEARANCE
The 1N5221BUR-1 thru 1N5281BUR-1 series of 0.5 watt Zener Voltage
Regulators provides a surface mount equivalent to the popular JEDEC
registered 1N5221B to 1N5281B for 2.4 to 200 volts in a metallurgically
bonded configuration. They are available with standard 5%, 10%, or 20%
tolerances as well as tighter tolerances identified by different suffix letters on
the part number. Microsemi also offers numerous other Zener products to
meet higher and lower power applications.
DO-213AA
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES APPLIC ATIONS / BENEFITS
• Surface mount equivalents to the JEDEC registered
1N5221 thru 1N5281B series
• Hermetically sealed surface mount package
• Internal metallurgical bond
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers
• RoHS Compliant devices avai lable by adding “e3” suffix
• DO-7 or DO-35 glass body axial-leaded Zener
equivalents also availab le p er JEDEC registration (see
separate data sheet for part numbers 1N5221 thru
1N5281B series
• Regulates voltage over a broad operating
current and temperature range
• Selection from 2.4 to 200 V
• Standard voltage tolerances are plus/minus 5%
with B suffix identification and 10 % with A suffix
• Tight tolerances available in plus or minus 2%
or 1% with C or D suffix respectively
• Nonsensitive to ESD per MIL-STD-750 Method 1020
• Minimal capacitance (see Figure 3)
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RAT ING S MECHANICAL AND PACKAGING
• Operating and Storage temperature: -65ºC to +175ºC
• Thermal Resistance: 100ºC/W junction to end cap
and 250ºC/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended footpri nt
(see last page)
• Steady-State Power: 0.5 watts at end cap
temperature TEC < 125oC or ambient temperature TA
< 50ºC when mounted on FR4 PC board as described
for thermal resistance above (see Figure 2 for
derating)
• Forward voltage @200 mA: 1.1 volts (maximum)
• Solder Temperatures: 260 ºC for 10 seconds (max)
• CASE: Hermetically sealed glass DO-213AA
(SOD80 or MLL34) MELF style package
• FINISH: End caps Tin-Lead or RoHS Compliant
annealed matte-Tin plating solderable per MIL-STD-
750, method 2026
• POLARITY: Cathode indicated by band where
diode is to be operated with the banded end positive
with respect to the opposite end for Zener regulation
• MARKING: cathode band only
• TAPE & REEL option: Standard per EIA-481-B with
12 mm tape, 2000 per 7 inch reel or 5000 per 13
inch reel (add “TR” suffix to part number)
• WEIGHT: 0.04 grams
• See package dimensions on l ast page
Microsemi
Scottsdale Division Page 1
Copyright © 2005
8-29-2005 REV A 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503